KR20210082486A - 레이저 가공 장치 - Google Patents

레이저 가공 장치 Download PDF

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Publication number
KR20210082486A
KR20210082486A KR1020217015675A KR20217015675A KR20210082486A KR 20210082486 A KR20210082486 A KR 20210082486A KR 1020217015675 A KR1020217015675 A KR 1020217015675A KR 20217015675 A KR20217015675 A KR 20217015675A KR 20210082486 A KR20210082486 A KR 20210082486A
Authority
KR
South Korea
Prior art keywords
laser processing
processing head
laser
unit
light
Prior art date
Application number
KR1020217015675A
Other languages
English (en)
Korean (ko)
Inventor
다케시 사카모토
준지 오쿠마
Original Assignee
하마마츠 포토닉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 하마마츠 포토닉스 가부시키가이샤 filed Critical 하마마츠 포토닉스 가부시키가이샤
Publication of KR20210082486A publication Critical patent/KR20210082486A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020217015675A 2018-10-30 2019-10-30 레이저 가공 장치 KR20210082486A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018203675A JP7219590B2 (ja) 2018-10-30 2018-10-30 レーザ加工装置
JPJP-P-2018-203675 2018-10-30
PCT/JP2019/042586 WO2020090891A1 (fr) 2018-10-30 2019-10-30 Dispositif d'usinage au laser

Publications (1)

Publication Number Publication Date
KR20210082486A true KR20210082486A (ko) 2021-07-05

Family

ID=70463748

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217015675A KR20210082486A (ko) 2018-10-30 2019-10-30 레이저 가공 장치

Country Status (5)

Country Link
JP (1) JP7219590B2 (fr)
KR (1) KR20210082486A (fr)
CN (1) CN113039036B (fr)
TW (1) TW202023726A (fr)
WO (1) WO2020090891A1 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5456510B2 (ja) 2010-02-23 2014-04-02 株式会社ディスコ レーザ加工装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56129340A (en) * 1980-03-13 1981-10-09 Toshiba Corp Method of dividing platelike material
JP4110219B2 (ja) * 2002-08-30 2008-07-02 株式会社東京精密 レーザーダイシング装置
JP2004276101A (ja) * 2003-03-18 2004-10-07 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
KR100641716B1 (ko) * 2005-02-16 2006-11-10 토파즈엘시디 주식회사 레이저를 이용한 도광판 제조방법
GB0622232D0 (en) * 2006-11-08 2006-12-20 Rumsby Philip T Method and apparatus for laser beam alignment for solar panel scribing
JP2010010209A (ja) * 2008-06-24 2010-01-14 Tokyo Seimitsu Co Ltd レーザーダイシング方法
CN101826575B (zh) * 2010-02-20 2012-01-04 英利能源（中国）有限公司 一种光伏组件的敷设方法
JP5284299B2 (ja) * 2010-03-04 2013-09-11 シャープ株式会社 薄膜太陽電池の製造方法、および薄膜太陽電池製造用のレーザ加工装置
JP5789802B2 (ja) * 2011-03-22 2015-10-07 株式会社ソシオネクスト 半導体チップの製造方法
DE102011079739A1 (de) * 2011-07-25 2013-01-31 Lpkf Laser & Electronics Ag Vorrichtung und Verfahren zur Durchführung und Überwachung eines Kunststoff-Laserdurchstrahl-Schweißprozesses
CN102637012B (zh) * 2012-04-01 2013-12-18 深圳市联赢激光股份有限公司 一种用于激光加工设备的双路功率负反馈系统
JP6559477B2 (ja) * 2015-06-23 2019-08-14 株式会社ディスコ ウェーハの加工方法
CN205166178U (zh) * 2015-10-26 2016-04-20 惠州市杰普特电子技术有限公司 激光焊接装置
CN205290076U (zh) * 2015-12-16 2016-06-08 深圳市联懋塑胶有限公司 一种手机壳加工用激光焊接装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5456510B2 (ja) 2010-02-23 2014-04-02 株式会社ディスコ レーザ加工装置

Also Published As

Publication number Publication date
JP2020069488A (ja) 2020-05-07
TW202023726A (zh) 2020-07-01
CN113039036A (zh) 2021-06-25
CN113039036B (zh) 2023-08-29
WO2020090891A1 (fr) 2020-05-07
JP7219590B2 (ja) 2023-02-08

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