WO2020090891A1 - Dispositif d'usinage au laser - Google Patents

Dispositif d'usinage au laser Download PDF

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Publication number
WO2020090891A1
WO2020090891A1 PCT/JP2019/042586 JP2019042586W WO2020090891A1 WO 2020090891 A1 WO2020090891 A1 WO 2020090891A1 JP 2019042586 W JP2019042586 W JP 2019042586W WO 2020090891 A1 WO2020090891 A1 WO 2020090891A1
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WO
WIPO (PCT)
Prior art keywords
laser processing
processing head
laser
unit
light
Prior art date
Application number
PCT/JP2019/042586
Other languages
English (en)
Japanese (ja)
Inventor
剛志 坂本
惇治 奥間
Original Assignee
浜松ホトニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 浜松ホトニクス株式会社 filed Critical 浜松ホトニクス株式会社
Priority to CN201980071415.9A priority Critical patent/CN113039036B/zh
Priority to KR1020217015675A priority patent/KR20210082486A/ko
Publication of WO2020090891A1 publication Critical patent/WO2020090891A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece

Definitions

  • the present disclosure relates to a laser processing device.
  • Patent Document 1 describes a laser processing apparatus that includes a holding mechanism that holds a work, and a laser irradiation mechanism that irradiates the work held by the holding mechanism with laser light.
  • a laser irradiation mechanism having a condenser lens is fixed to a base, and movement of a work along a direction perpendicular to the optical axis of the condenser lens is performed by a holding mechanism. Be implemented.
  • the present disclosure aims to provide a laser processing apparatus capable of confirming the success or failure of laser processing nondestructively while improving throughput.
  • a laser processing apparatus is movable along a first direction, and a support portion for supporting an object along a first direction and a second direction intersecting the first direction, and a second direction.
  • a first laser processing head and a second laser processing head for irradiating the object supported by the support portion with laser light, and the first laser processing head are attached,
  • a first mounting portion, which is movable along a third direction and a second direction intersecting the first direction and the second direction, respectively, and a second laser processing head are mounted, and the second direction and the third direction.
  • a second mounting portion that is movable along the first mounting portion, and an imaging unit that is mounted on the first mounting portion and that captures an image of the object with light that passes through the object.
  • a first laser processing head and a second laser processing head are arranged so as to face each other on a support portion that supports an object.
  • the first laser processing head and the second laser processing head are independently movable in two directions that intersect each other via the first mounting portion and the second mounting portion, respectively. Therefore, it is possible to perform laser processing independently of each other at two locations of the object by scanning the laser light. Therefore, the throughput can be improved.
  • an imaging unit that images the object with light that passes through the object is further attached to the first mounting portion that is responsible for the movement of the first laser processing head. Therefore, for example, while the laser processing is being performed by the second laser processing head, another portion of the object can be imaged by the imaging unit. Therefore, the state of laser processing can be confirmed nondestructively while suppressing the decrease in throughput. That is, according to this apparatus, it is possible to confirm the success or failure of the laser processing nondestructively while improving the throughput.
  • the laser processing apparatus includes movement of a support portion, a first mounting portion, and a second mounting portion, irradiation of laser light from the first laser processing head and the second laser processing head, and an object by an imaging unit.
  • a plurality of lines that extend along the first direction and that are arranged along the second direction are set on the object, and the control unit controls the plurality of lines.
  • the first scan processing for scanning one line of the laser beam from the first laser processing head in the first direction, and another line of the plurality of lines from the second laser processing head.
  • An object that includes a line that has been processed when the second scan process that scans the laser beam in the first direction is performed at least partially at the same time and only the second scan process is performed.
  • An imaging process for imaging by the region image pickup unit may be implemented.
  • the throughput is improved by overlappingly executing the first scan process and the second scan process.
  • the imaging processing can be performed by controlling the imaging unit that can move together with the first laser processing head. Therefore, it is possible to confirm the success or failure of the laser processing more reliably and nondestructively while improving the throughput.
  • the control unit determines, based on the image obtained by the imaging process, whether the modified region and / or the crack is formed in the object in the region in accordance with the regulation. In addition to performing the determination, when it is determined that the modified region and / or the crack is not formed in accordance with the regulation as a result of the determination, at least an auxiliary processing process for rescanning the laser light along the line is performed. You may execute. In this case, the processing error is compensated by the auxiliary processing.
  • the control unit sequentially performs the first scan from a line located at one end of the object in the second direction of the plurality of lines toward an inner line in the second direction. While performing the process, a main processing process that sequentially performs the second scan process from the line located at the other end of the object in the second direction of the plurality of lines toward the inner line in the second direction is performed. You may execute. As described above, in the main processing, the first scan process and the second scan process are sequentially performed from the line at the position contrasting with the object in the second direction, so that Waste of relative movement along one direction is eliminated, and throughput is further improved.
  • the control unit retracts the first laser processing head when the first laser processing head and the second laser processing head are closest to each other in the second direction in the main processing. While continuing the second scanning process, the imaging process may be executed. In this case, it is possible to confirm the success or failure of the laser processing nondestructively while maximally utilizing the first laser processing head and the second laser processing head to improve the throughput.
  • FIG. 4 It is a perspective view of the laser processing apparatus of one embodiment. It is a front view of a part of laser processing apparatus shown by FIG. It is a front view of the laser processing head of the laser processing apparatus shown by FIG. 4 is a side view of the laser processing head shown in FIG. 3.
  • FIG. It is a block diagram of the optical system of the laser processing head shown in FIG. It is a block diagram of the optical system of the laser processing head of a modification. It is a front view of a part of laser processing apparatus of a modification. It is a schematic top view which shows operation
  • the laser processing apparatus 1 includes a plurality of moving mechanisms 5 and 6, a supporting portion 7, and a pair of laser processing heads (first laser processing head, second laser processing head) 10A and 10B. And a light source unit 8 and a control unit 9.
  • the first direction will be referred to as the X direction
  • the second direction perpendicular to the first direction will be referred to as the Y direction
  • the third direction perpendicular to the first and second directions will be referred to as the Z direction.
  • the X direction and the Y direction are horizontal directions
  • the Z direction is a vertical direction.
  • the moving mechanism 5 has a fixed portion 51, a moving portion 53, and a mounting portion 55.
  • the fixed portion 51 is attached to the device frame 1a.
  • the moving unit 53 is attached to a rail provided on the fixed unit 51, and can move along the Y direction.
  • the attachment portion 55 is attached to a rail provided on the moving portion 53 and can move along the X direction.
  • the moving mechanism 6 includes a fixed part 61, a pair of moving parts (first moving part, second moving part) 63, 64, and a pair of mounting parts (first mounting part, second mounting part) 65, 66. And have.
  • the fixed portion 61 is attached to the device frame 1a.
  • Each of the pair of moving portions 63 and 64 is attached to a rail provided on the fixed portion 61, and each of them can move independently along the Y direction.
  • the attachment portion 65 is attached to a rail provided on the moving portion 63 and can move along the Z direction.
  • the attachment portion 66 is attached to a rail provided on the moving portion 64 and can move along the Z direction. That is, with respect to the device frame 1a, each of the pair of mounting portions 65 and 66 can move along the Y direction and the Z direction.
  • the support portion 7 is attached to a rotary shaft provided on the attachment portion 55 of the moving mechanism 5, and can rotate about an axis parallel to the Z direction as a center line. That is, the support part 7 can move along each of the X direction and the Y direction, and can rotate about the axis parallel to the Z direction as the center line.
  • the support unit 7 supports the object 100 along the X direction and the Y direction.
  • the object 100 is, for example, a wafer.
  • the laser processing head 10A (for example, the first laser processing head) is attached to the attachment portion 65 of the moving mechanism 6.
  • the laser processing head 10A is for irradiating the object 100 supported by the support 7 with laser light (first laser light) L1 while facing the support 7 in the Z direction.
  • the laser processing head 10B (for example, the second laser processing head) is attached to the attachment portion 66 of the moving mechanism 6.
  • the laser processing head 10B is for irradiating the object 100 supported by the support 7 with laser light (second laser light) L2 while facing the support 7 in the Z direction.
  • the light source unit 8 has a pair of light sources 81 and 82.
  • the light source 81 outputs laser light L1.
  • the laser light L1 is emitted from the emitting portion 81a of the light source 81 and guided to the laser processing head 10A by the optical fiber 2.
  • the light source 82 outputs laser light L2.
  • the laser light L2 is emitted from the emitting portion 82a of the light source 82, and is guided to the laser processing head 10B by another optical fiber 2.
  • the control unit 9 controls each unit of the laser processing apparatus 1 (a plurality of moving mechanisms 5, 6, a pair of laser processing heads 10A, 10B, a light source unit 8, etc.).
  • the control unit 9 is configured as a computer device including a processor, a memory, a storage, a communication device, and the like.
  • the software (program) read into the memory or the like is executed by the processor, and the reading and writing of data in the memory and the storage and the communication by the communication device are controlled by the processor. Thereby, the control unit 9 realizes various functions.
  • An example of processing by the laser processing apparatus 1 configured as above will be described.
  • An example of the processing is an example in which a modified region is formed inside the object 100 along each of a plurality of lines set in a grid pattern in order to cut the object 100, which is a wafer, into a plurality of chips. is there.
  • the moving mechanism 5 moves the supporting portion 7 along the X direction and the Y direction so that the supporting portion 7 supporting the object 100 faces the pair of laser processing heads 10A and 10B in the Z direction. To move. Then, the moving mechanism 5 rotates the support part 7 with the axis line parallel to the Z direction as the center line so that the plurality of lines extending in one direction on the object 100 are along the X direction.
  • the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the focus point of the laser beam L1 is located on one line extending in one direction.
  • the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the focal point of the laser light L2 is located on the other line extending in one direction.
  • the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the focusing point of the laser beam L1 is located inside the object 100.
  • the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the focal point of the laser beam L2 is located inside the object 100.
  • the light source 81 outputs the laser light L1 and the laser processing head 10A irradiates the object 100 with the laser light L1, and the light source 82 outputs the laser light L2 and the laser processing head 10B lasers the object 100.
  • the light L2 is emitted.
  • the condensing point of the laser light L1 relatively moves along one line extending in one direction (the laser light L1 is scanned), and the laser beam extends along another line extending in one direction.
  • the moving mechanism 5 moves the support portion 7 along the X direction so that the focal point of the light L2 moves relatively (the laser light L2 is scanned). In this way, the laser processing apparatus 1 forms the modified region inside the object 100 along each of the plurality of lines extending in one direction on the object 100.
  • the moving mechanism 5 rotates the support part 7 with the axis line parallel to the Z direction as the center line so that the plurality of lines extending in the other direction orthogonal to the one direction in the object 100 are along the X direction. ..
  • the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the focus point of the laser light L1 is located on one line extending in the other direction.
  • the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the focus point of the laser light L2 is located on another line extending in the other direction.
  • the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the focusing point of the laser beam L1 is located inside the object 100.
  • the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the focal point of the laser beam L2 is located inside the object 100.
  • the light source 81 outputs the laser light L1 and the laser processing head 10A irradiates the object 100 with the laser light L1, and the light source 82 outputs the laser light L2 and the laser processing head 10B lasers the object 100.
  • the light L2 is emitted.
  • the focal point of the laser light L1 relatively moves along one line extending in the other direction (the laser light L1 is scanned), and the laser beam extends along the other line extending in the other direction.
  • the moving mechanism 5 moves the support portion 7 along the X direction so that the focal point of the light L2 moves relatively (the laser light L2 is scanned). In this way, the laser processing apparatus 1 forms the modified region inside the object 100 along each of the plurality of lines extending in the other direction orthogonal to the one direction in the object 100.
  • the light source 81 outputs the laser light L1 that is transmissive to the target object 100, for example, by the pulse oscillation method, and the light source 82 outputs the laser light L1 to the target object 100, for example, by the pulse oscillation method.
  • the laser beam L2 having transparency is output.
  • the laser light is condensed inside the object 100, the laser light is particularly absorbed in a portion corresponding to the condensing point of the laser light, and a modified region is formed inside the object 100.
  • the modified region is a region where the density, refractive index, mechanical strength, and other physical properties are different from the surrounding unmodified region.
  • the modified region includes, for example, a melt-processed region, a crack region, a dielectric breakdown region, and a refractive index change region.
  • a plurality of modified spots are lined up. Are formed so as to be lined up in a row along the line.
  • One modified spot is formed by irradiation with one pulse of laser light.
  • the one-row reforming region is a set of a plurality of reforming spots arranged in one row. Adjacent modified spots may be connected to each other or may be separated from each other depending on the relative moving speed of the condensing point of the laser light with respect to the object 100 and the repetition frequency of the laser light.
  • the laser processing head 10A includes a casing (for example, a first casing) 11, an incident unit 12, an adjusting unit 13, and a condensing unit (for example, a first condensing unit). 14 and.
  • the housing 11 has a first wall portion 21 and a second wall portion 22, a third wall portion 23 and a fourth wall portion 24, and a fifth wall portion 25 and a sixth wall portion 26.
  • the first wall portion 21 and the second wall portion 22 face each other in the X direction.
  • the third wall portion 23 and the fourth wall portion 24 face each other in the Y direction.
  • the fifth wall portion 25 and the sixth wall portion 26 face each other in the Z direction.
  • the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22.
  • the distance between the first wall portion 21 and the second wall portion 22 is smaller than the distance between the fifth wall portion 25 and the sixth wall portion 26.
  • the distance between the first wall portion 21 and the second wall portion 22 may be equal to the distance between the fifth wall portion 25 and the sixth wall portion 26, or alternatively, the fifth wall portion 25 and the sixth wall portion 26. It may be larger than the distance to the portion 26.
  • the first wall portion 21 is located on the fixed portion 61 side of the moving mechanism 6, and the second wall portion 22 is located on the opposite side to the fixed portion 61.
  • the third wall portion 23 is located on the mounting portion 65 side of the moving mechanism 6, and the fourth wall portion 24 is located on the side opposite to the mounting portion 65 and on the laser processing head 10B side (FIG. 2). That is, the fourth wall portion 24 is a facing wall portion that faces the housing (second housing) of the laser processing head 10B along the Y direction.
  • the fifth wall portion 25 is located on the side opposite to the support portion 7, and the sixth wall portion 26 is located on the support portion 7 side.
  • the housing 11 is configured such that the housing 11 is attached to the mounting portion 65 with the third wall portion 23 arranged on the mounting portion 65 side of the moving mechanism 6. Specifically, it is as follows.
  • the mounting portion 65 has a base plate 65a and a mounting plate 65b.
  • the base plate 65a is attached to a rail provided on the moving unit 63 (see FIG. 2).
  • the mounting plate 65b is erected on the end of the base plate 65a on the laser processing head 10B side (see FIG. 2).
  • the casing 11 is attached to the attachment portion 65 by screwing the bolt 28 to the attachment plate 65b via the pedestal 27 while the third wall portion 23 is in contact with the attachment plate 65b.
  • the pedestal 27 is provided on each of the first wall portion 21 and the second wall portion 22.
  • the housing 11 is attachable to and detachable from the mounting portion 65.
  • the incident part 12 is attached to the fifth wall part 25.
  • the incident unit 12 causes the laser light L1 to enter the housing 11.
  • the incident portion 12 is offset to the second wall portion 22 side (one wall portion side) in the X direction and is offset to the fourth wall portion 24 side in the Y direction. That is, the distance between the incident portion 12 and the second wall portion 22 in the X direction is smaller than the distance between the incident portion 12 and the first wall portion 21 in the X direction, and the incident portion 12 and the fourth wall portion 24 in the Y direction. Is smaller than the distance between the incident portion 12 and the third wall portion 23 in the X direction.
  • the incident portion 12 is configured so that the connection end portion 2a of the optical fiber 2 can be connected.
  • the connection end portion 2a of the optical fiber 2 is provided with a collimator lens that collimates the laser light L1 emitted from the emission end of the fiber, and is not provided with an isolator that suppresses return light.
  • the isolator is provided in the middle of the fiber on the light source 81 side with respect to the connection end portion 2a. As a result, the connection end portion 2a is downsized, and the incident portion 12 is downsized.
  • An isolator may be provided at the connection end 2a of the optical fiber 2.
  • the adjusting unit 13 is arranged in the housing 11.
  • the adjusting unit 13 adjusts the laser light L1 incident from the incident unit 12. Details of the adjusting unit 13 will be described later.
  • the light collector 14 is arranged on the sixth wall 26. Specifically, the light collecting section 14 is arranged in the sixth wall section 26 in a state of being inserted into the hole 26 a formed in the sixth wall section 26.
  • the condensing unit 14 condenses the laser light L1 adjusted by the adjusting unit 13 and emits it to the outside of the housing 11.
  • the light collecting section 14 is offset to the second wall section 22 side (one wall section side) in the X direction and is biased to the fourth wall section 24 side in the Y direction. That is, the light condensing unit 14 is arranged so as to be biased toward the fourth wall portion (opposing wall portion) 24 side of the housing 11 when viewed from the Z direction.
  • the distance between the light collecting section 14 and the second wall section 22 in the X direction is smaller than the distance between the light collecting section 14 and the first wall section 21 in the X direction, and the light collecting section 14 and the fourth wall in the Y direction are fourth.
  • the distance from the wall portion 24 is smaller than the distance between the light collecting portion 14 and the third wall portion 23 in the X direction.
  • the adjusting unit 13 has an attenuator 31, a beam expander 32, and a mirror 33.
  • the incident unit 12, the attenuator 31, the beam expander 32, and the mirror 33 of the adjusting unit 13 are arranged on a straight line (first straight line) A1 extending along the Z direction.
  • the attenuator 31 and the beam expander 32 are arranged between the incident part 12 and the mirror 33 on the straight line A1.
  • the attenuator 31 adjusts the output of the laser light L1 incident from the incident unit 12.
  • the beam expander 32 expands the diameter of the laser light L1 whose output is adjusted by the attenuator 31.
  • the mirror 33 reflects the laser light L1 whose diameter has been expanded by the beam expander 32.
  • the adjusting unit 13 further includes a reflective spatial light modulator 34 and an image forming optical system 35.
  • the reflective spatial light modulator 34 of the adjustment unit 13, the imaging optical system 35, and the condensing unit 14 are arranged on a straight line (second straight line) A2 extending along the Z direction.
  • the reflective spatial light modulator 34 modulates the laser light L1 reflected by the mirror 33.
  • the reflective spatial light modulator 34 is, for example, a reflective liquid crystal (LCOS: Liquid Crystal on Silicon) spatial light modulator (SLM: Spatial Light Modulator).
  • the image forming optical system 35 constitutes a double-sided telecentric optical system in which the reflecting surface 34a of the reflective spatial light modulator 34 and the entrance pupil surface 14a of the condensing unit 14 are in an image forming relationship.
  • the image forming optical system 35 is composed of three or more lenses.
  • the straight line A1 and the straight line A2 are located on a plane perpendicular to the Y direction.
  • the straight line A1 is located on the second wall portion 22 side (one wall portion side) with respect to the straight line A2.
  • the laser beam L1 enters the housing 11 from the incident part 12, travels on the straight line A1, is sequentially reflected by the mirror 33 and the reflective spatial light modulator 34, and then the straight line A2.
  • the light travels upward and is emitted from the light collecting unit 14 to the outside of the housing 11.
  • the order of arrangement of the attenuator 31 and the beam expander 32 may be reversed.
  • the attenuator 31 may be arranged between the mirror 33 and the reflective spatial light modulator 34.
  • the adjusting unit 13 may have other optical components (for example, a steering mirror arranged in front of the beam expander 32).
  • the laser processing head 10A further includes a dichroic mirror 15, a measurement unit 16, an observation unit 17, a drive unit 18, and a circuit unit 19.
  • the dichroic mirror 15 is arranged on the straight line A2 between the imaging optical system 35 and the condensing unit 14. That is, the dichroic mirror 15 is arranged in the housing 11 between the adjusting unit 13 and the light collecting unit 14. The dichroic mirror 15 is attached to the optical base 29 on the side of the fourth wall portion 24. The dichroic mirror 15 transmits the laser light L1. From the viewpoint of suppressing astigmatism, the dichroic mirror 15 may be, for example, a cube type or two plate types arranged so as to have a twist relationship.
  • the measuring unit 16 is arranged inside the housing 11 with respect to the adjusting unit 13 on the first wall 21 side (the side opposite to the one wall side).
  • the measuring unit 16 is attached to the optical base 29 on the fourth wall 24 side.
  • the measurement unit 16 outputs measurement light L10 for measuring the distance between the surface of the object 100 (for example, the surface on the side on which the laser light L1 is incident) and the light condensing unit 14, and through the light condensing unit 14.
  • the measurement light L10 reflected by the surface of the object 100 is detected. That is, the measurement light L10 output from the measurement unit 16 is applied to the surface of the object 100 via the light condensing unit 14, and the measurement light L10 reflected on the surface of the object 100 passes through the light condensing unit 14. And is detected by the measuring unit 16.
  • the measurement light L10 output from the measurement unit 16 is sequentially reflected by the beam splitter 20 and the dichroic mirror 15 attached to the optical base 29 on the side of the fourth wall 24, and then the light collection unit 14 outputs the light. It goes out of the housing 11.
  • the measurement light L10 reflected on the surface of the object 100 enters the housing 11 from the light condensing unit 14, is sequentially reflected by the dichroic mirror 15 and the beam splitter 20, enters the measuring unit 16, and then the measuring unit 16 Detected in.
  • the observing unit 17 is arranged in the housing 11 on the first wall 21 side (the side opposite to the one wall side) with respect to the adjusting unit 13.
  • the observation section 17 is attached to the optical base 29 on the side of the fourth wall section 24.
  • the observation unit 17 outputs the observation light L20 for observing the surface of the object 100 (for example, the surface on the side where the laser light L1 is incident), and is reflected by the surface of the object 100 via the light condensing unit 14.
  • the observation light L20 thus generated is detected. That is, the observation light L20 output from the observation unit 17 is applied to the surface of the object 100 via the light condensing unit 14, and the observation light L20 reflected by the surface of the object 100 passes through the light condensing unit 14. And is detected by the observation unit 17.
  • the observation light L20 output from the observation unit 17 passes through the beam splitter 20, is reflected by the dichroic mirror 15, and is emitted from the condensing unit 14 to the outside of the housing 11.
  • the observation light L20 reflected on the surface of the object 100 enters the housing 11 from the light condensing unit 14, is reflected by the dichroic mirror 15, passes through the beam splitter 20, and enters the observation unit 17, Detected at 17.
  • the wavelengths of the laser light L1, the measurement light L10, and the observation light L20 are different from each other (at least the respective central wavelengths are deviated from each other).
  • the drive section 18 is attached to the optical base 29 on the side of the fourth wall section 24.
  • the driving unit 18 moves the condensing unit 14 arranged on the sixth wall unit 26 along the Z direction by the driving force of the piezoelectric element, for example.
  • the circuit portion 19 is arranged on the third wall portion 23 side with respect to the optical base 29 in the housing 11. That is, the circuit unit 19 is arranged on the third wall 23 side with respect to the adjustment unit 13, the measurement unit 16, and the observation unit 17 in the housing 11.
  • the circuit unit 19 is, for example, a plurality of circuit boards.
  • the circuit unit 19 processes the signal output from the measurement unit 16 and the signal input to the reflective spatial light modulator 34.
  • the circuit unit 19 controls the drive unit 18 based on the signal output from the measurement unit 16.
  • the circuit unit 19 maintains the distance between the surface of the object 100 and the light condensing unit 14 constant based on the signal output from the measurement unit 16 (that is, the surface of the object 100).
  • the drive unit 18 is controlled so that the distance from the condensing point of the laser light L1 is kept constant).
  • the housing 11 is provided with a connector (not shown) to which wiring for electrically connecting the circuit unit 19 to the control unit 9 (see FIG. 1) and the like is connected.
  • the laser processing head 10B includes a housing (for example, a second housing) 11, an incident unit 12, an adjusting unit 13, and a light collecting unit (for example, a second light collecting unit) 14.
  • a dichroic mirror 15, a measurement unit 16, an observation unit 17, a drive unit 18, and a circuit unit 19 are provided.
  • each configuration of the laser processing head 10B is, as shown in FIG. 2, each configuration of the laser processing head 10A with respect to a virtual plane that passes through the midpoint between the pair of mounting portions 65 and 66 and is perpendicular to the Y direction. Are arranged so as to have a plane symmetry relationship with (this is an example as described later).
  • the fourth wall portion 24 is located on the laser processing head 10B side with respect to the third wall portion 23, and the sixth wall portion 26 is supported with respect to the fifth wall portion 25. It is attached to the attachment portion 65 so as to be located on the side of the portion 7.
  • the fourth wall portion 24 is located on the laser processing head 10A side with respect to the third wall portion 23, and the sixth wall portion 26 is with respect to the fifth wall portion 25. Is attached to the attachment portion 66 so as to be located on the support portion 7 side. That is, also in the laser processing head 10B, the fourth wall portion 24 is a facing wall portion that faces the housing of the laser processing head 10A along the Y direction.
  • the light converging portion 14 is arranged so as to be biased toward the fourth wall portion (opposing wall portion) 24 side of the housing 11 when viewed from the Z direction.
  • the housing 11 of the laser processing head 10B is configured such that the housing 11 is attached to the mounting portion 66 with the third wall portion 23 arranged on the mounting portion 66 side. Specifically, it is as follows.
  • the mounting portion 66 has a base plate 66a and a mounting plate 66b.
  • the base plate 66a is attached to a rail provided on the moving unit 63.
  • the mounting plate 66b is erected at the end of the base plate 66a on the laser processing head 10A side.
  • the housing 11 of the laser processing head 10B is attached to the attachment portion 66 with the third wall portion 23 in contact with the attachment plate 66b.
  • the housing 11 of the laser processing head 10B can be attached to and detached from the mounting portion 66. [Operation and effect of laser processing head]
  • the housing 11 since the light source that outputs the laser light L1 is not provided in the housing 11, the housing 11 can be downsized. Further, in the housing 11, the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22, and the assembly attached to the sixth wall portion 26. The light portion 14 is biased toward the fourth wall portion 24 side in the Y direction. Thereby, when moving the housing 11 along the direction perpendicular to the optical axis of the light condensing unit 14, for example, it is assumed that another configuration (for example, the laser processing head 10B) is present on the fourth wall 24 side. Also, the condensing unit 14 can be brought close to the other configuration. Therefore, the laser processing head 10A may be suitable for moving the condensing unit 14 along the direction perpendicular to its optical axis.
  • the incident portion 12 is provided on the fifth wall portion 25 and is offset to the fourth wall portion 24 side in the Y direction.
  • the region such as disposing another configuration (for example, the circuit unit 19) in a region on the third wall 23 side with respect to the adjustment unit 13 in the region inside the housing 11. it can.
  • the condensing portion 14 is offset to the second wall portion 22 side in the X direction. Accordingly, when the housing 11 is moved along the direction perpendicular to the optical axis of the light condensing unit 14, for example, even if another configuration exists on the second wall 22 side, the other configuration is collected. The light unit 14 can be brought closer.
  • the incident portion 12 is provided on the fifth wall portion 25 and is offset toward the fourth wall portion 24 side in the Y direction and is offset toward the second wall portion 22 side in the X direction. ing.
  • the region such as disposing another configuration (for example, the circuit unit 19) in a region on the third wall 23 side with respect to the adjustment unit 13 in the region inside the housing 11. it can.
  • other regions for example, the measurement unit 16 and the observation unit 17 are arranged in the region of the housing 11 on the first wall 21 side with respect to the adjustment unit 13, and the region is effectively used. can do.
  • the measuring unit 16 and the observing unit 17 are arranged in the region on the first wall 21 side with respect to the adjusting unit 13 in the region inside the housing 11, and the circuit unit 19 is
  • the dichroic mirror 15 is arranged on the side of the third wall portion 23 with respect to the adjustment unit 13 in the area inside the housing 11, and the dichroic mirror 15 is arranged between the adjustment unit 13 and the light collection unit 14 in the housing 11. ing. Thereby, the area in the housing 11 can be effectively used.
  • the laser processing apparatus 1 can perform processing based on the measurement result of the distance between the surface of the object 100 and the light condensing unit 14. Further, the laser processing apparatus 1 can perform processing based on the observation result of the surface of the object 100.
  • the circuit section 19 controls the drive section 18 based on the signal output from the measuring section 16. Thereby, the position of the condensing point of the laser beam L1 can be adjusted based on the measurement result of the distance between the surface of the object 100 and the condensing unit 14.
  • the incident section 12, the attenuator 31, the beam expander 32, and the mirror 33 of the adjusting section 13 are arranged on the straight line A1 extending along the Z direction, and the adjusting section 13 is provided.
  • the reflective spatial light modulator 34, the imaging optical system 35, the condensing unit 14, and the condensing unit 14 are arranged on a straight line A2 extending along the Z direction. Accordingly, the adjusting unit 13 including the attenuator 31, the beam expander 32, the reflective spatial light modulator 34, and the imaging optical system 35 can be configured compactly.
  • the straight line A1 is located closer to the second wall portion 22 than the straight line A2.
  • another optical system for example, the measuring unit 16 and the observing unit 17
  • the light condensing unit 14 is provided in the region on the first wall 21 side with respect to the adjusting unit 13 in the region in the housing 11.
  • the incident section 12, the adjusting section 13, and the light collecting section 14 may be arranged on a straight line A extending along the Z direction.
  • the adjusting unit 13 can be configured compactly.
  • the adjusting unit 13 may not include the reflective spatial light modulator 34 and the imaging optical system 35.
  • the adjusting unit 13 may include an attenuator 31 and a beam expander 32.
  • the adjusting unit 13 including the attenuator 31 and the beam expander 32 can be configured compactly. The order of arrangement of the attenuator 31 and the beam expander 32 may be reversed.
  • FIG. 7 is a front view of a part of the laser processing apparatus 1 in which the laser light L1 is guided by the mirror.
  • the mirror 3 that reflects the laser light L1 moves so as to face the emitting portion 81a of the light source unit 8 in the Y direction and face the incident portion 12 of the laser processing head 10A in the Z direction. It is attached to the moving portion 63 of the mechanism 6.
  • the mirror 3 may be attached to the moving unit 63 of the moving mechanism 6 so that at least one of the angle adjustment and the position adjustment can be performed. According to this, the laser light L1 emitted from the emission portion 81a of the light source unit 8 can be more reliably incident on the incidence portion 12 of the laser processing head 10A.
  • the light source unit 8 may have one light source. In that case, the light source unit 8 may be configured so that a part of the laser light output from one light source is emitted from the emitting portion 81a and the rest of the laser light is emitted from the emitting portion 82a. [About operation of laser processing equipment]
  • FIG. 8 is a schematic top view showing the operation of the laser processing apparatus.
  • a schematic interior of the laser processing heads 10A and 10B is shown.
  • the object 100 is supported by the support portion 7.
  • the symbol S in the figure represents an optical system other than the optical system related to the irradiation of the laser beams L1 and L2 for forming the modified region, such as the measurement unit 16 and the observation unit 17 described above. ing.
  • the laser processing apparatus 1 also includes an alignment camera AC and an image pickup unit IR.
  • the alignment camera AC and the imaging unit IR are attached to the attachment portion 65 together with the laser processing head 10A.
  • the alignment camera AC images, for example, a device pattern or the like using light transmitted through the object 100. The image obtained by this is used for alignment of the irradiation positions of the laser beams L1 and L2 with respect to the object 100.
  • the image pickup unit IR picks up an image of the target object 100 with light that passes through the target object 100.
  • the image pickup unit IR has a light source (not shown), an objective lens (not shown), and a photodetector (not shown).
  • the light source outputs light that is transparent to the object 100.
  • the light source includes, for example, a halogen lamp and a filter, and outputs light in the near infrared region, for example.
  • the light output from the light source is guided by an optical system such as a mirror, passes through an objective lens, and is irradiated onto the object 100.
  • the objective lens passes the light reflected by the surface of the object 100 opposite to the light incident surface. That is, the objective lens passes the light propagated (transmitted) through the object 100.
  • the numerical aperture (NA) of the objective lens is, for example, 0.45 or more.
  • the objective lens has a correction ring.
  • the correction ring corrects the aberration generated in the light in the object 100 by adjusting the distances between the plurality of lenses forming the objective lens, for example.
  • the light detector detects the light that has passed through the objective lens.
  • the photodetector is composed of, for example, an InGaAs camera, and detects light in the near infrared region.
  • the imaging unit IR can image the modified region formed inside the object 100 and the tip of the crack extending from the modified region. That is, in the laser processing apparatus 1, the success or failure of laser processing can be confirmed nondestructively by using the imaging unit IR.
  • the target object 100 has a plurality of lines C extending along the X direction and arranged along the Y direction.
  • the line C is a virtual line, but may be an actually drawn line.
  • a plurality of lines extending along the Y direction and arranged along the X direction are also set in the object 100, the illustration thereof is omitted.
  • the laser processing device 1 performs laser processing along each line C under the control of the control unit 9.
  • the control unit 9 controls the movement of the support unit 7, the mounting unit 65, and the mounting unit 66, and the irradiation of the laser beams L1 and L2 from the laser processing head 10A and the laser processing head 10B.
  • the control unit 9 executes the first scan process and the second scan process.
  • the first scan process is a process of scanning one line C of the plurality of lines C with the laser light L1 from the laser processing head 10A in the X direction.
  • the second scan process is a process of scanning another line C of the plurality of lines C with the laser light L2 from the laser processing head 10B in the X direction.
  • the control unit 9 scans the laser beams L1 and L2 in the X direction
  • the laser processing heads 10A and 10B are moved in the Y direction and the Z direction through the mounting units 65 and 66 to move the laser beams L1 and L2.
  • the light-condensing point is located at a position on each line C that is inside the object 100. Then, in that state, by moving the support portion 7 in the X direction, the focus points of the laser beams L1 and L2 are moved in the object 100 along the line C in the X direction.
  • the control unit 9 executes the first scan process and the second scan process so that they overlap at least in part of the time. That is, the control unit 9 realizes simultaneously a state in which the laser beam L1 is scanned along one line C and a state in which the laser beam L2 is scanned along another line C at the same time. To do. That is, the control unit 9 simultaneously operates the laser processing head 10A and the laser processing head 10B. Thereby, the throughput can be clearly improved as compared with the processing using one laser processing head.
  • the control unit 9 independently sets each of the laser processing heads 10A and 10B in the Y direction by the distance of the line C (Z if necessary). Direction), and the scanning of the laser beams L1 and L2 along the next line C (that is, the first scanning process and the second scanning process) is continued.
  • the control unit 9 continuously performs this operation for the number of the lines C to form the modified region along all the lines C.
  • the control unit 9 controls the line C, which is located at one end in the Y direction of the object 100 of the plurality of lines C, to be a line C inside the Y direction.
  • the first scan process is executed in order toward.
  • the control unit 9 sequentially performs the second scan process from the line C located at the other end in the Y direction of the object 100 among the plurality of lines C toward the inner line in the Y direction ( This is called main processing).
  • the line C located at one end in the Y direction and the line C located at the other end in the Y direction have the same length in the X direction.
  • the control unit 9 moves the laser processing head 10A via the mounting unit 65 to position the condensing point of the laser light L1 at one end of the object 100 in the Y direction. It is in a state of being positioned on the line C and inside the object 100.
  • the control unit 9 moves the laser processing head 10B through the mounting unit 66 so that the focal point of the laser beam L2 is on the line C located at the other end of the object 100 in the Y direction. It is in a state of being positioned inside the object 100.
  • the position of the focal point of the laser beam L1 in the X direction and the position of the focal point of the laser beam L2 in the X direction match.
  • control section 9 moves the support section 7 in the X direction to move the focus points of the laser beams L1 and L2 in the object 100 along the respective lines C in the X direction.
  • first scan process and the second scan process for each line C are simultaneously started and simultaneously completed. That is, here, the first scan process and the second scan process overlap in their entirety.
  • the modified region M is formed inside the object 100 along the pair of lines C.
  • the control unit 9 moves the laser processing head 10A through the mounting unit 65 to position the condensing point of the laser light L1 only one inward from one end of the object 100 in the Y direction. It is in a state of being positioned on the line C and inside the object 100.
  • the control unit 9 moves the laser processing head 10B through the mounting unit 66 to move the focus point of the laser light L2 only one line inside from the other end of the object 100 in the Y direction. It is assumed that the object 100 is located at a position on C and inside the object 100. At this time, the position of the focal point of the laser beam L1 in the X direction and the position of the focal point of the laser beam L2 in the X direction match.
  • the control unit 9 moves the support unit 7 in the X direction (opposite direction to the X direction in the case of reciprocating operation) to move the inside of the object 100 along each line C in the X direction (reciprocating direction).
  • the focus points of the laser beams L1 and L2 are moved in the direction opposite to the X direction).
  • the first scan process and the second scan process for the respective lines C are simultaneously started and simultaneously completed. That is, also here, the first scan process and the second scan process overlap in their entirety.
  • the modified region M is further formed inside the object 100 along the pair of lines C.
  • the modified region M is shown as a solid line for the sake of explanation, but it is not necessary that the modified region M is actually visible from the surface of the object 100. ..
  • the positional relationship between the laser processing head 10A and the laser processing head 10B in the region inside the object 100 is such that the mutual distance is in the Y direction.
  • the unprocessed line C remains in the region of the object 100 corresponding to the distance D between the respective light condensing units 14 and in a positional relationship that does not shrink further.
  • the control unit 9 executes the following processing.
  • the control unit 9 retracts the laser processing head 10A while 2 Continue the scanning process. That is, after that, only the second scan process using the laser processing head 10B is executed.
  • the second scan process is sequentially performed in the Y direction from the line C closest to the laser processing head 10A toward the outer side in the Y direction (in the direction of arrow R1). You may execute.
  • the control unit 9 moves the imaging unit IR to the completed processing line C via the mounting unit 65 as shown in FIG. An image capturing process of capturing an image of the region of the object 100 including the line C by the image capturing unit IR is executed.
  • the control unit 9 determines whether or not the modified region M and / or a crack extending from the modified region M is formed in the target object 100 in the region based on the image obtained by the imaging process according to the regulation. Is determined.
  • the control unit 9 may make the determination by checking the modified region M itself, or may make the determination by checking the presence or the position of the tip of the crack extending from the modified region M.
  • the control unit 9 detects that an unprocessed region RS is generated along the line C where the modified region M should be formed in the image.
  • the control unit 9 executes an auxiliary processing process for scanning the laser beam L1 along the line C again.
  • the modified region M is formed along the line C where the unprocessed region RS was generated.
  • control unit 9 determines that the modified region M and / or the crack is not formed in accordance with the regulation as a result of the determination, the control unit 9 outputs at least the laser light L1 along the line C. Auxiliary processing is performed to perform scanning again.
  • the control unit 9 can perform the imaging process at at least one place on the line C in the object 100.
  • the laser processing apparatus 1 is movable along the X direction, and is disposed so as to face each other along the Y direction and a support portion 7 for supporting the object 100 along the X direction and the Y direction.
  • Laser processing heads 10A and 10B for irradiating the object 100 supported by the support portion 7 with the laser beams L1 and L2 are provided. Further, in the laser processing apparatus 1, the laser processing head 10A is attached, the mounting portion 65 that is movable along the Y direction and the Z direction, and the laser processing head 10B are attached, and the Y direction and the Z direction. And a mounting portion 66 that is movable along each of the.
  • the laser processing device 1 is equipped with an imaging unit IR that is mounted on the mounting portion 65 and that captures an image of the target object 100 with light that passes through the target object 100.
  • the laser processing head 10A and the laser processing head 10B are arranged on the support portion 7 supporting the object 100 so as to face each other.
  • the laser processing head 10A and the laser processing head 10B are independently movable via two mounting portions 65 and 66 in two directions intersecting with each other. For this reason, it is possible to perform laser processing at two locations on the object 100 independently of each other by scanning the laser beams L1 and L2. Therefore, the throughput can be improved.
  • An image pickup unit IR for picking up an image of the target object 100 by the light transmitted through the target object 100 is further mounted on the mounting portion 65 that is responsible for moving the laser processing head 10A. Therefore, for example, while performing the laser processing by the laser processing head 10B, another part of the object 100 can be imaged by the imaging unit IR. Therefore, the state of laser processing can be confirmed nondestructively while suppressing the decrease in throughput. That is, according to the laser processing apparatus 1, it is possible to confirm the success or failure of the laser processing nondestructively while improving the throughput.
  • the laser processing apparatus 1 moves the support portion 7, the mounting portion 65, and the mounting portion 66, irradiates the laser light L1 and L2 from the laser processing head 10A and the laser processing head 10B, and targets the imaging unit IR.
  • a control unit 9 for controlling the imaging of the object 100 is further provided.
  • a plurality of lines C extending along the X direction and arranged along the Y direction are set on the object 100.
  • the control unit 9 scans one line C of the plurality of lines C with the laser beam L1 from the laser processing head 10a in the X direction, and another line of the plurality of lines C.
  • the second scan processing of scanning the laser beam L2 from the laser processing head 10B in the X direction with respect to C is performed at least partially in a redundant manner.
  • the control unit 9 executes an image capturing process of capturing an image of the region of the target object 100 including the processed line C by the image capturing unit IR while performing only the second scan process.
  • the throughput can be improved.
  • the imaging processing can be performed by controlling the imaging unit IR that can move together with the laser processing head 10A. Therefore, it is possible to confirm the success or failure of the laser processing more reliably and nondestructively while improving the throughput.
  • the control unit 9 determines whether or not the modified region M and / or the crack is formed in the target object 100 in the region in accordance with the regulation based on the image obtained by the imaging process. If it is determined that the modified region M and / or the crack is not formed in accordance with the regulation as a result of the determination, the laser beam L1 is scanned at least along the line C again. Perform the auxiliary processing that you want to perform. Therefore, the auxiliary machining process compensates for the machining error.
  • the control unit 9 sequentially moves from the line C located at one end of the target object 100 in the Y direction of the plurality of lines C toward the inner line C in the second direction.
  • the second scan process is sequentially performed from the line C located at the other end in the Y direction of the target object 100 among the plurality of lines C toward the line C inside in the Y direction.
  • Perform the main processing As described above, in the main processing, the first scan process and the second scan process are sequentially performed from the line C at the symmetrical position of the object 100 in the Y direction, so that the focus points of the laser beams L1 and L2 are Waste of relative movement along the X direction with respect to the object 100 is eliminated, and throughput is further improved.
  • the control unit 9 retracts the laser processing head 10A from the area.
  • the second scanning process is continued and the imaging process is executed. In this case, it is possible to confirm the success or failure of the laser processing nondestructively while maximally utilizing the laser processing head 10A and the laser processing head 10B to improve the throughput.
  • the laser processing apparatus according to the present disclosure is not limited to the laser processing apparatus 1 described above, and can be arbitrarily modified.
  • the mounting portion 65 is provided on the first wall portion 21 of the housing 11 of the laser processing head 10A, while the mounting portion 66 is mounted on the first wall of the housing 11 of the laser processing head 10B. You may provide in the part 21.
  • the mounting portion 65 is provided on the third wall portion 23 of the housing 11 of the laser processing head 10A, while the mounting portion 66 is mounted on the housing 11 of the laser processing head 10B. In the aspect provided in the third wall portion 23, the positions of the moving portions 63 and 64 in the attachment portions 65 and 66 may be staggered in the X direction.
  • the mounting portion 65 is provided on the second wall portion 22 of the housing 11 of the laser processing head 10A, while the mounting portion 66 is mounted on the second wall portion 22 of the housing 11 of the laser processing head 10B. You may provide in the 2 wall part 22.
  • the mounting portion 65 is provided on the fifth wall portion 25 of the housing 11 of the laser processing head 10A, while the mounting portion 66 is mounted on the housing 11 of the laser processing head 10B. It may be provided on the five wall portion 25.
  • the mounting portion 65 is provided on the sixth wall portion 26 of the housing 11 of the laser processing head 10A, while the mounting portion 66 is mounted on the sixth wall portion 26 of the housing 11 of the laser processing head 10B. It may be provided on the six wall portion 26.
  • the attachment portions 65 and 66 may be attached to the respective wall portions different from the fourth wall portion 24 facing each other along the Y direction.
  • the condensing portion 14 is provided in the central portion of the housing 11 in the X direction. Good.
  • the laser processing apparatus 1 does not have to use the laser processing head 10A and the laser processing head 10B as the pair of laser processing heads. That is, in the laser processing apparatus 1, a pair (one type) of laser processing heads 10A is used as shown in FIG. 17A, or a pair of laser processing heads 10A is used as shown in FIG. A laser processing head 10B (another type) can be used. In these cases, the laser processing heads 10A and 10B on one side are rotated by 180 ° about the Z-axis direction with respect to the laser processing heads 10A and 10B on the other side, respectively. They are arranged so that their center positions coincide with each other. In these cases, it is not necessary to prepare two types of laser processing heads.
  • the wall portion provided with the mounting portions 65 and 66 can be variously changed.
  • the mounting portion 65 is provided on the first wall portion 21 of the housing 11 of one laser processing head 10A while the mounting portion 65 of the housing 11 of one laser processing head 10A is provided.
  • a mounting portion 66 can be provided on the two wall portion 22.
  • the mounting portion 65 is provided on the second wall portion 22 of the housing 11 of one laser processing head 10B while the mounting portion 65 of the housing 11 of one laser processing head 10B is provided.
  • the mounting portion 66 may be provided on the one wall portion 21. That is, even in these cases, the attachment portions 65 and 66 may be attached to the respective wall portions different from the fourth wall portion 24 facing each other along the Y direction.
  • the mode in which the imaging unit IR is attached to the attachment portion 65 to which the laser processing head 10A is attached has been described.
  • the image pickup unit IR may be attached to the attachment portion 66 to which the laser processing head 10B is attached, and the image pickup process may be performed when only the first scan process is being executed.
  • the image pickup unit IR is not limited to being attached to the attachment portions 65 and 66, and is a position that can move in the Y direction and the Z direction together with the laser processing head 10A (or the laser processing head 10B), and the laser. It may be provided at an arbitrary position which is not interposed between the fourth wall portion 24 of the processing head 10A and the fourth wall portion 24 of the laser processing head 10B.
  • the control unit 9 processes the object 100 at the wavelengths different from each other by the laser beam L1 from the laser processing head 10A and the laser beam L2 from the laser processing head 10B, and at the converging position in the Z direction. You may make it perform a process (multi-wavelength processing).
  • the multi-wavelength processing is performed, for example, when processing a wafer in which silicon (Si) and glass are bonded (first case) or when a part of the laser beams L1 and L2 incident from the back surface side is absorbed by the device. This can be used, for example, when processing a wafer in which circuit damage may occur (second case).
  • both the light with a wavelength for processing silicon (for example, 1064 nm) and the light with a wavelength for processing glass (for example, 532 nm) need to reach the target material, so processing is performed from the glass side.
  • the converging position of the laser beam L1 from the laser processing head 10A is aligned in the silicon through the glass, and the converging position of the laser beam L2 from the laser processing head 10B is aligned in the glass, and processing is performed at the corresponding wavelength.
  • the wavelength for processing the lower part of the wavelength is the wavelength that transmits the upper base material. Need to be Here, since the multi-wavelength processing is performed using the pair of laser processing heads 10A and 10B, the throughput can be improved.
  • the focus position of the laser beam L1 from the laser processing head 10A is set near the device, and the focus position of the laser beam L2 from the laser processing head 10B is set at a position away from the device.
  • the wavelength of the laser light L1 is set to a wavelength (for example, 1064 nm) at which the base material has more absorption so that the amount of light passing to the device side is reduced, and the wavelength of the laser light L2 is set to a value even if some light is emitted.
  • the wavelength (for example, 1342 nm) longer than the wavelength of the laser beam L1 suitable for processing the base material can be set.
  • a laser processing device that can confirm the success or failure of laser processing nondestructively while improving throughput.
  • SYMBOLS 1 ... Laser processing device, 7 ... Support part, 9 ... Control part, 10A ... Laser processing head (1st laser processing head), 10B ... Laser processing head (2nd laser processing head), 65 ... Mounting part (1st mounting) Part), 66 ... Mounting part (second mounting part), 100 ... Object, C ... Line, IR ... Imaging unit, L1, L2 ... Laser light.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un dispositif d'usinage au laser comprenant : une section de support qui peut se déplacer le long d'une première direction et qui supporte un objet le long de la première direction et d'une deuxième direction qui croise la première direction ; une première tête d'usinage au laser et une seconde tête d'usinage au laser qui sont disposées de manière à s'opposer l'une à l'autre le long de la deuxième direction et qui émettent des faisceaux laser sur l'objet supporté par la section de support ; une première unité de fixation à laquelle la première tête d'usinage au laser est fixée et qui peut se déplacer le long d'une troisième direction qui croise la première direction et la deuxième direction et qui peut se déplacer le long de la deuxième direction ; une seconde unité de fixation à laquelle la seconde tête d'usinage au laser est fixée et qui peut se déplacer le long de la deuxième direction et de la troisième direction ; et une unité d'imagerie qui est fixée à la première unité de fixation et qui image l'objet à l'aide de la lumière traversant l'objet.
PCT/JP2019/042586 2018-10-30 2019-10-30 Dispositif d'usinage au laser WO2020090891A1 (fr)

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