TW202023726A - 雷射加工裝置 - Google Patents

雷射加工裝置 Download PDF

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Publication number
TW202023726A
TW202023726A TW108139286A TW108139286A TW202023726A TW 202023726 A TW202023726 A TW 202023726A TW 108139286 A TW108139286 A TW 108139286A TW 108139286 A TW108139286 A TW 108139286A TW 202023726 A TW202023726 A TW 202023726A
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TW
Taiwan
Prior art keywords
laser processing
processing head
laser
light
line
Prior art date
Application number
TW108139286A
Other languages
English (en)
Chinese (zh)
Other versions
TWI848997B (zh
Inventor
坂本剛志
奥間惇治
Original Assignee
日商濱松赫德尼古斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商濱松赫德尼古斯股份有限公司 filed Critical 日商濱松赫德尼古斯股份有限公司
Publication of TW202023726A publication Critical patent/TW202023726A/zh
Application granted granted Critical
Publication of TWI848997B publication Critical patent/TWI848997B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW108139286A 2018-10-30 2019-10-30 雷射加工裝置 TWI848997B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018203675A JP7219590B2 (ja) 2018-10-30 2018-10-30 レーザ加工装置
JP2018-203675 2018-10-30

Publications (2)

Publication Number Publication Date
TW202023726A true TW202023726A (zh) 2020-07-01
TWI848997B TWI848997B (zh) 2024-07-21

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Also Published As

Publication number Publication date
KR20210082486A (ko) 2021-07-05
WO2020090891A1 (fr) 2020-05-07
CN113039036B (zh) 2023-08-29
CN113039036A (zh) 2021-06-25
JP2020069488A (ja) 2020-05-07
JP7219590B2 (ja) 2023-02-08

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