TW202023726A - 雷射加工裝置 - Google Patents
雷射加工裝置 Download PDFInfo
- Publication number
- TW202023726A TW202023726A TW108139286A TW108139286A TW202023726A TW 202023726 A TW202023726 A TW 202023726A TW 108139286 A TW108139286 A TW 108139286A TW 108139286 A TW108139286 A TW 108139286A TW 202023726 A TW202023726 A TW 202023726A
- Authority
- TW
- Taiwan
- Prior art keywords
- laser processing
- processing head
- laser
- light
- line
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018203675A JP7219590B2 (ja) | 2018-10-30 | 2018-10-30 | レーザ加工装置 |
JP2018-203675 | 2018-10-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202023726A true TW202023726A (zh) | 2020-07-01 |
TWI848997B TWI848997B (zh) | 2024-07-21 |
Family
ID=
Also Published As
Publication number | Publication date |
---|---|
KR20210082486A (ko) | 2021-07-05 |
WO2020090891A1 (fr) | 2020-05-07 |
CN113039036B (zh) | 2023-08-29 |
CN113039036A (zh) | 2021-06-25 |
JP2020069488A (ja) | 2020-05-07 |
JP7219590B2 (ja) | 2023-02-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201518035A (zh) | 加工裝置 | |
TW202023726A (zh) | 雷射加工裝置 | |
TWI848997B (zh) | 雷射加工裝置 | |
TWI825210B (zh) | 雷射加工裝置 | |
TWI834747B (zh) | 雷射加工裝置 | |
KR20230002713A (ko) | 레이저 가공 장치 | |
JP7402814B2 (ja) | レーザ加工ヘッド及びレーザ加工装置 | |
JP7475952B2 (ja) | レーザ加工ヘッド及びレーザ加工装置 | |
KR102685373B1 (ko) | 레이저 가공 장치 | |
TWI837204B (zh) | 雷射加工裝置 | |
JP7438009B2 (ja) | レーザ加工装置 | |
KR20210029107A (ko) | 레이저 가공 장치의 광축 확인 방법 | |
JP2005114587A (ja) | シリコンウェハの検査装置および検査方法 |