WO2021221061A1 - Tête de traitement laser et dispositif de traitement laser - Google Patents

Tête de traitement laser et dispositif de traitement laser Download PDF

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Publication number
WO2021221061A1
WO2021221061A1 PCT/JP2021/016817 JP2021016817W WO2021221061A1 WO 2021221061 A1 WO2021221061 A1 WO 2021221061A1 JP 2021016817 W JP2021016817 W JP 2021016817W WO 2021221061 A1 WO2021221061 A1 WO 2021221061A1
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WO
WIPO (PCT)
Prior art keywords
wall portion
laser
unit
housing
incident
Prior art date
Application number
PCT/JP2021/016817
Other languages
English (en)
Japanese (ja)
Inventor
剛志 坂本
Original Assignee
浜松ホトニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 浜松ホトニクス株式会社 filed Critical 浜松ホトニクス株式会社
Priority to CN202180031324.XA priority Critical patent/CN115461182A/zh
Priority to KR1020227034780A priority patent/KR20230002363A/ko
Publication of WO2021221061A1 publication Critical patent/WO2021221061A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms

Definitions

  • This disclosure relates to a laser processing head and a laser processing apparatus.
  • Patent Document 1 describes a laser processing device including a holding mechanism for holding a work and a laser irradiation mechanism for irradiating a work held by the holding mechanism with a laser beam.
  • a laser irradiation mechanism having a condensing lens is fixed to the base, and the movement of the work along the direction perpendicular to the optical axis of the condensing lens is performed by the holding mechanism. Will be implemented.
  • An object of the present disclosure is to provide a laser processing head capable of accurately condensing laser light, and a laser processing apparatus including such a laser processing head.
  • the laser processing head on one side of the present disclosure includes a first wall portion and a second wall portion facing each other in the first direction, and a third wall portion and a fourth wall portion facing each other in the second direction perpendicular to the first direction. , And a housing having a fifth wall portion and a sixth wall portion facing each other in a third direction perpendicular to the first direction and the second direction, and a housing arranged on the first wall portion or the fifth wall portion in the housing.
  • the laser light adjusting unit has an optical axis adjusting unit for adjusting the optical axis of the laser light incident from the incident portion, and the incident portion includes a condensing unit that collects light and emits light to the outside of the housing.
  • the light collecting portion is biased toward the first wall portion in the first direction, and the condensing portion is biased toward the second wall portion in the first direction.
  • an optical axis adjusting unit for adjusting the optical axis of the laser light incident from the incident portion is arranged on the optical path of the laser light from the incident portion to the condensing portion.
  • the optical axis of the laser light incident on the condensing portion is focused on the condensing portion.
  • the incident portion is offset toward the first wall portion of the housing in the first direction
  • the condensing portion is offset toward the second wall portion of the housing in the first direction.
  • the laser light can be collected with high accuracy.
  • the incident portion is arranged on the fifth wall portion
  • the laser light adjusting portion includes the first reflecting portion, the attenuator, the beam expander, the second reflecting portion, and the reflective space. It further has an optical modulator and an imaging optical system, the first reflecting part reflects the laser light incident from the incident part toward the second wall part, and the attenuator is the laser light reflected by the first reflecting part.
  • the output is adjusted, the optical axis adjustment unit reflects the laser light whose output has been adjusted by the attenuator toward the sixth wall, and the beam expander expands the diameter of the laser light reflected by the optical axis adjustment unit.
  • the second reflector reflects the laser beam whose diameter has been expanded by the beam expander toward the first wall and the fifth wall, and the reflective spatial light modulator is reflected by the second reflector. While modulating the laser light, it is reflected toward the 6th wall, and the imaging optical system is a bilateral telecentric optical system in which the reflecting surface of the reflective spatial light modulator and the incident pupil surface of the condensing unit are in an imaging relationship. It may be configured. According to this, the optical axis of the laser light incident on the "beam expander, the second reflecting part, the reflective spatial light modulator, the imaging optical system and the condensing part", which is a configuration related to the molding of the laser light, is adjusted. Therefore, the laser beam can be focused more accurately. Further, since the attenuator is arranged between the first reflecting portion and the optical axis adjusting portion, it is possible to suppress the increase in size of the housing due to the application of the attenuator.
  • the incident portion is arranged on the fifth wall portion
  • the laser light adjusting portion includes an attenuator, a first reflecting portion, a beam expander, a second reflecting portion, and a reflective space. It further has an optical modulator and an imaging optical system, the optical axis adjusting unit reflects the laser light incident from the incident part toward the second wall part, and the attenuator is the laser light reflected by the optical axis adjusting unit. The output is adjusted, the first reflecting part reflects the laser light whose output is adjusted by the attenuator toward the sixth wall part, and the beam expander expands the diameter of the laser light reflected by the first reflecting part.
  • the second reflector reflects the laser beam whose diameter has been expanded by the beam expander toward the first wall and the fifth wall, and the reflective spatial light modulator is reflected by the second reflector. While modulating the laser light, it is reflected toward the 6th wall, and the imaging optical system is a bilateral telecentric optical system in which the reflecting surface of the reflective spatial light modulator and the incident pupil surface of the condensing unit are in an imaging relationship. It may be configured. According to this, the optical axis of the laser light incident on the "beam expander, the second reflecting part, the reflective spatial light modulator, the imaging optical system and the condensing part", which is a configuration related to the molding of the laser light, is adjusted. Therefore, the laser beam can be focused more accurately. Further, since the attenuator is arranged between the optical axis adjusting portion and the first reflecting portion, it is possible to suppress the increase in size of the housing due to the application of the attenuator.
  • the incident portion is arranged on the first wall portion
  • the laser light adjusting portion includes an attenuator, a beam expander, a reflecting portion, a reflective spatial light modulator, and imaging optics.
  • the attenuator adjusts the output of the laser light incident from the incident part
  • the optical axis adjusting part reflects the laser light whose output is adjusted by the attenuator toward the sixth wall part, and the beam expander.
  • the reflecting unit reflects the laser light whose diameter has been expanded by the beam expander to the first wall side and the fifth wall side and reflects it.
  • the type spatial light modulator reflects the laser beam reflected by the reflecting portion toward the sixth wall side, and the imaging optical system is the incident pupil of the reflecting surface of the reflective spatial light modulator and the condensing portion.
  • a bilateral telecentric optical system in which the surface is in an imaging relationship may be configured. According to this, it is possible to adjust the optical axis of the laser light incident on the "beam expander, reflecting unit, reflective spatial light modulator, imaging optical system and condensing unit" which is a configuration related to the molding of the laser light. Therefore, the laser beam can be focused more accurately. Further, since the attenuator is arranged between the incident portion and the optical axis adjusting portion, it is possible to suppress the increase in size of the housing due to the application of the attenuator.
  • the distance between the third wall portion and the fourth wall portion is smaller than the distance between the first wall portion and the second wall portion, and the housing is the first wall portion.
  • the housing is configured so that the housing can be attached to the mounting portion in a state where at least one of the second wall portion, the third wall portion, and the fifth wall portion is arranged on the mounting portion side of the laser processing apparatus, and the incident portion and the incident portion and the fifth wall portion are configured.
  • the light collecting portion may be offset toward the fourth wall portion in the second direction.
  • the condensing unit can be brought closer to the other configuration.
  • the distance between the third wall portion and the fourth wall portion is smaller than the distance between the first wall portion and the second wall portion, the third wall portion and the fourth wall portion are along the second direction facing each other.
  • the space occupied by the housing can be reduced.
  • the incident portion and the condensing portion are offset toward the fourth wall portion in the second direction, another configuration is arranged in the region on the third wall portion side with respect to the laser light adjusting portion in the region inside the housing. The area can be effectively used.
  • the laser processing head on one side of the present disclosure may further include a circuit unit arranged on the third wall side with respect to the laser light adjusting unit in the housing. According to this, it is possible to effectively utilize the region on the third wall side with respect to the laser light adjusting portion in the region inside the housing.
  • a partition wall portion for partitioning a region inside the housing into a region on the third wall side and a region on the fourth wall side is provided in the housing, and laser light is provided.
  • the adjusting unit is arranged on the fourth wall side with respect to the partition wall portion in the housing, and the circuit unit is arranged on the third wall portion side with respect to the partition wall portion in the housing. good. According to this, since the heat generated in the circuit section is difficult to be transferred to the laser light adjusting section, it is possible to suppress the distortion caused by the heat generated in the circuit section in the laser light adjusting section, and the laser light can be appropriately transmitted. Can be adjusted. Further, for example, the circuit portion can be efficiently cooled in the region on the third wall side of the region inside the housing by air cooling or water cooling.
  • the laser light adjusting portion may be attached to the partition wall portion. According to this, the laser light adjusting unit can be reliably and stably supported in the housing.
  • the circuit portion may be separated from the partition wall portion. According to this, it is possible to more reliably suppress the heat generated in the circuit section from being transmitted to the laser light adjusting section through the partition wall section.
  • the laser processing head on one side of the present disclosure outputs measurement light for measuring the distance between the surface of the object and the condensing portion, and the measurement light reflected on the surface of the object via the condensing portion.
  • a measurement unit that detects the light and a dichroic mirror that reflects the measurement light and transmits the laser light are further provided. It may be arranged between the light adjusting unit and the condensing unit. According to this, it is possible to perform processing based on the measurement result of the distance between the surface of the object and the condensing portion in the laser processing apparatus while effectively utilizing the area inside the housing.
  • the measuring unit may be arranged on the first wall side with respect to the condensing unit in the housing. According to this, it is possible to perform processing based on the measurement result of the distance between the surface of the object and the condensing portion in the laser processing apparatus while more effectively utilizing the area inside the housing.
  • the laser processing head on one side of the present disclosure outputs an observation light for observing the surface of the object, and further provides an observation unit for detecting the observation light reflected on the surface of the object via the condensing unit.
  • the observation unit may be arranged on the first wall side with respect to the light condensing unit in the housing. According to this, it is possible to perform processing based on the observation result of the surface of the object in the laser processing apparatus while effectively utilizing the area inside the housing.
  • the laser processing head on one side of the present disclosure further includes a drive unit that moves the condensing unit along the third direction, and the circuit unit may control the drive unit based on the signal output from the measurement unit. good. According to this, the position of the condensing point of the laser beam can be adjusted based on the measurement result of the distance between the surface of the object and the condensing portion.
  • the laser processing apparatus on one side of the present disclosure includes the first laser processing head and the second laser processing head, which are the laser processing heads, the first mounting portion to which the housing of the first laser processing head is mounted, and the second.
  • Each of the first mounting portion and the second mounting portion is provided with a supporting portion for supporting, and each of the first mounting portion and the second mounting portion moves along the second direction, and the first housing, which is the housing of the first laser processing head, is the first housing.
  • the fourth wall of the body is located on the second laser processing head side with respect to the third wall of the first housing, and the sixth wall of the first housing is relative to the fifth wall of the first housing.
  • the second housing which is mounted on the first mounting portion so as to be located on the support portion side and is the housing of the second laser processing head, has the fourth wall portion of the second housing as the second housing.
  • the sixth wall portion of the second housing is located on the support portion side with respect to the fifth wall portion of the second housing so as to be located on the first laser processing head side with respect to the third wall portion of the second housing. 2 It is attached to the mounting part.
  • the object can be processed efficiently and accurately.
  • each of the first mounting portion and the second mounting portion may move along the third direction. According to this, the object can be processed more efficiently.
  • the support portion may move along the first direction and rotate about an axis parallel to the third direction as a center line. According to this, the object can be processed more efficiently.
  • the laser processing apparatus on one side of the present disclosure includes the laser processing head, a mounting portion to which the housing of the laser processing head is mounted, and a light source unit that outputs laser light incident on the incident portion of the laser processing head.
  • a support portion for supporting an object is provided, and the mounting portion moves along a second direction.
  • the laser light is collected with high accuracy by the laser processing head, so that the object can be processed with high accuracy.
  • the mounting portion may move along the third direction. According to this, the object can be processed efficiently.
  • the support portion may move along the first direction and rotate about an axis parallel to the third direction as a center line. According to this, the object can be processed efficiently.
  • FIG. 1 is a perspective view of the laser processing apparatus of one embodiment.
  • FIG. 2 is a front view of a part of the laser processing apparatus shown in FIG.
  • FIG. 3 is a front view of the laser processing head of the laser processing apparatus shown in FIG.
  • FIG. 4 is a side view of the laser machining head shown in FIG.
  • FIG. 5 is a block diagram of the optical system of the laser processing head shown in FIG.
  • FIG. 6 is a block diagram of the optical system of the laser processing head of the modified example.
  • FIG. 7 is a block diagram of the optical system of the laser processing head of the modified example.
  • FIG. 8 is a perspective view of the laser processing apparatus of the modified example.
  • the laser machining apparatus 1 includes a plurality of moving mechanisms 5, 6 and a support portion 7, and a pair of laser machining heads (first laser machining head, second laser machining head) 10A, 10B.
  • a light source unit 8 and a control unit 9 are provided.
  • the first direction is referred to as the X direction
  • the second direction perpendicular to the first direction is referred to as the Y direction
  • the third direction perpendicular to the first direction and the second direction is referred to as the Z direction.
  • the X direction and the Y direction are horizontal directions
  • the Z direction is a vertical direction.
  • the moving mechanism 5 has a fixed portion 51, a moving portion 53, and a mounting portion 55.
  • the fixing portion 51 is attached to the device frame 1a.
  • the moving portion 53 is attached to a rail provided on the fixed portion 51, and can move along the Y direction.
  • the mounting portion 55 is mounted on a rail provided on the moving portion 53, and can move along the X direction.
  • the moving mechanism 6 includes a fixed portion 61, a pair of moving portions (first moving portion, second moving portion) 63, 64, and a pair of mounting portions (first mounting portion, second mounting portion) 65, 66. And have.
  • the fixing portion 61 is attached to the device frame 1a.
  • Each of the pair of moving portions 63 and 64 is attached to a rail provided on the fixed portion 61, and each of them can move independently in the Y direction.
  • the mounting portion 65 is mounted on a rail provided on the moving portion 63, and can move along the Z direction.
  • the mounting portion 66 is mounted on a rail provided on the moving portion 64 and can move along the Z direction. That is, with respect to the device frame 1a, each of the pair of mounting portions 65 and 66 can move along the Y direction and the Z direction, respectively.
  • the support portion 7 is attached to a rotating shaft provided in the mounting portion 55 of the moving mechanism 5, and can rotate with an axis parallel to the Z direction as the center line. That is, the support portion 7 can move along each of the X direction and the Y direction, and can rotate with the axis parallel to the Z direction as the center line.
  • the support portion 7 supports the object 100.
  • the object 100 is, for example, a wafer.
  • the laser machining head 10A is attached to the attachment portion 65 of the moving mechanism 6.
  • the laser processing head 10A irradiates the object 100 supported by the support portion 7 with the laser beam (first laser beam) L1 in a state of facing the support portion 7 in the Z direction.
  • the laser machining head 10B is attached to the attachment portion 66 of the moving mechanism 6.
  • the laser processing head 10B irradiates the object 100 supported by the support portion 7 with the laser beam (second laser beam) L2 in a state of facing the support portion 7 in the Z direction.
  • the light source unit 8 has a pair of light sources 81 and 82.
  • the pair of light sources 81 and 82 are attached to the device frame 1a.
  • the light source 81 outputs the laser beam L1.
  • the laser beam L1 is emitted from the exit portion 81a of the light source 81, and is guided to the laser processing head 10A by the optical fiber 2.
  • the light source 82 outputs the laser beam L2.
  • the laser beam L2 is emitted from the exit portion 82a of the light source 82, and is guided to the laser processing head 10B by another optical fiber 2.
  • the control unit 9 controls each unit of the laser processing device 1 (a plurality of moving mechanisms 5, 6, a pair of laser processing heads 10A, 10B, a light source unit 8, etc.).
  • the control unit 9 is configured as a computer device including a processor, a memory, a storage, a communication device, and the like.
  • software program read into the memory or the like is executed by the processor, and reading and writing of data in the memory and storage and communication by the communication device are controlled by the processor.
  • the control unit 9 realizes various functions.
  • An example of processing by the laser processing apparatus 1 configured as described above will be described.
  • An example of this processing is an example in which a modification region is formed inside the object 100 along each of a plurality of lines set in a grid pattern in order to cut the object 100, which is a wafer, into a plurality of chips. be.
  • the moving mechanism 5 moves the support portion 7 along the X direction and the Y direction so that the support portion 7 supporting the object 100 faces the pair of laser machining heads 10A and 10B in the Z direction. To move. Subsequently, the moving mechanism 5 rotates the support portion 7 with the axis parallel to the Z direction as the center line so that the plurality of lines extending in one direction in the object 100 are along the X direction.
  • the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the condensing point of the laser beam L1 is located on one line extending in one direction.
  • the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the condensing point of the laser beam L2 is located on another line extending in one direction.
  • the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the condensing point of the laser beam L1 is located inside the object 100.
  • the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the focusing point of the laser beam L2 is located inside the object 100.
  • the light source 81 outputs the laser light L1 and the laser processing head 10A irradiates the object 100 with the laser light L1, the light source 82 outputs the laser light L2, and the laser processing head 10B lasers the object 100. Irradiate light L2.
  • the focusing point of the laser beam L1 moves relatively along one line extending in one direction, and the focusing point of the laser beam L2 is relative to the other line extending in one direction.
  • the moving mechanism 5 moves the support portion 7 along the X direction so as to move in a targeted manner. In this way, the laser machining apparatus 1 forms a modified region inside the object 100 along each of the plurality of lines extending in one direction in the object 100.
  • the moving mechanism 5 rotates the support portion 7 with the axis parallel to the Z direction as the center line so that a plurality of lines extending in the other direction orthogonal to one direction of the object 100 are along the X direction. ..
  • the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the condensing point of the laser beam L1 is located on one line extending in the other direction.
  • the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the condensing point of the laser beam L2 is located on another line extending in the other direction.
  • the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the condensing point of the laser beam L1 is located inside the object 100.
  • the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the focusing point of the laser beam L2 is located inside the object 100.
  • the light source 81 outputs the laser light L1 and the laser processing head 10A irradiates the object 100 with the laser light L1, the light source 82 outputs the laser light L2, and the laser processing head 10B lasers the object 100. Irradiate light L2.
  • the focusing point of the laser beam L1 moves relatively along one line extending in the other direction, and the focusing point of the laser beam L2 is relative to the other line extending in the other direction.
  • the moving mechanism 5 moves the support portion 7 along the X direction so as to move in a targeted manner. In this way, the laser machining apparatus 1 forms a modified region inside the object 100 along each of a plurality of lines extending in the other direction orthogonal to one direction in the object 100.
  • the light source 81 outputs the laser beam L1 having transparency to the object 100 by, for example, a pulse oscillation method, and the light source 82 is directed to the object 100 by, for example, a pulse oscillation method.
  • the laser beam L2 having transparency is output.
  • the laser light is focused inside the object 100, the laser light is particularly absorbed at the portion corresponding to the focusing point of the laser light, and a modified region is formed inside the object 100.
  • the modified region is a region in which the density, refractive index, mechanical strength, and other physical properties are different from those of the surrounding non-modified region. Examples of the modified region include a melting treatment region, a crack region, a dielectric breakdown region, a refractive index change region, and the like.
  • a plurality of modified spots are lined up. It is formed so as to line up in a row along the line.
  • One modified spot is formed by irradiation with one pulse of laser light.
  • a modification region in one row is a set of a plurality of modification spots arranged in one row. Adjacent modified spots may be connected to each other or separated from each other depending on the relative moving speed of the focusing point of the laser light with respect to the object 100 and the repetition frequency of the laser light.
  • the laser processing head 10A includes a housing 11, an incident portion 12, a laser light adjusting portion 13, and a condensing portion 14.
  • the housing 11 has a first wall portion 21, a second wall portion 22, a third wall portion 23 and a fourth wall portion 24, and a fifth wall portion 25 and a sixth wall portion 26.
  • the first wall portion 21 and the second wall portion 22 face each other in the X direction.
  • the third wall portion 23 and the fourth wall portion 24 face each other in the Y direction.
  • the fifth wall portion 25 and the sixth wall portion 26 face each other in the Z direction.
  • the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22.
  • the distance between the first wall portion 21 and the second wall portion 22 is smaller than the distance between the fifth wall portion 25 and the sixth wall portion 26.
  • the distance between the first wall portion 21 and the second wall portion 22 may be equal to the distance between the fifth wall portion 25 and the sixth wall portion 26, or the fifth wall portion 25 and the sixth wall portion 26. It may be larger than the distance to the part 26.
  • the first wall portion 21 is located on the side opposite to the fixed portion 61 of the moving mechanism 6, and the second wall portion 22 is located on the fixed portion 61 side.
  • the third wall portion 23 is located on the mounting portion 65 side of the moving mechanism 6, and the fourth wall portion 24 is located on the opposite side of the mounting portion 65 and on the laser machining head 10B side (FIG. 6). 2).
  • the fifth wall portion 25 is located on the side opposite to the support portion 7, and the sixth wall portion 26 is located on the support portion 7 side.
  • the housing 11 is configured so that the housing 11 can be mounted on the mounting portion 65 with the third wall portion 23 arranged on the mounting portion 65 side of the moving mechanism 6. Specifically, it is as follows.
  • the mounting portion 65 includes a base plate 65a and a mounting plate 65b.
  • the base plate 65a is attached to a rail provided on the moving portion 63 (see FIG. 2).
  • the mounting plate 65b is erected at the end of the base plate 65a on the laser machining head 10B side (see FIG. 2).
  • the housing 11 is attached to the mounting portion 65 by screwing the bolt 28 into the mounting plate 65b via the pedestal 27 in a state where the third wall portion 23 is in contact with the mounting plate 65b.
  • the pedestal 27 is provided on each of the first wall portion 21 and the second wall portion 22.
  • the housing 11 is removable from the mounting portion 65.
  • the incident portion 12 is arranged on the fifth wall portion 25.
  • the incident portion 12 causes the laser beam L1 to enter the housing 11.
  • the incident portion 12 is offset toward the first wall portion 21 in the X direction, and is offset toward the fourth wall portion 24 in the Y direction. That is, the distance between the incident portion 12 and the first wall portion 21 in the X direction is smaller than the distance between the incident portion 12 and the second wall portion 22 in the X direction, and the incident portion 12 and the fourth wall portion 24 in the Y direction.
  • the distance to and from is smaller than the distance between the incident portion 12 and the third wall portion 23 in the X direction.
  • the exit end 2a of the optical fiber 2 is connected to the incident portion 12.
  • the incident portion 12 is a portion including a hole 25a formed in the fifth wall portion 25.
  • the fifth wall portion 25 is provided with a mounting portion 25b.
  • the main body portion 2b of the exit end portion 2a is attached to the attachment portion 25b by a bolt or the like.
  • the tip portion 2c of the exit end portion 2a is inserted into the hole 25a.
  • the exit end 2a of the optical fiber 2 is removable from the incident portion 12.
  • a cover 25c is arranged between the fifth wall portion 25 and the main body portion 2b. The cover 25c covers the gap formed between the hole 25a and the tip portion 2c.
  • an isolator that suppresses the return light is arranged in the main body portion 2b, and a collimator lens that collimates the laser beam L1 is arranged in the tip portion 2c.
  • the incident portion 12 may be a connector or the like configured so that the exit end portion 2a of the optical fiber 2 can be connected.
  • the laser light adjusting unit 13 is arranged in the housing 11.
  • the laser light adjusting unit 13 adjusts the laser light L1 incident from the incident unit 12.
  • the laser light adjusting unit 13 is arranged on the fourth wall portion 24 side with respect to the partition wall portion 29 in the housing 11.
  • the laser light adjusting unit 13 is attached to the partition wall unit 29.
  • the partition wall portion 29 is provided in the housing 11, and divides the region inside the housing 11 into a region on the third wall portion 23 side and a region on the fourth wall portion 24 side.
  • the partition wall portion 29 is configured as a part of the housing 11.
  • Each configuration of the laser light adjusting unit 13 is attached to the partition wall portion 29 on the fourth wall portion 24 side.
  • the partition wall portion 29 functions as an optical base that supports each configuration of the laser beam adjusting portion 13.
  • the light collecting portion 14 is arranged on the sixth wall portion 26. Specifically, the light collecting portion 14 is arranged in the sixth wall portion 26 in a state of being inserted into the hole 26a formed in the sixth wall portion 26.
  • the condensing unit 14 condenses the laser light L1 adjusted by the laser light adjusting unit 13 and emits it to the outside of the housing 11.
  • the light collecting portion 14 is biased toward the second wall portion 22 in the X direction, and is offset toward the fourth wall portion 24 in the Y direction. That is, the distance between the condensing unit 14 and the second wall portion 22 in the X direction is smaller than the distance between the condensing unit 14 and the first wall portion 21 in the X direction, and the condensing unit 14 and the fourth in the Y direction.
  • the distance to the wall portion 24 is smaller than the distance between the condensing portion 14 and the third wall portion 23 in the X direction.
  • the laser light adjusting unit 13 has a reflecting unit (first reflecting unit) 31, an attenuator 32, and an optical axis adjusting unit 33.
  • the reflection unit 31, the attenuator 32, and the optical axis adjustment unit 33 are arranged on the first straight line A1 extending along the X direction.
  • the reflecting portion 31 faces the incident portion 12 in the Z direction. That is, the reflecting portion 31 faces the exit end portion 2a of the optical fiber 2 in the Z direction.
  • the reflecting portion 31 reflects the laser beam L1 incident from the incident portion 12 toward the second wall portion 22.
  • the reflecting unit 31 is, for example, a mirror or a prism.
  • the attenuator 32 adjusts the output of the laser beam L1 reflected by the reflecting unit 31.
  • the optical axis adjusting unit 33 reflects the laser beam L1 whose output has been adjusted by the attenuator 32 toward the sixth wall portion 26.
  • the optical axis adjusting unit 33 is a portion for adjusting the optical axis of the laser beam L1 incident from the incident unit 12.
  • the optical axis adjusting unit 33 includes a first steering mirror 331, a reflecting member 332, and a second steering mirror 333.
  • the first steering mirror 331 is arranged on the first straight line A1.
  • the first steering mirror 331 is composed of a mirror 331a and a holder 331b.
  • the mirror 331a is attached to the holder 331b.
  • the holder 331b is attached to the partition wall portion 29.
  • the holder 3331 holds the mirror 331a so that the orientation of the mirror 331a can be adjusted.
  • the first steering mirror 331 reflects the laser beam L1 whose output is adjusted by the attenuator 32 toward the sixth wall portion 26.
  • the reflection member 332 reflects the laser beam L1 reflected by the first steering mirror 331 toward the second wall portion 22 side.
  • the reflective member 332 is, for example, a mirror or a prism.
  • the second steering mirror 333 is arranged on the second straight line A2.
  • the second steering mirror 333 is composed of a mirror 333a and a holder 333b.
  • the mirror 333a is attached to the holder 333b.
  • the holder 333b is attached to the partition wall portion 29.
  • the holder 333b holds the mirror 333a so that the orientation of the mirror 333a can be adjusted.
  • the second steering mirror 333 reflects the laser beam L1 reflected by the reflecting member 332 toward the sixth wall portion 26.
  • the holders 331b and 333b can be accessed by a tool through an opening (not shown) with a lid formed in the second wall portion 22.
  • a tool through an opening (not shown) with a lid formed in the second wall portion 22.
  • the optical axis of the laser beam L1 incident on the condensing unit 14 is aligned with the optical axis of the condensing unit 14.
  • the orientation of each of the mirrors 331a and 333a can be adjusted.
  • the laser light adjusting unit 13 further includes a beam expander 34 and a reflecting unit (second reflecting unit) 35.
  • the optical axis adjusting unit 33, the beam expander 34, and the reflecting unit 35 are arranged on the second straight line A2 extending along the Z direction.
  • the beam expander 34 expands the diameter of the laser beam L1 reflected by the optical axis adjusting unit 33.
  • the reflecting portion 35 reflects the laser beam L1 whose diameter has been expanded by the beam expander 34 toward the first wall portion 21 and the fifth wall portion 25.
  • the reflecting unit 35 is, for example, a mirror or a prism.
  • the laser light adjusting unit 13 further includes a reflective spatial light modulator 36 and an imaging optical system 37.
  • the reflective spatial light modulator 36, the imaging optical system 37, and the condensing unit 14 are arranged on a third straight line A3 extending along the Z direction.
  • the reflection type spatial light modulator 36 modulates the laser light L1 reflected by the reflection unit 35 and reflects it toward the sixth wall portion 26 side.
  • the reflective spatial light modulator 36 is, for example, a spatial light modulator (SLM: Spatial Light Modulator) of a reflective liquid crystal (LCOS: Liquid Crystal on Silicon).
  • the imaging optical system 37 constitutes a bilateral telecentric optical system in which the reflecting surface 36a of the reflective spatial light modulator 36 and the entrance pupil surface 14a of the condensing unit 14 are in an imaging relationship.
  • the imaging optical system 37 is composed of three or more lenses.
  • the first straight line A1, the second straight line A2, and the third straight line A3 are located on a plane perpendicular to the Y direction.
  • the second straight line A2 is located on the second wall portion 22 side with respect to the third straight line A3.
  • the laser beam L1 incident on the housing 11 from the incident portion 12 along the Z direction is reflected by the reflecting portion 31 and travels on the first straight line A1.
  • the laser beam L1 traveling on the first straight line A1 is reflected by the optical axis adjusting unit 33 and travels on the second straight line A2.
  • the laser beam L1 traveling on the second straight line A2 is sequentially reflected by the reflecting unit 35 and the reflective spatial light modulator 36, and travels on the third straight line A3.
  • the laser beam L1 traveling on the third straight line A3 is emitted from the condensing unit 14 to the outside of the housing 11 along the Z direction.
  • the laser processing head 10A further includes a dichroic mirror 15, a measuring unit 16, an observing unit 17, a driving unit 18, and a circuit unit 19.
  • the dichroic mirror 15 is arranged between the imaging optical system 37 and the condensing unit 14 on the third straight line A3. That is, the dichroic mirror 15 is arranged between the laser light adjusting unit 13 and the condensing unit 14 in the housing 11. The dichroic mirror 15 is attached to the partition wall portion 29 on the fourth wall portion 24 side. The dichroic mirror 15 transmits the laser beam L1. From the viewpoint of suppressing astigmatism, the dichroic mirror 15 is preferably a cube type or a two-plate type arranged so as to have a twisting relationship.
  • the measuring unit 16 is arranged on the first wall portion 21 side with respect to the third straight line A3 in the housing 11. That is, the measuring unit 16 is arranged on the first wall portion 21 side with respect to the condensing unit 14 in the X direction.
  • the measuring portion 16 is attached to the partition wall portion 29 on the side of the fourth wall portion 24.
  • the measuring unit 16 outputs the measuring light L10 for measuring the distance between the surface of the object 100 (for example, the surface on the side where the laser light L1 is incident) and the condensing unit 14, and outputs the measuring light L10 via the condensing unit 14. ,
  • the measurement light L10 reflected on the surface of the object 100 is detected.
  • the measurement light L10 output from the measurement unit 16 irradiates the surface of the object 100 via the condensing unit 14, and the measurement light L10 reflected on the surface of the object 100 passes through the condensing unit 14. Is detected by the measuring unit 16.
  • the measurement light L10 output from the measurement unit 16 is sequentially reflected by the beam splitter 20 attached to the partition wall portion 29 and the dichroic mirror 15 on the fourth wall portion 24 side, and is reflected in the condensing portion. It is emitted from 14 to the outside of the housing 11.
  • the measurement light L10 reflected on the surface of the object 100 is incident on the housing 11 from the condensing unit 14 and is sequentially reflected by the dichroic mirror 15 and the beam splitter 20, and is incident on the measurement unit 16 and is incident on the measurement unit 16. Is detected by.
  • the observation unit 17 is arranged on the first wall portion 21 side with respect to the third straight line A3 in the housing 11. That is, the observation unit 17 is arranged on the first wall portion 21 side with respect to the condensing portion 14 in the X direction.
  • the observation unit 17 is attached to the partition wall portion 29 on the side of the fourth wall portion 24.
  • the observation unit 17 outputs the observation light L20 for observing the surface of the object 100 (for example, the surface on the side where the laser beam L1 is incident) and reflects the light L20 on the surface of the object 100 via the condensing unit 14. The observed light L20 is detected.
  • observation light L20 output from the observation unit 17 irradiates the surface of the object 100 via the condensing unit 14, and the observation light L20 reflected on the surface of the object 100 passes through the condensing unit 14. Is detected by the observation unit 17.
  • the observation light L20 output from the observation unit 17 passes through the beam splitter 20 and is reflected by the dichroic mirror 15, and is emitted from the light collection unit 14 to the outside of the housing 11.
  • the observation light L20 reflected on the surface of the object 100 enters the housing 11 from the condensing unit 14, is reflected by the dichroic mirror 15, passes through the beam splitter 20 and is incident on the observation unit 17, and is incident on the observation unit 17. Detected at 17.
  • the wavelengths of the laser light L1, the measurement light L10, and the observation light L20 are different from each other (at least the center wavelengths of the laser light L1 are deviated from each other).
  • the drive unit 18 is attached to the partition wall portion 29 on the fourth wall portion 24 side.
  • the driving unit 18 moves the condensing unit 14 arranged on the sixth wall unit 26 along the Z direction by, for example, the driving force of the piezoelectric element.
  • the circuit unit 19 is arranged on the third wall portion 23 side with respect to the partition wall portion 29 in the housing 11. That is, the circuit unit 19 is arranged in the housing 11 on the third wall portion 23 side with respect to the laser light adjusting unit 13, the measuring unit 16, and the observing unit 17.
  • the circuit portion 19 is separated from the partition wall portion 29.
  • the circuit unit 19 is, for example, a plurality of circuit boards.
  • the circuit unit 19 processes the signal output from the measuring unit 16 and the signal input to the reflective spatial light modulator 36.
  • the circuit unit 19 controls the drive unit 18 based on the signal output from the measurement unit 16.
  • the circuit unit 19 is such that the distance between the surface of the object 100 and the condensing unit 14 is kept constant (that is, with the surface of the object 100) based on the signal output from the measuring unit 16.
  • the drive unit 18 is controlled so that the distance of the laser beam L1 from the condensing point is kept constant).
  • the partition wall portion 29 has a notch and a hole through which wiring for electrically connecting each of the measuring unit 16, the observing unit 17, the driving unit 18, and the reflective spatial light modulator 36 and the circuit unit 19 passes. Etc. (not shown) are formed. Further, the housing 11 is provided with a connector (not shown) to which wiring or the like for electrically connecting the circuit unit 19 and the control unit 9 (see FIG. 1) is connected.
  • the laser processing head 10B includes a housing 11, an incident unit 12, a laser light adjusting unit 13, a condensing unit 14, a dichroic mirror 15, a measuring unit 16, and an observing unit 17.
  • a drive unit 18 and a circuit unit 19 are provided.
  • each configuration of the laser machining head 10B is a configuration of the laser machining head 10A with respect to a virtual plane passing through the midpoint between the pair of mounting portions 65 and 66 and perpendicular to the Y direction. It is arranged so as to have a plane-symmetrical relationship with.
  • the fourth wall portion 24 is located on the laser machining head 10B side with respect to the third wall portion 23, and the sixth wall portion 26 is the fifth wall. It is attached to the attachment portion 65 so as to be located on the support portion 7 side with respect to the portion 25.
  • the fourth wall portion 24 is located on the laser processing head 10A side with respect to the third wall portion 23, and the sixth wall portion 26 is the third. It is attached to the attachment portion 66 so as to be located on the support portion 7 side with respect to the 5 wall portion 25.
  • the housing 11 of the laser machining head 10B is configured so that the housing 11 can be mounted on the mounting portion 66 with the third wall portion 23 arranged on the mounting portion 66 side. Specifically, it is as follows.
  • the mounting portion 66 has a base plate 66a and a mounting plate 66b.
  • the base plate 66a is attached to a rail provided on the moving portion 63.
  • the mounting plate 66b is erected at the end of the base plate 66a on the laser machining head 10A side.
  • the housing 11 of the laser machining head 10B is attached to the mounting portion 66 with the third wall portion 23 in contact with the mounting plate 66b.
  • the housing 11 of the laser machining head 10B is removable from the mounting portion 66. [Action and effect]
  • an optical axis adjusting unit 33 for adjusting the optical axis of the laser light L1 incident from the incident unit 12 is arranged on the optical path of the laser light L1 from the incident unit 12 to the condensing unit 14.
  • the light collecting portion 14 is connected.
  • the optical axis of the incident laser light L1 can be aligned with the optical axis of the condensing unit 14.
  • the incident portion 12 is offset toward the first wall portion 21 side of the housing 11 in the X direction
  • the light collecting portion 14 is offset toward the second wall portion 22 side of the housing 11 in the X direction.
  • the incident portion 12 is arranged on the fifth wall portion 25 of the housing 11, and in the laser light adjusting portion 13, the optical axis adjusting portion 33 is located after the reflecting portion 31 and the attenuator 32 (in the laser processing head 10A).
  • the reflecting unit 35 Arranged on the downstream side in the traveling direction of the laser beam L1) and in front of the beam expander 34, the reflecting unit 35, the reflective spatial light modulator 36, and the imaging optical system 37 (upstream side in the traveling direction of the laser beam L1). Has been done. It is arranged in the front stage (upstream side in the traveling direction of the laser beam L1) of the beam expander 34, the reflecting unit 35, the reflective spatial light modulator 36, and the imaging optical system 37.
  • the optical axis of the laser light L1 incident on the "beam expander 34, the reflecting unit 35, the reflective spatial light modulator 36, the imaging optical system 37, and the condensing unit 14" which is a configuration related to the molding of the laser light L1.
  • the incident portion 12 is arranged on the fifth wall portion 25, and the attenuator 32 is arranged between the reflecting portion 31 and the optical axis adjusting portion 33 in the laser light adjusting portion 13. As a result, it is possible to suppress an increase in the size of the housing 11 due to the application of the attenuator 32.
  • the size of the housing 11 can be reduced. Further, in the housing 11, the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22, and the collection is arranged on the sixth wall portion 26. The light portion 14 is offset toward the fourth wall portion 24 in the Y direction. As a result, when the housing 11 is moved along the Y direction in which the third wall portion 23 and the fourth wall portion 24 face each other, for example, another configuration (for example, a laser machining head) is provided on the fourth wall portion 24 side. Even if 10B) is present, the condensing unit 14 can be brought closer to the other configuration.
  • the third wall portion 23 and the fourth wall portion 24 face each other.
  • the space occupied by the housing 11 can be reduced.
  • the incident portion 12 and the condensing portion 14 are offset toward the fourth wall portion 24 in the Y direction, the region in the housing 11 on the third wall portion 23 side with respect to the laser light adjusting portion 13 The area can be effectively used by arranging another configuration (for example, the circuit unit 19) in the area.
  • the circuit portion 19 is arranged in the housing 11 on the third wall portion 23 side with respect to the laser light adjusting portion 13. As a result, the region on the third wall portion 23 side of the region inside the housing 11 can be effectively used with respect to the laser light adjusting portion 13.
  • the laser light adjusting unit 13 is arranged in the housing 11 on the side of the fourth wall portion 24 with respect to the partition wall portion 29, and the circuit unit 19 is located in the housing 11. , It is arranged on the third wall portion 23 side with respect to the partition wall portion 29.
  • the heat generated in the circuit unit 19 is less likely to be transmitted to the laser light adjusting unit 13, so that it is possible to suppress distortion of the laser light adjusting unit 13 due to the heat generated in the circuit unit 19, and the laser light L1 Can be adjusted appropriately.
  • the circuit portion 19 can be efficiently cooled in the region on the third wall portion 23 side of the region in the housing 11 by, for example, air cooling or water cooling.
  • the laser light adjusting portion 13 is attached to the partition wall portion 29. As a result, the laser light adjusting unit 13 can be reliably and stably supported in the housing 11.
  • the circuit portion 19 is separated from the partition wall portion 29. As a result, it is possible to more reliably suppress the heat generated in the circuit unit 19 from being transmitted to the laser light adjusting unit 13 via the partition wall portion 29.
  • the measuring unit 16 and the observing unit 17 are arranged in a region on the first wall portion 21 side of the region in the housing 11 with respect to the condensing portion 14, and the circuit unit 19 is arranged.
  • the dichroic mirror 15 is arranged on the third wall portion 23 side with respect to the laser light adjusting portion 13 in the region inside the housing 11, and the dichroic mirror 15 is arranged in the housing 11 with the laser light adjusting portion 13 and the condensing unit 14. It is placed between. As a result, the area inside the housing 11 can be effectively used. Further, in the laser processing apparatus 1, processing based on the measurement result of the distance between the surface of the object 100 and the condensing unit 14 becomes possible. Further, in the laser processing apparatus 1, processing based on the observation result of the surface of the object 100 becomes possible.
  • the circuit unit 19 controls the drive unit 18 based on the signal output from the measurement unit 16. Thereby, the position of the condensing point of the laser beam L1 can be adjusted based on the measurement result of the distance between the surface of the object 100 and the condensing portion 14.
  • the object 100 can be processed efficiently and accurately.
  • each of the pair of mounting portions 65 and 66 moves along the Y direction and the Z direction, respectively. Thereby, the object 100 can be processed more efficiently.
  • the support portion 7 moves along each of the X direction and the Y direction, and rotates about an axis parallel to the Z direction as a center line. Thereby, the object 100 can be processed more efficiently.
  • the incident portion 12 is arranged on the first wall portion 21 of the housing 11, and in the laser light adjusting portion 13, the optical axis adjusting portion 33 is an attenuator. It may be arranged in the rear stage of 32 and in the front stage of the beam expander 34, the reflection unit 35, the reflection type spatial light modulator 36, and the imaging optical system 37.
  • the incident portion 12, the attenuator 32, and the optical axis adjusting portion 33 are arranged on the first straight line A1.
  • the attenuator 32 adjusts the output of the laser beam L1 incident from the incident portion 12. According to this, the laser light L1 incident on the "beam expander 34, the reflecting unit 35, the reflective space light modulator 36, the imaging optical system 37, and the condensing unit 14", which is a configuration related to the molding of the laser light L1. Since the optical axis can be adjusted, the laser beam L1 can be focused more accurately. Further, since the attenuator 32 is arranged between the incident portion 12 and the optical axis adjusting portion 33, it is possible to suppress the increase in size of the housing 11 due to the application of the attenuator 32. Further, the height of the laser processing apparatus 1 can be reduced. The above configuration can also be applied to the laser processing head 10B.
  • the incident portion 12 is arranged on the fifth wall portion 25 of the housing 11, and in the laser light adjusting portion 13, the optical axis adjusting portion 33 is an attenuator. It may be arranged in front of 32, the reflection unit 31, the beam expander 34, the reflection unit 35, the reflection type spatial light modulator 36, and the imaging optical system 37.
  • the optical axis adjusting unit 33 (specifically, the second steering mirror 333 of the optical axis adjusting unit 33), the attenuator 32, and the reflecting unit 31 are arranged on the first straight line A1.
  • the optical axis adjusting unit 33 (specifically, the first steering mirror 331 of the optical axis adjusting unit 33) faces the incident unit 12 in the Z direction, and the reflecting unit 31 is a beam expander in the Z direction. It faces 34 (others are the same as the laser processing head 10A shown in FIG. 5).
  • the optical axis adjusting unit 33 reflects the laser light L1 incident from the incident unit 12 toward the second wall portion 22 of the housing 11, and the attenuator 32 is the optical axis adjusting unit.
  • the output of the laser beam L1 reflected by the 33 is adjusted, the reflecting unit 31 reflects the laser beam L1 whose output is adjusted by the attenuator 32 toward the sixth wall portion 26 of the housing 11, and the beam expander 34 receives the laser beam L1. , The diameter of the laser beam L1 reflected by the reflecting unit 31 is enlarged. According to this, the laser light L1 incident on the "beam expander 34, the reflecting unit 35, the reflective space light modulator 36, the imaging optical system 37, and the condensing unit 14", which is a configuration related to the molding of the laser light L1. Since the optical axis can be adjusted, the laser beam L1 can be focused more accurately.
  • the attenuator 32 is arranged between the optical axis adjusting unit 33 and the reflecting unit 31, it is possible to suppress the increase in size of the housing 11 due to the application of the attenuator 32.
  • the above configuration can also be applied to the laser processing head 10B.
  • the attenuator 32 may be arranged between the optical axis adjusting unit 33 and the beam expander 34. Further, in the laser processing head 10A shown in FIG. 7, the attenuator 32 may be arranged between the reflecting portion 31 and the beam expander 34. Further, in the laser processing head 10A shown in FIGS. 5, 6 and 7, the attenuator 32 is placed in the subsequent stage of the beam expander 34 (for example, between the reflection unit 35 and the reflection type spatial light modulator 36). It may be arranged.
  • the subsequent stage of the beam expander 34 for example, between the reflection unit 35 and the reflection type spatial light modulator 36.
  • the optical axis adjusting unit 33 is not limited to the one having the first steering mirror 331, the reflecting member 332, and the second steering mirror 333.
  • the optical axis adjusting unit 33 may have a configuration for adjusting the optical axis of the laser beam L1 incident from the incident unit 12.
  • the optical axis adjusting unit 33 includes a first steering mirror 331 that reflects the laser beam L1 incident from the first wall portion 21 side along the X direction to the first wall portion 21 side and the fifth wall portion 25 side.
  • the second steering mirror 333 that reflects the laser beam L1 reflected by the first steering mirror 331 toward the sixth wall portion 26 side along the Z direction may be provided.
  • each of the first steering mirror 331 and the second steering mirror 333 may be an electric mirror that operates electrically.
  • the first steering mirror 331 and the second steering mirror 333 may be configured to automatically adjust the orientations of the mirrors 331a and 333a based on the image acquired by the observation unit 17.
  • the housing 11 at least one of the first wall portion 21, the second wall portion 22, the third wall portion 23, and the fifth wall portion 25 is located on the mounting portion 65 (or mounting portion 66) side of the laser processing apparatus 1.
  • the housing 11 may be configured so that it can be attached to the attachment portion 65 (or the attachment portion 66) in the arranged state.
  • circuit unit 19 is not limited to processing the signal output from the measuring unit 16 and / or the signal input to the reflective spatial light modulator 36, and the laser processing head processes some signal. It should be.
  • the light source unit 8 may have one light source.
  • the light source unit 8 may be configured so that a part of the laser light output from one light source is emitted from the emitting unit 81a and the remaining portion of the laser light is emitted from the emitting unit 82a.
  • the laser machining apparatus 1 includes a single laser machining head 10A, and the mounting portion 65 to which the housing 11 of the single laser machining head 10A is mounted moves at least along the Y direction. It may be something to do. Even in that case, since the laser beam L1 is accurately focused by the laser processing head 10A, the object 100 can be processed with high accuracy. Further, in the laser machining apparatus 1 provided with a single laser machining head 10A, if the mounting portion 65 moves along the Z direction, the object 100 can be machined efficiently. Further, in the laser machining apparatus 1 provided with the single laser machining head 10A, if the support portion 7 moves along the X direction and rotates about the axis parallel to the Z direction as the center line, the object 100 can be efficiently moved. Can be processed.
  • FIG. 8 is a perspective view of a laser machining apparatus 1 including two pairs of laser machining heads.
  • the laser machining apparatus 1 shown in FIG. 8 includes a plurality of moving mechanisms 200, 300, 400, a support portion 7, a pair of laser machining heads 10A, 10B, a pair of laser machining heads 10C, 10D, and a light source. It is equipped with a unit (not shown).
  • the moving mechanism 200 moves the support portion 7 along the respective directions of the X direction, the Y direction, and the Z direction, and rotates the support portion 7 with the axis parallel to the Z direction as the center line.
  • the moving mechanism 300 has a fixing portion 301 and a pair of mounting portions (first mounting portion, second mounting portion) 305 and 306.
  • the fixing portion 301 is attached to a device frame (not shown).
  • Each of the pair of mounting portions 305 and 306 is mounted on a rail provided on the fixing portion 301, and each can independently move along the Y direction.
  • the moving mechanism 400 has a fixing portion 401 and a pair of mounting portions (first mounting portion, second mounting portion) 405 and 406.
  • the fixing portion 401 is attached to a device frame (not shown).
  • Each of the pair of mounting portions 405 and 406 is mounted on a rail provided on the fixing portion 401, and each can independently move along the X direction.
  • the rail of the fixed portion 401 is arranged so as to three-dimensionally intersect the rail of the fixed portion 301.
  • the laser machining head 10A is attached to the attachment portion 305 of the moving mechanism 300.
  • the laser processing head 10A irradiates the object 100 supported by the support portion 7 with the laser beam in a state of facing the support portion 7 in the Z direction.
  • the laser light emitted from the laser processing head 10A is guided by the optical fiber 2 from the light source unit (not shown).
  • the laser machining head 10B is attached to the attachment portion 306 of the moving mechanism 300.
  • the laser processing head 10B irradiates the object 100 supported by the support portion 7 with the laser beam in a state of facing the support portion 7 in the Z direction.
  • the laser light emitted from the laser processing head 10B is guided by the optical fiber 2 from the light source unit (not shown).
  • the laser machining head 10C is attached to the attachment portion 405 of the moving mechanism 400.
  • the laser processing head 10C irradiates the object 100 supported by the support portion 7 with the laser beam in a state of facing the support portion 7 in the Z direction.
  • the laser light emitted from the laser processing head 10C is guided by the optical fiber 2 from the light source unit (not shown).
  • the laser machining head 10D is attached to the attachment portion 406 of the moving mechanism 400.
  • the laser processing head 10D irradiates the object 100 supported by the support portion 7 with the laser beam in a state of facing the support portion 7 in the Z direction.
  • the laser light emitted from the laser processing head 10D is guided by the optical fiber 2 from the light source unit (not shown).
  • the configuration of the pair of laser machining heads 10A and 10B in the laser machining apparatus 1 shown in FIG. 8 is the same as the configuration of the pair of laser machining heads 10A and 10B in the laser machining apparatus 1 shown in FIG.
  • the configuration of the pair of laser machining heads 10C and 10D in the laser machining apparatus 1 shown in FIG. 8 is such that the pair of laser machining heads 10A and 10B in the laser machining apparatus 1 shown in FIG. 1 have axes parallel to the Z direction. This is the same as the configuration of the pair of laser machining heads 10A and 10B when rotated 90 degrees as the center line.
  • the fourth wall portion 24 is located on the laser machining head 10D side with respect to the third wall portion 23, and the sixth wall portion 26 is the fifth wall. It is attached to the attachment portion 65 so as to be located on the support portion 7 side with respect to the portion 25. Further, in the housing (second housing) 11 of the laser machining head 10D, the fourth wall portion 24 is located on the laser machining head 10C side with respect to the third wall portion 23, and the sixth wall portion 26 is the fifth wall. It is attached to the attachment portion 66 so as to be located on the support portion 7 side with respect to the portion 25.
  • the laser processing head and the laser processing apparatus of the present disclosure are not limited to those for forming a modified region inside the object 100, and may be for performing other laser processing.
  • An example of the operation of the laser processing apparatus 1 is as follows. It is assumed that the object 100 has a plurality of lines extending in the X direction and arranged in the Y direction. In such a state, the control unit 9 scans the laser beam L1 in the X direction for one line and the second scan process for scanning the laser beam L2 in the X direction for another line. The processing is executed so as to overlap at least for a part of the time. In particular, the control unit 9 executes the first scan process in order from the line located at one end of the object 100 in the Y direction toward the inner line in the Y direction, while the other of the object 100 in the Y direction. The second scan process can be executed in order from the line located at the end of the line toward the inner line in the Y direction. As a result, the throughput can be improved.
  • the control unit 9 positions the focusing point of the laser light L1 at the first position in the Z direction in the first state in which the laser processing heads 10A and 10B are arranged on one line.
  • the focusing point of the laser beam L2 is set to the second position in the Z direction (on the incident surface side of the first position).
  • the second scan process of scanning the laser beam L2 in the X direction with respect to the one line while being positioned at the position of) is executed.
  • control unit 9 performs the first scan process and the second scan process while setting the condensing point of the laser beam L2 at a position separated from the condensing point of the laser beam L1 by a predetermined distance or more in the direction opposite to the X direction. Run.
  • the predetermined distance is, for example, 300 ⁇ m.
  • An example of the operation of the laser processing device 1 is as follows. At least one of a first scan process in which the control unit 9 scans the laser beam L1 in the X direction for one line and a second scan process for scanning the laser beam L2 in the X direction for another line.
  • the imaging process for imaging is executed. In the imaging process, light that passes through the object 100 (for example, light in the near infrared region) is used. As a result, the success or failure of the laser machining can be confirmed non-destructively by utilizing the time when the first scanning process is not performed.
  • the laser processing apparatus 1 performs a peeling process for peeling a part of the object 100.
  • the laser processing heads 10A and 10B irradiate the laser beams L1 and L2, respectively, and control the movement of the focusing points of the laser beams L1 and L2 in the horizontal direction.
  • a modified region is formed along the virtual surface inside the object 100.
  • a part of the object 100 can be peeled off with the modified region extending over the virtual surface as a boundary.
  • the laser processing apparatus 1 performs a trimming process for removing an unnecessary portion of the object 100.
  • the laser processing heads 10A and 10B are rotated based on the rotation information of the support portion 7 with the condensing point positioned along the peripheral edge of the effective region of the object 100 while rotating the support portion 7.
  • a modified region is formed along the peripheral edge of the effective region in the object 100.
  • An example of the operation of the laser processing device 1 is as follows. With respect to the object 100 having the functional element layer on the front surface side, the laser beam L1 is irradiated to the functional element layer along the line from the back surface of the object 100, and a weakened region is formed in the functional element layer along the line. .. From the back surface of the object 100, the inside of the object 100 is irradiated with a laser beam L2 having a pulse width shorter than the pulse width of the laser beam L1 so as to follow the laser beam L1 along the line. By irradiating the laser beam L2, a crack reaching the surface of the object 100 is surely formed along the line by utilizing the weakened region.
  • each configuration in the above-described embodiment without being limited to the above-mentioned materials and shapes.
  • each configuration in one embodiment or modification described above can be arbitrarily applied to each configuration in another embodiment or modification.
  • Reflection part (first reflection part), 32 ... Attenuator, 33 ... Optical axis adjustment part, 34 ... Beam expander, 35 ... Reflection part (second reflection part), 36 ... Reflection type spatial light modulation Instrument, 36a ... Reflective surface, 37 ... Imaging optical system, 65, 66, 305, 306, 405, 406 ... Mounting parts (first mounting part, second mounting part).

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
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  • Laser Beam Processing (AREA)

Abstract

L'invention concerne une tête de traitement laser pourvue : d'un boîtier ayant une première section de paroi et une deuxième section de paroi se faisant face dans une première direction, une troisième section de paroi et une quatrième section de paroi se faisant face dans une deuxième direction orthogonale à la première direction et une cinquième section de paroi et une sixième section de paroi se faisant face dans une troisième direction orthogonale à la première direction et à la deuxième direction ; d'une partie d'incidence qui est disposée sur la première section de paroi ou la cinquième section de paroi et qui permet à la lumière laser d'entrer dans l'intérieur du boîtier ; d'une partie de réglage de lumière laser qui est disposée à l'intérieur du boîtier et qui règle la lumière laser entrant à partir de la partie d'incidence ; et d'une partie de condensation de lumière qui est disposée sur la sixième section de paroi et qui condense et émet vers l'extérieur du boîtier la lumière laser réglée par la partie de réglage de lumière laser. La partie de réglage de lumière laser a une partie de réglage d'axe de lumière pour régler l'axe de lumière de la lumière laser entrant à partir de la partie d'incidence, la partie d'incidence est décalée vers la première section de paroi dans la première direction et la partie de condensation de lumière est décalée vers la seconde section de paroi dans la première direction.
PCT/JP2021/016817 2020-04-28 2021-04-27 Tête de traitement laser et dispositif de traitement laser WO2021221061A1 (fr)

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CN202180031324.XA CN115461182A (zh) 2020-04-28 2021-04-27 激光加工头及激光加工装置
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04167986A (ja) * 1990-11-01 1992-06-16 Nec Corp レーザ加工装置
JP2012192427A (ja) * 2011-03-15 2012-10-11 Omron Corp レーザ加工装置およびレーザ加工方法
JP5456510B2 (ja) * 2010-02-23 2014-04-02 株式会社ディスコ レーザ加工装置
JP2014083562A (ja) * 2012-10-23 2014-05-12 Olympus Corp レーザ照射ユニット及びレーザ加工装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04167986A (ja) * 1990-11-01 1992-06-16 Nec Corp レーザ加工装置
JP5456510B2 (ja) * 2010-02-23 2014-04-02 株式会社ディスコ レーザ加工装置
JP2012192427A (ja) * 2011-03-15 2012-10-11 Omron Corp レーザ加工装置およびレーザ加工方法
JP2014083562A (ja) * 2012-10-23 2014-05-12 Olympus Corp レーザ照射ユニット及びレーザ加工装置

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JP7475952B2 (ja) 2024-04-30
KR20230002363A (ko) 2023-01-05
JP2021171802A (ja) 2021-11-01
TW202146142A (zh) 2021-12-16

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