KR20210082486A - laser processing equipment - Google Patents

Abstract

The laser processing apparatus becomes movable along a 1st direction, and is arrange|positioned so that the support part for supporting an object along the said 1st direction and a 2nd direction intersecting the 1st direction, and mutually opposing along the said 2nd direction and a first laser processing head and a second laser processing head for irradiating a laser beam to the object supported by the support, and the first laser processing head is mounted, crossing the first direction and the second direction A first mounting part movable along each of the third direction and the second direction, and a second mounting part on which the second laser processing head is mounted and movable along each of the second direction and the third direction and an imaging unit mounted on the first mounting portion and configured to image the object by light passing through the object.

Description

laser processing equipment

The present disclosure relates to a laser processing apparatus.

Patent Document 1 describes a laser processing apparatus including a holding mechanism for holding a work and a laser irradiation mechanism for irradiating a laser beam to the work held by the holding mechanism. In the laser processing apparatus described in Patent Document 1, a laser irradiation mechanism having a condensing lens is fixed to the base, and the movement of the work in a direction perpendicular to the optical axis of the condensing lens is performed by the holding mechanism.

Patent Document 1: Japanese Patent No. 5456510

By the way, in the laser processing apparatus as mentioned above, in order to improve a throughput, it is considered to increase the moving speed of the workpiece|work by a holding mechanism, for example. However, even if it is intended to increase the movement speed of the workpiece, the acceleration time required for the movement of the workpiece to reach a constant velocity movement at the target speed also increases. For this reason, as an increase in the moving speed of a workpiece, an improvement in throughput beyond a certain level is desired. As described above, improvement in throughput is desired in the technical field. On the other hand, there is also a request to non-destructively confirm the success or failure of laser processing.

An object of this indication is to provide the laser processing apparatus which can confirm the success or failure of laser processing non-destructively, improving a throughput.

The laser processing apparatus which concerns on this indication becomes movable along a 1st direction, The support part for supporting an object along a 1st direction and a 2nd direction intersecting a 1st direction, and a 2nd direction so as to oppose each other A first laser processing head and a second laser processing head for irradiating a laser beam to an object supported by the support, and a first laser processing head mounted thereon, a third direction intersecting the first and second directions and a first mounting part movable along each of the second directions, a second laser processing head mounted thereon, a second mounting part movable along each of the second and third directions, and the first mounting part, and an imaging unit for imaging an object with light passing through the object.

In this apparatus, on the support part which supports an object, a 1st laser processing head and a 2nd laser processing head are arrange|positioned so that it may mutually oppose. And the 1st laser processing head and the 2nd laser processing head are each independently movable in two mutually intersecting directions via a 1st attachment part and a 2nd attachment part. For this reason, in two places of an object, it becomes possible to perform laser processing by scanning a laser beam independently of each other. Therefore, the improvement of the throughput is achieved.

Moreover, in the 1st mounting part which bears the movement of a 1st laser processing head, the imaging unit which images an object with the light which penetrates the object is further attached. Therefore, for example, while performing laser processing by a 2nd laser processing head, another location of an object can be imaged with an imaging unit. Therefore, the state of laser processing can be confirmed non-destructively, suppressing the fall of a throughput. That is, according to this apparatus, the success or failure of laser processing can be confirmed non-destructively, improving a throughput.

The laser processing apparatus according to the present disclosure includes movement of a support part, a first mounting part, and a second mounting part, irradiation of laser beams from the first laser processing head and the second laser processing head, and imaging of an object by an imaging unit. Further comprising a control unit to control, the plurality of lines extending along the first direction and arranged along the second direction are set to the object, the control unit is a first laser processing for one line among the plurality of lines At least a part of the first scan process of scanning the laser beam from the head in the first direction, and the second scan process of scanning the laser beam from the second laser processing head in the first direction with respect to another line among the plurality of lines. While performing overlapping with time, when only the 2nd scan process is being performed, you may perform the imaging process of imaging the area|region of the object containing the line on which processing was completed with an imaging unit. As described above, by performing the first scan process and the second scan process in duplicate, the throughput is improved. Moreover, the imaging process can be performed by controlling the imaging unit movable together with the 1st laser processing head at the timing in which only the 2nd scan process is being performed. Therefore, the success or failure of laser processing can be confirmed non-destructively, improving a throughput more reliably.

In the laser processing apparatus according to the present disclosure, based on the image obtained by the imaging process, the control unit determines whether or not modified regions and/or cracks are formed in the target object in the region according to the regulations, and the determination is made. As a result of , when it is determined that the modified region and/or cracks are not formed according to the regulations, at least the auxiliary processing processing of scanning the laser beam along the line may be performed again. In this case, processing errors are compensated for by auxiliary processing.

In the laser processing apparatus which concerns on this indication, a control part performs a 1st scan process sequentially toward the line inside the 2nd direction from the line located in one edge part of the 2nd direction of an object among a plurality of lines, You may perform the main processing process which performs a 2nd scan process sequentially toward the line inside the 2nd direction from the line located at the other end of the 2nd direction of an object among the lines of. In this way, in the main processing processing, the first direction of the converging point of the laser light with respect to the object is determined by executing the first scanning processing and the second scanning processing sequentially from the line at the position of the object contrasting in the second direction. The waste of the subsequent relative movement is reduced, and the throughput is further improved.

In the laser processing apparatus which concerns on this indication, in a main processing process, when a 1st laser processing head and a 2nd laser processing head approach most with respect to a 2nd direction, a control part retracts a 1st laser processing head, and a 2nd scan You may perform an imaging process while continuing a process. In this case, the success or failure of laser processing can be confirmed non-destructively while improving the throughput by maximally utilizing the first laser processing head and the second laser processing head.

ADVANTAGE OF THE INVENTION According to this indication, the laser processing apparatus which can confirm the success or failure of laser processing non-destructively, improving a throughput can be provided.

1 : is a perspective view of the laser processing apparatus of one Embodiment.
FIG. 2 is a front view of a part of the laser processing apparatus shown in FIG. 1 .
3 : is a front view of the laser processing head of the laser processing apparatus shown in FIG.
FIG. 4 is a side view of the laser processing head shown in FIG. 3 .
FIG. 5 is a configuration diagram of an optical system of the laser processing head shown in FIG. 3 .
6 is a configuration diagram of an optical system of a laser processing head of a modified example.
7 : is a front view of a part of the laser processing apparatus of a modification.
It is a schematic top view which shows operation|movement of a laser processing apparatus.
It is a schematic top view which shows operation|movement of a laser processing apparatus.
It is a schematic top view which shows operation|movement of a laser processing apparatus.
It is a schematic top view which shows operation|movement of a laser processing apparatus.
It is a schematic top view which shows operation|movement of a laser processing apparatus.
It is a schematic top view which shows the operation|movement of a laser processing apparatus.
14 is a schematic cross-sectional view showing the operation of the laser processing apparatus.
It is a figure which shows the modified example of a mounting part and a laser processing head.
It is a figure which shows the modified example of a mounting part and a laser processing head.
It is a figure which shows the modified example of a mounting part and a laser processing head.
It is a figure which shows the modified example of a mounting part and a laser processing head.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment is described in detail with reference to drawings. In addition, in each figure, the same code|symbol is attached|subjected to the same or equivalent part, and the overlapping description is abbreviate|omitted.

[Configuration of laser processing equipment]

As shown in FIG. 1, the laser processing apparatus 1 has several moving mechanism 5 and 6, the support part 7, and a pair of laser processing heads (1st laser processing head, 2nd laser processing) head) 10A, 10B, a light source unit 8 and a control unit 9 are provided. Hereinafter, a first direction is referred to as an X direction, a second direction perpendicular to the first direction is referred to as a Y direction, and a third direction perpendicular to the first and second directions is referred to as a Z direction. In this embodiment, the X direction and the Y direction are horizontal directions, and the Z direction is a vertical direction.

The moving mechanism 5 has a fixed part 51 , a moving part 53 , and a mounting part 55 . The fixing part 51 is attached to the apparatus frame 1a. The moving part 53 is attached to the rail provided in the fixed part 51, and can move along a Y direction. The mounting part 55 is attached to the rail provided in the moving part 53, and can move along the X direction.

The moving mechanism 6 includes a fixed part 61 , a pair of moving parts (first moving part, second moving part) 63 and 64 , and a pair of mounting parts (first attaching part, second attaching part). (65, 66). The fixing part 61 is attached to the apparatus frame 1a. Each of the pair of moving parts 63 and 64 is attached to the rail provided in the fixed part 61, and each can move independently along the Y direction. The mounting part 65 is attached to the rail provided in the moving part 63, and can move along the Z direction. The mounting part 66 is attached to the rail provided in the moving part 64, and can move along the Z direction. That is, with respect to the apparatus frame 1a, each of the pair of mounting parts 65 and 66 can move along each of a Y direction and a Z direction.

The support part 7 is attached to the rotation shaft provided in the mounting part 55 of the movement mechanism 5, and can rotate about the axis line parallel to the Z direction as a center line. That is, the support part 7 can move along each of the X-direction and the Y-direction, and can rotate with an axis parallel to the Z-direction as a center line. The support part 7 supports the object 100 along the X direction and the Y direction. The object 100 is, for example, a wafer.

1 and 2 , the laser processing head 10A (for example, the first laser processing head) is attached to the mounting portion 65 of the moving mechanism 6 . The laser processing head 10A is for irradiating the laser beam (1st laser beam) L1 to the object 100 supported by the support part 7 in the state opposite to the support part 7 in Z direction. The laser processing head 10B (for example, the 2nd laser processing head) is attached to the mounting part 66 of the moving mechanism 6 . The laser processing head 10B is for irradiating the laser beam (2nd laser beam) L2 to the object 100 supported by the support part 7 in the state opposing the support part 7 in the Z direction.

The light source unit 8 has a pair of light sources 81 and 82 . The light source 81 outputs the laser beam L1. The laser beam L1 is emitted from the emission part 81a of the light source 81 and is guided to the laser processing head 10A by the optical fiber 2 . The light source 82 outputs the laser beam L2. The laser beam L2 is emitted from the emission part 82a of the light source 82 and is guided to the laser processing head 10B by another optical fiber 2 .

The control unit 9 controls each part of the laser processing apparatus 1 (a plurality of moving mechanisms 5 and 6, a pair of laser processing heads 10A and 10B, and a light source unit 8, etc.). Control. The control unit 9 is configured as a computer device including a processor, a memory, a storage, a communication device, and the like. In the control unit 9, software (program) read into the memory or the like is executed by the processor, and reading and writing of data in the memory and storage, and communication by the communication device are controlled by the processor. Thereby, the control part 9 implement|achieves various functions.

An example of the processing by the laser processing apparatus 1 comprised as mentioned above is demonstrated. An example of the processing is an example of forming a modified region inside the object 100 along each of a plurality of lines set in a grid shape in order to cut the object 100, which is a wafer, into a plurality of chips.

First, the moving mechanism 5 moves along the X direction and the Y direction so that the support part 7 supporting the object 100 faces a pair of laser processing heads 10A and 10B in the Z direction, respectively. 7) is moved. Next, the moving mechanism 5 rotates the support part 7 with an axis parallel to the Z direction as a center line so that a plurality of lines extending in one direction from the object 100 follow the X direction.

Next, the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the condensing point of the laser beam L1 is located on one line extending in one direction. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the converging point of the laser beam L2 may be located on the other line extending in one direction. Next, the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the converging point of the laser beam L1 is located inside the object 100 . On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the converging point of the laser beam L2 is located inside the object 100 .

Next, while the light source 81 outputs the laser beam L1 and the laser processing head 10A irradiates the laser beam L1 to the object 100, the light source 82 outputs the laser beam L2 Thus, the laser processing head 10B irradiates the laser beam L2 to the object 100 . At the same time, the light-converging point of the laser light L1 relatively moves along one line extending in one direction (the laser light L1 is scanned) and the laser light L2 along another line extending in one direction. The moving mechanism 5 moves the support 7 along the X-direction so that the converging point relatively moves (so that the laser light L2 is scanned). In this way, the laser processing apparatus 1 forms a modified region inside the object 100 along each of a plurality of lines extending in one direction from the object 100 .

Next, the moving mechanism 5 rotates the support part 7 with an axis parallel to the Z direction as a center line so that a plurality of lines extending in the other direction orthogonal to one direction from the object 100 follow the X direction. .

Next, the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the converging point of the laser beam L1 may be located on one line extending in the other direction. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the condensing point of the laser beam L2 may be located on the other line extended in the other direction. Next, the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the converging point of the laser beam L1 is located inside the object 100 . On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the converging point of the laser beam L2 is located inside the object 100 .

Next, while the light source 81 outputs the laser beam L1 and the laser processing head 10A irradiates the laser beam L1 to the object 100, the light source 82 outputs the laser beam L2 Thus, the laser processing head 10B irradiates the laser beam L2 to the object 100 . At the same time, the converging point of the laser light L1 relatively moves along one line extending in the other direction (the laser light L1 is scanned) and the laser light L2 along another line extending in the other direction. ), the moving mechanism 5 moves the support 7 along the X-direction so that the converging point of ) relatively moves (so that the laser light L1 is scanned). In this way, the laser processing apparatus 1 forms a modified region in the object 100 along each of a plurality of lines extending in the other direction orthogonal to one direction from the object 100 .

In addition, in an example of the above-described processing, the light source 81 outputs a laser beam L1 having transparency to the object 100 by, for example, a pulse oscillation method, and the light source 82 is, for example, For example, the laser beam L2 having transparency to the object 100 is output by the pulse oscillation method. When such laser light is condensed inside the object 100 , the laser light is particularly absorbed at a portion corresponding to the converging point of the laser light, and a modified region is formed inside the object 100 . The modified region is a region different from the surrounding unmodified region in density, refractive index, mechanical strength, and other physical properties. The modified region includes, for example, a melt processing region, a crack region, a dielectric breakdown region, and a refractive index change region.

When the laser light output by the pulse oscillation method is irradiated to the object 100, and the converging point of the laser light is relatively moved along the line set on the object 100, a plurality of modified spots are formed so as to be arranged in a row along the line. do. One modified spot is formed by irradiation of one pulse of laser light. The modified region in one row is a set of a plurality of modified spots arranged in one row. The modified spots adjacent to each other may be connected to each other or separated from each other by the relative movement speed of the converging point of the laser light with respect to the object 100 and the repetition frequency of the laser light.

[Configuration of laser processing head]

3 and 4 , the laser processing head 10A includes a case 11 (eg, a first case), an incident unit 12 , an adjustment unit 13 , and a light collection unit 14 . ) (for example, a first light collecting unit).

The case 11 has a first wall portion 21 and a second wall portion 22 , a third wall portion 23 and a fourth wall portion 24 , and a fifth wall portion 25 and a sixth wall portion 26 , have. The 1st wall part 21 and the 2nd wall part 22 mutually oppose in the X direction. The 3rd wall part 23 and the 4th wall part 24 are mutually opposing in the Y direction. The 5th wall part 25 and the 6th wall part 26 mutually oppose in the Z direction.

The distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22 . The distance between the first wall portion 21 and the second wall portion 22 is smaller than the distance between the fifth wall portion 25 and the sixth wall portion 26 . Moreover, the distance between the 1st wall part 21 and the 2nd wall part 22 may be the same as the distance between the 5th wall part 25 and the 6th wall part 26, Or the 5th wall part 25 and the 6th wall part. It may be larger than the distance from (26).

In 10 A of laser processing heads, the 1st wall part 21 is located in the fixed part 61 side of the moving mechanism 6, The 2nd wall part 22 is located in the opposite side to the fixed part 61. . The 3rd wall part 23 is located in the mounting part 65 side of the moving mechanism 6, and the 4th wall part 24 is located in the laser processing head 10B side as the opposite side to the mounting part 65 (FIG. 2). That is, the 4th wall part 24 is the opposing wall part which opposes along the Y direction to the case (2nd case) of the laser processing head 10B. The 5th wall part 25 is located in the opposite side to the support part 7, and the 6th wall part 26 is located in the support part 7 side.

The case 11 is configured such that the case 11 is attached to the mounting unit 65 in a state where the third wall unit 23 is disposed on the mounting unit 65 side of the moving mechanism 6 . Specifically, it is as follows. The mounting portion 65 includes a base plate 65a and a mounting plate 65b. The base plate 65a is attached to a rail provided in the moving part 63 (refer to FIG. 2). The mounting plate 65b is erected on the end of the base plate 65a on the laser processing head 10B side. provided (see FIG. 2). In the case 11, the bolt 28 is screwed to the mounting plate 65b via the base 27 while the third wall part 23 is in contact with the mounting plate 65b, whereby the mounting part 65 ) is mounted on The base 27 is provided in each of the first wall portion 21 and the second wall portion 22 . The case 11 is detachable from the mounting part 65 .

The incident portion 12 is attached to the fifth wall portion 25 . The incident part 12 makes the laser beam L1 incident into the case 11 . The incidence part 12 is biased toward the second wall part 22 side (one wall part side) in the X direction, and is biased toward the fourth wall part 24 side in the Y direction. That is, the distance between the incident portion 12 and the second wall portion 22 in the X direction is smaller than the distance between the incident portion 12 and the first wall portion 21 in the X direction, and the incident portion 12 in the Y direction is smaller than the distance between the incident portion 12 and the first wall portion 21 in the X direction. ) and the fourth wall portion 24 are smaller than the distance between the incident portion 12 and the third wall portion 23 in the X direction.

The incident portion 12 is configured such that the connection end 2a of the optical fiber 2 is connectable. At the connection end 2a of the optical fiber 2, a collimator lens for collimating the laser beam L1 emitted from the output end of the fiber is provided, and an isolator for suppressing the return light is provided. there is not The isolator is provided in the middle of the fiber on the side of the light source 81 rather than the connection end 2a. Thereby, the size reduction of the connection end part 2a and, by extension, the size reduction of the incidence part 12 are attained. Further, an isolator may be provided at the connection end 2a of the optical fiber 2 .

The adjustment unit 13 is disposed in the case 11 . The adjustment unit 13 adjusts the laser light L1 incident from the incident unit 12 . The detail of the adjustment part 13 is mentioned later.

The light collecting portion 14 is disposed on the sixth wall portion 26 . Specifically, the light collecting portion 14 is disposed in the sixth wall portion 26 in a state of being inserted through the hole 26a formed in the sixth wall portion 26 . The condensing unit 14 emits the laser light L1 adjusted by the adjusting unit 13 to the outside of the case 11 while condensing it. The light collecting part 14 is biased toward the second wall part 22 side (one wall part side) in the X direction, and is biased toward the fourth wall part 24 side in the Y direction. That is, the light collecting portion 14 is disposed to be biased toward the fourth wall portion (opposing wall portion) 24 in the case 11 when viewed from the Z direction. That is, the distance between the light collecting part 14 and the second wall part 22 in the X direction is smaller than the distance between the light collecting part 14 and the first wall part 21 in the X direction, and the light collecting part 14 in the Y direction. ) and the fourth wall portion 24 are smaller than the distance between the light collecting portion 14 and the third wall portion 23 in the X direction.

As shown in FIG. 5 , the adjustment unit 13 includes an attenuator 31 , a beam expander 32 , and a mirror 33 . The incident part 12 and the attenuator 31 of the adjustment part 13, the beam expander 32, and the mirror 33 are arrange|positioned on the straight line (1st straight line) A1 extending along the Z direction. . The attenuator 31 and the beam expander 32 are arranged between the incident portion 12 and the mirror 33 on the straight line A1 . The attenuator 31 adjusts the output of the laser light L1 incident from the incident unit 12 . The beam expander 32 expands the diameter of the laser beam L1 whose output is adjusted by the attenuator 31 . The mirror 33 reflects the laser beam L1 whose diameter is enlarged by the beam expander 32 .

The adjustment unit 13 further includes a reflective spatial light modulator 34 and an imaging optical system 35 . The reflective spatial light modulator 34 of the adjustment unit 13, the imaging optical system 35, and the condensing unit 14 are arranged on a straight line (second straight line) A2 extending along the Z direction. The reflective spatial light modulator 34 modulates the laser light L1 reflected by the mirror 33 . The reflective spatial light modulator 34 is, for example, a spatial light modulator (SLM: Spatial Light Modulator) of a reflective liquid crystal (LCOS: Liquid Crystal Silicon). The imaging optical system 35 constitutes a bilateral telecentric optical system in which the reflective surface 34a of the reflective spatial light modulator 34 and the incident pupil plane 14a of the condenser 14 are in an imaging relationship. The imaging optical system 35 is constituted by three or more lenses.

The straight line A1 and the straight line A2 are located on a plane perpendicular to the Y direction. The straight line A1 is located on the second wall portion 22 side (one wall portion side) with respect to the straight line A2 . In the laser processing head 10A, the laser beam L1 enters the case 11 from the incident portion 12 , travels on a straight line A1 , and a mirror 33 and a reflective spatial light modulator 34 . After being sequentially reflected from the , it is emitted from the light collecting unit 14 to the outside of the case 11 by proceeding on the straight line A2 . In addition, the order of the arrangement|sequence of the attenuator 31 and the beam expander 32 may be reversed. Note that the attenuator 31 may be disposed between the mirror 33 and the reflective spatial light modulator 34 . Moreover, the adjustment part 13 may have another optical component (for example, the steering mirror etc. which are arrange|positioned before the beam expander 32).

The laser processing head 10A further includes a dichroic mirror 15 , a measurement unit 16 , an observation unit 17 , a drive unit 18 , and a circuit unit 19 .

The dichroic mirror 15 is disposed between the imaging optical system 35 and the condensing unit 14 on the straight line A2 . That is, the dichroic mirror 15 is disposed between the adjusting unit 13 and the light collecting unit 14 in the case 11 . The dichroic mirror 15 is attached to the optical base 29 from the side of the fourth wall portion 24 . The dichroic mirror 15 transmits the laser light L1. From the viewpoint of suppressing astigmatism, the dichroic mirror 15 can be, for example, a cube shape or a plate shape of two arranged so as to have a torsional relationship.

The measuring part 16 is arrange|positioned in the 1st wall part 21 side (the side opposite to one wall part side) with respect to the adjustment part 13 in the case 11. As shown in FIG. The measuring part 16 is attached to the optical base 29 from the 4th wall part 24 side. The measurement unit 16 outputs the measurement light L10 for measuring the distance between the surface of the object 100 (eg, the surface on the side on which the laser light L1 is incident) and the condensing unit 14, and , through the condensing unit 14 , the measurement light L10 reflected from the surface of the object 100 is detected. That is, the measurement light L10 output from the measurement unit 16 is irradiated to the surface of the object 100 through the light collecting unit 14, and the measurement light L10 reflected from the surface of the object 100 is, It is detected by the measuring unit 16 via the light collecting unit 14 .

More specifically, the measurement light L10 output from the measurement unit 16 includes a beam splitter 20 mounted on the optical base 29 on the fourth wall portion 24 side, and a dichroic mirror 15 . is sequentially reflected from the light collecting unit 14 and emitted out of the case 11 . The measurement light L10 reflected from the surface of the object 100 is incident on the case 11 from the condensing unit 14 and is sequentially reflected by the dichroic mirror 15 and the beam splitter 20, and the measurement unit It is incident on (16) and detected by the measuring unit (16).

The observation part 17 is arrange|positioned in the 1st wall part 21 side (the side opposite to one wall part side) with respect to the adjustment part 13 in the case 11. As shown in FIG. The observation part 17 is attached to the optical base 29 from the 4th wall part 24 side. The observation unit 17 outputs the observation light L20 for observing the surface of the object 100 (for example, the surface on the side where the laser light L1 is incident), and passes through the condensing unit 14 , The observation light L20 reflected from the surface of the object 100 is detected. That is, the observation light L20 output from the observation unit 17 is irradiated to the surface of the object 100 through the light collecting unit 14 , and the observation light L20 reflected from the surface of the object 100 is collected It is detected by the observation part 17 via the light part 14 .

More specifically, the observation light L20 output from the observation unit 17 passes through the beam splitter 20 , is reflected by the dichroic mirror 15 , and is emitted from the condensing unit 14 to the outside of the case 11 . do. The observation light L20 reflected from the surface of the object 100 enters the case 11 from the condensing unit 14, is reflected by the dichroic mirror 15, and passes through the beam splitter 20 to the observation unit ( 17), and is detected by the observation unit 17. In addition, each wavelength of the laser light L1, the measurement light L10, and the observation light L20 is different from each other (at least the respective central wavelengths are shifted from each other).

The drive unit 18 is attached to the optical base 29 on the fourth wall portion 24 side. The driving unit 18 moves the light collecting unit 14 disposed on the sixth wall unit 26 along the Z direction by, for example, the driving force of the piezoelectric element.

The circuit part 19 is arrange|positioned in the case 11 with respect to the 3rd wall part 23 side with respect to the optical base 29. As shown in FIG. That is, the circuit part 19 is arrange|positioned with respect to the 3rd wall part 23 side with respect to the adjustment part 13, the measurement part 16, and the observation part 17 in the case 11. As shown in FIG. The circuit unit 19 is, for example, a plurality of circuit boards. The circuit unit 19 processes the signal output from the measurement unit 16 and the signal input to the reflective spatial light modulator 34 . The circuit unit 19 controls the driving unit 18 based on the signal output from the measurement unit 16 . As an example, the circuit unit 19 is configured such that, based on the signal output from the measurement unit 16 , the distance between the surface of the object 100 and the light collecting unit 14 is kept constant (that is, of the object 100 ). The driving unit 18 is controlled so that the distance between the surface and the converging point of the laser light L1 is kept constant). Moreover, the connector (not shown) to which wiring for electrically connecting the circuit part 19 to the control part 9 (refer FIG. 1) etc. is connected in the case 11 is provided.

The laser processing head 10B, similarly to the laser processing head 10A, has a case 11 (eg, a second case), an incident unit 12 , an adjustment unit 13 , and a condensing unit (eg, a second case). A second condensing unit) 14 , a dichroic mirror 15 , a measuring unit 16 , an observation unit 17 , a driving unit 18 , and a circuit unit 19 are provided. However, as shown in FIG. 2, each structure of the laser processing head 10B passes through the midpoint between a pair of mounting parts 65 and 66, and regarding the imaginary plane perpendicular|vertical to a Y direction, a laser processing head They are arranged so as to have a plane-symmetric relationship with each configuration of (10A) (it is an example as will be described later).

For example, as for the case 11 of the laser processing head 10A, the 4th wall part 24 is located on the laser processing head 10B side with respect to the 3rd wall part 23, and the 6th wall part 26 is a 1st. 5 It is attached to the mounting part 65 so that it may be located on the support part 7 side with respect to the wall part 25. As shown in FIG. On the other hand, as for the case 11 of the laser processing head 10B, the 4th wall part 24 is located on the laser processing head 10A side with respect to the 3rd wall part 23, and the 6th wall part 26 is the second. 5 It is attached to the mounting part 66 so that it may be located on the support part 7 side with respect to the wall part 25. As shown in FIG. That is, also in the laser processing head 10B, the 4th wall part 24 is the opposing wall part which opposes along the Y direction to the case of the laser processing head 10A. Moreover, also in the laser processing head 10B, the light collection part 14 is biased toward the 4th wall part (opposing wall part) 24 side in the case 11 as seen from the Z direction, and is arrange|positioned.

The case 11 of the laser processing head 10B is comprised so that the case 11 may be attached to the mounting part 66 in the state which the 3rd wall part 23 was arrange|positioned at the mounting part 66 side. Specifically, it is as follows. The mounting portion 66 includes a base plate 66a and a mounting plate 66b. The base plate 66a is attached to a rail provided in the moving part 63 . The mounting plate 66b is erected at the end of the base plate 66a on the laser processing head 10A side. The case 11 of the laser processing head 10B is attached to the mounting part 66 in the state which the 3rd wall part 23 contacted the mounting plate 66b. The case 11 of the laser processing head 10B is detachable with respect to the attachment part 66 .

[Operation and effect of laser processing head]

In the laser processing head 10A, since the light source which outputs the laser beam L1 is not provided in the case 11, size reduction of the case 11 can be achieved. In addition, in the case 11 , the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22 , and is mounted on the sixth wall portion 26 . The light condensing portion 14 is biased toward the fourth wall portion 24 in the Y direction. As a result, when the case 11 is moved along the direction perpendicular to the optical axis of the condensing unit 14, for example, a different configuration (eg, a laser processing head ( Even if 10B)) exists, it is possible to bring the light collecting unit 14 closer to the other configuration. Accordingly, the laser processing head 10A may be suitable for moving the light collecting portion 14 along a direction perpendicular to its optical axis.

Moreover, in the laser processing head 10A, the incident part 12 is provided in the 5th wall part 25, and is biased toward the 4th wall part 24 side in the Y direction. Thereby, among the regions within the case 11, the region can be effectively used, such as by arranging a different configuration (for example, the circuit unit 19) in the region on the third wall part 23 side with respect to the adjustment part 13. can

Moreover, in the laser processing head 10A, the light condensing part 14 inclines toward the 2nd wall part 22 side in the X direction. As a result, when the case 11 is moved along the direction perpendicular to the optical axis of the light condensing unit 14, for example, even if there is another configuration on the second wall part 22 side, the other configuration is applied. The light condensing unit 14 can be brought closer.

Moreover, in 10 A of laser processing heads, while the incident part 12 is provided in the 5th wall part 25, and is biased toward the 4th wall part 24 side in the Y direction, the 2nd wall part 22 in the X direction. ) is skewed to the side. Thereby, among the regions within the case 11, the region can be effectively used, such as by arranging a different configuration (for example, the circuit unit 19) in the region on the third wall part 23 side with respect to the adjustment part 13. can In addition, among the regions in the case 11 , other configurations (eg, the measuring unit 16 and the observation unit 17 ) are arranged in the region on the side of the first wall part 21 with respect to the adjusting part 13 in the region, etc. can be used effectively.

Moreover, in the laser processing head 10A, the measuring part 16 and the observation part 17 are arrange|positioned in the area|region on the 1st wall part 21 side with respect to the adjustment part 13 among the area|region within the case 11, and a circuit part (19) is arranged on the third wall part 23 side with respect to the adjustment part 13 in the area within the case 11, and the dichroic mirror 15 is connected to the adjustment part 13 in the case 11. It is disposed between the light condensing unit 14 and the light condensing unit 14 . Thereby, the area in the case 11 can be used effectively. Moreover, in the laser processing apparatus 1, the processing based on the measurement result of the distance between the surface of the object 100 and the condensing part 14 becomes possible. Moreover, in the laser processing apparatus 1, processing based on the observation result of the surface of the target object 100 becomes possible.

Moreover, in the laser processing head 10A, the circuit part 19 controls the drive part 18 based on the signal output from the measurement part 16. As shown in FIG. Thereby, the position of the converging point of the laser beam L1 can be adjusted based on the measurement result of the distance between the surface of the object 100 and the condensing part 14. As shown in FIG.

Moreover, in the laser processing head 10A, the incident part 12 and the attenuator 31 of the adjustment part 13, the beam expander 32, and the mirror 33 are straight line A1 extending along the Z direction. a straight line A2 disposed on the upper surface, and the reflective spatial light modulator 34 of the adjusting unit 13, the imaging optical system 35 and the light collecting unit 14, and the light collecting unit 14 extending along the Z direction placed on top. Thereby, the adjustment unit 13 having the attenuator 31 , the beam expander 32 , the reflective spatial light modulator 34 , and the imaging optical system 35 can be configured in a compact manner.

Moreover, in 10 A of laser processing heads, the straight line A1 is located in the 2nd wall part 22 side with respect to the straight line A2. Thereby, in the region on the side of the first wall part 21 with respect to the adjustment part 13 among the regions in the case 11, other optical systems using the condensing part 14 (for example, the measuring part 16 and the observation part (for example) 17)), the degree of freedom in the configuration of the other optical system can be improved.

The above actions and effects are similarly expressed by the laser processing head 10B.

[Modified example of laser processing head]

As shown in FIG. 6 , the incident unit 12 , the adjustment unit 13 , and the light converging unit 14 may be arranged on a straight line A extending along the Z direction. According to this, the adjustment part 13 can be comprised compactly. In that case, the adjustment unit 13 may not have the reflective spatial light modulator 34 and the imaging optical system 35 . Moreover, the adjustment part 13 may have the attenuator 31 and the beam expander 32. As shown in FIG. According to this, the adjustment part 13 which has the attenuator 31 and the beam expander 32 can be comprised compactly. In addition, the order of the arrangement|sequence of the attenuator 31 and the beam expander 32 may be reversed.

Moreover, light guide of the laser beam L1 from the emission part 81a of the light source unit 8 to the incident part 12 of the laser processing head 10A, and the exit part 82a of the light source unit 8 ) to the incident portion 12 of the laser processing head 10B, at least one of the light guides of the laser beam L2 may be implemented by a mirror. Fig. 7 is a front view of a part of the laser processing apparatus 1 to which the laser beam L1 is guided by a mirror. In the structure shown in FIG. 7, the mirror 3 which reflects the laser beam L1 opposes the emitting part 81a of the light source unit 8 in a Y direction, and of the laser processing head 10A in a Z direction. It is attached to the moving part 63 of the moving mechanism 6 so that it may face the incident part 12. As shown in FIG.

In the configuration shown in FIG. 7 , even when the moving part 63 of the moving mechanism 6 is moved along the Y direction, the mirror 3 faces the emitting part 81a of the light source unit 8 in the Y direction. is maintained Moreover, even if the mounting part 65 of the moving mechanism 6 is moved along the Z direction, the state in which the mirror 3 opposes the incident part 12 of the laser processing head 10A in Z direction is maintained. Therefore, regardless of the position of the laser processing head 10A, the laser beam L1 emitted from the emission part 81a of the light source unit 8 is incident reliably on the incidence part 12 of the laser processing head 10A. can do it In addition, a light source such as a high-power long-short pulse laser, which is difficult to guide light by the optical fiber 2, may be used.

In addition, in the structure shown in FIG. 7, the mirror 3 may be attached to the moving part 63 of the moving mechanism 6 so that at least one of angle adjustment and position adjustment may become possible. According to this, the laser beam L1 radiated|emitted from the emitting part 81a of the light source unit 8 can be made to make the incident part 12 of 10A of laser processing head 10A incident more reliably.

Moreover, the light source unit 8 may have one light source. In that case, the light source unit 8 should just be comprised so that a part of the laser beam output from one light source may be emitted from the emitting part 81a, and the remainder of the said laser beam may be radiate|emitted from the emitting part 82a.

[About operation of laser processing equipment, etc.]

Then, the operation|movement of the laser processing apparatus 1 is demonstrated. 8 : is a schematic top view which shows operation|movement of a laser processing apparatus. In the following drawings, the schematic interior of laser processing head 10A, 10B is shown. As shown in FIG. 8 , the object 100 is supported by the support part 7 . In addition, the code|symbol S in the figure represents optical systems other than the optical system related to the irradiation of the laser beams L1 and L2 for forming a modified area|region like the measurement part 16 and the observation part 17 mentioned above on a representative basis.

Moreover, the laser processing apparatus 1 is equipped with alignment camera AC and imaging unit IR. The alignment camera AC and the imaging unit IR are attached to the mounting unit 65 together with the laser processing head 10A. The alignment camera AC images, for example, a device pattern using light passing through the target 100 . The image obtained by this is provided for alignment of the irradiation position of laser beam L1, L2 with respect to the target object 100. As shown in FIG.

The imaging unit IR images the target object 100 with light passing through the target object 100 . For example, when the object 100 is a wafer including silicon, light in the near-infrared region is used in the imaging unit IR. The imaging unit IR has a light source (not shown), an objective lens (not shown), and a light detection unit (not shown). The light source outputs light having transparency to the object 100 . The light source is constituted of, for example, a halogen lamp and a filter, and outputs, for example, light in the near-infrared region. The light output from the light source is guided by an optical system such as a mirror, passes through the objective lens, and is irradiated to the object 100 .

The objective lens passes the light reflected from the surface opposite to the light incident surface of the object 100 . That is, the objective lens transmits the light that has propagated (transmitted) the object 100 . The numerical aperture (NA) of the objective lens is, for example, 0.45 or more. The objective lens has a correction ring. The correction ring corrects aberrations occurring in the light within the object 100 by, for example, adjusting the distances between the plurality of lenses constituting the objective lens. The light detection unit detects light that has passed through the objective lens. The photodetector is constituted by, for example, an InGaAs camera, and detects light in the near-infrared region. The imaging unit IR can image the modified region formed inside the object 100 and the tip of the crack extending from the modified region. That is, in the laser processing apparatus 1, the success or failure of a laser processing can be confirmed non-destructively using imaging unit IR.

A plurality of lines C extending along the X direction and arranged along the Y direction are set in the object 100 . The line C is an imaginary line, but may be a line actually drawn. Moreover, although the some line extended along the Y direction and arranged along the X direction is also set in the target object 100, the illustration is abbreviate|omitted.

The laser processing apparatus 1 performs laser processing along each line C under the control of the control part 9. As shown in FIG. The control part 9, here, the movement of the support part 7, the mounting part 65, and the mounting part 66, and laser beam L1, L2 from the laser processing head 10A and the laser processing head 10B. ) to control the irradiation. In the laser processing apparatus 1, the control part 9 performs a 1st scan process and a 2nd scan process. A 1st scan process is a process which scans the laser beam L1 from 10A of laser processing heads with respect to 1 line C of several lines C in the X direction. A 2nd scanning process is a process which scans the laser beam L2 from the laser processing head 10B with respect to the other line C among several line C in the X direction.

The control unit 9 scans the laser beams L1 and L2 in the X direction, first, the laser processing heads 10A, 10B are moved in the Y direction and the Z direction via the mounting units 65 and 66, Let the converging points of the laser beams L1 and L2 be positioned at positions to be inside the object 100 as on each line C. And in that state, by moving the support part 7 in the X direction, the converging point of the laser beams L1 and L2 is moved along the line C in the object 100 in the X direction.

In particular, here, the control part 9 executes the 1st scan process and the 2nd scan process so that it may overlap for at least a part of time. That is, the control unit 9 is configured such that the state in which the laser light L1 is scanned along one line C and the state in which the laser light L2 is scanned along the other line C are simultaneously realized. do. That is, the control part 9 operates the laser processing head 10A and the laser processing head 10B simultaneously. Thereby, compared with the processing using one laser processing head, the improvement of a throughput is achieved clearly.

When the scanning of the laser beams L1 and L2 along one line C is completed, the control part 9 independently separates each of the laser processing heads 10A, 10B by the interval of the line C. It moves in the Y-direction (the Z-direction if necessary), and the scanning of the laser beams L1 and L2 along the following line C (namely, a 1st scan process and a 2nd scan process) is continued. The control unit 9 continuously performs this operation for approximately the number of lines C, thereby forming a modified region along all the lines C. As shown in FIG.

As shown in FIG.9 and FIG.10, here, the control part 9 is inside the Y direction from the line C located in one edge part of the Y direction of the object 100 among several lines C. The first scan processing is performed in order toward the line C of . At the same time, the control unit 9 sequentially performs a second scan process from the line C located at the other end of the object 100 in the Y direction among the plurality of lines C toward the inner line in the Y direction. (This is called 'main processing'). The line C located at one end of the Y direction and the line C located at the other end of the Y direction have the same length in the X direction.

This point will be described in more detail. In the main processing process, first, the control unit 9 sets the converging point of the laser light L1 by the movement of the laser processing head 10A via the mounting unit 65 in the Y direction of the object 100 . It is set as the state located in the position used as the inside of the object 100 as the line C located at one edge part. At the same time, the control unit 9 positions the converging point of the laser light L2 at the other end of the object 100 in the Y direction by movement of the laser processing head 10B via the mounting unit 66 . It is assumed that it is positioned at a position that becomes the inside of the object 100 as the line (C) image. At this time, the position of the X-direction of the light-converging point of the laser beam L1 coincides with the X-direction position of the light-converging point of the laser beam L2.

In that state, the control part 9 moves the support part 7 in the X direction, so that the light-converging point of the laser beams L1 and L2 in the X direction along each line C in the object 100 . move the Thereby, the 1st scan process and the 2nd scan process with respect to each line C are simultaneously started and completed simultaneously. That is, here, the 1st scan process and the 2nd scan process overlap in the whole. Thereby, the modified region M is formed in the inside of the object 100 along the pair of lines C. As shown in FIG.

Next, the control unit 9 sets the converging point of the laser beam L1 by 1 from one end of the object 100 in the Y direction by movement of the laser processing head 10A via the mounting unit 65 . It is assumed that it is positioned at a position to become the inside of the object 100 as the line (C) positioned on the inside by the number of pieces. At the same time, the control unit 9 sets the light-converging point of the laser light L2 by 1 from the other end of the object 100 in the Y direction by movement of the laser processing head 10B via the mounting unit 66 . It is assumed that it is positioned at a position to become the inside of the object 100 as the line (C) positioned on the inside by the number of pieces. At this time, the position of the X-direction of the light-converging point of the laser beam L1 coincides with the X-direction position of the light-converging point of the laser beam L2.

In that state, the control unit 9 moves the support unit 7 in the X direction (in the case of a reciprocating operation, in the opposite direction to the X direction), so that the inside of the object 100 is X along each line C. The converging point of the laser beams L1 and L2 is moved in the direction (the direction opposite to the X-direction in the case of a reciprocating operation). Thereby, also here, the 1st scan process and the 2nd scan process with respect to each line C are simultaneously started and completed simultaneously. That is, also here, the 1st scan process and the 2nd scan process overlap in the whole. Thereby, along the pair of lines (C), the modified region (M) is further formed in the inside of the object (100). By repeatedly performing the operation of the control unit 9, the laser processing head 10A and the laser processing head 10B are simultaneously operated up to the line C on the inner side of the object 100, and the laser is not omitted. processing can be done.

Moreover, in the top view after FIG. 9, although the modified area|region M is shown as a solid line for the necessity of explanation, it is not required that the modified area|region M is actually seen from the surface of the object 100. As shown in FIG.

Here, as shown in FIG. 11, while repeating the above operation, in the region inside the object 100, the positional relationship between the laser processing head 10A and the laser processing head 10B is the distance to each other. becomes a positional relationship (for example, in contact with each other) that does not decrease more than this in the Y direction, and in the area of the object 100 corresponding to the distance D between the respective light collecting parts 14, The unprocessed line C may remain. In this case, it becomes difficult to simultaneously execute the first scan process and the second scan process as described above. Accordingly, the control unit 9 executes the following processing in this case.

That is, as shown in FIG. 12, the control part 9 is laser processing head 10A, when 10 A of laser processing heads and the laser processing head 10B approach most with respect to a Y direction as a result of a main processing process. ), the second scan process is continued. That is, after that, only the 2nd scan process using the laser processing head 10B will be performed. Moreover, here, as an example, from the line C on the side of the laser processing head 10A most with respect to the Y direction among the lines C remaining unprocessed toward the outer side of the Y direction (arrow R1 direction) ), you may execute the second scan processing sequentially. When only this second scan process is being executed, the control unit 9 moves the imaging unit IR via the mounting unit 65 onto the line C on which processing has been completed, as shown in FIG. 13 . In addition, the imaging process of imaging the area|region of the target object 100 including the said line C by imaging unit IR is performed.

Then, the control unit 9 determines, based on the image obtained by the imaging process, whether the modified region M and/or cracks extending from the modified region M are formed in the object 100 in the corresponding region according to the regulations. Determine whether or not Here, the control part 9 may confirm the said determination by confirming the modified area|region M itself, and may confirm the presence or absence or the position of the front-end|tip of the crack extending from the modified area|region M, and may perform this determination. As an example, as shown in FIG. 14 , the control unit 9 detects that the unprocessed area RS is generated along the line C where the modified area M should be formed in the image, and , it can be determined that the modified region M is not formed according to the regulations. In this case, the control part 9 performs the auxiliary processing process which scans the laser beam L1 along the said line C again. Thereby, the modified area|region M is formed along the line C in which the unprocessed area|region RS had arisen.

In this way, when it is determined that the modified region M and/or cracks are not formed according to the regulation as a result of the determination, the control unit 9 performs at least the laser beam L1 along the line C. Auxiliary machining processing that scans again is performed. In addition, the control unit 9 can perform imaging processing at at least one location on the line C of the object 100 .

[Operation and effect of laser processing equipment]

The laser processing apparatus 1 is movable along the X-direction, and the support part 7 for supporting the object 100 along the X-direction and the Y-direction, and the Y-direction are arranged to face each other, and the support part ( 7) is provided with a laser processing head (10A, 10B) for irradiating the laser beam (L1, L2) to the object 100 supported by. Moreover, in the laser processing apparatus 1, the laser processing head 10A is attached, the mounting part 65 which became movable along each Y direction and Z direction, and the laser processing head 10B are attached, the Y direction and a mounting portion 66 that is movable along each of the and Z directions. And the laser processing apparatus 1 is attached to the mounting part 65, and is equipped with the imaging unit IR which images the target object 100 by the light which penetrate|transmits the target object 100. As shown in FIG.

In this laser processing apparatus 1, on the support part 7 which supports the target object 100, the laser processing head 10A and the laser processing head 10B are arrange|positioned so that it may mutually oppose. And the laser processing head 10A and the laser processing head 10B are independently movable in two mutually intersecting directions via the attachment part 65 and the attachment part 66 respectively. For this reason, in two places of the target object 100, it becomes mutually independent and it becomes possible to perform laser processing by scanning of laser beam L1, L2. Therefore, the improvement of the throughput is achieved.

Moreover, the imaging unit IR which images the object 100 by the light which penetrates the object 100 is further attached to the mounting part 65 which bears the movement of 10 A of laser processing heads. Therefore, for example, while performing laser processing by the laser processing head 10B, the other location of the target object 100 can be imaged by imaging unit IR. Therefore, the state of laser processing can be confirmed non-destructively, suppressing the fall of a throughput. That is, according to the laser processing apparatus 1, the success or failure of laser processing can be confirmed non-destructively, improving a throughput.

Moreover, the laser processing apparatus 1 includes the movement of the support part 7, the attachment part 65, and the attachment part 66, and laser beam L1 from the laser processing head 10A and the laser processing head 10B, It further comprises the control part 9 which controls irradiation of L2) and imaging of the target object 100 by imaging unit IR. A plurality of lines C extending along the X direction and arranged along the Y direction are set in the object 100 . And the control part 9 is the 1st scanning process which scans the laser beam L1 from 10A of laser processing head 10A in the X direction with respect to one line C among several lines C, The 2nd scanning process which scans the laser beam L2 from the laser processing head 10B with respect to the other line C among the lines C in the X direction is performed overlappingly in at least one part time. In addition, when only the second scan processing is being executed, the control unit 9 executes the imaging processing of imaging the area of the object 100 including the line C on which the processing has been completed by the imaging unit IR.

As described above, by performing the first scan process and the second scan process in duplicate, the throughput is improved. Moreover, at the timing in which only the 2nd scan process is performed, imaging process can be rinsed by controlling imaging unit IR which can move together with 10 A of laser processing heads. Therefore, the success or failure of laser processing can be confirmed non-destructively, improving a throughput more reliably.

Moreover, in the laser processing apparatus 1, the control part 9 determines whether the modified area|region M and/or a crack is formed in accordance with the regulation in the target object 100 in this area|region based on the image obtained by the imaging process. While determining whether or not, as a result of the determination, when it is determined that the modified region M and/or cracks are not formed according to the regulations, at least the laser beam L1 is scanned along the line C. Executes the auxiliary machining process to be performed again. For this reason, a machining error is compensated by an auxiliary machining process.

Moreover, in the laser processing apparatus 1, the control part 9 is a line inside the 2nd direction from the line C located in one edge part of the Y direction of the object 100 among several lines C. A line C inside the Y direction from the line C located at the other end of the object 100 in the Y direction among the plurality of lines C while executing the first scan process in order toward C) The main processing processing which executes the second scan processing sequentially toward each other is executed. In this way, in the main processing process, by executing the first scan process and the second scan process sequentially from the line C at the contrasting position of the object 100 in the Y direction, the laser beam L1, L2 The waste of the relative movement along the X-direction with respect to the object 100 of the light-converging point is reduced, and the throughput is further improved.

Moreover, in the laser processing apparatus 1, the control part 9 is the laser processing head 10A, when the laser processing head 10A and the laser processing head 10B approached most with respect to a Y direction in a main processing process. The second scan process is continued while evacuating from the area, and the imaging process is executed. In this case, the laser processing head 10A and the laser processing head 10B are utilized to the maximum to improve throughput, and the success or failure of laser processing can be confirmed non-destructively.

[Modified example]

The above embodiment exemplifies one embodiment of the laser processing apparatus. Therefore, the laser processing apparatus which concerns on this indication is not limited to the said laser processing apparatus 1, It can deform|transform arbitrarily.

15 to 18 are views showing modified examples of the mounting part and the laser processing head. As shown in Fig. 15(a), the mounting part 66 is attached to the laser processing head 10B while providing the mounting part 65 in the first wall part 21 of the case 11 of the laser processing head 10A. You may provide in the 1st wall part 21 of the case 11 of . Moreover, as shown in FIG.15(b), while providing the mounting part 65 in the 3rd wall part 23 of the case 11 of 10 A of laser processing heads, the mounting part 66 is a laser processing head. In the form provided in the 3rd wall part 23 of the case 11 of (10B), you may change the position of the moving parts 63 and 64 in the mounting parts 65 and 66 in the X direction. Furthermore, as shown in Fig. 15(c), while the mounting portion 65 is provided on the second wall portion 22 of the case 11 of the laser processing head 10A, the mounting portion 66 is attached to the laser processing head ( You may provide in the 2nd wall part 22 of the case 11 of 10B).

Moreover, as shown in Fig. 16(a), while providing the mounting part 65 to the 5th wall part 25 of the case 11 of the laser processing head 10A, the mounting part 66 is attached to the laser processing head ( You may provide in the 5th wall part 25 of the case 11 of 10B). Moreover, as shown in FIG. 16(b), while providing the mounting part 65 on the 6th wall part 26 of the case 11 of the laser processing head 10A, the mounting part 66 is attached to the laser processing head ( You may provide in the 6th wall part 26 of the case 11 of 10B). As described above, the attachment portions 65 and 66 may each be attached to a wall portion different from the fourth wall portion 24 opposite to each other along the Y direction. Furthermore, as shown in FIG. 16(c), the light collecting part 14 is provided in the central part of the case 11 with respect to the X direction while expanding the distance between the first wall part 21 and the second wall part 22. It is good to provide

Moreover, like the above example, in the laser processing apparatus 1, it is not necessary to use the laser processing head 10A and the laser processing head 10B as a pair of laser processing heads. That is, in the laser processing apparatus 1, as shown in FIG.17(a), a pair (one type) of laser processing heads 10A is used, or as shown in FIG.17(b). Similarly, a pair of (another type) laser processing head 10B can be used. In these cases, with respect to one laser processing head 10A, 10B, the other laser processing head 10A, 10B is rotated 180 degrees centering on the Z-axis direction, and the X of each light collecting part 14 is It is arranged so that the position of the center of the direction coincides. In these cases, there is no need to prepare two types of laser processing heads.

Likewise, even when only the laser processing head 10A (or only the laser processing head 10B) is used, the wall part which provides the mounting parts 65 and 66 can be changed variously. For example, as shown to Fig.18 (a), one laser processing head, providing the mounting part 65 in the 1st wall part 21 of the case 11 of 10 A of one laser processing head. The mounting part 66 can be provided in the 2nd wall part 22 of the case 11 of 10A. Moreover, as shown in FIG.18(b), one laser processing head 10B, providing the mounting part 65 in the 2nd wall part 22 of the case 11 of one laser processing head 10B. ), you may provide the mounting part 66 in the 1st wall part 21 of the case 11. That is, even in these cases, the mounting portions 65 and 66 may be respectively attached to the fourth wall portion 24 opposite to each other along the Y direction and to a different wall portion.

In addition, in the said embodiment, the form to which imaging unit IR is attached was demonstrated about the attachment part 65 to which 10 A of laser processing heads are attached. However, imaging unit IR is attached with respect to the mounting part 66 to which the laser processing head 10B is attached, and you may make it perform an imaging process when only a 1st scan process is being performed. In addition, the imaging unit IR is not limited to the case where it is attached to the mounting parts 65 and 66, The position which can move in Y direction and Z direction together with laser processing head 10A (or laser processing head 10B). Also, it can be provided at any position not interposed between the fourth wall portion 24 of the laser processing head 10A and the fourth wall portion 24 of the laser processing head 10B.

Moreover, the control part 9 is mutually different by the laser beam L1 from the laser processing head 10A, and the laser beam L2 from the laser processing head 10B, at the light-converging position of the Z direction. , you may make it perform the process (multi-panel processing) which processes the target object 100. In multi-wavelength processing, for example, when processing a wafer in which silicon (Si) and glass are bonded (case 1), or when a part of laser light (L1, L2) incident from the back side is absorbed by the device This can be used in the case of processing wafers in which circuit breakage may occur (the second case) or the like.

In the first case, both the light of the wavelength for processing silicon (for example, 1064 nm) and the light with the wavelength for processing the glass (for example, 532 nm) need to reach the target material, so the processing is performed from the glass side. . The condensing position of the laser light L1 from the laser processing head 10A is aligned within the silicon beyond the glass, and the condensing position of the laser light L2 from the laser processing head 10B is aligned within the glass, and processing is performed with a corresponding wavelength. Conduct. In order to process a wafer to which two different types of substrates are bonded in this way by multi-wavelength processing, the wavelength for processing the lower substrate among the wavelengths needs to be a wavelength that transmits the upper substrate. Here, since multi-wavelength processing is performed using a pair of laser processing heads 10A, 10B, the improvement of throughput is achieved.

On the other hand, in the second case, the converging position of the laser beam L1 from the laser processing head 10A is set in the device vicinity, and the condensing position of the laser beam L2 from the laser processing head 10B is set to the device set it away from The wavelength of the laser light L1 is set to a wavelength (for example, 1064 nm) that is more absorbed by the substrate so that the leakage light to the device side is reduced, and the wavelength of the laser light L2 is set to a wavelength of the laser light L2 even if some leakage light occurs. , a wavelength longer than the wavelength of the laser light L1 suitable for further processing of the substrate (for example, 1342 nm).

[Industrial Applicability]

A laser processing apparatus capable of confirming the success or failure of laser processing by non-destructiveness while improving throughput is provided.

1 - laser processing device
7 - support
9 - control
10A - laser processing head (first laser processing head)
10B - laser processing head (second laser processing head)
65 - mounting part ( first mounting part)
66 - mounting part ( second mounting part)
100 - object
C - line
IR - imaging unit
L1, L2 - laser light

Claims (5)

a support part movable along a first direction and configured to support an object in the first direction and in a second direction intersecting the first direction;
A first laser processing head and a second laser processing head disposed to face each other along the second direction, and for irradiating a laser beam to the object supported by the support;
a first mounting part on which the first laser processing head is mounted and movable along each of the third direction and the second direction intersecting the first direction and the second direction;
a second mounting part on which the second laser processing head is mounted and movable along each of the second direction and the third direction;
and an imaging unit mounted on the first mounting unit and configured to image the target object with light transmitted through the target object. The method according to claim 1,
Controls movement of the support part, the first mounting part, and the second mounting part, irradiation of the laser beam from the first laser processing head and the second laser processing head, and imaging of the target by the imaging unit It further comprises a control unit that
A plurality of lines extending along the first direction and arranged along the second direction are set in the object,
The control unit includes a first scan process for scanning the laser beam from the first laser processing head in the first direction with respect to one of the plurality of lines, and the second line for the other of the plurality of lines. 2 While executing the second scan process for scanning the laser beam from the laser processing head in the first direction in duplicate at least for a part of time, while executing only the second scan process, the line on which processing has been completed A laser processing apparatus for performing imaging processing for imaging an area of the target object including the imaging unit. 3. The method according to claim 2,
The control unit determines, based on the image obtained by the imaging process, whether or not a modified region and/or cracks are formed in the object in the region according to a regulation, and as a result of the judgment, Therefore, when it is determined that the said modified area|region and/or a crack is not formed, the laser processing apparatus which performs the auxiliary processing process which scans the said laser beam along the said line again at least. 4. The method according to claim 3,
The control unit executes the first scan process sequentially from a line positioned at one end of the object in the second direction among the plurality of lines toward an inner line in the second direction while executing the first scan process on the plurality of lines. A laser processing apparatus for executing a main processing process of sequentially executing the second scan process from a line positioned at the other end of the object in the second direction toward an inner line in the second direction. 5. The method according to claim 4,
The control unit, in the main processing, when the first laser processing head and the second laser processing head are closest to the second direction, while retracting the first laser processing head, the second The laser processing apparatus which carries out the said imaging process while continuing a scan process.

Images