TWI837204B - Laser processing equipment - Google Patents

Abstract

A laser processing device comprises: a support portion that supports an object and moves along a first direction; a first moving portion that moves along a second direction perpendicular to the first direction; a first mounting portion that is mounted on the first moving portion and moves along a third direction perpendicular to the first and second directions; a first laser processing head that is mounted on the first mounting portion and irradiates the object with a first laser light; a light source unit that outputs the first laser light; and a first mirror that is mounted on the first moving portion and reflects the first laser light. The first laser processing head has a first incident portion and a first focusing portion. The light source unit has a first emission portion. The first mirror is mounted on the first moving portion so as to be opposite to the first emission portion in the second direction and opposite to the first incident portion in the third direction.

Description

Laser processing equipment

The present invention relates to a laser processing device.

Patent document 1 describes a laser processing device, which includes: a holding mechanism for holding a workpiece, and a laser irradiation mechanism for irradiating laser light to the workpiece held by the holding mechanism. The laser processing device described in Patent document 1 is a laser irradiation mechanism having a focusing lens fixed to a base, and the holding mechanism is used to move the workpiece in a direction perpendicular to the optical axis of the focusing lens. [Prior technical document] [Patent document]

[Patent Document 1] Japanese Patent No. 5456510

[The problem that the invention is trying to solve]

In the case of a laser processing device such as the above, when considering the application to various processing, it is preferable to have a structure in which the focusing lens is moved in a direction perpendicular to the optical axis of the focusing lens. However, the laser processing device described in Patent Document 1 is a laser irradiation mechanism in which each structure on the optical path of the laser light from the laser oscillator to the focusing lens is arranged in a housing, so that it is difficult to move the focusing lens in a direction perpendicular to the optical axis of the focusing lens.

The present invention aims to provide a laser processing device that can smoothly move the focusing part in a direction perpendicular to its optical axis. [Means for solving the problem]

The laser processing device of one side of the present invention comprises: a support portion, which supports an object and moves along a first direction; a first moving portion, which moves along a second direction perpendicular to the first direction; a first mounting portion, which is mounted on the first moving portion and moves along a third direction perpendicular to the first direction and the second direction; a first laser processing head, which is mounted on the first mounting portion and irradiates a first laser light to the object; and a light source unit, which outputs a first 1 laser light; and a first mirror, which is mounted on the first movable part and reflects the first laser light, the first laser processing head having: a first input part for allowing the first laser light to enter, and a first focusing part for focusing the first laser light and emitting it, the light source unit having a first emitting part for allowing the first laser light to emit, and the first mirror is mounted on the first movable part so as to be opposite to the first emitting part in the second direction and opposite to the first input part in the third direction.

In the laser processing device, the first moving portion on which the first laser processing head is mounted via the first mounting portion is moved in the second direction, thereby allowing the first focusing portion of the first laser processing head to move in a direction perpendicular to its optical axis. In addition, even if the first moving portion is moved in the second direction, the first mirror and the first emission portion of the light source unit can be maintained in a state opposite to each other in the second direction. Furthermore, even if the first mounting portion is moved in the third direction, the first mirror and the first input portion of the first laser processing head can be maintained in a state opposite to each other in the third direction. Therefore, regardless of the position of the first laser processing head, the first laser light emitted from the first emission portion of the light source unit can be reliably injected into the first input portion of the first laser processing head. Furthermore, a light source such as a high-power long-short pulse laser which is difficult to guide light by an optical fiber can be used. As described above, according to the laser processing device, the focusing part can be smoothly moved in a direction perpendicular to its optical axis.

In the laser processing device of one aspect of the present invention, the first mirror may be mounted on the first moving part so as to enable at least one of angle adjustment and position adjustment. Thus, the first laser light emitted from the first emission part of the light source unit can be more reliably injected into the first injection part of the first laser processing head.

In the laser processing device of one aspect of the present invention, the support portion may be rotated with an axis parallel to the third direction as the center line. Thereby, the object can be processed efficiently.

The laser processing device of one side of the present invention further comprises: a second moving part, which moves along the second direction; a second mounting part, which is mounted on the second moving part and moves along the third direction; and a second laser processing head, which is mounted on the second mounting part and irradiates the object with the second laser light, and a light source unit, which outputs the second laser light, wherein the second laser processing head has: a second incident part for injecting the second laser light, and a second focusing part for focusing and emitting the second laser light, and the light source unit may have a second emission part for emitting the second laser light. Thus, the second moving part on which the second laser processing head is mounted via the second mounting part moves along the second direction, thereby enabling the second focusing part of the second laser processing head to move along the direction perpendicular to its optical axis. As described above, by providing a plurality of laser processing heads, an object can be processed efficiently.

The laser processing device of one side of the present invention further has a second mirror, which is mounted on the second moving part and reflects the second laser light. The second mirror can be mounted on the second moving part so as to be opposite to the second emitting part in the second direction and opposite to the second incident part in the third direction. Thereby, even if the second moving part is moved along the second direction, the state in which the second mirror and the second emitting part of the light source unit are opposite to each other in the second direction can be maintained. Furthermore, even if the second mounting part is moved along the third direction, the state in which the second mirror and the second incident part of the second laser processing head are opposite to each other in the third direction can be maintained. Therefore, regardless of the position of the second laser processing head, the second laser light emitted from the second emitting part of the light source unit can be reliably incident on the second incident part of the second laser processing head. Furthermore, light sources such as high-power long and short pulse lasers, which are difficult to guide with optical fibers, can be used.

In the laser processing device of one aspect of the present invention, the second mirror may be mounted on the second moving part so as to enable at least one of angle adjustment and position adjustment. Thus, the second laser light emitted from the second emission part of the light source unit can be more reliably injected into the second injection part of the second laser processing head.

The laser processing device of one aspect of the present invention further has an optical fiber, which can guide the second laser light from the second emission part to the second input part. Thereby, when the wavelength of the second laser light is a wavelength that can be guided by the optical fiber, the second laser light emitted from the second emission part of the light source unit can be more reliably injected into the second input part of the second laser processing head. [Effect of the invention]

According to the present invention, a laser processing device can be provided, which can enable the focusing part to move smoothly along the direction perpendicular to its optical axis.

Below, the implementation form of the present disclosure is described in detail with reference to the drawings. In addition, the same symbols are attached to the same or equivalent parts in each figure, and repeated descriptions are omitted. [Structure of laser processing device]

As shown in FIG1 , the laser processing device 1 includes: a plurality of moving mechanisms 5, 6, a support portion 7, a pair of laser processing heads (a first laser processing head, a second laser processing head) 10A, 10B, a light source unit 8, and a control portion 9. Hereinafter, the first direction is referred to as the X direction, the second direction perpendicular to the first direction is referred to as the Y direction, and the third direction perpendicular to the first direction and the second direction is referred to as the Z direction. In the present embodiment, the X direction and the Y direction are horizontal directions, and the Z direction is a vertical direction.

The moving mechanism 5 includes a fixed portion 51, a moving portion 53, and a mounting portion 55. The fixed portion 51 is mounted on the device frame 1a. The moving portion 53 is mounted on a track provided on the fixed portion 51 and is movable in the Y direction. The mounting portion 55 is mounted on a track provided on the moving portion 53 and is movable in the X direction.

The moving mechanism 6 comprises: a fixed portion 61, a pair of moving portions (a first moving portion and a second moving portion) 63, 64, and a pair of mounting portions (a first mounting portion and a second mounting portion) 65, 66. The fixed portion 61 is mounted on the device frame 1a. Each of the pair of moving portions 63, 64 is mounted on a track provided on the fixed portion 61, and can be independently moved in the Y direction. The mounting portion 65 is mounted on a track provided on the moving portion 63, and can be moved in the Z direction. The mounting portion 66 is mounted on a track provided on the moving portion 64, and can be moved in the Z direction. That is, each of the pair of mounting portions 65, 66 can be moved in the Y direction and the Z direction, respectively, with respect to the device frame 1a.

The support part 7 is mounted on the rotation axis of the mounting part 55 provided on the moving mechanism 5, and can rotate with the axis parallel to the Z direction as the center line. In other words, the support part 7 can move along each of the X direction and the Y direction, and can rotate with the axis parallel to the Z direction as the center line. The support part 7 supports the object 100. The object 100 is, for example, a wafer.

As shown in Fig. 1 and Fig. 2, the laser processing head 10A is mounted on the mounting portion 65 of the moving mechanism 6. The laser processing head 10A irradiates the object 100 supported by the supporting portion 7 with laser light (first laser light) L1 while facing the supporting portion 7 in the Z direction. The laser processing head 10B is mounted on the mounting portion 66 of the moving mechanism 6. The laser processing head 10B irradiates the object 100 supported by the supporting portion 7 with laser light (second laser light) L2 while facing the supporting portion 7 in the Z direction.

The light source unit 8 has a pair of light sources 81 and 82. The light source 81 is mounted on the fixed portion 61 of the moving mechanism 6. The light source 81 outputs the laser light L1. The laser light L1 is emitted from the emission portion (first emission portion) 81a of the light source 81 and guided to the laser processing head 10A by the mirror (first mirror) 3. The light source 82 is mounted on the device frame 1a. The light source 82 outputs the laser light L2. The laser light L2 is emitted from the emission portion (second emission portion) 82a of the light source 82 and guided to the laser processing head 10B by the optical fiber 2.

The structures of the light source 81 and the mirror 3 are described in more detail. The light source 81 is mounted on the fixed portion 61 and is located on the side of the moving portion 63 (the side opposite to the moving portion 64) in the Y direction. The emission portion 81a of the light source 81 faces the side of the moving portion 63. The mirror 3 is mounted on the moving portion 63 and is opposite to the emission portion 81a of the light source 81 in the Y direction and is opposite to the incident portion 12 of the laser processing head 10A in the Z direction. The mirror 3 is mounted on the moving portion 63 so as to enable at least one of angle adjustment and position adjustment. The laser light L1 emitted from the emission portion 81a of the light source 81 is reflected by the mirror 3 and incident on the incident portion 12 of the laser processing head 10A. In addition, the light source 81 may be mounted on the device frame 1a.

In the above-mentioned structure, even if the moving part 63 moves along the Y direction, the mirror 3 and the emitting part 81a of the light source 81 are maintained in a state of facing each other in the Y direction. Furthermore, even if the mounting part 65 moves along the Z direction, the mirror 3 and the incident part 12 of the laser processing head 10A are maintained in a state of facing each other in the Z direction. Therefore, regardless of the position of the laser processing head 10A, the laser light L1 emitted from the emitting part 81a of the light source 81 can be incident on the incident part 12 of the laser processing head 10A.

The control unit 9 controls the various parts of the laser processing device 1 (a plurality of moving mechanisms 5, 6, a pair of laser processing heads 10A, 10B, and a light source unit 8, etc.). The control unit 9 is a computer device including a processor, a memory, a storage unit, and a communication element, etc. In the control unit 9, the software (program) read into the memory, etc. is executed by the processor, and the reading and writing of data in the memory and the storage unit, as well as the communication of the communication element, are controlled by the processor. In this way, the control unit 9 realizes various functions.

An example of processing by the laser processing device 1 configured as described above is described. The example of processing is an example of forming a modified region inside the object 100 along each of a plurality of lines arranged in a grid shape in order to cut the object 100, which is a wafer, into a plurality of chips.

First, the moving mechanism 5 moves the support 7 along the X direction and the Y direction, so that the support 7 supporting the object 100 is opposite to the pair of laser processing heads 10A and 10B in the Z direction. Then, the moving mechanism 5 rotates the support 7 with the axis parallel to the Z direction as the center line, so that the multiple lines of the object 100 extending in one direction are along the X direction.

Next, the moving mechanism 6 moves the laser processing head 10A along the Y direction, so that the focal point of the laser light L1 is located on a line extending in one direction. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Y direction, so that the focal point of the laser light L2 is located on another line extending in one direction. Next, the moving mechanism 6 moves the laser processing head 10A along the Z direction, so that the focal point of the laser light L1 is located inside the object 100. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Z direction, so that the focal point of the laser light L2 is located inside the object 100.

Then, the light source 81 outputs the laser light L1 so that the laser processing head 10A irradiates the object 100 with the laser light L1, and the light source 82 outputs the laser light L2 so that the laser processing head 10B irradiates the object 100 with the laser light L2. At the same time, the moving mechanism 5 moves the support part 7 along the X direction, so that the focal point of the laser light L1 moves relatively along a line extending in one direction and the focal point of the laser light L2 moves relatively along other lines extending in one direction. In this way, the laser processing device 1 forms a modified area inside the object 100 along each of the plurality of lines extending in one direction of the object 100.

Next, the moving mechanism 5 rotates the support portion 7 about an axis parallel to the Z direction as a center line, so that a plurality of lines of the object 100 extending in another direction orthogonal to the one direction are along the X direction.

Next, the moving mechanism 6 moves the laser processing head 10A along the Y direction, so that the focal point of the laser light L1 is located on a line extending in another direction. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Y direction, so that the focal point of the laser light L2 is located on another line extending in another direction. Next, the moving mechanism 6 moves the laser processing head 10A along the Z direction, so that the focal point of the laser light L1 is located inside the object 100. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Z direction, so that the focal point of the laser light L2 is located inside the object 100.

Then, the light source 81 outputs the laser light L1 so that the laser processing head 10A irradiates the object 100 with the laser light L1, and the light source 82 outputs the laser light L2 so that the laser processing head 10B irradiates the object 100 with the laser light L2. At the same time, the moving mechanism 5 moves the support part 7 along the X direction, so that the focal point of the laser light L1 moves relatively along a line extending in another direction and the focal point of the laser light L2 moves relatively along other lines extending in another direction. In this way, the laser processing device 1 forms a modified area inside the object 100 along each of the multiple lines extending in another direction perpendicular to the one direction of the object 100.

Furthermore, in one example of the above-mentioned processing, the light source 81 outputs a penetrating laser light L1 to the object 100, for example, by a pulse oscillation method, and the light source 82 outputs a penetrating laser light L2 to the object 100, for example, by a pulse oscillation method. When the laser light is focused inside the object 100, the portion corresponding to the focal point of the laser light will particularly absorb the laser light, and a modified region will be formed inside the object 100. The modified region refers to a region whose density, refractive index, mechanical strength, and other physical properties are different from those of the surrounding non-modified regions. Examples of the modified region include a melt-processed region, a crack region, an insulation damage region, and a refractive index change region.

When the laser light output by pulse oscillation is irradiated to the object 100 and the focal point of the laser light is relatively moved along the line set on the object 100, a plurality of modified points are formed in a row along the line. One modified point is formed by irradiation with a pulse of laser light. A row of modified areas is a collection of a plurality of modified points arranged in a row. Adjacent modified points may be connected to each other or separated from each other due to the relative movement speed of the focal point of the laser light with respect to the object 100 and the repetition frequency of the laser light. [Structure of laser processing head]

As shown in FIG. 3 and FIG. 4 , the laser processing head 10A includes a housing 11 , an incident portion (first incident portion) 12 , an adjustment portion 13 , and a focusing portion (first focusing portion) 14 .

The housing 11 includes a first wall 21 and a second wall 22, a third wall 23 and a fourth wall 24, and a fifth wall 25 and a sixth wall 26. The first wall 21 and the second wall 22 face each other in the X direction. The third wall 23 and the fourth wall 24 face each other in the Y direction. The fifth wall 25 and the sixth wall 26 face each other in the Z direction.

The distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22. The distance between the first wall portion 21 and the second wall portion 22 is smaller than the distance between the fifth wall portion 25 and the sixth wall portion 26. Furthermore, the distance between the first wall portion 21 and the second wall portion 22 may be equal to the distance between the fifth wall portion 25 and the sixth wall portion 26, or may be larger than the distance between the fifth wall portion 25 and the sixth wall portion 26.

In the laser processing head 10A, the first wall portion 21 is located on the side of the fixed portion 61 of the moving mechanism 6, and the second wall portion 22 is located on the side opposite to the fixed portion 61. The third wall portion 23 is located on the side of the mounting portion 65 of the moving mechanism 6, and the fourth wall portion 24 is located on the side opposite to the mounting portion 65, that is, on the side of the laser processing head 10B (see FIG. 2). The fifth wall portion 25 is located on the side opposite to the support portion 7, and the sixth wall portion 26 is located on the side of the support portion 7.

The housing 11 is configured such that the housing 11 is mounted on the mounting portion 65 in a state where the third wall portion 23 is arranged on the mounting portion 65 side of the moving mechanism 6. Specifically, it is as follows. The mounting portion 65 includes a base plate 65a and a mounting plate 65b. The base plate 65a is mounted on a rail provided on the moving portion 63 (see FIG. 2 ). The mounting plate 65b is vertically provided at an end portion of the base plate 65a on the side of the laser processing head 10B (see FIG. 2 ). The housing 11 is mounted on the mounting portion 65 by screwing the mounting plate 65b with the bolts 28 through the pedestal 27 in a state where the third wall portion 23 contacts the mounting plate 65b. The pedestal 27 is provided on the first wall portion 21 and the second wall portion 22, respectively. The housing 11 can be loaded and unloaded with respect to the mounting portion 65.

The incident portion 12 is mounted on the fifth wall portion 25. The incident portion 12 injects the laser light L1 reflected by the mirror 3 into the housing 11. The incident portion 12 is biased toward the second wall portion 22 side (one wall side) in the X direction and biased toward the fourth wall portion 24 side in the Y direction. That is, the distance between the incident portion 12 and the second wall portion 22 in the X direction is smaller than the distance between the incident portion 12 and the first wall portion 21 in the X direction, and the distance between the incident portion 12 and the fourth wall portion 24 in the Y direction is smaller than the distance between the incident portion 12 and the third wall portion 23 in the X direction.

The adjustment section 13 is disposed in the housing 11. The adjustment section 13 adjusts the laser light L1 incident from the incident section 12. The components of the adjustment section 13 are mounted on an optical base 29 provided in the housing 11. The optical base 29 is mounted on the housing 11 in such a manner as to divide the area in the housing 11 into an area on the side of the third wall 23 and an area on the side of the fourth wall 24. The optical base 29 is integrated with the housing 11. The components of the adjustment section 13 are mounted on the optical base 29 on the side of the fourth wall 24. Details of the components of the adjustment section 13 will be described later.

The light-collecting section 14 is disposed on the sixth wall section 26. Specifically, the light-collecting section 14 is disposed on the sixth wall section 26 in a state of being inserted through a hole 26a formed on the sixth wall section 26. The light-collecting section 14 collects the laser light L1 adjusted by the adjusting section 13 and emits it to the outside of the housing 11. The light-collecting section 14 is biased toward the second wall section 22 side (one wall side) in the X direction and toward the fourth wall section 24 side in the Y direction. That is, the distance between the light-collecting section 14 and the second wall section 22 in the X direction is smaller than the distance between the light-collecting section 14 and the first wall section 21 in the X direction, and the distance between the light-collecting section 14 and the fourth wall section 24 in the Y direction is smaller than the distance between the light-collecting section 14 and the third wall section 23 in the X direction.

As shown in FIG5 , the adjustment section 13 includes an attenuator 31, a beam expander 32, and a mirror 33. The incident section 12, the attenuator 31, the beam expander 32, and the mirror 33 of the adjustment section 13 are arranged on a straight line (first straight line) A1 extending along the Z direction. The attenuator 31 and the beam expander 32 are arranged between the incident section 12 and the mirror 33 on the straight line A1. The attenuator 31 adjusts the output of the laser light L1 incident from the incident section 12. The beam expander 32 expands the diameter of the laser light L1 output after being adjusted by the attenuator 31. The mirror 33 reflects the laser light L1 whose diameter has been expanded by the beam expander 32.

The adjustment section 13 further comprises: a reflective spatial light modulator 34 and an imaging optical system 35. The reflective spatial light modulator 34 and the imaging optical system 35 of the adjustment section 13, and the focusing section 14, are arranged on a straight line (second straight line) A2 extending along the Z direction. The reflective spatial light modulator 34 modulates the laser light L1 reflected by the mirror 33. The reflective spatial light modulator 34 is, for example, a spatial light modulator (SLM: Spatial Light Modulator) of a reflective liquid crystal (LCOS: Liquid Crystal on Silicon). The imaging optical system 35 is a bilateral telecentric optical system that is configured so that the reflecting surface 34a of the reflective spatial light modulator 34 and the entrance pupil surface 14a of the focusing section 14 are in an imaging relationship. The imaging optical system 35 is composed of three or more lenses.

Straight line A1 and straight line A2 are located on a plane perpendicular to the Y direction. Straight line A1 is located on the second wall portion 22 side (one wall side) relative to straight line A2. In the laser processing head 10A, laser light L1 is incident from the incident portion 12 into the housing 11 and travels on straight line A1. After being reflected by the mirror 33 and the reflective spatial light modulator 34 in sequence, it travels on straight line A2 and is emitted from the focusing portion 14 to the outside of the housing 11. Furthermore, the arrangement order of the attenuator 31 and the beam expander 32 may be reversed. Furthermore, the attenuator 31 may be disposed between the mirror 33 and the reflective spatial light modulator 34. Furthermore, the adjustment portion 13 may have other optical components (for example, a turning mirror disposed before the beam expander 32).

The laser processing head 10A further includes a dichroic mirror 15, a measuring unit 16, an observation unit 17, a driving unit 18, and a circuit unit 19.

The dichroic mirror 15 is disposed between the imaging optical system 35 and the focusing section 14 on the straight line A2. That is, the dichroic mirror 15 is disposed between the adjustment section 13 and the focusing section 14 in the housing 11. The dichroic mirror 15 is mounted on the optical base 29 on the side of the fourth wall section 24. The dichroic mirror 15 allows the laser light L1 to pass through. From the viewpoint of suppressing astigmatism, the dichroic mirror 15 is preferably a cubic shape or a plate shape in which two pieces are arranged in a twisted relationship.

The measuring unit 16 is arranged on the first wall 21 side (the side opposite to the one wall side) with respect to the adjusting unit 13 in the housing 11. The measuring unit 16 is mounted on the optical base 29 on the fourth wall 24 side. The measuring unit 16 outputs a measuring light L10 for measuring the distance between the surface of the object 100 (for example, the surface on the side where the laser light L1 is incident) and the focusing unit 14, and detects the measuring light L10 reflected on the surface of the object 100 through the focusing unit 14. That is, the measuring light L10 output from the measuring unit 16 is irradiated onto the surface of the object 100 through the focusing unit 14, and the measuring light L10 reflected on the surface of the object 100 is detected by the measuring unit 16 through the focusing unit 14.

More specifically, the measurement light L10 output from the measurement section 16 is reflected in sequence by the beam splitter 20 and the dichroic mirror 15 mounted on the optical base 29 on the side of the fourth wall 24, and is emitted from the focusing section 14 to the outside of the housing 11. The measurement light L10 reflected on the surface of the object 100 is incident from the focusing section 14 into the housing 11, is reflected in sequence by the dichroic mirror 15 and the beam splitter 20, and is incident to the measurement section 16, where it is detected.

The observation section 17 is arranged on the first wall 21 side (the side opposite to the one wall side) with respect to the adjustment section 13 in the housing 11. The observation section 17 is mounted on the optical base 29 on the fourth wall 24 side. The observation section 17 outputs the observation light L20 for observing the surface of the object 100 (for example, the surface on the side where the laser light L1 is incident), and detects the observation light L20 reflected on the surface of the object 100 through the focusing section 14. That is, the observation light L20 output from the observation section 17 is irradiated to the surface of the object 100 through the focusing section 14, and the observation light L20 reflected on the surface of the object 100 is detected by the observation section 17 through the focusing section 14.

More specifically, the observation light L20 output from the observation section 17 passes through the beam splitter 20, is reflected by the dichroic mirror 15, and is emitted from the focusing section 14 to the outside of the housing 11. The observation light L20 reflected on the surface of the object 100 is incident from the focusing section 14 into the housing 11, is reflected by the dichroic mirror 15, passes through the beam splitter 20, is incident to the observation section 17, and is detected by the observation section 17. In addition, the wavelengths of the laser light L1, the measurement light L10, and the observation light L20 are different from each other (at least the central wavelengths of the respective light are offset from each other).

The driving unit 18 is attached to the optical base 29 on the side of the fourth wall 24. The driving unit 18 moves the light collecting unit 14 disposed on the sixth wall 26 in the Z direction by the driving force of a piezoelectric element, for example.

The circuit section 19 is disposed on the third wall section 23 side relative to the optical base 29 in the housing 11. That is, the circuit section 19 is disposed on the third wall section 23 side relative to the adjustment section 13, the measuring section 16, and the observation section 17 in the housing 11. The circuit section 19 is, for example, a plurality of circuit boards. The circuit section 19 processes the signal output from the measuring section 16 and the signal input to the reflective spatial light modulator 34. The circuit section 19 controls the driving section 18 based on the signal output from the measuring section 16. For example, the circuit unit 19 controls the driving unit 18 based on the signal output from the measuring unit 16 so as to maintain a constant distance between the surface of the object 100 and the focusing unit 14 (that is, to maintain a constant distance between the surface of the object 100 and the focusing point of the laser light L1). In addition, the housing 11 is provided with a connector (not shown) to which wiring for electrically connecting the circuit unit 19 to the control unit 9 (see FIG. 1 ) and the like is connected.

The laser processing head 10B, like the laser processing head 10A, includes a housing 11, an incident portion (second incident portion) 12, an adjustment portion 13, a focusing portion (second focusing portion) 14, a dichroic mirror 15, a measuring portion 16, an observation portion 17, a driving portion 18, and a circuit portion 19. However, as shown in FIG. 2 , the components of the laser processing head 10B are arranged to have a plane-symmetric relationship with the components of the laser processing head 10A with respect to a virtual plane passing through the midpoint between the pair of mounting portions 65 and 66 and perpendicular to the Y direction.

For example, the housing (first housing) 11 of the laser machining head 10A is mounted on the mounting portion 65 so that the fourth wall portion 24 is located on the laser machining head 10B side relative to the third wall portion 23 and the sixth wall portion 26 is located on the support portion 7 side relative to the fifth wall portion 25. In contrast, the housing (second housing) 11 of the laser machining head 10B is mounted on the mounting portion 66 so that the fourth wall portion 24 is located on the laser machining head 10A side relative to the third wall portion 23 and the sixth wall portion 26 is located on the support portion 7 side relative to the fifth wall portion 25.

The housing 11 of the laser processing head 10B is configured such that the housing 11 is mounted on the mounting portion 66 in a state where the third wall portion 23 is arranged on the mounting portion 66 side. Specifically, it is as follows. The mounting portion 66 has a base plate 66a and a mounting plate 66b. The base plate 66a is mounted on a rail provided on the moving portion 63. The mounting plate 66b is vertically provided at the end of the base plate 66a on the side of the laser processing head 10A. The housing 11 of the laser processing head 10B is mounted on the mounting portion 66 in a state where the third wall portion 23 contacts the mounting plate 66b. The housing 11 of the laser processing head 10B can be loaded and unloaded from the mounting portion 66.

Furthermore, in the laser processing head 10B, the input portion 12 is configured to be connected to the connection end 2a of the optical fiber 2. At the connection end 2a of the optical fiber 2, a collimating lens is provided to collimate the laser light L2 emitted from the emission end of the fiber, and no isolator is provided to suppress the reflected light. The isolator is provided in the middle of the fiber closer to the light source 82 than the connection end 2a. In this way, the miniaturization of the connection end 2a and even the miniaturization of the input portion 12 is sought. Furthermore, an isolator may be provided at the connection end 2a of the optical fiber 2. [Function and Effect]

In the laser processing device 1, the moving part 63 on which the laser processing head 10A is mounted through the mounting part 65 is moved along the Y direction, thereby enabling the focusing part 14 of the laser processing head 10A to move along the direction perpendicular to its optical axis. In addition, even if the moving part 63 moves along the Y direction, the mirror 3 and the emitting part 81a of the light source 81 are maintained in a state of facing each other in the Y direction. Furthermore, even if the mounting part 65 moves along the Z direction, the mirror 3 and the incident part 12 of the laser processing head 10A are maintained in a state of facing each other in the Z direction. Therefore, regardless of the position of the laser processing head 10A, the laser light L1 emitted from the emitting part 81a of the light source 81 can be reliably incident on the incident part 12 of the laser processing head 10A. Furthermore, a light source such as a high-power long-short pulse laser which is difficult to guide light by an optical fiber can be used. As described above, according to the laser processing device 1, the focusing part 14 can be smoothly moved in a direction perpendicular to its optical axis.

Furthermore, in the laser processing device 1, the mirror 3 is mounted on the moving portion 63 so as to enable at least one of angle adjustment and position adjustment. Thus, the laser light L1 emitted from the emission portion 81a of the light source 81 can be more reliably emitted to the injection portion 12 of the laser processing head 10A.

Furthermore, in the laser processing device 1, the support portion 7 rotates with the axis parallel to the Z direction as the center line. Thereby, the object 100 can be processed efficiently.

Furthermore, in the laser processing device 1, the light source unit 8 has an emission portion 82a for emitting the laser light L2, and the laser processing head 10B has an injection portion 12 for injecting the laser light L2, and a focusing portion 14 for focusing the laser light L2 and emitting it. Thus, the moving portion 64 to which the laser processing head 10B is mounted via the mounting portion 66 moves along the Y direction, thereby enabling the focusing portion 14 of the laser processing head 10B to move along a direction perpendicular to its optical axis. As described above, by providing a plurality of laser processing heads 10A and 10B, the object 100 can be efficiently processed.

Furthermore, in the laser processing device 1, the laser light L2 is guided to the laser processing head 10B by the optical fiber 2. Thus, when the wavelength of the laser light L2 is a wavelength that can be guided by the optical fiber 2, the laser light L2 emitted from the emission portion 82a of the light source unit 8 can be more accurately injected into the injection portion 12 of the laser processing head 10B. [Variation]

The present invention is not limited to the above-mentioned implementation form. For example, as shown in FIG6 , the incident part 12, the adjustment part 13 and the focusing part 14 may be arranged on a straight line A extending along the Z direction. In this way, the adjustment part 13 can be compactly constructed. In this case, the adjustment part 13 may or may not have a reflective spatial light modulator 34 and an imaging optical system 35. Furthermore, the adjustment part 13 may have an attenuator 31 and a beam expander 32. In this way, the adjustment part 13 having the attenuator 31 and the beam expander 32 can be compactly constructed. Furthermore, the arrangement order of the attenuator 31 and the beam expander 32 may be reversed.

Furthermore, the housing 11 only needs to be configured such that the housing 11 is mounted on the mounting portion 65 (or the mounting portion 66) in a state where at least one of the first wall portion 21, the second wall portion 22, the third wall portion 23, and the fifth wall portion 25 is disposed on the mounting portion 65 (or the mounting portion 66) side of the laser processing device 1. Furthermore, the focusing portion 14 only needs to be biased toward the fourth wall portion 24 side at least in the Y direction. Accordingly, when the housing 11 is moved along the Y direction, for example, even if there are other components on the fourth wall portion 24 side, the focusing portion 14 can be brought close to the other components. Furthermore, when the housing 11 is moved along the Z direction, for example, the focusing portion 14 can be brought close to the object 100.

Furthermore, the light-collecting portion 14 may be biased toward the first wall portion 21 side in the X direction. Thus, when the housing 11 is moved in a direction perpendicular to the optical axis of the light-collecting portion 14, for example, even if there are other components on the first wall portion 21 side, the light-collecting portion 14 may be brought closer to the other components. In this case, the incident portion 12 may be biased toward the first wall portion 21 side in the X direction. Thus, other components (such as the measuring portion 16 and the observing portion 17) may be arranged in the area on the second wall portion 22 side of the adjustment portion 13 in the housing 11, and the area can be effectively utilized.

Furthermore, not only the guiding of the laser light L1 from the emitting portion 81a of the light source 81 to the incident portion 12 of the laser processing head 10A, but also the guiding of the laser light L2 from the emitting portion 82a of the light source 82 to the incident portion 12 of the laser processing head 10B can be implemented by the mirror. FIG7 is a front view of a portion of the laser processing device 1 in which not only the laser light L1 but also the laser light L2 is guided by the mirror. The structure shown in FIG7 is specifically described below.

The light source 82 is mounted on the fixed portion 61 and is located on the side of the moving portion 64 (the side opposite to the moving portion 63) in the Y direction. The emission portion 82a of the light source 82 faces the side of the moving portion 64. The mirror (second mirror) 4 is mounted on the moving portion 64 and is opposite to the emission portion 82a of the light source 82 in the Y direction and is opposite to the incident portion 12 of the laser processing head 10B in the Z direction. The mirror 4 is mounted on the moving portion 64 so as to enable at least one of angle adjustment and position adjustment. The laser light L2 emitted from the emission portion 82a of the light source 82 is reflected by the mirror 4 and incident on the incident portion 12 of the laser processing head 10B. In addition, the light source 82 may be mounted on the device frame 1a.

In the above-mentioned structure, even if the moving part 64 moves along the Y direction, the mirror 4 and the emission part 82a of the light source 82 are maintained in a state of facing each other in the Y direction. Moreover, even if the mounting part 66 moves along the Z direction, the mirror 4 and the injection part 12 of the laser processing head 10B are maintained in a state of facing each other in the Z direction. Therefore, regardless of the position of the laser processing head 10B, the laser light L2 emitted from the emission part 82a of the light source 82 can be injected into the injection part 12 of the laser processing head 10B. Therefore, regardless of the position of the laser processing head 10B, the laser light L2 emitted from the emission part 82a of the light source 82 can be reliably injected into the injection part 12 of the laser processing head 10B. Moreover, a light source such as a high-power long and short pulse laser that is difficult to guide by an optical fiber can be used.

7, the mirror 4 may be mounted on the moving portion 64 so as to enable at least one of angle adjustment and position adjustment. This allows the laser light L2 emitted from the emission portion 82a of the light source 82 to be more reliably emitted into the injection portion 12 of the laser processing head 10B.

Furthermore, the light source unit 8 may include one light source. In this case, the light source unit 8 may be configured such that a part of the laser light output from one light source is emitted from the emission portion 81a and the remaining part of the laser light is emitted from the emission portion 82a.

Furthermore, the laser processing device 1 may include one set or three or more sets of the combination including the moving portion, the mounting portion mounted on the moving portion, the laser processing head mounted on the mounting portion, and the mirror mounted on the moving portion.

Furthermore, the laser processing head and the laser processing device of the present invention are not limited to those for forming a modified region inside the object 100, but may also be used for performing other laser processing.

Finally, an example of the operation of the laser processing device 1 is described. An example of the operation of the laser processing device 1 is as follows. A plurality of lines extending in the X direction and arranged in the Y direction are set on the object 100. In this state, the control unit 9 repeatedly performs, at least part of the time, a first scanning process of scanning the laser light L1 in the X direction for one line and a second scanning process of scanning the laser light L2 in the X direction for the other lines. In particular, the control unit 9 can sequentially perform the first scanning process from the line located at one end of the object 100 in the Y direction toward the line on the inner side of the Y direction, and simultaneously sequentially perform the second scanning process from the line located at the other end of the object 100 in the Y direction toward the line on the inner side of the Y direction. This can improve processing efficiency.

An example of the operation of the laser processing device 1 is as follows. In the laser processing device 1, the control unit 9 implements: in the first state where the laser processing heads 10A and 10B are arranged on a line, the focal point of the laser light L1 is located at the first position in the Z direction and the laser light L1 is scanned in the X direction for the line; and in the first state, the focal point of the laser light L2 is located at the second position in the Z direction (a position closer to the incident surface than the first position) and the laser light L2 is scanned in the X direction for the line. At this time, the control unit 9 implements the first scanning process and the second scanning process by making the focal point of the laser light L2 located at a position separated from the focal point of the laser light L1 by a predetermined distance in the direction opposite to the X direction. The predetermined distance is, for example, 300 μm. This can improve the processing efficiency and allow the cracks to fully develop from the modified area.

An example of the operation of the laser processing device 1 is as follows. The control unit 9 repeatedly performs, at least in part of the time, a first scanning process of scanning a line with laser light L1 in the X direction and a second scanning process of scanning the other lines with laser light L2 in the X direction, and performs a photographing process when only the second scanning process is performed, in which a region of the object 100 including the line where the processing is completed is photographed by a photographing unit that can move together with the laser processing head 10A. In the photographing process, light that can penetrate the object 100 (for example, light in the near-infrared region) is used. In this way, whether the laser processing is completed can be confirmed in a non-destructive manner by utilizing the time when the first scanning process is not performed.

An example of the operation of the laser processing device 1 is as follows. The laser processing device 1 performs a peeling process to peel off a portion of the object 100. The peeling process is, for example, to form a modified area along the virtual surface inside the object 100 by rotating the support 7 while irradiating the laser light L1 and L2 from the laser processing heads 10A and 10B, respectively, and controlling the horizontal movement of the focal points of the laser light L1 and L2. As a result, a portion of the object 100 can be peeled off with the modified area covering the virtual surface as a boundary.

An example of the operation of the laser processing device 1 is as follows. The laser processing device 1 performs trimming processing to remove unnecessary parts on the object 100. The trimming processing is, for example, to control the start and stop of irradiation of the laser beams L1 and L2 of the laser processing heads 10A and 10B based on the rotation information of the support portion 7 while rotating the support portion 7, in a state where the focal point is located along the periphery of the effective area of the object 100, thereby forming a modified area along the periphery of the effective area of the object 100. As a result, for example, the unnecessary parts can be removed with the modified area as the boundary by a jig or air.

An example of the operation of the laser processing device 1 is as follows. For an object 100 having a functional element layer on the surface side, laser light L1 is irradiated to the functional element layer from the inside of the object 100 along the line, and a weakened area is formed in the functional element layer along the line. From the inside of the object 100, laser light L2 having a pulse width shorter than the pulse width of the laser light L1 is irradiated to the inside of the object 100 along the line in a manner of following the laser light L1. By irradiating the laser light L2, the weakened area is utilized to reliably form a crack along the line that reaches the surface of the object 100.

1: Laser processing device 2: Optical fiber 3: Mirror (first mirror) 4: Mirror (second mirror) 7: Supporting part 8: Light source unit 10A, 10B: Laser processing head (first laser processing head, second laser processing head) 12: Injection part (first injection part, second injection part) 14: Focusing part (first focusing part, second focusing part) 63, 64: Moving part (first moving part, second moving part) 65, 66: Mounting part (first mounting part, second mounting part) 81a, 82a: Emission part (first emission part, second emission part)

[Figure 1] is a perspective view of a laser processing device of an implementation form. [Figure 2] is a front view of a portion of the laser processing device shown in Figure 1. [Figure 3] is a front view of a laser processing head of the laser processing device shown in Figure 1. [Figure 4] is a side view of the laser processing head shown in Figure 3. [Figure 5] is a configuration diagram of the optical system of the laser processing head shown in Figure 3. [Figure 6] is a configuration diagram of the optical system of the laser processing head of a modified example. [Figure 7] is a front view of a portion of the laser processing device of a modified example.

2: Optical fiber

2a: Connection end

3: Mirror (1st mirror)

6: Mobile mechanism

8: Light source unit

10A, 10B: Laser processing head (1st laser processing head, 2nd laser processing head)

11: Basket

12: Injection part (first injection part, second injection part)

14: Focusing part (first focusing part, second focusing part)

21: 1st wall

22: Second wall

23: The third wall

24: 4th wall

25: The 5th wall

26: Wall section 6

61:Fixed part

63,64: Moving part (1st moving part, 2nd moving part)

65,66: Installation part (1st installation part, 2nd installation part)

66a: Base plate

66b: Mounting plate

65a: Base plate

65b: Mounting plate

81: Light source

81a: Injection part (first injection part, second injection part)

L1, L2: Laser light

Claims (7)

A laser processing device comprises: a support portion that supports an object and moves along a first direction; a first moving portion that moves along a second direction perpendicular to the first direction; a first mounting portion that is mounted on the first moving portion and moves along a third direction perpendicular to the first direction and the second direction; a first laser processing head that is mounted on the first mounting portion and irradiates the object with a first laser light; a light source unit that outputs the first laser light; and a first mirror that is mounted on the first moving portion and reflects the first laser light, wherein the first laser processing head comprises: a first incident portion that allows the first laser light to be incident; a mirror that reflects the first laser light incident from the first incident portion; and a reflective spatial light modulator that modulates the first laser light reflected by the mirror. to be modulated; and a first focusing portion, which focuses and emits the first laser light modulated by the reflective spatial light modulator, the first mounting portion and the first laser processing head are arranged on one side of the first direction with respect to the first moving portion, the first incident portion and the mirror are arranged on a first straight line extending along the third direction, the reflective spatial light modulator and the first focusing portion are located on one side of the first direction with respect to the first straight line, and are arranged on a second straight line extending along the third direction, the light source unit has a first emitting portion for emitting the first laser light, the first mirror is mounted on the first moving portion so as to be opposite to the first emitting portion in the second direction and opposite to the first incident portion in the third direction. The laser processing device as described in claim 1, wherein the first mirror is mounted on the first moving part so as to enable at least one of angle adjustment and position adjustment. A laser processing device as described in claim 1 or 2, wherein the support portion rotates with an axis parallel to the third direction as the center line. The laser processing device as described in claim 1 or 2 further comprises: a second moving part, which moves along the second direction; a second mounting part, which is mounted on the second moving part and moves along the third direction; and a second laser processing head, which is mounted on the second mounting part and irradiates the second laser light to the object, the light source unit outputs the second laser light, the second laser processing head has: a second incident part for injecting the second laser light, and a second focusing part for focusing and emitting the second laser light, and the light source unit has a second emission part for emitting the second laser light. The laser processing device as described in claim 4 further comprises: a second mirror mounted on the second moving part and reflecting the second laser light, wherein the second mirror is mounted on the second moving part so as to be opposite to the second emitting part in the second direction and opposite to the second incident part in the third direction. The laser processing device as described in claim 5, wherein the second mirror is mounted on the second moving part so as to enable at least one of angle adjustment and position adjustment. The laser processing device as described in claim 4 further comprises: an optical fiber that guides the second laser light from the second emitting portion to the second incident portion.

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