TWI837204B - Laser processing equipment - Google Patents
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- TWI837204B TWI837204B TW108139170A TW108139170A TWI837204B TW I837204 B TWI837204 B TW I837204B TW 108139170 A TW108139170 A TW 108139170A TW 108139170 A TW108139170 A TW 108139170A TW I837204 B TWI837204 B TW I837204B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/047—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
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Abstract
雷射加工裝置,具備:支撐部,其支撐對象物,且沿著第1方向移動;第1移動部,其沿著與第1方向垂直的第2方向移動;第1安裝部,其安裝於第1移動部,且沿著與第1方向及第2方向垂直的第3方向移動;第1雷射加工頭,其安裝於第1安裝部,且對於對象物照射第1雷射光;光源單元,其輸出第1雷射光;以及第1鏡子,其安裝於第1移動部,且反射第1雷射光。第1雷射加工頭,具有第1射入部及第1聚光部。光源單元,具有第1射出部。第1鏡子,是在第1移動部安裝成,在第2方向與第1射出部相對向且在第3方向與第1射入部相對向。A laser processing device comprises: a support portion that supports an object and moves along a first direction; a first moving portion that moves along a second direction perpendicular to the first direction; a first mounting portion that is mounted on the first moving portion and moves along a third direction perpendicular to the first and second directions; a first laser processing head that is mounted on the first mounting portion and irradiates the object with a first laser light; a light source unit that outputs the first laser light; and a first mirror that is mounted on the first moving portion and reflects the first laser light. The first laser processing head has a first incident portion and a first focusing portion. The light source unit has a first emission portion. The first mirror is mounted on the first moving portion so as to be opposite to the first emission portion in the second direction and opposite to the first incident portion in the third direction.
Description
本發明,關於雷射加工裝置。The present invention relates to a laser processing device.
於專利文獻1,記載有雷射加工裝置,其具備:保持工件的保持機構、對保持機構所保持之工件照射雷射光的雷射照射機構。專利文獻1所記載的雷射加工裝置,是使具有聚光透鏡的雷射照射機構對基台固定,藉由保持機構來實施沿著與聚光透鏡之光軸垂直的方向之工件的移動。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本專利第5456510號公報[Patent Document 1] Japanese Patent No. 5456510
[發明所欲解決的課題][The problem that the invention is trying to solve]
如上述般的雷射加工裝置,在考慮到對各種加工的應用時,有著使聚光透鏡沿著與聚光透鏡之光軸垂直的方向來移動的構造為佳的情況。但是,專利文獻1所記載的雷射加工裝置,是使從雷射振盪器到聚光透鏡的雷射光之光路上的各構造配置在筐體內藉此構成雷射照射機構,故難以使聚光透鏡沿著與聚光透鏡之光軸垂直的方向來移動。In the case of a laser processing device such as the above, when considering the application to various processing, it is preferable to have a structure in which the focusing lens is moved in a direction perpendicular to the optical axis of the focusing lens. However, the laser processing device described in
本發明,其目的是提供雷射加工裝置,可使聚光部沿著與其光軸垂直的方向來順利地移動。 [用以解決課題的手段]The present invention aims to provide a laser processing device that can smoothly move the focusing part in a direction perpendicular to its optical axis. [Means for solving the problem]
本發明之一側面的雷射加工裝置,具備:支撐部,其支撐對象物,且沿著第1方向移動;第1移動部,其沿著與第1方向垂直的第2方向移動;第1安裝部,其安裝於第1移動部,且沿著與第1方向及第2方向垂直的第3方向移動;第1雷射加工頭,其安裝於第1安裝部,且對於對象物照射第1雷射光;光源單元,其輸出第1雷射光;以及第1鏡子,其安裝於第1移動部,且反射第1雷射光,第1雷射加工頭,具有:讓第1雷射光射入的第1射入部、以及使第1雷射光聚光並射出的第1聚光部,光源單元,具有讓第1雷射光射出的第1射出部,第1鏡子是在第1移動部安裝成,在第2方向與第1射出部相對向且在第3方向與第1射入部相對向。The laser processing device of one side of the present invention comprises: a support portion, which supports an object and moves along a first direction; a first moving portion, which moves along a second direction perpendicular to the first direction; a first mounting portion, which is mounted on the first moving portion and moves along a third direction perpendicular to the first direction and the second direction; a first laser processing head, which is mounted on the first mounting portion and irradiates a first laser light to the object; and a light source unit, which outputs a first 1 laser light; and a first mirror, which is mounted on the first movable part and reflects the first laser light, the first laser processing head having: a first input part for allowing the first laser light to enter, and a first focusing part for focusing the first laser light and emitting it, the light source unit having a first emitting part for allowing the first laser light to emit, and the first mirror is mounted on the first movable part so as to be opposite to the first emitting part in the second direction and opposite to the first input part in the third direction.
在該雷射加工裝置,透過第1安裝部來安裝了第1雷射加工頭的第1移動部是沿著第2方向移動,可使藉此第1雷射加工頭的第1聚光部沿著與其光軸垂直的方向來移動。此外,就算使第1移動部沿著第2方向來移動,亦可維持成在第2方向使第1鏡子與光源單元的第1射出部相對向的狀態。且,就算使第1安裝部沿著第3方向來移動,亦可維持成在第3方向使第1鏡子與第1雷射加工頭的第1射入部相對向的狀態。於是,無關第1雷射加工頭的位置,可將從光源單元的第1射出部所射出之第1雷射光,確實地射入至第1雷射加工頭的第1射入部。而且,可利用難以由光纖導光的高功率長短脈衝雷射等之光源。如以上所述,根據本雷射加工裝置,可使聚光部沿著與其光軸垂直的方向順利地移動。In the laser processing device, the first moving portion on which the first laser processing head is mounted via the first mounting portion is moved in the second direction, thereby allowing the first focusing portion of the first laser processing head to move in a direction perpendicular to its optical axis. In addition, even if the first moving portion is moved in the second direction, the first mirror and the first emission portion of the light source unit can be maintained in a state opposite to each other in the second direction. Furthermore, even if the first mounting portion is moved in the third direction, the first mirror and the first input portion of the first laser processing head can be maintained in a state opposite to each other in the third direction. Therefore, regardless of the position of the first laser processing head, the first laser light emitted from the first emission portion of the light source unit can be reliably injected into the first input portion of the first laser processing head. Furthermore, a light source such as a high-power long-short pulse laser which is difficult to guide light by an optical fiber can be used. As described above, according to the laser processing device, the focusing part can be smoothly moved in a direction perpendicular to its optical axis.
在本發明之一側面的雷射加工裝置,第1鏡子,在第1移動部安裝成使角度調整及位置調整的至少一個成為可能亦可。藉此,可將從光源單元的第1射出部所射出之第1雷射光,更確實地射入至第1雷射加工頭的第1射入部。In the laser processing device of one aspect of the present invention, the first mirror may be mounted on the first moving part so as to enable at least one of angle adjustment and position adjustment. Thus, the first laser light emitted from the first emission part of the light source unit can be more reliably injected into the first injection part of the first laser processing head.
在本發明之一側面的雷射加工裝置,支撐部,以平行於第3方向的軸線為中心線來旋轉亦可。藉此,可效率良好地加工對象物。In the laser processing device of one aspect of the present invention, the support portion may be rotated with an axis parallel to the third direction as the center line. Thereby, the object can be processed efficiently.
本發明之一側面的雷射加工裝置,進一步具備:第2移動部,其沿著第2方向來移動;第2安裝部,其安裝於第2移動部,且沿著第3方向來移動;以及第2雷射加工頭,其安裝於第2安裝部,且對於對象物照射第2雷射光,光源單元,輸出第2雷射光,第2雷射加工頭,具有:讓第2雷射光射入的第2射入部、以及將第2雷射光予以聚光並射出的第2聚光部,光源單元,具有讓第2雷射光射出的第2射出部亦可。藉此,透過第2安裝部來安裝了第2雷射加工頭的第2移動部是沿著第2方向移動,藉此可使第2雷射加工頭的第2聚光部沿著與其光軸垂直的方向來移動。如上述般,藉由設有複數個雷射加工頭,可效率良好地加工對象物。The laser processing device of one side of the present invention further comprises: a second moving part, which moves along the second direction; a second mounting part, which is mounted on the second moving part and moves along the third direction; and a second laser processing head, which is mounted on the second mounting part and irradiates the object with the second laser light, and a light source unit, which outputs the second laser light, wherein the second laser processing head has: a second incident part for injecting the second laser light, and a second focusing part for focusing and emitting the second laser light, and the light source unit may have a second emission part for emitting the second laser light. Thus, the second moving part on which the second laser processing head is mounted via the second mounting part moves along the second direction, thereby enabling the second focusing part of the second laser processing head to move along the direction perpendicular to its optical axis. As described above, by providing a plurality of laser processing heads, an object can be processed efficiently.
本發明之一側面的雷射加工裝置,進一步具備第2鏡子,其安裝於第2移動部,且反射第2雷射光,第2鏡子,是在第2移動部安裝成在第2方向與第2射出部相對向且在第3方向與第2射入部相對向亦可。藉此,就算使第2移動部沿著第2方向來移動,亦可維持成在第2方向使第2鏡子與光源單元的第2射出部相對向的狀態。且,就算使第2安裝部沿著第3方向來移動,亦可維持成在第3方向使第2鏡子與第2雷射加工頭的第2射入部相對向的狀態。於是,無關第2雷射加工頭的位置,可將從光源單元的第2射出部所射出之第2雷射光,確實地射入至第2雷射加工頭的第2射入部。而且,可利用難以由光纖導光的高功率長短脈衝雷射等之光源。The laser processing device of one side of the present invention further has a second mirror, which is mounted on the second moving part and reflects the second laser light. The second mirror can be mounted on the second moving part so as to be opposite to the second emitting part in the second direction and opposite to the second incident part in the third direction. Thereby, even if the second moving part is moved along the second direction, the state in which the second mirror and the second emitting part of the light source unit are opposite to each other in the second direction can be maintained. Furthermore, even if the second mounting part is moved along the third direction, the state in which the second mirror and the second incident part of the second laser processing head are opposite to each other in the third direction can be maintained. Therefore, regardless of the position of the second laser processing head, the second laser light emitted from the second emitting part of the light source unit can be reliably incident on the second incident part of the second laser processing head. Furthermore, light sources such as high-power long and short pulse lasers, which are difficult to guide with optical fibers, can be used.
在本發明之一側面的雷射加工裝置,第2鏡子,在第2移動部安裝成使角度調整及位置調整的至少一個成為可能亦可。藉此,可將從光源單元的第2射出部所射出之第2雷射光,更確實地射入至第2雷射加工頭的第2射入部。In the laser processing device of one aspect of the present invention, the second mirror may be mounted on the second moving part so as to enable at least one of angle adjustment and position adjustment. Thus, the second laser light emitted from the second emission part of the light source unit can be more reliably injected into the second injection part of the second laser processing head.
本發明之一側面的雷射加工裝置,進一步具備光纖,其將第2雷射光從第2射出部導光至第2射入部亦可。藉此,在第2雷射光的波長為可由光纖導光之波長的情況時,可將從光源單元的第2射出部所射出之第2雷射光,更確實地射入至第2雷射加工頭的第2射入部。 [發明的效果]The laser processing device of one aspect of the present invention further has an optical fiber, which can guide the second laser light from the second emission part to the second input part. Thereby, when the wavelength of the second laser light is a wavelength that can be guided by the optical fiber, the second laser light emitted from the second emission part of the light source unit can be more reliably injected into the second input part of the second laser processing head. [Effect of the invention]
根據本發明,可提供雷射加工裝置,可使聚光部沿著與其光軸垂直的方向來順利地移動。According to the present invention, a laser processing device can be provided, which can enable the focusing part to move smoothly along the direction perpendicular to its optical axis.
以下,針對本揭示的實施形態,參照圖式進行詳細說明。又,在各圖中對相同或相當的部分附上相同符號,並省略重複的說明。 [雷射加工裝置的構造]Below, the implementation form of the present disclosure is described in detail with reference to the drawings. In addition, the same symbols are attached to the same or equivalent parts in each figure, and repeated descriptions are omitted. [Structure of laser processing device]
如圖1所示般,雷射加工裝置1,具備:複數個移動機構5、6、支撐部7、一對雷射加工頭(第1雷射加工頭、第2雷射加工頭)10A、10B、光源單元8、控制部9。以下,將第1方向稱為X方向,將與第1方向垂直的第2方向稱為Y方向,將與第1方向及第2方向垂直的第3方向稱為Z方向。在本實施形態,X方向及Y方向為水平方向,Z方向為鉛直方向。As shown in FIG1 , the
移動機構5,具有:固定部51、移動部53、安裝部55。固定部51,安裝於裝置框架1a。移動部53,安裝於設在固定部51的軌道,可沿著Y方向移動。安裝部55,安裝於設在移動部53的軌道,可沿著X方向移動。The
移動機構6,具有:固定部61、一對移動部(第1移動部、第2移動部)63、64、一對安裝部(第1安裝部、第2安裝部)65、66。固定部61,安裝於裝置框架1a。一對移動部63、64的各個,安裝於設在固定部61的軌道,可各自獨立地沿著Y方向移動。安裝部65,安裝於設在移動部63的軌道,可沿著Z方向移動。安裝部66,安裝於設在移動部64的軌道,可沿著Z方向移動。也就是說,可對於裝置框架1a,使一對安裝部65、66的各個分別沿著Y方向及Z方向來移動。The
支撐部7,安裝於設在移動機構5之安裝部55的旋轉軸,可以平行於Z方向的軸線為中心線來旋轉。也就是說,支撐部7,可沿著X方向及Y方向的各個來移動,可以平行於Z方向的軸線為中心線來旋轉。支撐部7,支撐對象物100。對象物100,例如為晶圓。The
如圖1及圖2所示般,雷射加工頭10A,安裝在移動機構6的安裝部65。雷射加工頭10A,是在Z方向上與支撐部7對向的狀態下,對支撐部7所支撐的對象物100照射雷射光(第1雷射光)L1。雷射加工頭10B,安裝於移動機構6的安裝部66。雷射加工頭10B,是在Z方向上與支撐部7對向的狀態下,對支撐部7所支撐的對象物100照射雷射光(第2雷射光)L2。As shown in Fig. 1 and Fig. 2, the
光源單元8,具有一對光源81、82。光源81,安裝於移動機構6的固定部61。光源81,輸出雷射光L1。雷射光L1,從光源81的射出部(第1射出部)81a射出,藉由鏡子(第1鏡子)3導光至雷射加工頭10A。光源82,安裝於裝置框架1a。光源82,輸出雷射光L2。雷射光L2,從光源82的射出部(第2射出部)82a射出,藉由光纖2導光至雷射加工頭10B。The
針對光源81及鏡子3的構造,進行更具體的說明。光源81,安裝在固定部61,而在Y方向上位於移動部63的側方(與移動部64相反之側)。光源81的射出部81a,朝向移動部63側。鏡子3,安裝在移動部63,而在Y方向上與光源81的射出部81a相對向且在Z方向上與雷射加工頭10A的射入部12相對向。鏡子3,在移動部63安裝成使角度調整及位置調整的至少一個成為可能。從光源81的射出部81a所射出之雷射光L1,被鏡子3反射,而射入至雷射加工頭10A的射入部12。又,光源81,安裝於裝置框架1a亦可。The structures of the
在上述的構造,即使移動部63沿著Y方向移動,在Y方向亦維持著鏡子3與光源81之射出部81a相對向的狀態。且,即使安裝部65沿著Z方向移動,在Z方向亦維持著鏡子3與雷射加工頭10A之射入部12相對向的狀態。於是,無關雷射加工頭10A的位置,可將從光源81的射出部81a所射出之雷射光L1,射入至雷射加工頭10A的射入部12。In the above-mentioned structure, even if the moving
控制部9,控制雷射加工裝置1的各部(複數個移動機構5、6、一對雷射加工頭10A、10B、及光源單元8等)。控制部9,是構成為含有處理器、記憶體、儲存部及通訊元件等的電腦裝置。在控制部9,讀取至記憶體等的軟體(程式),被處理器所執行,記憶體及儲存部之資料的讀取及寫入,以及通訊元件的通訊,是由處理器所控制。藉此,控制部9,實現各種功能。The
針對如上述般構成的雷射加工裝置1所致之加工的一例進行說明。該加工的一例,是為了將晶圓亦即對象物100切斷成複數個晶片,沿著設定成格子狀之複數條線的各個,在對象物100的內部形成改質區域的例子。An example of processing by the
首先,移動機構5沿著X方向及Y方向的各個使支撐部7移動,而使支撐著對象物100的支撐部7在Z方向上與一對雷射加工頭10A、10B相對向。接著,移動機構5以平行於Z方向的軸線為中心線使支撐部7旋轉,而使對象物100之往一方向延伸的複數條線沿著X方向。First, the moving
接著,移動機構6沿著Y方向使雷射加工頭10A移動,而使雷射光L1的聚光點位在往一方向延伸的一條線上。另一方面,移動機構6沿著Y方向使雷射加工頭10B移動,而使雷射光L2的聚光點位在往一方向延伸的其他線上。接著,移動機構6沿著Z方向使雷射加工頭10A移動,而使雷射光L1的聚光點位在對象物100的內部。另一方面,移動機構6沿著Z方向使雷射加工頭10B移動,而使雷射光L2的聚光點位在對象物100的內部。Next, the moving
接著,光源81輸出雷射光L1而使雷射加工頭10A對於對象物100照射雷射光L1,且光源82輸出雷射光L2而使雷射加工頭10B對於對象物100照射雷射光L2。與此同時,移動機構5沿著X方向使支撐部7移動,而使雷射光L1的聚光點沿著往一方向延伸的一條線相對地移動且使雷射光L2的聚光點沿著往一方向延伸的其他線相對地移動。如此一來,雷射加工裝置1,會沿著對象物100之往一方向延伸的複數條線的各個,在對象物100的內部形成改質區域。Then, the
接著,移動機構5以平行於Z方向的軸線為中心線使支撐部7旋轉,而使對象物100之往與一方向正交之另一方向延伸的複數條線沿著X方向。Next, the moving
接著,移動機構6沿著Y方向使雷射加工頭10A移動,而使雷射光L1的聚光點位在往另一方向延伸的一條線上。另一方面,移動機構6沿著Y方向使雷射加工頭10B移動,而使雷射光L2的聚光點位在往另一方向延伸的其他線上。接著,移動機構6沿著Z方向使雷射加工頭10A移動,而使雷射光L1的聚光點位在對象物100的內部。另一方面,移動機構6沿著Z方向使雷射加工頭10B移動,而使雷射光L2的聚光點位在對象物100的內部。Next, the moving
接著,光源81輸出雷射光L1而使雷射加工頭10A對於對象物100照射雷射光L1,且光源82輸出雷射光L2而使雷射加工頭10B對於對象物100照射雷射光L2。與此同時,移動機構5沿著X方向使支撐部7移動,而使雷射光L1的聚光點沿著往另一方向延伸的一條線相對地移動且使雷射光L2的聚光點沿著往另一方向延伸的其他線相對地移動。如此一來,雷射加工裝置1,會沿著對象物100之往與一方向正交之另一方向延伸的複數條線的各個,在對象物100的內部形成改質區域。Then, the
又,在上述之加工的一例,光源81例如是藉由脈衝振盪方式,來對於對象物100輸出具有穿透性的雷射光L1,光源82,例如是藉由脈衝振盪方式,來對於對象物100輸出具有穿透性的雷射光L2。使這種雷射光在對象物100的內部聚光時,在雷射光之聚光點所對應的部分會特別吸收到雷射光,而在對象物100的內部形成改質區域。改質區域,是指密度、折射率、機械性強度、其他的物理特性與周圍的非改質區域不同的區域。作為改質區域,例如有,溶融處理區域、裂紋區域、絕緣破壞區域、折射率變化區域等。Furthermore, in one example of the above-mentioned processing, the
使藉由脈衝振盪方式來輸出的雷射光照射至對象物100,並沿著設定在對象物100的線使雷射光的聚光點相對地移動的話,複數個改質點會沿著線並排成一列地形成。一個改質點,是藉由一脈衝之雷射光的照射而形成。一列的改質區域,是並排成一列之複數個改質點的集合。相鄰的改質點,是因雷射光的聚光點對於對象物100的相對移動速度及雷射光的重複頻率,而有彼此相連的情況,也有彼此分離的情況。
[雷射加工頭的構造]When the laser light output by pulse oscillation is irradiated to the
如圖3及圖4所示般,雷射加工頭10A,具備:筐體11、射入部(第1射入部)12、調整部13、聚光部(第1聚光部)14。As shown in FIG. 3 and FIG. 4 , the
筐體11,具有:第1壁部21及第2壁部22、第3壁部23及第4壁部24、還有第5壁部25及第6壁部26。第1壁部21及第2壁部22,在X方向互相對向。第3壁部23及第4壁部24,在Y方向互相對向。第5壁部25及第6壁部26,在Z方向互相對向。The
第3壁部23與第4壁部24的距離,比第1壁部21與第2壁部22的距離還小。第1壁部21與第2壁部22的距離,比第5壁部25與第6壁部26的距離還小。又,第1壁部21與第2壁部22的距離,跟第5壁部25與第6壁部26的距離相等亦可,或是,比第5壁部25與第6壁部26的距離還大亦可。The distance between the
在雷射加工頭10A,第1壁部21,位在移動機構6的固定部61側,第2壁部22,位在與固定部61相反之側。第3壁部23,位在移動機構6的安裝部65側,第4壁部24,位在與安裝部65相反之側亦即雷射加工頭10B側(參照圖2)。第5壁部25,位在與支撐部7相反之側,第6壁部26,位在支撐部7側。In the
筐體11,構成為:在使第3壁部23配置於移動機構6之安裝部65側的狀態下使筐體11安裝於安裝部65。具體來說是如下。安裝部65,具有基座板65a、安裝板65b。基座板65a,安裝於設在移動部63的軌道(參照圖2)。安裝板65b,在基座板65a豎立設置於雷射加工頭10B側的端部(參照圖2)。筐體11,在第3壁部23接觸於安裝板65b的狀態下,透過台座27以螺栓28螺合於安裝板65b,藉此安裝於安裝部65。台座27,分別設在第1壁部21及第2壁部22。筐體11,可對安裝部65裝卸。The
射入部12,安裝於第5壁部25。射入部12,將被鏡子3反射的雷射光L1射入至筐體11內。射入部12,在X方向上偏靠第2壁部22側(一方的壁部側),在Y方向上偏靠第4壁部24側。也就是說,X方向之射入部12與第2壁部22的距離,比X方向之射入部12與第1壁部21的距離還小,Y方向之射入部12與第4壁部24的距離,比X方向之射入部12與第3壁部23的距離還小。The
調整部13,配置在筐體11內。調整部13,調整從射入部12射入的雷射光L1。調整部13所具有的各構件,安裝於設在筐體11內的光學基座29。光學基座29,是以將筐體11內的區域分隔成第3壁部23側的區域與第4壁部24側的區域之方式,來安裝於筐體11。光學基座29,與筐體11成為一體。調整部13所具有的各構件,在第4壁部24側安裝於光學基座29。關於調整部13所具有的各構件之詳細暫待後述。The
聚光部14,配置在第6壁部26。具體來說,聚光部14,是在插通於形成在第6壁部26的孔26a的狀態下,配置於第6壁部26。聚光部14,是將被調整部13調整過的雷射光L1予以聚光並射出至筐體11外。聚光部14,在X方向上偏靠第2壁部22側(一方的壁部側),在Y方向上偏靠第4壁部24側。也就是說,X方向之聚光部14與第2壁部22的距離,比X方向之聚光部14與第1壁部21的距離還小,Y方向之聚光部14與第4壁部24的距離,比X方向之聚光部14與第3壁部23的距離還小。The light-collecting
如圖5所示般,調整部13,具有:衰減器31、擴束器32、鏡子33。射入部12,還有調整部13的衰減器31、擴束器32及鏡子33,配置在沿著Z方向延伸的直線(第1直線)A1上。衰減器31及擴束器32,在直線A1上,配置在射入部12與鏡子33之間。衰減器31,調整從射入部12射入之雷射光L1的輸出。擴束器32,將以衰減器31調整過輸出的雷射光L1之徑予以擴大。鏡子33,將以擴束器32擴大過徑的雷射光L1予以反射。As shown in FIG5 , the
調整部13,進一步具有:反射型空間光調變器34、成像光學系統35。調整部13的反射型空間光調變器34及成像光學系統35,還有聚光部14,是配置在沿著Z方向延伸的直線(第2直線)A2上。反射型空間光調變器34,是將以鏡子33反射的雷射光L1予以調變。反射型空間光調變器34,例如為反射型液晶(LCOS:Liquid Crystal on Silicon)的空間光調變器(SLM:Spatial Light Modulator)。成像光學系統35,是構成使反射型空間光調變器34的反射面34a與聚光部14的入瞳面14a成為成像關係的兩側遠心光學系統。成像光學系統35,是由三個以上的透鏡所構成。The
直線A1及直線A2,位在與Y方向垂直的平面上。直線A1,對於直線A2位在第2壁部22側(一方的壁部側)。在雷射加工頭10A,雷射光L1,是從射入部12射入至筐體11內而在直線A1上進行,依序以鏡子33及反射型空間光調變器34反射之後,在直線A2上進行而從聚光部14射出至筐體11外。又,衰減器31及擴束器32的配列順序顛倒亦可。且,衰減器31,配置在鏡子33與反射型空間光調變器34之間亦可。且,調整部13,具有其他的光學零件(例如在配置在擴束器32之前的轉向鏡等)亦可。Straight line A1 and straight line A2 are located on a plane perpendicular to the Y direction. Straight line A1 is located on the
雷射加工頭10A,進一步具備:二向分色鏡15、測定部16、觀察部17、驅動部18、電路部19。The
二向分色鏡15,在直線A2上配置於成像光學系統35與聚光部14之間。也就是說,二向分色鏡15,在筐體11內配置於調整部13與聚光部14之間。二向分色鏡15,在第4壁部24側安裝於光學基座29。二向分色鏡15,供雷射光L1穿透。二向分色鏡15,就抑制散光的觀點來看,例如為方體型,或是配置成具有扭曲關係的兩片之板型為佳。The
測定部16,在筐體11內,對於調整部13配置在第1壁部21側(與一方的壁部側相反之側)。測定部16,在第4壁部24側安裝於光學基座29。測定部16,輸出用來測定對象物100之表面(例如雷射光L1射入之側的表面)與聚光部14之距離的測定光L10,透過聚光部14,檢測出在對象物100的表面反射的測定光L10。也就是說,從測定部16輸出的測定光L10,透過聚光部14照射至對象物100的表面,在對象物100的表面反射的測定光L10,透過聚光部14而被測定部16檢測到。The measuring
更具體來說,從測定部16輸出的測定光L10,是被在第4壁部24側安裝於光學基座29的分束鏡20及二向分色鏡15依序反射,而從聚光部14射出至筐體11外。在對象物100的表面反射的測定光L10,是從聚光部14射入至筐體11內而被二向分色鏡15及分束鏡20依序反射,並射入至測定部16,而被測定部16檢測到。More specifically, the measurement light L10 output from the
觀察部17,在筐體11內,對於調整部13配置在第1壁部21側(與一方的壁部側相反之側)。觀察部17,在第4壁部24側安裝於光學基座29。觀察部17,輸出用來觀察對象物100之表面(例如雷射光L1射入之側的表面)的觀察光L20,透過聚光部14,檢測出在對象物100的表面反射的觀察光L20。也就是說,從觀察部17輸出的觀察光L20,透過聚光部14照射至對象物100的表面,在對象物100的表面反射的觀察光L20,透過聚光部14而被觀察部17檢測到。The
更具體來說,從觀察部17輸出的觀察光L20,穿過分束鏡20而被二向分色鏡15反射,而從聚光部14射出至筐體11外。在對象物100的表面反射的觀察光L20,是從聚光部14射入至筐體11內而被二向分色鏡15反射,並穿過分束鏡20射入至觀察部17,而被觀察部17檢測到。又,雷射光L1、測定光L10及觀察光L20之各自的波長互相不同(至少各自的中心波長互相錯開)。More specifically, the observation light L20 output from the
驅動部18,在第4壁部24側安裝於光學基座29。驅動部18,例如藉由壓電元件的驅動力,使配置在第6壁部26的聚光部14沿著Z方向移動。The driving
電路部19,在筐體11內,對於光學基座29配置在第3壁部23側。也就是說,電路部19,在筐體11內,對於調整部13、測定部16及觀察部17配置在第3壁部23側。電路部19,例如為複數片電路基板。電路部19,處理從測定部16輸出的訊號、以及輸入至反射型空間光調變器34的訊號。電路部19,基於從測定部16輸出的訊號來控制驅動部18。作為一例,電路部19,基於從測定部16輸出的訊號來控制驅動部18,使對象物100之表面與聚光部14的距離維持成一定(亦即,使對象物100之表面與雷射光L1之聚光點的距離維持成一定)。又,於筐體11,設有連接器(圖示省略),其連接有用來將電路部19電性連接於控制部9(參照圖1)等的配線。The
雷射加工頭10B,與雷射加工頭10A同樣地,具備:筐體11、射入部(第2射入部)12、調整部13、聚光部(第2聚光部)14、二向分色鏡15、測定部16、觀察部17、驅動部18、電路部19。但是,雷射加工頭10B的各構件,如圖2所示般,關於通過一對安裝部65、66間的中點且與Y方向垂直的虛擬平面,是配置成與雷射加工頭10A之各構件具有面對稱的關係。The
例如,雷射加工頭10A的筐體(第1筐體)11,安裝於安裝部65,而使第4壁部24對於第3壁部23位在雷射加工頭10B側且使第6壁部26對於第5壁部25位在支撐部7側。相對地,雷射加工頭10B的筐體(第2筐體)11,安裝於安裝部66,而使第4壁部24對於第3壁部23位在雷射加工頭10A側且使第6壁部26對於第5壁部25位在支撐部7側。For example, the housing (first housing) 11 of the
雷射加工頭10B的筐體11,是在第3壁部23配置於安裝部66側的狀態下使筐體11安裝於安裝部66而構成。具體來說是如下。安裝部66,具有基座板66a、安裝板66b。基座板66a,安裝於設在移動部63的軌道。安裝板66b,在基座板66a豎立設置於雷射加工頭10A側的端部。雷射加工頭10B的筐體11,是在第3壁部23接觸於安裝板66b的狀態下,安裝於安裝部66。雷射加工頭10B的筐體11,可對安裝部66裝卸。The
又,在雷射加工頭10B,射入部12,構成為可供光纖2的連接端部2a連接。於光纖2的連接端部2a,設有將從纖線的射出端射出的雷射光L2予以準直的準直透鏡,並未設有抑制回射光的隔離器。該隔離器,是設在比連接端部2a還靠光源82側的纖線之途中。藉此,來謀求連接端部2a的小型化,甚至射入部12的小型化。又,在光纖2的連接端部2a設有隔離器亦可。
[作用及效果]Furthermore, in the
在雷射加工裝置1,透過安裝部65來安裝了雷射加工頭10A的移動部63是沿著Y方向來移動,藉此可使雷射加工頭10A的聚光部14沿著與其光軸垂直的方向來移動。此外,即使移動部63沿著Y方向移動,在Y方向亦維持著鏡子3與光源81之射出部81a相對向的狀態。且,即使安裝部65沿著Z方向移動,在Z方向上亦維持著鏡子3與雷射加工頭10A之射入部12相對向的狀態。於是,無關雷射加工頭10A的位置,可將從光源81的射出部81a所射出之雷射光L1,確實地射入至雷射加工頭10A的射入部12。而且,可利用難以由光纖導光的高功率長短脈衝雷射等之光源。如以上所述,根據雷射加工裝置1,可使聚光部14沿著與其光軸垂直的方向順利地移動。In the
且,在雷射加工裝置1,鏡子3,在移動部63安裝成使角度調整及位置調整的至少一個成為可能。藉此,可將從光源81的射出部81a所射出之雷射光L1,更確實地射入至雷射加工頭10A的射入部12。Furthermore, in the
且,在雷射加工裝置1,支撐部7以平行於Z方向的軸線為中心線來旋轉。藉此,可效率良好地加工對象物100。Furthermore, in the
且,在雷射加工裝置1,光源單元8,具有讓雷射光L2射出的射出部82a,雷射加工頭10B,具有讓雷射光L2射入的射入部12、以及將雷射光L2予以聚光並射出的聚光部14。藉此,透過安裝部66來安裝了雷射加工頭10B的移動部64是沿著Y方向來移動,藉此可使雷射加工頭10B的聚光部14沿著與其光軸垂直的方向來移動。如上述般,藉由設有複數個雷射加工頭10A、10B,可效率良好地加工對象物100。Furthermore, in the
且,在雷射加工裝置1,是藉由光纖2來將雷射光L2導光至雷射加工頭10B。藉此,在雷射光L2的波長為可由光纖2導光之波長的情況時,可將從光源單元8的射出部82a所射出之雷射光L2,更確實地射入至雷射加工頭10B的射入部12。
[變形例]Furthermore, in the
本發明,並不限定於上述的實施形態。例如圖6所示般,射入部12、調整部13及聚光部14,配置在沿著Z方向延伸的直線A上亦可。藉此,可緊湊地構成調整部13。該情況時,調整部13,有沒有反射型空間光調變器34及成像光學系統35皆可。且,調整部13,具有衰減器31及擴束器32亦可。藉此,可緊湊地構成具有衰減器31及擴束器32的調整部13。又,衰減器31及擴束器32的配列順序顛倒亦可。The present invention is not limited to the above-mentioned implementation form. For example, as shown in FIG6 , the
且,筐體11,只要構成為:在第1壁部21、第2壁部22、第3壁部23及第5壁部25之至少一個配置在雷射加工裝置1之安裝部65(或安裝部66)側的狀態下,使筐體11安裝於安裝部65(或安裝部66)即可。且,聚光部14,至少在Y方向上偏靠第4壁部24側即可。根據該等,在使筐體11沿著Y方向移動的情況,例如,即使在第4壁部24側存在其他的構件,亦可使聚光部14靠近該其他的構件。且,在使筐體11沿著Z方向移動的情況,例如,可使聚光部14靠近對象物100。Furthermore, the
且,聚光部14,在X方向上偏靠第1壁部21側亦可。藉此,在沿著與聚光部14的光軸垂直的方向來使筐體11移動的情況,例如,即使在第1壁部21側存在有其他的構件,亦可使聚光部14靠近該其他的構件。該情況時,射入部12,在X方向上偏靠第1壁部21側亦可。藉此,在筐體11內之區域之中對於調整部13在第2壁部22側的區域配置其他構件(例如測定部16及觀察部17)等,可有效利用該區域。Furthermore, the light-collecting
且,不只是從光源81之射出部81a往雷射加工頭10A之射入部12的雷射光L1之導光,就連從光源82之射出部82a往雷射加工頭10B之射入部12的雷射光L2之導光亦可藉由鏡子來實施。圖7,是不只有雷射光L1,就連雷射光L2亦被鏡子所導光之雷射加工裝置1之一部分的前視圖。以下,針對圖7所示之構造,進行具體的說明。Furthermore, not only the guiding of the laser light L1 from the emitting
光源82,安裝在固定部61,而在Y方向上位於移動部64的側方(與移動部63相反之側)。光源82的射出部82a,朝向移動部64側。鏡子(第2鏡子)4,安裝在移動部64,而在Y方向上與光源82的射出部82a相對向且在Z方向上與雷射加工頭10B的射入部12相對向。鏡子4,在移動部64安裝成使角度調整及位置調整的至少一個成為可能。從光源82的射出部82a所射出之雷射光L2,被鏡子4反射,而射入至雷射加工頭10B的射入部12。又,光源82,安裝於裝置框架1a亦可。The
在上述的構造,即使移動部64沿著Y方向移動,在Y方向亦維持著鏡子4與光源82之射出部82a相對向的狀態。且,即使安裝部66沿著Z方向移動,在Z方向亦維持著鏡子4與雷射加工頭10B之射入部12相對向的狀態。於是,無關雷射加工頭10B的位置,可將從光源82的射出部82a所射出之雷射光L2,射入至雷射加工頭10B的射入部12。於是,無關雷射加工頭10B的位置,可將從光源82的射出部82a所射出之雷射光L2,確實地射入至雷射加工頭10B的射入部12。而且,可利用難以由光纖導光的高功率長短脈衝雷射等之光源。In the above-mentioned structure, even if the moving
且,在圖7所示之構造,鏡子4在移動部64安裝成使角度調整及位置調整的至少一個成為可能亦可。藉此,可將從光源82的射出部82a所射出之雷射光L2,更確實地射入至雷射加工頭10B的射入部12。7, the
且,光源單元8,是具有一個光源者亦可。該情況時,光源單元8亦可構成為:將從一個光源輸出之雷射光的一部分從射出部81a射出且將該雷射光的剩餘部分從射出部82a射出。Furthermore, the
且,雷射加工裝置1,關於包含移動部、安裝於移動部的安裝部、安裝於安裝部的雷射加工頭、以及安裝於移動部的鏡子的組合,是具備一組亦可,具備三組以上亦可。Furthermore, the
且,本發明的雷射加工頭及雷射加工裝置,並不限定於在對象物100的內部形成改質區域者,為實施其他雷射加工者亦可。Furthermore, the laser processing head and the laser processing device of the present invention are not limited to those for forming a modified region inside the
最後,針對雷射加工裝置1的動作之例子進行說明。雷射加工裝置1之動作的一例,是如下所述。於對象物100,設定有往X方向延伸且在Y方向配列的複數條線。在這種狀態下,控制部9,是在至少一部分的時間重複實行:對於一條線使雷射光L1於X方向掃描的第1掃描處理、對於其他線使雷射光L2於X方向掃描的第2掃描處理。特別是,控制部9,可從位在對象物100之Y方向之一方之端部的線朝向Y方向之內側的線依序實行第1掃描處理,並同時從位在對象物100之Y方向之另一端部的線朝向Y方向之內側的線依序實行第2掃描處理。藉此,可謀求處理效率的提升。Finally, an example of the operation of the
雷射加工裝置1之動作的一例,是如下所述。雷射加工裝置1中,控制部9實行:在雷射加工頭10A、10B配列於一條線上的第1狀態下,使雷射光L1的聚光點位於Z方向的第1位置並使雷射光L1對於該一條線往X方向掃描的第1掃描處理;以及在第1狀態下,使雷射光L2的聚光點位於Z方向的第2位置(比第1位置還靠射入面側的位置)並使雷射光L2對於該一條線往X方向掃描的第2掃描處理。此時,控制部9,是使雷射光L2的聚光點位在比雷射光L1的聚光點還往與X方向相反之方向分開既定距離以上的位置,來實行第1掃描處理及第2掃描處理。既定距離,例如為300μm。藉此,可提升處理效率,並使龜裂充分地從改質區域進展。An example of the operation of the
雷射加工裝置1之動作的一例,是如下所述。控制部9,是在至少一部分的時間重複實行:對於一條線使雷射光L1於X方向掃描的第1掃描處理、對於其他線使雷射光L2於X方向掃描的第2掃描處理,並且,在只有實行第2掃描處理時,實行拍攝處理,其將包含加工結束之線的對象物100之區域,以可與雷射加工頭10A一起移動的拍攝單元來拍攝。在拍攝處理中,使用有穿透對象物100的光(例如近紅外線區域的光)。藉此,可利用沒有進行第1掃描處理的時間,來非破壞地確認雷射加工是否完成。An example of the operation of the
雷射加工裝置1之動作的一例,是如下所述。雷射加工裝置1,在對象物100實施將一部分予以剝離的剝離加工。剝離加工,例如是一邊使支撐部7旋轉,一邊從雷射加工頭10A、10B分別照射雷射光L1、L2,並控制該雷射光L1、L2之聚光點各自之水平方向的移動,藉此在對象物100的內部沿著虛擬面形成改質區域。其結果,可用遍及虛擬面的該改質區域為邊界,來剝離對象物100的一部分。An example of the operation of the
雷射加工裝置1之動作的一例,是如下所述。雷射加工裝置1,是在對象物100實施將不要部分予以除去的修整加工。修整加工,例如是一邊使支撐部7旋轉,一邊在聚光點位於沿著對象物100之有效區域之周緣的位置的狀態下,基於支撐部7的旋轉資訊來控制雷射加工頭10A、10B之雷射光L1、L2之照射的開始及停止,藉此沿著對象物100之有效區域的周緣來形成改質區域。其結果,例如可藉由治具或空氣,以該改質區域為邊界將不要部分予以除去。An example of the operation of the
雷射加工裝置1之動作的一例,是如下所述。對於在表面側具有功能元件層的對象物100,是從對象物100的裏面沿著線來將雷射光L1照射至功能元件層,並沿著線來將弱化區域形成在功能元件層。從對象物100的裏面,沿著線,以對於雷射光L1追隨的方式,將比雷射光L1之脈衝寬度還短之脈衝寬度的雷射光L2照射至對象物100的內部。藉由雷射光L2的照射,利用該弱化區域,而沿著線確實地形成到達對象物100之表面的龜裂。An example of the operation of the
1:雷射加工裝置
2:光纖
3:鏡子(第1鏡子)
4:鏡子(第2鏡子)
7:支撐部
8:光源單元
10A,10B:雷射加工頭(第1雷射加工頭,第2雷射加工頭)
12:射入部(第1射入部,第2射入部)
14:聚光部(第1聚光部,第2聚光部)
63,64:移動部(第1移動部,第2移動部)
65,66:安裝部(第1安裝部,第2安裝部)
81a,82a:射出部(第1射出部,第2射出部)1: Laser processing device
2: Optical fiber
3: Mirror (first mirror)
4: Mirror (second mirror)
7: Supporting part
8:
[圖1],是實施形態之雷射加工裝置的立體圖。 [圖2],是圖1所示之雷射加工裝置之一部分的前視圖。 [圖3],是圖1所示之雷射加工裝置之雷射加工頭的前視圖。 [圖4],是圖3所示之雷射加工頭的側視圖。 [圖5],是圖3所示之雷射加工頭之光學系統的構成圖。 [圖6],是變形例之雷射加工頭之光學系統的構成圖。 [圖7],是變形例之雷射加工裝置之一部分的前視圖。[Figure 1] is a perspective view of a laser processing device of an implementation form. [Figure 2] is a front view of a portion of the laser processing device shown in Figure 1. [Figure 3] is a front view of a laser processing head of the laser processing device shown in Figure 1. [Figure 4] is a side view of the laser processing head shown in Figure 3. [Figure 5] is a configuration diagram of the optical system of the laser processing head shown in Figure 3. [Figure 6] is a configuration diagram of the optical system of the laser processing head of a modified example. [Figure 7] is a front view of a portion of the laser processing device of a modified example.
2:光纖 2: Optical fiber
2a:連接端部 2a: Connection end
3:鏡子(第1鏡子) 3: Mirror (1st mirror)
6:移動機構 6: Mobile mechanism
8:光源單元 8: Light source unit
10A,10B:雷射加工頭(第1雷射加工頭,第2雷射加工頭) 10A, 10B: Laser processing head (1st laser processing head, 2nd laser processing head)
11:筐體 11: Basket
12:射入部(第1射入部,第2射入部) 12: Injection part (first injection part, second injection part)
14:聚光部(第1聚光部,第2聚光部) 14: Focusing part (first focusing part, second focusing part)
21:第1壁部 21: 1st wall
22:第2壁部 22: Second wall
23:第3壁部 23: The third wall
24:第4壁部 24: 4th wall
25:第5壁部 25: The 5th wall
26:第6壁部
26:
61:固定部 61:Fixed part
63,64:移動部(第1移動部,第2移動部) 63,64: Moving part (1st moving part, 2nd moving part)
65,66:安裝部(第1安裝部,第2安裝部) 65,66: Installation part (1st installation part, 2nd installation part)
66a:基座板 66a: Base plate
66b:安裝板 66b: Mounting plate
65a:基座板 65a: Base plate
65b:安裝板 65b: Mounting plate
81:光源 81: Light source
81a:射出部(第1射出部,第2射出部) 81a: Injection part (first injection part, second injection part)
L1,L2:雷射光 L1, L2: Laser light
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2018-203672 | 2018-10-30 | ||
JP2018203672A JP7219589B2 (en) | 2018-10-30 | 2018-10-30 | Laser processing equipment |
Publications (2)
Publication Number | Publication Date |
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TW202027892A TW202027892A (en) | 2020-08-01 |
TWI837204B true TWI837204B (en) | 2024-04-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW108139170A TWI837204B (en) | 2018-10-30 | 2019-10-30 | Laser processing equipment |
Country Status (7)
Country | Link |
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US (1) | US20220009032A1 (en) |
JP (1) | JP7219589B2 (en) |
KR (1) | KR20210080506A (en) |
CN (1) | CN112955272A (en) |
DE (1) | DE112019005440T5 (en) |
TW (1) | TWI837204B (en) |
WO (1) | WO2020090915A1 (en) |
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CN108526732A (en) * | 2018-06-14 | 2018-09-14 | 青岛理工大学 | Device and method for synchronously processing light guide plate through double-output laser half-process |
-
2018
- 2018-10-30 JP JP2018203672A patent/JP7219589B2/en active Active
-
2019
- 2019-10-30 DE DE112019005440.6T patent/DE112019005440T5/en active Pending
- 2019-10-30 KR KR1020217015644A patent/KR20210080506A/en not_active Application Discontinuation
- 2019-10-30 CN CN201980071402.1A patent/CN112955272A/en active Pending
- 2019-10-30 WO PCT/JP2019/042629 patent/WO2020090915A1/en active Application Filing
- 2019-10-30 US US17/288,601 patent/US20220009032A1/en not_active Abandoned
- 2019-10-30 TW TW108139170A patent/TWI837204B/en active
Patent Citations (5)
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JP2004111946A (en) * | 2002-08-30 | 2004-04-08 | Tokyo Seimitsu Co Ltd | Laser dicing equipment and dicing method |
KR20060091843A (en) * | 2005-02-16 | 2006-08-22 | 토파즈엘시디 주식회사 | Manufacturing method for light guide panel using co2 laser |
JP2011173129A (en) * | 2010-02-23 | 2011-09-08 | Disco Corp | Laser machining device |
JP2015047621A (en) * | 2013-09-02 | 2015-03-16 | 三菱重工業株式会社 | Composite processing device and composite processing method |
CN107971629A (en) * | 2017-11-24 | 2018-05-01 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | Laser working light path structure |
Also Published As
Publication number | Publication date |
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JP2020069487A (en) | 2020-05-07 |
WO2020090915A1 (en) | 2020-05-07 |
DE112019005440T5 (en) | 2021-07-22 |
CN112955272A (en) | 2021-06-11 |
TW202027892A (en) | 2020-08-01 |
US20220009032A1 (en) | 2022-01-13 |
JP7219589B2 (en) | 2023-02-08 |
KR20210080506A (en) | 2021-06-30 |
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