JPH01266983A - Piercing machine for printed board - Google Patents

Abstract

PURPOSE:To form a small diameter hole on a printed board correctly and with high efficiency by alternately using the laser lights of a short wavelength and long wavelength on a movable table in XY direction in case of piercing a small diameter hole on the printed board consisting of a copper foil and resin layer. CONSTITUTION:The printed board 1 alternately having plural copper foils 1a, 1c, 1e, 1g and resin layers 1b, 1d, 1f is placed on the table 7 movable in XY direction and the work head 23 for the laser beam 17 emitted from the short wavelength laser oscillator 15 of an excimer laser oscillator, etc., and the work head 24 for the laser beam 18 emitted from the long wavelength laser oscillator 16 of a carbon dioxide gas laser oscillator, etc., are arranged on the surface thereof. A converging optical system 26 and polarization optical system 40 are respectively provided on the both work heads 23, 24 and the laser beam is focused by the converging optical system 26 alternately by the short wavelength laser beam for piercing of the copper foil of the printed board and by the long wavelength laser beam for piercing of the resin layer. The small bore hole whose diameter is in <=0.1mm is correctly pierced on the copper foil and resin layer alternately by correctly aligning the converging position of the laser beam by the polarization optical system 40.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a printed circuit board drilling machine for drilling holes in printed circuit boards, and is particularly suitable for processing small holes with a diameter of (J, 2 myin or less). For printed circuit board drilling machine.

It is related to

[Conventional technology]

Holes in printed circuit boards are generally drilled.

It is being done.

When it comes to drilling holes in printed circuit boards using a drill, it's trivial.

It is difficult to drill small holes with a diameter of 0.1 mm or less due to constraints on the production of the drill or the strength of the drill.

It was difficult.

For this, holes in the printed circuit board are made using laser light.

Several methods have been proposed for performing the ritual.

One method is to drill holes in the outer layer of copper foil at the required locations in advance using zero-etching, and then pass through the holes.

Laser light emitted from a carbon dioxide laser oscillator.

Irradiate the resin to create blind holes or holes 1-.

- It is used to process holes.

[Problem to be solved by the invention]

However, after etching, the resin layer is processed.

This method requires multiple steps for etching to make holes in the copper foil, which reduces the efficiency of the process.

In addition, when a printed circuit board is irradiated with an excimer laser with a wavelength in the ultraviolet region, the outer copper foil layer can be efficiently etched, but the resin layer underneath can be etched.

Processability is improved because the energy is used to decompose the resin.

9. Holes make work less efficient.

The object of the present invention is to solve the problems of the prior art described above.

In view of this, anamei allows work to be done more efficiently.

We provide printed circuit board drilling machines.

[Means to solve the problem] 10 In order to achieve the above object, in the present invention.

First, a printed circuit board is placed and moved in the X direction.

The table and the direction perpendicular to the direction of table movement.

A small carriage that can be moved to this carriage.

at a predetermined interval so as to face the printed circuit board.

A pair of supported processing heads and each processing head.

Compatible excimer laser oscillators and carbon dioxide lasers.

An oscillator is provided.

Further, the Karoe head was provided with a deflection optical system for moving the focusing position of the laser beam. 3゜Furthermore,
A means for moving the condensing optical system was provided so as to condense the laser beam at a required position.

[For production]

Then, the table and carriage were all moved, the holes in the lint board were placed in position, and the excimer laser oscillated.

A processing head corresponding to the device is placed opposite the machine, and a laser beam is focused and irradiated onto the surface of the copper foil on the outer layer of the printed circuit board to form a hole in the copper foil. Then move the carriage.

and processing compatible with carbon dioxide laser oscillators.

Place the RAD facing the hole formed in the copper foil and shine the laser beam.

Irradiate the resin so that it is focused downwards on the resin to be processed.
Drill holes in the resin layer.

Then, holes are made alternately in the copper foil and the resin layer.

Drill the hole to the required depth and place.

Drill one blind hole or one through hole to the required depth.

Note that the wavelength of the laser light emitted from the excimer laser oscillator is 308 nm, and the wavelength of the laser light emitted from the carbon dioxide laser oscillator is 10,600 nm.

Then, the beam sub-box 4 when condensing light due to each wavelength difference.

There will be a difference in the diameter of the holes.

For this reason, holes with the same diameter are formed in the copper foil and the resin layer.

To do this, it is necessary to move the table and carriage relative to each other during copper foil processing, thereby expanding the copper foil processing area.

And, as mentioned above, the operation sound that expands the processing area.

If this is done by moving the focusing position of the laser beam using a deflection optical system, it will be more efficient.

processing can be carried out. Further, it is possible to easily process a hole larger than the diameter of the beam spot by 1°.

In addition, there is a means for moving the condensing optical system, and a laser beam.

By moving the light focusing position, the depth can be adjusted to any desired depth.

It can be processed up to

[Embodiment] 1° Hereinafter, an embodiment of the present invention will be explained based on FIGS. 1 to 8.

In the figure, 1 is a printed circuit board. 2 is bed.

Guides 3 are fixed in parallel on the bed 2 at predetermined intervals. 4 is a feed screw, which is supported via a bearing 5 on 1 and ped 2 in parallel with guide 3.

A motor 6 is supported by a bearing 5, coupled to the feed screw 4, and rotates the feed screw 4. Reference numeral 7 denotes a tape le, which is slidably supported on the guide 3 and is provided with a nut 8 that is screwed into the feed screw 4.・.

Reference numeral 9 denotes a column, which is erected above the bed 2 so as to straddle the table 7. Reference numeral 10 denotes a guide, which is fixed in parallel to the column 9 at a predetermined interval. 11° is the feed screw,
to the column 9 via the bearing 12;

It is supported parallel to the id 10. 13 is a motor.

It is supported by a bearing 5 and coupled to a feed screw 11.

Rotate the feed screw 11. 14 is a carriage.

The feed screw is slidably supported by the guide 10 and is a feed screw.

11 is provided. .

15 is an Ashima laser oscillator (hereinafter simply referred to as oscillator 1°), and 16 is a carbon dioxide laser oscillator (hereinafter simply referred to as oscillator 1°).

(called an oscillator), respectively, on the side of column 9.

It is located at the rear. 17 is a laser beam.

It is excavated from the oscillator 15. 18 is a laser beam.

Then, the oscillator 16 generates oscillation. 19 is the light guide tube 1,1
Each is connected to an oscillator 15,16.・20
is a repeater, which is connected to one end of the light guide tube 19 and has a reflecting mirror 21 inside. Reference numeral 22 denotes a light guide tube, which is formed to be expandable and retractable like, for example, a Rondo antenna, and one end of which is coupled to the repeater 20.

23 and 24 are processing heads, which are supported by a carriage 1°4 at a predetermined interval and each guide light.

It is connected to the tube 22. 25 is a reflective mirror.

It is fixed on the top of the processing head 23, 24.

There is. 26 is a condensing optical system, and a processing spatula, respectively.

It is located in the center of the doors 23 and 24. 40 is.

of the processing heads 23 and 24, respectively, with deflection optics.

located at the bottom.

The condensing optical system 26 is shown in FIGS. 3 and 4.

It is structured like this.　　　　　　　　1. .

In the figure, 27 is a case of the processing head 23 (24), in which a groove 28 is formed. A lens holder 29 is slidably fitted into the case 27 and holds a condensing lens 30 therein. 31 is a pin, lens holder 2
9 and slidably penetrates the groove 28.

33 is a gear, which is rotatable between the sleeve 32 fitted onto the case 27.

A pin 31 is mounted on the inner peripheral surface in contact with the case 27.
A spiral groove 34 is formed into which the groove 34 is slidably fitted. A motor 35 is supported by the case 27. 3
6 is a gear, which meshes with gear 33.

It is fixed to the rotating shaft of the motor 35 as shown in FIG. .

Therefore, when the motor 35 operates and the gear 36 degrees rotates, the gear 33 also rotates. At this time,.

Since the groove 34 on the inner circumferential surface of the gear 33 also rotates, the pin 311° cuts into the groove 28 and moves, thereby moving the lens holder 29.

Move in the direction of the optical axis. With this lens holder 29.

At the same time, the lens 30 moves and the laser beam 17 (.

18) in the shape of a groove 34 in the direction of the optical axis.

It can be changed within the scope of what has been achieved. 1. The deflection optical system 40 has a configuration as shown in FIGS. 5 and 6.

In the figure, a prism 41 is supported by a gear 42 that is rotatably supported at the lower end of the case 27. 43 is a prism and gear 42.8.

It is supported by a gear 44 which is rotatably suspended. A motor 45 is provided with a rotation detector 46 and is supported by the case 27, and a gear 47 and a gear 48 meshing with the gear 42 are fixed to its rotating shaft. 49 is a motor, and a rotation detector 50 is provided.

attached, supported by the case 27, and rotated.

A gear 51 is fixed to the shaft. 52 is the axis.

It is rotatably supported by the gate case 27 and has teeth at one end.

A gear 53 meshing with wheel 44 is fixed at the other end.

supports the gear 54 that meshes with the gear 51 so that it can rotate simultaneously.

An arm 55 is fixed. A gear 56 meshes with the gear 47°, and is rotatably supported by the case 27. 57 is a gear portion that meshes with the gear 56;

An internal gear portion that meshes with the gear 54 is integrally formed at the front.

It is rotatably supported by the case 27. , 1, and the gears 51, 54 and 57 constitute a planetary gear mechanism.

With such a configuration, the motor 45 is activated.

If you do so, gear 48 will move! lll the evil car 42 is turning,
Prism 41 rotates. At the same time, gears 47, 56.
,,.

57.54. Arm 55. Since the gear 53 rotates via the shaft 52, the gear 44 is rotated and the prism 43 is also rotated.

Here, if the number of teeth of the gear 42 and the gear 44, and the gear 48 and the gear 53 are the same, the prism 41 and the prism 43 can be rotated at the same time by making the rotational speed of the motor 45 and the shaft 52 the same. rotate at the same speed.

If the number of teeth of gear 51 and gear 54 is the same, then
The rotation speed of the shaft 52 is three-quarters of the rotation speed of the motor 45. Therefore - wheel 47 and gears.

Rotation of gear 57 with the ratio of the number of teeth of gear 57 being 4:3.

By setting the speed to 4/3 of the same rotational speed of the rotating shaft of the motor 45, the prisms 41, 43 can be rotated at the same speed. 1° On the other hand, when the motor 49 is operated and the gear 51 is rotated, the gear 5
4 resides in the gear 57 and revolves, causing the shaft 52 to rotate.
The gear 44 is rotated by the gear 53, and the prism 43 is rotated so that the phase with respect to the C1 prism 41 can be changed.

By changing the phase of the prism 41 and the prism 43 by t, the light condensing position by the lens 30 can be deviated from the optical axis of the lens 30. .

Also, the amount of deviation of the focal point from the optical axis is determined by the prism.

It can be set arbitrarily by changing the phase of 41.43.

In the above configuration, as shown in FIG.

When forming a through hole 1h in the lint substrate 1 with an opening having the same diameter d as the beam spot of the laser beam 18 oscillated from the oscillator 16, the convergence angle of the ILI beams 17 and 18 should be taken into consideration. Then, copper foil・la + l
c + le r Ig and resin layer 1b, 1d=i processing.

Set the beam spot deflection scanning amount when scanning.

First, as shown in FIG. 7(a), the signal is emitted.

The 1° beam spot SIl of the laser beam 17 excavated from the vibrator 15 is applied to the surface of the copper foil 1a, and the motors 45, 49' (r) of the deflection optical system are activated to move the beam from the center of the processing area toward the outer periphery. The copper foil 1a is moved in a thinly wound manner or concentrically to form a hole in the copper foil 1a.

Then, by operating the motor 13, the carriage...

After moving the processing head 24 to face the hole formed in the copper foil 1a, the motor 35 of the condensing optical system 26 is activated, and the oscillator 16 oscillates the beam 18.
The position of the lens 30 is set so that the beam spot Sc is coupled to the lower surface of the resin rft 1 b (the upper surface of the copper foil IC).

After setting the amount of deviation of the beam spot Sc by operating the motor 49 of the deflection optical system 40.

The motor 45 is operated as shown in FIG. 7(b).

Then, holes are made in the resin layer 1b. 1,
1. Then, the carriage is moved by the operation of the motor 13.

14 to move the processing head 23 to the copper foil 1a and the processing head 23.

After facing the hole formed in the resin layer 1b, the condensed light is focused.

The motor 35 of the optical system 26 is operated, and the position of the lens 30 is set so that the beam spot 1°SE of the laser beam 17 excavated from the oscillator 15 is coupled to the upper surface of the copper foil 1c.

and motors 45, 49i of the deflection optical system 40.

It is operated to make a hole of a required size in the copper foil 1c.

, 12 Similarly, as shown in FIG. 7(d), resin layer 1d, copper foil 1e as shown in FIG. 7(e),
After drilling a hole in the resin layer 1f as shown in FIG. 7(f), a hole is drilled in the lowest layer copper foil 1g to form a through hole 1h2, as shown in FIG. 7(g).

As mentioned above, a short-wavelength laser beam emitted from an excimer laser oscillator is used to make holes in copper foil, and a long-wavelength laser beam emitted from a carbon dioxide laser oscillator is used to make holes in a resin layer. (Infrared region)1. By using laser light, holes can be efficiently made in the copper foil and resin layer.

Further, when making a blind hole, processing may be completed when the required copper foil 1c (or le) is exposed. At this time, the energy of the laser beam oscillated from the carbon dioxide laser oscillator is absorbed into the copper foil by only about 2 inches, so that it is possible to accurately drill holes up to the required copper foil.

In the above embodiment, a case has been described in which processing is performed only from one direction in order to drill one hole, but the printed circuit board may be reversed midway through and processing may be performed from both sides. Further, although the holes may be machined sequentially one by one, the required number of holes may be drilled for each layer.

Also, from the hole diameter that can be machined in the above embodiments.

If an even smaller hole is to be made, a diaphragm may be provided in the optical path of the laser beam to reduce the diameter of the laser beam.

〔Effect of the invention〕

As described above, according to the present invention, the through hole has a small diameter.

- Holes and blind holes on printed circuit boards.

Can be opened efficiently and accurately.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a fourth example of a printed circuit board drilling machine according to the present invention, FIG. 2 is a perspective view showing an optical path of the laser beam in FIG. 1, and FIG. 4 is a front sectional view of the condensing optical system in the figure, FIG. 4 is a sectional view taken along IV-IV in FIG. 3, and FIG. 5 is a polarized view in FIG. 2. A configuration diagram of the internal optical system, and FIG. 6 is a bottom view of FIG. 5. In FIG. 7, the holes marked are process ratios showing an example of the process, and the 8th. . The figure is a cross-sectional view of a printed circuit board with holes.

Claims (5)

[Claims] 1. A printed circuit board drilling machine has a table on which a printed circuit board is placed and moves in the X direction, and a carriage that moves in a direction perpendicular to the moving direction of the table. A printed circuit board drilling machine characterized in that a pair of processing heads corresponding to each laser oscillator for focusing laser light on a processing section are arranged at a predetermined interval. 2. 2. The printed circuit board drilling machine according to claim 1, wherein an excimer laser oscillator is provided as a short wavelength laser oscillator, and a carbon dioxide laser oscillator is used as a long wavelength laser oscillator. 3. 3. The printed circuit board drilling machine according to claim 1, wherein the distance between the pair of processing heads is set to an integral multiple of the minimum pitch of holes to be drilled in the printed circuit board. 4. Deflection optics that moves the focusing position of the laser beam along a circumference of at least a predetermined radius, with the axis of the optical system in the processing head as a reference, on the processing head that is compatible with at least a short wavelength laser oscillator. A printed circuit board drilling machine according to any one of claims 1 to 3, characterized in that a system is provided. 5. A patent claim characterized in that a moving means is provided for moving the condensing optical system of the processing head so as to focus the laser beam on the surface of the copper foil during steel foil processing and on the bottom surface of the resin during resin processing. The printed circuit board drilling machine according to any one of items 1 to 4.