JPH07185867A - Laser beam machining device - Google Patents

Abstract

PURPOSE:To efficiently perform laser machining by rotating a machining table around Z-axis to correspond to the movement in the direction of X-axis or Y-axis of a material to be machined, in performing laser machining by irradiating the material with a laser beam, and thereby coinciding the moving direction of a laser beam on the material with the position of the laser beam. CONSTITUTION:The device is provided with a movable table 20 which is movable in the direction of X-axis and Y-axis, machining table 23 which is provided rotatably around Z-axis perpendicular to the movable table 20, and laser generator 31 by which a material 10 placed on the machining table 23 is irradiated with a laser beam 32 having a cross-sectional shape other than a circular section.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus.

[0002]

2. Description of the Related Art Since a laser beam can accurately collect light energy at a small point, in recent years, a laser beam has been used for processing such as drilling, cutting, and cutting of a material to be processed such as a metal material or a synthetic resin material. Is being carried out.

Since material processing using a laser beam (hereinafter, simply referred to as laser processing) is non-contact processing, the force and vibration associated with the processing are not transmitted to the material to be processed, and it is hard and easily broken like ceramics. Suitable for processing materials with high elasticity such as materials and rubber materials.

For the above laser processing, 1 kHz to 10 kHz
A pulse laser oscillator that oscillates a laser beam at a repetition rate of about kHz is used.

This laser beam, as shown in FIG.
The peak output is high when the duration of one pulse is about 10 ns to 1 μs, and the material to be processed can be effectively processed, and the pulse interval is about 0.1 ms to 1 ms. Has a characteristic that the heat influence on the is small.

A laser beam oscillated from a high-power pulse laser oscillator often has a rectangular beam cross section, which is due to the characteristics of the laser medium to be excited.

That is, as shown in FIG. 8, in the solid-state pulse laser oscillator in which the laser rod 3 having a circular cross section is arranged between the laser resonators formed by the total reflection mirror 1 and the semi-transmission mirror 2, A laser beam 4 having a cross section is oscillated.

A total reflection mirror 1 as shown in FIG.
In a solid-state pulse laser oscillator in which a laser rod 5 having a rectangular cross section is arranged between a laser resonator formed by a semitransparent mirror 2 and a semitransparent mirror 2, a laser beam 6 having a rectangular cross section is formed.
Is oscillated.

When the pulse laser oscillators shown in FIGS. 8 and 9 are compared, if the laser rods 3 and 5 have the same length L and are formed in the same volume, the laser rod 5 having a rectangular cross section is formed. In this case, the surface area is larger than that of the laser rod 3 having a circular cross section, the heat dissipation is excellent, and the laser performance is easily improved.

Therefore, in the high-power solid-state pulse laser oscillator, the laser rod 5 having a rectangular cross section as shown in FIG.
Is used.

On the other hand, as shown in FIG. 10, between the laser resonator formed by the total reflection mirror 1 and the semi-transmission mirror 2, a pair of rod-shaped members extending from the total reflection mirror side toward the semi-transmission mirror side is formed. A high output gas pulse laser oscillator (excimer pulse laser oscillator) in which electrodes 7 and 8 are opposed to each other and XeCl and KrF are interposed as a laser medium between the electrodes 7 and 8, or between the electrodes 7 and 8 In a gas pulse laser oscillator (CO ₂ laser oscillator) in which CO ₂ is interposed as a laser medium, the cross-sectional shape of the space in which the discharge between both electrodes 7 and 8 is formed is substantially rectangular, and therefore has a rectangular cross section. The laser beam 9 is oscillated.

When performing laser processing such as cutting on the material 10 to be processed using the solid-state pulse laser oscillator (see FIG. 8), the laser beam 4 oscillated from the solid-state laser oscillator is used as a lens. Light collecting means (not shown)
While irradiating the work material 10 via the X-axis, the work material 10 is irradiated with the X-axis so that the irradiation position of the laser beam 4 is displaced along the cutting line S assumed for the working execution portion of the work material 10. Direction or Y-axis direction.

A solid-state pulse laser oscillator (see FIG. 9) or a gas pulse laser oscillator (see FIG. 10)
When performing laser processing such as cutting on the material to be processed 10 as shown in FIG. 12, the laser beam 6 oscillated from the solid-state laser oscillator or the laser beam 9 oscillated from the gas pulse laser oscillator is used. The material 10 to be processed is irradiated through a condensing means (not shown) such as a lens, and the laser beam 6 or the laser beam 9 is also used.
The work material 10 is moved so that the irradiation position of X is displaced along the cutting line S assumed for the processing execution portion of the work material 10.
It is sequentially moved in the axial direction or the Y-axis direction.

[0014]

However, as shown in FIGS. 11 and 12, the coordinate (X ₁ , Y ₀ ) assumed on one side surface of the work material 10 goes straight to the coordinate (X ₁ , Y ₁ ). Between the coordinates (X ₁ , Y ₁ ) and the coordinates (X ₂ , Y ₂ ) along an arc of radius r centered on the coordinates (X ₂ , Y ₁ ),
When the material 10 to be processed is to be cut according to a cutting line S which goes straight from the coordinates (X ₂ , Y ₂ ) to the coordinates (X ₃ , Y ₂ ), a laser having a circular cross section emitted from the solid-state pulse laser oscillator shown in FIG. In the beam 4, between the coordinates (X ₁ , Y ₀ ) and the coordinates (X ₁ , Y ₁ ), between the coordinates (X ₁ , Y ₁ ) and the coordinates (X ₂ , Y ₂ ), and the coordinates ( X ₂ , Y ₂ ) and coordinates (X ₃ ,
Y ₂ ), the cutting portion (the processing portion where the work material 10 is removed by the laser beam 4)
Have the same width D, but in the laser beam 6 having a rectangular cross section emitted from the solid-state pulse laser oscillator shown in FIG. 9 or the laser beam 9 having a rectangular cross section emitted from the gas pulse laser oscillator shown in FIG. Coordinates (X ₁ ,
The width D of the cut portion between Y ₀ ) and the coordinates (X ₁ , Y ₁ ) is equal to the short side a (see FIG. 6) of the cross section of the laser beams 6, 9 and the coordinates (X ₁ , Y ₁ ) And the coordinate (X ₂ , Y ₂ ), the width D of the cut portion gradually increases from the coordinate (X ₁ , Y ₁ ) to the coordinate (X ₂ , Y ₂ ), and further, the coordinate (X The width D of the cut portion between ( ₂ , Y ₂ ) and the coordinates (X ₃ , Y ₂ ) becomes equal to the long side b (see FIG. 6) of the cross section of the laser beams 6, 9.

Therefore, when performing laser processing on the material 10 to be processed using the laser beams 6 and 9 having a high peak output, the material to be processed 10 is moved in the Y-axis direction more than when the material 10 is moved in the Y-axis direction. When the processing material 10 is moved in the X-axis direction, more portions are evaporated by the laser beams 6 and 9.

Further, as compared with the case where the work material 10 is moved in the Y-axis direction and cutting is performed by using the short side a of the laser beams 6, 9 as the working tip, the work material 10 is moved in the X-axis direction and the laser beam is applied. The processing speed is lower when the cutting is performed with the long side b of the beams 6 and 9 as the processing tip.

The present invention has been made in view of the above-mentioned circumstances, and irradiates a work material with a laser beam having a cross-sectional shape other than a circular cross section, and moves the work material in the X-axis direction and the Y-axis direction. The purpose of this is to match the moving direction of the laser beam with respect to the material to be processed and the direction of the laser beam when performing laser processing.

[0018]

To achieve the above object, in a laser processing apparatus according to claim 1 of the present invention, a movable table 20 that can be moved in the X-axis direction and the Y-axis direction, and the movable table. Driving devices 18 and 21 for moving 20 in the X-axis direction and the Y-axis direction, a processing table 23 provided so as to be rotatable about the Z-axis perpendicular to the moving table 20, and the processing table. Drive device 24 for rotating 23 around the Z-axis, and processing table 23
Position detectors 25, 27 and 29 for detecting the positions of the workpiece material 10 placed on the X-axis direction, the Y-axis direction and the Z-axis direction,
A laser oscillator 31 that oscillates a laser beam 32 having a cross-sectional shape other than a circular cross-section with respect to the workpiece 10 placed on the processing table 23, and a data setting storage device that sets a position at which the processing table 23 should be sequentially moved. 35, the data 36 output from the data setting storage unit 35, and the position detection signals 26, 28, 30 output from the position detectors 25, 27, 29, based on the drive units 18, 21,
24, and a controller 37 that outputs drive command signals 38, 39, 40.

Further, in the laser processing apparatus according to the second aspect of the present invention, the processing table 63 movable in the X-axis direction and the Y-axis direction, and the processing table 63 moved in the X-axis direction and the Y-axis direction. Drive devices 18, 21 for
Position detectors 25 and 27 for detecting the positions of the workpiece material 10 placed on the processing table 63 in the X-axis direction and the Y-axis direction.
And a laser beam 32 having a cross-sectional shape other than a circular cross-section
A laser oscillator 31 that oscillates with respect to the material 10 to be processed placed on the processing table 63, and an optical path of the laser beam 32 is surrounded between the pulse laser oscillator 31 and the material 10 to be processed mounted on the processing table 63. The hollow waveguide 42 arranged so as to rotate in the circumferential direction, and a drive device 49 for rotating the hollow waveguide 42 in the circumferential direction,
Position detector 51 for detecting the rotational position of the hollow waveguide 42
A data setting storage device 35 for setting the position where the machining table 63 should be sequentially moved, the data 36 output from the data setting storage device 35, and the position detectors 25, 27, 5
The controller 52 outputs drive command signals 38, 39, 53 to the respective drive units 18, 21, 49 based on the position detection signals 26, 28, 50 output from 1.

Further, in the laser processing apparatus according to the third aspect of the present invention, the processing table 63 movable in the X-axis direction and the Y-axis direction, and the processing table 63 moved in the X-axis direction and the Y-axis direction. Drive devices 18, 21 for
Position detectors 25 and 27 for detecting the positions of the workpiece material 10 placed on the processing table 63 in the X-axis direction and the Y-axis direction.
And a laser beam 32 having a cross-sectional shape other than a circular cross-section
And a total reflection mirror 54 for reflecting the laser beam 32 oscillated from the laser oscillator 31, and a laser oscillator 31 supported so as to be rotatable in the range of about 90 ° about the Z-axis. A total reflection mirror 55 that reflects the laser beam 32 reflected by the total reflection mirror 54, and a recess that reflects the laser beam 32 reflected by the total reflection mirror 55 toward the workpiece 10 placed on the processing table 63. A spherical reflection mirror 56, a drive device 58 for rotating the total reflection mirror 55 about the Z axis, a position detector 60 for detecting the rotation position of the total reflection mirror 55, and a position where the processing table 63 should be sequentially moved. Data setting memory device 35 for setting the data, data 36 output from the data setting memory device 35, and position detection signals output from the position detectors 25, 27, 60. Based on 6,28,59 drive command signals 38, 39 to each drive unit 18,21,58,
And a controller 61 that outputs 62.

[0021]

In the laser processing apparatus according to the first aspect of the present invention, the processing table 23 on which the material 10 to be processed is placed rotates about the vertical Z-axis and the moving table 20 moves the X-axis.
Since it moves in the axial direction and the Y-axis direction, the laser oscillator 3
1 to 3 a laser beam 3 having a cross-sectional shape other than a circular cross-section
When performing laser processing by irradiating the workpiece material 10 with 2
When the processing table 23 is rotated around the Z axis so as to correspond to the movement of the work material 10 in the X axis direction or the Y axis direction, the moving direction of the laser beam 32 and the direction of the laser beam 32 with respect to the work material 10. And will match.

Further, in the laser processing apparatus according to the second aspect of the present invention, the processing table 63 on which the material 10 to be processed is placed moves in the X-axis direction and the Y-axis direction, and the laser oscillator 31 causes the material 10 to be processed. Since the hollow waveguide 42 is provided so as to be able to rotate in the circumferential direction so as to surround the optical path of the laser beam 32 having a cross-sectional shape other than the circular cross-section irradiated to the laser beam, When the material 10 is irradiated with the shaped laser beam 32 for laser processing, the hollow waveguide 42 is rotated so as to correspond to the movement of the material 10 in the X-axis direction or the Y-axis direction. And the laser beam 3 for the material 10 to be processed
The moving direction of 2 and the direction of the laser beam 32 coincide with each other.

Further, in the laser processing apparatus according to the third aspect of the present invention, the processing table 63 on which the material to be processed 10 is placed moves in the X-axis direction and the Y-axis direction, and is oscillated by the laser oscillator 31. The laser beam 32 having a cross-sectional shape other than the cross-section is directed to the material 10 to be processed through the total reflection mirror 54, the total reflection mirror 55 which rotates in the range of about 90 ° about the Z axis, and the concave spherical reflection mirror 56. Since the irradiation is performed, when the laser beam 32 having a cross-sectional shape other than the circular cross-section is irradiated from the laser oscillator 31 to the material to be processed 10 for laser processing, the X-axis direction or the Y-axis of the material to be processed 10 is processed. When the total reflection mirror 55 is rotated so as to correspond to the movement in the direction, the moving direction of the laser beam 32 with respect to the material 10 to be processed and the direction of the laser beam 32 coincide with each other.

[0024]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a first embodiment of the laser processing apparatus according to the present invention, in which 11 is a processing table, and the processing table 11
Is an X-axis direction moving mechanism 12 and a Y-axis direction moving mechanism 13.
And a Z-axis center rotation mechanism 14.

The X-axis direction moving mechanism 12 has a base plate 16 fixed to a substrate 15 and a moving table 17 capable of moving in the X-axis direction substantially horizontal to the base plate 16.
And a drive device 18 for moving the moving table 17 along the X axis.

The X-axis direction moving mechanism 12 is provided with a position detector 25, which detects the relative position of the moving table 17 with respect to the base plate 16 and detects a position detection signal 26. Is output.

The Y-axis direction moving mechanism 13 includes a base plate 19 fixed to the moving table 17, and a moving table 20 capable of moving in a substantially horizontal Y-axis direction orthogonal to the X-axis with respect to the base plate 19. The moving table 20
And a drive device 21 for moving the Y axis along the Y axis.

The Y-axis direction moving mechanism 13 is provided with a position detector 27, which detects the relative position of the moving table 20 with respect to the base plate 19 and detects a position detection signal 28. Is output.

The Z-axis center rotating mechanism 14 includes a base plate 22 fixed to the moving table 20, a processing table 23 that can rotate about a Z axis perpendicular to the base plate 22, and the processing table. A drive device 24 for rotating 23 around the Z axis is provided, and the work material 10 can be placed on the upper surface of the processing table 23.

The Z-axis center rotation mechanism 14 is provided with a position detector 29, which detects the relative position of the machining table 23 with respect to the base plate 22 to detect a position detection signal. It outputs 30.

Reference numeral 31 is a pulse laser oscillator, and the pulse laser oscillator 31 oscillates a laser beam 32 having a rectangular cross section.

Reference numeral 33 is a total reflection mirror, and 34 is a condenser lens. The laser beam 32 oscillated from the pulse laser oscillator 31 is reflected by the total reflection mirror 33 and is incident on the condenser lens 34. The laser beam 32 condensed by the optical lens 34 is applied to the material 10 to be processed placed on the processing table 23.

Reference numeral 35 is a data setting storage device, which outputs coordinate data 36 (coordinate data of the cutting line S) 36 of positions at which the machining table 23 should be successively moved.

Reference numeral 37 is an NC controller, and the NC controller 37 has the coordinate data 36 output from the data setting storage unit 35 and the position detectors 25, 27,
Based on the position detection signals 26, 28, 30 output from 29, drive command signals 38, 39, 40 are output to the respective drive devices 18, 21, 24.

The operation of this embodiment will be described below.

For example, as shown in FIG. 2, from the coordinates (X ₁ , Y ₀ ) assumed on one side surface of the workpiece 10 to the coordinates (X
₁ , Y ₁ ), goes straight from the coordinates (X ₁ , Y ₁ ) to the coordinates (X ₂ , Y ₂ ) along an arc of radius r centered on the coordinates (X ₂ , Y ₁ ), and , The work material 1 according to the cutting line S that goes straight from the coordinates (X ₂ , Y ₂ ) to the coordinates (X ₃ , Y ₂ ).
When cutting 0, the coordinate data 36 (coordinate data of the above-mentioned cutting line S) 36 of the position where the machining table 23 is to be successively moved is set in the data setting storage unit 35, and the upper surface of the machining table 23 is covered. The processing material 10 is placed.

At this time, the processing table 23 and the processing table 23 are processed so that the laser beam 32 focused by the condenser lens 34 is irradiated to the assumed coordinates (X ₁ , Y ₀ ) on one side surface of the processing material 10. The position relative to the material 10 is adjusted.

When the positions of the processing table 23 and the material 10 to be processed are adjusted, the data setting storage unit 35 is operated to NC.
The coordinate data 36 is output to the controller 37.

When the coordinate data 36 is input from the data setting memory 35, the NC controller 37 is based on the coordinate data 36 and the position detection signals 26, 28 and 30 output from the position detectors 25, 27 and 29. , Each drive device 1
Drive command signals 38, 39,
40 is output.

That is, when the coordinate data 36 is input to the NC controller 37, first, the drive command signal 39 is sent from the NC controller 37 to the drive unit 21 of the Y-axis direction moving mechanism 13 constituting the working table 11. Is output,
The moving table 20 moves along the Y axis.

As described above, when the moving table 20 moves along the Y axis, the material 10 to be processed placed on the processing table 23 is displaced in the Y axis direction via the Z axis center rotation mechanism 14, As shown in FIG. 2, the irradiation position of the laser beam 32 is changed from the coordinates (X ₁ , Y ₀ ) of the work material 10 to the coordinates (X ₁ ,
Linearly moving toward the Y ₁ ), and using the short side a (see FIG. 6) of the laser beam 32 as the processing tip, the coordinates (X ₁ , Y ₀ ) to the coordinates (X ₁ , Y ₁ ) of the material 10 to be processed. A cutting process is performed between them.

When the irradiation position of the laser beam 32 reaches the coordinates (X ₁ , Y ₁ ) of the material 10 to be processed, the position detector 27
In addition to the drive command signal 39 output to the drive device 21 based on the position detection signal 28 output from the NC controller 37, the drive device 18 of the X-axis direction moving mechanism 12 and the Z-axis forming the working table 11 are included. Drive command signals 38 and 40 are output to the drive device 24 of the central rotation mechanism 14.

The output of the drive command signal 38 causes the moving table 17 to move along the X axis, and the already output drive command signal 39 causes the moving table 20 to move along the Y axis.

Thus, when the moving table 17 moves along the X axis and the moving table 20 moves along the Y axis at the same time, the machining table 2 is moved through the Z axis center rotation mechanism 14.
The work material 10 placed on the No. 3 is the Y-axis direction moving mechanism 13
And the X-axis center rotation mechanism 14 to displace in the X-axis direction and the Z-axis center rotation mechanism 14 to displace in the Y-axis direction at the same time, so that the irradiation position of the laser beam 32 is changed as shown in FIG. From the coordinates (X ₁ , Y ₁ ) of the work material 10 to the coordinates (X _1
2 , radius ₂ centered on the coordinate (X ₂ , Y ₁ ) toward Y ₂ ).
Move along the arc of.

At this time, the drive command signal 40
Is output, the machining table 23 has a line segment and a coordinate (X ₂ , Y ₁ ) extending from the coordinate (X ₂ , Y ₁ ) of the center of an arc having a radius r to the coordinate (X ₁ , Y ₁ ) around the Z axis. It is rotated by an angle θ formed by a line segment extending from Y ₁ ) to the coordinates (X, Y) of the irradiation position of the laser beam 32.

Therefore, the irradiation position of the laser beam 32 is changed from the coordinates (X ₁ , Y ₁ ) of the work material 10 to the coordinates (X ₂ , Y ₂ ).
While moving toward, the short side a of the laser beam 32 always faces the tangential direction of an arc having a radius r centered on the coordinates (X ₂ , Y ₁ ), and the short side a of the laser beam 32 is used as a processing tip. The cutting process is performed between the coordinates (X ₁ , Y ₁ ) and the coordinates (X ₂ , Y ₂ ).

Further, when the irradiation position of the laser beam 32 reaches the coordinates (X ₂ , Y ₂ ) of the material 10 to be processed, based on the position detection signals 26, 28 output from the position detectors 25, 27, the processing table is processed. The drive command signal 38 is output only to the drive device 18 of the X-axis direction moving mechanism 12 which constitutes 11, and the moving table 17 moves along the X-axis.

In this way, when the moving table 17 moves along the X-axis, the material 10 to be processed placed on the working table 23 is moved to the X-axis via the Y-axis direction moving mechanism 13 and the Z-axis center rotating mechanism 14. It is displaced in the axial direction, and as shown in FIG. 2, the irradiation position of the laser beam 32 moves linearly from the coordinates (X ₂ , Y ₂ ) of the work material 10 toward the coordinates (X ₃ , Y ₂ ), Cutting is performed between the coordinates (X ₂ , Y ₂ ) and the coordinates (X 3, Y ₂ ) of the material 10 to be processed with the short side a of the laser beam 32 as the processing tip.

As described above, in this embodiment, since the short side a of the laser beam 32 having a high processing speed can be always used as the processing tip, the width of the cut portion of the material 10 to be processed is kept substantially constant. Therefore, laser processing can be efficiently performed.

FIG. 3 shows a second embodiment of the laser processing apparatus according to the present invention. In the figure, the same reference numerals as those in FIG. 1 represent the same parts.

Reference numeral 41 is a working table, and the working table 41 is X
It is composed of an axial movement mechanism 12 and a Y-axis movement mechanism 13 (the Z-axis center rotation mechanism 14 is removed from the machining table 11 shown in FIG. 1 and the machining table 63 is driven instead of the movement table 20. Base plate 19 by device 21
With respect to the Y-axis direction).

Also in this embodiment, the laser beam 32 having a rectangular cross-section oscillated from the pulse laser oscillator 31 is reflected by the total reflection mirror 33 in the same manner as in the first embodiment of the present invention described above. The laser beam 32 that has entered the condenser lens 34 and is condensed by the condenser lens 34 irradiates the work material 10 placed on the processing table 63.

Reference numeral 42 denotes a hollow waveguide, and the hollow waveguide 4
As shown in FIG. 4, reference numeral 2 denotes a pair of strip-shaped reflecting plates 43, 43 having reflecting surfaces facing each other at a predetermined interval, and abutting on the facing surfaces of the reflecting plates 43, 43 and reflecting plates. 43,43
It has a pair of spacer members 45, 45 arranged so that a space 44 is formed between them, and a tube member 46 in which the reflection plates 43, 43 and the spacer members 45, 45 are installed.

The hollow waveguide 42 is arranged between the pulse laser oscillator 31 and the total reflection mirror 33 so as to surround the optical path of the laser beam 32.

Reference numeral 47 is a waveguide rotating mechanism. The waveguide rotating mechanism 47 includes a rotation supporting device 48 for supporting the hollow waveguide 42 so as to be rotatable in the circumferential direction, and a hollow guide device. Wave tube 4
Drive device 49 for rotating 2 and hollow waveguide 42
And a position detector 51 that outputs a position detection signal 50.

The laser beam 32 oscillated from the pulse laser oscillator 31 passes through the hollow waveguide 42 and then passes through the total reflection mirror 33 and the condenser lens 34 to be processed on the processing table 63. The material 10 is irradiated, but by changing the rotation position of the hollow waveguide 42, the short length of the laser beam 32 irradiated to the material 10 to be processed corresponding to the rotation position of the hollow waveguide 42. Side a and long side b
The orientation of is changed.

Reference numeral 52 denotes an NC controller. The NC controller 52 has the coordinate data 36 output from the data setting storage unit 35 and the position detection signals 26, 28 and 50 output from the position detectors 25, 27 and 51. Based on
Drive command signal 3 for each drive device 18, 21, 49
It outputs 8, 39, 53.

The operation of this embodiment will be described below.

For example, when the material 10 to be processed is to be cut along the cutting line S as shown in FIG. 2, the coordinate data 36 is set in the data setting memory 35,
The material 10 to be processed is placed on the upper surface of the processing table 63, and the coordinate (X ₁ , Y ₀ ) assumed on one side surface of the material 10 to be processed is irradiated with the laser beam 32 condensed by the condenser lens 34. As described above, the relative position between the processing table 63 and the material 10 to be processed is adjusted.

When the positions of the processing table 63 and the material 10 to be processed are adjusted, the data setting storage unit 35 is operated to NC.
The coordinate data 36 is output to the controller 37.

When the coordinate data 36 is input from the data setting memory 35, the NC controller 52 is based on the coordinate data 36 and the position detection signals 26, 28, 50 output from the position detectors 25, 27, 51. , Each drive device 1
8, 21, 49 sequentially drive command signals 38, 39,
53 is output.

That is, when the coordinate data 36 is input to the NC controller 52, first, the NC controller 52 drives the drive unit 21 of the Y-axis direction moving mechanism 13.
Drive command signal 39 is output to the machining table 63
As shown in FIG. 2, the irradiation position of the laser beam 32 moves from the coordinates (X ₁ , Y ₀ ) of the workpiece 10 as shown in FIG. 2 as in the case of the first embodiment of the present invention shown in FIG. Coordinates (X ₁ ,
Linearly moving toward the Y ₁ ), and using the short side a (see FIG. 6) of the laser beam 32 as the processing tip, the coordinates (X ₁ , Y ₀ ) to the coordinates (X ₁ , Y ₁ ) of the material 10 to be processed. A cutting process is performed between them.

When the irradiation position of the laser beam 32 reaches the coordinates (X ₁ , Y ₁ ) of the material 10 to be processed, in addition to the drive command signal 39 output to the drive unit 21, the NC controller 52 also moves in the X-axis direction. Drive command signals 38 and 53 are output to the drive device 18 of the moving mechanism 12 and the drive device 49 of the waveguide rotating mechanism 47.

When the drive command signal 38 is output, the moving table 17 moves along the X-axis, and the drive command signal 39 already output causes the working table 63 to move along the Y-axis.

Thus, when the moving table 17 moves along the X axis and the working table 63 simultaneously moves along the Y axis, the material 10 to be processed placed on the working table 63 is moved.
Are displaced in the X-axis direction and simultaneously displaced in the Y-axis direction, and the irradiation position of the laser beam 32 is changed from the coordinate (X ₁ , Y ₁ ) of the work material 10 to the coordinate (X ₂ , Y 2 as shown in FIG. ₂ )
It moves toward an arc along a circular arc of radius r centering on the coordinates (X ₂ , Y ₁ ).

At this time, the drive command signal 53
Is output, the drive device 49 of the waveguide rotation mechanism 47 is actuated, and the hollow waveguide 42 moves from the coordinates (X ₂ , Y ₁ ) of the center of the circular arc having the radius r to the coordinates (X ₁ , Y). ₁ ) and a line segment extending from the coordinates (X ₂ , Y ₁ ) to the coordinates (X, Y) of the irradiation position of the laser beam 32 are rotated by an angle θ.

Therefore, the irradiation position of the laser beam 32 is changed from the coordinates (X ₁ , Y ₁ ) of the workpiece 10 to the coordinates (X ₂ , Y ₂ ).
While moving toward, the short side a of the laser beam 32 always faces the tangential direction of an arc having a radius r centered on the coordinates (X ₂ , Y ₁ ), and the short side a of the laser beam 32 is used as a processing tip. The cutting process is performed between the coordinates (X ₁ , Y ₁ ) and the coordinates (X ₂ , Y ₂ ).

Furthermore, when the irradiation position of the laser beam 32 reaches the coordinates (X ₂ , Y ₂ ) of the material 10 to be processed, the X-axis is detected based on the position detection signals 26, 28 output from the position detectors 25, 27. The drive command signal 38 is output only to the drive device 18 of the direction moving mechanism 12, and the moving table 17 moves along the X axis.

As described above, when the moving table 17 moves along the X-axis, the material 10 to be processed placed on the processing table 63 is displaced in the X-axis direction, and the laser beam 32 is irradiated as shown in FIG. The position is the coordinate (X ₂ ,
Linearly move from Y ₂ ) to coordinates (X ₃ , Y ₂ ),
Cutting is performed between the coordinates (X ₂ , Y ₂ ) and the coordinates (X ₃ , Y ₂ ) of the material 10 to be processed with the short side a of the laser beam 32 as the processing tip.

As described above, in this embodiment, the short side a of the laser beam 32 having a high processing speed can always be the processing tip, so that the width of the cut portion of the material 10 to be processed is kept substantially constant. Therefore, laser processing can be efficiently performed.

FIG. 5 shows a third embodiment of the laser processing apparatus according to the present invention. In the figure, the parts designated by the same reference numerals as those in FIG. 3 represent the same parts.

In this embodiment, a laser beam 32 having a rectangular cross section oscillated from a pulse laser oscillator 31.
Is reflected by the total reflection mirror 54 upward in a substantially vertical direction and is incident on the total reflection mirror 55.
Is reflected in a substantially horizontal direction to enter a concave spherical reflection mirror 56 having a ⅛ spherical shape, and is further reflected in a downward direction in a substantially vertical direction by the concave spherical reflection mirror 56 to a condenser lens 34. The laser beam 32 which is incident and condensed by the condenser lens 34 is irradiated to the material 10 to be processed placed on the processing table 63.

Reference numeral 57 denotes a reflection mirror rotating mechanism. The reflection mirror rotating mechanism 57 rotates the total reflection mirror 55 by a driving device 58 for rotating the total reflection mirror 55 about a vertical Z axis. A position detector 60 that detects a moving position and outputs a position detection signal 59 is provided. The total reflection mirror 55 rotates about the Z axis in a range of about 90 °, and the total reflection mirror 55 causes the total reflection mirror 55 to rotate. The reflected laser beam 32 always passes through the concave spherical reflection mirror 56 and is reflected to enter the condenser lens 34.

In this way, the laser beam 32 has the total reflection mirror 55, the concave spherical reflection mirror 56, and the condenser lens 34.
Workpiece material 10 placed on processing table 63 via
However, by changing the rotation position of the total reflection mirror 55, the short side a and the length of the laser beam 32 irradiated to the material to be processed 10 corresponding to the rotation position of the total reflection mirror 55. The direction of the side b is changed.

Reference numeral 61 denotes an NC controller. The NC controller 61 has coordinate data 36 output from the data setting storage unit 35 and position detection signals 26, 28 and 59 output from the position detectors 25, 27 and 60. Based on
Drive command signal 3 for each drive device 18, 21, 58
8, 39, and 62 are output.

The operation of this embodiment will be described below.

For example, when the material 10 to be processed is to be cut according to the cutting line S as shown in FIG. 2, the coordinate data 36 is set in the data setting memory 35,
The material 10 to be processed is placed on the upper surface of the processing table 63 so that the laser beam 32 focused by the condenser lens 34 is irradiated to the assumed coordinates (X ₁ , Y ₀ ) on one side surface of the material 10 to be processed. Place.

When the coordinate data 36 is input from the data setting storage unit 35, the NC controller 61 is based on the coordinate data 36 and the position detection signals 26, 28 and 59 output from the position detectors 25, 27 and 60. , Each drive device 1
8, 21, 49 sequentially drive command signals 38, 39,
62 is output.

That is, when the coordinate data 36 is input to the NC controller 61, first, the drive device 21 of the Y-axis direction moving mechanism 13 is sent from the NC controller 61.
Drive command signal 39 is output to the machining table 63
As shown in FIG. 2, the irradiation position of the laser beam 32 moves from the coordinates (X ₁ , Y ₀ ) of the work material 10 as shown in FIG. 2 in the same manner as in the second embodiment of the present invention shown in FIG. Coordinates (X ₁ ,
Linearly moving toward the Y ₁ ), and using the short side a (see FIG. 6) of the laser beam 32 as the processing tip, the coordinates (X ₁ , Y ₀ ) to the coordinates (X ₁ , Y ₁ ) of the material 10 to be processed. A cutting process is performed between them.

When the irradiation position of the laser beam 32 reaches the coordinates (X ₁ , Y ₁ ) of the material 10 to be processed, in addition to the drive command signal 39 output to the drive unit 21, the NC controller 61 also moves in the X-axis direction. Drive command signals 38 and 62 are output to the drive unit 18 of the moving mechanism 12 and the drive unit 58 of the reflection mirror rotating mechanism 57.

When the drive command signal 38 is output, the moving table 17 moves along the X axis, and the drive command signal 39 already output causes the working table 63 to move along the Y axis.

As described above, when the moving table 17 moves along the X axis and the working table 63 moves simultaneously along the Y axis, the material 10 to be processed placed on the working table 63 is moved.
Are displaced in the X-axis direction and simultaneously displaced in the Y-axis direction, and the irradiation position of the laser beam 32 is changed from the coordinate (X ₁ , Y ₁ ) of the work material 10 to the coordinate (X ₂ , Y 2 as shown in FIG. ₂ )
It moves toward an arc along a circular arc of radius r centering on the coordinates (X ₂ , Y ₁ ).

At this time, the drive command signal 62
Is output, the drive device 58 of the reflection mirror rotating mechanism 57 is operated, and the total reflection mirror 55 is centered on the Z axis.
A line segment extending from the coordinate (X ₂ , Y ₁ ) at the center of the arc of the radius r to the coordinate (X ₁ , Y ₁ ) and the coordinate (X, Y) of the irradiation position of the laser beam 32 from the coordinate (X ₂ , Y ₁ ). ) Is rotated by an angle θ formed by a line segment extending to ().

Therefore, the irradiation position of the laser beam 32 is changed from the coordinate (X ₁ , Y ₁ ) of the work material 10 to the coordinate (X ₂ , Y ₂ ).
While moving toward, the short side a of the laser beam 32 always faces the tangential direction of an arc having a radius r centered on the coordinates (X ₂ , Y ₁ ), and the short side a of the laser beam 32 is used as a processing tip. The cutting process is performed between the coordinates (X ₁ , Y ₁ ) and the coordinates (X ₂ , Y ₂ ).

Further, when the irradiation position of the laser beam 32 reaches the coordinates (X ₂ , Y ₂ ) of the material 10 to be processed, the X-axis is detected based on the position detection signals 26, 28 output from the position detectors 25, 27. The drive command signal 38 is output only to the drive device 18 of the direction moving mechanism 12, and the moving table 17 moves along the X axis.

As described above, when the moving table 17 moves along the X-axis, the material 10 to be processed placed on the processing table 63 is displaced in the X-axis direction, and the laser beam 32 is irradiated as shown in FIG. The position is the coordinate (X ₂ ,
Linearly move from Y ₂ ) to coordinates (X ₃ , Y ₂ ),
Cutting is performed between the coordinates (X ₂ , Y ₂ ) and the coordinates (X ₃ , Y ₂ ) of the material 10 to be processed with the short side a of the laser beam 32 as the processing tip.

As described above, in this embodiment, the short side a of the laser beam 32 having a high processing speed can always be the processing tip, so that the width of the cut portion of the material 10 to be processed is kept substantially constant. Therefore, laser processing can be efficiently performed.

The laser processing apparatus of the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

[0090]

As described above, according to the laser processing apparatus of the present invention, various excellent effects as described below can be obtained.

(1) In the laser processing apparatus according to the first aspect of the present invention, the processing table 23 on which the material to be processed 10 is placed rotates about the vertical Z axis, and the moving table 20 moves the X axis. Direction and Y-axis direction, the laser oscillator 31 irradiates the workpiece 10 with a laser beam 32 having a cross-sectional shape other than a circular cross-section and moves the processing table 23 in the X-axis direction or the Y-axis direction. Material 10 to be processed by laser
By rotating the machining table 23 about the Z axis so as to correspond to the movement of the X axis direction or the Y axis direction,
Laser processing can be performed efficiently by matching the moving direction of the laser beam 32 with respect to the material 10 to be processed and the direction of the laser beam 32, and maintaining the width of the processed portion of the material 10 to be substantially constant. You can

(2) In the laser processing apparatus according to the second aspect of the present invention, the processing table 63 on which the material to be processed 10 is placed moves in the X-axis direction and the Y-axis direction, and the laser oscillator 31 processes the workpiece. Since the hollow waveguide 42 is provided so as to be able to rotate in the circumferential direction so as to surround the optical path of the laser beam 32 having a cross-sectional shape other than the circular cross-section irradiated to the material 10, the laser oscillator 31 does not have a circular cross-section. The laser beam 32 having the cross-sectional shape of
When performing laser processing by irradiating 0 with moving the processing table 23 in the X-axis direction or the Y-axis direction, the hollow waveguide is adapted to correspond to the movement of the workpiece material 10 in the X-axis direction or the Y-axis direction. By rotating 42, the moving direction of the laser beam 32 with respect to the material 10 to be processed and the direction of the laser beam 32 can be matched to efficiently perform laser processing, and the processed portion of the material 10 can be processed. The width of can be kept substantially constant.

(3) In the laser processing apparatus according to claim 3 of the present invention, the processing table 63 on which the material to be processed 10 is placed moves in the X-axis direction and the Y-axis direction and is oscillated by the laser oscillator 31. A laser beam 32 having a cross-sectional shape other than a circular cross-section is processed through a total reflection mirror 54, a total reflection mirror 55 that rotates about the Z axis within a range of about 90 °, and a concave spherical reflection mirror 56. 10 is irradiated, the laser beam 31 having a cross-sectional shape other than a circular cross-section is irradiated from the laser oscillator 31 to the material 10 to be processed and the processing table 23 is moved in the X-axis direction or the Y-axis direction. When the laser processing is performed by the laser beam, the total reflection mirror 55 is rotated so as to correspond to the movement of the workpiece material 10 in the X-axis direction or the Y-axis direction. Is matched with the moving direction and the direction of the laser beam 32 of the laser beam 32 with respect to be able to implement efficient laser processing, also, the material to be processed 1
The width of the processed portion of 0 can be kept substantially constant.

[Brief description of drawings]

FIG. 1 is a conceptual diagram showing a first embodiment of a laser processing apparatus of the present invention.

FIG. 2 is a plan view showing a relationship between a coordinate of a cutting line and a direction of a laser beam having a rectangular cross section, which is assumed on one side surface of a material to be processed.

FIG. 3 is a conceptual diagram showing a second embodiment of the laser processing apparatus of the present invention.

FIG. 4 is a partially cutaway perspective view showing the structure of a hollow waveguide.

FIG. 5 is a conceptual diagram showing a third embodiment of the laser processing apparatus of the present invention.

FIG. 6 is a conceptual diagram of a laser beam having a rectangular cross section.

FIG. 7 is a graph showing the output change of the laser beam of the pulse laser oscillator.

FIG. 8 is a conceptual diagram showing an example of a solid-state pulse laser oscillator.

FIG. 9 is a conceptual diagram showing another example of a solid-state pulse laser oscillator.

FIG. 10 is a conceptual diagram showing an example of a gas pulse laser oscillator.

FIG. 11 is a plan view showing the relationship between the coordinates of the cutting line and the laser beam trajectory having a circular cross section, which is assumed on one side surface of the material to be processed.

FIG. 12 is a plan view showing a relationship between a coordinate of a cutting line and a laser beam trajectory having a rectangular cross section, which is assumed on one side surface of a material to be processed.

[Explanation of symbols]

10 Work Material 18, 21, 24, 49, 58 Driving Device 20 Moving Table 23, 63 Processing Table 25, 27, 29, 51, 60 Position Detector 26, 28, 30, 50, 59 Position Detection Signal 31 Pulse Laser Oscillator (laser oscillator) 32 Laser beam 35 Data setting memory 36 Coordinate data (data) 37, 52, 61 NC controller (controller) 38, 39, 40, 53, 62 Drive command signal 42 Hollow waveguide 54, 55 All Reflection mirror 56 Concave spherical reflection mirror

Claims (3)

[Claims] 1. A moving table (20) capable of moving in the X-axis direction and the Y-axis direction, and a drive device (18) for moving the moving table (20) in the X-axis direction and the Y-axis direction.
(21), a machining table (23) provided so as to be rotatable about a Z axis perpendicular to the moving table (20), and the machining table (23) is rotated about the Z axis. A driving device (24) for moving the workpiece (10) placed on the processing table (23) in the X-axis direction, the Y-axis direction, and the Z-axis.
Position detectors (25), (2) that detect the axial position
7) and 29), and a laser oscillator (31) that oscillates a laser beam (32) having a cross-sectional shape other than a circular cross-section with respect to the material (10) to be processed placed on the processing table (23). A data setting storage device (35) for setting a position at which the processing table (23) should be sequentially moved, data (36) output from the data setting storage device (35), and each position detector (25), (27). ), (29) based on the position detection signals (26), (28), (30), drive command signals (38), (24) for the drive devices (18), (21), (24). A laser processing apparatus comprising: a controller (37) for outputting (39) and (40). 2. A processing table (63) movable in the X-axis direction and the Y-axis direction, and a drive device (18) for moving the processing table (63) in the X-axis direction and the Y-axis direction.
(21), position detectors (25) and (27) for detecting the positions of the material to be processed (10) placed on the processing table (63) in the X-axis direction and the Y-axis direction, and a cross section other than a circular cross section. A laser oscillator (31) for oscillating a laser beam (32) having a shape with respect to the material (10) to be processed placed on the processing table (63), and a pulse laser oscillator (31)
And the work material (10) placed on the processing table (63)
A hollow waveguide (42) arranged so as to surround the optical path of the laser beam (32) and to be rotatable in the circumferential direction, and the hollow waveguide (42) is rotated in the circumferential direction. A drive device (49) for making it move, a position detector (51) for detecting the rotational position of the hollow waveguide (42), and a processing table (6)
3) a data setting storage device (35) for setting a position to be successively moved, data (36) output from the data setting storage device (35) and position detectors (25), (2)
7), position detection signals (26) output from (51),
Based on (28) and (50), each drive device (18),
Drive command signals (38) to (21) and (49),
A laser processing apparatus comprising: a controller (52) that outputs (39) and (53). 3. A machining table (63) movable in the X-axis direction and the Y-axis direction, and a drive unit (18) for moving the machining table (63) in the X-axis direction and the Y-axis direction.
(21), position detectors (25) and (27) for detecting the positions of the material to be processed (10) placed on the processing table (63) in the X-axis direction and the Y-axis direction, and a cross section other than a circular cross section. A laser oscillator (31) that oscillates a laser beam (32) having a shape, and a total reflection mirror (54) that reflects the laser beam (32) oscillated from the laser oscillator (31)
And a total reflection mirror (55) which is supported so as to be rotatable about the Z axis within a range of about 90 ° and which reflects the laser beam (32) reflected by the total reflection mirror (54).
A concave spherical reflection mirror (56) for reflecting the laser beam (32) reflected by the total reflection mirror (55) toward the material (10) to be processed placed on the processing table (63); A drive device (58) for rotating the reflection mirror (55) about the Z axis, a position detector (60) for detecting the rotation position of the total reflection mirror (55), and a machining table (63) are sequentially moved. A data setting storage device (35) for setting the position to be set, data (36) output from the data setting storage device (35), and position detectors (25), (2
7), position detection signals (26) output from (60),
Based on (28) and (59), each drive device (18),
Drive command signals (38) to (21) and (58),
And a controller (61) for outputting (39) and (62).