KR20230002713A - laser processing device - Google Patents

Abstract

By irradiating a laser beam along the line to an object on which a plurality of lines arranged along the second direction extending along the first direction and intersecting the first direction are set, the object is modified along the line. A laser processing apparatus for forming an area, comprising: a support portion for supporting the object; a first laser processing head and a second laser processing head for irradiating the laser beam to the object supported by the support portion; A first movement mechanism for moving one laser processing head and the second laser processing head along the first direction and the second direction, respectively, and at least the first laser processing head and the second laser processing head; A laser processing device comprising a control unit for controlling the irradiation of the laser beam from and the movement of the first laser processing head and the second laser processing head by the first moving mechanism.

Description

laser processing device

One aspect of the present disclosure relates to a laser processing apparatus.

Patent Document 1 describes a laser processing apparatus including a holding mechanism for holding a workpiece and a laser irradiation mechanism for irradiating a laser beam to the workpiece held in the holding mechanism. In the laser processing apparatus described in Patent Literature 1, a laser irradiation mechanism having a condensing lens is fixed to a base, and a workpiece is moved along a direction perpendicular to an optical axis of the condensing lens by a holding mechanism.

Patent Document 1: Japanese Patent No. 5456510

By the way, in the laser processing apparatus as described above, the improvement of throughput is requested|required. For improvement of throughput, it is conceivable to increase the moving speed of the workpiece by the holding mechanism, for example. However, even if an attempt is made to increase the movement speed of the workpiece, the acceleration time required for the movement of the workpiece to reach constant velocity movement at the target speed also increases. For this reason, it is difficult to improve the throughput beyond a certain level by increasing the moving speed of the workpiece.

As a result of encountering such problems and advancing earnest research, the present inventors have obtained the following findings. That is, the throughput can be improved by simultaneously operating two laser processing heads that can move independently of each other in at least part of the time. At this time, it is conceivable to move the laser processing head along the line in order to irradiate the laser beam along the line to be processed set on the object to be processed. However, in this case, the following new problems may arise.

That is, in the case where there is only one laser processing head, the line to be processed can be aligned with the movement line, which is the trajectory of the movement of the laser processing head, by, for example, rotating the support unit that supports the object. On the other hand, if there are two laser processing heads and the moving lines of the respective laser processing heads are not parallel to each other, by rotating the support for supporting the object and matching the line to the moving line of one laser processing head, the other The movement line of the laser processing head is deviated from the line concerned. Such a shift may lead to a decrease in processing quality.

Therefore, an object of one aspect of the present disclosure is to provide a laser processing apparatus capable of suppressing deterioration in processing quality while improving throughput.

A laser processing apparatus according to one aspect of the present disclosure is directed to irradiating a laser beam along the lines to an object on which a plurality of lines extending along a first direction and arranged along a second direction intersecting the first direction are set. A laser processing device for forming a modified region on an object along a line by means of a laser processing device, comprising: a support portion for supporting the object; a first laser processing head and a second laser processing head for irradiating laser light to the object supported by the support portion; And, the first movement mechanism for moving the first laser processing head and the second laser processing head along the first direction and the second direction, respectively, and from at least the first laser processing head and the second laser processing head A control unit for controlling irradiation of the laser beam and movement of the first laser processing head and the second laser processing head by the first moving mechanism is provided, the first moving mechanism extends along the first direction and the first A laser processing head is mounted, a first moving part for moving the first laser processing head along the first direction, and a second laser processing head extending along the first direction are mounted, and the second laser processing head is mounted thereon. A second moving unit for moving the head along the first direction, and extending along the second direction, the first moving unit and the second moving unit are mounted, and each of the first moving unit and the second moving unit is connected to a second moving unit. and a third movement unit for moving the second laser processing head along the first direction, wherein the control unit moves a second movement line representing movement of the second laser processing head along the first direction by the second movement unit from a reference line along the first direction. Acquisition processing for acquiring the amount of displacement in two directions, and second movement to move the second laser processing head along the first direction in a state in which the laser beam is being output from at least the second laser processing head after the acquisition processing By controlling the part, an irradiation process of irradiating a laser beam to an object along a line is performed. While moving the second laser processing head in the second direction, the second laser processing head is moved in the first direction by the control of the second moving unit.

This laser processing apparatus has two laser processing heads (a 1st laser processing head and a 2nd laser processing head) for irradiating a target object with a laser beam. And the 1st laser processing head and the 2nd laser processing head are movable along the 1st direction in which the line set to the object extends by the 1st moving part and the 2nd moving part of a 1st moving mechanism. Therefore, at least part of the time, the throughput can be improved by simultaneously operating the first laser processing head and the second laser processing head.

Further, in this laser processing device, the control unit acquires the displacement amount of the second movement line along the first direction of the second laser processing head by the second moving unit from the reference line along the first direction to the second direction. Acquisition processing is performed. A line set on the object follows the first direction. Therefore, the deviation amount of the second movement line obtained here from the reference line corresponds to the deviation amount from the line in the irradiation process. Then, in the irradiation process, the second laser processing head is moved in the first direction while moving in the second direction by an amount corresponding to the shift amount. Therefore, even when the line set for the object coincides with the movement line of the first laser processing head, the displacement of the second movement line of the second laser processing head from the line is suppressed, and the deterioration of processing quality can be suppressed.

In the laser processing apparatus according to one aspect of the present disclosure, in the acquisition process, the control unit moves the first movement while outputting a laser beam from the first laser processing head in a state where the sample for acquiring the amount of deviation is supported by the support unit. A first step indicating movement of the first laser processing head along the first direction by irradiating the sample with laser light along the first direction by moving the first laser processing head along the first direction under negative control. 1st formation process of forming a 1st processing line as a movement line on a sample by the processing trace of a laser beam, and control of a 2nd moving part while outputting a laser beam from the 2nd laser processing head in the state where the sample is supported by the support part A second processing line as a second moving line is formed on the sample by irradiating a laser beam on the sample along the first direction by moving the second laser processing head along the first direction by the processing trace of the laser beam. You may perform a shift amount acquisition process which acquires the shift amount using the 1st overhead line as a reference line based on the forming process and the comparison of a 1st overhead line and a 2nd overhead line. In this way, if the first processing line and the second processing line formed by actually processing the sample are used as the first and second travel lines for calculating the displacement amount, it becomes possible to obtain the displacement amount with higher accuracy.

A laser processing apparatus according to one aspect of the present disclosure includes a second method for moving a support unit along a first direction and rotating the support unit around a rotation axis along a third direction intersecting the first and second directions. A moving mechanism is further provided, and the control unit performs an alignment process of rotating the support unit so that the line coincides with the first movement line by control of the second moving mechanism before the irradiation process, and in the irradiation process, the control unit performs the first alignment process. In the state where the laser beam is being output from the laser processing head and the 2nd laser processing head, while moving the support part along the 1st direction by the control of the 2nd moving mechanism, to the control of the 1st moving part and the 2nd moving part Thus, the laser beam may be irradiated to the object along the line by moving the first laser processing head and the second laser processing head in the opposite direction to the support portion along the first direction. In this way, when both the support portion for supporting the object and the laser processing head are moved, the moving speed of the convergence point of the laser beam relative to the object is increased, and the processing speed is improved.

Also, in this case, the moving speed of the target of the light converging point is shared by each of the support section and the laser processing head. For this reason, it is possible to suppress each moving speed compared with the case where one of a support part and a laser processing head is moved. As a result, the time and distance related to acceleration/deceleration of the support portion and the laser processing head can be reduced.

Here, it is common that the weight of the laser processing head is lighter than the weight of the support part. Therefore, it is conceivable to move the laser processing head faster than the support unit when moving the light converging point at the target moving speed (that is, to increase the burden of the speed of the laser processing head relatively).

In contrast, in the laser processing device according to one aspect of the present disclosure, an optical fiber for introducing a laser beam output from a light source is connected to the first laser processing head and the second laser processing head, and the control unit performs irradiation processing. , the speed of the first laser processing head and the second laser processing head along the first direction may be smaller than the speed of the support unit along the first direction. In this way, when the optical fiber for introducing the laser light from the light source is connected to the laser processing head, regardless of the weight relationship between the laser processing head and the support, the laser processing head is relatively slow (i.e., laser It is possible to achieve protection of the optical fiber by relatively reducing the burden of speed on the processing head.

In the laser processing device according to one aspect of the present disclosure, the first moving mechanism includes a pair of third moving parts disposed to face each other in the first direction, and the first moving part and the second moving part include a pair of third moving parts. It may be supported across the moving part. In this case, each of the first laser processing head and the second laser processing head is supported reliably.

Here, in the laser processing device according to one aspect of the present disclosure, a laser beam is irradiated along the lines to an object on which a plurality of lines are set extending along the first direction and arranged along the second direction intersecting the first direction. A laser processing device for forming a modified region on an object along a line by doing, comprising: a support portion for supporting the object, a first laser processing head for irradiating laser light to the object supported by the support portion, and a second laser processing head; A processing head, an input acceptance unit for displaying information and accepting input, and a control unit for controlling the input reception unit, wherein the control unit includes processing conditions of an object by laser light from a first laser processing head; A display process of displaying information for receiving an input for independently setting at least some of the processing conditions of the object by means of the laser beam from the second laser processing head is displayed on the input acceptance unit.

This laser processing apparatus has two laser processing heads (a 1st laser processing head and a 2nd laser processing head) for irradiating a target object with a laser beam. Therefore, at least part of the time, the throughput can be improved by simultaneously operating the first laser processing head and the second laser processing head.

In addition, in this laser processing device, the control unit sets at least a part of the processing conditions of the target object by the laser beam from the first laser processing head and the processing conditions of the object by the laser beam from the second laser processing head independently of each other. Information for accepting input for setting is displayed in the input accepting part. Therefore, the first laser processing head and the second laser processing head and the second laser processing head do not cause a difference in the processing quality of laser processing of the object by the first laser processing head and the second laser processing head, respectively. By setting processing conditions for each of the laser processing heads, a decrease in processing quality can be suppressed.

In the laser processing device according to one aspect of the present disclosure, the control unit inputs a correction amount from the reference of the processing conditions of the second laser processing head when the processing conditions of the first laser processing head are used as the standard in display processing It is also okay to display the information to be received on the input reception unit. In this case, input for suppressing the train of the laser processing head becomes easy.

The laser processing device according to one aspect of the present disclosure further includes a first movement mechanism for moving the first laser processing head and the second laser processing head along the first and second directions, respectively, and the control unit , The movement of the first laser processing head and the second laser processing head by the first movement mechanism is controlled, and the first movement mechanism extends along the first direction, and the first laser processing head is attached thereto, and the first movement mechanism extends along the first direction. A first moving part for moving the laser processing head along the first direction, extending along the first direction and a second laser processing head are mounted thereon, and for moving the second laser processing head along the first direction The second moving part and the third moving part extending along the second direction and having the first moving part and the second moving part attached thereto and moving each of the first moving part and the second moving part along the second direction. and, in the display process, the control unit comprises a displacement amount of a second movement line representing the movement of the second laser processing head along the first direction by the second moving unit from the reference line along the first direction to the second direction. Information for accepting the input of the correction amount for ? may be displayed on the input accepting unit. In this way, as an example of the correction amount of the train of the laser processing head, the shift amount described above can be used.

According to one aspect of the present disclosure, it is possible to provide a laser processing apparatus capable of suppressing deterioration in processing quality while improving throughput.

1 is a plan view of a laser processing device according to an embodiment.
FIG. 2 is a partial side view of the laser processing apparatus shown in FIG. 1 .
FIG. 3 is a front view of a laser processing head of the laser processing apparatus shown in FIG. 1 .
Fig. 4 is a side view of the laser processing head shown in Fig. 3;
FIG. 5 is a configuration diagram of an optical system of the laser processing head shown in FIG. 3 .
6 is a configuration diagram of an optical system of a laser processing head of a modified example.
7 is a configuration diagram of an optical system of a laser processing head of a modified example.
8 is a schematic top view showing the operation of the laser processing device.
9 is a schematic top view showing the operation of the laser processing device.
10 is a schematic top view showing the operation of the laser processing device.
Fig. 11 is a schematic plan view for explaining eccentricity correction.
12 is a schematic plan view for explaining eccentricity correction.
Fig. 13 is a schematic plan view for explaining eccentricity correction.
Fig. 14 is a schematic plan view for explaining eccentricity correction.
15 is a schematic plan view for explaining eccentricity correction.
16 is a schematic plan view for explaining a modified example of eccentricity correction.
Fig. 17 is a diagram showing processing results when processing is performed using two laser processing heads under the same processing conditions.
Fig. 18 is a diagram showing processing results when processing is performed using two laser processing heads under the same processing conditions.
19 is a table showing specific examples of processing conditions.
Fig. 20 is a diagram showing an example of an input screen displayed by an input acceptor.
21 is a diagram showing an example of information for accepting an input of a correction amount.
22 is a diagram showing an example of information for accepting an input of a correction amount.
23 is a table showing processing conditions before and after performing train correction.
Fig. 24 is a photograph of a cut surface showing a machining result when machining is actually performed through train correction.

Hereinafter, an embodiment of one aspect of the present disclosure will be described in detail with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same or equivalent part about each figure, and overlapping description is abbreviate|omitted. In addition, in each drawing, there is a case where a Cartesian coordinate system defined by the X-axis, Y-axis, and Z-axis is shown. The X direction is an example of the first direction and is the first horizontal direction. The Y direction is an example of a second direction crossing the first direction, and is a second horizontal direction. The Z direction is an example of a third direction crossing the first and second directions, and is a vertical direction.

[Configuration of laser processing equipment]

As shown in Figs. 1 and 2, the laser processing apparatus 1 includes a moving mechanism 5 (second moving mechanism), a moving mechanism 6 (first moving mechanism), a support part 7, and a light source. A unit 8, a control unit 9, a laser processing head 10A (1st laser processing head), a laser processing head 10B (2nd laser processing head), and a pair of cameras AC are provided.

The moving mechanism 5 has a fixed part 51, a moving part 53, and a mounting part 55. The fixing part 51 is attached to the device frame 1a. The moving part 53 is attached to the rail provided in the fixed part 51, and can move along the Y direction. The attachment part 55 is attached to the rail provided in the moving part 53, and is movable along the X direction. The support portion 7 is attached to a rotational shaft provided in the mounting portion 55 and can rotate around an axis parallel to the Z direction. That is, the movement mechanism 5 has a function for moving the support part 7 along the X direction and the Y direction, and a function for rotating it around an axis along the Z direction.

The moving mechanism 6 includes a pair of Y-axis moving parts (third moving parts) 61, X-axis moving parts (first moving parts) 62A, and X-axis moving parts (second moving parts) 62B. , Z-axis moving parts 63 and 64, and mounting parts 65, 66, 67A and 67B. A pair of Y-axis moving parts 61 are disposed facing each other in the X direction and extend along the Y direction (here substantially parallel). 62 A of X-axis moving parts extend along the X direction, and are attached to the rail provided in the Y-axis moving part 61 via the attachment part 67A at both ends of the X direction. That is, the X-axis moving part 62A is supported across a pair of Y-axis moving parts 61 . Thereby, 62 A of X-axis moving parts are movable along the Y direction by the Y-axis moving part 61. That is, the Y-axis moving unit 61 has a function for moving the X-axis moving unit 62A in the Y direction.

The Z-axis moving part 63 extends along the Z direction and is attached to a rail provided on the X-axis moving part 62A. Thereby, the Z-axis moving part 63 is movable along the X direction by the X-axis moving part 62A. A laser processing head 10A is attached to the Z-axis moving unit 63 via a mounting unit 65 . Therefore, 62 A of X-axis moving parts have a function for moving the laser processing head 10A along the X direction for every Z-axis moving part 63. The laser processing head 10A is attached to a rail provided in the Z-axis moving portion 63 via a mounting portion 65 . Thereby, 10 A of laser processing heads are movable along the Z direction by the Z-axis moving part 63. That is, the Z-axis moving unit 63 has a function for moving the laser processing head 10A along the Z direction. In this way, the moving mechanism 6 holds the laser processing head 10A so as to be movable three-dimensionally along the X direction, the Y direction, and the Z direction.

The X-axis moving part 62B extends along the X direction, and is attached to the rail provided in the Y-axis moving part 61 via the attaching part 67B at both ends of the X direction. That is, the X-axis moving part 62B is supported across a pair of Y-axis moving parts 61 . Thereby, the X-axis moving part 62B is movable along the Y direction by the Y-axis moving part 61. That is, the Y-axis moving unit 61 has a function for moving the X-axis moving unit 62B in the Y direction.

The Z-axis moving part 64 extends along the Z direction and is attached to a rail provided on the X-axis moving part 62B. Thereby, the Z-axis moving part 64 is movable along the X direction by the X-axis moving part 62B. A laser processing head 10B is attached to the Z-axis moving unit 64 via a mounting unit 66 . Therefore, the X-axis moving part 62B has a function for moving the laser processing head 10B along the X direction for each Z-axis moving part 64 . The laser processing head 10B is attached to a rail provided in the Z-axis moving portion 64 via a mounting portion 66 . Thereby, the laser processing head 10B is movable along the Z direction by the Z-axis moving part 64 . That is, the Z-axis moving unit 64 has a function for moving the laser processing head 10A along the Z direction. In this way, the moving mechanism 6 holds the laser processing head 10B so that it can move three-dimensionally along the X direction, the Y direction, and the Z direction.

As described above, the support portion 7 is attached to a rotating shaft provided in the mounting portion 55 of the moving mechanism 5, and can rotate with an axis parallel to the Z direction as a center line. That is, the support part 7 can move along each of the X direction and the Y direction, and can rotate about the axis parallel to the Z direction as a center line. The support part 7 supports the target object 100 along the X direction and the Y direction. The object 100 is, for example, a wafer.

The laser processing head 10A is for irradiating the laser beam L1 with respect to the target object 100 supported by the support portion 7 in a state facing the support portion 7 in the Z direction. The laser processing head 10B is for irradiating the laser beam L2 to the object 100 supported by the support 7 in a state facing the support 7 in the Z direction.

The pair of cameras AC have different magnifications and are for capturing an image of the object 100 supported by the support 7 in a state facing the support 7 in the Z direction. The camera AC is attached to the Z-axis moving part 63 via the attaching part 65 together with the laser processing head 10A as an example. The camera AC can image, for example, the device pattern of the object 100, the modified region, and the formation state of cracks extending from the modified region using light passing through the target object 100. The image obtained by the camera AC is provided, for example, for alignment of the irradiation position of the laser beams L1 and L2 with respect to the target object 100 and adjustment of the irradiation conditions of the laser beams L1 and L2.

The light source unit 8 has a pair of light sources 81 and 82 . The light source 81 outputs the laser beam L1. The laser light L1 is emitted from the emitting part 81a of the light source 81, and is guided to the laser processing head 10A by the optical fiber 2. That is, the optical fiber 2 for introducing the laser beam L1 output from the light source 81 is connected to the laser processing head 10A. The light source 82 outputs the laser beam L2. The laser light L2 is emitted from the emitting part 82a of the light source 82, and is guided to the laser processing head 10B by another optical fiber 2. That is, the optical fiber 2 for introducing the laser beam L2 output from the light source 82 is provided in the laser processing head 10B.

The controller 9 controls each part of the laser processing device 1 (a plurality of moving mechanisms 5 and 6, laser processing heads 10A and 10B, a camera AC, and a light source unit 8, etc.) do. The control unit 9 has a processing unit 91, a storage unit 92, and an input accepting unit 93. The processing unit 91 is configured as a computer device including a processor, memory, storage and communication device and the like. In the processing unit 91, the processor executes the software (program) read into the memory or the like to control reading and writing of data in the memory and storage and communication by the communication device. The storage unit 92 is, for example, a hard disk or the like, and stores various kinds of data. The input acceptance unit 93 is an interface unit that displays various types of information and accepts input of various types of information from the user. In this embodiment, the input accepting unit 93 constitutes a GUI (Graphical User Interface).

An example of processing by the laser processing apparatus 1 configured as described above will be described. An example of the processing is an example in which a modified region is formed inside the object 100 along a plurality of lines set in a lattice shape in order to cut the object 100, which is a wafer, into a plurality of chips.

First, the moving mechanism 5 moves the support 7 along the X and Y directions, respectively, so that the support 7 supporting the object 100 faces the pair of laser processing heads 10A and 10B in the Z direction. ) to move. Next, the moving mechanism 5 rotates the support part 7 with the axis parallel to the Z direction as the center line so that a plurality of lines extending in one direction from the object 100 follow the X direction. Thereby, a plurality of lines (line C shown in FIG. 1 ) are set in the target object 100 while extending along the X direction and arranged along the Y direction.

Next, the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the converging point of the laser beam L1 is located on one line extending in one direction. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the converging point of the laser beam L2 is located on another line extending in one direction. Next, the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the convergence point of the laser beam L1 is located inside the target object 100 . On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the convergence point of the laser beam L2 is located inside the target object 100 .

Next, the light source 81 outputs the laser light L1, the laser processing head 10A irradiates the target object 100 with the laser light L1, and the light source 82 outputs the laser light L2. Thus, the laser processing head 10B irradiates the laser beam L2 to the object 100 . In addition to that, the light convergence point of the laser beam L1 moves relatively along one line extending in one direction (the laser beam L1 is scanned), and further along another line extending in one direction, the laser beam L2 While the moving mechanism 5 moves the support part 7 along the X direction so that the light converging point of ) moves relatively (so that the laser beam L2 is scanned), the moving mechanism 6 moves the X direction. Therefore, the laser processing heads 10A and 10B are moved in the opposite direction to the support portion 7 . In this way, the laser processing apparatus 1 forms a modified region at least inside the object 100 along each of a plurality of lines extending in one direction in the object 100 .

Next, the moving mechanism 5 rotates the support part 7 with the axis parallel to the Z direction as the center line so that a plurality of lines extending from the object 100 in another direction orthogonal to one direction follow the X direction . Thereby, a plurality of other lines (lines C shown in FIG. 1 ) are set in the target object 100 while extending along the X direction and arranged along the Y direction.

Next, the moving mechanism 6 moves the laser processing head 10A along the Y direction so that the converging point of the laser beam L1 is located on one line extending in the other direction. On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Y direction so that the converging point of the laser beam L2 is located on another line extending in the other direction. Next, the moving mechanism 6 moves the laser processing head 10A along the Z direction so that the convergence point of the laser beam L1 is located inside the target object 100 . On the other hand, the moving mechanism 6 moves the laser processing head 10B along the Z direction so that the convergence point of the laser beam L2 is located inside the target object 100 .

Next, the light source 81 outputs the laser light L1, the laser processing head 10A irradiates the target object 100 with the laser light L1, and the light source 82 outputs the laser light L2. Thus, the laser processing head 10B irradiates the laser beam L2 to the object 100 . In addition, the convergence point of the laser beam L1 moves relatively along one line extending in the other direction (the laser beam L1 is scanned), and the laser beam along another line extending in the other direction. While the moving mechanism 5 moves the support part 7 along the X direction so that the light converging point of (L2) moves relatively (so that the laser beam L2 is scanned), the moving mechanism 6 moves the X Along the direction, the laser processing heads 10A and 10B are moved in the opposite direction to the support portion 7 . In this way, the laser processing apparatus 1 forms a modified region at least inside the object 100 along each of a plurality of lines extending in another direction orthogonal to one direction in the object 100 .

In addition, in the example of the processing described above, the light source 81 outputs the laser light L1 having transparency to the target object 100 by, for example, a pulse oscillation method, and the light source 82, for example, For example, the laser light L2 having transparency to the target object 100 is outputted by the pulse oscillation method. When such laser light is condensed inside the object 100, the laser light is particularly absorbed at a portion corresponding to the convergence point of the laser light, and a modified region is formed inside the object 100. The modified region is a region different from the surrounding unmodified region in density, refractive index, mechanical strength, and other physical properties. Examples of the modified region include a melted region, a crack region, a dielectric breakdown region, and a refractive index change region.

When the target object 100 is irradiated with the laser beam output by the pulse oscillation method and the convergence point of the laser beam is relatively moved along the line set in the target object 100, a plurality of modified spots are formed so as to line up in a row along the line. do. One modified spot is formed by irradiation of one pulse of laser light. A modified region in a row is a set of a plurality of modified spots arranged in a row. Modified spots adjacent to each other may be connected to each other or separated from each other depending on the relative movement speed of the convergence point of the laser beam with respect to the object 100 and the repetition frequency of the laser beam.

[Configuration of the laser processing head]

Subsequently, the configuration of the laser processing head will be described in detail. As shown in FIGS. 3 and 4 , the laser processing head 10A includes a housing 11, an incident part 12, a laser beam adjustment part 13, and a light collecting part 14. . The housing 11 has a first wall portion 21 and a second wall portion 22, a third wall portion 23 and a fourth wall portion 24, and a fifth wall portion 25 and a sixth wall portion 26. there is. The 1st wall part 21 and the 2nd wall part 22 oppose each other in the X direction. The 3rd wall part 23 and the 4th wall part 24 oppose each other in the Y direction. The fifth wall portion 25 and the sixth wall portion 26 face each other in the Z direction.

The distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22 . The distance between the first wall portion 21 and the second wall portion 22 is smaller than the distance between the fifth wall portion 25 and the sixth wall portion 26 . In addition, the distance between the 1st wall part 21 and the 2nd wall part 22 may be the same as the distance between the 5th wall part 25 and the 6th wall part 26, or the 5th wall part 25 and the 6th wall part It may be greater than the distance to (26).

In the laser processing head 10A, the first wall portion 21 is located on the opposite side to the Y-axis moving portion 61 of the moving mechanism 6, and the second wall portion 22 is the Y-axis moving portion 61 located on the side. The 3rd wall part 23 is located on the side of the attachment part 65 of the moving mechanism 6, and the 4th wall part 24 is located on the side opposite to the attachment part 65, but is located on the side of the laser processing head 10B (FIG. 2). That is, the 4th wall part 24 is an opposing wall part which opposes the housing (2nd housing) of the laser processing head 10B along the Y direction. The fifth wall portion 25 is located on the side opposite to the support portion 7, and the sixth wall portion 26 is located on the support portion 7 side.

The housing 11 is configured so that the housing 11 is mounted on the mounting portion 65 in a state where the third wall portion 23 is disposed on the side of the mounting portion 65 of the moving mechanism 6 . Specifically, it is as follows. The mounting portion 65 has a base plate 65a and a mounting plate 65b. The base plate 65a is attached to a rail provided on the Z-axis moving part 63 (see Fig. 2). The mounting plate 65b is erected at an end portion of the base plate 65a on the side of the laser processing head 10B (see Fig. 2). The housing 11 is attached to the mounting portion 65 by screwing the bolt 28 to the mounting plate 65b through the pedestal 27 in a state where the third wall portion 23 is in contact with the mounting plate 65b. is fitted The pedestal 27 is provided on each of the first wall portion 21 and the second wall portion 22 . The housing 11 is detachable from the mounting portion 65 .

The incident part 12 is disposed on the fifth wall part 25 . The incident part 12 injects the laser light L1 into the housing 11 . The incident portion 12 is biased toward the first wall portion 21 in the X direction, and biased toward the fourth wall portion 24 in the Y direction. That is, the distance between the incident part 12 and the first wall part 21 in the X direction is smaller than the distance between the incident part 12 and the second wall part 22 in the X direction, and the incident part 12 in the Y direction. ) and the fourth wall portion 24 is smaller than the distance between the incident portion 12 and the third wall portion 23 in the X direction.

The exit end 2a of the optical fiber 2 is connected to the entrance section 12 . Specifically, the incident portion 12 is a portion including the hole 25a formed in the fifth wall portion 25 . A mounting portion 25b is provided on the fifth wall portion 25 . The main body portion 2b of the exit end portion 2a is attached to the mounting portion 25b by bolts or the like. In this state, the distal end 2c of the exit end 2a is inserted through the hole 25a. With this, the exit end 2a of the optical fiber 2 can be attached or detached from the entrance section 12 . Between the 5th wall part 25 and the body part 2b, the cover 25c is arrange|positioned. The cover 25c covers the gap formed between the hole 25a and the tip portion 2c. As an example, at the exit end portion 2a, an isolator for suppressing return light is disposed within the body portion 2b, and a collimator lens for collimating the laser beam L1 is disposed within the tip portion 2c. In addition, the entering part 12 may be a connector or the like configured so that the output end 2a of the optical fiber 2 is connectable.

The laser beam adjustment unit 13 is disposed within the housing 11 . The laser beam adjustment unit 13 adjusts the laser beam L1 incident from the incident unit 12 . The laser beam adjustment unit 13 is disposed on the fourth wall portion 24 side with respect to the partition wall portion 29 within the housing 11 . The laser beam adjustment unit 13 is attached to the partition wall unit 29 . The partition wall part 29 is provided in the housing 11, and divides the area|region in the housing 11 into the area|region on the 3rd wall part 23 side, and the area|region on the 4th wall part 24 side. The partition wall portion 29 is constituted as a part of the housing 11 . Each component of the laser beam adjustment unit 13 is attached to the partition wall unit 29 from the fourth wall unit 24 side. The partition wall portion 29 functions as an optical base supporting each configuration of the laser beam adjusting portion 13 .

The light collecting part 14 is disposed on the sixth wall part 26 . Specifically, the light concentrating portion 14 is disposed on the sixth wall portion 26 in a state of being inserted through the hole 26a formed in the sixth wall portion 26 . The condensing unit 14 condenses the laser beam L1 adjusted by the laser beam adjusting unit 13 and emits it out of the housing 11 . The light collecting portion 14 is biased toward the second wall portion 22 side (one wall portion side) in the X direction, and is biased toward the fourth wall portion 24 side in the Y direction. That is, the light concentrating portion 14 is disposed biased toward the fourth wall portion (opposite wall portion) 24 side of the housing 11 as viewed in the Z direction. That is, the distance between the light concentrating portion 14 and the second wall portion 22 in the X direction is smaller than the distance between the light concentrating portion 14 and the first wall portion 21 in the X direction, and the light concentrating portion 14 in the Y direction. ) and the fourth wall portion 24 is smaller than the distance between the light collecting portion 14 and the third wall portion 23 in the X direction.

As shown in FIG. 5 , the laser beam adjusting unit 13 includes a reflecting unit (first reflecting unit) 31 , an attenuator 32 and an optical axis adjusting unit 33 . The reflector 31, the attenuator 32, and the optical axis adjustment unit 33 are arranged on a first straight line A1 extending along the X direction. The reflection part 31 faces the incident part 12 in the Z direction. That is, the reflector 31 faces the exit end 2a of the optical fiber 2 in the Z direction. The reflection part 31 reflects the laser light L1 incident from the incident part 12 toward the second wall part 22 side. The reflector 31 is, for example, a mirror or a prism. The attenuator 32 adjusts the output of the laser beam L1 reflected by the reflector 31 . The optical axis adjuster 33 reflects the laser beam L1 whose output is adjusted by the attenuator 32 toward the sixth wall portion 26 .

The optical axis adjustment unit 33 is a unit for adjusting the optical axis of the laser beam L1 incident from the incident unit 12 . In this embodiment, the optical axis adjusting unit 33 includes a first steering mirror 331 , a reflecting member 332 , and a second steering mirror 333 .

The first steering mirror 331 is disposed on the first straight line A1. The first steering mirror 331 is constituted by a mirror 331a and a holder 331b. The mirror 331a is attached to the holder 331b. The holder 331b is attached to the partition wall portion 29 . The holder 331b holds the mirror 331a so that the direction of the mirror 331a can be adjusted. The first steering mirror 331 reflects the laser light L1, the output of which is adjusted by the attenuator 32, toward the sixth wall portion 26.

The reflection member 332 reflects the laser light L1 reflected by the first steering mirror 331 toward the second wall portion 22 side. The reflecting member 332 is, for example, a mirror or a prism.

The second steering mirror 333 is disposed on the second straight line A2. The second steering mirror 333 is constituted by a mirror 333a and a holder 333b. The mirror 333a is attached to the holder 333b. The holder 333b is attached to the partition wall portion 29 . The holder 333b holds the mirror 333a so that the direction of the mirror 333a can be adjusted. The second steering mirror 333 reflects the laser beam L1 reflected by the reflecting member 332 toward the sixth wall portion 26 .

As an example, access to each of the holders 331b and 333b is possible with a tool through an opening (not shown) with a lid formed in the second wall portion 22 . Thereby, by operating the tool while viewing an image or the like acquired by the observation unit 17 described later, the optical axis of the laser beam L1 incident on the light collecting unit 14 coincides with the optical axis of the light collecting unit 14, The direction of each mirror 331a, 333a can be adjusted.

The laser beam adjusting unit 13 further includes a beam expander 34 and a reflecting unit (second reflecting unit) 35 . The optical axis adjusting unit 33, the beam expander 34, and the reflecting unit 35 are arranged on a second straight line A2 extending along the Z direction. The beam expander 34 expands the diameter of the laser beam L1 reflected by the optical axis adjustment unit 33 . The reflector 35 reflects the laser beam L1 whose diameter has been enlarged by the beam expander 34 toward the fifth wall portion 25 side as well as toward the first wall portion 21 side. The reflector 35 is, for example, a mirror or a prism.

The laser beam adjustment unit 13 further includes a reflective spatial light modulator 36 and an imaging optical system 37 . The reflective spatial light modulator 36, the imaging optical system 37, and the condensing unit 14 are arranged on a third straight line A3 extending along the Z direction. The reflective spatial light modulator 36 modulates the laser light L1 reflected by the reflector 35 and reflects it toward the sixth wall portion 26 . The reflective spatial light modulator 36 is, for example, a reflective liquid crystal (LCOS: liquid, crystal, on, silicon) spatial light modulator (SLM: Spatial Light Modulator). The imaging optical system 37 constitutes a bilateral telecentric optical system in which the reflective surface 36a of the reflective spatial light modulator 36 and the entrance pupil surface 14a of the condenser 14 are in an imaging relationship. The imaging optical system 37 is constituted by three or more lenses.

The 1st straight line A1, the 2nd straight line A2, and the 3rd straight line A3 are located on the plane perpendicular|vertical to the Y direction. The second straight line A2 is located on the side of the second wall portion 22 with respect to the third straight line A3. In the laser processing head 10A, the laser beam L1 incident from the incident part 12 into the housing 11 along the Z direction is reflected by the reflecting part 31 and travels along the first straight line A1. do. The laser beam L1 traveling along the first straight line A1 is reflected by the optical axis adjustment unit 33 and travels along the second straight line A2. The laser light L1 traveling along the second straight line A2 is sequentially reflected by the reflector 35 and the reflective spatial light modulator 36 and travels along the third straight line A3. The laser beam L1 traveling on the third straight line A3 is emitted out of the housing 11 from the condensing unit 14 along the Z direction.

The laser processing head 10A further includes a dichroic mirror 15, a measurement unit 16, an observation unit 17, a drive unit 18, and a circuit unit 19.

The dichroic mirror 15 is disposed between the imaging optical system 37 and the condensing unit 14 on the third straight line A3. That is, the dichroic mirror 15 is disposed between the laser beam adjusting unit 13 and the condensing unit 14 within the housing 11 . The dichroic mirror 15 is attached to the partition wall portion 29 from the fourth wall portion 24 side. The dichroic mirror 15 transmits the laser beam L1. From the viewpoint of suppressing astigmatism, the dichroic mirror 15 is preferably a cube shape or two plate shapes arranged so as to have a torsional relationship, for example.

The measurement part 16 is arrange|positioned in the housing 11 on the 1st wall part 21 side with respect to the 3rd straight line A3. That is, the measurement unit 16 is disposed on the first wall portion 21 side with respect to the light collecting unit 14 in the X direction. The measurement part 16 is attached to the partition wall part 29 from the 4th wall part 24 side. The measurement unit 16 outputs measurement light L10 for measuring the distance between the surface of the object 100 (for example, the surface on the side where the laser beam L1 is incident) and the light collecting unit 14, , Through the concentrating unit 14, the measurement light L10 reflected from the surface of the object 100 is detected. That is, the measurement light L10 output from the measurement unit 16 is irradiated to the surface of the object 100 via the light collecting unit 14, and the measurement light L10 reflected from the surface of the object 100 is, It is detected by the measuring unit 16 via the light collecting unit 14 .

More specifically, the measurement light L10 output from the measurement unit 16 is transmitted to the beam splitter 20 and the dichroic mirror 15 attached to the partition wall unit 29 from the fourth wall unit 24 side. The light is sequentially reflected from the light concentrator 14 and emitted out of the housing 11. The measurement light L10 reflected from the surface of the object 100 is incident from the light collecting unit 14 into the housing 11 and is sequentially reflected by the dichroic mirror 15 and the beam splitter 20, and the measuring unit (16) and is detected by the measuring unit (16).

The observation part 17 is arranged in the housing 11 on the side of the first wall part 21 with respect to the third straight line A3. That is, the observation unit 17 is disposed on the first wall portion 21 side with respect to the light collecting unit 14 in the X direction. The observation part 17 is attached to the partition wall part 29 from the 4th wall part 24 side. The observation unit 17 outputs observation light L20 for observing the surface of the object 100 (for example, the surface on the side where the laser beam L1 is incident), and passes through the light collecting unit 14, Observation light L20 reflected from the surface of the object 100 is detected. That is, the observation light L20 output from the observation unit 17 is irradiated to the surface of the object 100 via the light collecting unit 14, and the observation light L20 reflected from the surface of the object 100 is It is detected by the observation unit 17 via the miner 14.

More specifically, the observation light L20 output from the observation unit 17 is transmitted through the beam splitter 20, reflected by the dichroic mirror 15, and emitted from the light collecting unit 14 to the outside of the housing 11. do. Observation light L20 reflected from the surface of the object 100 is incident in the housing 11 from the condensing unit 14, reflected by the dichroic mirror 15, and transmitted through the beam splitter 20 to the observation unit ( 17) and is detected by the observation unit 17. In addition, the respective wavelengths of the laser light L1, the measurement light L10, and the observation light L20 are different from each other (at least the respective center wavelengths are shifted from each other).

The drive part 18 is attached to the partition wall part 29 from the 4th wall part 24 side. The driving unit 18 moves the light collecting unit 14 disposed on the sixth wall 26 along the Z direction by, for example, a driving force of a piezoelectric element.

The circuit portion 19 is arranged on the side of the third wall portion 23 with respect to the partition wall portion 29 within the housing 11 . That is, the circuit part 19 is arranged on the third wall part 23 side with respect to the laser beam adjustment part 13, the measuring part 16, and the observation part 17 in the housing 11. The circuit section 19 is separated from the partition wall section 29 . The circuit section 19 is, for example, a plurality of circuit boards. The circuit unit 19 processes a signal output from the measuring unit 16 and a signal input to the reflective spatial light modulator 36 . The circuit unit 19 controls the drive unit 18 based on the signal output from the measuring unit 16 . As an example, the circuit unit 19, based on the signal output from the measurement unit 16, maintains a constant distance between the surface of the object 100 and the light collecting unit 14 (ie, the surface of the object 100 and The driving unit 18 is controlled so that the distance from the converging point of the laser light L1 is kept constant.

Further, in the partition wall portion 29, there is a notch through which wires for electrically connecting each of the measuring unit 16, the observation unit 17, the driving unit 18, and the reflective spatial light modulator 36 and the circuit unit 19 pass. , holes, etc. (not shown) are formed. Further, the housing 11 is provided with a connector (not shown) to which wires or the like for electrically connecting the circuit portion 19 and the control portion 9 (see Fig. 1) are connected.

Like the laser processing head 10A, the laser processing head 10B includes a housing 11, an incident part 12, a laser beam adjustment unit 13, a condensing unit 14, and a dichroic mirror ( 15), a measurement unit 16, an observation unit 17, a driving unit 18, and a circuit unit 19. However, each configuration of the laser processing head 10B, as shown in FIG. 2, passes through the midpoint between the pair of mounting parts 65 and 66 and is perpendicular to the Y direction, with respect to the virtual plane, the laser processing head It is arrange|positioned so that it may have a relationship of plane symmetry with each structure of (10A).

For example, as for the housing 11 of the laser processing head 10A, the 4th wall part 24 is located on the laser processing head 10B side with respect to the 3rd wall part 23, and the 6th wall part 26 is 1st It is attached to the mounting portion 65 so as to be located on the support portion 7 side with respect to the five-wall portion 25. On the other hand, in the housing 11 of the laser processing head 10B, the fourth wall portion 24 is located on the laser processing head 10A side with respect to the third wall portion 23, and the sixth wall portion 26 is It is attached to the mounting portion 66 so as to be located on the support portion 7 side with respect to the five-wall portion 25.

The housing 11 of the laser processing head 10B is configured so that the housing 11 is attached to the mounting portion 66 in a state where the third wall portion 23 is disposed on the mounting portion 66 side. Specifically, it is as follows. The mounting portion 66 has a base plate 66a and a mounting plate 66b. The base plate 66a is attached to a rail provided on the Z-axis moving part 63 . The mounting plate 66b is erected at an end portion of the base plate 66a on the side of the laser processing head 10A. The housing 11 of the laser processing head 10B is mounted on the mounting portion 66 with the third wall portion 23 in contact with the mounting plate 66b. The housing 11 of the laser processing head 10B is detachable from the mounting portion 66 .

[Operation and effect of laser processing head]

In the laser processing head 10A, on the optical path of the laser light L1 from the incident part 12 to the light collecting part 14, for adjusting the optical axis of the laser light L1 incident from the incident part 12 An optical axis adjustment unit 33 is disposed. By this, for example, for maintenance or the like, the exit end 2a of the optical fiber 2 is removed from the housing 11, and the exit end 2a of the optical fiber 2 is again inserted into the entrance part 12. When connected, the optical axis of the laser beam L1 incident on the condensing section 14 can be aligned with the optical axis of the condensing section 14. In addition, the incident portion 12 is biased toward the first wall portion 21 side of the housing 11 in the X direction, and the light collecting portion 14 is biased toward the second wall portion 22 side of the housing 11 in the X direction. This makes it possible to suppress the lengthening of the optical path of the laser light L1 from the incident part 12 to the optical axis adjustment part 33, and as a result, the laser light L1 incident on the condensing part 14 It is possible to suppress deviation of the optical axis from the optical axis of the concentrating unit 14 . Therefore, according to the laser processing head 10A, the laser beam L1 can be accurately condensed.

In addition, in the laser processing head 10A, the incident part 12 is disposed on the fifth wall part 25 of the housing 11, and in the laser beam adjusting part 13, the optical axis adjusting part 33 is the reflecting part ( 31) and the rear end of the attenuator 32 (downstream in the traveling direction of the laser light L1), furthermore, the beam expander 34, the reflector 35, the reflective spatial light modulator 36, and the imaging optical system ( 37) (on the upstream side in the traveling direction of the laser light L1). It is disposed in front of the beam expander 34, the reflector 35, the reflective spatial light modulator 36, and the imaging optical system 37 (on the upstream side in the traveling direction of the laser light L1). As a result, the "beam expander 34, reflector 35, reflective spatial light modulator 36, imaging optical system 37, and condenser 14", which are components related to the shaping of the laser light L1, Since the optical axis of the incident laser light L1 can be adjusted, the laser light L1 can be focused more precisely. In addition, the incident part 12 is arranged on the fifth wall part 25, and in the laser beam adjusting part 13, the attenuator 32 is arranged between the reflecting part 31 and the optical axis adjusting part 33. . This makes it possible to suppress the size of the housing 11 due to the application of the attenuator 32 .

Moreover, in the laser processing head 10A, since the light source which outputs the laser beam L1 is not provided in the housing 11, the housing 11 can be downsized. Further, in the housing 11, the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22, and disposed on the sixth wall portion 26. The light concentrating portion 14 is biased toward the fourth wall portion 24 in the Y direction. As a result, when the housing 11 is moved along the Y direction in which the third wall portion 23 and the fourth wall portion 24 oppose each other, for example, another configuration on the fourth wall portion 24 side ( For example, even if the laser processing head 10B) exists, the light condensing part 14 can be made close to the said other structure. Moreover, since the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22, the third wall portion 23 and the fourth wall portion 24 When moving the housing 11 along the mutually opposing Y direction, the space occupied by the housing 11 can be reduced. In addition, since the incident part 12 and the light collecting part 14 are biased toward the fourth wall part 24 side in the Y direction, the third wall part 23 side with respect to the laser beam adjusting part 13 in the area within the housing 11 The area can be effectively used, such as disposing another configuration (for example, the circuit section 19) in the area of .

Moreover, in the laser processing head 10A, the circuit part 19 is arrange|positioned in the housing 11 on the 3rd wall part 23 side with respect to the laser beam adjustment part 13. Thereby, the area|region on the side of the 3rd wall part 23 with respect to the laser beam adjusting part 13 of the area|region in the housing 11 can be utilized effectively.

In addition, in the laser processing head 10A, the laser beam adjustment unit 13 is disposed on the side of the fourth wall portion 24 with respect to the partition wall portion 29 in the housing 11, and the circuit portion 19, Inside the housing 11, it is arrange|positioned on the side of the 3rd wall part 23 with respect to the partition wall part 29. This makes it difficult for heat generated in the circuit portion 19 to be transmitted to the laser beam adjusting portion 13, and therefore deformation of the laser beam adjusting portion 13 due to heat generated in the circuit portion 19 can be suppressed. , the laser light L1 can be appropriately adjusted. Moreover, the circuit part 19 can be efficiently cooled in the area|region on the side of the 3rd wall part 23 among the area|region in the housing 11 by air cooling, water cooling, etc., for example.

Moreover, in the laser processing head 10A, the laser beam adjustment part 13 is attached to the partition wall part 29. Thereby, the laser beam adjustment part 13 can be supported reliably and stably within the housing 11.

Moreover, in the laser processing head 10A, the circuit part 19 is separated from the partition wall part 29. Accordingly, it is possible to more reliably suppress heat generated in the circuit portion 19 from being transmitted to the laser beam adjusting portion 13 via the partition wall portion 29 .

In addition, in the laser processing head 10A, the measurement unit 16 and the observation unit 17 are arranged in an area on the side of the first wall portion 21 with respect to the light condensing unit 14 among the areas within the housing 11, The circuit section 19 is arranged on the side of the third wall section 23 with respect to the laser beam adjustment section 13 in the area within the housing 11, and the dichroic mirror 15 is positioned within the housing 11 to the laser beam. It is disposed between the adjustment unit 13 and the light collecting unit 14. In this way, the area within the housing 11 can be used effectively. Further, in the laser processing apparatus 1, processing based on the measurement result of the distance between the surface of the object 100 and the light concentrating portion 14 becomes possible. Moreover, in the laser processing apparatus 1, processing based on the observation result of the surface of the object 100 becomes possible.

Moreover, in the laser processing head 10A, the circuit part 19 controls the drive part 18 based on the signal output from the measurement part 16. Thereby, the position of the light condensing point of the laser light L1 can be adjusted based on the measurement result of the distance between the surface of the target object 100 and the light condensing part 14 .

The above actions and effects are similarly exhibited by the laser processing head 10B.

In addition, in the laser processing apparatus 1, since the laser beam L1 is precisely focused by the respective laser processing heads 10A and 10B, the object 100 can be processed efficiently and with high accuracy.

Moreover, in the laser processing apparatus 1, each of a pair of mounting parts 65 and 66 moves along each of the Y direction and the Z direction. In this way, the object 100 can be processed more efficiently.

Moreover, in the laser processing apparatus 1, the support part 7 moves along each of the X direction and the Y direction, and rotates about the axis line parallel to the Z direction as a center line. In this way, the object 100 can be processed more efficiently.

[Modified example of laser processing head]

As shown in FIG. 6 , the incident part 12 is disposed on the first wall part 21 of the housing 11, and in the laser beam adjusting part 13, the optical axis adjusting part 33 is the attenuator 32 ), and may be disposed at the front end of the beam expander 34, the reflector 35, the reflective spatial light modulator 36, and the imaging optical system 37. In the laser processing head 10A shown in FIG. 6 , the incident unit 12, the attenuator 32, and the optical axis adjustment unit 33 (specifically, the first steering mirror 331 of the optical axis adjustment unit 33) , It is arranged on the 1st straight line A1 (Otherwise, it is the same as the laser processing head 10A shown in FIG. 5). In the laser processing head 10A shown in FIG. 6 , the attenuator 32 adjusts the output of the laser beam L1 incident from the incident part 12 . According to this, "the beam expander 34, the reflector 35, the reflective spatial light modulator 36, the imaging optical system 37, and the condenser 14", which are components related to the shaping of the laser light L1, Since the optical axis of the incident laser light L1 can be adjusted, the laser light L1 can be focused more precisely. In addition, since the attenuator 32 is disposed between the incident part 12 and the optical axis adjusting part 33, the size of the housing 11 due to the application of the attenuator 32 can be suppressed. Moreover, the height reduction of the laser processing apparatus 1 can be aimed at. The above configuration is also applicable to the laser processing head 10B.

In addition, in the laser processing head 10A, as shown in FIG. 7 , the incident part 12 is disposed on the fifth wall part 25 of the housing 11, and in the laser beam adjustment part 13, the optical axis The adjusting unit 33 is disposed in front of the attenuator 32, the reflecting unit 31, the beam expander 34, the reflecting unit 35, the reflective spatial light modulator 36 and the imaging optical system 37. It's okay to be. In the laser processing head 10A shown in FIG. 7 , the optical axis adjustment unit 33 (specifically, the second steering mirror 333 of the optical axis adjustment unit 33), the attenuator 32, and the reflection unit 31 , disposed on the first straight line A1, the optical axis adjusting unit 33 (specifically, the first steering mirror 331 of the optical axis adjusting unit 33) faces the incident unit 12 in the Z direction, , the reflector 31 faces the beam expander 34 in the Z direction (other than that, it is the same as the laser processing head 10A shown in FIG. 5). In the laser processing head 10A shown in FIG. 7 , the optical axis adjustment unit 33 reflects the laser beam L1 incident from the incident unit 12 toward the second wall portion 22 side of the housing 11, The attenuator 32 adjusts the output of the laser beam L1 reflected by the optical axis adjustment unit 33, and the reflection unit 31 stores the laser beam L1 whose output is adjusted by the attenuator 32 into a housing. It is reflected toward the sixth wall portion 26 side of (11), and the beam expander 34 expands the diameter of the laser beam L1 reflected by the reflecting portion 31. According to this, "the beam expander 34, the reflector 35, the reflective spatial light modulator 36, the imaging optical system 37, and the condenser 14", which are components related to the shaping of the laser light L1, Since the optical axis of the incident laser light L1 can be adjusted, the laser light L1 can be focused more precisely. In addition, since the attenuator 32 is disposed between the optical axis adjusting unit 33 and the reflecting unit 31, the size of the housing 11 due to the application of the attenuator 32 can be suppressed. The above configuration is also applicable to the laser processing head 10B.

In the laser processing head 10A shown in each of FIGS. 5 and 6 , the attenuator 32 may be disposed between the optical axis adjustment unit 33 and the beam expander 34 . In addition, in the laser processing head 10A shown in FIG. 7 , the attenuator 32 may be disposed between the reflecting portion 31 and the beam expander 34 . In addition, in the laser processing head 10A shown in each of FIGS. 5, 6, and 7, the attenuator 32 is located at the rear end of the beam expander 34 (for example, the reflector 35 and the reflective space). It may be arranged between the light modulator 36). Each of the above configurations is also applicable to the laser processing head 10B.

In addition, the optical axis adjusting unit 33 is not limited to having the first steering mirror 331, the reflecting member 332, and the second steering mirror 333. The optical axis adjustment unit 33 should just have a configuration for adjusting the optical axis of the laser beam L1 incident from the incident unit 12 . As an example, the optical axis adjustment unit 33 is a first steering mirror that reflects the laser beam L1 incident from the first wall portion 21 side along the X direction toward the fifth wall portion 25 side as well as the first wall portion 21 side. 331 and a second steering mirror 333 for reflecting the laser beam L1 reflected by the first steering mirror 331 toward the sixth wall 26 along the Z direction. In addition, each of the first steering mirror 331 and the second steering mirror 333 may be an electric mirror operated by electric power. In that case, the first steering mirror 331 and the second steering mirror 333 may be configured to automatically adjust the direction of each mirror 331a, 333a based on the image acquired by the observation unit 17. .

In addition, in the housing 11, at least one of the first wall portion 21, the second wall portion 22, the third wall portion 23, and the fifth wall portion 25 is the mounting portion 65 of the laser processing device 1. It is sufficient if the housing 11 is configured to be mounted on the mounting portion 65 (or the mounting portion 66) in a state disposed on the (or mounting portion 66) side.

Further, the circuit unit 19 is not limited to processing the signal output from the measurement unit 16 and/or the signal input to the reflective spatial light modulator 36, and processes any signal from the laser processing head. It can be anything.

In addition, the light source unit 8 may have one light source. In that case, the light source unit 8 should just be comprised so that a part of the laser beam output from one light source may be emitted from the emitting part 81a, and the remainder of the said laser beam may be radiated from the emitting part 82a.

[About operation of laser processing equipment]

Next, the operation of the laser processing device 1 will be described. 8 is a schematic top view showing the operation of the laser processing device. In FIG. 1 and subsequent drawings, the inside of the laser processing head 10A, 10B is shown schematically. As shown in FIGS. 1 and 8 , the object 100 is supported by the support portion 7 . Reference numeral S in the figure represents an optical system other than the optical system related to the irradiation of the laser beams L1 and L2 for forming the modified region, such as the measuring unit 16 and the observation unit 17 described above. .

In the object 100, as described above, while extending along the X direction, a plurality of lines C arranged along the Y direction are set. The line C is a virtual line, but may be a line actually drawn. In addition, a plurality of lines arranged along the X direction while extending along the Y direction are also set in the target object 100, but the illustration is omitted.

The laser processing apparatus 1 performs an irradiation process of performing laser processing along each line C under the control of the control unit 9 . In the irradiation process, the controller 9 controls at least the movement of the support portion 7 by the moving mechanism 5, the movement of the laser processing heads 10A and 10B by the moving mechanism 6, and the laser processing head ( 10A) and irradiation of the laser beams L1 and L2 from the laser processing head 10B are controlled. In the laser processing apparatus 1, the control part 9 executes a 1st process and a 2nd process as irradiation process (irradiation process includes a 1st process and a 2nd process).

The first process is a process of scanning the laser beam L1 from the laser processing head 10A in the X direction with respect to one line C among the plurality of lines C. The second process is a process of scanning the laser beam L2 from the laser processing head 10B in the X direction with respect to another line C among the plurality of lines C.

When the control unit 9 scans the laser beams L1 and L2 in the X direction, each light-converging point is moved along the X direction by the following operation. That is, first, the laser processing heads 10A and 10B are moved in the Y and Z directions through the Y-axis moving parts 61 and the Z-axis moving parts 63 and 64 of the moving mechanism 6, so that the laser It is assumed that the convergence point of the light L1 and L2 is positioned at a position inside the object 100 on each line C. And while moving the support part along the X direction through the moving mechanism 5 in that state, the laser processing head 10A, 10B is moved along the X direction through X-axis moving part 62A, 62B, and the support part By moving in the opposite direction to (7), the convergence point of the laser beams L1 and L2 is moved along the X direction along the line C in the object 100.

In particular, here, the control unit 9 executes the first process and the second process so as to overlap at least part of the time. That is, the control unit 9 is such that the state in which the laser beam L1 is being scanned along one line C and the state in which the laser beam L2 is being scanned along the other line C are simultaneously realized. do. That is, the controller 9 simultaneously operates the laser processing head 10A and the laser processing head 10B. By this, the improvement of throughput is aimed at clearly compared with processing using one laser processing head.

When the scanning of the laser beams L1 and L2 along one line C is completed, the control unit 9 separates each of the laser processing heads 10A and 10B independently and measures the distance between the lines C. It is moved in the Y direction (Z direction as necessary) by the same amount, and scanning of the laser beams L1 and L2 along the next line C (i.e., the first process and the second process) is continued. The controller 9 forms the modified region M along all the lines C by continuously performing this operation for approximately the number of lines C.

At this time, the control unit 9 sequentially performs the first processing from the line C located at one end of the object 100 in the Y direction among the plurality of lines C toward the inner line C in the Y direction. run At the same time, the controller 9 executes the second process sequentially from the line C located at the other end of the Y-direction of the object 100 among the plurality of lines C toward the inner line in the Y-direction. (This is called the main processing process). The line C located at one end of the Y direction and the line C located at the other end of the Y direction have the same length as each other in the X direction.

This point is demonstrated in more detail. In the main machining process, first, the control unit 9 moves the laser processing head 10A in the Y-direction and the Z-direction by controlling the Y-axis moving unit 61 and the Z-axis moving unit 63 . Thereby, the convergence point of the laser beam L1 is placed in a position located inside the object 100 on the line C located at one end of the Y direction of the object 100. At the same time, the control unit 9 moves the laser processing head 10B in the Y-direction and the Z-direction by controlling the Y-axis moving unit 61 and the Z-axis moving unit 64 . Thereby, the convergence point of the laser beam L2 is placed in a position located inside the object 100 on the line C located at the other end of the Y direction of the object 100. At this time, the X-direction position of the light-converging point of the laser beam L1 and the X-direction position of the light-converging point of the laser beam L2 coincide, for example.

In that state, the control part 9 moves the support part 7 along the X direction by controlling the moving part 53 of the moving mechanism 5. Moreover, in that state, the control part 9 moves the laser processing head 10A in the direction opposite to the support part 7 along the X direction by controlling the X-axis moving part 62A. Moreover, the control part 9 moves the laser processing head 10B in the direction opposite to the support part 7 along the X direction by controlling the X-axis moving part 62B in that state. Thereby, the convergence point of the laser beams L1 and L2 is moved in the object 100 along the X direction along each line C.

That is, in the state where laser beams L1 and L2 are being output from laser processing heads 10A and 10B, control unit 9 moves support portion 7 and laser processing heads 10A and 10B together along the X direction. By controlling the moving mechanisms 5 and 6 so as to move in opposite directions, the target object 100 is irradiated with laser beams L1 and L2 along respective lines C (irradiation processing is performed).

In particular, the controller 9 moves the moving mechanism 5 and the moving mechanism 6 (X-axis) so as to move the support portion 7 and the laser processing head 10A in opposite directions along the X direction as the first processing. Moving unit 62A) is controlled, and as a second process, at the same timing as the first process, the moving mechanism 5 moves the support part 7 and the laser processing head 10B in directions opposite to each other along the X direction. ) and the moving mechanism 6 (X-axis moving part 62B) are controlled. As a result, the first processing and the second processing for each line C are simultaneously started and completed simultaneously. That is, here, the first processing and the second processing are overlapping in their entirety. By this, a modified region M is formed inside the object 100 along the line C.

In the irradiation process, the relationship between the speed of movement of the support section 7 along the X direction and the speed of movement of the laser processing heads 10A and 10B along the X direction is The control unit 9 can arbitrarily set within a range that reaches the target value of the speed. As an example, here, the control unit 9 makes the speed of the laser processing head 10A, 10B along the X direction smaller than the speed of the support part 7 along the X direction. In addition, the speed of the laser processing head 10A and the speed of the laser processing head 10B can be equal to each other when the lengths of the lines C to be irradiated with the laser beams L1 and L2 are equal to each other. can However, for example, when the length of the line C to be irradiated with the laser beam L1 and the length of the line C to be irradiated with the laser beam L2 are different from each other, The speed of the processing head 10A and the speed of the laser processing head 10B may be different from each other.

Next, the controller 9 moves the laser processing head 10A in the Y direction by controlling the Y-axis moving unit 61 . As a result, the convergence point of the laser beam L1 is located at a position inside the object 100 on the line C located inward by one end from one end in the Y direction of the object 100. it becomes done At the same time, the controller 9 moves the laser processing head 10B by controlling the Y-axis moving unit 61 . As a result, the convergence point of the laser beam L2 is located at a position inside the object 100 on the line C located inside by one from the other end of the Y direction of the object 100. it becomes done At this time, the X-direction position of the light-converging point of the laser beam L1 and the X-direction position of the light-converging point of the laser beam L2 coincide, for example.

In that state, the control unit 9 moves the support unit 7 and the laser processing head 10A, 10B in opposite directions along the X direction under the control of the moving mechanisms 5 and 6, thereby moving the target object. In (100), the convergence point of the laser beams L1 and L2 is moved along the X direction along each line C. Thereby, also here, the 1st process and the 2nd process for each line C are simultaneously started and completed simultaneously. That is, even here, the first processing and the second processing are overlapping in their entirety. By repeating the operation of the control unit 9, the laser processing head 10A and the laser processing head 10B are simultaneously operated until the line C further inside the object 100, and the laser processing head 10B is operated without waste. processing can be done.

In each drawing, the modified region M is shown as a solid line for the sake of explanation, but it is not required that the modified region M is actually visible from the surface of the object 100 .

Here, as shown in FIG. 9, while the above operation is repeated, the positional relationship between the laser processing head 10A and the laser processing head 10B in the area further inside the object 100 is different from each other. A positional relationship in which the distance is no longer reduced in the Y direction (for example, a state immediately before contact with each other), and also the An unprocessed line C may remain in the area. In this case, it becomes difficult to simultaneously execute the first process and the second process as described above. Therefore, the control unit 9 executes the following post-processing process in this case.

That is, as shown in FIG. 10, the control unit 9, as a result of the main processing process, when the laser processing head 10A and the laser processing head 10B come closest to each other in the Y direction, the object 100 When a part of the line C remains in the area between the respective light concentrating parts 14, the laser processing head 10A is retracted from the area of the object 100, and the laser processing head 10B is removed. A post-processing process is executed in which the laser beam L2 of the line is scanned in the X direction for the part of the line C (the second process is executed). In addition, the opposite may be sufficient as laser processing head 10A and laser processing head 10B.

With this, laser processing is completed for all lines C. Then, as needed, by rotating the support part 7, the line which intersects the line C may be set along the X direction, and the above operation|movement can be repeated.

[Embodiment of eccentricity correction]

Continuing, control related to correction of eccentricity of the laser processing apparatus 1 will be described. As shown in FIG. 11, in the laser processing apparatus 1, when viewed from the Z direction, the X-axis moving part 62A for moving the laser processing head 10A along the X direction, and the laser processing head ( 10B) in the X direction, there is a case where the X-axis moving parts 62B are not parallel to each other (eccentricity occurs). Here, as an example, there is a case where the X-axis moving part 62A is parallel to the X direction and the X-axis moving part 62B is inclined in the Y direction with respect to the X direction.

In such a case, if the movement line (first movement line) of the laser processing head 10A as viewed from the Z direction is aligned with the line C by, for example, rotating the support portion 7, the laser processing head 10B The movement line (second movement line) of is inclined with respect to the line (C). Therefore, if the irradiation process is performed in that state and each of the laser processing heads 10A and 10B is moved along the line C, the modified area MA by the laser processing head 10A coincides with the line C However, deviation Δy from the line C occurs in the modified region MB by the laser processing head 10B.

Therefore, in the laser processing apparatus 1, prior to the irradiation process, control for correcting this shift Δy (correction of eccentricity) is performed. In addition, the movement line of the laser processing head 10A, 10B is, as an example, the extension direction of the X-axis moving parts 62A, 62B when viewed from the Z direction, that is, the laser processing head 10A, 10B when viewed from the Z direction ) (can be defined by the trajectory of movement of the light concentrating unit 14). Continuing, the control related to this eccentricity correction is concretely demonstrated.

In the correction of eccentricity, first, as shown in FIG. 12 , the sample 100T is supported with respect to the support part 7 . The sample 100T is, for example, a bare wafer. Next, the control unit 9 controls the Y-axis moving unit 61 so that the position of the light-converging point of the laser beam L1 in the Y direction is positioned at the center of the sample 100T, 10A of the laser processing head. ) in the Y direction. In addition to this, the controller 9 matches the position of the converging point of the laser beam L1 in the Z direction to the surface of the sample 100T. For this reason, the control part 9 can move the laser processing head 10A in the Z direction by controlling the Z-axis moving part 63, for example.

Next, the control unit 9 controls the X-axis moving unit 62A while outputting the laser beam L1 from the laser processing head 10A in a state where the sample 100T is supported by the support unit 7. 1st formation process which moves the laser processing head 10A along the X direction by this is performed. By this 1st formation process, the sample 100T is irradiated with the laser beam L1 along the X direction, and the processing line (1st processing line) DA is formed by the processing trace of the laser beam L1. The overhead line DA corresponds to the movement line (first movement line) of the laser processing head 10A.

Next, as shown in FIG. 13 , the controller 9 evacuates the laser processing head 10A from the area on the sample 100T by control of the Y-axis moving unit 61, and the laser beam The laser processing head 10A is moved in the Y direction so that the position of the light converging point of (L2) in the Y direction is located at the center of the sample 100T. In addition to this, the controller 9 matches the position of the converging point of the laser beam L2 in the Z direction to the surface of the sample 100T. For this reason, the control part 9 can move the laser processing head 10B in the Z direction by controlling the Z-axis moving part 64, for example.

Next, the control unit 9 controls the X-axis moving unit 62B while outputting the laser beam L2 from the laser processing head 10B in a state where the sample 100T is supported by the support unit 7. 2nd forming process which moves the laser processing head 10B along the X direction by this is performed. By this 2nd formation process, the sample 100T is irradiated with the laser beam L2 along the X direction, and the processing line (2nd processing line) DB is formed by the processing trace of the laser beam L2. The overhead line DB corresponds to the movement line (second movement line) of the laser processing head 10B.

Next, the control unit 9 images the sample 100T by controlling the moving mechanism 6 and the camera AC, and information indicating the formation state of the overhead lines DA and DB based on the obtained image Acquire Then, the controller 9 acquires the displacement amount of the overhead line DB from the overhead line DA (reference line) in the Y direction based on the comparison between the overhead line DA and the overhead line DB (displacement amount acquisition). process). Here, as shown in FIG. 14, the amount of deviation from the overhead line DA at the starting point (X=0) of the overhead line DB is b, and the end point of the overhead line DB Assuming that the amount of deviation from the overhead line DA at (X = 300) is a, the amount of deviation ΔY in the entirety of the overhead line DB is obtained as ΔY = ((a-b) / 300) x + b (x is the coordinate in the X direction). As described above, in the eccentricity correction, the control unit 9 moves along the X direction of the movement line (processing line DB) indicating the movement of the laser processing head 10B along the X direction by the X-axis moving unit 62B. Acquisition processing for acquiring the displacement amount ΔY in the Y direction from the (coincidence) reference line (process line DA) is performed.

Since the expression of this displacement amount ΔY is the expression of the straight line of the processing line DB in the X-Y plane, when moving the laser processing head 10B in the X direction in the irradiation process described above, the expression of the displacement amount ΔY The eccentricity is corrected by moving the laser processing head 10B also in the Y direction so that the Y coordinate becomes the same.

That is, as shown in FIG. 15 , in the irradiation process (second process), the controller 9 controls the Y-axis moving unit 61 by the amount of shift ΔY (to cancel the shift ΔY). While moving the laser processing head 10B in the Y direction (arrow AA in the drawing), the laser processing head 10B is moved in the X direction under the control of the X-axis moving unit 62B (arrow AB in the drawing). By this, the eccentricity of the laser processing head 10B in the Y direction is corrected, and the modified area MB corresponding to the line C is formed with respect to the laser processing head 10B. In addition, prior to this irradiation process, the control unit 9 performs an alignment process of rotating the support unit 7 so that the line C coincides with the movement line of the laser processing head 10A under the control of the moving mechanism 5. is being carried out. Therefore, the modified region MA corresponding to the line C is formed also in the laser processing head 10A.

[First modified example of eccentricity correction]

In addition, in the above example of eccentricity correction, an example in which one object 100 is supported by the support part 7 has been given, but as shown in FIG. 16, a plurality of (here two) objects 100A and 100B ) can be applied even when supported by the support part 7 and processed simultaneously. Continuing, this modified example is demonstrated. Further, since the former eccentricity correction is caused by the displacement of the X-axis moving parts 62A, 62B for moving the laser processing heads 10A, 10B along the X direction, it is sometimes referred to as axial displacement correction. Further, the correction of the displacement caused by the displacement of the postures of the objects 100A and 100B described below may be referred to as wafer displacement correction.

In this example, the X-axis moving parts 62A, 62B are parallel to the X direction, and no train is generated in the laser processing heads 10A, 10B. So, the lines (C) set in each of the objects (100A, 100B) are not parallel to each other. Therefore, for example, when the line C of the object 100A coincides with the moving line of the laser processing head 10A by rotating the support portion 7, the line C of the object 100B The moving line of the laser processing head 10B is inclined. Therefore, when the irradiation process is performed in this state, the modified area MA by the laser processing head 10A coincides with the line C of the object 100A, but the modified area MB by the laser processing head 10B ), a deviation Δy from the line C of the object 100B occurs.

In eccentricity correction for correcting this shift Δy, the following processing is performed. In addition, here, the said alignment process is already performed, and it sets the line C of object 100A to match with the movement line of laser processing head 10A. Here, the control unit 9 first captures an image of the target object 100B by controlling the moving mechanism 6 and the camera AC. Then, based on the obtained image, the control unit 9 determines the direction in which the line C of the object 100B is set, and the movement line of the laser processing head 10B by the X-axis moving unit 62B (here X It coincides with the direction and the amount of deviation from the agreement is acquired. Here, as an example, the direction in which the edge of the device area in the image extends and the direction in which the street area between the edges of the device area extends are referred to as the area where the line C is set, and the movement line of the laser processing head 10B. By comparing with (X direction), the shift amount can be acquired.

That is, in this example, the control unit 9 controls the reference line along the X direction of the movement line (second movement line) indicating the movement of the laser processing head 10B along the X direction by the X-axis moving unit 62B (object Acquisition processing for acquiring the displacement amount in the Y direction from the line C set in 100B is performed. Then, in the irradiation process (second process), the control unit 9 moves the laser processing head 10B in the Y direction by the amount corresponding to the shift amount (so as to cancel the shift amount) by the control of the Y-axis moving unit 61. While moving, the laser processing head 10B is moved in the X direction under the control of the X-axis moving unit 62B. Thereby, a modified region MB corresponding to the line C of the object 100B is formed also in the laser processing head 10B.

[Second modified example of eccentricity correction]

In addition, in the above example, an example of correcting the shift amount of the other moving line when one of the moving lines of the laser processing heads 10A and 10B is aligned with the line C has been described. However, eccentricity correction can also be applied when correcting the shift amount of the movement lines of both laser processing heads 10A and 10B. In this example, the laser processing apparatus 1 is equipped with X-axis moving parts 62A, 62B and another X-axis moving part (the structure is the same as that of X-axis moving parts 62A, 62B), and a camera (AC) is mounted on the separate X-axis moving unit. And, in the eccentricity correction, the control unit 9 takes the extension direction of the separate X-axis moving unit as a reference line, and sets the corresponding line of movement of the laser processing heads 10A and 10B by the X-axis moving units 62A and 62B. The displacement amount in the Y direction from the reference line is acquired.

Then, in the irradiation process (first process and second process), the controller 9 performs laser processing in the Y direction by the amount corresponding to the shift amount (so as to cancel the shift amount) by the control of the Y-axis moving unit 61. While moving the heads 10A, 10B, the laser processing heads 10A, 10B are moved in the X direction by the control of the X-axis moving parts 62A, 62B. That is, here, the controller 9 corrects the eccentricity of both laser processing heads 10A and 10B.

[Other variations of eccentricity correction]

In the example of eccentricity correction according to the above embodiment, the surface of the sample 100T is irradiated with the laser beams L1 and L2 by matching the converging points of the laser beams L1 and L2 to the surface of the sample 100T. In this, overhead lines DA and DB for obtaining the amount of deviation were formed. However, the overhead lines DA and DB may be formed inside the sample 100T. In this case, the control unit 9 modifies the inside of the sample 100T by aligning the converging points of the laser beams L1 and L2 to the inside of the sample 100T and irradiating the laser beams L1 and L2. An overhead line (DA, DB) composed of regions is formed. Then, the control unit 9 uses the camera AC to image the inside of the sample 100T with light passing through the sample 100T, and obtains information indicating the formation state of the overhead lines DA and DB do.

[Operation and effect of laser processing device]

As described above, the laser processing apparatus 1 has two laser processing heads 10A and 10B for irradiating the target object 100 with laser beams L1 and L2. Then, the laser processing heads 10A and 10B are movable along the X direction in which the line C set on the object 100 extends by the X-axis moving parts 62A and 62B of the moving mechanism 6. has been Therefore, in at least part of the time, the throughput can be improved by simultaneously operating the laser processing heads 10A and 10B.

Further, in the laser processing apparatus 1, the control unit 9 moves the movement line along the X direction of the laser processing head 10B by the X-axis moving unit 62B in the X direction from the reference line along the X direction. Acquisition processing for acquiring the displacement amount ΔY is performed. A line C set in the target object 100 follows the X direction. Therefore, the deviation amount ΔY of the movement line obtained here from the reference line corresponds to the deviation amount from the line C in the irradiation process. Then, in the irradiation process, the laser processing head 10B is moved in the X direction while moving in the Y direction by an amount corresponding to the shift amount ΔY. Therefore, even when the line C set on the object 100 coincides with the movement line of the laser processing head 10A, the displacement of the movement line of the laser processing head 10B from the line C is suppressed, and processing Deterioration of quality can be suppressed.

In addition, in the laser processing apparatus 1, in the acquisition process, the control unit 9 removes the laser processing head 10A from the laser processing head 10A in a state where the sample 100T for acquisition of the displacement amount ΔY is supported by the support unit 7. While outputting the laser light L1, by moving the laser processing head 10A along the X direction under the control of the X-axis moving part 62A, the laser light L1 is transmitted to the sample 100T along the X direction. is irradiated, and a first forming process is performed in which a processing line DA as a moving line is formed on the sample 100T by processing traces of the laser beam L1.

In addition, the control unit 9 controls the Y-axis moving unit 61 while outputting the laser beam L2 from the laser processing head 10B in a state where the sample 100T is supported by the support unit 7. By moving the laser processing head 10B along the X direction by irradiating the laser beam L2 to the sample 100T along the X direction, the processing line DB as a moving line by the processing trace of the laser beam L2 ) is performed on the sample 100T. And the control part 9 performs shift|offset|difference amount acquisition processing which acquires the shift|offset|difference amount ΔY with the overhead line DA as a reference line based on the comparison with the overhead line DA and the overhead line DB. In this way, if the processing lines DA and DB formed by actually processing the sample 100T are used as moving lines for calculating the displacement amount ΔY, it becomes possible to obtain the displacement amount with higher accuracy.

In addition, in the laser processing apparatus 1, the control unit 9 moves the support unit 7 so that the line C coincides with the movement line of the laser processing head 10A by control of the moving mechanism 5 before the irradiation process. Alignment processing is performed to rotate the . Then, in the irradiation process, the control unit 9 moves the support unit ( 7), and by moving the laser processing heads 10A, 10B in the direction opposite to the support portion 7 along the X direction under the control of the X-axis moving parts 62A, 62B, the line ( C), the object 100 is irradiated with laser beams L1 and L2.

In this way, when both the support portion 7 supporting the object 100 and the laser processing heads 10A and 10B are moved, the moving speed of the converging point of the laser beams L1 and L2 relative to the object 100 is improved. , the processing speed is improved. Moreover, in this case, the moving speed of the target of the light converging point is shared by the support part 7 and the laser processing heads 10A and 10B, respectively. For this reason, it is possible to suppress each moving speed compared with the case where one of the support part 7 and laser processing head 10A, 10B is moved. As a result, the time and distance for acceleration/deceleration of the support portion 7 and the laser processing heads 10A and 10B can be reduced.

Here, it is common that the weight of laser processing head 10A, 10B is lighter than the weight of the support part 7. Therefore, in moving the light condensing point at the target moving speed, the laser processing heads 10A and 10B move faster than the support 7 (ie, the burden of the speed of the laser processing heads 10A and 10B is relatively reduced). enlargement) can be considered.

On the other hand, in the laser processing apparatus 1, the optical fiber 2 for introducing the laser beams L1 and L2 output from the light source 81 is connected to the laser processing heads 10A and 10B. And the control part 9 makes the speed of laser processing head 10A, 10B along the X direction smaller than the speed of the support part 7 along the X direction in irradiation process. In this way, when the optical fiber 2 is connected to the laser processing heads 10A and 10B, regardless of the weight relationship between the laser processing heads 10A and 10B and the support portion 7, the laser processing head 10A , 10B) is relatively slow (that is, the load of the speed of the laser processing heads 10A, 10B is relatively small), it is possible to aim at the protection of the optical fiber 2.

In addition, in the laser processing apparatus 1, the moving mechanism 6 includes a pair of Y-axis moving parts 61 arranged to face each other in the X direction, and the X-axis moving parts 62A, 62B are a pair of It is supported across the Y-axis moving part 61 of . For this reason, each of laser processing head 10A, 10B is supported reliably.

[Embodiment of train correction]

In the above embodiment, an example of eccentricity correction has been described as train alignment correction of the laser processing heads 10A and 10B. However, in the laser processing apparatus 1, it is also possible to perform other train corrections. Subsequently, an example of train correction will be described.

17 and 18 are views showing processing results when processing is performed using two laser processing heads under the same processing conditions. 17 shows the processing result by the laser processing head 10A, and FIG. 18 shows the processing result by the laser processing head 10B. Figure 17 (a) and Figure 18 (a) is a cross section along the line (C) of the object 100, and is a photograph showing the cross section where the modified region (M) is exposed. Fig. 17(b) and Fig. 18(b) are schematic diagrams showing a cross section crossing the line C of the object 100. As shown in Figs.

The processing conditions here are the conditions shown in the table of FIG. 19 as an example. In the table of FIG. 19, the number of passes described on the horizontal axis, such as 1 pass and 2 passes, corresponds to the number of scans of the laser beams L1 and L2. That is, here, the laser beams L1 and L2 are scanned four times for one line C. In addition, as shown by the number of focal points on the vertical axis, the laser beams L1 and L2 are split into two for only one path, resulting in two focal points. Therefore, here, five modified regions M1, M2, M3, M4, and M5 are formed for one line C.

ZH (μm) on the vertical axis in the table of FIG. 19 corresponds to the position of the converging point of the laser beams L1 and L2 in the object 100 in the Z direction. VD (μm) is the interval between adjacent modified regions when the laser beams L1 and L2 are branched into a plurality of focal points and the number of focal points is set to 2 or more. Incidentally, the condensing state parameter is a parameter for varying the laser condensing state such as spherical aberration and astigmatism. In addition, here, the target object 100 with a thickness of 400 μm is used.

As shown in Figs. 17 and 18, even if the processing conditions shown in Fig. 19 are common to the laser processing heads 10A and 10B, there may be differences in the respective processing results. More specifically, when the laser processing head 10B shown in FIG. 18 is used, compared to the case where the laser processing head 10A shown in FIG. 17 is used, each of the modified regions M1 to M5 The amount of extension of the crack FA from is small. As a result, in the example of FIG. 18 , a black line BA is generated between the modified regions M3 and M4. The black line BA is the position corresponding to the region when a region in which cracks FA extending from each modified region M are not connected occurs between adjacent modified regions M. It is a line of dark color that occurs on the cut surface in .

The laser processing apparatus 1 has a function for correcting the difference between the processing results of these two laser processing heads 10A and 10B, that is, the train. That is, in the laser processing apparatus 1, the control unit 9 controls the processing conditions of the target object 100 by the laser beam L1 from the laser processing head 10A and the laser beam from the laser processing head 10B. Display processing for displaying information (such as the input screen G in FIG. 20) on the input accepting unit 93 for accepting input to set at least some of the processing conditions of the object 100 independently of each other by (L2) carry out

Fig. 20 is a diagram showing an example of an input screen displayed by an input acceptor. As shown in Fig. 20, the input screen G includes a basic condition acceptance unit G1 for accepting selection of basic processing conditions (basic conditions). For example, when the control unit 9 accepts selection of a basic condition according to the thickness of the object 100 ("T400 µm basic condition" in the example shown in the figure) from the basic condition accepting unit G1, processing according to the selection is performed. Conditions (for example, processing conditions as shown in Fig. 19) are set.

Further, the input screen G includes a correction item accepting unit G2 for selecting items for train correction (correction items). Correction items that the correction item accepting unit G2 accepts selection are eccentricity correction (G21), processing correction (G22), AF correction (G23), and laser ON OFF correction (G24) in the illustrated example. The eccentricity correction (G21) is the eccentricity correction described above.

When the selection of the eccentricity correction (G21) is accepted, the control unit 9, as shown in FIG. G21p)) is displayed on the input acceptor 93. Here, although the correction amount input screen G21p concerning laser processing head 10B is shown as an example, it can be similarly displayed also about laser processing head 10A. In the correction amount input screen G21p, the movement line (for example, the processing line DA) representing the movement along the X direction of the laser processing head 10A by the X-axis moving unit 62A is used as a reference line, and the X-axis moving unit 62B accepts an input of a correction amount for the amount of displacement in the Y direction from the reference line of the movement line (e.g., the processing line DB) indicating the movement of the laser processing head 10B along the X direction. X coordinate 1" is the X coordinate of the beginning of the movement line of the laser processing head 10B, and "X coordinate 2" is the X coordinate of the end of the movement line of the laser processing head 10B.

In this way, the control unit 9, in the display process, for accepting input of the correction amount from the reference of the processing conditions of the laser processing head 10B when the processing conditions of the laser processing head 10A are used as standards Information (correction amount input screen G21p) is displayed on the input acceptor 93. More specifically, as described above, the control unit 9 sets a movement line (for example, an overhead line DA) representing the movement of the laser processing head 10A along the X direction by the X-axis moving unit 62A. As a reference line, the amount of displacement in the Y direction from the reference line of the movement line (for example, the processing line DB) indicating the movement of the laser processing head 10B by the X-axis moving unit 62B along the X direction Information for accepting input of the correction amount (correction amount input screen G21p) is displayed on the input accepting unit 93.

The controller 9 also transmits information corresponding to the correction amount input screen G21p to the input acceptor 93 even when selection of another correction item is accepted in the correction item acceptor G2 of the input screen G. display Fig. 21(b) shows the correction amount input screen G22p when the selection of the processing correction (G22) is accepted to the correction item accepting unit G2. Further, "Z height correction" on the correction amount input screen G22p shows the correction amount based on the laser processing head 10A of "ZH (μm)" in the processing conditions of FIG. 19 . In addition, "light condensation correction" of the correction amount input screen G22p shows the correction amount based on the laser processing head 10A of "light condensation parameter" in the processing conditions of FIG. 19 .

Fig. 22(a) shows the correction amount input screen G23p when selection of the AF correction (G23) is accepted by the correction item accepting unit G2. As described above, in the laser processing apparatus 1, based on the signal output from the measurement unit 16, the distance between the surface of the object 100 and the light concentrating portion 14 is kept constant (ie, the object ( 100) and the focusing point of the laser beams L1 and L2 are kept constant), auto focus control (AF control) for controlling the driver 18 is performed. In the correction amount input screen G23p, correction amounts of various conditions in this AF control are accepted.

Specifically, the "AF follow-up start position" of the correction amount input screen G23p is the correction amount of the position in the X direction at which the AF control of the laser processing head 10B starts when the laser processing head 10A is used as a reference indicates "AF fixed distance" of the correction amount input screen G23p, while maintaining constant the distance between the surface of the object 100 and the converging point of the laser beam L2 when the laser processing head 10A is used as a reference Indicates the correction amount of the distance (distance from the edge of the object 100) at which processing is performed. In addition, the "AF light amount" of the correction amount input screen G23p is the light amount of the measurement light L10 in the measurement part 16 of the laser processing head 10B when the laser processing head 10A is used as a standard. Indicates the amount of correction. Further, "AF gain" on the correction amount input screen G23p indicates the amount of correction of the strength of the control signal for moving the light collecting unit 14 to follow the surface displacement of the object 100 . More specifically, "AF gain" refers to the gain of feedback control (e.g., proportional gain, integral gain, differential gain of PID control) for controlling the piezoelectric element that moves the drive unit 18, for example. It is a parameter divided into a plurality of stages (for example, 10 stages) for correction.

Fig. 22(b) shows the correction amount input screen G24p when the selection of the laser ON OFF correction (G24) has been accepted by the correction item accepting unit G2. "Edge OFF distance" of the correction amount input screen G24p is the correction amount of the length of the edge OFF section. The edge OFF section is a section from the edge of the object 100 to a predetermined position, and is a section in which a modified region is not formed by turning off the laser. This is for correcting a shift caused by unevenness or the like from when the laser is turned ON until the pulse actually oscillates at a constant output. In addition, "ON OFF position" of the correction amount input screen G24p is a modified region when laser is turned OFF in a part of a predetermined region in the object 100 to form a region in which no modified region is formed. Indicates the correction amount of the displacement of the formed position.

As described above, for example, "T400 μm basic condition" is accepted at the basic condition acceptance unit G1 of the input screen G, and selection of processing correction (G22) is accepted at the correction item acceptance unit G2. Further, when input of the correction amount shown in Fig. 21(b) is received on the correction amount input screen G22p, the control unit 9 first sets the processing conditions shown in FIG. Similarly, while setting the standard processing conditions (FIG. 23(a)), for the laser processing head 10B, the processing conditions shown in FIG. 19 are taken into account with each correction amount shown in FIG. (Fig. 23(b)) is set. Thereby, train correction is performed.

In this state, the controller 9 performs irradiation processing. Fig. 24 is a photograph of a cut surface showing a machining result when machining is actually performed through train correction. Fig. 24 (a) shows the processing result by the laser processing head 10A, and Fig. 24 (b) shows the processing result by the laser processing head 10B. As shown in Fig. 24, the generation of black streaks (BF), which had occurred in the example of Fig. 18, is suppressed, and a uniform processing state is obtained for laser processing heads 10A and 10B.

As described above, in the laser processing apparatus 1, the control unit 9 determines the processing conditions of the target object 100 by the laser beam L1 from the laser processing head 10A and the laser processing head 10B. In order to set at least some of the processing conditions of the object 100 by the laser light L2 independently of each other, information for accepting an input (such as an input screen G) is displayed on the input accepting unit 93. Therefore, each of the laser processing heads 10A and 10B so that a difference (train of the laser processing heads 10A and 10B) does not occur in the processing quality of the laser processing of the object 100 by each of the laser processing heads 10A and 10B. By setting the processing conditions of , deterioration in processing quality can be suppressed.

In addition, in the laser processing apparatus 1, the control unit 9, in the display process, the correction amount from the standard of the processing conditions of the laser processing head 10B when the processing conditions of the laser processing head 10A are used as a standard Information (correction amount input screen G21p, etc.) for accepting the input of is displayed on the input accepting unit 93. For this reason, the input for suppressing the train of laser processing head 10A, 10B is easy.

The above embodiment describes one embodiment of the laser processing apparatus according to one aspect of the present disclosure. Therefore, the above laser processing device 1 can be deformed arbitrarily. For example, in the above example, the case where the X-axis moving parts 62A and 62B are supported across a pair of Y-axis moving parts 61 has been shown. However, the moving mechanism 6 includes a single Y-axis moving part 61, and the X-axis moving parts 62A, 62B are supported by the single Y-axis moving part 61 in a state of letter paper beam. It's okay even if it is.

[Industrial Applicability]

A laser processing apparatus capable of improving throughput and suppressing deterioration in processing quality is provided.

Reference Signs List 1: laser processing device 5: moving mechanism (second moving mechanism)
6: moving mechanism (first moving mechanism) 7: support
9: control unit
10A: laser processing head (first laser processing head)
10B: laser processing head (second laser processing head)
61: Y-axis moving part (third moving part) 62A: X-axis moving part (first moving part)
62B: X-axis moving unit (second moving unit) 93: Input receiving unit
100: object 100T: sample
AC: camera

Claims (8)

By irradiating a laser beam along the line to an object on which a plurality of lines arranged along the second direction extending along the first direction and intersecting the first direction are set, the object is modified along the line. A laser processing device for forming a region,
A support part for supporting the object;
A first laser processing head and a second laser processing head for irradiating the laser beam to the object supported by the support portion;
a first moving mechanism for moving the first laser processing head and the second laser processing head along the first direction and the second direction, respectively;
At least, for controlling the irradiation of the laser light from the first laser processing head and the second laser processing head, and the movement of the first laser processing head and the second laser processing head by the first moving mechanism. Equipped with a control unit,
The first moving mechanism,
A first moving part extending along the first direction and having the first laser processing head mounted thereon and moving the first laser processing head along the first direction;
A second moving part extending along the first direction and having the second laser processing head mounted thereon and moving the second laser processing head along the first direction;
The third moving part extends along the second direction, the first moving part and the second moving part are mounted, and moves each of the first moving part and the second moving part along the second direction. include,
The control unit,
Acquisition processing for acquiring a displacement amount of a second movement line representing the movement of the second laser processing head along the first direction by the second moving unit from a reference line along the first direction in the second direction Wow,
After the acquisition process, at least in a state where the laser beam is being output from the second laser processing head, by controlling the second moving unit to move the second laser processing head along the first direction, performing an irradiation process of irradiating the object with the laser beam along a line;
In the irradiation process, the control unit moves the second laser processing head in the second direction by an amount equal to the shift amount by control of the third moving unit, while controlling the second moving unit to move the second laser processing head in the second direction. A laser processing device that moves a second laser processing head in the first direction. The method of claim 1,
The control unit, in the acquisition process,
In a state where the sample for acquiring the displacement amount is supported by the support part, the first laser processing head is moved to the first laser processing head by control of the first moving unit while outputting the laser beam from the first laser processing head. A first movement line representing the movement of the first laser processing head along the first direction by the first movement unit by irradiating the sample with the laser beam along the first direction by moving along the direction. A first formation process of forming a first processing line as , on the sample by processing traces of the laser beam;
Moving the second laser processing head along the first direction by the control of the second moving unit while outputting the laser light from the second laser processing head in a state where the sample is supported by the support portion a second formation process of irradiating the sample with the laser beam along the first direction and forming a second processing line as the second moving line on the sample by processing traces of the laser beam;
A laser processing device that performs a shift amount acquisition process for acquiring the shift amount based on a comparison between the first overhead line and the second overhead line, using the first overhead line as the reference line. According to claim 1 or claim 2,
A second moving mechanism for moving the support along the first direction and rotating the support around a rotation axis along a third direction intersecting the first and second directions;
The control unit, before the irradiation process, controls the second moving mechanism so that the line coincides with the first movement line representing the movement of the first laser processing head along the first direction by the first moving unit. Alignment processing is performed to rotate the support portion so as to
In the irradiation process, the control unit controls the support unit along the first direction by controlling the second moving mechanism in a state where the laser beam is being output from the first laser processing head and the second laser processing head. In addition to moving, moving the first laser processing head and the second laser processing head in the direction opposite to the support along the first direction by the control of the first moving unit and the second moving unit , to irradiate the laser beam to the object along the line, the laser processing device. The method of claim 3,
An optical fiber for introducing the laser light output from a light source is connected to the first laser processing head and the second laser processing head,
The control unit makes the speed of the first laser processing head and the second laser processing head along the first direction smaller than the speed of the support unit along the first direction in the irradiation process. According to any one of claims 1 to 4,
The first moving mechanism includes a pair of third moving parts disposed to face each other in the first direction;
The laser processing device, wherein the first moving part and the second moving part are supported across the pair of third moving parts. By irradiating a laser beam along the line to an object on which a plurality of lines arranged along the second direction extending along the first direction and intersecting the first direction are set, the object is modified along the line. A laser processing device for forming a region,
A support part for supporting the object;
A first laser processing head and a second laser processing head for irradiating the laser beam to the object supported by the support portion;
an input reception unit for displaying information and accepting input;
A control unit for controlling the input reception unit is provided;
The control unit sets at least a part of processing conditions of the object by the laser light from the first laser processing head and processing conditions of the object by the laser light from the second laser processing head independently of each other. A laser processing apparatus that performs a display process of displaying information for accepting an input for doing so on the input accepting unit. The method of claim 6,
The control unit inputs information for receiving an input of a correction amount from the reference of the processing conditions of the second laser processing head when the processing conditions of the first laser processing head are based on the processing conditions of the first laser processing head in the display processing. A laser processing device that is displayed on the reception area. The method of claim 7,
a first moving mechanism for moving the first laser processing head and the second laser processing head along the first direction and the second direction, respectively;
The controller controls movement of the first laser processing head and the second laser processing head by the first movement mechanism,
The first moving mechanism,
A first moving part extending along the first direction and having the first laser processing head mounted thereon and moving the first laser processing head along the first direction;
A second moving part extending along the first direction and having the second laser processing head mounted thereon and moving the second laser processing head along the first direction;
The third moving part extends along the second direction, the first moving part and the second moving part are mounted, and moves each of the first moving part and the second moving part along the second direction. include,
The control unit may, in the display processing, the second direction of a second movement line indicating movement of the second laser processing head along the first direction by the second moving unit from a reference line along the first direction. A laser processing device that displays information for accepting an input of the correction amount for the amount of deviation to the input receiving unit.

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