KR20210042842A - 가압모듈 및 그를 가지는 소자 핸들러 - Google Patents
가압모듈 및 그를 가지는 소자 핸들러 Download PDFInfo
- Publication number
- KR20210042842A KR20210042842A KR1020200131340A KR20200131340A KR20210042842A KR 20210042842 A KR20210042842 A KR 20210042842A KR 1020200131340 A KR1020200131340 A KR 1020200131340A KR 20200131340 A KR20200131340 A KR 20200131340A KR 20210042842 A KR20210042842 A KR 20210042842A
- Authority
- KR
- South Korea
- Prior art keywords
- unit
- exchange position
- tray
- test
- loading
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20190125529 | 2019-10-10 | ||
KR1020190125529 | 2019-10-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20210042842A true KR20210042842A (ko) | 2021-04-20 |
Family
ID=75436765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020200131340A KR20210042842A (ko) | 2019-10-10 | 2020-10-12 | 가압모듈 및 그를 가지는 소자 핸들러 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20210042842A (zh) |
TW (1) | TW202137363A (zh) |
WO (1) | WO2021071340A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102549629B1 (ko) * | 2022-10-27 | 2023-06-30 | (주)성우 | 이차전지용 캡조립체 검사장치 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11598842B2 (en) * | 2020-03-27 | 2023-03-07 | Intel Corporation | Apparatus and system of surface wave mitigation for multiple-input-multiple-output (MIMO) radar antenna |
TWI849688B (zh) * | 2023-01-13 | 2024-07-21 | 鴻勁精密股份有限公司 | 電子元件接合機構、測試裝置及作業機 |
TWI827515B (zh) * | 2023-06-01 | 2023-12-21 | 鴻勁精密股份有限公司 | 壓接機構、測試裝置及作業機 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070118376A (ko) * | 2006-06-12 | 2007-12-17 | 삼성전자주식회사 | 수평 회전 구동형 반도체 자재 핸들링 장치와 그를포함하는 테스트 장치 |
KR101428522B1 (ko) * | 2008-05-21 | 2014-08-12 | 주식회사 원익아이피에스 | 진공처리시스템, 진공처리시스템에 사용되는 버퍼모듈 및진공처리시스템의 트레이 이송방법 |
KR20120047879A (ko) * | 2012-02-27 | 2012-05-14 | (주)제이티 | 소자검사장치 |
KR102000948B1 (ko) * | 2012-02-29 | 2019-07-17 | (주)제이티 | 소자검사장치 |
KR20190000477A (ko) * | 2017-06-23 | 2019-01-03 | (주)제이티 | 소자핸들러 |
-
2020
- 2020-10-12 WO PCT/KR2020/013876 patent/WO2021071340A1/ko active Application Filing
- 2020-10-12 TW TW109135216A patent/TW202137363A/zh unknown
- 2020-10-12 KR KR1020200131340A patent/KR20210042842A/ko unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102549629B1 (ko) * | 2022-10-27 | 2023-06-30 | (주)성우 | 이차전지용 캡조립체 검사장치 |
Also Published As
Publication number | Publication date |
---|---|
TW202137363A (zh) | 2021-10-01 |
WO2021071340A1 (ko) | 2021-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20210042842A (ko) | 가압모듈 및 그를 가지는 소자 핸들러 | |
KR101430101B1 (ko) | 소자검사장치 | |
US8970244B2 (en) | Transport apparatus for moving carriers of test parts | |
US6456062B2 (en) | Contact arm and electronic device testing apparatus using the same | |
KR100722643B1 (ko) | 집적회로 시험장치 | |
US20110037492A1 (en) | Wafer probe test and inspection system | |
KR20110113554A (ko) | 소자검사장치 | |
US7371078B2 (en) | Insert attachable to an insert magazine of a tray for holding an area array type electronic component to be tested | |
US6304093B1 (en) | transportation and active temperature control of integrated circuits for test | |
JP2008300834A (ja) | マルチプローブカードユニット、それを備えたプローブ検査装置、それらの製造方法、及びプローブ検査装置を利用する方法 | |
KR20180115564A (ko) | 소자 픽업 모듈 및 이를 구비하는 반도체 소자 테스트 장치 | |
KR20190000477A (ko) | 소자핸들러 | |
KR20140034414A (ko) | 소자검사장치 | |
KR20130042945A (ko) | 소자검사장치 및 그에 사용되는 소자가압장치 | |
KR100866537B1 (ko) | 콘택트유닛 구동장치, 그를 포함하는 테스트 핸들러, 및그를 포함하는 반도체 소자 제조방법 | |
KR100300132B1 (ko) | 반도체 소자와 테스터 소켓 간의 접촉력 제어장치 | |
KR20140119243A (ko) | 소자검사장치 | |
KR102341232B1 (ko) | 테스트 트레이 및 테스트 핸들러 | |
KR102329230B1 (ko) | 메모리 모듈 실장 테스트 장치 | |
KR101140917B1 (ko) | 전류와 열을 이용한 엘이디 검사장치 | |
KR102156128B1 (ko) | 소자검사장치 | |
KR20200143064A (ko) | 소자검사장치 및 그에 사용되는 소자가압툴 | |
TWI398638B (zh) | A method of removing the electronic component, and a control program for carrying out the method | |
CN109729737A (zh) | 检查系统的调节方法及其使用的辅助器件 |