KR20210035738A - Substrate processing apparatus - Google Patents

Abstract

A substrate processing apparatus (1) includes: a chemical liquid tank (30); a first circulation pipe (31) connected to the chemical liquid tank (30); a pump for sending a chemical liquid in the chemical liquid tank (30) to the first circulation pipe (31); a second circulation pipe (32) branched and connected to the first circulation pipe (31); a filter (39) provided in an upstream portion (33) of the first circulation pipe (31), which is located on an upstream side from a connection position (P2) of the second circulation pipe (32); and a pressure adjustment unit for adjusting a pressure of the chemical liquid flowing through the upstream portion (33). The pressure adjustment unit includes a regulator (71) for regulating an opening degree of the second circulation pipe (32). The regulator (71) allows a pressure of the chemical liquid flowing through the upstream portion (33) in a circulation idle state of the substrate processing apparatus (1) to coincide with or approach a pressure of the chemical liquid flowing through the upstream portion (33) in a ready state of the substrate processing apparatus (1). Accordingly, a clean processing liquid with a small particle content is supplied to a processing unit.

Description

Substrate processing apparatus {SUBSTRATE PROCESSING APPARATUS}

This invention relates to a substrate processing apparatus. Examples of substrates to be processed include a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a flat panel display such as an organic EL (electroluminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk. , A substrate for a port mask, a ceramic substrate, a substrate for a solar cell, and the like.

In a manufacturing process of a semiconductor device or a liquid crystal display device, a substrate processing device for processing a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device is used.

Such a substrate processing apparatus includes a processing unit, a processing liquid tank for storing a processing liquid supplied to the processing unit, as described in Japanese Patent Laid-Open No. 2013-175552 and Japanese Patent Laid-Open No. 2007-266211, A circulation pipe for circulating the treatment liquid in the treatment liquid tank, a pump for sending the treatment liquid in the treatment liquid tank to the circulation pipe, and a filter for filtering the treatment liquid flowing through the circulation pipe are provided.

The inventors of the present application are examining the provision of two circulation pipes. Specifically, it is considered to provide an outer circulation pipe connected to the treatment liquid tank and supplying the treatment liquid to the treatment unit, and an inner circulation pipe branchly connected to the outer circulation pipe.

In this case, it is conceivable to install a filter in an upstream portion of the outer circulation pipe on the upstream side of the connection position of the inner circulation pipe in the outer circulation pipe. In order to keep the treatment liquid flowing through the inner circulation pipe and/or the outer circulation pipe clean, it is necessary to keep the particle trapping ability of the filter constant.

The particle trapping ability of the filter changes with fluctuations in the pressure of the liquid applied to the filter. When the filter's ability to capture particles is lowered, there is a concern that particles previously captured by the filter may leak out of the filter and contaminate the downstream side of the filter.

This is not the only factor that deteriorates the filter's ability to capture particles. Even when a large amount of particles are supplied to the filter and the filter is clogged, the particle trapping ability of the filter is lowered.

In addition, if the amount of particles in the treatment liquid flowing through the inner circulation pipe and/or the outer circulation pipe can be measured, it is possible to exclude the treatment liquid containing a large amount of particles from the inner circulation pipe and/or the outer circulation pipe. .

Thus, one of the objects of the present invention is to provide a substrate processing apparatus capable of supplying a clean processing liquid having a small content of particles to a processing unit.

A first aspect of the present invention is a processing unit having a discharge port for discharging a treatment liquid toward a substrate, a treatment liquid tank storing the treatment liquid supplied to the discharge port, and an upstream end connected to the treatment liquid tank. And an outer circulation pipe that includes a downstream end and forms an outer circulation flow path for circulating the treatment liquid in the treatment liquid tank together with the treatment liquid tank, and sends the treatment liquid in the treatment liquid tank to the outer circulation pipe. A pump and a discharge port communication pipe branchly connected to the outer circulation pipe at a first connection position, and a discharge port communication pipe communicating with the discharge port, and a branch connection to the outer circulation pipe at a second connection position upstream of the first connection position, A second upstream portion that is a portion upstream of the second connection position in the outer circulation pipe and an inner circulation passage for circulating the processing liquid in the processing liquid tank are formed together with the processing liquid tank, and the An inner circulation pipe for returning the treatment liquid supplied from the outer circulation pipe to the treatment liquid tank, a filter installed through the second upstream portion, and a pressure for adjusting the pressure of the treatment liquid flowing through the second upstream portion In a one-way circulation state including an adjustment unit and a control device for controlling the pressure adjustment unit, wherein the control device does not circulate the treatment liquid in the outer circulation passage and circulates the treatment liquid in the inner circulation passage The pressure of the treatment liquid flowing through the second upstream side portion is equal to the pressure of the treatment liquid flowing through the second upstream side portion in a twin circulation state in which the treatment liquid circulates in both the outer circulation passage and the inner circulation passage. There is provided a substrate processing apparatus that controls the pressure adjustment unit so as to match or close.

The filter's ability to capture particles varies depending on the amount of pressure applied to the filter. In a state where pressure is applied to the filter, smaller particles can be captured compared to a state in which pressure is not applied to the filter. And, as the pressure applied to the filter increases, it is possible to capture even smaller particles. Conversely, when the pressure applied to the filter decreases, the particles that can be trapped increase, and the particle trapping ability of the filter decreases. That is, the particle trapping ability of the filter changes due to fluctuations in the pressure applied to the filter. In the case where the filter's ability to capture particles is lowered, there is a concern that particles that have been captured by the filter before that time may flow out from the filter to the secondary side.

On the other hand, if the pressure applied to the filter is too large, the flow rate and/or flow rate in the filter exceeds allowable, and as a result, there is a fear that particles may escape the filter. In order to properly trap particles by the filter, it is necessary to keep the pressure applied to the filter constant.

According to this configuration, the pressure of the treatment liquid flowing through the second upstream portion in the one-way circulation state in which the treatment liquid circulates in the inner circulation passage is a pair in which the treatment liquid circulates in both the outer circulation passage and the inner circulation passage. In the circulating state, the pressure adjusting unit is controlled so as to match or approach the pressure of the processing liquid flowing through the second upstream portion. Since the pressure applied to the filter in the one-way circulation state matches or is close to the pressure applied to the filter in the twin circulation state, the particle trapping ability of the filter can be kept constant regardless of the circulation state of the treatment liquid.

Thereby, it is possible to suppress or prevent particles from leaking out of the filter accompanying the change in the pressure applied to the filter. Therefore, a clean treatment liquid with a small content of particles (preferably, a clean treatment liquid containing no particles) can be supplied to the treatment unit.

In the first aspect, the pressure adjustment unit includes an opening degree adjustment unit that adjusts the opening degree of the inner circulation pipe.

According to this configuration, the pressure of the processing liquid flowing through the second upstream portion is adjusted by adjusting the opening degree of the inner circulation pipe by the pressure adjusting unit. Thereby, with a simple configuration, the pressure of the processing liquid flowing through the second upstream portion can be adjusted.

In the first aspect, as an operation state of the substrate processing apparatus, an executable state in which the bicyclic state is executed, and a state different from the executable state, and a standby state in which power supply to the substrate processing apparatus is maintained, are , Is selectively installed to be executable, and the standby state includes a circulating standby state for realizing the one-way circulating state.

According to this configuration, the pressure of the processing liquid flowing through the second upstream portion in the circulating standby state of the substrate processing apparatus coincides with the pressure of the processing liquid flowing through the second upstream portion in the executable state of the substrate processing apparatus. Or, so as to get closer, the pressure adjustment unit is controlled. Since the pressure applied to the filter in the circulating standby state of the substrate processing apparatus is equal to or close to the pressure applied to the filter in the practicable state of the substrate processing apparatus 1, the particle trapping ability of the filter can be determined. Regardless of whether the operating state is in a circular standby state or an executable state, it can remain constant or nearly constant.

In the first phase, the standby state is a circulation in which the driving of the pump is stopped while the power supply to the substrate processing apparatus is maintained, and circulation of the processing liquid in the outer circulation passage and the inner circulation passage is stopped. It further includes a stop waiting state.

According to this configuration, the standby state is a circulating standby state in which the processing liquid does not circulate in the outer circulation passage and the processing liquid circulates in the inner circulation passage, and the drive of the pump is stopped (the outer circulation passage and the inner circulation passage It includes a circulation stop waiting state (which stops circulation of the processing liquid in both).

In the circulating standby state, the processing liquid does not circulate in the outer circulation passage, and the processing liquid in the inner circulation passage circulates. Therefore, when the target portion of the maintenance work is a portion that does not affect the circulation of the processing liquid in the inner circulation passage (for example, in the case of maintenance work for a processing unit or a transfer robot), the substrate processing apparatus is circulated and waited. It is possible to perform maintenance work on the substrate processing apparatus while setting it to the state.

On the other hand, when the maintenance object is a portion that has an influence on circulation of the treatment liquid in the inner circulation passage, the maintenance operation cannot be performed while circulating the treatment liquid in the inner circulation passage. Therefore, in this case, the operation state of the substrate processing apparatus is set to the circulation stop standby state.

In this way, it is possible to classify a plurality of standby states according to the maintenance site. Therefore, it is possible to shorten the period in which the pump is in a stopped state. Therefore, it is possible to improve the operation rate of the substrate processing apparatus.

In the first aspect, the substrate processing apparatus includes an inner circulation valve installed in the inner circulation pipe to open and close the inner circulation pipe, and a portion downstream from the second connection position in the outer circulation pipe. A drainage pipe branchingly connected to the phosphorus second downstream portion at a third connection position and discharging the processing liquid from the second downstream portion, and an upstream side of the third connection position in the second downstream portion. A first switching unit for switching a destination of the processing liquid between a downstream side of the third connection position in the second downstream portion and the drain pipe, wherein the control device stops the circulation. At the time of transition from the standby state to the executable state, driving of the pump is started, the inner circulation valve is closed, and the processing liquid on the upstream side of the third connection position in the second downstream portion is By driving the first switching unit so as to flow into the drain pipe, a process of discharging the processing liquid in the second upstream portion and the processing liquid in the second downstream portion through the drain pipe is performed.

In the state of waiting for the circulation stop of the substrate processing apparatus, the pump is stopped. In this state, circulation of the processing liquid is stopped, and there is no movement of the processing liquid in the filter. At this time, no pressure is applied to the filter. Therefore, the filter's ability to capture particles is low. Therefore, in the state of waiting for circulation stop of the substrate processing apparatus, particles captured by the filter flow out from the filter to the secondary side and are accumulated on the secondary side of the filter. When particles are accumulated on the secondary side of the filter and the pump is started to circulate the treatment liquid, particles accumulated on the secondary side of the filter diffuse throughout the outer circulation flow path and/or the inner circulation flow path. There is a risk of becoming.

According to this configuration, at the time of transition from the circulation stop standby state to the executable state, the processing liquid in the second upstream portion and the processing liquid in the second downstream portion are discharged to the outside of the substrate processing apparatus through the drain pipe. Accordingly, it is possible to suppress or prevent contamination of the inner circulation passage and/or the outer circulation passage by the treatment liquid containing particles.

In the first aspect, the substrate processing apparatus further includes a selection unit operated by a user to select any one of a plurality of standby states including the circulation standby state and the circulation stop standby state.

According to this configuration, the circulation standby state and the circulation stop standby state can be selectively executed by operation of the selection unit by a user (including a maintenance person in charge) of the substrate processing apparatus.

In the first aspect, the substrate processing apparatus further includes a detection unit that detects a state relating to the substrate processing apparatus, and when the state is detected by the detection unit in the circulation standby state, the control device A step of stopping the drive of the pump and stopping the circulation of the treatment liquid in the inner circulation passage is further performed.

According to this configuration, when a predetermined state is detected by the detection unit in the circulation standby state, the drive of the pump is stopped. That is, in this case, circulation of the treatment liquid in the inner circulation flow path is stopped. In the circulation standby state, it is possible to perform maintenance work on the substrate processing apparatus. When a predetermined state occurs with respect to the substrate processing apparatus, it may not be desirable to continue the maintenance work.

Therefore, by adopting a configuration capable of detecting a predetermined state, and when such a predetermined state occurs, the circulation of the subsequent processing liquid in the outer circulation passage is stopped, thereby preventing the occurrence of undesirable events. I can.

In the first aspect, the substrate processing apparatus includes a plurality of the processing units, the outer circulation pipe includes a first circulation pipe for supplying a processing liquid in common to the plurality of processing units, the The discharge port communication pipe includes a plurality of supply pipes corresponding to the plurality of processing units on a one-to-one basis.

According to this configuration, the supply piping provided in a one-to-one correspondence to the processing unit is branchly connected to the first circulation piping, so that the processing liquid flowing through the first circulation flow path is supplied to the processing unit through the supply piping.

A second aspect of the present invention is a processing unit having a discharge port for discharging a treatment liquid toward a substrate, a treatment liquid tank storing treatment liquid supplied to the discharge port, and an upstream end and a downstream end connected to the treatment liquid tank. An outer circulation pipe forming an outer circulation passage for circulating the treatment liquid in the treatment liquid tank together with the treatment liquid tank, and a pump for delivering the treatment liquid in the treatment liquid tank to the outer circulation pipe, A discharge port communication pipe branchly connected to the outer circulation pipe at a first connection position, and a discharge port communication pipe communicating with the discharge port, and a branch connection to the outer circulation pipe at a second connection position upstream of the first connection position, and the outer circulation Forming an inner circulation flow path for circulating the treatment liquid in the treatment liquid tank together with the second upstream part and the treatment liquid tank, which is a part upstream of the second connection position in the pipe, and the outer circulation pipe An inner circulation pipe for returning the treatment liquid supplied from the treatment liquid tank to the treatment liquid tank, and a first parallel pipe and a second parallel pipe that are part of the second upstream side and are connected in parallel to each other at an upstream side of the second connection position The first filter and the second filter respectively interposed therebetween, and the destination of the processing liquid on the upstream side of the fourth connection position in which the upstream end of the first parallel pipe and the upstream end of the second parallel pipe are connected to each other, the When starting the driving of the pump from a state in which the driving of the pump is stopped and a second switching unit that switches between the first parallel pipe and the second parallel pipe, the second switching unit is controlled , A destination of the processing liquid upstream of the fourth connection position is set to the second parallel pipe, and then, the second switching unit is controlled to a destination of the processing liquid upstream of the fourth connection position. It provides a substrate processing apparatus comprising a control device for switching to the first parallel pipe.

In a state in which the pump is stopped, there are cases in which equipment replacement or piping is remodeled. Particles may adhere to the device or the like after modification or the like. In this state, when the circulation of the processing liquid is started by the start of driving the pump, a large amount of particles adhering to the device or the like is supplied to the filter, and there is a fear that the filter may be clogged. As a result, the filter's ability to capture particles decreases, and there is a fear that particles may leak out from the filter.

According to this configuration, when starting the drive of the pump, the destination of the processing liquid on the upstream side of the fourth connection position is set to the second parallel pipe. Then, when a predetermined time elapses, the destination of the processing liquid on the upstream side of the fourth connection position is switched to the first parallel pipe. That is, the filter for trapping particles in the processing liquid in the second upstream portion is switched between the first filter and the second filter other than at the start of driving of the pump and thereafter. At the start of driving the pump, by trapping particles by a second filter different from the first filter normally used, it is possible to suppress the occurrence of clogging in the first filter that is normally used. Thereby, leakage of particles from the first filter can be suppressed or prevented. Therefore, a clean treatment liquid with a small content of particles (preferably, a clean treatment liquid containing no particles) can be supplied to the treatment unit.

In this case, it is preferable that the first filter is different from the second filter in terms of filtering performance. In particular, it is preferable that the eyes of the second filter are coarser than those of the first filter. When the pore diameter of the first filter is small, the ratio of the particles trapped in the pores of the first filter to occupy the pores increases, so that clogging of the first filter is likely to occur.

In this case, at the start of driving the pump, relatively large particles are captured by the second filter, and in other cases, relatively small particles can be captured by the first filter. Therefore, when the pump is started to drive, the amount of particles captured by the second filter can be suppressed, so that clogging of the second filter and escaping of particles from the second filter can be suppressed.

A third aspect of the present invention is a processing unit having a discharge port for discharging a treatment liquid toward a substrate, a treatment liquid tank storing treatment liquid supplied to the discharge port, and an upstream end and a downstream end connected to the treatment liquid tank. An outer circulation pipe forming an outer circulation passage for circulating the treatment liquid in the treatment liquid tank together with the treatment liquid tank, and a pump for delivering the treatment liquid in the treatment liquid tank to the outer circulation pipe, A discharge port communication pipe branchly connected to the outer circulation pipe at a first connection position, and a discharge port communication pipe communicating with the discharge port, and a branch connection to the outer circulation pipe at a second connection position upstream of the first connection position, and the outer circulation Forming an inner circulation flow path for circulating the treatment liquid in the treatment liquid tank together with the second upstream part and the treatment liquid tank, which is a part upstream of the second connection position in the pipe, and the outer circulation pipe An inner circulation pipe for returning the treatment liquid supplied from the treatment liquid tank to the treatment liquid tank, and a device downstream region set at a downstream side of the device installed through the second upstream part of the second upstream part, It provides a substrate processing apparatus including a contamination state measurement device that measures a contamination state in a region downstream of the device.

According to this configuration, particles generated due to the device are measured by the contamination state measuring device installed in the second upstream portion of the device downstream region. With the contamination state measuring device, not only the presence or absence of particles generated by the apparatus, but also the amount of particles generated by the apparatus can be measured. In addition, since the contamination state measuring device is installed in a region downstream of the device through which particles generated from the device flow, the amount of particles generated from the device can be accurately measured.

Therefore, a clean treatment liquid with a small content of particles (preferably, a clean treatment liquid containing no particles) can be supplied to the treatment unit.

In a third aspect, the substrate processing apparatus corresponds one-to-one to a plurality of the apparatuses installed through the second upstream side portion, and a plurality of the apparatus downstream regions that correspond to the plurality of apparatuses on a one-to-one basis, And a plurality of the contamination state measuring devices provided through the second upstream portion.

According to this configuration, the contamination state measuring device is provided corresponding to the downstream region of each device. Based on the measured values of a plurality of contamination state measuring devices, it is possible to specify the device as the particle generation source.

In the third aspect, the substrate processing apparatus includes a plurality of drainage pipes branchly connected to the plurality of equipment downstream regions at a plurality of fifth connection positions provided for each of the equipment downstream regions, and in the second upstream portion. A first to switch the destination of the processing liquid upstream from the fifth connection position between the drain pipe connected to the downstream of the fifth connection position in the second upstream portion and the downstream region of the device. It further includes 3 conversion units.

According to this configuration, the drain pipe is branched and connected to the downstream region of each device. When a device serving as a particle generation source is specified, it is possible to discharge the treatment liquid through a drain pipe to a region downstream of the device corresponding to the device. In this case, it is possible to directly discharge the processing liquid containing particles through an area downstream of the device corresponding to the device serving as the particle generation source. Thereby, it is possible to suppress or prevent diffusion of particles to other parts of the second upstream side or to the inner circulation pipe.

In a third aspect, the substrate processing apparatus further includes a plurality of the third switching units corresponding to the plurality of drain pipes on a one-to-one basis, and a control device for controlling the plurality of the third switching units, and the control When the number of particles contained in the processing liquid flowing through the downstream region of the device exceeds the threshold, the device switches the destination of the processing liquid in the downstream region of the device to the drain pipe, and The third switching unit corresponding to the drain pipe is controlled so that the processing liquid on the upstream side of the apparatus downstream region is discharged to the outside of the substrate processing apparatus.

According to this configuration, when the number of particles contained in the processing liquid flowing in the downstream area of the device (measured value of a contamination state measurement device or a calculated value based on it) exceeds the threshold value, the device corresponding to the downstream area of the device is a particle generation source. It is judged to be. Further, by discharging the treatment liquid including particles through the drain pipe corresponding to the downstream region of the device, it is possible to suppress or prevent the particles from spreading to other portions of the second upstream side or the inner circulation pipe.

In a third aspect, the substrate processing apparatus further includes a plurality of the third switching units corresponding to the plurality of drain pipes on a one-to-one basis, and a control device for controlling the plurality of the third switching units, and the control When the difference in the number of particles contained in the processing liquid flowing through the two adjacent regions downstream of the device exceeds the threshold value, the device drains the destination of the processing liquid in the downstream region of the device on the side with a larger number of particles. By switching to a pipe, the third switching unit corresponding to the drain pipe is controlled to discharge the processing liquid upstream of the apparatus downstream region in the second upstream portion to the outside of the substrate processing apparatus.

According to this configuration, when the difference between the number of particles (measured value of the contamination state measuring device or calculated value based on it) contained in the processing liquid flowing in the area downstream of the apparatus exceeds the threshold value, the number of particles is higher. It is determined that a device corresponding to the downstream area of the device is a particle generation source. In addition, by discharging the treatment liquid containing particles through the drain pipe corresponding to the downstream region of the device, it is possible to suppress or prevent diffusion of particles to other portions of the second upstream side or the inner circulation pipe.

In a third aspect, the substrate processing apparatus is a bypass pipe connecting the downstream region of the device and the inner circulation pipe, a portion upstream of a connection position of the bypass pipe in the second upstream portion, And a bypass pipe forming a bypass circulation passage for circulating the treatment liquid in the treatment liquid tank together with a portion downstream of the connection position of the bypass pipe in the inner circulation pipe, and the second upstream side. The destination of the processing liquid on the upstream side of the sixth connection position to which the bypass pipe is connected in the portion is between the downstream side of the sixth connection position in the second upstream side and the bypass pipe. It further comprises a fourth switching unit for switching in.

According to this configuration, a bypass pipe connecting the downstream region of the device and the inner circulation pipe is branched to each device downstream region. When a device serving as a particle generating source is specified, it is possible to guide the processing liquid in the area downstream of the device corresponding to the device to the inner circulation pipe through the bypass pipe. In this case, it is possible to directly guide the processing liquid containing particles to the inner circulation pipe from the area downstream of the device corresponding to the device serving as the particle generation source. The processing liquid containing particles is purified as it passes through a filter provided through the bypass pipe. Thereby, it is possible to suppress or prevent diffusion of particles to other parts of the second upstream side or to the inner circulation pipe.

In the third aspect, the substrate processing apparatus controls a plurality of the bypass pipes, a plurality of the fourth switching units corresponding to the plurality of bypass pipes on a one-to-one basis, and the plurality of the fourth switching units. The control device further comprises a control device, the control device, when the number of particles contained in the processing liquid flowing through the downstream region of the device exceeds a threshold value, switches the destination of the processing liquid in the downstream region of the device to the bypass pipe. Thus, the fourth switching unit corresponding to the bypass pipe is controlled.

According to this configuration, when the number of particles contained in the processing liquid flowing in the downstream area of the device (measured value of a contamination state measurement device or a calculated value based on it) exceeds the threshold value, the device corresponding to the downstream area of the device is a particle generation source. It is judged to be. And, as the treatment liquid containing particles is guided to the inner circulation pipe through the bypass pipe corresponding to the downstream region of the device, the diffusion of particles to other parts of the second upstream side or the inner circulation pipe is suppressed or prevented. can do.

In the third aspect, the substrate processing apparatus controls a plurality of the bypass pipes, a plurality of the fourth switching units corresponding to the plurality of bypass pipes on a one-to-one basis, and the plurality of the fourth switching units. And a control device further comprising a control device, wherein the control device further comprises: when the difference in the number of particles contained in the processing liquid flowing through the two adjacent device downstream regions exceeds a threshold value, the device downstream of the side with a larger number of particles. The fourth switching unit corresponding to the bypass pipe is controlled so as to switch the destination of the processing liquid in the region to the bypass pipe.

According to this configuration, when the difference between the number of particles (measured value of the contamination state measuring device or calculated value based on it) contained in the processing liquid flowing in the area downstream of the apparatus exceeds the threshold value, the number of particles is higher. It is determined that a device corresponding to the downstream area of the device is a particle generation source. And, as the treatment liquid containing particles is guided to the inner circulation pipe through the bypass pipe corresponding to the downstream region of the device, the diffusion of particles to other parts of the second upstream side or the inner circulation pipe is suppressed or prevented. can do.

In the third aspect, the substrate processing apparatus controls a plurality of the bypass pipes, a plurality of the fourth switching units corresponding to the plurality of bypass pipes on a one-to-one basis, and the plurality of the fourth switching units. The control device further comprises a control device, wherein the plurality of bypass pipes are connected to the second upstream portion at a plurality of sixth connection positions corresponding to the plurality of bypass pipes on a one-to-one basis, and the control When the device starts driving the pump from the state in which the pump is stopped, the plurality of the plurality of the plurality of the plurality from the upstream side, based on the positional relationship of the plurality of the sixth connection position in the flow direction of the chemical liquid. The plurality of the fourth conversion units are controlled to sequentially open the bypass pipe.

In a state in which the pump is stopped, there are cases in which equipment replacement or piping is remodeled. Particles may be attached to the replaced equipment or modified piping. In this state, when the circulation of the treatment liquid is started by the start of driving the pump, there is a possibility that a large amount of particles attached to the replaced equipment or the remodeled pipe will spread to the entire outer circulation passage and/or the inner circulation passage. have.

According to this configuration, when starting the driving of the pump from the state in which the driving of the pump is stopped, the bypass pipe is sequentially opened from the pipe whose sixth connection position is located on the upstream side. Therefore, the flow path through which the processing liquid circulates can be expanded in stages. Thereby, by sequentially opening the bypass pipe, it is possible to circulate the treatment liquid in the inner circulation passage while suppressing or preventing diffusion of particles to other portions of the second upstream side or to the inner circulation pipe.

In the third aspect, the substrate processing apparatus further includes a filter provided through the bypass pipe.

According to this configuration, particles are removed by the filter from the processing liquid flowing through each bypass pipe, and the processing liquid is purified. Since a filter is interposed in each bypass pipe, particles can be efficiently removed from the treatment liquid containing particles.

In the third aspect, the substrate processing apparatus undergoes an abnormal state when the number of particles contained in the processing liquid flowing through the downstream region of the apparatus exceeds a threshold value during the execution of the substrate processing in the processing unit. And, after completion of the substrate processing being performed, the supply of the processing liquid to the processing unit is stopped.

According to this configuration, when the number of particles contained in the processing liquid flowing through the downstream region of the device (measured value of the contamination state measuring device or calculated value based on it) exceeds the threshold value during the execution of the substrate processing in the processing unit. Inform the ideal. Then, the substrate processing being executed continues, and after the substrate processing being executed is finished, the supply of the processing liquid to the substrate processing unit is stopped.

Thereby, it is possible to suppress or prevent the processing liquid containing particles from being supplied to the substrate without extremely lowering the throughput.

In the first to third aspects, the pump includes a bellows pump, including a movable member installed to be reciprocally movable, and a bellows having one end fixed to the housing and the other end fixed to the movable member, and the others When discharging the processing liquid in at least one of the circulation pipe and the inner circulation pipe to the outside of the substrate processing apparatus, the control apparatus controls the bellows pump so that the stroke time of the moving member increases.

The bellows pump has a property of trapping particles flowing from the upstream side or particles generated on the surface of the bellows and collecting them in the bellows. And, as particles are gradually discharged from the bellows pump, there is a fear that the treatment liquid will continue to be contaminated over a long period of time.

According to this configuration, as the stroke time of the moving member of the bellows pump is made longer than usual, particles collected in the bellows are discharged out of the bellows pump. When the processing liquid in the outer circulation pipe and/or the inner circulation pipe is discharged to the outside of the substrate processing apparatus through the drain pipe, the bellows pump is driven so that the stroke time of the moving member of the bellows pump is longer than usual. Thereby, particles in the bellows pump can be discharged out of the substrate processing apparatus.

In addition, by executing such a method at the start of the operation of the bellows pump, the treatment liquid containing particles can be discharged from the bellows pump, the outer circulation passage, and the inner circulation passage, and after that, the clean treatment liquid is transferred to the outer circulation. It can be circulated in the flow path and/or the inner circulation flow path. Thereby, it is possible to reduce the amount of the processing liquid required at the start of driving the bellows pump.

In the first to third aspects, the substrate processing apparatus may further include a heater provided through the second upstream side portion, and a gas releasing portion provided on at least one of an upstream side and a downstream side of the heater.

When circulation of the processing liquid is stopped in the outer circulation passage and the inner circulation passage, the processing liquid collected in the heater may evaporate. The pressure in the heater may increase due to vaporization of the treatment liquid.

According to this configuration, since the gas releasing portion is provided on one of the upstream side and the downstream side of the heater, even when the treatment liquid is vaporized, the generated gas flows out of the heater from the gas releasing portion, and the pressure in the heater does not rise, or Rarely rises. Thereby, it is possible to suppress or prevent a pressure increase in the heater when the circulation of the treatment liquid in the outer circulation passage and the inner circulation passage is stopped.

The above-described or other objects, features, and effects in the present invention will become apparent from the description of the following embodiments with reference to the accompanying drawings.

1 is a schematic view of a substrate processing apparatus according to a first embodiment of the present invention as viewed from above.
Fig. 2 is a schematic diagram of a horizontal view of the inside of a processing unit provided in the substrate processing apparatus.
3 is a block diagram showing the hardware of the substrate processing apparatus.
4 is a process chart for explaining an example of substrate processing performed by the substrate processing apparatus.
5 is a schematic diagram showing a chemical solution supply device of the substrate processing apparatus.
6 is a diagram for explaining the configuration of the pump shown in FIG. 5.
7 is a diagram for explaining the configuration of the filter shown in FIG. 5.
FIG. 8 is a diagram showing an example of a maintenance screen in the display input device shown in FIG. 3.
9 is a diagram for explaining a flow of a chemical liquid in the chemical liquid supply device in a ready state.
Fig. 10 is a diagram for explaining a flow of a chemical liquid in the chemical liquid supplying device in an idle state in which circulation is stopped.
Fig. 11 is a diagram for explaining a flow of a chemical liquid in the chemical liquid supply device in a circulation idle state.
12 is a flowchart for explaining the transition of the operation state of the substrate processing apparatus from the ready state to the idle state.
13 is a diagram for explaining a flow of processing performed in a circulation stop idle state.
Fig. 14 is a diagram for explaining the flow of the chemical liquid immediately after the transition from the circulation stop idle state to the ready state.
15 is a diagram for explaining a flow of processing performed in a circular idle state.
16 is a diagram for explaining a flow of a chemical liquid immediately after transition from a circulation idle state to a ready state.
17 is a diagram for explaining the relationship between the stroke time of the pump and the number of particles to be adhered.
Fig. 18 is a schematic diagram showing a chemical solution supply device of the substrate processing apparatus according to the second embodiment of the present invention.
19 is a diagram for explaining a flow of a chemical liquid in the chemical liquid supply device in a ready state.
Fig. 20 is a diagram for explaining the flow of the chemical liquid immediately after the transition from the circulation stop idle state to the ready state.
Fig. 21A is a schematic diagram showing a chemical solution supply device of the substrate processing apparatus according to the third embodiment of the present invention.
21B is a schematic diagram showing a modified example of the third embodiment of the present invention.
Fig. 21C is a schematic diagram showing a chemical solution supply device of the substrate processing apparatus according to the fourth embodiment of the present invention.
22 is a flowchart for explaining the contents of processing executed in the chemical liquid supply device in a ready state.
23 is a flowchart for explaining a first method for specifying a particle generation source.
24 is a flowchart for explaining a second method for specifying a particle generation source.
Fig. 25 is a schematic diagram showing a chemical liquid supply device of the substrate processing apparatus according to the fifth embodiment of the present invention.
26 is a flowchart for explaining the contents of processing executed in the chemical liquid supply device in the ready state.
Fig. 27 is a diagram for explaining a flow of a chemical liquid immediately after a transition from a circulation stop idle state to a ready state.
Fig. 28 is a diagram showing a state following Fig. 27;
Fig. 29 is a diagram showing a state following Fig. 28;

1 is a schematic view of a substrate processing apparatus according to a first embodiment of the present invention as viewed from above.

The substrate processing apparatus 1 is a single wafer type apparatus that processes a disk-shaped substrate W such as a semiconductor wafer one by one. The substrate processing apparatus 1 transfers the load port LP for holding the carrier C for accommodating the substrate W and the substrate W transferred from the carrier C on the load port LP to a processing liquid or A transfer robot that transfers the substrate W between the processing unit 2 and the carrier C on the load port LP and a plurality of processing units 2 for processing with processing fluids such as processing gas, and substrate processing It has a control device 3 that controls the device 1.

The transfer robot is an indexer robot IR that carries in and carries out the substrate W with respect to the carrier C on the load port LP, and carries in and carries out the substrate W with respect to the plurality of processing units 2. It includes a center robot (CR) that performs. The indexer robot IR transfers the substrate W between the load port LP and the center robot CR, and the center robot CR is between the indexer robot IR and the processing unit 2 The substrate W is transported. The center robot CR includes a hand H1 supporting the substrate W, and the indexer robot IR includes a hand H2 supporting the substrate W.

The substrate processing apparatus 1 includes a plurality of (for example, four) fluid boxes 4 that accommodate fluid devices such as a discharge valve 23 to be described later. The processing unit 2 and the fluid box 4 are arranged in the outer wall 1a of the substrate processing apparatus 1 and are covered with the outer wall 1a of the substrate processing apparatus 1. A chemical liquid cabinet 5 that houses a chemical liquid tank 30 or the like, which will be described later, is disposed outside the outer wall 1a of the substrate processing apparatus 1. The chemical liquid cabinet 5 may be disposed on the side of the substrate processing apparatus 1, or may be disposed under the clean room (underground) in which the substrate processing apparatus 1 is installed.

The plurality of processing units 2 form a plurality (for example, four) of towers TW arranged so as to surround the center robot CR in plan view. The center robot CR can access any tower TW. Each tower TW includes a plurality of (for example, three) processing units 2 stacked up and down. Each of the four fluid boxes 4 corresponds to four towers TW. The chemical liquid in the chemical liquid cabinet 5 is supplied to all the processing units 2 included in the tower TW corresponding to the fluid box 4 via any one of the fluid boxes 4.

FIG. 2 is a schematic view of the inside of the processing unit 2 provided in the substrate processing apparatus 1 as viewed horizontally.

The processing unit 2 includes a box-shaped chamber 6 having an internal space, and a vertical rotation axis A1 passing through the central portion of the substrate W while holding the substrate W horizontally in the chamber 6 It includes a spin chuck 10 that rotates around and a cylindrical cup 14 for receiving the processing liquid discharged from the substrate W.

The chamber 6 includes a box-shaped partition wall 8 provided with a carry-in/out port through which the substrate W passes, a shutter 9 for opening and closing the carry-in/out port, and clean air, which is air filtered by a filter. It includes an FFU 7 (fan filter unit) that forms a flow in the chamber 6. The center robot CR carries the substrate W into the chamber 6 through the carry-in/out port, and takes out the substrate W from the chamber 6 through the carry-in/out port.

The spin chuck 10 includes a disk-shaped spin base 12 held in a horizontal posture, a plurality of chuck pins 11 holding a substrate W in a horizontal posture above the spin base 12, and , A spin motor 13 for rotating the substrate W around the rotation axis A1 as the chuck pin 11 and the spin base 12 are rotated. The spin chuck 10 is not limited to a clamping type chuck in which a plurality of chuck pins 11 are brought into contact with the outer peripheral surface of the substrate W, and the rear surface (lower surface) of the substrate W, which is a non-device formation surface. It may be a vacuum type chuck that holds the substrate W horizontally by adsorbing it on the upper surface of the spin base 12.

The cup 14 includes a cylindrical inclined portion 14a extending upwardly at an angle toward the rotation axis A1, and a cylindrical guide portion extending downward from the lower end (outer end) of the inclined portion 14a ( 14b), and a liquid receiving portion 14c forming an annular groove that is opened in an upward direction. The inclined portion 14a includes a substrate W and an annular upper end having an inner diameter larger than that of the spin base 12. The upper end of the inclined portion 14a corresponds to the upper end of the cup 14. The upper end of the cup 14 surrounds the substrate W and the spin base 12 in plan view.

The processing unit 2 includes an upper position (position shown in Fig. 2) in which the upper end of the cup 14 is positioned above the holding position in which the spin chuck 10 holds the substrate W, and the cup 14 It includes a cup lifting unit 15 for vertically lifting the cup 14 between the upper end of the lower position located below the holding position. When the processing liquid is supplied to the substrate W, the cup 14 is placed in the upper position. The processing liquid scattered outward from the substrate W is received by the inclined portion 14a and then collected in the liquid receiving portion 14c by the guide portion 14b.

The processing unit 2 includes a rinse liquid nozzle 16 that discharges a rinse liquid downward toward the upper surface of the substrate W held by the spin chuck 10. The rinse liquid nozzle 16 is connected to a rinse liquid pipe 17 provided with a rinse liquid valve 18 interposed therebetween. The processing unit 2 is between a processing position in which the rinse liquid discharged from the rinse liquid nozzle 16 is supplied to the substrate W and a retracted position away from the substrate W when the rinse liquid nozzle 16 is viewed from the top. A nozzle moving unit for horizontally moving the rinse liquid nozzle 16 may be provided.

When the rinse liquid valve 18 is opened, the rinse liquid is supplied from the rinse liquid pipe 17 to the rinse liquid nozzle 16 and is discharged from the rinse liquid nozzle 16. The rinse liquid is pure water (deionized water: DIW (Deionized water)), for example. The rinse liquid is not limited to pure water, and may be any one of carbonated water, electrolytic ionized water, hydrogen water, ozone water, ammonia water (for example, 0.1 to 100 ppm), and hydrochloric acid water having a dilution concentration (for example, about 10 to 100 ppm). .

The processing unit 2 includes a discharge nozzle 21 having a discharge port 21a for discharging a chemical liquid downward toward the upper surface of the substrate W held by the spin chuck 10. The discharge nozzle 21 is connected to a supply pipe (discharge port communication pipe) 22 provided with the discharge valve 23 interposed therebetween. The supply of the chemical liquid to the discharge nozzle 21 and the supply stop are switched by the discharge valve 23.

When the discharge valve 23 is opened, the chemical liquid is supplied from the supply pipe 22 to the discharge nozzle 21, and the chemical liquid is discharged from the discharge port 21a of the discharge nozzle 21. The chemical liquid supplied to the discharge nozzle 21 is an organic solvent such as IPA. Further, the chemical liquid supplied to the discharge nozzle 21 may be a sulfuric acid-containing liquid such as SPM (a mixture of sulfuric acid and hydrogen peroxide solution) or sulfuric acid. In addition, the chemical liquid supplied to the discharge nozzle 21 is nitric acid, hydrochloric acid, hydrofluoric acid, phosphoric acid, acetic acid, aqueous ammonia, aqueous hydrogen peroxide, organic acids (e.g., citric acid, oxalic acid, etc.), and organic alkalis (e.g., TMAH: Tetramethylammonium hydroxide, etc.), a surfactant, and a liquid containing at least one of a corrosion inhibitor. Liquids other than this may be supplied to the discharge nozzle 21.

The discharge valve 23 is a discharge execution state in which the supply of the chemical liquid from the supply pipe 22 to the discharge nozzle 21 is executed, and the discharge stop in which the supply of the chemical liquid from the supply pipe 22 to the discharge nozzle 21 is stopped. Switch between states. The discharge stop state may be a state in which the valve body is separated from the valve seat. Although not shown, the discharge valve 23 includes a valve body including an annular valve seat surrounding an internal flow path through which the chemical liquid flows, and a valve body disposed in the internal flow path and movable with respect to the valve seat. The discharge valve 23 may be an air operated valve whose opening degree is changed by pneumatic pressure, or may be an electric valve whose opening degree is changed by electric power. The same applies to other valves unless otherwise specified.

The processing unit 2 includes a processing position in which the chemical liquid discharged from the discharge port 21a of the discharge nozzle 21 is supplied to the upper surface of the substrate W, and the discharge nozzle 21 is separated from the substrate W when viewed in a plan view. And a nozzle moving unit 26 for horizontally moving the discharge nozzle 21 between the retracted positions. The nozzle moving unit 26 is, for example, a turning unit that horizontally moves the discharge nozzle 21 around the swing axis A2 extending vertically around the cup 14.

3 is a block diagram showing the hardware of the substrate processing apparatus 1.

The control device 3 is a computer including a computer main body 3a and a peripheral device 3d connected to the computer main body 3a. The computer main body 3a includes a CPU 3b (central processing unit: a central processing unit) that executes various commands, and a main memory device 3c that stores information. The peripheral device 3d includes an auxiliary storage device 3e for storing information such as a program P, a reading device 3f for reading information from the removable media RM, and a host computer HC. It includes a communication device 3g that communicates with other devices.

The control device 3 is connected to a display input device (selection unit) 3h. The display input device 3h is operated when an operator, such as a user or a maintenance person in charge, inputs information to the substrate processing device 1. Information is displayed on the screen of the display input device 3h. The display input device 3h may be, for example, a touch panel type display device. The input device and the display device may be provided separately from each other. The input device may be any one of a keyboard, a pointing device, and a touch panel, or may be a device other than these.

The CPU 3b executes the program P stored in the auxiliary storage device 3e. The program P in the auxiliary storage device 3e may be installed in advance in the control device 3 or sent from the removable media RM to the auxiliary storage device 3e through the reading device 3f. Alternatively, it may be sent to the auxiliary storage device 3e via the communication device 3g from an external device such as the host computer HC.

The auxiliary memory device 3e and the removable media RM are nonvolatile memories that hold memory even when no power is supplied. The auxiliary storage device 3e is, for example, a magnetic storage device such as a hard disk drive. The removable media RM is, for example, an optical disk such as a compact disk, or a semiconductor memory such as a memory card. The removable media RM is an example of a computer-readable recording medium on which a program P is recorded. The removable media RM is a non-transitory tangible media.

The auxiliary storage device 3e stores a plurality of recipes. The recipe is information that prescribes the processing contents, processing conditions, and processing procedure of the substrate W. The plurality of recipes are different from each other in at least one of the processing contents of the substrate W, processing conditions, and processing procedures. The control device 3 controls the substrate processing device 1 so that the substrate W is processed according to a recipe designated by the host computer HC. The control device 3 is programmed to execute the substrate processing example described later.

4 is a process chart for explaining an example of processing of the substrate W performed by the substrate processing apparatus 1. Hereinafter, reference will be made to FIGS. 1, 2 and 4.

When the substrate W is processed by the substrate processing apparatus 1, a carry-in process of carrying the substrate W into the chamber 6 is performed (step S1 in Fig. 4).

Specifically, with the discharge nozzle 21 retracting from the upper side of the substrate W and the cup 14 being positioned at the lower position, the center robot CR (refer to FIG. 1) is the substrate W. While supporting the hand H2, the hand H2 enters the chamber 6. After that, the center robot CR places the substrate W on the hand H2 on the spin chuck 10 with the surface of the substrate W facing upward. The spin motor 13 starts rotation of the substrate W after the substrate W is gripped by the chuck pin 11. The center robot CR places the substrate W on the spin chuck 10 and then retracts the hand H2 from the inside of the chamber 6.

Next, a chemical liquid supply step of supplying the chemical liquid to the substrate W is performed (step S2 in Fig. 4).

Specifically, the nozzle moving unit 26 moves the discharge nozzle 21 to the processing position, and the cup lifting unit 15 raises the cup 14 to the upper position. After that, the discharge valve 23 is opened, and the discharge nozzle 21 starts to discharge the chemical liquid. When the discharge nozzle 21 is discharging the chemical liquid, the nozzle moving unit 26 is located at a central processing position where the chemical liquid discharged from the discharge port 21a of the discharge nozzle 21 collides with the upper surface center of the substrate W. , The discharge nozzle 21 may be moved between the outer processing positions in which the chemical liquid discharged from the discharge nozzle 21 collides with the upper surface outer peripheral portion of the substrate W, and the liquid deposition position of the chemical liquid is located in the center of the upper surface of the substrate W. The discharge nozzle 21 may be stopped so as to be positioned.

The chemical liquid discharged from the discharge nozzle 21 collides with the upper surface of the substrate W and then flows outward along the upper surface of the rotating substrate W. Thereby, a liquid film of the chemical liquid is formed covering the entire upper surface of the substrate W, and the chemical liquid is supplied to the entire upper surface of the substrate W. Particularly, when the nozzle moving unit 26 moves the discharge nozzle 21 between the central processing position and the outer processing position, the entire upper surface of the substrate W is scanned at the position where the chemical solution is deposited, so that the chemical solution is transferred to the substrate ( It is uniformly supplied to the entire upper surface of W). Thereby, the upper surface of the substrate W is uniformly processed. When a predetermined time elapses after the discharge valve 23 is opened, the discharge valve 23 is closed, and the discharge of the chemical solution from the discharge nozzle 21 is stopped. After that, the nozzle moving unit 26 moves the discharge nozzle 21 to the retracted position.

Next, a rinse liquid supply step of supplying pure water, which is an example of the rinse liquid, to the upper surface of the substrate W is performed (step S3 in Fig. 4).

Specifically, the rinse liquid valve 18 opens, and the rinse liquid nozzle 16 starts discharging pure water. The pure water deposited on the upper surface of the substrate W flows outward along the upper surface of the rotating substrate W. The chemical liquid on the substrate W is washed off by the pure water discharged from the rinse liquid nozzle 16. As a result, a pure liquid film covering the entire upper surface of the substrate W is formed. When a predetermined time elapses after the rinse liquid valve 18 is opened, the rinse liquid valve 18 is closed, and the discharge of pure water is stopped.

Next, a drying process of drying the substrate W is performed by high-speed rotation of the substrate W (step S4 in Fig. 4).

Specifically, the spin motor 13 accelerates the substrate W in the rotational direction, at a high rotational speed (for example, thousands of rpm) greater than the rotational speed of the substrate W in the chemical solution supplying process and the rinse solution supplying process. The substrate W is rotated. Thereby, the liquid is removed from the substrate W, and the substrate W is dried. When a predetermined time elapses after the high-speed rotation of the substrate W is started, the spin motor 13 stops rotating. Thereby, the rotation of the substrate W is stopped.

Next, a carrying out step of carrying out the substrate W from the chamber 6 is performed (step S5 in Fig. 4).

Specifically, the cup lifting unit 15 lowers the cup 14 to the lower position. After that, the center robot CR (refer to FIG. 1) causes the hand H2 to enter the chamber 6. The center robot CR supports the substrate W on the spin chuck 10 with the hand H2 after the plurality of chuck pins 11 release the holding of the substrate W. After that, the center robot CR makes the hand H2 retract from the inside of the chamber 6 while supporting the substrate W with the hand H2. Thereby, the processed substrate W is carried out from the chamber 6.

5 is a schematic diagram showing a chemical liquid supply device CS1 of the substrate processing device 1. 6 is a diagram for explaining the configuration of the pump 37. 7 is a diagram for explaining the configuration of the filter 39. In FIG. 5, the fluid box 4 is indicated by a dashed-dotted line, and the chemical liquid cabinet 5 is indicated by a double-dashed line. A member arranged in the area surrounded by the dashed-dotted line is arranged in the fluid box 4, and the member arranged in the area surrounded by the double-dashed line is arranged in the chemical liquid cabinet 5.

The chemical liquid supply device CS1 of the substrate processing apparatus 1 includes a chemical liquid tank (processing liquid tank) 30 that stores a chemical liquid supplied to the substrate W, and a plurality of chemical liquids circulating the chemical liquid in the chemical liquid tank 30. Includes circulation piping.

As shown in Fig. 5, the plurality of circulation pipes includes a first circulation pipe (outer circulation pipe) 31 in which an upstream end 31a and a downstream end 31b are connected to the chemical liquid tank 30, and a first And a second circulation pipe (internal circulation pipe) 32 which is branchly connected to the circulation pipe 31 and is a return pipe for returning the chemical liquid in the first circulation pipe 31 to the chemical liquid tank 30. The first circulation pipe 31 is an upstream portion (second upstream portion) 33 on the upstream side of the connection position P2 (second connection position) to which the second circulation pipe 32 is connected, and It includes a downstream portion (second downstream portion) 34 on the downstream side from the connection position P2. In the example of FIG. 5, the chemical liquid tank 30 and the first circulation pipe 31 form a first circulation passage C1 for circulating the chemical liquid in the chemical liquid tank 30. In the example of FIG. 5, the chemical liquid tank 30, the upstream portion 33, and the second circulation pipe 32 form a second circulation flow path C2 for circulating the chemical liquid in the chemical liquid tank 30. do. In the example of FIG. 5, the first circulation passage C1 is arranged not only in the chemical liquid cabinet 5 but also in the fluid box 4, and the second circulation passage C2 is only in the chemical liquid cabinet 5. It is placed.

In the first embodiment, the first circulation passage C1 constitutes an outer circulation passage, and the second circulation passage C2 constitutes an inner circulation passage circulating inside the outer circulation passage.

In the example of FIG. 5, the first circulation passage C1 constitutes an outer circulation passage extending to the fluid box 4. The first circulation flow path C1 supplies a chemical solution to each of the plurality of processing units 2. Specifically, a plurality of supply pipes (discharge port communication pipes) 22 are connected to the first circulation pipe 31 and branch from the first circulation pipe 31. The plurality of supply pipes 22 correspond to the plurality of processing units 2 on a one-to-one basis. The chemical liquid supplied to the supply pipe 22 from the first circulation passage C1 is supplied to the processing unit 2 corresponding to the supply pipe 22.

In addition, in the example of FIG. 5, the first circulation pipe 31 includes a common pipe 35 extending downstream from the chemical liquid tank 30 and a plurality of individual pipes 36 branching from the common pipe 35. Includes. The upstream end of the common pipe 35 corresponds to the upstream end of the first circulation pipe 31. The upstream end of the common pipe 35 is connected to the chemical liquid tank 30. The downstream end of each individual pipe 36 corresponds to the downstream end of the first circulation pipe 31. The downstream end of each individual pipe 36 is connected to the chemical liquid tank 30. The upstream side portion 33 of the first circulation pipe 31 is included in the common pipe 35. The connection position P2 is set in the common pipe 35. Accordingly, the second circulation pipe 32 is connected to the common pipe 35. The downstream portion 34 of the first circulation pipe 31 includes a part of the common pipe 35 and a plurality of individual pipes 36.

Each of the plurality of individual pipes 36 corresponds to a plurality of towers TW. 5 shows the whole of one individual pipe 36 and a part of the remaining three individual pipes 36 (upstream end and downstream end). 5 shows three processing units 2 included in the same tower TW. The three supply pipes 22 corresponding to the three processing units 2 included in the same tower TW are connected to the same individual pipe 36. In other words, in the first circulation pipe 31, the supply pipe 22 is branchly connected to a connection position (first connection position) P1 set downstream from the connection position P2.

Each individual pipe 36 is provided with a first circulation valve 40 for opening and closing the individual pipe 36. When the first circulation valve 40 is closed, the chemical liquid flowing through the common pipe 35 is not guided to each individual pipe 36 (i.e., the chemical liquid flowing through the upstream portion 33 is on the downstream side). It is not guided to part 34). Then, when the first circulation valve 40 is opened, the chemical liquid flowing through the common pipe 35 is guided to each individual pipe 36 (that is, the chemical liquid flowing through the upstream portion 33 is transferred to the downstream portion ( 34).

As shown in FIG. 5, the chemical liquid supply device CS1 of the substrate processing apparatus 1 includes a pump 37 that sends the chemical liquid in the chemical liquid tank 30 to the first circulation pipe 31, and a chemical liquid tank 30. ), a heater 38 for heating the chemical liquid in the chemical liquid tank 30 to adjust the temperature of the chemical liquid in the chemical liquid tank 30, and a filter 39 for removing foreign matter from the chemical liquid flowing through the first circulation pipe 31. The pump 37, the heater 38, and the filter 39 are provided in the upstream side portion 33 in this order from the chemical liquid tank 30 side. The heater 38 heats the chemical liquid flowing through the upstream portion 33. Although not shown, at least one of a flow meter and a temperature sensor may be provided in the upstream side part 33 interposed therebetween. Although not shown, the supply piping 22 may be provided with at least one of a flow meter, a flow rate adjustment unit, and a heater interposed therebetween. Although not shown, on the downstream side of the connection position P1 and the upstream side of the connection position P3 mentioned later, a flow meter and a flow rate adjustment unit may be provided.

The pump 37 is, for example, a bellows pump. In this case, as shown in FIG. 6, in the pump 37, one pump chamber 44 and the other pump chamber 45 are formed into partitions. One pump chamber 44 is formed by one cylinder head 41, a pump head 42, and a cylinder 43 interposed therebetween. The other pump chamber 45 is formed by the other cylinder head 41, the pump head 42, and a cylinder 43 interposed therebetween.

The pump 37 further includes two substantially disk-shaped moving members 46 arranged in one pump chamber 44 and the other pump chamber 45, and two resin bellows 47 formed freely from expansion and contraction. Includes. One end of each bellows 47 is connected to a corresponding moving member 46, and the other end of each bellows 47 is fixed to a pump head (housing) 42. In one pump chamber 44, a bellows 47 separates one air chamber 48 on the outer side of the bellows 47 and a chemical liquid chamber 49 on the inner side of the bellows 47 from each other. Is formed. In addition, in the other pump chamber 45, the other side air chamber 50 on the outside of the bellows 47 and the other chemical liquid chamber 51 on the inside of the bellows 47 by the bellows 47, They are formed in isolation from each other. In the pump head 42, a chemical solution introduction port 55 on one side for introducing a chemical solution into the chemical solution chamber 49 on one side, and a chemical solution introduction port 56 on the other side for introducing a chemical solution into the chemical solution chamber 51 on the other side. ), and a chemical solution outlet port 57 for extracting a chemical solution from the inside of the chemical solution chamber 49 on one side and the chemical solution chamber 51 on the other side.

When one air chamber 48 is open, air is supplied to the other air chamber 50, and the air pressure in the other air chamber 50 increases, the air pressure causes the other pump chamber ( 45) The moving member 46 moves toward the pump head 42 side. Thereby, the volume of the chemical liquid chamber 51 on the other side is reduced, and the chemical liquid in the chemical liquid chamber 51 on the other side is delivered from the chemical liquid lead-out port 57. In conjunction with this, the moving member 46 in the pump chamber 44 on one side moves to the cylinder head 41 side. Thereby, the volume of the one-sided chemical liquid chamber 49 is enlarged, and the chemical liquid is sucked into the one-sided chemical liquid chamber 49 from the one-sided chemical liquid introduction port 55.

Contrary to this, when air is supplied to one air chamber 48 with the other air chamber 50 open, and the air pressure in one air chamber 48 increases, the air pressure , The moving member 46 in the pump chamber 44 on one side moves to the pump head 42 side. Thereby, the volume of the one-sided chemical liquid chamber 49 is reduced, and the chemical liquid in the one-sided chemical liquid chamber 49 is delivered from the chemical liquid lead-out port 57. In conjunction with this, the moving member 46 in the pump chamber 45 on the other side moves to the cylinder head 41 side. Thereby, the volume of the other chemical liquid chamber 51 is enlarged, and the chemical liquid is sucked into the other chemical liquid chamber 51 from the other chemical liquid introduction port 56.

In this way, when the moving member 46 reciprocates between the cylinder head 41 and the pump head 42, the chemical solution is delivered from the chemical solution extraction port 57, and the chemical solution from the chemical solution tank 30 is first It can be delivered to the circulation pipe 31.

The pump 37, in its driving state, is the chemical liquid in the chemical liquid tank 30 regardless of the type of the operation state of the substrate processing apparatus 1 (ready state, circulation stop idle state, circulation idle state). It is continuously sent to the first circulation pipe 31 at a constant pressure. The substrate processing apparatus 1 is provided with a pressurizing device for pushing the chemical liquid in the chemical liquid tank 30 to the first circulation pipe 31 by raising the atmospheric pressure in the chemical liquid tank 30 in place of the pump 37. You can do it. Both the pump 37 and the pressurizing device are examples of pumps that send the chemical liquid in the chemical liquid tank 30 to the first circulation pipe 31.

As shown in Fig. 5, the heater 38 is a heater that generates Joule heat. At least one of the upstream side and the downstream side of the heater 38 is provided with a gas releasing portion (not shown). When the circulation of the chemical liquid is stopped in both the first circulation flow path C1 and the second circulation flow path C2, the chemical liquid collected in the heater 38 may evaporate. However, since a gas releasing portion is provided on one of the upstream and downstream sides of the heater 38, even when the chemical liquid is vaporized, the generated gas flows out of the heater 38 from the gas releasing portion, and the pressure in the heater 38 It doesn't rise or it hardly rises. Thereby, it is possible to suppress or prevent an increase in pressure in the heater 38 when the circulation of the chemical solution is stopped in both the first circulation passage C1 and the second circulation passage C2.

As shown in FIG. 7, the filter 39 includes a filter body 61 and a housing 62 that holds the filter body 61 therein. The housing 62 can be opened and closed, and the filter body 61 is attached to the housing 62 so as to be removable. The filter body 61 is, for example, in a cylindrical shape with one end closed. The interior of the housing 62 is divided by the filter body 61 into a primary side space (the primary side of the filter 39) (X1) and a secondary side space (the secondary side of the filter 39) (X2). . The primary side space X1 is a space inside the filter body 61. The secondary side space X2 is a space outside the filter body 61 among the spaces inside the housing 62.

The filter body 61 is, for example, a standard closed type filter. The filter 39 filters the chemical liquid flowing through the primary side space X1, and removes particles from the chemical liquid. Throughout the filter body 61, a plurality of holes extending from the inner surface of the filter body 61 to the outer surface of the filter body 61 and passing through the filter body 61 in the thickness direction of the filter body 61 ( 63) is formed. The hole 63 may be, for example, a square shape when viewed from the thickness direction of the filter body 61, or a polygonal shape other than a regular square shape, a circle shape, or an ellipse shape when viewed from the thickness direction of the filter body 61. do.

The chemical liquid flows from the primary-side space X1 toward the secondary-side space X2 and passes through the hole 63 of the filter body 61. Particles contained in the chemical liquid flowing through the primary side space X1 are adsorbed by the wall surface of the filter body 61 partitioning the hole 63 when passing through the hole 63, and are trapped in the hole 63. . Thereby, particles are removed from the chemical liquid.

In the filter 39 of this type, the particle trapping ability of the filter 39 changes with fluctuations in pressure applied to the filter 39. In the state in which pressure is applied to the filter 39, smaller particles can be captured as compared to the state in which no pressure is applied to the filter 39. And, as the pressure applied to the filter 39 increases, even smaller particles can be captured. In other words, when the pressure applied to the filter 39 decreases, the particles that can be trapped increase, and the particle trapping ability of the filter 39 decreases. That is, due to the fluctuation of the pressure applied to the filter 39, the particle trapping ability of the filter 39 changes. When the particle capturing ability of the filter 39 is lowered, there is a possibility that the particles captured by the filter 39 may flow out from the filter 39 to the secondary side before the capturing capacity decreases.

In addition, in this type of filter 39, as the number of particles captured by the filter 39 gradually increases as the filter 39 continues to be used, the filter 39 is gradually clogged, and the adsorption performance of the filter 39 is reduced. Slowly declines. As a result, the particle capturing ability by the filter 39 decreases.

5 and 7, the chemical liquid supply device CS1 of the substrate processing apparatus 1 includes an air draining pipe 64 for removing air bubbles (air) on the primary side in the filter 39, and a filter. (39) A drain pipe (66) for discharging the liquid inside is further provided. The air draining pipe 64 is used to remove air bubbles in the filter 39 that cause the generation of particles. Specifically, one end (upstream end) of the air draining pipe 64 and the drainage pipe 66 is connected to the primary side of the filter 39 (in the primary-side space X1). The other end of the air draining pipe 64 is connected to the chemical liquid tank 30. As shown in FIG. 5, the air bleeding pipe 64 is provided with an air bleeding valve 65 for opening and closing the air bleeding pipe 64. The other end of the drain pipe 66 is connected to the drain tank 80. The drain pipe 66 is provided with a drain valve 67 for opening and closing the drain pipe 66.

As shown in FIG. 5, the chemical liquid supply device CS1 of the substrate processing apparatus 1 includes a second circulation valve (internal circulation valve) 70 provided through the second circulation pipe 32, and a first And a pressure adjusting unit that adjusts the pressure of the chemical liquid flowing through the upstream side portion 33 of the circulation pipe 31. The pressure adjustment unit is an opening degree adjustment unit that adjusts the opening degree of the second circulation pipe 32. The opening degree adjustment unit is installed through the second circulation pipe 32. In the example of FIG. 5, the opening degree adjustment unit is the regulator 71. The regulator 71 is, for example, an electric power regulator. The opening degree adjustment unit is not limited to the regulator 71, and may be an electric valve such as a relief valve or an electric needle valve. Moreover, the opening degree adjustment unit may be integrated with the 2nd circulation valve 70.

The pressure adjustment unit further includes a pressure sensor 72 that detects the pressure of the chemical liquid in the upstream portion 33. The pressure sensor 72 detects the pressure of the chemical liquid in the upstream portion 33 at a predetermined detection position P11 on the upstream portion 33. In the circulating idle state of the substrate processing apparatus 1, the pressure of the chemical liquid flowing through the filter 39 is substantially equal to the pressure of the chemical liquid at the detection position P11. Therefore, it can be considered that detecting the pressure of the chemical liquid in the upstream portion 33 at the detection position P11 by the pressure sensor 72 is substantially equivalent to detecting the pressure of the chemical liquid flowing through the filter 39. have. The detection position P11 may be upstream of the filter 39 or downstream of the filter 39 as shown in FIG. 5.

As shown in FIG. 5, the chemical liquid supply device CS1 of the substrate processing apparatus 1 further includes a drain tank 80 for storing the chemical liquid discharged from the chemical liquid tank 30. A discharge pipe 81 extending toward the liquid discharge tank 80 is connected to the chemical liquid tank 30. A discharge valve 82 that opens and closes the discharge pipe 81 is provided in the middle of the discharge pipe 81. When discharging the chemical liquid in the chemical liquid tank 30, the discharge valve 82 opens. Thereby, the chemical liquid in the chemical liquid tank 30 is delivered from the chemical liquid tank 30 to the drain tank 80 and is stored in the drain tank 80.

A drain pipe 83 is connected to the drain tank 80. The chemical liquid stored in the drainage tank 80 is sent to a drainage treatment facility other than the substrate processing device 1 by opening a valve (not shown) provided through the drainage pipe 83, and a drainage treatment in this drainage treatment facility. do.

In the vicinity of the downstream end of each individual pipe 36 (that is, near the downstream end of the first circulation pipe 31), one end of a branch drainage pipe (drainage pipe) 85 is branched connected. The other end of the branch drain pipe 85 is connected to the drain tank 80. A branch drain valve 86 for opening and closing the branch drain pipe 85 is provided in the middle of the branch drain pipe 85. In each individual piping 36, a return valve 89 for opening and closing the individual piping 36 is provided on the downstream side of the connection position (third connection position) P3 of the branch drainage piping 85. .

The branch drain valve 86 and the return valve 89 constitute a first switching unit. The 1st switching unit is the destination of the chemical liquid upstream from the connection position P3 in the downstream part 34 of the 1st circulation pipe 31, and the connection position P3 in the downstream part 34 It switches between the downstream side and the branch drainage piping (drainage piping) 85. The first switching unit may be provided with a three-way valve in place of or in addition to the branch drain valve 86 and the return valve 89.

When the return valve 89 is opened with the branch drain valve 86 closed, the chemical liquid flowing upstream from the connection position P3 of the branch drain pipe 85 in the individual piping 36 is the individual piping. It is guided to the chemical liquid tank 30 through a part downstream from the connection position P3 in (36). On the other hand, by opening the branch drain valve 86 with the return valve 89 closed, the chemical liquid flowing upstream from the connection position P3 of the branch drain pipe 85 in the individual pipe 36 , It is guided to the drainage tank 80 through the branch drainage pipe 85.

As shown in Fig. 5, the chemical solution supplying device CS1 of the substrate processing apparatus 1 includes a chemical solution replenishing pipe 87 for replenishing a new chemical solution (new solution), that is, an unused chemical solution, to the chemical solution tank 30. , A chemical liquid supplement valve 88 for opening and closing the chemical liquid supplement pipe 87.

The operation state of the substrate processing apparatus 1 is a ready state (an executable state, which is an operation state in which the processing can be executed in the processing unit 2), and the processing unit 2 is incapable of executing the processing. Includes an idle state (standby state) that is a phosphorus (not ready) operating state. When the supply of electric power to the substrate processing apparatus 1 is started by the activation of the substrate processing apparatus 1, the substrate processing apparatus 1 enters an idle state. Thereafter, as the ready operation is performed, the substrate processing apparatus 1 shifts to the ready state. In the ready state of the substrate processing apparatus 1, the substrate processing operation (lot processing) by the substrate processing apparatus 1 can be realized.

When it is necessary to perform maintenance work on the substrate processing apparatus 1 (check for errors, replacement of equipment, replacement of consumables, etc.), the maintenance person in charge shall set the substrate processing apparatus 1 in a ready state to an idle state. Implement. Then, with respect to the substrate processing apparatus 1 in the idle state, a maintenance person in charge performs maintenance work. That is, only in the idle state of the substrate processing apparatus 1, a maintenance operation can be performed on the substrate processing apparatus 1. Then, as the ready operation is performed after the maintenance operation is finished, the operation state of the substrate processing apparatus 1 shifts to the ready state.

The ready state of the substrate processing apparatus 1 is a state in which the chemical solution can be supplied to the processing unit 2 in terms of the chemical solution supply device CS1. The idle state of the substrate processing apparatus 1 is an operation state in which the chemical solution cannot be supplied to the processing unit 2 (not ready), as for the chemical solution supply device CS1.

The idle state of the substrate processing apparatus 1 is a circulation stop idle state (circulation stop standby state) in which circulation of the chemical solution is stopped in both the first circulation passage C1 and the second circulation passage C2, and the first It includes a circulation idle state (circulation standby state) in which circulation of the chemical solution in the second circulation passage C2 is continued while the circulation of the chemical solution in the circulation passage C1 is stopped. That is, in the substrate processing apparatus 1, two types of idle states are prepared. In any idle state, power supply to the substrate processing apparatus 1 is maintained. For this reason, in the idle state of the substrate processing apparatus 1, it is possible to perform operations (operations such as a transfer robot) required for maintenance of individual driving parts of the substrate processing apparatus 1.

8 is a diagram showing an example of a maintenance screen 90 in the display input device 3h.

When performing maintenance work in the substrate processing apparatus 1, the maintenance person in charge operates the maintenance screen 90 in the display input device 3h. On the maintenance screen 90, as shown in FIG. 8, a button for stopping the substrate transfer process in the substrate processing apparatus 1 and a system restart button 91 operated to return to the ready state. And, a button for a down (idle state) operation of the substrate processing apparatus 1 and an emergency stop button 92 are displayed.

Buttons for stop operation of the substrate transfer process in the substrate processing apparatus 1 include a transfer stop button 93 and a cycle stop button 94. When the transfer stop button 93 is operated in the ready state of the substrate processing apparatus 1, the center robot CR and the indexer robot IR that are carrying out the substrate transfer immediately stop the operation. When the cycle stop button 94 is operated, the center robot CR and the indexer robot IR stop the operation after the substrate transfer process being executed at that time is ended.

Buttons for down operation of the substrate processing apparatus 1 include a circulation stop idle button 95 for shifting the substrate processing apparatus 1 to the circulation stop idle state, and the substrate processing apparatus 1 transition to the circulation idle state. It includes a cycle idle button 96 for making it possible. When the circulation stop idle button 95 is operated in the ready state of the substrate processing apparatus 1, the substrate processing apparatus 1 shifts to the circulation stop idle state. When the circulating idle button 96 is operated in the ready state of the substrate processing apparatus 1, the substrate processing apparatus 1 shifts to the circulating idle state. That is, by the operation of the maintenance screen 90 by the maintenance person in charge, selection of the circulation idle state and the circulation stop idle state is executed.

9 is a diagram for explaining the flow of the chemical liquid in the chemical liquid supply device CS1 in a ready state.

In the lower part of Fig. 9, two valves and two pumps are drawn. Of the two valves, the upper valve (a part of which is completely painted in black) shows the state in which the valve is open (indicated as ``OPEN'' in Fig. 9), and the lower valve is the state in which the valve is closed ( In Fig. 9, "CLOSE") is shown. Among the two pumps, the upper pump (some of which has been completely painted in black) shows a state in which the pump is sending liquid (indicated as ``ON'' in Fig. 9), and the lower pump is the pump It shows a state in which it is not being sent (indicated as "OFF" in FIG. 9). This is also the same in Figs. 10, 11, 14, 16, 19, 20, and 27 to 29.

In the ready state of the substrate processing apparatus 1, the pump 37 is in a driven state, and the second circulation valve 70 and the first circulation valve 40 are open. In this state, the air bleed valve 65 is open, and the drain valve 67 is closed. Further, in this state, the return valve 89 is open and the branch drain valve 86 is closed. In this state, the discharge valve 82 is closed.

In the ready state of the substrate processing apparatus 1, the chemical liquid in the chemical liquid tank 30 is sent to the upstream side portion 33 of the first circulation pipe 31 by the pump 37, and the connection position P2 Pass through. Thereby, the chemical liquid flows from the upstream side part 33 to the downstream side part 34, and returns to the chemical liquid tank 30 from the downstream side part 34. Previously, foreign matter contained in the chemical solution is removed by the filter 39. Moreover, the chemical liquid in the chemical liquid tank 30 is heated by the heater 38 so that it may become a temperature prescribed|regulated by a recipe, and is sent to the downstream part 34. Thereby, the chemical liquid in the chemical liquid tank 30 is sent to the downstream portion 34 while being maintained at a constant temperature higher than the temperature of the atmosphere in the processing unit 2 (for example, 20 to 26°C).

The chemical liquid in the upstream portion 33 of the first circulation pipe 31 flows into the downstream portion 34 from the connection position P2, and from the connection position P2 to the second circulation pipe 32 Flow in. The chemical liquid flowing into the second circulation pipe 32 returns to the chemical liquid tank 30 from the downstream end of the second circulation pipe 32.

That is, in the ready state, the chemical liquid circulates through the first circulation flow path C1 and the chemical liquid circulates through the second circulation flow path C2 (double circulation state).

If, in the ready state of the substrate processing apparatus 1, the circulation of the chemical liquid in the second circulation passage C2 is stopped, the chemical liquid does not move in the second circulation pipe 32, and the second circulation pipe ( There is a risk of particles accumulating in 32). In order to prevent such particles from accumulating, circulation of the chemical liquid in the second circulation passage C2 is not stopped in the ready state of the substrate processing apparatus 1.

Fig. 10 is a diagram for explaining the flow of the chemical liquid in the chemical liquid supply device CS1 in an idle state in which circulation is stopped.

In the circulation stop idle state of the substrate processing apparatus 1, the pump 37 is in a drive stop state. The second circulation valve 70 and the first circulation valve 40 are closed. Other valves are also closed.

In the circulation stop idle state, since the drive of the pump 37 is stopped, the circulation of the chemical liquid is stopped in both the first circulation passage C1 and the second circulation passage C2. And, in the circulation stop idle state, the chemical liquid stays in the middle part of the 1st circulation flow path C1 and the 2nd circulation flow path C2. Specifically, the entire area of the upstream portion 33, the upstream side of the first circulation valve 40 in the downstream portion 34, and the second circulation valve 70 in the second circulation pipe 32 ), the chemical solution remains on the upstream side. Of course, it goes without saying that the chemical solution also remains in the pump 37, the heater 38, and the filter 39.

At this time, there is a high possibility that a large number of particles are contained in the chemical liquid remaining in the secondary side space X2 of the filter 39. This is considered to be the following cause. In other words, by stopping the drive of the pump 37, there is no movement of the chemical liquid in the filter 39, and the pressure of the chemical liquid is not applied to the filter 39. Therefore, the particles captured by the filter 39 flow out to the secondary space X2 and accumulate in the chemical liquid remaining in the secondary space X2.

In particular, when the chemical liquid is a sulfuric acid-containing liquid, the amount of particles generated due to oxidation of the chemical liquid in the pipe increases. Even when the chemical liquid is IPA, the amount of particles generated due to elution of the pipe (resin pipe) increases. Therefore, when the chemical liquid is a sulfuric acid-containing liquid or IPA, the amount of particles contained in the chemical liquid remaining in the secondary side space X2 of the filter 39 is further increased.

11 is a diagram for explaining the flow of the chemical liquid in the chemical liquid supply device CS1 in a circulation idle state.

In the circulation idle state of the chemical liquid supply device CS1, the pump 37 is in a driving state. In this state, the second circulation valve 70 is open and the first circulation valve 40 is closed. In this state, the air bleed valve 65 is open and the drain valve 67 is closed. All other valves are closed.

The chemical liquid in the upstream portion 33 does not flow into the downstream portion 34 from the connection position P2, but flows only into the second circulation pipe 32. The chemical liquid flowing into the second circulation pipe 32 returns to the chemical liquid tank 30 from the downstream end of the second circulation pipe 32.

That is, in the circulation idle state, the chemical liquid does not circulate through the first circulation flow passage C1, and the chemical liquid circulates through the second circulation flow passage C2 (one-way circulation state).

12 is a flowchart for explaining the transition of the operation state of the substrate processing apparatus 1 from the ready state to the idle state.

In the ready state of the substrate processing apparatus 1, as the button for down operation is operated (step S11), the operation state of the substrate processing apparatus 1 shifts from the ready state to the idle state. Specifically, either one of the circulation stop idle state and the circulation idle state is selected, and a button corresponding to the selected idle state is operated (step S12). When the circulation stop idle button 95 (see Fig. 8) is operated, the substrate processing apparatus 1 shifts to the circulation stop idle state. When the circulation idle button 96 (see Fig. 8) is operated, the substrate processing apparatus 1 shifts to the circulation idle state.

When the circulation stop idle button 95 is operated (YES in step S12), the control device 3 stops driving the pump 37 (step S13), and furthermore, the first circulation valve 40 and the second circulation The valve 70 is closed (step S14). In addition, the control device 3 also closes other valves. Thereby, the substrate processing apparatus 1 shifts to the cycle stop idle state.

On the other hand, when the circulation idle button 96 is operated (NO in step S12), the control device 3 continues to drive the pump 37 (step S16), and the first circulation valve 40 (Fig. 12) In the following, "outer circulation valve 40") is closed (step S17). Then, the control device 3 controls the regulator 71 so that the pressure of the chemical liquid flowing through the upstream portion 33 coincides with or approaches the pressure of the chemical liquid flowing through the upstream portion 33 in the ready state. Control (step S18). The pressure of the chemical liquid flowing through the upstream portion 33 is adjusted by adjusting the opening degree of the second circulation pipe 32 by the regulator 71.

Specifically, the pressure of the chemical liquid at the detection position P11 of the upstream portion 33 is detected by the pressure sensor 72. The control device 3 stores the value of the pressure of the chemical liquid at the detection position P11 in the ready state. Then, the control device 3 controls the regulator 71 so that the pressure of the chemical liquid at the detection position P11 coincides with or approaches the stored pressure value. Thereby, the pressure of the chemical liquid flowing through the upstream portion 33 is maintained at or near the value of the pressure of the chemical liquid flowing through the upstream portion 33 in the ready state.

Thereby, the substrate processing apparatus 1 shifts to the cycle idle state.

13 is a diagram for explaining a flow of processing performed in a circulation stop idle state. Fig. 14 is a diagram for explaining the flow of the chemical liquid immediately after the transition from the circulation stop idle state to the ready state.

In the cycle stop idle state of the substrate processing apparatus 1, the maintenance person in charge performs maintenance work (step S21 in Fig. 13). In the circulation stop idle state, the drive of the pump 37 is stopped, and the circulation of the chemical liquid in the circulation flow path (the first circulation flow path C1 and the second circulation flow path C2) is stopped. Therefore, the maintenance person in charge can perform maintenance work on the processing unit 2, the conveyance robot, etc. in the circulation stop idle state. In addition, the maintenance person in charge of the maintenance work on the chemical liquid supply device CS1, that is, the maintenance work on the equipment and piping inside the fluid box 4 or the chemical liquid cabinet 5 (equipment and Piping can be remodeled, repaired and replaced, or consumables are replaced. Hereinafter, these can be simply referred to as "remodeling of equipment, etc."). However, in the circulation stop idle state, it is preferable to perform maintenance work on the equipment or piping inside the chemical liquid cabinet 5 which cannot be maintained in the circulation idle state.

In the cycle stop idle state of the substrate processing apparatus 1, when the system resume button 91 (see FIG. 8) is operated (ready, YES in step S22 in FIG. 13), the operation state of the substrate processing apparatus 1 Transitions to the ready state (step S23 in Fig. 13). Specifically, as shown in FIG. 14, the control device 3 restarts the drive of the pump 37 and opens the first circulation valve 40. In addition, the control device 3 immediately after the transition to the ready state, as shown in Fig. 14, in a state where the return valve 89 and the air bleed valve 65 are closed, the branch drain valve 86 and the drain Open valve 67. Thereby, the chemical liquid remaining in the first circulation passage C1 and the second circulation passage C2 is not returned to the chemical liquid tank 30 and is discharged to the drainage tank 80. The discharge period at this time is the pump 37 so that the whole of the chemical liquid stored in the first circulation flow path C1 and the second circulation flow path C2 can be replaced with a new chemical liquid supplied after restarting the drive of the pump 37. It is set based on the supply capacity, chemical liquid viscosity, pipe diameter, and pipe length.

When a predetermined period elapses after the branch drain valve 86 is opened, the control device 3 closes the branch drain valve 86 and the drain valve 67 and opens the return valve 89. Thereby, it returns to the ready state shown in Fig. 9 (step S24 in Fig. 13). In this ready state, processing (production lot processing) is performed on the substrate W in the processing unit 2.

15 is a diagram for explaining a flow of processing performed in a circular idle state. 16 is a diagram for explaining a flow of a chemical liquid immediately after transition from a circulation idle state to a ready state.

Conventionally, as an idle state of a substrate processing apparatus, a circulation idle state has not been provided. Therefore, in the idle state of the substrate processing apparatus, the drive of the pump was stopped and the circulation of the chemical solution in the circulation passage was stopped. In the state in which the pump is stopped, the pressure of the chemical liquid applied to the filter becomes zero, so that particles flow out of the filter. Therefore, after restarting the circulation of the chemical liquid in the circulation passage, a large number of particles exist in the circulation passage. For this reason, it is necessary to perform preliminary circulation in which the chemical liquid is preliminarily circulated in the circulation passage or flushing in which the chemical liquid in the circulation passage is replaced. However, these preliminary circulation and flushing require a great deal of time. Not only that, but in flushing, a large amount of chemicals were consumed.

In the circulating idle state of the substrate processing apparatus 1, since there is no drive stop of the pump 37, there is no need to perform preliminary circulation or flushing after restarting from the circulating idle state.

In the cycle idle state of the substrate processing apparatus 1, the maintenance person in charge performs maintenance work (step S31 in Fig. 15). In the circulation idle state, the pump 37 is driven and the chemical liquid is circulated in the second circulation flow path C2, but the circulation of the chemical liquid is stopped in the first circulation flow path C1. Therefore, the maintenance person in charge can perform maintenance work on the processing unit 2, the conveyance robot, etc. in the circulation idle state. In addition, the maintenance person in charge performs maintenance work on the chemical liquid supply device CS1, that is, maintenance work (remodeling of equipment, etc.) on the equipment, piping, consumables, etc. inside the fluid box 4 in the circulating idle state. Can be done.

However, in the circulation idle state, maintenance work is performed when the chemical liquid circulates in a part of the circulation flow path. When a predetermined state occurs with respect to the chemical liquid supply device CS1, depending on the type of the state, it may not be desirable to continue the maintenance work. Therefore, in the cycle idle state, a hard interlock is prepared.

Specifically, in the chemical liquid cabinet 5, a detection sensor (detection unit) 100 (refer to FIG. 3) for detecting that the cover (not shown) of the chemical liquid cabinet 5 is open, and a chemical liquid cabinet 5 A detection sensor (detection unit) 101 (refer to Fig. 3) for detecting the occurrence of leakage in) is provided. In the circulation idle state, the presence or absence of detection by the detection sensors 100 and 101 is monitored by the control device 3. When detection sensors 100 and 101 detect the opening of the cover of the chemical liquid cabinet 5 or the occurrence of leakage in the chemical liquid cabinet 5, the control device 3 stops the drive of the pump 37. It stops, and the circulation of the chemical liquid in the detected 2nd circulation flow path C2 is stopped. Thus, it is possible to prevent the occurrence of undesirable events.

When the maintenance work is being performed in the circulation idle state, even when the maintenance person in charge operates the emergency stop button 92 (see Fig. 8), the control device 3 stops the drive of the pump 37 and stops the emergency. The circulation of the chemical liquid in the second circulation passage C2 after the button 92 is operated is stopped.

In the cycle idle state of the substrate processing apparatus 1, when the system resume button 91 (see FIG. 8) is operated (ready operation, YES in step S32 in FIG. 15), the operation state of the substrate processing apparatus 1 is The transition to the ready state (step S33 in Fig. 15). Specifically, the control device 3 opens the first circulation valve 40 as shown in FIG. 16. Further, immediately after transition to the ready state, the control device 3 opens the branch drain valve 86 in a state where the return valve 89 is closed, as shown in FIG. 16. Thereby, the chemical liquid remaining in the upstream side portion 33 and the downstream side portion 34 is not returned to the chemical solution tank 30 and is discharged to the drainage tank 80. By opening the first circulation valve 40 while the pump 37 continues to be driven, the circulation of the chemical solution in the first circulation flow path C1 is resumed. The pressure-applied chemical liquid can be introduced into the downstream portion 34. Thereby, the drainage time required for drainage at the time of transition from the circulation idle state to the ready state can be significantly shortened compared to the case of returning from the circulation stop idle state (a state shown in Fig. 14) (for example, For example, about 1/5 to about 1/10).

When a predetermined period elapses after the branch drain valve 86 is opened, the control device 3 closes the branch drain valve 86 and the drain valve 67 and opens the return valve 89. Thereby, it returns to the ready state shown in Fig. 9 (step S34 in Fig. 15). In this ready state, processing (production lot processing) is performed on the substrate W in the processing unit 2.

As described above, according to the first embodiment, the chemical liquid flowing through the upstream side portion 33 in the circulation idle state of the substrate processing apparatus 1 (in the one-way circulation state in which the chemical liquid circulates only in the second circulation flow path C2). The pressure of the substrate processing apparatus 1 in the ready state (in the bicyclic state in which the chemical liquid in both the first circulation passage C1 and the second circulation passage C2 circulates) upstream side ( The regulator 71 is controlled so as to match or approach the pressure of the chemical liquid flowing through 33). The pressure applied to the filter 39 in the circulating idle state (one-way circulation state) of the substrate processing apparatus 1 is applied to the filter 39 in the ready state (bicycle state) of the substrate processing apparatus 1 Since it matches or is close to the pressure, it is possible to keep the particle trapping ability of the filter 39 constant or close, regardless of whether the operating state of the substrate processing apparatus 1 is a cyclic idle state or a ready state.

Thereby, it is possible to suppress or prevent leakage of the trapped particles from the filter 39 along with the change in the pressure applied to the filter 39. Therefore, a clean chemical liquid with a small content of particles (preferably, a clean chemical liquid containing no particles) can be supplied to the processing unit 2.

In addition, in the first embodiment, the pressure of the chemical liquid flowing through the upstream portion 33 is adjusted by adjusting the opening degree of the second circulation pipe 32 by the regulator 71. Thereby, with a simple configuration, the pressure of the chemical liquid flowing through the upstream side portion 33 can be adjusted.

In addition, during the circulation idle state, the chemical liquid does not circulate in the first circulation flow path C1, and the chemical liquid circulates in the second circulation flow path C2. Therefore, when the target site for maintenance work is a site that does not affect the circulation of the chemical liquid in the second circulation flow path C2 (for example, when it is a maintenance work for the processing unit 2 or the transfer robot), It is possible to perform maintenance work on the chemical liquid supply device CS1 and the processing unit 2 while setting the substrate processing device 1 to the circulation idle state.

On the other hand, when the maintenance object is a part that has an influence on the circulation of the chemical liquid in the second circulation flow path C2, the maintenance operation cannot be performed while circulating the chemical liquid in the second circulation flow path C2. Therefore, in this case, the operation state of the substrate processing apparatus 1 is set to the cycle stop idle state.

In this way, by classifying a plurality of idle states according to the maintenance portion, it is possible to shorten the period in which the pump 37 is stopped. Currently, most of the maintenance for the substrate processing apparatus 1 is to make the target a site that does not affect the circulation of the chemical liquid in the second circulation passage C2. Therefore, by adopting the circulating idle state as the idle state of the substrate processing apparatus 1, the operation rate of the substrate processing apparatus 1 can be dramatically improved.

By the way, in the first embodiment, at the time of drainage after returning from the idle state (circulation stop idle state and/or circulation idle state) to the ready state, the stroke time of the moving member 46 of the pump 37 ( The time required for one reciprocating operation of the movable member 46 (see Fig. 6) may be longer than the idle state or the ready state. In other words, the stroke time of the moving member 46 at the time of drainage after returning from the idle state to the ready state may be longer than the stroke time in other states, that is, in a stable state such as an idle state or a ready state.

The bellows 47 of the pump 37 (bellows pump) has a large surface area (that is, an area in contact with a chemical liquid) and is made of a resin, so that particles are likely to be generated. On the other hand, the pump 37 (bellows pump) has a property of trapping generated particles and collecting them in the bellows 47 due to the structural characteristics thereof. In the ready state, as the particles are gradually discharged from the bellows 47 by the drive of the pump 37, the circulation flow path (the first circulation flow path C1 and/or the second circulation flow path C2) is There is a fear that the circulating chemical liquid will continue to be contaminated over a long period of time.

17 is a diagram for explaining the relationship between the stroke time of the pump 37 and the number of particles to be adhered. In Fig. 17, the circulation pressure and circulation flow rate of the pump 37 are made constant, respectively.

By making the stroke time of the moving member 46 of the pump 37 longer than the normal stroke time (1.5 seconds) (2.0 seconds), particles collected before that time in the bellows 47 of the pump 37 are removed. , It is possible to effectively discharge out of the pump 37.

After returning to the ready state, in the case of discharging the chemical liquid in the first circulation flow path C1 and/or the second circulation flow path C2 to the outside of the chemical liquid supply device CS1, the control device 3 comprises a pump ( The pump 37 is controlled so that the stroke time of the moving member 46 of 37) is longer than the idle state or the ready state. Thereby, the amount of particles collected in the pump 37 can be reduced, and therefore, particles contained in the chemical liquid supplied to the substrate W can be reduced.

18 is a schematic diagram showing a chemical solution supply device CS2 of the substrate processing device 201 according to the second embodiment of the present invention.

In the second embodiment, portions common to the first embodiment described above are denoted by the same reference numerals as in the case of Figs. 1 to 17, and the description is omitted.

The main difference between the chemical liquid supply device CS2 according to the second embodiment and the chemical liquid supply device CS1 according to the first embodiment is the first parallel pipe 211A in the middle of the upstream side portion 33. And the second parallel pipe 211B is installed, and the first parallel pipe 211A and the second parallel pipe 211B are respectively provided with the first filter 239A and the second filter 239B interposed therebetween. . The second filter 239B is a dedicated filter at the time of transition to the ready state. Hereinafter, it will be described in detail.

As described above, the first circulation pipe 31 includes an upstream portion 33 on the upstream side from the connection position P2 and a downstream portion 34 on the downstream side from the connection position P2. . The second circulation pipe 32 branches from the first circulation pipe 31 at the connection position P2. In the second embodiment, the first circulation pipe 31 branches into two at the connection position P4 between the chemical liquid tank 30 and the connection position P2, and then connects to the connection position P4. It is gathered at the positions between the positions P2. The upstream side portion 33 includes a first parallel pipe 211A and a second parallel pipe 211B connected in parallel. The upstream ends of the first parallel pipe 211A and the second parallel pipe 211B are connected to each other at the connection position P4. The downstream ends of the first parallel pipe 211A and the second parallel pipe 211B are connected to each other at a position between the connection position P4 and the connection position P2.

The first parallel pipe 211A is provided with a first filter 239A and a first parallel valve 212A for opening and closing the first parallel pipe 211A. The second parallel pipe 211B is provided with a second filter 239B and a second parallel valve 212B for opening and closing the second parallel pipe 211B. The 1st filter 239A and the 2nd filter 239B are the same filter as the filter 39 (refer FIG. 7).

The first parallel valve 212A and the second parallel valve 212B constitute a second switching unit. The second switching unit switches the destination of the chemical liquid upstream from the connection position P4 in the upstream side portion 33 between the first parallel pipe 211A and the second parallel pipe 211B. The second switching unit may be provided with a three-way valve in place of or in addition to the first parallel valve 212A and the second parallel valve 212B.

The first parallel valve 212A is opened while the second parallel valve 212B is closed. Thereby, in the upstream side portion 33, the chemical liquid flowing upstream from the connection position P4 of the first parallel pipe 211A and the second parallel pipe 211B is guided to the first parallel pipe 211A. It passes through the first filter 239A.

Meanwhile, the second parallel valve 212B is opened while the first parallel valve 212A is closed. Thereby, in the upstream portion 33, the chemical liquid flowing upstream from the connection position P4 of the first parallel pipe 211A and the second parallel pipe 211B is guided to the second parallel pipe 211B. It passes through the second filter 239B.

The first filter 239A is different from the second filter 239B in filtering performance. The diameter of the hole 63 (see Fig. 7) of the second filter 239B is larger than the diameter of the hole 63 (see Fig. 7) of the first filter 239A. That is, when the hole diameter of the first filter 239A is small, the ratio of the particles captured in the hole 63 of the first filter 239A to occupy the hole 63 increases, so that the first filter 239A is clogged. This is easy to happen.

In the example of Fig. 18, the air bleeding pipe is omitted, but an air bleeding pipe such as the air bleeding pipe 64 (see Fig. 5) may be provided in each of the filters 239A and 239B. In addition, a liquid drain pipe similar to the liquid drain pipe 66 (see Fig. 5) may be provided to each of the filters 239A and 239B.

19 is a diagram for explaining a flow of a chemical liquid in the substrate processing apparatus 201 in a ready state. Fig. 20 is a diagram for explaining a flow of a chemical liquid immediately after a transition from a circulation stop idle state to a ready state.

As shown in FIG. 19, the flow of the chemical liquid in the ready state of the substrate processing apparatus 201 becomes the same as the ready state (see FIG. 9) of the substrate processing apparatus 1 according to the first embodiment. . In addition, in the ready state of the substrate processing apparatus 201, as shown in FIG. 19, the control apparatus 3 closes the second parallel valve 212B and opens the first parallel valve 212A. Thus, in the ready state, in the upstream side portion 33, the chemical liquid flowing upstream from the connection position P4 (the fourth connection position) of the first parallel pipe 211A and the second parallel pipe 211B is removed. 1 It is guided to the parallel pipe 211A and passes through the first filter 239A.

On the other hand, the circulation stop idle state of the substrate processing apparatus 201 is also in the same flow as the circulation stop idle state (see Fig. 10) of the substrate processing apparatus 1 according to the first embodiment. In the circulation stop idle state, since the drive of the pump 37 is stopped, the circulation of the chemical liquid is stopped in both the first circulation passage C1 and the second circulation passage C2.

In the circulation stop idle state, since circulation of the chemical liquid is stopped in both the first circulation flow passage C1 and the second circulation flow passage C2, the internal equipment of the chemical liquid cabinet 5 (equipment, piping, consumables Etc.). Such maintenance work includes remodeling (remodeling, repairing, and replacing) the equipment arranged upstream of the filters 239A and 239B in the upstream side portion 33. Particles may be attached to equipment that has been remodeled or the like. In this state, when the circulation of the chemical solution is started by the start of the drive of the pump 37, a large amount of particles adhering to the device or the like are supplied to the filters 239A and 239B, resulting in clogging of the filters 239A and 239B. Occurs, and the particle capturing ability of the filters 239A and 239B decreases. As a result, there is a possibility that particles may leak out from the filters 239A and 239B.

At the time of transition from the circulation stop idle state to the ready state, as shown in FIG. 20, the control device 3 closes the first parallel valve 212A and opens the second parallel valve 212B. Thereby, the chemical liquid flowing upstream from the connection position P4 of the 1st parallel pipe 211A and the 2nd parallel pipe 211B in the upstream side part 33 is guided to the 2nd parallel pipe 211B, and is 2 It passes through the filter 239B.

When a predetermined time has elapsed from the transition to the ready state, the control device 3 closes the second parallel valve 212B and opens the first parallel valve 212A. Thereby, the chemical liquid flowing upstream from the connection position P4 of the first parallel pipe 211A and the second parallel pipe 211B in the upstream side portion 33 is guided to the first parallel pipe 211A, 1 It passes through the filter 239A.

As described above, according to the second embodiment, when the substrate processing apparatus 201 transitions to the ready state, the chemical solution is filtered with the second filter 239B different from the first filter 239A used in the ready state, and then , The chemical solution is filtered with the first filter 239A. Thereby, it is possible to suppress the occurrence of clogging in the first filter 239A. Thereby, leakage of particles from the first filter 239A can be suppressed or prevented. Therefore, a clean chemical liquid with a small content of particles (preferably, a clean chemical liquid containing no particles) can be supplied to the processing unit 2.

Further, since the eyes of the second filter 239B are sparer than the eyes of the first filter 239A, at the time of transition to the ready state, the second filter 239B captures relatively large particles. , It is possible to trap relatively small particles by the first filter 239A. Therefore, at the time of transition to the ready state, since the amount of particles captured by the second filter 239B can be suppressed, clogging of the second filter 239B and particles from the second filter 239B Can suppress the leakage of.

21A is a schematic diagram showing a chemical solution supply device CS3 of the substrate processing apparatus 301 according to the third embodiment of the present invention.

In the third embodiment, portions common to the first embodiment described above are denoted by the same reference numerals as in the case of Figs. 1 to 17, and the description is omitted.

The main point that the chemical liquid supply device CS3 according to the third embodiment differs from the chemical liquid supply device CS1 according to the first embodiment is a return pipe (outer circulation pipe) in the middle of each supply pipe 22. ) 302 is branched. In the external circulation pipe according to the third embodiment, a portion of the first circulation pipe 31 on the upstream side of the connection position P1, a portion of the supply pipe 22 on the upstream side of the connection position P9, and a return It is constituted by a pipe 302. The inner circulation pipe according to the third embodiment is constituted by a portion of the first circulation pipe 31 on the downstream side of the connection position P1. The discharge port communication pipe according to the third embodiment is constituted by a flow path from the connection position P9 to the discharge port 21a.

In the example of FIG. 21A, not only the discharge valve 23 but also a heater 303, a flow meter 304, a flow rate adjustment valve 305, and the like are provided in each supply pipe 22. The return pipe 302 is branchly connected to a connection position P9 set downstream from the respective installation positions of the flow meter 304, the flow control valve 305, and the heater 303 in the supply pipe 22. have. The other end of the return pipe 302 is connected to the chemical liquid tank 30. The third circulation flow path C3 for circulating the chemical liquid in the chemical liquid tank 30 includes a chemical liquid tank 30, a portion of the first circulation pipe 31 on the upstream side of the connection position P1, and a supply pipe 22 ), it is formed by the part on the upstream side of the connection position P9 and the return pipe 302. A return valve 306 for opening and closing the return piping 302 is provided in the middle of the return piping 302, interposed therebetween.

In the third embodiment, the third circulation passage C3 constitutes an outer circulation passage, and a portion of the first circulation passage C1 on the downstream side of the connection position P1 constitutes an inner circulation passage.

A second discharge valve 307 for opening and closing the downstream portion is provided in a portion of each supply pipe 22 on the downstream side of the connection position P9. When the return valve 306 is opened while the second discharge valve 307 is closed, the chemical liquid flowing upstream from the connection position P9 in the supply pipe 22 is transferred through the return pipe 302. It is guided to the tank 30. On the other hand, when the second discharge valve 307 is opened while the return valve 306 is closed, the chemical liquid flowing upstream from the connection position P9 in the supply pipe 22 is transferred to the discharge nozzle 21. It is guided to the discharge port 21a.

In the third embodiment, as shown in Fig. 21A, the chemical liquid supply device CS3 is the upstream side portion 33 according to the third embodiment, that is, the connection position P1 of the first circulation pipe 31 And a pressure adjustment unit that adjusts the pressure of the chemical liquid flowing through the portion on the upstream side. The pressure adjustment unit is an opening degree adjustment unit that adjusts the opening degree of the downstream portion 34 on the downstream side from the connection position P1. The opening degree adjustment unit is provided through the downstream portion 34. In the example of FIG. 21A, the opening degree adjustment unit is a regulator 308. The regulator 308 is, for example, a major regulator. The opening degree adjustment unit is not limited to the regulator 308, and may be an electric valve such as a relief valve or an electric needle valve. The pressure adjustment unit further includes a pressure sensor 72 that detects the pressure of the chemical liquid in the upstream portion 33.

Similar to the substrate processing apparatus 1, as the operation states of the substrate processing apparatus 301, a ready state, a circulation stop idle state, and a circulation idle state are prepared. In the ready state of the substrate processing apparatus 301, the chemical liquid circulates in both the third circulation passage C3 constituting the outer circulation passage and the first circulation passage C1 constituting the inner circulation passage (bicycle state). . In the circulation stop idle state of the substrate processing apparatus 301, circulation of the chemical solution is stopped in both the third circulation flow path C3 and the first circulation flow path C1. In the circulation idle state of the substrate processing apparatus 301, circulation of the chemical liquid in the third circulation flow path C3 is stopped, and the circulation of the chemical liquid continues in the first circulation flow path C1. Whether the substrate processing apparatus 301 is in the ready state or the circulation idle state, the chemical liquid circulates through the second circulation passage C2. When the substrate processing apparatus 301 is in the circulation stop idle state, the chemical liquid does not circulate through the second circulation passage C2.

In the cycle idle state of the substrate processing apparatus 301, the maintenance person in charge can perform maintenance work on the processing unit 2 and the transfer robot. In addition, the maintenance person in charge is interposed in the equipment related to the chemical liquid supply device CS3, that is, the supply pipe 22 and the return pipe 302, and the supply pipe 22 and the return pipe 302 in the circulation idle state. And installed equipment (e.g., discharge valve 23, heater 303, flow meter 304, flow control valve 305, return valve 306, second discharge valve 307), etc. Work (modification, etc.) can be performed.

In the circulation idle state of the substrate processing apparatus 301 (in a one-way circulation state in which the chemical solution in the first circulation passage C1 circulates), the pressure of the chemical solution flowing through the upstream side portion 33 is determined by the substrate processing apparatus ( In the ready state of 301 (in the bicyclic state in which the chemical liquid in both the first circulation passage C1 and the third circulation passage C3 circulates), the pressure of the chemical liquid flowing through the upstream side portion 33 To match or close, the regulator 308 is controlled. The pressure applied to the filter 39 in the circulating idle state (one-way circulation state) of the substrate processing apparatus 301 is applied to the filter 39 in the ready state (bicycle state) of the substrate processing apparatus 301. Since it matches or is close to the pressure, it is possible to keep the particle trapping ability of the filter 39 constant or almost constant, regardless of whether the operating state of the substrate processing apparatus 301 is in the cyclic idle state or the ready state.

Thereby, it is possible to suppress or prevent leakage of the trapped particles from the filter 39 along with the change in the pressure applied to the filter 39. Therefore, a clean chemical liquid with a small content of particles (preferably, a clean chemical liquid containing no particles) can be supplied to the processing unit 2.

21B is a schematic diagram showing a modified example of the third embodiment of the present invention.

The difference between the modified example shown in Fig. 21B and the third embodiment shown in Fig. 21A is that the connection position P9 is located in the middle of each discharge nozzle 21, that is, inside the processing unit 2 It is a point that is placed. In the modified example shown in Fig. 21B, a portion of the supply pipe 22 on the downstream side of the connection position P9 constitutes a discharge port communication pipe communicating with the discharge port 21a. In the modified example shown in FIG. 21B, the third circulation passage C3 extends to the middle portion of the discharge nozzle 21, that is, to the interior of the processing unit 2. By circulating the chemical liquid heated by the heater through the third circulation flow path C3, the chemical liquid, which is precisely temperature-controlled at a desired high temperature, can be discharged from the discharge port of the discharge nozzle 21.

21C is a schematic diagram showing a chemical solution supply device CS4 of the substrate processing apparatus 401 according to the fourth embodiment of the present invention.

In the fourth embodiment, portions common to the first embodiment described above are denoted by the same reference numerals as those in Figs. 1 to 17, and the description is omitted.

The main difference between the chemical liquid supply device CS4 according to the fourth embodiment and the chemical liquid supply device CS1 according to the first embodiment is installed through the upstream part 33 of the upstream part 33 A contamination state for measuring the contamination state of the device downstream area 402 in the device downstream area 402 set on the downstream side of the device (for example, the pump 37, the heater 38, and the filter 39). This is a point where the measurement device 403 is interposed.

The device downstream region 402 is a part of the upstream side portion 33 including an intervening position of the device provided through the upstream side portion 33 and downstream of the intervening position. In the case where a plurality of devices are installed through the upstream part 33, if two devices adjacent to the direction in which the chemical liquid flows are defined as an upstream device and a downstream device, from the installation position of the upstream device to the installation position of the downstream device. The area of is the device downstream area 402 corresponding to the upstream device. As shown in Fig. 21C, a device downstream region 402 is provided for each device (pump 37, heater 38, filter 39).

In the example of Fig. 21C, three equipment downstream regions 402 are provided in the upstream side portion 33, and the three contamination state measurement devices 403 are upstream side portions 33 corresponding to the second upstream side portion. ). Accordingly, one contamination state measuring device 403 is provided corresponding to the downstream region 402 of each device.

The contamination state measurement device 403 measures the amount of particles contained in the chemical liquid flowing through the downstream region 402 of each device. Specifically, the contamination state measurement device 403 measures the number of particles contained in the chemical solution that has passed through the device downstream region 402 within a predetermined time. The measurement result by the contamination state measurement device 403 is input to the control device 3. The contamination state measurement device 403 includes, for example, a particle counter, a total reflection fluorescence X-ray analyzer (TRXRF), an energy dispersive X-ray analyzer (EDX: Energy Dispersive X-ray spectrometer), and a scanning electron microscope (SEM). : Scanning Electron Microscope), and at least one of an image recognition foreign matter inspection device.

In each device downstream region 402, an individual drainage pipe (drainage pipe) 404 is branchly connected. The downstream end of each individual drainage pipe 404 is connected to the drainage tank 80. The individual drainage pipe 404 is provided with an individual drainage valve 405 for opening and closing the individual drainage pipe 404.

The individual drainage pipe 404 is connected to the upstream side portion 33 at a connection position (5th connection position) P5. The contamination state measurement device 403 measures the contamination state at the measurement position P12 of the upstream portion 33. The connection position P5 is disposed at a position further downstream from the corresponding equipment (pump 37, heater 38, filter 39) by a predetermined distance (for example, 15 cm). The measurement position P12 is disposed at a position far from the corresponding equipment (pump 37, heater 38, filter 39) at a small interval (for example, 10 cm) on the downstream side. In the example of FIG. 21C, the connection position P5 is arrange|positioned downstream from the measurement position P12. The connection position P5 may be arranged upstream from the measurement position P12. The measurement position P12 and the connection position P5 may be arranged at the same distance from each of the corresponding devices (pump 37, heater 38, filter 39).

In each device downstream region 402, a device downstream valve 406 for opening and closing the device downstream region 402 is interposed therebetween.

In the fourth embodiment, the individual drain valve 405 and the device downstream valve 406 constitute a third switching unit. The 3rd switching unit is the destination of the chemical liquid upstream from the connection position P5 in each device downstream region 402, and is located downstream from the connection position P5 in the device downstream region 402. , Switch between individual drainage pipes 404. The third switching unit may be provided with a three-way valve in place of or in addition to the individual drain valve 405 and the equipment downstream valve 406.

In each device downstream region 402, the device downstream valve 406 installed through the device downstream region 402 is closed, and an individual drain valve 405 corresponding to the device downstream region 402 is By opening, the chemical liquid flowing through the device downstream region 402 is guided to the liquid drain tank 80 through the individual drain pipe 404 corresponding to the device downstream region 402.

On the other hand, in each device downstream region 402, the device downstream valve 406 provided through the device downstream region 402 with the individual drain valve 405 corresponding to the device downstream region 402 closed. ) Is opened, the chemical liquid in the device downstream region 402 passes through the device downstream valve 406 and is discharged downstream from the device downstream region 402. If the device downstream region 402 is not the device downstream region 402 that is the most downstream, the chemical liquid that has passed through the device downstream region 402 is the following device (in the example of FIG. 21C, the heater 38 or the filter 39) ).

22 is a flowchart for explaining the contents of processing executed in the chemical liquid supply device CS4 in a ready state.

In the ready state of the chemical liquid supply device CS4, the control device 3 constantly monitors the amount of particles contained in the chemical liquid flowing through each device downstream region 402 (step S41). Then, the control device 3 specifies a particle generation source (a device serving as a particle generation source) based on the measurement result by the contamination state measurement device 403.

Then, the control device 3 specifies a device downstream region 402 corresponding to a specific particle generation source (a device serving as a particle generation source) (step S42), and an individual drain valve corresponding to the device downstream region 402 (405) is opened (step S43). At this time, the individual drain valve 405 other than that is in a closed state (step S43).

23 is a flowchart for explaining a first method for specifying a particle generation source.

The control device 3 checks whether or not the measurement value by the contamination state measurement device 403 exceeds a predetermined first threshold based on the measurement result by the contamination state measurement device 403 (step S51 ). And, when the measured value by the pollution state measuring device 403 exceeds the first threshold value (YES in step S51), the control device 3 is a device downstream region corresponding to the pollution state measuring device 403 ( 402) is specified as a particle generation source (step S52).

24 is a flowchart for explaining a second method for specifying a particle generation source.

The control device 3 checks whether or not the difference between the measured values by the pollution state measuring devices 403 adjacent to each other exceeds the second threshold based on the measurement result by the pollution state measuring device 403 (step S61). And, when the difference between the measured values by the pollution state measuring devices 403 adjacent to each other exceeds the second threshold (YES in step S61), the control device 3 is the pollution state measuring device 403 with the higher measured value. The device downstream region 402 corresponding to) is specified as a particle generation source (step S62).

In the first method shown in Fig. 23 and the second method shown in Fig. 24, particles are not based on the magnitude relationship between the measured value and the threshold value, but on the basis of the magnitude relationship between the calculated value calculated based on the measurement value and the threshold value. The generation source may be identified.

According to the fourth embodiment, particles generated due to the device are measured by the contamination state measurement device 403 provided in the upstream portion 33 through the device downstream region 402. The contamination state measuring device 403 can measure not only the presence or absence of particles generated by the apparatus, but also the amount of particles generated by the apparatus. In addition, since the contamination state measuring device 403 is provided in the device downstream region 402 through which particles generated from the device pass, the amount of particles generated from the device can be accurately measured.

Therefore, a clean chemical liquid with a small content of particles (preferably, a clean chemical liquid containing no particles) can be supplied to the processing unit 2.

Further, a contamination state measuring device 403 is provided corresponding to the downstream region 402 of each device. Based on the measured values of the plurality of contamination state measuring devices 403, it is possible to specify the device as the particle generation source.

In addition, an individual drainage pipe 404 is branchly connected to the downstream region 402 of each device. When a device that is a particle generation source is specified, a chemical solution containing particles is discharged through an individual drainage pipe 404 to the device downstream region 402 corresponding to the device. It is possible to drain the liquid directly through the device downstream region 402 corresponding to the device.

In this fourth embodiment, when the substrate processing apparatus 401 is in a ready state and the processing unit 2 is processing the substrate W, particles contained in the chemical liquid flowing through the apparatus downstream region 402 are When the number (measured value of the pollution state measurement device 403 or a calculated value based on it) exceeds a third threshold value higher than the first threshold value, the display input device 3h (see Fig. 3) and an alarm device (not shown) ), at least one of them may warn of contamination (abnormal state) of the chemical solution and stop the substrate processing. Even when the number of particles in the plurality of device downstream regions 402 exceeds the first threshold, an abnormal state may be warned and substrate processing may be stopped. In this case, if there is a substrate processing being performed, it is not stopped immediately, but is stopped after that.

Such processing may be performed not only in the substrate processing according to the fourth embodiment, but also in the substrate processing according to the fifth embodiment described below.

25 is a schematic diagram showing a chemical solution supply device CS5 of the substrate processing device 501 according to the fifth embodiment of the present invention.

In the fifth embodiment, portions common to the fourth embodiment described above are denoted by the same reference numerals as those in Figs. 21C to 24, and the description is omitted.

The main point that the chemical liquid supply device CS5 according to the fifth embodiment differs from the chemical liquid supply device CS4 according to the fourth embodiment is, instead of the individual drain pipe 404 in the downstream region 402 of each device. Thus, the bypass pipe 502 connecting the device downstream region 402 and the second circulation pipe 32 is provided. In addition, the bypass pipe 502 corresponding to the device downstream region 402 which is the most downstream side is not provided.

The upstream end of each bypass pipe 502 is connected to the upstream side portion 33 at a connection position (6th connection position) P61. The downstream end of each bypass pipe 502 is connected to the second circulation pipe 32 at a connection position P62. Bypass circulation flow paths CB1 and CB2 (see Figs. 27 to 28) for circulating the chemical liquid in the chemical liquid tank 30 are connected to the bypass pipe 502 at the upstream side portion 33 (P61). ) And a portion on the downstream side of the connection position P62 in the second circulation pipe 32.

The upstream end of the upper bypass pipe 502 (hereinafter referred to as ``upper bypass pipe 502'') in FIG. 25 is the lower bypass pipe 502 (hereinafter, referred to as It is arranged upstream from the upstream end of the "lower bypass pipe 502"). On the other hand, the downstream end of the upper bypass pipe 502 is disposed downstream from the downstream end of the lower bypass pipe 502. Accordingly, the positional relationship of the upstream ends of the plurality of bypass pipes 502 with respect to the direction in which the chemical liquid flows is different from the positional relationship of the downstream ends of the plurality of bypass pipes 502 with respect to the direction in which the chemical liquid flows.

Each bypass pipe 502 includes a bypass valve 503 for opening and closing the bypass pipe 502, and a bypass filter 504 for removing foreign substances from the chemical liquid flowing through the bypass pipe 502. It is installed intervening. The bypass filter 504 is the same filter as the filter 39 (see Fig. 7).

In the example of FIG. 25, in each device downstream region 402, the connection position P61 of the bypass pipe 502 corresponding to the device downstream region 402 is measured by the contamination state measurement device 403 It is arranged downstream from the position P12. More specifically, the connection position P61 of the bypass pipe 502 is a predetermined distance (for example, 15) downstream from the corresponding equipment (pump 37, heater 38, filter 39). Centimeters) away. The measurement position P12 and the connection position P61 may be arranged at the same distance from each of the corresponding devices (pump 37, heater 38, filter 39). The connection position P61 may be arranged upstream from the measurement position P12.

In the fifth embodiment, the bypass valve 503 and the device downstream valve 406 constitute a fourth switching unit. The fourth switching unit includes a destination of the chemical solution upstream of the connection position P61 in each device downstream region 402, and a destination downstream of the connection position P61 in each device downstream region 402, It switches between the bypass piping 502. The 4th switching unit may be provided with a three-way valve in place of or in addition to the bypass valve 503 and the equipment downstream valve 406.

In each device downstream region 402, the device downstream valve 406 corresponding to the device downstream region 402 is closed, and the bypass valve 503 corresponding to the device downstream region 402 is opened. Thereby, the chemical liquid flowing through the device downstream region 402 is guided to the second circulation pipe 32 through the bypass pipe 502 corresponding to the device downstream region 402.

On the other hand, in each device downstream region 402, with the bypass valve 503 corresponding to the device downstream region 402 closed, the device downstream valve 406 corresponding to the device downstream region 402 When is opened, the chemical liquid in the device downstream region 402 passes through the device downstream valve 406 and is discharged downstream from the device downstream region 402. If the device downstream region 402 is not the device downstream region 402 that is the most downstream, the chemical liquid that has passed through the device downstream region 402 is the next device (in the example of FIG. 25, the heater 38 or the filter 39) ).

26 is a flowchart for explaining the contents of processing executed in the chemical liquid supply device CS5 in the ready state.

In the ready state of the chemical liquid supply device CS5, the control device 3 constantly monitors the amount of particles contained in the chemical liquid flowing through the downstream region 402 of each device (step S71). Then, the control device 3 specifies a particle generation source (a device serving as a particle generation source) based on the measurement result by the contamination state measurement device 403 (step S72). As a method for specifying the particle generation source, the first method shown in Fig. 23 and the second method shown in Fig. 24 can be adopted.

Then, the control device 3 specifies a device downstream region 402 corresponding to a specific particle generation source (a device serving as a particle generation source), and sets a bypass valve 503 corresponding to the device downstream region 402. Open (step S73). At this time, the bypass valve 503 and the second circulation valve 70 (indicated as "internal circulation valve 70" in Fig. 23) are in a closed state (step S73).

According to this fifth embodiment, in addition to the effects described in connection with the fourth embodiment, the following effects are exhibited.

That is, a bypass pipe 502 connecting the equipment downstream region 402 and the second circulation pipe 32 is branched to each device downstream region 402. When a device that is a particle generation source is specified, it is possible to directly guide the chemical liquid in the device downstream region 402 corresponding to the device to the second circulation pipe 32 through the bypass pipe 502. . In this case, it is possible to directly guide the chemical liquid containing particles from the device downstream region 402 corresponding to the device serving as the particle generation source to the second circulation pipe 32. The chemical liquid containing particles is purified as it passes through the bypass filter 504 provided through the bypass pipe 502. Thereby, it is possible to suppress or prevent the diffusion of particles to other portions of the upstream portion 33 or the second circulation pipe 32.

27 to 29 are diagrams for explaining the flow of the chemical liquid immediately after transition from the circulation stop idle state to the ready state in the fifth embodiment.

In the circulating stop idle state, when equipment is replaced or a pipe is remodeled, particles may adhere to the replaced equipment or the remodeled pipe. In this state, transition to the ready state, and when the circulation of the chemical solution in the circulation flow path is started, a large amount of particles attached to the replaced equipment or the remodeled piping are transferred to the first circulation flow path (C1) and/or the second circulation. There is a risk of spreading to the entire flow path C2.

At the time of transition from the circulation stop idle state to the ready state, as shown in Figs. 27 to 29, the connection position P61 is sequentially from the bypass pipe 502 located on the upstream side, and the bypass pipe 502 ) Opens. First, as shown in FIG. 27, the chemical liquid flows into the bypass pipe 502 (bypass pipe 502 corresponding to the pump 37) on the upstream side. Thereby, the chemical liquid circulates through the bypass circulation passage CB1 (see Fig. 27).

After the chemical liquid flowing through the bypass circulation passage CB1 is cleaned, as shown in FIG. 28, the chemical liquid is supplied to the downstream bypass pipe 502 (bypass pipe 502 corresponding to the heater 38). This flows. Thereby, the chemical liquid circulates through the bypass circulation passage CB2 (see Fig. 28).

After the chemical liquid flowing through the bypass circulation passage CB2 is cleaned, as shown in FIG. 29, the inflow of the chemical liquid into the second circulation passage C2 is allowed. Thereby, the chemical liquid circulates through the second circulation passage C2.

At the time of transition from the circulation stop idle state to the ready state, the connection position P61 is sequentially opened from the bypass pipe 502 located on the upstream side, so that the circulation passage through which the chemical liquid circulates is provided as the bypass circulation passage CB1 ) → Bypass circulation flow path (CB2) → Second circulation flow path (C2). Thereby, the chemical liquid can be circulated in the second circulation passage C2 while suppressing or preventing diffusion of particles to other portions of the upstream portion 33 or the second circulation pipe 32.

As mentioned above, although five embodiments of this invention have been described, this invention can also be implemented in another mode.

For example, in the first embodiment, the regulator 71 may adjust the opening degree of the upstream side portion 33 rather than the opening degree of the second circulation pipe 32.

In the first and third embodiments described above, the pressure sensor 72 may be disposed on the downstream side of the filter 39. In addition, even if the pressure of the upstream portion 33 is not detected, the pressure sensor 72 may be omitted when the pressure adjustment of the upstream portion 33 by the regulator 71 can be satisfactorily performed.

In the first and third embodiments, the regulators 71 and 308 may adjust the flow rate in both the ready state and the circulation stop idle state.

In the second, fourth, and fifth embodiments, the cycle idle state does not need to be provided as the operating state of the substrate processing apparatus.

As a method for discharging the chemical liquid in the first circulation passage C1 and/or the second circulation passage C2 at the time of transition to the ready state, the chemical liquid tank ( The chemical solution may be once returned to 30), and then the chemical solution in the chemical solution tank 30 may be drained.

Instead of the downstream end of each individual pipe 36 of the first circulation pipe 31 being connected to the chemical liquid tank 30, the downstream end of the downstream pipe to which the plurality of individual pipes 36 are connected is the chemical liquid tank 30 ) May be connected.

Instead of the downstream end of each return pipe 302 being connected to the chemical liquid tank 30, the downstream end of the return common pipe to which a plurality of return pipes 302 are connected may be connected to the chemical liquid tank 30, respectively. The downstream end of the return pipe 302 may be connected to the first circulation pipe 31.

As the pump 37, a pump other than a bellows pump may be employed.

The liquid stored in the chemical liquid tank 30 is not limited to the chemical liquid, and other liquids such as a rinse liquid may be used.

The number of supply pipes 22 connected to the same individual pipe 36 may be less than two, or may be four or more.

The number of individual pipes 36 provided in the first circulation pipe 31 may be less than 3 or 5 or more.

In the first to fifth embodiments, the gas releasing portion 600 may be provided on the downstream side of the heater 38 provided through the upstream portion 33. As shown by a broken line in FIG. 5, the gas releasing part 600 includes a relief pipe 601 and a relief valve 602 provided through the relief pipe 601. The upstream end of the relief pipe 601 is connected to the downstream side of the heater 38 in the upstream side portion 33. The downstream end of the relief pipe 601 is connected to the drain tank 80.

When circulation of the chemical liquid (treatment liquid) is stopped, the chemical liquid (treatment liquid) collected in the heater 38 may evaporate. The pressure in the heater 38 may increase due to vaporization of the chemical liquid (treatment liquid).

In the modified example shown by the broken line in FIG. 5, since the gas releasing unit 600 is provided on the downstream side of the heater 38, even when the chemical liquid is vaporized, the generated gas is discharged to the gas releasing unit 600. Thereby, it is possible to suppress or prevent a pressure increase in the heater 38 when the circulation of the chemical liquid (treatment liquid) is stopped.

In this modification, the downstream end of the relief pipe 601 may be connected to the chemical liquid tank 30 instead of the drain tank 80. Moreover, the gas releasing part 600 may be provided not on the downstream side of the heater 38 but on the upstream side of the heater 38.

The substrate processing apparatuses 1, 201, 301, 401, and 501 are not limited to apparatuses that process the disk-shaped substrate W, and may be apparatuses that process the polygonal substrate W.

Two or more of all the above-described configurations may be combined.

Embodiments of the present invention have been described in detail, but these are only specific examples used to clarify the technical content of the present invention, and the present invention is not limited to these specific examples and should not be interpreted, but the spirit of the present invention and The scope is limited only by the appended claims.

Claims (23)

A processing unit having a discharge port for discharging the processing liquid toward the substrate,
A treatment liquid tank for storing the treatment liquid supplied to the discharge port,
An outer circulation pipe including an upstream end and a downstream end connected to the treatment liquid tank and forming an outer circulation flow path for circulating the treatment liquid in the treatment liquid tank together with the treatment liquid tank,
A pump for delivering the treatment liquid in the treatment liquid tank to the outer circulation pipe,
A discharge port communication pipe branchly connected to the outer circulation pipe at a first connection position and communicated with the discharge port,
A second upstream side portion and the treatment liquid branchly connected to the outer circulation pipe at a second connection position upstream of the first connection position, and which is a portion upstream of the second connection position in the outer circulation pipe An inner circulation pipe forming an inner circulation passage for circulating the treatment liquid in the treatment liquid tank together with the tank, and an inner circulation pipe for returning the treatment liquid supplied from the outer circulation pipe to the treatment liquid tank,
A filter installed through the second upstream portion,
A pressure adjustment unit that adjusts the pressure of the processing liquid flowing through the second upstream portion;
And a control device for controlling the pressure adjustment unit,
In the control device, the pressure of the treatment liquid flowing through the second upstream portion in the one-way circulation state in which the treatment liquid does not circulate in the outer circulation passage and the treatment liquid circulates in the inner circulation passage is the outer circulation A substrate processing apparatus that controls the pressure adjustment unit to match or close to the pressure of the processing liquid flowing through the second upstream portion in a bicyclic state in which the processing liquid circulates in both a flow path and the inner circulation flow path. . The method according to claim 1,
The substrate processing apparatus, wherein the pressure adjustment unit includes an opening degree adjustment unit that adjusts the opening degree of the inner circulation pipe. The method according to claim 1,
As an operation state of the substrate processing apparatus, an executable state in which the bicyclic state is executed, and a state different from the executable state, and a standby state in which power supply to the substrate processing apparatus is maintained, are selectively executable. Installed properly,
The substrate processing apparatus, wherein the standby state includes a circulation standby state for realizing the one-way circulation state. The method of claim 3,
In the standby state, a circulation stop standby state in which the driving of the pump is stopped while the power supply to the substrate processing apparatus is maintained, and circulation of the processing liquid in the outer circulation passage and the inner circulation passage is stopped is further provided. Containing, substrate processing apparatus. The method of claim 4,
The substrate processing apparatus,
An inner circulation valve interposed in the inner circulation pipe and opening and closing the inner circulation pipe,
A drain pipe for branching connection at a third connection position to a second downstream portion which is a portion downstream from the second connection position in the outer circulation pipe and discharging the processing liquid from the second downstream portion;
Switching between the destination of the processing liquid on the upstream side of the third connection position in the second downstream portion, between the downstream side of the third connection position in the second downstream portion and the drainage pipe Further comprising a first switching unit to,
The control device starts driving of the pump, closes the inner circulation valve, and the third connection in the second downstream portion at the time of transition from the circulation stop standby state to the executable state. By driving the first switching unit so that the treatment liquid upstream of the position flows into the drainage pipe, the treatment liquid in the second upstream portion and the treatment liquid in the second downstream portion are discharged through the drainage pipe. A substrate processing apparatus that performs a process of performing the process. The method of claim 4,
The substrate processing apparatus further comprising a selection unit operated by a user to select any one of a plurality of standby states including the circulation standby state and the circulation stop standby state. The method of claim 3,
The substrate processing apparatus further includes a detection unit that detects a state related to the substrate processing apparatus,
When the state is detected by the detection unit in the circulation standby state, the control device stops driving the pump to further execute a step of stopping the circulation of the processing liquid in the inner circulation passage. , Substrate processing device. The method according to claim 1,
The substrate processing apparatus includes a plurality of the processing units,
The outer circulation pipe includes a first circulation pipe for supplying a treatment liquid in common to the plurality of treatment units,
The substrate processing apparatus, wherein the discharge port communication pipe includes a plurality of supply pipes corresponding to the plurality of processing units on a one-to-one basis. A processing unit having a discharge port for discharging the processing liquid toward the substrate,
A treatment liquid tank for storing the treatment liquid supplied to the discharge port,
An outer circulation pipe including an upstream end and a downstream end connected to the treatment liquid tank and forming an outer circulation flow path for circulating the treatment liquid in the treatment liquid tank together with the treatment liquid tank,
A pump for delivering the treatment liquid in the treatment liquid tank to the outer circulation pipe,
A discharge port communication pipe branchly connected to the outer circulation pipe at a first connection position and communicated with the discharge port,
A second upstream side portion and the treatment liquid branchly connected to the outer circulation pipe at a second connection position upstream of the first connection position, and which is a portion upstream of the second connection position in the outer circulation pipe An inner circulation pipe forming an inner circulation passage for circulating the treatment liquid in the treatment liquid tank together with the tank, and an inner circulation pipe for returning the treatment liquid supplied from the outer circulation pipe to the treatment liquid tank,
A first filter and a second filter interposed in the first parallel pipe and the second parallel pipe, which are part of the second upstream portion and are connected in parallel to each other on an upstream side of the second connection position;
Switching between the first parallel pipe and the second parallel pipe, the destination of the processing liquid on the upstream side of the fourth connection position in which the upstream end of the first parallel pipe and the upstream end of the second parallel pipe are connected to each other. A second switching unit to perform,
When starting the driving of the pump from the state in which the pump is stopped, the second switching unit is controlled to set the destination of the processing liquid upstream of the fourth connection position to the second parallel pipe. And a control device for controlling the second switching unit thereafter to switch a destination of the processing liquid upstream of the fourth connection position to the first parallel pipe. The method of claim 9,
The substrate processing apparatus, wherein the first filter is different from the second filter in filtering performance. A processing unit having a discharge port for discharging the processing liquid toward the substrate,
A treatment liquid tank for storing the treatment liquid supplied to the discharge port,
An outer circulation pipe including an upstream end and a downstream end connected to the treatment liquid tank and forming an outer circulation flow path for circulating the treatment liquid in the treatment liquid tank together with the treatment liquid tank,
A pump for delivering the treatment liquid in the treatment liquid tank to the outer circulation pipe,
A discharge port communication pipe branchly connected to the outer circulation pipe at a first connection position and communicated with the discharge port,
A second upstream side portion and the treatment liquid branchly connected to the outer circulation pipe at a second connection position upstream of the first connection position, and which is a portion upstream of the second connection position in the outer circulation pipe An inner circulation pipe forming an inner circulation passage for circulating the treatment liquid in the treatment liquid tank together with the tank, and an inner circulation pipe for returning the treatment liquid supplied from the outer circulation pipe to the treatment liquid tank,
A contamination state measurement device that is interposed in a device downstream region set on a downstream side of a device installed in the second upstream side of the second upstream side and measures the contamination state in the downstream region of the device. , Substrate processing device. The method of claim 11,
A plurality of the devices interposed in the second upstream portion,
A substrate processing apparatus comprising: a plurality of the contamination state measuring devices provided one-to-one to a plurality of downstream regions of the apparatus that correspond to the plurality of apparatuses on a one-to-one basis, and provided through the second upstream portion. The method of claim 12,
A plurality of drainage pipes branchly connected to the plurality of device downstream regions at a plurality of fifth connection positions provided for each of the device downstream regions;
The destination of the processing liquid on the upstream side of the fifth connection position in the second upstream portion is connected to a downstream side of the fifth connection position in the second upstream portion and a region downstream of the device. The substrate processing apparatus further comprising a third switching unit that switches between the drain pipes. The method of claim 13,
The substrate processing apparatus,
A plurality of the third conversion units corresponding to the plurality of drainage pipes on a one-to-one basis,
Further comprising a control device for controlling the plurality of the third switching unit,
When the number of particles contained in the processing liquid flowing through the downstream region of the device exceeds the threshold value, the control device switches the destination of the processing liquid in the downstream region of the device to the drain pipe, and provides the second upstream portion. The substrate processing apparatus, wherein the third switching unit corresponding to the drain pipe is controlled to discharge the processing liquid upstream of the apparatus downstream region to the outside of the substrate processing apparatus. The method of claim 13,
The substrate processing apparatus,
A plurality of the third conversion units corresponding to the plurality of drainage pipes on a one-to-one basis,
Further comprising a control device for controlling the plurality of the third switching unit,
When the difference in the number of particles contained in the processing liquid flowing through the two adjacent device downstream regions exceeds a threshold value, the control device is configured to determine the destination of the processing liquid in the downstream region of the device on the side with a larger number of particles. A substrate that switches to a drain pipe and controls the third switching unit corresponding to the drain pipe to discharge a processing liquid upstream from the region downstream of the device in the second upstream portion to the outside of the substrate processing apparatus. Processing device. The method of claim 12,
A bypass pipe connecting the device downstream region and the inner circulation pipe, wherein a portion upstream from a connection position of the bypass pipe in the second upstream portion, and the bypass pipe in the inner circulation pipe A bypass pipe forming a bypass circulation passage for circulating the treatment liquid in the treatment liquid tank together with a portion downstream from the connection position of the pipe;
In the second upstream portion, a destination of the processing liquid upstream from a sixth connection position to which the bypass pipe is connected is located downstream from the sixth connection position in the second upstream portion, and the corresponding The substrate processing apparatus further comprising a fourth switching unit that switches between the bypass piping. The method of claim 16,
The substrate processing apparatus,
A plurality of the bypass pipes,
A plurality of the fourth conversion units corresponding to the plurality of bypass pipes on a one-to-one basis,
Further comprising a control device for controlling the plurality of the fourth switching unit,
When the number of particles contained in the processing liquid flowing through the downstream region of the device exceeds a threshold value, the control device corresponds to the bypass pipe so that the destination of the processing liquid in the downstream region of the device is switched to the bypass pipe. A substrate processing apparatus that controls the fourth switching unit to perform. The method of claim 16,
The substrate processing apparatus,
A plurality of the bypass pipes,
A plurality of the fourth conversion units corresponding to the plurality of bypass pipes on a one-to-one basis,
Further comprising a control device for controlling the plurality of the fourth switching unit,
When the difference in the number of particles contained in the processing liquid flowing through the two adjacent device downstream regions exceeds a threshold value, the control device is configured to determine the destination of the processing liquid in the downstream region of the device on the side with a larger number of particles. A substrate processing apparatus for controlling the fourth switching unit corresponding to the bypass piping so as to switch to the bypass piping. The method of claim 16,
The substrate processing apparatus,
A plurality of the bypass pipes,
A plurality of the fourth conversion units corresponding to the plurality of bypass pipes on a one-to-one basis,
Further comprising a control device for controlling the plurality of the fourth switching unit,
The plurality of the bypass pipes are connected to the second upstream portion at a plurality of the sixth connection positions corresponding to the plurality of bypass pipes on a one-to-one basis,
When the control device starts driving the pump from a state in which the driving of the pump is stopped, based on the positional relationship of the plurality of sixth connection positions in the direction in which the chemical liquid flows, from the upstream side A substrate processing apparatus for controlling the plurality of fourth switching units so that the plurality of bypass pipes are sequentially opened. The method of claim 16,
The substrate processing apparatus further comprising a filter installed through the bypass pipe. The method of claim 11,
During the execution of the substrate processing in the processing unit, when the number of particles contained in the processing liquid flowing through the downstream region of the device exceeds the threshold value, an abnormal state is notified, and after completion of the substrate processing being executed, A substrate processing apparatus for stopping supply of a processing liquid to the processing unit. The method according to any one of claims 5, 14 and 15,
The pump includes a bellows pump comprising a moving member installed to be reciprocally movable, and a bellows having one end fixed to the housing and the other end fixed to the moving member,
When discharging the processing liquid in at least one of the outer circulation pipe and the inner circulation pipe to the outside of the substrate processing device, the control device controls the bellows pump to increase the stroke time of the moving member. . The method according to any one of claims 1 to 21,
A heater installed through the second upstream portion,
The substrate processing apparatus further comprising an air venting unit provided on at least one of an upstream side and a downstream side of the heater.

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