KR102391794B1 - Substrate processing apparatus - Google Patents

Abstract

The substrate processing apparatus 1 includes a chemical liquid tank 30 , a first circulation pipe 31 connected to the chemical liquid tank 30 , and a chemical liquid in the chemical liquid tank 30 to the first circulation pipe 31 . The pump, the second circulation pipe 32 branched to the first circulation pipe 31, and the second circulation pipe 32 in the first circulation pipe 31 are upstream from the connection position P2 of the second circulation pipe 32 . It includes a filter 39 provided with the side portion 33 interposed therebetween, and a pressure adjusting unit for adjusting the pressure of the chemical liquid flowing through the upstream side portion 33 . The pressure adjustment unit includes a regulator 71 that adjusts the opening degree of the second circulation pipe 32 . The regulator 71 controls the pressure of the chemical liquid flowing through the upstream portion 33 in the circulation idle state of the substrate processing apparatus 1 to flow through the upstream portion 33 in the ready state of the substrate processing apparatus 1 . It matches or approaches the pressure of the chemical.

Description

Substrate processing apparatus {SUBSTRATE PROCESSING APPARATUS}

This invention relates to a substrate processing apparatus. Examples of substrates to be processed include semiconductor wafers, liquid crystal display substrates, FPD (Flat Panel Display) substrates such as organic EL (Electroluminescence) display devices, optical disk substrates, magnetic disk substrates, and magneto-optical disk substrates. , a substrate for a port mask, a ceramic substrate, a substrate for a solar cell, and the like.

In manufacturing processes, such as a semiconductor device and a liquid crystal display device, the substrate processing apparatus which processes board|substrates, such as a semiconductor wafer and the glass substrate for liquid crystal display devices, is used.

As described in Japanese Patent Application Laid-Open No. 2013-175552 and Japanese Patent Application Laid-Open No. 2007-266211, such a substrate processing apparatus includes a processing unit, a processing liquid tank for storing processing liquid supplied to the processing unit; A circulation pipe for circulating the processing liquid in the processing liquid tank, a pump for sending the processing liquid in the processing liquid tank to the circulation piping, and a filter for filtering the processing liquid flowing through the circulation pipe are provided.

The present inventors are examining providing two circulation piping. Specifically, it is being considered to provide an outer circulation pipe connected to the processing liquid tank and supplying the processing liquid to the processing unit, and an inner circulation piping branched to the outer circulation piping.

In this case, it is conceivable to provide via a filter in the upstream part of the outer circulation piping on an upstream rather than the connection position of the inner circulation piping in an outer circulation piping. In order to keep the processing liquid flowing through the internal circulation pipe and/or the external circulation pipe clean, it is necessary to keep the particle trapping ability of the filter constant.

The particle trapping ability of a filter changes with fluctuations in the pressure of the liquid applied to the filter. When the particle trapping ability of the filter is low, there is a fear that particles previously captured by the filter may leak out from the filter and contaminate the downstream side of the filter.

It is not the only factor that reduces the particle trapping ability of the filter. Even when a large amount of particles is supplied to the filter and the filter is clogged, the particle trapping ability of the filter is lowered.

In addition, if the amount of particles in the processing liquid flowing through the internal circulation piping and/or the external circulation piping can be measured, it is also possible to exclude the processing liquid containing a large amount of particles from the internal circulation piping and/or the external circulation piping. .

Accordingly, one of the objects of the present invention is to provide a substrate processing apparatus capable of supplying a processing unit with a clean processing liquid with a small content of particles.

A first aspect of the present invention is a processing unit having a discharge port for discharging a processing liquid toward a substrate, a processing liquid tank storing processing liquid supplied to the discharge port, and an upstream end connected to the processing liquid tank and a downstream end, an outer circulation pipe forming an outer circulation flow path for circulating the treatment liquid in the treatment liquid tank together with the treatment liquid tank, and sending the treatment liquid in the treatment liquid tank to the outer circulation pipe a pump, a discharge port communicating pipe branchingly connected to the outer circulation pipe at a first connection position and communicating with the discharge port, and branchingly connected to the outer circulation pipe at a second connection position upstream from the first connection position; an inner circulation flow path for circulating the treatment liquid in the treatment liquid tank is formed together with a second upstream portion and the treatment liquid tank that are portions upstream from the second connection position in the outer circulation pipe, an inner circulation pipe for returning the treatment liquid supplied from the outer circulation pipe to the treatment liquid tank, a filter provided through the second upstream portion, and a pressure for adjusting the pressure of the treatment liquid flowing through the second upstream portion an adjustment unit and a control device for controlling the pressure adjustment unit, wherein the control device is in a one-way circulation state in which the processing liquid circulates in the inner circulation passage without circulating the processing liquid in the outer circulation passage The pressure of the processing liquid flowing through the second upstream portion is the pressure of the processing liquid flowing through the second upstream portion in a twin circulation state in which the processing liquid circulates in both the outer circulation passage and the inner circulation passage. and controlling the pressure adjusting unit to match or close.

The particle trapping ability of a filter varies depending on the amount of pressure applied to the filter. In the state in which pressure is applied to the filter, it is possible to capture smaller particles as compared to the state in which no pressure is applied to the filter. And as the pressure applied to the filter increases, even smaller particles can be captured. Conversely, as the pressure applied to the filter decreases, the particles that can be captured become larger, and the filter's ability to capture particles decreases. That is, the particle trapping ability of the filter changes according to the fluctuation of the pressure applied to the filter. When the particle trapping ability of the filter becomes low, there is a fear that particles previously captured by the filter may flow out from the filter to the secondary side.

On the other hand, when the pressure applied to the filter is too large, the flow rate and/or flow rate in the filter will exceed the allowable, and as a result, there is a possibility that particles may escape the filter. In order to properly trap particles by the filter, it is necessary to keep the pressure applied to the filter constant.

According to this configuration, in the one-way circulation state in which the processing liquid circulates in the inner circulation flow path, the pressure of the processing liquid flowing through the second upstream part is a pair in which the processing liquid circulates in both the outer circulation passage and the inner circulation passage. The pressure regulating unit is controlled to match or approach the pressure of the processing liquid flowing through the second upstream portion in the circulating state. Since the pressure applied to the filter in the uni-circulation state coincides with or is close to the pressure applied to the filter in the double-circulation state, the particle trapping ability of the filter can be kept constant regardless of the circulating state of the treatment liquid.

In this way, it is possible to suppress or prevent the particles that have been captured from leaking out of the filter as a result of a change in the pressure applied to the filter. Therefore, it is possible to supply a clean treatment liquid with a small particle content (preferably, a clean treatment liquid not containing particles) to the treatment unit.

In the first aspect, the pressure regulating unit includes an opening degree regulating unit that adjusts the opening degree of the internal circulation pipe.

According to this configuration, the pressure of the processing liquid flowing through the second upstream portion is adjusted by adjusting the opening degree of the internal circulation pipe by the pressure adjusting unit. Accordingly, it is possible to adjust the pressure of the processing liquid flowing through the second upstream portion with a simple configuration.

In a first aspect, as the operating state of the substrate processing apparatus, an executable state in which the twin cycle state is executed, a state different from the executable state, and a standby state in which power supply to the substrate processing apparatus is maintained , optionally and executable, wherein the standby state includes a circulation standby state for realizing the one-way circulation state.

According to this configuration, the pressure of the processing liquid flowing through the second upstream portion in the circulation standby state of the substrate processing apparatus matches the pressure of the processing liquid flowing through the second upstream portion in the executable state of the substrate processing apparatus. or close, the pressure regulating unit is controlled. Since the pressure applied to the filter in the circulating standby state of the substrate processing apparatus 1 coincides with or is close to the pressure applied to the filter in the operable state of the substrate processing apparatus 1, the particle trapping ability of the filter increases that of the substrate processing apparatus. Regardless of whether the operating state is a cycle-ready state or an executable state, it may remain constant or nearly constant.

In the first aspect, in the standby state, while the power supply to the substrate processing apparatus is maintained, the driving of the pump is stopped, and circulation of the processing liquid in the outer circulation passage and the inner circulation passage is stopped. It further includes a stand-by state.

According to this configuration, the standby state includes a circulation standby state in which the processing liquid circulates in the inner circulation passage without circulating the processing liquid in the outer circulation passage, and a circulating standby state in which the pump is stopped (of the outer circulation passage and the inner circulation passage) In both cases, the circulation stop standby state is included in which the circulation of the processing liquid is stopped.

In the circulation standby state, the processing liquid does not circulate in the outer circulation passage, but the processing liquid in the inner circulation passage circulates. Therefore, when the target site for the maintenance operation is a site that does not affect the processing liquid circulation in the internal circulation flow path (for example, in the case of maintenance work for a processing unit or a transfer robot), the substrate processing apparatus waits for circulation. It is possible to perform a maintenance operation|work with respect to a substrate processing apparatus, setting to a state.

On the other hand, in the case where the maintenance target is a site that affects the circulation of the processing liquid in the internal circulation passage, the maintenance operation cannot be performed while the processing liquid is circulated in the internal circulation passage. Therefore, in this case, the operation state of the substrate processing apparatus is set to the circulation stop standby state.

In this way, it is possible to classify a plurality of standby states according to the maintenance site. Therefore, it is possible to shorten the period during which the pump is in a stopped state. Therefore, the operation rate of the substrate processing apparatus can be improved.

In the first aspect, the substrate processing apparatus includes an internal circulation valve provided through the internal circulation pipe to open and close the internal circulation pipe, and a portion downstream of the second connection position in the external circulation pipe a drain pipe branchingly connected to the second downstream portion at a third connection position and discharging the processing liquid from the second downstream portion; and a first switching unit for switching a destination of the processing liquid between a side downstream from the third connection position in the second downstream portion and the drainage pipe, wherein the control device stops the circulation In the transition from the standby state to the executable state, driving of the pump is started, the internal circulation valve is closed, and the processing liquid upstream of the third connection position in the second downstream portion is the By driving the first switching unit to flow into the drainage pipe, a process of discharging the processing liquid in the second upstream part and the processing liquid in the second downstream part through the drainage pipe is executed.

In the circulation stop standby state of the substrate processing apparatus, the drive of the pump is stopped. In this state, circulation of the processing liquid is stopped, and there is no movement of the processing liquid in the filter. At this time, no pressure is applied to the filter. Therefore, the particle trapping ability of the filter is low. Therefore, in the circulation stop standby state of the substrate processing apparatus, particles captured by the filter flow out from the filter to the secondary side, and are accumulated on the secondary side of the filter. In a state in which particles are accumulated on the secondary side of the filter, when driving of the pump is started and circulation of the treatment liquid is started, the particles accumulated on the secondary side of the filter are diffused throughout the outer circulation passage and/or the inner circulation passage. there is a risk of becoming

According to this configuration, upon transition from the circulation stop standby state to the executable state, the processing liquid in the second upstream portion and the processing liquid in the second downstream portion are discharged out of the substrate processing apparatus through the drain pipe. Accordingly, it is possible to suppress or prevent contamination of the inner circulation passage and/or the outer circulation passage by the treatment liquid containing the particles.

In a first aspect, the substrate processing apparatus further includes a selection unit operated by a user to select any one of a plurality of standby states including the circulation standby state and the circulation stop standby state.

According to this configuration, the circulation standby state and the circulation stop standby state can be selectively executed by the operation of the selection unit by the user (including the maintenance person in charge) of the substrate processing apparatus.

In a first aspect, the substrate processing apparatus further includes a detection unit configured to detect a state related to the substrate processing apparatus, and when the state is detected by the detection unit in the circulation standby state, the control device further executes a step of stopping driving of the pump to stop circulation of the processing liquid in the internal circulation passage.

According to this configuration, when a predetermined state is detected by the detection unit in the circulation standby state, the drive of the pump is stopped. That is, in this case, circulation of the processing liquid in the internal circulation passage is stopped. In a circulation standby state, it is possible to perform a maintenance operation|work with respect to a substrate processing apparatus. When a predetermined state arises with respect to a substrate processing apparatus, it may be undesirable to continue the maintenance operation|work.

Accordingly, by adopting a configuration capable of detecting a predetermined condition, when such a predetermined condition occurs, the subsequent circulation of the treatment liquid in the outer circulation passage is stopped, thereby preventing the occurrence of undesirable events in advance. can

In a first aspect, the substrate processing apparatus includes a plurality of the processing units, and the outer circulation pipe includes a first circulation pipe for supplying a processing liquid in common to the plurality of processing units, and the The discharge port communication pipe includes a plurality of supply pipes corresponding to the plurality of processing units one-to-one.

According to this configuration, the supply piping provided in the processing unit in a one-to-one correspondence is branch-connected to the first circulation piping, so that the processing liquid flowing through the first circulation passage is supplied to the processing unit through the supply piping.

A second aspect of the present invention provides a processing unit having a discharge port for discharging a processing liquid toward a substrate, a processing liquid tank storing the processing liquid supplied to the discharge port, and upstream and downstream ends connected to the processing liquid tank an external circulation pipe forming an external circulation flow path for circulating the processing liquid in the processing liquid tank together with the processing liquid tank; a discharge port communicating pipe branched-connected to the outer circulation pipe at a first connection position and communicating with the discharge port, and branched-connected to the outer circulation pipe at a second connection position on an upstream side of the first connection position, the outer circulation an inner circulation passage for circulating the treatment liquid in the treatment liquid tank is formed together with a second upstream portion and the treatment liquid tank that are portions upstream from the second connection position in the pipe, and the outer circulation pipe an internal circulation pipe returning the processing liquid supplied from a first filter and a second filter provided therebetween, and a destination of the processing liquid upstream from a fourth connection position in which the upstream end of the first parallel pipe and the upstream end of the second parallel pipe are connected to each other; When starting the drive of the said pump from the state in which the 2nd switching unit which switches between a 1st parallel piping and the said 2nd parallel piping, and the drive of the said pump is stopped, the said 2nd switching unit is controlled, , set the destination of the processing liquid upstream from the fourth connection position to the second parallel pipe, and then control the second switching unit to determine the destination of the processing liquid upstream from the fourth connection position and a control device for switching to the first parallel pipe.

In a state in which the drive of the pump is stopped, there are cases where replacement of equipment, remodeling of piping, and the like are performed. After modification, etc., particles may adhere to the device or the like. In this state, when the circulation of the processing liquid is started by starting the driving of the pump, a large amount of particles adhering to the device or the like is supplied to the filter, which may cause clogging of the filter. As a result, the particle trapping ability of the filter is lowered, and there is a possibility that particles may leak out of the filter.

According to this configuration, when starting the driving of the pump, the destination of the processing liquid upstream from the fourth connection position is set to the second parallel pipe. And when the predetermined time elapses, the destination of the processing liquid upstream from the 4th connection position is switched to the 1st parallel piping. That is, the filter that captures particles in the processing liquid in the second upstream portion is switched between the first filter and the second filter at and after the start of driving the pump. By trapping particles by the second filter different from the first filter normally used at the start of driving the pump, clogging of the normally used first filter can be suppressed. Thereby, leakage of particles from the first filter can be suppressed or prevented. Therefore, it is possible to supply a clean treatment liquid with a small particle content (preferably, a clean treatment liquid not containing particles) to the treatment unit.

In this case, it is preferable that a 1st filter differs from a 2nd filter in filtering performance. In particular, it is preferable that the sieve of a 2nd filter is coarser than the sieve of a 1st filter. When the pore diameter of the first filter is small, the proportion of particles captured in the pores of the first filter occupies the pores becomes large, so that the clogging of the first filter tends to occur.

In this case, at the start of driving of the pump, relatively large particles are captured by the second filter, and in other cases, relatively small particles can be captured by the first filter. Therefore, at the start of driving of the pump, since the amount of particles captured by the second filter can be suppressed, clogging of the second filter and escaping of particles from the second filter can be suppressed.

A third aspect of the present invention provides a processing unit having a discharge port for discharging a processing liquid toward a substrate, a processing liquid tank storing the processing liquid supplied to the discharge port, and upstream and downstream ends connected to the processing liquid tank an external circulation pipe forming an external circulation flow path for circulating the processing liquid in the processing liquid tank together with the processing liquid tank; a discharge port communicating pipe branched-connected to the outer circulation pipe at a first connection position and communicating with the discharge port, and branched-connected to the outer circulation pipe at a second connection position on an upstream side of the first connection position, the outer circulation an inner circulation passage for circulating the treatment liquid in the treatment liquid tank is formed together with a second upstream portion and the treatment liquid tank that are portions upstream from the second connection position in the pipe, and the outer circulation pipe an internal circulation pipe returning the treatment liquid supplied from and a contamination state measuring device for measuring a contamination state of a region downstream of the apparatus.

According to this configuration, the particles generated due to the device are measured by the contamination state measuring device interposed in the device downstream region of the second upstream part. With the contamination state measuring device, it is possible to measure not only the presence or absence of particles generated due to the device, but also the amount of particles generated due to the device. In addition, since the contamination state measuring device is provided in a region downstream of the device through which particles generated from the device flow, it is possible to accurately measure the amount of particles generated from the device.

Therefore, it is possible to supply a clean treatment liquid with a small particle content (preferably, a clean treatment liquid not containing particles) to the treatment unit.

In a third aspect, the substrate processing apparatus corresponds one-to-one to a plurality of the devices installed interposed in the second upstream portion, and a plurality of device downstream regions corresponding to the plurality of devices on a one-to-one basis, and a plurality of said pollution state measuring devices provided with the second upstream portion interposed therebetween.

According to this configuration, the contamination state measuring device is provided corresponding to each device downstream area. Based on the measured values of the plurality of contamination state measuring devices, it is possible to specify the device serving as the particle generating source.

In a third aspect, the substrate processing apparatus includes: a plurality of drain pipes branched and connected to the plurality of downstream regions at a plurality of fifth connection positions provided for each of the device downstream regions; a method of switching the destination of the processing liquid upstream from the fifth connection position between the downstream side of the fifth connection position in the second upstream portion and the drain pipe connected to the device downstream region 3 It further includes a conversion unit.

According to this configuration, a drain pipe is branched and connected to each device downstream region. In the case where the device serving as the particle generating source is specified, it is possible to discharge the processing liquid through a drainage pipe to a region downstream of the device corresponding to the device. In this case, it is possible to directly discharge the processing liquid containing the particles through a region downstream of the device corresponding to the device serving as the particle generating source. Thereby, it is possible to suppress or prevent the diffusion of particles to other parts of the second upstream part or to the internal circulation pipe.

In a third aspect, the substrate processing apparatus further includes a plurality of third switching units corresponding to the plurality of drain pipes on a one-to-one basis, and a control device for controlling the plurality of third switching units, the control When the number of particles contained in the processing liquid flowing through the device downstream region exceeds a threshold value, the device switches the destination of the processing liquid in the device downstream region to the drainage pipe, and The third switching unit corresponding to the drain pipe is controlled such that the processing liquid on the upstream side of the apparatus downstream area is discharged outside the substrate processing apparatus.

According to this configuration, when the number of particles (measured value of the contamination state measuring device or calculated value based on it) contained in the processing liquid flowing through the device downstream region exceeds the threshold, the device corresponding to the device downstream region is a particle generating source. is judged to be In addition, by discharging the processing liquid including particles through the drainage pipe corresponding to the downstream region of the device, it is possible to suppress or prevent the particles from diffusing into other parts of the second upstream part or the internal circulation pipe.

In a third aspect, the substrate processing apparatus further includes a plurality of third switching units corresponding to the plurality of drain pipes on a one-to-one basis, and a control device for controlling the plurality of third switching units, the control When the difference between the number of particles included in the processing liquid flowing through the two adjacent device downstream regions exceeds a threshold value, the device drains the destination of the processing liquid in the device downstream region with a larger number of particles The third switching unit corresponding to the drain pipe is controlled so as to switch to the pipe and discharge the processing liquid upstream from the region downstream of the device in the second upstream portion to the outside of the substrate processing apparatus.

According to this configuration, when the difference between the number of particles (measured value of the contamination state measuring device or calculated value based on it) contained in the processing liquid flowing through the adjacent device downstream region exceeds a threshold value, the number of particles is higher than the threshold value. It is determined that a device corresponding to the device downstream region is a particle generating source. In addition, by discharging the processing liquid containing particles through the drainage pipe corresponding to the downstream region of the device, it is possible to suppress or prevent the particles from diffusing into other parts of the second upstream part or the internal circulation pipe.

In a third aspect, in the substrate processing apparatus, a bypass pipe connecting the device downstream region and the internal circulation pipe, a portion upstream from a connection position of the bypass pipe in the second upstream part; and a bypass pipe forming a bypass circulation passage for circulating the processing liquid in the processing liquid tank together with a portion downstream from the connection position of the bypass piping in the internal circulation piping; In the portion, the destination of the processing liquid on the upstream side of the sixth connection position to which the bypass piping is connected is located on the downstream side of the sixth connection position in the second upstream portion, and between the bypass piping It further includes a fourth conversion unit to convert in.

According to this structure, the bypass piping which connects the said apparatus downstream area|region and the internal circulation piping is branch-connected to each apparatus downstream area|region. When the device serving as the particle generating source is specified, it is possible to guide the processing liquid in the device downstream region corresponding to the device to the internal circulation pipe through the bypass pipe. In this case, it is possible to guide the processing liquid containing the particles directly from the device downstream region corresponding to the device serving as the particle generating source to the internal circulation pipe. The processing liquid containing particles is purified as it passes through a filter provided through the bypass pipe. Thereby, it is possible to suppress or prevent the diffusion of particles to other parts of the second upstream part or to the internal circulation pipe.

In a third aspect, the substrate processing apparatus controls the plurality of bypass pipes, the plurality of fourth switching units corresponding to the plurality of bypass pipes on a one-to-one basis, and the plurality of the fourth switching units wherein the control device switches the destination of the processing liquid in the device downstream region to the bypass pipe when the number of particles included in the processing liquid flowing through the device downstream region exceeds a threshold value To do so, the fourth switching unit corresponding to the bypass pipe is controlled.

According to this configuration, when the number of particles (measured value of the contamination state measuring device or calculated value based on it) contained in the processing liquid flowing through the device downstream region exceeds the threshold, the device corresponding to the device downstream region is a particle generating source. is judged to be And, by guiding the processing liquid including particles to the internal circulation pipe through the bypass pipe corresponding to the downstream region of the device, diffusion of particles to other parts of the second upstream part or the internal circulation pipe is suppressed or prevented can do.

In a third aspect, the substrate processing apparatus controls the plurality of bypass pipes, the plurality of fourth switching units corresponding to the plurality of bypass pipes on a one-to-one basis, and the plurality of the fourth switching units and a control device configured to: when a difference between the numbers of particles included in the processing liquid flowing through two adjacent device downstream regions exceeds a threshold value, the control device is configured to: The fourth switching unit corresponding to the bypass pipe is controlled to switch the destination of the processing liquid in the region to the bypass pipe.

According to this configuration, when the difference between the number of particles (measured value of the contamination state measuring device or calculated value based on it) contained in the processing liquid flowing through the adjacent device downstream region exceeds a threshold value, the number of particles is higher than the threshold value. It is determined that a device corresponding to the device downstream region is a particle generating source. And, by guiding the processing liquid including particles to the internal circulation pipe through the bypass pipe corresponding to the downstream region of the device, diffusion of particles to other parts of the second upstream part or the internal circulation pipe is suppressed or prevented can do.

In a third aspect, the substrate processing apparatus controls the plurality of bypass pipes, the plurality of fourth switching units corresponding to the plurality of bypass pipes on a one-to-one basis, and the plurality of the fourth switching units and a control device, wherein the plurality of bypass pipes are connected to the second upstream portion at a plurality of sixth connection positions corresponding to the plurality of bypass pipes on a one-to-one basis, and When the device starts driving of the pump from a state in which the driving of the pump is stopped, the plurality of the plurality of the plurality of connections from the upstream side is based on the positional relationship of the plurality of sixth connection positions in the direction in which the chemical liquid flows. control the plurality of the fourth switching units to sequentially open the bypass pipe of

In a state in which the drive of the pump is stopped, there are cases where replacement of equipment, remodeling of piping, and the like are performed. Particles may be attached to the replaced device or the modified pipe. In this state, when the circulation of the treatment liquid is started by starting the driving of the pump, there is a risk that a large amount of particles adhering to the replaced equipment or the remodeled pipe will spread throughout the outer circulation passage and/or the inner circulation passage. there is.

According to this configuration, when starting the drive of the pump from the state in which the drive of the pump is stopped, the bypass pipe is sequentially opened from the pipe located at the upstream side of the sixth connection position. Therefore, the flow path through which the processing liquid circulates can be expanded step by step. Accordingly, by sequentially opening the bypass piping, the processing liquid can be circulated in the internal circulation passage while suppressing or preventing the diffusion of particles to other parts of the second upstream part or to the internal circulation piping.

In a third aspect, the substrate processing apparatus further includes a filter provided through the bypass pipe.

According to this configuration, particles are removed by the filter from the processing liquid flowing through each bypass pipe, and the processing liquid is purified. Since each bypass pipe is provided with a filter interposed therebetween, the particles can be efficiently removed from the processing liquid containing the particles.

In a third aspect, when the number of particles contained in the processing liquid flowing through the device downstream region exceeds a threshold value, the substrate processing apparatus is configured to generate an abnormal state during execution of the substrate processing in the processing unit. In addition, after the end of the substrate processing being executed, the supply of the processing liquid to the processing unit is stopped.

According to this configuration, during execution of substrate processing in the processing unit, when the number of particles (measured value of the contamination state measuring device or calculated value based on it) contained in the processing liquid flowing through the device downstream region exceeds a threshold value, report an abnormality Then, the substrate processing in progress is continued, and after the substrate processing in execution is finished, the supply of the processing liquid to the substrate processing unit is stopped.

Accordingly, it is possible to suppress or prevent the supply of the processing liquid containing particles to the substrate without extremely reducing the throughput.

In the first to third aspects, the pump includes a bellows pump including a movable member installed so as to be reciprocally movable, and a bellows having one end fixed to the housing and the other end fixed to the movable member, When discharging the processing liquid in at least one of the circulation pipe and the internal circulation pipe to the outside of the substrate processing apparatus, the control device controls the bellows pump so that the stroke time of the moving member is increased.

The bellows pump has a property of capturing particles flowing from the upstream side or particles generated on the surface of the bellows, and collecting them in the bellows. And, as the particles are gradually discharged from the bellows pump, there is a risk that the treatment liquid will continue to be contaminated over a long period of time.

According to this configuration, as the stroke time of the moving member of the bellows pump is made longer than usual, the particles collected in the bellows are discharged outside the bellows pump. When discharging the processing liquid in the outer circulation piping and/or the internal circulation piping to the outside of the substrate processing apparatus through the drainage piping, the bellows pump is driven so that the stroke time of the moving member of the bellows pump becomes longer than usual. Thereby, the particles in the bellows pump can be discharged out of the substrate processing apparatus.

In addition, by performing this method at the start of driving the bellows pump, the processing liquid containing particles can be discharged from the bellows pump, the outer circulation passage, and the inner circulation passage, and thereafter, the clean processing liquid is discharged into the outer circulation. It may be circulated in a flow path and/or an internal circulation flow path. Accordingly, it is possible to reduce the amount of the processing liquid required at the start of driving the bellows pump.

In the first to third aspects, the substrate processing apparatus may further include a heater provided through the second upstream portion, and a gas evacuation unit provided on at least one of an upstream side and a downstream side of the heater.

When circulation of the processing liquid is stopped in the outer circulation flow path and the inner circulation flow path, the processing liquid accumulated in the heater may be vaporized. The pressure in the heater may increase due to vaporization of the processing liquid.

According to this configuration, since the gas evacuation part is provided on one of the upstream side and the downstream side of the heater, even when the processing liquid is vaporized, the generated gas flows out of the heater from the gas evacuation part, so that the pressure in the heater does not rise or hardly rises. Accordingly, it is possible to suppress or prevent a rise in pressure in the heater when the circulation of the processing liquid is stopped in the outer circulation passage and the inner circulation passage.

The above-mentioned or still another objective in this invention, the characteristic, and an effect will become clear by description of embodiment mentioned next with reference to an accompanying drawing.

BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic diagram which looked at the substrate processing apparatus which concerns on 1st Embodiment of this invention from above.
2 is a schematic diagram horizontally viewed inside a processing unit provided in the substrate processing apparatus.
3 is a block diagram illustrating hardware of the substrate processing apparatus.
4 is a process diagram for explaining an example of substrate processing performed by the substrate processing apparatus.
5 is a schematic diagram illustrating a chemical liquid supply device of the substrate processing apparatus.
FIG. 6 is a diagram for explaining the configuration of the pump shown in FIG. 5 .
Fig. 7 is a diagram for explaining the configuration of the filter shown in Fig. 5;
FIG. 8 is a diagram showing an example of a maintenance screen in the display input device shown in FIG. 3 .
9 is a diagram for explaining the flow of a chemical solution in the chemical solution supply device in a ready state.
FIG. 10 is a diagram for explaining the flow of the chemical liquid in the chemical liquid supply device in the circulation stop idle state.
11 is a diagram for explaining the flow of the chemical solution in the chemical solution supply device in the circulation idle state.
12 is a flowchart for explaining the transition of the operation state of the substrate processing apparatus from the ready state to the idle state.
Fig. 13 is a diagram for explaining the flow of processing performed in the circulation stop idle state.
Fig. 14 is a diagram for explaining the flow of the chemical immediately after the transition from the circulation stop idle state to the ready state.
Fig. 15 is a diagram for explaining the flow of processing performed in the cyclic idle state.
Fig. 16 is a diagram for explaining the flow of the chemical immediately after the transition from the circulation idle state to the ready state.
Fig. 17 is a diagram for explaining the relationship between the stroke time of the pump and the number of particles to be adhered.
18 is a schematic diagram illustrating a chemical liquid supplying apparatus of a substrate processing apparatus according to a second embodiment of the present invention.
19 is a diagram for explaining the flow of a chemical solution in the chemical solution supply device in a ready state.
Fig. 20 is a diagram for explaining the flow of the chemical immediately after the transition from the circulation stop idle state to the ready state.
21A is a schematic diagram illustrating a chemical liquid supply apparatus of a substrate processing apparatus according to a third embodiment of the present invention.
21B is a schematic diagram showing a modified example of the third embodiment of the present invention.
21C is a schematic diagram illustrating a chemical liquid supply apparatus of a substrate processing apparatus according to a fourth embodiment of the present invention.
22 is a flowchart for explaining the contents of a process executed in the chemical liquid supply device in a ready state.
23 is a flowchart for explaining a first method for specifying a particle generation source.
Fig. 24 is a flowchart for explaining the second method for specifying a particle source.
25 is a schematic diagram illustrating a chemical solution supplying apparatus of a substrate processing apparatus according to a fifth embodiment of the present invention.
26 is a flowchart for explaining the contents of a process executed in the chemical liquid supply device in a ready state.
Fig. 27 is a diagram for explaining the flow of the chemical immediately after the transition from the circulation stop idle state to the ready state.
Fig. 28 is a diagram showing a state following the state of Fig. 27;
Fig. 29 is a diagram showing a state following the state of Fig. 28;

BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic diagram which looked at the substrate processing apparatus which concerns on 1st Embodiment of this invention from above.

The substrate processing apparatus 1 is a single-wafer type apparatus which processes disk-shaped board|substrates W, such as a semiconductor wafer, one by one. The substrate processing apparatus 1 includes a load port LP holding a carrier C for accommodating a substrate W, and a substrate W conveyed from the carrier C on the load port LP as a processing liquid or A plurality of processing units 2 that process with a processing fluid such as processing gas, a transport robot that transports the substrate W between the processing unit 2 and the carrier C on the load port LP, and substrate processing A control device 3 for controlling the device 1 is provided.

The transfer robot includes an indexer robot IR that carries in and unloads the substrate W with respect to the carrier C on the load port LP, and the loading and unloading of the substrate W with respect to the plurality of processing units 2 . It includes a center robot (CR) that performs The indexer robot IR transfers the substrate W between the load port LP and the center robot CR, and the center robot CR moves between the indexer robot IR and the processing unit 2 . The board|substrate W is conveyed. The center robot CR includes a hand H1 that supports the substrate W, and the indexer robot IR includes a hand H2 that supports the substrate W.

The substrate processing apparatus 1 includes a plurality of (for example, four) fluid boxes 4 accommodating fluid devices such as a discharge valve 23 to be described later. The processing unit 2 and the fluid box 4 are arranged in the outer wall 1a of the substrate processing apparatus 1 , and are covered with the outer wall 1a of the substrate processing apparatus 1 . The chemical liquid cabinet 5 which accommodates the chemical liquid tank 30 etc. which will be mentioned later is arrange|positioned outside the outer wall 1a of the substrate processing apparatus 1 . The chemical liquid cabinet 5 may be arrange|positioned at the side of the substrate processing apparatus 1, and may be arrange|positioned below the clean room (underground) in which the substrate processing apparatus 1 is installed.

The plurality of processing units 2 form a plurality of (for example, four) towers TW arranged to surround the center robot CR in plan view. The center robot CR can access any tower TW. Each tower TW includes a plurality of (for example, three) processing units 2 stacked up and down. The four fluid boxes 4 correspond to the four towers TW, respectively. The chemical liquid in the chemical liquid cabinet 5 is supplied to all the processing units 2 included in the tower TW corresponding to the fluid box 4 through one fluid box 4 .

FIG. 2 is a schematic diagram of the inside of the processing unit 2 provided in the substrate processing apparatus 1 viewed horizontally.

The processing unit 2 includes a box-shaped chamber 6 having an internal space, and a vertical rotation axis A1 passing through the central portion of the substrate W while maintaining the substrate W horizontally in the chamber 6 . It includes a spin chuck 10 that rotates around it, and a cylindrical cup 14 that receives the processing liquid discharged from the substrate W.

The chamber 6 includes a box-shaped partition wall 8 provided with a carry-in/out port through which the substrate W passes, a shutter 9 that opens and closes the carry-in/out port, and clean air that is filtered by a filter. FFU 7 (fan filter unit) which forms a flow in chamber 6 is included. The center robot CR carries in the board|substrate W into the chamber 6 through the carrying-in/out port, and carries out the board|substrate W from the chamber 6 through the carrying-in/out port.

The spin chuck 10 includes a disk-shaped spin base 12 held in a horizontal posture, a plurality of chuck pins 11 above the spin base 12 for holding a substrate W in a horizontal posture, , a spin motor 13 that rotates the substrate W around the rotation axis A1 by rotating the chuck pin 11 and the spin base 12 . The spin chuck 10 is not limited to a clamping chuck that contacts the outer circumferential surface of the substrate W with the plurality of chuck pins 11, and the back surface (lower surface) of the substrate W, which is a non-device forming surface. It may be a vacuum chuck that holds the substrate W horizontally by adsorbing it to the upper surface of the spin base 12 .

The cup 14 includes a cylindrical inclined portion 14a extending obliquely upward toward the rotation axis A1, and a cylindrical guide portion extending downward from the lower end (outer end) of the inclined portion 14a ( 14b) and a liquid receiving portion 14c forming an annular groove open in the upward direction. The inclined portion 14a includes an annular upper end having an inner diameter larger than that of the substrate W and the spin base 12 . The upper end of the inclined portion 14a corresponds to the upper end of the cup 14 . The upper end of the cup 14 surrounds the substrate W and the spin base 12 in a plan view.

The processing unit 2 includes an upper position (a position shown in FIG. 2 ) in which the upper end of the cup 14 is located higher than a holding position in which the spin chuck 10 holds the substrate W, and the cup 14 . and a cup raising/lowering unit 15 for vertically raising and lowering the cup 14 between the lower positions in which the upper end is located below the holding position. When the processing liquid is supplied to the substrate W, the cup 14 is disposed at the upper position. The processing liquid scattered outward from the substrate W is received by the inclined portion 14a, and then collected in the liquid receiving portion 14c by the guide portion 14b.

The processing unit 2 includes a rinse liquid nozzle 16 that discharges the rinse liquid downward toward the upper surface of the substrate W held by the spin chuck 10 . The rinse liquid nozzle 16 is connected to a rinse liquid pipe 17 provided with a rinse liquid valve 18 interposed therebetween. The processing unit 2 is disposed between a processing position in which the rinse liquid discharged from the rinse liquid nozzle 16 is supplied to the substrate W and a retracted position in which the rinse liquid nozzle 16 is separated from the substrate W in a plan view. A nozzle moving unit for horizontally moving the rinse liquid nozzle 16 may be provided.

When the rinse liquid valve 18 is opened, the rinse liquid is supplied from the rinse liquid pipe 17 to the rinse liquid nozzle 16 and discharged from the rinse liquid nozzle 16 . The rinse liquid is, for example, pure water (deionized water: DIW (Deionized water)). The rinsing liquid is not limited to pure water, and may be carbonated water, electrolytic ion water, hydrogen water, ozone water, ammonia water (for example, 0.1 to 100 ppm), and hydrochloric acid water having a dilution concentration (for example, about 10 to 100 ppm). .

The processing unit 2 includes a discharge nozzle 21 having a discharge port 21a for discharging the chemical downward toward the upper surface of the substrate W held by the spin chuck 10 . The discharge nozzle 21 is connected to a supply pipe (discharge port communicating pipe) 22 provided with a discharge valve 23 interposed therebetween. The supply and stop of supply of the chemical to the discharge nozzle 21 are switched by the discharge valve 23 .

When the discharge valve 23 is opened, the chemical liquid is supplied from the supply pipe 22 to the discharge nozzle 21 , and the chemical liquid is discharged from the discharge port 21a of the discharge nozzle 21 . The chemical liquid supplied to the discharge nozzle 21 is an organic solvent such as IPA. In addition, the chemical|medical solution supplied to the discharge nozzle 21 may be SPM (mixed solution of sulfuric acid and hydrogen peroxide solution), sulfuric acid containing liquids, such as sulfuric acid. In addition, the chemical liquid supplied to the discharge nozzle 21 is nitric acid, hydrochloric acid, hydrofluoric acid, phosphoric acid, acetic acid, aqueous ammonia, hydrogen peroxide, organic acids (eg, citric acid, oxalic acid, etc.), organic alkalis (eg, TMAH: The liquid containing at least one of tetramethylammonium hydroxide etc.), surfactant, and a corrosion inhibitor may be sufficient. A liquid other than this may be supplied to the discharge nozzle 21 .

The discharge valve 23 includes a discharge execution state in which the supply of the chemical liquid from the supply pipe 22 to the discharge nozzle 21 is executed, and a discharge stop in which the supply of the chemical liquid from the supply pipe 22 to the discharge nozzle 21 is stopped. switch between states. The discharge stop state may be a state in which the valve body is separated from the valve seat. Although not shown, the discharge valve 23 includes a valve body including an annular valve seat surrounding the internal flow path through which the chemical solution flows, and a valve body disposed in the internal flow path and movable with respect to the valve seat. The discharge valve 23 may be an air operated valve whose opening degree is changed by air pressure, or an electric valve whose opening degree is changed by electric power. The same applies to other valves, unless otherwise specified.

The processing unit 2 has a processing position where the chemical liquid discharged from the discharge port 21a of the discharge nozzle 21 is supplied to the upper surface of the substrate W, and the discharge nozzle 21 is separated from the substrate W in plan view. and a nozzle moving unit 26 for horizontally moving the discharge nozzle 21 between the retracted positions. The nozzle moving unit 26 is, for example, a turning unit that horizontally moves the discharge nozzle 21 around an oscillation axis A2 extending vertically from the periphery of the cup 14 .

3 is a block diagram showing hardware of the substrate processing apparatus 1 .

The control device 3 is a computer, including a computer body 3a and a peripheral device 3d connected to the computer body 3a. The computer body 3a includes a CPU 3b (central processing unit) that executes various instructions, and a main memory 3c that stores information. The peripheral device 3d includes an auxiliary storage device 3e for storing information such as a program P, a reading device 3f for reading information from the removable medium RM, and a host computer HC and the like. and a communication device 3g that communicates with other devices.

The control device 3 is connected to a display input device (selection unit) 3h. The display input device 3h is operated when an operator such as a user or a person in charge of maintenance inputs information into the substrate processing apparatus 1 . The information is displayed on the screen of the display input device 3h. The display input device 3h may be, for example, a touch panel type display device. The input device and the display device may be provided separately from each other. Any one of a keyboard, a pointing device, and a touch panel may be sufficient as an input device, and devices other than these may be sufficient as it.

The CPU 3b executes the program P stored in the auxiliary storage device 3e. The program P in the auxiliary storage device 3e may be previously installed in the control device 3 or may be sent from the removable medium RM to the auxiliary storage device 3e via the reading device 3f. Alternatively, it may be transmitted from an external device such as the host computer HC to the auxiliary storage device 3e via the communication device 3g.

The auxiliary storage device 3e and the removable medium RM are nonvolatile memories that hold storage even when power is not supplied. The auxiliary storage device 3e is, for example, a magnetic storage device such as a hard disk drive. The removable media RM is, for example, an optical disk such as a compact disk or a semiconductor memory such as a memory card. The removable medium RM is an example of a computer-readable recording medium in which the program P is recorded. Removable media (RM) is a non-transitory tangible media (non-transitory tangible media).

The auxiliary storage device 3e stores a plurality of recipes. A recipe is information which prescribes|regulates the process content of the board|substrate W, process conditions, and a process sequence. A plurality of recipes differ from each other in at least one of the processing contents of the substrate W, processing conditions, and processing order. The control apparatus 3 controls the substrate processing apparatus 1 so that the board|substrate W is processed according to the recipe designated by the host computer HC. The control device 3 is programmed to execute a substrate processing example described later.

4 is a process diagram for explaining an example of the processing of the substrate W performed by the substrate processing apparatus 1 . In the following, reference is made to FIGS. 1, 2 and 4 .

When the board|substrate W is processed by the substrate processing apparatus 1, the carrying-in process of carrying in the board|substrate W into the chamber 6 is performed (step S1 of FIG. 4).

Specifically, in a state in which the discharge nozzle 21 is retracted from above the substrate W and the cup 14 is located at the lower position, the center robot CR (see FIG. 1 ) moves the substrate W While supporting with the hand H2, the hand H2 is entered into the chamber 6 . Thereafter, the center robot CR places the substrate W on the hand H2 on the spin chuck 10 with the surface of the substrate W facing upward. The spin motor 13 starts rotation of the substrate W after the substrate W is gripped by the chuck pin 11 . The center robot CR places the substrate W on the spin chuck 10 and then withdraws the hand H2 from the inside of the chamber 6 .

Next, a chemical solution supply process of supplying the chemical solution to the substrate W is performed (step S2 in FIG. 4 ).

Specifically, the nozzle moving unit 26 moves the discharge nozzle 21 to the processing position, and the cup raising/lowering unit 15 raises the cup 14 to the upper position. After that, the discharge valve 23 is opened, and the discharge nozzle 21 starts discharging the chemical liquid. When the discharge nozzle 21 is discharging the chemical solution, the nozzle moving unit 26 moves the chemical solution discharged from the discharge port 21a of the discharge nozzle 21 to the central processing position at which the chemical solution collides with the center of the upper surface of the substrate W; , The discharge nozzle 21 may be moved between the outer periphery processing positions where the chemical liquid discharged from the discharge nozzle 21 collides with the upper surface outer periphery of the substrate W, and the liquid landing position of the chemical liquid is located in the center of the upper surface of the substrate W The discharge nozzle 21 may be stopped so as to be positioned.

After the chemical liquid discharged from the discharge nozzle 21 collides with the upper surface of the substrate W, it flows outward along the upper surface of the rotating substrate W. Accordingly, a liquid film of the chemical solution covering the entire upper surface of the substrate W is formed, and the chemical liquid is supplied to the entire upper surface of the substrate W. In particular, when the nozzle moving unit 26 moves the discharge nozzle 21 between the central processing position and the outer peripheral processing position, the entire upper surface of the substrate W is scanned at the chemical liquid landing position, so that the chemical is transferred to the substrate ( It is uniformly supplied to the entire upper surface of W). Accordingly, the upper surface of the substrate W is uniformly treated. When a predetermined time elapses after the discharge valve 23 is opened, the discharge valve 23 is closed, and the discharge of the chemical from the discharge nozzle 21 is stopped. Then, the nozzle moving unit 26 moves the discharge nozzle 21 to the retracted position.

Next, a rinse liquid supply process of supplying pure water, which is an example of a rinse liquid, to the upper surface of the substrate W is performed (step S3 in FIG. 4 ).

Specifically, the rinse liquid valve 18 is opened, and the rinse liquid nozzle 16 starts discharging pure water. The pure water liquefied on the upper surface of the substrate W flows outward along the upper surface of the rotating substrate W. The chemical liquid on the substrate W is washed away by the pure water discharged from the rinse liquid nozzle 16 . Thereby, a liquid film of pure water covering the entire upper surface of the substrate W is formed. When a predetermined time elapses after the rinsing liquid valve 18 is opened, the rinsing liquid valve 18 is closed to stop discharging of pure water.

Next, the drying process of drying the board|substrate W by high-speed rotation of the board|substrate W is performed (step S4 in FIG. 4).

Specifically, the spin motor 13 accelerates the substrate W in the rotational direction to a high rotational speed (eg, several thousand rpm) greater than the rotational speed of the substrate W in the chemical liquid supply process and the rinse liquid supply process. The substrate W is rotated. Thereby, the liquid is removed from the substrate W, and the substrate W is dried. When a predetermined time elapses after the high-speed rotation of the substrate W is started, the spin motor 13 stops rotating. Thereby, rotation of the board|substrate W is stopped.

Next, the carrying-out process of carrying out the board|substrate W from the chamber 6 is performed (step S5 of FIG. 4).

Specifically, the cup raising/lowering unit 15 lowers the cup 14 to the lower position. Thereafter, the center robot CR (refer to FIG. 1 ) moves the hand H2 into the chamber 6 . The center robot CR supports the substrate W on the spin chuck 10 with the hand H2 after the plurality of chuck pins 11 release the grip of the substrate W. Thereafter, the center robot CR retracts the hand H2 from the inside of the chamber 6 while supporting the substrate W with the hand H2. Thereby, the processed board|substrate W is carried out from the chamber 6 .

FIG. 5 is a schematic diagram illustrating a chemical liquid supply device CS1 of the substrate processing apparatus 1 . 6 : is a figure for demonstrating the structure of the pump 37. As shown in FIG. 7 : is a figure for demonstrating the structure of the filter 39. As shown in FIG. In FIG. 5 , the fluid box 4 is indicated by a dashed-dotted line, and the chemical liquid cabinet 5 is indicated by a dashed-dotted line. The members arranged in the region enclosed by the dashed-dotted line are arranged in the fluid box 4 , and the members arranged in the region enclosed by the dashed-dotted line are arranged in the chemical liquid cabinet 5 .

The chemical liquid supply device CS1 of the substrate processing apparatus 1 includes a chemical liquid tank (processing liquid tank) 30 for storing a chemical liquid supplied to the substrate W, and a plurality of chemical liquids for circulating the chemical liquid in the chemical liquid tank 30 . Includes circulation piping.

5 , the plurality of circulation pipes includes a first circulation pipe (outer circulation pipe) 31 having an upstream end 31a and a downstream end 31b connected to the chemical liquid tank 30 , and a first It is branched to the circulation pipe 31 and includes a second circulation pipe (internal circulation pipe) 32 which is a return pipe for returning the chemical solution in the first circulation pipe 31 to the chemical solution tank 30 . The first circulation pipe 31 includes an upstream part (second upstream part) 33 on the upstream side from the connection position P2 (the second connection position) to which the second circulation pipe 32 is connected, and a downstream portion (second downstream portion) 34 on the downstream side of the connection position P2. In the example of FIG. 5 , the chemical liquid tank 30 and the first circulation pipe 31 form a first circulation passage C1 for circulating the chemical liquid in the chemical liquid tank 30 . In the example of FIG. 5 , a second circulation passage C2 for circulating the chemical liquid in the chemical liquid tank 30 is formed by the chemical liquid tank 30 , the upstream part 33 , and the second circulation pipe 32 . do. In the example of FIG. 5 , the first circulation passage C1 is arranged not only in the chemical liquid cabinet 5 but also in the fluid box 4 , and the second circulation passage C2 is provided only in the chemical liquid cabinet 5 . is placed.

In 1st Embodiment, the 1st circulation flow path C1 comprises the outer circulation flow path, and the 2nd circulation flow path C2 comprises the internal circulation flow path which circulates inside the outer circulation flow path.

In the example of FIG. 5 , the first circulation passage C1 constitutes an outer circulation passage extending to the fluid box 4 . The first circulation passage C1 supplies the chemical solution to each of the plurality of processing units 2 . Specifically, a plurality of supply pipes (discharge port communicating pipes) 22 are connected to the first circulation pipe 31 and branch from the first circulation pipe 31 . The plurality of supply pipes 22 correspond to the plurality of processing units 2 on a one-to-one basis. The chemical liquid supplied to the supply pipe 22 from the first circulation passage C1 is supplied to the processing unit 2 corresponding to the supply pipe 22 .

In addition, in the example of FIG. 5 , the first circulation pipe 31 includes a common pipe 35 extending downstream from the chemical liquid tank 30 and a plurality of individual pipes 36 branching from the common pipe 35 . include The upstream end of the common pipe 35 corresponds to the upstream end of the first circulation pipe 31 . The upstream end of the common pipe 35 is connected to the chemical liquid tank 30 . The downstream end of each individual pipe 36 corresponds to the downstream end of the 1st circulation pipe 31 . The downstream end of each individual pipe 36 is connected to the chemical liquid tank 30 . The upstream portion 33 of the first circulation pipe 31 is included in the common pipe 35 . The connection position P2 is set in the common pipe 35 . Accordingly, the second circulation pipe 32 is connected to the common pipe 35 . The downstream portion 34 of the first circulation pipe 31 includes a part of the common pipe 35 and a plurality of individual pipes 36 .

The plurality of individual pipes 36 respectively correspond to the plurality of towers TW. FIG. 5 shows the whole of one individual pipe 36 and a part (upstream end and downstream end) of the remaining three individual pipes 36 . 5 shows three processing units 2 included in the same tower TW. The three supply pipes 22 corresponding to the three processing units 2 included in the same tower TW are connected to the same individual pipe 36 . In other words, in the 1st circulation pipe 31, the supply pipe 22 is branch-connected to the connection position (1st connection position) P1 set downstream from the connection position P2.

Each individual pipe 36 is provided with a first circulation valve 40 for opening and closing the individual pipe 36 interposed therebetween. In the state in which the first circulation valve 40 is closed, the chemical liquid flowing through the common pipe 35 is not guided to each individual pipe 36 (that is, the chemical liquid flowing through the upstream part 33 is on the downstream side) not guided to part 34). Then, when the first circulation valve 40 is opened, the chemical liquid flowing through the common pipe 35 is guided to each individual pipe 36 (that is, the chemical liquid flowing through the upstream part 33 is transferred to the downstream part ( 34)).

As shown in FIG. 5 , the chemical liquid supply device CS1 of the substrate processing apparatus 1 includes a pump 37 that sends the chemical liquid in the chemical liquid tank 30 to the first circulation pipe 31 , and the chemical liquid tank 30 . ) by heating the chemical solution in the chemical solution tank 30 to adjust the temperature of the chemical solution, and a filter 39 for removing foreign substances from the chemical solution flowing through the first circulation pipe (31). The pump 37 , the heater 38 , and the filter 39 are provided in the upstream part 33 , interposed in this order from the chemical liquid tank 30 side. The heater 38 heats the chemical liquid flowing through the upstream part 33 . Although not shown, at least one of a flow meter and a temperature sensor may be interposed in the upstream part 33, and may be provided. Although not illustrated, at least one of a flow meter, a flow rate adjustment unit, and a heater may be interposed in the supply pipe 22 . Although not shown in figure, in the downstream of the connection position P1, and the upstream of the connection position P3 mentioned later, a flow meter and a flow volume adjustment unit may be interposed and provided.

The pump 37 is, for example, a bellows pump. In this case, as shown in FIG. 6 , one side pump chamber 44 and the other side pump chamber 45 are partitioned in the pump 37 . The one-side pump chamber 44 is formed by one cylinder head 41, a pump head 42, and a cylinder 43 interposed therebetween. The other pump chamber 45 is formed by the other cylinder head 41, the pump head 42, and the cylinder 43 provided interposed therebetween.

The pump 37 further includes two substantially disk-shaped moving members 46 arranged in one pump chamber 44 and the other pump chamber 45, and two resin bellows 47 that are formed so as to be expandable and contractible. include One end of each bellows 47 is connected to a corresponding moving member 46 , and the other end of each bellows 47 is fixed to a pump head (housing) 42 . In the one-side pump chamber 44 , the one-side air chamber 48 outside the bellows 47 and the one-side chemical liquid chamber 49 inside the bellows 47 are isolated from each other by the bellows 47 . has been formed Further, in the other pump chamber 45, the other side air chamber 50 outside the bellows 47 and the other chemical liquid chamber 51 inside the bellows 47 are provided by the bellows 47, formed in isolation from each other. In the pump head 42 , one side chemical solution introduction port 55 for introducing a chemical solution into the chemical solution chamber 49 on one side, and the other side chemical solution introduction port 56 for introducing a chemical solution into the other side chemical solution chamber 51 . ) and a chemical solution guiding port 57 for drawing out a chemical solution from the inside of the chemical solution chamber 49 on the one side and the chemical solution chamber 51 on the other side are provided.

When the one side air chamber 48 is open, air is supplied to the other side air chamber 50, and the air pressure in the other side air chamber 50 increases, by the air pressure, the other side pump chamber ( The moving member 46 in 45 moves toward the pump head 42 side. Thereby, the volume of the chemical liquid chamber 51 on the other side is reduced, and the chemical liquid in the chemical liquid chamber 51 on the other side is discharged from the chemical liquid delivery port 57 . In conjunction with this, the moving member 46 in the one-side pump chamber 44 moves to the cylinder head 41 side. Thereby, the volume of the one-side chemical liquid chamber 49 is enlarged, and the chemical liquid is sucked into the one-side chemical liquid chamber 49 from the one-side chemical liquid introduction port 55 .

Contrary to this, when air is supplied to the one-side air chamber 48 with the other-side air chamber 50 open and the air pressure in the one-side air chamber 48 increases, the air pressure , the moving member 46 in the one-side pump chamber 44 moves to the pump head 42 side. Thereby, the volume of the one-side chemical liquid chamber 49 is reduced, and the chemical liquid in the one-side chemical liquid chamber 49 is discharged from the chemical liquid outlet port 57 . In conjunction with this, the moving member 46 in the pump chamber 45 on the other side moves to the cylinder head 41 side. Accordingly, the volume of the chemical liquid chamber 51 on the other side is expanded, and the chemical liquid is sucked into the chemical liquid chamber 51 on the other side from the chemical liquid introduction port 56 on the other side.

In this way, when the moving member 46 reciprocates between the cylinder head 41 and the pump head 42 , the chemical solution is discharged from the chemical solution outlet port 57 , and the chemical solution from the chemical solution tank 30 is transferred to the first It can be sent to the circulation pipe (31).

In its driving state, the pump 37 pumps the chemical liquid in the chemical liquid tank 30 irrespective of the type of operation state of the substrate processing apparatus 1 (ready state, circulation stop idling state, or circulation idling state). It continues to send to the 1st circulation pipe 31 with a constant pressure. The substrate processing apparatus 1 is provided with a pressurizing device that pushes the chemical liquid in the chemical liquid tank 30 to the first circulation pipe 31 by increasing the atmospheric pressure in the chemical liquid tank 30 instead of the pump 37 . may be doing Both the pump 37 and the pressurization device are examples of pumps that send the chemical liquid in the chemical liquid tank 30 to the first circulation pipe 31 .

As shown in FIG. 5 , the heater 38 is a heater that generates Joule heat. At least one of the upstream side and the downstream side of the heater 38 is provided with a gas evacuation unit (not shown). When the circulation of the chemical liquid in both the first circulation passage C1 and the second circulation passage C2 is stopped, the chemical liquid accumulated in the heater 38 may be vaporized. However, since the gas evacuation part is provided on one of the upstream side and the downstream side of the heater 38, even when the chemical liquid is vaporized, the generated gas flows out of the heater 38 from the gas evacuation part, and the pressure in the heater 38 is It does not rise or hardly rises. Accordingly, it is possible to suppress or prevent a rise in pressure in the heater 38 when circulation of the chemical is stopped in both the first circulation passage C1 and the second circulation passage C2 .

As shown in FIG. 7 , the filter 39 includes a filter body 61 and a housing 62 holding the filter body 61 therein. The housing 62 can be opened and closed, and the filter body 61 is detachably attached to the housing 62 . The filter body 61 has a cylindrical shape with one end blocked, for example. The inside of the housing 62 is divided into a primary side space (primary side of the filter 39 ) X1 and a secondary side space (secondary side of the filter 39 ) X2 by a filter body 61 . . The primary-side space X1 is a space inside the filter body 61 . The secondary-side space X2 is a space outside the filter body 61 among the spaces inside the housing 62 .

The filter body 61 is, for example, a standard occlusion type filter. The filter 39 filters the chemical liquid flowing in the primary-side space X1 and removes particles from the chemical liquid. A plurality of holes ( 63) is formed. The hole 63 may be, for example, a square shape when viewed from the thickness direction of the filter body 61, or a polygonal shape other than a square shape, a circular shape, or an elliptical shape when viewed from the thickness direction of the filter body 61. do.

The chemical liquid flows from the primary-side space X1 toward the secondary-side space X2 and passes through the hole 63 of the filter body 61 . Particles contained in the chemical liquid flowing through the primary-side space X1 are adsorbed by the wall surface of the filter body 61 dividing the hole 63 when passing through the hole 63 , and are captured in the hole 63 . . Thereby, the particle is removed from the chemical|medical solution.

In this type of filter 39 , the particle trapping ability of the filter 39 changes with the fluctuation of the pressure applied to the filter 39 . In a state in which pressure is applied to the filter 39 , smaller particles can be captured compared to a state in which no pressure is applied to the filter 39 . And as the pressure applied to the filter 39 increases, it is possible to capture even smaller particles. Conversely, when the pressure applied to the filter 39 decreases, the particles that can be captured become large, and the particle trapping ability of the filter 39 decreases. That is, the particle trapping ability of the filter 39 changes according to a change in the pressure applied to the filter 39 . When the particle trapping ability of the filter 39 becomes low, there is a fear that particles captured by the filter 39 before the trapping ability is lowered may flow out from the filter 39 to the secondary side.

In addition, in this type of filter 39, if the number of particles captured by the filter 39 gradually increases as the filter 39 continues to be used, the filter 39 is gradually clogged and the adsorption performance of the filter 39 is reduced. slow down As a result, the particle trapping ability of the filter 39 decreases.

5 and 7 , the chemical liquid supply device CS1 of the substrate processing apparatus 1 includes an air bleed pipe 64 for evacuating primary air bubbles (air) in the filter 39 , and a filter A drain pipe (66) for discharging the liquid in (39) is further provided. The air bleed pipe 64 is used to remove air bubbles in the filter 39 that cause the generation of particles. Specifically, one end (upstream end) of the air bleed pipe 64 and the drain pipe 66 is connected to the primary side (in the primary side space X1) of the filter 39 . The other end of the air bleed pipe 64 is connected to the chemical liquid tank 30 . As shown in Fig. 5, the air bleed pipe 64 is provided with an air bleed valve 65 for opening and closing the air bleed pipe 64 interposed therebetween. The other end of the drain pipe 66 is connected to the drain tank 80 . The drain pipe 66 is provided with a drain valve 67 for opening and closing the drain pipe 66 interposed therebetween.

As shown in FIG. 5 , the chemical liquid supply device CS1 of the substrate processing apparatus 1 includes a second circulation valve (anti-circulation valve) 70 provided through a second circulation pipe 32 , and a first and a pressure regulating unit that adjusts the pressure of the chemical liquid flowing through the upstream portion 33 of the circulation pipe 31 . The pressure regulating unit is an opening degree regulating unit that adjusts the opening degree of the second circulation pipe 32 . The opening degree adjustment unit is provided through the second circulation pipe 32 . In the example of FIG. 5 , the opening degree adjustment unit is the regulator 71 . The regulator 71 is, for example, an electro-pneumatic regulator. The opening degree adjustment unit is not limited to the regulator 71, and may be an electric valve such as a relief valve or an electric needle valve. Moreover, the opening degree adjustment unit may be integrated with the 2nd circulation valve 70. As shown in FIG.

The pressure adjusting unit further includes a pressure sensor 72 for detecting the pressure of the chemical in the upstream portion 33 . The pressure sensor 72 detects the pressure of the chemical in the upstream part 33 at a predetermined detection position P11 on the upstream part 33 . In the circulation idle state of the substrate processing apparatus 1 , the pressure of the chemical liquid flowing through the filter 39 is substantially equal to the pressure of the chemical liquid at the detection position P11 . Therefore, detecting the pressure of the chemical solution in the upstream portion 33 at the detection position P11 by the pressure sensor 72 can be considered substantially equivalent to detecting the pressure of the chemical solution flowing through the filter 39 . there is. As shown in FIG. 5 , the detection position P11 may be upstream of the filter 39 or downstream of the filter 39 .

As shown in FIG. 5 , the chemical liquid supply device CS1 of the substrate processing apparatus 1 further includes a drain tank 80 for storing the chemical liquid discharged from the chemical liquid tank 30 . A discharge pipe 81 extending toward the drain tank 80 is connected to the chemical liquid tank 30 . A discharge valve 82 that opens and closes the discharge pipe 81 is provided in the middle of the discharge pipe 81 interposed therebetween. When the chemical liquid in the chemical liquid tank 30 is discharged, the discharge valve 82 is opened. Thereby, the chemical liquid in the chemical liquid tank 30 is guided from the chemical liquid tank 30 to the drain tank 80 , and is stored in the drain tank 80 .

A drain pipe 83 is connected to the drain tank 80 . The chemical liquid stored in the drainage tank 80 is sent to a drainage treatment facility other than the substrate processing apparatus 1 by opening a valve (not shown) provided through the drainage pipe 83 , and the liquid is drained in the drainage treatment facility do.

One end of a branch drain pipe (drain pipe) 85 is branched to the vicinity of the downstream end of each individual pipe 36 (that is, near the downstream end of the first circulation pipe 31 ). The other end of the branch drainage pipe 85 is connected to the drainage tank 80 . A branch drain valve 86 for opening and closing the branch drain pipe 85 is provided in the middle of the branch drain pipe 85 interposed therebetween. In each individual pipe 36, a return valve 89 for opening and closing the individual pipe 36 is provided on the downstream side of the connection position (third connection position) P3 of the branch drain pipe 85 interposed therebetween. .

The branch drain valve 86 and the return valve 89 constitute the first switching unit. The 1st switching unit determines the destination of the chemical|medical solution upstream from the connection position P3 in the downstream part 34 of the 1st circulation piping 31, the connection position P3 in the downstream part 34. It switches between the more downstream side and the branch drain pipe (drain pipe) 85 . The first switching unit may include a three-way valve in place of or in addition to the branch drain valve 86 and the return valve 89 .

When the return valve 89 is opened with the branch drain valve 86 closed, the chemical liquid flowing upstream from the connection position P3 of the branch drain pipe 85 in the separate pipe 36 is transferred to the separate pipe. It is guided to the chemical liquid tank 30 through a part downstream from the connection position P3 in (36). On the other hand, when the branch drain valve 86 is opened while the return valve 89 is closed, the chemical liquid flowing upstream from the connection position P3 of the branch drain pipe 85 in the individual pipe 36 is discharged. , is guided to the drain tank 80 through the branch drain pipe 85 .

As shown in FIG. 5 , the chemical liquid supplying device CS1 of the substrate processing apparatus 1 includes a chemical liquid replenishment pipe 87 for replenishing the chemical liquid tank 30 with a new chemical liquid (new liquid), that is, an unused chemical liquid, and , further includes a chemical liquid replenishment valve 88 for opening and closing the chemical liquid replenishment pipe 87 .

The operation state of the substrate processing apparatus 1 is a ready state (executable state, eventually activated state) which is an operation state in which the processing can be executed in the processing unit 2 , and the processing cannot be executed in the processing unit 2 . Includes idle state (standby state), which is an active (not ready) state. When the supply of electric power to the substrate processing apparatus 1 is started by activation of the substrate processing apparatus 1 , the substrate processing apparatus 1 will be in an idle state. After that, as the ready operation is performed, the substrate processing apparatus 1 shifts to the ready state. In the ready state of the substrate processing apparatus 1 , a substrate processing operation (lot processing) by the substrate processing apparatus 1 can be realized.

When it is necessary to perform a maintenance operation on the substrate processing apparatus 1 (inspection at the time of an error, replacement of equipment, replacement of consumables, etc.), the maintenance person puts the substrate processing apparatus 1 in a ready state into an idle state. carry out And with respect to the substrate processing apparatus 1 in an idle state, a maintenance person in charge performs a maintenance operation|work. That is, only in the idle state of the substrate processing apparatus 1, a maintenance operation can be performed with respect to the substrate processing apparatus 1 . And as a ready operation is performed after completion|finish of a maintenance operation|work, the operation state of the substrate processing apparatus 1 shifts to a ready state.

The ready state of the substrate processing apparatus 1 is a state in which the chemical liquid can be supplied to the processing unit 2 in relation to the chemical liquid supply device CS1 . The idle state of the substrate processing apparatus 1 is an operating state in which the chemical liquid cannot be supplied (not ready) to the processing unit 2 , in relation to the chemical liquid supply apparatus CS1 .

The idle state of the substrate processing apparatus 1 includes a circulation stop idle state in which circulation of the chemical is stopped in both the first circulation passage C1 and the second circulation passage C2 (circulation stop standby state), and a first It includes a circulation idle state (circulation standby state) in which circulation of the chemical liquid is continued in the second circulation passage C2 while stopping the circulation of the chemical liquid in the circulation passage C1 . That is, in the substrate processing apparatus 1, two types of idle states are prepared. In any idle state, power supply to the substrate processing apparatus 1 is maintained. Therefore, in the idle state of the substrate processing apparatus 1, the operation|movement (operations, such as a conveyance robot) necessary for the maintenance of each drive component of the substrate processing apparatus 1, etc. can be made to be performed.

8 is a diagram showing an example of the maintenance screen 90 in the display input device 3h.

When performing a maintenance operation in the substrate processing apparatus 1, a person in charge of maintenance operates the maintenance screen 90 in the display input device 3h. On the maintenance screen 90 , as shown in FIG. 8 , a button for stopping operation of the substrate transfer process in the substrate processing apparatus 1 and a system restart button 91 operated for returning to the ready state And, a button for down (turning to an idle state) operation of the substrate processing apparatus 1 and an emergency stop button 92 are displayed.

The buttons for the stop operation of the substrate transfer process in the substrate processing apparatus 1 include a transfer stop button 93 and a cycle stop button 94 . In the ready state of the substrate processing apparatus 1, when the transfer stop button 93 is operated, the center robot CR and the indexer robot IR which are carrying out a board|substrate transfer will stop an operation|movement immediately. When the cycle stop button 94 is operated, the center robot CR and the indexer robot IR stop operating after the substrate transfer processing being executed at that point in time is finished.

The button for the down operation of the substrate processing apparatus 1 includes a cycle stop idle button 95 for shifting the substrate processing apparatus 1 to the cycle stop idling state, and the cycle stop idle button 95 for shifting the substrate processing device 1 to the cycle stop idle state. It includes a cycle idle button 96 for activating. When the circulation stop idle button 95 is operated in the ready state of the substrate processing apparatus 1 , the substrate processing apparatus 1 shifts to the circulation stop idle state. When the cycle idle button 96 is operated in the ready state of the substrate processing apparatus 1 , the substrate processing apparatus 1 shifts to the cycle idle state. That is, selection of a circulation idling state and a circulation stop idling state is performed by operation of the maintenance screen 90 by a maintenance person in charge.

9 is a diagram for explaining the flow of the chemical solution in the chemical solution supply device CS1 in the ready state.

In the lower part of Figure 9, two valves and two pumps are depicted. Among the two valves, the upper valve (the valve partially painted black) indicates an open state (indicated as "OPEN" in FIG. 9), and the lower valve indicates a closed state ( In Fig. 9, "CLOSE" is indicated). Of the two pumps, the upper pump (the pump partially painted black) shows a state in which the pump is sending liquid (indicated as "ON" in FIG. 9), and the lower pump pumps the liquid. A state in which transmission is not performed (indicated as "OFF" in FIG. 9) is shown. This is the same also in FIGS. 10, 11, 14, 16, 19, 20, and 27-29.

In the ready state of the substrate processing apparatus 1 , the pump 37 is in a driving state, and the second circulation valve 70 and the first circulation valve 40 are open. In this state, the air bleed valve 65 is open and the drain valve 67 is closed. In this state, the return valve 89 is open and the branch drain valve 86 is closed. In this state, the discharge valve 82 is closed.

In the ready state of the substrate processing apparatus 1 , the chemical liquid in the chemical liquid tank 30 is sent by the pump 37 to the upstream part 33 of the first circulation pipe 31 , and is connected to the connection position P2 . pass through Thereby, the chemical liquid flows from the upstream part 33 to the downstream part 34 , and returns to the chemical liquid tank 30 from the downstream part 34 . Previously, foreign substances contained in the chemical are removed by the filter (39). In addition, the chemical liquid in the chemical liquid tank 30 is heated by the heater 38 to a temperature prescribed by the recipe and sent to the downstream part 34 . Thereby, the chemical liquid in the chemical liquid tank 30 is sent to the downstream part 34 while being maintained at a constant temperature higher than the temperature of the atmosphere in the processing unit 2 (for example, 20-26 degreeC).

The chemical liquid in the upstream part 33 of the first circulation pipe 31 flows into the downstream part 34 from the connection position P2 and from the connection position P2 to the second circulation pipe 32 . influx The chemical liquid flowing into the second circulation pipe 32 returns to the chemical liquid tank 30 from the downstream end of the second circulation pipe 32 .

That is, in the ready state, the chemical liquid circulates in the first circulation passage C1 and the chemical liquid circulates in the second circulation passage C2 (twin circulation state).

If the circulation of the chemical solution in the second circulation passage C2 is stopped in the ready state of the substrate processing apparatus 1 , the chemical liquid does not move in the second circulation pipe 32 and the second circulation pipe ( 32), there is a risk that particles may accumulate. In order to prevent the accumulation of such particles, the circulation of the chemical liquid in the second circulation passage C2 is not stopped in the ready state of the substrate processing apparatus 1 .

10 is a diagram for explaining the flow of the chemical liquid in the chemical liquid supply device CS1 in the circulation stop idle state.

In the cycle stop idle state of the substrate processing apparatus 1 , the pump 37 is in the drive stop state. The second circulation valve 70 and the first circulation valve 40 are closed. All other valves are closed.

In the circulation stop idling state, since the drive of the pump 37 is stopped, circulation of the chemical is stopped in both the first circulation passage C1 and the second circulation passage C2. And in the circulation stop idling state, the chemical|medical solution remains in the middle part of the 1st circulation flow path C1 and the 2nd circulation flow path C2. Specifically, the entire area of the upstream part 33 , the upstream side of the first circulation valve 40 in the downstream part 34 , and the second circulation valve 70 in the second circulation pipe 32 . ) upstream of the chemical liquid. Of course, it goes without saying that the chemical is also retained in the pump 37 , the heater 38 , and the filter 39 .

At this time, there is a high possibility that the chemical liquid remaining in the secondary-side space X2 of the filter 39 contains many particles. This is considered to be the cause of the following. That is, by stopping the drive of the pump 37 , there is no movement of the chemical solution in the filter 39 , and the pressure of the chemical solution is not applied to the filter 39 . Therefore, the particles captured by the filter 39 flow out to the secondary-side space X2 and accumulate in the chemical solution remaining in the secondary-side space X2.

In particular, when the chemical solution is a sulfuric acid-containing solution, the amount of particles generated due to oxidation of the chemical solution in the pipe increases. Even when the chemical is IPA, the amount of particles generated due to the elution of the pipe (resin pipe) increases. Therefore, when the chemical liquid is a sulfuric acid-containing liquid or IPA, the amount of particles contained in the chemical liquid remaining in the secondary-side space X2 of the filter 39 is further increased.

11 is a diagram for explaining the flow of the chemical liquid in the chemical liquid supply device CS1 in the circulation idle state.

In the circulation idle state of the chemical liquid supply device CS1 , the pump 37 is in the driving state. In this state, the 2nd circulation valve 70 is open, and the 1st circulation valve 40 is closed. In this state, the air bleed valve 65 is open and the drain valve 67 is closed. All other valves are closed.

The chemical liquid in the upstream part 33 does not flow into the downstream part 34 from the connection position P2 but flows into only the second circulation pipe 32 . The chemical liquid flowing into the second circulation pipe 32 returns to the chemical liquid tank 30 from the downstream end of the second circulation pipe 32 .

That is, in the circulation idle state, the chemical liquid does not circulate in the first circulation passage C1 and the chemical liquid circulates in the second circulation passage C2 (one-way circulation state).

12 is a flowchart for explaining the transition of the operation state of the substrate processing apparatus 1 from the ready state to the idle state.

In the ready state of the substrate processing apparatus 1, as a button for a down operation is operated (step S11), the operation state of the substrate processing apparatus 1 shifts from the ready state to the idle state. Specifically, any one of the circulation stop idle state and the circulation idle state is selected, and a button corresponding to the selected idle state is operated (step S12). When the circulation stop idle button 95 (refer to FIG. 8) is operated, the substrate processing apparatus 1 shifts to the circulation stop idle state. When the cycle idle button 96 (refer to FIG. 8) is operated, the substrate processing apparatus 1 shifts to the cycle idle state.

When the circulation stop idle button 95 is operated (YES in step S12), the control device 3 stops the driving of the pump 37 (step S13), and further the first circulation valve 40 and the second circulation The valve 70 is closed (step S14). The control device 3 further closes the other valves as well. Thereby, the substrate processing apparatus 1 shifts to the circulation stop idle state.

On the other hand, when the circulation idle button 96 is operated (NO in step S12), the control device 3 continues driving the pump 37 (step S16), and further, the first circulation valve 40 (FIG. 12) In , "outer circulation valve 40") is closed (step S17). Then, the control device 3 controls the regulator 71 so that the pressure of the chemical liquid flowing through the upstream portion 33 matches or approaches the pressure of the chemical liquid flowing through the upstream portion 33 in the ready state. control (step S18). By adjusting the opening degree of the second circulation pipe 32 by the regulator 71 , the pressure of the chemical liquid flowing through the upstream part 33 is adjusted.

Specifically, the pressure of the chemical at the detection position P11 of the upstream part 33 is detected by the pressure sensor 72 . The control device 3 stores the value of the pressure of the chemical at the detection position P11 in the ready state. Then, the control device 3 controls the regulator 71 so that the pressure of the chemical at the detection position P11 coincides with or approaches the stored pressure value. Thereby, the pressure of the chemical liquid flowing through the upstream portion 33 is maintained at or near the value of the pressure of the chemical liquid flowing through the upstream portion 33 in the ready state.

Thereby, the substrate processing apparatus 1 shifts to a circulation idle state.

Fig. 13 is a diagram for explaining the flow of processing performed in the circulation stop idle state. Fig. 14 is a diagram for explaining the flow of the chemical immediately after the transition from the circulation stop idle state to the ready state.

In the cycle stop idling state of the substrate processing apparatus 1, a maintenance person performs a maintenance operation|work (step S21 of FIG. 13). In the circulation stop idle state, the driving of the pump 37 is stopped, and the circulation of the chemical liquid in the circulation passages (the first circulation passage C1 and the second circulation passage C2) is stopped. Therefore, the maintenance person in charge can perform the maintenance work with respect to the processing unit 2, a conveyance robot, etc. in a circulation stop idling state. In addition, the maintenance person in charge of maintenance works on the chemical liquid supply device CS1, that is, the maintenance work on the equipment and piping inside the fluid box 4 or the chemical liquid cabinet 5 (equipment and Remodeling, repair and replacement of piping, replacement of consumables, etc. Hereinafter, these may simply be referred to as "remodeling of equipment, etc.") can be performed. However, in the circulation stop idling state, it is preferable to perform maintenance work on the equipment and piping inside the chemical liquid cabinet 5 that cannot be maintained in the circulation idling state.

In the cycle stop idle state of the substrate processing apparatus 1, when the system restart button 91 (refer FIG. 8) is operated (ready, YES in step S22 of FIG. 13), the operation state of the substrate processing apparatus 1 moves to the ready state (step S23 in Fig. 13). Specifically, as shown in FIG. 14 , the control device 3 restarts the drive of the pump 37 and opens the first circulation valve 40 . In addition, the control device 3 immediately after the transition to the ready state, as shown in FIG. 14 , closes the return valve 89 and the air bleed valve 65 with the branch drain valve 86 and drain valve closed. Open valve (67). Accordingly, the chemical liquid remaining in the first circulation passage C1 and the second circulation passage C2 is discharged to the drain tank 80 without being returned to the chemical liquid tank 30 . The discharge period at this time is such that all of the chemical liquid remaining in the first circulation passage C1 and the second circulation passage C2 can be replaced with the new chemical liquid supplied after the pump 37 is restarted. It is set based on the supply capacity, chemical viscosity, pipe diameter, and pipe length.

When a predetermined period elapses after the branch drain valve 86 is opened, the control device 3 closes the branch drain valve 86 and the drain valve 67 and opens the return valve 89 . Thereby, it returns to the ready state shown in FIG. 9 (step S24 of FIG. 13). In this ready state, processing (production lot processing) with respect to the substrate W is performed in the processing unit 2 .

Fig. 15 is a diagram for explaining the flow of processing performed in the cyclic idle state. Fig. 16 is a diagram for explaining the flow of the chemical immediately after the transition from the circulation idle state to the ready state.

Conventionally, as an idle state of a substrate processing apparatus, a circulation idle state is not provided. Therefore, in the idle state of the substrate processing apparatus, the drive of the pump is stopped and the circulation of the chemical in the circulation passage is stopped. In a state in which the pump is stopped, the pressure of the chemical liquid applied to the filter becomes zero, so that particles flow out of the filter. Therefore, after the restart of circulation of the chemical liquid in the circulation passage, many particles are present in the circulation passage. Therefore, it is necessary to perform preliminary circulation in which the chemical liquid is preliminarily circulated in the circulation passage or flushing in which the chemical liquid in the circulation passage is replaced. However, these preliminary circulations and flushing require a great amount of time. Not only that, but a large amount of chemical was consumed in flushing.

In the circulation idling state of the substrate processing apparatus 1 , there is no drive stop of the pump 37 , and therefore, it is not necessary to perform preliminary circulation or flushing after resumption from the circulation idling state.

In the circulation idling state of the substrate processing apparatus 1, a maintenance person performs a maintenance operation|work (step S31 of FIG. 15). In the circulation idle state, the pump 37 is driven and the chemical liquid is circulated in the second circulation passage C2 , but the chemical liquid circulation is stopped in the first circulation passage C1 . Therefore, the maintenance person in charge can perform the maintenance work for the processing unit 2, the conveyance robot, etc. in a circulation idling state. In addition, in the circulation idle state, the maintenance person performs maintenance work on the chemical liquid supply device CS1, that is, maintenance work on the equipment, piping, consumables, etc. inside the fluid box 4 (remodeling of equipment, etc.) can be done

However, in the circulation idling state, when the chemical liquid is circulating in a part of the circulation passage, the maintenance work is performed. When a predetermined condition has occurred in the chemical liquid supply device CS1, it may not be preferable to continue the maintenance operation depending on the type of the condition. Therefore, in the cyclic idle state, a hard interlock is prepared.

Specifically, in the chemical liquid cabinet 5 , a detection sensor (detection unit) 100 (see FIG. 3 ) for detecting that a cover (not shown) of the chemical liquid cabinet 5 is opened, and a chemical liquid cabinet 5 ), a detection sensor (detection unit) 101 (refer to FIG. 3 ) for detecting the occurrence of leakage in the inside is provided. In the circulation idle state, the presence or absence of detection of the detection sensors 100 and 101 is monitored by the control device 3 . When the detection sensors 100 and 101 detect the opening of the cover of the chemical liquid cabinet 5 or the occurrence of leakage in the chemical liquid cabinet 5 , the control device 3 controls the driving of the pump 37 . It stops, and the circulation of the chemical|medical solution in the 2nd circulation flow path C2 after detection is stopped. Thereby, the occurrence of undesirable events can be prevented in advance.

Even when the maintenance person in charge operates the emergency stop button 92 (refer to FIG. 8) while maintenance work is being performed in the circulation idling state, the control device 3 stops the drive of the pump 37 and makes an emergency stop The circulation of the chemical liquid in the second circulation passage C2 after the button 92 has been operated is stopped.

In the cycle idle state of the substrate processing apparatus 1, when the system restart button 91 (refer to FIG. 8) is operated (ready operation, YES in step S32 of FIG. 15), the operation state of the substrate processing apparatus 1 is changed It shifts to a ready state (step S33 in FIG. 15). Specifically, the control device 3 opens the first circulation valve 40 as shown in FIG. 16 . Also, immediately after the transition to the ready state, the control device 3 opens the branch drain valve 86 in the closed state of the return valve 89 as shown in FIG. 16 . Accordingly, the chemical liquid remaining in the upstream portion 33 and the downstream portion 34 is discharged to the drain tank 80 without being returned to the chemical liquid tank 30 . When the first circulation valve 40 is opened while the pump 37 is being driven, circulation of the chemical liquid in the first circulation passage C1 is resumed. The chemical liquid to which the pressure is applied can be made to flow into the downstream part 34 . As a result, the drain time required for draining when transitioning from the circulation idling state to the ready state can be significantly shortened compared to the case of returning from the circulation stop idling state (the state shown in Fig. 14) (for example, For example, about 1/5 to about 1/10).

When a predetermined period elapses after the branch drain valve 86 is opened, the control device 3 closes the branch drain valve 86 and the drain valve 67 and opens the return valve 89 . Thereby, it returns to the ready state shown in FIG. 9 (step S34 of FIG. 15). In this ready state, processing (production lot processing) with respect to the substrate W is performed in the processing unit 2 .

As described above, according to the first embodiment, the chemical liquid flowing through the upstream portion 33 in the circulation idle state of the substrate processing apparatus 1 (in the one-way circulation state in which the chemical liquid circulates only in the second circulation passage C2 ) the pressure of the upstream part ( 33) to match or close to the pressure of the chemical liquid flowing through the regulator 71 is controlled. The pressure applied to the filter 39 in the circulation idle state (unidirectional circulation state) of the substrate processing apparatus 1 is applied to the filter 39 in the ready state (twin circulation state) of the substrate processing apparatus 1 . Since it is close to or equal to the pressure, the particle trapping ability of the filter 39 can be kept constant or close, regardless of whether the operating state of the substrate processing apparatus 1 is a cycle idle state or a ready state.

Thereby, it is possible to suppress or prevent the particles that have been captured from leaking out of the filter 39 with a change in the pressure applied to the filter 39 . Therefore, it is possible to supply the processing unit 2 with a clean chemical solution having a small particle content (preferably, a clean chemical solution containing no particles).

Moreover, in the first embodiment, the pressure of the chemical liquid flowing through the upstream portion 33 is adjusted by adjusting the opening degree of the second circulation pipe 32 by the regulator 71 . Thereby, the pressure of the chemical|medical solution which flows through the upstream part 33 can be adjusted with a simple structure.

Further, during the circulation idle state, the chemical liquid does not circulate in the first circulation passage C1 and the chemical liquid circulates in the second circulation passage C2 . Therefore, when the target site of the maintenance work is a site that does not affect the chemical liquid circulation in the second circulation passage C2 (for example, in the case of maintenance work for the processing unit 2 or the transfer robot), It is possible to perform a maintenance operation on the chemical liquid supply apparatus CS1 and the processing unit 2 while setting the substrate processing apparatus 1 to the circulation idle state.

On the other hand, when the maintenance target is a site that affects the chemical liquid circulation in the second circulation passage C2, the maintenance operation cannot be performed while the chemical liquid is circulated in the second circulation passage C2. Therefore, in this case, the operation state of the substrate processing apparatus 1 is set to the circulation stop idle state.

In this way, by classifying a plurality of idle states according to the maintenance site, it is possible to shorten the period during which the pump 37 is stopped. Currently, most of the maintenance of the substrate processing apparatus 1 is to target a site that does not affect the chemical liquid circulation in the second circulation passage C2 . Therefore, by employing the cyclic idle state as the idle state of the substrate processing apparatus 1 , the operation rate of the substrate processing apparatus 1 can be remarkably improved.

By the way, in the first embodiment, at the time of drainage after returning to the ready state from the idle state (circulation stop idle state and/or circulation idle state), the stroke time ( The time required for one reciprocating operation of the moving member 46 (refer to FIG. 6) may be longer than the idle state or the ready state. In other words, the stroke time of the moving member 46 at the time of drainage after returning from the idle state to the ready state may be longer than the stroke time in the other states, that is, in a stable state such as an idle state or a ready state.

Since the bellows 47 of the pump 37 (bellows pump) has a large surface area (that is, a liquid contact area with a chemical solution) and is made of resin, particles are easily generated. On the other hand, the pump 37 (bellows pump) has a property of catching generated particles and collecting them in the bellows 47 due to its structural characteristics. And, in the ready state, as particles are gradually discharged from the inside of the bellows 47 by the driving of the pump 37 in the ready state, the circulation flow path (the first circulation flow path C1 and/or the second circulation flow path C2) is There is a possibility that the circulating chemical solution will continue to be contaminated over a long period of time.

17 is a diagram for explaining the relationship between the stroke time of the pump 37 and the number of particles to be adhered. In FIG. 17, the circulation pressure and circulation flow rate of the pump 37 are made constant, respectively.

By making the stroke time of the moving member 46 of the pump 37 longer (2.0 sec) than the normal stroke time (1.5 sec), the particles collected before in the bellows 47 of the pump 37 are removed. , it is possible to effectively discharge out of the pump 37 .

When the chemical liquid in the first circulation passage C1 and/or the second circulation passage C2 is discharged to the outside of the chemical liquid supply device CS1 after the return to the ready state, the control device 3 includes a pump ( The pump 37 is controlled so that the stroke time of the moving member 46 of 37) becomes longer than the idle state or the ready state. Thereby, it is possible to reduce the amount of particles collected in the pump 37, therefore, it is possible to reduce the particles contained in the chemical solution supplied to the substrate (W).

18 is a schematic diagram illustrating a chemical liquid supply device CS2 of the substrate processing apparatus 201 according to the second embodiment of the present invention.

In 2nd Embodiment, the same reference code|symbol as the case of FIGS. 1-17 is attached|subjected to the part common to 1st Embodiment mentioned above, and description is abbreviate|omitted.

The main difference between the chemical solution supplying device CS2 according to the second embodiment from the chemical solution supplying device CS1 according to the first embodiment is that the first parallel pipe 211A is located in the middle of the upstream part 33 . and the second parallel pipe 211B is provided, and the first parallel pipe 211A and the second parallel pipe 211B are respectively provided with the first filter 239A and the second filter 239B interposed therebetween. . The second filter 239B is a dedicated filter at the time of transition to the ready state. Hereinafter, it demonstrates concretely.

As described above, the first circulation pipe 31 includes an upstream portion 33 upstream from the connection position P2 and a downstream portion 34 downstream from the connection position P2. . The second circulation pipe 32 is branched from the first circulation pipe 31 at the connection position P2 . In the second embodiment, the first circulation pipe 31 branches into two at the connection position P4 between the chemical liquid tank 30 and the connection position P2, and then connects to the connection position P4. It gathers at the position between the positions P2. The upstream portion 33 includes a first parallel pipe 211A and a second parallel pipe 211B connected in parallel. The upstream ends of the 1st parallel pipe 211A and the 2nd parallel pipe 211B are mutually connected at the connection position P4. The downstream ends of the 1st parallel pipe 211A and the 2nd parallel pipe 211B are mutually connected at the position between the connection position P4 and the connection position P2.

The 1st parallel pipe 211A is provided with the 1st filter 239A and the 1st parallel valve 212A for opening and closing the 1st parallel pipe 211A interposed therebetween. The 2nd parallel pipe 211B is provided with the 2nd filter 239B and the 2nd parallel valve 212B for opening and closing the 2nd parallel pipe 211B interposed therebetween. The 1st filter 239A and the 2nd filter 239B are the same filters as the filter 39 (refer FIG. 7).

The 1st parallel valve 212A and the 2nd parallel valve 212B comprise the 2nd switching unit. The 2nd switching unit switches the destination of the chemical|medical solution upstream from the connection position P4 in the upstream part 33 between the 1st parallel pipe 211A and the 2nd parallel pipe 211B. The 2nd switching unit may be provided with the three-way valve in place of or in addition to the 1st parallel valve 212A and the 2nd parallel valve 212B.

The first parallel valve 212A is opened while the second parallel valve 212B is closed. Thereby, in the upstream part 33, the chemical|medical solution which flows upstream from the connection position P4 of the 1st parallel pipe 211A and the 2nd parallel pipe 211B is guided to the 1st parallel pipe 211A, It passes through the first filter 239A.

On the other hand, the 2nd parallel valve 212B is opened in the state in which the 1st parallel valve 212A is closed. Thereby, in the upstream part 33, the chemical|medical solution which flows upstream from the connection position P4 of the 1st parallel pipe 211A and the 2nd parallel pipe 211B is guided to the 2nd parallel pipe 211B, It passes through the second filter 239B.

The first filter 239A is different from the second filter 239B in filtering performance. The diameter of the hole 63 (refer FIG. 7) of the 2nd filter 239B is larger than the diameter of the hole 63 (refer FIG. 7) of the 1st filter 239A. That is, if the hole diameter of the first filter 239A is small, the ratio of particles captured in the hole 63 of the first filter 239A to occupy the hole 63 increases, so that the first filter 239A is clogged. This is likely to happen.

In the example of FIG. 18 , the air bleed pipe is omitted, but an air bleed pipe like the air bleed pipe 64 (refer to FIG. 5 ) may be provided in each of the filters 239A and 239B. In addition, a drain pipe similar to the drain pipe 66 (refer FIG. 5) may be provided in each filter 239A, 239B.

19 is a diagram for explaining the flow of the chemical in the substrate processing apparatus 201 in the ready state. Fig. 20 is a diagram for explaining the flow of the chemical immediately after the transition from the circulation stop idle state to the ready state.

The flow of the chemical in the ready state of the substrate processing apparatus 201 is the same as that in the ready state (refer to FIG. 9 ) of the substrate processing apparatus 1 according to the first embodiment, as shown in FIG. 19 . . Moreover, in the ready state of the substrate processing apparatus 201, as shown in FIG. 19, the control apparatus 3 closes the 2nd parallel valve 212B, and also opens the 1st parallel valve 212A. Accordingly, in the ready state, in the upstream portion 33 , the chemical liquid flowing upstream from the connection position P4 (fourth connection position) of the first parallel pipe 211A and the second parallel pipe 211B is released. 1 It is guided to the parallel pipe 211A and passes through the 1st filter 239A.

On the other hand, the circulation stop idling state of the substrate processing apparatus 201 also becomes the same flow as the circulation stop idle state (refer to FIG. 10 ) of the substrate processing apparatus 1 according to the first embodiment. In the circulation stop idling state, since the drive of the pump 37 is stopped, circulation of the chemical is stopped in both the first circulation passage C1 and the second circulation passage C2.

In the circulation stop idling state, since circulation of the chemical liquid is stopped in both the first circulation passage C1 and the second circulation passage C2 , the equipment inside the chemical liquid cabinet 5 (equipment, piping, and consumables) etc.), maintenance work is performed. Such maintenance work includes performing remodeling and the like (remodeling, repair and replacement) of the equipment disposed upstream of the filters 239A and 239B in the upstream portion 33 . Particles may adhere to equipment that has been modified or the like. In this state, when the circulation of the chemical is started by starting the driving of the pump 37, a large amount of particles adhering to the device or the like is supplied to the filters 239A and 239B. As a result, the filters 239A and 239B are clogged. , the particle trapping ability of the filters 239A and 239B is reduced. As a result, there is a possibility that particles may leak from the filters 239A and 239B.

At the time of transition from the circulation stop idle state to the ready state, as shown in FIG. 20 , the control device 3 closes the first parallel valve 212A and opens the second parallel valve 212B. Thereby, in the upstream part 33, the chemical|medical solution which flows upstream from the connection position P4 of the 1st parallel pipe 211A and the 2nd parallel pipe 211B is guided to the 2nd parallel pipe 211B, and is removed. 2 is passed through the filter 239B.

When a predetermined time elapses from the transition to the ready state, the control device 3 closes the second parallel valve 212B and opens the first parallel valve 212A. Thereby, in the upstream part 33, the chemical|medical solution which flows upstream from the connection position P4 of the 1st parallel pipe 211A and the 2nd parallel pipe 211B is guided to the 1st parallel pipe 211A, 1 It passes through the filter 239A.

As described above, according to the second embodiment, when the substrate processing apparatus 201 shifts to the ready state, the chemical liquid is filtered through the second filter 239B different from the first filter 239A used in the ready state, and thereafter , the chemical solution is filtered through the first filter 239A. Thereby, it can suppress that clogging arises in the 1st filter 239A. Thereby, leakage of particles from the first filter 239A can be suppressed or prevented. Therefore, it is possible to supply the processing unit 2 with a clean chemical solution having a small particle content (preferably, a clean chemical solution containing no particles).

In addition, since the sieve of the second filter 239B is coarser than that of the first filter 239A, relatively large particles are captured by the second filter 239B at the time of transition to the ready state, otherwise , it is possible to trap relatively small particles by the first filter 239A. Therefore, at the time of transition to the ready state, since the amount of particles captured by the second filter 239B can be suppressed, clogging of the second filter 239B and particles from the second filter 239B. leakage can be suppressed.

21A is a schematic diagram illustrating a chemical liquid supply device CS3 of the substrate processing apparatus 301 according to the third embodiment of the present invention.

In 3rd Embodiment, the same reference code|symbol as the case of FIGS. 1-17 is attached|subjected to the part common to 1st Embodiment mentioned above, and description is abbreviate|omitted.

The main difference between the chemical liquid supplying device CS3 according to the third embodiment from the chemical liquid supplying device CS1 according to the first embodiment is that a return pipe (outer circulation pipe) is located in the middle of each supply pipe 22 . ) and 302 are branched. The external circulation piping according to the third embodiment includes a portion upstream from the connection position P1 among the first circulation piping 31 , a portion upstream from the connection position P9 among the supply piping 22 , and a return It is constituted by a pipe 302 . The internal circulation piping which concerns on 3rd Embodiment is comprised by the part on the downstream side from the connection position P1 among the 1st circulation piping 31. As shown in FIG. The discharge port communication piping according to the third embodiment is constituted by a flow path from the connection position P9 to the discharge port 21a.

In the example of FIG. 21A, not only the discharge valve 23 but the heater 303, the flow meter 304, the flow control valve 305, etc. are provided in each supply piping 22 via the intervening. The return pipe 302 is branched and connected to the connection position P9 set on the downstream side of the respective installation positions of the flow meter 304 , the flow control valve 305 , and the heater 303 in the supply pipe 22 , there is. The other end of the return pipe 302 is connected to the chemical liquid tank 30 . The third circulation flow path C3 for circulating the chemical liquid in the chemical liquid tank 30 includes the chemical liquid tank 30 , a portion of the first circulation pipe 31 on an upstream side from the connection position P1 , and a supply pipe 22 . ), it is formed by the part on the upstream side from the connection position P9, and the return pipe 302. As shown in FIG. A return valve 306 for opening and closing the return pipe 302 is provided in the middle of the return pipe 302 interposed therebetween.

In 3rd Embodiment, the 3rd circulation flow path C3 comprises the outer circulation flow path, and the part downstream from the connection position P1 among the 1st circulation flow paths C1 comprises the internal circulation flow path.

A second discharge valve 307 for opening and closing the downstream portion is provided in a portion downstream of the connection position P9 of each of the supply pipes 22 interposed therebetween. When the return valve 306 is opened while the second discharge valve 307 is closed, the chemical liquid flowing upstream from the connection position P9 in the supply pipe 22 is transferred through the return pipe 302 to the chemical solution. Guided to the tank 30 . On the other hand, when the second discharge valve 307 is opened while the return valve 306 is closed, the chemical liquid flowing upstream from the connection position P9 in the supply pipe 22 is discharged from the discharge nozzle 21 . It is guided to the discharge port 21a.

In the third embodiment, as shown in FIG. 21A , the chemical liquid supply device CS3 is connected to the upstream part 33 according to the third embodiment, that is, at the connection position P1 in the first circulation pipe 31 . and a pressure adjusting unit that adjusts the pressure of the chemical liquid flowing through the upstream portion. The pressure regulating unit is an opening degree regulating unit that adjusts the opening degree of the downstream portion 34 on the downstream side from the connection position P1 . The opening degree adjustment unit is provided via the downstream part 34 . In the example of FIG. 21A , the opening degree adjustment unit is the regulator 308 . The regulator 308 is, for example, an electro-pneumatic regulator. The opening degree adjustment unit is not limited to the regulator 308, and may be an electric valve such as a relief valve or an electric needle valve. The pressure adjusting unit further includes a pressure sensor 72 for detecting the pressure of the chemical in the upstream portion 33 .

Similar to the substrate processing apparatus 1 , a ready state, a circulation stop idle state, and a circulation idle state are prepared as the operating state of the substrate processing apparatus 301 . In the ready state of the substrate processing apparatus 301 , the chemical liquid circulates through both the third circulation passage C3 constituting the outer circulation passage and the first circulation passage C1 constituting the inner circulation passage (twin circulation state). . In the circulation stop idle state of the substrate processing apparatus 301 , circulation of the chemical is stopped in both the third circulation passage C3 and the first circulation passage C1 . In the circulation idle state of the substrate processing apparatus 301 , circulation of the chemical liquid is stopped in the third circulation passage C3 , and circulation of the chemical liquid continues in the first circulation passage C1 . Even when the substrate processing apparatus 301 is in a ready state and a circulation idle state, the chemical liquid circulates in the second circulation passage C2 . When the substrate processing apparatus 301 is in the circulation stop idle state, the chemical liquid does not circulate in the second circulation passage C2 .

In the cyclic idling state of the substrate processing apparatus 301 , a maintenance person can perform a maintenance operation on the processing unit 2 or the transfer robot. In addition, the maintenance person is interposed in the equipment related to the chemical liquid supply device CS3 , that is, the supply pipe 22 and the return pipe 302 , and the supply pipe 22 and the return pipe 302 in the circulation idle state. Maintenance of the installed equipment (eg, the discharge valve 23 , the heater 303 , the flow meter 304 , the flow control valve 305 , the return valve 306 , the second discharge valve 307 ), etc. work (remodeling, etc.) can be performed.

In the circulation idle state of the substrate processing apparatus 301 (in the one-way circulation state in which the chemical liquid in the first circulation passage C1 circulates), the pressure of the chemical liquid flowing through the upstream part 33 is 301) in the ready state (in the twin circulation state in which the chemical liquid in both the first circulation passage C1 and the third circulation passage C3 circulates), the pressure of the chemical liquid flowing through the upstream part 33 To match or close, the regulator 308 is controlled. The pressure applied to the filter 39 in the circulation idle state (one-way circulation state) of the substrate processing apparatus 301 is applied to the filter 39 in the ready state (twin circulation state) of the substrate processing apparatus 301 . Since it is close to or equal to the pressure, the particle trapping ability of the filter 39 can be kept constant or nearly constant, regardless of whether the operating state of the substrate processing apparatus 301 is a circulation idle state or a ready state.

Thereby, it is possible to suppress or prevent the particles that have been captured from leaking out of the filter 39 with a change in the pressure applied to the filter 39 . Therefore, it is possible to supply the processing unit 2 with a clean chemical solution having a small particle content (preferably, a clean chemical solution containing no particles).

21B is a schematic diagram showing a modified example of the third embodiment of the present invention.

The difference between the modified example shown in FIG. 21B and the third embodiment shown in FIG. 21A is that the connection position P9 is positioned in the middle of each discharge nozzle 21 , that is, inside the processing unit 2 . that is being placed. In the modified example shown in FIG. 21B, the part downstream from the connection position P9 of the supply piping 22 comprises the discharge port communicating piping which communicates with the discharge port 21a. In the modified example shown in FIG. 21B , the third circulation passage C3 extends to the middle of the discharge nozzle 21 , that is, to the inside of the processing unit 2 . By circulating the chemical liquid heated by the heater in the third circulation passage C3 , the chemical liquid temperature-controlled to a desired high temperature can be discharged from the discharge port of the discharge nozzle 21 .

21C is a schematic diagram illustrating a chemical liquid supply device CS4 of the substrate processing apparatus 401 according to the fourth embodiment of the present invention.

In the fourth embodiment, the same reference numerals as in the case of FIGS. 1 to 17 are attached to parts common to the first embodiment described above, and description thereof is omitted.

The main difference between the chemical solution supplying device CS4 according to the fourth embodiment and the chemical solution supplying device CS1 according to the first embodiment is that the upstream part 33 is provided interposed between the upstream part 33 . A contamination state in which the contamination state of the device downstream region 402 is measured in the device downstream region 402 set on the downstream side of the device to be used (eg, the pump 37 , the heater 38 , the filter 39 ). The point is that the measurement device 403 is interposed therebetween.

The device downstream region 402 is a part of the upstream portion 33 including an intervening position of the device installed interposed in the upstream portion 33 and downstream of the intervening position. When a plurality of devices are installed with the upstream part 33 interposed therebetween, if two devices adjacent to the direction in which the chemical liquid flows are defined as an upstream device and a downstream device, from the installation position of the upstream device to the installation position of the downstream device A region of is a device downstream region 402 corresponding to an upstream device. As shown in Fig. 21C, a device downstream region 402 is provided for each device (pump 37, heater 38, filter 39).

In the example of FIG. 21C , three device downstream regions 402 are provided in the upstream part 33 , and the three contamination state measuring devices 403 are located in the upstream part 33 corresponding to the second upstream part. ) is installed through the Accordingly, one contamination state measuring device 403 is provided for each device downstream region 402 .

The contamination state measuring device 403 measures the amount of particles contained in the chemical liquid flowing through each device downstream region 402 . Specifically, the contamination state measuring device 403 measures the number of particles contained in the chemical solution that has passed through the device downstream region 402 within a predetermined period of time. The measurement result by the contamination state measurement device 403 is input to the control device 3 . The contamination state measuring device 403 is, for example, a particle counter, a total reflection fluorescence X-ray analyzer (TRXRF), an energy dispersive X-ray spectrometer (EDX: Energy Dispersive X-ray spectrometer), and a scanning electron microscope (SEM). : Scanning Electron Microscope), and at least one of an image recognition foreign material inspection device.

In each device downstream region 402 , an individual drain pipe (drain pipe) 404 is branched. A downstream end of each individual drain pipe 404 is connected to a drain tank 80 . The individual drain pipe 404 is provided with an individual drain valve 405 for opening and closing the individual drain pipe 404 interposed therebetween.

The individual drain pipe 404 is connected to the upstream part 33 at the connection position (fifth connection position) P5. The contamination state measuring device 403 measures the contamination state at the measurement position P12 of the upstream part 33 . The connection position P5 is arrange|positioned at the position away from each corresponding apparatus (pump 37, the heater 38, the filter 39) downstream by a predetermined distance (for example, 15 centimeters). The measurement position P12 is arrange|positioned at the position away from each corresponding apparatus (pump 37, the heater 38, the filter 39) downstream by a small interval (for example, 10 centimeters). In the example of FIG. 21C, the connection position P5 is arrange|positioned rather than the measurement position P12 downstream. The connection position P5 may be arrange|positioned rather than the measurement position P12 upstream. The measurement position P12 and the connection position P5 may be arrange|positioned with the space|interval of about the same degree apart from each corresponding apparatus (pump 37, heater 38, filter 39).

In each device downstream region 402 , a device downstream valve 406 for opening and closing the device downstream region 402 is interposed therebetween.

In the fourth embodiment, the individual drain valve 405 and the device downstream valve 406 constitute the third switching unit. The third switching unit is configured to determine the destination of the chemical liquid upstream from the connection position P5 in each device downstream region 402, downstream from the connection position P5 in each device downstream region 402, and , switch between the individual drain pipes 404 . The third switching unit may be provided with a three-way valve in place of or in addition to the individual drain valve 405 and the device downstream valve 406 .

In each device downstream region 402 , an individual drain valve 405 corresponding to the device downstream region 402 is in a closed state with the device downstream valve 406 provided interposed in the device downstream region 402 is closed. By opening, the chemical liquid flowing through the device downstream region 402 is guided to the drain tank 80 through the individual drain pipe 404 corresponding to the device downstream region 402 .

On the other hand, in each device downstream region 402 , an individual drain valve 405 corresponding to the device downstream region 402 is in a closed state, and the device downstream valve 406 is provided through the device downstream region 402 . ) is opened, the chemical liquid in the device downstream region 402 passes through the device downstream valve 406 and is discharged downstream from the device downstream region 402 . If the device downstream region 402 is not the most downstream device downstream region 402, the chemical liquid that has passed through the device downstream region 402 is the next device (in the example of FIG. 21C , the heater 38 or the filter 39) ) is guided by

22 is a flowchart for explaining the contents of a process executed in the chemical liquid supply device CS4 in the ready state.

In the ready state of the chemical liquid supply device CS4 , the control device 3 constantly monitors the amount of particles contained in the chemical liquid flowing through each device downstream region 402 (step S41 ). Then, the control device 3 specifies the particle generating source (the device serving as the particle generating source) based on the measurement result by the contamination state measuring device 403 .

Then, the control device 3 specifies the device downstream region 402 corresponding to the specific particle generating source (the device serving as the particle generating source) (step S42 ), and the individual drain valve corresponding to the device downstream region 402 . 405 is opened (step S43). At this time, the other individual drain valves 405 are in the closed state (step S43).

23 is a flowchart for explaining a first method for specifying a particle generation source.

The control device 3 checks whether or not the value measured by the pollution state measurement device 403 exceeds a predetermined first threshold based on the measurement result by the pollution state measurement device 403 (step S51 ) ). Then, when the value measured by the contamination state measuring device 403 exceeds the first threshold (YES in step S51 ), the control device 3 controls the device downstream area ( ) corresponding to the contamination state measuring device 403 . 402) is specified as the particle generation source (step S52).

Fig. 24 is a flowchart for explaining the second method for specifying a particle generation source.

The control device 3 checks whether the difference between the values measured by the pollution state measurement devices 403 adjacent to each other exceeds a second threshold based on the measurement results by the pollution state measurement device 403 (step) S61). Then, when the difference between the values measured by the adjacent pollution state measurement devices 403 exceeds the second threshold (YES in step S61), the control device 3 sends the control device 3 to the pollution state measurement device 403 with the higher measurement value. ), the device downstream region 402 corresponding to ) is specified as a particle generation source (step S62).

In the first method shown in Fig. 23 and the second method shown in Fig. 24, the particles are not based on the magnitude relationship between the measured value and the threshold value, but based on the magnitude relationship between the calculated value calculated based on the measured value and the threshold value. The generation source may be specified.

According to the fourth embodiment, particles generated due to the device are measured by the contamination state measuring device 403 provided in the device downstream region 402 of the upstream part 33 . With the contamination state measuring device 403, not only the presence or absence of particles generated due to the device, but also the amount of particles generated due to the device can be measured. In addition, since the contamination state measuring device 403 is provided in the device downstream region 402 through which particles generated from the device pass, it is possible to accurately measure the amount of particles generated from the device.

Therefore, it is possible to supply the processing unit 2 with a clean chemical solution having a small particle content (preferably, a clean chemical solution containing no particles).

In addition, a pollution state measuring device 403 is provided corresponding to each device downstream region 402 . Based on the measured values of the plurality of contamination state measuring devices 403 , it is possible to specify the device serving as the particle generating source.

In addition, an individual drain pipe 404 is branched to each device downstream region 402 . When the device serving as the particle generating source is specified, the chemical solution containing particles is discharged into the device downstream region 402 corresponding to the device through an individual drain pipe 404, thereby discharging the chemical solution as the particle generating source. It is possible to drain directly through the instrument downstream region 402 corresponding to the instrument.

In the fourth embodiment, when the substrate processing apparatus 401 is in a ready state and the processing unit 2 is processing the substrate W, particles contained in the chemical solution flowing through the device downstream region 402 When the number (measured value of the pollution state measuring device 403 or a calculated value based on it) exceeds a third threshold higher than the first threshold, the display input device 3h (refer to FIG. 3 ) and an alarm device (not shown) ) may warn of contamination of the chemical (abnormal state) and stop the substrate processing. Even when the number of particles exceeds the first threshold in the plurality of device downstream regions 402 , an abnormal state may be warned and substrate processing may be stopped. In this case, when there is a substrate processing in progress, it is not stopped immediately, but is stopped thereafter.

Such processing may be performed not only in the substrate processing according to the fourth embodiment, but also in the substrate processing according to the fifth embodiment described below.

25 is a schematic diagram illustrating a chemical liquid supply device CS5 of the substrate processing apparatus 501 according to the fifth embodiment of the present invention.

In the fifth embodiment, the same reference numerals as in the case of FIGS. 21C to 24 are attached to parts common to the fourth embodiment described above, and description thereof is omitted.

The main difference between the chemical liquid supplying device CS5 according to the fifth embodiment and the chemical liquid supplying device CS4 according to the fourth embodiment is that in each device downstream region 402, an individual drainage pipe 404 is replaced. Thus, the bypass pipe 502 for connecting the device downstream region 402 and the second circulation pipe 32 is provided. In addition, the bypass pipe 502 corresponding to the device downstream region 402 which is the most downstream is not provided.

The upstream end of each bypass pipe 502 is connected to the upstream part 33 at the connection position (sixth connection position) P61. The downstream end of each bypass pipe 502 is connected to the 2nd circulation pipe 32 at the connection position P62. The bypass circulation passages CB1 and CB2 (refer to FIGS. 27 to 28 ) for circulating the chemical liquid in the chemical liquid tank 30 are connected to the bypass pipe 502 and the upstream part 33 at a connection position P61 . ) and a portion downstream of the connection position P62 in the second circulation pipe 32 .

The upstream end of the upper bypass pipe 502 (hereinafter referred to as "the upper bypass pipe 502") in FIG. 25 is the lower bypass pipe 502 (hereinafter, referred to as "upper bypass pipe 502") in FIG. It is disposed upstream from the upstream end of the "lower bypass pipe 502"). On the other hand, the downstream end of the upper bypass pipe 502 is arranged downstream from the downstream end of the lower bypass pipe 502 . Accordingly, the positional relationship of the upstream ends of the plurality of bypass pipes 502 with respect to the direction in which the chemical liquid flows is different from the positional relationship of the downstream ends of the plurality of bypass pipes 502 with respect to the direction in which the chemical liquid flows.

Each bypass pipe 502 includes a bypass valve 503 for opening and closing the bypass pipe 502 , and a bypass filter 504 for removing foreign substances from the chemical liquid flowing through the bypass pipe 502 . interposed and installed. The bypass filter 504 is the same filter as the filter 39 (refer to FIG. 7).

In the example of FIG. 25 , in each device downstream region 402 , the connection position P61 of the bypass pipe 502 corresponding to the device downstream region 402 is measured by the contamination state measuring device 403 . It is arrange|positioned downstream from the position P12. More specifically, the connection position P61 of the bypass pipe 502 is a predetermined interval (for example, 15 centimeters) apart. The measurement position P12 and the connection position P61 may be arrange|positioned with the space|interval of about the same degree apart from each corresponding apparatus (pump 37, heater 38, filter 39). The connection position P61 may be arrange|positioned rather than the measurement position P12 upstream.

In the fifth embodiment, the bypass valve 503 and the device downstream valve 406 constitute a fourth switching unit. The fourth switching unit is configured to determine a destination of the chemical liquid upstream from the connection position P61 in each device downstream region 402, downstream from the connection position P61 in each device downstream region 402; Switches between bypass piping 502 . The 4th switching unit may be provided with a three-way valve instead of or in addition to the bypass valve 503 and the device downstream valve 406.

In each device downstream region 402 , the bypass valve 503 corresponding to the device downstream region 402 is opened while the device downstream valve 406 corresponding to the device downstream region 402 is closed. As a result, the chemical liquid flowing through the device downstream region 402 is guided to the second circulation pipe 32 through the bypass pipe 502 corresponding to the device downstream region 402 .

On the other hand, in each device downstream region 402 , in a state where the bypass valve 503 corresponding to the device downstream region 402 is closed, the device downstream valve 406 corresponding to the device downstream region 402 is closed. When is opened, the chemical liquid in the device downstream region 402 passes through the device downstream valve 406 and is discharged downstream from the device downstream region 402 . If the device downstream region 402 is not the most downstream device downstream region 402, the chemical liquid that has passed through the device downstream region 402 is the next device (in the example of FIG. 25 , the heater 38 or the filter 39) ) is guided.

26 is a flowchart for explaining the contents of processing executed in the chemical liquid supply device CS5 in the ready state.

In the ready state of the chemical liquid supply device CS5 , the control device 3 constantly monitors the amount of particles contained in the chemical liquid flowing through each device downstream region 402 (step S71 ). Then, the control device 3 specifies the particle generating source (the device serving as the particle generating source) based on the measurement result by the contamination state measuring device 403 (step S72). As a method for specifying the particle generation source, the first method shown in Fig. 23 and the second method shown in Fig. 24 can be employed.

Then, the control device 3 specifies a device downstream region 402 corresponding to a specific particle generation source (a device serving as a particle generation source), and activates a bypass valve 503 corresponding to the device downstream region 402 . open (step S73). At this time, the other bypass valves 503 and the second circulation valves 70 (referred to as "internal circulation valves 70" in FIG. 23) are in the closed state (step S73).

According to this fifth embodiment, in addition to the effects described in relation to the fourth embodiment, the following effects are exhibited.

That is, the bypass piping 502 which connects the said apparatus downstream area|region 402 and the 2nd circulation pipe 32 is branch-connected to each device downstream region 402 . When the device serving as the particle generating source is specified, it is possible to directly guide the chemical solution in the device downstream region 402 corresponding to the device to the second circulation pipe 32 through the bypass pipe 502 . . In this case, it is possible to directly guide the chemical liquid containing particles from the device downstream region 402 corresponding to the device serving as the particle generation source to the second circulation pipe 32 . The chemical liquid containing particles is purified as it passes through the bypass filter 504 provided through the bypass pipe 502 . Thereby, it is possible to suppress or prevent particles from diffusing into other parts of the upstream part 33 or the second circulation pipe 32 .

27 to 29 are diagrams for explaining the flow of the chemical immediately after the transition from the circulation stop idle state to the ready state in the fifth embodiment.

In the circulation stop idling state, when equipment is replaced or piping is remodeled, particles may adhere to the replaced equipment or the remodeled piping. In this state, when the state transitions to the ready state and the circulation of the chemical liquid in the circulation flow path is started, a large amount of particles adhering to the replaced equipment or the remodeled pipe is transferred to the first circulation path C1 and/or the second circulation path. There is a risk of spreading throughout the flow path (C2).

At the time of transition from the circulation stop idling state to the ready state, as shown in Figs. 27 to 29 , the connection position P61 is sequentially from the bypass pipe 502 located on the more upstream side to the bypass pipe 502 . ) is opened. First, as shown in FIG. 27, a chemical|medical solution flows into the bypass pipe 502 (bypass pipe 502 corresponding to the pump 37) on the upstream side. Thereby, the chemical|medical solution circulates in the bypass circulation flow path CB1 (refer FIG. 27).

After the chemical liquid flowing through the bypass circulation passage CB1 is cleaned, the chemical liquid is transferred to the downstream bypass pipe 502 (bypass pipe 502 corresponding to the heater 38) as shown in FIG. 28 . it flows Thereby, the chemical|medical solution circulates in the bypass circulation flow path CB2 (refer FIG. 28).

After the chemical liquid flowing through the bypass circulation passage CB2 is cleaned, the inflow of the chemical liquid into the second circulation passage C2 is allowed as shown in FIG. 29 . Accordingly, the chemical liquid circulates through the second circulation passage C2.

At the time of transition from the circulation stop idle state to the ready state, the connection position P61 is opened sequentially from the bypass pipe 502 located on the more upstream side, so that the circulation flow path through which the chemical liquid circulates is changed to the bypass circulation flow path CB1 ) → the bypass circulation flow path (CB2) → the second circulation flow path (C2), in the order of, can be expanded step by step. Thereby, the chemical liquid can be circulated in the second circulation passage C2 while suppressing or preventing diffusion of particles to other portions of the upstream portion 33 or to the second circulation pipe 32 .

As mentioned above, although five embodiment of this invention was described, this invention can also be implemented in another form.

For example, in the first embodiment, the regulator 71 may adjust the opening degree of the upstream portion 33 instead of the opening degree of the second circulation pipe 32 .

In the first and third embodiments described above, the pressure sensor 72 may be disposed on the downstream side of the filter 39 . Moreover, even if the pressure of the upstream part 33 is not detected, when the pressure adjustment of the upstream part 33 by the regulator 71 can be performed favorably, the pressure sensor 72 may be abbreviate|omitted.

In the first and third embodiments, the regulators 71 and 308 may adjust the flow rate in both the ready state and the circulation stop idle state.

In the second, fourth, and fifth embodiments, the cyclic idle state does not need to be provided as the operating state of the substrate processing apparatus.

As a method of discharging the chemical liquid in the first circulation passage C1 and/or the second circulation passage C2 at the time of transition to the ready state, the chemical liquid is not discharged through the branch drain pipe 85, but the chemical liquid tank ( 30), the chemical liquid may be temporarily returned, and then the chemical liquid in the chemical liquid tank 30 may be drained.

Instead of the downstream end of each individual pipe 36 of the first circulation pipe 31 being connected to the chemical solution tank 30 , the downstream end of the downstream pipe to which the plurality of individual pipes 36 are connected is the chemical solution tank 30 . ) may be connected.

Instead of the downstream end of each return pipe 302 being connected to the chemical solution tank 30 , the downstream end of the return common pipe to which the plurality of return pipes 302 are connected may be connected to the chemical solution tank 30 , The downstream end of the return pipe 302 may be connected to the first circulation pipe 31 .

As the pump 37, a pump other than a bellows pump may be employed.

The liquid stored in the chemical liquid tank 30 is not limited to the chemical liquid, and may be another liquid such as a rinse liquid.

The number of the supply piping 22 connected to the same individual piping 36 may be less than two, and four or more may be sufficient as it.

The number of the individual pipes 36 provided in the 1st circulation pipe 31 may be less than 3, and 5 or more may be sufficient as them.

In the first to fifth embodiments, the gas evacuation unit 600 may be provided on the downstream side of the heater 38 provided via the upstream part 33 . As shown by a broken line in FIG. 5 , the gas evacuation unit 600 includes a relief pipe 601 and a relief valve 602 provided with the relief pipe 601 interposed therebetween. The upstream end of the relief pipe 601 is connected to the downstream side of the heater 38 in the upstream part 33 . The downstream end of the relief pipe 601 is connected to the drain tank 80 .

When circulation of the chemical liquid (processing liquid) is stopped, the chemical liquid (processing liquid) accumulated in the heater 38 may vaporize. The pressure in the heater 38 may rise due to vaporization of the chemical (processing liquid).

In the modified example shown by the broken line in FIG. 5, since the gas evacuation part 600 is provided on the downstream side of the heater 38, even when the chemical|medical solution vaporizes, the generated gas is discharged|emitted to the gas evacuation part 600. As shown in FIG. Accordingly, it is possible to suppress or prevent the pressure increase in the heater 38 when the circulation of the chemical liquid (processing liquid) is stopped.

In this modification, the downstream end of the relief pipe 601 may be connected to the chemical liquid tank 30 instead of the drain tank 80 . In addition, the gas evacuation unit 600 may be provided on the upstream side of the heater 38 instead of on the downstream side of the heater 38 .

The substrate processing apparatuses 1 , 201 , 301 , 401 , and 501 are not limited to the apparatus for processing the disk-shaped substrate W , and may be an apparatus for processing the polygonal substrate W .

Two or more of all the structures mentioned above may be combined.

Although embodiments of the present invention have been described in detail, these are merely specific examples used to clarify the technical content of the present invention, and the present invention should not be construed as being limited to these specific examples, and the spirit and spirit of the present invention and The scope is limited only by the appended claims.

Claims (23)

a processing unit having a discharge port for discharging the processing liquid toward the substrate;
a processing liquid tank storing the processing liquid supplied to the discharge port;
an outer circulation pipe including an upstream end and a downstream end connected to the treatment liquid tank and forming an outer circulation passage for circulating the treatment liquid in the treatment liquid tank together with the treatment liquid tank;
a pump for sending the treatment liquid in the treatment liquid tank to the external circulation pipe;
a discharge port communicating pipe which is branchedly connected to the external circulation pipe at a first connection position and communicates with the discharge port;
A second upstream portion and the treatment liquid branched and connected to the outer circulation pipe at a second connection position on the upstream side of the first connection position and which is a portion upstream from the second connection position in the outer circulation pipe an internal circulation pipe forming an internal circulation flow path for circulating the processing liquid in the processing liquid tank together with the tank, and returning the processing liquid supplied from the outer circulation piping to the processing liquid tank;
a filter installed in the second upstream part;
a pressure adjusting unit for adjusting the pressure of the processing liquid flowing through the second upstream part;
a control device for controlling the pressure regulating unit;
In the one-way circulation state in which the control device circulates the processing liquid in the inner circulation flow path without circulating the processing liquid in the outer circulation flow path, the pressure of the processing liquid flowing through the second upstream part is the pressure of the outer circulation and controlling the pressure regulating unit to coincide with or close to a pressure of the processing liquid flowing through the second upstream portion in a dual circulation state in which the processing liquid circulates in both the flow path and the internal circulation flow path. . The method according to claim 1,
The substrate processing apparatus, wherein the pressure regulating unit includes an opening degree regulating unit that adjusts an opening degree of the internal circulation pipe. The method according to claim 1,
As the operating state of the substrate processing apparatus, an executable state in which the twin cycle state is executed and a standby state that is different from the executable state and maintains power supply to the substrate processing apparatus are selectively executable is properly installed,
The substrate processing apparatus in which the said standby state contains the circulation standby state which implement|achieves the said one-way circulation state. 4. The method according to claim 3,
The standby state further includes a circulation stop standby state in which the driving of the pump is stopped and the circulation of the processing liquid in the outer circulation passage and the inner circulation passage is stopped while power supply to the substrate processing apparatus is maintained. comprising, a substrate processing apparatus. 5. The method according to claim 4,
The substrate processing apparatus,
an internal circulation valve which is installed interposed in the internal circulation pipe and opens and closes the internal circulation pipe;
a drain pipe branchingly connected at a third connection position to a second downstream portion that is a portion downstream from the second connection position in the outer circulation piping to discharge the processing liquid from the second downstream portion;
The destination of the processing liquid upstream from the third connection position in the second downstream portion is switched between the destination downstream of the third connection position in the second downstream portion and the drain pipe Further comprising a first conversion unit to
In the transition from the circulation stop standby state to the executable state, the control device starts driving the pump, closes the internal circulation valve, and further includes the third connection in the second downstream part. By driving the first switching unit so that the processing liquid on the upstream side flows into the drainage pipe, the processing liquid in the second upstream part and the processing liquid in the second downstream part are discharged through the drainage pipe The substrate processing apparatus which performs the process to do. 5. The method according to claim 4,
and a selection unit operated by a user to select any one of a plurality of standby states including the circulation standby state and the circulation stop standby state. 4. The method according to claim 3,
The substrate processing apparatus further includes a detection unit configured to detect a state related to the substrate processing apparatus,
further executing a step of, when the state is detected by the detection unit in the circulation standby state, the control device stops driving of the pump to stop circulation of the processing liquid in the internal circulation passage; , substrate processing equipment. The method according to claim 1,
The substrate processing apparatus includes a plurality of the processing units;
The outer circulation pipe includes a first circulation pipe for supplying the processing liquid in common to the plurality of processing units,
The substrate processing apparatus, wherein the discharge port communication pipe includes a plurality of supply pipes corresponding to the plurality of processing units on a one-to-one basis. a processing unit having a discharge port for discharging the processing liquid toward the substrate;
a processing liquid tank storing the processing liquid supplied to the discharge port;
an outer circulation pipe including an upstream end and a downstream end connected to the treatment liquid tank and forming an outer circulation passage for circulating the treatment liquid in the treatment liquid tank together with the treatment liquid tank;
a pump for sending the treatment liquid in the treatment liquid tank to the external circulation pipe;
a discharge port communicating pipe which is branchedly connected to the external circulation pipe at a first connection position and communicates with the discharge port;
A second upstream portion and the treatment liquid branched and connected to the outer circulation pipe at a second connection position on the upstream side of the first connection position and which is a portion upstream from the second connection position in the outer circulation pipe an internal circulation pipe forming an internal circulation flow path for circulating the processing liquid in the processing liquid tank together with the tank, and returning the processing liquid supplied from the outer circulation piping to the processing liquid tank;
a first filter and a second filter which are a part of the second upstream part and are respectively interposed in first and second parallel pipes connected in parallel to each other on an upstream side from the second connection position;
Switching between the first parallel pipe and the second parallel pipe, the destination of the processing liquid upstream from the fourth connection position where the upstream end of the first parallel pipe and the upstream end of the second parallel pipe are connected to each other a second conversion unit to
When starting the driving of the pump from a state in which the driving of the pump is stopped, the second switching unit is controlled to set the destination of the processing liquid upstream from the fourth connection position to the second parallel pipe and, when a predetermined time elapses after starting the driving of the pump, a control device for controlling the second switching unit to switch the destination of the processing liquid upstream from the fourth connection position to the first parallel pipe A substrate processing apparatus comprising a. 10. The method of claim 9,
The said 1st filter differs from the said 2nd filter in filtering performance, The substrate processing apparatus. a processing unit having a discharge port for discharging the processing liquid toward the substrate;
a processing liquid tank storing the processing liquid supplied to the discharge port;
an outer circulation pipe including an upstream end and a downstream end connected to the treatment liquid tank and forming an outer circulation passage for circulating the treatment liquid in the treatment liquid tank together with the treatment liquid tank;
a pump for sending the treatment liquid in the treatment liquid tank to the external circulation pipe;
a discharge port communicating pipe which is branchedly connected to the external circulation pipe at a first connection position and communicates with the discharge port;
A second upstream portion and the treatment liquid branched and connected to the outer circulation pipe at a second connection position on the upstream side of the first connection position and which is a portion upstream from the second connection position in the outer circulation pipe an internal circulation pipe forming an internal circulation flow path for circulating the processing liquid in the processing liquid tank together with the tank, and returning the processing liquid supplied from the outer circulation piping to the processing liquid tank;
a plurality of devices installed interposed in the second upstream part;
Among the second upstream portions, set on the downstream side of the plurality of devices to correspond one-to-one to a plurality of device downstream regions corresponding to the plurality of devices on a one-to-one basis, interposed in the second upstream portion and a plurality of contamination state measuring devices installed and configured to measure contamination states of the plurality of regions downstream of the apparatus. 12. The method of claim 11,
a plurality of drainage pipes branched and connected to the plurality of device downstream regions at a plurality of fifth connection positions provided for each of the device downstream regions;
a destination of the processing liquid upstream from the fifth connection position in the second upstream portion is connected to a downstream side of the fifth connection position in the second upstream portion and to the region downstream of the device The substrate processing apparatus further comprising a third switching unit for switching between the drain pipes. 13. The method of claim 12,
The substrate processing apparatus,
a plurality of the third switching units corresponding to the plurality of drain pipes on a one-to-one basis;
a control device for controlling said plurality of said third switching units;
when the number of particles contained in the processing liquid flowing through the device downstream region exceeds a threshold value, the control device switches the destination of the processing liquid in the device downstream region to the drain pipe, and sends the processing liquid to the second upstream part and controlling the third switching unit corresponding to the drain pipe to discharge the processing liquid on an upstream side of the apparatus downstream area outside the substrate processing apparatus. 13. The method of claim 12,
The substrate processing apparatus,
a plurality of the third switching units corresponding to the plurality of drain pipes on a one-to-one basis;
a control device for controlling said plurality of said third switching units;
when a difference between the number of particles included in the processing liquid flowing through the two adjacent device downstream regions exceeds a threshold, the control device determines the destination of the processing liquid in the downstream region of the device with the larger number of particles; a substrate configured to control the third switching unit corresponding to the drain pipe to switch to the drain pipe and discharge the processing liquid upstream from the region downstream of the device in the second upstream part out of the substrate processing apparatus processing unit. 12. The method of claim 11,
a bypass pipe connecting the device downstream region and the internal circulation pipe, a portion upstream from a connection position of the bypass pipe in the second upstream part, and the bypass in the internal circulation pipe a bypass pipe forming a bypass circulation passage for circulating the processing liquid in the processing liquid tank together with a portion downstream from the connection position of the piping;
In the second upstream portion, a destination of the processing liquid upstream from a sixth connection position to which the bypass pipe is connected is downstream from the sixth connection position in the second upstream portion; The substrate processing apparatus further comprising a 4th switching unit which switches between bypass piping. 16. The method of claim 15,
The substrate processing apparatus,
a plurality of the bypass pipes;
a plurality of the fourth switching units corresponding to the plurality of bypass pipes on a one-to-one basis;
a control device for controlling the plurality of the fourth switching units;
The control device corresponds to the bypass pipe so that, when the number of particles included in the processing liquid flowing through the device downstream region exceeds a threshold, the destination of the processing liquid in the device downstream region is switched to the bypass pipe The substrate processing apparatus which controls the said 4th switching unit which does. 16. The method of claim 15,
The substrate processing apparatus,
a plurality of the bypass pipes;
a plurality of the fourth switching units corresponding to the plurality of bypass pipes on a one-to-one basis;
a control device for controlling the plurality of the fourth switching units;
when a difference between the number of particles included in the processing liquid flowing through the two adjacent device downstream regions exceeds a threshold, the control device determines the destination of the processing liquid in the downstream region of the device with the larger number of particles; The substrate processing apparatus which controls the said 4th switching unit corresponding to the said bypass piping to switch to a bypass piping. 16. The method of claim 15,
The substrate processing apparatus,
a plurality of the bypass pipes;
a plurality of the fourth switching units corresponding to the plurality of bypass pipes on a one-to-one basis;
a control device for controlling the plurality of the fourth switching units;
the plurality of bypass pipes are connected to the second upstream portion at a plurality of sixth connection positions corresponding to the plurality of bypass pipes one-to-one;
When the control device starts driving the pump from a state in which the driving of the pump is stopped, from the upstream side, based on the positional relationship of the plurality of sixth connection positions in the direction in which the chemical liquid flows and controlling the plurality of fourth switching units so that the plurality of the bypass pipes are sequentially opened. 16. The method of claim 15,
The substrate processing apparatus further comprising a filter installed through the bypass pipe. 12. The method of claim 11,
During the execution of the substrate processing in the processing unit, when the number of particles contained in the processing liquid flowing through the device downstream region exceeds a threshold value, an abnormal state is notified, and after the substrate processing being executed is finished, The substrate processing apparatus which stops supply of the processing liquid to the said processing unit. 15. The method of any one of claims 5, 13 and 14,
The pump includes a bellows pump including a movable member installed so as to be reciprocally movable, and a bellows having one end fixed to the housing and the other end fixed to the movable member,
When discharging the processing liquid in at least one of the external circulation pipe and the internal circulation pipe to the outside of the substrate processing apparatus, the control device controls the bellows pump so that the stroke time of the moving member is increased. . 21. The method of any one of claims 1 to 20,
a heater provided interposed in the second upstream part;
and an air bleeder provided on at least one of an upstream side and a downstream side of the heater. delete

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