KR20200122242A - Dicing die bond film - Google Patents

Abstract

Provided is a dicing die bonding film which is not susceptible to floating between an adhesive layer and an adhesive layer during cold expansion and normal-temperature expansion, and thereafter. The dicing die bonding film is provided with: a dicing tape having a laminated structure including a base material and an adhesive layer; and an adhesive layer peelably adhered to the adhesive layer in the dicing tape, the adhesive layer having a water contact angle of 110° or less and an arithmetic average surface roughness Ra of 1.0 μm or less on the surface of the adhesion side of the adhesive layer.

Description

Dicing die bonding film {DICING DIE BOND FILM}

The present invention relates to a dicing die bonding film. More specifically, the present invention relates to a dicing die bonding film that can be used in the manufacturing process of a semiconductor device.

In the process of manufacturing a semiconductor device, a dicing die-bonding film is sometimes used in the process of obtaining a semiconductor chip having an adhesive film of a size equivalent to a die-bonding chip, that is, a semiconductor chip having an adhesive layer for die bonding. . The dicing die-bonding film has a size corresponding to the semiconductor wafer to be processed, and includes, for example, a dicing tape composed of a substrate and an adhesive layer, and a die-bonding film (adhesive layer) that is peelably adhered to the adhesive layer side. Have.

As one of the methods of obtaining a semiconductor chip having an adhesive layer using a dicing die-bonding film, a method of expanding the dicing tape in the dicing die-bonding film to break the die-bonding film is known. have. In this method, first, a semiconductor wafer is bonded onto the die bonding film of the dicing die bonding film. This semiconductor wafer is processed so that it can be divided into a plurality of semiconductor chips later, for example, by cutting together with a die-bonding film.

Next, in order to cut the die-bonding film on the dicing tape, the dicing tape of the dicing die-bonding film is stretched in a two-dimensional direction including the radial direction and the circumferential direction of the semiconductor wafer using an expander. In this expanding process, splitting occurs also in the semiconductor wafer on the die-bonding film at a location corresponding to the splitting location in the die-bonding film, and the semiconductor wafer is converted into a plurality of semiconductor chips on the dicing die-bonding film or dicing tape. It is reorganized.

Next, in order to increase the separation distance with respect to the semiconductor chip including the plurality of die-bonding films after being cut on the dicing tape, an expanding process is performed again. Next, for example, after going through a cleaning process, each semiconductor chip is pushed up from the lower side of the dicing tape by a pin member serving as a pickup mechanism together with a die-bonding film of a chip equivalent size adhered thereto, from the top of the dicing tape. Pick up. In this way, a die-bonding film, that is, a semiconductor chip including an adhesive layer, is obtained. The semiconductor chip including this adhesive layer is fixed to an adherend such as a mounting substrate by die bonding through the adhesive layer.

About the technique of the dicing die-bonding film used as mentioned above, it is described in following patent documents 1-3, for example.

Japanese Patent Publication No. 2007-2173 Japanese Patent Laid-Open No. 2010-177401 Japanese Patent Publication No. 2016-115804

In recent years, multilayering of circuit layers and thinning of silicon layers have progressed due to the demand for higher semiconductor capacity. However, as the thickness (total thickness) of the circuit layer increases due to the multilayering of the circuit layer, the ratio of the resin contained in the circuit layer tends to increase, and the linear expansion coefficient of the multilayered circuit layer and the thinned silicon layer. The difference between the two becomes remarkable, and the semiconductor chip becomes easy to bend. For this reason, when a conventional dicing die-bonding film is used, in particular, a semiconductor chip obtained after dicing, in which a circuit layer including a die-bonding film is multi-layered, has an expand process (cool expand and room temperature expand described later) and After that (for example, during a cleaning process, until pickup, etc.), there is a problem that peeling (lifting) is likely to occur at the interface between the pressure-sensitive adhesive layer of the dicing tape and the die-bonding film. When lifting occurs, the semiconductor chip is likely to slide off after the expansion process (cleaning process, handling, etc.).

The present invention has been made in view of the above problems, and its object is to provide a dicing die-bonding film that is less likely to be lifted between the adhesive layer and the adhesive layer during cool expansion and room temperature expansion, and thereafter. have.

The present inventors, as a result of earnestly examining in order to achieve the above object, a dicing tape having a laminated structure including a substrate and an adhesive layer, and an adhesive layer that is peelably adhered to the adhesive layer in the dicing tape. In the case of using a dicing die-bonding film, the pressure-sensitive adhesive layer has a water contact angle of 110° or less and an arithmetic average surface roughness Ra of 1.0 μm or less on the surface of the side to which the adhesive layer is adhered, At the time of cool expansion, at room temperature expansion, and after that, it was found that lifting hardly occurs between the adhesive layer and the pressure sensitive adhesive layer. The present invention was completed based on these findings.

That is, the present invention comprises a dicing tape having a laminated structure comprising a base material and an adhesive layer, and an adhesive layer peelably adhered to the adhesive layer in the dicing tape, and the adhesive layer, There is provided a dicing die-bonding film having a water contact angle of 110° or less and an arithmetic average surface roughness Ra of 1.0 μm or less on the surface on the side to which the adhesive layer is in close contact.

The dicing die-bonding film of the present invention includes a dicing tape and an adhesive layer. The dicing tape has a laminated structure including a base material and an adhesive layer. The adhesive layer is in close contact with the adhesive layer in the dicing tape so that peeling is possible. The dicing die-bonding film having such a configuration can be used to obtain a semiconductor chip including an adhesive layer in the manufacturing process of a semiconductor device.

In the process of manufacturing a semiconductor device, as described above, in order to obtain a semiconductor chip with an adhesive layer, an expand process performed using a dicing die-bonding film, that is, an expand process for division, is sometimes performed. have. In this expanding process, it is necessary that a cleaving force acts appropriately on the adhesive layer on the dicing tape in the dicing die bonding film. The pressure-sensitive adhesive layer of the dicing tape in the dicing die-bonding film of the present invention has a water contact angle of 110° or less and an arithmetic average surface roughness Ra of 1.0 μm or less on the surface to which the adhesive layer is adhered. to be. According to the dicing die-bonding film of the present invention having such a configuration, the adhesion between the pressure-sensitive adhesive layer and the adhesive layer is adequately excellent, and peeling (raising) between the pressure-sensitive adhesive layer and the adhesive layer in the expansion process and afterwards occurs. Can be suppressed.

In addition, in the dicing die-bonding film of the present invention, surface freedom obtained from the equation of Kaelble Uy using the contact angle of water and methylene iodide on the surface of the pressure-sensitive adhesive layer (the surface on the side where the adhesive layer is in close contact) It is preferable that the value of the polar component of energy is 0.10 or more. According to the dicing die-bonding film of the present invention having such a configuration, the difference between the polar component on the surface of the adhesive layer is small, and the affinity between the surface of the adhesive layer and the surface of the adhesive layer is increased, so that the adhesion between the adhesive layer and the adhesive layer is more It becomes appropriate, and it is possible to further suppress the occurrence of peeling (raising) between the pressure-sensitive adhesive layer and the adhesive layer in the expansion process and thereafter.

In addition, in the dicing die-bonding film of the present invention, the pressure-sensitive adhesive layer preferably contains an acrylic polymer containing a hydrocarbon group-containing (meth)acrylic acid ester and a hydroxy group-containing monomer which may have an alkoxy group as a monomer component. According to the dicing die-bonding film of the present invention having such a configuration, it is possible to easily design a pressure-sensitive adhesive layer having a surface having a water contact angle of 110° or less and an arithmetic average surface roughness Ra of 1.0 μm or less.

It is preferable that the said adhesive layer contains a polyisocyanate compound as a crosslinking agent. According to the dicing die-bonding film of the present invention having such a structure, it is possible to easily design a pressure-sensitive adhesive layer having a surface having a water contact angle of 110° or less and an arithmetic average surface roughness Ra of 1.0 μm or less, and the pressure-sensitive adhesive layer is relatively As a result, it is possible to easily design a radiation-curable pressure-sensitive adhesive layer that can be used separately from a state exhibiting high adhesion and a state exhibiting relatively low adhesion.

In the dicing die-bonding film of the present invention, in the expanding process in which a dicing die-bonding film is used to obtain a semiconductor chip having an adhesive layer and thereafter, it is difficult to cause lift between the adhesive layer and the pressure-sensitive adhesive layer. In particular, even when a semiconductor chip in which a circuit layer is multi-layered is used, it is difficult to cause lift.

1 is a schematic cross-sectional view showing an embodiment of a dicing die-bonding film of the present invention.
FIG. 2 shows some of the steps in a method for manufacturing a semiconductor device using the dicing die-bonding film shown in FIG. 1.
3 shows a process following the process shown in FIG. 2.
4 shows a process following the process shown in FIG. 3.
5 shows a step following the step shown in FIG. 4.
6 shows a process following the process shown in FIG. 5.
7 shows a process following the process shown in FIG. 6.
FIG. 8 shows some steps in a modified example of the method for manufacturing a semiconductor device using the dicing die-bonding film shown in FIG. 1.
FIG. 9 shows some steps in a modified example of the method for manufacturing a semiconductor device using the dicing die-bonding film shown in FIG. 1.
FIG. 10 shows some steps in a modified example of the method for manufacturing a semiconductor device using the dicing die-bonding film shown in FIG. 1.
FIG. 11 shows some steps in a modified example of the method for manufacturing a semiconductor device using the dicing die-bonding film shown in FIG. 1.

[Dicing Die Bond Film]

The dicing die-bonding film of the present invention includes a dicing tape having a laminated structure including a base material and an adhesive layer, and an adhesive layer which is peelably adhered to the adhesive layer in the dicing tape. One embodiment of the dicing die-bonding film of the present invention will be described below.

1 is a schematic cross-sectional view showing an embodiment of a dicing die-bonding film of the present invention. As shown in FIG. 1, the dicing die-bonding film 1 includes a dicing tape 10 and an adhesive layer 20 laminated on the pressure-sensitive adhesive layer 12 in the dicing tape 10. It is provided and can be used in an expand process in the process of obtaining a semiconductor chip provided with an adhesive layer in the manufacture of a semiconductor device.

The dicing die bonding film 1 has a disk shape of a size corresponding to a semiconductor wafer to be processed in a manufacturing process of a semiconductor device. The diameter of the dicing die bonding film 1 is, for example, within the range of 345 to 380 mm (12 inch wafer correspondence type), within the range of 245 to 280 mm (8 inch wafer correspondence type), and 195 to 230 mm. It is within the range (for 6 inch wafer type), or in the range of 495 to 530 mm (for 18 inch wafer type).

The dicing tape 10 in the dicing die-bonding film 1 has a laminated structure including a base material 11 and an adhesive layer 12. The surface 12a of the pressure-sensitive adhesive layer 12 in the dicing die-bonding film 1 on the side to which the adhesive layer 20 is in close contact has a water contact angle of 110° or less, and an arithmetic average surface roughness Ra of 1.0 It is not more than µm.

(materials)

The base material in a dicing tape is an element which functions as a support body in a dicing tape or a dicing die-bonding film. As a base material, a plastic base material (especially a plastic film) is mentioned, for example. The substrate may be a single layer or a laminate of the same or different types of substrates.

As the resin constituting the plastic substrate, for example, low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, homopolyproene, polybutene, poly Methylpentene, ethylene-vinyl acetate copolymer (EVA), ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester (random, alternating) copolymer, ethylene-butene copolymer, ethylene-hexene copolymer Polyolefin resins such as coalescence; Polyurethane; Polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT); Polycarbonate; Polyimide; Polyetheretherketone; Polyetherimide; Polyamides such as aramid and wholly aromatic polyamide; Polyphenyl sulfide; Fluororesin; Polyvinyl chloride; Polyvinylidene chloride; Cellulose resin; Silicone resins, etc. are mentioned. From the viewpoint of securing good heat shrinkability in the substrate and easy to maintain the chip spacing distance using a dicing tape or partial heat shrinkage of the substrate in the room temperature expansion process described later, the substrate is made of an ethylene-vinyl acetate copolymer. It is preferable to contain it as a main component.

In addition, the main component of the base material is a component that occupies the largest mass ratio among the constituent components. Only 1 type may be used for the said resin, and 2 or more types may be used. When the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer as described later, it is preferable that the substrate has radiation transmittance.

When the base material is a plastic film, the plastic film may be non-oriented, or may be oriented in at least one direction (uniaxial direction, biaxial direction, etc.). When oriented in at least one direction, the plastic film becomes heat-shrinkable in the at least one direction. If it has heat shrinkability, it becomes possible to heat shrink the outer circumferential portion of the semiconductor wafer of the dicing tape, thereby making it possible to fix in a state where the distance between the semiconductor chips provided with the individualized adhesive layer is widened. Chip can be picked up easily. In order for the base material and the dicing tape to have isotropic heat shrinkability, the base material is preferably a biaxially oriented film. Further, the plastic film oriented in at least one direction can be obtained by stretching the non-stretched plastic film in at least one direction (uniaxial stretching, biaxial stretching, etc.).

The base material and the dicing tape preferably have a heat shrinkage rate of 1 to 30%, more preferably 2 to 25%, and furthermore, in a heat treatment test performed under the conditions of a heating temperature of 100°C and a heating time treatment of 60 seconds. It is preferably 3 to 20%, particularly preferably 5 to 20%. The thermal contraction rate is preferably a thermal contraction rate in at least one direction of the MD direction and the TD direction.

The surface on the side of the pressure-sensitive adhesive layer of the substrate is for the purpose of enhancing adhesion and retention with the pressure-sensitive adhesive layer, for example, corona discharge treatment, plasma treatment, sand mat processing treatment, ozone exposure treatment, flame exposure treatment, high pressure electric shock exposure treatment, Physical treatment such as ionizing radiation treatment; Chemical treatment such as chromic acid treatment; Surface treatment, such as adhesion facilitation treatment with a coating agent (undercoat), may be performed. Further, in order to impart antistatic ability, a conductive vapor deposition layer containing a metal, an alloy, or oxides thereof may be provided on the surface of the substrate. It is preferable that the surface treatment for enhancing adhesion is performed on the entire surface of the substrate on the side of the pressure-sensitive adhesive layer.

The thickness of the base material is preferably 40 µm or more, more preferably 50 µm or more, and even more preferably from the viewpoint of securing the strength for the base material to function as a support in a dicing tape and dicing die-bonding film. Is 55 µm or more, particularly preferably 60 µm or more. In addition, from the viewpoint of realizing appropriate flexibility in dicing tapes and dicing die-bonding films, the thickness of the substrate is preferably 200 µm or less, more preferably 180 µm or less, and even more preferably 150 µm or less. to be.

(Adhesive layer)

As described above, the pressure-sensitive adhesive layer in the dicing die-bonding film of the present invention has a surface water contact angle of 110° or less on the side to which the adhesive layer is in close contact, and an arithmetic average surface roughness Ra of 1.0 μm or less. The dicing die-bonding film of the present invention has such a configuration, so that the adhesion between the pressure-sensitive adhesive layer and the adhesive layer is adequately excellent, and peeling (lifting) between the pressure-sensitive adhesive layer and the adhesive layer in the expansion process and afterwards occurs. You can suppress that.

The arithmetic mean surface roughness (Ra) of the surface of the pressure-sensitive adhesive layer on the side to which the adhesive layer is adhered (surface 12a) is 1.0 µm or less, preferably 0.5 µm or less, and more preferably 0.3 µm or less. Said Ra is obtained by measuring the surface of the pressure-sensitive adhesive layer in the portion where the adhesive layer is not laminated in the dicing die-bonding film of the present invention. The arithmetic mean surface roughness can be measured based on JIS B0601.

The water contact angle of the surface of the pressure-sensitive adhesive layer on the side of the adhesive layer (surface 12a) is 110° or less, preferably 108° or less, and more preferably 105° or less. The water contact angle is obtained by measuring the surface of the pressure-sensitive adhesive layer at the portion where the adhesive layer is not laminated in the dicing die-bonding film of the present invention.

Further, the water contact angle is, for example, 80° or more, preferably 84° or more, and more preferably 88° or more. If the water contact angle is 80° or more, fusion of the pressure-sensitive adhesive layer and the adhesive layer can be suppressed, and the problem of not being peeled when intentionally peeling the pressure-sensitive adhesive layer and the adhesive layer can be made more difficult to occur.

The value of the polar component of the surface free energy obtained from the equation of Kaelble Uy using the contact angle of water and methylene iodide on the surface of the adhesive layer on the side of the adhesive layer (surface 12a) is 0.10 or more. Preferably, it is more preferably 0.20 or more, and still more preferably 0.40 or more. If the value of the polar component is 0.10 or more, the difference between the polar component on the surface of the adhesive layer becomes small, and the affinity between the surface of the adhesive layer and the surface of the adhesive layer increases, so that the adhesion between the adhesive layer and the adhesive layer becomes more suitable, and expands It is possible to further suppress the occurrence of peeling (raising) between the pressure-sensitive adhesive layer and the adhesive layer in the step and thereafter. The value of the polar component is γs ^p in the following formula (1) used when determining the surface free energy, and can be obtained using the following formula (2) and the following formula (3).

γs=γs ^d +γs ^p (1)

γw (1 + cosθw) = 2 (γs d γw d) 1/2 +2 (γs p γw p) 1/2 (2)

γi(1+cosθi)=2(γs ^d γi ^d ) ^1/2 +2(γs ^p γi ^p ) ^1/2 (3)

In the above formulas (1) to (3), γs is the surface free energy of the pressure-sensitive adhesive layer, γs ^d is the dispersion component of the surface free energy of the pressure-sensitive adhesive layer, γs ^p is the polar component of the surface free energy of the pressure-sensitive adhesive layer, and γw is 72.8mJ. /㎡, γw ^d is 21.8mJ/㎡, γw ^p is 51.0mJ/㎡, γi is 50.8mJ/㎡, γi ^d is 48.5mJ/㎡, γi ^p is 2.3mJ/㎡, θw is the water contact angle of the adhesive layer surface and θi denote the contact angle of methylene iodide on the surface of the pressure-sensitive adhesive layer, respectively. γw, γw ^d , γw ^p , γi, γi ^d and γi ^p are known literature values.

It is preferable that the adhesive layer of a dicing tape is an adhesive layer (acrylic adhesive layer) containing an acrylic polymer as a base polymer. The acrylic polymer is a polymer containing a structural unit derived from an acrylic monomer (a monomer component having a (meth)acryloyl group in the molecule) as a structural unit of the polymer.

It is preferable that the said acrylic polymer is a polymer containing the most by mass ratio of structural units derived from (meth)acrylic acid ester. Moreover, only 1 type may be used for the acrylic polymer, and 2 or more types may be used for it. In addition, in this specification, "(meth)acryl" represents "acrylic" and/or "methacryl" (any one or both of "acrylic" and "methacryl"), and it is the same in addition to that.

As said (meth)acrylic acid ester, the hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group is mentioned, for example. Examples of the hydrocarbon group-containing (meth)acrylic acid ester include alkyl (meth)acrylates, cycloalkyl (meth)acrylates, and aryl (meth)acrylates.

Examples of the (meth)acrylic acid alkyl ester include methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester (lauryl ester), tridecyl ester, Tetradecyl ester, hexadecyl ester, octadecyl ester, eicosyl ester, etc. are mentioned.

As said (meth)acrylic acid cycloalkyl ester, cyclopentyl ester, cyclohexyl ester, etc. of (meth)acrylic acid are mentioned, for example. As said aryl ester of (meth)acrylic acid, a phenyl ester and a benzyl ester of (meth)acrylic acid are mentioned, for example.

Examples of the hydrocarbon group-containing (meth)acrylic acid ester having an alkoxy group include those in which at least one hydrogen atom in the hydrocarbon group in the hydrocarbon group-containing (meth)acrylic acid ester is substituted with an alkoxy group. For example, (meth)acrylic acid 2-methoxymethyl ester, 2-methoxyethyl ester, 2-methoxybutyl ester, and the like.

The hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group may be used alone or in combination of two or more.

In one embodiment, the hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group has a total number of carbon atoms in the ester moiety (when having an alkoxy group, the total number including the number of carbon atoms in the alkoxy group) is 6 It is preferably from to 10. In particular, it is preferable that it is a hydrocarbon group-containing (meth)acrylic acid ester having a total number of carbon atoms of 6 to 10 in the hydrocarbon group. In these cases, it is possible to more easily achieve both the suppression of lifting between the pressure-sensitive adhesive layer and the adhesive layer in the expansion process and afterwards, and good pick-up properties in the pickup process.

In addition, the hydrocarbon group-containing (meth)acrylic acid ester that may have an alkoxy group is, in another embodiment, the total number of carbon atoms in the ester moiety (in the case of having an alkoxy group, the total number of carbon atoms in the alkoxy group is included). It is preferred that the number) is 2 to 4. In particular, it is preferably a hydrocarbon group-containing (meth)acrylic acid ester having a total number of carbon atoms of 2 to 4 in the hydrocarbon group. In these cases, since the hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group has a relatively high polarity, the ratio of the polar group-containing monomer can be relatively at least easily and the water contact angle on the surface of the pressure-sensitive adhesive layer can be made 110° or less.

Hydrocarbon group which may have an alkoxy group In order to properly express basic properties such as adhesion by (meth)acrylic acid ester in the pressure-sensitive adhesive layer, a hydrocarbon group which may have an alkoxy group in all monomer components for forming an acrylic polymer The proportion of the containing (meth)acrylic acid ester is preferably 20 mol% or more, more preferably 30 mol% or more, and still more preferably 40 mol% or more.

In addition, in the present specification, the monomer component includes a compound having a radiation polymerizable group (e.g., a second functional group and radiation polymerizable carbon-carbon to be described later) in the step introduced into the polymer prior to irradiation to the pressure-sensitive adhesive layer. Compounds having a double bond) are not included.

The acrylic polymer may contain a structural unit derived from another monomer component copolymerizable with the hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group, for the purpose of modification such as cohesion and heat resistance. Examples of the other monomer components include polar group-containing monomers such as carboxy group-containing monomers, acid anhydride monomers, hydroxy group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, and nitrogen atom-containing monomers. .

Examples of the carboxy group-containing monomer include acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid.

As said acid anhydride monomer, maleic anhydride, itaconic anhydride, etc. are mentioned, for example. Examples of the hydroxy group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, ( 8-hydroxyoctyl meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl (meth)acrylate, etc. are mentioned. .

As said glycidyl group-containing monomer, glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, etc. are mentioned, for example.

As the sulfonic acid group-containing monomer, for example, styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, (meth) And acryloyloxynaphthalenesulfonic acid.

Examples of the phosphoric acid group-containing monomer include 2-hydroxyethylacryloyl phosphate.

Examples of the nitrogen atom-containing monomer include morpholino group-containing monomers such as (meth)acryloylmorpholine, cyano group-containing monomers such as (meth)acrylonitrile, and amide group-containing monomers such as (meth)acrylamide. And the like.

As the other monomer component, among others, a hydroxy group-containing monomer and a nitrogen atom-containing monomer (particularly, a morpholino group-containing monomer) are preferable, and more preferably (meth)acrylate 2-hydroxyethyl (2-hydroxyethyl ( Meth)acrylate), (meth)acryloylmorpholine. That is, the acrylic polymer preferably contains a structural unit derived from 2-hydroxyethyl (meth)acrylate and/or a structural unit derived from (meth)acryloylmorpholine.

As for the said other monomer component, only 1 type may be used and 2 or more types may be used.

In order to properly express basic properties such as adhesion by a hydrocarbon group-containing (meth)acrylic acid ester that may have an alkoxy group in the pressure-sensitive adhesive layer, the total of the polar group-containing monomers in all monomer components for forming the acrylic polymer The ratio is preferably 60 mol% or less, and more preferably 50 mol% or less. Further, from the viewpoint of being able to easily design the water contact angle on the surface of the pressure-sensitive adhesive layer to 110° or less, the total proportion of the polar group-containing monomer is preferably 10 mol% or more, and more preferably 15 mol% or more.

In order to properly express basic properties such as adhesion by a hydrocarbon group-containing (meth)acrylic acid ester that may have an alkoxy group in the pressure-sensitive adhesive layer, a constituent unit derived from a hydroxy group-containing monomer in all monomer components for forming an acrylic polymer The ratio of is preferably 5 mol% or more, and more preferably 10 mol% or more. Moreover, the said ratio may be 80 mol% or less, 70 mol% or less, and 60 mol% or less, for example.

In the case of using the nitrogen atom-containing monomer as the monomer component for forming the acrylic polymer, the water contact angle on the surface of the pressure-sensitive adhesive layer can be easily designed to be 110° or less, in view of the total monomer component for forming the acrylic polymer. The proportion of the structural unit derived from the nitrogen atom-containing monomer is preferably 3 mol% or more, and more preferably 5 mol% or more. Moreover, the said ratio may be 50 mol% or less, 30 mol% or less, and 20 mol% or less, for example.

The acrylic polymer may contain a constituent unit derived from a polyfunctional monomer copolymerizable with a monomer component forming the acrylic polymer in order to form a crosslinked structure in the polymer skeleton. Examples of the polyfunctional monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, and neopentyl glycol di (meth) acrylic. Rate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy(meth)acrylate ( For example, monomers having a (meth)acryloyl group and other reactive functional groups in the molecule such as polyglycidyl (meth)acrylate), polyester (meth)acrylate, urethane (meth)acrylate, etc. have.

As for the said polyfunctional monomer, only 1 type may be used and 2 or more types may be used. In order to properly express basic properties such as adhesion by a hydrocarbon group-containing (meth)acrylic acid ester that may have an alkoxy group in the pressure-sensitive adhesive layer, the ratio of the polyfunctional monomer in the total monomer components for forming the acrylic polymer is , 40 mol% or less is preferable, and more preferably 30 mol% or less.

The acrylic polymer is derived from a compound having a second functional group capable of reacting with the first functional group and a radiation polymerizable functional group together with a structural unit derived from a monomer having a first functional group (eg, the polar group-containing monomer) It is preferred to have a structural part. When the acrylic polymer has such a configuration, the design of the radiation curable pressure-sensitive adhesive to be described later becomes easy.

Examples of the combination of the first functional group and the second functional group include a carboxyl group and an epoxy group, an epoxy group and a carboxyl group, a carboxyl group and an aziridyl group, an aziridyl group and a carboxyl group, a hydroxy group and an isocyanate group, an isocyanate group and a hydroxy group. Among these, a combination of a hydroxy group and an isocyanate group and a combination of an isocyanate group and a hydroxy group are preferable from the viewpoint of easiness of reaction tracking. Among them, preparing a polymer having a highly reactive isocyanate group is of high technical difficulty, while from the viewpoint of easy production and availability of an acrylic polymer having a hydroxy group, the first functional group is a hydroxy group, and the second functional group is an isocyanate group. A combination is preferred.

In particular, it is preferable that the acrylic polymer has a structural moiety derived from a compound having a radiation polymerizable carbon-carbon double bond (especially a (meth)acryloyl group) and an isocyanate group together with a structural unit derived from a hydroxy group-containing monomer.

As a compound having a radiopolymerizable carbon-carbon double bond and an isocyanate group, methacryloyl isocyanate, 2-acryloyloxyethyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α,α- And dimethylbenzyl isocyanate. Among them, 2-acryloyloxyethyl isocyanate and 2-methacryloyloxyethyl isocyanate are preferable. In addition, as the acrylic polymer having a hydroxy group, structural units derived from the aforementioned hydroxy group-containing monomers and ether compounds such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether are included. It can be mentioned.

The molar ratio [the former/the latter] of the constituent unit derived from the monomer having the first functional group and the compound having the second functional group and the radiation-polymerizable functional group is preferably 0.95 or more, more preferably 1.00 or more, and even more preferably 1.05 or more, particularly preferably 1.10 or more. When the molar ratio is 0.95 or more, bonding of the first functional group (for example, a hydroxy group) and the second functional group (for example, an isocyanate group) is sufficiently promoted, and yet the first unreacted in the acrylic polymer in the pressure-sensitive adhesive layer It is assumed that the functional group remains to some extent, the peeling force between the pressure-sensitive adhesive layer and the base material is further improved, and cracking of the pressure-sensitive adhesive layer at the time of expansion is more difficult to occur. The molar ratio may be, for example, 10.00 or less, 5.00 or less, 3.00 or less, 2.00 or less, 1.50 or less, and 1.30 or less.

In particular, it is preferable that the molar ratio of the hydroxy group-containing monomer and 2-methacryloyloxyethyl isocyanate [the hydroxy group-containing monomer/2-methacryloyloxyethyl isocyanate] is within the above range.

The acrylic polymer is obtained by polymerizing at least one monomer component containing an acrylic monomer. As a polymerization method, solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, etc. are mentioned.

The pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer or the pressure-sensitive adhesive layer may contain a crosslinking agent. For example, when an acrylic polymer is used as the base polymer, the acrylic polymer can be crosslinked to further reduce a low molecular weight substance in the pressure-sensitive adhesive layer. Further, the number average molecular weight of the acrylic polymer can be increased.

Examples of the crosslinking agent include polyisocyanate compounds, epoxy compounds, polyol compounds (polyphenol compounds, etc.), aziridine compounds, melamine compounds, and the like. Among them, polyisocyanate compounds are preferable. In this case, it is possible to easily design a pressure-sensitive adhesive layer having a surface having a water contact angle of 110° or less and an arithmetic average surface roughness Ra of 1.0 μm or less, and a state in which the pressure-sensitive adhesive layer exhibits a relatively high adhesive force and a relatively low adhesive force. It is possible to easily design a radiation-curable pressure-sensitive adhesive layer that can be used in different states. When a crosslinking agent is used, the amount of the crosslinking agent is preferably about 5 parts by mass or less, and more preferably 0.1 to 5 parts by mass, based on 100 parts by mass of the base polymer.

The mass average molecular weight of the acrylic polymer (after crosslinking when using a crosslinking agent) is preferably 300,000 or more (eg, 300,000 to 1.4 million), and more preferably 350,000 or more. When the mass average molecular weight is 300,000 or more, there is a tendency that there are few low molecular weight substances in the pressure-sensitive adhesive layer, and contamination to the adhesive layer or semiconductor wafer or the like can be further suppressed.

The pressure-sensitive adhesive layer may be a pressure-sensitive adhesive layer capable of intentionally reducing the adhesive force by an action from the outside in the process of using the dicing die-bonding film (a pressure-sensitive adhesive layer capable of reducing the adhesive force), or in the process of using the dicing die-bonding film It may be a pressure-sensitive adhesive layer (a non-adhesive pressure-sensitive pressure-sensitive adhesive layer) with little or no reduction in adhesion due to external action, and it is appropriate according to the method or conditions of the separation of semiconductor wafers that are separated using a dicing die-bonding film. You can choose.

When the pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer capable of reducing adhesive strength, in the manufacturing process or use process of the dicing die-bonding film, it is recommended to use a state in which the pressure-sensitive adhesive layer shows a relatively high adhesive strength and a relatively low adhesive strength. It becomes possible. For example, when bonding an adhesive layer to the adhesive layer of a dicing tape during the manufacturing process of a dicing die-bonding film, or when a dicing die-bonding film is used in the dicing process, the adhesive layer exhibits relatively high adhesive strength. It is possible to suppress and prevent lifting of the adherend such as the adhesive layer from the pressure-sensitive adhesive layer, and then, a pickup process for picking up the semiconductor chip with the adhesive layer from the dicing tape of the dicing die-bonding film. In, by reducing the adhesive force of the pressure-sensitive adhesive layer, pickup can be easily performed.

Examples of the pressure-sensitive adhesive for forming such an adhesive force-reducing pressure-sensitive adhesive layer include radiation-curable pressure-sensitive adhesives and heat-foaming pressure-sensitive adhesives. As the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer capable of reducing adhesive force, one type of pressure-sensitive adhesive may be used, or two or more types of pressure-sensitive adhesives may be used.

As the radiation-curable pressure-sensitive adhesive, for example, a type of pressure-sensitive adhesive that is cured by irradiation of electron beam, ultraviolet light, α-ray, β-ray, γ-ray, or X-ray can be used, and a type of pressure-sensitive adhesive that is cured by ultraviolet irradiation (ultraviolet-curable Adhesive) can be used particularly preferably.

Examples of the radiation curable pressure sensitive adhesive include an additive type radiation curable pressure sensitive adhesive containing a base polymer such as the acrylic polymer and a radiation polymerizable monomer component or oligomer component having a functional group such as a radiation polymerizable carbon-carbon double bond. have.

As the radiation polymerizable monomer component, for example, urethane (meth)acrylate, trimethylolpropane tri (meth)acrylate, pentaerythritol tri (meth)acrylate, pentaerythritol tetra (meth)acrylate, dipenta Erythritol monohydroxypenta (meth)acrylate, dipentaerythritol hexa (meth)acrylate, and 1,4-butanedioldi (meth)acrylate.

Examples of the radiation-polymerizable oligomer component include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based and polybutadiene-based, and a molecular weight of about 100 to 30000 is preferable.

The content of the radiation curable monomer component and oligomer component in the radiation curable pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is, for example, 5 to 500 parts by mass, preferably about 40 to 150 parts by mass, based on 100 parts by mass of the base polymer. .

Moreover, as an additive-type radiation curable adhesive, you may use what was disclosed, for example in Unexamined-Japanese-Patent No. 60-196956.

Examples of the radiation-curable pressure-sensitive adhesive include an internal type radiation-curable pressure-sensitive adhesive containing a base polymer having a functional group such as a radiation-polymerizable carbon-carbon double bond at the polymer side chain or at the end of the polymer main chain. When such an intrinsic radiation-curable pressure-sensitive adhesive is used, there is a tendency that it is possible to suppress an unintended change in adhesion properties over time due to the movement of a low molecular weight component in the formed pressure-sensitive adhesive layer.

As the base polymer contained in the internal radiation curable pressure-sensitive adhesive, an acrylic polymer is preferable. As a method of introducing a radiation polymerizable carbon-carbon double bond into an acrylic polymer, for example, a raw material monomer containing a monomer component having the first functional group is polymerized (copolymerized) to obtain an acrylic polymer, and then the second functional group and A method in which a compound having a radiation-polymerizable carbon-carbon double bond is subjected to a condensation reaction or an addition reaction with respect to an acrylic polymer while maintaining the radiation-polymerizable carbon-carbon double bond.

It is preferable that the said radiation curable adhesive contains a photoinitiator. Examples of the photopolymerization initiator include α-ketol compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, thioxanthone compounds Compounds, campoquinone, halogenated ketones, acylphosphine oxide, acylphosphonate, and the like.

Examples of the α-ketol-based compound include 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxy-α,α'-dimethylacetophenone, 2- Methyl-2-hydroxypropiophenone, 1-hydroxycyclohexylphenyl ketone, etc. are mentioned.

Examples of the acetophenone-based compound include methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1-[4-(methylthio) -Phenyl]-2-morpholinopropane-1, and the like.

As said benzoin ether compound, benzoin ethyl ether, benzoin isopropyl ether, anisoin methyl ether, etc. are mentioned, for example. As said ketal compound, benzyl dimethyl ketal etc. are mentioned, for example.

Examples of the aromatic sulfonyl chloride compound include 2-naphthalenesulfonyl chloride. Examples of the photoactive oxime compound include 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime and the like.

Examples of the benzophenone-based compound include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, and the like.

Examples of the thioxanthone compound include thioxanthone, 2-chloro thioxanthone, 2-methyl thioxanthone, 2,4-dimethyl thioxanthone, isopropyl thioxanthone, and 2,4-dichloroti Oxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, etc. are mentioned.

The content of the photoinitiator in the radiation curable pressure-sensitive adhesive is, for example, 0.05 to 20 parts by mass with respect to 100 parts by mass of the base polymer.

The heat-expandable pressure-sensitive adhesive is a pressure-sensitive adhesive containing a component (foaming agent, thermally expandable microspheres, etc.) that foams or expands by heating.

As said foaming agent, various inorganic foaming agents and organic foaming agents are mentioned. Examples of the inorganic foaming agent include ammonium carbonate, ammonium hydrogen carbonate, sodium hydrogen carbonate, ammonium nitrite, sodium borohydride, and azide. Examples of the organic foaming agent include salt fluorinated alkanes such as trichloromonofluoromethane and dichloromonofluoromethane; Azo compounds such as azobisisobutyronitrile, azodicarbonamide, and barium azodicarboxylate; Hydrazine-based compounds such as paratoluenesulfonyl hydrazide, diphenylsulfone-3,3'-disulfonyl hydrazide, 4,4'-oxybis (benzenesulfonyl hydrazide), and allylbis (sulfonyl hydrazide); semicarbazide compounds such as p-toluylenesulfonyl semicarbazide and 4,4'-oxybis(benzenesulfonyl semicarbazide); Triazole compounds such as 5-morphoryl-1,2,3,4-thiatriazole; N-nitroso compounds, such as N,N'-dinitrosopentamethylenetetramine, and N,N'-dimethyl-N,N'-dinitrosoterephthalamide, etc. are mentioned.

Examples of the thermally expandable microspheres include microspheres having a structure in which a substance that is easily gasified and expanded by heating is enclosed in a shell. Examples of substances that are easily gasified and expanded by the heating include isobutane, propane, pentane, and the like. Thermally expandable microspheres can be produced by encapsulating a material that is easily gasified and expanded by heating in the shell-forming material by a coacervation method or an interfacial polymerization method. As the shell-forming material, a material exhibiting heat melting property or a material capable of being ruptured by the action of thermal expansion of the sealing material may be used. Examples of such substances include vinylidene chloride/acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone.

As the non-adhesive pressure-sensitive adhesive layer, a pressure-sensitive adhesive layer is exemplified. In addition, the pressure-sensitive adhesive layer includes a pressure-sensitive adhesive layer having a constant adhesive strength while curing the pressure-sensitive adhesive layer formed of the radiation curable pressure-sensitive adhesive described above with respect to the pressure-sensitive adhesive layer capable of reducing adhesive force by radiation irradiation in advance. As the pressure-sensitive adhesive for forming the non-adhesive pressure-sensitive adhesive layer, one type of pressure-sensitive adhesive may be used, or two or more types of pressure-sensitive adhesives may be used.

Further, the entire pressure-sensitive adhesive layer may be a non-adhesive pressure-sensitive adhesive layer, and a part may be a non-adhesive pressure-sensitive adhesive layer. For example, when the pressure-sensitive adhesive layer has a single-layer structure, the entire pressure-sensitive adhesive layer may be a non-adhesive pressure-sensitive pressure-sensitive adhesive layer, and a predetermined portion in the pressure-sensitive adhesive layer (e.g., the area to be bonded to the ring frame, The outer region) may be a non-adhesive pressure-sensitive adhesive layer, and another portion (eg, a central region that is a region to be adhered of a semiconductor wafer) may be a pressure-sensitive adhesive layer capable of reducing adhesive force.

When the pressure-sensitive adhesive layer has a laminated structure, all the pressure-sensitive adhesive layers in the laminated structure may be non-adhesive pressure-sensitive adhesive layers, and some of the pressure-sensitive adhesive layers in the laminated structure may be non-adhesive pressure-sensitive pressure-sensitive adhesive layers.

The pressure-sensitive adhesive layer formed by radiation-curable pressure-sensitive adhesive (non-radiation radiation-curable pressure-sensitive adhesive layer) is previously cured by irradiation with radiation (radiation-radiated radiation-curable pressure-sensitive adhesive layer), even if the adhesive strength is reduced by radiation irradiation, It exhibits the adhesiveness caused by the contained polymer component, and it is possible to exhibit the minimum necessary adhesive force to the adhesive layer of a dicing tape in a dicing process or the like.

In the case of using a radiation-cured adhesive layer that has been irradiated with radiation, in the direction of expansion of the surface of the adhesive layer, the entire adhesive layer may be a radiation-curable adhesive layer that has been irradiated, and a part of the adhesive layer is a radiation-curable adhesive layer and other parts It may be a radiation curable pressure-sensitive adhesive layer that is not irradiated with this radiation.

In addition, in this specification, the term ``radiation-curable pressure-sensitive adhesive layer'' refers to a pressure-sensitive adhesive layer formed of a radiation-curable pressure-sensitive adhesive, and radiation curing after the non-irradiation radiation-curable pressure-sensitive adhesive layer and the pressure-sensitive adhesive layer are cured by irradiation with radiation. It includes both sides of the completed radiation curable pressure-sensitive adhesive layer.

As the pressure-sensitive adhesive for forming the pressure-sensitive pressure-sensitive adhesive layer, a known or common pressure-sensitive pressure-sensitive adhesive can be used, and an acrylic pressure-sensitive adhesive or a rubber-based pressure-sensitive adhesive having an acrylic polymer as a base polymer can be preferably used. When the pressure-sensitive adhesive layer contains an acrylic polymer as a pressure-sensitive adhesive, it is preferable that the acrylic polymer is a polymer containing the most constituent units derived from (meth)acrylic acid ester as a structural unit by mass ratio. As the acrylic polymer, for example, an acrylic polymer described as an acrylic polymer that can be included in the pressure-sensitive adhesive layer can be employed.

The pressure-sensitive adhesive layer or the pressure-sensitive adhesive that forms the pressure-sensitive adhesive layer may contain, in addition to each of the components described above, additives used in known or commonly used pressure-sensitive adhesive layers such as a crosslinking accelerator, tackifier, anti-aging agent, and colorant (pigment, dye, etc.). do.

Examples of the colorant include compounds that are colored by irradiation with radiation. When it contains a compound that is colored by irradiation with radiation, only the irradiated portion can be colored. The compound to be colored by irradiation with radiation is colorless or pale color before irradiation, but is a compound that becomes colored by irradiation with radiation, and examples thereof include leuco dyes. The amount of the compound to be colored by irradiation with radiation is not particularly limited and may be appropriately selected.

The thickness of the pressure-sensitive adhesive layer is not particularly limited, but in the case where the pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer formed of a radiation curable pressure-sensitive adhesive, from the viewpoint of balancing the adhesive force to the adhesive layer before and after radiation curing of the pressure-sensitive adhesive layer. It is preferably about 50 μm, more preferably 2 to 30 μm, and still more preferably 5 to 25 μm.

(Adhesive layer)

The adhesive layer has a function as an adhesive that exhibits thermosetting properties for die bonding and, if necessary, has an adhesive function for holding a work such as a semiconductor wafer and a frame member such as a ring frame. The adhesive layer can be cleaved by applying a tensile stress, and is used after being cleaved by applying a tensile stress.

The adhesive layer and the adhesive constituting the adhesive layer may contain a thermosetting resin and, for example, a thermoplastic resin as a binder component, or may contain a thermoplastic resin having a thermosetting functional group capable of causing bonding by reacting with a curing agent. When the adhesive constituting the adhesive layer contains a thermoplastic resin having a thermosetting functional group, the adhesive need not contain a thermosetting resin (epoxy resin, etc.). The adhesive layer may have a single layer structure or may have a multilayer structure.

As the thermoplastic resin, for example, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, Thermoplastic polyimide resins, polyamide resins such as 6-nylon and 6,6-nylon, phenoxy resins, acrylic resins, saturated polyester resins such as PET and PBT, polyamideimide resins, and fluororesins. As for the said thermoplastic resin, only 1 type may be used and 2 or more types may be used. As the thermoplastic resin, an acrylic resin is preferable because it contains few ionic impurities and has high heat resistance, so that it is easy to secure bonding reliability by an adhesive layer.

It is preferable that the said acrylic resin contains a structural unit derived from a hydrocarbon group-containing (meth)acrylic acid ester as the largest structural unit by mass ratio. Examples of the hydrocarbon group-containing (meth)acrylic acid ester include a hydrocarbon group-containing (meth)acrylic acid ester exemplified as a hydrocarbon group-containing (meth)acrylic acid ester forming an acrylic polymer that can be included in the above-described pressure-sensitive adhesive layer. .

The acrylic resin may contain a structural unit derived from another monomer component copolymerizable with a hydrocarbon group-containing (meth)acrylic acid ester. Examples of the other monomer components include a carboxyl group-containing monomer, an acid anhydride monomer, a hydroxy group-containing monomer, a glycidyl group-containing monomer, a sulfonic acid group-containing monomer, a phosphoric acid group-containing monomer, acrylamide, acrylonitrile, and other functional group-containing monomers. Polyfunctional monomers and the like may be mentioned, and specifically, those exemplified as other monomer components constituting the acrylic polymer that can be included in the pressure-sensitive adhesive layer described above can be used.

When the adhesive layer contains a thermosetting resin together with a thermoplastic resin, examples of the thermosetting resin include epoxy resin, phenol resin, amino resin, unsaturated polyester resin, polyurethane resin, silicone resin, thermosetting polyimide resin, etc. Can be lifted. As for the said thermosetting resin, only 1 type may be used and 2 or more types may be used. Epoxy resin is preferable as the thermosetting resin from the reason that the content of ionic impurities or the like that may cause corrosion of a semiconductor chip to be die-bonded tends to be small. Moreover, a phenol resin is preferable as a curing agent for an epoxy resin.

Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolak type , Orthocresol novolak type, trishydroxyphenylmethane type, tetraphenylolethane type, hydantoin type, trisglycidyl isocyanurate type, and glycidylamine type epoxy resin. Among them, novolac-type epoxy resins, biphenyl-type epoxy resins, trishydroxyphenylmethane-type epoxy resins, and tetraphenylolethane-type epoxy resins are preferred from the viewpoint of high reactivity with a phenol resin as a curing agent and excellent heat resistance. .

As a phenolic resin that can act as a curing agent for an epoxy resin, for example, a novolac-type phenolic resin, a resol-type phenolic resin, polyoxystyrene such as polyparaoxystyrene, and the like can be mentioned. As a novolak type phenol resin, a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a tert-butylphenol novolak resin, a nonylphenol novolak resin, etc. are mentioned, for example. As for the said phenol resin, only 1 type may be used and 2 or more types may be used. Among them, phenol novolac resins and phenol aralkyl resins are preferred from the viewpoint of tending to improve the connection reliability of the adhesive when used as a curing agent for an epoxy resin as an adhesive for die bonding.

In the adhesive layer, from the viewpoint of sufficiently advancing the curing reaction between the epoxy resin and the phenol resin, the phenol resin is preferably 0.5 to 2.0 equivalents, more preferably 0.5 to 2.0 equivalents of hydroxyl groups in the phenolic resin per equivalent of epoxy groups in the epoxy resin component. It is included in an amount of 0.7 to 1.5 equivalents.

When the adhesive layer contains a thermosetting resin, the content ratio of the thermosetting resin is 5 to 60% by mass relative to the total mass of the adhesive layer from the viewpoint of appropriately expressing the function as a thermosetting adhesive in the adhesive layer. Preferably, it is 10-50 mass% more preferably.

When the adhesive layer contains a thermoplastic resin having a thermosetting functional group, as the thermoplastic resin, for example, an acrylic resin containing a thermosetting functional group can be used. The acrylic resin in this thermosetting functional group-containing acrylic resin preferably contains a structural unit derived from a hydrocarbon group-containing (meth)acrylic acid ester as the largest structural unit by mass ratio. Examples of the hydrocarbon group-containing (meth)acrylic acid ester include those exemplified as hydrocarbon group-containing (meth)acrylic acid esters that form an acrylic polymer that can be included in the pressure-sensitive adhesive layer described above.

On the other hand, as a thermosetting functional group in the thermosetting functional group-containing acrylic resin, a glycidyl group, a carboxyl group, a hydroxy group, an isocyanate group, etc. are mentioned, for example. Among them, a glycidyl group and a carboxyl group are preferable. That is, as the thermosetting functional group-containing acrylic resin, a glycidyl group-containing acrylic resin and a carboxyl group-containing acrylic resin are particularly preferred. In addition, it is preferable to include a curing agent together with a thermosetting functional group-containing acrylic resin, and examples of the curing agent include those exemplified as a crosslinking agent that can be included in the radiation curable pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer described above. When the thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group, it is preferable to use a polyphenolic compound as a curing agent, and for example, various phenol resins described above can be used.

For the adhesive layer before curing for die bonding, in order to achieve a certain degree of crosslinking, for example, a polyfunctional compound capable of reacting and bonding with a functional group at the end of the molecular chain of the resin that may be included in the adhesive layer is used. It is preferable to mix it with the resin composition for adhesive layer formation as a crosslinking component. Such a configuration is preferable from the viewpoint of improving the adhesive properties under high temperature with respect to the adhesive layer, and from the viewpoint of improving heat resistance.

As said crosslinking component, a polyisocyanate compound is mentioned, for example. Examples of the polyisocyanate compound include tolylene diisocyanate, diphenylmethane diisocyanate, p-phenylenediisocyanate, 1,5-naphthalene diisocyanate, and adducts of polyhydric alcohols and diisocyanates. Further, as the crosslinking component, another polyfunctional compound such as an epoxy resin may be used in combination with a polyisocyanate compound.

The content of the crosslinking component in the resin composition for forming an adhesive layer is 0.05 parts by mass or more from the viewpoint of improving the cohesiveness of the formed adhesive layer with respect to 100 parts by mass of the resin having the functional group capable of reacting and bonding with the crosslinking component. This is preferable, and 7 parts by mass or less is preferable from the viewpoint of improving the adhesion of the formed adhesive layer.

It is preferable that the adhesive layer contains a filler. By mixing the filler with the adhesive layer, physical properties such as conductivity, thermal conductivity, and elastic modulus of the adhesive layer can be adjusted. Examples of the filler include inorganic fillers and organic fillers, and inorganic fillers are particularly preferred.

As the inorganic filler, for example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, boron nitride, crystalline silica, amorphous silica, etc. , Metals such as aluminum, gold, silver, copper, and nickel, alloys, amorphous carbon black, graphite, and the like. The filler may have various shapes such as a spherical shape, a needle shape, and a flake shape. As said filler, only 1 type may be used and 2 or more types may be used.

The average particle diameter of the filler is preferably 0.005 to 10 µm, more preferably 0.005 to 1 µm. When the average particle diameter is 0.005 µm or more, wettability and adhesion to an adherend such as a semiconductor wafer are further improved. When the average particle diameter is 10 µm or less, the effect of the filler added for imparting the above characteristics can be made sufficient, and heat resistance can be ensured. In addition, the average particle diameter of a filler can be calculated|required using, for example, a photometric particle size distribution meter (for example, a brand name "LA-910", manufactured by Horiba Seisakusho Co., Ltd.).

The adhesive layer may contain other components as necessary. As said other component, a curing catalyst, a flame retardant, a silane coupling agent, an ion trap agent, a dye, etc. are mentioned, for example. As for the said other additive, only 1 type may be used and 2 or more types may be used.

Examples of the flame retardant include antimony trioxide, antimony pentoxide, and brominated epoxy resin.

Examples of the silane coupling agent include β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropylmethyldiethoxysilane. I can.

Examples of the ion trapping agent include hydrotalcite, bismuth hydroxide, hydrated antimony oxide (for example, ``IXE-300'' manufactured by Toa Kosei Co., Ltd.), and zirconium phosphate of a specific structure (for example, Doa ``IXE-100'' manufactured by Kosei Co., Ltd.), magnesium silicate (for example, ``Kyoward 600'' manufactured by Kyowa Chemical Industry Co., Ltd.), aluminum silicate (for example, Kyowa Chemical Industry Co., Ltd.) "Kyoward 700" manufactured by Shikigashi.) and the like.

A compound capable of forming a complex between metal ions can also be used as an ion trapping agent. As such a compound, a triazole type compound, a tetrazole type compound, and a bipyridyl type compound are mentioned, for example. Among these, a triazole-based compound is preferable from the viewpoint of the stability of the complex formed between metal ions.

Examples of the triazole-based compound include 1,2,3-benzotriazole, 1-{N,N-bis(2-ethylhexyl)aminomethyl}benzotriazole, carboxybenzotriazole, 2-(2- Hydroxy-5-methylphenyl)benzotriazole, 2-(2-hydroxy-3,5-di-t-butylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3-t- Butyl-5-methylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3,5-di-t-amylphenyl)benzotriazole, 2-(2-hydroxy-5-t-octyl Phenyl)benzotriazole, 6-(2-benzotriazolyl)-4-t-octyl-6'-t-butyl-4'-methyl-2,2'-methylenebisphenol, 1-(2',3' -Hydroxypropyl)benzotriazole, 1-(1,2-dicarboxydiethyl)benzotriazole, 1-(2-ethylhexylaminomethyl)benzotriazole, 2,4-di-t-pentyl-6 -{(H-benzotriazol-1-yl)methyl}phenol, 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, 3-(2H-benzotriazole-2- Yl)-5-(1,1-dimethylethyl)-4-hydroxy, octyl-3-[3-t-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazole-2- Yl)phenyl]propionate, 2-ethylhexyl-3-[3-t-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2-(2H-benzo Triazol-2-yl)-4-t-butylphenol, 2-(2-hydroxy-5-methylphenyl)benzotriazole, 2-(2-hydroxy-5-t-octylphenyl)-benzotriazole , 2-(3-t-butyl-2-hydroxy-5-methylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3,5-di-t-amylphenyl)benzotriazole, 2-(2-hydroxy-3,5-di-t-butylphenyl)-5-chloro-benzotriazole, 2-[2-hydroxy-3,5-di(1,1-dimethylbenzyl)phenyl ]-2H-benzotriazole, 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], 2- [2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, methyl-3-[3-(2H-benzotriazol-2-yl)-5-t -Butyl-4-hydroxyphenyl] And propionate.

Further, a predetermined hydroxyl group-containing compound such as a quinol compound, a hydroxyanthraquinone compound, or a polyphenol compound can also be used as an ion trapping agent. Specific examples of such a hydroxyl-containing compound include 1,2-benzenediol, alizarin, anthrupine, tannin, gallic acid, methyl gallate, and pyrogallol.

The thickness of the adhesive layer (in the case of a laminate, the total thickness) is not particularly limited, but is, for example, 1 to 200 µm. The upper limit is preferably 100 µm, more preferably 80 µm. The lower limit is preferably 3 µm, more preferably 5 µm.

In the dicing die-bonding film of the present invention, the peeling force between the pressure-sensitive adhesive layer and the adhesive layer in the T-type peeling test under conditions of a temperature of 23°C and a peeling rate of 300 mm/min is 0.3 N/20. It is preferably mm or more, more preferably 0.5 N/20 mm or more, and still more preferably 0.7 N/20 mm or more. When the peeling force is 0.3 N/20 mm or more, the adhesiveness between the pressure-sensitive adhesive layer and the adhesive layer can be appropriate, and in the case of performing the expand process without radiation curing, the expand process and the subsequent It is easy to suppress occurrence of peeling (raising) between the pressure-sensitive adhesive layer and the adhesive layer.

In addition, the higher the peeling force is, the more preferable it is, but the upper limit thereof may be, for example, 10N/20mm, 5.0N/20mm, or 3.0N/20mm. In addition, for a dicing die-bonding film using a radiation-curable pressure-sensitive adhesive for the pressure-sensitive adhesive layer, it is preferable that the peeling force of the pressure-sensitive adhesive layer before radiation curing (the peeling force in the T-type peeling test before ultraviolet curing) is the above-described value.

In the dicing die-bonding film of the present invention, the peeling force between the pressure-sensitive adhesive layer and the adhesive layer after radiation curing in a T-type peeling test under conditions of a temperature of 23°C and a peeling rate of 300 mm/min is 0.3 N. It is preferably /20 mm or less, and more preferably 0.2 N/20 mm or less. If the peeling force is 0.3 N/20 mm or less, it becomes easy to realize good pickup in the pickup step performed after radiation curing.

The dicing die bonding film may have a separator. Specifically, for each dicing die-bonding film, a sheet-like form having a separator may be used, or a separator may be in a long shape, and a plurality of dicing die-bonding films may be disposed thereon, and the separator may be wound to form a roll. .

The separator is an element for covering and protecting the surface of the adhesive layer of the dicing die-bonding film, and when using the dicing die-bonding film, it is peeled from the film. Examples of the separator include plastic films or papers coated on the surface with a release agent such as a polyethylene terephthalate (PET) film, a polyethylene film, a polypropylene film, a fluorine-based release agent or a long-chain alkyl acrylate-based release agent. The thickness of the separator is 5 to 200 µm, for example.

The dicing die-bonding film 1 which is an embodiment of the dicing die-bonding film of the present invention is manufactured as follows, for example.

First, the base material 11 can be obtained by forming a film by a known or commonly used film forming method. Examples of the film forming method include a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a coextrusion method, a dry lamination method, and the like.

Next, after forming a coating film by applying a composition (adhesive composition) to form the pressure-sensitive adhesive layer 12, including a pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer 12 and a solvent, on the substrate 11, if necessary Therefore, the coating film can be solidified by solvent removal or curing, and the pressure-sensitive adhesive layer 12 can be formed. As the coating method, known or commonly used coating methods, such as roll coating, screen coating, and gravure coating, are mentioned, for example. In addition, as a solvent removal condition, it is carried out within the range of temperature 80-150 degreeC and time 0.5-5 minutes, for example.

Further, after applying the pressure-sensitive adhesive composition on the separator to form a coating film, the coating film may be solidified under the above-described solvent removal conditions to form the pressure-sensitive adhesive layer 12. After that, the pressure-sensitive adhesive layer 12 is bonded together with a separator on the substrate 11. As described above, the dicing tape 10 can be produced. In addition, in the case of employing the method of transferring the pressure-sensitive adhesive layer 12 formed on the separator onto the substrate 11, in order to make the Ra of the surface 12a of the pressure-sensitive adhesive layer 12 to 1.0 μm or less, the peeling treatment surface It is preferable to use a separator with a smaller Ra of the (adhesive composition applied surface).

For the adhesive layer 20, first, a composition (adhesive composition) containing a resin, a filler, a curing catalyst, a solvent, and the like to form the adhesive layer 20 is prepared. Next, after the adhesive composition is applied on the separator to form a coating film, if necessary, the coating film is solidified by solvent removal or curing, and the adhesive layer 20 is formed. It does not specifically limit as a coating method, For example, well-known or common coating methods, such as roll coating, screen coating, and gravure coating, are mentioned. Moreover, as a solvent removal condition, it is performed within the range of a temperature of 70-160 degreeC and a time 1-5 minutes, for example.

Subsequently, the separators are removed from the dicing tape 10 and the adhesive layer 20, respectively, and the adhesive layer 20 and the adhesive layer 12 are bonded together so that they become a bonding surface. Bonding can be performed by, for example, pressing. At this time, the lamination temperature is not particularly limited, and for example, 30 to 50°C is preferable, and more preferably 35 to 45°C. Further, the line pressure is not particularly limited, for example, 0.1 to 20 kgf/cm is preferable, and more preferably 1 to 10 kgf/cm.

As described above, when the pressure-sensitive adhesive layer 12 is a radiation-curable pressure-sensitive adhesive layer, when irradiating the pressure-sensitive adhesive layer 12 with radiation such as ultraviolet rays after bonding of the adhesive layer 20, for example, The adhesive layer 12 is irradiated with radiation from the side, and the irradiation amount is, for example, 50 to 500 mJ, and preferably 100 to 300 mJ.

In the dicing die-bonding film 1, the area to be irradiated as a measure for reducing the adhesive force of the pressure-sensitive adhesive layer 12 (irradiation area R) is usually within the bonding area of the adhesive layer 20 in the pressure-sensitive adhesive layer 12. This is the area excluding the periphery. When the irradiation area R is partially provided, it can be carried out through a photomask in which a pattern corresponding to the area excluding the irradiation area R is formed. Further, a method of forming an irradiation area R by irradiating radiation in a spot is also mentioned.

In the manner described above, for example, the dicing die-bonding film 1 shown in FIG. 1 can be produced.

[Semiconductor device manufacturing method]

A semiconductor device can be manufactured using the dicing die-bonding film of the present invention. Specifically, a step of attaching a divided body of a semiconductor wafer including a plurality of semiconductor chips or a semiconductor wafer that can be divided into a plurality of semiconductor chips on the side of the adhesive layer in the dicing die-bonding film of the present invention (" Step A'') and a semiconductor having an adhesive layer by expanding the dicing tape in the dicing die-bonding film of the present invention under relatively low temperature conditions, and cutting at least the adhesive layer A process of obtaining a chip (sometimes referred to as ``step B'') and a process of expanding the dicing tape under relatively high temperature conditions to increase the spacing between semiconductor chips including the adhesive layer (``process A semiconductor device can be manufactured by a manufacturing method including a step of picking up a semiconductor chip provided with the adhesive layer (sometimes referred to as "step D") and a step of picking up a semiconductor chip including the adhesive layer.

A divided body of a semiconductor wafer including the plurality of semiconductor chips used in step A, or a semiconductor wafer that can be divided into a plurality of semiconductor chips can be obtained as follows. First, as shown in Figs. 2A and 2B, a divided groove 30a is formed in the semiconductor wafer W (divided groove forming step). The semiconductor wafer W has a first surface Wa and a second surface Wb. Various semiconductor elements (not shown) are already formed on the side of the first surface Wa of the semiconductor wafer W, and a wiring structure, etc. (not shown) necessary for the semiconductor element is already formed on the first surface Wa. have.

Then, after bonding the wafer processing tape T1 having the adhesive surface T1a to the second surface Wb side of the semiconductor wafer W, while the semiconductor wafer W is held on the wafer processing tape T1, the semiconductor wafer W is A dividing groove 30a having a predetermined depth is formed on the first surface Wa side by using a rotating blade such as a dicing device. The dividing groove 30a is a gap for separating the semiconductor wafer W in units of semiconductor chips (in Figs. 2 to 4, the dividing groove 30a is schematically represented by a thick line).

Next, as shown in Fig. 2(c), bonding of the wafer processing tape T2 having the adhesive surface T2a to the first surface Wa side of the semiconductor wafer W, and the wafer from the semiconductor wafer W The processing tape T1 is peeled off.

Next, as shown in (d) of FIG. 2, in a state where the semiconductor wafer W is held in the wafer processing tape T2, from the second surface Wb until the semiconductor wafer W reaches a predetermined thickness. It is thinned by the grinding process of (wafer thinning process). Grinding processing can be performed using a grinding processing apparatus provided with a grinding grindstone. By this wafer thinning process, the semiconductor wafer 30A which can be divided into a plurality of semiconductor chips 31 is formed in the present embodiment.

Specifically, the semiconductor wafer 30A has a portion (connecting portion) that connects a portion of the wafer to be divided into a plurality of semiconductor chips 31 from the second surface Wb side. The thickness of the connection portion in the semiconductor wafer 30A, that is, the distance between the second surface Wb of the semiconductor wafer 30A and the tip of the second surface Wb side of the dividing groove 30a is 1 to 30 μm, for example, It is preferably 3 to 20 μm.

(Step A)

In step A, on the side of the adhesive layer 20 in the dicing die bonding film 1, a divided body of a semiconductor wafer including a plurality of semiconductor chips, or a semiconductor wafer that can be divided into a plurality of semiconductor chips is affixed. .

In one embodiment in step A, as shown in Fig. 3(a), the semiconductor wafer 30A held by the wafer processing tape T2 is bonded to the adhesive layer 20 of the dicing die-bonding film 1 Join for. Thereafter, as shown in Fig. 3B, the wafer processing tape T2 is peeled from the semiconductor wafer 30A.

Further, after bonding of the semiconductor wafer 30A to the adhesive layer 20, the pressure-sensitive adhesive layer 12 may be irradiated with radiation such as ultraviolet rays from the side of the substrate 11. The irradiation amount is, for example, 50 to 500 mJ/cm 2, and preferably 100 to 300 mJ/cm 2. In the dicing die-bonding film 1, the area (irradiation area R shown in FIG. 1) to be irradiated as a measure to reduce the adhesive force of the pressure-sensitive adhesive layer 12 is, for example, an adhesive layer ( 20) It is an area excluding its periphery in the bonding area.

(Step B)

In step B, under relatively low temperature conditions, the dicing tape 10 in the dicing die-bonding film 1 is expanded, and at least the adhesive layer 20 is cut to obtain a semiconductor chip having an adhesive layer. Get

In one embodiment in step B, first, after affixing the ring frame 41 on the pressure-sensitive adhesive layer 12 of the dicing tape 10 in the dicing die-bonding film 1, FIG. 4 As shown in (a), the dicing die-bonding film 1 carrying the semiconductor wafer 30A is fixed to the holding tool 42 of the expander.

Next, under relatively low temperature conditions, a first expansion process (cool expansion process) is performed as shown in FIG. 4B, and the semiconductor wafer 30A is reorganized into a plurality of semiconductor chips 31. In addition, the adhesive layer 20 of the dicing die-bonding film 1 is divided into the adhesive layer 21 of a small piece to obtain a semiconductor chip 31 having an adhesive layer.

In the cool expand process, the hollow cylindrical push-up member 43 provided in the expander is brought into contact with the dicing tape 10 on the lower side of the drawing of the dicing die bonding film 1 and is raised, The dicing tape 10 of the dicing die bonding film 1 to which the semiconductor wafer 30A is bonded is expanded so as to be stretched in a two-dimensional direction including the radial direction and the circumferential direction of the semiconductor wafer 30A.

This expansion is performed under conditions in which tensile stress within the range of 15 to 32 MPa, preferably 20 to 32 MPa is generated in the dicing tape 10. The temperature conditions in the cool expand process are, for example, 0°C or less, preferably -20 to -5°C, more preferably -15 to -5°C, and more preferably -15°C. The expand speed in the cool expand process (the speed at which the pushing member 43 is raised) is preferably 0.1 to 100 mm/second. Further, the amount of expand in the cool expand step is preferably 3 to 16 mm.

In the step B, when the semiconductor wafer 30A which can be divided into a plurality of semiconductor chips is used, the division into the semiconductor chip 31 occurs due to the division of the semiconductor wafer 30A at a thin and easily cracked portion. In addition, in step B, deformation is suppressed in each region where each semiconductor chip 31 is in close contact with the adhesive layer 20 of the dicing tape 10 to be expanded. On the other hand, a tensile stress generated in the dicing tape 10 acts on a portion located in the vertical direction in the diagram of the divided grooves between the semiconductor chips 31 in a state where such a strain suppressing action does not occur. As a result, in the adhesive layer 20, a portion located in the vertical direction of the dividing groove between the semiconductor chips 31 is cut. After the division by the expand, as shown in FIG. 4C, the pushing member 43 is lowered to release the expanded state in the dicing tape 10.

(Step C)

In step C, the dicing tape 10 is expanded under relatively high temperature conditions to widen the spacing between semiconductor chips including the adhesive layer.

In one embodiment in step C, first, a second expanding step (room temperature expanding step) under relatively high temperature conditions is performed as shown in Fig. 5A, and a semiconductor having an adhesive layer The distance (separation distance) between the chips 31 is increased.

In step C, the hollow cylindrical push-up member 43 provided in the expander is raised again, and the dicing tape 10 of the dicing die bonding film 1 is expanded. The temperature conditions in the second expand process are, for example, 10°C or higher, and preferably 15 to 30°C. The expand speed in the second expand process (the speed at which the pushing member 43 is raised) is, for example, 0.1 to 10 mm/second, and preferably 0.3 to 1 mm/second. In step C, the separation distance between the semiconductor chips 31 including the adhesive layer is widened to the extent that the semiconductor chip 31 including the adhesive layer can be properly picked up from the dicing tape 10 in the pickup step described later. After the separation distance is widened by the expand, as shown in FIG. 5B, the pushing member 43 is lowered to release the expanded state in the dicing tape 10.

From the viewpoint of suppressing narrowing of the separation distance of the semiconductor chip 31 provided with the adhesive layer on the dicing tape 10 after releasing the expanded state, before releasing the expanded state, the dicing tape 10 It is preferable to heat and contract a part outside of the semiconductor chip 31 holding region in this.

After step C, if necessary, a cleaning step of cleaning the semiconductor chip 31 side of the dicing tape 10 with the semiconductor chip 31 having an adhesive layer using a cleaning solution such as water is provided. You may have it.

(Step D)

In step D (pick-up step), a semiconductor chip provided with an individualized adhesive layer is picked up. In one embodiment in step D, after passing through the cleaning step as necessary, the semiconductor chip 31 including the adhesive layer is picked up from the dicing tape 10 as shown in FIG. 6. For example, with respect to the semiconductor chip 31 provided with the adhesive layer to be picked up, the pin member 44, which is a pickup mechanism, is raised from the lower side of the drawing of the dicing tape 10 to interpose the dicing tape 10. It is pushed up and held by adsorption jig 45. In the pick-up process, the push-up speed of the pin member 44 is, for example, 1 to 100 mm/second, and the push-up amount of the pin member 44 is, for example, 50 to 3000 µm.

The method for manufacturing the semiconductor device may include steps other than steps A to D. For example, in one embodiment, as shown in Fig. 7(a), the semiconductor chip 31 having the picked up adhesive layer is placed with the adherend 51 via the adhesive layer 21. Temporarily fix (temporary fixation process).

Examples of the adherend 51 include a lead frame, a TAB (Tape Automated Bonding) film, a wiring board, and a separately manufactured semiconductor chip. The shear adhesion at 25° C. at the time of temporary bonding of the adhesive layer 21 is preferably 0.2 MPa or more with respect to the adherend 51, and more preferably 0.2 to 10 MPa. The configuration in which the shear adhesive force of the adhesive layer 21 is 0.2 MPa or more is achieved by ultrasonic vibration or heating in the wire bonding process described later, so that the adhesive layer 21 and the semiconductor chip 31 or the adherend 51 are It is possible to suitably perform wire bonding by suppressing the occurrence of shear deformation on the bonding surface. In addition, the shear adhesive force at 175° C. at the time of temporary bonding of the adhesive layer 21 is preferably 0.01 MPa or more, more preferably 0.01 to 5 MPa with respect to the adherend 51.

Next, as shown in FIG. 7B, the electrode pads (not shown) of the semiconductor chip 31 and the terminal portions (not shown) of the adherend 51 are electrically connected through the bonding wire 52. Connect (wire bonding process).

The connection between the electrode pad of the semiconductor chip 31 or the terminal portion of the adherend 51 and the bonding wire 52 can be realized by ultrasonic welding with heating, so that the adhesive layer 21 is not thermally cured. . As the bonding wire 52, a gold wire, an aluminum wire, a copper wire, or the like can be used, for example. The wire heating temperature in wire bonding is, for example, 80 to 250°C, and preferably 80 to 220°C. In addition, the heating time is several seconds to several minutes.

Next, as shown in FIG. 7C, the semiconductor chip 31 is sealed with a sealing resin 53 for protecting the semiconductor chip 31 or the bonding wire 52 on the adherend 51. Do (sealing process).

In the sealing process, thermal curing of the adhesive layer 21 proceeds. In the sealing process, the sealing resin 53 is formed by, for example, a transfer mold technique performed using a mold. As the constituent material of the sealing resin 53, for example, an epoxy resin can be used. In the sealing process, the heating temperature for forming the sealing resin 53 is, for example, 165 to 185°C, and the heating time is, for example, from 60 seconds to several minutes.

When curing of the sealing resin 53 does not sufficiently proceed in the sealing process, a post-curing process for completely curing the sealing resin 53 is performed after the sealing process. Even when the adhesive layer 21 is not completely thermally cured in the sealing process, complete thermal curing of the adhesive layer 21 together with the sealing resin 53 is possible in the post curing process. In the post-curing process, the heating temperature is, for example, 165 to 185°C, and the heating time is, for example, 0.5 to 8 hours.

In the above-described embodiment, as described above, after the semiconductor chip 31 having the adhesive layer is temporarily attached to the adherend 51, the wire bonding process is performed without completely thermally curing the adhesive layer 21. . Instead of this configuration, in the above-described method for manufacturing a semiconductor device, a semiconductor chip 31 having an adhesive layer is temporarily bonded to the adherend 51, and then the adhesive layer 21 is thermally cured, and then a wire bonding process is performed. Also works.

In the semiconductor device manufacturing method described above, as another embodiment, the wafer thinning step shown in FIG. 8 may be performed instead of the wafer thinning step described above with reference to FIG. 2D. After going through the above-described process with reference to FIG. 2(c), in the wafer thinning process shown in FIG. 8, while the semiconductor wafer W is held on the wafer processing tape T2, the wafer reaches a predetermined thickness. Until then, it is thinned by grinding from the second surface Wb to form a semiconductor wafer divided body 30B held by the wafer processing tape T2 including a plurality of semiconductor chips 31.

In the wafer thinning process, a method of grinding the wafer until the divided grooves 30a are exposed to the second surface Wb side (first method) may be employed, and from the second surface Wb side to the divided grooves 30a. A method of forming a semiconductor wafer divided body 30B by grinding the wafer before, and then generating a crack between the dividing groove 30a and the second surface Wb by the action of the pressing force on the wafer from the rotary grindstone (second Method) may be employed. Depending on the method employed, the depth from the first surface Wa of the divided groove 30a formed as described above with reference to FIGS. 2A and 2B is appropriately determined.

In Fig. 8, the divided grooves 30a through the first method or the divided grooves 30a through the second method, and cracks subsequent thereto are schematically shown by thick lines. In the semiconductor device manufacturing method, in step A, the semiconductor wafer divided body 30B thus produced as a semiconductor wafer divided body is used in place of the semiconductor wafer 30A, and described above with reference to FIGS. 3 to 7 You may perform each step.

9(a) and 9(b) show the step B in the embodiment, that is, the first expansion performed after bonding the semiconductor wafer divided body 30B to the dicing die bonding film 1 Represents a process (cool expand process).

In step B in this embodiment, the hollow cylindrical push-up member 43 provided in the expander is fitted with the dicing tape 10 at the lower side of the drawing of the dicing die bonding film 1. The dicing tape 10 of the dicing die-bonding film 1 bonded to the semiconductor wafer division body 30B is brought into contact and raised in a two-dimensional direction including the radial direction and the circumferential direction of the semiconductor wafer division body 30B. Expand to stretch.

This expansion is performed in the dicing tape 10 under conditions in which tensile stress within a range of, for example, 5 to 28 MPa, preferably 8 to 25 MPa is generated. The temperature conditions in the cool expand process are, for example, 0°C or less, preferably -20 to -5°C, more preferably -15 to -5°C, and more preferably -15°C. The expand speed in the cool expand process (the speed at which the pushing member 43 is raised) is preferably 1 to 400 mm/second. In addition, the amount of expand in the cool expand process is preferably 50 to 200 mm.

By such a cool expansion process, the adhesive layer 20 of the dicing die-bonding film 1 is divided into the adhesive layer 21 of small pieces, and a semiconductor chip 31 having an adhesive layer is obtained. Specifically, in the cool expand process, in the adhesive layer 20 in close contact with the adhesive layer 12 of the dicing tape 10 to be expanded, each semiconductor chip 31 of the semiconductor wafer division body 30B While deformation is suppressed in each of the regions in close contact with each other, dicing tape in a state in which such a deformation suppressing action does not occur in a portion located in the vertical direction in the diagram of the dividing groove 30a between the semiconductor chips 31 Tensile stress occurring in (10) acts. As a result, in the diagram of the dividing groove 30a between the semiconductor chips 31 in the adhesive layer 20, a portion positioned in the vertical direction is cut.

In the semiconductor device manufacturing method described above, as a further embodiment, instead of the semiconductor wafer 30A or the semiconductor wafer divided body 30B used in step A, a semiconductor wafer 30C manufactured as follows is provided. You can use it.

In this embodiment, as shown in FIGS. 10A and 10B, first, a modified region 30b is formed on the semiconductor wafer W. The semiconductor wafer W has a first surface Wa and a second surface Wb. Various semiconductor elements (not shown) are already formed on the side of the first surface Wa of the semiconductor wafer W, and a wiring structure, etc. (not shown) necessary for the semiconductor element is already formed on the first surface Wa. have.

Then, after bonding the wafer processing tape T3 having the adhesive surface T3a to the first surface Wa side of the semiconductor wafer W, while the semiconductor wafer W is held by the wafer processing tape T3, the condensing point is aligned inside the wafer. A true laser light is irradiated from the side opposite to the wafer processing tape T3 to the semiconductor wafer W along a line to be divided, and a modified region 30b is formed in the semiconductor wafer W by ablation by multiphoton absorption. . The modified region 30b is a fragile region for separating the semiconductor wafer W in units of semiconductor chips.

A method of forming the modified region 30b on the line to be divided by laser light irradiation in a semiconductor wafer is described in detail in, for example, Japanese Unexamined Patent Application Publication No. 2002-192370, but in the present embodiment The laser light irradiation conditions of, for example, are appropriately adjusted within the range of the following conditions.

<Laser light irradiation conditions>

(A) laser light

Laser light source Semiconductor laser excitation Nd:YAG laser

wavelength 1064nm

Laser light spot cross-sectional area 3.14×10 ^-8 ㎠

Rash form Q switch pulse

Repetition frequency 100㎑ or less

Pulse width 1 μs or less

Print 1mJ or less

Laser light quality TEM00

Polarization characteristics Linearly polarized

(B) condensing lens

Magnification 100 times or less

NA 0.55

Transmittance to laser light wavelength 100% or less

(C) The moving speed of the mounting platform on which the semiconductor substrate is loaded 280㎜/sec or less

Next, as shown in (c) of FIG. 10, in a state where the semiconductor wafer W is held in the wafer processing tape T3, from the second surface Wb until the semiconductor wafer W reaches a predetermined thickness. The semiconductor wafer 30C which can be divided into a plurality of semiconductor chips 31 is formed by thinning by grinding processing of (wafer thinning step).

In the method for manufacturing a semiconductor device, in step A, the semiconductor wafer 30C thus produced as a semiconductor wafer that can be divided into pieces is used instead of the semiconductor wafer 30A, as described above with reference to FIGS. 3 to 7. You may perform each process.

11(a) and 11(b) show Step B in the embodiment, that is, a first expanding step performed after bonding the semiconductor wafer 30C to the dicing die bonding film 1 ( Cool expand process).

In the cool expand process, the hollow cylindrical push-up member 43 provided in the expander is brought into contact with the dicing tape 10 on the lower side of the drawing of the dicing die bonding film 1 and is raised, The dicing tape 10 of the dicing die bonding film 1 to which the semiconductor wafer 30C is bonded is expanded so as to be stretched in a two-dimensional direction including the radial direction and the circumferential direction of the semiconductor wafer 30C.

This expansion is performed in the dicing tape 10 under conditions in which tensile stress within a range of, for example, 5 to 28 MPa, preferably 8 to 25 MPa is generated. The temperature conditions in the cool expand process are, for example, 0°C or less, preferably -20 to -5°C, more preferably -15 to -5°C, and more preferably -15°C. The expand speed in the cool expand process (the speed at which the pushing member 43 is raised) is preferably 1 to 400 mm/second. In addition, the amount of expand in the cool expand process is preferably 50 to 200 mm.

By such a cool expansion process, the adhesive layer 20 of the dicing die-bonding film 1 is divided into the adhesive layer 21 of small pieces, and a semiconductor chip 31 having an adhesive layer is obtained. Specifically, in the cool expand process, cracks are formed in the weakly modified region 30b of the semiconductor wafer 30C, and the division into the semiconductor chip 31 occurs. In addition, in the cool expansion process, in the adhesive layer 20 in close contact with the adhesive layer 12 of the dicing tape 10 to be expanded, each semiconductor chip 31 of the semiconductor wafer 30C is in close contact. While deformation is suppressed in each of the regions, the tensile stress generated in the dicing tape 10 in a state in which such a deformation suppressing action does not occur in the diagram of the crack formation region of the wafer in the vertical direction. Works. As a result, in the diagram of the crack formation location between the semiconductor chips 31 in the adhesive layer 20, the location located in the vertical direction is cut.

Further, in the semiconductor device manufacturing method, the dicing die-bonding film 1 can be used for obtaining a semiconductor chip having an adhesive layer as described above, but a plurality of semiconductor chips are stacked to achieve three-dimensional mounting. It can also be used for the purpose of obtaining a semiconductor chip provided with an adhesive layer in the case of a case. Between the semiconductor chips 31 in such three-dimensional mounting, a spacer may be interposed together with the adhesive layer 21, and the spacer may not be interposed.

[Example]

Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited at all by these examples. In addition, the composition of each monomer component constituting the acrylic polymer P ₂ of the pressure-sensitive adhesive layer in Examples and Comparative Examples is shown in the table. However, in the table, the unit of each numerical value indicating the composition of the composition is the numerical value for the monomer component is a relative "mole" in the composition, and the numerical value for each component other than the monomer component is 100 mass of the acrylic polymer P ₂ It is "parts by mass" for wealth.

Example 1

(Dicing Tape)

In a reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer, and a stirring device, 100 moles of 2-ethylhexyl acrylate (2EHA), 30 moles of 2-hydroxyethyl acrylate (HEA), and an acryl furnace A mixture containing 30 moles of ylmorpholine (AM), 0.2 parts by mass of benzoyl peroxide as a polymerization initiator and toluene as a polymerization solvent was stirred at 61°C for 6 hours in a nitrogen atmosphere based on 100 parts by mass of these monomer components ( polymerization). Thereby, a polymer solution containing acrylic polymer P ₁ was obtained.

Next, a mixture containing a polymer solution containing this acrylic polymer P ₁ , 2-methacryloyloxyethyl isocyanate (MOI), and dibutyltin dilaurate as an addition reaction catalyst was prepared at 50° C. for 48 hours. And stirred under an air atmosphere (additional reaction). In the reaction solution, the blending amount of MOI is 25 mol. Moreover, in the said reaction solution, the compounding amount of dibutyltin dilaurate is 0.01 mass part with respect to 100 mass parts of acrylic polymer P ₁ . By this addition reaction, a polymer solution containing acrylic polymer P ₂ (acrylic polymer containing constituent units derived from an isocyanate compound containing an unsaturated functional group) having a methacrylate group in the side chain was obtained.

Next, to the polymer solution, 1 part by mass of a polyisocyanate compound (brand name "Coronate L", manufactured by Tosoh Corporation) and 2 parts by mass of a photopolymerization initiator (brand name "Irgacure") per 100 parts by mass of acrylic polymer P ₂ 127", BASF company make) was added and mixed, and toluene was added and diluted, and the adhesive composition was obtained.

Next, a pressure-sensitive adhesive composition layer was formed by applying the pressure-sensitive adhesive composition using an applicator on the silicon-releasing-treated surface of a PET separator (thickness 50 μm) having a silicon-releasing-treated side. Next, the composition layer was subjected to solvent removal by heating at 120° C. for 2 minutes to form a pressure-sensitive adhesive layer having a thickness of 10 μm on the PET separator.

Next, using a laminator, the EVA film (thickness 125 micrometers) as a base material was bonded to the exposed surface of this adhesive layer at room temperature. The conjugate was then stored at 50° C. for 24 hours. In the manner described above, the dicing tape of Example 1 was produced.

(Adhesive layer)

Acrylic polymer A ₁ (copolymer of ethyl acrylate and butyl acrylate, acrylonitrile and glycidyl methacrylate, mass average molecular weight is 1.2 million, glass transition temperature is 0° C., epoxy value is 0.4 eq/kg) and 54 parts by mass , Solid phenol resin (trade name "MEHC-7851SS", solid at 23°C, manufactured by Meiwa Kasei Co., Ltd.) and 3 parts by mass of liquid phenol resin (trade name "MEH-8000H", liquid at 23°C, Meiwa Kasei Corporation. 3 parts by mass of silica filler (trade name "SO-C2", average particle diameter of 0.5 µm, manufactured by Adomatex Co., Ltd.) 40 parts by mass was added to methyl ethyl ketone and mixed, and viscosity at room temperature The concentration was adjusted so as to be 700 mPa·s to obtain an adhesive composition.

Next, a coating film was formed by applying the adhesive composition using an applicator on the silicone release treatment surface of a PET separator (thickness 38 μm) having a silicone release treatment surface, and the coated film at 130°C for 2 minutes. Solvent removal was performed. In the manner described above, an adhesive layer having a thickness of 10 μm in Example 1 was produced on the PET separator.

(Production of dicing die-bonding film)

The PET separator was peeled from the dicing tape of Example 1, and the adhesive layer of Example 1 was bonded to the exposed adhesive layer. For bonding, a hand roller was used. Next, 300 mJ of ultraviolet rays were irradiated from the dicing tape side to prepare a dicing die-bonding film of Example 1.

Example 2

In the same manner as in Example 1, except that the blending amount of acryloylmorpholine (AM) constituting the acrylic polymer P ₂ (an acrylic polymer containing a structural unit derived from an unsaturated functional group-containing isocyanate compound) in the pressure-sensitive adhesive layer was changed to 10 mol. Thus, the dicing tape and dicing die-bonding film of Example 2 were produced.

Example 3

A dicing tape and a dicing die-bonding film of Example 3 were produced in the same manner as in Example 1 except that the pressure-sensitive adhesive layer was not irradiated with ultraviolet rays.

Example 4

Dicing tape and dicing of Example 4 in the same manner as in Example 3, except that the blending amount of the polyisocyanate compound (trade name ``Coronate L'', manufactured by Tosoh Corporation) was 2 parts by mass in the production of the pressure-sensitive adhesive layer. A die bond film was produced.

Example 5

A dicing tape and a dicing die-bonding film of Example 5 were produced in the same manner as in Example 2, except that the pressure-sensitive adhesive layer was not irradiated with ultraviolet rays.

Example 6

Dicing tape and dicing of Example 6 in the same manner as in Example 5, except that the blending amount of the polyisocyanate compound (brand name ``Coronate L'', manufactured by Tosoh Corporation) was 2 parts by mass in the production of the pressure-sensitive adhesive layer. A die bond film was produced.

Example 7

(Dicing Tape)

50 mol of ethyl acrylate (EA), 50 mol of butyl acrylate (BA), and 2-hydroxyethyl acrylate (HEA) in a reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer, and a stirring device A mixture containing 20 moles and 0.2 parts by mass of benzoyl peroxide as a polymerization initiator and toluene as a polymerization solvent was stirred at 61° C. for 6 hours in a nitrogen atmosphere (polymerization reaction) with respect to 100 parts by mass of these monomer components. Thereby, a polymer solution containing acrylic polymer P ₁ was obtained.

Next, a mixture containing a polymer solution containing this acrylic polymer P ₁ , 2-methacryloyloxyethyl isocyanate (MOI), and dibutyltin dilaurate as an addition reaction catalyst was prepared at 50° C. for 48 hours. And stirred under an air atmosphere (additional reaction). In the reaction solution, the amount of MOI blended is 18 mol. Moreover, in the said reaction solution, the compounding amount of dibutyltin dilaurate is 0.01 mass part with respect to 100 mass parts of acrylic polymer P ₁ . By this addition reaction, a polymer solution containing acrylic polymer P ₂ (acrylic polymer containing constituent units derived from an isocyanate compound containing an unsaturated functional group) having a methacrylate group in the side chain was obtained.

Next, to the polymer solution, 1 part by mass of a polyisocyanate compound (brand name "Coronate L", manufactured by Tosoh Corporation) and 2 parts by mass of a photopolymerization initiator (brand name "Irgacure") per 100 parts by mass of acrylic polymer P ₂ 127", BASF company make) was added and mixed, and toluene was added and diluted, and the adhesive composition was obtained.

Next, a pressure-sensitive adhesive composition layer was formed by applying the pressure-sensitive adhesive composition using an applicator on the silicon-releasing-treated surface of a PET separator (thickness 50 μm) having a silicon-releasing-treated side. Next, the composition layer was subjected to solvent removal by heating at 120° C. for 2 minutes to form a pressure-sensitive adhesive layer having a thickness of 10 μm on the PET separator.

Next, using a laminator, the EVA film (thickness 125 micrometers) as a base material was bonded to the exposed surface of this adhesive layer at room temperature. The conjugate was then stored at 50° C. for 24 hours. As described above, the dicing tape of Example 7 was produced.

(Production of dicing die-bonding film)

The PET separator was peeled from the dicing tape of Example 7, and the adhesive layer of Example 1 was bonded to the exposed pressure-sensitive adhesive layer. For bonding, a hand roller was used. In this way, the dicing die-bonding film of Example 7 was produced.

Example 8

Dicing tape and dicing of Example 8 in the same manner as in Example 7, except that the blending amount of the polyisocyanate compound (trade name ``Coronate L'', manufactured by Tosoh Corporation) was 2 parts by mass in the production of the pressure-sensitive adhesive layer. A die bond film was produced.

Comparative Example 1

(Dicing Tape)

100 moles of 2-ethylhexyl acrylate (2EHA), 20 moles of 2-hydroxyethyl acrylate (HEA), and these monomers in a reaction vessel equipped with a cooling pipe, a nitrogen introduction pipe, a thermometer, and a stirring device A mixture containing 0.2 parts by mass of benzoyl peroxide as a polymerization initiator and toluene as a polymerization solvent was stirred at 61°C for 6 hours in a nitrogen atmosphere with respect to 100 parts by mass of the component (polymerization reaction). Thereby, a polymer solution containing acrylic polymer P ₁ was obtained.

Next, a mixture containing a polymer solution containing this acrylic polymer P ₁ , 2-methacryloyloxyethyl isocyanate (MOI), and dibutyltin dilaurate as an addition reaction catalyst was prepared at 50° C. for 48 hours. And stirred under an air atmosphere (additional reaction). In the reaction solution, the amount of MOI blended is 18 mol. Moreover, in the said reaction solution, the compounding amount of dibutyltin dilaurate is 0.01 mass part with respect to 100 mass parts of acrylic polymer P ₁ . By this addition reaction, a polymer solution containing acrylic polymer P ₂ (acrylic polymer containing constituent units derived from an isocyanate compound containing an unsaturated functional group) having a methacrylate group in the side chain was obtained.

Next, to the polymer solution, 0.5 parts by mass of a polyisocyanate compound (brand name ``Coronate L'', manufactured by Tosoh Corporation) and 2 parts by mass of a photopolymerization initiator (brand name ``Irgacure'') based on 100 parts by mass of acrylic polymer P ₂ 127", BASF company make) was added and mixed, and toluene was added and diluted, and the adhesive composition was obtained.

Next, a pressure-sensitive adhesive composition layer was formed by applying the pressure-sensitive adhesive composition using an applicator on the silicon-releasing-treated surface of a PET separator (thickness 50 μm) having a silicon-releasing-treated side. Next, the composition layer was subjected to solvent removal by heating at 120° C. for 2 minutes to form a pressure-sensitive adhesive layer having a thickness of 10 μm on the PET separator.

Next, using a laminator, the EVA film (thickness 125 micrometers) as a base material was bonded to the exposed surface of this adhesive layer at room temperature. The conjugate was then stored at 50° C. for 24 hours. As described above, the dicing tape of Comparative Example 1 was produced.

(Production of dicing die-bonding film)

The PET separator was peeled from the dicing tape of Comparative Example 1, and the adhesive layer of Example 1 was bonded to the exposed pressure-sensitive adhesive layer. For bonding, a hand roller was used. In this way, the dicing die-bonding film of Comparative Example 1 was produced.

Comparative Example 2

Dicing tape and dicing of Comparative Example 2 in the same manner as in Comparative Example 1, except that the blending amount of the polyisocyanate compound (brand name ``Coronate L'', manufactured by Tosoh Corporation) was 1 part by mass in the production of the pressure-sensitive adhesive layer. A die bond film was produced.

Comparative Example 3

Dicing tape and dicing of Comparative Example 3 in the same manner as in Comparative Example 1, except that the blending amount of the polyisocyanate compound (brand name ``Coronate L'', manufactured by Tosoh Corporation) was 2 parts by mass in the production of the pressure-sensitive adhesive layer. A die bond film was produced.

Comparative Example 4

(Dicing Tape)

100 mol of lauryl methacrylate (LMA), 20 mol of 2-hydroxyethyl methacrylate (HEMA), and these monomers in a reaction vessel equipped with a cooling tube, a nitrogen inlet tube, a thermometer, and a stirring device A mixture containing 0.2 parts by mass of benzoyl peroxide as a polymerization initiator and toluene as a polymerization solvent was stirred at 61°C for 6 hours in a nitrogen atmosphere with respect to 100 parts by mass of the component (polymerization reaction). Thereby, a polymer solution containing acrylic polymer P ₁ was obtained.

Next, a mixture containing a polymer solution containing this acrylic polymer P1, 2-methacryloyloxyethyl isocyanate (MOI), and dibutyltin dilaurate as an addition reaction catalyst was prepared at 50° C. for 48 hours, It was stirred under an air atmosphere (additional reaction). In the reaction solution, the amount of MOI blended is 18 mol. Moreover, in the said reaction solution, the compounding amount of dibutyltin dilaurate is 0.01 mass part with respect to 100 mass parts of acrylic polymer P ₁ . By this addition reaction, a polymer solution containing acrylic polymer P ₂ (acrylic polymer containing constituent units derived from an isocyanate compound containing an unsaturated functional group) having a methacrylate group in the side chain was obtained.

Next, to the polymer solution, 0.5 parts by mass of a polyisocyanate compound (brand name ``Coronate L'', manufactured by Tosoh Corporation) and 2 parts by mass of a photopolymerization initiator (brand name ``Irgacure'') based on 100 parts by mass of acrylic polymer P ₂ 127", BASF company make) was added and mixed, and toluene was added and diluted, and the adhesive composition was obtained.

Next, a pressure-sensitive adhesive composition layer was formed by applying the pressure-sensitive adhesive composition using an applicator on the silicon-releasing-treated surface of a PET separator (thickness 50 μm) having a silicon-releasing-treated side. Next, the composition layer was subjected to solvent removal by heating at 120° C. for 2 minutes to form a pressure-sensitive adhesive layer having a thickness of 10 μm on the PET separator.

Next, using a laminator, the EVA film (thickness 125 micrometers) as a base material was bonded to the exposed surface of this adhesive layer at room temperature. The conjugate was then stored at 50° C. for 24 hours. As described above, the dicing tape of Comparative Example 4 was produced.

(Production of dicing die-bonding film)

The PET separator was peeled from the dicing tape of Comparative Example 4, and the adhesive layer of Example 1 was bonded to the exposed adhesive layer. For bonding, a hand roller was used. In this way, the dicing die-bonding film of Comparative Example 4 was produced.

Comparative Example 5

Dicing tape and dicing of Comparative Example 5 in the same manner as in Comparative Example 4, except that the blending amount of the polyisocyanate compound (brand name ``Coronate L'', manufactured by Tosoh Corporation) was 1 part by mass in the preparation of the pressure-sensitive adhesive layer. A die bond film was produced.

Comparative Example 6

In the production of the pressure-sensitive adhesive layer, the pressure-sensitive adhesive composition is applied using an applicator on the silicone release-treated surface of a PET separator (thickness 50 μm, arithmetic average surface roughness of the release-treated surface is 1.0 μm) having a side subjected to silicone release treatment. The dicing tape and the dicing die-bonding film of Comparative Example 6 were produced in the same manner as in Example 2 except that the pressure-sensitive adhesive composition layer was formed.

<Evaluation>

The following evaluation was performed about the dicing die-bonding film obtained by an Example and a comparative example. The results are shown in the table.

(1) Surface roughness

Confocal laser microscope (trade name ``shape measurement laser microscope VK-X100'', manufactured by Keyence Corporation) for the surface of the pressure-sensitive adhesive layer in the area where the adhesive layer is not laminated of the dicing die-bonding film obtained in Examples and Comparative Examples ), the arithmetic mean surface roughness (Ra) was measured at a magnification of 10 times the eyepiece and 20 times the objective lens.

(2) water contact angle

Using a contact angle meter "CA-X type" (manufactured by Kyowa Gaimen Chemical Co., Ltd.), one drop of a reagent was added dropwise to the surface of the pressure-sensitive adhesive layer, and the water contact angle was measured by measuring the angle at that time.

(3) Value of the polarity component of surface free energy obtained from the equation of Kaelble Uy

In the same manner as the water contact angle measurement, the methylene iodide contact angle on the surface of the pressure-sensitive adhesive layer was measured. Then, the water contact angle measured in the contact angle evaluation was θw, and the methylene iodide contact angle was θi, and γs ^p was obtained from the following equations (2) and (3), and the value of the polar component of the surface free energy was taken. In addition, γw is 72.8mJ/m2, γw ^d is 21.8mJ/m2, γw ^p is 51.0mJ/m2, γi is 50.8mJ/m2, γi ^d is 48.5mJ/m2, γi ^p is 2.3mJ/m2.

γw (1 + cosθw) = 2 (γs d γw d) 1/2 +2 (γs p γw p) 1/2 (2)

γi(1+cosθi)=2(γs ^d γi ^d ) ^1/2 +2(γs ^p γi ^p ) ^1/2 (3)

(4) Lifting of semiconductor chips with die-bonding film

Using the brand name "ML300-Integration" (manufactured by Tokyo Seimitsu Co., Ltd.) as a laser processing device, by aligning the condensing point inside a 12-inch semiconductor wafer, a grid-shaped (10 mm × 10 mm) line to be divided Accordingly, laser light was irradiated to form a modified region inside the semiconductor wafer. The irradiation of laser light was performed under the following conditions.

(A) laser light

Laser light source Semiconductor laser excitation Nd:YAG laser

wavelength 1064nm

Laser light spot cross-sectional area 3.14×10 ^-8 ㎠

Rash form Q switch pulse

Repetition frequency 100㎑

Pulse width 30ns

Print 20 μJ/pulse

Laser light quality TEM00 40

Polarization characteristics Linearly polarized

(B) condensing lens

Magnification 50 times

NA 0.55

Transmittance to laser light wavelength 60%

(C) The moving speed of the mounting platform on which the semiconductor substrate is loaded 100mm/sec

After forming the modified region inside the semiconductor wafer, a protective tape for backgrinding was bonded to the surface of the semiconductor wafer, and the thickness of the semiconductor wafer was reduced to 30 µm using a back grinder (brand name "DGP8760", manufactured by Disco Corporation). The back side was ground if possible.

To the dicing die-bonding films obtained in Examples and Comparative Examples, a semiconductor wafer in which a modified region was formed and a dicing ring were bonded. Then, the semiconductor wafer and the die-bonding film were cleaved using a die separator (trade name "DDS2300", manufactured by Disco Corporation). Specifically, first, in the cool expander unit, cool expansion was performed under conditions of a temperature of -15°C, an expand speed of 100 mm/sec, and an expand amount of 15 mm to cut a semiconductor wafer. After the cool expansion, it was confirmed that there was no problem in the lifting of the semiconductor chip including the splitting and die-bonding film.

After cutting the semiconductor wafer and the die-bonding film, the cool expander unit was used as it is, and expanded at room temperature under the conditions of room temperature, an expand speed of 0.3 mm/sec, and an expand amount of 8 mm. Then, the area of the part where the die-bonding film was lifted from the dicing tape (the ratio of the area of the semiconductor chip provided with the floating die-bonding film when the entire area of the die-bonding film was 100%) was observed with a microscope. The case where the ratio of the area of the floating part was less than 30% was evaluated as ?, the case of 30 to 50% was evaluated as ?, and the case where it exceeded 50% was evaluated as x.

As the above summary, the configuration of the present invention and variations thereof are added below.

[1] a dicing tape having a laminated structure comprising a substrate and an adhesive layer,

And an adhesive layer in close contact with the pressure-sensitive adhesive layer in the dicing tape so as to be peelable,

The pressure-sensitive adhesive layer is a dicing die-bonding film having a water contact angle of 110° or less and an arithmetic average surface roughness Ra of 1.0 μm or less on the surface of the side to which the adhesive layer is in close contact.

[2] The dicing die-bonding film according to [1], wherein the water contact angle is 108° or less (preferably 105° or less).

[3] The dicing die-bonding film according to [1] or [2], wherein the water contact angle is 80° or more (preferably 84° or more, more preferably 88° or more).

[4] The dicing die-bonding film according to any one of [1] to [3], wherein the arithmetic mean surface roughness Ra is 0.5 µm or less (preferably 0.3 µm or less).

[5] The value of the polar component of the surface free energy obtained from the equation of Kaelble Uy using the contact angle between water and methylene iodide on the surface of the pressure-sensitive adhesive layer is 0.10 or more (preferably 0.20 or more, more preferably 0.40 The dicing die-bonding film according to any one of [1] to [4] which is the above).

[6] The dicing die-bonding film according to any one of [1] to [5], wherein the pressure-sensitive adhesive layer contains an acrylic polymer as a base polymer.

[7] The dicing die-bonding film according to [6], wherein the acrylic polymer contains, as a monomer component, a hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group.

[8] The dicing die-bonding film according to [7], wherein the total number of carbon atoms in the ester portion of the hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group is 6 to 10.

[9] The dicing die-bonding film according to [6], wherein the total number of carbon atoms in the ester portion of the hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group is 2 to 4.

[10] The proportion of the hydrocarbon group-containing (meth)acrylic acid ester which may have an alkoxy group in all monomer components for forming the acrylic polymer is 20 mol% or more (preferably 30 mol% or more, more preferably The dicing die-bonding film according to any one of [7] to [9], which is 40 mol% or more.

[11] The dicing die-bonding film according to claim 1 in any one of [6] to [10], wherein the acrylic polymer contains a hydroxy group-containing monomer as a monomer component.

[12] The dicing die-bonding film according to [11], wherein the hydroxy group-containing monomer is 2-hydroxyethyl (meth)acrylate.

[13] The dicing die-bonding film according to [11] or [12], wherein the ratio of the hydroxy group-containing monomer in all monomer components for forming the acrylic polymer is 5 to 80 mol%.

[14] The acrylic polymer is any of [6] to [13] containing a nitrogen atom-containing monomer (preferably a morpholino group-containing monomer, more preferably (meth)acryloylmorpholine) as a monomer component. The dicing die-bonding film according to claim 1 according to claim 1.

[15] The dicing die-bonding film according to [14], wherein the ratio of the nitrogen atom-containing monomer in all monomer components for forming the acrylic polymer is 3 to 50 mol%.

[16] The dicing according to any one of [6] to [15], wherein the total ratio of the hydroxy group-containing monomer and the nitrogen atom-containing monomer in all monomer components for forming the acrylic polymer is 10 to 60 mol%. Die bond film.

[17] The acrylic polymer has a structural unit derived from a compound having a second functional group capable of reacting with the first functional group and a radiation polymerizable functional group together with a structural unit derived from a monomer having a first functional group [6] to The dicing die-bonding film according to any one of [16].

[18] The dicing die-bonding film according to [17], wherein the combination of the first functional group and the second functional group is a combination of a hydroxy group and an isocyanate group, or a combination of an isocyanate group and a hydroxy group.

[19] The dicing die-bonding film according to [17], wherein the first functional group is a hydroxy group, and the second functional group is an isocyanate group.

[20] Any of [17] to [19], wherein the compound having the second functional group and the radiation polymerizable functional group is a compound having a radiation polymerizable carbon-carbon double bond (particularly, a (meth)acryloyl group) and an isocyanate group. The dicing die bonding film described in one.

[21] The dicing die-bonding film according to any one of [17] to [20], wherein the compound having the second functional group and the radiation polymerizable functional group is 2-(meth)acryloyloxyethyl isocyanate.

[22] The molar ratio of the constituent unit derived from the monomer having the first functional group and the compound having the second functional group and the radiation polymerizable functional group is 0.95 or more (preferably 1.00 or more, more preferably 1.05 or more, even more preferably 1.10 or more), the dicing die-bonding film in any one of [17] to [21].

[23] The molar ratio of the constituent unit derived from the monomer having the first functional group and the compound having the second functional group and the radiation-polymerizable functional group is 10.00 or less (preferably 5.00 or less, more preferably 3.00 or less, even more preferably The dicing die-bonding film according to any one of [17] to [22], which is 2.00 or less, more preferably 1.50 or less, particularly preferably 1.30 or less.

[24] The dicing die-bonding film according to any one of [1] to [23], wherein the pressure-sensitive adhesive layer contains a crosslinking agent (particularly, a polyisocyanate compound).

[25] The dicing die-bonding film according to [24], wherein the amount of the crosslinking agent is 0.1 to 5 parts by mass based on 100 parts by mass of the base polymer.

[26] The dicing die-bonding film according to any one of [1] to [25], wherein the pressure-sensitive adhesive layer contains a curing catalyst (especially dibutyltin dilaurate).

1: dicing die bond film
10: dicing tape
11: description
12: adhesive layer
20, 21: adhesive layer
W, 30A, 30C: semiconductor wafer
30B: semiconductor wafer split body
30a: split groove
30b: modified area
31: semiconductor chip

Claims (4)

A dicing tape having a laminated structure including a substrate and an adhesive layer,
A peelable adhesive layer attached to the adhesive layer in the dicing tape,
The pressure-sensitive adhesive layer is a dicing die-bonding film having a water contact angle of 110° or less and an arithmetic average surface roughness Ra of 1.0 μm or less on the surface of the side to which the adhesive layer is in close contact. The method of claim 1,
A dicing die-bonding film, wherein a value of the polar component of the surface free energy obtained from Kaelble Uy's equation using the contact angle of water and methylene iodide on the surface of the pressure-sensitive adhesive layer is 0.10 or more. The method according to claim 1 or 2,
The pressure-sensitive adhesive layer is a dicing die-bonding film containing, as a monomer component, an acrylic polymer containing a hydrocarbon group-containing (meth)acrylic acid ester and a hydroxy group-containing monomer which may have an alkoxy group. The method of claim 3,
The said pressure-sensitive adhesive layer contains a polyisocyanate compound as a crosslinking agent, Dicing die-bonding film.

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