KR20200041840A - Producing method of mask integrated frame - Google Patents

Abstract

The present invention relates to a method of manufacturing a mask integrated frame. According to the present invention, the method of manufacturing the mask integrated frame is a method of manufacturing the mask integrated frame in which a plurality of masks and a frame supporting the mask are integrally formed. The method of manufacturing the mask integrated frame comprises the steps of: (a) preparing a mask support template having a mask adhered to a template; (b) preparing a frame having at least one mask cell region; (c) raising a temperature of a process region including the frame in which at least one mask cell region provided to a first temperature; (d) loading the template on the frame to correspond the mask to the mask cell region of the frame; (e) irradiating a laser to the welding portion of the mask to attach the mask to the frame; and (f) lowering the temperature of the process region including the frame to a second temperature.

Description

Method of manufacturing a frame-integrated mask {PRODUCING METHOD OF MASK INTEGRATED FRAME}

The present invention relates to a method of manufacturing a frame-integrated mask. More specifically, the present invention relates to a method of manufacturing a frame-integrated mask capable of stably supporting and moving without deformation of a mask and clarifying alignment between each mask.

As a technique for forming a pixel in an OLED manufacturing process, a FMM (Fine Metal Mask) method is used, in which a thin metal mask is closely adhered to a substrate to deposit an organic material at a desired location.

In the conventional OLED manufacturing process, the mask is manufactured in a stick form, a plate form, etc., and then the mask is welded and fixed to the OLED pixel deposition frame. In one mask, a plurality of cells corresponding to one display may be provided. In addition, several masks can be fixed to the OLED pixel deposition frame for large-area OLED manufacturing. In the process of fixing to the frame, each mask is tensioned to be flat. Adjusting the tensile force so that the entire part of the mask is flat is a very difficult task. In particular, in order to align the mask patterns having a size of only a few to several tens of µm while all cells are flattened, a high-level operation to check the alignment state in real time while finely adjusting the tensile force applied to each side of the mask is required. do.

Nevertheless, in the process of fixing several masks to one frame, there was a problem in that alignment between the masks and between the mask cells did not work well. In addition, because the thickness of the mask film is too thin and large area in the process of welding and fixing the mask to the frame, the mask cell may be damaged or warped by a load, or wrinkles or burrs generated in the welding part in the welding process. There were problems such as misalignment.

In the case of ultra-high-definition OLED, the current QHD image quality is 500 ~ 600 pixel per inch (PPI), and the pixel size reaches about 30 ~ 50㎛, and 4K UHD, 8K UHD high image quality is higher than ~ 860 PPI, ~ 1600 PPI, etc. It has the resolution of. As described above, the alignment error between each cell should be reduced to a few μm in consideration of the pixel size of the ultra-high quality OLED, and an error out of this may lead to product failure, so the yield may be very low. Therefore, there is a need to develop a technique that prevents deformation such as a mask being crushed or distorted, a technique for making alignment clear, and a technique for fixing a mask to a frame.

Therefore, the present invention was devised to solve the problems of the prior art as described above, and the mask can be stably supported and moved without deformation, and the deformation of the mask can be prevented from being crushed or twisted, and the alignment can be made clear. An object of the present invention is to provide a method for manufacturing a frame-integrated mask.

In addition, it is an object of the present invention to provide a method for manufacturing a frame-integrated mask in which the production time is significantly reduced and the yield is significantly increased.

The above object of the present invention is a method of manufacturing a frame-integrated mask in which a plurality of masks and a frame supporting a mask are integrally formed, comprising: (a) preparing a mask support template in which a mask is adhered to a template; (b) preparing a frame having at least one mask cell region; (c) raising a temperature of a process region including a frame having at least one mask cell region to a first temperature; (d) loading a template on the frame to correspond the mask to the mask cell area of the frame; (e) attaching the mask to the frame by irradiating a laser to the welding portion of the mask; And (f) lowering the temperature of the process region including the frame to a second temperature. It is achieved by a method of manufacturing a frame-integrated mask.

The mask is composed of a metal sheet manufactured by a rolling process, and the template may have a higher coefficient of thermal expansion than the mask.

By repeating steps (d) to (f), a plurality of masks may be respectively attached to all mask cell regions of the frame.

The temporary adhesive portion may be an adhesive or adhesive sheet that can be separated by applying heat, or an adhesive or adhesive sheet that can be separated by UV irradiation.

The first temperature is a temperature equal to or higher than the OLED pixel deposition process temperature, the second temperature is at least a temperature lower than the first temperature, the first temperature is any one of 25 ° C to 60 ° C, and the second temperature is the first temperature. The temperature is any one of 20 ° C to 30 ° C lower than 1 temperature, and the OLED pixel deposition process temperature may be any one of 25 ° C to 45 ° C.

In step (c), the mask stretches greater than the intrinsic thermal expansion length and may stretch or equal to or less than the thermal expansion length of the template.

In step (d), the mask on the template may correspond to the mask cell region only by controlling the position of the template without applying tension to the mask.

When the temperature of the process region is lowered to the second temperature in step (f), the mask attached to the frame is contracted to receive tension.

Between steps (e) and (f), the temporary adhesive may further include a step of separating the mask and the template by performing at least one of heat application, chemical treatment, ultrasonic application, and UV application.

In step (a), the mask may be adhered to the template with a tensile force applied in the lateral direction.

The mask may be composed of a metal sheet produced by a rolling or electroforming process.

After step (e), the temporary adhesive is subjected to at least one of heat application, chemical treatment, ultrasonic application, and UV application to separate the mask and the template, and when the template is separated from the mask, tensile force applied to the mask is applied to the frame Can be.

According to the present invention configured as described above, the mask can be stably supported and moved without deformation, and there is an effect of preventing deformation such as the mask being struck or twisted and clarifying the alignment.

In addition, according to the present invention, there is an effect that can significantly reduce the manufacturing time, and significantly increase the yield.

1 is a schematic view showing a conventional OLED pixel deposition mask.
2 is a schematic view showing a process of bonding a conventional mask to a frame.
3 is a schematic diagram showing that an alignment error occurs between cells in the process of stretching a conventional mask.
4 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front view and a side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram showing a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention.
8 is a schematic view showing a mask for forming a conventional high-resolution OLED.
9 is a schematic diagram showing a mask according to an embodiment of the present invention.
10 is a schematic view showing a process of manufacturing a mask metal film according to an embodiment of the present invention by rolling.
11 is a schematic view showing a process of manufacturing a mask metal film according to another embodiment of the present invention by electroforming.
12 is a schematic diagram showing a process of manufacturing a mask support template by laminating a mask on a template according to an embodiment of the present invention.
13 is an enlarged cross-sectional schematic diagram showing a temporary adhesive part according to an embodiment of the present invention.
14 is a schematic diagram showing a process of loading a mask support template on a frame according to an embodiment of the present invention.
15 is a schematic diagram showing a state in which a template is loaded on a frame according to an embodiment of the present invention to associate a mask with a cell region of the frame.
16 is a schematic view showing a process of separating a mask and a template after adhering a mask according to an embodiment of the present invention to a frame.
17 is a schematic diagram showing a state in which a mask according to an embodiment of the present invention is attached to a frame.
18 is a schematic diagram showing an OLED pixel deposition apparatus using an integrated frame mask according to an embodiment of the present invention.
19 is a schematic view showing a state in which a template is loaded on a frame after raising a temperature of a process region according to a second embodiment of the present invention, and a mask is mapped to a cell region of the frame.
20 is a schematic side cross-sectional view showing a process of bonding a frame according to a difference in thermal expansion coefficient of a mask.
21 is a schematic side cross-sectional view showing a series of processes for adhering a mask according to a second embodiment of the present invention to a frame.
22 is a schematic view showing a process of separating a mask and a template after adhering a mask according to a second embodiment of the present invention to a frame.
23 is a schematic diagram showing a state in which a mask according to a second embodiment of the present invention is associated with a cell region of a neighboring frame.
24 is a schematic diagram showing a process of separating a mask and a template after adhering a mask according to a second embodiment of the present invention to a cell region of a neighboring frame.
25 is a schematic diagram showing a state in which a mask according to a second embodiment of the present invention is attached to a frame.
26 is a schematic view showing a process of lowering the temperature of the process region after adhering the mask according to the second embodiment of the present invention to the cell region of the frame.
27 to 28 are schematic diagrams showing a process of adhering a mask according to a third embodiment of the present invention to a template.
29 is a schematic diagram showing a state in which a template is loaded on a frame according to a third embodiment of the present invention to associate a mask with a cell region of the frame.
30 is a schematic view showing a process of separating a mask and a template after adhering a mask according to a third embodiment of the present invention to a frame.
31 is a schematic diagram showing a state in which a mask according to a third embodiment of the present invention is attached to a cell region of a frame.

For a detailed description of the present invention, which will be described later, reference is made to the accompanying drawings that illustrate, by way of example, specific embodiments in which the invention may be practiced. These examples are described in detail enough to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain shapes, structures, and properties described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in relation to one embodiment. In addition, it should be understood that the location or placement of individual components within each disclosed embodiment can be changed without departing from the spirit and scope of the invention. Therefore, the following detailed description is not intended to be taken in a limiting sense, and the scope of the present invention, if appropriately described, is limited only by the appended claims, along with all ranges equivalent to those claimed. In the drawings, similar reference numerals refer to the same or similar functions across various aspects, and length, area, thickness, and the like may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those skilled in the art to easily implement the present invention.

1 is a schematic diagram showing a conventional OLED pixel deposition mask 10.

Referring to FIG. 1, the conventional mask 10 may be manufactured in a stick-type or plate-type. The mask 10 shown in (a) of FIG. 1 is a stick-shaped mask and can be used by welding and fixing both sides of the stick to an OLED pixel deposition frame. The mask 100 illustrated in FIG. 1B is a plate-type mask and may be used in a large area pixel formation process.

The body 10 of the mask 10 (or the mask film 11) is provided with a plurality of display cells C. One cell C corresponds to one display such as a smartphone. The pixel pattern P is formed in the cell C to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, the pixel pattern P is formed in the cell C to have a resolution of 70 X 140. That is, a number of pixel patterns P form a cluster to form one cell C, and a plurality of cells C may be formed on the mask 10.

2 is a schematic view showing a process of bonding the conventional mask 10 to the frame 20. 3 is a schematic diagram showing that alignment errors between cells occur in the process of tensioning (F1 to F2) of the conventional mask 10. The stick mask 10 having six cells C: C1 to C6 shown in FIG. 1A will be described as an example.

Referring to (a) of FIG. 2, first, the stick mask 10 must be flattened. The stick mask 10 is stretched as it is pulled by applying tensile force F1 to F2 in the long axis direction of the stick mask 10. In this state, the stick mask 10 is loaded on the frame 20 in the form of a square frame. The cells C1 to C6 of the stick mask 10 are positioned in an empty area inside the frame of the frame 20. The frame 20 may be sized such that cells C1 to C6 of one stick mask 10 are positioned in an empty area inside the frame, and cells C1 to C6 of the plurality of stick masks 10 are framed. It may be large enough to be located in the interior empty area.

Referring to (b) of FIG. 2, after aligning while finely adjusting the tensile forces F1 to F2 applied to each side of the stick mask 10, a part of the side of the stick mask 10 is welded (W) to Accordingly, the stick mask 10 and the frame 20 are interconnected. Fig. 2 (c) shows a cross-section of a stick mask 10 and a frame connected to each other.

Referring to Figure 3, despite the fine adjustment of the tensile force (F1 ~ F2) applied to each side of the stick mask 10, there is a problem that the alignment between the mask cells (C1 ~ C3) does not work well. For example, the distances D1 to D1 "and D2 to D2" between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. The stick mask 10 is a large area including a plurality of (for example, six) cells C1 to C6 and has a very thin thickness of several tens of μm, so it is easily struck or distorted by a load. In addition, it is very difficult to check in real time the alignment between the cells (C1 to C6) while adjusting the tensile force (F1 to F2) so that all the cells (C1 to C6) are flat.

Therefore, the fine error of the tensile force (F1 ~ F2) may cause an error in the degree of stretching or unfolding each cell (C1 ~ C3) of the stick mask 10, accordingly, the distance (D1) between the mask pattern (P) ~ D1 ", D2 ~ D2") causes a problem that is different. Of course, it is difficult to perfectly align the error to 0, but in order to prevent the mask pattern P having a size of several to several tens of µm from adversely affecting the pixel process of the ultra-high-definition OLED, the alignment error does not exceed 3 µm. It is desirable not to. The alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition, while connecting the plurality of stick masks 10 of approximately 6 to 20 to one of the frame 20, between the plurality of stick masks 10 and the plurality of cells C of the stick mask 10 It is also very difficult to clarify the alignment between ~ C6), and it is a significant reason to reduce productivity because the process time due to the alignment is forced to increase.

On the other hand, after the stick mask 10 is connected and fixed to the frame 20, the tensile forces F1 to F2 applied to the stick mask 10 may act on the frame 20 in reverse. That is, after the stick mask 10, which has been stretched tightly by the tensile forces F1 to F2, is connected to the frame 20, tension may be applied to the frame 20. Usually this tension is not large, so it may not have a significant effect on the frame 20, but if the size of the frame 20 is small and the rigidity is low, this tension can deform the frame 20 finely. This may cause a problem that the alignment state is wrong between the plurality of cells C to C6.

Accordingly, the present invention proposes a frame 200 and a frame-integrated mask that enable the mask 100 to form an integral structure with the frame 200. The mask 100 integrally formed in the frame 200 is prevented from being deformed, such as being struck or twisted, and can be clearly aligned with the frame 200. When the mask 100 is connected to the frame 200, any tension is not applied to the mask 100, so that the tension of the frame 200 is not deformed after the mask 100 is connected to the frame 200. . In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 is significantly reduced, and the yield can be significantly increased.

Figure 4 is a front view showing a frame-integrated mask according to an embodiment of the present invention [Fig. 4 (a)] and side cross-sectional view [Fig. 4 (b)], Figure 5 according to an embodiment of the present invention It is a front view (FIG. 5 (a)) and a side cross-sectional view (FIG. 5 (b)) showing the frame.

4 and 5, the frame-integrated mask may include a plurality of masks 100 and one frame 200. In other words, the plurality of masks 100 are bonded to the frame 200 one by one. Hereinafter, for convenience of explanation, the mask 100 having a square shape will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped on both sides before being adhered to the frame 200, and the frame 200 ), The protrusions can be removed.

A plurality of mask patterns P may be formed in each mask 100, and one cell C may be formed in one mask 100. One mask cell C may correspond to one display such as a smartphone.

The mask 100 may be made of an invar having a coefficient of thermal expansion of about 1.0 X 10 ^-6 / ° C, and a super invar of about 1.0 X 10 ^-7 / ° C. Since the mask 100 of this material has a very low coefficient of thermal expansion, it is less likely that the pattern shape of the mask is deformed by thermal energy, and thus can be used as a fine metal mask (FMM) or shadow mask in manufacturing a high-resolution OLED. In addition, considering that technologies for performing a pixel deposition process in a range in which the temperature change value is not large recently, the mask 100 has nickel (Ni), nickel-cobalt (Ni-Co) having a slightly higher thermal expansion coefficient than this. ). The mask 100 may use a metal sheet produced by rolling, electroforming, etc., but considering the thermal expansion coefficient, it is preferable to use a metal sheet produced by a rolling process.

The frame 200 is formed to allow the plurality of masks 100 to adhere. The frame 200 may include various edges formed in a first direction (for example, a horizontal direction) and a second direction (for example, a vertical direction) including the outermost border. These various corners may partition the region to which the mask 100 is to be adhered on the frame 200.

The frame 200 may include a frame frame 210 having a substantially square shape or a square frame shape. The inside of the frame portion 210 may be hollow. That is, the border frame unit 210 may include a hollow region R. The frame 200 may be made of a metal material such as invar, super invar, aluminum, titanium, etc., and is composed of invar, super invar, nickel, nickel-cobalt, etc. having the same thermal expansion coefficient as the mask in consideration of thermal deformation. Preferably, these materials can be applied to both the frame portion 210 of the frame 200, the mask cell sheet portion 220.

In addition to this, the frame 200 may include a plurality of mask cell regions CR, and may include a mask cell sheet portion 220 connected to the edge frame portion 210. The mask cell sheet portion 220 may be formed by rolling similarly to the mask 100, or may be formed using other film forming processes such as electroforming, but considering the thermal expansion coefficient, it is preferable to use the one formed by the rolling process. desirable. In addition, the mask cell sheet unit 220 may be connected to the edge frame unit 210 after forming a plurality of mask cell regions CR through laser scribing, etching, or the like on a flat sheet. Alternatively, the mask cell sheet unit 220 may form a plurality of mask cell regions CR through laser scribing, etching, or the like after connecting a planar sheet to the edge frame unit 210. In the present specification, a plurality of mask cell regions CR are first formed on the mask cell sheet portion 220, and then, it is mainly assumed to be connected to the edge frame portion 210.

The mask cell sheet unit 220 may include at least one of the edge sheet unit 221 and the first and second grid sheet units 223 and 225. The border sheet portions 221 and the first and second grid sheet portions 223 and 225 refer to portions divided in the same sheet, and they are integrally formed with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Therefore, the edge sheet portion 221 may have an approximately square shape and a square frame shape corresponding to the edge frame portion 210.

In addition, the first grid sheet portion 223 may be formed to extend in the first direction (horizontal direction). The first grid sheet portion 223 is formed in a straight shape so that both ends may be connected to the edge sheet portion 221. When the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, it is preferable that each of the first grid sheet portions 223 has equal intervals.

In addition, in addition to this, the second grid sheet portion 225 may be formed to extend in the second direction (vertical direction). The second grid sheet portion 225 may be formed in a straight line shape, and both ends may be connected to the edge sheet portion 221. The first grid sheet portion 223 and the second grid sheet portion 225 may cross each other vertically. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, it is preferable that each second grid sheet portion 225 has an equal interval.

Meanwhile, an interval between the first grid sheet parts 223 and an interval between the second grid sheet parts 225 may be the same or different depending on the size of the mask cell C.

The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of the cross section perpendicular to the longitudinal direction may be a rectangular shape, a rectangular shape such as a parallelogram, a triangular shape, or the like. , The sides and corners may be rounded. The cross-sectional shape can be adjusted in processes such as laser scribing and etching.

The thickness of the frame portion 210 may be thicker than the thickness of the mask cell sheet portion 220. The border frame portion 210 may be formed to a thickness of several mm to several cm because it is responsible for the overall rigidity of the frame 200.

In the case of the mask cell sheet portion 220, the process of manufacturing a substantially thick sheet is difficult, and if it is too thick, the organic material source 600 (see FIG. 18) passes through the mask 100 in the OLED pixel deposition process. This can cause clogging problems. Conversely, if the thickness is too thin, it may be difficult to secure rigidity sufficient to support the mask 100. Accordingly, the mask cell sheet portion 220 is thinner than the thickness of the frame portion 210, but is preferably thicker than the mask 100. The thickness of the mask cell sheet portion 220 may be formed about 0.1 mm to 1 mm. In addition, the widths of the first and second grid sheet portions 223 and 225 may be formed to about 1 to 5 mm.

A plurality of mask cell regions CR: CR11 to CR56 may be provided except for regions occupied by the border sheet portions 221 and the first and second grid sheet portions 223 and 225 in the planar sheet. In another aspect, the mask cell region CR is an area occupied by the border sheet portions 221 and the first and second grid sheet portions 223 and 225 in the hollow region R of the border frame portion 210. Except for, it may mean an empty area.

As the cell C of the mask 100 corresponds to the mask cell region CR, it can be used as a passage through which the pixels of the OLED are substantially deposited through the mask pattern P. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P constituting one cell C may be formed in one mask 100. Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell area CR of the frame 200, but the clear alignment of the mask 100 may be performed. For this, it is necessary to avoid the large area mask 100, and the small area mask 100 having one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200. In this case, for clear alignment, it may be considered to correspond to the mask 100 having a small number of cells C of 2-3.

The frame 200 includes a plurality of mask cell regions CR, and each of the masks 100 may be adhered so that one mask cell C corresponds to the mask cell region CR. Each mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy around the mask cell C (corresponding to a portion of the mask film 110 excluding the cell C). have. The dummy may include only the mask film 110 or may include the mask film 110 on which a predetermined dummy pattern having a shape similar to the mask pattern P is formed. The mask cell C corresponds to the mask cell area CR of the frame 200, and a part or all of the dummy may be adhered to the frame 200 (mask cell sheet portion 220). Accordingly, the mask 100 and the frame 200 can achieve an integral structure.

On the other hand, according to another embodiment, the frame is not manufactured by adhering the mask cell sheet portion 220 to the border frame portion 210, the border frame portion 210 in the hollow region (R) portion of the border frame portion 210 ) And a frame in which a grid frame (corresponding to the grid sheet portions 223 and 225) integrally formed directly may be used. This type of frame also includes at least one mask cell region CR, and it is possible to manufacture a frame-integrated mask by matching the mask 100 to the mask cell region CR.

Hereinafter, a process of manufacturing the frame-integrated mask will be described.

First, the frame 200 described above with reference to FIGS. 4 and 5 may be provided. 6 is a schematic diagram showing a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to (a) of FIG. 6, a border frame unit 210 is provided. The border frame part 210 may have a rectangular frame shape including the hollow region R.

Next, referring to FIG. 6B, a mask cell sheet portion 220 is manufactured. The mask cell sheet portion 220 is manufactured by manufacturing a flat sheet using a rolling, electroplating, or other film forming process, and then removing the mask cell region CR through laser scribing, etching, or the like. can do. In this specification, description will be given taking an example in which 6 X 5 mask cell regions CR: CR11 to CR56 are formed. Five first grid sheet portions 223 and four second grid sheet portions 225 may be present.

Next, the mask cell sheet portion 220 may correspond to the border frame portion 210. In the process of matching, by stretching (F1 to F4) all sides of the mask cell sheet portion 220, the mask cell sheet portion 220 is flattened and the border sheet portion 221 is attached to the border frame portion 210. You can respond. One side can hold and hold the mask cell sheet portion 220 with several points (eg, 1 to 3 points in FIG. 6 (b), for example). On the other hand, the mask cell sheet portion 220 may be tensioned (F1, F2) along some side directions rather than all sides.

Next, when the mask cell sheet portion 220 corresponds to the edge frame portion 210, the edge sheet portion 221 of the mask cell sheet portion 220 may be welded (W) to be adhered. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 can be firmly adhered to the frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 to reduce the excitation space between the edge frame portion 210 and the mask cell sheet portion 220 as much as possible to increase adhesion. The welding (W) portion may be generated in the form of a line or a spot, and has the same material as the mask cell sheet portion 220 and integrally forms the border frame portion 210 and the mask cell sheet portion 220. It can be a medium to connect to.

7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6, the mask cell sheet portion 220 having the mask cell region CR is first manufactured and adhered to the border frame portion 210. However, in the embodiment of FIG. 7, the flat sheet of the border frame portion ( After adhesion to 210), a portion of the mask cell region CR is formed.

First, as illustrated in (a) of FIG. 6, a border frame portion 210 including a hollow region R is provided.

Next, referring to (a) of FIG. 7, a flat sheet (the flat mask cell sheet part 220 ′) may correspond to the border frame part 210. The mask cell sheet portion 220 ′ is in a planar state in which the mask cell region CR is not yet formed. In the process of matching, all sides of the mask cell sheet portion 220 'are tensioned (F1 to F4), so that the mask cell sheet portion 220' can be flattened to correspond to the border frame portion 210. One side can hold and hold the mask cell sheet portion 220 'with several points (for example, 1 to 3 points in FIG. 7 (a)). On the other hand, the mask cell sheet portion 220 'may be tensioned (F1, F2) along some side directions rather than all sides.

Next, if the mask cell sheet portion 220 'corresponds to the edge frame portion 210, the edge portion of the mask cell sheet portion 220' may be welded (W) to adhere. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 'can be firmly adhered to the edge frame portion 220. The welding (W) should be performed as close as possible to the edge of the edge frame portion 210 to minimize the excitation space between the edge frame portion 210 and the mask cell sheet portion 220 'and increase adhesion. The welding (W) portion may be generated in the form of a line or a spot, and has the same material as the mask cell sheet portion 220 ', and the frame portion 210 and the mask cell sheet portion 220'. It can be a medium to integrally connect.

Next, referring to FIG. 7B, a mask cell region CR is formed on a planar sheet (planar mask cell sheet portion 220 '). The mask cell region CR may be formed by removing the sheet of the mask cell region CR portion through laser scribing, etching, or the like. In this specification, description will be given taking an example in which 6 X 5 mask cell regions CR: CR11 to CR56 are formed. When the mask cell region CR is formed, the edge frame portion 210 and the welded (W) portion become the edge sheet portion 221, and the five first grid sheet portions 223 and the four second grids The mask cell sheet portion 220 having the sheet portion 225 may be configured.

8 is a schematic view showing a mask for forming a conventional high-resolution OLED.

In order to realize a high-resolution OLED, the size of the pattern is decreasing, and the thickness of the mask metal film used for this needs to be reduced. As shown in FIG. 8 (a), in order to implement a high-resolution OLED pixel 6, the pixel spacing and pixel size in the mask 10 'must be reduced (PD-> PD'). In addition, in order to prevent the OLED pixel 6 from being unevenly deposited by the shadow effect, it is necessary to form the pattern of the mask 10 ′ inclined 14. However, in the process of forming the pattern inclined (14) on the thick mask 10 'having a thickness T1 of about 30 to 50 µm, patterning 13 that matches the fine pixel spacing PD' and the pixel size Since it is difficult to do this, it may cause the yield to deteriorate in the processing step. In other words, in order to form the pattern 14 with a fine pixel spacing PD ', a thin mask 10' must be used.

In particular, for high resolution of UHD level, as shown in FIG. 8 (b), it is possible to perform fine patterning by using a thin mask 10 'having a thickness T2 of about 20 µm or less. In addition, for ultra-high resolution of UHD or higher, the use of a thin mask 10 'having a thickness T2 of about 10 mu m may be considered.

9 is a schematic diagram showing a mask 100 according to an embodiment of the present invention.

The mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM around the mask cell C. It has been described above that the mask 100 may be manufactured from a metal sheet produced by a rolling process, electroplating, or the like, and that one cell C may be formed in the mask 100. The dummy DM corresponds to a portion of the mask film 110 (the mask metal film 110) excluding the cell C, and includes only the mask film 110 or a predetermined dummy having a shape similar to the mask pattern P The patterned mask layer 110 may be included. In the dummy DM, a part or all of the dummy DM may be adhered to the frame 200 (the mask cell sheet unit 220) corresponding to the edge of the mask 100.

The width of the mask pattern P may be smaller than 40 μm, and the thickness of the mask 100 may be about 5-20 μm. Since the frame 200 includes a plurality of mask cell regions (CR: CR11 to CR56), a mask 100 having mask cells (C: C11 to C56) corresponding to each of the mask cell regions (CR: CR11 to CR56) ) Can also be provided in plural.

The one surface 101 of the mask 100 is preferably flat because it is a surface to be contacted and adhered to the frame 200. In a planarization process, which will be described later, one surface 101 may be flattened and mirrored. The other surface 102 of the mask 100 may face one surface of the template 50 to be described later.

Hereinafter, the mask metal film 110 ′ is manufactured, and the mask 100 is supported by supporting the template 50, and the template 50 supported by the mask 100 is loaded on the frame 200. A series of processes for manufacturing the frame-integrated mask as the mask 100 is adhered to the frame 200 will be described.

10 is a schematic view showing a process of manufacturing a mask metal film according to an embodiment of the present invention by rolling. 11 is a schematic view showing a process of manufacturing a mask metal film according to another embodiment of the present invention by electroforming.

First, the mask metal film 110 may be prepared. As an embodiment, the mask metal film 110 may be prepared by a rolling method.

Referring to (a) of FIG. 10, a metal sheet produced by a rolling process may be used as the mask metal film 110 ′. The metal sheet produced by the rolling process may have a thickness of tens to hundreds of μm in the manufacturing process. As described above with reference to FIG. 8, a fine mask pattern can be used only by using a thin mask metal film 110 having a thickness of about 20 μm or less for high resolution of UHD level, and a thickness of about 10 μm for ultra high resolution of UHD or higher. A thin mask metal film 110 having a must be used. However, since the mask metal film 110 ′ generated by the rolling process has a thickness of about 25 to 500 μm, it is necessary to make the thickness thinner.

Therefore, a process of flattening (PS) one surface of the mask metal layer 110 ′ may be further performed. Here, the planarization (PS) means that the one surface (upper surface) of the mask metal film 110 'is mirrored, and at the same time, the upper portion of the mask metal film 110' is partially removed to reduce the thickness. Planarization (PS) may be performed by a chemical mechanical polishing (CMP) method, and a known CMP method may be used without limitation. In addition, the thickness of the mask metal layer 110 ′ may be reduced by chemical wet etching or dry etching. In addition to this, a process capable of flattening the thickness of the mask metal film 110 ′ can be used without limitation.

In the process of performing the planarization (PS), for example, in the CMP process, the surface roughness R _a of the upper surface of the mask metal layer 110 ′ may be controlled. Preferably, mirroring may be performed in which the surface roughness is further reduced. Alternatively, as another example, after performing a planarization (PS) by performing a chemical wet etching or dry etching process, a surface roughness (R _a ) may be reduced by adding a polishing process such as a separate CMP process.

As such, the thickness of the mask metal film 110 ′ can be made thinner than about 50 μm. Accordingly, the thickness of the mask metal film 110 is preferably formed to about 2 μm to 50 μm, and more preferably, the thickness can be formed to about 5 μm to 20 μm. However, it is not necessarily limited thereto.

Referring to FIG. 10 (b), as in FIG. 10 (a), the mask metal film 110 may be manufactured by reducing the thickness of the mask metal film 110 ′ manufactured by the rolling process. However, the mask metal layer 110 ′ may be reduced in thickness by performing a planarization (PS) process in a state of being attached to the template 50 to be described later via a temporary adhesive portion 55.

As another embodiment, the mask metal film 110 may be prepared by electroplating.

Referring to (a) of FIG. 11, a conductive substrate 21 is prepared. In order to perform electroforming, the base material 21 of the mother plate may be a conductive material. The base plate can be used as a cathode electrode in electroplating.

As a conductive material, in the case of metal, metal oxides may be generated on the surface, impurities may be introduced in a metal manufacturing process, and in the case of a polycrystalline silicon substrate, inclusions or grain boundaries may exist, and a conductive polymer In the case of a substrate, there is a high likelihood that impurities are contained, and strength. Acid resistance may be vulnerable. Elements that prevent the electric field from being uniformly formed on the surface of the mother plate (or cathode body), such as metal oxides, impurities, inclusions, and grain boundaries, are referred to as "defects". Due to the defect, a uniform electric field is not applied to the cathode body of the above-described material, so that a part of the plating film 110 (or the mask metal film 110) may be formed non-uniformly.

In realizing ultra-high-definition pixels of UHD level or higher, non-uniformity of the plating film and the plating film pattern (mask pattern P) may adversely affect the formation of pixels. For example, the current QHD image quality is 500 to 600 PPI (pixel per inch), and the pixel size reaches about 30 to 50㎛, and for 4K UHD and 8K UHD high image quality, higher than ~ 860 PPI and ~ 1600 PPI It has the same resolution. A micro display applied directly to a VR device, or a micro display used to be inserted into a VR device, aims to achieve an ultra-high quality of about 2,000 PPI or higher, and the pixel size reaches about 5 to 10 μm. Since the pattern width of the FMM and shadow mask applied to it can be formed to a size of several to several tens of µm, preferably less than 30 µm, even a defect of several µm in size takes up a large portion of the pattern size of the mask. to be. In addition, in order to remove defects in the cathode body of the above-described material, an additional process for removing metal oxide, impurities, etc. may be performed, and in this process, other defects such as etching of the cathode body material may be caused. have.

Therefore, the present invention can use a single crystal base plate (or a cathode body). In particular, it is preferably a single crystal silicon material. To have conductivity, a high concentration doping of 10 ¹⁹ / cm ³ or more may be performed on the single crystal silicon base plate. Doping may be performed on the entire base plate, or may be performed only on the surface portion of the base plate.

On the other hand, as a single crystal material, metals such as Ti, Cu, Ag, GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge and other semiconductors, graphite (graphite), graphene (graphene), etc. _{, CH 3 NH 3 PbCl 3,} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures Etc. can be used. In the case of metal and carbon-based materials, they are basically conductive materials. In the case of a semiconductor material, doping with a high concentration of 10 ¹⁹ / cm ³ or more may be performed to have conductivity. For other materials, conductivity may be formed by performing doping or by forming oxygen vacancy. Doping may be performed on the entire base plate, or may be performed only on the surface portion of the base plate.

In the case of a single crystal material, since there are no defects, there is an advantage in that a uniform plating film 110 can be generated due to the formation of a uniform electric field on all surfaces during electroforming. The frame-integrated masks 100 and 200 manufactured through a uniform plating film can further improve the quality level of the OLED pixels. In addition, since there is no need to perform an additional process for removing and eliminating defects, there is an advantage in that the process cost is reduced and productivity is improved.

Referring back to Figure 11 (a), next, using a conductive substrate 21 as a base plate (cathode body (Cathode Body)), the anode body (not shown) to be spaced apart on the conductive substrate 21 A plating film 110 (or a mask metal film 110) may be formed by electroplating. The plating film 110 may be formed on the exposed top and side surfaces of the conductive substrate 21 facing the positive electrode body and having an electric field. In addition to the side surface of the conductive substrate 21, the plating film 110 may be formed even on a part of the lower surface of the conductive substrate 21.

Next, the edge portion of the plated film 110 is cut (D) with a laser, or a photoresist layer is formed on the plated film 110 and the exposed portion of the plated film 110 is etched and removed (D). You can. Accordingly, as shown in (b) of FIG. 11, the plated film 110 can be separated from the conductive substrate 21.

On the other hand, before separating the plated film 110 from the conductive substrate 21, heat treatment (H) may be performed. The present invention is to reduce the thermal expansion coefficient of the mask 100 and at the same time to prevent deformation by the heat of the mask 100 and the mask pattern (P), the plating film from the conductive substrate 21 (or mother plate, cathode body) ( 110) is characterized in that heat treatment (H) is performed before separation. The heat treatment may be performed at a temperature of 300 ° C to 800 ° C.

Generally, the thermal expansion coefficient of the invar thin plate produced by electroforming is higher than that of the inba thin plate produced by rolling. Thus, the thermal expansion coefficient can be lowered by performing heat treatment on the thin film of Invar, and peeling, deformation, etc. may occur on the thin film of Invar during this heat treatment. This is a phenomenon that occurs because only the Inba thin plate is heat treated or the Inba thin plate temporarily adhered only to the upper surface of the conductive substrate 21 is heat treated. However, in the present invention, since the plating film 110 is formed not only on the upper surface of the conductive substrate 21 but also on a part of the side surface and the lower surface, peeling, deformation, or the like does not occur even when the heat treatment H is performed. In other words, since the heat treatment is performed in a state in which the conductive substrate 21 and the plating film 110 are closely adhered, there is an advantage of preventing peeling, deformation, etc. due to heat treatment, and stably performing heat treatment.

The thickness of the mask metal film 110 generated by the electroplating process may be thinner than the rolling process. Accordingly, the planarization (PS) process of reducing the thickness may be omitted, but the etching characteristics may be different depending on the composition, crystal structure / fine structure of the surface layer of the plating mask metal film 110 ′, and thus planarization (PS) It is necessary to control the surface properties and thickness through.

12 is a schematic diagram showing a process of manufacturing a mask support template by laminating the mask 100 on the template 50 according to an embodiment of the present invention.

First, the mask 100 on which a plurality of mask patterns P are formed may be prepared. The mask 100 described above in FIG. 9 may be prepared, and the mask pattern P may be formed using a known patterning method using etching using a lithography process, laser etching, or the like.

Next, referring to (a) of FIG. 12, a template 50 may be provided. The template 50 is a medium through which the mask 100 is attached on one surface and can be moved in a supported state. One surface of the template 50 is preferably flat so as to support and move the flat mask 100. The central portion 50a may correspond to the mask cell C of the mask 100, and the edge portion 50b may correspond to the dummy DM of the mask metal film 110. The size of the template 50 may be the same or larger than that of the mask 100 so that the mask 100 can be attached to the entire flat surface.

The template 50 is preferably a transparent material so that it is easy to observe vision and the like in the process of aligning and adhering the mask 100 to the frame 200. In addition, the laser may penetrate through a transparent material. As a transparent material, glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, zirconia, soda-lime glass , Low-iron glass or the like can be used. For example, in consideration of the coefficient of thermal expansion between the mask 100, the template 50 may be used BOROFLOAT ^® 33 material having an excellent heat resistance of the borosilicate glass, chemical durability, mechanical strength and transparency.

On the other hand, in the template 50, one surface in contact with the mask metal film 110 is a mirror surface so that an air gap does not occur between the interface with the mask metal film 110 (or the mask 100). You can. In consideration of this, the surface roughness (Ra) of one surface of the template 50 may be 100 nm or less. To implement the template 50 having a surface roughness (Ra) of 100 nm or less, the template 50 may use a wafer. The wafer has a surface roughness (Ra) of about 10 nm, and there are many commercial products and many surface treatment processes, so it can be used as a template 50. Since the surface roughness (Ra) of the template (50) is nm-scale, there is no or little air gap, and it is easy to generate the weld beads (WB) by laser welding, thereby affecting the alignment error of the mask pattern (P). May not give.

The template 50 according to an embodiment of the present invention may have a higher coefficient of thermal expansion than the mask 100 / mask metal film 110. As an example, assuming the case where the mask 100 / mask metal film 110 uses an invar sheet manufactured by a rolling process, the thermal expansion coefficient of the mask is about 1.0 × 10 ⁻⁶ / ° C. Therefore, the template 50 may use a material having a coefficient of thermal expansion larger than this, and a material having a coefficient of thermal expansion of about 2.0 X 10 ^-6 / ° C to 20.0 X 10 ^-6 / ° C. If the coefficient of thermal expansion of the template 50 is too large, the deviation of the heat of the mask 100 and the template 50 becomes too large, so that control may not be easy. Taking this into consideration, among the above materials, a wafer (about 3.0 X 10 ^-6 / ° C), soda-lime glass (about 9 X 10 ^-6 / ° C), low iron glass (low-rion glass) (about 8 X 10 ^-6 / ℃), BOROFLOAT ^® 33 (about 3.3 X 10 ^-6 / ℃), alumina (about 4 X 10 ^-6 ~ 11 X 10 ^-6 / ℃), zirconia (of borosilicate glass) It is preferred to use a template 50 comprising about 10 X 10 ^-6 / ° C). The behavior of the template 50 and the mask 100 according to the thermal expansion coefficient will be described later in FIGS. 20 to 22.

The template 50 has a laser through hole 51 in the template 50 so that the laser L irradiated from the upper part of the template 50 can reach the welding part (WP, area to perform welding) of the mask 100. ) May be formed. The laser through-hole 51 may be formed in the template 50 to correspond to the position and number of the welding part WP. Since a plurality of welding parts WP are disposed at predetermined intervals at the edge or dummy DM portion of the mask 100, a plurality of laser passing holes 51 may also be formed at predetermined intervals to correspond thereto. As an example, since a plurality of welding parts are disposed at predetermined intervals on both sides (left / right) dummy DM portions of the mask 100, the laser through holes 51 also have templates 50 on both sides (left / right). A plurality may be formed along a predetermined interval.

The laser through-hole 51 does not necessarily correspond to the position and number of the welding parts WP. For example, it is also possible to perform welding by irradiating the laser L only on a part of the laser through holes 51. In addition, some of the laser through holes 51 that do not correspond to the welding part WP may be used instead of the alignment mark when aligning the mask 100 and the template 50. If the material of the template 50 is transparent to the laser (L) light, the laser through hole 51 may not be formed.

On the other hand, as well as the laser (L), it is applied from the upper portion of the template 50, as long as it reaches the welding portion (WP) of the mask 100 within the range that can perform welding other forms of energy ("welding energy") ). In this case, the laser through hole 51 may be referred to as a through hole 51.

A temporary adhesive portion 55 may be formed on one surface of the template 50. Temporary adhesive portion 55, the mask 100 (or mask metal film 110) is temporarily adhered to one surface of the template 50 until the mask 100 is adhered to the frame 200 on the template 50 It can be supported by.

The temporary adhesive 55 may use an adhesive or adhesive sheet (thermal release type) that can be separated by applying heat, or an adhesive or adhesive sheet (UV release type) that can be separated by UV irradiation.

As an example, the temporary adhesive 55 may use liquid wax. The liquid wax may be the same as the wax used in the polishing step of a semiconductor wafer or the like, and the type is not particularly limited. Liquid wax is a resin component for controlling adhesion, impact resistance, etc., mainly related to holding power, and may include materials and solvents such as acrylic, vinyl acetate, nylon, and various polymers. As an example, the temporary adhesive portion 55 may be SKYLIQUID ABR-4016 including acrylonitrile butadiene rubber (ABR) as a resin component and n-propyl alcohol as a solvent component. The liquid wax may be formed on the temporary adhesive portion 55 using spin coating.

The temporary adhesive portion 55, which is a liquid wax, has a low viscosity at a temperature higher than 85 ° C to 100 ° C, and a high viscosity at a temperature lower than 85 ° C and can be partially hardened like a solid, thereby fixing the mask 100 and the template 50 Can be glued.

The present invention is characterized in that the mask support template is manufactured by laminating the mask 100 and the template 50 after the mask 100 and the template 50 are respectively formed with the mask pattern P formed thereon.

Referring to (b) of FIG. 12, the mask 100 may be adhered to the template 50. After the liquid wax is heated to 85 ° C. or higher and the mask 100 is brought into contact with the template 50, adhesion may be performed by passing the mask 100 and the template 50 between rollers.

According to one embodiment, the template 50 is vaporized for about 120 ° C. for 60 seconds to vaporize the solvent of the temporary adhesive portion 55, and immediately, a mask metal film lamination process may be performed. . The lamination may be performed by loading the mask 100 on the template 50 having the temporary adhesive portion 55 formed on one surface, and passing it between the upper roll at about 100 ° C and the lower roll at about 0 ° C. As a result, the mask 100 may be contacted via the temporary adhesive portion 55 on the template 50.

13 is an enlarged cross-sectional schematic view showing a temporary adhesive portion 55 according to an embodiment of the present invention. As another example, the temporary adhesive 55 may use a thermal release tape. The core film 56, such as a PET film, is disposed in the center of the heat release tape, and a heat release adhesive (thermal release adhesive) 57a, 57b is disposed on both sides of the core film 56, and the adhesion layer 57a , 57b), the release film / release film 58a, 58b may be disposed. Here, the adhesive layers 57a and 57b disposed on both sides of the core film 56 may have different temperatures from being peeled off from each other.

According to one embodiment, in a state in which the release film / release film 58a, 58b is removed, the lower surface of the heat release tape (second adhesive layer 57b) is adhered to the template 50, and the top of the heat release tape The surface (first adhesive layer 57a) may be adhered to the mask metal film 110 '. Since the first adhesive layer 57a and the second adhesive layer 57b have different peeling temperatures, when separating the template 50 from the mask 100 in FIG. 22 to be described later, the first adhesive layer 57a The mask 100 may be separated from the template 50 and the temporary adhesive part 55 by applying the heat to be peeled off.

As described above, the mask support template according to an embodiment of the present invention, after manufacturing the mask 100 and the template 50, respectively, the mask pattern P is formed, the mask 100 and the template 50 are temporarily bonded ( Since manufacturing can be completed by laminating through 55), the manufacturing process has a simple advantage.

Since the frame 200 includes a plurality of mask cell regions (CR: CR11 to CR56), a mask 100 having mask cells (C: C11 to C56) corresponding to each of the mask cell regions (CR: CR11 to CR56) ) Can also be provided in plural. In addition, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.

14 is a schematic diagram showing a process of loading a mask support template on a frame according to an embodiment of the present invention.

14, the template 50 may be transferred by a vacuum chuck (90). The vacuum chuck 90 may adsorb and transfer the opposite side of the template 50 surface to which the mask 100 is adhered. The vacuum chuck 90 may be connected to moving means (not shown) that is moved in the x, y, z, and θ axes. Further, the vacuum chuck 90 may be connected to a flip means (not shown) capable of adsorbing and flipping the template 50. As shown in (b) of FIG. 14, after the vacuum chuck 90 adsorbs and flips the template 50, in the process of transferring the template 50 onto the frame 200, the mask 100 There is no effect on the adhesion state and alignment state.

15 is a schematic diagram showing a state in which a template is loaded on a frame according to an embodiment of the present invention to associate a mask with a cell region of the frame. In FIG. 15, it is illustrated that one mask 100 corresponds to / adhesively adheres to the cell region CR, but the mask 100 is framed 200 by simultaneously correlating the plurality of masks 100 to all the cell regions CR. ) May be performed.

Next, referring to FIG. 15, the mask 100 may correspond to one mask cell area CR of the frame 200. By loading the template 50 on the frame 200 (or the mask cell sheet unit 220), the mask 100 may correspond to the mask cell area CR. While controlling the position of the template 50 / vacuum chuck 90, it can be seen whether the mask 100 corresponds to the mask cell region CR through a microscope. Since the template 50 compresses the mask 100, the mask 100 and the frame 200 can be in close contact.

Meanwhile, the lower support 70 may be further disposed under the frame 200. The lower support 70 may have a size sufficient to fit within the hollow region R of the frame edge portion 210 and may be flat. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet portion 220 may be formed on the upper surface of the lower support 70. In this case, the edge sheet portions 221 and the first and second grid sheet portions 223 and 225 are fitted into the support grooves, so that the mask cell sheet portion 220 can be more secured.

The lower support 70 may compress the opposite surface of the mask cell region CR in contact with the mask 100. That is, the lower support 70 supports the mask cell sheet portion 220 in an upward direction to prevent the mask cell sheet portion 220 from sagging in the downward direction during the bonding process of the mask 100. At the same time, since the lower support 70 and the template 50 compress the frame and the frame 200 (or the mask cell sheet portion 220) of the mask 100 in opposite directions, the mask 100 The alignment state of can be maintained without being disturbed.

As described above, the mask 100 corresponds to the mask cell area CR of the frame 200 by simply attaching the mask 100 on the template 50 and loading the template 50 on the frame 200. Since the process is complete, no tension may be applied to the mask 100 in this process.

Subsequently, the laser 100 may be irradiated to the mask 100 to bond the mask 100 to the frame 200 by laser welding. A welding bead WB is generated in a welding portion of the laser-welded mask, and the welding bead WB may be integrally connected with the same material as the mask 100 / frame 200.

16 is a schematic diagram showing a process of separating the mask 100 and the template 50 after adhering the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 16, after the mask 100 is adhered to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (EP), chemical treatment (CM), ultrasound application (US), and UV application (UV) to the temporary adhesive portion 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. For example, when heat (EP) of a temperature higher than 85 ° C to 100 ° C is applied (EP), the viscosity of the temporary adhesive portion 55 is lowered, and the adhesive force between the mask 100 and the template 50 is weakened, and thus the mask 100 ) And the template 50 may be separated. As another example, the mask 100 and the template 50 may be separated by dissolving and removing the temporary adhesive portion 55 by immersing (CM) the temporary adhesive portion 55 in chemical substances such as IPA, acetone, and ethanol. have. As another example, when ultrasonic waves are applied (US) or UV is applied (UV), the adhesive force between the mask 100 and the template 50 is weakened, so that the mask 100 and the template 50 may be separated.

In more detail, the temporary bonding portion 55 that mediates the adhesion between the mask 100 and the template 50 is a TBDB adhesive material, and thus various debonding methods can be used.

As an example, a solvent debonding method according to chemical treatment (CM) may be used. Debonding may be performed as the temporary adhesive portion 55 is dissolved by the penetration of a solvent. At this time, since the pattern P is formed on the mask 100, the solvent may penetrate through the mask pattern P and the interface between the mask 100 and the template 50. Solvent debonding has the advantage of being relatively economical compared to other debonding methods because it can be debonded at room temperature and does not require a separate devised complex debonding facility.

As another example, a heat debonding method according to heat application (EP) may be used. Decomposition of the temporary adhesive portion 55 is induced by using high-temperature heat, and when the adhesive force between the mask 100 and the template 50 is reduced, debonding may be performed in the vertical direction or the horizontal direction.

As another example, a peelable adhesive debonding method according to heat application (EP), UV application (UV), or the like may be used. When the temporary adhesive portion 55 is a heat-peeling tape, debonding may be performed by a peeling adhesive debonding method, and this method does not require a high temperature heat treatment and expensive heat treatment equipment as the heat debonding method and the process of the process. Has a relatively simple advantage.

As another example, a room temperature debonding method according to chemical treatment (CM), ultrasonic application (US), or UV application (UV) may be used. If a non-sticky treatment is performed on a part (center portion) of the mask 100 or the template 50, only the border portion may be adhered by the temporary adhesive portion 55. In addition, during debonding, the solvent penetrates into the edge portion, and debonding is performed by dissolving the entrance-adhesive portion 55. This method has the advantage that during the bonding and debonding, the rest of the mask 100 and the template 50 except for the border areas are not directly lost or defects caused by adhesive material residues during debonding. There is this. In addition, unlike the thermal debonding method, there is an advantage in that the process cost can be relatively reduced because a high-temperature heat treatment process is not required during debonding.

17 is a schematic diagram showing a state in which the mask 100 according to an embodiment of the present invention is adhered to the frame 200.

Referring to FIG. 17, one mask 100 may be adhered to one cell region CR of the frame 200.

Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when the mask cell sheet portion 220 is adhered with tensile force applied to the mask 100, the tensile force remaining in the mask 100 is masked. The cell sheet portion 220 and the mask cell region CR may be actuated to deform them. Therefore, it is necessary to perform adhesion of the mask 100 to the mask cell sheet portion 220 without applying a tensile force to the mask 100. The present invention corresponds to the mask cell region CR of the frame 200 by attaching the mask 100 on the template 50 and loading the template 50 on the frame 200. Since the process is completed, it is not possible to apply any tensile force to the mask 100 in this process. Thus, it is possible to prevent the frame 200 (or the mask cell sheet portion 220) from being deformed by the tension applied to the mask 100 acting as a tension on the frame 200.

The conventional mask 10 of FIG. 1 includes 6 cells (C1 to C6), and thus has a long length, whereas the mask 100 of the present invention includes a cell (C) and thus has a short length. The degree to which the pixel position accuracy (PPA) is distorted may be reduced. For example, assuming that the length of the mask 10 including a plurality of cells C1 to C6, ... is 1 m, and a PPA error of 10 μm is generated in 1 m as a whole, the mask 100 of the present invention Can be 1 / n of the above error range according to the relative length reduction (corresponding to the reduction in the number of cells (C)). For example, if the length of the mask 100 of the present invention is 100 mm, since it has a length reduced from 1 m to 1/10 of the conventional mask 10, a PPA error of 1 μm is generated over the entire length of 100 mm. , Alignment error is significantly reduced.

On the other hand, if the mask 100 includes a plurality of cells C, and each cell C corresponds to each cell region CR of the frame 200, within the range in which the alignment error is minimized, The mask 100 may correspond to a plurality of mask cell areas CR of the frame 200. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell area CR. Also in this case, considering the process time and productivity according to the alignment, it is preferable that the mask 100 has as few cells C as possible.

In the case of the present invention, since only one cell C of the mask 100 needs to be matched and the alignment state is checked, it is necessary to simultaneously correspond to a plurality of cells C: C1 to C6 and check all of the alignment state. Compared to the conventional method (see Fig. 2), the manufacturing time can be significantly reduced.

That is, in the frame-integrated mask manufacturing method of the present invention, each cell C11 to C16 included in the six masks 100 corresponds to one cell region CR11 to CR16, respectively, and the alignment state is checked. Through the process, time can be significantly shortened compared to a conventional method in which six cells C1 to C6 are simultaneously mapped and all six cells C1 to C6 are aligned at the same time.

In addition, in the method for manufacturing a frame-integrated mask of the present invention, the product yield in 30 processes of 30 masks 100 corresponding to and aligned with 30 cell regions (CR: CR11 to CR56) is 6 cells (C1). ~ C6), each of the five masks 10 (see FIG. 2 (a)), which correspond to and align the frame 20, may appear to be much higher than the conventional product yield in the five steps. Since the conventional method of arranging six cells C1 to C6 in a region corresponding to six cells C at a time is a much cumbersome and difficult operation, the product yield is low.

On the other hand, as described above in step 12, when attaching the mask 100 to the template 50 by a lamination process, a temperature of about 100 ° C. may be applied to the mask 100. Thereby, it may be adhered to the template 50 in a state in which some tensile tension is applied to the mask 100. Thereafter, when the mask 100 is adhered to the frame 200 and the template 50 is separated from the mask 100, the mask 100 may shrink in a predetermined amount.

When the templates 50 and the masks 100 are separated after each of the masks 100 are adhered to the corresponding mask cell area CR, a tension is applied to the plurality of masks 100 contracting in opposite directions. Therefore, the force is canceled, so that the deformation does not occur in the mask cell sheet portion 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area is directed to the right side of the mask 100 attached to the CR11 cell area. The acting tension and the tension acting in the left direction of the mask 100 attached to the CR12 cell region may be canceled. Thus, the deformation of the frame 200 (or the mask cell sheet part 220) due to tension is minimized, so that an alignment error of the mask 100 (or the mask pattern P) can be minimized.

18 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 18, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a coolant line 350 is disposed, and an organic material source 600 from the bottom of the magnet plate 300. It includes a deposition source supply unit 500 for supplying.

Between the magnet plate 300 and the source deposition unit 500, a target substrate 900 such as glass on which the organic source 600 is deposited may be interposed. The target substrate 900 may be disposed such that the frame-integrated masks 100 and 200 (or FMM) that allow the organic material source 600 to be deposited on a pixel-by-pixel basis are in close contact or very close. The magnet 310 generates a magnetic field and can be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may supply the organic material source 600 while reciprocating the left and right paths, and the organic material sources 600 supplied from the deposition source supply unit 500 may include patterns P formed in the frame-integrated masks 100 and 200. ) To be deposited on one side of the target substrate 900. The deposited organic source 600 that has passed through the pattern P of the frame-integrated masks 100 and 200 may act as the pixel 700 of the OLED.

In order to prevent uneven deposition of the pixels 700 by the shadow effect, the patterns of the frame-integrated masks 100 and 200 may be inclined (S) (or formed in a tapered shape (S)). . Since the organic material sources 600 passing through the pattern in the diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be uniformly deposited with a thickness as a whole.

Since the mask 100 is adhesively fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if it is raised to the process temperature for pixel deposition, the position of the mask pattern P is hardly affected. The PPA between 100 and its neighboring mask 100 may be maintained so as not to exceed 3 μm.

19 is a schematic view showing a state in which a template is loaded on a frame after raising a temperature of a process region according to a second embodiment of the present invention, and a mask is mapped to a cell region of the frame. In FIG. 19, it is illustrated that one mask 100 corresponds to / adhesively adheres to the cell region CR, but the mask 100 is framed 200 by simultaneously correlating the plurality of masks 100 to all the cell regions CR. ) May be performed. In this case, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.

Next, referring to FIG. 19, after raising (ET) the temperature of the process region, the mask 100 may correspond to one mask cell region CR of the frame 200. The present invention is characterized in that no tension is applied to the mask 100 in a process in which the mask 100 corresponds to the mask cell region CR of the frame 200.

Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when the mask cell sheet portion 220 is adhered with tensile force applied to the mask 100, the tensile force remaining in the mask 100 is masked. The cell sheet portion 220 and the mask cell region CR may be actuated to deform them. Therefore, it is necessary to perform adhesion of the mask 100 to the mask cell sheet portion 220 without applying a tensile force to the mask 100. Thus, it is possible to prevent the frame 200 (or the mask cell sheet portion 220) from being deformed by the tension applied to the mask 100 acting as a tension on the frame 200.

However, without applying a tensile force to the mask 100, the frame 200 is adhered to the frame 200 (or the mask cell sheet portion 220) to manufacture a frame-integrated mask, and one problem occurs when the frame-integrated mask is used in a pixel deposition process. Can occur. In the pixel deposition process performed at about 25 to 45 ° C., the mask 100 thermally expands by a predetermined length. Even in the mask 100 made of an invar material, a length of about 1 to 3 ppm may change according to a temperature rise of about 10 ° C. to form a pixel deposition process atmosphere. For example, when the total length of the mask 100 is 500 mm, the length may be increased by about 5 to 15 μm. Then, the mask 100 is struck by its own weight, or it is stretched in a fixed state in the frame 200, causing deformation such as warping, which causes a problem that the alignment errors of the patterns P become large.

Accordingly, the present invention according to the second embodiment is characterized in that it corresponds to and adheres to the mask cell region CR of the frame 200 without applying a tensile force to the mask 100 at a temperature higher than that at room temperature. . In this specification, it is expressed that the mask 100 corresponds to and adheres to the frame 200 after raising (ET) the temperature of the process region to the first temperature.

The term “process region” may mean a space in which components such as the mask 100 and the frame 200 are located, and an adhesive process of the mask 100 is performed. The process region may be a space in a closed chamber or an open space. Also, the term “first temperature” may mean a temperature that is higher than or equal to the temperature of the pixel deposition process when the frame-integrated mask is used in the OLED pixel deposition process. Considering that the pixel deposition process temperature is about 25 to 45 ° C, the first temperature may be about 25 ° C to 60 ° C. The temperature rise of the process region can be performed by installing a heating means in the chamber or by providing a heating means around the process region. Also, the term “second temperature” may mean a temperature lower than the first temperature. Considering that the first temperature is about 25 ° C to 60 ° C, the second temperature may be about 20 ° C to 30 ° C on the premise that it is lower than the first temperature, and preferably, the second temperature may be room temperature. The temperature drop of the process region may be performed by a method of installing a cooling means in the chamber, a method of installing a cooling means around the process region, a method of naturally cooling to room temperature, or the like.

Referring again to FIG. 19, after raising (ET) the temperature of the process region including the frame 200 to the first temperature, the mask 100 may correspond to the mask cell region CR. Alternatively, after the mask 100 corresponds to the mask cell region CR, the temperature of the process region including the frame 200 may be increased (ET) to the first temperature.

By loading the template 50 on the frame 200 (or the mask cell sheet unit 220), the mask 100 may correspond to the mask cell area CR.

Subsequently, the laser 100 may be irradiated to the mask 100 to bond the mask 100 to the frame 200 by laser welding. Correspondence and adhesion may be performed in the same manner as in FIG. 15.

On the other hand, in the process of raising the temperature of the process region to the first temperature (ET) as described above, and attaching to the frame 200 without applying a direct tensile force to the mask 100, the mask 100 and the frame 200 [ Or, there is a point to be considered according to the difference in thermal expansion coefficient according to the material of the mask cell sheet portion 220].

20 is a schematic side cross-sectional view showing a process of bonding a frame according to a difference in thermal expansion coefficient of a mask. 20 (a1) to (a3) show a process of bonding the invar mask 100 'generated by the electroforming process on the mask cell sheet part 220 (frame 200), and FIG. 20 (b1) ) to (b3) represent a process of bonding the invar mask 100 "generated by the rolling process on the mask cell sheet portion 220 (frame 200).

Referring to (a1) of FIG. 20, the invar mask 100 ′ generated by the electroforming process is placed on the mask cell sheet portion 220. The invar mask 100 'produced by the electroforming process has a thermal expansion coefficient greater than about 3.0 X 10 ^-6 / ° C. In addition, the mask cell sheet portion 220 composed of the invar sheet produced by the rolling process has a coefficient of thermal expansion of about 1.0 X 10 ^-6 / ° C.

Next, referring to (a2) of FIG. 20, the temperature of the process region may be increased (ET) to the first temperature. Since the mask cell sheet portion 220 has a smaller thermal expansion coefficient than the invar mask 100 ', the displacement of L1 occurs after expansion / expansion, whereas the inba mask 100' has L2 that is about three times larger than L1. Displacement may occur (L1 <L2). In this state, it is possible to integrally connect the invar mask 100 ′ by welding the mask cell sheet portion 220 to form a welding bead WB.

Next, referring to (a3) of FIG. 20, the temperature of the process region may be lowered (LT) to the second temperature. Since the mask cell sheet portion 220 has a smaller coefficient of thermal expansion than the invar mask 100 ', the displacement of L1 occurs after contraction / compression and returns to the original size, whereas the inba mask 100' is about three times larger than L1. Large L2 displacement occurs and can return to its original size. At this time, since the invar mask 100 'is contracted / compressed with a larger displacement in a state of being attached to the mask cell sheet portion 220 by welding, tension (TS) is applied to the surrounding mask cell sheet portion 220 itself. Is done. The invar mask 100 ′ may be adhered to the mask cell sheet portion 220 in a more taut state by applying its own tension (TS).

For comparison with the invar mask 100 'generated by the electroforming process, the case of the inba mask 100 "produced by the rolling process will be described.

Referring to (b1) of FIG. 20, the invar mask 100 "generated by the rolling process is placed on the mask cell sheet portion 220. The inba mask 100" generated by the rolling process has a coefficient of thermal expansion of about 1.0 X 10 ^-6 / ℃ degree. In addition, the mask cell sheet portion 220 composed of the invar sheet produced by the rolling process has a thermal expansion coefficient of about 1.0 X 10 ^-6 / ° C, similar to that of the invar mask 100 ".

Next, referring to (b2) of FIG. 20, the temperature of the process region may be increased (ET) to the first temperature. Since the mask cell sheet portion 220 is stretched / expanded, displacement of L1 occurs, and since the inba mask 100 "has the same thermal expansion coefficient as the mask cell sheet portion 220, displacement of L2 equal to L1 is generated. (L1 = L2) In this state, the invar mask 100 "may be integrally connected by welding the mask cell sheet portion 220 to form a welding bead WB.

Next, referring to (b3) of FIG. 20, the temperature of the process region may be lowered (LT) to the second temperature. Since the thermal expansion coefficient of the mask cell sheet unit 220 and the invar mask 100 "are the same, after the contraction / compression, displacements of the same L1 and L2 occur, respectively, and the original size can be returned. Mask cell sheet unit 220 Because the invar mask 100 "contracts / compresses with the same displacement, the invar mask 100" does not apply tension to the surrounding mask cell sheet portion 220. Therefore, the invar mask produced by the rolling process ( In the case of 100 "), tension is not applied to the mask cell sheet portion 220, and thus, sagging occurs due to a load, and thus an alignment error of the mask pattern P may occur, so that the mask cell sheet portion 220 is stretched. It needs a way to adhere to.

21 is a schematic side cross-sectional view showing a series of processes for adhering a mask 100 to a frame 200 according to a second embodiment of the present invention. 21 is a mask cell sheet portion 220 (frame 200) composed of an inba sheet generated by a rolling process, as shown in (b1) to (b3) of FIG. 20, an inba mask 100 produced by a rolling process. Shows the process of bonding to. For reference, FIGS. 21A and 21B correspond to FIG. 19 [FIG. 23], FIG. 21C corresponds to FIG. 22 [FIG. 24], and FIG. 21D is FIG. 25. It can be understood to correspond to.

Referring to (a) of FIG. 21, the template 50 to which the invar mask 100 generated by the rolling process is adhered and supported is placed on the mask cell sheet portion 220. The invar mask 100 and the template 50 are in a state of being bonded via a temporary adhesive portion 55. The template 50 may have a coefficient of thermal expansion greater than that of the invar mask 100 produced by the rolling process. For example, the coefficient of thermal expansion of the template 50 of the borosilicate glass (BOROFLOAT ^® 33) material is about 3.0 X 10 ^-6 / ℃. In addition, the mask cell sheet portion 220 composed of the invar sheet produced by the rolling process has a thermal expansion coefficient of about 1.0 X 10 ^-6 / ° C, similar to that of the invar mask 100.

Next, referring to (b) of FIG. 21, the temperature of the process region may be increased (ET) to the first temperature. After the mask cell sheet portion 220 is stretched / expanded, displacement of L1 may occur. The mask 100 also needs to be stretched / expanded by the intrinsic thermal expansion length to generate the same degree of displacement as L1, but since it is adhered to the template 50, it can be expanded / expanded larger than this. In other words, the template 50 having a coefficient of thermal expansion greater than the mask 100 generates a displacement of L2 greater than L1 (L1 <L2), and the mask 100 adhered to the template 50 is the template 50 The force to expand / expand as much as L2 can be applied like a tensile force. Thus, the mask 100 is stretched at least larger than L1, and can be stretched to the same or less than L2. In this state, the invar mask 100 may be welded to the mask cell sheet portion 220 to be integrally connected as a welding bead WB is formed.

Next, referring to (c) of FIG. 21, while maintaining the temperature of the process region at the first temperature (ET), the template 50 may be debonded from the mask 100. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (EP), chemical treatment (CM), ultrasound application (US), and UV application (UV) to the temporary adhesive portion 55. have.

When the mask 100 is separated from the template 50, since the tensile force applied by the template 50 is released, the mask 100 having a displacement of L2 greater than L1 can be further contracted / compressed to the extent corresponding to L1. . Then, the tension (TS) is applied to the surrounding mask cell sheet portion (220) by itself.

Next, referring to (d) of FIG. 21, the temperature of the process region may be lowered (LT) to the second temperature. In a state in which its own tension (TS) is applied, the mask 100 and the mask cell sheet unit 220 may each heat shrink to return to their original size.

22 is a schematic diagram showing a process of separating the mask 100 and the template 50 after adhering the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 22, after the mask 100 is adhered to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (EP), chemical treatment (CM), ultrasound application (US), and UV application (UV) to the temporary adhesive portion 55. have. The separation process may be performed in the same way as in FIG. 16.

23 is a schematic diagram showing a state in which the mask 100 according to the second embodiment of the present invention is associated with the cell area CR of the neighboring frame 200.

Referring to FIG. 23, the mask 100 may correspond to the mask cell region CR12 adjacent to the mask cell region CR11 to which the mask 100 is adhered. The temperature of the process region may be maintained in a state where the temperature was increased (ET) to the first temperature in FIG. 19.

By loading the template 50 on the frame 200 (or the mask cell sheet portion 220), the mask 100 may correspond to the mask cell area CR12. The method of controlling the position of the template 50 and corresponding the mask 100 to the mask cell area CR12 is the same as the process of FIG. 19. Meanwhile, the mask 100 may first correspond to a mask cell region CR other than the mask cell region CR12 adjacent to the mask cell region CR11.

Subsequently, the laser 100 may be irradiated to the mask 100 to bond the mask 100 to the frame 200 by laser welding.

24 is a schematic view showing a process of separating the mask 100 and the template 50 after adhering the mask 100 according to the second embodiment of the present invention to the cell region CR of the neighboring frame 200. .

Referring to FIG. 24, after the mask 100 is adhered to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (EP), chemical treatment (CM), ultrasound application (US), and UV application (UV) to the temporary adhesive portion 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. This is the same as described above in FIG. 22.

25 is a schematic diagram showing a state in which a mask according to an embodiment of the present invention is attached to a frame.

Next, referring to FIG. 25, a process of matching and adhering the mask 100 to the remaining mask cell area CR may be performed. All masks 100 may be adhered to the mask cell area CR of the frame 200.

Meanwhile, after the masks 100 are attached to and adhered to all the mask cell regions CR, the templates 50 attached to each mask 100 may be separated at the same time.

26 is a schematic diagram showing a process of lowering (LT) the temperature of the process region after adhering the mask 100 to the cell region CR of the frame 200 according to an embodiment of the present invention.

Next, referring to FIG. 26, the temperature of the process region is lowered (LT) to the second temperature.

When the temperature of the process region is lowered (LT) to the second temperature, the mask 100 may heat shrink by a predetermined length. The mask 100 may be isotropically heat-shrinked along all lateral directions. However, since the mask 100 is fixedly connected by welding (W) to the frame 200 (or the mask cell sheet portion 220), the heat shrinkage of the mask 100 is applied to the surrounding mask cell sheet portion 220. The tension (TS) is applied by itself. The mask 100 may be more tightly adhered to the frame 200 by applying its own tension (TS) of the mask 100.

As described above in FIG. 21, due to the difference in thermal expansion coefficient between the mask 100 and the template 50, the tension TS may be applied even before the temperature of the process region is lowered (LT) to the second temperature, and the temperature After lowering (LT), tension (TS) due to thermal contraction may be further applied.

In addition, since all of the masks 100 are adhered to the corresponding mask cell region CR, the temperature of the process region is lowered to the second temperature (LT), so that all the masks 100 simultaneously cause heat shrinking, thereby forming a frame. A problem in which the alignment errors of the 200 or the patterns P are increased may be prevented. In more detail, even if the tension TS is applied to the mask cell sheet portion 220, since the plurality of masks 100 apply the tension TS in opposite directions, the force is canceled and the mask cell sheet portion is canceled. No deformation occurs at 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area is directed to the right side of the mask 100 attached to the CR11 cell area. The acting tension TS and the tension acting in the left direction of the mask 100 attached to the CR12 cell region may be canceled. Thus, the deformation of the frame 200 (or the mask cell sheet part 220) by the tension TS is minimized, so that the alignment error of the mask 100 (or the mask pattern P) can be minimized. There is this.

On the other hand, as described above in (b1) to (b3) of FIG. 20, the method of controlling the temperature of the process region to the first and second temperatures is a mask cell in which the invar mask 100 "generated by the rolling process is tightened. There is a problem in that it is difficult to adhere to the sheet portion 220. In addition, the method described in FIG. 21 uses the difference in thermal expansion coefficient between the mask 100 and the template 50 to generate an invar mask 100 produced by a rolling process. ) Can be adhered on the mask cell sheet portion 220 in a taut state, but in order to raise (ET) the process region to the first temperature and drop (LT) it to the second temperature, heating or cooling is possible. The hassle of having a device / cooling device arises. In order to further install these devices in an apparatus for manufacturing a frame-integrated mask, interference with other equipment should be considered, and a problem of cost increase occurs as devices are added. In addition, there is a problem in that a bad effect of giving a thermal shock to another device may occur in the process of heating / cooling a process area.

Accordingly, the present invention according to the third embodiment does not apply a direct tensile force to the mask 100 in the process of adhering the mask 100 to the frame 200 at the same time without heating or cooling the process region. It proposes a method that can be tightly adhered to the frame 200.

27 to 28 are schematic diagrams showing a process of adhering the mask 100 to the template 50 according to the third embodiment of the present invention.

The mask support template according to the third embodiment of the present invention is characterized in that the mask 100 is adhered onto the template 50 in a state in which a tensile force F is applied in the lateral direction.

Referring to FIG. 27, an apparatus 40 for manufacturing a mask metal film support template may include a body 41, an upper block 42, a lower block 45, and tensioning means 46.

The body 41 may provide a chamber space to which the mask 100 and the template 50 are adhered. The body 41 is connected to a vacuum forming means (not shown) such as a pump, so that the chamber space can be a vacuum (VAC) environment.

The upper block 42 may be disposed above the chamber space. The upper block 42 is connected to a lifting means (not shown) that can move up and down, so that it can come into contact with the lower block 45 when it is located at the lower limit. The template 50 may be fixed to the lower portion of the upper block 42.

The lower block 45 may be disposed under the chamber space so as to face the upper block 42. The lower block 45 may be in a fixed state, but may be connected to a lifting means (not shown) that can move up and down like the upper block 42. The mask 100 may be fixed on the lower block 45.

The tensioning means 46 on the lower block 45 can clamp the mask 100 to apply a tensile force F in the lateral direction. The tensioning means 46 may clamp one or both sides of the mask 100. Upon application of the tensile force F of the tensioning means 46, the mask 100 may be fixed on the lower block 45 in a state longer than the original length. At this time, the mask cell (C) portion and the dummy (DM) portion on which the mask pattern (P) of the mask 100 is formed may be fixed in an aligned state with the template 50.

Next, referring to (a) of FIG. 28, the upper block 42 may descend. Alternatively, the upper block 42 and the lower block 45 may descend / rise each other. Accordingly, the template 50 fixed to the lower portion of the upper block 42 and the mask 100 fixed to the upper portion of the lower block 45 may contact each other.

After the template 50 and the mask 100 are contacted by the temporary adhesive portion 55, they may be adhered to each other. At this time, it is preferable to maintain a vacuum (VAC) atmosphere in the chamber space to prevent air bubbles from entering between the template 50 and the mask 100.

In the case of the liquid wax, the temporary adhesive part 55 compresses the upper block 42 and the lower block 45 while maintaining the chamber space at a temperature of about 85 ° C to 100 ° C, so that the template 50 and the mask 100 Adhesion can be performed. In addition, according to an embodiment, the template 50 is vaporized for about 120 ° C. for 60 seconds to vaporize the solvent of the temporary adhesive portion 55, and the upper block 42 and the lower block 45 are vaporized. By pressing, the template 50 and the mask 100 may be adhered.

The template 50 and the mask 100 may be adhered while the tensioning means 46 keeps applying the tensile force F to the side of the mask 100.

Since an area that can be clamped on the side surface of the mask 100 is required, the mask 100 may have a larger area than the template 50. After the mask 100 is adhered to the template 50, a portion (dummy (DM) portion) of the mask 100 protruding out of the template 50 may be cut.

Then, a mask support template may be manufactured as shown in FIG. 28 (b). The mask support template to which the template 50 and the mask 100 are adhered can be taken out from the main body 41. Since the template 50 is adhesively fixed in a state in which the tensile force F is applied to the mask 100, even if the tensioning means 46 releases the clamping, the mask 100 remains in its own state. The adhesive may be fixed on the template 50. This residual tensile force (IT) can be maintained until the mask 100 is separated from the template 50.

19 is a schematic diagram showing a state in which the template 100 is loaded on the frame 200 according to the third embodiment of the present invention, and the mask 100 corresponds to the cell region CR of the frame 200. In FIG. 19, it is illustrated that one mask 100 corresponds to / adhesively adheres to the cell region CR, but the mask 100 is framed 200 by simultaneously correlating the plurality of masks 100 to all the cell regions CR. ) May be performed. In this case, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.

Next, referring to FIG. 19, the mask 100 may correspond to one mask cell area CR of the frame 200.

Subsequently, the laser 100 may be irradiated to the mask 100 to bond the mask 100 to the frame 200 by laser welding. Correspondence and adhesion may be performed in the same manner as in FIG. 15.

30 is a schematic diagram showing a process of separating the mask 100 and the template 50 after adhering the mask 100 to the frame 200 according to the third embodiment of the present invention.

Referring to FIG. 30, after the mask 100 is adhered to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (ET), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary adhesive portion 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. The separation process may be performed in the same way as in FIG. 16.

When the template 50 is separated from the mask 100, the mask 100 may shrink in a predetermined amount while being adhered to the frame 200 (the mask cell sheet portion 220). 28 (b), when the template 50 is detached while the tensile force IT is retained in the mask 100 itself, the mask 100 contracts in a process of returning to a unique length. Accordingly, the tension 100 may be applied to the frame 200 (the mask cell sheet portion 220) so that the mask 100 can be adhered in a tight state.

31 is a schematic diagram showing a state in which the mask 100 according to the third embodiment of the present invention is adhered to the frame 200. 31 shows a state in which all the masks 100 are attached to the cell area CR of the frame 200. The template 50 can be separated after adhering the mask 100 one by one, but all the templates 50 can be separated after adhering all the masks 100.

When the template 50 and the mask 100 are separated after each of the masks 100 are adhered to the corresponding mask cell region CR, the tension TS of the plurality of masks 100 contracting in mutually opposite directions (TS) ) Is applied, the force is canceled, so that no deformation occurs in the mask cell sheet portion 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area is directed to the right side of the mask 100 attached to the CR11 cell area. The acting tension TS and the tension acting in the left direction of the mask 100 attached to the CR12 cell region may be canceled. Thus, the deformation of the frame 200 (or the mask cell sheet part 220) by the tension TS is minimized, so that the alignment error of the mask 100 (or the mask pattern P) can be minimized. There is this.

The present invention has been illustrated and described with reference to preferred embodiments, as described above, but is not limited to the above embodiments and is varied by those skilled in the art to which the present invention pertains without departing from the spirit of the present invention. Modifications and modifications are possible. Such modifications and variations are to be regarded as falling within the scope of the invention and appended claims.

40: mask metal film support template manufacturing apparatus
41: body
42: upper block
45; Lower block
46: tension means
50: template
51: laser through hole
55: temporary adhesive
70: lower support
100: mask
100 ': Mask created by electroplating process
100 ": mask produced by the rolling process
110: mask film, mask metal film
200: frame
210: border frame
220: mask cell sheet portion
221: border sheet portion
223: first grid sheet portion
225: second grid sheet portion
1000: OLED pixel deposition device
C: cell, mask cell
CM: chemical treatment
CR: mask cell area
DM: Dummy, mask dummy
ET: the temperature of the process zone is raised to the first temperature
EP: heat applied
L: laser
LT: the temperature in the process region is lowered to the second temperature
R: Hollow area of the border frame
P: mask pattern
US: ultrasonic approval
UV: UV applied
W: Welding
WB: welding bead
WP: Weld

Claims (12)

A method of manufacturing a frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed,
(a) preparing a mask support template with a mask adhered to the template;
(b) preparing a frame having at least one mask cell region;
(c) raising a temperature of a process region including a frame having at least one mask cell region to a first temperature;
(d) loading a template on the frame to correspond the mask to the mask cell area of the frame;
(e) attaching the mask to the frame by irradiating a laser to the welding portion of the mask; And
(f) lowering the temperature of the process region including the frame to a second temperature;
A method of manufacturing a frame-integrated mask comprising a. According to claim 1,
The mask is made of a metal sheet manufactured by a rolling process, and the template has a larger coefficient of thermal expansion than the mask, and the method of manufacturing the frame-integrated mask is provided. According to claim 1,
A method of manufacturing a frame-integrated mask, wherein steps (d) to (f) are repeated to attach a plurality of masks to all mask cell regions of the frame, respectively. According to claim 1,
The temporary adhesive portion is an adhesive or adhesive sheet that can be separated by applying heat, and an adhesive or adhesive sheet that can be separated by UV irradiation. According to claim 1,
The first temperature is a temperature equal to or higher than the OLED pixel deposition process temperature, and the second temperature is at least a temperature lower than the first temperature,
The first temperature is any one of 25 ℃ to 60 ℃,
The second temperature is any one of 20 ° C to 30 ° C lower than the first temperature,
OLED pixel deposition process temperature is any one of 25 ℃ to 45 ℃, the method of manufacturing a frame-integrated mask. According to claim 1,
In step (c), the method of manufacturing a frame-integrated mask, wherein the mask extends greater than the intrinsic thermal expansion length and extends equal to or less than the thermal expansion length of the template. According to claim 1,
In step (d), the method of manufacturing a frame-integrated mask, wherein the mask on the template corresponds to the mask cell region without applying tension to the mask and only by controlling the position of the template. According to claim 1,
When the temperature of the process region is lowered to the second temperature in step (f), the mask attached to the frame contracts and receives tension, thereby producing a frame-integrated mask. According to claim 1,
Between step (e) and step (f), separating the mask and the template by performing at least one of heat application, chemical treatment, ultrasonic application, and UV application to the temporary adhesion part.
The method of manufacturing a frame-integrated mask further comprising a. According to claim 1,
In step (a), the mask is adhered on the template in a state in which a tensile force is applied in the lateral direction, the method of manufacturing a frame-integrated mask. The method of claim 10,
The mask is made of a metal sheet produced by a rolling or electroforming process. The method of claim 10,
After step (e), the temporary adhesive is subjected to at least one of heat application, chemical treatment, ultrasonic application, and UV application to separate the mask and the template,
When the template is separated from the mask, a tensile force applied to the mask is applied to the frame.

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