KR20200036683A - Film formation apparatus, film formation method, and manufacturing method of electronic device - Google Patents

Abstract

A film formation material ejected from a film formation source in a film formation standby area is suppressed from being attached to an object, on which a film is to be formed, by suppressing, if possible, that the film formation material flies toward a film formation area. A film formation apparatus (1) comprises: an object (2) on which a film is to be formed; a chamber (10) in which a film formation source (3) for forming a film on the object (2), on which a film is to be formed, is arranged by flying the film formation material toward the object (2), on which a film is to be formed; and a moving means (12) which is provided between a predetermined film formation standby area (B) and a film formation area (A) within the chamber (10) to move the film formation source (3) relatively to the object (2) on which a film is to be formed. The film formation apparatus further comprises a shutter member (7) movable between a partition position at which the film formation area (A) and the film formation standby area (B) are partitioned from each other, and an open position at which the film formation area (A) and the film formation standby area (B) are open.

Description

Film forming apparatus, film forming method, and manufacturing method of electronic device {FILM FORMATION APPARATUS, FILM FORMATION METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE}

The present invention relates to a film forming apparatus, a film forming method, and a method for manufacturing an electronic device.

As a film-forming apparatus for forming a film-forming object on a substrate or the like, a film-forming device for arranging a film-forming object and a film-forming source opposite to each other and moving the film-forming source and the film-forming object relative to each other is known. Patent Literature 1 discloses a film forming apparatus (sputter device) in which sputtering particles (film forming material) are released from a target by sputtering the sputtering surface of the target, and the sputtering particles are deposited on a substrate to form a thin film. In this film forming apparatus, the film is formed by moving the cathode unit provided with the target in parallel with the substrate while discharging sputtering particles from the target. In the film formation, emission of sputtering particles is started in the state where the cathode unit is in an area where the substrate does not face the sputtering surface (film formation waiting area).

When unintended deposition of a film-forming material from a film-forming source in a film-forming atmosphere area into a film-forming object occurs, the film thickness of the film to be formed and the uniformity of film quality are reduced. In Patent Document 1, a shielding plate (shielding member) is provided around the target, and the distance between the film formation standby position and the substrate is reduced by a predetermined amount or more. This makes it difficult for the sputtering particles emitted from the target of the cathode unit in the film formation waiting position to reach the substrate.

Japanese Patent Publication No. 2015-178682

However, when the distance between the target and the substrate is increased, there have been problems such as an increase in the footprint (installation area) of the apparatus or a large-scale vacuum installation due to the enlargement of the chamber. Further, for example, when sputtering is performed, a gas such as an inert gas is introduced and gas molecules are present in the atmosphere, and the sputtered particles emitted collide with the gas molecules in the atmosphere and scatter. For this reason, film-forming materials, such as sputtering particles, do not necessarily fly linearly, and it is not sufficient to suppress the incidence of sputtering particles into the substrate by simply increasing the distance between the target and the substrate.

Accordingly, in view of the above-described problems, the present invention aims to suppress the formation of materials to be deposited from a film formation source from the film formation source from being deposited in the film formation waiting area toward the film formation region, and to prevent adhesion to the film formation object.

The film-forming apparatus as one aspect of the present invention includes a chamber in which a film-forming object and a film-forming source that causes a film-forming material to fly into the film-forming object to be deposited on the film-forming object are arranged,

A film forming apparatus having moving means for moving the film forming source relative to the film forming object between a predetermined film forming waiting area and a film forming region in the chamber,

It is characterized by having a shutter member movable between a partition position for partitioning between the film formation area and the film formation waiting area and an open position for opening the film formation area and the film formation waiting area.

In addition, a method of forming a film as another aspect of the present invention includes a preparation process in which a film forming source is placed in a film forming waiting area in a chamber, and a film forming material is brought into an emergency state from the film forming source, and a film forming area in the chamber is formed from the film forming waiting area. In the preparation step, the film forming source in which the film forming material is in an emergency state is moved relative to the film forming object, and the film forming process is performed by depositing the film forming material flying from the film forming source onto the film forming object. As a method of forming a film, a shutter member that is movable between a partitioning position for partitioning between the film forming area and the film forming waiting area and an open position for opening the film forming area and the film forming waiting area is provided, and in the preparation step, , The shutter member is positioned at the partition position to form the film formation region and the castle. A film waiting area is partitioned, and in the film forming step, the shutter member is positioned in an open position, and the film forming source is moved relative to the film forming object from the film waiting area to the film forming area.

In addition, a method of manufacturing an electronic device as another aspect of the present invention includes a preparation process in which a film formation source is placed in a film formation waiting area in a chamber, and a film forming material is brought into flight from the film forming source, and the chamber is formed from the film formation waiting area. In the inner film forming region, the film forming source in which the film forming material is in a flying state in the preparation step is moved relative to the film forming object, and the film forming material is deposited by depositing the film forming material flying from the film forming source onto the film forming object. A method for manufacturing an electronic device having a process, the shutter member is movable between a partition position for partitioning between the film formation region and the film formation standby region and an open position for opening the film formation region and the film formation standby region. Thus, in the preparation step, the shutter member is placed in the partition position. Position to partition the film formation region and the film formation waiting area, and in the film forming process, the shutter member is positioned in an open position to move the film forming source from the film forming waiting area to the film forming region relative to the film forming object. It is characterized by letting.

ADVANTAGE OF THE INVENTION According to this invention, the film-forming material discharged from a film-forming source in a film-forming waiting area can be suppressed from flying toward the film-forming area, and can be suppressed from adhering to a film-forming object.

(A) (A) is a schematic diagram showing the configuration of the film forming apparatus of the first embodiment, (B) is an enlarged view of the first film formation waiting area in (A), and (C) is a schematic enlarged view of the shutter member in (A). Perspective view.
[Fig. 2] (A) is a plan view of Fig. 1 (A), and (B) is a perspective view showing a magnet unit of a rotating cathode.
3 is a schematic diagram showing the configuration of a film forming apparatus according to a second embodiment of the present invention.
4] (A) and (B) are schematic views showing the configuration of a film forming apparatus according to Embodiment 3 of the present invention, and (C) is a perspective view schematically showing a shutter member.
[Fig. 5] (A) and (B) are schematic diagrams showing the configuration of the film forming apparatus of Embodiment 4 of the present invention.
6 is a schematic diagram showing the configuration of a film forming apparatus according to a fifth embodiment of the present invention, and (B) is a perspective view schematically showing a driving mechanism of a shutter member.
7 is a schematic diagram showing the configuration of a film forming apparatus according to Embodiment 6 of the present invention.
Fig. 8 is a diagram showing a general layer structure of an organic EL device.

Hereinafter, embodiments of the present invention will be described in detail. However, the following embodiments are merely illustrative of preferred structures of the present invention, and the scope of the present invention is not limited to these structures. In addition, the hardware configuration and software configuration of the apparatus in the following description, processing flow, manufacturing conditions, dimensions, materials, shapes, and the like, unless otherwise specified, are intended to limit the scope of the present invention to these only. no.

[Embodiment 1]

First, with reference to FIGS. 1 (A), (B), and 2 (A), the basic configuration of the film forming apparatus 1 of Embodiment 1 will be described. The film forming apparatus 1 according to the present embodiment is a semiconductor device, a magnetic device, various electronic devices such as electronic components, or an object to be formed in the manufacture of an optical component 2 (a laminate is formed on a substrate) It is used to deposit a thin film on a). More specifically, the film forming apparatus 1 is preferably used in the manufacture of electronic devices such as light emitting elements, photoelectric conversion elements, and touch panels. Among them, the film forming apparatus 1 according to the present embodiment is particularly preferably applicable to the production of organic light emitting elements such as organic EL (ErectroLuminescence) elements, and organic photoelectric conversion elements such as organic thin film solar cells. Further, the electronic device in the present invention includes a display device (e.g., an organic EL display device) equipped with a light-emitting element, a lighting device (e.g., an organic EL lighting device), and a sensor equipped with a photoelectric conversion element ( For example, it also includes an organic CMOS image sensor.

8 schematically shows the general layer structure of the organic EL element. As shown in Fig. 8, the organic EL element is generally configured such that an anode, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, and a cathode are formed on the substrate in this order. The film forming apparatus 1 according to the present embodiment is suitably used when forming a layered film such as a metal or metal oxide used for an electron injection layer or an electrode (cathode) by sputtering on an organic film. . In addition, it is not limited to the film formation on the organic film, and as long as it is a combination of materials that can be formed by sputtering, such as a metal material or an oxide material, a laminated film can be formed on various surfaces.

The film forming apparatus 1 has a chamber 10 and a drive mechanism (linear drive mechanism 12), as shown in Fig. 1A. Inside the chamber 10, a film-forming object 2 and a rotating cathode unit 3 as a film-forming source for making film-forming objects 2 by making sputter particles, which are film-forming materials, fly toward the film-forming objects 2 (hereinafter, Simply referred to as "cathode unit 3"). The drive mechanism drives at least one of the cathode unit 3 and the film-forming object 2 so that the cathode unit 3 moves relative to the film-forming object 2. In this embodiment, the linear drive mechanism 12 which is a drive mechanism drives the cathode unit 3. The cathode unit 3 faces the film formation object 2 by the linear drive mechanism 12 and does not face the film formation region A to form a film formation object 2 and the film formation object 2, It is made to be movable between the film formation waiting areas B which are not formed on the film formation object 2. That is, in the present embodiment, the linear drive mechanism 12 is a moving means for moving the film forming source relative to the film forming object 2 between the film forming waiting area B and the film forming area A. Although the film formation waiting area B is located in two places on the upstream side and the downstream side with respect to the film forming area A, in the following description, the cathode unit 3 has a film forming waiting area B on the right side in the figure. A description will be made assuming that the film formation region A is moved to the left side in the drawing and film formation is performed on the film formation object 2. The present invention provides a shutter member (7) that partitions between the film formation region (A) and the film formation standby region (B), which is movable in a first direction (G) orthogonal to the movement direction (F).

A gas introducing means and an exhaust means (not shown) are connected to the chamber 10, and are configured to maintain the inside at a predetermined pressure. That is, a sputter gas (an inert gas such as argon or a reactive gas such as oxygen or nitrogen) is introduced into the chamber 10 by a gas introducing means, and from inside the chamber 10, a vacuum pump Exhaust is performed by exhaust means such as, and the pressure inside the chamber 10 is adjusted to a predetermined pressure.

The film-forming object 2 is held by the holder 21 and is horizontally disposed on the ceiling wall 10d side of the chamber 10. The film-forming object 2 is carried in, for example, from a gate valve (not shown) provided on the sidewall of the chamber 10 to form a film, and after film formation, is discharged from the gate valve. In the illustrated example, the film-forming surface 2a of the object to be formed 2 is formed of a so-called upward deposition (depo-up) in which the film formation is performed in a state facing downward in the direction of gravity, but is not limited thereto. For example, the film-forming object 2 is disposed on the bottom side of the chamber 10, and the cathode unit 3 is disposed above it, so that the film-forming surface 2a of the film-forming object 2 faces upward in the direction of gravity. A so-called depo-down configuration in which film formation is performed in a state may be used. Alternatively, the film-forming object 2 may be vertically erected, that is, the film-forming is performed in a state where the film-forming surface of the film-forming object 2 is parallel to the direction of gravity.

The cathode unit 3 is provided with a pair of rotating cathodes 3A, 3B arranged in parallel at predetermined intervals in the moving direction. The two rotating cathodes 3A and 3B are supported by a support block 210 and an end block 220, both ends of which are fixed on the mobile table 230, as shown in Fig. 2A. Further, the rotating cathodes 3A and 3B have a cylindrical target 35 and a magnet unit 30 disposed therein. The target block 35 is freely supported by the support block 210 and the end block 220, and the magnet unit 30 is supported in a fixed state. In addition, although the magnet unit 30 is not rotated here, it is not limited to this, The magnet unit 30 may also rotate or rock. The movable table 230 is supported freely to move in a direction parallel to the film formation surface 2a (the horizontal direction here) of the film forming object 2 along a pair of guide rails 250 through a conveying guide such as a linear bearing. It is done. In the drawing, if the direction parallel to the guide rail 250 is the X axis, the vertical direction is the Z axis, and the direction perpendicular to the guide rail 250 in the horizontal plane is the Y axis, the cathode unit 3, the rotation axis is In the state toward the Y-axis direction, while rotating around the rotation axis, the film-forming object 2 is moved in parallel, that is, on the XY plane in the X-axis direction.

The targets 35 of the rotating cathodes 3A and 3B are cylindrical in this embodiment, and function as a source of film-forming material for forming a film on the film-forming object 2. The material of the target 35 is not particularly limited, and examples thereof include metal simple substances such as Cu, Al, Ti, Mo, Cr, Ag, Au, and Ni, or alloys or compounds containing these metal elements. You can. As the material of the target 35, transparent conductive oxides such as ITO, IZO, IWO, AZO, GZO, and IGZO may be used. The target 35 is formed with a layer of a backing tube 35a made of another material inside the layer on which these film-forming materials are formed. A power source 13 is electrically connected to the backing tube 35a, and functions as a cathode to which a bias voltage is applied from the power source 13. The bias voltage may be applied to the target itself or there may be no backing tube. Also, the chamber 10 is grounded. In addition, although the target 35 is a cylindrical target, the term "cylindrical" here does not mean only a mathematically rigid cylinder, but the mother bus is a curved line rather than a straight line, or a cross section perpendicular to the central axis is a mathematically rigid "circle". This includes anything that is not. That is, the target 2 in this invention should just be a cylindrical shape rotatable about a central axis.

The magnet unit 30 forms a magnetic field in the direction toward the film-forming object 2, and as shown in FIG. 2 (B), the center magnet 31 extending in a direction parallel to the rotation axis of the rotating cathode 3A ), A peripheral magnet 32 of a different pole from the center magnet 31 surrounding the center magnet 31, and a yoke plate 33. The peripheral magnet 32 is constituted by a pair of straight portions 32a and 32b extending parallel to the center magnet 31 and rotating portions 32c and 32d connecting both ends of the straight portions 32a and 32b. It is done. The magnetic field formed by the magnet unit 3 has a magnetic force line that returns from the magnetic pole of the central magnet 31 to the linear portions 32a and 32b of the peripheral magnet 32 in a loop shape. As a result, a toroidal magnetic field tunnel extending in the long longitudinal direction of the target 35 is formed near the surface of the target 35. Electrons are captured by this magnetic field, and plasma can be concentrated in the vicinity of the surface of the target 35 to increase the efficiency of sputtering.

The target 35 is rotationally driven by the target driving device 11 which is a rotational driving device. Although the target drive device 11 is not particularly shown, it has a drive source such as a motor, and a general drive mechanism for transmitting power to the target 35 via a power transmission mechanism is applied, for example, the support block 210 ) Or the end block 220 or the like. On the other hand, the moving table 230 is linearly driven in the X-axis direction by the linear drive mechanism 12. Although the linear drive mechanism 12 is not particularly illustrated, various known linear motion mechanisms, such as a screw feed mechanism using a ball screw or the like, which converts the rotational motion of the rotary motor into linear motion, and a linear motor can be used.

In addition, one end of the atmospheric arm mechanism 60 constituted by a link mechanism following linear movement is connected to the mobile table 230 by a waiting box. The atmospheric arm mechanism 60 has a plurality of hollow arms 61 and 62, the inside of which are held at atmospheric pressure, and these arms 61 and 62 are rotatably connected to each other at the joint portion 63. . One end of the arm 61 is rotatably connected to the mounting portion of the bottom wall 10a of the chamber 10, and the end of the other arm 62 is rotatably connected to the mounting portion of the mobile table 230 have. Inside the atmospheric arm mechanism 60, a power cable connected to a motor of a linear drive mechanism 12 or a target drive device 11, a signal cable for a control signal, a tube for flowing cooling water, and the like are stored.

In the film formation waiting area B, a counter member 4 facing the cathode unit 3 waiting in the film forming waiting area B is fixed to the chamber 10. The opposing member 4 has a horizontal plate portion 4a extending horizontally (XY plane) facing the cathode unit 3 at a predetermined distance, and a side of the semi-film-forming region of the horizontal plate portion 4a (moving direction upstream side) It has a vertical plate portion (4b) extending vertically (YZ plane) from the end of the chamber toward the bottom wall. With respect to the bottom wall 10a of the chamber 10, the height of the horizontal plate portion 4a is disposed at the same height as the object to be formed 2 located in the film formation region A. An end portion of the horizontal plate portion 4a on the film formation region A side is provided with a gap of a degree through which the shutter member 7 passes between the holder 21 of the film formation object 2.

In addition, the first shielding member 51 moving with respect to the film forming object 2 together with the first cathode unit 3 is provided on the film forming region A side and the film forming region A side of the cathode unit 3 and The second shielding member 52 is disposed. The 1st shielding member 51 and the 2nd shielding member 52 are connected by the bottom plate part 53 fixed to the mobile base 230. In addition, the height of the 1st shielding member 51 and the 2nd shielding member 52 is about the height of the top part of the target 35 of each cathode of the cathode unit 3.

In the state where the cathode unit 3 is located in the film formation waiting area B, the second shielding member 52 is close to the vertical plate portion 4b of the opposing member 4, and the position of the first shielding member 51 (A) The opposite ends of the horizontal plate portion (4a) of the opposing member (4) are located at substantially the same position in the X-axis direction as the end portion of the film formation region (A). Between the horizontal plate portion 4a of the opposing member 4 and the first shielding member 51, an opening C communicating with the film formation region A and the film formation standby region B is formed, and this opening ( By blocking C) with the shutter member 7, the film formation region A and the film formation standby region B are partitioned.

In the first embodiment, the shutter member 7 is a substantially rectangular plate-shaped member, the long side of which extends in the Y-axis direction, the short side of which extends in the Z-axis direction, and the film forming region side of the first shielding member 51 It is freely assembled in the first direction (G) parallel to the Z-axis, linearly reciprocating along the side. The shutter member 7 has a partition position G1 that partitions between the film formation region A and the film formation standby region B, and an open position G2 that opens between the film formation region A and the film formation standby region B. ). Here, the partition position G1 and the open position G2 are taken as the position of the front end 7a on the side that moves in the direction in which the shutter member 7 divides. In the illustrated example, the partition position G1 is such that the tip 7a of the shutter member 7 moves toward the ceiling wall 10d side of the chamber 10, and the end of the opposing member 4 and the film-forming object 2 It is a position that has reached the gap H between the holders 21 and reached the ceiling wall 10d side. In this partition position G1, in the illustrated example, the gap H penetrates a predetermined amount, but may be up to the middle of the gap H. In addition, the open position G2 is a position where the tip 7a of the shutter member 7 has moved to the vicinity of the opposite end 5a of the first shielding member 51. Regarding the open position G2, the tip 7a of the shutter member 7 may fall downward from the gap H, and may be up to the middle of the opening C. The shutter member 7 is configured to be movable between the partition position G1 and the open position G2, and when the film forming source is in the film formation waiting area B, the shutter member 7 is placed in the partition position G1. Position it. Thereby, while making the film-forming source movable between the film-forming area (A) and the film-forming waiting area (B), avoiding the enlargement of the device, and the film-forming material released from the film-forming source in the film-forming waiting area (B) is formed in the film forming region. It is possible to suppress the flight to the side (A).

The shutter member 7 is reciprocally driven linearly by an actuator 8 such as a pneumatic cylinder for driving. Fig. 1 (C) schematically shows the actuator 8 with a two-dot chain line. For example, in the case of a pneumatic cylinder, when the compressed air is on, the pneumatic cylinder extends to partition the shutter member 7 It moves to (G1), and when compressed air is off, the pneumatic cylinder contracts and moves to the open position (G2). The actuator is not limited to an actuator using a fluid pressure such as a pneumatic cylinder, and for example, a screw feed mechanism that converts the rotation of the motor into a linear motion may be used, a linear motor may be used, and various linear drive mechanisms may be used. Can be used.

Next, a film forming method by the film forming apparatus 1 will be described. First, the cathode unit 3 is made to stand by in the film formation waiting area B. In this state, the shutter member 7 is in the partition position G1 by the actuator 8, and the film forming region A and the film forming standby region B are partitioned by the shutter member 7. In this film formation waiting area B, prior to the film formation process (this sputtering configuration), the cathode unit 3 is driven to provide bias potential to the first rotating cathode 3A and the second rotating cathode 3B. Thereby, each target 35 is rotated and sputter particles are released to perform pre-sputtering (preparation process). Pre-sputtering is preferably performed until the generation of plasma formed around each target 35 is stabilized.

In this pre-sputtering process, among the sputter particles emitted from each target 35, sputter particles flying toward the ceiling wall 10d of the chamber 10 are shielded by the horizontal plate portion 4a of the opposing member 4 The sputtered particles flying in the moving direction toward the film forming region A are shielded by the first shielding member 51 and the shutter member 7. Furthermore, the sputtered particles flying to the opposite side to the film formation region A are shielded by the second shielding member 52 and the vertical plate portion 4b of the opposing member 4. In this way, in the pre-sputtering step, the film formation waiting area B and the film forming area A are partitioned by the shutter member 7, so that the film forming material generated in the pre-sputtering is flying to the film forming area A, It can suppress that it adheres to the film-forming object 2 arrange | positioned in the film-forming area | region A.

After pre-sputtering for a certain period of time, the process proceeds to the present sputtering process. At the time of transition to the sputtering step, first, the shutter member 7 is moved from the partition position G1 to the open position G2. Thereafter, the sputtering is performed by rotating the target 35 of the cathode unit 3 while sputtering, thereby driving the linear drive mechanism 12 to enter the film formation region A. Then, within the film-forming region A, the cathode unit 3 is moved with respect to the film-forming object 2 at a predetermined speed. In the meantime, the plasma is concentrated by the magnet unit 30 in the vicinity of the surface of the target 35 facing the film formation object 2, and the gas ions in the positive ion state in the plasma sputter the target 35, Scattered sputter particles are deposited on the film-forming object 2. With the movement of the cathode unit 3, sputter particles are deposited and deposited in succession from the upstream side to the downstream side in the direction of movement of the cathode unit 3 to form a film. Upon passing through the film formation region A, the cathode unit 3 enters the film formation waiting area B on the opposite side, stops the linear drive mechanism 12, and stops driving the cathode unit 3. Further, if necessary, the film may be reciprocated to perform film formation. In this case, the shutter member 7 is also provided in the film formation waiting area B on the left side, as in the film forming waiting area B on the right side. You may do so.

Next, another embodiment of the film forming apparatus of the present invention will be described. In the following description, mainly only the differences from the first embodiment will be described, and the same reference numerals will be used for the same components and the description will be omitted.

[Embodiment 2]

3 (A) shows a film forming apparatus 201 according to Embodiment 2 of the present invention. In the above embodiment, the shutter member 7 is provided on the cathode unit 3, but in this embodiment 2, the shutter member 27 is provided on the chamber 10 side, and from the outside of the chamber 10 It is supposed to be driven. That is, the front end 27a in the direction in which the shutter member 27 moves to the partition position G1 is an end (in the figure, the lower end) on the bottom wall 10a side of the chamber 10, and the partition position G1 is It is a position moved toward the proximal end portion 51b side of the end portion 51a of the first shielding member 51. In the illustrated example, when the shutter member 27 is in the open position G2, the shutter member 27 is described to penetrate the ceiling wall 10d of the chamber 10, but is schematically shown. , For example, a sufficient space may be provided between the ceiling wall 10d so that the shutter member 27 does not penetrate, and the shutter member 27 is guided freely by sliding movement on the ceiling wall 10d. A member may be provided, and a sealing member may be attached to the sliding moving part, and various configurations can be adopted. The actuator 28 for driving the shutter member 27 is located outside the chamber 10, and a sealing member is provided in a through hole through which the rod 281 for driving passes through the ceiling wall 10d of the chamber 10. After sliding, it is inserted freely. The actuator is not limited to an actuator using a fluid pressure such as a pneumatic cylinder, as in the first embodiment. For example, a screw feed mechanism that converts the rotation of the motor into a linear motion may be used, or a linear motor may be used. , Various linear drive mechanisms can be used.

[Embodiment 3]

4 shows a film forming apparatus 301 according to Embodiment 3 of the present invention. Fig. 4 (A) shows a state where the shutter member 37 is in a partition position, Fig. 4 (B) shows a state where the shutter member 37 is in an open position, and Fig. 4 (C) is a perspective view showing a schematic configuration of the shutter member. Although the above-described Embodiments 1 and 2 were configured to slide the shutter members 7 and 27 linearly between the partitioning position G1 and the open position G2 in the first direction G, this Embodiment 3 is The shutter member 37 is oscillated in an arc in the first direction G.

That is, the shutter member 37 is configured to have a shutter body 371 and a swing arm 372 supporting the shutter body 371, and one end of the swing arm 372 is a horizontal member of the opposing member 4 ( 4a). The cross-sectional shape of the shutter body 371 (the cross-section of the XZ plane) is an arc shape that is a part of a circle drawn around this point O, and at the partition position G1, the tip 37a located at the bottom thereof is The first shielding member 51 contacts the position close to the end of the side surface on the side of the film formation region A, and the opposite end 37b is horizontal between the holder 21 of the film forming object 2 and the opposing member 4 Located in the gap H with the tip of the plate portion 4a, the shutter body 371 covers the opening C (see Fig. 4 (A)). Further, in the open position G2, the tip end 37a in the partitioning direction of the shutter body 371 is spaced apart from the first shielding member 51, so that the holder 21 and the opposing member 4 of the film formation object 2 are opposed. ) Is located in the vicinity of the gap H with the horizontal plate portion 4a, and the end 37b on the opposite side of the shutter body 371 is in contact with the ceiling wall 10d of the chamber 10 (see Fig. 4B). ). The rotation actuator 38 for rotationally driving the shutter member 37 may be a mechanism having a rotational movement mechanism such as a motor, as shown in Fig. 4C, for example, a position of the swing arm 372 It is connected to the shaft 373 installed in operation.

[Embodiment 4]

5 shows a film forming apparatus 401 according to Embodiment 4 of the present invention. Fig. 5 (A) shows a state where the shutter member 47 is in a partition position, and Fig. 5 (B) shows a state where the shutter member 47 is in an open position. In the fourth embodiment, as in the third embodiment, the movement trajectory of the shutter member 47 is made to oscillate substantially between the partition position G1 and the open position G2 in an arc shape. The difference is that the shutter member 47 is supported on the cathode unit 3 by swinging freely.

That is, the shutter member 47 is configured to have a shutter body 471 and a swing arm 472 supporting the shutter body 471, and one end of the swing arm 472 rotates on the first shield member 51 Freely supported. In the illustrated example, the support shaft 473 is rotatably supported at the end 5a of the first shielding member 51. The cross-sectional shape of the shutter body 471 (the cross-section of the XZ plane) is an arc shape that is a part of a circle drawn around this support shaft 473, and at the segment position G1, the tip end 47a located at the upper end thereof The horizontal member 4a of the opposing member 4 contacts the end portion 4c on the film formation region side, but the end portion 47b on the opposite side is spaced apart from the first shielding member 51 at a predetermined distance.

Therefore, in the compartment position, the opening C is not completely shielded, but the lower side is in an open state, so that the sputter particles generated in the film formation waiting area B may return from the lower side to the film forming region side. However, since the side facing the film-forming object 2 is partitioned by the shutter body 471, the possibility of sputtering particles generated in the film-forming waiting area adhering to the film-forming object 2 is low (Fig. 5 (A)). Reference). Moreover, in the open position G2, the front end 47a in the partitioning direction of the shutter body 471 moves away from the end 4c on the film formation region side of the horizontal plate portion 4a, and the opposite end 47b is in the chamber. It moves to the bottom wall 10a side of (10), and contacts the 1st shielding member 51 (refer FIG. 5 (B)).

The rotary actuator for rotationally driving the shutter member 37 is not particularly shown, but a mechanism having a rotating operation mechanism such as a motor is operatively connected to the support shaft 473 of the swinging arm 472 as in the third embodiment. .

[Embodiment 5]

6 shows a film forming apparatus 501 according to Embodiment 5 of the present invention. Fig. 6 (A) shows a state in which the shutter member 57 is a partition position. In the above-described Embodiments 3 and 4, the shutter members 37 and 47 are configured to swing, but in the fifth embodiment, the shutter member 57 is wound to switch between the partition position G1 and the open position G2. I did it. That is, as shown in FIG. 6 (B), the shutter member 57 includes a shutter body 571 in which a number of elongated rigid plate portions extending in the Y-axis direction are freely bent in the Z-axis direction, and this shutter body ( A winding shaft 572 for winding 571) is provided, and the winding shaft 572 is fixed to the chamber 10 side. The take-up shaft 572 is installed on the horizontal plate portion 4a of the opposing member 4 with respect to the gap H, and the holder 21 of the film-forming object 2 is provided with a shutter body 571 during winding and rewinding. ) Is provided with an arc-shaped guide 573 for guiding.

The shutter member 57, in the partition position G1, the shutter member 57 is rewound and stretched through the gap H, and the tip 57a is formed in the film-forming region A of the first shielding member 51 ) Side. Therefore, also in the fifth embodiment, as in the fourth embodiment, the opening C is not completely shielded at the partition position, but the lower end side is in an open state.

Therefore, there is a possibility that sputtered particles generated in the film formation waiting area return from the lower side to the film forming area side, but since the side facing the film forming object 2 is partitioned by the shutter member 57, in the film forming waiting area B There is little possibility that the sputtered particles generated are adhered to the film-forming object 2. In addition, in the open position G2, the tip 57a of the shutter member 57 moves to the position of the gap H and opens. Although not particularly illustrated with respect to the rotary actuator that winds the shutter member 57, a mechanism having a rotating operation mechanism such as a motor is operatively connected to the winding shaft 9.

[Embodiment 6]

7 shows a film forming apparatus 601 according to Embodiment 6 of the present invention. In the fifth embodiment, the shutter member 57 is configured to be wound around the winding shaft 672 provided on the chamber 10 side, but in the sixth embodiment, the shutter member 67 and the cathode unit 3 ) Side. That is, the winding shaft 672 is rotatably mounted on the side surface of the first shielding member 51 on the side of the film formation region A, and the end of the shutter member 67 is connected to the winding shaft 69. . Then, the front end 67a on the partition side passes through the gap H, and is guided through the guide 673 to the upper surface of the horizontal plate portion 4a of the opposing member 4. The holder 21 is provided with an arc-shaped guide 673.

In the shutter body 671, in the partition position G1, the opening C is completely shielded, and in the open position G2, the tip 67a of the shutter body 671 is the position of the gap H It moves to open. The rotary actuator that winds up the shutter member 67 is not particularly shown, but in the same manner as in the fifth embodiment, a rotating operation mechanism such as a motor is provided on the first shielding member 51 and is operatively connected to the winding shaft 69 do.

[Other embodiments]

Further, in the above-described embodiment, the cathode unit 3 has two rotating cathodes 3A and 3B arranged in two stations, but may be three or more or one. Further, not the cathode unit 3, but the target may be a planar cathode unit on a flat plate. In addition, the present invention is not limited to a sputter film forming apparatus, and can be applied to a film forming source of a deposition method that does not use sputtering.

1: film forming apparatus
2: Object to be formed
3: Rotating cathode unit (Team Tabernacle)
7, 27, 37, 47, 57, 67: no shutter
10: chamber
12: linear driving mechanism (film forming source driving mechanism)
A: deposition area, B: deposition waiting area
F: direction of movement
G; First direction, G1: compartment position, G2: open position

Claims (17)

A chamber in which a film-forming object and a film-forming source that causes a film-forming material to fly toward the film-forming object to be deposited on the film-forming object are disposed;
A film forming apparatus comprising moving means for moving the film forming source relative to the film forming object between a predetermined film forming waiting area and a film forming region in the chamber,
And a partition member for partitioning between the film formation area and the film formation waiting area, and a shutter member movable between the film formation area and the open position for opening the film formation waiting area. According to claim 1,
The film formation waiting area is a region where the film forming source and the film forming object face each other, and the film forming waiting area is a region where the film forming source and the film forming object do not face each other. The method according to claim 1 or 2,
The film forming apparatus is characterized in that the film forming standby region and the film forming region are arranged in a second direction that intersects a first direction that goes directly to the film forming surface of the film forming object. According to claim 3,
The moving means moves the film forming source from the film forming waiting area to the film forming area by moving the film forming source relative to the film forming object in the second direction,
In the film forming region, the film forming apparatus is characterized in that the moving means deposits the film forming object by moving the film forming source in the second direction relative to the film forming object. The method according to any one of claims 1 to 4,
The film forming apparatus, characterized in that the position of the shutter member in the first direction directly to the film forming surface of the film forming object is different between the partition position and the open position. The method according to any one of claims 1 to 5,
The shutter member, by partially partitioning the space in the chamber, the film forming apparatus, characterized in that to partition the film formation region and the film formation waiting area. The method according to any one of claims 1 to 6,
The film forming apparatus, characterized in that the shutter member moves between the partition position and the open position by moving in a first direction that goes directly to the film forming surface of the film forming object. The method according to any one of claims 1 to 7,
The film forming apparatus characterized in that the shutter member moves linearly between the partition position and the open position. The method according to any one of claims 1 to 8,
The film forming apparatus is characterized in that the shutter member is configured to swing around a point. The method according to any one of claims 1 to 9,
The film forming apparatus is configured such that the shutter member moves by winding and rewinding the winding shaft. The method according to any one of claims 1 to 10,
The film forming apparatus is characterized in that the shutter member is supported on the chamber side and moves relative to the film forming source during the relative movement of the film forming source and the film forming object by the moving means. The method according to any one of claims 1 to 10,
The shutter member is supported on the film forming source side, and when the film forming source and the film forming object are moved relative to each other by the moving means, the film forming source is moved relative to the film forming object. Device. The method according to any one of claims 1 to 12,
The film forming source is a film forming apparatus, characterized in that the sputtering cathode. The method according to any one of claims 1 to 13,
The film forming source has a magnetic field generating means disposed at a position facing the film forming object via a target disposed in the chamber. The method of claim 13 or 14,
A film-forming apparatus characterized in that plasma is generated around the film-forming source in the film formation waiting area before film-forming to the film-forming object. A preparation step in which a film formation source is placed in a film formation waiting area in a chamber, and a film forming material is brought into emergency from the film formation source;
The film-forming source in which the film-forming material is in a flying state in the preparation step is moved relative to the film-forming object from the film-forming waiting area to the film-forming area in the chamber, so that the film-forming material flying from the film-forming source is formed into the film-forming. A film forming method comprising a film forming step of depositing and depositing on an object,
A shutter member is provided to move between a partition position for partitioning between the film formation region and the film formation standby region and an open position for opening the film formation region and the film formation standby region,
In the preparatory step, the shutter member is positioned at the partition position to partition the film formation region and the film formation standby region,
In the film forming step, the film forming method is characterized in that the shutter member is placed in an open position to move the film forming source from the film forming waiting area to the film forming area relative to the film forming object. A preparation step in which a film formation source is placed in a film formation waiting area in a chamber, and a film forming material is brought into emergency from the film formation source;
The film-forming source in which the film-forming material is in a flying state in the preparation step is moved relative to the film-forming object from the film-forming waiting area to the film-forming area in the chamber, so that the film-forming material flying from the film-forming source is formed into the film-forming. A method of manufacturing an electronic device having a film forming step of depositing and depositing on an object,
A shutter member is provided to move between a partition position for partitioning between the film formation region and the film formation standby region and an open position for opening the film formation region and the film formation standby region,
In the preparatory step, the shutter member is positioned at the partition position to partition the film formation region and the film formation standby region,
In the film forming step, the method of manufacturing an electronic device, characterized in that the shutter member is placed in an open position to move the film forming source from the film formation waiting area to the film forming area relative to the film forming object.

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