KR20220036341A - Sputtering Apparatus and Method for Depositing Film - Google Patents

Abstract

A sputtering device and a film forming method are provided that improve the workability of removing foreign substances from a target and simultaneously shorten the removal time.
A chamber 10 in which a substrate is placed, a moving mechanism 230 that moves the target 110 within the chamber 10 to an opposing area S2 that faces the substrate and a non-opposing area S1 that does not face the substrate; , It is characterized in that it is provided with foreign matter removal rollers 331 and 332 as removal members for removing foreign matter deposited on the target 110 in a state in which the target 110 is disposed in the non-opposing area S1.

Description

Sputtering Apparatus and Method for Depositing Film}

The present invention relates to a sputtering device and a film forming method for forming a thin film on a substrate by sputtering.

In a sputtering device, a technique is known to perform sputtering using a cylindrical target (also called a rotary cathode) that rotates during sputtering. In this technology, foreign substances are deposited over time on the non-erosion portion of the target, which is the portion that does not contribute to sputtering (usually both ends). Since these foreign substances can cause abnormal discharge or contamination of the film forming part, it is necessary to open the chamber and remove them manually. Therefore, removing foreign substances takes effort and time.

Japanese Patent Publication No. 2013-234375 Japanese Patent Publication No. 2019-94548

The purpose of the present invention is to provide a sputtering device and a film forming method that improve the workability of removing foreign substances from a target and simultaneously shorten the removal time.

In order to solve the above problems, the sputtering device of the present invention,

A sputtering device that forms a thin film on a substrate by sputtering from constituent atoms of a cylindrical target that rotates during sputtering,

a chamber in which the substrate is placed,

a moving mechanism that moves the target within the chamber to an opposing area that faces the substrate and a non-opposing area that does not face the substrate;

A removal member is provided to remove foreign substances deposited on the target when the target moves to the non-opposing area.

According to the present invention, foreign matter deposited on the target is removed by the removal member, making it possible to remove the foreign matter without opening the chamber.

As described above, according to the present invention, the workability of removing foreign substances from a target can be improved and the removal time can be shortened.

Figure 1 is a schematic diagram of the internal structure of a sputtering device according to Example 1 of the present invention as seen from above.
Figure 2 is a schematic cross-sectional view of the internal structure of the sputtering device according to Example 1 of the present invention.
Figure 3 is a schematic cross-sectional view of the internal structure of the sputtering device according to Example 1 of the present invention.
Figure 4 is a schematic configuration diagram of a target unit according to Embodiment 1 of the present invention.
Figure 5 is a schematic cross-sectional view of the internal structure of the sputtering device according to Example 2 of the present invention, focusing on the characteristic features.
Figure 6 is a schematic cross-sectional view of the internal structure of the sputtering device according to Example 3 of the present invention, focusing on the characteristic features.
Figure 7 is a schematic cross-sectional view showing an example of an electronic device.

EMBODIMENT OF THE INVENTION Below, with reference to drawings, the form for carrying out this invention will be described in detail by way of example based on examples. However, the dimensions, materials, shapes, relative arrangements, etc. of the components described in this embodiment are not intended to limit the scope of the present invention to these only, unless specifically stated.

(Example 1)

With reference to FIGS. 1 to 4, the sputtering device and film forming method according to Example 1 of the present invention will be described. Figure 1 is a schematic diagram of the internal structure of a sputtering device according to Example 1 of the present invention as seen from above. FIG. 2 is a cross-sectional view seen in the direction of arrow V1 in FIG. 1. FIG. 3 is a cross-sectional view seen in the direction of arrow V2 in FIG. 1. Figure 4 is a schematic configuration diagram of a target unit according to Embodiment 1 of the present invention, (a) in the figure is a schematic configuration diagram viewed from the front near the target unit, and (b) in the figure is a ( This is a cross-sectional view of AA in a).

<Overall configuration of sputter device>

With reference to FIGS. 1 to 3, the overall structure of the sputtering device according to this embodiment will be described. The sputtering device 1 according to this embodiment includes a chamber 10 whose interior is in a vacuum atmosphere, a target unit 100 provided in the chamber 10, and a moving mechanism 230 for moving the target unit 100. It is provided with a driving device 200 having ).

The chamber 10 is provided with a substrate holding mechanism 11 that holds the substrate P and a mask holding mechanism 12 that holds the mask M. By this holding mechanism, the substrate P and the mask M are maintained in a stationary state during the film forming operation (during the sputtering operation). The chamber 10 is an airtight container and is operated by the exhaust pump 20. , the interior is maintained in a vacuum state (or a reduced pressure state) by opening the gas supply valve 30 and supplying gas into the chamber 10 to appropriately change the gas atmosphere (or pressure zone) for processing. The entire chamber 10 is electrically grounded by the ground circuit 40.

The driving device 200 includes a waiting box 210, a pair of guide rails 221 and 222 that guide the moving direction of the waiting box 210, and a moving mechanism 230 that moves the waiting box 210. It is provided with a standby arm 240 that follows the movement of the standby box 210. The waiting box 210 has a hollow interior and is configured to communicate with the outside of the chamber 10 through the inside of the waiting arm 240. Therefore, the inside of the atmospheric box 210 is exposed to the atmosphere. By adopting this configuration, the wirings 51 and 52 connected to the power source 50 installed outside the chamber 10 can be connected to the target unit 100. Meanwhile, the target unit 100 is fixed to the waiting box 210.

The waiting box 210 is configured to move back and forth along a pair of guide rails 221 and 222 by a moving mechanism 230. The moving mechanism 230 employs a ball screw mechanism and includes a ball screw 231 and a drive source 232 such as a motor that rotates the ball screw 231. However, the drive mechanism for reciprocating the waiting box 210 is not limited to the ball screw mechanism, and various known technologies such as the rack and pinion mechanism can be adopted. When a rack and pinion mechanism is used as the moving mechanism 230, it can be installed in the conveyance guide portion.

The standby arm 240 is installed in the cavity of the moving standby box 210 for arranging wires 51 and 52 connected to the power source 50 installed outside the chamber 10. That is, the standby arm 240 has a hollow interior and is configured to operate in accordance with the movement of the standby box 210. More specifically, the standby arm 240 is provided with a first arm 241 and a second arm 242. One end of the first arm 241 is configured to be rotatable with respect to the bottom plate of the chamber 10. One end of the second arm 242 is pivotably supported with respect to the other end of the first arm 241, and the other end is pivotably supported with respect to the waiting box 210.

The drive device 200 configured as described above makes it possible to reciprocate the target unit 100 fixed to the waiting box 210 together with the waiting box 210. As a result, a film forming operation (sputtering) can be performed on the substrate P by operating the target unit 100 during at least one of the outbound and return journeys. Therefore, even when forming a film on a large-sized substrate P, the film forming operation is performed while moving the target unit 100 using the driving device 200, so that the film is formed from one end of the substrate P toward the other end. A thin film can be formed continuously.

<Target unit>

With reference to FIG. 4, an example of a target unit 100 applicable to the sputtering device 1 according to this embodiment will be described. The target unit 100 includes a target 110, a support block 120 that supports both ends of the target 110, and an end block 130. Meanwhile, in this embodiment, two targets 110 are installed, and a support block 120 and an end block 130 that support both ends of the two targets 110 are also provided with two targets 110. ) are installed one by one. However, in the sputtering device according to the present invention, the number of targets is not limited. The target 110 is a cylindrical member that rotates during sputtering, and is also called a rotary cathode. The support block 120 and the end block 130 are fixed to the upper surface of the waiting box 210. The target 110 includes a cylindrical target body 111 and a cathode 112, which is an electrode disposed on the inner periphery of the target. In addition, the target 110 is rotatably supported by the support block 120 and the end block 130, and rotates during sputtering by a drive source such as a motor (not shown) provided in the end block 130. It is structured to do so. Meanwhile, in the case of a magnetron sputtering type sputtering device, a magnet is installed inside the cathode 112 to generate a magnetic field (leakage magnetic field) between the target 110 and the substrate P.

In the target unit 100 configured as described above, plasma is generated between the target 110 and the anode chamber 10 by applying a voltage above a certain level between them. Then, when positive ions in the plasma collide with the target 110, particles of the target material are emitted from the target 110 (target body 111). Particles emitted from the target 110 repeatedly collide, and neutral atoms of the target material among the emitted particles are deposited on the substrate P. As a result, a thin film made of the constituent atoms of the target 110 is formed on the substrate P. Additionally, in the case of the magnetron sputtering method, plasma can be concentrated in a predetermined area between the target 110 and the substrate P by the leakage magnetic field. As a result, sputtering is performed efficiently, so the deposition rate of the target material on the substrate P can be improved. Furthermore, in the target unit 100 according to this embodiment, the target 110 is configured to rotate during sputtering. As a result, the consumption area (eroded area due to erosion) of the target 110 is not concentrated in one part, and the use efficiency of the target 110 can be increased.

The target unit 100 provided with the target 110 configured as above is transported by the drive device 200 provided with the moving mechanism 230 together with the waiting box 210. In FIG. 1, the range S0 represents the movement range of the target 110, and the target 110 does not face the substrate P from the opposing area S2 that faces the substrate P in the chamber 10. It is configured to move up to the non-opposing area S1. Sputtering is performed while the target 110 moves through the opposing area S2. On the other hand, by providing a partition wall 60 near the boundary between the non-opposing area S1 and the opposing area S2, for example, as shown in FIG. 2, the non-opposing area can be moved without lengthening the movement range of the target 110. In S1, the target 110 and the substrate P may not face each other. That is, while the target 110 is located in the non-opposing area S1, a thin film can be prevented from being formed on the substrate P.

In the sputtering device 1 according to the present embodiment, a removal device 300 is installed in the chamber 10 to remove foreign substances deposited in the non-eroding portion that does not contribute to sputtering in the target 110. there is. This removal device 300 includes a driving source 310 including a motor, etc., a holding member 320 configured to rotate within a certain range by the driving source 310, and rotating by the holding member 320. It is provided with foreign matter removal rollers 331 and 332 as removal members that can be axially supported. Preferred materials for the foreign matter removal rollers 331 and 332 include PEEK, ceramic materials, rubber materials such as Viton, and acrylic adhesives.

By the removal device 300 configured as described above, with the target 110 disposed in the non-opposing area S1, foreign matter is deposited on the non-eroded portion of the target 110 by the removal rollers 331 and 332. Foreign substances can be removed. More specifically, when removing foreign matter, the holding member 320 is rotated by the drive source 310 while the two targets 110 are each rotating, and the foreign matter removal rollers 331 and 332 are rotated by the two targets 110. It contacts one middle side and the other side of the target 110, respectively. The foreign matter removal rollers 331 and 332 are configured to rotate in accordance with the rotation of each target 110, and deposited on the target 110 at the contact portion between the target 110 and the foreign matter removal rollers 331 and 332. The foreign matter is cut off and falls off.

Meanwhile, the foreign matter removal rollers 331 and 332 are configured to follow the rotation of the target 110 a little later (at a slightly slower rotation speed), so that the surfaces of the foreign matter removal rollers 331 and 332 and the target 110 are connected to each other. It can create friction between surfaces and effectively remove foreign substances. In addition, the foreign matter removal rollers 331 and 332 may be configured to actively rotate using a motor or the like, rather than being driven by the rotation of the target 110. In this case, at the contact portion between the target 110 and the foreign matter removal rollers 331 and 332, the direction in which the target 110 moves and the direction in which the foreign matter removal rollers 331 and 332 move are opposite, thereby removing the foreign matter. The removal effect can be improved. Furthermore, the foreign matter removal effect can be increased by providing a plurality of irregularities on the surfaces of the foreign matter removal rollers 331 and 332.

After the foreign matter removal operation, the holding member 320 is rotated in the reverse direction by the drive source 310, and the foreign matter removal rollers 331 and 332 are separated from the two targets 110. In this way, the removal device 300 is a device equipped with an approach and separation mechanism that moves the foreign matter removal rollers 331 and 332 toward and away from the target 110. Meanwhile, in FIGS. 1 and 2, the state in which the target 110 and the foreign matter removal rollers 331 and 332 are spaced apart is shown with a solid line, and the state in which they are in contact with each other is shown with a dotted line.

In the target 110 according to this embodiment, both ends in the direction of the rotation center axis are non-eroded areas. When removing foreign matter, the foreign matter removal rollers 331 and 332 contact the non-eroded portions at both ends, so that the foreign substances deposited on the non-eroded portions at both ends are removed.

<Method of tabernacle>

The film forming method (sputtering) using the sputtering device 1 will be explained in process order. First, sputtering is performed within the chamber 10 while moving the target 110 into the opposing area S2 by the driving device 200. Then, when removing foreign substances, the target 110 is moved to the non-opposing area S1 by the driving device 200. Thereafter, in the non-opposing area S1, the non-eroded portions that do not contribute to sputtering in the two targets 110 are removed by the foreign matter removal rollers 331 and 332 installed in the removal device 300 disposed in the chamber 10. Foreign matter deposited in is removed. Meanwhile, a series of operations are performed by a control device (not shown) that controls the operation of the sputtering device 1. However, the operation of rotating the holding member 320 in the removal device 300 may be performed manually by an operator outside the chamber 10. In addition, the removal of foreign matter may be performed each time the target 110 reciprocates, or may be performed every predetermined number of reciprocations, and the frequency of removal can be set appropriately.

According to the sputtering device 1 according to this embodiment, foreign matter deposited in the non-eroded portion of the target 110 is removed by the foreign matter removal rollers 331 and 332 as removal members. This makes it possible to remove foreign substances without opening the chamber 10. Accordingly, the workability of removing foreign substances from the target 110 can be improved, and at the same time, the removal time can be shortened.

(Example 2)

Figure 5 shows Example 2 of the present invention. In this embodiment, the configuration of the target and removal device is different from that of Embodiment 1 above. Since the other structure and operation are the same as those of Example 1, the same reference numerals are given to the same components, and the description thereof is omitted as appropriate.

Figure 5 is a cross-sectional schematic diagram showing the internal configuration of the sputtering device according to Example 2 of the present invention, focusing on the characteristic configuration, focusing on the configuration different from Example 1, and showing the same configuration as Example 1. The configuration is omitted except for some configurations.

In the sputtering device 1A according to the present embodiment, the target 110A constituting the target unit 100A is provided with a plurality of target pieces 111A arranged in a line in the rotation center axis direction.

And, the removal device 300A according to the present embodiment includes a drive source 310A including a motor, a holding member 320A configured to rotate within a certain range by the driving source 310A, and a holding member 320A. It is provided with a foreign matter removal roller 330A as a removal member rotatably supported by 320A. The foreign matter removal roller 330A includes a removal unit 331A for removing foreign matter deposited on non-eroded portions at both ends in the rotation center axial direction of the target 110A, and adjacent target pieces in the plurality of target pieces 111A ( An auxiliary removal unit 332A is provided to remove foreign substances deposited in the gap 112A between 111A).

As described above, when the target 110A having a plurality of target pieces 111A is adopted, the foreign matter removal roller 330A shown in this embodiment is adopted, so that the gap between the neighboring target pieces 111A ( Foreign substances deposited in 112A) can also be removed. On the other hand, also in this embodiment, the same effect as in Example 1 is obtained.

(Example 3)

Figure 6 shows Example 3 of the present invention. In this embodiment, the configuration of the removal device is different from that of Embodiment 1 above. Since the other structure and operation are the same as those of Example 1, the same reference numerals are given to the same components, and the description thereof is omitted as appropriate.

Figure 6 is a cross-sectional schematic diagram showing the internal structure of the sputtering device according to Example 3 of the present invention, focusing on the characteristic configuration, focusing on the configuration different from Example 1, and showing the same configuration as Example 1. The configuration is omitted except for some configurations.

In the above embodiment, the removal device 300 is disposed outside the movement range S0 of the target 110, and the holding member 320 holding the foreign matter removal rollers 331 and 332 is positioned at the target 110. ) shows a case where it is configured to rotate around an axis parallel to the central axis of rotation. In contrast, in the sputtering device 1B according to this embodiment, the removal device 300B is configured to be installed at positions on both sides of the target 110 with the target 110 located in the non-opposing area S1. . Also in the removal device 300B according to this embodiment, a drive source 310B including a motor, etc., a holding member 320B configured to rotate within a certain range by the drive source 310B, and a holding member ( It is provided with a foreign matter removal roller 330B as a removal member that is rotatably supported by 320B). The holding member 320B according to this embodiment is configured to rotate around an axis parallel to the reciprocating movement direction of the target 110.

Even when the removal device 300B configured in this way is adopted, the same effect as in Example 1 is obtained.

<Electronic device manufacturing equipment>

The sputtering devices 1, 1A, and 1B shown in each of the above embodiments can be used as manufacturing equipment for manufacturing electronic devices. Hereinafter, the electronic device manufacturing apparatus and the electronic device manufactured by the electronic device manufacturing apparatus will be described with reference to FIG. 7. The sputtering devices 1, 1A, 1B are used on a substrate P (a laminate is formed on the surface of the substrate P) in the manufacture of various electronic devices such as semiconductor devices, magnetic devices, electronic components, optical components, etc. It can be used to deposit and form a thin film (organic film, metal film, metal oxide film, etc.) (including existing ones). More specifically, the sputtering devices 1, 1A, and 1B are preferably used in the manufacture of electronic devices such as light-emitting elements, photoelectric conversion elements, and touch panels. Among them, the sputtering devices 1, 1A, and 1B according to this embodiment are particularly preferably applied in the production of organic light-emitting devices such as organic EL (ElectroLuminescence) devices and organic photoelectric conversion devices such as organic thin-film solar cells. possible. On the other hand, electronic devices include display devices (for example, organic EL display devices) or lighting devices (for example, organic EL lighting devices) with light-emitting elements, and sensors (for example, organic CMOS image sensors) with photoelectric conversion elements. ) also includes.

An example of an organic EL element manufactured by an electronic device manufacturing apparatus is shown in FIG. 7. The organic EL device shown has an anode (F1), a hole injection layer (F2), a hole transport layer (F3), an organic light-emitting layer (F4), an electron transport layer (F5), an electron injection layer (F6), and an anode (F1) on a substrate (P). The film is formed in the order of the cathode (F7). The sputtering device 1, 1A, 1B according to the present embodiment, in particular, forms a laminated film of a metal film or metal oxide used for an electron injection layer or an electrode (cathode or anode) on an organic film by sputtering. It is preferably used when In addition, it is not limited to film formation on an organic film, and lamination film formation on various surfaces is possible as long as it is a combination of materials that can be filmed by sputtering, such as metal materials and oxide materials.

(etc)

In each of the above examples, the case where the removal member for removing foreign matter is a foreign matter removal roller is shown. However, the removal member according to the present invention is not limited to a foreign matter removal roller, and various structures such as a brush-shaped member can be adopted.

1 Sputter device
10 chamber
100 target units
110 target
200 driving device
230 mobile device
300 removal device
331, 332 Foreign matter removal roller
S1 non-opposed region
S2 opposing area

Claims (8)

A sputtering device that forms a thin film on a substrate by sputtering from constituent atoms of a cylindrical target that rotates during sputtering,
a chamber in which the substrate is placed,
a moving mechanism that moves the target within the chamber to an opposing area that faces the substrate and a non-opposing area that does not face the substrate;
A sputtering device comprising a removal member that removes foreign substances deposited on the target when the target moves to the non-opposing area. According to paragraph 1,
When removing foreign matter, a sputtering device wherein the removal member is in contact with the target while the target is rotating. According to paragraph 2,
The sputtering device is characterized in that the removal member is a roller that rotates in response to the rotation of the target. According to any one of claims 1 to 3,
A sputtering device comprising an approach and separation mechanism that approaches and separates the removal member from the target. According to any one of claims 1 to 3,
A sputtering device, wherein both ends of the target in the direction of the rotation center axis are non-eroded portions, and when removing foreign matter, the removal member is in contact with the non-eroded portions at both ends. According to any one of claims 1 to 3,
The target has a plurality of target pieces arranged in a row in the direction of the rotation center axis of the target,
A sputtering device characterized in that the removal member includes an auxiliary removal part that removes foreign matter deposited in gaps between neighboring target pieces in the plurality of target pieces. A film formation method for forming a thin film on a substrate by sputtering from constituent atoms of a cylindrical target that rotates during sputtering, comprising:
In a chamber, sputtering is performed while moving the target in an opposing area facing the substrate;
A process of moving the target within the chamber to a non-facing area that does not face the substrate;
and removing foreign matter deposited on the target in the non-opposing area using a removal member installed in the chamber. In clause 7,
A film forming method characterized in that foreign substances are removed by rotating the target and bringing the removal member into contact with the target.