KR20070011087A - Vacuum cluster for applying coatings to a substrate - Google Patents

Abstract

A vacuum cluster for applying coatings to a substrate is provided to enhance deposition coating quality and increase productivity of a plant by improving a structure thereof. A vacuum cluster for applying coatings to a substrate(5) includes a vacuum chamber(1), a substrate holder(4), a processing unit(6), and a processing unit transfer unit(7). The substrate holder is used for adjusting a position of the substrate. The processing unit applies the coatings to the substrate. The processing unit transfer unit is moved in parallel to a surface of the substrate holder and/or the substrate. The vacuum chamber includes a main chamber(2) and at least one process chamber(3). The processing unit is installed within the processing chamber of the vacuum chamber. The processing unit transfer unit is installed at the outside of the vacuum chamber and is connected with the processing unit by the substrate holder.

Description

VACUUM CLUSTER FOR APPLYING COATINGS TO A SUBSTRATE}

1 schematically shows a vacuum cluster (first variant) with a single processing compartment that does not separate the vacuum space.

FIG. 2 is a schematic illustration of a vacuum cluster (second variant) with a single process compartment, a passageway and a vacuum gate valve for separating the main compartment from the process compartment, if necessary.

FIG. 3 shows schematically a vacuum cluster (first and second variant) with two processing compartments.

<Explanation of symbols for the main parts of the drawings>

1: vacuum chamber

2: main compartment

3: treatment compartment

4: substrate holder

5: substrate

6: processing unit

7: conveying mechanism

8: holder

9: platform

10: bellows

11: communicating parts

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to vacuum clusters and variations thereof, and to vacuum depositing a material including mass-produced elements such as a cathode ray tube and a flat panel display on a substrate for the purpose of coating a multilayer thin film coating on the front surface of the substrate. It is intended for use in and for coating multi-part and multi-layer coatings of various materials in multicluster vacuum plants.

Methods and plants are known for coating a thin film coating on the outer surface of a cathode ray tube (cathode ray tube (CRT)) after assembly.

In known plants a deposition chamber with a differential vacuuming system consists of a deposition zone and a vacuumization zone.

In operation of the plant, the pressure of the evaporation zone is in the range of from 1x10 ^-1 Pa to 8x10 ^-1 Pa, the evacuation zone pressure is in the range of from 5x10 ^-3 Pa to 7x10 ^-2 Pa.

The cathode ray tube disposed in the substrate holder moves along the vacuum chamber. In this case, the substrate holder is provided with a barrier plate which divides the volume of the vacuum chamber into two zones, the deposition zone and the vacuumization zone. Coatings performed in known plants are deposited in vacuo, for example by magnetron deposition on a portion of the surface adjacent to a restraining ring or other ground region of the CRT screen that facilitates the removal of surface electrostatic discharges on the surface [1].

However, the known plants are characterized by their fundamental disadvantages.

In sequential processing plants, productivity is low. In addition, moving the assembled CRT inside the vacuum chamber does not rule out the ingress of various contaminants and unwanted impurities from the surface of the structural component, and the deposition of these materials on the surface to be coated, which in turn does not guarantee the required quality of the coating. . In this case, malfunctions of individual units of the system cause a complete shutdown of the system when the CRT to be coated through the plant is treated in a continuous and consistent flow. For this reason, the plant has low reliability and serviceability, and eventually low productivity.

Also, known plants cannot reduce the power consumption per CRT to be coated when materials are deposited in proportion to system productivity, since all units of the system must perform strict functions to ensure the operation of the system as a whole. Because.

Also known is a vacuum sputtering plant with a vacuum chamber, which is provided with a passage for positioning the substrate, a sealing element and a processing apparatus for depositing a coating [2].

In addition, vacuum modules (variants thereof) and systems thereof for coating a coating on a substrate are known, which include passages for positioning the substrate, sealing elements, processing apparatus for depositing the coating, and vacuum And a vacuum chamber provided with a gate valve and a processing apparatus carrying mechanism mounted to be movable in a direction parallel to each other with respect to the substrate surface [3].

 Vacuum deposition plants, vacuum modules with design variants thereof, and systems of the modules are intended for use in the field of vacuum deposition of materials on substrates for the purpose of producing high quality thin film multilayer coatings.

However, all known plants which are designed to coat the substrate under vacuum are all characterized by a common serious disadvantage, namely

A) the contamination of the coating itself and the high defect rate do not guarantee the proper quality of the coating,

B) the short service life of preventive and supplementary maintenance;

C) does not guarantee homogeneity or uniformity of coating thickness,

D) failure to ensure the required productivity.

The movement of the carrier with the treatment device inside the vacuum chamber and the presence of undesirable contaminants associated with the coating during the deposition process thus most severely affects the coating cleanliness and defect rate, and ultimately the quality.

In addition, the presence of various communicating components (for water, gas and power supply) that are also placed inside the vacuum chamber during carrier movement requires overall and intermittent expensive measures to protect these components from heat and radiation flow. The effect of this leads to surface destruction and vacuum deterioration of these components, each of which leads to further deterioration of the coating itself.

Finally, the arrangement of processing devices inside the vacuum chamber where the coating coating process takes place significantly limits the use of multiple processing devices in a vacuum chamber with any particular volume, or requires a significant expansion of this volume. This reduces the continuous cycle of operation between preventive and consuming operations, which in turn reduces the overall productivity of the plant.

The proposed invention aims at improving the quality of the deposition coating, increasing the productivity of the plant for similar purposes and improving the functional and technical properties.

In order to solve the problems raised, according to the present invention (first variant), a vacuum chamber, a substrate holder for positioning a substrate, a processing apparatus for coating a coating on the substrate, and the substrate and / or substrate Providing a vacuum cluster for coating a substrate to a substrate, the processing apparatus carrying mechanism mounted to be able to reciprocate parallel to the holder surface, the vacuum chamber within the vacuum cluster having a main compartment and at least one processing compartment; And the processing apparatus is disposed within the processing compartment of the vacuum chamber and mounted to reciprocate into the main compartment of the vacuum chamber parallel to the surface of the substrate holder and / or to the substrate, wherein the processing apparatus carrying mechanism The processing device by a holder disposed outside the vacuum chamber and having a communicating component for supplying the processing device. It is connected.

According to a second variant of the invention, the vacuum chamber has a main compartment and at least one processing compartment, the main compartment of the vacuum chamber being a single processing unit and a vacuum for connecting passages and the main compartment with the processing compartment. A gate valve and disposed in the surface of the substrate holder and / or in a plane orthogonal to the substrate, the processing compartment being designed as a separate unit and coupled to the main compartment of the vacuum chamber, the processing apparatus being the substrate holder Mounted in a processing compartment of the vacuum chamber to reciprocate into a main compartment of the vacuum chamber parallel to the surface of the substrate and / or to the substrate, the processing device carrying mechanism being disposed outside the vacuum chamber and It is connected with the processing apparatus by a holder having communicating parts for feeding.

The holder is designed as a hollow tube rigidly coupled to the conveying mechanism and the processing device, and inside the holder there is arranged a communicating component used as a gas, water and power carrier.

Also in accordance with one of the design variants, the vacuum chamber in the proposed cluster includes two or more processing compartments, each processing compartment having the processing apparatus.

The processing device is mounted on a platform connected with the processing device conveyance mechanism and is designed as a replaceable set of processing parts, the set of processing parts comprising linear sources, targets of etching, assisting and sputtering. , A magnetron sputtering source, and a heater for treating the substrate to coat the coating.

In this case, the processing apparatus conveying mechanism is designed as a carrier, and the holder firmly coupled with the conveying apparatus and the processing apparatus is disposed inside the flexible bellows which is hermetically coupled with the processing compartment and the conveying apparatus.

The design of the vacuum cluster and the design variants which coat the coating proposed as the invention on the substrate have undoubted advantages compared to known devices of similar purpose.

For example, in the claimed design, the fact that the processing device transport mechanism is located outside of the vacuum chamber makes it possible to significantly reduce the amount of contamination caused by the presence of abrasion surfaces when moving the device under vacuum.

The fact that communicating parts (gas, water and power carriers) for operating the processing apparatus are provided inside the hollow cylindrical holder outside the vacuum chamber also contributes to the reduction of contamination. In this case, the length of the holder is chosen prior to the extent of the process of movement of the treatment device relative to the substrate when coating the coating. These holders themselves serve as protective screens to protect the surfaces of the communicating parts from the effects of heat and radiation flow.

According to a second variant, the technical compartment of the vacuum chamber can be designed as an independent unit coupled to the vacuum chamber. In this case the main compartment of the vacuum chamber serves as a compartment for coating the coating and the treatment compartment serves as a compartment for receiving the treatment apparatus.

In this case, the vacuum chamber needs to be equipped with additional communicating parts (gas, water and power carriers), since these parts are all already operating inside the cylindrical holder and are mounted in the vacuum chamber to function independently. Because you can. Thus, penetration of additional contaminants into the vacuum chamber is substantially reduced to zero.

The use of flexible bellows (both variants of the design of the vacuum cluster) is for vacuum sealing of communicating components. Here, one side of the bellows ensures a vacuum tight connection with the processing compartment and the other side ensures a vacuum tight connection with a conveying device disposed outside the vacuum chamber.

The ability to maintain airtightness as the bellows stretch allows for the scanning of the substrate surface while ensuring the free movement of the processing unit in the main compartment.

The vacuum gate valve (second variant) mounted between the passageway and the main compartment and the technical compartment allows for maintenance and replacement of the processing unit on one side without the lack of airtightness of the vacuum chamber, and preventive operation between It allows you to increase the cycle and eventually increase the productivity of the plant as a whole.

When using a large amount of processing apparatus required to coat a multilayer coating of the widest range of materials, several, for example, three processing compartments can be combined with the main compartment of the vacuum chamber, each of which is treated Device. Since the processing apparatus enters the main compartments all at once to coat the coating, the contamination of the processing apparatus itself is significantly reduced and the stability of the vacuum parameters required to coat the coating is ensured. All of the foregoing ensures a high quality of the coating to be coated on the substrate.

Designed in accordance with the invention, the conveying mechanism which is drawn out of the vacuum chamber allows to carry out preventive and maintenance work without the lack of a vacuum inside the vacuum chamber which, if necessary, increases the productivity of the plant as a whole.

1, 2 and 3 show a vacuum cluster proposed as the invention and its design variant.

1 is a schematic illustration of a vacuum cluster (first variant) with a single treatment compartment that does not separate vacuum spaces, and FIG. 2 shows a treatment compartment, passages and, if necessary, a main compartment. Is a schematic illustration of a vacuum cluster (second variant) with a vacuum gate valve for separation from the chamber, and FIG. 3 is a schematic illustration of a vacuum cluster (first and second variant) with two processing compartments Drawing.

A vacuum cluster designed according to a first variant of coating a coating on a substrate (FIG. 1) is a vacuum chamber 1 having a main compartment 2 and a processing compartment 3, and a substrate having a substrate 5. A holder 4, a processing device 6 disposed inside the processing compartment 3, for coating the substrate with a coating, a transport mechanism 7 for transporting the processing device 6, and a processing device 6 A holder 8 connected to the holder, a platform 9 on which the processing device 6 is mounted, and a bellows 10 on which the holder 8, on which the communication component 11 is disposed, is located.

The bellows 10 separates the holder 8 from the periphery and seals the holder 8 in a vacuum space.

Due to the ability of the bellows 10 to maintain airtightness during expansion and contraction, the surface of the substrate 5 with the aid of the processing device 6 is caused by the conveying mechanism 7 reciprocating relative to the substrate 5. When coating the coating on the substrate surface can be scanned.

The holder 8 is designed as a hollow cylindrical tube, inside which a communicating part 11 is installed which ensures the operation of the processing apparatus 6.

Unlike the first variant of the design, the vacuum cluster according to the second variant (FIG. 2) is mounted in a plane perpendicular to the passage 12 and the plane of the substrate holder 4 and / or the substrate 5. And a vacuum gate valve 13 for coupling the main compartment 2 of the vacuum chamber 1 with the process compartment 3.

Furthermore, the processing compartment 3 according to the second variant of the design of the vacuum cluster is designed as a separation unit coupled to the main compartment 2 of the vacuum chamber 1.

3 shows a vacuum cluster with two treatment compartments 3, 3 ′. This vacuum cluster includes a processing compartment 3 'as well as a processing compartment 3', and is disposed inside the processing compartment 3 'to treat the substrate 5 with a coating device 6', and to A conveying mechanism 7 'for conveying the apparatus 6', a holder 8 'connected to the processing apparatus 6', a platform 9 'on which the processing apparatus 6' is mounted, and communicating parts Holder 8 'with 11' includes a bellows 10 'located inward.

To help understand the plant operating relationship, FIG. 3 shows, as an example, a lateral passage 14 formed in the main compartment 2 of the vacuum chamber 1 and provided with a slit gate valve 15 for placing the substrate 5 therein. Is showing. This lateral passage exists in each of the variants of the design of the vacuum cluster, but is not shown in FIGS. 1 and 2. The reason for this is that the modified form of forming the lateral passage in the main compartment of the vacuum chamber may be arbitrary (for example, formed on the upper or side surface of the main compartment 2).

A vacuum cluster, proposed as an invention (first and second variant forms), for coating a coating on a substrate operates as follows.

The substrate 5 is disposed in the substrate holder 4 disposed in the main compartment 2 of the vacuum chamber 1 via the lateral passage 14. Next to the slit gate valve 15 is closed, and the vacuum chamber (1) is the residual pressure ^{(e.g., 5 x 10 -4 - 10 -5} Pa) is degassed (脫氣) to.

Cooling fluid, process gas and power are supplied to the processing device 6 by a communication component 11 located in the bellows 10 and the system enters the operating mode. The transport mechanism 7 is then activated and a coating is deposited on the substrate 5 located in the main compartment 2 by the processing device 6.

The movement of the processing device 6 arranged in the processing compartment 3 into the main compartment 2 is made by a conveying mechanism 7 arranged outside the vacuum chamber 1.

The coating is coated on the substrate 5 according to a specific program while the processing device 6 reciprocates inside the main compartment 2.

Upon completion of the coating coating process, the treatment device 6 moves to an initial position in the treatment compartment 3.

Substrate 5 is then removed from main compartment 2 of vacuum chamber 1. The slit gate valve 15 is opened for this purpose and the substrate 5 is withdrawn from the vacuum chamber 1 through the lateral passage 14.

The passage 12 and the vacuum gate valve 13 arranged between the main compartment 2 and the processing compartment 3 provided in the second variant of vacuum cluster design (FIG. 2) are as follows.

A) maintenance and replacement of the processing unit within the main compartment without vacuum;

B) prolong the cycle between preventive actions and eventually increase the productivity of the vacuum cluster.

In addition, multiple (more than two) processing compartments 3 each having a processing device 6 may be combined with the main compartment 2 of the vacuum chamber 1.

FIG. 3 thus shows the main compartment 2 of the vacuum chamber 1 in which the treatment compartments 3, 3 ′ with the treatment devices 6, 6 ′ are coupled.

The substrate 5 is supplied / removed to / from the substrate holder 4 via the lateral passage 14.

With this design, a larger number of processing devices are used which alternately process the substrates located in the main compartment 2, but the functionality of the equipment can be increased.

Those used as alternative parts of the processing device 6 disposed on the platform 9 include an ion sputtering source in the form of an accelerator with an anode layer and a two-point rotating target as follows (FIG. 3), and the platform 9 ′. Those used as replacement parts for the processing apparatus 6 'disposed in the apparatus include a continuous flat magnetron and a linear infrared substrate heater as follows.

In this case, effective information regarding multi-layer multilayer coatings with numerous different materials is possible. The degree of contamination of the devices themselves is considerably reduced because these devices are alternately present in the main compartment 2 in which the deposition process is carried out.

Examples of specific embodiments of the technique for coating a coating to a substrate using a vacuum cluster designed according to any of the proposed variants are as follows.

The substrate 5 is disposed in the substrate holder 4 through the lateral passage 14 of the main compartment 2 of the vacuum chamber 1, and then the slit gate valve 15 is closed. The substrate 5 is supplied from the outside through the side passage 14 or from the conveying vacuum chamber through the side passage 14 by a single conveying system in vacuum when using one or more vacuum clusters (FIG. 3). ).

The pressure in the main compartment 2 reaches 10 ⁻⁴ Pa. Cold water and an argon-oxygen mixture in a ratio of 95%: 5%, respectively, are supplied to the ion source disposed in the processing compartment 3.

In this case the total pressure in the main compartment 2 is equal to 5 × 10 ⁻² Pa and the temperature of the water supplied from the outside of the vacuum chamber is from 15 ° C. to 18 ° C.

A positive potential of 4 kW is applied to the anode of the ion source contained in the processing apparatus 6, which is an alternative component that causes the onset of discharge, and the ion source is a ceramic indium-tin-oxide (ITO) target (90% In ₂ O ₃ , 10% SnO ₂ ) to form an ion beam.

The transport mechanism 7 is set in a movable state, and together with the processing components (ion source and target) mounted thereon, the platform 9 moves to the main compartment 2, and within the main compartment 2 is placed on the substrate 5. Relatively reciprocating motion.

The stoichiometric composition and thickness of the film is controlled by the quartz sensor. When a certain thickness is reached, the platform 9 with the processing device 6 returns to the processing compartment 3 and the process ends.

The slit gate valve 15 opens and the substrate 5 is removed through the lateral passage 14 (FIG. 3).

In a second variant of the vacuum cluster design, when the passage 12 and the vacuum gate valve 13 are provided between the main treatment compartment and the technical compartment, a coating coating process occurs in a similar manner.

The only difference is that the structural parts described above are for maintaining a vacuum in the processing compartment 3, and the vacuum gate valve 13 (FIG. 2) is processed within the processing compartment 3 under vacuum. During sealing, the passage 12 between the main compartment and the processing compartment is blocked before loading the substrate 5 into the main compartment 2.

This can quickly evacuate the main compartment 2 of the vacuum chamber 1, reduce the process cycle time, and increase the productivity of the equipment.

When using more than one treatment compartment, the coating coating process occurs as follows (Figure 3).

The substrate 5 is moved from the vacuum chamber into the main compartment 2 of the vacuum cluster and placed in the substrate holder 4 through the lateral passage 14 as in the case of a multicluster system. Next, the slit gate valve 15 is closed.

The processing devices 6, 6 ′ disposed in the processing compartments 3, 3 ′ have an alternative source of ion, with an silver target sputtered on the platform 9 in the case of the processing device 6. In contrast, in the case of the processing apparatus 6 ', a magnetron equipped with an infrared heater and an ITO target is installed on the platform 9'.

The pressure inside the main compartment reaches 10 ^-4 Pa. The processing device 6 ′ moves from the processing compartment 3 ′ into the main compartment 2 and is coated with the substrate 5 by the transport mechanism 7 ′.

While the processing apparatus 6 'is moved relative to the substrate 5, the infrared heater is switched on and the substrate temperature reaches 250 ° C. An argon-oxygen mixture at a ratio of 84%: 16%, respectively, is then supplied to the vacuum chamber 1. The pressure inside the main compartment 2 then becomes equal to 5 × 10 ⁻¹ Pa.

A negative potential of 480 V is applied to the magnetron, and an ITO coating with a thickness of 400 kV is coated with a discharge of 5.3 A. The processing device 6 'is then switched off after moving into the processing compartment 3'.

The ion source disposed in the processing compartment 3 is filled with argon gas at a pressure of 6 × 10 ⁻² Pa, and a potential of 4.0 kPa is applied to the ion source. An ion beam is then formed which is directed to the target with a current of 340 mA.

A transport mechanism 7 designed as a carrier moves the ion source disposed on the platform 9 of the processing apparatus 6 to the main compartment 2. Next, the processing apparatus 6 coats the substrate 5 with a coating, and an Ag film having a thickness of 150 mm 3 is formed on the surface of the substrate.

The processing device 6 is then switched off after returning into the processing compartment 3.

The final layer of ITO thin film having a thickness of 400 kPa is formed by the processing apparatus 6 'disposed in the processing compartment 3' exactly the same as the first layer.

When the coating coating process is complete, the slit gate valve 15 opens and the substrate 5 moves from the main compartment 2 through the lateral passage 14 into the common transport chamber of the multicluster plant.

Thus, the design of a vacuum cluster and its variant form for coating a coating on a substrate having the widest range of standard dimensions, proposed as an invention, ensures the versatility and high productivity of the claimed plant.

The transporter drawn out of the vacuum system can, if necessary, perform preventive and up-to-date maintenance of the transporter without lack of vacuum inside the chamber.

The interchangeability of the processing parts mounted on the platform of the processing apparatus makes it possible to reduce the time taken to arrange the processing parts on the platform, which depends on the working set.

The automated design of the processing compartment makes it possible to provide plant versatility by using two or more compartments and by combining the processing parts into the main compartment as an independent processing unit without expanding the volume of the main compartment of the vacuum chamber. do.

By arranging communicating parts inside the holder and sealing the last parts by flexible bellows, they protect these parts from the effects of heat and radiation, while prolonging their service life and preventing various contaminants from entering the substrate surface when coating the coating. prevent.

The presence of a passage with a vacuum gate valve can separate the main compartment from the processing compartment and at the same time maintain the vacuum in the other if the tightness of one of these compartments, which contributes to the overall increase in plant productivity, is lacking.

By providing structural components to the device, a high quality thin film coating made of the widest range of materials of substrates of various standard sizes can be obtained.

The vacuum clusters and variants thereof which propose a coating on a substrate, proposed as an invention, are used for various purposes and can be used in industrial conditions.

<Source of information>

1. US Pat. No. 5489369, of International Classification Code C23C 14/56, published February 6, 1996.

2. German Patent No. 4313353.3 of International Classification Code C23C 14/22, published October 27, 1994.

3. Eurasian Patent No. 003148 (most similar) of International Classification Codes C23C 14/54, 14/56 and 14/34, published February 27, 2003.

Claims (11)

A vacuum cluster for coating a coating on a substrate, With vacuum chamber, A substrate holder for positioning the substrate, A processing apparatus for coating the coating on the substrate, A processing apparatus carrying mechanism mounted to reciprocate in parallel with the surface of the substrate holder and / or with respect to the substrate, The vacuum chamber has a main compartment and at least one processing compartment, wherein the processing apparatus is disposed within the processing compartment of the vacuum chamber and within the main compartment of the vacuum chamber parallel to the surface of the substrate holder and / or to the substrate. And the processing device carrying mechanism is disposed outside the vacuum chamber and connected to the processing device by a holder. Characterized in that the vacuum cluster. A vacuum cluster for coating a coating on a substrate, A vacuum chamber with a passage, A substrate holder for mounting a substrate, A processing apparatus for coating the coating on the substrate, A processing apparatus carrying mechanism mounted to reciprocate in parallel with the surface of the substrate holder and / or with respect to the substrate; Equipped with a vacuum gate valve, The vacuum chamber has a main compartment and at least one processing compartment, wherein the main compartment of the vacuum chamber is a single processing unit and has a vacuum gate valve for connecting passages and the main compartment with the processing compartment and of the substrate holder. Disposed in a plane orthogonal to the surface and / or the substrate, the processing compartment being designed as a separate unit and coupled to the main compartment of the vacuum chamber, wherein the processing apparatus is directed to the surface of the substrate holder and / or to the substrate Mounted in a processing compartment of the vacuum chamber so as to be able to reciprocate into the main compartment of the vacuum chamber in parallel, wherein the processing device carrying mechanism is disposed outside the vacuum chamber and connected to the processing device by a holder. Characterized in that the vacuum cluster. 3. The vacuum cluster of claim 1 or 2, wherein the vacuum chamber comprises two or more processing compartments, each processing compartment having the processing device. 4. The processing apparatus of any one of claims 1, 2 and 3, wherein the processing apparatus is designed with a set of processing components, the set of processing components comprising linear sources, targets of etching, assisting and sputtering. And a magnetron sputtering source, and a heater for treating the substrate to coat the coating on the substrate. 5. The vacuum cluster of claim 4 wherein said processing components are adapted to be replaceable. 5. The vacuum cluster as claimed in claim 1, wherein the processing device is mounted on a platform connected with the processing device conveying mechanism. 6. 7. A vacuum cluster according to any one of claims 1, 2 and 6, wherein said processing device conveyance mechanism is designed as a carrier. 3. The vacuum cluster of claim 1 or 2, wherein the holder is designed as a hollow tube rigidly coupled with the conveying mechanism and the processing device. 9. A vacuum cluster according to any one of claims 1, 2 and 8, wherein said holder is disposed inside a flexible bellows hermetically coupled with said processing compartment and conveyance mechanism. 10. The vacuum cluster according to any one of claims 1, 2, 8 and 9, wherein a communication component for supplying power to the processing apparatus is disposed inside the holder. 11. The vacuum cluster of claim 10, wherein said gas, water and electric carrier are used as communicating components.

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