JP2015183229A - Vacuum vapor deposition apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum vapor deposition apparatus having a shutter exchange mechanism applicable to a linear evaporation source without generating radiant heat to an object to be vapor-deposited and without adding a dedicated drive part for the exchange of a shutter plate to which a vapor deposition material adheres.SOLUTION: A vacuum vapor deposition apparatus of the present invention includes a linear evaporation source having a plurality of nozzles in the longitudinal direction, and a shutter mechanism that causes opening/closing movement of a shutter plate to block a vapor deposition material evaporating from the evaporation source. The shutter mechanism includes a shutter base that supports the shutter plate, a shutter drive part that causes linear opening/closing movement of the shutter base on a plane vertical to a direction of evaporation and supply, shutter plate holding means that holds a plurality of the shutter plates laminated on the evaporation source side of the shutter base, and shutter base separation means that sequentially separates the shutter plates from the evaporation source side by movement on extension of opening movement.

Description

  The present invention relates to a vacuum deposition apparatus for depositing a deposition material on an object to be deposited on a glass substrate, and in particular, has a linear evaporation source provided with a plurality of nozzles, and the evaporation direction of the deposition material that evaporates a shutter mechanism from the evaporation source. It is related with the vacuum evaporation system arrange | positioned so that it may block.

  2. Description of the Related Art Conventionally, a vacuum evaporation apparatus is provided with a shutter mechanism between an evaporation source and an object to be deposited disposed so as to oppose the evaporation source in order to control the amount of evaporation material evaporated from the evaporation source. Such a shutter mechanism controls the amount of vapor deposition on the deposition target by providing a shutter plate so as to block the evaporation direction of the vapor deposition material and opening and closing the shutter plate.

  When vapor deposition is performed on the deposition target while controlling the vapor deposition amount with the shutter mechanism, the vapor deposition material sequentially adheres to the surface of the shutter plate facing the evaporation source. Since the deposition amount of the deposition material on the shutter plate increases in proportion to the deposition processing amount, it is necessary to replace the shutter plate with a new one or to clean the used shutter plate frequently.

  When replacing or cleaning the shutter plate, it is necessary to stop the operation of the vacuum vapor deposition apparatus and remove or attach the shutter plate, or to reduce the exhaust pressure in the vacuum chamber or adjust the temperature of the evaporation source during the re-operation. As described above, it takes a lot of time for replacement and cleaning, and it takes a lot of time to restart.

  As means for solving this problem, for example, in Patent Document 1, a technique for easily replacing shutters by a mechanism that selectively rotates a plurality of shutters that are rotatably supported inside a vacuum vessel one by one. It is shown.

  Patent Document 2 discloses a technique in which a shutter plate is rotated by rotating the inside of a storage cylinder in which a plurality of shutter plates are stacked, and the shutter plate is easily replaced by a mechanism that sequentially removes the shutter plate facing the evaporation source. .

  In Patent Document 3, a heating element is provided on the shutter to prevent the deposit from adhering to the shutter, and it is not necessary to replace the shutter. However, a heating element for heating the shutter is necessary to prevent adhesion. It is.

JP 59-059881 A JP 09-003632 A JP 05-059537 A

It is known that the vapor directivity of the vapor deposition material evaporated from the evaporation source can be approximated to cos ⁿ θ. For example, for the organic materials Alq3, α-NPD and the metal materials Al, Ag, Mg, etc. deposited on the organic EL element, the n value of the vapor directivity is approximately n = 5-8. In order to deposit a uniform film thickness, the amount of vapor deposition is limited by the angle limiting plate 9 at both ends of the vapor directivity as shown in FIG. For example, when the evaporation direction of +30 degrees or more and −30 degrees or less is limited by the angle limiting plate 9, the material adhesion ratio (opening ratio α [%]) to the shutter 7 is α when n = 6. = 83%, and the remaining 17% adheres to the angle limiting plate 9. Here, when the material M [kg] is charged, the material adhesion amount W [kg] is W = M × α. When the acceleration of gravity is g [m / s ² ] and the adhesion area is A [m ² ], if W × g / A> material adhesion force [N / m ² ], peeling of the adhered material occurs. It falls to the evaporation source 10 and causes nozzle clogging. Accordingly, when there is a possibility that the material is peeled off within the continuous operation time, it is necessary to replace the shutter 7.

  In addition, when the deposition object 100 is an organic EL element, the radiant heat from the evaporation source 10 damages the deposition object 100, and thus there is a problem that the radiant heat from the evaporation source 10 must be suppressed.

  However, Patent Document 1 cannot be applied to a linear evaporation source in which a plurality of nozzles are provided and the nozzle of the evaporation source is limited to one point source, due to space problems.

  Further, Patent Document 2 requires a drive unit that extracts the shutter plate separately from the drive unit that rotates the storage cylinder, and requires a space for extraction and storage on the drive unit side. In Patent Documents 1 and 2, when the shutter holding part facing the evaporation source side moves, the vapor deposition material adheres and becomes a generation source of dust that affects the film forming performance.

  Further, Patent Document 3 requires a heating element and generates radiant heat that damages the deposition object 100. In addition, the capital investment such as the heating element control unit and the costs associated therewith increases. In addition, the evaporated vapor deposition material may not adhere to the shutter, but may adhere to a large amount of other structures.

  The present invention has been made in view of the above problems, and an object of the present invention is to add a dedicated drive unit for exchanging the shutter plate to which the vapor deposition material is adhered without generating radiant heat to the vapor deposition target. It is another object of the present invention to provide a vacuum evaporation apparatus having a shutter exchange mechanism that can be applied to a linear evaporation source.

  In order to achieve the above object, the vacuum deposition apparatus of the present invention has the following features as an example.

  The present invention has a linear evaporation source having a plurality of nozzles in the longitudinal direction for supplying vapor deposition material to evaporate, and a shutter mechanism for blocking vapor deposition material evaporated from the evaporation source by opening and closing a shutter plate. Includes a shutter base that supports the shutter plate, a shutter drive unit that linearly opens and closes in a plane perpendicular to the direction in which the shutter base is evaporated and supplied, and a plurality of shutter plates that are stacked on the evaporation source side of the shutter base. Shutter plate holding means for holding the shutter plate, and shutter plate separating means for sequentially separating the shutter plate from the evaporation source side by movement on the extension of the opening movement of the shutter plate.

  According to the present invention, there is provided a shutter replacement mechanism that can be applied to a linear evaporation source without generating a radiant heat to an object to be deposited and without adding a dedicated drive unit for replacing a shutter plate to which a deposition material is adhered. The vacuum evaporation apparatus which has can be provided.

It is the side view of an evaporation source, and the graph which shows the vapor directivity of the vapor deposition substance evaporated from an evaporation source. It is a perspective view which shows 1st Embodiment of the vacuum evaporation system which has 1st Example of the shutter mechanism of this invention, and 1st Example of the collection | recovery mechanism which collect | recovers shutter plates. FIG. 3 is a side view of the shutter mechanism and the recovery mechanism as viewed from the arrow A and a top view of the shutter mechanism at the evaporation source standby position shown in FIG. 2, and is an explanatory view of the shutter plate replacement operation and recovery operation. It is a figure which shows a state. 2 is a side view of the shutter mechanism and the recovery mechanism as viewed from the arrow A and a top view of the shutter mechanism at the evaporation source standby position shown in FIG. 2, and is an explanatory view of the shutter plate replacement operation and recovery operation. It is a figure which shows a state. It is a figure which shows 2nd Embodiment of the vacuum evaporation system which has the 2nd Example of the shutter mechanism of this invention. It is a figure which shows 3rd Embodiment of the vacuum evaporation system which has a 3rd Example of the shutter mechanism of this invention, and is the figure which attached | subjected the B side view which looked at the direction of arrow B in FIG. It is a figure which shows 4th Embodiment of the vacuum evaporation system which has a 4th Example of the shutter mechanism of this invention. It is a figure which shows 5th Embodiment of the vacuum evaporation system which has a 2nd Example of the collection | recovery mechanism of this invention. It is a figure which shows 6th Embodiment of the vacuum evaporation system of this invention which provided the shutter plate unit supply mechanism.

  An embodiment according to the present invention will be described with reference to the drawings. In addition, this structure shown in figure is arrange | positioned in the vacuum chamber 11 as shown in FIG. 8, The inside is maintained by the pressure reduction part which is not shown in figure in the predetermined pressure reduction state.

  FIG. 1 is a side view of the evaporation source 10 and a graph showing the vapor directivity of the vapor deposition material evaporated from the evaporation source 10. The crucible 2 is filled with the vapor deposition material 1 and is heated by the heater 3 to a temperature at which the vapor deposition material 1 evaporates. The evaporated deposition material is evaporated from the hole (nozzle) 6 on the upper surface of the crucible 2 and deposited on the deposition object 100 to form a desired film.

  Note that the heater 3 and the crucible 2 are covered with the reflector 4 and the cooling BOX 5 in order to reduce the outflow of heat from the heater 3 and the crucible 2 to the outside. Further, in order to deposit a uniform film thickness, the amount of vapor deposition is limited by the angle limiting plate 9 in the small portions at both ends of the vapor directivity. Then, the deposition amount is monitored by a deposition amount monitoring sensor (not shown), and after the deposition amount is stabilized to a desired value, the shutter plate 72 is opened and deposition is started.

(Embodiment 1)
FIG. 2 is a perspective view showing a first embodiment of a vacuum deposition apparatus 50 having a first embodiment S1 of the shutter mechanism 7 of the present invention and a first embodiment K1 of the recovery mechanism 8 for recovering the shutter plate 72. It is. 3 and 4 show a side view of the shutter mechanism 7 and the recovery mechanism 8 viewed from the arrow A and a top view of the shutter mechanism 7 viewed from the top at the standby position of the evaporation source 10 shown in FIG. It is explanatory drawing of 72 exchange operation | movement and collection | recovery operations. FIG. 3 shows a state before replacement, and FIG. 4 shows a state after replacement.

  As shown in FIG. 2, the evaporation source 10 is a type in which a plurality of nozzles 6 are arranged in a straight line, and is called a linear evaporation source 10. After the shutter plate 72 is opened at the standby position shown in FIG. 2, the linear evaporation source 10 is moved horizontally in the X direction indicated by the arrow by a driving device (not shown) to form a uniform film on the deposition object 100 such as a glass substrate. Is vapor-deposited.

  Further, after completion of vapor deposition or when the vapor deposition amount is not stable at a desired value, the standby plate 72 is closed as shown in FIG. 3 to wait for extra vapor deposition material to other structures. It plays a role in preventing adhesion. For example, if the shutter driving unit 7k is configured as shown in FIG. 2, it is possible to transmit the rotational movement of the motor to the horizontal movement of the shutter plate 72 and easily open and close the shutter plate 72. .

  Next, the shutter plate 72 replacement operation will be described with reference to FIGS. The shutter mechanism 7 includes a shutter drive unit 7k, a shutter base 71, a plurality of shutter plates 72 stacked on the evaporation source 10 side, a shutter plate holding means 70, and a shutter that separates the shutter plate 72 from the shutter base 71. Plate separation means 74.

  The shutter plate holding means 70 is provided at both ends in the longitudinal direction of the shutter base 71, a plurality of holding portions for holding a plurality of stacked shutter plates 72, and a shutter plate corresponding to the holding portion. 72 has a plurality of held portions provided at both ends in the longitudinal direction and held by the holding portion. The holding part and the held part are shifted in the lateral direction according to the number of stacked shutter plates 72.

  In Example S1, magnet portions 73a, 73b, and 73c (73) are provided as holding portions corresponding to the shutter plates 72a, 72b, and 72c (72) in which three shutter bases 71 are laminated. Further, the shutter plate 72 corresponds to the magnet portions 73a, 73b, and 73c (73), respectively, and is an extension portion formed of a material that is attracted to the magnet extending from the end portion, for example, a convex bending. It has processing parts 72αa, 72αb, 72αc (72α). Accordingly, each shutter plate 72 is held on the shutter base 71 by the adhesive magnetic force between the convex bent portion 72α and the magnet portion 73. Note that a magnet portion may be provided in the held portion, and the holding portion may be formed of a material that is attracted to the magnet.

  And the holding | maintenance part of the magnet part 73 (73a, 73b, 73c) has a slide structure which can be spaced apart from the convex bending process part 72 (alpha), as shown in the top view of FIG. The slide structure of the magnet unit 73 may be grooved on the upper surface of the shutter base 71 or a linear guide may be provided.

  As shown in the top view of FIG. 4, the shutter plate separating means 74 has a separation block 74α that is processed into a slope and fixed to the recovery BOX 8A. The separation block 74α is a mechanism for releasing the adhesive magnetic force between the convex bending portion 72α and the magnet portion 73. Normally, the shutter plate 72 is on the evaporation source 10 in the standby position, and is attached so as not to diffuse the vapor deposition material 1 to unnecessary portions. When the evaporation source 10 deposits the next deposition target portion 100 again, the shutter plate 72 is indicated by the shutter drive unit 7k in the direction opposite to the arrow X direction shown in FIG. If it moves to the opening direction, as shown in FIG. In the following description, the X direction is referred to as an opening direction, and the opposite direction to the X direction is referred to as a closing direction.

  However, in the current shutter plate 72, FIG. 3, when it is determined that the shutter plate 72a has obtained 1 vapor deposition of a predetermined amount of vapor deposition material, it further moves horizontally from the standby position to the extension in the opening direction, as shown in FIG. Move to the shutter replacement position. As shown in the top view of FIG. 4, the sloped separation block 74α enters the gap between the convex bent portion 72αa of the shutter plate 72a and the magnet portion 73a, the adhesive magnetic force becomes invalid, and the shutter plate 72a falls. To do. As a result, the shutter plate 72 can be replaced.

  As shown in FIG. 4, the dropped shutter plate 72 a falls to the recovery BOX 8 </ b> A provided immediately below the replacement position of the shutter plate 72. It is desirable that the recovery BOX 8A has a structure in which the impact of the dropped shutter plate 72 is reduced and the adhered material is not scattered. Therefore, for example, a buffer portion such as a spring may be provided on the recovery bottom surface 8As of the recovery BOX 8A. Further, in the recovery BOX 8A, the recovery bottom surface 8As may be inclined. In order to keep the collected shutter plate 72 away from the heat source and reduce the scattering of the deposits, it is better to set the inclination direction opposite to the evaporation source 10.

  Further, in order to collect the shutter plate 72 laminated on the upper layer, it is necessary to move further horizontally in the opening direction than the lower shutter plate 72. Accordingly, the length L of the recovery BOX 8A is set such that the uppermost shutter plate 72c can be recovered.

The shutter base 71 has a flow path through which a coolant such as cooling water can pass, and the inlet / outlet can be connected to the coolant.
In addition, the vertical and horizontal lengths of the adhesion surface of the deposition material 1 on the shutter plate 72 are longer than the vertical and horizontal lengths of the shutter base 71. With such a length relationship, when the shutter plate is opened and closed, the vapor deposition material 1 does not adhere to the shutter base 71, and as a result, the generation of dust of the vapor deposition material that adversely affects the film formation performance. Can be eliminated.

  As described above, according to the first embodiment, the shutter mechanism 7 disposed so as to block the vapor deposition material evaporated from the evaporation source further moves the shutter plate 72 over the extension in the opening direction of the shutter plate 72 to release the shutter. 72 can be dropped. As a result, it is not necessary to provide a drive unit for newly dropping, and the shutter plate 72 can be replaced with a single drive mechanism.

  Further, as described above, according to the first embodiment, it is not necessary to provide a heating element, and further hold the shutter plate 72 and flow the coolant into the shutter base 71 facing the deposition target 100, Radiation heat to the deposition object 100 can be reduced as much as possible, and film formation performance can be improved.

  In the following description of the embodiments, components other than those necessary for the description are not given to the components including the shutter plate 72 in order to avoid complexity.

(Embodiment 2)
FIG. 5 is a diagram showing a second embodiment of the vacuum evaporation apparatus 50 having the second example S2 of the shutter mechanism 7 of the present invention, and a diagram corresponding to FIG. 4 of the first embodiment. is there. Except for the shutter mechanism 7, the second embodiment is the same as the first embodiment. However, the recovery mechanism 8 is not shown.

  The difference of the embodiment S2 from the embodiment S1 is that the shutter plate holding means 70 and the shutter plate separating means 74 are different. The embodiment S1 is performed using a magnetic force, whereas the embodiment S2 is performed using a hook. Other parts constituting the shutter mechanism 7 are the same.

In the shutter plate holding means 70 of the embodiment S2, the hook pin 75 disposed on the side surface of the shutter base 71 as a holding portion is used, and the extended portion extending from the end portion of the shutter plate 72 as the holding portion, as in the embodiment S1. For example, it has the notch process part 72 (beta) a provided in the convex bending process part 72 (alpha) a.
The shutter plate separating means 74 has a separation block 74β whose tip is processed into a flat surface.
With this structure, as shown in the example in which the shutter plate 72a in FIG. 5 is replaced, the shutter plate 72a is further moved on the extension in the opening direction from the standby position and moved horizontally to the shutter replacement position, as in the case of Example S1. As a result, the separation block 74β pushes the upper portion of the notched portion 72βa of the convex bent portion 72αa, the convex bent portion 72αa is separated from the hook pin 75a, and the shutter plate 72a falls. As a result, the shutter plate 72a can be replaced.

  Also in the embodiment S2, the same effect as the embodiment S1 can be obtained by using a simpler mechanism called a hook. In Example S2, the shutter plate 72 does not necessarily need to be made of a magnetic material.

(Embodiment 3)
FIG. 6 is a view showing a third embodiment of the vacuum evaporation apparatus 50 having the third example S3 of the shutter mechanism 7 of the present invention, and is a view corresponding to FIG. It is the figure which attached | subjected the B side view seen from the direction of arrow B in FIG. Except for the shutter mechanism 7, the second embodiment is the same as the first embodiment. However, the recovery mechanism 8 is not shown.

  The difference between the embodiment S3 and the embodiment S1 is that the shutter plate holding means 70 is different. In the embodiment S1, the magnetic force is used, whereas in the embodiment S3, the clamp 76 is used. Other parts constituting the shutter mechanism 7 are the same.

The shutter plate holding means 70 of Example S3 is provided on the upper surface of the shutter base 71 as a holding portion, for example, a convex bent portion 72α having a flat portion extending from the end of the shutter plate 72 as a holding portion, And a clamp 76 that holds the convex bent portion 72α with a spring 76β.
The shutter plate separation means 74 has a separation block 74α whose tip is sloped as in the embodiment S1.

  With this structure, as shown in the example of replacing the shutter plate 72a in FIG. 6, the shutter plate 72 is moved horizontally from the standby position to the shutter replacement position located in the opening direction, as in the embodiment S1, The sloped separation block 74α overcomes the spring 76βa, opens the clamp 76a, separates the shutter plate 72a from the shutter base 71, and drops it. As a result, the shutter plate 72a can be replaced.

  In Example S3, the same effect as Example S1 can be obtained by using a mechanism called a clamp 76.

(Embodiment 4)
FIG. 7 is a view showing a fourth embodiment of the vacuum evaporation apparatus 50 having the fourth example S4 of the shutter mechanism 7 of the present invention, and is a view corresponding to FIG. 4 of the first embodiment. is there. Except for the shutter mechanism 7, the second embodiment is the same as the first embodiment. However, the recovery mechanism 8 is not shown.

  The difference of the embodiment S4 from the embodiment S1 is that the shutter plate holding means 70 and the shutter plate separating means 74 are different. In Example S1, the magnetic force is used, whereas in Example S4, the plunger 77 is used. Other parts constituting the shutter mechanism 7 are the same.

In the shutter plate holding means 70 of Example S4, the magnet portion 73 disposed in the shutter base 71 that fixes the shutter plate 72 as a holding portion by magnetic force is used, and at least a portion corresponding to the magnet portion 73 is a magnet as the held portion. And an engaging groove or hole 72γ (72γa) provided in each of the plurality of stacked shutter plates 72.
The shutter plate separating means 74 has a projection 77 δ that engages with a groove or hole 72 γ of one shutter plate out of a plurality of stacked shutter plates 72, and a spring 77 γ that engages the projection 77 δ. And a jar 77.

  With this structure, as shown in the example of replacing the shutter plate 72a in FIG. 7, when the shutter 72 is further moved in the opening direction to reach the shutter replacement position, the protrusion 77δ is formed in the groove of the lowermost shutter plate 72a, or When engaging with the hole 72γa and horizontally moving from the shutter replacement position to the shutter closing position again, only the engaged shutter plate 72a is left on the plunger 77 side and is separated from the shutter base 71 and dropped. As a result, the shutter plate 72 can be replaced.

  In the examples S1 to S3, the shape of the shutter plate 72 to be stacked differs depending on the mounting position of the convex bent portion 72α. However, according to the structure of this example S4, the structure and position of the groove or hole 72γ are changed. There is an advantage that the shutter plates 72 to be stacked can have the same shape. Further, it is preferable that the hooking process is a groove process rather than a hole process in consideration of adhesion of the vapor deposition material to the shutter base 71 and the like.

  Moreover, also in Example S4, the same effect as Example S1 can be show | played by using the mechanism called a plunger.

(Embodiment 5)
FIG. 8 is a fifth embodiment of the vacuum evaporation apparatus 50 having the second example K2 of the recovery mechanism 8 of the present invention, corresponding to FIG. 4 of the first embodiment, and a top view in FIG. 4 is omitted. doing. Except for the recovery mechanism 8, the second embodiment is the same as the first embodiment.

  In the embodiment K2, unlike the embodiment K1, the shutter plate unloading mechanism 8B is disposed as the collecting mechanism 8 in the dropping direction of the shutter plate 72. The shutter plate carry-out mechanism 8B includes a carry-out preliminary chamber 13, and an upper surface gate valve 12a and a side gate valve 12b for carrying out the shutter plate 72 without breaking the vacuum of the vacuum evaporation apparatus 50.

  When the shutter plate 72 is replaced and dropped, the upper gate valve 12a of the carry-out preliminary chamber 13 whose exhaust pressure has been reduced is opened, and the shutter plate 72 is introduced into the carry-out preliminary chamber 13. Thereafter, the upper gate valve 12a is closed, only the carry-out preliminary chamber 13 is released to the atmosphere, the side gate valve 12b is opened, and the shutter plate 72 is recovered. The drop height of the shutter plate 72 is several tens of centimeters, and there is no problem that the vapor deposition material 1 attached to the shutter 72 scatters. However, if necessary, a buffer portion such as a spring may be provided on the floor of the carry-out preliminary chamber 13.

  With such a structure, the used shutter plate 72 can be recovered without stopping the operation of the vacuum vapor deposition apparatus and releasing the inside of the vacuum chamber 11 to the atmosphere.

(Embodiment 6)
FIG. 9 is a view showing a sixth embodiment of the vacuum evaporation apparatus 50 provided with the shutter plate unit supply mechanism 20. The shutter plate unit supply mechanism 20 includes a supply reserve chamber 15 disposed on the side surface of the vacuum chamber 11, an exchange holder 14 on which a plurality of unused shutter plates are placed, a vacuum chamber 11, and a supply reserve chamber 15. A gate valve 12c provided between the gate valve 12c, a shutter drive unit 7k for extending the rail along the extension of the opening / closing operation until just before the gate valve 12c, and moving the supply holder 14 toward the shutter mechanism 7, and a supply spare A gate valve 12d is provided for isolating the chamber 15 from the air atmosphere area. The supply preliminary chamber 15 may be provided on the right side surface of the vacuum chamber 11.

  Then, after all the shutter plates 72 are replaced and dropped, the side gate valve 12c of the supply preparatory chamber 15 that has been evacuated and decompressed is opened and the replacement holder 14 is moved horizontally to additionally supply the stacked shutter plates 72. be able to. With such a structure, it is possible to supply the shutter plate 72 without stopping the operation of the vacuum vapor deposition apparatus and releasing the inside of the vacuum chamber 11 to the atmosphere.

  With the structure and operation shown in the first to fourth embodiments described above, the evaporation of the shutter plate 72 is performed without adding a replacement drive unit and without affecting the size of the device itself. Those facing the source 10 can be updated sequentially.

  Further, with the structure and operation shown in the first to fourth embodiments described above, it is not necessary to provide a heating element, and the shutter plate 72 is further held in the shutter base 71 facing the deposition target 100. By flowing the coolant, the radiant heat to the deposition object can be reduced as much as possible, and the film forming performance can be maintained.

  The shutter plate holding means is not limited to the above, and any structure that allows the shutter plate 72 to be dropped by moving the position on the extension line on the shutter opening / closing movement axis can be used without departing from the spirit of the present invention. Various modifications may be made. Further, in order to prevent vapor deposition materials from adhering to structures other than the shutter plate 72 as much as possible, the shutter plate 72 has a larger area facing the evaporation source 10 than the shutter base 71, and the shutter plate holding portion is not exposed to the evaporation source 10 side. A structure is desirable.

  Moreover, if it is set as the structure and operation | movement shown to Embodiment 5 and 6, operation | movement of a vacuum evaporation system will be stopped, and collection | recovery and additional supply of the shutter board | plate 72 will be carried out without releasing the inside of the vacuum chamber 11 to air | atmosphere. It can be carried out.

  In the above description, an example of a vacuum vapor deposition apparatus that forms a film to be deposited in a horizontal state has been described. However, the present invention can also be applied to a vacuum deposition apparatus that forms a film in a vertical state. In that case, when the shutter plate 72 is moved up and down and dropped, it is necessary to devise such as receiving it obliquely like the collecting mechanism 8A so that no impact is applied to one side.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

1: Vapor deposition material 6: Nozzle 7: Shutter mechanism 7k: Shutter drive unit 70: Shutter plate holding means 71: Shutter base 72: Shutter plate 72α: Convex bent part 72β: Notch processed part 72γ: Groove or hole 73: Magnet part 74: Shutter plate separation mechanism 74α, 74β: Separation block 75: Hook pin 76: Clamp 76β: Spring 77: Plunger 77γ: Spring 77δ: Projection part 8: Collection mechanism 8A: Collection BOX 8B: Shutter plate unloading mechanism 9: Angle limiting plate 10: Evaporation source 11: Vacuum chamber
12a, 12b, 12c, 12d: Gate valve 13: Unloading preliminary chamber 14: Replacement holder 15: Supply preliminary chamber 100: Deposited material

Claims (11)

A linear evaporation source having a plurality of nozzles for evaporating and supplying the vapor deposition material in the longitudinal direction; and a shutter mechanism for blocking the vapor deposition material evaporated from the evaporation source by opening and closing a shutter plate;
The shutter mechanism is
A shutter base for supporting the shutter plate;
A shutter drive unit for linearly opening and closing the shutter base in a plane perpendicular to the direction in which the evaporation base is supplied;
Shutter plate holding means for holding a plurality of the laminated shutter plates on the evaporation source side of the shutter base;
A vacuum deposition apparatus, comprising: shutter plate separating means for sequentially separating the shutter plate from the evaporation source side by movement of the shutter plate on an extension of opening movement. The vacuum evaporation apparatus according to claim 1,
The shutter plate holding means holds a plurality of the shutters that are provided at the first ends on both sides in the longitudinal direction of the shutter base so as to be shifted in the short direction with respect to the plurality of stacked shutter plates. And a second end portion on both sides in the longitudinal direction of the shutter plate corresponding to the holding portion, and extending from the end portion toward the shutter base and held by the holding portion. A plurality of held parts.
A vacuum evaporation apparatus characterized by that. The vacuum evaporation apparatus according to claim 2,
The holding part is a magnet part made of a magnet and movable in the longitudinal direction,
The held part is an attracting part that is attracted to the magnet part,
The shutter plate separation means is a separation block whose tip is sloped so that the adhesive magnetic force formed by the magnet portion and the attracting portion can be released.
A vacuum evaporation apparatus characterized by that. The vacuum evaporation apparatus according to claim 2,
The holding portion is a hook pin disposed on an end side surface of the shutter base;
The held portion is a hook that engages with the hook pin,
The shutter plate separating means is a separation block whose tip is processed into a flat surface and is in contact with the shutter base side of the hook.
A vacuum evaporation apparatus characterized by that. The vacuum evaporation apparatus according to claim 2,
The held portion has a flat portion,
The holding part is a clamp that is provided on the opposite side of the evaporation source of the shutter base and presses the flat part,
The shutter plate separating means is a separation block whose tip is sloped so that the clamp can be separated.
A vacuum evaporation apparatus characterized by that. The vacuum evaporation apparatus according to claim 1,
The shutter plate holding means includes a holding portion having a magnet portion disposed in a shutter base for adhering and fixing the shutter plate by a magnetic force, a suction portion that attracts the magnet portion to a portion corresponding to the magnet portion, A holding portion having a hooking groove or hole provided on each of the shutter plates stacked in a sheet,
The shutter plate separating means is a plunger having a protrusion that engages with the groove or hole of one of the shutters that are stacked, and a spring that engages the protrusion. Performs the engagement with the shutter plate at the lowest layer by the movement on the extension of the opening movement with the plunger, and maintains and separates the engaged shutter plate when returning to the closing direction again.
A vacuum evaporation apparatus characterized by that. A vacuum deposition apparatus according to any one of claims 1 to 6,
The shutter base has a coolant channel therein.
A vacuum evaporation apparatus characterized by that. A vacuum deposition apparatus according to any one of claims 1 to 6,
The vertical and horizontal lengths of the deposition surface of the vapor deposition material of the shutter plate are longer than the vertical and horizontal lengths of the shutter base,
A vacuum evaporation apparatus characterized by that. A vacuum deposition apparatus according to any one of claims 1 to 6,
The shutter plate collecting portion disposed immediately below the shutter plate from the shutter base;
A vacuum evaporation apparatus characterized by that. In the vacuum evaporation apparatus in any one of Claim 1 to 6,
A carry-out preliminary chamber of the shutter plate disposed outside the vacuum chamber of the vacuum vapor deposition apparatus in a direction in which the shutter plate is separated and dropped, and a gate valve provided between the vacuum chamber and the carry-out preliminary chamber. A vacuum deposition apparatus characterized by comprising: The vacuum deposition apparatus according to any one of claims 1 to 6, wherein the shutter plate is provided on a side surface outside the vacuum chamber of the vacuum deposition apparatus on an extension of the opening / closing operation of the shutter mechanism. A chamber, an exchange holder for placing a plurality of stacked unused shutter plates, a gate valve provided between the vacuum chamber and the supply preliminary chamber, and an extension of the opening / closing operation to the shutter mechanism. A moving mechanism for moving the supply holder toward the shutter plate unit supply mechanism,
A vacuum evaporation apparatus characterized by that.

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