KR20190100976A - 라디오 주파수 격리된 히터들을 갖는 정전 척 - Google Patents

라디오 주파수 격리된 히터들을 갖는 정전 척 Download PDF

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Publication number
KR20190100976A
KR20190100976A KR1020197024206A KR20197024206A KR20190100976A KR 20190100976 A KR20190100976 A KR 20190100976A KR 1020197024206 A KR1020197024206 A KR 1020197024206A KR 20197024206 A KR20197024206 A KR 20197024206A KR 20190100976 A KR20190100976 A KR 20190100976A
Authority
KR
South Korea
Prior art keywords
metal layer
heater assembly
heater
metal
heaters
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020197024206A
Other languages
English (en)
Korean (ko)
Inventor
데이비드 벤자민슨
켄 샤츠
드미트리 루보미르스키
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20190100976A publication Critical patent/KR20190100976A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H01L21/67098—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/34—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater flexible, e.g. heating nets or webs
    • H01L21/6831—
    • H01L21/6835—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
  • Drying Of Semiconductors (AREA)
KR1020197024206A 2017-01-20 2018-01-12 라디오 주파수 격리된 히터들을 갖는 정전 척 Ceased KR20190100976A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/411,896 2017-01-20
US15/411,896 US20180213608A1 (en) 2017-01-20 2017-01-20 Electrostatic chuck with radio frequency isolated heaters
PCT/US2018/013631 WO2018136335A1 (en) 2017-01-20 2018-01-12 Electrostatic chuck with radio frequency isolated heaters

Publications (1)

Publication Number Publication Date
KR20190100976A true KR20190100976A (ko) 2019-08-29

Family

ID=62906927

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197024206A Ceased KR20190100976A (ko) 2017-01-20 2018-01-12 라디오 주파수 격리된 히터들을 갖는 정전 척

Country Status (6)

Country Link
US (1) US20180213608A1 (cg-RX-API-DMAC7.html)
JP (1) JP2020506508A (cg-RX-API-DMAC7.html)
KR (1) KR20190100976A (cg-RX-API-DMAC7.html)
CN (1) CN110226222B (cg-RX-API-DMAC7.html)
TW (1) TWI799403B (cg-RX-API-DMAC7.html)
WO (1) WO2018136335A1 (cg-RX-API-DMAC7.html)

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JP2022534141A (ja) * 2018-10-12 2022-07-28 アプライド マテリアルズ インコーポレイテッド ヒータが一体化されたチャンバリッド
KR102164132B1 (ko) * 2018-11-28 2020-10-12 한국생산기술연구원 멀티 프로버용 척 조립체 및 채널
IL283621B2 (en) 2018-12-21 2025-04-01 Asml Holding Nv Retinal subfield thermal control
WO2020251876A1 (en) * 2019-06-10 2020-12-17 Lam Research Corporation Power and data transmission to substrate support in plasma chambers via optical fiber
CN112992635B (zh) * 2019-12-13 2023-10-24 中微半导体设备(上海)股份有限公司 一种晶圆固定装置及其形成方法、等离子体处理设备
KR102867189B1 (ko) * 2020-03-31 2025-09-30 어플라이드 머티어리얼스, 인코포레이티드 고온 마이크로-존 정전 척
KR102677038B1 (ko) * 2020-05-22 2024-06-19 세메스 주식회사 정전 척과 그 제조 방법 및 기판 처리 장치
CN211957596U (zh) * 2020-05-28 2020-11-17 北京鲁汶半导体科技有限公司 一种等离子体刻蚀系统及其可用于加热的法拉第屏蔽装置
JP7564060B2 (ja) * 2021-06-08 2024-10-08 東京エレクトロン株式会社 プラズマ処理装置
US12581880B2 (en) * 2022-11-02 2026-03-17 Applied Materials, Inc. Faraday faceplate
WO2025205043A1 (ja) * 2024-03-28 2025-10-02 東京エレクトロン株式会社 プラズマ処理装置及び基板支持台
CN119626881B (zh) * 2024-11-22 2026-05-08 北京北方华创微电子装备有限公司 半导体工艺设备
US12652731B1 (en) 2025-10-21 2026-06-09 Tystar Corporation Hybrid induction-resistive heating system for processing next generation electronic materials

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US5192849A (en) * 1990-08-10 1993-03-09 Texas Instruments Incorporated Multipurpose low-thermal-mass chuck for semiconductor processing equipment
US5962923A (en) * 1995-08-07 1999-10-05 Applied Materials, Inc. Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches
US6519835B1 (en) * 2000-08-18 2003-02-18 Watlow Polymer Technologies Method of formable thermoplastic laminate heated element assembly
US7544251B2 (en) * 2004-10-07 2009-06-09 Applied Materials, Inc. Method and apparatus for controlling temperature of a substrate
US20090152276A1 (en) * 2004-10-07 2009-06-18 All-Clad Metalcrafters Llc Griddle Plate and Cookware Having a Vacuum Bonded, High Conductivity, Low Density Carbon Foam Core Plate
US20070181065A1 (en) * 2006-02-09 2007-08-09 General Electric Company Etch resistant heater and assembly thereof
US20080066683A1 (en) * 2006-09-19 2008-03-20 General Electric Company Assembly with Enhanced Thermal Uniformity and Method For Making Thereof
WO2009117612A2 (en) * 2008-03-21 2009-09-24 Applied Materials, Inc. Shielded lid heater assembly
US8461674B2 (en) * 2011-09-21 2013-06-11 Lam Research Corporation Thermal plate with planar thermal zones for semiconductor processing
US9508530B2 (en) * 2011-11-21 2016-11-29 Lam Research Corporation Plasma processing chamber with flexible symmetric RF return strap
US8937800B2 (en) * 2012-04-24 2015-01-20 Applied Materials, Inc. Electrostatic chuck with advanced RF and temperature uniformity
US9404176B2 (en) * 2012-06-05 2016-08-02 Applied Materials, Inc. Substrate support with radio frequency (RF) return path
US9984866B2 (en) * 2012-06-12 2018-05-29 Component Re-Engineering Company, Inc. Multiple zone heater
CN104410373B (zh) * 2012-06-14 2016-03-09 西凯渥资讯处理科技公司 包含相关系统、装置及方法的功率放大器模块
US9685356B2 (en) * 2012-12-11 2017-06-20 Applied Materials, Inc. Substrate support assembly having metal bonded protective layer
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CN104332378B (zh) * 2013-07-22 2016-09-07 中微半导体设备(上海)有限公司 等离子体处理装置及其温度测试装置
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US11158526B2 (en) * 2014-02-07 2021-10-26 Applied Materials, Inc. Temperature controlled substrate support assembly
KR102369706B1 (ko) * 2014-02-07 2022-03-04 엔테그리스, 아이엔씨. 정전 척 및 이의 제조 방법
KR102302723B1 (ko) * 2014-07-23 2021-09-14 어플라이드 머티어리얼스, 인코포레이티드 튜닝가능한 온도 제어되는 기판 지지 어셈블리

Also Published As

Publication number Publication date
WO2018136335A1 (en) 2018-07-26
TWI799403B (zh) 2023-04-21
US20180213608A1 (en) 2018-07-26
JP2020506508A (ja) 2020-02-27
CN110226222B (zh) 2023-04-07
TW201836056A (zh) 2018-10-01
CN110226222A (zh) 2019-09-10

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