TWI799403B - 具有射頻隔離式加熱器的靜電吸盤 - Google Patents

具有射頻隔離式加熱器的靜電吸盤 Download PDF

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Publication number
TWI799403B
TWI799403B TW107101531A TW107101531A TWI799403B TW I799403 B TWI799403 B TW I799403B TW 107101531 A TW107101531 A TW 107101531A TW 107101531 A TW107101531 A TW 107101531A TW I799403 B TWI799403 B TW I799403B
Authority
TW
Taiwan
Prior art keywords
radio frequency
electrostatic chuck
frequency isolated
heaters
isolated heaters
Prior art date
Application number
TW107101531A
Other languages
English (en)
Other versions
TW201836056A (zh
Inventor
大衛 班傑明森
肯 夏茲
迪米奇 路柏曼斯基
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201836056A publication Critical patent/TW201836056A/zh
Application granted granted Critical
Publication of TWI799403B publication Critical patent/TWI799403B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
  • Drying Of Semiconductors (AREA)
TW107101531A 2017-01-20 2018-01-16 具有射頻隔離式加熱器的靜電吸盤 TWI799403B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/411,896 US20180213608A1 (en) 2017-01-20 2017-01-20 Electrostatic chuck with radio frequency isolated heaters
US15/411,896 2017-01-20

Publications (2)

Publication Number Publication Date
TW201836056A TW201836056A (zh) 2018-10-01
TWI799403B true TWI799403B (zh) 2023-04-21

Family

ID=62906927

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107101531A TWI799403B (zh) 2017-01-20 2018-01-16 具有射頻隔離式加熱器的靜電吸盤

Country Status (6)

Country Link
US (1) US20180213608A1 (zh)
JP (1) JP2020506508A (zh)
KR (1) KR20190100976A (zh)
CN (1) CN110226222B (zh)
TW (1) TWI799403B (zh)
WO (1) WO2018136335A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112740389A (zh) * 2018-10-12 2021-04-30 应用材料公司 具有集成加热器的腔室盖
KR102164132B1 (ko) * 2018-11-28 2020-10-12 한국생산기술연구원 멀티 프로버용 척 조립체 및 채널
KR20210105903A (ko) 2018-12-21 2021-08-27 에이에스엠엘 홀딩 엔.브이. 레티클 서브필드 열 제어
CN112992635B (zh) * 2019-12-13 2023-10-24 中微半导体设备(上海)股份有限公司 一种晶圆固定装置及其形成方法、等离子体处理设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201327719A (zh) * 2011-09-21 2013-07-01 Lam Res Corp 用於半導體處理之具有平面熱區的熱板
US20130189848A1 (en) * 2008-03-21 2013-07-25 Michael D. Willwerth Shielded lid heater assembly
US20140165915A1 (en) * 2012-12-14 2014-06-19 Applied Materials, Inc. Thermal radiation barrier for substrate processing chamber components
US20140177123A1 (en) * 2012-12-21 2014-06-26 Applied Materials, Inc. Single-body electrostatic chuck
TW201511176A (zh) * 2013-07-22 2015-03-16 Advanced Micro Fabrication Equipment Shanghai Co Ltd 等離子體處理裝置及其溫度測試裝置
US20160027678A1 (en) * 2014-07-23 2016-01-28 Applied Materials, Inc. Tunable temperature controlled substrate support assembly

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US5192849A (en) * 1990-08-10 1993-03-09 Texas Instruments Incorporated Multipurpose low-thermal-mass chuck for semiconductor processing equipment
US5962923A (en) * 1995-08-07 1999-10-05 Applied Materials, Inc. Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches
US6519835B1 (en) * 2000-08-18 2003-02-18 Watlow Polymer Technologies Method of formable thermoplastic laminate heated element assembly
US20090152276A1 (en) * 2004-10-07 2009-06-18 All-Clad Metalcrafters Llc Griddle Plate and Cookware Having a Vacuum Bonded, High Conductivity, Low Density Carbon Foam Core Plate
US7544251B2 (en) * 2004-10-07 2009-06-09 Applied Materials, Inc. Method and apparatus for controlling temperature of a substrate
US20070181065A1 (en) * 2006-02-09 2007-08-09 General Electric Company Etch resistant heater and assembly thereof
US20080066683A1 (en) * 2006-09-19 2008-03-20 General Electric Company Assembly with Enhanced Thermal Uniformity and Method For Making Thereof
KR102011535B1 (ko) * 2011-11-24 2019-08-16 램 리써치 코포레이션 가요성 있는 대칭적 rf 복귀 스트랩을 갖는 플라즈마 프로세싱 챔버
US8937800B2 (en) * 2012-04-24 2015-01-20 Applied Materials, Inc. Electrostatic chuck with advanced RF and temperature uniformity
US9404176B2 (en) * 2012-06-05 2016-08-02 Applied Materials, Inc. Substrate support with radio frequency (RF) return path
US9984866B2 (en) * 2012-06-12 2018-05-29 Component Re-Engineering Company, Inc. Multiple zone heater
CN104410373B (zh) * 2012-06-14 2016-03-09 西凯渥资讯处理科技公司 包含相关系统、装置及方法的功率放大器模块
US9685356B2 (en) * 2012-12-11 2017-06-20 Applied Materials, Inc. Substrate support assembly having metal bonded protective layer
WO2014164910A1 (en) * 2013-03-12 2014-10-09 Applied Materials, Inc. Multi zone heating and cooling esc for plasma process chamber
CN106164331B (zh) * 2013-09-20 2018-11-23 应用材料公司 具有一体式静电夹盘的基板载体
US9853579B2 (en) * 2013-12-18 2017-12-26 Applied Materials, Inc. Rotatable heated electrostatic chuck
US10497598B2 (en) * 2014-02-07 2019-12-03 Entegris, Inc. Electrostatic chuck and method of making same
US11158526B2 (en) * 2014-02-07 2021-10-26 Applied Materials, Inc. Temperature controlled substrate support assembly

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130189848A1 (en) * 2008-03-21 2013-07-25 Michael D. Willwerth Shielded lid heater assembly
TW201327719A (zh) * 2011-09-21 2013-07-01 Lam Res Corp 用於半導體處理之具有平面熱區的熱板
US20140165915A1 (en) * 2012-12-14 2014-06-19 Applied Materials, Inc. Thermal radiation barrier for substrate processing chamber components
US20140177123A1 (en) * 2012-12-21 2014-06-26 Applied Materials, Inc. Single-body electrostatic chuck
TW201511176A (zh) * 2013-07-22 2015-03-16 Advanced Micro Fabrication Equipment Shanghai Co Ltd 等離子體處理裝置及其溫度測試裝置
US20160027678A1 (en) * 2014-07-23 2016-01-28 Applied Materials, Inc. Tunable temperature controlled substrate support assembly

Also Published As

Publication number Publication date
WO2018136335A1 (en) 2018-07-26
CN110226222A (zh) 2019-09-10
JP2020506508A (ja) 2020-02-27
KR20190100976A (ko) 2019-08-29
TW201836056A (zh) 2018-10-01
CN110226222B (zh) 2023-04-07
US20180213608A1 (en) 2018-07-26

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