KR20190065480A - 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법 - Google Patents

판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법 Download PDF

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Publication number
KR20190065480A
KR20190065480A KR1020197015976A KR20197015976A KR20190065480A KR 20190065480 A KR20190065480 A KR 20190065480A KR 1020197015976 A KR1020197015976 A KR 1020197015976A KR 20197015976 A KR20197015976 A KR 20197015976A KR 20190065480 A KR20190065480 A KR 20190065480A
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South Korea
Prior art keywords
workpiece
cutout
hole
introducing
laser beam
Prior art date
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Ceased
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KR1020197015976A
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English (en)
Korean (ko)
Inventor
노르베르트 암브로지우스
로만 오슈트홀트
Original Assignee
엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=54072638&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20190065480(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from DE102014113339.0A external-priority patent/DE102014113339A1/de
Application filed by 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 filed Critical 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트
Publication of KR20190065480A publication Critical patent/KR20190065480A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • H01L23/15—
    • H01L23/5384—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

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  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Ceramic Engineering (AREA)
  • Surface Treatment Of Glass (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1020197015976A 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법 Ceased KR20190065480A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102014113339.0 2014-09-16
DE102014113339.0A DE102014113339A1 (de) 2014-09-16 2014-09-16 Verfahren zur Erzeugung von Ausnehmungen in einem Material
DE102014116291 2014-11-07
DE102014116291.9 2014-11-07
PCT/DE2015/100333 WO2016041544A1 (de) 2014-09-16 2015-08-07 Verfahren zum einbringen mindestens einer ausnehmung oder einer durchbrechung in ein plattenförmiges werkstück

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020177007041A Division KR20170044143A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020217005121A Division KR20210022773A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법

Publications (1)

Publication Number Publication Date
KR20190065480A true KR20190065480A (ko) 2019-06-11

Family

ID=54072638

Family Applications (6)

Application Number Title Priority Date Filing Date
KR1020197015976A Ceased KR20190065480A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020257016919A Active KR102851778B1 (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020217005121A Ceased KR20210022773A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020177007041A Ceased KR20170044143A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020237018486A Active KR102813417B1 (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020257028228A Pending KR20250133802A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법

Family Applications After (5)

Application Number Title Priority Date Filing Date
KR1020257016919A Active KR102851778B1 (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020217005121A Ceased KR20210022773A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020177007041A Ceased KR20170044143A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020237018486A Active KR102813417B1 (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법
KR1020257028228A Pending KR20250133802A (ko) 2014-09-16 2015-08-07 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법

Country Status (11)

Country Link
US (2) US11610784B2 (enExample)
EP (2) EP3195706B2 (enExample)
JP (2) JP6782692B2 (enExample)
KR (6) KR20190065480A (enExample)
CN (1) CN107006128B (enExample)
ES (1) ES2923764T5 (enExample)
LT (1) LT3195706T (enExample)
MY (1) MY196621A (enExample)
SG (2) SG10201902331XA (enExample)
TW (1) TWI616939B (enExample)
WO (1) WO2016041544A1 (enExample)

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Also Published As

Publication number Publication date
ES2923764T5 (en) 2025-10-09
KR20170044143A (ko) 2017-04-24
EP3195706B2 (de) 2025-05-14
TWI616939B (zh) 2018-03-01
US20220223434A1 (en) 2022-07-14
MY196621A (en) 2023-04-23
KR102851778B1 (ko) 2025-09-01
ES2923764T3 (es) 2022-09-30
US12604743B2 (en) 2026-04-14
KR102813417B1 (ko) 2025-05-29
TW201621986A (zh) 2016-06-16
CN107006128A (zh) 2017-08-01
CN107006128B (zh) 2020-05-19
EP4061101A1 (de) 2022-09-21
KR20210022773A (ko) 2021-03-03
KR20250133802A (ko) 2025-09-08
US11610784B2 (en) 2023-03-21
SG11201702091WA (en) 2017-04-27
JP6782692B2 (ja) 2020-11-11
KR20230084606A (ko) 2023-06-13
JP2020185613A (ja) 2020-11-19
JP7049404B2 (ja) 2022-04-06
WO2016041544A1 (de) 2016-03-24
EP3195706A1 (de) 2017-07-26
EP3195706B1 (de) 2022-06-01
JP2017534458A (ja) 2017-11-24
KR20250079054A (ko) 2025-06-04
SG10201902331XA (en) 2019-04-29
LT3195706T (lt) 2022-08-10
US20170256422A1 (en) 2017-09-07

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