KR20190053672A - Temperature test equipment for semiconductor - Google Patents

Abstract

The present invention relates to a temperature tester for a semiconductor. According to the present invention, a hot/cold test unit comprising a hot/cold block, a lower thermoelement, and an upper thermoelement is applied to test whether a semiconductor can be normally operated in a low-temperature condition or high-temperature condition of a specific temperature by selectively providing the temperature condition or high-temperature condition of the specific temperature to the semiconductor through a binary refrigeration system, so a plurality of thermoelements including upper and lower thermoelements are applied, but a hot test or cold test can be conducted without extra components such as a heat pipe, cooling fan, and the like, and therefore, the present invention is capable of simplifying a device while considerably lowering manufacturing costs.

Description

[0001] Temperature test equipment for semiconductor [0002]

The present invention relates to a semiconductor temperature inspecting apparatus, and more particularly, to a semiconductor temperature inspecting apparatus for a semiconductor, which comprises a hot / cold block, a lower thermoelectric element and an upper thermoelectric element, Or a high temperature state is provided so that a hot / cold test unit for testing whether a semiconductor is operated at a low temperature or a high temperature at a specific temperature is applied to apply a plurality of thermoelectric elements of the lower thermoelectric element and the upper thermoelectric element, A hot test or a cold test can be performed without requiring a configuration of a heat pipe, a cooling fan, and the like, thereby realizing simplification of the device and significantly reducing the manufacturing cost of the device. .

In general, in order to verify a semiconductor standard according to a temperature change in a semiconductor IC (hereinafter, referred to as a semiconductor) test, a temperature test equipment capable of quickly converting an accurate temperature into a high temperature and a low temperature is required.

In the temperature test equipment for semiconductors as described above, equipment using a freon gas was usually used to adjust the temperature.

However, in order to adjust the temperature by the development of nanotechnology, researches on the thermoelectric element capable of realizing clean energy without the use of the freon gas are being actively carried out. Accordingly, by using the thermoelectric element of low cost and high efficiency, There has been a need to develop temperature test equipment for verification of semiconductor specifications according to changes.

On the other hand, a hot / cold mobile chamber as disclosed in Patent Document 1 (Korean Patent Laid-Open Publication No. 2014-0142383, Nov. 12, 2014) is disclosed in the above-described temperature test equipment for semiconductors, The hot / cold mobile chamber, which is a temperature test device for a semiconductor, has a problem in that the structure of the hot / cold mobile chamber is complicated, for example, a heat pipe and a cooling fan are required together with the thermoelectric element.

In other words, the hot / cold mobile chamber, which is a conventional temperature test equipment for a semiconductor, has a complicated structure in which a heat pipe is required together with a thermoelectric element in order to make a temperature change from a low temperature to a high temperature or from a high temperature to a low temperature .

Therefore, a hot test or a cold test can be performed without requiring a separate heat pipe and a cooling fan to apply a thermoelectric device, thereby realizing the simplification of the device and significantly reducing the manufacturing cost It is required to study and develop a temperature inspection apparatus for a semiconductor used as a temperature test apparatus for a semiconductor.

Published Korean Patent No. 2014-0142383 Dec. 12, 2014. Registration No. 1340842 of Korea Registered on December 6, 2013. Korea Registered Patent No. 1023734 Registration Mar. 14, 2011.

In order to solve the above problems, the present invention provides a semiconductor device comprising a hot / cold block, a lower thermoelectric element, and an upper thermoelectric element, And a plurality of thermoelectric elements of the lower thermoelectric element and the upper thermoelectric element are applied by applying a hot / cold test unit for testing whether the semiconductor is operated normally at a low temperature or at a high temperature, And it is an object of the present invention to provide a temperature inspection apparatus for a semiconductor which can perform a hot test or a cold test without requiring a configuration of a fan or the like.

In addition, according to the present invention, a plurality of thermoelectric elements of a lower thermoelectric element and an upper thermoelectric element are applied, but a hot test or a cold test can be performed without requiring a separate heat pipe and a cooling fan, And at the same time, it is possible to significantly reduce the manufacturing cost of the device.

Another object of the present invention is to provide a thermo-cold test unit of a dual-refrigerating system type including a hot / cold block, a lower thermoelectric element and an upper thermoelectric element, So that the hot test or the cold test can be switched to the simple test mode, thereby maximizing the test efficiency of the hot / cold test on the semiconductor.

The present invention for achieving the above-mentioned objects is as follows. That is, a temperature inspection apparatus for a semiconductor according to the present invention comprises: a mounting unit in which the semiconductor is accommodated together with a socket for inspecting whether a semiconductor is good or not; and a temperature sensor installed on a lifting plate, The semiconductor device is brought into contact with the socket while being raised or lowered along the lifting guide to provide a low temperature state or a high temperature state of a target specific temperature to the semiconductor side embedded in the socket to test whether a specific temperature of the semiconductor is low or in a high temperature state And a temperature display unit for displaying a target temperature provided by the hot / cold test unit, wherein the hot / cold test unit comprises: a hot / cold test unit And the lower central portion is fixedly installed so as to protrude downwardly through the lower plate, The protruded lower central portion is selectively brought into close contact with the upper portion of the socket through the lowering of the lifting plate to selectively transmit the low temperature or the high temperature from the upper portion in a downward dual cooling system, State is provided to test whether the semiconductor is operating normally at a low temperature state or at a high temperature state with respect to the semiconductor.

Here, the hot / cold test unit has a lower end protruding downward by a predetermined length in a mounting hole penetrating the center of a cover fixed on the upper surface of the steel plate, and a lower end protruding through the steel plate, A hot / cold block that protrudes and selectively lowers or warms to a semiconductor side embedded in the socket while being selectively attached to an upper portion of the socket; A lower thermoelectric element in which a lower surface is closely disposed on an upper portion of the hot / cold block; A conductive plate disposed in close contact with an upper portion of the lower thermoelectric element and connected to the hot / cold block closely disposed on a lower portion of the lower thermoelectric element through a coupling bolt; An upper thermoelectric element disposed at an upper portion of the lower thermoelectric element with the conducting plates sandwiched therebetween and delivering a lower temperature or a higher temperature to the lower thermoelectric element side through the conduction plate in a dual cooling system system; A heat insulating cover covering the upper portion of the conductive plate and the periphery of the upper thermoelectric element after the lower thermoelectric element is seated after the lower portion of the conductive plate is projected downward from the upper portion; A water jacket which is in close contact with the upper part of the upper thermoelectric element and is fixed through the heat insulating cover and the bolt and circulates the cooling water inside to cool the heat selectively discharged from the upper surface of the upper thermoelectric element; A seat support plate having an elastic member disposed on an upper portion of the water jacket and being elastically supported in close contact with the water jacket; A case in which the seat support plate, the elastic member, the water jacket, the heat insulating cover, the upper thermoelectric element, the conductive plate, the lower thermoelectric element, and the hot / cold block are inserted upward from the opened lower portion and the cover is coupled and fixed to the lower end through the coupling bolt .

At this time, the hot / cold block senses the temperature of the lower end portion, and the sensor insertion groove is formed with a downward predetermined depth on one side of the upper surface so as to be able to send the sensed temperature to the temperature display unit side, It is preferable that a temperature sensor for transmitting the sensed temperature to the temperature display unit side is inserted.

Also, the hot / cold block closely disposed on the lower portion of the lower thermoelectric element and the coupling bolt for coupling the conduction plate are connected to each other by a plate-head type coupling bolt so that the upper surface of the conduction plate and the lower surface of the upper thermoelectric element are closely contacted. It is preferable to be provided.

In addition, the water jacket may include a water jacket having an inlet hole and an outlet hole formed at predetermined intervals on a side thereof so as to allow the cooling water to circulate therein, the inlet hole and the outlet hole extending through a predetermined length inward from the side perpendicular to the inlet and outlet holes, And a discharge connector is connected to an open side of the discharge hole so as to connect the discharge pipe, and an outlet connector is connected to the open side of the discharge hole, It is preferable that the finishing cap is coupled to the open side of the communication hole.

The elastic member is provided in a plurality of spaces at a predetermined interval between the lower surface of the seat support plate and the upper surface of the water jacket while the upper end of the elastic member is seated and supported on the lower surface of the seat support plate, Wherein the seating support plate is formed with a seating support groove which is formed at a lower surface of the seating support plate and is in close contact with the upper end of the elastic member while being fixed by a predetermined length so as to be confined to the upper surface of the water jacket, It is preferable that the lower end of the elastic member is pressed and supported on the restricting groove while the lower end of the elastic member is inserted and restrained by a predetermined length on the restricting groove.

Further, in order to perform a hot test or a cold test on a plurality of semiconductors, the mounting unit is provided with a plurality of sockets at the upper portion thereof, and the hot / cold test unit is provided with a predetermined interval It is preferable that a plurality of these are installed and fixed.

The effect of the semiconductor temperature inspecting apparatus according to the present invention will be described below.

First, the semiconductor device includes a hot / cold block, a lower thermoelectric element, and an upper thermoelectric element, and selectively provides a low temperature state or a high temperature state to a semiconductor to be tested through a dual cooling system, Or a hot / cold test unit for testing whether or not the thermoelectric element is normally operated in a high temperature state is applied, a plurality of thermoelectric elements of the lower thermoelectric element and the upper thermoelectric element are applied, but without a separate heat pipe, a cooling fan, Cold test can be done.

Second, a plurality of thermoelectric elements of the lower thermoelectric element and the upper thermoelectric element are applied, but a hot test or a cold test can be performed without requiring the configuration of a separate heat pipe and a cooling fan, thereby realizing simplification of the device, The manufacturing cost can be remarkably reduced.

Third, by applying a hot / cold test unit based on a dual cooling system including a hot / cold block, a bottom thermoelectric element and an upper thermoelectric element, the polarity is switched for the lower thermoelectric element and the upper thermoelectric element, Thereby maximizing the test efficiency of the hot / cold test on the semiconductor.

1 is a perspective view showing a temperature inspection apparatus for a semiconductor according to the present invention.
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]
FIG. 3 is a plan view perspective view showing a hot / cold test unit as a recess in the temperature inspection apparatus for semiconductor according to the present invention. FIG.
FIG. 4 is a bottom view perspective view showing a hot / cold test unit as a recess in the temperature inspection apparatus for semiconductor according to the present invention. FIG.
5 is a bottom view perspective view showing a hot / cold test unit as a recess in the temperature inspection apparatus for semiconductor according to the present invention.
FIG. 6 is a view showing an engaging structure of a hot / cold test unit which is a recess in the temperature inspection apparatus for a semiconductor according to the present invention, and is an example of an engaging section showing a cross section taken along the line AA in FIG.
7 is a view showing an engaging structure of a hot / cold test unit which is a substantial part in a temperature testing apparatus for a semiconductor according to the present invention, and is an example of an engaging section showing a cross-sectional view taken along the line BB in Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, a preferred embodiment of a temperature inspection apparatus for a semiconductor according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a temperature inspection apparatus for a semiconductor according to the present invention, and FIG. 2 is a front view showing a temperature inspection apparatus for a semiconductor according to the present invention.

FIG. 3 is a plan view of a hot / cold test unit in a temperature inspection apparatus for a semiconductor according to the present invention. FIG. 4 is a cross- FIG. 5 is a bottom view perspective view showing a hot / cold test unit as a recess in the temperature inspection apparatus for a semiconductor according to the present invention. FIG.

FIG. 6 is a view showing a coupling structure of a hot / cold test unit as a recess in a semiconductor temperature testing apparatus according to the present invention, FIG. 5 is a view showing an engaging structure of a hot / cold test unit, which is a recess, in a temperature inspection apparatus for use with a temperature sensor according to a first embodiment of the present invention.

1 to 7, the temperature inspection apparatus for semiconductor according to a preferred embodiment of the present invention roughly includes an actual body 100, a hot / cold test unit 300, and a temperature display unit 400 .

Specifically, the semiconductor chip (100) is accommodated with the socket (110) together with the semiconductor (not shown) to inspect whether the semiconductor is good or not.

In other words, the socket 100 is mounted on the upper surface of the socket 100, and a semiconductor (not shown) such as an IC or a memory is embedded in the socket 110.

The semiconductor device 100 is provided with an electrical characteristic to the semiconductor (not shown) so as to know whether the semiconductor is good or defective.

The hot / cold test unit 300 is installed on a lifting plate 201 which moves up and down along the lifting and lowering guide 200 at the upper part of the body 100, A low temperature state or a high temperature state of a target specific temperature to the semiconductor side embedded in the socket 110 is provided so as to test whether a specific temperature of the semiconductor is low or in a high temperature state .

In other words, the reason why the semiconductor device is provided with a low-temperature state or a high-temperature state through the hot / cold test unit 300 is to check whether the semiconductor is normally operated under extreme conditions to increase the reliability of the test.

The temperature display unit 400 displays a target temperature provided by the hot / cold test unit 300, that is, a temperature to be provided to the semiconductor side.

Meanwhile, the hot / cold test unit 300, which is a substantial part of the temperature testing apparatus for a semiconductor according to the present invention having the above-described configuration, is configured such that the lower middle portion of the hot plate 201 protrudes downward Installation is fixed.

In the hot / cold test unit 300, the lower central portion protruding downward from the lifting plate 201 is selectively brought into close contact with the upper portion of the socket 110 through the lowering of the lifting plate 201, Temperature or high-temperature state at a specific target temperature to the semiconductor side while transmitting low-temperature or high-temperature state by a downward two-way refrigeration system system to test whether the semiconductor is in a low-temperature state or a high- .

In other words, the hot / cold test unit 300 installed on the lifting plate 201 on the upper side of the body 100 selectively descends along the lifting guide 200 and descends toward the body 100 And is closely contacted with the upper part of the socket 110 or falls down to provide a low temperature state or a high temperature state by applying a temperature to the semiconductor.

2, the hot / cold test unit 300 is mounted on the rear side of the center of the lifting plate 201 on which the hot / cold test unit 300 is installed and fixed from above, (Not shown) mounted on the rear side of the center of the lifting plate 201, though not shown in detail. The gear 200 'is installed to pass through the lifting plate 201, Lt; / RTI >

Through this operation, the lifting plate 201 can be selectively lifted and lowered by driving the gear (not shown), and at the same time, the hot / cold test unit 300 can be operated to be lifted and lowered.

The hot / cold test unit 300 includes a hot / cold block 320, a lower thermoelectric element 330, a conducting plate 340, an upper thermoelectric element 350, a heat insulating cover 360 A water jacket 370, a seat support plate 385, and a case 390. [

In detail, the hot / cold block 320 is disposed in a mounting hole 311 penetrating the center of a cover 310 fixed on the upper surface of the elevating plate 201, And a lower end of the lower end selectively contacts the upper portion of the socket 110 to transmit a specific low or high temperature to the semiconductor built in the socket 110 .

In addition, the bottom surface of the lower thermoelectric element 330 is disposed closely to the upper portion of the hot / cold block 320.

The conductive plate 340 is disposed in close contact with the upper portion of the lower thermoelectric element 330 and includes the hot / cold block 320, which is disposed in close contact with the lower portion of the lower thermoelectric element 330 through the bolt B1. .

At this time, the coupling bolt B1 for coupling the conductive plate 340 with the hot / cold block 320, which is disposed closely to the lower portion of the lower thermoelectric element 330, It is preferable that the bottom surface of the upper thermoelectric element 350 is provided as a dish-head type coupling bolt in close contact.

In other words, it is preferable that coupling plates (not shown) of a dish head type are formed on both sides of the conductive plate 140, and coupling bolts B1 provided in the dish type are coupled through the coupling holes (Not shown) of the conduction plate 140 are formed on both sides of the hot / cold block 320 so that the lower end of the coupling bolt B1 can be threadedly coupled with the coupling bolt B1. It is preferable that a coupling hole (not shown) to be coupled and fixed by a predetermined length of the lower end is formed through.

The upper thermoelectric element 350 is disposed on the lower thermoelectric element 330 while the conduction plate 340 is interposed therebetween and is connected to the lower thermoelectric element 330 via the conduction plate 340 It is to transfer low temperature or high temperature by binary refrigeration system system.

The lower end of the conductive plate 340 is seated downward from the upper portion of the heat insulating cover 360 and then the upper thermoelectric element 350 is seated on the upper surface of the conductive plate 340, 350).

The water jacket 370 is in close contact with the upper portion of the upper thermoelectric element 350 and is fixedly installed through the heat insulating cover 360 and the engaging bolt B2 so that cooling water circulates inside the water jacket 370, And the heat emitted from the upper surface of the thermoelectric element 350 is cooled.

In other words, a coupling hole (not shown) is formed on both sides of the water jacket 370 so that the water jacket 370 and the heat insulating cover 360 can be fixedly installed through the coupling bolt B2, (Not shown) may be formed on both sides of the heat insulating cover 360 corresponding to the engaging holes (not shown) of the water jacket 370.

The seat support plate 385 is elastically supported by the water jacket 370 so as to be in close contact with the water jacket 370 with an elastic member 381 interposed therebetween.

The case 390 includes the seat support plate 385, the elastic member 381, the water jacket 370, the heat insulating cover 360, the upper thermoelectric element 350, the conductive plate 340, The thermoelectric element 330 and the hot / cold block 320 are inserted upward and the cover 310 is coupled to the lower end through the coupling bolts B3.

In other words, a pair of coupling holes (not shown) are formed on both sides of the case 390 so that the case 390 and the cover 310 can be coupled with each other through the coupling bolt B3 And a pair of coupling holes (not shown) are formed through both sides of the cover 310, respectively.

In the hot / cold test unit 300, which is a main part of the temperature inspection apparatus for semiconductor according to the present invention as described above, the hot / cold block 300 senses the temperature of the lower end portion, It is important to be able to send out the temperature that has been reached.

For this, the hot / cold block 300 preferably has a predetermined downward depth on one side of the upper surface thereof, and the sensor insertion groove 321 is formed in the sensor insertion groove 321, A temperature sensor S for emitting a sensed temperature to the heater 400 is inserted.

Meanwhile, the water jacket 370 in the hot / cold test unit 300, which is a substantial part of the semiconductor temperature testing apparatus according to the present invention as described above, And the inflow hole 371 and the discharge hole 372 are formed through a predetermined length inward.

The water jacket 370 is connected to the inlet hole 371 and the discharge hole 372 from the side orthogonal to the side through which the inlet hole 371 and the discharge hole 372 pass, (373) is formed.

The water jacket 370 is connected to an inlet connector 374 for connecting the inlet pipe to the open side of the inlet hole 371. An open side of the outlet hole 372 is connected to a drain connector 375 are coupled to each other and a finishing cap 376 is coupled to the open side of the communication hole 373. [

The elastic member 381 in the hot / cold test unit 300, which is a substantial part of the temperature inspection apparatus for a semiconductor according to the present invention as described above, (110) with respect to the lower end of the socket (320).

It is preferable that the elastic members 381 are provided at a predetermined distance between the lower surface of the seat support plate 385 and the upper surface of the water jacket 370.

In addition, it is important that the upper end of the elastic member 381 is seated on the lower surface of the seating support plate 385, and the lower end thereof can be restrained on the upper surface of the water jacket 370.

For this, the seat support plate 385 is preferably formed with a seating support groove 388, which is spaced at a predetermined distance from the bottom surface of the seating support plate 385 and is in close contact with the upper end of the elastic member 381.

The water jacket 370 is formed on the upper surface of the water jacket 370 so that the water jacket 370 is recessed at a predetermined distance from the upper surface of the water jacket 370. The lower end of the elastic member 381 It is preferable that the lower end is closely contacted and supported while being constrained by the predetermined length.

It is preferable that the semiconductor testing apparatus for semiconductor according to the present invention configured as described above is capable of performing a hot test or a cold test on a plurality of semiconductors. It is preferable that a plurality of these are provided on the upper part.

Preferably, the hot / cold test unit 300 is fixed to the upper portion of the lifting plate 201 at a predetermined interval in correspondence with the socket 110.

According to the temperature checking apparatus for a semiconductor according to the present invention as described above, the semiconductor device includes a hot / cold block, a lower thermoelectric element, and an upper thermoelectric element, Or a high temperature state is provided so that a hot / cold test unit for testing whether a semiconductor is operated at a low temperature or a high temperature at a specific temperature is applied to apply a plurality of thermoelectric elements of the lower thermoelectric element and the upper thermoelectric element, Hot and cold tests can be performed without requiring the configuration of heat pipes, cooling fans, and the like.

In addition, a plurality of thermoelectric elements of the lower thermoelectric element and the upper thermoelectric element are applied, but a hot test or a cold test can be performed without requiring the configuration of a separate heat pipe and a cooling fan, The manufacturing cost can be remarkably reduced.

Moreover, by applying the hot / cold test unit of the dual cooling system system including the hot / cold block, the lower thermoelectric element and the upper thermoelectric element, the polarity is switched to the lower thermoelectric element and the upper thermoelectric element, So that the test efficiency for the hot / cold test on the semiconductor can be maximized.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, the invention is not limited thereto. Various modifications may be made by those skilled in the art. Are included in the scope of the present invention.

100: Socket 110: Socket
200: elevating guide 201:
200 ': reg gear
300: Hot / Cold test unit
310: cover 311: installation hole
320: hot / cold block 321: sensor insertion groove
330: Lower thermoelectric element 340: Conductive plate
350: upper thermoelectric element 360: insulating cover
370: Water jacket 371: Inlet ball
372: Exhaust hole 373: Connection hole
374: inlet connector 375: outlet connector
376: Finishing cap 378:
381: elastic member 385:
388: seat support groove 390: case
400: Temperature display unit
B1, B2, B3: Coupling Bolt
S: Temperature sensor

Claims (7)

The semiconductor device according to any one of claims 1 to 3, further comprising: a semiconductor device (100) for receiving the semiconductor with the socket (110) And contacts the socket 110 to provide a low temperature state or a high temperature state of a target specific temperature to the semiconductor side embedded in the socket 110 to thereby raise a specific temperature A cold / hot test unit 300 for testing whether the hot / cold test unit 300 normally operates in a low temperature state or a high temperature state, and a temperature display unit 400 for indicating a target temperature provided by the hot / A temperature inspection apparatus for a semiconductor, comprising:
The hot / cold test unit 300 is installed and fixed so as to protrude downward through a lower central portion of the upper portion of the elevating plate 201. The lower central portion of the elevating plate 201 protrudes to the lower portion of the elevating plate 201, (110) through the lower part of the socket (201) and selectively delivering a low temperature or a high temperature from the upper part in a downward two-way refrigeration system system to a low temperature state or a high temperature state And the semiconductor device is tested for normal operation of the semiconductor in a low temperature state or a high temperature state at a specific temperature.
The method according to claim 1,
The lower end of the hot / cold test unit 300 is disposed in a mounting hole 311 penetrating the center of the cover 310 fixedly mounted on the upper surface of the steel plate 201 so as to protrude downward A lower end of the socket 110 protrudes through the lifting plate 201 for a predetermined length and a lower surface of the lower surface of the socket 110 is selectively brought into close contact with the upper surface of the socket 110 to provide a hot / A cold block 320;
A lower thermoelectric element 330 closely disposed on the upper surface of the hot / cold block 320;
A conductive plate 340 disposed in close contact with an upper portion of the lower thermoelectric element 330 and coupled with the hot / cold block 320 disposed in close contact with a lower portion of the lower thermoelectric element 330 through a bolt B1, );
The conductive plate 340 is interposed between the lower thermoelectric element 330 and the lower thermoelectric element 330. The thermoelectric element 330 is disposed above the lower thermoelectric element 330 and communicates with the lower thermoelectric element 330 through the conduction plate 340 in a dual- An upper thermoelectric element 350;
The lower portion of the conductive plate 340 is projected downward from the upper portion and then the upper thermoelectric element 350 is seated to cover the upper portion of the conductive plate 340 and the upper thermoelectric element 350 360);
And the cooling water is circulated and selectively moved from the upper surface of the upper thermoelectric element 350 to the upper thermoelectric element 350. The upper thermoelectric element 350 is fixed to the upper thermoelectric element 350 through the heat insulating cover 360 and the bolt B2, A water jacket 370 for cooling the heat released;
A seating support plate 385 having an elastic member 381 disposed on the water jacket 370 and elastically supported by the water jacket 370;
The elastic member 381, the water jacket 370, the heat insulating cover 360, the upper thermoelectric element 350, the conductive plate 340, the lower thermoelectric element 330, and the hot / Cold block 320 is inserted upward and the cover 310 is coupled to the lower end through the coupling bolts B3.
3. The method of claim 2,
The hot / cold block 300 senses the temperature of the lower end of the hot / cold block 300 and transmits the sensed temperature to the temperature display unit 400,
The sensor inserting groove 321 is formed to be depressed with a downward predetermined depth on one side of the upper surface,
Wherein a temperature sensor (S) for sending out the sensed temperature to the temperature display unit (400) is inserted into the sensor insertion groove (321).
3. The method of claim 2,
The coupling bolt B1 for coupling the conductive plate 340 with the hot / cold block 320 disposed in close contact with the lower portion of the lower thermoelectric element 330 is formed on the upper surface of the conductive plate 340, Characterized in that the lower surface of the element (350) is provided as a dish-head type coupling bolt in close contact.
3. The method of claim 2,
The water jacket 370 has an inlet hole 371 and a discharge hole 372 formed at predetermined intervals on a side thereof so as to allow the cooling water to circulate through the inside of the water jacket 370,
An inward constant length communication hole 373 is formed so as to communicate with the inflow hole 371 and the discharge hole 372 from a side orthogonal to the side through which the inflow hole 371 and the discharge hole 372 pass,
The open side of the inflow hole 371 is coupled with an inflow connector 374 connecting the inflow pipe and the open side of the discharge hole 372 is coupled with a discharge connector 375 connecting the discharge pipe, ) Is coupled to a finishing cap (376).
3. The method of claim 2,
The elastic members 381 are provided at a predetermined distance between the lower surface of the seat support plate 385 and the upper surface of the water jacket 370,
The upper end of the elastic member 381 is seated and supported on the lower surface of the seating support plate 385 and the lower end of the elastic member 381 is restrained on the upper surface of the water jacket 370,
The seating support plate 385 is recessed at a lower surface of the seating support groove 388 with a predetermined distance therebetween, and the upper end of the elastic member 381 is inserted and restrained by a predetermined length,
The water jacket 370 is formed with a recessed groove 378 corresponding to the seat support groove 388 so as to be spaced apart from the upper surface of the water jacket 37 by a predetermined distance. The lower end of the elastic member 381 And the lower end is closely contacted and supported while being restrained by insertion.
The method according to claim 1,
To enable hot or cold test of multiple semiconductors,
A plurality of the sockets 110 are provided at the upper portion of the yarn body 100,
Wherein the hot / cold test unit (300) is mounted and fixed at a predetermined interval on the upper portion of the lifting plate (201) in correspondence with the socket (110).

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