KR101393107B1 - Test socket for semiconductor - Google Patents

Test socket for semiconductor Download PDF

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Publication number
KR101393107B1
KR101393107B1 KR1020130050933A KR20130050933A KR101393107B1 KR 101393107 B1 KR101393107 B1 KR 101393107B1 KR 1020130050933 A KR1020130050933 A KR 1020130050933A KR 20130050933 A KR20130050933 A KR 20130050933A KR 101393107 B1 KR101393107 B1 KR 101393107B1
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KR
South Korea
Prior art keywords
semiconductor chip
temperature
test
cover
heat exchange
Prior art date
Application number
KR1020130050933A
Other languages
Korean (ko)
Inventor
김용국
권병태
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(주)피코셈
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Priority to KR1020130050933A priority Critical patent/KR101393107B1/en
Application granted granted Critical
Publication of KR101393107B1 publication Critical patent/KR101393107B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A test socket for a semiconductor chip is disclosed. A test socket for a semiconductor chip of the present invention comprises: a base block mounted on a test board and having a seating groove for seating the semiconductor chip; And a cover block which covers the base block, has a through hole facing the seating groove, and a pressing leg is formed to press the corner of the semiconductor chip.

Description

Test socket for semiconductor chip {TEST SOCKET FOR SEMICONDUCTOR}

The present invention relates to a test socket for a semiconductor chip, and more particularly, to a test socket for a semiconductor chip capable of increasing a temperature measurement area of the semiconductor chip.

In general, semiconductor chips are becoming thinner, more highly integrated, and higher in density as semiconductor technology is developed. Semiconductor chips are manufactured and tested for goodness and failure using test packages. The test package includes a test board and a test socket. The test socket is mounted on the test board.

The test socket includes a base block on which the semiconductor chip is mounted, and a cover block which contacts the base block to cover the semiconductor chip. The cover block presses the periphery of the semiconductor chip to stably support the semiconductor chip. A through hole is formed in the cover block so that the temperature sensor can access the semiconductor chip.

Test the semiconductor chip by supplying current to the test board. Heat is generated in the semiconductor chip while the semiconductor chip is being tested. The temperature sensor contacts the semiconductor chip through the through-hole to measure the temperature of the semiconductor chip.

BACKGROUND ART [0002] The background art of the present invention is disclosed in Korean Registered Patent No. 1164089 (Registered on Mar. 07, 2012, entitled Socket for Testing Semiconductor Chip).

Conventionally, since the cover block is in contact with the peripheral surface of the semiconductor chip to support the semiconductor chip, the temperature measuring area of the semiconductor chip is reduced as the peripheral surface of the semiconductor chip is covered by the cover block. It is difficult to secure the test reliability of the semiconductor chip because a temperature of a part of the semiconductor chip can not be measured.

Further, as the semiconductor chip is miniaturized, the contact area between the semiconductor chip and the curve block is relatively increased, so that the temperature measurement area of the semiconductor chip can be relatively reduced. Therefore, it may be difficult to secure the test reliability of the semiconductor chip.

Further, since the peripheral surface of the semiconductor chip is in surface contact with the cover block, the semiconductor chip and the cover block can be heat-exchanged. Thus, the temperature measured in some areas of the semiconductor chip may be inaccurate.

Therefore, there is a need to improve this.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a test socket for a semiconductor chip capable of increasing a temperature measurement area of a semiconductor chip.

Another object of the present invention is to provide a test socket for a semiconductor chip which can test a semiconductor chip even when the semiconductor chip is miniaturized, and can ensure the reliability of the test.

It is another object of the present invention to provide a test socket for a semiconductor chip capable of reducing a contact area between a semiconductor chip and a cover block.

A test socket for a semiconductor chip according to the present invention comprises: a base block mounted on a test board and having a seating groove for seating the semiconductor chip; And a cover block covering the base block, having a through hole facing the seating groove, and a pressing leg formed to press the corner of the semiconductor chip.

The pressing leg may be in line contact or point contact with the edge of the semiconductor chip.

At least two pressing legs may be formed to correspond to the corner portions of the semiconductor chip.

The circumferential surface of the seating groove may be inclined and the outer surface of the pressing leg may be inclined to correspond to the circumferential surface.

The through hole may be larger than the seating groove.

The through hole may be formed in a "+" shape such that a portion of the semiconductor chip excluding the corner portion is exposed.

The cover block may have a stepped portion around the through hole.

According to the present invention, since the temperature measurement area of the semiconductor chip can be increased, the test reliability of the semiconductor chip can be secured.

Further, according to the present invention, even if the semiconductor chip is miniaturized, the semiconductor chip can be tested and the reliability of the test can be secured.

Further, according to the present invention, since the contact area between the semiconductor chip and the cover block can be reduced, the temperature can be accurately measured in the entire region of the semiconductor chip.

1 is a side view showing a test package according to an embodiment of the present invention.
2 is a perspective view showing a test socket for the semiconductor chip of FIG.
3 is a perspective view showing a state in which a cover block is opened in a test socket for a semiconductor chip of FIG.
4 is a cross-sectional view of the test socket for the semiconductor chip of FIG.
5 is a perspective view showing a through hole and a pressing leg in the test socket for semiconductor chip of FIG. 2;
Fig. 6 is a plan view showing the through hole and the pressing leg of Fig. 5;
7 is a perspective view illustrating a temperature measuring apparatus for a semiconductor chip according to an embodiment of the present invention.
FIG. 8 is a schematic view showing the temperature measuring apparatus for a semiconductor chip of FIG. 7; FIG.
FIG. 9 is a schematic view showing a state in which the cover frame is lifted in the semiconductor chip temperature measuring apparatus of FIG. 7; FIG.
10 is a schematic view showing a state where a test package is mounted on a base frame in the temperature measurement apparatus for a semiconductor chip of FIG.

Hereinafter, an embodiment of a test socket for a semiconductor chip according to the present invention will be described with reference to the accompanying drawings. In the course of describing the test socket for a semiconductor chip, the thickness of the lines and the size of the components shown in the drawings may be exaggerated for clarity and convenience of explanation. In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.

1 is a side view showing a test package according to an embodiment of the present invention.

Referring to FIG. 1, a test package 100 for a semiconductor chip according to an embodiment of the present invention includes a test board 110 and a test socket 120 for a semiconductor chip.

Circuit wiring (not shown) is printed on the test board 110. The circuit wiring is connected to the circuit wiring printed on the semiconductor chip (10). The test board 110 is provided with a plurality of connect pins 113 to be connected to the circuit wiring of the semiconductor chip 10. The plurality of connect pins 113 may be arranged in a row or in a plurality of rows. As the number of circuit wirings of the test board 110 is increased, the number of the connect pins 113 increases.

A test socket 120 for a semiconductor chip is mounted on a test board 110. A plurality of circuit wirings (not shown) are connected to the test socket 120 so as to be connected to the circuit wirings of the test board 110.

When a current is supplied to some of the connect pins 113, a current flows to a part of the circuit wiring connected to the connect pin 113. [ The circuit wiring through which current flows is generated. At this time, if the circuit wiring through which the current flows generates heat within the normal temperature range, it is judged that the circuit wiring is normally formed. If the circuit wiring through which current flows generates heat out of the normal temperature range, it is judged that the circuit wiring is abnormally formed. Therefore, it is possible to determine whether the semiconductor chip 10 is defective by measuring the temperature of the semiconductor chip 10.

FIG. 2 is a perspective view showing a test socket for the semiconductor chip of FIG. 1, FIG. 3 is a perspective view showing a state in which the cover block is opened in the test socket for semiconductor chip of FIG. 2, Fig.

2 through 4, a test socket 120 for a semiconductor chip includes a base block 130 and a cover block 140.

The base block 130 is mounted on the test board 110. A circuit wiring (not shown) is formed on the base block 130 so as to be connected to the test board 110. The base block 130 may be formed as a square block as a whole.

A hinge portion 136 is coupled to one side of the base block 130. The hinge portion 136 allows the cover block 140 to be rotatably coupled to the base block 130. The elastic member 137 is engaged with the hinge portion 136 to open the cover block 140 by elastic force. A stopping jaw (not shown) is formed on the other side of the base block 130.

In the base block 130, a seating groove 134 is formed so that the semiconductor chip 10 is seated. The base block 130 may include a base body 131 mounted on the test board 110 and a seating panel 132 coupled to the base body 131 and having a seating groove 134 formed therein. At this time, a coupling groove (not shown) may be formed on the base body 131 and a seating panel 132 may be coupled to a coupling groove (not shown) of the base body 131. The seat panel 132 can be fastened to the base body 131 by a fastening member such as a screw. Of course, the base body 131 and the seat panel 132 may be integrally formed.

The seating groove 134 may be formed to be equal to or slightly larger than the size of the semiconductor chip 10. A plurality of connecting pins (not shown) are disposed on the bottom surface of the seating groove 134 so as to be electrically connected to the circuit wiring formed on the base block 130. The connection pin is electrically connected to a connection portion (not shown) of the semiconductor chip 10. The connection portion of the semiconductor chip 10 may be a connection pad or a solder ball.

The circumferential surface 134a of the seating groove 134 is formed obliquely. For example, the circumferential surface 134a of the seating groove 134 may be formed to be inclined as a whole or by forming a plurality of inclined ribs. The peripheral surface 134a of the seating groove 134 is inclined so that the semiconductor chip 10 can be easily seated in the seating groove 134. [

The cover block 140 is installed to cover the base block 130. And may be formed in a square block shape corresponding to the base block 130.

One side of the cover block 140 is coupled to the hinge portion 136 and a hook 143 is formed on the other side of the cover block 140 so as to be caught by the hook of the base block 130. The hook 143 may be integrally formed with the cover block 140 or may be formed separately.

A through hole 144 is formed in the cover block 140 so as to face the seating groove 134. The through hole 144 will be described in detail below.

FIG. 4 is a cross-sectional view of the test socket for the semiconductor chip of FIG. 2, and FIG. 5 is a perspective view of the test socket for the semiconductor chip of FIG. 2 showing the through hole and the pressing leg.

Referring to FIGS. 4 and 5, a step 148 may be formed in the cover block 140 around the through-hole 144. The stepped portion 148 forms an opening larger than the through hole 144 so that the temperature measuring device 260 is prevented from interfering with the peripheral surface of the opening portion even if the temperature measuring device 260 moves while measuring the temperature of the semiconductor chip 10. [ The opening may be formed in a shape corresponding to the through hole 144.

A pressing leg 146 is formed in the cover block 140 so as to press the edge portion of the semiconductor chip 10. The pressing leg 146 may protrude toward the base block 130. Here, the corner portion of the semiconductor chip is defined as including the edge of the semiconductor chip and a region near the edge.

The pressing leg 146 presses the edge portion of the semiconductor chip 10 so that the contact area between the semiconductor chip 10 and the pressing leg 146 can be reduced. Therefore, the heat exchange area between the semiconductor chip 10 and the pressing leg 146 can be reduced, and the temperature of the semiconductor chip 10 can be accurately measured.

In addition, as the contact area between the semiconductor chip 10 and the pressing leg 146 is reduced, the exposed area of the semiconductor chip 10 can be relatively increased. Therefore, since the temperature measuring area of the semiconductor chip 10 can be relatively increased, the test reliability of the semiconductor chip 10 can be secured.

The pressing leg 146 may be in line contact or point contact with the edge portion of the semiconductor chip 10. [ The pressing leg 146 is formed so as to be tapered toward the end 146a. The contact area between the pressing leg 146 and the semiconductor chip 10 can be further reduced since the end 146a of the pressing leg 146 is in line contact or point contact. Therefore, the heat exchange area between the semiconductor chip 10 and the pressing leg 146 can be further reduced, and the temperature measurement area of the semiconductor chip 10 can be further increased.

The pressing leg 146 is linearly or point-contacted, so that even if the semiconductor chip 10 is miniaturized, the temperature measuring area of the semiconductor chip 10 can be sufficiently secured. Therefore, even if the semiconductor chip 10 is miniaturized, the test reliability of the semiconductor chip 10 can be secured.

At least two pressing legs 146 may be formed so as to correspond to the corner portions of the semiconductor chip 10.

For example, two pressing legs 146 may be formed to press the diagonal corners of the semiconductor chip 10. In this case, the contact area between the semiconductor chip 10 and the pressing leg 146 can be further reduced, and the temperature measurement area of the semiconductor chip 10 can be further increased.

Further, three or four pressing legs 146 may be formed to press three or four corner portions of the semiconductor chip 10. [ When three or four pressing legs 146 are formed, the semiconductor chip 10 can be stably supported. In this case, since the semiconductor chip 10 is in close contact with the seating groove 134, it is possible to prevent the semiconductor chip 10 from being tilted or twisted. Therefore, it is possible to prevent the temperature measuring instrument 260 from being abnormally contacted with or not in contact with a part of the semiconductor chip 10. [ Further, the temperature measuring instrument 260 can more accurately measure the temperature of the entire area of the semiconductor chip 10.

The outer side surface 146a of the pressing leg 146 may be formed to be inclined so as to correspond to the circumferential surface 134a of the seating groove 134. [ The outer side surface 146a of the pressing leg 146 is inclined so that the outer side surface 146a of the pressing leg 146 can be maximally approached to the edge of the receiving groove 134. [ In other words, the pressing leg 146 can be positioned as far as possible from the edge of the seating groove 134. Therefore, since the pressing leg 146 shields the semiconductor chip 10 as much as possible, the temperature measuring area of the semiconductor chip 10 can be further increased.

FIG. 5 is a perspective view showing a through hole and a pressing leg in the test socket for semiconductor chip of FIG. 2, and FIG. 6 is a plan view of the through hole and the pressing leg of FIG.

Referring to FIGS. 5 and 6, the through-hole 144 may be formed to be larger than the seating groove 134. Since the through hole 144 is formed to be larger than the seating groove 134, almost all of the semiconductor chip 10 can be exposed to the outside. The periphery of the through hole 144 can be prevented from covering the periphery of the semiconductor chip 10 so that the temperature measuring device 260 can measure the temperature with respect to almost the entire area of the semiconductor chip 10. [

The through hole 144 may be formed in a "+" shape, that is, a cross shape so as to expose a portion of the semiconductor chip 10 other than the corner portion thereof. The through hole 144 has a concave shape outward from the circumferential surface 134a of the seating groove 134 except for the portion where the pressing leg 146 is formed. The pressing leg 146 is formed at a position protruding from the through hole 144 toward the corner of the seating groove 134. The through hole 144 is formed sufficiently large so that the temperature measuring instrument 260 is not interfered with when the temperature measuring instrument 260 approaches the mounting recess 134.

The cover block 140 may include a cover body 141 on which a hook 143 is installed and a pressure panel 142 coupled to the cover body 141. [ The pressure panel 142 is coupled to the cover body 141 by a fastening member. A through hole 144 and a pressing leg 146 are formed in the pressing panel 142 and an opening is formed in the cover body 141. Of course, the cover body 141 and the pressure panel 142 may be integrally formed.

Next, a temperature measuring apparatus for a semiconductor chip according to the present invention will be described.

FIG. 7 is a perspective view illustrating a temperature measuring apparatus for a semiconductor chip according to an embodiment of the present invention, and FIG. 8 is a schematic view illustrating the temperature measuring apparatus for a semiconductor chip of FIG.

7 and 8, a temperature measuring apparatus 200 for a semiconductor chip includes a base frame 210, a cover frame 220, a temperature controller 240, a moving device 250, and a temperature meter 260 .

The base frame 210 is mounted on the upper side of the table 201. The test package 100 is seated on the base frame 210. The base frame 210 may be formed in various shapes as well as a rectangular plate as a whole.

The base frame 210 includes a first base 211 in the form of a rectangular plate and a second base 212 attached to the upper surface of the body and having a space in the center. One surface of the first base 211 is formed of a thermally conductive material, and the second base 212 is formed of a non-thermal conductive material.

A position fixing portion 215 is formed on the base frame 210 so that the cover frame 220 is disposed at a correct position. The position fixing portion 215 may vertically protrude upward from the base frame 210. The end portion of the position fixing portion 215 may be formed in a conical shape.

The cover frame 220 is disposed opposite to the base frame 210. A through hole 225 is formed in the cover frame 220 so as to correspond to the semiconductor chip 10 mounted on the test package 100. The through hole 225 may be formed larger than the opening of the cover block 140.

A transparent window is disposed on one side of the through hole 225 (see FIG. 8) in the cover frame 220. The transparent window allows the test socket 120 for a semiconductor chip to be seen from the outside. Therefore, since the operator can see the temperature of the semiconductor chip 10 when measuring the temperature of the semiconductor chip 10, it is possible to visually confirm whether the temperature measurement is normally performed.

The cover frame 220 includes a first cover 221 in the form of a rectangular frame and a second cover 222 attached to the first cover 221 and formed with a center portion. One surface of the first cover 221 is formed of a thermally conductive material, and the second cover 222 is formed of a non-thermal conductive material. When the cover frame 220 is positioned on the upper side of the base frame 210, the second cover 222 is brought into contact with the second base 212.

A heat exchange chamber 230 is formed in the base frame 210 and the cover frame 220 to receive the test package 100. The lower side of the heat exchange chamber 230 is a space of the base frame 210 and the upper side of the heat exchange chamber 230 is a space of the cover frame 220.

A sealing portion 231 is formed around the heat exchange chamber 230 so as to be in close contact with the test package 100. The sealing portion 231 seals the heat exchange chamber 230 so that the heat exchange chamber 230 is shielded from the outside.

The sealing part 231 is formed on the second base 212 and is in contact with the lower surface of the test package 100. The lower sealing part 233 is formed on the upper surface of the test package 100, And an upper contact portion 235 which is in close contact with the upper contact portion 235. The lower close contact portion 233 and the upper close contact portion 235 are formed at positions facing each other. The sealing portion 231 may be formed to surround the heat exchange chamber 230. The test socket 120 for the semiconductor chip is located in the heat exchange chamber 230 and the test socket 120 for the semiconductor chip is shielded from the outside by the sealing portion 231. The sealing portion 231 allows the inside of the heat exchange chamber 230 to be maintained at a constant temperature.

A temperature controller 240 may be disposed around the test package 100 to heat exchange the test package 100. The temperature controller 240 maintains the heat exchange chamber 230 at a constant temperature so that the semiconductor chip 10 can be tested in a constant temperature atmosphere. In addition, the temperature controller 240 can vary the temperature of the heat exchange chamber 230 to various temperatures, so that the semiconductor chip 10 can be tested under various conditions such as low temperature, normal temperature, and high temperature. Thus, it can be tested whether the semiconductor chip 10 operates normally under the temperature conditions in which it is actually used.

The temperature regulator 240 may be disposed in the base frame 210 and the cover frame 220. The temperature regulator 240 is disposed above and below the heat exchange chamber 230 so that the heat exchange chamber 230 can maintain a uniform temperature throughout. An example of such a temperature controller 240 is as follows.

The temperature regulator 240 includes a medium supply 243 of the heat exchange tube 241.

The heat exchange tube 241 is disposed in the base frame 210 and the cover frame 220. The heat exchange tubes 241 may be arranged in various forms such as a zigzag or a spiral shape of the base frame 210 and the cover frame 220. The heat exchange medium flows into the heat exchange tube (241). As the heat exchange medium, water, distilled water, fluid such as oil, or gas with excellent stability may be applied.

The medium supply unit 243 may include a pump (not shown) for pumping the heat exchange medium and a heat cooling unit (not shown) for heating and cooling the heat exchange medium. As the medium supply unit 243, various structures such as a heater and a refrigerant pipe can be applied.

The inlet hose and the drain hose are connected to the heat exchange tube 241 disposed in the base frame 210. The inlet hose and the drain hose are connected to the heat exchange tube 241 disposed in the cover frame 220. This hose is connected to the medium supply unit 243.

The mobile device 250 is disposed on one side of the base frame 210. The mobile device 250 can be fixed to the table 201 by a fastening member (not shown). The moving device 250 includes an X-axis stage 251, a Y-axis stage 253, and a Z- The X-axis stage 251, the Y-axis stage 253 and the Z-axis stage 255 move the temperature measuring instrument 260 in three axial directions so that the temperature measuring instrument 260 is brought into contact with the semiconductor chip 10, So that the temperature of the substrate 10 can be measured.

The X-axis stage 251, the Y-axis stage 253 and the Z-axis stage 255 can be manually moved by an operation unit (not shown) or automatically moved by a motor (not shown). When the temperature of the semiconductor chip 10 is measured while the mobile device 250 is being moved, the measured temperature value may be stored in the control unit and displayed on the display unit 205.

The temperature meter 260 is movably disposed in the mobile device 250. The temperature measuring instrument 260 passes through the through hole 225 of the cover frame 220 and then contacts the semiconductor chip 10 to measure the temperature of the semiconductor chip 10. [ A thermocouple contacting the semiconductor chip 10 may be applied to the temperature measuring instrument 260. The temperature measuring instrument 260 transmits temperature information to the control unit by electric wire or wireless communication.

And a pressing device 270 disposed around the base frame 210. The pressing device 270 presses the cover frame 220 toward the base frame 210 side. An example of such a pressure device 270 is as follows.

The pressurizing device 270 includes a support 271, a pressurizing lever 273, and a pressurizing rod 275.

The support frame 271 is disposed around the base frame 210. 6, four support frames 271 are provided around the base frame 210, but the number of the support frames 271 can be variously changed. The support base 271 may be formed in a square pillar shape or a cylindrical shape.

The press lever 273 is hinged to the upper side of the support table 271. The pressing lever 273 is rotated up and down about the hinge portion 136. [

The pressing rod 275 is linked to the pressing lever 273 and the supporting table 271 so as to press the cover frame 220 toward the base frame 210 by operating the pressing lever 273. [ Since the lower end of the pressing rod 275 is in direct contact with the cover frame 220, heat loss of the heat exchange chamber 230 can be prevented. That is, when the fastening member pushes the cover frame 220 through the cover frame 220 and the base frame 210, the heat energy of the heat exchange chamber 230 can be released to the outside through the fastening member. However, since the pressing rod 275 presses the cover frame 220 from the outside of the cover frame 220, the path through which heat energy is emitted can be eliminated. Therefore, the heat energy of the heat exchange chamber 230 can be minimized.

The operation of the temperature measuring apparatus for a semiconductor chip constructed as described above will be described.

FIG. 9 is a schematic view showing a state in which the cover frame is lifted in the semiconductor chip temperature measuring apparatus of FIG. 7; FIG.

Referring to Fig. 9, the cover frame 220 is lifted upward. At this time, the cover frame 220 can be raised manually or elevated by a lifting device (not shown) such as a cylinder. When the cover frame 220 is lifted, the heat exchange chamber 230 is opened.

10 is a schematic view showing a state in which a test package is mounted on a base frame 210 in the temperature measurement apparatus for a semiconductor chip of FIG.

Referring to FIG. 10, a test package 100 is seated on a base frame 210. The test socket 120 for the semiconductor chip of the test package 100 is located above the test board 110.

FIG. 8 is a schematic view showing the temperature measuring apparatus for a semiconductor chip of FIG. 7; FIG.

Referring to FIG. 8, after the test package 100 is mounted on the base frame 210, the cover frame 220 is lowered. The cover frame 220 is disposed at the correct position by the position fixing portion 215. When the cover frame 220 is seated, the heat exchange chamber 230 is shielded from the outside.

The pressing rod 275 presses the cover frame 220 toward the base frame 210 as the pressing lever 273 is operated. When the pressurizing device 270 presses the cover frame 220, the lower close contact portion 233 of the base frame 210 and the upper close contact portion 235 of the cover frame 220 press both sides of the test board 110 do. The lower adhesion portion 233 and the upper adhesion portion 235 seal the heat exchange chamber 230 as they are in close contact with the test board 110. A test board 110 and a test socket 120 are positioned inside the heat exchange chamber 230. At this time, the test board 110 and the test socket 120 are shielded from the external environment.

As the temperature regulator 240 is driven, the heat exchanging medium is heated or cooled to the target temperature in the medium supply unit 243. As the heat exchange medium is introduced into the heat exchange tube 241, the heat exchange chamber 230 is heated or cooled to the set temperature. The heat exchange chamber 230 continuously maintains the temperature set by the temperature regulator 240.

The temperature controller 240 maintains the heat exchange chamber 230 at a constant temperature so that the semiconductor chip 10 can be tested in a constant temperature atmosphere. At this time, the temperature controller 240 is driven to maintain the heat exchange chamber 230 at a constant temperature, and then the semiconductor chip 10 can be operated by supplying current to the semiconductor chip 10. As the semiconductor chip 10 is operated, the semiconductor chip 10 can be heated at a constant temperature. Therefore, the temperature of the semiconductor chip 10, which is generated in a constant temperature state by the temperature measuring device 260, can be measured as a whole. In addition, it is possible to accurately test whether the semiconductor chip generates heat at the same level as that of an actual product.

In addition, the temperature controller 240 can vary the temperature of the heat exchange chamber 230 to various temperatures, so that the semiconductor chip 10 can be tested under various conditions such as low temperature, normal temperature, and high temperature. Thus, it can be tested whether the semiconductor chip 10 operates normally under the temperature conditions in which it is actually used.

When the internal temperature of the heat exchange chamber 230 reaches a set temperature, current is applied to some of the connect pins 113 of the test package 100. As the current is applied to some of the circuit wirings, the corresponding circuit wirings can be tested. At this time, the circuit wiring to which current is applied generates heat.

The temperature measuring instrument 260 passes through the through hole 225 of the cover frame 220 and the through hole 144 of the cover block 140 and contacts the semiconductor chip 10. The temperature measuring instrument 260 measures the temperature of the portion corresponding to the circuit wiring of the semiconductor chip 10 which generates heat.

Test all circuit wiring by sequentially applying current to the circuit wiring. At this time, the temperature measuring device 260 measures the temperature of the semiconductor chip 10 as a whole while moving the surface of the semiconductor chip 10.

The temperature meter 260 transmits a signal regarding the measured temperature to the control unit. A temperature value corresponding to the entire area of the semiconductor chip 10 is stored in the control unit. The temperature for each region of the semiconductor chip 10 is displayed by the display unit 205. [

On the other hand, when the circuit wiring through which current flows generates heat within the normal temperature range, it is judged that the circuit wiring is normally formed. If the circuit wiring through which current flows generates heat out of the normal temperature range, it is judged that the circuit wiring is abnormally formed. Therefore, it is possible to determine whether the semiconductor chip 10 is defective by measuring the temperature of the semiconductor chip 10.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. I will understand.

Accordingly, the true scope of protection of the present invention should be defined by the claims.

10: semiconductor chip 100: test package
110: test board 120: test socket
130: base block 134: seat groove
134a: circumferential surface 136: hinge portion
140: cover block 144: through hole
146: pressure leg 146a:
148: step unit 200: temperature measuring device for semiconductor chip
210: base frame 220: cover frame
225: through hole 230: heat exchange chamber
131: sealing part 133:
135: upper contact portion 240: temperature controller
250: Mobile device 260: Temperature meter
270: pressure device 271: support
273: pressure lever 275: pressing rod

Claims (7)

A base block mounted on the test board and having a seating groove for seating the semiconductor chip; And
And a cover block covering the base block, having a through hole facing the seating recess, and a pressing leg formed to press the corner of the semiconductor chip.
The method according to claim 1,
Wherein the pressing leg is in line contact or point contact with an edge portion of the semiconductor chip.
3. The method of claim 2,
Wherein at least two pressing legs are formed to correspond to corner portions of the semiconductor chip.
3. The method of claim 2,
The circumferential surface of the seating groove is formed to be inclined,
Wherein an outer surface of the pressing leg is formed to be inclined so as to correspond to the circumferential surface.
5. The method according to any one of claims 1 to 4,
Wherein the through hole is formed to be larger than the seating groove.
6. The method of claim 5,
Wherein the through hole is formed in a "+" shape so as to expose a portion of the semiconductor chip excluding a corner portion thereof.
The method according to claim 6,
And a stepped portion is formed in the cover block around the through hole.
KR1020130050933A 2013-05-06 2013-05-06 Test socket for semiconductor KR101393107B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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KR102168476B1 (en) * 2019-08-27 2020-10-21 한국기계연구원 Fabricating apparatus and method for transparent stamp, the same transparent stamp made by the apparatus and imprint lithography method with the same transparent stamp
KR102171511B1 (en) 2019-08-27 2020-10-29 주식회사 엘비엘 Socket for semiconductor chip test
KR102171508B1 (en) 2019-08-27 2020-10-29 주식회사 엘비엘 Socket for testing both sides of semiconductor chips

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KR101019417B1 (en) 2008-09-03 2011-03-07 주식회사 엔티에스 A socket for testing electonic camera module
KR101028754B1 (en) 2009-07-06 2011-04-14 주식회사 오킨스전자 Press cover for semiconductor package test device

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KR100939326B1 (en) 2008-04-28 2010-01-28 미래산업 주식회사 Structure of aligning electronic parts, carrier module, and method for testing the electronic parts
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Publication number Priority date Publication date Assignee Title
KR102036202B1 (en) * 2018-10-26 2019-10-24 (주) 나노에이스 Support for inspection of semiconductor chips
KR102168476B1 (en) * 2019-08-27 2020-10-21 한국기계연구원 Fabricating apparatus and method for transparent stamp, the same transparent stamp made by the apparatus and imprint lithography method with the same transparent stamp
KR102171511B1 (en) 2019-08-27 2020-10-29 주식회사 엘비엘 Socket for semiconductor chip test
KR102171508B1 (en) 2019-08-27 2020-10-29 주식회사 엘비엘 Socket for testing both sides of semiconductor chips

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