KR20190045817A - 레이저가공기의 제어장치, 레이저가공방법, 및 레이저가공기 - Google Patents
레이저가공기의 제어장치, 레이저가공방법, 및 레이저가공기 Download PDFInfo
- Publication number
- KR20190045817A KR20190045817A KR1020180083470A KR20180083470A KR20190045817A KR 20190045817 A KR20190045817 A KR 20190045817A KR 1020180083470 A KR1020180083470 A KR 1020180083470A KR 20180083470 A KR20180083470 A KR 20180083470A KR 20190045817 A KR20190045817 A KR 20190045817A
- Authority
- KR
- South Korea
- Prior art keywords
- laser beam
- syringe
- pulsed laser
- incident
- light source
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017204857A JP7066368B2 (ja) | 2017-10-24 | 2017-10-24 | レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機 |
JPJP-P-2017-204857 | 2017-10-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20190045817A true KR20190045817A (ko) | 2019-05-03 |
Family
ID=66229695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180083470A KR20190045817A (ko) | 2017-10-24 | 2018-07-18 | 레이저가공기의 제어장치, 레이저가공방법, 및 레이저가공기 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7066368B2 (ja) |
KR (1) | KR20190045817A (ja) |
CN (1) | CN109693035B (ja) |
TW (1) | TWI704023B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7339879B2 (ja) * | 2019-12-23 | 2023-09-06 | 住友重機械工業株式会社 | レーザ加工機の制御装置及びレーザ加工方法 |
JP2022063595A (ja) * | 2020-10-12 | 2022-04-22 | 住友重機械工業株式会社 | レーザ加工機の制御装置、レーザ加工機、及びレーザ加工方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004066300A (ja) | 2002-08-07 | 2004-03-04 | Matsushita Electric Ind Co Ltd | レーザ加工装置およびレーザ加工方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0195889A (ja) * | 1987-10-06 | 1989-04-13 | Amada Co Ltd | レーザ加工装置およびレーザ加工方法 |
JP2938336B2 (ja) * | 1994-02-09 | 1999-08-23 | 新日本製鐵株式会社 | 鋼板へのレーザ刻印装置および方法 |
JP2004358550A (ja) | 2003-06-09 | 2004-12-24 | Sumitomo Heavy Ind Ltd | レーザ加工方法およびレーザ加工装置 |
US7133187B2 (en) * | 2004-06-07 | 2006-11-07 | Electro Scientific Industries, Inc. | AOM modulation techniques employing plurality of transducers to improve laser system performance |
JP4749092B2 (ja) | 2005-02-28 | 2011-08-17 | パナソニック電工Sunx株式会社 | レーザ加工方法、並びにレーザ加工装置 |
JP2007142000A (ja) * | 2005-11-16 | 2007-06-07 | Denso Corp | レーザ加工装置およびレーザ加工方法 |
EP2076354B1 (en) * | 2006-08-22 | 2011-11-02 | GSI Group Corporation | System for employing scanners in an x-y high speed drilling system |
US7982160B2 (en) | 2008-03-31 | 2011-07-19 | Electro Scientific Industries, Inc. | Photonic clock stabilized laser comb processing |
JP5288987B2 (ja) * | 2008-10-21 | 2013-09-11 | 三菱電機株式会社 | レーザ加工装置 |
JP4873578B2 (ja) | 2009-09-07 | 2012-02-08 | 住友重機械工業株式会社 | レーザ加工装置及び加工条件の決定方法 |
CN203236853U (zh) * | 2012-12-21 | 2013-10-16 | 上海大量光电科技有限公司 | 激光加工影像检测校正装置 |
JP2015054330A (ja) * | 2013-09-10 | 2015-03-23 | 株式会社片岡製作所 | レーザ加工機 |
JP6234296B2 (ja) * | 2014-03-27 | 2017-11-22 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工方法 |
CN203791833U (zh) * | 2014-04-02 | 2014-08-27 | 温州职业技术学院 | 一种聚焦透镜激光束出射位置调校辅助装置 |
CN104972221B (zh) * | 2014-04-03 | 2017-12-26 | 苏州天弘激光股份有限公司 | 一种激光加工设备及激光加工寻焦方法 |
WO2015198398A1 (ja) | 2014-06-24 | 2015-12-30 | 三菱電機株式会社 | レーザ加工装置、加工制御装置およびレーザ加工方法 |
DE102014117157B4 (de) * | 2014-11-24 | 2017-02-16 | Scansonic Mi Gmbh | Verfahren und Vorrichtung zum Fügen von Werkstücken an einem Überlappungsstoß |
JP6570921B2 (ja) | 2015-03-16 | 2019-09-04 | ビアメカニクス株式会社 | レーザ穴あけ加工条件の設定方法及びレーザ加工機 |
JP6553940B2 (ja) * | 2015-05-15 | 2019-07-31 | 株式会社ディスコ | レーザー加工装置 |
DE102015112151A1 (de) * | 2015-07-24 | 2017-02-09 | Lpkf Laser & Electronics Ag | Verfahren und Vorrichtung zur Laserbearbeitung eines Substrates mit mehrfacher Ablenkung einer Laserstrahlung |
WO2017161284A1 (en) * | 2016-03-17 | 2017-09-21 | Electro Scientific Industries, Inc. | Location of image plane in a laser processing system |
-
2017
- 2017-10-24 JP JP2017204857A patent/JP7066368B2/ja active Active
-
2018
- 2018-07-16 TW TW107124413A patent/TWI704023B/zh active
- 2018-07-18 CN CN201810790726.8A patent/CN109693035B/zh active Active
- 2018-07-18 KR KR1020180083470A patent/KR20190045817A/ko not_active Application Discontinuation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004066300A (ja) | 2002-08-07 | 2004-03-04 | Matsushita Electric Ind Co Ltd | レーザ加工装置およびレーザ加工方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2019076919A (ja) | 2019-05-23 |
JP7066368B2 (ja) | 2022-05-13 |
CN109693035B (zh) | 2022-06-14 |
TWI704023B (zh) | 2020-09-11 |
TW201916961A (zh) | 2019-05-01 |
CN109693035A (zh) | 2019-04-30 |
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