KR20190035956A - Reel body, film connection body, film winding body, and manufacturing method for film connection body - Google Patents

Abstract

In order to make it difficult for the adhesive film 30 to be displaced from the lead film 40 even when the width of the adhesive film 30 is narrowed, the reel 10 is formed of the cylindrical winding core 20, A lead film 40 connected to the peripheral surface of the winding core 20, an adhesive film 30 having a width less than 1 mm wound around the winding core 20, a lead film 40 and an adhesive film 30 And the connection strength between the lead film 40 and the adhesive film 30 by the connection tape 50 is 5.0 N or more.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reel, a film connecting body, a film reeling body, and a manufacturing method of the film connecting body. BACKGROUND OF THE INVENTION 1. Field of the Invention [0002]

The present invention relates to a reel, a film connecting body, a film winding attaching body, and a manufacturing method of the film connecting body.

For example, as disclosed in Patent Documents 1, 2, 4, and 5, the adhesive film may be provided in a wound state on a reel. The reel, that is, the reel, on which the adhesive film is wound, roughly includes a cylindrical winding core and an adhesive film wound around the winding core. A lead film is connected to one longitudinal end portion of the adhesive film, and this lead film is fixed to the circumferential surface of the winding core. That is, the adhesive film is fixed to the winding core through the lead film, and then wound around the winding core. The adhesive film is drawn out from the reel body and used.

However, a demand for narrowing the width of the adhesive film is becoming stronger each year. For example, Patent Literatures 1, 2, 4, and 5 disclose an anisotropic conductive film as an example of an adhesive film. However, in the field of anisotropic conductive films, such demands are particularly strong. For example, There is a demand for using an anisotropic conductive film. The reasons for this are, for example, the following.

The anisotropic conductive film is used, for example, for bonding components arranged in an outer frame (so-called frame) of various displays. Displays in which anisotropic conductive films are used vary. For example, anisotropic conductive films are used in portable displays (e.g., displays for smart phones, cellular phones, and wearable devices) as well as various stationary displays. And, the outer frames of these displays are becoming narrower each year, mainly to increase the ratio of the display area. As a result, the demand for narrowing the width of the anisotropic conductive film has become stronger each year.

Japanese Patent Application Laid-Open No. 2006-218867 International Publication No. 2010/084728 Japanese Patent Application Laid-Open No. 2005-297055 Japanese Patent Application Laid-Open No. 2001-284005 Japanese Patent Application Laid-Open No. 2009-289755

However, if the width of the adhesive film is narrowed, the connection strength between the adhesive film and the lead film tends to become weak. When the connecting strength between the connecting film and the lead film is weakened, the adhesive film tends to be displaced from the lead film when tension is applied to the adhesive film. Examples of the case where tension is applied to the adhesive film include a case in which an adhesive film is pulled out from the reel body. If the adhesive film in the reel is shifted from the lead film, the reel can not be used. This is because when the adhesive film is displaced from the lead film, the adhesive film can not be drawn out from the reel body. Specifically, even if the adhesive film is to be pulled out from the reel, the reel body will idly rotate, and the adhesive film will not be pulled out of the reel body. Therefore, the adhesive film remaining on the reel is wasted.

Further, the larger the number of adhesive films remaining on the reel, the larger the tension is applied to the adhesive film when the adhesive film is pulled out. Therefore, the more adhesive films remaining on the reel, the more easily the adhesive film is displaced from the lead film. That is, if the width of the adhesive film is narrowed, the possibility that a large amount of the adhesive film is wasted increases. Particularly, there is a demand for lengthening of the adhesive film in recent years. This is to reduce the number of times of reel replacement in the operation using the reel. For this reason, in many cases, a large amount of adhesive film is wound around the reel.

Further, in the operation using a reel, there are cases where a drawing process for drawing the adhesive film from the reel body and various subsequent processes following the drawing process are performed in one line. If the adhesive film deviates from the lead film during operation of this line, it is necessary to temporarily stop the drawing process and replace the reel. As described above, if the adhesive film in the reel is shifted from the lead film, the reel can not be used. In this line, if the drawing process is stopped, all subsequent processes following the drawing process are also stopped. Therefore, there is a significant delay in the operation of the line. And, as described above, when the width of the adhesive film is narrowed, the adhesive film is liable to be displaced from the lead film when tension is applied to the adhesive film. Therefore, if the width of the adhesive film is narrowed, there is a high possibility that the operation of the line is delayed.

Further, in the above line, a process of temporarily stopping the rotation of the reel after withdrawing the adhesive film to a predetermined length, a process of cutting off the adhesive film, and a process of restarting the rotation of the reel may be performed. During these processes, a large tension is applied to the adhesive film. Therefore, if the width of the adhesive film is narrowed, the adhesive film tends to be displaced from the lead film even during these processes. Further, in the line for applying a driving force to the winding core of the reel, particularly great tension is applied to the adhesive film when the reel starts rotating and stops. Therefore, in the line that applies the driving force to the winding core of the reel, the adhesive film tends to be particularly displaced from the lead film. In addition, since the line speed of the anisotropic connection is directly related to the productivity, it is required to speed up this. As a result, the reel tends to have a sudden fluctuation in tension.

As described above, when the width of the adhesive film is narrowed, the adhesive film is liable to be displaced from the lead film. If the adhesive film deviates from the lead film, there arises a problem such that the adhesive film remaining on the reel is wasted, and the operation using the reel is significantly delayed. As a result, a technique for improving the strength of the adhesive film and the lead film has been desired.

For example, Patent Document 3 discloses a so-called ultrasonic connection technique as a technique for connecting a plurality of members. In this technique, while one member is pressed against the other member, ultrasonic vibration is applied to these members.

However, in this technique, the connection strength between the adhesive film and the lead film can not be made sufficiently large. Further, in this technique, irregularities are formed at the connection portion between the adhesive film and the lead film. Therefore, when the adhesive film is wound around the winding core, the unevenness is transferred to the adhesive film. Concretely, the unevenness of the connection portion is transferred to the portion of the adhesive film that is wound on the connection portion between the adhesive film and the lead film. As a result, the quality of the adhesive film deteriorates. For example, when the adhesive film is an anisotropic conductive film, anisotropy of the anisotropic conductive film may be deteriorated. In addition, it is almost impossible to connect an adhesive film having a width of less than 1 mm and a lead film by ultrasonic vibration in the present technology. In addition, in this technique, it is necessary to separately prepare an ultrasonic oscillator.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a novel and improved reel that can make it difficult for the adhesive film to be displaced from the lead film even when the width of the adhesive film is narrow, And a method for manufacturing a film connecting body, a film winding body, and a film connecting body.

In order to solve the above problems, according to an aspect of the present invention, there is provided a semiconductor device comprising: a cylindrical winding core; a lead film connected to a circumferential surface of the winding core; an adhesive film having a width less than 1 mm wound around the winding core; And a reed body having a connection strength between the lead film and the adhesive film by the connection tape of 5.0 N or more is provided.

Here, the adhesive film includes a support film and an adhesive layer formed on the support film. The support film has a protrusion protruding in the longitudinal direction with respect to the adhesive layer. The protrusion of the support film and the lead film may be connected to the connection tape.

The total length of the adhesive surface of the adhesive film and the connection tape and the length of the adhesive surface of the lead film and the connection tape may be larger than 30% of the circumferential length of the outer peripheral surface of the winding core.

The total length of the bonding surface of the adhesive film and the connection tape and the bonding surface length of the lead film and the connection tape may be 120 mm or more.

The ratio of the bonding surface length of the adhesive film to the connection tape and the bonding surface length of the lead film and the connection tape may be 3: 7 to 7: 3.

The connection tape may be provided on the front and back surfaces of the adhesive film and the lead film.

The length of the adhesive film may be 50 m or more.

Further, the adhesive film may contain an anisotropic conductive material.

According to another aspect of the present invention, there is provided a reel comprising: a lead film connected to a circumferential surface of a winding core of a reel; an adhesive film having a width less than 1 mm wound around the winding core; and a connection tape connecting the lead film and the adhesive film, A connection strength between the lead film and the adhesive film by the connection tape is 5.0 N or more.

According to the above aspect of the present invention, the adhesive film having a width of less than 1 mm and the lead film are connected by the connection tape. The connection strength between the adhesive film and the lead film is 5.0 N or more. As shown in Examples described later, when the connection strength is 5.0 N or more, the adhesive film is difficult to be displaced from the lead film. Therefore, even if the width of the adhesive film is less than 1 mm, it is possible to make the adhesive film difficult to be displaced from the lead film.

According to another aspect of the present invention, there is provided a laminated film comprising a support film, a lead film which is adjacent to an end portion in the longitudinal direction of the support film and is connected to a peripheral surface of the winding core of the reel, And a cured layer formed on the other surface of the support film and extending from the other surface of the support film to the other surface of the support film, And a connection strength between the support film and the lead film is 5.0 N or more.

Here, the width of the film connecting body may be less than 1 mm.

The length of the connecting tape may be less than 120 mm.

In addition, the cured layer may contain a photo-curable initiator capable of initiating curing of the adhesive layer by light irradiation.

Further, the adhesive layer may contain a photo-curable initiator.

Further, the adhesive layer may contain an anisotropic conductive material.

According to another aspect of the present invention, there is provided a film winding attachment having a winding core and the film connector wound around the winding core, the lead film being connected to the winding core.

According to another aspect of the present invention, there is provided a reel having the film winding attachment body and a flange portion provided at both axial end portions of the winding core.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a connection step of connecting one surface of a support film and a lead film with a connection tape; and a step of forming an adhesive layer And a curing step of curing the adhesive layer to be cured which is an adhesive layer existing at a boundary portion between the support film and the lead film.

Here, the curing step may be performed by irradiating light to the adhesive layer to be cured.

The method may further comprise a curing preparation step of causing the curable adhesive layer to contain a photo-curable initiator capable of initiating curing of the adhesive layer by light irradiation.

Further, the adhesive layer may contain an anisotropic conductive material.

As described above, according to any one aspect of the present invention, even if the width of the adhesive film is less than 1 mm, it is possible to make the adhesive film difficult to be displaced from the lead. According to another aspect of the present invention, since the support film and the lead film can be connected by the cured layer and the connection tape, even when the width of the adhesive film is narrowed, it becomes possible to make the adhesive film difficult to be displaced from the lead film.

Fig. 1 (a) is a side view schematically showing an outer appearance of a reel according to a first embodiment of the present invention. Fig. (b) is a front view schematically showing the appearance of the reel according to the first embodiment of the present invention.
Fig. 2 is a side view schematically showing a configuration in the vicinity of a winding core of a reel according to the embodiment; Fig.
3 is an enlarged side view showing the structure of the connecting portion.
4 is a side view schematically showing a method of measuring connection strength.
5 is a side view schematically showing a modification of the structure of the connecting portion.
6 is a side view schematically showing a modification of the structure of the connecting portion.
7 is a graph showing the connection strength of the reference example (adhesive film width 1.5 mm, connection tape length 30 mm) and comparison strength of Comparative Example 1 (adhesive film width 0.8 mm, connection tape length 30 mm).
8 is a graph showing the correspondence relationship between the connection tape length and the connection strength.
9 is a graph showing a correspondence relationship between the tape shift occurrence rate and the connection strength.
10 is a graph showing the correspondence relationship between the connection tape length and the tape shift occurrence rate.
11 is a graph showing a correspondence relationship between connection tape length and connection strength.
Fig. 12 is a graph showing the relationship between the bonding surface length ratio (the ratio of the bonding surface length of the adhesive film and the connection tape to the bonding surface length of the lead and the connection tape) and the connection strength.
13 is a side sectional view showing a schematic structure of a film connecting body according to a second embodiment of the present invention.
14 is a side view schematically showing a method of measuring connection strength.
15 (a) is a side view schematically showing the appearance of a reel according to a second embodiment of the present invention. (b) is a front view schematically showing an appearance of a reel according to a second embodiment of the present invention.
16 is a side sectional view showing a connecting portion between the film connector and the winding core.
17 is a cross-sectional side view for explaining a method of manufacturing the film connecting body.
18 is a side cross-sectional view showing a schematic configuration of a film connecting body end.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present specification and drawings, constituent elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant description will be omitted.

<A. First Embodiment>

<1a. Reel Configuration>

First, the configuration of the reel 10 will be described with reference to Figs. 1 to 3. Fig. 1 and 2, the reel 10 includes a winding core 20, flanges 21 and 22, an adhesive film 30, a lead film 40, a connecting tape 50 And a fixing connection tape 60,

The winding core (20) has a cylindrical shape and serves as a rotating shaft of the reel (10). Further, the winding core 20 is wound with the adhesive film 30. The outer diameter (diameter of the outer diameter surface) of the winding core 20 is not particularly limited and may be suitably determined according to the use of the reel 10 or the like. For example, the diameter of the winding core 20 (diameter of the outer diameter surface) may be about 45 to 95 mm. The flanges 21 and 22 are provided at both end portions in the axial direction of the winding core 20, respectively. The flanges 21 and 22 are circular members and are installed in the winding core 20 so as to be parallel to each other. Between the flanges 21 and 22, the adhesive film 30 is accommodated.

The adhesive film 30 is a long film having a width of less than 1.0 mm. As described above, since the width of the adhesive film 30 is very narrow, it is very difficult to maintain the connection strength with the lead film 40 at a high value. In this respect, in this embodiment, the connection strength between the adhesive film 30 and the lead film 40 is maintained at a high value, specifically 5.0 N or more, by using the connecting tape 50 for connection. It is difficult for the adhesive film 30 to be displaced from the reel body 10 when the connection strength between the adhesive film 30 and the lead film 40 is 5.0 N or more as shown in the following embodiments. The length of the adhesive film 30 is not particularly limited and may be suitably determined in accordance with the use of the adhesive film 30. [ For example, the length of the adhesive film 30 may be 50 m or more, 200 m or more, or 300 m or more. In addition, from the viewpoint of suppressing the winding displacement or coming out (the adhesive layer 32 emerges from the width direction of the adhesive film 30), the upper limit is preferably 500 m or less.

The adhesive film 30 has a support film 31 and an adhesive layer 32 formed on the support film 31. [ The support film 31 is a film which becomes a base layer of the adhesive layer 32. At the longitudinal end of the support film 31, a protrusion 31a projecting in the longitudinal direction with respect to the adhesive layer 32 is formed. Then, the connection connecting tape 50 is bonded to the projecting portion 31a. The protruding portion 31a may be formed at the end portion connected to the lead film 40. [ Also, the projecting portion 31a may be omitted. In this case, the connection connecting tape 50 may be adhered to the adhesive layer 32. The back surface of the support film 31 (the surface on the side where the adhesive layer 32 is not formed) and the lead film 40 may be connected by the connection connecting tape 50.

The material of the support film 31 is not particularly limited and may be appropriately determined depending on the use of the adhesive film 30. [ Examples of the material constituting the support film 31 include a film obtained by applying a releasing agent such as silicone to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene) &Lt; / RTI &gt; These support films 31 prevent drying of the adhesive film 30 and can maintain the shape of the adhesive film 30. The thickness of the support film 31 is not particularly limited. For example, the thickness of the support film 31 may be about 12 to 125 탆.

The adhesive layer 32 is a layer having adhesiveness and is formed on the support film 31. The material of the adhesive layer 32 is not particularly limited and may be suitably determined in accordance with the use of the adhesive film 30. [ For example, the adhesive layer 32 may be an anisotropic conductive material. The thickness of the adhesive layer 32 is not particularly limited. For example, the thickness of the adhesive layer 32 may be about 3 to 160 mu m. The surface of the adhesive layer 32 may be covered with a cover film. This cover film may be made of substantially the same material as the support film 31. [ The color of the support film 31 or the cover film may be, for example, white (milky white) or colorless and transparent.

The lead film (40) is a member for fixing the adhesive film (30) to the winding core (20). The connecting tape 50 for connection is bonded to one end of the lead film 40. [ That is, one end of the lead film 40 is connected to the adhesive film 30 via the connecting tape 50 for connection. The other end of the lead film 40 is connected (fixed) to the winding core 20 via the fixing connecting tape 60. The width of the lead film 40 is not particularly limited, but may be the same as the width of the adhesive film 30. [ In the manufacturing method described below, the raw fabric of the adhesive film 30 and the raw end of the lead film 40 are connected by the connecting tape 50 for connection, and the raw fabrics of the adhesive film 30 and the lead film 40 are collectively cut. Therefore, the lead film 40 produced by this manufacturing method has the same width as the adhesive film 30. [

The material of the lead film 40 is also not particularly limited. For example, the material constituting the lead film 40 may be the same as the material constituting the support film 31. The thickness of the lead film 40 is not particularly limited and may be approximately equal to that of the support film 31. [ The color of the lead film 40 is not particularly limited, but it is preferable that the color is present in the support film 31 and easily visible. For example, when the support film 31 is white (milky white), it may be black.

The connecting tape 50 for connection is to connect the adhesive film 30 and the lead film 40. Concretely, the connecting tape 50 for connection connects the projecting portion 31a of the adhesive film 30 and the lead film 40. By this connection connecting tape 50, the connection strength between the adhesive film 30 and the lead film 40 is maintained at 5.0 N or more.

The connection strength is determined by the type of connection tape 50 (more specifically, the combination of the type of connection tape 50 and the material of the support film 31 and the lead film 40), the adhesive surface 51 And the length L2 of the bonding surface 52, the ratio of the length L1 of the bonding surface 51 to the length L2 of the bonding surface 52, and the like. The adhesive surface 51 is an adhesive surface of the protruding portion 31a and the connecting tape 50 for connection and the adhesive surface 52 is an adhesive surface of the lead film 40 and the connecting tape 50 for connection. The present inventors have found that the connection strength can be made to be 5.0 N or more by adjusting these parameters.

Here, the type of connection tape 50 for connection is not particularly limited as long as the connection strength between the adhesive film 30 and the lead film 40 can be 5.0 N or more. As the type of connection tape 50 for connection, for example, silicone tape and the like can be mentioned.

The total length L of the length L1 of the bonding surface 51 and the length L2 of the bonding surface 52 is not particularly limited as long as the connection strength between the adhesive film 30 and the lead film 40 can be 5.0 N or more Do not. The total length L is, for example, 120 mm or more under the conditions of the embodiment described later.

The total length L is preferably larger than 30% of the circumferential length of the outer circumferential surface of the winding core 20, more preferably 40% or more, and more preferably 1 or more circumferential length of the winding core 20 . This is because the connection strength becomes particularly large when the total length L becomes a value within these ranges. The upper limit value of the total length L is not particularly limited, but may be about 600 mm. If the total length L is excessively long, wrinkles tend to occur on the connecting tape 50 for connection, for example, when the adhesive film 30 and the lead film 40 are connected. Such wrinkles may cause the same problems as unevenness at the time of ultrasonic connection.

The ratio L1: L2 of the length L1 of the bonding surface 51 to the length L2 of the bonding surface 52 is particularly limited as long as the bonding strength between the bonding film 30 and the lead film 40 can be 5.0 N or more It does not. L1: L2 may be, for example, from 3: 7 to 7: 3.

2 and 3, the end portions of the adhesive film 30 and the end portions of the lead film 40 are adjacent to each other, but a gap may be formed between them. However, it is preferable that they do not overlap each other. When the two are overlapped, the overlapping portion becomes a step. This step may cause the same problems as unevenness at the time of ultrasonic connection.

The width of the connection connecting tape 50 is not particularly limited, but may be the same as the width of the adhesive film 30. [ In the manufacturing method described below, the raw fabric of the adhesive film 30 and the raw end of the lead film 40 are connected by the connecting tape 50 for connection, and the raw fabrics of the adhesive film 30 and the lead film 40 are collectively cut. Therefore, the connecting tape 50 for connection manufactured by this manufacturing method has the same width as the adhesive film 30. [

The fixing connecting tape (60) connects the lead film (40) and the winding core (20). The fixing connecting tape 60 is not limited to the connecting tape 50 for connection, but the connecting tape 60 for fixing is not limited to a particular type, Is preferably the same kind as the above. The thicknesses of the connecting tape 50 for connection and the connecting tape 60 for fixing are not particularly limited and are suitably set in view of winding and handling.

2, the connecting tape 50 for connection is provided only on one side of the supporting film 31 and the lead film 40. However, as shown in Fig. 5, the supporting film 31 and the lead film 40, Or may be provided on both sides of the base 40. 6, the connection connecting tape 50 may be provided on the back surface of the support film 31 (the surface on the side where the adhesive layer 31 is not formed).

2a. Measurement method of connection strength>

Next, a method of measuring the connection strength will be described with reference to Fig. First, the film connecting body 10a is prepared. The film connecting body 10a is manufactured by connecting the adhesive film 30 and the lead film 40 with the connection connecting tape 50. [ A detailed manufacturing method of the film connecting body 10a will be described later.

Subsequently, the lead film 40 is fixed to the clamp 110 fixed to the test stand 100. Subsequently, the adhesive film 30 is fixed to the tensile tester 120. Here, since the adhesive film 30 is long, after the adhesive film 30 is cut in the vicinity of the connection portion with the lead film 40, the adhesive film 30 is fixed to the tensile tester 120. Subsequently, the tensile testing machine 120 is lifted up vertically. When the tensile tester 120 is pulled up, the load applied to the tensile tester 120 is increased, and finally the adhesive film 30 is separated from the lead film 40. [ At this time, the load applied to the tensile tester 120 is measured, and the measured value is taken as the connection strength.

<3a. Method for preparing reel>

Next, a method for producing the reel 10 will be described. First, the fabric (support film fabric) of the support film 31 is prepared. The supporting film is a film having a width broader than that of the supporting film 31 and having the same length as the supporting film 31. Subsequently, an adhesive layer 32 is formed on the surface of the support film. Thus, an adhesive film fabric is produced. Subsequently, the projecting portion 31a is formed at one end in the longitudinal direction of the original of the adhesive film. The projecting portion 31a is formed by peeling the adhesive layer 32 from one longitudinal end portion of the adhesive film original end. The projecting portion 31a may be formed by forming the adhesive layer 32 at a portion other than the projecting portion 31a. The protruding portion 31a may be cleaned before the connecting connection tape 50 is bonded.

Subsequently, a raw fabric (lead film fabric) of the lead film 40 is prepared. The raw material of the lead film is a film which is wider than the lead film (40) and has the same length as the lead film (40). Then, the connecting tape is used to connect the adhesive film fabric and the lead film fabric, thereby fabricating the connecting fabric. Then, the connecting body is cut to a width of less than 1 mm. Thus, the film connecting body 10a described above is manufactured. Subsequently, an annular piece (including the winding core 20 and the flanges 21 and 22) is prepared separately and the winding core 20 of the idler and the film connecting body 10a Of the lead film 40 are connected. Then, the adhesive film (30) is wound around the winding core (20). Through the above steps, the reel 10 is produced. According to the present manufacturing method, a wide connector body is manufactured, and then the connector body 10a is cut to a width of less than 1 mm. Therefore, it is possible to cope with the narrowing of the adhesive film 30. The above-described manufacturing method is merely an example. The reel 10 may be manufactured by any manufacturing method.

As described above, according to the first embodiment, the adhesive film 30 having a width of less than 1 mm and the lead film 40 are connected by the connecting tape 50 for connection. The connection strength between the adhesive film 30 and the lead film 40 is 5.0 N or more. Therefore, even if the width of the adhesive film 30 is less than 1 mm, the adhesive film 30 can be prevented from being displaced from the lead film 40. [ Further, since only the adhesive film 30 and the lead film 40 may be connected by the connection connecting tape 50, the present embodiment can be realized by making use of existing facilities.

The connecting tape 50 for connection may be connected to the lead film 40 formed on the adhesive film 30. In this case, the adhesive film 30 and the lead film 40 are made more rigid Can be connected.

The total length L of the length L1 of the bonding surface 51 and the length L2 of the bonding surface 52 may be larger than 30% of the circumferential length of the outer circumferential surface of the winding core 20. In this case, The lead film 40 can be more firmly connected.

The total length L may be 120 mm or more. In this case, the adhesive film 30 and the lead film 40 can be more firmly connected.

The ratio of the length L1 of the bonding surface 51 to the length L2 of the bonding surface 52, that is, the ratio of the bonding surface length may be 3: 7 to 7: 3. According to this embodiment, the connection strength can be set to 5.0 N or more within this range. Therefore, according to the present embodiment, the ratio of the adhesive surface length can be adjusted within this range.

The connecting tape 50 for connection may be provided on the front and back surfaces of the adhesive film 30 and the lead film 40. In this case, the adhesive film 30 and the lead film 40 can be more firmly connected .

The length of the adhesive film 30 may be 50 m or more. As described above, when the adhesive film 30 is elongated, the adhesive film 30 is liable to be displaced from the lead film 40. When the adhesive film 30 is displaced from the lead film 40, all the adhesive films 30 remaining on the reel 10 are wasted. In this embodiment, even when the long adhesive film 30 is wound around the reel 10, it is possible to make the adhesive film 30 difficult to be displaced from the lead film 40. [

The adhesive layer 32 of the adhesive film 30 may be an anisotropic conductive layer. In this case, the adhesive film 30 including the anisotropic conductive layer can be prevented from being displaced from the reel 10.

<B. Second Embodiment>

<1b. Structure of film connector>

First, the structure of the film connecting member 201 will be described with reference to Fig. The film connector 201 includes an adhesive film 210, a lead film 220, a connecting tape 230 for connection, and a cured layer 240.

The adhesive film 210 has a support film 211 and an adhesive layer 212 formed on the other surface 211b of the support film 211. [ The support film 211 is a film to be a base layer of the adhesive layer 212. The material of the support film 211 is not particularly limited and may be appropriately determined depending on the use of the adhesive film 210. [ Examples of the material constituting the supporting film 211 include a film obtained by applying a releasing agent such as silicone to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene) &Lt; / RTI &gt; These support films 211 prevent drying of the adhesive film 210 and can maintain the shape of the adhesive film 210. The thickness of the support film 211 is not particularly limited. For example, the thickness of the support film 211 may be about 12 to 125 占 퐉. Further, the surface of the adhesive layer 212 may be covered with a cover film. The cover film may be made of substantially the same material as the support film 211. The color of the support film 211 or the cover film may be, for example, white (milky white) or colorless and transparent.

The adhesive layer 212 is a layer having adhesiveness and is formed on the other surface 211b of the support film 211. [ The material of the adhesive layer 212 is not particularly limited and may be appropriately determined depending on the use of the adhesive film 210. [ For example, the adhesive layer 212 may be composed of an anisotropic conductive material. Here, the anisotropic conductive material includes at least a polymerizable compound, a thermal curing initiator, and conductive particles.

The polymerizable compound is a resin which polymerizes and cures with each other. The polymerizable compound is not particularly limited as long as it is an anisotropic conductive material. The polymerizable compound includes, for example, an epoxy polymerizable compound and an acrylic polymerizable compound. The epoxy polymerizable compound is a monomer, an oligomer or a prepolymer having one or two or more epoxy groups in the molecule. Examples of the epoxy polymerizable compound include various modified epoxy resins such as various bisphenol type epoxy resins (bisphenol A type and F type), novolak type epoxy resins, rubber and urethane, naphthalene type epoxy resins, biphenyl type epoxy resins , A phenol novolak type epoxy resin, a stilbene type epoxy resin, a triphenolmethane type epoxy resin, a dicyclopentadiene type epoxy resin, a triphenylmethane type epoxy resin, and prepolymers thereof.

The acrylic polymerizable compound is a monomer, an oligomer or a prepolymer having one or two or more acrylic groups in the molecule. As the acrylic polymerizable compound, there may be mentioned, for example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate , Dimethyloltricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) , 2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris (acryloxyethyl) isocyanurate and urethane acrylate .

In the present embodiment, any one of the above-mentioned polymerizable compounds may be used, or two or more kinds may be arbitrarily used in combination.

The thermosetting initiator is a material that absorbs heat to activate it and initiates polymerization of the polymerizable compound. Examples of the thermal curing initiator include a thermal anion or thermal cationic curing initiator for curing an epoxy polymerizable compound, and a thermal radical curing initiator for curing an acrylic polymerizable compound. In the present embodiment, a suitable thermosetting initiator may be selected from a polymerizable compound, but the cured layer 240 is composed of a cured product of the adhesive layer 212, as described later. The cured layer 240 is formed by irradiating the adhesive layer 212 with light. Therefore, it is preferable that the thermosetting initiator is an initiator which is activated by light irradiation. That is, the thermosetting initiator is preferably an initiator that also serves as a photocuring initiator. Examples of such a thermal curing initiator include a thermal cationic or thermal radical curing initiator.

When the thermosetting initiator contained in the adhesive layer 212 is an initiator that can not also serve as a photocuring initiator, i.e., a thermo-anionic curing initiator, the adhesive layer 212 contains a photocuring initiator separately from the thermosetting initiator . So as to cure the adhesive layer 212 by light irradiation. The type of photo-curing initiator is not particularly limited, but the photo cationic curing initiator may be inferior to the thermo-anionic curing initiator. For this reason, it is preferable to use a photo-radical curing initiator as the photo-curing initiator. The thermo-anionic curing initiator polymerizes the epoxy-based polymerizable compound. On the other hand, the photo-radical curing initiator polymerizes the acrylic polymerizable compound. Therefore, in this case, the polymerizable compound contained in the adhesive layer 212 becomes an epoxy-based polymerizable compound and an acrylic-based polymerizable compound (so-called epoxy acrylate-based system). When the thermosetting initiator contained in the adhesive layer 212 is an anion-based curing initiator, the adhesive layer 212 may contain a thermosetting initiator that also serves as a photocuring initiator instead of the photocuring initiator described above. Hereinafter, the thermal curing initiator and the photo-curing initiator both used as the photo-curing initiator are also referred to as &quot; photo-curable initiator &quot;. Therefore, it is preferable that the adhesive layer 212 contains a photocurable initiator. The photocurable initiator is not necessarily included in the entirety of the adhesive layer 212 but may be contained in the adhesive layer 212 to be cured, that is, the adhesive layer to be cured. The method of incorporating the photo-curable initiator in the adhesive layer to be cured will be described later.

The conductive particles are particles for anisotropic conductive connection between a plurality of terminals. The kind of the conductive particles is not particularly limited. The conductive particles include, for example, metal particles and metal-coated resin particles. Examples of the metal particles include metal particles such as nickel, cobalt, copper, silver, gold or palladium. As the metal-coated resin particles, for example, the surface of core resin particles such as a styrene-divinylbenzene copolymer, a benzoguanamine resin, a crosslinked polystyrene resin, an acrylic resin or a styrene-silica composite resin may be coated with nickel, copper, And the like, and the like. A gold or palladium thin film may be formed on the surface of the conductive particles, or an insulating resin thin film thin enough to be broken when pressed. The anisotropic conductive material may contain two or more conductive particles.

The anisotropic conductive material may contain a film forming resin, various additives, and the like in addition to the above components. The film-forming resin is added to the anisotropic conductive material when it is desired to make the anisotropic conductive material film-like. The kind of the film-forming resin is not particularly limited as long as it satisfies the following characteristics. As the film-forming resin, various resins such as epoxy resin, phenoxy resin, polyester urethane resin, polyester resin, polyurethane resin, acrylic resin, polyimide resin and butyral resin can be used. In the present embodiment, any one of these film-forming resins may be used, or two or more kinds thereof may be arbitrarily combined. The film-forming resin is preferably a phenoxy resin from the viewpoint of good film-forming property and adhesion reliability.

Examples of the additive that can be added to the anisotropic conductive material include a silane coupling agent, an inorganic filler, a colorant, an antioxidant, and an antirust agent. The kind of the silane coupling agent is not particularly limited. Examples of the silane coupling agent include epoxy-based, amino-based, mercapto-sulfide-based, and ureide-based silane coupling agents. When these silane coupling agents are added to the anisotropic conductive material, adhesion to an inorganic substrate such as a glass substrate can be improved.

The inorganic filler is an additive for adjusting the flowability and film strength, particularly the minimum melt viscosity, of the anisotropic conductive material. The kind of the inorganic filler is not particularly limited. Examples of the inorganic filler include silica, talc, titanium oxide, calcium carbonate, magnesium oxide, and the like.

The lead film 220 is a member for fixing the adhesive film 210 to the reel 400 described later. Further, the lead film 220 also functions as an end film indicating that the adhesive film 210 is terminated. The material of the lead film 220 is not particularly limited. For example, the material constituting the lead film 220 may be the same as the material constituting the support film 211. The thickness of the lead film 220 is not particularly limited and may be approximately equal to that of the support film 211. However, it is preferable that the lead film 220 is colored in a color different from that of the support film 211. Thereby, the user of the adhesive film 210 can easily see the lead film 220. [ The color of the lead film 220 is not particularly limited, but it is preferable that the color is present in the support film 211 and easily visible. For example, when the support film 211 is white (milky white), it may be black.

The connecting tape 230 for connection connects one surface 211a of the supporting film 211 and one surface 211a of the lead film 220 to each other. The adhesive film 210 and the lead film 220 are connected by the connecting tape 230 for connection and the cured layer 240 described later.

Here, the type of connection tape 230 for connection is not particularly limited as long as it can connect the adhesive film 210 and the lead film 220. As the kind of connection connecting tape 230, for example, silicone tape and the like can be mentioned.

The length of the connection connecting tape 230 is not particularly limited, but if it is excessively long, there is a possibility that workability at the time of attaching the connection connecting tape 230 is lowered. Concretely, when connecting the support film 211 and the lead film 220 using the connection connecting tape 230, there is a possibility that the connection connecting tape 230 is wrinkled. From this point of view, the upper limit value of the length L13 of the connection connecting tape 230 is preferably less than 120 mm, more preferably 110 mm or less. That is, when the length of the connecting tape 230 for connection is not less than 120 mm, the connection connecting tape 230 may be wrinkled very rarely. However, if the length of the connection connecting tape 230 specified in the first embodiment is such a wrinkle as described above, there is no practical problem. In other words, this crease does not cause any trouble in the subsequent process such as slit and winding and drawing. Also, the quality of the adhesive film is not practically deteriorated by the unevenness of the wrinkles. On the other hand, if the connection connecting tape 230 is too short, there is a possibility that the connection strength between the adhesive film 210 and the lead film 220 is lowered. In addition, there is a possibility that workability is lowered. Therefore, the length L13 of the connection connecting tape 230 is preferably 10 mm or more, more preferably 30 mm or more.

The ratio L11: L12 of the length L11 of the part to be adhered to the support film 211 to the length L12 of the part to be adhered to the lead film 220 is not particularly limited, From the viewpoint of maintaining the connection strength, for example, from 3: 7 to 7: 3.

In addition, the thickness of the connection connecting tape 230 is not particularly limited and may be suitably set in terms of winding and handling.

In Fig. 13, the end portion of the adhesive film 210 and the end portion of the lead film 220 are adjacent to each other, but a gap may be formed between them. However, it is preferable that they do not overlap each other. When the two are overlapped, the overlapping portion becomes a step. This step may cause the same problems as unevenness at the time of ultrasonic connection.

The cured layer 240 includes a cured product of the adhesive layer 212 and is formed from the other surface 211b of the supporting film 211 to the other surface 220b of the lead film 220. [ Thereby, the cured layer 240 connects the adhesive film 210 and the lead film 220.

From the viewpoint of maintaining the connection strength between the adhesive film 210 and the lead film 220, the length L14 of the cured layer 240 on the support film 211 side is preferably 150 mm or more, more preferably 300 mm or more , And more preferably 400 mm or more. In addition, if the length L14 is excessively long, the film length to be used for connection decreases, and therefore, a shorter length is preferable. For example, the length L14 is preferably 550 mm or less, more preferably 500 mm or less, and even more preferably 450 mm or less. It is needless to say that the length L15 of the cured layer 240 on the side of the lead film 220 should be substantially equal to the length of the lead film 220 but may be shorter than the length of the lead film 220. [

The cured layer 240 includes a cured product of the adhesive layer 212 and thus has permeability. This is because the adhesive layer 212 has high crystallinity due to curing. Therefore, even when the cured layer 240 is formed on the lead film 220, the lead film 220 becomes visible.

The curing degree (reaction rate) of the cured layer 240 is not particularly limited, but is preferably 50% or more. In this case, the connection strength between the adhesive film 210 and the lead film 220 can be further increased. The degree of curing (reaction rate) can be calculated from the attenuation amount (%) of the functional group contributing to the polymerization before the curing treatment and after the curing treatment by using an infrared spectrophotometer (product number FT / IR-4100, manufactured by Nippon Bunko) .

Further, since the cured layer 240 is a portion that can not be used as the adhesive film 210, it is preferable that the cured layer 240 can be easily distinguished from the adhesive layer 212. At this point, the cured layer 240 contains a cured product of the adhesive layer 212, and therefore is slightly smaller in thickness than the adhesive layer 212. In this regard, the cured layer 240 is distinguishable from the adhesive layer 212. However, in order to increase the visibility of the cured layer 240, the cured layer 240 may be colored. The method of coloring the cured layer 240 will be described later, but roughly speaking, the adhesive composition containing the colorant may be contained in the adhesive layer 212 before curing the adhesive layer 212. The type of the colorant is not particularly limited, and any colorant may be used as long as it is applicable to the anisotropic conductive material.

<2b. Width of film connector >

The width of the film connector 201 is not particularly limited, but may be less than 1 mm. According to the present embodiment, even if the width of the film connector 201 is less than 1 mm, the connection strength between the adhesive film 210 and the lead film 220 can be maintained at a high value (for example, 5.0 N or more) . The width of the film connecting body may be 0.8 mm or less, or 0.6 mm or less. The width of the film connecting member 201 may be the same as the width of the adhesive film (adhesive layer, supporting film).

&Lt; 3b. Connection strength between adhesive film and lead film >

The connection strength between the adhesive film 210 and the lead film 220 may be adjusted according to characteristics required for the reel 400, but is preferably 5.0 N or more. The connection strength is determined by the length L13, L11: L12 of the connection connecting tape 230, the length L14 of the cured layer 240 on the side of the supporting film 211, the length L14 of the cured layer 240 on the side of the lead film 220 And the hardening degree of the hardened layer 240. [0086] When these parameters are within a preferable range, the connection strength may be 5.0 N or more. The connection strength is more preferably 5.5 N or more.

&Lt; 4b. Measurement method of connection strength>

Next, a method of measuring the connection strength will be described with reference to Fig. First, the lead film 220 and the cured layer 240 are fixed to the clamp 310 fixed to the test stand 300. Subsequently, the adhesive film 210 is fixed to the tensile tester 320. Here, since the adhesive film 210 is long, after the adhesive film 210 is cut in the vicinity of the connection portion with the lead film 220, the adhesive film 210 is fixed to the tensile tester 320. Subsequently, the tensile tester 320 is lifted up vertically. When the tensile tester 320 is pulled up, the load applied to the tensile tester 320 is increased, and finally the adhesive film 210 is separated from the lead film 220. At this time, the load applied to the tensile tester 320 is measured, and the measured value is taken as the connection strength.

<5b. Reel Configuration>

Next, the configuration of the reel 400 will be described with reference to Figs. 15 to 16. Fig. 15 and 16, the reel 400 includes a film connecting body 201, a winding core 420, flanges 421 and 422, and a fixing connecting tape 260.

The winding core 420 has a cylindrical shape and serves as a rotating shaft of the reel body 400. The outer diameter (diameter of the outer diameter surface) of the winding core 420 is not particularly limited and may be suitably determined according to the use of the reel 400 or the like. For example, the outer diameter (diameter of the outer diameter surface) of the winding core 420 may be about 45 to 95 mm.

16, the lead film 220 and the cured layer 240 of the film connecting body 201 are fixed to the outer surface 420a of the winding core 420 by the fixing connecting tape 260 do. When the length L15 of the cured layer 240 on the side of the lead film 220 is shorter than the length of the lead film 220, only the lead film 220 may be fixed on the outer surface 420a. Then, the film connecting body 201 is wound around the winding core 420. The film connecting body 201 is wound around the winding core 420 to constitute a film winding attachment body. The type of fixing tape 260 is not particularly limited, but it is preferable that the same type of tape as the connection tape 230 is used from the viewpoint of securing the connection strength between the adhesive film 210 and the lead film 220 . The thickness of the fixing use adhesive tape 260 is not particularly limited and may be suitably set in terms of winding and handling.

The flanges 421 and 422 are provided at both axial ends of the winding core 420, respectively. The flanges 421 and 422 are circular members and are installed in the winding core 420 so as to be parallel to each other. The film connector 201 is housed between the flanges 421 and 422.

<6b. Production method of film connector>

Next, a manufacturing method of the film connecting body 201 will be described with reference to Figs. 17 and 18. Fig. First, the support film fabric 271 and the lead film fabric 280 are prepared. The supporting film material 271 is a film having a width larger than that of the supporting film 211 and having the same length as the supporting film 211. The lead film fabric 280 is a film that is wider than the lead film 220 and has the same length as the lead film 220. Subsequently, the support film fabric 271 and the one side surfaces 271a and 280a of the lead film fabric 280 are connected to each other by the connection connecting tape 230 (connection step). Thus, the fabric connection member 201a is fabricated. On the other hand, an adhesive composition Y having the same composition as the adhesive layer 212 is prepared. Subsequently, the far-end connection member 201a is set in the transfer apparatus. This conveying device is capable of conveying the far-end connecting member 201a in the direction of arrow A. Further, a coating apparatus 500 and a light source 600 are provided in the transfer apparatus. The type of the coating apparatus 500 is not particularly limited and may be, for example, a gravure coater, a wire bar coater or a die coater. The light source 600 is a light source that emits light of a curable wavelength to the adhesive layer fabric 272, for example, an ultraviolet lamp or the like. The irradiation condition of the light source 600 may be adjusted so as to obtain a desired degree of curing. The light source 600 is provided downstream of the coating device 500 in the transport direction.

Subsequently, the adhesive agent composition 500 is applied onto the other side surfaces 271b and 280b of the support film fabric 271 and the lead film fabric 280 using the coating apparatus 500 while conveying the fabric connection body 201a in the direction of arrow A Y is applied (adhesive layer forming step). Thereby, the adhesive layer fabric 272 is formed on the other surface 271b, 280b. Subsequently, at the timing when the irradiation start position reaches the light source 600, light is irradiated from the light source 600 to the adhesive layer raw material 272 (curing step). Here, the irradiation start position is a position distant from the boundary portion between the support film fabric 271 and the lead film fabric 280 by the distance L14 toward the support film fabric 271 side. Subsequently, the irradiation of the light from the light source 600 is stopped at the timing when the irradiation end position reaches the light source 600. Here, the irradiation end position is a position distant from the boundaries between the support film fabric 271 and the lead film fabric 280 by the distance L15 toward the lead film fabric 280 side. The adhesive layer material 272 existing between the irradiation start position and the irradiation end position becomes an adhesive layer to be cured.

Thus, the adhesive layer fabric 272 formed at the boundary portion between the support film fabric 271 and the lead film fabric 280 and the peripheral portion thereof is cured. That is, the hardened layer 290 is formed on the farthest connecting material 201a. Through the above steps, the film connecting body 201b shown in Fig. 18 is formed. Subsequently, the film connecting body 201b is slit to a desired width to produce the film connecting body 201. [

When the adhesive composition contains a photo-curable initiator, the film connector 201 can be manufactured by the above-described method. However, the adhesive composition sometimes does not contain a photocurable initiator. For example, when the adhesive composition contains a thermoionomer curing agent, the thermoionomer curing agent is not activated by light irradiation. As a result, the film connecting member 201 can not be manufactured by the above-described method. In this case, the film connecting member 201 may be manufactured by the following method. That is, an auxiliary coating apparatus is provided upstream of the light source 600. The cooper coater applies a secondary adhesive composition over the adhesive layer fabric (270). The secondary adhesive composition includes a photocurable initiator and a polymerizable compound that is cured by the photocurable initiator. For example, the secondary adhesive composition includes a photo-radical curing initiator and an acrylic polymerizable compound. The auxiliary adhesive composition may contain the above-mentioned coloring agent. As a result, the cured layer 240 is colored. Then, at the timing when the irradiation start position reaches the auxiliary coating apparatus, the auxiliary coating apparatus is driven. Thereby, the auxiliary coating apparatus applies the auxiliary adhesive composition on the adhesive layer fabric 270 (curing preparation step). Subsequently, at the timing when the irradiation end position reaches the auxiliary coating device, the auxiliary coating device is stopped. By adding this step to the above-described step, the auxiliary adhesive composition is contained in the adhesive layer to be cured. Therefore, the adhesive layer to be cured is cured by light irradiation from the light source 600. The auxiliary coater may be any device capable of containing the auxiliary adhesive composition in the adhesive layer fabric 272. For example, the auxiliary coating apparatus may be the same coating apparatus as the coating apparatus 500 described above, or may be a spray apparatus capable of spraying the auxiliary adhesive composition onto the adhesive layer fabric 272.

Example

First, an embodiment corresponding to the first embodiment will be described.

(Example 1)

(Fabrication of a connector)

In Example 1, a film connecting body 10a was produced by the following steps. , 60 parts by mass of a phenoxy resin (YNP50, manufactured by Shin-Etsu Chemical Co., Ltd.), 60 parts by mass of a phenoxy resin (YN50, manufactured by Shin-Etsu Chemical Co., Ltd.), 2 parts by mass of a silane coupling agent (KBM- , And 2 parts by mass of a reaction initiator (perhexa C manufactured by Nippon Oil Co., Ltd.) were mixed to prepare an adhesive composition. Subsequently, conductive particles (AUL704, manufactured by Sekisui Chemical Co., Ltd.) were dispersed in the adhesive composition so that the particle surface density in the adhesive layer 32 was 8000 pieces / mm2. Subsequently, the adhesive composition in which the conductive particles were dispersed was applied to a PET film (thickness: 50 m, length of supporting film) having a length of more than 50 m so as to have a thickness of 14 m. Thus, an adhesive layer 32 was formed on the surface of the support film. That is, an adhesive film fabric was produced. In the first embodiment, the adhesive layer 32 is an anisotropic conductive layer.

Subsequently, the adhesive layer 32 was removed from one end in the lengthwise direction of the original of the adhesive film to form the protruding portion 31a. Subsequently, the same PET film as the support film fabric was prepared as a lead film fabric. Subsequently, the lead film raw fabric and the protruding portion 31a of the original of the adhesive film were connected by the connection connecting tape 50, thereby fabricating a connecting body fabric. Here, as the connecting tape 50 for connection, ADOK S (product number: S-100B) manufactured by Sunei Kagaku Co., Ltd. was used. The connecting tape 50 for connection is an example of a silicon tape. The length of the connecting tape 51 was 120 mm, and the length L1 of the bonding surface 51 and the length L2 of the bonding surface 52 were all 60 mm. Therefore, L1: L2 = 1: 1. In addition, the end portion of the end of the adhesive film (the end of the projecting portion 31a) and the end portion of the end of the lead film are adjacent to each other. Subsequently, the connecting body was cut at a width of 0.8 mm to prepare a film connecting body 10a.

(Measurement of connection strength)

Subsequently, the connection strength was measured by the above-mentioned measuring method. As the tensile tester, Tensilon manufactured by E &amp; D Co., Ltd. was used. As a result, the connection strength was 5.2 N.

(Preparation of Reel)

And an airless core having a winding core 20 having a diameter of 95 mm was prepared. Then, the winding core 20 and the lead film 40 of the film connecting body 10a were connected to each other using the fixing connecting tape 60. [ Here, the fixing connection tape 60 is the same as the connection tape 50 for connection. The length of the fixing connecting tape 60 is 30 mm and the length of the bonding surface between the fixing connecting tape 60 and the lead film 40 is set so that the lead film 40 does not deviate from the winding core 20, The length of the bonding surface between the fixing connecting tape 60 and the winding core 20 is 15 mm. Subsequently, the adhesive film 30 was wound around the winding core 20 to produce a reel 10. In order to carry out the drawing test described later, a total of 100 the same reels 10 were produced.

(Withdrawal test)

A drawing test was conducted in which the adhesive film 30 was drawn out at 700 mm / sec from the reel 10 by using a drawer tester, The drawing test was performed until all the adhesive films 30 were drawn out from the reel 10. When the adhesive film 30 could not be pulled out in the middle of the drawing, it was determined that the adhesive film 30 deviated from the lead film 40, and the drawing test was completed. The pull-out test was performed on 100 reels 10 and the number of reels 10 displaced from the lead film 40 by the adhesive film 30 was divided by 100 to calculate the tape shift occurrence rate. It can be said that the adhesive film 30 is less likely to be displaced from the lead film 40 as the incidence of tape deviation is smaller.

(Example 2)

The same process as in Example 1 was performed except that the connection tape length was 300 mm and the length L1 of the bonding surface 51 and the length L2 of the bonding surface 52 were all 150 mm.

(Example 3)

The same process as in Example 1 was performed except that the connecting tape length was 400 mm and the length L1 of the bonding surface 51 and the length L2 of the bonding surface 52 were all 200 mm.

(Example 4)

The same treatment as in Example 1 was carried out except that the connecting body was cut into a width of 0.6 mm.

(Example 5)

The same process as in Example 1 was performed except that the ratio of the length L1 of the bonding surface 51 to the length L2 of the bonding surface 52 was 3: 7.

(Example 6)

The same process as in Example 1 was performed except that the ratio of the length L1 of the bonding surface 51 to the length L2 of the bonding surface 52 was 7: 3.

(Reference example)

The length of the connecting tape 51 was 30 mm, and the length L1 of the bonding surface 51 and the length L2 of the bonding surface 52 were all 15 mm. Further, the connecting body was cut into a width of 1.5 mm. The same treatment as in Example 1 was performed except for the above.

(Comparative Example 1)

The same process as in Example 1 was carried out except that the connection tape length was 30 mm and the length L1 of the bonding surface 51 and the length L2 of the bonding surface 52 were all 15 mm.

(Comparative Example 2)

The same process as in Example 1 was carried out except that the connecting tape length was 60 mm and the length L1 of the bonding surface 51 and the length L2 of the bonding surface 52 were all 30 mm.

(Comparative Example 3)

The same process as in Example 1 was carried out except that the connecting tape length was 90 mm and the length L1 of the bonding surface 51 and the length L2 of the bonding surface 52 were all 45 mm.

(Comparative Example 4)

The same treatment as in Example 4 was performed except that the connection tape length was 30 mm and the length L1 of the bonding surface 51 and the length L2 of the bonding surface 52 were all 15 mm.

(Comparative Example 5)

The same treatment as in Example 4 was performed except that the connecting tape length was 60 mm and the length L1 of the bonding surface 51 and the length L2 of the bonding surface 52 were all 30 mm.

(Comparative Example 6)

The same process as in Example 1 was performed except that the ratio of the length L1 of the bonding surface 51 to the length L2 of the bonding surface 52 was 2: 8.

(Comparative Example 7)

The same process as in Example 1 was carried out except that the ratio of the length L1 of the bonding surface 51 to the length L2 of the bonding surface 52 was 8: 2.

(Measurement result)

Table 1 shows the structures, the connection strengths, and the tape shift incidence rates of the respective examples.

(Consideration on width of adhesive film)

7 shows the connection strength of the reference example and the connection strength of the comparison example 1 in comparison. In Reference Example and Comparative Example 1, only the adhesive film width is different. As shown in Fig. 7 and Table 1, by increasing the width of the adhesive film, the connection strength becomes large, and further, the adhesive film 30 becomes difficult to be displaced from the lead film 40. [ However, the reference example can not cope with a demand for narrowing the width of the adhesive film. Thus, in the embodiment, after the width of the adhesive film is reduced, the connection connecting tape 50 is elongated.

(Consideration on Connection Tape Length)

8 shows the correspondence relationship between the connection tape length (more specifically, the total length L of the length L1 of the bonding surface 51 and the length L2 of the bonding surface 52) and connection strength. 9 shows the correspondence relationship between the tape shift occurrence rate and the connection strength. 10 shows a correspondence relationship between the connection tape length and the tape shift occurrence rate. In Figs. 8 to 10, the width of the adhesive film is 0.8 mm. Therefore, the connection tape lengths of 30, 60 and 90 mm in FIG. 8 are Comparative Examples 1, 2 and 3, and connection tape lengths of 120, 300 and 400 mm are Examples 1, 2 and 3, respectively. As shown in Fig. 8 and Table 1, the longer the connection connecting tape 50 becomes, the higher the connection strength becomes, and further, the adhesive film 30 becomes difficult to be displaced from the lead film 40. [ Particularly, as shown in Figs. 9, 10 and Table 1, in the first, second and third embodiments, the tape shift occurrence rate becomes zero. In Embodiments 1, 2 and 3, the connection strength is 5.0 N or more. Therefore, when the connection strength is 5.0 N or more, it can be seen that the tape shift occurrence rate becomes zero. Further, even when the width of the adhesive film 30 is less than 1 mm, the connection tape length is set to 120 mm or more (more specifically, the total length L is set to 120 mm or more) Or more. Further, when the connection tape length is 300 mm, a connection strength almost equal to that of the reference example is realized. However, even if the connection tape length becomes 400 mm, the connection strength hardly changes. Therefore, if the connection tape length becomes longer, the connection strength reaches the upper limit value.

When the connection tape length is 90 mm, the connection tape length is 30% of the circumferential length of the outer circumferential surface of the winding core 20. When the length of the connecting tape is 120 mm, the length of the connecting tape is 40% of the circumferential length of the outer circumferential surface of the winding core 20. When the length of the connecting tape is 300 mm, the length of the connecting tape is one week or longer of the outer circumferential surface of the winding core 20. Therefore, it is preferable that the connecting tape length is larger than 30% of the diameter of the winding core 20, more preferably 40% or more, and more preferably 1 week or more of the winding core 20.

11 shows the correspondence relationship between the connection tape length and the connection strength when the width of the adhesive film is 0.6 mm. Therefore, the connection tape length = 30 and 60 mm in FIG. 11 indicate Comparative Examples 4 and 5, and the connection tape length = 120 mm is Example 4. As evident from Fig. 11 and Table 1, even if the adhesive film width becomes 0.6 mm, the same theory as above is established. That is, as the connecting tape 50 for connection becomes longer, the connecting strength becomes larger, and further, the adhesive film 30 becomes difficult to be displaced from the lead film 40. [ Particularly, in the fourth embodiment, the tape shift occurrence rate becomes zero. In Example 4, the connection strength is 5.0 N or more. According to Example 4 and Comparative Examples 4 and 5, even when the width of the adhesive film is 0.6 mm, the connection strength can be 5.0 N or more by setting the connection tape length to 120 mm.

(Consideration on the ratio of adhesive surface length)

12 shows the correspondence relationship between the adhesive surface length ratio (length L1 of the adhesive surface 51: length L2 of the adhesive surface 52) and adhesive strength. As shown in Fig. 12 and Table 1, it can be seen that the ratio of the bonding surface length does not necessarily have to be 1: 1. That is, in this embodiment, when the ratio of the bonding surface length is in the range of 3: 7 to 7: 3, the bonding strength becomes 5.0 N or more. Therefore, it can be seen that the ratio of the adhesive surface length can be adjusted within this range.

Next, an embodiment corresponding to the second embodiment will be described.

(Example 7)

(Fabrication of a connector)

In Example 7, the film connecting member 201 was produced by the following steps. , 20 parts by mass of a phenoxy resin (Shinpuritizumi Kagaku Kasei YP70), 30 parts by mass of a liquid epoxy resin (EP828, manufactured by Mitsubishi Chemical Corporation), 20 parts by mass of a solid epoxy resin (YD014, , 5 parts by mass of a curing agent (LW-S1 produced by Acro-APRO) and 30 parts by mass of conductive particles were mixed to prepare an adhesive composition. Here, as the conductive particles, conductive particles in which zinc oxide was coated at a ratio of 20 mass% with respect to the mass of the conductive base particles were used for the conductive base particles (AUL704 made by Sekisui Chemical Co., Ltd.).

Subsequently, a PET film having a length of 50 m and a thickness of 50 탆 was prepared as the supporting film material 271. As the lead film fabric 280, a PET film identical to the support film fabric 271 was prepared. The length of the lead film fabric 280 was 2 m. Subsequently, one surface 271a of the support film fabric 271 and one surface 271a of the lead film 280 are connected to each other by a connection tape 230 (Adek S (product number: S-100B) manufactured by Suni Kagen Co., Ltd.) . The length L13 of the connection connecting tape 230 is 30 mm, and L11: L12 = 1: 1. Thus, a fabric connecting body 201a was produced. The adhesive layer fabric 272 and the cured layer fabric 290 were formed on the other surface 271b, 280b of the support film fabric 271 and the lead film fabric 280 by the above-described method. The thickness of the adhesive layer fabric 272 was 14 mu m. The length L14 of the cured layer raw material 290 on the support film raw material end 271 side is 150 mm and the length L15 is the same as the length of the lead film raw material 280. [ Also, the ultraviolet lamp was used to cure the adhesive layer fabric 272. The wavelength of the ultraviolet ray was 365 nm, and the accumulated light amount was 300 mJ / cm 2. Further, the degree of curing of the cured layer raw material 290 was measured by the above-described method, and the degree of curing was 65%. By the above process, the film connecting body fabric 201b was produced. Subsequently, the film connecting body 201b was slit with a width of 0.8 mm to prepare a film connecting body 201 for testing.

(Measurement of connection strength)

Subsequently, the connection strength was measured by the above-mentioned measuring method. As the tensile tester, Tensilon manufactured by E &amp; D Co., Ltd. was used. The connection strength was measured five times, and the average value of the measurement results was taken as the connection strength. As a result, the connection strength was 5.1N.

(Preparation of Reel)

An airless bar having a winding core 420 having a diameter of 95 mm was prepared. Then, the winding core 420 and the lead film 220 of the film connecting member 201 were connected to each other using the fixing connecting tape 260. Here, the fixing connection tape 260 is the same as the connection tape 230 for connection. The length of the fixing connecting tape 260 is set to 30 mm so that the length of the bonding surface between the fixing connecting tape 260 and the lead film 220 , And the ratio of the length of the bonding surface between the fixing connecting tape 260 and the winding core 420 is about 1: 1. Then, the film connecting body 201 was wound around the winding core 420 to produce a reel 400. [ In order to carry out the drawing test described later, a total of 100 similar reels 400 were produced.

(Withdrawal test)

An extraction test was conducted in which the film connector 201 was drawn out from the reel 400 at 700 mm / sec using a drawer tester A &amp; D Tensilon. The withdrawal test was performed until all the film connectors 201 were pulled out from the reel 400. When the film connecting body 201 can not be pulled out during the drawing, it is determined that the film connecting body 201 is displaced from the lead film 220, and the drawing test is terminated. The drawing test was performed on 100 reels 400 and the number of reel bodies 400 displaced from the lead film 220 by the film connecting body 201 was divided by 100 to calculate the tape deviation occurrence rate. It can be said that as the incidence of tape deviation is smaller, the film connecting body 201 is less likely to be displaced from the lead film 220. The tape misalignment occurrence rate in Example 7 was zero. The results are collectively shown in Table 2. In addition, the overall evaluation was made on the connection strength, the presence of wrinkles, and the tape shift occurrence rate. That is, the overall evaluation was set to &quot; A (excellent) &quot; when all the requirements of the connection strength of 5.5 N or more, no wrinkles, and the tape shift occurrence rate 0 were satisfied. B ⁺ (excellent but not better than A) "in the case where the connection strength satisfies all the requirements of 5.0 N or more and less than 5.5 N, no wrinkle, and a tape shift occurrence rate of 0. The overall evaluation was set to &quot; B ^- (Better than B ⁺ but practically no problem) &quot; when the connection strength satisfies all the requirements of 5.0 N or more and less than 5.5 N, . Assessment A, B ^+, B ^- if the conditions that are not all satisfied, the assessment was to "C (that there is a problem in practical use)".

(Example 8)

The same treatment as in Example 7 was performed except that the length L14 of the cured layer fabric 290 side on the support film fabric 271 side was 200 mm. The results are collectively shown in Table 2.

(Example 9)

The same treatment as in Example 7 was performed except that the length L14 of the cured layer fabric 290 side on the support film fabric 271 side was 300 mm. The results are collectively shown in Table 2.

(Example 10)

The same process as in Example 7 was performed except that the length L14 of the cured layer fabric 290 side on the support film fabric 271 side was 400 mm. The results are collectively shown in Table 2.

(Example 11)

Except that the length L14 of the cured layer fabric 290 on the support film fabric 271 side is 55 mm and the length L13 of the connecting tape 230 for connection is 110 mm and L11: L12 = 1: 1 The same treatment as in Example 7 was carried out. The results are collectively shown in Table 2.

(Example 12)

Except that the length L14 of the cured layer fabric 290 on the side of the supporting film material 271 side is 60 mm and the length L13 of the connecting tape 230 for connection is 120 mm and L11: L12 = 1: 1 The same treatment as in Example 7 was carried out. In Example 12, when connecting one of the surfaces 271a and 280a of the supporting film material 271 and the lead film 280 with the connection connecting tape 230, the connection connecting tape 230 is slightly wrinkled I have. The wrinkles were not particularly disturbed in the subsequent processes such as slit and winding and drawing. Further, transfer of the unevenness of the wrinkles to the adhesive film 210 was not confirmed. As a result, there was no practical problem. The results are collectively shown in Table 2.

(Example 13)

The same process as in Example 7 was performed except that the width of the film connecting member 201 was 0.6 mm. The results are collectively shown in Table 2.

(Comparative Example 8)

The same treatment as in Example 7 was performed except that the length L14 of the cured layer fabric 290 side on the support film fabric 271 side was 100 mm. The results are collectively shown in Table 2.

(Comparative Example 9)

The same treatment as in Example 7 was performed except that the length L14 of the cured layer fabric 290 side on the support film fabric 271 side was 120 mm. The results are collectively shown in Table 2.

(Comparative Example 10)

The same process as in Example 7 was performed except that the connection tape 230 was attached to both sides of the support film fabric 271 and the lead film fabric 280 and the fabric layer 290 was not formed. The results are collectively shown in Table 2.

According to Examples 7 to 13, a high connection strength and a tape shift occurrence rate of 0 could be achieved. On the other hand, in the comparative example, the connection strength was weak and the tape shift occurrence rate was also increased. Therefore, in Examples 7 to 13, even when the width of the adhesive film was narrowed, it was made possible to make it difficult for the adhesive film to be displaced from the lead film. Particularly, when L14 is 300 to 400 mm, the connection strength is further increased. Therefore, L14 is preferably 300 to 400 mm. However, in Example 12, since the connection connecting tape 230 was wrinkled, the workability was slightly lowered. Therefore, the length of the connecting tape 230 for connection is preferably less than 120 mm.

Further, in Examples 7 and 10, the same processes as in Examples 7 and 10 were carried out except that L11: L12 was 3: 7 and 7: 3, respectively, to obtain substantially the same results as those in Examples.

While the preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, the present invention is not limited thereto. It will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims. It is to be understood that they fall within the technical scope of the invention.

10: Reel
20: winding core
30: Adhesive film
31: Support film
32: Adhesive layer
40: lead film
50: connection tape for connection
60: Fixing connection tape
201: Film connector
210: Adhesive film
211: Support film
212: Adhesive layer
220: lead film
230: connection tape for connection
240: Cured layer
260: Fixing connection tape
400: Reel
420: winding core
421, 422: Flange

Claims (1)

A cylindrical winding core,
A lead film connected to a peripheral surface of the winding core;
An adhesive film having a width of 0.6 mm or less wound around the winding core,
And a connection tape connecting the lead film and the adhesive film,
The connection strength between the lead film and the adhesive film by the connection tape is 5.0 N or more,
Wherein the adhesive film comprises a support film and an adhesive layer formed on the support film,
And the connection tape connects the lead film and a surface of the support film on which the adhesive layer is not formed.

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