KR20190013498A - 분진 비산 방지 장치 그리고 이 분진 비산 방지 장치를 구비한 기판 가공 장치 - Google Patents

분진 비산 방지 장치 그리고 이 분진 비산 방지 장치를 구비한 기판 가공 장치 Download PDF

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Publication number
KR20190013498A
KR20190013498A KR1020180082212A KR20180082212A KR20190013498A KR 20190013498 A KR20190013498 A KR 20190013498A KR 1020180082212 A KR1020180082212 A KR 1020180082212A KR 20180082212 A KR20180082212 A KR 20180082212A KR 20190013498 A KR20190013498 A KR 20190013498A
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KR
South Korea
Prior art keywords
substrate
dust
scribing
scattering prevention
prevention device
Prior art date
Application number
KR1020180082212A
Other languages
English (en)
Korean (ko)
Inventor
츠토무 우에노
기요시 다카마츠
요시타카 니시오
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20190013498A publication Critical patent/KR20190013498A/ko

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H01L51/56—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • H01L2251/566—

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Cleaning In General (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020180082212A 2017-07-31 2018-07-16 분진 비산 방지 장치 그리고 이 분진 비산 방지 장치를 구비한 기판 가공 장치 KR20190013498A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017148006A JP2019026513A (ja) 2017-07-31 2017-07-31 粉塵飛散防止装置並びにこの粉塵飛散防止装置を備えた基板加工装置
JPJP-P-2017-148006 2017-07-31

Publications (1)

Publication Number Publication Date
KR20190013498A true KR20190013498A (ko) 2019-02-11

Family

ID=65264077

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180082212A KR20190013498A (ko) 2017-07-31 2018-07-16 분진 비산 방지 장치 그리고 이 분진 비산 방지 장치를 구비한 기판 가공 장치

Country Status (4)

Country Link
JP (1) JP2019026513A (zh)
KR (1) KR20190013498A (zh)
CN (1) CN109318387A (zh)
TW (1) TW201921422A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111653195A (zh) * 2020-06-09 2020-09-11 汤军文 一种方便除尘的户外广告用显示屏

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3018964B2 (ja) * 1995-11-24 2000-03-13 双葉電子工業株式会社 洗浄方法及び洗浄装置
JPH1111966A (ja) * 1997-06-20 1999-01-19 Toshiba Corp スクライブ装置及びスクライブ方法
JPH11105833A (ja) * 1997-10-09 1999-04-20 Toyo Seikan Kaisha Ltd クリーンルーム内外への容器の搬送方法
TW528736B (en) * 2001-04-02 2003-04-21 Mitsuboshi Diamond Ind Co Ltd Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel
JP4029968B2 (ja) * 2002-07-01 2008-01-09 株式会社アドバンスト・ディスプレイ 搬送車、製造装置及び搬送システム
JP4509613B2 (ja) * 2004-03-19 2010-07-21 大日本スクリーン製造株式会社 基板処理装置
JP5434578B2 (ja) * 2009-12-25 2014-03-05 旭硝子株式会社 フロートガラス製造装置の冷却レア
JP2014201449A (ja) * 2013-04-01 2014-10-27 日本電気硝子株式会社 ガラス板搬送装置及びガラス板搬送方法
JP2015078254A (ja) * 2013-10-15 2015-04-23 東レ株式会社 樹脂組成物、それを用いたポリイミド樹脂膜、それを含むカラーフィルタ、ｔｆｔ基板、表示デバイスおよびそれらの製造方法
JP6364789B2 (ja) * 2014-01-29 2018-08-01 三星ダイヤモンド工業株式会社 スクライブ装置
JP2017113880A (ja) * 2014-04-28 2017-06-29 旭硝子株式会社 ガラス積層体、樹脂層付きガラス基板、樹脂層付き支持基材
JP2015217603A (ja) * 2014-05-16 2015-12-07 三星ダイヤモンド工業株式会社 ブレイク方法並びにブレイク装置
JP6539965B2 (ja) * 2014-09-16 2019-07-10 宇部興産株式会社 フレキシブルデバイスの製造方法
JP6577714B2 (ja) * 2015-02-04 2019-09-18 株式会社 ハリーズ 透明板検査装置及び透明板清掃検査システム

Also Published As

Publication number Publication date
TW201921422A (zh) 2019-06-01
CN109318387A (zh) 2019-02-12
JP2019026513A (ja) 2019-02-21

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