KR20180134654A - Metal patterning film and method of preparing the same - Google Patents

Metal patterning film and method of preparing the same Download PDF

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Publication number
KR20180134654A
KR20180134654A KR1020170072675A KR20170072675A KR20180134654A KR 20180134654 A KR20180134654 A KR 20180134654A KR 1020170072675 A KR1020170072675 A KR 1020170072675A KR 20170072675 A KR20170072675 A KR 20170072675A KR 20180134654 A KR20180134654 A KR 20180134654A
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South Korea
Prior art keywords
layer
metal pattern
adhesion
substrate
metal
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KR1020170072675A
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Korean (ko)
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KR102078438B1 (en
Inventor
이기석
장성호
성지현
이승헌
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주식회사 엘지화학
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Priority to KR1020170072675A priority Critical patent/KR102078438B1/en
Priority to JP2019566944A priority patent/JP6930698B2/en
Priority to EP18812838.3A priority patent/EP3636430A4/en
Priority to PCT/KR2018/003607 priority patent/WO2018225938A1/en
Priority to US16/619,763 priority patent/US11090910B2/en
Priority to CN201880036896.5A priority patent/CN110719842B/en
Publication of KR20180134654A publication Critical patent/KR20180134654A/en
Application granted granted Critical
Publication of KR102078438B1 publication Critical patent/KR102078438B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
    • B32B17/10183—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer being not continuous, e.g. in edge regions
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    • B32B17/10192—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer being not continuous, e.g. in edge regions patterned in the form of columns or grids
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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    • C—CHEMISTRY; METALLURGY
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

The present application relates to a metal patterning film and to a manufacturing method thereof, wherein the film comprises: a substrate; a first adhesion enhancing layer and a second adhesion enhancing layer provided on both sides of the substrate, respectively; a metal pattern provided on the opposite surface in contact with the substrate of the first adhesion promoting layer; a first adhesion layer provided on the surface of the first adhesion promoting layer provided with the metal pattern so as to cover metal patterns; and a second adhesion layer provided on the opposite surface of the second adhesion promoting layer in contact with the substrate, wherein the first adhesion enhancement layer and the second adhesion enhancement layer comprise a metal oxide film containing an inorganic oxide. In the present application, the adhesion promoting layer of an ultra-thin film is formed on the surface of the substrate to improve the adhesion with the adhesion layer.

Description

금속 패턴 필름 및 이의 제조 방법{METAL PATTERNING FILM AND METHOD OF PREPARING THE SAME}FIELD OF THE INVENTION [0001] The present invention relates to a metal pattern film,

본 출원은 부착증진층을 포함하는 금속 패턴 필름 및 이의 제조 방법을 제공한다.The present application provides a metal pattern film including an adhesion promoting layer and a method of manufacturing the same.

자동차 또는 건축용으로 사용되는 기능성 접합 유리 제조시, 일반적으로 폴리비닐부티랄(PVB)이 점착제로 사용된다. 특별한 기능이 부여된 접합 유리는 폴리비닐부티랄(PVB)이 라미네이션(Lamination)된 기능성 필름을 두 장의 유리 사이에 넣어 열압착 공정으로 제조된다.Polyvinyl butyral (PVB) is commonly used as an adhesive in the manufacture of functional bonded glass for automotive or architectural use. Laminated glass with a special function is produced by a thermocompression process in which a functional film laminated with polyvinyl butyral (PVB) is placed between two sheets of glass.

필름이 삽입된 기능성 접착 유리의 제조를 위해서는 폴리비닐부티랄(PVB)과 기능성 필름 사이의 부착력이 일정 수준 이상이어야 하며, 재가공이 가능하기 위해서는 박리가 가능한 수준이 되어야 한다.In order to manufacture a functional adhesive glass having a film, the adhesive force between polyvinyl butyral (PVB) and the functional film must be at least a certain level, and in order to be reworkable, the film must be peelable.

기존의 폴리비닐부티랄(PVB)이 라미네이션(Lamination) 된 폴리비닐부티랄(PVB)/기능성 필름의 박리시 스틱(STICK)-슬립(SLIP)현상이 발생하게 되며, 스틱(STICK)-슬립(SLIP)현상에 의해 주름 및 얼룩이 남아 재사용이 불가하다는 단점을 갖는다.The existing polyvinyl butyral (PVB) laminated polyvinyl butyral (PVB) / the sticking stickiness (slip) phenomenon of the functional film occurs, and the stick-slip (slip) SLIP) phenomenon is present and wrinkles and unevenness are left unavailable for reuse.

기존에 일반적으로 사용되고 있는 기능성 필름으로 PET필름이 사용되며, PET필름은 박리(Peel off)시 스틱(STICK)-슬립(SLIP)현상이 발생하게 되어, 면과 면이 박리될 때 진동을 동반하기 때문에 주름 및 얼룩이 남아 재사용이 불가능하다. 따라서, 기능성 접합 유리 제조에 있어, 스틱(STICK)-슬립(SLIP)현상을 해소하여, 주름 및 얼룩이 남지 않아 재가공이 가능한 금속 패턴 필름이 필요하다.PET film is used as a functional film which is generally used in the past. PET film has a stick-slip phenomenon during peel-off, and accompanied with vibration when the face and the face are peeled off. Therefore, wrinkles and unevenness remain, which makes it impossible to reuse. Therefore, in the production of functional bonded glass, there is a need for a metal pattern film which can eliminate the stick-slip (SLIP) phenomenon and can be reworked without wrinkles and unevenness.

한국 특허문헌 제10-2016-0079296호Korean Patent Publication No. 10-2016-0079296

본 출원은 기재의 표면에 초박막의 부착증진층을 형성하여 점착층과의 부착력을 향상시키고, 박리시 스틱(STICK)-슬립(SLIP)현상을 해소하는 것을 특징으로 하는 금속 패턴 필름 및 이의 제조방법을 제공하고자 한다.The present application relates to a metal pattern film characterized by forming an ultra-thin adhesion enhancement layer on the surface of a substrate to improve the adhesion with the adhesive layer and to eliminate the sticking stickiness (SLIP) phenomenon and a method for manufacturing the same .

본 출원의 일 실시상태는 기재; 상기 기재의 양면에 각각 구비된 제1 부착증진층 및 제2 부착증진층; 상기 제1 부착증진층의 상기 기재에 접하는 면의 반대면에 구비된 금속 패턴; 상기 제1 부착증진층의 상기 금속 패턴이 구비된 면 상에 상기 금속 패턴을 덮도록 구비된 제1 점착층; 및 상기 제2 부착증진층의 상기 기재에 접하는 면의 반대 면에 구비된 제2 점착층을 포함하며, 상기 제1 부착증진층 및 제2 부착증진층은 무기산화물을 포함하는 금속 패턴 필름을 제공한다.One embodiment of the present application includes a description; A first adhesion enhancing layer and a second adhesion enhancing layer provided on both sides of the substrate; A metal pattern provided on an opposite surface of the first adhesion promoting layer to the substrate; A first adhesive layer provided on the surface of the first adhesion promoting layer provided with the metal pattern so as to cover the metal pattern; And a second adhesive layer provided on an opposite side of a surface of the second adhesion promoting layer that is in contact with the substrate, wherein the first adhesion enhancing layer and the second adhesion promoting layer provide a metal pattern film containing an inorganic oxide do.

또한, 본 출원의 일 실시상태는 본 출원의 일 실시상태에 따른 금속 패턴 필름을 포함하는 접합 유리를 제공한다.In addition, one embodiment of the present application provides a bonded glass including a metal pattern film according to one embodiment of the present application.

또한, 본 출원의 일 실시상태는 기재를 준비하는 단계; 상기 기재의 양면에 각각 제1 부착증진층 및 제2 부착증진층을 형성하는 단계; 상기 제1 부착증진층의 상기 기재에 접하는 면의 반대면에 금속 패턴을 패터닝하여 금속 패턴을 형성하는 단계; 상기 제1 부착증진층의 상기 금속 패턴이 구비된 면 상에 상기 금속 패턴을 덮도록 제1 점착층을 형성하는 단계; 및 상기 제2 부착증진층의 상기 기재에 접하는 면의 반대 면에 제2 점착층을 형성하는 단계를 포함하며, 상기 제1 부착증진층 및 제2 부착증진층은 무기산화물을 포함하는 것인 금속 패턴 필름의 제조방법을 제공한다.In addition, one embodiment of the present application includes a step of preparing a substrate; Forming a first adhesion promoting layer and a second adhesion enhancing layer on both sides of the substrate; Forming a metal pattern by patterning a metal pattern on an opposite surface of the first adhesion promoting layer to a surface in contact with the substrate; Forming a first adhesive layer on the surface of the first adhesion promoting layer on which the metal pattern is provided so as to cover the metal pattern; And forming a second adhesive layer on a surface of the second adhesion promoting layer opposite to the surface in contact with the substrate, wherein the first adhesion enhancing layer and the second adhesion promoting layer comprise an inorganic oxide A method for producing a patterned film is provided.

본 출원의 일 실시상태에 따른 금속 패턴 필름은 기재의 양면에 초박막 무기산화물층을 형성하여 투과율의 저하 없이 점착층과의 부착력을 향상시킬 뿐 아니라 박리시 스틱(STICK)-슬립(SLIP)현상을 해소하여 면과 면이 박리될 때 진동을 감소시켜 주름 및 얼룩형성을 방지하여 재가공이 가능하도록 한다.The metal pattern film according to one embodiment of the present application not only improves the adhesive force with the adhesive layer without decreasing the transmittance by forming an ultra-thin inorganic oxide layer on both sides of the substrate, but also causes sticking stick (SLIP) And the vibration is reduced when the face and the face are peeled off to prevent formation of wrinkles and stains, thereby enabling rework.

또한, 본 출원의 일 실시상태에 따른 금속 패턴 필름은 초박막의 무기산화물층을 형성함으로써, 기재 상부에 증착되는 패턴층과 기재 사이의 밀착력 향상의 효과가 있어, 메탈메쉬 기반의 투명 도전성 필름의 원단의 부착층 기능을 포함할 수 있다.In addition, the metal pattern film according to one embodiment of the present application has an effect of improving the adhesion between the pattern layer deposited on the substrate and the substrate by forming an ultra-thin inorganic oxide layer, and the metal mesh based transparent conductive film Lt; RTI ID = 0.0 > function. ≪ / RTI >

또한, 본 출원의 일 실시상태에 따른 금속 패턴 필름은 나노 단위의 무기산화물층을 이용하여, 투명하고 필름의 광특성 변화가 없기 때문에 투명한 기능성 접합 유리 제조시 유용하게 사용할 수 있다.In addition, the metal pattern film according to one embodiment of the present application uses a nano-sized inorganic oxide layer and is transparent and has no change in optical characteristics of the film, so that it can be usefully used in the production of transparent functional bonded glass.

도 1은 본 출원의 일 실시상태에 따른 금속 패턴 필름을 나타낸 측면도이다.
도 2는 본 출원의 일 실시상태에 따른 박리 공정을 나타낸 도이다.
도 3은 본 출원의 일 실시상태에 따른 금속 패턴의 제조방법을 나타낸 도이다.
도 4는 본 출원의 일 실시상태에 따른 금속 패턴 필름의 박리력을 측정한 도이다.1 is a side view showing a metal pattern film according to an embodiment of the present application.
2 is a view showing a peeling process according to an embodiment of the present application.
3 is a view showing a method of manufacturing a metal pattern according to an embodiment of the present application.
Fig. 4 is a view showing the peeling force of the metal pattern film according to one embodiment of the present application. Fig.

이하, 본 명세서에 대하여 더욱 상세하게 설명한다.Hereinafter, the present invention will be described in more detail.

본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 본 발명의 실시예에 대하여 첨부한 도면을 참고로 하여 상세히 설명한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

본 출원의 일 실시상태에 따른 금속 패턴 필름은, 기재; 상기 기재의 양면에 각각 구비된 제1 부착증진층 및 제2 부착증진층; 상기 제1 부착증진층의 상기 기재에 접하는 면의 반대면에 구비된 금속 패턴; 상기 제1 부착증진층의 상기 금속 패턴이 구비된 면 상에 상기 금속 패턴을 덮도록 구비된 제1 점착층; 및 상기 제2 부착증진층의 상기 기재에 접하는 면의 반대 면에 구비된 제2 점착층을 포함하며, 상기 제1 부착증진층 및 제2 부착증진층은 무기산화물을 포함한다.A metal pattern film according to an embodiment of the present application includes a substrate; A first adhesion enhancing layer and a second adhesion enhancing layer provided on both sides of the substrate; A metal pattern provided on an opposite surface of the first adhesion promoting layer to the substrate; A first adhesive layer provided on the surface of the first adhesion promoting layer provided with the metal pattern so as to cover the metal pattern; And a second adhesive layer provided on a side of the second adhesion promoting layer opposite to the side in contact with the base material, wherein the first adhesion promoting layer and the second adhesion promoting layer comprise an inorganic oxide.

본 출원의 일 실시상태에 따른 금속 패턴 필름은 기재 양면에 초박막의 무기산화물층을 형성하여 투과율의 저하 없이 점착층과의 부착력을 향상시킬 수 있으며, 박리시 스틱(STICK)-슬립(SLIP)현상을 해소하여 면과 면이 박리될 때 진동을 감소시켜 주름 및 얼룩 형성을 방지하여 재가공이 가능하도록 하며, 또한 나노 단위의 무기산화물층을 형성하여, 패턴과 기재 사이의 밀착력 향상의 효과가 있다.The metal pattern film according to one embodiment of the present application can form an ultra-thin inorganic oxide layer on both sides of the substrate to improve the adhesion with the adhesive layer without lowering the transmittance, and the sticking stickiness (SLIP) It is possible to reduce the vibration when the surface and the surface are peeled off to prevent the formation of wrinkles and stains so as to be able to reprocess and further improve the adhesion between the pattern and the substrate by forming a nano unit inorganic oxide layer.

본 명세서에 있어서, 상기 스틱(STICK)-슬립(SLIP)현상은 면과 면이 박리될 때 진동을 동반하는 마찰현상 또는 부드럽지 못한 운동을 초래하여 진동을 유발시켜 정밀도를 저하시키는 현상을 의미한다.In this specification, the stick-slip (SLIP) phenomenon refers to a phenomenon in which when the surface and the surface are peeled, a friction phenomenon accompanied by vibration or a non-smooth motion causes vibration to degrade precision .

본 출원의 일 실시상태에 있어서, 상기 기재는 투명 고분자 필름으로 이루어질 수 있다.In one embodiment of the present application, the substrate may be made of a transparent polymer film.

본 출원의 일 실시상태에 있어, 상기 기재는 PET 필름, PC(polycarbonate) 필름, PEN(polyethylene naphthalate) 필름으로 이루어질 수 있으며, 이에만 한정되는 것은 아니다.In one embodiment of the present application, the substrate may be made of a PET film, a polycarbonate (PC) film, or a polyethylene naphthalate (PEN) film, but is not limited thereto.

본 출원의 일 실시상태에 있어서, 상기 기재의 두께는 1㎛ 이상 200㎛ 이하, 바람직하게는 10㎛ 이상 100㎛ 이하일 수 있다.In one embodiment of the present application, the thickness of the substrate may be 1 탆 or more and 200 탆 or less, preferably 10 탆 or more and 100 탆 or less.

본 출원의 일 실시상태에 있어서, 상기 제1 및 제2 부착증진층은 네오븀 옥사이드(Nb2Ox), 산화알루미늄(Al2O3), 산화규소(SiO2), 산화아연(ZnO), 산화네오븀(NbO), 산화주석(SnO), 산화지르코늄(ZrO) 및 산화인듐주석(ITO)으로 이루어진 군에서 선택되는 1 이상을 포함한다.In one embodiment of the present application, the first and second adhesion promoting layers are formed of a material selected from the group consisting of nebium oxide (Nb2Ox), aluminum oxide (Al2O3), silicon oxide (SiO2), zinc oxide (ZnO) , Tin oxide (SnO), zirconium oxide (ZrO), and indium tin oxide (ITO).

상기 네오븀 옥사이드(Nb2Ox)에 있어, x의 범위는 1 내지 6의 정수, 바람직하게는 1 내지 4의 정수이다.In the neobinary oxide (Nb 2 O x), the range of x is an integer of 1 to 6, preferably an integer of 1 to 4.

본 출원의 일 실시상태에 있어서, 상기 제1 및 제2 부착증진층은 산화알루미늄(Al2O3)으로 이루어질 수 있다.In one embodiment of the present application, the first and second adhesion promoting layers may be made of aluminum oxide (Al 2 O 3).

또 다른 일 실시상태에 있어서, 상기 제1 및 제2 부착증진층은 산화규소(SiO2)로 이루어질 수 있다.In another embodiment, the first and second adhesion promoting layers may be made of silicon oxide (SiO2).

또 다른 일 실시상태에 있어서, 상기 제1 및 제2 부착증진층은 산화인듐주석(ITO)으로 이루어질 수 있다.In another embodiment, the first and second adhesion promoting layers may be made of indium tin oxide (ITO).

또 다른 일 실시상태에 있어서, 상기 제1 및 제2 부착증진층은 Nb2Ox층이 단독으로 사용될 수 있다.In yet another embodiment, the first and second adhesion enhancement layers may be used solely of the Nb2Ox layer.

상기 제1 및 제2 부착증진층이 Nb2Ox층 단독으로 사용될 경우, 금속 패턴 필름의 광특성이 가장 우수하다.When the first and second adhesion enhancing layers are used alone as the Nb2Ox layer, the optical characteristics of the metal pattern film are most excellent.

또 다른 일 실시상태에 있어서, 상기 제1 부착증진층과 상기 기재가 접하는 면 사이에 합금 중간층이 더 포함될 수 있다.In another embodiment, an alloy intermediate layer may be further included between the first adhesion promoting layer and the surface in contact with the substrate.

또 다른 일 실시상태에 있어서, 상기 제2 부착증진층과 상기 기재가 접하는 면 사이에 합금 중간층이 더 포함될 수 있다.In another embodiment, an alloy intermediate layer may be further included between the second adhesion promoting layer and the surface in contact with the substrate.

본 출원의 일 실시상태에 있어서, 상기 합금 중간층의 두께는 0.5nm 이상 1.9nm 이하, 바람직하게는 0.5nm 이상 1.5nm 이하일 수 있다.In one embodiment of the present application, the thickness of the alloy intermediate layer may be 0.5 nm or more and 1.9 nm or less, preferably 0.5 nm or more and 1.5 nm or less.

상기 합금 중간층의 두께가 2nm 이상인 경우 가시광의 투과율 감소가 나타나 성능의 저하가 발생하게 된다.When the thickness of the alloy intermediate layer is 2 nm or more, the transmittance of visible light decreases and the performance deteriorates.

상기 합금 중간층은 NiCr, Ni, Cr 일 수 있으나, 이에 한정되지 않는다.The alloy intermediate layer may be NiCr, Ni, Cr, but is not limited thereto.

상기 금속 패턴 필름에 있어, 제1 및 제2 부착증진층으로 무기산화물층을 적용한 경우, 기재(PET)와 폴리비닐부티랄(PVB)의 열압착 후, 박리 평가 결과 스틱(STICK)-슬립(SLIP)현상이 현저하게 감소되었으며, 이에 따라 주름 및 얼룩이 남지 않아 금속 패턴 필름을 재가공할 수 있었다.In the case where the inorganic oxide layer is applied to the first and second adhesion enhancing layers in the metal pattern film, after sticking the substrate (PET) and the polyvinyl butyral (PVB) to each other, SLIP) phenomenon was remarkably reduced, so that wrinkles and stains were not left, and the metal pattern film could be reworked.

본 출원의 일 실시상태에 있어, 상기 제1 및 제2 부착증진층의 각각의 두께는 0.1nm 이상 30nm 이하, 바람직하게는 1nm 이상 25nm 이하, 더욱 바람직하게는 1nm 이상 20nm 이하인 것을 특징으로 할 수 있다.In one embodiment of the present application, the thickness of each of the first and second adhesion enhancing layers is 0.1 nm or more and 30 nm or less, preferably 1 nm or more and 25 nm or less, more preferably 1 nm or more and 20 nm or less have.

상기 나노 단위 두께의 부착증진층을 형성함으로써, 필름의 광특성 변화가 없어 투명한 기능성 접합 유리 제작에 유용하게 사용될 수 있으며, 투과율의 저하 없이, 점착층과의 부착력을 향상시킬 뿐 아니라 박리시 스틱(STICK)-슬립(SLIP)현상을 해소할 수 있다.By forming the adhesion enhancement layer having a thickness of the nano unit, there is no change in the optical properties of the film, so that it can be usefully used in the production of a transparent functional bonded glass. In addition to improving the adhesion with the adhesive layer without lowering the transmittance, STICK) - Slip (SLIP) phenomenon can be solved.

본 출원의 일 실시상태에 따른 금속 패턴 필름은, 상기 제1 부착증진층의 상기 기재에 접하는 면의 반대면에 구비된 금속 패턴을 갖는 것을 특징으로 한다.The metal pattern film according to one embodiment of the present application has a metal pattern provided on the opposite surface of the first adhesion promoting layer in contact with the substrate.

본 출원의 일 실시상태에 있어서, 상기 금속 패턴은 알루미늄, 구리, 니켈, 크롬, 금, 은 및 백금으로 이루어진 군에서 선택되는 1 이상을 포함할 수 있으며, 상기 금속 패턴은 전기전도도가 우수한 구리가 가장 바람직하나, 이에 한정되지 않는다.In one embodiment of the present application, the metal pattern may include at least one selected from the group consisting of aluminum, copper, nickel, chromium, gold, silver and platinum, Most preferred, but not limited thereto.

본 출원의 일 실시상태에 있어서, 상기 금속 패턴의 선고는 10㎛ 이하 바람직하게는 5㎛ 이하인 것을 특징으로 한다.In one embodiment of the present application, the fine pattern of the metal pattern is 10 mu m or less, preferably 5 mu m or less.

상기 금속 패턴의 선고란, 상기 부착증진층에 접하는 면으로부터, 이에 대항하는 면까지의 거리를 의미한다.The designation of the metal pattern means a distance from a surface in contact with the adhesion enhancement layer to a surface in contact with the adhesion enhancement layer.

본 출원의 일 실시상태에 있어서, 상기 금속 패턴의 선고의 편차는 20% 이내 바람직하게는 5% 이내인 것을 특징으로 한다.In one embodiment of the present application, the deviation of the pitch of the metal pattern is 20% or less, preferably 5% or less.

상기 편차는 평균 선고를 기준으로 평균 선고와 개별 선고의 차이에 대한 백분율을 의미한다.The deviation means a percentage of the difference between the average sentence and the individual sentence based on the average sentence.

본 출원의 일 실시상태에 있어서, 상기 금속 패턴의 전체 개구율, 즉 금속 패턴에 의하여 덮여지지 않는 기재 영역의 비율은 90% 이상, 바람직하게는 95% 이상이다.In one embodiment of the present application, the total opening ratio of the metal pattern, that is, the ratio of the substrate region not covered by the metal pattern is 90% or more, preferably 95% or more.

본 출원의 일 실시상태에 있어서, 상기 금속 패턴의 선폭은 40㎛ 이하, 구체적으로 0.1㎛ 내지 40㎛ 이하일 수 있다.In one embodiment of the present application, the line width of the metal pattern may be 40 占 퐉 or less, specifically 0.1 占 퐉 to 40 占 퐉 or less.

본 출원의 일 실시상태에 있어서, 상기 금속 패턴의 선간 간격은 50㎛ 내지 1000㎛이다.In one embodiment of the present application, the line-to-line spacing of the metal patterns is 50 탆 to 1000 탆.

본 출원의 일 실시상태에 있어서, 상기 제1 및 제2 점착층은 PVB(polyvinylbutyral), EVA(ethylene vinyl acetate), PU(polyurethane), 또는 PO(Polyolefin)를 포함하는 것을 특징으로 하며, 바람직하게는 PVB(polyvinylbutyral)층일 수 있다.In one embodiment of the present application, the first and second adhesive layers are characterized by comprising PVB (polyvinylbutyral), EVA (ethylene vinyl acetate), PU (polyurethane), or PO (polyolefin) May be a PVB (polyvinylbutyral) layer.

또 다른 일 실시상태에 있어서, 상기 제1 및 제2 점착층의 각각의 두께는 1㎛ 이상 1000㎛ 이하, 바람직하게는 1㎛ 이상 760㎛ 이하인 것을 특징으로 한다.In another embodiment, each of the first and second adhesive layers has a thickness of 1 占 퐉 or more and 1000 占 퐉 or less, and preferably 1 占 퐉 or more and 760 占 퐉 or less.

상기 각각의 제1 및 제2 점착층이 상기 두께를 갖는 경우 금속 패턴 필름의 밀착력이 향상되며, 특히 접합유리를 더 포함하는 경우에 있어 유리의 파손 시 파편의 비산을 방지하는 효과를 갖는다.When each of the first and second adhesive layers has the above thickness, the adhesion of the metal pattern film is improved, and in particular, when the first and second adhesive layers further include a laminated glass, it has an effect of preventing scattering of fragments upon breakage of the glass.

본 출원의 일 실시상태에 있어, 상기 금속 패턴 필름을 포함하는 접합 유리를 제공한다.In one embodiment of the present application, a laminated glass including the metal pattern film is provided.

본 출원의 일 실시상태에 있어서, 상기 접합유리는 상기 제1 점착층의 상기 패턴이 형성된 제1 부착증진층과 접하는 면의 반대면 및 상기 제2 점착층의 상기 제2 부착증진층과 접하는 면의 반대면에 각각 유리를 더 포함하는 구성으로 이루어진다.In one embodiment of the present application, the laminated glass is provided on a surface of the first adhesive layer opposite to the surface in contact with the first adhesion enhancing layer on which the pattern is formed and a surface of the second adhesive layer in contact with the second adhesion enhancing layer On the opposite side of the glass plate.

상기 접합유리는, 상기 금속 패턴 필름의 상기 가합지된 점착층과 유리를 열압착하는 단계를 통해 제조될 수 있다.The laminated glass can be manufactured by thermocompression bonding the glass laminated adhesive layer of the metal pattern film and the glass.

본 출원의 일 실시상태에 있어서, 상기 제1 및 제2 점착층과 유리의 합지는 강화유리 사이에 가합지된 점착층을 삽입하여 진공라미네이터 또는 오토클레이브 등의 열압착 설비를 통하여 140℃ 이상의 온도에서 시트 단위로 제조될 수 있다.In one embodiment of the present invention, the adhesive layer between the first and second adhesive layers and the glass is inserted into the adhesive glass layer between the tempered glass through a thermocompression equipment such as a vacuum laminator or an autoclave at a temperature of 140 ° C or higher In sheet form.

본 출원의 일 실시상태에 따르면, 상기 금속 패턴과 상기 기재의 계면에는 프라이머층이 추가로 구비될 수 있다.According to an embodiment of the present application, a primer layer may be further provided on the interface between the metal pattern and the substrate.

본 출원의 일 실시상태는 기재를 준비하는 단계; 상기 기재의 양면에 각각 제1 부착증진층 및 제2 부착증진층을 형성하는 단계; 상기 제1 부착증진층의 상기 기재에 접하는 면의 반대면에 금속 패턴을 패터닝하여 금속 패턴을 형성하는 단계; 상기 제1 부착증진층의 상기 금속 패턴이 구비된 면 상에 상기 금속 패턴을 덮도록 제1 점착층을 형성하는 단계; 및 상기 제2 부착증진층의 상기 기재에 접하는 면의 반대 면에 제2 점착층을 형성하는 단계를 포함하며, 상기 제1 부착증진층 및 제2 부착증진층은 무기산화물을 포함하는 것인 금속 패턴 필름의 제조방법을 제공한다.One embodiment of the present application is a method of manufacturing a semiconductor device, comprising: preparing a substrate; Forming a first adhesion promoting layer and a second adhesion enhancing layer on both sides of the substrate; Forming a metal pattern by patterning a metal pattern on an opposite surface of the first adhesion promoting layer to a surface in contact with the substrate; Forming a first adhesive layer on the surface of the first adhesion promoting layer on which the metal pattern is provided so as to cover the metal pattern; And forming a second adhesive layer on a surface of the second adhesion promoting layer opposite to the surface in contact with the substrate, wherein the first adhesion enhancing layer and the second adhesion promoting layer comprise an inorganic oxide A method for producing a patterned film is provided.

본 출원의 일 실시상태에 따른 제조방법에 있어서, 상기 제1 및 제2 부착증진층은 기재상에 E-beam sputter 설비를 이용하여 기상증착 공정에 의해 형성될 수 있으나, 이에 한정되지 않는다.In the manufacturing method according to one embodiment of the present application, the first and second adhesion enhancing layers may be formed by a vapor deposition process using an E-beam sputtering equipment on a substrate, but are not limited thereto.

본 출원의 일 실시상태에 따른 제조방법에 있어서, 상기 제1 부착증진층 및 제2 부착증진층의 각각의 면에 제1 및 제2 점착층을 형성하는 단계는 열압착, 고상 점착필름 합지, 액상 점착액 코팅 공정에 의해서 형성될 수 있으며, 바람직하게는 열압착 공정을 이용할 수 있다.In the manufacturing method according to one embodiment of the present application, the step of forming the first and second adhesive layers on the respective surfaces of the first adhesion promoting layer and the second adhesion promoting layer may be performed by thermocompression bonding, A liquid adhesive liquid coating process, and preferably a thermocompression process can be used.

상기 열압착 공정의 압력, 온도 및 시간은 사용되는 점착층의 종류에 따라 차이가 있지만, 예컨대 열압착 공정은 60℃ 내지 150℃의 범위에서 선택된 온도에서 수행될 수 있으며, 필요에 따라 압력이 가해질 수 있다.The pressure, temperature and time of the thermocompression process vary depending on the kind of the adhesive layer to be used, but for example, the thermocompression process can be performed at a temperature selected from the range of 60 ° C to 150 ° C, .

본 출원의 일 실시상태에 있어서 상기 부착증진층의 양면에 제1 및 제2 점착층의 가합지는 80℃ 내외의 온도에서 롤 라미네이터를 이용하여 제조한다.In one embodiment of the present application, the lamination of the first and second adhesive layers on both sides of the adhesion enhancement layer is manufactured using a roll laminator at a temperature of about 80 캜.

본 출원의 일 실시상태에 따른 제조방법에 있어서, 상기 금속 패턴을 형성하는 단계는 금속층을 형성하는 단계; 및 상기 금속층을 패터닝하여 금속 패턴을 형성하는 단계를 포함하는 것인 금속 패턴 필름의 제조방법을 제공한다.In the manufacturing method according to an embodiment of the present application, the step of forming the metal pattern may include: forming a metal layer; And patterning the metal layer to form a metal pattern.

본 출원의 일 실시상태에 따른 제조방법에 있어서, 상기 금속층을 형성하는 단계는 증착 또는 도금을 통하여 형성될 수 있다.In the manufacturing method according to one embodiment of the present application, the step of forming the metal layer may be formed through vapor deposition or plating.

본 출원의 일 실시상태에 따른 제조방법에 있어서, 상기 금속층을 패터닝하여 금속 패턴을 형성하는 단계는 상기 금속층 상에 에칭 레지스트 패턴을 형성한 후, 에칭 레지스트 패턴에 의하여 덮여 있지 않은 금속층을 제거함으로써 수행되는 것인 금속 패턴 필름의 제조방법을 제공한다.In the manufacturing method according to one embodiment of the present application, the step of patterning the metal layer to form the metal pattern may include forming an etching resist pattern on the metal layer, and then removing the metal layer not covered by the etching resist pattern Wherein the metal pattern film is a metal film.

상기 금속층 상에 에칭 레지스트 패턴의 형성은 포토공정 또는 인쇄공정으로 형성할 수 있으나, 이에 한정되는 것은 아니다.The etching resist pattern may be formed on the metal layer by a photolithography process or a printing process, but is not limited thereto.

본 출원의 일 실시상태에 따른 제조방법에 있어서, 상기 에칭 레지스트 패턴이 형성된 금속층을 선택적으로 에칭하여 금속 패턴의 형성 후, 금속 패턴 상부에 잔류하는 에칭 레지스트를 박리액을 이용하여 제거하는 단계를 더 포함할 수 있다.In the manufacturing method according to an embodiment of the present application, the step of selectively removing the metal layer on which the etching resist pattern is formed to remove the etching resist remaining on the metal pattern after the metal pattern is formed using the removing liquid .

상기 에칭 레지스트를 제거하기 위한 박리액으로는 알칼리 용액 또는 유기 용매가 이용될 수 있다.As the removing solution for removing the etching resist, an alkali solution or an organic solvent may be used.

상기 알칼리용액으로는 1.0wt% 이상의 농도로 희석된 수산화나트륨 수용액, 수산화칼륨이 사용될 수 있으며, 알칼리 용액이면 이에 한정되지 않는다.The alkali solution may be an aqueous sodium hydroxide solution or potassium hydroxide diluted to a concentration of 1.0 wt% or more, and is not limited to an alkaline solution.

상기 유기 용매로는 에탄올, 이소프로필알콜, 아세톤이 사용될 수 있으며, 유기 용매면 이에 한정되지 않는다.The organic solvent may be ethanol, isopropyl alcohol, or acetone, and is not limited to an organic solvent.

도 3은 부착증진층이 형성된 기재상에 금속 패턴을 형성하는 과정을 나타낸 도이다. 구체적으로, 기재상에 제1 및 제2 부착증진층을 형성한 후, 제1 부착증진층 상에 금속층을 형성한 후, 에칭 레지스트 패턴을 형성하고 이를 선택적으로 에칭하여 금속 패턴을 형성하는 과정을 나타낸 도이다.3 is a view showing a process of forming a metal pattern on a substrate having an adhesion promoting layer formed thereon. Specifically, a process for forming a metal pattern by forming first and second adhesion enhancing layers on a substrate, forming a metal layer on the first adhesion enhancing layer, forming an etching resist pattern, and selectively etching the metal layer to form a metal pattern Fig.

본 출원의 일 실시상태에 따른 제조방법에 있어서, 상기 제1 점착층을 금속 패턴이 구비된 기재로부터 박리 공정하는 단계를 더 포함하는 금속 패턴 필름의 제조방법을 제공한다.According to an embodiment of the present invention, there is provided a method of manufacturing a metal pattern film, further comprising a step of peeling the first adhesive layer from a base material having a metal pattern.

도 2는 본원 발명에 따른 금속 패턴 필름의 박리과정을 나타낸 것이다. 구체적으로, 제1 및 제2 점착층을 금속패턴이 구비된 기재로부터 박리하는 과정으로, 점착층과 패턴 필름을 물리적인 힘으로 박리하는 과정을 나타낸 것이다.FIG. 2 illustrates a peeling process of the metal pattern film according to the present invention. Specifically, the process of separating the adhesive layer and the pattern film by physical force in the process of peeling the first and second adhesive layers from the substrate having the metal pattern is shown.

제1 점착층을 기재에 합지할 때, 기포 발생, 이물 유입, 기재 구겨짐 등의 불량이 발생할 수 있으며, 제1 점착층 또는 금속 패턴이 구비된 기재를 재사용하기 위하여 상기 박리 공정이 진행 될 수 있고, 이때 상기 제1 및 제2 부착 증진층을 사용함으로서 스틱(STICK)-슬립(SLIP)현상을 방지하여 제1 점착층과 금속 패턴 기재가 손상을 방지해 자원 재활용 및 생산원가 절감이 가능한 장점을 갖는다.When the first adhesive layer is laminated to the substrate, defects such as bubble generation, foreign matter inflow, wrinkling of the substrate may occur, and the peeling process may be carried out to reuse the substrate having the first adhesive layer or the metal pattern , The first and second adhesion promoting layers are used to prevent the sticking-slip phenomenon, thereby preventing the first adhesive layer and the metal pattern substrate from being damaged, thereby enabling recycling of resources and cost reduction .

상기 제1 점착층과 금속패턴이 구비된 기재를 박리 공정하는 단계에 있어서, 본 출원의 일 실시상태에 따른 부착증진층을 사용함으로써, 스틱(STICK)-슬립(SLIP)현상이 현저하게 감소된 금속 패턴 필름을 제조할 수 있었다.By using the adhesion enhancement layer according to one embodiment of the present application in the step of peeling the base material having the metal pattern on the first adhesive layer, sticking-slip (SLIP) phenomenon is remarkably reduced A metal pattern film can be produced.

도 1은 상기 금속 패턴 필름의 적층 구조를 예시한 것이다. 종래에는 기재상에 전도성 발열 패턴을 형성하고 점착층을 형성하는 방법이 사용되었지만, 본 발명에 따르면 기재상 부착증진층을 더 포함함으로써, 스틱(STICK)-슬립(SLIP)현상이 현저하게 감소시킬 수 있었다.FIG. 1 illustrates a laminated structure of the metal pattern film. Conventionally, a method of forming a conductive heating pattern on a substrate and forming an adhesive layer has been used. However, according to the present invention, by further including the substrate adhesion enhancement layer, sticking-slip (SLIP) I could.

이하, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 본 발명의 실시예에 대하여 상세히 설명한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다.Hereinafter, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

본 발명의 일 실시상태에 따른 금속 패턴 필름의 실시예 및 비교예를 하기 표 1에 기재하였다.Examples and Comparative Examples of the metal pattern film according to one embodiment of the present invention are shown in Table 1 below.

실시예. 1Examples. One

50㎛ 두께의 PET(polyethylene terephthalate) 상에 E-beam sputter 설비를 사용해 기상증착 공정을 통하여 부착증진층으로 16nm의 ITO를 PET상에 증착시켰다. 이 후, ITO층 상에 도금을 통하여 Cu층을 형성한 후, 인쇄공정을 통하여 에칭 레지스트 패턴을 형성하였다. 에칭 레지스트 패턴이 형성된 금속층을 선택적으로 에칭하여 금속 패턴을 형성한 후, 금속 패턴의 상부에 잔류하는 에칭 레지스트를 1.0 wt% 농도의 수산화나트륨 수용액을 통하여 제거하였다. 이 후 점착층으로 PVB를 140℃ 에서 30분 동안 진공과 함께 라미네이션(Lamination)하여 금속 패턴 필름을 제작하였다.A 16 nm thick ITO was deposited on the PET as an adhesion promoting layer through a vapor deposition process using an E-beam sputtering apparatus on PET (polyethylene terephthalate) of 50 μm thickness. Thereafter, a Cu layer was formed on the ITO layer through plating, and then an etching resist pattern was formed through a printing process. The metal layer on which the etching resist pattern was formed was selectively etched to form a metal pattern, and then the etching resist remaining on the metal pattern was removed through a 1.0 wt% aqueous solution of sodium hydroxide. Thereafter, the PVB was laminated with a vacuum at 140 캜 for 30 minutes as an adhesive layer to fabricate a metal pattern film.

실시예. 2 내지 4Examples. 2 to 4

부착증진층으로 하기 표 1의 물질을 사용한 것을 제외하고는 실시예 1과 동일한 방법으로 실시예 2 내지 4의 금속 패턴 필름을 제작하였다.The metal pattern films of Examples 2 to 4 were prepared in the same manner as in Example 1, except that the material of Table 1 was used as the adhesion enhancing layer.

비교예. 1 내지 13Comparative Example. 1 to 13

PET(polyethylene terephthalate) 대신 하기 표 1에 기재된 필름 제조 업체들로부터 수급한 PET 필름을 사용하였으며, 부착증진층을 사용하지 않은 것을 제외하고는 실시예 1과 동일한 방법으로 비교예 1 내지 13의 금속 패턴 필름을 제작하였다. 하기 표 1의 기재는 다양한 필름 업체들로부터 수급한 PET 필름의 grade 명칭이다.PET films supplied from the film manufacturers described in the following Table 1 were used instead of PET (polyethylene terephthalate), and in the same manner as in Example 1 except that the adhesion promoting layer was not used, A film was produced. Table 1 below shows the grade names of PET films received from various film manufacturers.

PET 제조사(grade 명)PET manufacturer (grade name) 부착증진층(nm)Adhesion enhancement layer (nm) 두께(㎛)Thickness (㎛) Avg, 90 peel strength(N/cm)Avg, 90 peel strength (N / cm) Max, 90 peel strength(N/cm)Max, 90 peel strength (N / cm) Stick/ SLIPStick / SLIP 실시예 1Example 1 Toray(XG7PH2)Toray (XG7PH2) ITO(16)ITO (16) 5050 15.3015.30 >20> 20 XX 실시예 2Example 2 Toray(XG7PH2)Toray (XG7PH2) SiO2(12)SiO 2 (12) 5050 >20> 20 >20> 20 XX 실시예 3Example 3 Toray(XG7PH2)Toray (XG7PH2) Al2O3(8)Al 2 O 3 (8) 5050 17.9517.95 >20> 20 XX 실시예 4Example 4 Toray(XG7PH2)Toray (XG7PH2) NbOx(5)NbOx (5) 5050 >20> 20 >20> 20 XX 비교예 1Comparative Example 1 SKC(TH34)SKC (TH34) XX 2020 2.452.45 7.17.1 OO 비교예 2Comparative Example 2 Teijin DuPont(KEL86W)Teijin DuPont (KEL86W) XX 5050 0.800.80 2.872.87 OO 비교예 3Comparative Example 3 Teijin DuPont(HPE)Teijin DuPont (HPE) XX 3838 0.250.25 0.530.53 OO 비교예 4Comparative Example 4 Teijin DuPont(G2P2)Teijin DuPont (G2P2) XX 3838 0.160.16 0.250.25 OO 비교예 5Comparative Example 5 Teijin DuPont(G2PZ)Teijin DuPont (G2PZ) XX 3838 1.301.30 5.365.36 OO 비교예 6Comparative Example 6 Mitsubishi(O300E188W53B2)Mitsubishi (O300E188W53B2) XX 188188 0.950.95 11.811.8 OO 비교예 7Comparative Example 7 Mitsubishi(T604E50E92)Mitsubishi (T604E50E92) XX 5050 0.580.58 3.63.6 OO 비교예 8Comparative Example 8 Mitsubishi(T604E50M12)Mitsubishi (T604E50M12) XX 5050 2.302.30 6.86.8 OO 비교예 9Comparative Example 9 Toray(XD592)Toray (XD592) XX 7575 3.793.79 18.018.0 OO 비교예 10Comparative Example 10 Toray(U48)Toray (U48) XX 5050 2.622.62 13.013.0 OO 비교예 11Comparative Example 11 Toray(XG7PH2)Toray (XG7PH2) XX 5050 4.154.15 15.4115.41 OO 비교예 12Comparative Example 12 LGC primer coating PET
(전면)LGC primer coating PET
(Front) XX 5050 4.074.07 15.0415.04 OO 비교예 13Comparative Example 13 LGC primer coating PET
(배면)LGC primer coating PET
(Back) XX 5050 1.901.90 5.275.27 OO

상기 표 1에서는 본원 발명에 따른 부착증진층의 유무에 따라, 무기산화물을 증착한 PET와 PVB를 열 압착한 실시예 1 내지 4는 무기산화물층을 증착하지 않은 비교예 1 내지 13에 비하여, 박리 평가결과 스틱(STICK)/슬립(SLIP)현상이 발생하지 않음을 확인할 수 있었다.In the above Table 1, Examples 1 to 4, in which PET and PVB were thermally bonded with each other according to the presence or absence of the adhesion promoting layer according to the present invention, compared with Comparative Examples 1 to 13 in which the inorganic oxide layer was not deposited, As a result of the evaluation, it was confirmed that stick / slip phenomenon did not occur.

상기 스틱(STICK)/슬립(SLIP)현상의 유무는 목시 관찰 및 박리력 측정 그래프의 형태에 따라 판단된다.The presence or absence of the stick / slip phenomenon is determined according to the shape of the visual observation and peeling force measurement graph.

상기 표 1에서 기재 간 박리력을 측정하는 방법 중, 부착면과 박리되는 면이 수직을 유지하며 일정한 속도로 박리시키기 위한 힘을 측정하는 방법인 90 deg. Peel strength test에 따른 평균적인 힘을 Avg, 90 peel strength(N/cm)로, 최대값을 Max, 90 peel strength(N/cm)로 표시하였다. 상기 Peel strength test의 측정 수치는 기재와 제1 점착층 사이의 밀착력 및 스틱/슬립 현상 방지 효과를 확인할 수 있는 데이터이며, 측정 장치로 Texture analyzer(TA XT Plus)를 사용하였다.In Table 1, among the methods of measuring the peeling force between the substrates, a method of measuring the force for peeling at a constant rate while keeping the surface perpendicular to the surface to be peeled is 90 deg. Peel strength test was carried out with the average force of 90 peel strength (N / cm) and the maximum value of 90 peel strength (N / cm). The measurement value of the peel strength test was data which can confirm the adhesion between the substrate and the first adhesive layer and the effect of preventing the stick / slip phenomenon, and a texture analyzer (TA XT Plus) was used as a measuring device.

상기 표 1에서 실시예 1 내지 4는, 무기산화물층을 증착하지 않은 비교예 1 내지 13에 비하여 상기 제1 점착층을 금속 패턴이 구비된 기재로부터 박리시키기 위한 평균적인 힘 및 최대값이 모두 증가했음을 확인할 수 있었다.In Examples 1 to 4 in Table 1, the average force and the maximum value for peeling the first adhesive layer from the substrate having the metal pattern were increased as compared with Comparative Examples 1 to 13 in which the inorganic oxide layer was not deposited .

상기와 같은 수치를 통하여, 본 발명의 부착증진층을 사용함으로써, 제1 점착층과 기재 사이의 밀착력이 증가하였음을 확인할 수 있었다.Through the above-mentioned numerical values, it was confirmed that the adhesion between the first adhesive layer and the substrate was increased by using the adhesion promoting layer of the present invention.

도 4는 본 출원의 일 실시상태에 따른 금속 패턴 필름의 박리력을 측정한 그래프이다. 구체적으로 부착증진층은 실시예 1과 같이 ITO를 사용하였으며 이에 따른 peel strength를 측정한 그래프이다. 부착증진층이 적용된 경우 그래프의 형태가 부착증진층이 적용되지 않은 경우보다 완만함을 확인할 수 있으며, 이는 스틱(STICK)/슬립(SLIP)현상이 발생하지 않음을 나타내고, peel strength의 세기를 통하여, 밀착력 또한 증가하였음을 확인할 수 있었다.4 is a graph showing the peeling force of the metal pattern film according to one embodiment of the present application. Specifically, the adhesion enhancement layer used in Example 1 was ITO, and the peel strength was measured. When the adhesion enhancement layer is applied, the shape of the graph is more gradual than when the adhesion enhancement layer is not applied. This indicates that stick / slip phenomenon does not occur, and through the strength of peel strength, And adhesion was also increased.

하기 표 2로부터 금속 패턴 필름의 부착증진층 및 점착층으로 NbOx(5nm)/PET(100㎛)를 사용한 경우에 있어, 다양한 종류의 산을 본원 발명의 금속 패턴 필름에 적용한 경우의 금속 패턴 필름의 손상여부를 확인할 수 있다. 하기 표 2에서 알 수 있듯, 다양한 종류의 산에 의해 NbOx층의 손상이 없어 여전히 스틱(STICK)/슬립(SLIP)현상이 발생하지 않음을 확인할 수 있었다.The following Table 2 shows that when NbOx (5 nm) / PET (100 m) is used as the adhesion enhancement layer and adhesive layer of the metal pattern film, various kinds of acid are applied to the metal pattern film of the present invention You can check if it is damaged. As can be seen from the following Table 2, it was confirmed that stick / slip (SLIP) did not occur due to no damage of the NbO x layer due to various kinds of acids.

Avg, 90 peel strength(N/cm)Avg, 90 peel strength (N / cm) Max, 90 peel strength(N/cm)Max, 90 peel strength (N / cm) Stick/ SLIPStick / SLIP 약품처리 XChemical processing X >20> 20 >20> 20 XX 인질초Hostile second >20> 20 >20> 20 XX 황산과수Sulfuric acid and water >20> 20 >20> 20 XX 염화철Ferric chloride >20> 20 >20> 20 XX 고객사 PETCustomer PET 6.126.12 7.137.13 XX

하기 표 3에서는 부착증진층 없이 형성된 금속 시드 필름 상에 전해도금 시, 금속층의 응집력 상승에 의해 금속층-기재간 부착력이 저하되기 때문에 일반적으로 20nm 이상의 NiCr을 금속층 하부에 형성하여 금속층과 기재 간 부착력을 유지하나, NbOx 등 부착증진층이 도입되면 도금 후 금속층-기재 간 부착력이 향상됨을 확인할 수 있으며, 특히 Nb2Ox를 단독으로 적용 시, 광특성이 가장 우수함을 확인할 수 있었다.In the following Table 3, when the metal seed film formed without the adhesion promoting layer is electroplated, the adhesion force between the metal layer and the substrate is lowered due to the increase of the cohesive strength of the metal layer. Therefore, NiCr of 20 nm or more is generally formed below the metal layer, However, when the adhesion promoting layer such as NbOx was introduced, it was confirmed that the adhesion between the metal layer and the substrate was improved after plating, and especially when Nb 2 Ox alone was applied, it was confirmed that the optical characteristics were the best.

기재 상에 형성된 박막과 기재 간 밀착력을 간단하게 측정하는 방법으로 Cross-cut test를 사용하였으며, 이는 박막 표면에 1 mm 간격으로 가로 세로 10회 씩 칼집을 내서 100개의 cell을 형성한 후, 박막 위에 점착 테이프(일반적으로 ichiban tape를 사용)를 붙였다 떼어낼 때 얼마나 기재 상에 박막이 붙어 있는지 확인하여 기재간 밀착력을 평가하는 방법이다.The cross-cut test was used to measure the adhesion between the substrate and the thin film formed on the substrate. The cross-cut test was performed on the thin film surface, It is a method of evaluating the adhesion between substrates by confirming how thin a film is on the substrate when the adhesive tape (generally using ichiban tape) is attached and detached.

측정 기준으로, 95~100 % 박막이 남아 있다면 5B라 표현하며 박막이 기재 상에 유지되는 정도가 적어질수록 표현하는 숫자가 낮아지며(4B~0B) 이는 밀착력이 떨어진다는 의미이다. 하기 표 3에서는 도금한 금속층과 기재 사이의 Cross-cut test에서 5B 수준으로 확인된 결과에 대해 OK(5B)로 기재하였다.As a measurement criterion, if 95 to 100% of the thin film is left, it is expressed as 5B. As the thin film is kept on the substrate, the number to be expressed becomes lower (4B to 0B), which means that the adhesion is lowered. In Table 3 below, OK (5B) is described as the result of the cross-cut test between the plated metal layer and the substrate at 5B level.

하기 표 3에서 알 수 있듯, 중간층이 적용되지 않은 경우, 도금 후 금속층- 필름간 부착력이 좋지 않음(NG)을 확인할 수 있으며, 또한 도금층 제거후 필름-PVB 부착력이 좋지 않음을 확인(NG)할 수 있으며, 무기산화물 중간층, 합금 중간층 및 합금+무기산화물 중간층이 적용된 경우, 부착력이 좋아졌음을 확인할 수 있다.As can be seen from Table 3 below, when the intermediate layer is not applied, it can be confirmed that the adhesion between the metal layer and the film is not good (NG) after plating, and that the adhesion of the film-PVB after the removal of the plating layer is not good (NG) And it can be confirmed that the adhesion is improved when the inorganic oxide intermediate layer, the alloy intermediate layer and the alloy + inorganic oxide intermediate layer are applied.

하기 표 3에서 면저항은 접촉식 면저항 측정기(4-point probe)를 이용하였으며, 투과도는 COH-400 투과율 측정기(D65/10)을 사용하였다.In Table 3, the sheet resistance was measured using a contact-type 4-point probe and a COH-400 permeability meter (D65 / 10) was used.

구분division 중간층 적용 XMiddle layer application X 무기산화물 중간층Inorganic oxide intermediate layer 합금 중간층Alloy middle layer 합금+무기산화물 중간층Alloy + inorganic oxide middle layer 금속 증착 필름 구조Metallized film structure PET/CuPET / Cu PET/Nb2Ox/CuPET / Nb 2 Ox / Cu PET/NiCr/CuPET / NiCr / Cu PET/NiCr/Nb2Ox/CuPET / NiCr / Nb 2 Ox / Cu 도금 전 Before plating 면저항
(Ω/ㅁ)Sheet resistance
(Ω / ㅁ) 0.20.2 0.20.2 0.20.2 0.20.2 금속층-필름 간 부착력Adhesion between metal layer and film OK(5B)OK (5B) OK(5B)OK (5B) OK(5B)OK (5B) OK(5B)OK (5B) 도금 후After plating 면저항
(Ω/ㅁ)Sheet resistance
(Ω / ㅁ) 0.010.01 0.010.01 0.010.01 0.010.01 금속층-필름 간 부착력Adhesion between metal layer and film NGNG OK(5B)OK (5B) OK(5B)OK (5B) OK(5B)OK (5B) 도금층 제거 후After removing the plating layer 투과도(%)Permeability (%) 90.0190.01 88.3788.37 86.8286.82 83.7583.75 산란도(%)Spawning rate (%) 1.091.09 1.551.55 1.121.12 1.211.21 필름-PVB 부착력
(90도 PEEL TEST)Film-PVB adhesion
(90 degree PEEL TEST) NG(~4 N/cm)NG (~ 4 N / cm) OK(>20N/cm)OK (> 20 N / cm) OK(~15 N/cm)OK (~ 15 N / cm) OK(>20 N/cm)OK (> 20 N / cm)

10: 유리
20: 제1 점착층
30: 금속 패턴
40: 제1 부착증진층
50: 기재
60: 제2 부착증진층
70: 제2 점착층
80: 유리
90: 금속층
100: 에칭 레지스트 패턴10: Glass
20: first adhesive layer
30: metal pattern
40: first adhesion promoting layer
50: substrate
60: Second adhesion enhancement layer
70: Second adhesive layer
80: Glass
90: metal layer
100: etching resist pattern

Claims (14)

기재;
상기 기재의 양면에 각각 구비된 제1 부착증진층 및 제2 부착증진층;
상기 제1 부착증진층의 상기 기재에 접하는 면의 반대면에 구비된 금속 패턴;
상기 제1 부착증진층의 상기 금속 패턴이 구비된 면 상에 상기 금속 패턴을 덮도록 구비된 제1 점착층; 및
상기 제2 부착증진층의 상기 기재에 접하는 면의 반대 면에 구비된 제2 점착층을 포함하며,
상기 제1 부착증진층 및 제2 부착증진층은 무기산화물을 포함하는 금속 패턴 필름.materials;
A first adhesion enhancing layer and a second adhesion enhancing layer provided on both sides of the substrate;
A metal pattern provided on an opposite surface of the first adhesion promoting layer to the substrate;
A first adhesive layer provided on the surface of the first adhesion promoting layer provided with the metal pattern so as to cover the metal pattern; And
And a second adhesive layer provided on an opposite surface of the second adhesion promoting layer to the substrate,
Wherein the first adhesion promoting layer and the second adhesion enhancing layer comprise inorganic oxides. 청구항 1에 있어서, 상기 제1 및 제2 부착증진층은 네오븀 옥사이드, 산화알루미늄, 산화규소, 산화아연, 산화네오븀, 산화주석, 산화지르코늄 및 산화인듐주석으로 이루어진 군에서 선택되는 1 이상을 포함하는 금속 패턴 필름.[Claim 4] The method of claim 1, wherein the first and second adhesion promoting layers comprise at least one selected from the group consisting of neobinary oxide, aluminum oxide, silicon oxide, zinc oxide, nebium oxide, tin oxide, zirconium oxide, Includes a metal pattern film. 청구항 1에 있어서, 상기 제1 및 제2 부착증진층의 각각의 두께는 0.1nm 이상 30nm 이하인 것을 특징으로 하는 금속 패턴 필름.The metal pattern film according to claim 1, wherein the thickness of each of the first and second adhesion promoting layers is 0.1 nm or more and 30 nm or less. 청구항 1에 있어서, 상기 금속 패턴은 알루미늄, 구리, 니켈, 크롬, 금, 은 및 백금으로 이루어진 군에서 선택되는 1 이상을 포함하는 금속 패턴 필름.The metal pattern film according to claim 1, wherein the metal pattern comprises at least one selected from the group consisting of aluminum, copper, nickel, chromium, gold, silver and platinum. 청구항 1에 있어서, 상기 금속 패턴의 선고는 10㎛ 이하인 것을 특징으로 하는 금속 패턴 필름.The metal pattern film according to claim 1, wherein the metal pattern has a thickness of 10 μm or less. 청구항 1에 있어서, 상기 금속 패턴의 선고의 편차는 20% 이내인 것을 특징으로 하는 금속 패턴 필름.The metal pattern film according to claim 1, wherein the deviation of the surface roughness of the metal pattern is within 20%. 청구항 1에 있어서, 상기 제1 및 제2 점착층은 PVB(polyvinylbutyral), EVA(ethylene vinyl acetate), PU(polyurethane), 또는 PO(Polyolefin)를 포함하는 것을 특징으로 하는 금속 패턴 필름.The metal pattern film according to claim 1, wherein the first and second adhesive layers comprise polyvinylbutyral (PVB), ethylene vinyl acetate (EVA), polyurethane (PU), or polyolefin (PO). 청구항 1에 있어서, 상기 제1 및 제2 점착층은 PVB(polyvinylbutyral)층인 것인 금속 패턴 필름.The metal pattern film according to claim 1, wherein the first and second adhesive layers are PVB (polyvinylbutyral) layers. 청구항 1에 있어서, 상기 제1 및 제2 점착층의 각각의 두께는 1㎛ 이상 1000㎛ 이하인 것을 특징으로 하는 금속 패턴 필름.The metal pattern film according to claim 1, wherein each of the first and second adhesive layers has a thickness of 1 탆 to 1000 탆. 청구항 1 내지 9 중 어느 한 항에 따른 금속 패턴 필름을 포함하는 접합 유리.A laminated glass comprising the metal pattern film according to any one of claims 1 to 9. 기재를 준비하는 단계;
상기 기재의 양면에 각각 제1 부착증진층 및 제2 부착증진층을 형성하는 단계;
상기 제1 부착증진층의 상기 기재에 접하는 면의 반대면에 금속 패턴을 패터닝하여 금속 패턴을 형성하는 단계;
상기 제1 부착증진층의 상기 금속 패턴이 구비된 면 상에 상기 금속 패턴을 덮도록 제1 점착층을 형성하는 단계; 및
상기 제2 부착증진층의 상기 기재에 접하는 면의 반대 면에 제2 점착층을 형성하는 단계를 포함하며,
상기 제1 부착증진층 및 제2 부착증진층은 무기산화물을 포함하는 것인 청구항 1 내지 9 중 어느 한 항에 따른 금속 패턴 필름의 제조방법.Preparing a substrate;
Forming a first adhesion promoting layer and a second adhesion enhancing layer on both sides of the substrate;
Forming a metal pattern by patterning a metal pattern on a surface of the first adhesion promoting layer opposite to the surface in contact with the substrate;
Forming a first adhesive layer on the surface of the first adhesion promoting layer on which the metal pattern is provided so as to cover the metal pattern; And
And forming a second adhesive layer on a side of the second adhesion promoting layer opposite to the side in contact with the substrate,
The method of manufacturing a metal pattern film according to any one of claims 1 to 9, wherein the first adhesion promoting layer and the second adhesion promoting layer comprise an inorganic oxide. 청구항 11에 있어서, 상기 금속 패턴을 형성하는 단계는
금속층을 형성하는 단계; 및
상기 금속층을 패터닝하여 금속 패턴을 형성하는 단계를 포함하는 것인 금속 패턴 필름의 제조방법.12. The method of claim 11, wherein forming the metal pattern comprises:
Forming a metal layer; And
And patterning the metal layer to form a metal pattern. 청구항 12에 있어서, 상기 금속층을 패터닝하여 금속 패턴을 형성하는 단계는 상기 금속층 상에 에칭 레지스트 패턴을 형성한 후, 에칭 레지스트 패턴에 의하여 덮여 있지 않은 금속층을 제거함으로써 수행되는 것인 금속 패턴 필름의 제조방법.[12] The method of claim 12, wherein forming the metal pattern by patterning the metal layer is performed by forming an etching resist pattern on the metal layer, and then removing the metal layer not covered with the etching resist pattern. Way. 청구항 11에 있어서, 상기 제1 점착층을 금속 패턴이 구비된 기재로부터 박리 공정하는 단계를 더 포함하는 금속 패턴 필름의 제조방법.The method of manufacturing a metal pattern film according to claim 11, further comprising a step of peeling the first adhesive layer from a substrate provided with a metal pattern.
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