JP5822132B2 - LAMINATE AND CONDUCTIVE PATTERN FILM MANUFACTURING METHOD - Google Patents

Description

  The present invention relates to a laminate including a base film and a light-shielding conductive layer that is provided on both sides of the base film and has light-shielding properties and conductivity. Moreover, this invention relates to the conductive pattern film manufacturing method which manufactures the conductive pattern film in which the conductive pattern was provided on the base film using a laminated body.

  In recent years, various thin electronic devices such as a touch panel device, an organic EL display device, a liquid crystal display device, and electronic paper have been put into practical use. A thin electronic device is generally produced by providing an optical element or a conductive pattern on a substrate such as glass or film.

  As one of the specific methods for manufacturing a thin electronic device, first, a substrate and a plurality of layers provided on the substrate and made of various materials for realizing the function of the electronic device are included. A method using a laminate is known. In this case, an electronic device is manufactured by patterning each layer of the laminated body into a desired pattern by etching or the like. For example, in Patent Document 1, first, a transparent base film, a transparent conductive layer and a metal layer provided on one side of the base film, a transparent conductive layer provided on the other side of the base film, and A laminate having a metal layer is prepared. Next, each transparent conductive layer and metal layer are partially etched using a predetermined etching solution. As a result, a touch panel sensor formed on the base film in a predetermined pattern and including a transparent conductive pattern made of a transparent conductive material and a light-shielding conductive pattern connected to the transparent conductive pattern and made of a metal material is manufactured. .

JP 2010-238052 A

  In order to realize easy handling of electronic devices and manufacturing processes, a film containing a synthetic resin having flexibility may be used as a base material. A laminated body manufactured using a flexible film as a base is generally manufactured and stored as a wound body wound up in a roll shape. By the way, when the layer located in the outermost side among each layer provided in the both sides of a laminated body is a metal layer, the metal layers of the laminated body adjacent to each other in the wound body are fused (attached). In other words, it is known that a so-called blocking phenomenon occurs. When the blocking phenomenon occurs, there arises a problem that the developability of the laminate is deteriorated and the workability is lowered, and a problem that the mark of the adhered portion remains in the metal layer of the laminate.

  In order to prevent the blocking phenomenon, it is known to insert a film having low adhesiveness between adjacent laminates when winding the laminate. However, in this case, a mechanism for inserting a film when winding the laminate, a mechanism for removing the film when developing the laminate, and the like are additionally required.

  An object of the present invention is to provide a laminate capable of effectively solving such problems, and capable of suppressing the occurrence of a blocking phenomenon.

  The present invention includes a base film, a first light-shielding conductive layer provided on one side of the base film, having light-shielding properties and conductivity, and provided on the other side of the base film. The second light-shielding conductive layer having conductivity and provided on at least one of one side of the first light-shielding conductive layer or the other side of the second light-shielding conductive layer and made of a conductive oxide material in an amorphous state. And an amorphous layer.

  In the laminate according to the present invention, the amorphous layer may be provided on either one side of the first light-shielding conductive layer and the other side of the second light-shielding conductive layer.

  In the laminate according to the present invention, at least one between the base film and the first light-shielding conductive layer or between the base film and the second light-shielding conductive layer is translucent and conductive. A transparent conductive layer having properties may be provided.

  In the laminated body according to the present invention, the amorphous layer is removed at the same time when the first light-shielding conductive layer or the second light-shielding conductive layer on the transparent conductive layer is partially removed using a predetermined etching solution. You may be comprised so that.

  In the laminate according to the present invention, both the transparent conductive layer and the amorphous layer may be made of a conductive oxide material containing indium.

  In the laminate according to the present invention, the first light-shielding conductive layer and the second light-shielding conductive layer are preferably composed of at least one of silver, copper, aluminum, or an alloy thereof.

  The present invention includes a base film, a first light-shielding conductive layer provided on one side of the base film, having light-shielding properties and conductivity, and provided on the other side of the base film. One side of a laminate having a second light-shielding conductive layer having conductivity and a first amorphous layer provided on one side of the first light-shielding conductive layer and made of an amorphous conductive oxide material Forming a photosensitive first photosensitive layer and forming a photosensitive second photosensitive layer on the other surface of the laminate, and disposing a first mask on the first photosensitive layer. And exposing the first photosensitive layer and the second photosensitive layer in different patterns with the second mask disposed on the second photosensitive layer, and the first photosensitive layer and the second photosensitive layer. Developing and patterning and patterning Etching the first amorphous layer and the first light-shielding conductive layer using the patterned first photosensitive layer as a mask, and etching the second light-shielding conductive layer using the patterned second photosensitive layer as a mask It is a manufacturing method of the conductive pattern film characterized by including the process and the process of removing the said patterned 1st photosensitive layer and said 2nd photosensitive layer.

In the manufacturing method of the conductive pattern film by this invention, the said laminated body is provided between the said base film and the said 1st light shielding conductive layer, The 1st transparent conductive layer which has translucency and electroconductivity, A second transparent conductive layer provided between the base film and the second light-shielding conductive layer and having translucency and conductivity may further be included. In this case, in the first patterning step, the first transparent conductive layer is further etched using the patterned first photosensitive layer as a mask, and the second transparent conductive layer is used using the patterned second photosensitive layer as a mask. Is further etched. In this case, the manufacturing method of the conductive pattern film partially removes the first light-shielding conductive layer on the first transparent conductive layer by using a predetermined etching solution after the first patterning step. A second patterning step for removing the first amorphous layer on the first light-shielding conductive layer may be further provided.

  According to the present invention, an amorphous layer made of a conductive oxide material in an amorphous state is provided on at least one side of the first light-shielding conductive layer or the other side of the second light-shielding conductive layer of the laminate. Is provided. For this reason, when a laminated body is manufactured and stored as a wound body wound up in a roll shape, the light-shielding conductive layer of one laminated body is in contact with the light-shielding conductive layer of the laminated body adjacent to the one laminated body. There is nothing. For this reason, it can suppress that a blocking phenomenon arises.

FIG. 1 is a cross-sectional view showing a laminate in an embodiment of the present invention. FIG. 2 is a view showing a laminate manufacturing apparatus for manufacturing a laminate. FIG. 3 is a view showing an unwinding device of the laminate manufacturing apparatus shown in FIG. 2. 4 is a view showing a film forming apparatus of the laminate manufacturing apparatus shown in FIG. FIG. 5 is a view showing a winding device of the laminate manufacturing apparatus shown in FIG. 2. FIGS. 6A and 6B are diagrams showing an example of a touch panel sensor manufactured from the stacked body according to the embodiment of the present invention. FIG. 7 is a flowchart illustrating a method for manufacturing a touch panel sensor. FIGS. 8A to 8F are diagrams showing a manufacturing process of the touch panel sensor. FIG. 9 is a view showing a modification of the film forming apparatus. FIG. 10 is a cross-sectional view illustrating a modified example of the laminated body. FIG. 11 is a cross-sectional view showing a modified example of the laminate. FIG. 12 is a cross-sectional view showing a modified example of the laminate. FIG. 13 is a cross-sectional view showing a modified example of the laminate.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. First, the laminated body 10 in this Embodiment is demonstrated using FIG.

As shown in FIG. 1, the laminate 10 includes a base film 11, a first transparent conductive layer 21 provided on the surface of one side of the base film 11, and a first transparent conductive layer 21. The first light-shielding conductive layer 22 provided on the surface on one side, the first amorphous layer 23 provided on the surface on one side of the first light-shielding conductive layer 22, and the other side of the base film 11 The second transparent conductive layer 31 provided on the surface of the second transparent conductive layer 31, the second light-shielding conductive layer 32 provided on the surface of the other side of the second transparent conductive layer 31, and the other side of the second light-shielding conductive layer 32 And a second amorphous layer 33 provided on the surface.

  Hereinafter, each layer which comprises the laminated body 10 is demonstrated.

(Base film)
First, the base film 11 will be described. The base film 11 serves as a base when the laminate 10 is manufactured, and has a synthetic resin layer 12 as shown in FIG. As a material of the synthetic resin layer 12, a material having transparency and flexibility is used, and for example, a synthetic resin (plastic) is used. Examples of synthetic resins include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), cycloolefin polymer (COP), cyclic olefin copolymer (COC), polycarbonate (PC), polyimide (PI), and triacetyl cellulose (TAC). Or a resin having flexibility and transparency, such as polymethyl methacrylate (PMMA), etc. The thickness of the synthetic resin layer 12 is in the range of 25 to 200 μm, for example.

  The base film 11 includes a first hard coat layer 13 provided on one surface of the synthetic resin layer 12 and a second hard coat layer 14 provided on the other surface of the synthetic resin layer 32. And may further have. By providing the first hard coat layer 13 and the second hard coat layer 14, the scratch resistance of the base film 11 against scratches and the like can be enhanced. As a material constituting the hard coat layers 13 and 14, for example, an acrylic resin is used.

(Transparent conductive layer)
The transparent conductive layers 21 and 31 are layers configured to have translucency and conductivity. As a material constituting the transparent conductive layers 21 and 31, a transparent conductive material having conductivity and exhibiting translucency is used. For example, indium tin oxide (ITO), zinc oxide, indium oxide, antimony added Metals such as tin oxide, fluorine-added tin oxide, aluminum-added zinc oxide, potassium-added zinc oxide, silicon-added zinc oxide, zinc oxide-tin oxide, indium oxide-tin oxide, zinc oxide-indium oxide-magnesium oxide An oxide is used. The thickness of the transparent conductive layers 21 and 31 is, for example, in the range of 18 to 50 nm. Preferably, the transparent conductive layers 21 and 31 are made of a transparent conductive material in a crystalline state.

(Light-shielding conductive layer)
The light shielding conductive layers 22 and 32 are layers configured to have light shielding properties and conductivity. As the material constituting the light-shielding conductive layers 22 and 32, a material having higher conductivity than the transparent conductive material constituting the transparent conductive layers 21 and 31 is used. For example, silver, copper or aluminum, or an alloy thereof The metal material which consists of at least 1 type of is used. Among these, the silver alloy has a smaller specific resistance than a molybdenum alloy or the like used as a material for a conductive pattern in a conventional general touch panel sensor, and is therefore preferable as a material for the light-shielding conductive layers 22 and 32. As an example of such a silver alloy, an APC alloy containing silver, palladium, and copper can be given. The thickness of the light-shielding conductive layers 22 and 32 is, for example, in the range of 100 to 400 nm.

(Amorphous layer)
The amorphous layers 23 and 33 are layers made of a conductive oxide material that has conductivity and is in an amorphous state. As the conductive oxide material constituting the amorphous layers 23 and 33, in the same manner as the transparent conductive material of the transparent conductive layers 21 and 31, indium tin oxide (ITO), zinc oxide, indium oxide, antimony-added oxidation Metal oxidation such as tin, fluorine-added tin oxide, aluminum-added zinc oxide, potassium-added zinc oxide, silicon-added zinc oxide, zinc oxide-tin oxide system, indium oxide-tin oxide system, zinc oxide-indium oxide-magnesium oxide system Things are used. The thickness of the amorphous layers 23 and 33 is in the range of 1 to 30 nm, for example, and is about 5 nm, for example.

  The transparent conductive layers 21 and 31 and the amorphous layers 23 and 33 may all be made of a conductive oxide material containing indium. For example, the transparent conductive layers 21 and 31 and the amorphous layers 23 and 33 may all be made of ITO. Further, the transparent conductive layers 21 and 31 and the amorphous layers 23 and 33 may be made of either ITO or IZO.

  As shown in FIG. 1, the amorphous layers 23 and 33 are layers constituting a surface on one side and a surface on the other side of the stacked body 10. That is, the amorphous layers 23 and 33 are located on the outermost surface of the stacked body 10. As a result of intensive studies by the present inventors, the outermost surface of the laminate 10 is constituted by the amorphous layers 23 and 33 as described above, so that the outermost surface of the laminate 10 is constituted by the light-shielding conductive layers 22 and 32. It has been found that the blocking phenomenon can be made less likely to occur than in the case. As the reason, for example, it is conceivable that the conductive oxide material in the amorphous state has higher heat dissipation than the metal material. In general, in a laminate formed by a vacuum film formation method such as vacuum deposition or sputtering, an annealing process is performed during or after the film formation process in order to control the crystal state of the material constituting each layer of the laminate. At this time, the laminate is heated. However, when the laminate is wound up in a state where the laminate is at a high temperature, adhesion (adhesion) between adjacent laminates tends to occur. Here, when the amorphous layers 23 and 33 having high heat dissipation are located on the outermost surface of the laminate 10 as in the present embodiment, the laminate 10 is wound up after the film forming process or the annealing process. In the meantime, the temperature of the outermost surface of the laminated body 10 can be sufficiently lowered. Thereby, it can suppress that a blocking phenomenon arises between adjacent laminated bodies.

  The reason why the blocking phenomenon is hardly caused by providing the amorphous layers 23 and 33 is not limited to the high heat dissipation in the amorphous layers 23 and 33. Other characteristics different from those of the light shielding conductive layers 22 and 32 included in the amorphous layers 23 and 33 may contribute to suppression of the blocking phenomenon. Therefore, even when the laminated body is not heated during the film forming process or the annealing process performed thereafter, the effect of suppressing the blocking phenomenon by providing the amorphous layers 23 and 33 can occur.

  The amorphous layers 23 and 33 according to the present embodiment can be defined from various viewpoints. For example, in the amorphous layers 23 and 33, the diffraction pattern obtained by X-ray analysis or electron beam analysis on the amorphous conductive oxide material constituting the amorphous layers 23 and 33 does not include a clear peak, a so-called halo. It can be defined by being a pattern. In this case, assuming that the maximum peak height (maximum diffraction intensity) of the diffraction pattern when the conductive oxide material is in a crystalline state is 1, the conductive oxidation in an amorphous state measured under the same conditions The diffraction intensity at the position corresponding to the maximum peak in the diffraction pattern of the material is sufficiently smaller than 1, for example 0.5 or less. Alternatively, the amorphous layers 23 and 33 may be defined as layers made of a conductive oxide material and having low chemical resistance. In this case, the amorphous layers 23 and 33 are layers which dissolve within 5 minutes when exposed to an iron chloride-based or phosphonitrate-based etching solution.

  Next, the operation and effect of the present embodiment having such a configuration will be described. Here, the manufacturing method of the laminated body 10 is demonstrated with reference to FIG. 2 thru | or FIG. Next, a method for producing a conductive pattern film in which a conductive pattern having conductivity is provided on the substrate film 11 using the obtained laminate 10 will be described. Here, as an example, a method for manufacturing the touch panel sensor 80 will be described with reference to FIGS.

Manufacturing process Figure 2 the laminate is a diagram showing a laminate production apparatus 40 for producing a laminate 10. As shown in FIG. 2, the laminate manufacturing apparatus 40 is provided with an unwinding device 50 for unwinding the base film 11, and layers 21, 22, 23, 31, 32, 33 provided on the base film 11. A film forming device 60 for forming the film 11 and a winding device 70 for winding the laminated body 10 are provided. 3 to 5 are enlarged views of the unwinding device 50, the film forming device 60, and the winding device 70 of FIG.

(First unwinding process)
First, as shown in FIG. 2, the shaft 51 around which the base film 11 is wound is prepared in the unwinding device 50, and then the base film 11 is unwound toward the film forming device 60. At this time, the base film 11 is heated at 80 to 120 ° C. by the heating mechanism 52 including the heater 53, and the gas in the unwinding device 50 is discharged to the outside by the exhaust means 54. Thereby, impurities such as moisture and oil adhering to the base film 11 are removed.

(First film formation step)
Next, a first film forming step of providing a desired layer on one side of the base film 11 is performed by the film forming apparatus 60. Various methods such as vacuum deposition, sputtering, CVD, and ion plating can be adopted as a film forming method by the film forming apparatus 60. Here, an example in which sputtering is used as the film forming method will be described.

As shown in FIG. 4, the film forming apparatus 60 includes a film forming chamber 66 in which a film forming process is performed, a transfer drum 68 around which the base film 11 is wound, and a gas inside the film forming chamber 66. A vacuum exhaust mechanism 67 that discharges the substrate to the outside, and a target that is provided so as to face the substrate film 11 being conveyed and serves as a raw material for the layer provided on the substrate film 11. In the example shown in FIG. 4, as a target, in order from the first upstream side in the rotational direction R ₁ of the conveyance drum 68, a first target 61a made of a transparent conductive material, and a second target 62a made of a metal material, conductive And a third target 63a made of a conductive oxide material.

  In the first film forming step by the film forming apparatus 60, first, the base film 11 is wound around the transport drum 68. Next, atoms constituting each of the targets 61a, 62a, and 63a are attached to one side of the base film 11 by sputtering. As a result, the first transparent conductive layer 21, the first light shielding conductive layer 22, and the first amorphous layer 23 are sequentially provided on the surface on one side of the base film 11. At this time, the transport drum 68 may be configured to heat or cool the base film 11 to a temperature suitable for forming each layer. For example, the transport drum 68 may include a temperature adjusting means (not shown) for heating or cooling the base film 11 to −20 to 180 ° C. In addition, after the 1st film-forming process by the film-forming apparatus 60, the annealing process which heats each layer provided on the base film 11 and advances crystallization may be implemented.

  Here, when the first amorphous layer 23 is provided on one surface of the first light-shielding conductive layer 22 by sputtering, the film forming apparatus 60 is formed on the surface on one side of the first light-shielding conductive layer 22. The film forming conditions are controlled so that the conductive oxide material to be in an amorphous state. Specifically, the film formation atmosphere such as temperature and pressure in the third region 63 is adjusted. Thereby, the first amorphous layer 23 composed of a conductive oxide material in an amorphous state can be obtained.

  By the way, conventionally, it is known that the crystal state of the obtained conductive oxide material can be controlled by controlling the water vapor partial pressure in the film forming atmosphere in the film forming process of the conductive oxide material such as ITO. For example, when the partial pressure of water vapor during the film formation process is very small, a polycrystalline ITO layer composed of fine crystal grains can be obtained, and the obtained crystal grains increase as the partial pressure of water vapor increases. It has been known. Further, for example, as described in JP-A-2003-16858, it is known that an amorphous ITO layer can be obtained by further increasing the water vapor partial pressure during the film forming process.

  Also in this embodiment, the partial pressure of water vapor during the film formation process may be adjusted so that an amorphous conductive oxide material can be obtained. For example, as shown in FIG. 4, a water vapor supply unit 65 e that supplies water vapor to the atmosphere around the third target 63 a and the base film 11 in the third region 63 of the film forming apparatus 60, and the water vapor content of the third region 63 A measurement unit 65c that measures the pressure and a control unit 65d that controls the water vapor supply unit 65e based on the measurement result of the water vapor partial pressure by the measurement unit 65c may be provided. Thereby, the amorphous state can be realized more reliably.

  As shown in FIG. 4, in the first region 61 of the film forming apparatus 60, similarly to the third region 63, the water vapor supply unit 65 e that supplies water vapor to the atmosphere around the first target 61 a and the base film 11. And a measurement unit 65c that measures the partial pressure of water vapor in the first region 61, and a control unit 65d that controls the water vapor supply unit 65e based on the measurement result of the partial pressure of water vapor by the measurement unit 65c. . In this case, by adjusting the water vapor partial pressure in the first region 61, the first transparent conductive layer 21 made of a transparent conductive material containing crystal grains having a desired size can be obtained more reliably.

(First winding process)
Thereafter, in the winding device 70, the base film 11 provided with the first transparent conductive layer 21, the first light shielding conductive layer 22, and the first amorphous layer 23 on one side thereof is wound by the shaft 71.

(Second unwinding process)
Thereafter, the base film 11 provided with the first transparent conductive layer 21, the first light-shielding conductive layer 22, and the first amorphous layer 23 on one side thereof is again carried into the unwinding device 50, and then formed into a film. The base film 11 is unwound toward the device 60. At this time, the base film 11 is wound on the transport drum 68 in a state where the other side of the base film 11, that is, the side where the layer is not yet provided faces outward. Unwind toward.

(Second film formation step)
Next, the 2nd film-forming process which provides a desired layer on the other side of the base film 11 with the film-forming apparatus 60 is implemented. In the second film forming step, first, the base film 11 is wound around the transport drum 68. Next, the atoms constituting each of the targets 61a, 62a, 63a are attached to the other side of the base film 11 by sputtering. As a result, the second transparent conductive layer 31, the second light-shielding conductive layer 32, and the second amorphous layer 33 are sequentially provided on the surface on the other side of the base film 11. Since the specific method is the same as that in the case of the first film forming step described above, detailed description thereof is omitted.

(Second winding process)
Thereafter, in the winding device 70, the base film 11, the first transparent conductive layer 21, the first light-shielding conductive layer 22, the first amorphous layer 23 provided on one side of the base film 11, and the base film 11, the laminated body 10 including the second transparent conductive layer 31, the second light-shielding conductive layer 32, and the second amorphous layer 33 provided on the other side is wound up in a roll shape by the shaft 71.

  Here, according to this Embodiment, the outermost surface of the laminated body 10 is comprised by the amorphous layers 23 and 33 which have high heat dissipation. For this reason, the temperature of the outermost surface of the laminated body 10 can be sufficiently lowered after the film formation process and before the laminated body 10 is wound up. Thereby, it is possible to suppress the occurrence of adhesion between adjacent laminates 10, that is, the occurrence of a blocking phenomenon.

Method for Producing Touch Panel Sensor Next, a method for producing the touch panel sensor 80 from the laminate 10 will be described with reference to FIGS.

(Touch panel sensor)
First, the manufactured touch panel sensor 80 will be described with reference to FIGS. 6A is a plan view illustrating an example of the touch panel sensor 80, and FIG. 6B is a cross-sectional view taken along the line VIa-VIa in FIG. 6A.

  As shown in FIGS. 6A and 6B, the touch panel sensor 80 has a plurality of first transparent conductive patterns 81 and second transparent conductive patterns 86 provided in a predetermined pattern on the base film 11. Yes. As shown in FIGS. 6A and 6B, each first transparent conductive pattern 81 extends in the x direction on one side of the base film 11, and each second transparent conductive pattern 86 is a base material. On the other side of the film 11, it extends in the y direction orthogonal to the x direction. In FIG. 6A, each pattern provided on one side of the base film 11 is indicated by a solid line, and each pattern provided on the other side of the base film 11 is indicated by a dotted line. Yes.

  As shown in FIG. 6B, each of the transparent conductive patterns 81 and 86 is composed of transparent conductive layers 21 and 31 made of a transparent conductive material. In this case, a touch location can be detected based on changes in current and voltage in each of the transparent conductive patterns 81 and 86 caused by static electricity from a detection target such as a human body. Specifically, the position in the y direction of the touch location of the detected object can be detected by each first transparent conductive pattern 81, and the x direction of the touch location of the detected object can be detected by each second transparent conductive pattern 86. The position at can be detected.

  Further, on the base film 11, a first light-shielding conductive pattern 82 and a second light-shielding conductive pattern 87 electrically connected to the first transparent conductive pattern 81 and the second transparent conductive pattern 86, respectively, and a first light-shielding conductive pattern 82 and the second light-shielding conductive pattern 87, and a first terminal portion 83 and a second terminal portion 88 for taking out signals from the first transparent conductive pattern 81 and the second transparent conductive pattern 86 to the outside are further provided. It has been. Each light shielding conductive pattern 82 and 87 and each terminal part 83 and 88 include light shielding conductive layers 22 and 32 made of a metal material. Therefore, signals from the first transparent conductive pattern 81 and the second transparent conductive pattern 86 can be extracted to the outside with a low resistance.

  The first light-shielding conductive pattern 82 and the first terminal portion 83 include the first transparent conductive layer 21 interposed between the base film 11 and the first light-shielding conductive layer 22 and one side of the first light-shielding conductive layer 22. And a first amorphous layer 23 provided on the substrate. As described above, the materials constituting the first transparent conductive layer 21 and the first amorphous layer 23 have conductivity. For this reason, the first transparent conductive layer 21 and the first amorphous layer 23 can contribute to lowering the resistance of the first light-shielding conductive pattern 82 and the first terminal portion 83. Similarly, the second light-shielding conductive pattern 87 and the second terminal portion 88 are formed by the second transparent conductive layer 31 interposed between the base film 11 and the second light-shielding conductive layer 32 and the second light-shielding conductive layer 22. And a second amorphous layer 33 provided on the other side.

  Next, a method for manufacturing the touch panel sensor 80 will be described with reference to FIGS. 8A to 8F along the flowchart shown in FIG.

(Photosensitive layer formation process)
First, the laminate 10 is prepared (step S11). Next, as shown in FIG. 8A, a first photosensitive layer 29a is provided on one side of the laminate 10, and a second photosensitive layer 39a is provided on the other side of the laminate 10 ( Step S12). The photosensitive layers 29a and 39a have photosensitivity to light in a specific wavelength range, for example, ultraviolet rays. The specific photosensitive characteristics of the photosensitive layers 29a and 39a are not particularly limited. For example, a photocurable photosensitive material may be used as the photosensitive layers 29a and 39a, or a photodissolvable photosensitive material may be used. Here, an example in which a photocurable photosensitive material is used as the photosensitive layers 29a and 39a will be described.

(Primary exposure process)
Next, as shown in FIG. 8B, the first exposure mask 28a is disposed on the first photosensitive layer 29a, and the second exposure mask 38a is disposed on the second photosensitive layer 39a. Each of the masks 28a and 38a has an opening that transmits exposure light in a pattern corresponding to the transparent conductive patterns 81 and 86, the light-shielding conductive patterns 82 and 87, and the terminal portions 83 and 88, which will be formed later, and a light-shield that shields the exposure light. Part. Thereafter, exposure light is irradiated to the photosensitive layers 29a and 39a through the masks 28a and 38a (step S13). As a result, the first photosensitive layer 29a and the second photosensitive layer 39a are simultaneously exposed in different patterns.

  Here, according to the present embodiment, the stacked body 10 includes the first light-shielding conductive layer 22 and the second light-shielding conductive layer 32 having light shielding properties. Therefore, the exposure light transmitted through the first photosensitive layer 29 a is shielded by the first light shielding conductive layer 22. Further, the exposure light transmitted through the second photosensitive layer 39 a is shielded by the second light-shielding conductive layer 32. Therefore, the exposure light irradiated from one side of the laminated body 10 for exposing the first photosensitive layer 29a does not reach the second photosensitive layer 39a, and similarly for exposing the second photosensitive layer 39a. The exposure light irradiated from the other side of the laminate 10 does not reach the first photosensitive layer 29a. As a result, in the exposure step S13, the first photosensitive layer 29a and the second photosensitive layer 39a can be simultaneously exposed with a desired pattern with high accuracy.

(Development process)
Next, the exposed first photosensitive layer 29a and second photosensitive layer 39a are developed (step S14). Specifically, a developer corresponding to the first photosensitive layer 29a and the second photosensitive layer 39a is prepared, and the photosensitive layers 29a and 39a are developed using this developer. As a result, as shown in FIG. 8C, portions of the photosensitive layers 29a and 39a that are not irradiated with the exposure light are removed, and as a result, the photosensitive layers 29a and 39a are patterned into a predetermined pattern.

(First patterning step)
Thereafter, the first amorphous layer 23, the first light-shielding conductive layer 22, and the first transparent conductive layer 21 are etched using the patterned first photosensitive layer 29a as a mask. In addition, the second amorphous layer 33, the second light-shielding conductive layer 32, and the second transparent conductive layer 31 are etched using the patterned second photosensitive layer 39a as a mask. By this etching, as shown in FIG. 8D, the first amorphous layer 23, the first light-shielding conductive layer 22, and the first transparent conductive layer 21 are patterned into a pattern substantially the same as the pattern of the first photosensitive layer 29a. The Further, the second amorphous layer 33, the second light-shielding conductive layer 32, and the second transparent conductive layer 31 are patterned into a pattern substantially the same as the pattern of the second photosensitive layer 39a (step S15). Note that a specific method for performing such etching is not particularly limited, and various methods can be used. For example, the amorphous layers 23 and 33, the light shielding conductive layers 22 and 32, and the transparent conductive layers 21 and 31 are respectively etched using an etching solution to selectively etch the amorphous layers 23 and 33, the light shielding conductive layers 22 and 32, and the transparent layers. The conductive layers 21 and 31 may be etched sequentially. Alternatively, the amorphous layers 23 and 33, the light-shielding conductive layer 22, and the amorphous layers 23 and 33, the light-shielding conductive layers 22 and 32, and the transparent conductive layers 21 and 31 are etched using an etchant that can attack two or more layers. , 32 and two or more of the transparent conductive layers 21 and 31 may be etched simultaneously. After the etching, the photosensitive layers 29a and 39a remaining on the amorphous layers 23 and 33 are removed (step S16).

(Secondary exposure process)
Next, as shown in FIG. 8E, the third photosensitive layer 29 b is provided in a portion corresponding to the first light-shielding conductive pattern 82 and the first terminal portion 83 to be formed later in the first amorphous layer 23. Further, the fourth photosensitive layer 39 b is provided in a portion corresponding to the second light-shielding conductive pattern 87 and the second terminal portion 88 to be formed later in the second amorphous layer 23. Specifically, as in the above-described steps S12 to S14, first, the photosensitive layers 29b and 39b are provided on the laminate 10 (step S17), and then the photosensitive layers 29b and 39b are simultaneously exposed in a predetermined pattern. Thereafter, the photosensitive layers 29b and 39b are developed (step S19).

(Second patterning step)
Thereafter, as shown in FIG. 8F, the light-shielding conductive layers 22 and 32 and the amorphous layers 23 and 33 not covered with the photosensitive layers 29b and 39b are removed by etching (step S20). At this time, the etching liquid has an erosion property with respect to the light-shielding conductive layers 22 and 32 and an etching solution with no erosion property or only weak erosion property with respect to the transparent conductive layers 21 and 31 made of a transparent conductive material in a crystalline state. A liquid may be used. As such an etching solution, for example, a phosphoric acid acetic acid-based etching solution may be mentioned.

  As described above, the amorphous layers 23 and 33 are made of a conductive oxide material in an amorphous state. In general, the chemical resistance of the conductive oxide material in the amorphous state is lower than the chemical resistance of the conductive oxide material in the crystalline state. Therefore, the etching is performed so that the amorphous layers 23 and 33 can be simultaneously removed when the light-shielding conductive layers 22 and 32 on the transparent conductive layers 21 and 31 are partially removed using an etchant in the second patterning step. The liquid or amorphous layers 23 and 33 can be set. For example, the etchant used in the second patterning step is selected so as not to have erosion with respect to the transparent conductive layers 21 and 31 but with erosion with respect to the amorphous layers 23 and 33. Alternatively, the amorphous state of the conductive oxide material of the amorphous layers 23 and 33 is set so as to be eroded by the etching solution used in the second patterning step. As a result, the amorphous layers 23 and 33 can be removed simultaneously with the light-shielding conductive layers 22 and 32, thereby reducing the number of steps required for the second patterning step.

  Thereafter, the photosensitive layers 29b and 39b remaining on the amorphous layers 23 and 33 are removed (step S21). Thereby, a touch panel sensor 80 as shown in FIGS. 6A and 6B can be obtained.

  Here, according to the present embodiment, the photosensitive layers 29a, 29b, 39a, 39b are provided on the amorphous layers 23, 33. Here, in general, the adhesion between the photosensitive material constituting the photosensitive layers 29a, 29b, 39a, 39b and the conductive oxide material constituting the amorphous layers 23, 33 is such that the photosensitive material, the light-shielding conductive layer 22, It is higher than the adhesiveness between the metal materials constituting 32. Therefore, the photosensitive layers 29a, 29b, 39a, and 39b can be easily provided on the amorphous layers 23 and 33 without performing optical or chemical treatment on the amorphous layers 23 and 33 in advance. As a result, compared with the case where the photosensitive layers 29a, 29b, 39a, and 39b are provided on the light-shielding conductive layers 22 and 32, the number of steps required to provide the photosensitive layers 29a, 29b, 39a, and 39b can be reduced. .

  In the touch panel sensor 80 according to the present embodiment, the first overcoat layer 84 that covers the first transparent conductive pattern 81 and the first light-shielding conductive pattern 82 is based on the dotted line shown in FIG. 6B. A second overcoat layer 89 provided on one side of the material film 11 and covering the second transparent conductive pattern 86 and the second light-shielding conductive pattern 87 may be provided on the other side of the base film 11. Thus, the transparent conductive patterns 81 and 86 and the light shielding conductive patterns 82 and 87 can be shielded from the external atmosphere. Thereby, the reliability of the transparent conductive patterns 81 and 86 and the light shielding conductive patterns 82 and 87 in the touch panel sensor 80 can be improved. As a material constituting the overcoat layers 84 and 89, for example, an insulating material such as an acrylic resin is used.

  By the way, the terminal parts 83 and 88 of the touch panel sensor 80 are members for taking out signals from the transparent conductive patterns 81 and 86 to the outside. Therefore, the terminal portions 83 and 88 cannot be completely covered with the overcoat layers 84 and 89 as shown in FIG. Here, according to the present embodiment, as shown in FIG. 6B, the first light-shielding conductive layer 22 is covered with the first amorphous layer 23 in the first terminal portion 83. Although not shown, the second light-shielding conductive layer 32 is also covered with the second amorphous layer 33 in the second terminal portion 88. As described above, the amorphous layers 23 and 33 are made of a conductive oxide material having conductivity. Therefore, by forming the outermost surfaces of the terminal portions 83 and 88 with such amorphous layers 23 and 33, the surface of the light-shielding conductive layers 22 and 32 is kept from the outside atmosphere while ensuring the conductivity in the terminal portions 83 and 88. Can be shielded. This can prevent the light-shielding conductive layers 22 and 32 of the terminal portions 83 and 88 from being oxidized. As a result, good electrical conductivity in the terminal portions 83 and 88 can be secured over a long period of time.

Modifications Various modifications can be made to the above-described embodiment. Hereinafter, an example of modification will be described.

(Modified example of laminate manufacturing method)
In the present embodiment, first, a plurality of layers are provided on one side of the base film 11 by flowing the base film 11 in one direction in the laminate manufacturing apparatus 40, and then the base film 11 An example in which a plurality of layers are formed on the other side of the base film 11 by flowing the film again in one direction in the laminate manufacturing apparatus 40 is shown. However, the present invention is not limited to this, and as shown in FIG. 9, a plurality of layers are provided on each of one side and the other side of the base film 11 while the base film 11 is reciprocated by roll-to-roll. A laminated body may be manufactured using a film forming apparatus 60 </ b> A capable of providing a film.

In the film forming apparatus 60A shown in FIG. 9, in order from the first upstream side in the rotational direction R _1, the first target 61a made of a transparent conductive material, and a second target 62a made of a metal material, a conductive oxide material A third target 63a made of, a fourth target 62a ′ made of a metal material, and a fifth target 61a ′ made of a transparent conductive material are arranged. In FIG. 9, the partition 66 a and the film-forming vacuum exhaust mechanism 67 that partitions the film-forming chamber 66 into a plurality of regions, the water vapor supply unit 65 e that can be disposed near the target, and the like are omitted for simplicity. Yes.

In the laminate manufacturing method using the film forming apparatus 60A shown in FIG. 9, first, the first film forming step is performed while the base film 11 is conveyed from left to right in FIG. First, the base film 11 is wound around the conveying drum 68 rotating in the first rotational direction R _1. Next, atoms constituting each of the targets 61a, 62a, and 63a are attached to one side of the base film 11 by sputtering. As a result, the first transparent conductive layer 21, the first light shielding conductive layer 22, and the first amorphous layer 23 are sequentially provided on the surface on one side of the base film 11. Then, after the front and back of the base film 11 are reversed, the second film forming step is performed while the base film 11 is conveyed from right to left in FIG. First, the base film 11 is wound around the conveying drum 68 rotating in the second rotational direction R _2. Next, the atoms constituting each of the targets 61a ′, 62a ′, and 63a are attached to the other side of the base film 11 by sputtering. As a result, the second transparent conductive layer 31, the second light-shielding conductive layer 32, and the second amorphous layer 33 are sequentially provided on the surface on the other side of the base film 11. Thus, the laminated body 10 by this Embodiment can be manufactured.

(Modified example of laminate)
In the present embodiment, an example in which the amorphous layers 23 and 33 are provided on one side of the first light-shielding conductive layer 22 and the other side of the second light-shielding conductive layer 32 is shown. That is, an example is shown in which the amorphous layer is located on both the outermost surface on one side and the outermost surface on the other side of the laminate 10. However, the present invention is not limited to this, and it is sufficient that an amorphous layer is provided on at least one of one side of the first light-shielding conductive layer 22 and the other side of the second light-shielding conductive layer 32. For example, as shown in FIG. 10, the first amorphous layer 23 is provided only on one side surface of the first light-shielding conductive layer 22, and the amorphous layer is provided on the other side surface of the second light-shielding conductive layer 32. It may not be provided. Even in this case, the temperature of the surface on one side of the first light-shielding conductive layer 22 is reduced by the first amorphous layer 23 until the stacked body 10 is wound after the film forming process or the annealing process. It can be made low enough. Thereby, it is possible to suppress the occurrence of the blocking phenomenon.

  As shown in FIG. 11, the laminate 10 includes a first index matching layer 24 provided between the base film 11 and the first transparent conductive layer 21, and the base film 11 and the second transparent conductive layer 31. And a second index matching layer 34 provided between the two. For example, as shown in FIG. 11, each of the index matching layers 24 and 34 includes high refractive index layers 25 and 35 having a higher refractive index than the transparent conductive layers 21 and 31, and a lower refractive index than the transparent conductive layers 21 and 31. And at least one set of low refractive index layers 26, 36 having the above. By providing such index matching layers 24 and 34, it is possible to appropriately adjust the light transmittance and reflectance in the stacked body 10. For example, when the touch panel sensor 80 is manufactured using the laminate 10, the light transmittance between a region where the transparent conductive patterns 81 and 86 are provided and a region where the transparent conductive patterns 81 and 86 are not provided. In addition, the index matching layers 24 and 34 can be appropriately set so that the difference in reflectance is reduced.

  The material constituting the high refractive index layers 25 and 35 is not particularly limited as long as the material has a higher refractive index than the material constituting the transparent conductive layers 21 and 31. For example, niobium oxide is used. The material constituting the low refractive index layers 26 and 36 is not particularly limited as long as the material has a lower refractive index than the material constituting the transparent conductive layers 21 and 31. For example, silicon oxide is used. The thicknesses of the high-refractive index layers 25 and 35 and the low-refractive index layers 26 and 36 are appropriately set according to the materials used so that desired transmittance and reflectance are achieved.

  As shown in FIG. 12, the laminated body 10 includes a first intermediate layer 27 provided between the first transparent conductive layer 21 and the first light shielding conductive layer 22, a second transparent conductive layer 31, and a second light shielding. And a second intermediate layer 37 provided between the conductive layer 32 and the conductive layer 32. Here, the intermediate layers 27 and 37 are layers configured to have greater adhesion to the light-shielding conductive layers 22 and 32 than the transparent conductive layers 21 and 31. By interposing such intermediate layers 27 and 37 between the transparent conductive layers 21 and 31 and the light shielding conductive layers 22 and 32, the light shielding conductive layers 22 and 32 are securely fixed to the transparent conductive layers 21 and 31. can do.

  The material constituting the intermediate layers 27 and 37 is not particularly limited as long as the material has good adhesion to the transparent conductive layers 21 and 31 and the light-shielding conductive layers 22 and 32. For example, a metal such as molybdenum (Mo) alloy is used. It is done. Examples of the Mo alloy include MoNb, which is an alloy of Mo and niobium (Nb).

  Moreover, in this Embodiment, although the example in which the transparent conductive layers 21 and 31 are provided between the base film 11 and the light shielding conductive layers 22 and 32 was shown, it is not restricted to this. The laminate 10 includes a base film 11, the light shielding conductive layers 22 and 32 provided on one side and the other side of the base film 11, and one side of the first light shielding conductive layer 22 or the second light shielding conductive. And an amorphous layer provided on at least one of the other sides of the layer 32. The laminated body 10 provided with at least these layers can enjoy the above-described effect that the occurrence of the blocking phenomenon when being wound is suppressed. For example, as illustrated in FIG. 13, the laminate 10 includes a base film 11, one of the first light-shielding conductive layer 22 provided on the surface on one side of the base film 11, and one of the first light-shielding conductive layers 22. The first amorphous layer 23 provided on the surface on the other side, the second light-shielding conductive layer 32 provided on the surface on the other side of the base film 11, and the other side of the second light-shielding conductive layer 32 And a second amorphous layer 33 provided on the surface. Although not shown, in the laminate 10, the transparent conductive layer is either between the base film 11 and the first light-shielding conductive layer 22 or between the base film 11 and the second light-shielding conductive layer 32. It may be provided only in.

  In addition, although some modified examples with respect to the above-described embodiment have been described, naturally, a plurality of modified examples can be applied in combination as appropriate.

DESCRIPTION OF SYMBOLS 10 Laminated body 11 Base film 12 Synthetic resin layer 13 1st hard coat layer 14 2nd hard coat layer 21 1st transparent conductive layer 22 1st light shielding conductive layer 23 1st amorphous layer 24 1st index matching layer 25 1st high Refractive index layer 26 First low refractive index layer 27 First intermediate layer 31 Second transparent conductive layer 32 Second light shielding conductive layer 33 Second amorphous layer 34 Second index matching layer 35 Second high refractive index layer 36 Second low refractive index Rate layer 37 Second intermediate layer 40 Laminate manufacturing device 50 Unwinding device 60 Film forming device 70 Winding device 80 Touch panel sensor 81 First transparent conductive pattern 82 First light shielding conductive pattern 83 First terminal portion 84 First overcoat layer 86 Second transparent conductive pattern 87 Second light-shielding conductive pattern 88 Second terminal portion 89 Second overcoat layer

Claims (9)

A base film;
A first light-shielding conductive layer provided on one side of the base film and having light-shielding properties and conductivity;
A second light-shielding conductive layer provided on the other side of the base film and having a light-shielding property and conductivity;
An amorphous layer that is provided on at least one side of the first light-shielding conductive layer or the other side of the second light-shielding conductive layer and is made of a conductive oxide material in an amorphous state. Laminated body.   The laminate according to claim 1, wherein the amorphous layer is provided on either one side of the first light-shielding conductive layer and the other side of the second light-shielding conductive layer.   A transparent conductive layer having translucency and conductivity is provided between at least one of the base film and the first light-shielding conductive layer or between the base film and the second light-shielding conductive layer. It is provided, The laminated body of Claim 1 or 2 characterized by the above-mentioned.   The amorphous layer is configured to be simultaneously removed when the first light-shielding conductive layer or the second light-shielding conductive layer on the transparent conductive layer is partially removed using a predetermined etching solution. The laminate according to claim 3.   The laminate according to claim 3 or 4, wherein each of the transparent conductive layer and the amorphous layer is made of a conductive oxide material containing indium.   The said 1st light shielding conductive layer and the said 2nd light shielding conductive layer are comprised from at least 1 sort (s) of silver, copper, aluminum, or these alloys, It is any one of Claim 1 thru | or 5 characterized by the above-mentioned. The laminated body of description. A base film, a first light-shielding conductive layer that is provided on one side of the base film and having light-shielding properties and conductivity, and a light-shielding property and conductivity that are provided on the other side of the base film. Photosensitive on one side of a laminate having a second light-shielding conductive layer and a first amorphous layer provided on one side of the first light-shielding conductive layer and made of a conductive oxide material in an amorphous state. Forming a first photosensitive layer having, and forming a photosensitive second photosensitive layer on the other surface of the laminate;
Exposing the first photosensitive layer and the second photosensitive layer in different patterns with a first mask disposed on the first photosensitive layer and a second mask disposed on the second photosensitive layer; ,
Developing and patterning the first photosensitive layer and the second photosensitive layer;
First patterning is performed by etching the first amorphous layer and the first light-shielding conductive layer using the patterned first photosensitive layer as a mask, and etching the second light-shielding conductive layer using the patterned second photosensitive layer as a mask. Process,
Removing the patterned first photosensitive layer and second photosensitive layer. A method for producing a conductive pattern film, comprising: The laminate is provided between the base film and the first light-shielding conductive layer, and has a light-transmitting and conductive first transparent conductive layer, the base film, and the second light-shielding conductive layer. A second transparent conductive layer provided between and having translucency and conductivity,
In the first patterning step, the first transparent conductive layer is further etched using the patterned first photosensitive layer as a mask, and the second transparent conductive layer is further etched using the patterned second photosensitive layer as a mask. And
In the method of manufacturing the conductive pattern film , after the first patterning step, the first light shielding conductive layer on the first transparent conductive layer is partially removed and a first light shielding is performed using a predetermined etching solution. The method for producing a conductive pattern film according to claim 7, further comprising a second patterning step of removing the first amorphous layer on the conductive layer.   The laminate according to claim 1, wherein the laminate is a laminate used for producing a conductive pattern film by the production method according to claim 7.

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