JP5585143B2 - Transparent conductive laminate, method for producing the same, and touch panel - Google Patents

Description

  The present invention relates to a transparent conductive laminate having an indium tin oxide (ITO) film formed on a transparent substrate, having low conductivity, high transmittance, and excellent adhesion and resistance. Further, the present invention relates to a transparent conductive laminate used for a touch panel or a display using a touch panel in which the pattern shape is not conspicuous, particularly a capacitive touch panel.

  Conventionally, a transparent conductive film having a high visible transmittance is used for a liquid crystal display (LCD), a plasma display (PDP), a touch panel, and the like. These displays and touch panels are overwhelmingly thin and light compared to conventional cathode ray tube (CRT) displays, are light in weight, and have many advantages such as power saving. ing.

  Since a liquid crystal display, a plasma display, and a touch panel are optical components, a transparent conductive film used as a member therein is required to have low electrical resistance, high transmittance for visible light, high durability, and the like. ITO film has good conductivity and good translucency in the visible light wavelength range, so transparent electrodes for various displays, touch panels and solar cells, heat reflecting glass, anti-fogging, anti-icing, anti-static glass It is used for electromagnetic seal glass. As a method for forming the ITO film, methods such as a magnetron sputtering method and an EB deposition method in which an accelerated electron beam is irradiated are widely used industrially. Specifically, the following patent documents have been proposed.

JP-A-6-320661 JP-A-7-207439 JP-A-8-174746 JP-A-8-192492 JP 2003-160362 A

  According to Patent Documents 1 and 2, there is proposed a method for producing a transparent conductive film having a high transmittance in the visible light region by producing a laminate using a magnetron sputtering method. However, while the obtained transparent conductive thin film has a certain resistance, the transparent conductive film has a drawback that the strength of the substrate itself is insufficient and the adhesion and durability of the transparent conductive film are insufficient. There is.

  Patent Documents 3 and 4 propose a method in which a hard coat layer made of a transparent hard organic material layer is provided on one side or both sides of a transparent substrate, and a silicon oxide and an ITO transparent conductive film are laminated thereon. From this method, the obtained transparent conductive film has adhesion and certain durability, but the durability of the transparent conductive film is still insufficient in application to a touch panel.

  Further, Patent Document 5 proposes a method of laminating a metal oxide layer, a silicon oxide layer and an ITO transparent conductive film on a transparent glass substrate. From this method, the obtained transparent conductive film has adhesion and a certain resistance, but it is necessary to heat the substrate to 200 ° C. or higher when laminating, and it cannot be applied to plastic.

  Therefore, the present invention solves the above-mentioned problems of the prior art, has high transparency with respect to a substrate such as a film, has excellent adhesion, and has transparent conductivity used for a display or touch panel in which the pattern shape is inconspicuous. It aims at making a laminated body.

As means for solving the above-mentioned problems, the invention according to claim 1 is characterized in that a metal oxide layer, a silicon oxide layer, an indium tin oxide layer, and an adhesive are formed on one surface or both surfaces of a transparent substrate. A transparent conductive laminate comprising layers in order from the transparent substrate side, wherein the indium tin oxide layer comprises a conductive pattern region and a non-conductive pattern region, and the refractive index of the metal oxide layer is 1.7 to 2.6, the optical film thickness is 12 to 35 nm, the refractive index of the silicon oxide layer is 1.3 to 1.5, and the optical film thickness is 70 to 110 nm. There, the greater than the optical thickness of the indium tin oxide layer is 30 nm, and it is 65nm or less, the pressure-sensitive adhesive layer thickness of 10μm or more, 200 [mu] m Ri der less, the total light transmittance be 80% or more The haze 1% or less, according to JIS K7194, surface (sheet) resistance of 100Ω / □ or more and 500Ω / □ or less, and transmission hues a * and b * of −4.0 to 4.0 respectively (color calculation: 2 °, visual field D65 light source), and reflection hues a * and b * are from -4.0 to 4.0 (color calculation: 2 °, visual field D65 light source), and the conductive pattern region and the non-conductive The difference in transmittance and reflectance with respect to the pattern region is −3.0% to 3.0% in the range of 450 nm to 750 nm, respectively. The conductive pattern region and the non-conductive pattern region transmitting the color difference Delta] E * ab with (T) and the reflection color difference ΔE * ab (R) is a transparent conductive laminate, respectively, characterized in der Rukoto -5.0 to 5.0.

  In the invention according to claim 2, a hard coat layer in contact with the transparent substrate is provided on one surface or both surfaces of the transparent substrate, and the film thickness of the hard coat layer is 1 μm or more and 8 μm or less. It is a transparent conductive laminated body of Claim 1 characterized by the above-mentioned.

The invention described in Claim 3 is a touch panel which is characterized by using a transparent conductive laminate according to claim 1 or 2.

In the invention according to claim 4 , the metal oxide having a refractive index of 1.7 or more and 2.6 or less and an optical film thickness of 12 nm or more and 35 nm or less on one surface or both surfaces of the transparent substrate. A step of forming a physical layer and a silicon oxide layer having a refractive index of 1.3 to 1.5 and an optical film thickness of 70 nm to 110 nm by magnetron sputtering in order from the transparent substrate side; Forming an indium tin oxide layer having an optical thickness of 30 nm to 65 nm on the surface of the silicon oxide layer by a magnetron sputtering method using a target having a tin oxide content of 2 wt% to 15 wt%; a step of forming a conductive pattern areas and non-conductive pattern area on the indium tin oxide layer, the conductive pattern region and the non-conductive pattern region top Includes a step of forming an adhesive layer, in this order, the total light transmittance is not less than 80%, a haze of 1% or less, according to JIS K7194, the surface (sheet) resistance of 100 [Omega / □ or 500 [Omega / □ or less, transmitted hues a * and b * are each −4.0 to 4.0 (color calculation: 2 °, field of view D65 light source), and reflected hues a * and b * are −4.0 or more. 4.0 or less (color calculation: 2 °, field of view D65 light source), and the difference in transmittance and reflectance between the conductive pattern region and the non-conductive pattern region is in the range of 450 nm to 750 nm. The transmission color difference ΔE * ab (T) and the reflection color difference ΔE * ab (R) between the conductive pattern region and the non-conductive pattern region are −3.0% to 3.0%, respectively. -5.0 or more and 5.0 or less That you produce electroconductive laminate is a manufacturing method of the transparent conductive laminate according to claim.

The invention according to claim 5 includes a step of forming a hard coat layer having a thickness of 1 μm or more and 8 μm or less in contact with the transparent substrate on one or both surfaces of the transparent substrate. It is a manufacturing method of the transparent conductive laminated body of Claim 4 characterized by the above-mentioned.

  The transparent conductive laminate of the present invention has high transparency and excellent adhesion between the respective layers. Moreover, when a pattern is formed in the indium tin oxide layer which is a transparent conductive film and it uses as a capacitive touch panel, the touch panel excellent in the visibility which the pattern shape does not stand out can be obtained.

It is a section explanatory view of a 1st embodiment of a transparent conductive layered product of the present invention. It is a section explanatory view of a 2nd embodiment of a transparent conductive layered product of the present invention. It is a section explanatory view of a 3rd embodiment of a transparent conductive layered product of the present invention.

  FIG. 1 is a schematic cross-sectional view showing a basic layer configuration of a transparent conductive laminate according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing a layer configuration in which a hard coat layer is provided on the transparent conductive laminate according to the embodiment of the present invention. FIG. 3 is a schematic sectional view showing a layer structure in which a metal oxide layer, a silicon oxide layer, and an indium / tin oxide layer are provided on both surfaces of a transparent substrate.

  As shown in FIG. 1, a transparent conductive laminate 10 according to an embodiment of the present invention includes a transparent substrate 1, a metal oxide layer 2a, a silicon oxide layer 3a, an indium / tin oxide layer 4a, and an adhesive layer 5a. The indium tin oxide layer 4a forms a conductive pattern region 6a and a non-conductive pattern region 7a. The metal oxide layer 2a, the silicon oxide layer 3a, the indium / tin oxide layer 4a, and the pressure-sensitive adhesive layer 5a may be formed on both surfaces of the transparent substrate 1.

  The transparent substrate of the present invention is made of a transparent plastic. Examples of the transparent plastic film include a transparent substrate synthesized from an organic resin such as acrylic resin, polyamide resin, melamine resin, polyimide resin, polyester resin, cellulose and copolymer resins thereof, gelatin, and casein. Specific examples include polyester, polyethylene terephthalate (PET), polybutylene terephthalate, polymethyl methacrylate (PMMA), acrylic, polycarbonate (PC), polystyrene, triacetate (TAC), polyvinyl alcohol, polyvinyl chloride, polyvinylidene chloride, polyethylene, Ethylene-vinyl acetate copolymer, polyvinyl butyral, metal ion cross-linked ethylene-methacrylic acid copolymer, polyurethane, cellophane and the like are preferable, but PET, PC, PMMA, TAC and the like are preferable, but not limited thereto.

  In the present invention, the above-mentioned polyester, polyethylene terephthalate (PET), polybutylene terephthalate, polymethyl methacrylate (PMMA), triacetate (TAC) and the like can be used as the transparent substrate. However, since the mechanical strength of the transparent substrate is insufficient, the product formed thereon has insufficient mechanical strength. In order to solve this problem, as shown in FIG. 2, a first hard coat layer 8a can be inserted between the transparent substrate 1 and the metal oxide layer 2a. Only one layer of the hard coat layer may be provided on the surface of the transparent base material 1, but in order to suppress curling that occurs when the strength of the transparent base material is increased, a second hard coat layer is provided on the back surface of the transparent base material 1. It is also possible to insert the hard coat layer 8b.

  The transparent substrate of the present invention may be subjected to surface treatment such as easy adhesion treatment, plasma treatment and corona treatment.

  The film thicknesses of the first hard coat layer 8a and the second hard coat 8b of the present invention are preferably 1 μm or more and 8 μm or less. If the film thickness is thin, the performance of the hard coat layer is difficult to achieve. If the film thickness is thick, the performance of the hard coat layer tends to be improved, but the possibility of occurrence of cracks increases. Then, by adjusting the film thickness of the first hard coat layer 8a and the film thickness of the second hard coat layer 8b, the stress on the front and back of the obtained transparent conductive laminate can be adjusted to be symmetric. .

  Examples of the curable resin used in the hard coat layer of the present invention include a curable resin and a thermosetting resin that are cured by irradiation with ionizing radiation or ultraviolet rays. Specifically, acrylic resins such as UV curable acrylic esters, acrylamides, methacrylic esters, and methacrylamides, organosilicon resins, thermosetting polysiloxane resins, and the like are suitable. . Although the above resin is mentioned, it is not this limitation.

  The hard coat layer is formed by dissolving the main component resin and UV absorbing material in a solvent, die coater, curtain flow coater, roll coater, reverse roll coater, gravure coater, knife coater, bar coater, spin coater. And a known coating method such as a micro gravure coater.

  The metal oxide layers 2a and 2b of the present invention are high refractive index metal oxide layers. Examples of the material used for the metal oxide layer include, but are not limited to, ZnO, TiO2, CeO2, Sb2O5, SnO2, Y2O3, La2O3, ZrO2, Al2O3, and Nb2O5.

  The refractive index of the metal oxide layer is preferably 1.7 or more and 2.6 or less in consideration of the refractive indexes of the transparent substrate and the hard coat layer. By setting it as this range, it becomes higher than the refractive index of a hard-coat layer, and can be used as a high refractive index material.

  The optical film thickness of the metal oxide layer is preferably 12 nm or more and 35 nm or less. By setting it within this range, the obtained pattern shape has visibility so as not to stand out. The optical film thickness is represented by nd, where n is the refractive index of the metal oxide and d is the film thickness.

  The silicon oxide layers 3a and 3b of the present invention are low refractive index metal oxide layers and are represented by SiOx. Here, x is the number of oxygen atoms. The refractive index of the silicon oxide layer is preferably 1.3 or more and 1.5 or less. By making it into this range, the obtained silicon oxide layer can be used as a low refractive index material. Here, the refractive index of the silicon oxide layer can be adjusted by the number x of oxygen atoms, and the value of x is preferably 1.5 or more and 2.0 or less.

  Moreover, it is preferable that the optical film thickness of a silicon oxide layer is 70 nm or more and 110 nm or less. By setting it as this range, the transparent conductive laminated body with the visibility which the obtained pattern shape does not stand out can be obtained.

  The metal oxide layer and the silicon oxide layer of the present invention can obtain a transparent conductive laminate having desired optical characteristics by adjusting the refractive index and the optical film thickness within the above ranges, respectively. Specifically, as will be described later, a transparent conductive laminate having high transparency, a low haze value, and good visibility can be obtained. And the transparent conductive laminated body of this invention can reduce the peculiar yellow tint of an indium tin oxide layer itself.

  Further, the action of the metal oxide layer and the silicon oxide layer of the present invention includes not only simple optical adjustment but also adhesion improving action. By forming the metal oxide layer and the silicon oxide layer, the affinity with the indium tin oxide layer is improved, and the adhesion of the transparent conductive laminate can be improved.

  As shown in FIG. 1, the metal oxide layer and the silicon oxide layer of the present invention may be provided only on one surface of the transparent substrate 1 or may be provided on both surfaces of the transparent substrate 1. When a hard coat layer is provided on the transparent substrate 1, a hard coat layer surface metal oxide layer 2a and a silicon oxide layer 3a can be sequentially provided as shown in FIG. Further, as shown in FIG. 3, the first metal oxide layer 2a and the first silicon oxide layer 3a are formed on the surface of the first hard coat layer 8a, and the second metal oxide layer is formed on the surface of the second hard coat layer 8b. The physical layer 2b and the second silicon oxide layer 3b can be sequentially provided.

  As the laminated film formation method of the present invention, vapor phase film formation is preferable in order to obtain film characteristics. The vapor deposition method includes a magnetron sputtering method, a physical vacuum vapor deposition method (PVD) such as an EB vapor deposition method that irradiates an accelerated electron beam, and a chemical vacuum vapor deposition method (CVD). Among these, the magnetron sputtering method is particularly preferable.

  The indium tin oxide layers 4a and 4b of the present invention are preferably formed using a target having a tin oxide content of 2 wt% or more and 15 wt% or less. When the tin oxide content is less than 2 wt%, the carrier density is too low and the conductive performance is significantly reduced. When the content of tin oxide exceeds 15 wt%, the structure of the indium tin oxide layer changes and the conductive performance also deteriorates.

  The optical film thickness of the indium tin oxide layer is preferably 30 nm or more and 65 nm or less. When the thickness is smaller than 30 nm, the film thickness is thin and performance cannot be obtained. On the other hand, if the thickness is larger than 65 nm, the obtained film has low transmittance and optical characteristics are deteriorated.

  The indium tin oxide layer of the present invention is provided on the surface of the silicon oxide layer 3a or 3b as shown in FIGS. 1 to 3, and forms a pattern to form the conductive pattern regions 6a and 6b and the non-conductive pattern region. 7a and 7b are provided.

  As a pattern formation method, a resist is applied on the indium tin oxide layer, the pattern is formed by exposure / development, and then the indium tin oxide layer is chemically dissolved. And a method of sublimating the indium tin oxide layer with a laser, and the like can be selected in a timely manner depending on the shape and accuracy of the pattern. In consideration of pattern accuracy and thinning, a photolithography method is preferable.

  Examples of the adhesive layer include, but are not limited to, acrylic adhesives, rubber adhesives, silicone adhesives, and the like. The thickness is preferably 10 μm or more and 200 μm or less. If the thickness is less than 10 μm, sufficient adhesion cannot be ensured, and even if the thickness is slightly blurred, uneven color is easily noticeable. If the thickness exceeds 200 μm, the transparency is inferior and the appearance is defective. As a result, there are problems such as an increase in total thickness, high cost, and poor productivity. When the transparent conductive laminate of the present invention is provided with an adhesive layer, it can be bonded to glass, a plastic sheet, a film or the like when creating a touch panel.

  The transparent conductive laminate of the present invention has a total light transmittance of 80% or more, a haze of 1% or less, a sheet resistance of 100Ω / □ or more and 500Ω / □ or less, and a transmission hue a * and b. Since * satisfies −4.0 to 4.0 (color calculation: 2 °, visual field D65 light source), a transparent conductive laminate having excellent optical characteristics can be produced.

  The most ideal condition that the pattern shape formed on the indium tin oxide layer is not conspicuous is the difference in transmittance between the conductive pattern region and the non-conductive pattern region for each wavelength within the visible light range. The difference in reflectance is 0. In the present invention, as shown in FIGS. 1 to 3, patterning is performed on the conductive pattern regions 6a and 6b and the non-conductive pattern regions 7a and 7b, and the adhesive layers 5a and 5b are pasted on the upper surface. In the combined state, for each wavelength within the visible light range, the difference in transmittance and reflectance between the conductive pattern region 6a and the non-conductive pattern region 7a, or between the conductive pattern region 6b and the non-conductive pattern region 7b. The difference is −3.0% or more and 3.0% or less in the range of 450 nm or more and 750 nm or less, respectively. Further, the transmission color difference ΔE * ab (T) and the reflection color difference ΔE * ab (R) between the conductive pattern region and the non-conductive pattern region are respectively −5.0 or more and 5.0 or less. By satisfying this range, the shape of the pattern formed on the obtained transparent conductive laminate is almost inconspicuous.

  The application range of the present invention is a touch panel using a transparent conductive laminate. The transparent conductive laminate produced in the present invention has features such as low sheet resistance, good adhesion, high transmittance, and inconspicuous pattern shape. It can be applied to a touch panel.

  Hereinafter, the present invention will be specifically described based on examples.

<Example 1>
Using Unidic V-9500 (manufactured by DIC), an ultraviolet curable acrylic resin, hard coat layers (HC (1) and HC (2)) are microgravure on both sides of a 188 μm polyethylene terephthalate film (PET). It was coated by a coater. The thickness of the obtained hard coat layer is 3 μm for both HC (1) and HC (2). High refractive index oxidation, which is a metal oxide layer, on the surface of HC (1) of this 194 μm thick HC (1) / PET / HC (2) film (PET film with double-sided hard coat) by magnetron sputtering. Titanium (TiO2) and low refractive index silicon oxide (SiO2) were sequentially laminated. At this time, the optical thickness of the TiO2 layer was 18 nm, the optical thickness of the SiO2 layer was 85 nm, the refractive index of the TiO2 layer was 2.23, and the refractive index of the SiO2 layer was 1.46. Next, an indium tin oxide (ITO) layer containing 10 wt% tin oxide was formed with an optical film thickness of 54 nm, and the resistance value was measured. Next, a conductive pattern region and a non-conductive pattern region were formed on the indium tin oxide layer by photolithography. Finally, an adhesive having a refractive index of 1.50 and a thickness of 25 μm was bonded to the upper surfaces of the conductive pattern region and the non-conductive pattern region. In the TiO2 layer and the SiO2 layer, the amount of oxygen vacancies in the formed thin film was changed by changing the oxygen flow rate (partial pressure) during film formation, and the refractive index was adjusted. In addition, the sheet resistance during film formation of the ITO layer was adjusted by applied power, film formation time, and oxygen flow rate. Thus, the transparent conductive laminate of Example 1 was produced. Evaluation of the obtained transparent conductive laminated body was performed as follows.

[Sheet resistance measurement]
The resistance value was measured by a 4-terminal method using a surface resistance measuring device Loresta GP manufactured by Mitsubishi Chemical Analytech.

[Spectral spectrum measurement]
Using an automatic spectrophotometer U-4000 manufactured by Hitachi, Ltd., D65 was measured at a 2 degree visual field, and color calculation was performed.

  A JIS L * a * b * color system was used for evaluation of optical characteristics. Each numerical value is obtained by the following formula.

ΔL * _T = | transmission L * (conductive pattern region) −transmission L * (non-conductive pattern region) |
Δa * _T = | transmission a * (conductive pattern region) −transmission a * (non-conductive pattern region) |
Δb * _T = | transmission b * (conductive pattern region) −transmission b * (non-conductive pattern region) |
ΔL * _R = | reflected L * (conductive pattern region) −reflected L * (non-conductive pattern region) |
Δa * _R = | reflected a * (conductive pattern region) −reflected a * (non-conductive pattern region) |
Δb * _R = | reflected b * (conductive pattern region) −reflected b * (non-conductive pattern region) |
ΔE * ab (T) = [(ΔL * _T ) ² + (Δa * _T ) ² + (Δb * _T ) ² ] ^1/2
ΔE * ab (R) = [(ΔL * _R ) ² + (Δa * _R ) ² + (Δb * _R ) ² ] ^1/2
[Measurement of total light transmittance and haze]
Measurement was performed according to JISK7105 using an NDH 2000 haze meter manufactured by Nippon Denshoku.

<Example 2>
On the surface of HC (2) on the back surface of the transparent conductive laminate obtained from Example 1, high refractive index titanium oxide (TiO2) and low refractive index silicon oxide (SiO2), which are metal oxide layers, were sequentially formed. Laminated. At this time, the optical thickness of the TiO2 layer was 18 nm, the optical thickness of the SiO2 layer was 85 nm, the refractive index of the TiO2 layer was 2.23, and the refractive index of the SiO2 layer was 1.46. Next, an indium tin oxide (ITO) layer containing 10 wt% tin oxide was formed with an optical film thickness of 54 nm, and the resistance value was measured. Next, a conductive pattern region and a non-conductive pattern region were formed on the ITO layer by photolithography. Finally, an adhesive having a refractive index of 1.50 and a thickness of 25 μm was bonded to the upper surfaces of the conductive pattern region and the non-conductive pattern region. The adjustment of the refractive indexes of the TiO2 layer and the SiO2 layer and the control of the sheet resistance of the ITO layer were adjusted in the same manner as in Example 1. Thus, a transparent conductive laminate of Example 2 was produced. Evaluation of the obtained transparent conductive laminate was performed in the same manner as in Example 1.

<Comparative Example 1>
Using unidic V-9500 (manufactured by DIC), which is an ultraviolet curable acrylic resin, (HC (1) and HC (2)) were coated on both sides of PET of 188 μm with a micro gravure coater. The thickness of the obtained hard coat layer is 3 μm for both HC (1) and HC (2). An indium tin oxide (ITO) layer containing 10 wt% of tin oxide was formed on the surface of HC (1) by magnetron sputtering with an optical film thickness of 54 nm, and the resistance value was measured. Next, a conductive pattern region and a non-conductive pattern region were formed on the ITO layer by photolithography. Finally, an adhesive having a refractive index of 1.50 and a thickness of 25 μm was bonded to the upper surfaces of the conductive pattern region and the non-conductive pattern region. Thus, a transparent conductive laminate of Comparative Example 1 was produced. Evaluation of the obtained transparent conductive laminate was performed in the same manner as in Example 1.

<Comparative example 2>
In Example 1, the optical film thickness of the TiO2 layer was 40 nm, the optical film thickness of the SiO2 layer was 88 nm, and other operations were performed in the same manner as in Example 1 to obtain a transparent conductive laminate. Evaluation of the obtained transparent conductive laminate was performed in the same manner as in Example 1.

  The evaluation results for Examples 1 and 2 and Comparative Examples 1 and 2 of the present invention are shown in Table 1 below.

As shown in Table 1, the transparent conductive laminates obtained in Examples 1 and 2 have sheet resistance, total light transmittance, haze, transmission hues a * and b *, conductive pattern regions and non-conductive pattern regions. The transparent color difference ΔE * ab (T) and the reflection color difference ΔE * ab (R) were within the desired ranges, and a transparent conductive laminate having excellent optical characteristics could be obtained.

  On the other hand, the transparent conductive laminate obtained in Comparative Example 1 resulted in a reflection color difference ΔE * ab (R) that was outside the desired range. Moreover, the transparent conductive laminate obtained in Comparative Example 2 resulted in the reflection hue a *, the reflection hue b *, and the reflection color difference ΔE * ab (R) being out of the desired ranges.

  When Examples 1 and 2 are compared with Comparative Examples 1 and 2, the transparent conductive laminate of the present invention has excellent optical characteristics and the pattern shape is not conspicuous, so it can be applied to a capacitive touch panel and the like. It was confirmed that there was.

  In the present invention, a transparent conductive laminate having high transparency with respect to a plastic substrate such as a film, excellent adhesion, and inconspicuous pattern shape could be produced. The obtained ITO transparent conductive laminate can be sufficiently applied to a capacitance type touch panel or the like.

DESCRIPTION OF SYMBOLS 1 ... Transparent base material 2a, 2b ... Metal oxide layer 3a, 3b ... Silicon oxide layer 4a, 4b ... Indium tin layer 5a, 5b ... Adhesive layer 6a, 6b ... Conductive pattern area | region 7a, 7b ... Nonelectroconductive Pattern areas 8a, 8b ... hard coat layers 10, 20, 30 ... transparent conductive laminate

Claims (5)

A transparent conductive laminate in which a metal oxide layer, a silicon oxide layer, an indium tin oxide layer, and an adhesive layer are provided in this order from the transparent substrate side on one or both surfaces of the transparent substrate. The indium tin oxide layer comprises a conductive pattern region and a non-conductive pattern region, the refractive index of the metal oxide layer is 1.7 or more and 2.6 or less, and the optical film thickness is 12 nm or more and 35 nm or less. The refractive index of the silicon oxide layer is 1.3 or more and 1.5 or less, the optical film thickness is 70 nm or more and 110 nm or less, the optical film thickness of the indium tin oxide layer is larger than 30 nm , and and at 65nm or less, the thickness of the adhesive layer is Ri der than 200μm or less 10 [mu] m,
Total light transmittance is 80% or more, haze is 1% or less, surface resistance is 100Ω / □ or more and 500Ω / □ or less, and transmission hues a * and b * are −4.0 to 4.0, respectively. (Color calculation: 2 °, visual field D65 light source), reflection hues a * and b * are −4.0 to 4.0 (color calculation: 2 °, visual field D65 light source), and the conductive pattern The difference in transmittance and reflectance between the region and the non-conductive pattern region is −3.0% or more and 3.0% or less in the range of 450 nm or more and 750 nm or less, respectively. the non-conductive transparent color difference Delta] E * ab between the pattern region (T) and the reflection color difference ΔE * ab (R) is a transparent conductive laminate, respectively, characterized in der Rukoto -5.0 to 5.0 .   2. The hard coat layer in contact with the transparent substrate is provided on one surface or both surfaces of the transparent substrate, and the film thickness of the hard coat layer is 1 μm or more and 8 μm or less. Transparent conductive laminate. Touch panel, which comprises using a transparent conductive laminate according to claim 1 or 2. On one or both surfaces of the transparent substrate, a metal oxide layer having a refractive index of 1.7 to 2.6 and an optical film thickness of 12 nm to 35 nm, and a refractive index of 1.3 or more. A step of forming a silicon oxide layer having an optical film thickness of 1.5 or less and an optical film thickness of 70 nm or more and 110 nm or less in order from the transparent substrate side by a magnetron sputtering method, and an optical film thickness on the surface of the silicon oxide layer. Forming an indium tin oxide layer having a thickness of 30 nm or more and 65 nm or less by a magnetron sputtering method using a target having a tin oxide content of 2 wt% or more and 15 wt% or less, and the indium tin oxide shape forming a conductive pattern areas and non-conductive pattern area in the layer, the conductive pattern region and an adhesive layer wherein the non-conductive pattern region top And the steps to be completed in this order ,
Total light transmittance is 80% or more, haze is 1% or less, surface resistance is 100Ω / □ or more and 500Ω / □ or less, and transmission hues a * and b * are −4.0 to 4.0, respectively. (Color calculation: 2 °, visual field D65 light source), reflection hues a * and b * are −4.0 to 4.0 (color calculation: 2 °, visual field D65 light source), and the conductive pattern The difference in transmittance and reflectance between the region and the non-conductive pattern region is −3.0% or more and 3.0% or less in the range of 450 nm or more and 750 nm or less, respectively. the transmission color difference Delta] E * ab of the non-conductive pattern region (T) and the reflection color difference ΔE * ab (R) is, that you produce transparent conductive laminate is -5.0 or more and 5.0 or less, respectively A method for producing a transparent conductive laminate. 5. The method according to claim 4 , comprising a step of forming a hard coat layer having a thickness of 1 μm or more and 8 μm or less in contact with the transparent substrate on one or both surfaces of the transparent substrate. A method for producing a transparent conductive laminate.

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