KR20180112004A - 폴리싱 시스템 및 그의 제조 방법 및 사용 방법 - Google Patents

폴리싱 시스템 및 그의 제조 방법 및 사용 방법 Download PDF

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Publication number
KR20180112004A
KR20180112004A KR1020187026429A KR20187026429A KR20180112004A KR 20180112004 A KR20180112004 A KR 20180112004A KR 1020187026429 A KR1020187026429 A KR 1020187026429A KR 20187026429 A KR20187026429 A KR 20187026429A KR 20180112004 A KR20180112004 A KR 20180112004A
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KR
South Korea
Prior art keywords
polishing
substrate
ceramic
abrasive
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020187026429A
Other languages
English (en)
Korean (ko)
Inventor
존 제이 가글리아르디
에릭 씨 코드
폴 에스 러그
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20180112004A publication Critical patent/KR20180112004A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • H01L21/304—
    • H01L21/30625—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020187026429A 2016-02-16 2017-02-10 폴리싱 시스템 및 그의 제조 방법 및 사용 방법 Withdrawn KR20180112004A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662295760P 2016-02-16 2016-02-16
US62/295,760 2016-02-16
PCT/US2017/017379 WO2017142805A1 (en) 2016-02-16 2017-02-10 Polishing systems and methods of making and using same

Publications (1)

Publication Number Publication Date
KR20180112004A true KR20180112004A (ko) 2018-10-11

Family

ID=58057347

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187026429A Withdrawn KR20180112004A (ko) 2016-02-16 2017-02-10 폴리싱 시스템 및 그의 제조 방법 및 사용 방법

Country Status (6)

Country Link
US (1) US20210189175A1 (https=)
JP (1) JP2019513161A (https=)
KR (1) KR20180112004A (https=)
CN (1) CN108603076A (https=)
TW (1) TW201742136A (https=)
WO (1) WO2017142805A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6708994B2 (ja) 2017-03-27 2020-06-10 日立化成株式会社 スラリ及び研磨方法
WO2018179061A1 (ja) 2017-03-27 2018-10-04 日立化成株式会社 研磨液、研磨液セット及び研磨方法
WO2019181016A1 (ja) * 2018-03-22 2019-09-26 日立化成株式会社 研磨液、研磨液セット及び研磨方法
WO2020021680A1 (ja) 2018-07-26 2020-01-30 日立化成株式会社 スラリ及び研磨方法
WO2020065723A1 (ja) 2018-09-25 2020-04-02 日立化成株式会社 スラリ及び研磨方法
KR102952447B1 (ko) * 2019-09-24 2026-04-13 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 연마 조성물 및 이의 사용 방법
EP4045226B1 (en) 2019-10-15 2024-01-03 FUJIFILM Electronic Materials U.S.A., Inc. Polishing compositions and methods of use thereof
CN114703433A (zh) * 2022-04-13 2022-07-05 常熟致圆微管技术有限公司 一种生物可降解的医用金属镁及镁合金板材的制备方法
KR102874526B1 (ko) * 2022-12-19 2025-10-21 한남대학교 산학협력단 Cmp 슬러리의 연마입자 표면에 코팅된 아크릴 폴리머 분산제의 특성연구
CN118271973B (zh) * 2024-05-29 2024-08-20 广东粤港澳大湾区黄埔材料研究院 悬浮抛光液及其制备方法和碳化硅的抛光方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3036003A (en) 1957-08-07 1962-05-22 Sinclair Research Inc Lubricating oil composition
US3236770A (en) 1960-09-28 1966-02-22 Sinclair Research Inc Transaxle lubricant
NL137371C (https=) 1963-08-02
NL145565B (nl) 1965-01-28 1975-04-15 Shell Int Research Werkwijze ter bereiding van een smeermiddelcompositie.
US3414347A (en) 1965-03-30 1968-12-03 Edroy Products Company Inc Binocular with pivoted lens plate
US3574576A (en) 1965-08-23 1971-04-13 Chevron Res Distillate fuel compositions having a hydrocarbon substituted alkylene polyamine
US3539633A (en) 1965-10-22 1970-11-10 Standard Oil Co Di-hydroxybenzyl polyamines
US3461172A (en) 1966-11-22 1969-08-12 Consolidation Coal Co Hydrogenation of ortho-phenolic mannich bases
US3448047A (en) 1967-04-05 1969-06-03 Standard Oil Co Lube oil dispersants
US3586629A (en) 1968-09-16 1971-06-22 Mobil Oil Corp Metal salts as lubricant additives
US3591598A (en) 1968-11-08 1971-07-06 Standard Oil Co Certain condensation products derived from mannich bases
US3634515A (en) 1968-11-08 1972-01-11 Standard Oil Co Alkylene polyamide formaldehyde
US3725480A (en) 1968-11-08 1973-04-03 Standard Oil Co Ashless oil additives
US3726882A (en) 1968-11-08 1973-04-10 Standard Oil Co Ashless oil additives
US3980569A (en) 1974-03-15 1976-09-14 The Lubrizol Corporation Dispersants and process for their preparation
IN172215B (https=) 1987-03-25 1993-05-08 Lubrizol Corp
US5157088A (en) 1987-11-19 1992-10-20 Dishong Dennis M Nitrogen-containing esters of carboxy-containing interpolymers
BR8907130A (pt) 1988-10-24 1991-02-13 Exxon Chemical Patents Inc Composicao de oleo lubrificante,fluido de transmissao de forca,concentrado de aditivo,processo para melhorar a modificacao de atrito de um oleo lubrificante,composicao de sal de amina e sal
JP2000343411A (ja) * 1999-06-01 2000-12-12 Teijin Ltd 研磨用シート
US6319108B1 (en) * 1999-07-09 2001-11-20 3M Innovative Properties Company Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
US6551366B1 (en) 2000-11-10 2003-04-22 3M Innovative Properties Company Spray drying methods of making agglomerate abrasive grains and abrasive articles
CN100556619C (zh) * 2006-05-31 2009-11-04 天津晶岭微电子材料有限公司 蓝宝石衬底材料表面粗糙度的控制方法
US20130017765A1 (en) * 2011-07-11 2013-01-17 3M Innovative Properties Company Lapping carrier and method of using the same
WO2015048011A1 (en) * 2013-09-25 2015-04-02 3M Innovative Properties Company Multi-layered polishing pads
SG11201602206PA (en) * 2013-09-25 2016-04-28 3M Innovative Properties Co Composite ceramic abrasive polishing solution
JP6283940B2 (ja) * 2014-03-28 2018-02-28 富士紡ホールディングス株式会社 研磨パッド
US10556316B2 (en) * 2015-05-13 2020-02-11 3M Innovative Properties Company Polishing pads and systems for and methods of using same

Also Published As

Publication number Publication date
JP2019513161A (ja) 2019-05-23
TW201742136A (zh) 2017-12-01
US20210189175A1 (en) 2021-06-24
CN108603076A (zh) 2018-09-28
WO2017142805A1 (en) 2017-08-24

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