KR20180089398A - 무전해 금속 도금용 안정제로서의 수용성이고 공기 안정성인 포스파아다만탄 - Google Patents
무전해 금속 도금용 안정제로서의 수용성이고 공기 안정성인 포스파아다만탄 Download PDFInfo
- Publication number
- KR20180089398A KR20180089398A KR1020187013527A KR20187013527A KR20180089398A KR 20180089398 A KR20180089398 A KR 20180089398A KR 1020187013527 A KR1020187013527 A KR 1020187013527A KR 20187013527 A KR20187013527 A KR 20187013527A KR 20180089398 A KR20180089398 A KR 20180089398A
- Authority
- KR
- South Korea
- Prior art keywords
- metal
- electrolyte
- acid
- group
- carbon atoms
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15189465.6A EP3156517B1 (en) | 2015-10-13 | 2015-10-13 | Use of water soluble and air stable phosphaadamantanes as stabilizer in electrolytes for electroless metal deposition |
EP15189465.6 | 2015-10-13 | ||
PCT/US2016/055655 WO2017066069A1 (en) | 2015-10-13 | 2016-10-06 | Water soluble and air stable phosphaadamantanes as stabilizers for electroless metal deposition |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20180089398A true KR20180089398A (ko) | 2018-08-08 |
Family
ID=54324851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020187013527A KR20180089398A (ko) | 2015-10-13 | 2016-10-06 | 무전해 금속 도금용 안정제로서의 수용성이고 공기 안정성인 포스파아다만탄 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20190085461A1 (zh) |
EP (1) | EP3156517B1 (zh) |
KR (1) | KR20180089398A (zh) |
CN (1) | CN108495952A (zh) |
ES (1) | ES2712858T3 (zh) |
TW (1) | TW201718938A (zh) |
WO (1) | WO2017066069A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI646215B (zh) * | 2017-11-03 | 2019-01-01 | 陳始明 | 無電極電鍍金屬的裝置及其方法 |
CN109457238B (zh) * | 2018-08-30 | 2021-01-15 | 上海昕沐化学科技有限公司 | 高速稳定的化学镀铜液及其制备方法 |
JP7228411B2 (ja) * | 2019-03-06 | 2023-02-24 | 上村工業株式会社 | 無電解金めっき浴 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0769572A1 (en) | 1995-06-06 | 1997-04-23 | ENTHONE-OMI, Inc. | Electroless nickel cobalt phosphorous composition and plating process |
JP3816241B2 (ja) * | 1998-07-14 | 2006-08-30 | 株式会社大和化成研究所 | 金属を還元析出させるための水溶液 |
DE10015214C1 (de) * | 2000-03-27 | 2002-03-21 | Infineon Technologies Ag | Verfahren zur Metallisierung eines Isolators und/oder eines Dielektrikums |
DE10246453A1 (de) | 2002-10-04 | 2004-04-15 | Enthone Inc., West Haven | Verfahren zur stromlosen Abscheidung von Nickel |
JP2005290415A (ja) | 2004-03-31 | 2005-10-20 | Okuno Chem Ind Co Ltd | 無電解銅めっき液 |
JP5247142B2 (ja) | 2007-12-19 | 2013-07-24 | 株式会社大和化成研究所 | 銀めっき方法 |
CN101348927B (zh) | 2008-09-05 | 2010-10-06 | 江南机器(集团)有限公司 | 无氰预镀铜溶液 |
GB2467163B (en) * | 2009-01-26 | 2013-11-06 | Rhodia Operations | Ligands |
WO2011003116A2 (en) * | 2009-07-03 | 2011-01-06 | Enthone Inc. | Beta-amino acid comprising electrolyte and method for the deposition of a metal layer |
-
2015
- 2015-10-13 EP EP15189465.6A patent/EP3156517B1/en active Active
- 2015-10-13 ES ES15189465T patent/ES2712858T3/es active Active
-
2016
- 2016-10-06 CN CN201680059667.6A patent/CN108495952A/zh active Pending
- 2016-10-06 US US15/765,637 patent/US20190085461A1/en not_active Abandoned
- 2016-10-06 WO PCT/US2016/055655 patent/WO2017066069A1/en active Application Filing
- 2016-10-06 KR KR1020187013527A patent/KR20180089398A/ko not_active Application Discontinuation
- 2016-10-12 TW TW105132884A patent/TW201718938A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP3156517B1 (en) | 2018-12-05 |
US20190085461A1 (en) | 2019-03-21 |
WO2017066069A8 (en) | 2018-07-19 |
EP3156517A8 (en) | 2017-06-07 |
CN108495952A (zh) | 2018-09-04 |
WO2017066069A1 (en) | 2017-04-20 |
TW201718938A (zh) | 2017-06-01 |
EP3156517A1 (en) | 2017-04-19 |
ES2712858T3 (es) | 2019-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6501821B2 (ja) | 基板上に金属層を堆積させるための鍍金処方物 | |
EP2855732A2 (en) | Plating bath for electroless deposition of nickel layers | |
JP2013508538A5 (zh) | ||
WO2015020772A1 (en) | Electroless nickel plating solution and method | |
KR20180089398A (ko) | 무전해 금속 도금용 안정제로서의 수용성이고 공기 안정성인 포스파아다만탄 | |
US6020021A (en) | Method for depositing electroless nickel phosphorus alloys | |
JP6053785B2 (ja) | 無電解ニッケルめっき浴組成物 | |
TWI709663B (zh) | 用於金之無電電鍍之鍍浴組合物、沉積金層之方法及乙二胺衍生物之用途 | |
CA2968437C (en) | Plating bath and method for electroless deposition of nickel layers | |
WO2023144003A1 (en) | Composition for depositing a palladium coating on an activated copper-coated substrate | |
EP2270255A1 (en) | Beta-amino acid comprising electrolyte and method for the deposition of a metal layer | |
JP2021511438A (ja) | 無電解金めっき浴 | |
US20170350016A1 (en) | Use of Water Soluble Lanthanide Compounds As Stabilizer In Electrolytes For Electroless Metal Deposition | |
KR101507452B1 (ko) | Pcb 제조를 위한 무전해 니켈-팔라듐-금 도금 방법 | |
JP2023539306A (ja) | 基板上にパラジウム被覆を析出させるための組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |