KR20180075658A

KR20180075658A - Copper alloy plate for heat dissipation parts

Info

Publication number: KR20180075658A
Application number: KR1020187015408A
Authority: KR
Inventors: 마사야스 니시무라; 야스시 마사고; 다이스케 하시모토
Original assignee: 가부시키가이샤 고베 세이코쇼
Priority date: 2015-11-03
Filing date: 2016-11-01
Publication date: 2018-07-04
Also published as: JP2017089003A; WO2017078013A1; TW201726935A; TWI621722B; CN108350531A

Abstract

Provided is a copper alloy plate for heat dissipation parts having high strength, excellent processability and heat radiation property. A steel sheet, comprising at least one of Ni and Co in an amount of 0.8 to 4.0 mass% and Si in an amount of 0.2 to 1.0 mass%, one or both of Ni and Co and Si in a mass ratio of 3.0 to 7.0, Copper alloy plate made of impurities. The tensile strength in the direction parallel to the rolling direction is 570 MPa or more, the strength is 500 MPa or more, the elongation is 5% or more, the tensile strength in the direction perpendicular to the rolling direction is 550 MPa or more, the proof strength is 480 MPa or more, the elongation is 5% And the bending line width is 70 mm or more when the bending line is set in the direction perpendicular to the rolling direction and 90 degrees bending is performed at R / t = 0.5, and the bending line A width of 20 mm or more, and a rank pod value of 0.9 or more.

Description

Copper alloy plate for heat dissipation parts

This disclosure relates to a copper alloy plate used for a CPU installed in an electronic device such as a personal computer, a tablet terminal, a smart phone, a mobile phone, and a digital camera, and a heat dissipation component dissipating heat such as liquid crystal.

BACKGROUND ART [0002] Heat dissipation parts for dissipating heat generated from electronic components such as a CPU, a liquid crystal, and an image pickup element mounted on electronic devices such as a personal computer, a tablet terminal, a smart phone, a cellular phone, a digital camera, and a digital video camera are used. The heat dissipation component prevents an excessive increase in the temperature of the electronic component, thereby preventing thermal runaway of the electronic component and functioning normally. As heat dissipating parts, those made of pure copper having high thermal conductivity, stainless steel excellent in strength and corrosion resistance, and lightweight aluminum alloy have been used. These heat-dissipating components are not only a heat-dissipating function but also a structural member for protecting the mounted electronic components from an external force applied to the electronic apparatus.

BACKGROUND ART [0002] Electronic components mounted on electronic devices are required to have higher speed and higher functionality, and the densification of electronic components is always in progress. Therefore, the amount of heat generated by the electronic components is rapidly increasing. In addition, in order to reduce the size, thickness, and weight of electronic devices, it is required to reduce the thickness of heat dissipation parts. However, even when the heat dissipation parts are thinned, it is required to maintain the heat dissipation performance and the structural strength.

The plate material, which is the material of the heat dissipation part, is molded into a heat dissipating part through plastic forming such as heme bending (close bending), 90 bending, extrusion, stepping, and drawing. In the bending process, the width of the bent portion (the length of the bent line) of the lead frame and the terminal is about several millimeters or less. However, in the heat dissipation component, the width of the bent portion is about 20 mm or more. It is known that the bending workability of the plate material decreases sharply as the bending width increases, and rigid bending workability is required in the plate material for heat dissipation parts as compared with the plate material for terminals and lead frames. Further, in the extrusion and stepped machining, molding may be performed up to about 1 mm in height. The rank pod value is sometimes used as an index showing good and poor processability of drawing and extruding workability.

Pure copper as a material for heat dissipation parts is excellent in thermal conductivity, but has a small strength and can not make thinner heat dissipation parts. Stainless steel and nickel silver are low in thermal conductivity (2 to 6% IACS) and can not be used as heat dissipation parts for electronic components with large heat dissipation. Aluminum alloys are insufficient in both strength and thermal conductivity. On the other hand, as for the copper alloy, Patent Document 1 discloses a (Ni, Co) -Si-based copper alloy excellent in conductivity, stress relaxation property and molding processability, but does not disclose the bending workability.

Japanese Patent Application Laid-Open No. 2015-101760

It is an object of the present invention to provide a copper alloy plate for heat dissipation parts having excellent moldability including heat resistance, bending workability, and heat dissipation.

The copper alloy sheet for a heat dissipation component according to the present disclosure is characterized in that it contains 0.8 to 4.0% by mass of one or two kinds of Ni and Co, 0.2 to 1.0% by mass of Si and one or two kinds of Ni and Co, Si, the balance being 3.0 to 7.0, the balance being Cu and inevitable impurities, the tensile strength in the rolling parallel direction being not less than 570 MPa, the tensile strength not less than 500 MPa, the elongation not less than 5%, the tensile strength in the direction perpendicular to the rolling not less than 550 MPa, The bending line is made to be in the rolling vertical direction and the 90 degree bend is carried out by setting the ratio R / t of the bending radius R and the plate thickness t to 0.5 , A bending limit width of not less than 70 mm and a bending limit of not less than 20 mm and a rank pod value of not less than 0.9 when the bending line is in the direction perpendicular to the rolling direction. On the other hand, the higher the rank pod value (r value), the better the molding processability such as extrusion and drawing processing.

The copper alloy may further include one or two kinds of Zn: not more than 2.5% and Sn: not more than 1%. In addition, one or both of Mg, Al, Cr, Mn, Ca, Ti, Zr, Fe and P may be contained in a total amount of 1 mass% or less (P content thereof is 0.1 mass% or less).

The surface coating layer may be formed on the surface of the copper alloy plate by plating or the like as needed, thereby improving the corrosion resistance. As the surface coating layer, a plating layer made of any one of Sn layer, Cu-Sn alloy layer, Ni, Co, Fe, Ni-Co alloy or Ni-Fe alloy is conceivable.

According to the present disclosure, the strength as a structural member, particularly, the strength to withstand deformation and drop impact resistance, the molding processability such as bending, extrusion and drawing that can withstand processing into a complicated shape, and the high heat dissipation property A copper alloy plate for a heat dissipation component can be provided. Further, when the surface coating layer is formed on the copper alloy plate, the corrosion resistance is improved, and the performance as a heat radiation member can be prevented from deteriorating even in a severe environment.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view for explaining a test method of a 90-degree bend test of the embodiment. Fig.
Fig. 2 is a view for explaining a test method of the extrudability evaluation test of the embodiment. Fig.

Hereinafter, a copper alloy for a heat dissipation component according to an embodiment of the present invention will be described in detail.

The composition of the copper alloy is that it contains 0.8 to 4.0% by mass of one or two kinds of Ni and Co, 0.2 to 1.0% by mass of Si, one or two kinds of Ni and Co and Si, 7.0, and the remainder is composed of Cu and inevitable impurities.

The copper alloy includes, as necessary, one or two of Zn and not more than 2.5% by mass of Sn and not more than 1% by mass of Sn, if necessary. If necessary, one or both of Mg, Al, Cr, Mn, Ca, Ti, Zr, Fe and P are contained in an amount of 1 mass% or less (P content is 0.1 mass% or less) .

Ni or Co and Si precipitate an intermetallic compound, thereby increasing the strength of the copper alloy. (Ni content or Co content in one kind, Ni content and Co content in two cases) of Ni or Co is less than 0.8% by mass or Si content is less than 0.2% , The precipitation amount of the Ni-Si or / and Co-Si compound is small and the desired strength can not be obtained. On the other hand, when the content of one or both of Ni and Co exceeds 4.0% by mass and the Si content exceeds 1% by mass, cracks are generated during hot rolling. On the other hand, when the content of one or both of Ni and Co exceeds 4.0 mass%, or when the Si content exceeds 1 mass%, cracks tend to occur during hot rolling. Therefore, the content of one or both of Ni and Co is set to 0.8 to 4.0 mass%, and the Si content is set to 0.2 to 1 mass%.

When the mass ratio of one or both of Ni or Co and Si is less than 3 or more than 7, desired strength and conductivity can not be satisfied at the same time. Therefore, the mass ratio is set to 3.0 to 7.0. Preferably, the lower limit of the mass ratio is 3.5, and the upper limit is 5.5. On the other hand, the mass ratio of one or both of Ni or Co and Si means that the ratio of [Ni] + [Co] and the content of [Si], when the content of Ni is [Ni], the content of Co is [Co] Co]) / [Si]. This mass ratio is calculated by setting [Co] = 0 mass% when Co is not contained in the copper alloy and [Ni] = 0 mass% when Ni is not contained.

Zn and / or Sn, which are added as needed as a subcomponent, act to improve the strength of the copper alloy. However, if the Zn content exceeds 2.5% by mass or the Sn content exceeds 1% by mass, the strength of the copper alloy improves, but the conductivity and the thermal conductivity deteriorate. Therefore, the Zn content is 2.5 mass% or less and the Sn content is 1 mass% or less.

Further, Mg, Al, Cr, Mn, Ca, Ti, Zr, Fe and P which are added as necessary as auxiliary components have an effect of improving the strength of the copper alloy. The subcomponent elements other than P have an effect of improving the hot rolling property at the time of production. However, if the total content of these subcomponents is more than 1% by mass, the strength of the copper alloy is improved, but the conductivity and the thermal conductivity are lowered. Therefore, these subcomponents are added within a range in which the total content is 1 mass% or less and the conductivity of the copper alloy sheet is not less than 35% IACS. The preferable range of the total content of these subcomponents is 0.7% by mass or less, and more preferably 0.5% by mass or less. The content of P is regulated to 0.1% by mass or less, preferably 0.05% by mass or less, from the viewpoint of preventing deterioration of hot rolling property. The addition amount of each of the subcomponents except for P is preferably 0.2% by mass or less of Mg and Fe, 0.1% by mass or less of Al, Cr, Mn, Ti and Zr, and 0.05% to be.

The heat-dissipating component is required to have strength as a structural member, particularly strength to withstand deformation and drop impact. If the tensile strength of the copper alloy sheet in the rolling parallel direction is 570 MPa or more, the proof stress is 500 MPa or more, the tensile strength in the direction perpendicular to the rolling direction is 550 MPa or more, and the proof stress is 480 MPa or more, . When the elongation in the rolling parallel direction of the copper alloy sheet is 5% or more and the elongation in the direction perpendicular to the rolling direction is 5% or more, the molding processability in the case of forming the heat dissipating member from the copper alloy sheet by drawing and / There is no problem in particular. On the other hand, the proof stress is a tensile strength when a 0.2% permanent elongation occurs in the tensile test.

When a heat dissipating member is molded using a copper alloy sheet as a material, generally, a copper alloy sheet is required to have excellent bending workability, drawing workability, and extrusion workability. The bending limit width of the copper alloy plate when the bending line is made to be 90 degrees in the rolling direction and the ratio R / t of the bending radius R to the plate thickness t is 0.5 and the bending line width is 70 mm or more, If the bending limit width in the case of performing close contact bending in the vertical direction is 20 mm or more, the manufacturing process including the bending process is not hindered. In the case where the bending limit width of the copper alloy sheet does not reach the above value, cracking and / or fracture occurs in the bending portion in the process of manufacturing the heat dissipation component, making it difficult to form into a complicated shape. When the rank-pod value (r value) of the copper alloy sheet is 0.9 or more, no problem occurs in the manufacturing process including extrusion or drawing. If the r value is less than 0.9, cracks and / or fractures occur in the extruded or drawn portion, making molding into a complex shape difficult as in the case of bending.

In order to absorb heat generated from a semiconductor element or the like and dissipate it to the outside, it is preferable that the copper alloy plate for a heat dissipation component has a conductivity of more than 35% IACS and a thermal conductivity of more than 150 W / m · K.

On the other hand, the thermal conductivity can be converted from the conductivity by the Wiedemann-Franz rule, and when the conductivity is 35% IACS or more, the thermal conductivity is 150 W / m · K or more.

&Lt; Process for producing a copper alloy plate &

The copper alloy sheet according to the embodiment of the present invention can be produced by a process of melt casting, homogenizing treatment, hot rolling, cold rolling, recrystallization annealing, finish cold rolling and aging annealing.

In the homogenizing treatment, the ingot is heated at 900 to 1000 占 폚 for 0.5 to 5 hours, hot rolling is started at that temperature, hot rolling is terminated at a temperature of 700 占 폚 or more, Water cooling).

The machining rate per pass of hot rolling affects not only thermal series but also toughness of the final product, homogeneity and densification of the structure. In order to produce a copper alloy sheet for a heat-radiating part according to an embodiment of the present invention, it is preferable that the average value of the machining rate per pass of the hot rolling is 20% or more and the maximum machining rate is 25% or more.

The reason for this is as described below.

When the rolling by the rolling roll is applied, compressive stress is applied in the rolling direction to the region of constant depth hc from the surface of the rolled ingot immediately after the rolling roll, tensile stress in the rolling direction in the region of the central portion of the thickness of the ingot from the depth hc Is known to work. In the region where the compressive stress acts, the compressive stress becomes larger as the depth from the surface becomes shallower. In the region where the tensile stress acts, the tensile stress increases as the center becomes closer to the center of thickness of the ingot.

The depth hc, which is changed from compressive stress to tensile stress, can be calculated by the rolling roll diameter and the reduction amount (thickness on the side of the rolling roll - plate thickness on the outward side of the rolling roll), etc. (OG Muzalevskii: Stal in English, June 455). According to this calculation formula, when the rolling roll diameter is constant, hc becomes larger as the pressing amount becomes larger (that is, the machining rate also becomes larger). That is, the region where the tensile stress acts in the ingot becomes smaller.

The ingot has defects such as micro cavities due to shrinkage holes and gas, and microsegregations and inclusions of alloying elements, and these defects become closer to the center of the ingot thickness. It is industrially difficult to set these defects to zero.

When the ingot is heated for the homogenization treatment, the micro-segregation is solved by the diffusion of the alloying element, but the micro cavity inside the ingot is not eliminated. Rather, the homogenization treatment forms a curtain of voids, and the gas component dissolved in the ingot precipitates at the inclusions-parent metal interface and / or intergranular boundaries, and the microvoids inside the ingot tend to increase.

Since there are micro cavities and inclusions inside the ingot, it is preferable to increase the machining rate per one pass of the hot rolling in order to increase the internal quality of the hot rolled material. Therefore, it is preferable that the machining rate per pass of the hot rolling is 20% or more on average and the maximum machining rate is 25% or more. More preferably, the average value of the machining rate per one pass of the hot rolling is 25% or more, and the maximum machining rate is 30% or more.

Further, by increasing the machining rate per one pass of the hot rolling, the number of hot rolling passes can be reduced and the hot rolling can be finished at a higher temperature. Therefore, quenching (quenching) from a higher temperature becomes possible, and the amount of alloying element in the thermal expansion material can be increased. As a result, it is possible to improve the uniformity of the structure of the copper alloy plate (product) after the cold rolling and the heat treatment which are performed continuously, and to obtain good bending workability, drawing workability and extrusion workability.

On the other hand, when a large pressure drop is applied to the ingot at the beginning of the hot rolling, cracks may occur on the rolled surface in the vicinity of the end surface of the ingot. For this reason, in the manufacturing process, rolling from the first pass to the third pass of the hot rolling is generally performed at a light processing rate.

However, if the rolling pass of the light-machining rate is continued at the initial stage of the hot rolling, a tensile stress acts in the region from the hc to the ingot center for every rolling pass, and the micro-cavities in the ingot and the inter- And microscopic cracks are generated. Thereafter, even if the machining rate per one pass is increased, the compression of the cracks once formed is delayed, and the internal quality of the thermal expansion material is deteriorated. The copper alloy sheet produced by subjecting such heat spreading material to cold rolling and heat treatment is difficult to be subjected to rigorous processing such as wide bending, heme bending, drawing processing, and extrusion processing with a small bending R.

Therefore, in order to produce the copper alloy sheet according to the embodiment of the present invention, it is preferable to set the average machining rate at the beginning of the hot rolling, specifically, the third pass from the first pass to 10% or more. The average machining ratio of the first pass through the third pass is more preferably 12% or more, and more preferably 15% or more.

If the initial machining rate of the hot rolling is increased, hot cracking of the ingot tends to occur. To avoid this, it is preferable to roll the ingot cross section by edger before the start of the first pass. By employing Ezer, it is possible to increase the processing rate at the initial stage of rolling and to prevent or reduce the occurrence of internal cracks at the initial stage of rolling.

After hot rolling, if necessary, both sides of the heat spreader are subjected to cold rolling at an appropriate rolling rate. The processing rate of the cold rolling may be appropriately set so as to obtain a predetermined processing rate and a product plate thickness in the finish cold rolling.

In the subsequent recrystallization annealing, the cold rolled steel sheet is heated in the temperature range of 620 to 850 캜 for 10 to 100 seconds. This recrystallization annealing is performed in order to improve elongation, bending workability and extrusion workability of the copper alloy plate (product). If the temperature of the recrystallization annealing is less than 620 占 폚 or the holding time is less than 10 seconds, recrystallization becomes insufficient and the workability of the copper alloy plate (product) deteriorates. On the other hand, when the temperature of the recrystallization annealing exceeds 850 DEG C or the holding time exceeds 100 seconds, the recrystallized grains are coarsened (coarsening with an average crystal grain size of 10 mu m or more) Is not obtained. The cooling after the recrystallization annealing is carried out by increasing the amount of Ni, Co, and Si in a large amount and increasing the average cooling rate from the temperature of the recrystallization annealing to 300 ° C to maximize the effect of improving the strength and the conductivity in the aging step Is at least 5 ° C / sec.

After the recrystallization annealing, finish cold rolling is carried out if necessary. In the case of performing the finish cold rolling, the processing rate may be appropriately set within a range of preferably 30% or less.

Followed by aging annealing. The conditions for the aging annealing are preferably in the range of from 350 to 570 DEG C for 1 to 10 hours. If the temperature of the aging treatment is less than 350 占 폚 or the holding time is less than 1 hour, the precipitation is insufficient and the conductivity of the copper alloy sheet (product) is not improved. On the other hand, if the temperature of the aging treatment exceeds 570 占 폚 or the holding time exceeds 10 hours, the precipitate becomes coarse, and sufficient strength can not be obtained in the copper alloy plate (product). After aging annealing, the copper alloy sheet is cooled to room temperature.

On the other hand, when the product form is a long coil, the aging annealing is performed in the coil state, so that the coil after annealing tends to be wound, making it difficult to carry out a forming process such as cutting, press forming, stamping and etching . Therefore, in order to eliminate or reduce the winding tendency of the coil, it is preferable to perform the deformation correction by the tension leveler or the tension annealing process. In addition, when the requirements of dimensional precision, bending reduction, stress relaxation resistance, and the like of the molded member such as press molding, stamping, and etching are strict, continuous low temperature annealing is further performed in addition to the coil subjected to the tension leveler or the tension annealing .

By forming the surface coating layer on the copper alloy plate by plating or the like, the corrosion resistance of the heat dissipation component is improved, and the performance as a heat dissipation component can be prevented from deteriorating even in a severe environment.

As the surface coating layer formed on the surface of the copper alloy sheet, a Sn layer is preferable. When the thickness of the Sn layer is less than 0.2 占 퐉, the improvement of the corrosion resistance is not sufficient, and when it exceeds 5 占 퐉, the productivity is lowered and the cost is increased. Therefore, the thickness of the Sn layer is set to 0.2 to 5 mu m. The Sn layer includes a Sn metal and a Sn alloy.

As the surface coating layer, a Cu-Sn alloy layer may be formed below the Sn layer. If the thickness of the Cu-Sn alloy layer exceeds 3 탆, the bending workability and the like decrease, so that the thickness of the Cu-Sn alloy layer is 3 탆 or less. In this case, the thickness of the Sn layer is 0 to 5 mu m (including the case of no Sn layer), and the total thickness of the Cu-Sn alloy layer and the Sn layer is 0.2 mu m or more.

The Cu-Sn alloy layer may be exposed on the surface (see Japanese Patent Laid-Open Nos. 2006-183068 and 2013-185193). Since the Cu-Sn alloy layer has a hardness of Hv: 200 to 400, it has a scratch-inhibiting effect by handling. The surface exposure rate (value obtained by multiplying the surface area of the Cu-Sn alloy layer exposed per unit area of the surface of the material by 100) of the Cu-Sn alloy layer is preferably 50% or less. On the other hand, when there is no Sn layer on the Cu-Sn alloy layer (the thickness of the Sn layer is zero), the surface exposure rate of the Cu-Sn alloy layer is 100%.

A plating layer composed of any one of Ni, Co, Fe, Ni-Co alloy or Ni-Fe alloy can be formed as a base layer below the Cu-Sn alloy layer. If the thickness of the plated layer exceeds 3 탆, the bending workability and the like decrease, and therefore, the thickness is 3 탆 or less. The thickness of the plating layer is preferably 0.1 탆 or more.

Further, only the plating layer (not including the Cu-Sn alloy layer and / or Sn layer) of any one of Ni, Co, Fe, Ni-Co alloy or Ni-Fe alloy can be formed as the surface coating layer . The thickness of the plating layer is 3 μm or less from the viewpoint of preventing deterioration such as bending workability and the like. The thickness of the plating layer is preferably 0.1 탆 or more.

Each of the surface coating layers may be formed by electroplating, reflow plating, electroless plating, sputtering or the like. The Cu-Sn alloy layer can be formed by subjecting a copper alloy sheet as a base material to Sn plating, or a copper alloy base material by Cu plating and Sn plating, followed by a reflow treatment, and reacting Cu with Sn. The heating conditions for the reflow treatment are 230 to 600 ° C for 5 to 30 seconds.

Example One

No. of Table 1 The copper alloy having the composition shown in 1 to 26 was dissolved and dissolved in an ingot having a thickness of 50 mm, a length of 80 mm and a width of 200 mm in the atmosphere by an electric furnace. Thereafter, the ingot was heated at 950 占 폚 for one hour, then hot-rolled to a thickness of 15 mm, immersed in water at 800 占 폚 and quenched. For the hot rolling rolls, rolls having a diameter of 450 mm were used. The pass schedule for hot rolling was 50mm ⇒42mm (16.0%) ⇒35mm (16.7%) ⇒27mm (22.9%) ⇒20mm (25.9%) ⇒15mm (25.0%) with a 5-pass finish. The parentheses indicate the machining rate. The average value of the machining rate per pass is 21.3%. On the other hand, The hydrogen content of the copper alloy of 1 to 26 was 0.5 to 1.1 mass ppm and the oxygen content was 4 to 23 mass ppm.

Next, after the edges of both ends of the rolled material were cut off, the surface thereof was ground to remove the oxide film and cold-rolled to a thickness of 0.21 mm.

Subsequently, recrystallization annealing at 750 占 폚 for 60 seconds was performed. The plate material after recrystallization annealing was water-cooled. On the other hand, the average crystal grain size (measured in the rolling parallel direction by the cutting method specified in JISH0501) measured on the surface of the plate after the recrystallization annealing was less than 10 mu m.

Subsequently, finishing cold rolling was carried out to make the plate thickness to 0.15 mm, and then the aging annealing was carried out under the conditions of 500 deg. C x 2Hr.

The stainless steel plate (SUS304) and aluminum alloy (5052 (H34)), which are commercially available stainless steel plates having the same plate thickness as the copper alloy tank (product plate) obtained in the above process, (r value) and extrusion processability were measured in the following manner.

These results are shown in Table 2.

In addition, (No. 29, 30) having the same composition as in Example 2 were subjected to hot rolling with different pass schedules.

No. The 29 pass schedules were 50 mm ⇒ 48 mm (4.0%) ⇒ 46 mm (4.2%) ⇒ 44 mm (4.3%) ⇒ 42 mm (4.5%) ⇒ 40 mm (4.8%) ⇒ 38 mm 36mm (5.3%) ⇒34mm (5.6%) ⇒32mm (5.9%) ⇒30mm (6.3%) ⇒28mm (6.7%) ⇒26mm (7.1%) ⇒24mm (7.7%) ⇒22mm 9.1%) ⇒ 18mm (10.0%) ⇒15mm (16.7%). The average value of the machining rate per pass is 6.8%. On the other hand, at the end of each pass, the temperature of the thermal expansion material was measured by a surface thermometer. When the temperature reached 800 ° C, the temperature was again inserted into the furnace at 950 ° C and the temperature was elevated. The temperature of the heat seal immediately after the pass of the 17 pass was 810 deg. No. 29, the conditions of the steps other than the hot rolling were as follows. Same as 1-26.

No. The 30 pass schedules were 50mm ⇒46mm (8.0%) ⇒42mm (8.7%) ⇒38mm (9.5%) ⇒34mm (10.5%) ⇒30mm (11.8%) with a 5-pass finish. No. 30, the conditions of the steps other than the hot rolling and the first cold rolling (the processing ratio was increased because of the large thickness of the heat spreading material) were as follows. Same as 1-26.

On the other hand, the average crystal grain size (measured in the rolling parallel direction by the cutting method specified in JISH0501) measured on the surface of the plate after the recrystallization annealing was as follows. 29 and 30 were all less than 10 μm.

No. 29, and 30 copper alloy tanks (product tiles) were used as test materials, and the mechanical properties, conductivity, bending limit width, rank pod value (r value), and extrusion processability were measured and evaluated.

These results are shown in Table 3. In Table 3, 2 are also described.

JIS No. 5 test specimens were taken from each of the specimens so that their longitudinal directions were parallel and perpendicular to the rolling direction and tensile tests were carried out on the basis of the provisions of JIS Z2241 to determine the direction of parallelism ( ∥ ) and Tensile strength, and proof strength (tensile strength at the time of 0.2% permanent elongation) and elongation were measured.

The conductivity was measured based on the provisions of JISH0505 (measurement temperature: 25 DEG C).

&Lt; Bending limit width of 90 degree bending >

Four test pieces (three pieces for each width) having different lengths of 30 mm in length and 10 to 100 mm in width (widths of 10, 15, 20, 25 ... to 100 mm in intervals of 5 mm) were prepared. So that the direction of the side of the test piece 30 mm in length is parallel to the rolling direction of the specimen. Using this test piece, the V-shaped block 1 and the press fitting 2 shown in Fig. 1 were set in a hydraulic press, the ratio R / t of the bending radius R to the plate thickness t was set to 0.5, 1) in the width direction of the test piece 3 (Good Way bending) and bending at 90 degrees. The width of the V-shaped block 1 and the pressing metal 2 (thickness in the direction perpendicular to the paper surface of Fig. 1) was 120 mm. The load of the hydraulic press was set to 1000 kgf (9800 N) per 10 mm width of the test piece.

After the bending test, the entire length of the outside of the bending portion of the test piece was observed with an optical microscope of 100 times, and no crack was observed in all of the three test pieces. The maximum width of the test piece determined to be free of cracks was defined as the bending limit width of the blank. On the other hand, the bending limit width of 70 mm or more was evaluated as acceptable.

&Lt; Bending limit width of contact bending >

A test piece of a quadrangular shape having different widths of 30 mm in length and 5 to 50 mm in width (5 mm wide, 5 mm wide, 10 mm wide, 15 mm wide and 20 mm wide at intervals of 5 mm) was prepared from the specimen in the same manner as in the 90- Three for each width). The direction of the 30 mm length of the specimen was parallel to the rolling direction. Using this test piece, the ratio R / t of the bending radius R to the plate thickness t was set to 2.0, and the direction of the bent line was set to the width direction of the test piece (Good Way) After that, close bending was performed.

After the bending test, the presence or absence of cracks in the bent portion was observed with an optical microscope of 100 times, and in the case where no crack was observed at all of the three test pieces, no crack was determined. The maximum width of the test piece determined to be free of cracks was defined as the bending limit width of the test piece. On the other hand, the bending limit width of 20 mm or more was evaluated as acceptable.

&Lt; Measurement of rank pod value (r value) >

JIS-5 tensile test specimens were prepared from the test specimens cut in parallel to the rolling direction, at 45 degrees and in the direction perpendicular to the rolling direction, and subjected to a tensile test. The r value was calculated by the following equation using the value at the time of 5% strain. On the other hand, an r value of 0.9 or more was evaluated as acceptable.

r = 0.25 x (r1 + 2 x r2 + r3)

r1: r value at 5% strain measured with tensile specimen in parallel rolling direction

r2: r value at 5% strain measured with a tensile specimen in the rolling direction at 45 °

r3: r value at 5% strain measured with tensile specimen in the direction perpendicular to the rolling direction

&Lt; Evaluation of extrudability &

A specimen of 25 mm x 25 mm square was cut out from the blank. So that the direction of the pair of feces of the test piece was parallel to the rolling direction of the specimen. Using this test piece, as shown in Fig. 2, the test piece 5 was placed on a die 4 having a square hole 4a opened so that one side of the test piece and one side of the hole of the die were parallel to each other, And the punch 7 having a square cross section with a side length of 10 mm was lowered at a speed of 1 mm / min, . The inner corner radius at the upper end of the die 4 is 1.5 mm, and the radius of the corner at the lower end of the punch 7 is 0.8 mm. The strength (load) applied to the punch 6 was measured using an autograph, and the displacement at the maximum strength was defined as the height of the test piece 5. On the other hand, the extrusion height was evaluated as 0.8 mm or more.

As shown in Tables 1 and 2, the alloy having the alloy composition defined in the present disclosure and having the pass schedule of hot rolling set as a preferable condition. 1 to 17 satisfy tensile strength, proof stress, elongation, conductivity, bending limit width of 90-degree bending and close-contact bending, and rank-pod value (r-value). In addition, 1 to 17, a large ejection height is obtained.

On the other hand, in the case of the No. 1 having no alloy composition prescribed in this disclosure. 19 to 23 and the pass schedule of hot rolling were set as the preferable conditions. 29 and 30 do not satisfy the specification of the present disclosure at least one of the tensile strength, the proof stress, the elongation, the conductivity, the bending limit width of the 90 degree bending and the close bending, and the rank pod value (r value).

On the other hand, 18 has excessive Ni and Si contents. 24 has excessive Co and Si contents. 25 is excessive in the total content of Ni and Co and the Si content. 26 had an excessive P content, cracks were formed during hot rolling, and subsequent steps could not be carried out.

No. 19 has insufficient Ni and Si contents, and has low tensile strength and proof stress.

No. 20 has an excessive Sn content, low conductivity, and a small bending limit width of 90 degrees bending and close bending.

No. 21 has an excessive Zn content and a low conductivity.

No. 22, and 23, the content of the subcomponent is excessive and the conductivity is low.

No. 29 and 30 have small bending limit widths of 90 degrees bending and close bending. Also, the r value is low and the projecting height is small.

In addition, the commercially available stainless steel sheet No. 27 is a low-conductivity aluminum alloy sheet commercially available. 28 has low strength and strength, and low r value.

Example 2

Next, as shown in Fig. Cu plating, Sn plating, and Ni-Co alloy plating were formed on the surface of the copper alloy tank (product board) of the copper plating bath (product board) Table 4 shows the plating bath composition and plating condition of each plating, and Table 5 shows the thickness of each plating layer.

No. 5 of Table 5. 31 to 33, 36, 37 and 39 to 42 were obtained by performing Cu plating and Sn plating after Ni plating or Ni-Co plating (or not), and then subjected to a reflow treatment. . &Lt; / RTI > The reflow process was performed at 450 캜 for 15 seconds, and the cooling following the reflow process was water cooling. This is a normal condition for reflow processing. No. The Cu-Sn layers 31 to 33, 36, 37, and 39 to 42 are formed by a Cu-plated Sn and a Sn-plated Sn by a reflow process. Cu plating was destroyed by reflow treatment.

No. 5 of Table 5. 38 was made of Ni plating, Cu plating and Sn plating, and Cu of Cu plating and Sn of Sn plating reacted with time to form a Cu-Sn alloy layer, and Cu plating disappeared with time. The thickness of the Sn plating layer is after the disappearance of the Cu plating.

The thickness of each plated layer was measured by the following method.

First, the total thickness of the Sn layer (the total thickness of the Sn layer including the Cu-Sn alloy layer) is measured using a fluorescent X-ray film thickness meter (Seiko Electronics Industry Co., Ltd., type SFT3200). Subsequently, the thickness of the Cu-Sn alloy layer is measured in the following manner. Sn layer thickness was obtained by subtracting the thickness of the Cu-Sn alloy layer from the total thickness of the Sn layer.

<Cu-Sn alloy layer>

p-nitrophenol and caustic soda for 10 minutes to peel off the Sn layer and measure the amount of Sn in the Cu-Sn alloy layer using a fluorescent X-ray film thickness meter. The thickness of the Cu-Sn alloy layer is the Sn-converted thickness.

The thicknesses of the Ni layer and the Ni-Co alloy layer were measured using a fluorescent X-ray film thickness meter.

&Lt; Cu-Sn alloy layer exposure rate >

The surface of each of the post-plating members (on which the Cu-Sn alloy layer was formed) was observed with an SEM (scanning electron microscope), and the surface composition (x 200) obtained for any three fields of view was subjected to bake processing. Thereafter, an average value of the material surface exposure rate of the Cu-Sn alloy coating layer in the above-mentioned three fields of view was measured by image analysis.

The corrosion resistance of the plating material after plating was evaluated by a salt spray test. (Manufactured by Wako Pure Chemical Industries, Ltd.) containing 5% by mass of NaCl was used and the test conditions were as follows: test temperature: 35 占 폚 占 1 占 폚, sprayed liquid PH: 6.5 to 7.2 and spray pressure: 0.098 占0.01 MPa, sprayed for 72 hours and then washed with water and dried. Subsequently, the surface of the test piece was observed with a stereoscopic microscope to observe whether or not there was corrosion (base material corrosion and spot corrosion on the surface of the plating).

&Lt; Evaluation of bending workability of plating material &

Three tetragonal test pieces each having a length of 30 mm and a width of 20 mm were prepared from the respective post-plating members. The direction of the 30 mm long side of the specimen was parallel to the rolling direction of the blank (base material). Using this test piece, the V-shaped block 1 and the press fitting 2 shown in Fig. 1 were set in a hydraulic press, and the ratio R / t of the bending radius R to the plate thickness t was set to 2.0, and the direction of the bent line And 90 degrees bending was performed while being directed in a direction perpendicular to the rolling direction of the base material. The load of the hydraulic press was set to 1000 kgf (9800 N) per 10 mm width of the test piece.

After the bending test, the entire length of the outer side of the bending portion of the test piece was observed with an optical microscope at a magnification of 100, and no crack was observed in one portion of all three test pieces, no cracking, .

As shown in Table 5, the plating composition and the thickness of each plating layer specified in this disclosure were measured. No corrosion of the base material was observed in the salt spray test between 31 and 40, and cracking did not occur in the bending workability test. On the other hand, the Ni layer or the Ni-Co alloy layer is not formed. 33, and the Sn-Sn alloy layer was not left and the Cu-Sn alloy layer was exposed on the surface. 37, no substrate corrosion was observed, but spot erosion (surface corrosion of the coating layer surface) was observed.

On the other hand, when the thickness of the plating layer is outside the range of the present disclosure, 41 to 43 showed corrosion of the base material in the salt spray test, but cracking occurred in the plating in the bending workability test.

No. 41, the thickness of the Sn layer was thin, the total thickness of the Cu-Sn alloy layer and the Sn layer was insufficient, and substrate material corrosion occurred.

No. 42 and 43, the thickness of the Cu-Sn alloy layer or the Ni layer was large, and cracking occurred in the plating in the bending test.

The disclosure of the present specification includes the following aspects.

Sun 1:

1. A nickel-chromium alloy comprising 0.8 to 4.0% by mass of one or both of Ni and Co, 0.2 to 1.0% by mass of Si, one or two of Ni and Co and Si in a mass ratio of 3.0 to 7.0, A tensile strength in the direction parallel to the rolling direction is not less than 570 MPa, a proof stress is not less than 500 MPa, an elongation is not less than 5%, a tensile strength in the direction perpendicular to the rolling direction is not less than 550 MPa, a proof stress is not less than 480 MPa, A bending working width limit of 70 mm or more when the conductivity is higher than 35% IACS and the ratio R / t of the bending radius R to the plate thickness t is 0.5 and the bending line is in the rolling vertical direction, Wherein the bending working width and the rank pod value are 20 mm or more and 0.9 or more, respectively, when the line is subjected to the close bending in the vertical direction of rolling.

Sun 2:

The copper alloy sheet for a heat dissipation component according to claim 1, further comprising one or two of Zn: 2.5 mass% or less and Sn: 1.0 mass% or less.

Sun 3:

Further comprising 1% by mass or less of one or more of Mg, Al, Cr, Mn, Ca, Ti, Zr, Fe and P in a total amount of not more than 0.1% by mass The copper alloy sheet for heat dissipation parts described in the above-mentioned (1) or (2).

Sun 4:

A copper alloy plate for a heat-dissipating component according to any one of claims 1 to 3, wherein a Sn layer having a thickness of 0.2 to 5 占 퐉 is formed on the surface.

Sun 5:

A Cu-Sn alloy layer having a thickness of 3 占 퐉 or less and a Sn layer having a thickness of 0 to 5 占 퐉 are formed on the surface in this order and the total thickness of the Cu-Sn alloy layer and the Sn layer is 0.2 占 퐉 or more. A copper alloy plate for a heat dissipation component according to any one of claims 1 to 6.

Sun 6:

A plating layer made of any one of Ni, Co, Fe, Ni-Co alloy or Ni-Fe alloy with a thickness of 3 占 퐉 or less on the surface, a Cu-Sn alloy layer with a thickness of 3 占 퐉 or less and a Sn layer with a thickness of 0 to 5 占 m , And the total thickness of the Cu-Sn alloy layer and the Sn layer is 0.2 占 퐉 or more. The copper alloy sheet for a heat-dissipating component according to any one of claims 1 to 3,

Sun 7:

The copper alloy for a heat dissipation component according to any one of claims 1 to 3, wherein a plating layer composed of any one of Ni, Co, Fe, Ni-Co alloy or Ni-Fe alloy with a thickness of 3 탆 or less is formed on the surface plate.

Sun 8:

The copper alloy plate for a heat dissipation component according to Claim 5 or 6, wherein the Cu-Sn alloy layer is exposed on the outermost surface and the exposed area ratio is 50% or less.

Sun 9:

A heat-dissipating component comprising a copper alloy plate for a heat-dissipating component according to any one of claims 1 to 7.

The present application is accompanied by a priority claim based on Japanese Patent Application No. 2015-216217, filed on November 3, 2015, as a basic application. Mentionee < RTI ID = 0.0 > 2015-216217 < / RTI >

1: V-shaped block
2:
3: Specimen
4: Die
5: Specimen
6: Blank holder
7: Punch

Claims

The method according to claim 1,
Further comprising one or two kinds of Zn: 2.5 mass% or less and Sn: 1.0 mass% or less.

3. The method according to claim 1 or 2,
Further comprising 1% by mass or less of one or more of Mg, Al, Cr, Mn, Ca, Ti, Zr, Fe and P in a total amount of not more than 0.1% by mass Copper alloy plate for heat dissipation parts.

3. The method according to claim 1 or 2,
And a Sn layer having a thickness of 0.2 to 5 占 퐉 is formed on the surface of the copper alloy plate.

The method of claim 3,
And a Sn layer having a thickness of 0.2 to 5 占 퐉 is formed on the surface of the copper alloy plate.

3. The method according to claim 1 or 2,
Sn alloy layer having a thickness of 3 占 퐉 or less and a Sn layer having a thickness of 0 占 퐉 to 5 占 퐉 in this order on the surface thereof and the total thickness of the Cu-Sn alloy layer and the Sn layer is 0.2 占 퐉 or more. plate.

The method of claim 3,
Sn alloy layer having a thickness of 3 占 퐉 or less and a Sn layer having a thickness of 0 占 퐉 to 5 占 퐉 in this order on the surface thereof and the total thickness of the Cu-Sn alloy layer and the Sn layer is 0.2 占 퐉 or more. plate.

3. The method according to claim 1 or 2,
A plating layer made of any one of Ni, Co, Fe, Ni-Co alloy or Ni-Fe alloy with a thickness of 3 占 퐉 or less on the surface, a Cu-Sn alloy layer with a thickness of 3 占 퐉 or less and a Sn layer with a thickness of 0 to 5 占 m , And the total thickness of the Cu-Sn alloy layer and the Sn layer is 0.2 占 퐉 or more.

The method of claim 3,
A plating layer made of any one of Ni, Co, Fe, Ni-Co alloy or Ni-Fe alloy with a thickness of 3 占 퐉 or less on the surface, a Cu-Sn alloy layer with a thickness of 3 占 퐉 or less and a Sn layer with a thickness of 0 to 5 占 m , And the total thickness of the Cu-Sn alloy layer and the Sn layer is 0.2 占 퐉 or more.

3. The method according to claim 1 or 2,
Wherein a plating layer composed of any one of Ni, Co, Fe, Ni-Co alloy or Ni-Fe alloy having a thickness of 3 占 퐉 or less is formed on the surface of the copper alloy plate.

The method of claim 3,
Wherein a plating layer composed of any one of Ni, Co, Fe, Ni-Co alloy or Ni-Fe alloy having a thickness of 3 占 퐉 or less is formed on the surface of the copper alloy plate.

The method according to claim 6,
Wherein the Cu-Sn alloy layer is exposed on the outermost surface and the exposed area ratio is 50% or less.

8. The method of claim 7,
Wherein the Cu-Sn alloy layer is exposed on the outermost surface and the exposed area ratio is 50% or less.

9. The method of claim 8,
Wherein the Cu-Sn alloy layer is exposed on the outermost surface and the exposed area ratio is 50% or less.

10. The method of claim 9,
Wherein the Cu-Sn alloy layer is exposed on the outermost surface and the exposed area ratio is 50% or less.

A heat-dissipating component comprising the copper alloy plate for a heat-dissipating component according to any one of claims 1 to 15.