KR20180048891A - 미세 구조를 갖는 유리의 제조 방법 - Google Patents

미세 구조를 갖는 유리의 제조 방법 Download PDF

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Publication number
KR20180048891A
KR20180048891A KR1020187009016A KR20187009016A KR20180048891A KR 20180048891 A KR20180048891 A KR 20180048891A KR 1020187009016 A KR1020187009016 A KR 1020187009016A KR 20187009016 A KR20187009016 A KR 20187009016A KR 20180048891 A KR20180048891 A KR 20180048891A
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South Korea
Prior art keywords
glass
etching
acid
laser
hole
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KR1020187009016A
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English (en)
Korean (ko)
Inventor
유지 히라누마
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닛본 이따 가라스 가부시끼가이샤
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Publication of KR20180048891A publication Critical patent/KR20180048891A/ko

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/097—Glass compositions containing silica with 40% to 90% silica, by weight containing phosphorus, niobium or tantalum
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • B23K2203/54—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Metallurgy (AREA)
  • Glass Compositions (AREA)
  • Surface Treatment Of Glass (AREA)
KR1020187009016A 2015-08-31 2016-08-29 미세 구조를 갖는 유리의 제조 방법 KR20180048891A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015170551 2015-08-31
JPJP-P-2015-170551 2015-08-31
PCT/JP2016/003931 WO2017038075A1 (fr) 2015-08-31 2016-08-29 Procédé de production de verre présentant une structure fine

Publications (1)

Publication Number Publication Date
KR20180048891A true KR20180048891A (ko) 2018-05-10

Family

ID=58187041

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187009016A KR20180048891A (ko) 2015-08-31 2016-08-29 미세 구조를 갖는 유리의 제조 방법

Country Status (6)

Country Link
US (1) US20180340262A1 (fr)
JP (1) JPWO2017038075A1 (fr)
KR (1) KR20180048891A (fr)
CN (1) CN107922254A (fr)
TW (1) TWI712568B (fr)
WO (1) WO2017038075A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210059069A (ko) * 2019-11-13 2021-05-25 주식회사 비에스피 유연 oled 모듈 제조방법
KR102459645B1 (ko) * 2022-07-18 2022-10-28 주식회사 아이티아이 레이저를 이용한 미세 가공 장치 및 방법

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US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
US10134657B2 (en) 2016-06-29 2018-11-20 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
US11478880B2 (en) * 2017-03-06 2022-10-25 Lpkf Laser & Electronics Ag Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching process
JP2018158855A (ja) * 2017-03-22 2018-10-11 日本電気硝子株式会社 有孔ガラス基板の製造方法
JP7076182B2 (ja) * 2017-05-08 2022-05-27 ビアメカニクス株式会社 レーザ加工方法
EP3624982A1 (fr) * 2017-05-15 2020-03-25 LPKF Laser & Electronics AG Procédé d'usinage, en particulier de séparation, d'un substrat par gravure profonde induite par laser
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
JP2018199605A (ja) * 2017-05-29 2018-12-20 Ａｇｃ株式会社 ガラス基板の製造方法およびガラス基板
JP7064706B2 (ja) * 2017-08-28 2022-05-11 日本電気硝子株式会社 レーザーアシストエッチング用ガラス基板、及びそれを用いた有孔ガラス基板の製造方法
JP7109739B2 (ja) * 2017-09-20 2022-08-01 日本電気硝子株式会社 レーザーアシストエッチング用ガラス基板、及びそれを用いた有孔ガラス基板の製造方法
JP7057646B2 (ja) * 2017-11-13 2022-04-20 ビアメカニクス株式会社 レーザ加工方法
US20190185373A1 (en) * 2017-12-19 2019-06-20 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
JP7020099B2 (ja) * 2017-12-19 2022-02-16 凸版印刷株式会社 貫通孔形成方法及び貫通孔を有するガラス基板の製造方法
JP7407499B2 (ja) * 2017-12-26 2024-01-04 株式会社ディスコ 凹部又は貫通孔の形成方法、電極の形成方法
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11152294B2 (en) 2018-04-09 2021-10-19 Corning Incorporated Hermetic metallized via with improved reliability
KR102593698B1 (ko) * 2018-05-31 2023-10-24 더 스쿨 코포레이션 칸사이 유니버시티 실리콘 반도체 기판의 에칭 방법, 반도체 장치의 제조 방법 및 에칭액
WO2020129553A1 (fr) * 2018-12-19 2020-06-25 日本板硝子株式会社 Substrat en verre ayant une microstructure et procédé de production pour substrat en verre ayant une microstructure
FR3090624B1 (fr) * 2018-12-20 2021-01-08 Eurokera Verres aluminoborosilicates de cuivre et leurs utilisations
KR20210127188A (ko) 2019-02-21 2021-10-21 코닝 인코포레이티드 구리-금속화된 쓰루 홀을 갖는 유리 또는 유리 세라믹 물품 및 이를 제조하기 위한 공정
TW202103830A (zh) * 2019-03-25 2021-02-01 美商康寧公司 在玻璃中形成穿孔之方法
CN109951960A (zh) * 2019-03-27 2019-06-28 嘉兴腓特烈太赫科技有限公司 在毫米波石英电路上实现通孔的方法
TWI709761B (zh) * 2019-04-15 2020-11-11 上暘光學股份有限公司 具有雷射誘發週期表面微結構之光學鏡片
US20220212982A1 (en) * 2019-04-28 2022-07-07 Okinawa Institute Of Science And Technology School Corporation Method of fabricating a through glass via on a suspended nanocrystalline diamond
PL429832A1 (pl) * 2019-05-05 2020-11-16 Żrodowski Łukasz Sposób wytwarzania addytywnego trójwymiarowych obiektów
DE102019111634A1 (de) * 2019-05-06 2020-11-12 Lpkf Laser & Electronics Ag Verfahren zur Herstellung von Mikrostrukturen in einem Glassubstrat
US11952310B2 (en) 2019-05-10 2024-04-09 Corning Incorporated Silicate glass compositions useful for the efficient production of through glass vias
JP7260852B2 (ja) * 2019-07-31 2023-04-19 日本電気硝子株式会社 ガラス板のエッチング方法
CN112782939A (zh) * 2019-11-08 2021-05-11 深圳市捷智造科技有限公司 一种基于激光曝光的二维码制作方法
JP7251704B2 (ja) * 2020-09-16 2023-04-04 株式会社Nsc ガラス用エッチング液およびガラス基板製造方法
WO2022075068A1 (fr) * 2020-10-06 2022-04-14 日本電気硝子株式会社 Substrat en verre ayant un trou traversant
TWI755111B (zh) * 2020-10-23 2022-02-11 晨豐光電股份有限公司 具有奈米柱狀微結構的玻璃及其製造方法
US20230399253A1 (en) * 2020-11-16 2023-12-14 Nippon Electric Glass Co., Ltd. Glass substrate
CN113336448B (zh) * 2021-05-18 2023-01-13 江西欧迈斯微电子有限公司 玻璃蚀刻液及其制备方法、超薄玻璃基板及其蚀刻方法
JP2023082984A (ja) * 2021-12-03 2023-06-15 日本電気硝子株式会社 ガラス板の製造方法
CN114560634A (zh) * 2022-03-28 2022-05-31 广东工业大学 一种异形玻璃通孔的加工方法
CN115108729A (zh) * 2022-08-04 2022-09-27 广东工业大学 一种采用钝化液的玻璃深孔加工方法
CN117247230A (zh) * 2023-08-01 2023-12-19 咸宁南玻光电玻璃有限公司 玻璃及其通孔加工方法和应用
CN117545321A (zh) * 2023-11-28 2024-02-09 惠科股份有限公司 显示面板和显示装置

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Cited By (4)

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Publication number Priority date Publication date Assignee Title
KR20210059069A (ko) * 2019-11-13 2021-05-25 주식회사 비에스피 유연 oled 모듈 제조방법
US11532804B2 (en) 2019-11-13 2022-12-20 Bsp Co., Ltd. Method of manufacturing flexible OLED module
KR102459645B1 (ko) * 2022-07-18 2022-10-28 주식회사 아이티아이 레이저를 이용한 미세 가공 장치 및 방법
WO2024019452A1 (fr) * 2022-07-18 2024-01-25 주식회사 아이티아이 Dispositif et procédé de micro-traitement à l'aide d'un laser

Also Published As

Publication number Publication date
TWI712568B (zh) 2020-12-11
US20180340262A1 (en) 2018-11-29
TW201722881A (zh) 2017-07-01
WO2017038075A1 (fr) 2017-03-09
JPWO2017038075A1 (ja) 2018-06-14
CN107922254A (zh) 2018-04-17

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