KR20180011702A - 스크라이브 방법 그리고 스크라이브 장치 - Google Patents

스크라이브 방법 그리고 스크라이브 장치 Download PDF

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Publication number
KR20180011702A
KR20180011702A KR1020170032319A KR20170032319A KR20180011702A KR 20180011702 A KR20180011702 A KR 20180011702A KR 1020170032319 A KR1020170032319 A KR 1020170032319A KR 20170032319 A KR20170032319 A KR 20170032319A KR 20180011702 A KR20180011702 A KR 20180011702A
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KR
South Korea
Prior art keywords
cutter wheel
offset value
scribing
center
scribe
Prior art date
Application number
KR1020170032319A
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English (en)
Korean (ko)
Inventor
노리유키 구리야마
카즈오 하야시
모토야스 스기야마
준이치 오가와
일회 이
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20180011702A publication Critical patent/KR20180011702A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/005—Devices for the automatic drive or the program control of the machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
KR1020170032319A 2016-07-25 2017-03-15 스크라이브 방법 그리고 스크라이브 장치 KR20180011702A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016145274A JP6744626B2 (ja) 2016-07-25 2016-07-25 スクライブ方法並びにスクライブ装置
JPJP-P-2016-145274 2016-07-25

Publications (1)

Publication Number Publication Date
KR20180011702A true KR20180011702A (ko) 2018-02-02

Family

ID=61081169

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170032319A KR20180011702A (ko) 2016-07-25 2017-03-15 스크라이브 방법 그리고 스크라이브 장치

Country Status (4)

Country Link
JP (1) JP6744626B2 (ja)
KR (1) KR20180011702A (ja)
CN (1) CN107650277A (ja)
TW (1) TW201803819A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190114407A (ko) 2018-03-30 2019-10-10 주식회사 탑 엔지니어링 변위 센서를 이용한 스크라이브 장치
KR20190114408A (ko) 2018-03-30 2019-10-10 주식회사 탑 엔지니어링 변위 센서를 이용한 스크라이브 장치의 동작 방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113183049B (zh) * 2021-04-28 2022-05-03 泉州金石金刚石工具有限公司 一种金刚石磨具加工用可等量定长的滑动式裁切装置
CN113735429B (zh) * 2021-08-24 2023-09-08 芜湖东旭光电科技有限公司 玻璃划线切割装置及其切割方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0829546B2 (ja) * 1989-10-25 1996-03-27 スタンレー電気株式会社 軸一体型カッターホイル付きカッター
JP4290784B2 (ja) * 1998-09-09 2009-07-08 三星ダイヤモンド工業株式会社 ガラススクライバー
JP2001293586A (ja) * 2000-04-12 2001-10-23 Takatori Corp ガラスの割断方法
CN1863740B (zh) * 2001-07-18 2012-04-25 三星钻石工业股份有限公司 划线头和使用该划线头的划线装置以及划线方法
KR101251107B1 (ko) * 2005-12-01 2013-04-05 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이브 방법
TWI438163B (zh) * 2007-06-06 2014-05-21 Mitsuboshi Diamond Ind Co Ltd Multi-stroke head loading scribing device and cutter wheel automatic replacement system
CN101530965B (zh) * 2008-03-11 2010-12-08 富士迈半导体精密工业（上海）有限公司 基板切割装置及基板切割方法
JP5139852B2 (ja) * 2008-03-17 2013-02-06 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
JP5332344B2 (ja) * 2008-06-30 2013-11-06 三星ダイヤモンド工業株式会社 チップホルダ及びホルダユニット
TWI435851B (zh) * 2009-10-29 2014-05-01 Mitsuboshi Diamond Ind Co Ltd Cutter wheel holder unit
KR101694311B1 (ko) * 2010-07-01 2017-01-09 주식회사 탑 엔지니어링 글래스 패널의 스크라이빙 장치 및 스크라이빙 방법
CN102601434B (zh) * 2012-03-22 2013-09-11 上海交通大学 一种整体叶轮开槽插铣加工优化方法
CN103317541B (zh) * 2013-06-07 2015-07-08 浙江工业大学 一种基于平板切割机的刀具补偿方法
JP2015000497A (ja) * 2013-06-14 2015-01-05 三星ダイヤモンド工業株式会社 チップホルダユニット、チップホルダ、ピン、ホイールチップ及び基板加工装置
CN103739192B (zh) * 2013-11-14 2016-02-17 上海和辉光电有限公司 切割装置及切割方法
CN104960013A (zh) * 2015-05-18 2015-10-07 合肥京东方光电科技有限公司 一种覆膜贴片切割装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190114407A (ko) 2018-03-30 2019-10-10 주식회사 탑 엔지니어링 변위 센서를 이용한 스크라이브 장치
KR20190114408A (ko) 2018-03-30 2019-10-10 주식회사 탑 엔지니어링 변위 센서를 이용한 스크라이브 장치의 동작 방법

Also Published As

Publication number Publication date
CN107650277A (zh) 2018-02-02
JP2018015903A (ja) 2018-02-01
JP6744626B2 (ja) 2020-08-19
TW201803819A (zh) 2018-02-01

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