KR20170119105A - Pressure-resistant electrode paste for chip component using thermo-plastic resin and manufacturing method therewith - Google Patents
Pressure-resistant electrode paste for chip component using thermo-plastic resin and manufacturing method therewith Download PDFInfo
- Publication number
- KR20170119105A KR20170119105A KR1020160046839A KR20160046839A KR20170119105A KR 20170119105 A KR20170119105 A KR 20170119105A KR 1020160046839 A KR1020160046839 A KR 1020160046839A KR 20160046839 A KR20160046839 A KR 20160046839A KR 20170119105 A KR20170119105 A KR 20170119105A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- glass frit
- electrode paste
- ceramic
- coating layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 101
- 239000002003 electrode paste Substances 0.000 title claims abstract description 94
- 229920005989 resin Polymers 0.000 title claims abstract description 55
- 239000011347 resin Substances 0.000 title claims abstract description 55
- 229920001169 thermoplastic Polymers 0.000 title 1
- 239000004416 thermosoftening plastic Substances 0.000 title 1
- 239000000843 powder Substances 0.000 claims abstract description 127
- 238000000034 method Methods 0.000 claims abstract description 91
- 239000011247 coating layer Substances 0.000 claims abstract description 89
- 239000000919 ceramic Substances 0.000 claims abstract description 80
- 238000005245 sintering Methods 0.000 claims abstract description 75
- 239000000203 mixture Substances 0.000 claims abstract description 68
- 239000000088 plastic resin Substances 0.000 claims abstract description 65
- 230000001965 increasing effect Effects 0.000 claims abstract description 55
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 36
- 238000003825 pressing Methods 0.000 claims abstract description 23
- 239000011521 glass Substances 0.000 claims description 150
- 239000011231 conductive filler Substances 0.000 claims description 72
- 229910052751 metal Inorganic materials 0.000 claims description 59
- 239000002184 metal Substances 0.000 claims description 59
- 239000002904 solvent Substances 0.000 claims description 40
- 238000001035 drying Methods 0.000 claims description 30
- 238000005118 spray pyrolysis Methods 0.000 claims description 29
- 238000007639 printing Methods 0.000 claims description 22
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 19
- 238000002360 preparation method Methods 0.000 claims description 13
- 239000001856 Ethyl cellulose Substances 0.000 claims description 9
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 9
- 229920001249 ethyl cellulose Polymers 0.000 claims description 9
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims 1
- 238000005524 ceramic coating Methods 0.000 abstract description 31
- 230000006835 compression Effects 0.000 abstract description 17
- 238000007906 compression Methods 0.000 abstract description 17
- 230000032798 delamination Effects 0.000 abstract description 12
- 238000006116 polymerization reaction Methods 0.000 abstract description 8
- 230000001976 improved effect Effects 0.000 abstract description 6
- 230000008520 organization Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 65
- 239000011248 coating agent Substances 0.000 description 29
- 238000000576 coating method Methods 0.000 description 29
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 27
- 238000010304 firing Methods 0.000 description 17
- -1 asphaltene Substances 0.000 description 13
- 239000011787 zinc oxide Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 239000002002 slurry Substances 0.000 description 10
- 238000000197 pyrolysis Methods 0.000 description 9
- 239000007921 spray Substances 0.000 description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 8
- 230000003247 decreasing effect Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- 230000006399 behavior Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000011324 bead Substances 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 230000001737 promoting effect Effects 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 238000007667 floating Methods 0.000 description 4
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910000480 nickel oxide Inorganic materials 0.000 description 4
- 239000005416 organic matter Substances 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910000428 cobalt oxide Inorganic materials 0.000 description 3
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000012792 core layer Substances 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000002542 deteriorative effect Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000010345 tape casting Methods 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000000295 fuel oil Substances 0.000 description 2
- 229910001195 gallium oxide Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000006259 organic additive Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000011300 coal pitch Substances 0.000 description 1
- 239000011294 coal tar pitch Substances 0.000 description 1
- 239000000567 combustion gas Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 239000010779 crude oil Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011302 mesophase pitch Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000011301 petroleum pitch Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000012258 stirred mixture Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000001238 wet grinding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
Abstract
INDUSTRIAL APPLICABILITY The present invention can increase the strength and the resistance to compression of a pattern (internal electrode) itself printed on a ceramic sheet by using a polymerization reaction of a plastic resin and a sub resin (acrylic or PVB) As the compression bonding property is improved, even if an external pressure is generated by the pressing process, the desired function as a chip can be exhibited without being deformed from the designed position and shape. The content of the sub resin can be controlled, The shrinkability can be efficiently increased and the shrinkage behavior of the ceramic sheet and the ceramic coating powder is likewise improved so that the shrinkage matching property is increased to prevent delamination of the sheet and the electrode, And the softening point (Ts), the sintering of the ceramic is promoted so that the shrinkage start point and shrinkage end point of the core and the coating layer Proceeds in similar period by being directed to a pressure-resistant wearing electrode paste composition, and the chip component manufacture method using the same applying the plastic resin that can remarkably increase the denseness of the sintered organization reduce resistance.
Description
The present invention relates to a pressure-resistant wearing electrode paste composition to which a plastic resin is applied, and a method of manufacturing a chip component using the same. More specifically, the present invention relates to a pressure-resistant electrode paste composition comprising a sub resin and a plastic resin (PVB) The present invention relates to a pressure-resistant electrode paste composition employing a plastic resin that can drastically solve the problems of dripping and line width sagging of a printed electrode during a pressing process by improving the internal strength and compressive resistance of the internal electrode (pattern) And a method of manufacturing a chip component.
In recent years, demand for high-density, high-performance and miniaturized electronic components has increased drastically due to the thinning and high performance of electronic devices. In order to meet the high density, miniaturization and high functionality of these needle parts, Static stratification is indispensable.
1 is a manufacturing process diagram of a laminated chip component disclosed in Korean Patent No. 10-0287561 (the name of the invention: a method of manufacturing a multilayer chip component).
(S900) of the laminated chip component shown in Fig. 1 (hereinafter referred to as the prior art 1) includes a sheet production step S910 for producing a sheet by a tape casting method, a sheet production step S910 for producing a sheet A via hole forming step S920 for forming a via hole in the via hole forming step S920, a pressing step S930 for mechanically pressing the sheet perforated by the via hole forming step S920, and a pressing step S930, A via hole filling step (S940) of filling the via hole of the formed sheet with a silver paste having a viscosity of 30,000 to 70,000 cps, a drying step (S950) of drying the sheet subjected to the via hole filling step (S940) (S960) for printing silver paste to form an internal electrode, a drying step (S970) for drying the printed internal electrode, a WIP step (S980) for pressing the sheet isotropically by CIP or WIP, Lt; RTI ID = 0.0 > And a cutting step (S999) of cutting the sheet to a desired dimension.
Conventional technique 1 (S900) configured as described above has an advantage that the spreading of the silver paste can be prevented and the sheet can be kept flat by filling the via hole by performing the squeezing step (S930) after the via hole forming step (S920) .
However, in the prior art 1 (S900), as the body is uniformly pressurized with a force of several tons (N) in all directions at the time of the WIP step (S980), the line width of the internal electrode printed on the sheet is reduced as it is compressed inward And a pattern deformation phenomenon such as widening occurs frequently.
At this time, since the electrode paste forming the internal electrode is hardened to a predetermined strength in the drying step (S970), and there is a limit in increasing the internal strength and compressive strength of the paste only in the drying step (S970) Likewise, when the force (pressure) exceeds a threshold value, the pattern is deformed from the design position and shape.
In other words, even if a technique for highly efficient electrode paste or a technique for precisely printing an electrode paste according to a design pattern is studied and applied for manufacturing high-performance chip parts, due to the characteristics of the paste having low internal strength and low squeezability As the pattern is deformed during the pressing step, despite the research on other techniques, it has a limitation that it can not manufacture a high-function chip.
In particular, in the case of miniaturization and high-performance chips, when the internal electrode is deformed even finely with the design pattern, the desired high performance can not be exhibited. Therefore, research for increasing the internal strength and compressive resistance of the electrode paste is urgent, There has been no research for increasing the internal strength and the compression resistance of the resin composition.
2 is an exploded perspective view showing a laminated bead disclosed in Korean Patent Laid-Open No. 10-2013-0044603 (entitled: Laminated bead and its manufacturing method).
The stacked
In the conventional art 2 200 configured as described above, the
However, since the conventional art 2 200 does not improve the internal strength of the
On the other hand, a paste composition based on a metal powder such as silver (Ag), palladium (Pd) or the like having high conductivity is generally used as an internal electrode of a chip component. In this case, since the quality is dependent on the sinterability and the crystallinity of the ceramic dielectric base material, a metal powder capable of being fired at a high temperature is essentially required.
However, in the conventional chip parts, the shrinkage rate increases due to the difference in the starting point and the end point of contraction between the metal powder and the sheet for ensuring conductivity, and the cross-sectional area of the electrode is decreased due to the increase in shrinkage ratio, There is a problem that the characteristics are deteriorated.
In addition, conventional chip parts have a problem in that delamination of sheets and internal electrodes frequently occurs due to the shrinkage matching property of sheet and metal powder being operated by different shrinkage behaviors.
Therefore, in order to secure insulation resistance and temperature characteristics, various researches have been made on the atomization and dispersion of additives in addition to the development of base materials having excellent properties even in the case of fine particles.
In the Korean Patent No. 10-1315105 (entitled " Electrode Paste Composition for Solar Cell) ", which is a patent registered by the applicant of the present invention, a paste containing a conductive filler composed of a conductive filler coated with a coating powder on the outer surface of a metal powder And the paste composition suppresses oxidation of the metal powder during sintering to improve the resistance characteristics and increase the electrode efficiency.
The paste composition has been studied for a solar cell, but the paste composition (hereinafter referred to as "
Also, since the liquid phase process applied to the
In the
In order to solve such a problem, a paste composition (hereinafter referred to as the prior art 4) in which the coating powder forming the coating layer of the conductive filler is made of ceramic powder has been studied. In the prior art 4, the sintering of the sheet and the coating powder proceeds at a similar time Accordingly, it is possible to minimize the delamination of the sheet and the coating powder by increasing the shrinkage matching property of the sheet and the coating powder, and also to lower the shrinkage ratio and improve the resistance characteristic.
However, in the conventional technique 4, the shrinkage matching property of the sheet and the coating powder is increased, but the sintering temperature of the coating powder and the metal powder is different and the compactness of the sintered structure is remarkably decreased. .
As described above, according to the conventional arts 1 to 4, 1) it is possible to improve the physical properties of the internal strength and compression resistance without deteriorating the performance of the paste itself, 2) to apply the coating powder (ceramics) to the outer surface of the metal powder 3) It is difficult to control precisely in the liquid phase process for forming the core-core layer of the conductive filler in the past, and the process is complicated and cumbersome, and the metal powder 4) It is urgent to study the electrode paste composition which can solve the problem that the denseness of the shrinkage structure of the metal powder and the coating powder is lowered as the coating powder is coated on the outer surface of the metal powder. to be.
SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a method for producing an electrode paste, which comprises adding a plastic resin and a sub resin (acrylic or PVB) to an electrode paste, The inner strength, the adhesive force, and the compression resistance of the pattern (internal electrode) printed on the ceramic sheet can be remarkably increased, and the conventional problem that the position and shape of the pattern is deformed by the pressure generated in the pressing process can be drastically solved COMPRESSION COMPOSITION FOR WRITING ELECTRODE PASTE COMPRISING A PLASTIC RESIN AND METHOD FOR PRODUCING CHIP PARTS THEREFOR
Another object of the present invention is to provide a pressure-resistant electrode paste composition employing a plastic resin capable of effectively increasing the compressibility without decreasing the performance of the conductive filler by controlling the content of the sub resin, and a method of manufacturing a chip component using the same .
In addition, another object of the present invention is to provide a conductive filler comprising a core which is a metal powder and a coating layer which is a ceramic powder coated on the outer surface of the core, so that sintering of the coating powder forming the sheet and the coating layer during firing proceeds at a similar time, As a result, the shrinkage start point and the end point of the coating powder forming the sheet and the coating layer proceed at a similar time, and the shrinkage behavior of the sheet and ceramic coating powder proceeds similarly, so that the shrinkage matching property is increased, and delamination ), And a method of manufacturing a chip component using the same.
Another object of the present invention is to provide a method for controlling the composition of a conductive filler by coating a coating layer (ceramic) on the outer surface of a core (metal powder) of a conductive filler through a spray pyrolysis process to control the composition of the spray solution, The present invention provides a pressure-resistant wearable electrode paste composition and a method of manufacturing a chip component using the same, which can be manufactured by a simple process without finely dividing the process into multiple steps without finely controlling the core and the coating layer of the core.
Another object of the present invention is to provide a method for producing a glass frit which is capable of promoting the sintering of ceramics by controlling the content of the glass frit and the softening point Ts, The present invention provides a pressure-resistant wearable electrode paste composition and a method of manufacturing a chip component using the same, which can increase the shrinkage-matching efficiency by significantly increasing the sintering efficiency and the compactness of the sintered structure, .
According to an aspect of the present invention, there is provided a method of manufacturing an electrode paste, including: preparing an electrode paste to which an auxiliary resin, such as acrylic resin or polyvinyl butyral (PVB), is added; A sheet manufacturing step of manufacturing a ceramic sheet; A printing step of printing on the one surface of the ceramic sheet by the sheet manufacturing step the electrode paste produced by the electrode paste manufacturing step according to a predetermined pattern; A drying step of drying the ceramic sheet on which the pattern is printed by the printing step; A sheet stacking step of stacking the ceramic sheets having passed through the drying step; And a pressing step of pressing the laminated ceramic sheet by the sheet laminating step.
In the present invention, the electrode paste may include 1.5 to 4.0% by weight of the plastic resin and 1.5 to 4.0% by weight of the sub resin, and the plastic resin may be ethyl cellulose .
In the present invention, the electrode paste manufacturing step may include a conductive filler manufacturing step for manufacturing the conductive filler, a glass frit manufacturing step for manufacturing the glass frit, and a solvent preparing step for preparing the solvent, Wherein the conductive filler comprises 78.0 to 90.0% by weight of the conductive filler prepared by the conductive filler production step, 0.1 to 5.0% by weight of the glass frit produced by the glass frit preparing step, 6.9 to 15.0% 1.5 to 4.0% by weight of the resin and 1.5 to 4.0% by weight of the plastic resin are mixed and stirred to prepare the electrode paste.
The method of manufacturing a chip component according to the present invention may further include a slicing step of cutting the ceramic sheets pressed by the pressing step into a thin plate and a sintering step of sintering the sintered body by the slicing step, The filler manufacturing step preferably increases the shrinkage matching property of the coating layer and the ceramic sheet during the sintering step by coating the outer surface of the core, which is a metal powder, with a ceramic-based coating layer through a spray pyrolysis process.
In the present invention, the glass frit is manufactured such that the softening point (Ts) of the glass frit is lower than the sintering temperature by 80 to 120 ° C during the sintering step,
In another aspect of the present invention, there is provided an electrode paste composition printed on one surface of a ceramic sheet, comprising: a core made of a metal powder; and a conductive filler composed of a ceramic-based coating layer coated on the outer surface of the core through a heat- 90.0% by weight; 1.5 to 4.0% by weight of a plastic resin; 1.5 to 4.0% by weight of a sub resin which is acrylic or polyvinyl butyral (PVB); 0.1 to 5.0% by weight of glass frit; And 6.9 to 15.0% by weight of a solvent.
Also, in the present invention, the plastic resin is preferably ethyl cellulose.
In the present invention, the glass frit has a softening point (Ts) lower than the sintering temperature by 80 to 120 ° C,
According to the present invention having the above-described problems and the solution, the strength and compression resistance of the pattern (internal electrode) itself printed on the ceramic sheet can be enhanced by using the polymerization reaction of the plastic resin and the sub resin (acrylic or PVB).
Further, according to the present invention, since the strength (strength of the inner electrode) and the compression resistance are improved, even if external pressure is generated by the pressing process, the pattern is not deformed from the designed position and shape, and the desired function as a chip can be exhibited.
According to the present invention, the content of the sub resin can be controlled to efficiently increase the compressibility without deteriorating the performance of the conductive filler.
According to the present invention, as the shrinkage behavior of the ceramic sheet and the ceramic coating powder proceeds similarly, the shrinkage matching property is increased, and the delamination of the sheet and the electrode can be prevented.
According to the present invention, the coating layer (ceramic) is coated on the outer surface of the core (metal powder) of the conductive filler through the spray pyrolysis process to control the composition of the spray solution, the specific gravity of the organic material, The coating layer can be finely controlled and the process can be performed in a single step without multi-step separation.
According to the present invention, the sintering of the ceramic is promoted by controlling the content of the glass frit and the softening point (Ts) so that the shrinkage start point and the shrinkage end point of the core and the coating layer proceed at a similar time, The resistance can be reduced.
1 is a manufacturing process diagram of a laminated chip component disclosed in Korean Patent No. 10-0287561 (the name of the invention: a method of manufacturing a multilayer chip component).
2 is an exploded perspective view showing a laminated bead disclosed in Korean Patent Laid-Open No. 10-2013-0044603 (entitled: Laminated bead and its manufacturing method).
3 is a process flow chart showing a method of manufacturing a pressure-resistant wearable chip component according to an embodiment of the present invention.
4 is a process flow chart for explaining the electrode paste production step (S10) of FIG.
Fig. 5 is a configuration diagram showing the composition of the electrode paste composition produced by Fig.
FIG. 6 is a process flow chart for explaining the conductive filler manufacturing step (S11) of FIG.
FIG. 7 is an exemplary view showing a conductive filler produced by the conductive filler production step (S11) of FIG. 6;
8 is a process flow chart for explaining the glass frit producing step S12 of Fig.
9 (a) is a microscope showing a sintered structure of an electrode paste composition to which no glass frit is added as in Comparative Example 7 after firing at 900 ° C, and FIG. 9 (b) is a microscope showing a sintered structure of Example 4.
10 is an experimental photograph showing the fluidity of the glass frit of the present invention according to the softening point at a firing temperature of 900 캜.
Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.
3 is a process flow chart showing a method of manufacturing a pressure-resistant wearable chip component according to an embodiment of the present invention.
The method (S1) for producing a pressure-resistant wearable chip component according to an embodiment of the present invention significantly improves the internal strength, the adhesive force and the compression resistance of the electrode paste by adding the plastic resin and the sub resin at an optimum content so as not to deteriorate the performance of the electrode paste Therefore, it is possible to solve the problem that the position and shape of the pattern are deformed by the pressure generated in the pressing process. At this time, the sub resin is made of acrylic or polyvinyl butyral (PVB).
In the method (S1) for manufacturing a pressure-resistant wearable chip component of the present invention, the coating layer (ceramic) is coated on the outer surface of the core (metal powder) of the conductive filler of the electrode paste through spray pyrolysis, The delamination of the sheet and the electrode can be minimized and the sintering of the ceramics can be promoted by controlling the content of the glass frit and the softening point Ts to improve the sintering of the core and the coating layer The shrinkage starting point and the shrinking end point may be configured to proceed at a similar timing, thereby increasing the shrinkage matching property, thereby significantly improving the sintering efficiency and improving the resistance characteristics.
As shown in FIG. 3, the method S1 of manufacturing a pressure-resistant chip component includes an electrode paste manufacturing step S10, a ceramic sheet manufacturing step S20, a pattern printing step S30, a drying step S40, A pressing step S60, a slicing step S70, a sintering step S80 and an external electrode applying step S90.
The electrode paste manufacturing step S10 is a process step of manufacturing an electrode paste for forming internal electrodes of a chip component. At this time, the electrode paste is composed of 78.0 to 90.0 wt% of conductive filler, 1.5 to 4.0 wt% of plastic resin, 1.5 to 4.0 wt% of sub resin, 0.1 to 5.0 wt% of glass frit, and 6.9 to 15.0 wt% of solvent. At this time, the sub resin is acrylic or polyvinyl butyral (PVB).
In addition, the electrode paste production step (S10) optimizes the content of the plastic resin to 1.5 to 4.0% by weight, and 1.5 to 4.0% by weight of the sub resin is added to produce an electrode paste composition, The position and the shape of the pattern are not deformed even when an external pressure is generated in the pressing step S60, so that the chip characteristic can be maximized.
In the present invention, acrylic or polyvinyl butyral is applied as a sub resin. At this time, acrylic contains polar atom groups and has high mechanical strength such as tensile strength and impact strength as compared with resins such as polystyrene ethylcellulose. Since acrylate has a relatively weak polar group, acrylic resin is used alone in the electrode paste composition If used, the viscosity will be excessively high, resulting in poor printability due to tackiness during screen printing printing. On the other hand, polyvinyl butyral (PVB) has good compatibility with phenol resin, melamine resin, urea resin, alkyd resin and ethylcellulose (EC) resin, And it has a high toughness property as a binder of metal powder.
In the electrode paste production step S10, a coating layer (ceramic) is coated on the outer surface of the core (metal powder) of the conductive filler so that the sintering of the ceramic sheet and the coating layer at the time of firing proceeds at a similar timing, The shrinkage starting point and the finishing point of time are similar to each other and the shrinkage behavior of the ceramic sheet and the ceramic coating powder proceeds in a similar manner to increase the shrinkage matching property and minimize the delamination of the sheet and the electrode.
In the electrode paste manufacturing step S10, the coating layer is coated on the outer surface of the core through the spray pyrolysis process, thereby finely controlling the core and coating layer of the conductive filler through controlling the composition of the spray solution, the specific gravity of the organic material, and the temperature of the reaction furnace. The process is not performed in a multi-step manner and the process is simplified by one process.
In addition, the electrode paste production step (S10) promotes the sintering of the ceramics through the adjustment of the content of the glass frit and the softening point (Ts) so that the shrinkage start time and shrinkage end time of the core and the coating layer proceed at similar times, The sintering efficiency is remarkably increased and the resistance characteristic can be improved.
The electrode paste composition step S10 thus configured will be described in detail later with reference to FIGS. 4 to 8. FIG.
The ceramic sheet manufacturing step S20 is a step in which zinc oxide (ZnO) powder is mixed with a small amount of semicrystalline oxide,
In the ceramic sheet manufacturing step S20, the mixed and stirred mixture is formed into a thin sheet through a tape casting process or the like. At this time, since the tape casting method is widely used in the production of ceramic sheets, a detailed description thereof will be omitted.
The pattern printing step S30 is a step of printing the electrode paste manufactured by the electrode paste manufacturing step S10 on one surface of the ceramic sheet produced by the ceramic sheet manufacturing step S20 according to a predetermined pattern. At this time, it is preferable that a screen printing method is applied to the printing method, but it is not limited thereto, and it is natural that a variety of known printing methods can be applied.
Also, the pattern printed by the pattern printing step S30 forms internal electrodes of the chip component.
The drying step S40 is a process step of generating hot air by the ceramic sheet on which the internal electrodes are printed by the pattern printing step S30 and drying the printed internal electrodes. In this case, the drying step (S40) is preferably performed at a temperature of 60 to 100 DEG C for about 10 to 30 minutes at which the solvent of the internal electrode is actively evaporated, but the heating temperature and time are not limited thereto.
At this time, the drying step (S40) can induce polymerization reaction of the plastic resin and the sub resin of the electrode paste composition, thereby enhancing the internal strength, adhesion, elastic restoring force and compression resistance of the internal electrode.
The sheet stacking step (S50) is a process step of stacking the ceramic sheets subjected to the drying step (S40).
The pressing step S60 is a process step of pressing the laminated ceramic sheets (hereinafter referred to as a laminated ceramic body) by the sheet laminating step S50 in all directions to join the ceramic sheets.
Also, the pressing step S60 isostatically pressurizes the laminated body with a force (N) of 1.0 to 1.5 tons through CIP (Cold Isostatic Pressure) or WIP (Warm Isostatic Pressure). At this time, in the pressing step (S60), the laminate body receives a pressure (N) of 1 to 1.5 tons in all directions, so that the ceramic sheets are compressed, so that the inner electrode printed on the ceramic sheet also receives pressure. However, in the present invention, the internal electrode is firmly solidified by the polymerization reaction of the sub resin, so that the internal strength and the internal squeezability are increased, and the pattern is not deformed despite the pressure generated in the pressing step (S60) .
The slicing step S70 is a step of slicing the laminated body pressed by the pressing step S60 to a predetermined thickness.
The sintering step S80 is a process step (S90) of sintering the cut (cut) sintered body by the slicing step S70 to a temperature of approximately 900 to 950 캜.
At this time, in the electrode paste manufacturing step (S10), since the coating layer of the same ceramic type as the ceramic sheet is coated on the outer surface of the core (metal powder) through the spray pyrolysis process, The sintering of the ceramic sheet and the coating layer proceeds at a similar time, so that the shrinkage starting point and the ending point of the ceramic sheet and the coating layer proceed at similar periods, that is, the shrinkage behavior is similar, The delamination of the electrode can be minimized.
Further, in the electrode paste production step (S10), the sintering of the ceramic is promoted by adjusting the content of the glass frit and the softening point (Ts), so that the shrinkage start time and shrinkage end time of the core and the coating layer The shrinkage matching property is increased and the sintering efficiency is remarkably increased, and at the same time, the denseness of the sintered structure is increased and the resistance can be reduced.
The external electrode applying step (S90) is a process step of manufacturing chip parts by applying external electrodes to both sides of a sintered sheet by a sintering step (S80). At this time, it is needless to say that the external electrode application step S90 may include a step of sintering the body to which the external electrode is applied.
FIG. 4 is a process flow chart for explaining the electrode paste production step (S10) of FIG. 3, FIG. 5 is a configuration diagram showing the composition of the electrode paste composition manufactured by FIG. 4, Fig. 7 is an exemplary view showing a conductive filler produced by the conductive filler manufacturing step S11 of Fig. 6; Fig. Sub resin 1.5 to 4.0 wt%
4, the electrode paste manufacturing step S10 includes a conductive filler manufacturing step S11, a glass frit manufacturing step S12, a plastic resin and sub resin preparing step S13, a solvent preparing step S15, , A filtering step S16, and a bubble removing step S17.
5, the electrode paste production step S10 includes the steps of: 78.0 to 90.0% by weight of the
6, the conductive filler manufacturing step S11 includes a spray solution manufacturing step S111, a droplet activation step S112, a thermal decomposition and grain growth step S113, a core and a coating layer forming step S114 .
The spray solution preparation step (S111) is a process step of preparing a spray solution using a precursor of a core-forming material constituting the
In addition, the core forming material may be at least one selected from the group consisting of Ag, Ni, Sn, Cu, Fe, Pd, Al, Au, Zn, Platinum (Pt), and the like. The coating layer forming material may be selected from the group consisting of silica, alumina, titania, yttria, zirconia, ceria, gallium oxide, lanthanum oxide, iron oxide, nickel oxide, cobalt oxide, Copper oxide, zinc oxide, and the like can be used.
In addition, the spraying solution preparation step (S111) mixes and dissolves the core-forming material and the coating-layer-forming material having such a constitution in a solvent. Various solvents known in the art such as distilled water, alcohol and the like can be used as the solvent.
In addition, the spray solution preparation step (S111) includes adding an organic additive for inducing oxidation of carbon in the decomposition process, and the organic additive includes sucrose, petroleum pitch, coal pitch, mesophase pitch, coal tar pitch, At least one selected from the group consisting of resins, vinyl polymers, aromatic hydrocarbons, nitrogen-containing compounds, sulfur compounds, coal liquefied oil, asphaltene, crude oil, naphtha, petroleum heavy oil and cracked heavy oil. At this time, the organic material is added so as to have a concentration of 80 to 200% of the concentration synthesized by the core forming material and the coating layer forming material.
The droplet activation step (S112) is a process step of activating the spray solution prepared by the spray solution production step (S111) into a droplet state.
In addition, the droplet activation step (S112) generates a droplet by supplying a spraying solution to a spraying means such as a known ultrasonic atomizing device, an air nozzle mopping device, a droplet generating device and the like. At this time, the droplet generated is preferably formed to have a diameter of 0.1 to 300 mu m.
The pyrolysis and grain growth step (S113) is a process step that causes pyrolysis and particle growth of droplets generated by the droplet activation step (S112) using a known spray pyrolysis apparatus.
The coating layer forming step S114 includes a drying step, a pyrolysis step and a crystallization step. When droplets having undergone pyrolysis and particle growth by the pyrolysis and grain growth step (S113) are instantaneously introduced into the reaction part at a high temperature, A pyrolysis step and a crystallization step are performed to form the
The drying step is a process step in which the droplet is dried with a carbon-containing complex salt by instantaneous drying by instantly drying the droplet at a high temperature.
In addition, since the elapsed time from the drying step to the pyrolysis step determines the decomposition rate of the organic matter, it is preferable that the optimum elapsed time is 0.1 to 0.3 seconds. If the elapsed time is less than 0.1 second, a hollow structure consisting of a thin shell is formed by explosive organic decomposition. If the elapsed time exceeds 0.3 seconds, decomposition of organic matter proceeds slowly, Respectively.
In the pyrolysis step, organic matter on the surface of the droplet that has been subjected to the drying step is combusted to form a primary core-coated layer particle structure while combustion gas is generated, and then residual organic matter reaction occurs in the core part successively, Shell structure can be synthesized.
The crystallization step makes it possible to produce a powder of the core-coated layer structure by crystallizing the particles subjected to the pyrolysis step for 3 to 5 seconds.
The
The
In addition, the core may be formed in various shapes such as amorphous, plate-like, angular, and the like with a diameter of 0.1 to 30 탆. At this time, if the diameter of the core is less than 0.1 탆, the dispersibility is reduced, and if the diameter exceeds 30 탆, the resistance value of the electrode is amplified.
The
The
8 is a process flow chart for explaining the glass frit producing step S12 of Fig.
8, the melting point of the ceramic forming the
8, the glass frit manufacturing step S12 includes a glass sample manufacturing step S121, a first glass powder manufacturing step S122, a first glass powder slurry manufacturing step S123, A manufacturing step S124, a second glass powder slurry production step S125, and a final glass powder manufacturing step S126.
In the glass specimen preparation step (S121), the oxide powder is melted at a temperature of 1200 to 1500 ° C for one hour and quenched to manufacture a glass specimen.
Also, in the present invention, in consideration of the sintering temperature of 900 ° C, the oxide powder to be applied to the glass specimen preparation step (S121) is formed so as to have a softening point Ts of 780 to 820 ° C
That is, according to the present invention, the softening point of the glass frit is controlled to 780 ~ 820 ° C by adjusting the content of each of the oxide powders in the step of preparing the glass specimen (S121), so that the sintering of the coating powder can be promoted efficiently under optimal conditions .
In the first glass powder production step S122, the glass specimen manufactured through the glass specimen preparation step S121 is dry-grinded at 7000 rpm or more for 30 minutes using a disk mill apparatus to obtain an
In the first glass powder slurry production step (S123), 100 g of the first glass powder produced in the first glass powder production step (S122), 600 g of zirconia balls having a diameter of 2 mm and 100 g of pure water are mixed, and the mixture is mixed with Mono Mill ) Equipment at 300 rpm for 30 minutes to wet-grind the first glass powder slurry.
In the second glass powder production step (S124), the first glass powder slurry prepared by the first glass powder slurry production step (S123) is dried at 100 DEG C for 12 hours to produce a second glass powder having a diameter of 10 mu m or less .
In the second glass powder slurry production step (S125), 100 g of the second glass powder having a diameter of 10 mu m produced by the second glass powder production step (S124), 600 g of zirconia balls having a diameter of 0.5 mm, And wet milling the mixture at 300 rpm for 30 minutes in a mono mill, thereby producing a second glass powder slurry.
In the final glass powder production step (S126), the second glass powder slurry prepared in the second glass powder slurry production step (S125) was dried at 200 DEG C or lower for 12 hours to prepare glass powder having an average diameter of 1 mu m, Frit is manufactured.
The glass frit produced in the glass frit producing step S12 having such a configuration has a softening point Ts of 780 to 820 deg. C, which is lower than the sintering temperature of 900 deg. C by 80 to 120 deg. C, in the sintering step S80. If the softening point (Ts) of the glass frit is lower than the sintering temperature of -120 ° C., the melting point of the glass during firing is excessively higher than that of the coating powder, and as the metal powder shrinks, the coating powder and the sintered metal powder If the softening point (Ts) of the glass frit exceeds -80 DEG C higher than the sintering temperature, the melting point of the glass is delayed and the inherent function for promoting the sintering of the coating powder And the compactness of the sintered structure of the coating powder and the metal powder is deteriorated.
As described above, according to the present invention, it is possible to provide optimum conditions for facilitating the sintering of the
In other words, according to the electrode paste composition of the present invention, since the
Referring back to FIG. 4, the plastic resin and the sub resin preparation step S13 are repeated until the polymerization reaction occurs during the drying step S40 to increase the strength and the inner squeezability of the internal electrode Is a process step of preparing a plastic resin and a sub resin.
In addition, the plastic resin and the sub resin are added in an amount of 3.0 to 8.0% by weight based on the electrode paste composition in the summing.
Further, the plastic resin is preferably added in an amount of 1.5 to 4.0% by weight. If the content of the plastic resin is less than 1.5% by weight, the viscosity of the plastic resin may be lowered and the adhesive strength may decrease after printing and drying. If the content is more than 4.0% by weight, the content of the sub resin may be lowered, There is a problem of falling.
The plastic resin may be one of ethyl cellulose, polyester, polysulfone, phenoxy, polyamide, or a mixture of at least two thereof. Specifically, it is preferably ethyl cellulose.
The sub resin is preferably added in an amount of 1.5 to 4.0% by weight. At this time, if the content of the sub resin is less than 1.5% by weight, the content of the sub resin is lowered so that the strength and compression resistance of the internal electrode are lowered. If the content of the sub resin is more than 4.0% by weight, the strength of the internal electrode is increased, There is a problem that the printing becomes poor due to the sticking.
The sub resin is made of acrylic or polyvinyl butyral (PVB).
The plastic resin and the sub resin to be applied to the plastic resin and the sub-resin preparation step S13 thus formed are subjected to a polymerization reaction by heat generated in the drying step (S40) to function as a function for increasing the internal strength of the electrode paste and the squeezability As well as to determine the consistency of the paste composition and the rheological properties of the composition as a function of deformation and flow.
The solvent preparation step (S14) is a step of preparing a solvent.
The solvent may be selected from the group consisting of aromatic hydrocarbons, ethers, ketones, lactones, ether alcohols, esters and diesters, Or a mixture of at least two of them.
The mixing step S15 is a step in which the conductive filler by the conductive filler production step S11, the glass frit by the glass frit production step S12, the plastic resin by the plastic resin and the sub resin preparation step S13, , And a solvent preparation step (S14) are mixed and stirred to disperse the compositions in the solvent.
In the mixing step S14, as described above, the conductive filler in an amount of 78.0 to 90.0 wt%, the plastic resin in an amount of 1.5 to 4.0 wt%, the sub resin in an amount of 1.5 to 4.0 wt%, the glass frit in an amount of 0.1 to 5.0 wt% To 15.0% by weight are mixed and dispersed and stirred.
If the content of the glass frit is less than 0.1% by weight, the content of the glass frit is excessively decreased and the function of promoting the sintering of the coating layer (ceramic) can not be performed. Thus, the coating powder is sintered later than the metal powder, If the content exceeds 5.0% by weight, the content of the glass frit having a low conductivity is increased and the electrode efficiency is decreased. At the same time, the glass having a high floating property floats and the surface of the electrode There arises a problem that the resistance is increased at the same time as it is covered.
At this time, the plastic resin is preferably added in an amount of 1.5 to 4.0% by weight. If the content of the plastic resin is less than 1.5% by weight, the viscosity of the plastic resin may be lowered and the adhesive strength may decrease after printing and drying. If the content is more than 4.0% by weight, the content of the sub resin may be lowered, There is a problem of falling.
At this time, the sub resin is preferably added in an amount of 1.5 to 4.0% by weight. At this time, if the content of the sub resin is less than 1.5% by weight, the content of the sub resin is lowered so that the strength and compression resistance of the internal electrode are lowered. If the content of the sub resin is more than 4.0% by weight, the strength of the internal electrode is increased, There is a problem that the printing becomes poor due to the sticking.
Also, the mixing step (S15) mechanically mixes the mixtures using a 3-roll mill.
The filtering step S16 is a processing step of filtering the mixed and stirred intermediate by a mixing step S15 to remove impurities of the intermediate and particles having a large particle size.
The bubble removing step (S17) is a processing step for producing an electrode paste composition by defoaming the paste composition from which the impurities have been removed through a filtering step (S16) with a defoaming device to remove air bubbles in the composition.
The method (S1) for fabricating a pressure-resistant wearable chip component according to one embodiment of the present invention comprises the steps of: preparing 1.5 to 4.0% by weight of a plastic resin and 1.5 to 4.0% by weight of a sub resin, And the electrode paste to which the sub resin is added is printed on the ceramic sheet and dried to cause a polymerization reaction to harden the electrode paste, thereby improving the internal strength, adhesiveness, elastic restoring force and compression resistance of the internal electrode, It is possible to remarkably solve the conventional problem that the pattern deformation phenomenon such as the increase of the line width due to the pressure in the step S60 occurs.
In addition, since the same ceramic-based coating layer as the ceramic sheet is coated on the outer surface of the core (metal powder) through the spray pyrolysis process in the electrode paste production step (S10) ), The sintering of the ceramic sheet and the coating layer proceeds at a similar time, so that the shrinkage starting point and the ending point of the ceramic sheet and the coating layer proceed at similar times, that is, the shrinkage behavior is similar, The delamination of the ceramic sheet and the internal electrode can be minimized.
In addition, the method (S1) for manufacturing a pressure-resistant wearable chip component promotes sintering of the ceramic through adjusting the content of the glass frit and the softening point (Ts) during the electrode paste production step (S10) And shrinkage termination time are similar to each other, the shrinkage matching property is increased and the sintering efficiency is remarkably increased, and at the same time, the compactness of the sintered structure is increased and the resistance can be reduced.
Hereinafter, the electrode paste composition according to one embodiment of the present invention will be described in more detail with reference to examples. The following embodiments are for illustrative purposes only and do not limit the scope of protection of the present invention.
Table 1 shows the components contained in Examples of the present invention and Comparative Examples.
Paste
Composition
(Sub-resin)
(Ts: 800 DEG C)
* Unit in Table 1 is% by weight.
85.5% by weight of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
1.0 wt% of glass frit having a softening point (Ts) of 800 DEG C;
10.0 wt% solvent;
2.0% by weight of a plastic resin;
And 1.5% by weight of acrylic.
85.0 wt% of a conductive filler having a ceramic coating layer coated on the outer surface of the metal powder by a spray pyrolysis process;
1.0 wt% of glass frit having a softening point (Ts) of 800 DEG C;
10.0 wt% solvent;
2.0% by weight of a plastic resin;
And 2.0% by weight of acrylic.
83.0 wt% of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
1.0 wt% of glass frit having a softening point (Ts) of 800 DEG C;
10.0 wt% solvent;
2.0% by weight of a plastic resin;
4.0% by weight of acrylic.
[Comparative Example 1]
81.0 wt% of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
1.0 wt% of glass frit having a softening point (Ts) of 800 DEG C;
10.0 wt% solvent;
2.0% by weight of a plastic resin;
And 6.0 wt% of acrylic.
[Comparative Example 2]
79.0 wt% of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
1.0 wt% of glass frit having a softening point (Ts) of 800 DEG C;
10.0 wt% solvent;
2.0% by weight of a plastic resin;
And 8.0% by weight of acrylic.
[Comparative Example 3]
86.0 wt% of a conductive filler having a ceramic coating layer coated on the outer surface of the metal powder by a spray pyrolysis process;
1.0 wt% of glass frit having a softening point (Ts) of 800 DEG C;
10.0 wt% solvent;
2.0% by weight of a plastic resin;
And 1.0 wt% of acrylic.
[Experimental Example 1]
In Experimental Example 1, the hardness of the dry film was measured to demonstrate the compression resistance.
In the hardness test of Experimental Example 1, the specimen (electrode paste composition) was printed and dried on an alumina substrate with a size of 20 mm x 20 mm, and the hardness of the paste dry film was measured using a Vickers hardness tester.
[Experimental Example 2]
In Experimental Example 2, the specimen was manufactured in the same manner as the specimen of Experimental Example 1, and then the resistance of the specimen manufactured using the resistance meter of Mitsubishi Corporation was measured.
[Experimental Example 3]
In Experimental Example 3, specimens were prepared in the same manner as in Experimental Example 1,
Table 2 shows the measured values of Experimental Example 1 for Examples 1 to 3 and Comparative Examples 1 to 3 in Table 1.
Vickers hardness
(HV)
(uΩ · cm)
(%)
With reference to Table 2, the hardness (resistance to compression), the volume resistance measurement value and the electrode shrinkage ratio of Examples 1 to 3 and Comparative Examples 1 to 3 will be examined.
Example 1 is an electrode paste composition containing 1.5% by weight of acryl, having a Vickers hardness of '12.00 '(HV) and a volume resistivity of' 2.21 '(u? · Cm) %. In this case, in Example 1, it was found that the polymerization reaction was activated by drying with acrylic to have a high hardness, and the content of the conductive filler was high, so that the conductivity was excellent and the volume resistance was low.
Example 2 is an electrode paste composition containing 2.0% by weight of acryl, having a Vickers hardness of 13.00 (HV), a volume resistivity of 2.29 (u? · Cm) and a thickness shrinkage ratio of 1 %. At this time, in Example 2, the content of acrylic was increased to increase the Vickers hardness and the shrinkage was small, but the content of the conductive filler was reduced and the volume resistance was insignificantly increased as compared with Example 1.
Example 3 is an electrode paste composition containing 4.0% by weight of acryl, having a Vickers hardness of 16.00 (HV), a volume resistivity of 2.31 (u? · Cm) and a thickness shrinkage ratio of 0 %. At this time, in Example 3, the volume resistivity was increased while the hardness was increased as compared with Example 2. It can be seen that the thickness shrinkage ratio of the electrode was 0% as the hardness was improved.
In other words, it can be seen that Examples 1 to 3 have a high hardness of more than '12. 00 '(HV) and a low volume resistance value of less than 2.31 (uΩ · cm). In other words, the acrylic, plastic resin and conductive filler It can be confirmed that the compression resistance can be increased without deteriorating the conductivity through controlling the content.
Comparative Example 1 is an electrode paste composition containing 6.0% by weight of acryl, having a Vickers hardness of 18.00 (HV), a volume resistivity of 3.21 (u? · Cm) and a thickness shrinkage ratio of 0 %. At this time, in Comparative Example 1, since the viscosity was excessively increased due to the increase of the content of acrylic (exceeding the critical range), the gelation phenomenon occurred, and the printing property was deteriorated due to stickiness. As a result, It can be seen that it is remarkably increased.
Comparative Example 2 is an electrode paste composition containing 8.0% by weight of acryl, and has a Vickers hardness of 21.00 (HV) and a volume resistivity of 4.11 (u? 占) m) %. At this time, in Comparative Example 2, as the content of acrylic was increased, the viscosity of the paste was further increased, and it was found that the volume resistance was significantly higher than that of Examples 1 to 3 at the time of casting.
Comparative Example 3 was an electrode paste composition containing 1.0% by weight of acryl, and had a Vickers hardness of 6.00 (HV), a volume resistivity of 1.61 (u? · Cm) and a thickness shrinkage ratio of 11 %. At this time, in Comparative Example 3, as the content of acrylic fell below the threshold value (less than 1.5% by weight), Vickers hardness was remarkably decreased and the electrode shrinkage ratio was increased as compared with Examples 1 to 3 and Comparative Examples 1 and 2 .
Table 3 shows the contained components of the examples and comparative examples of the present invention.
4
5
6
4
5
6
7
Composition
(Sub-resin)
(Ts: 800 DEG C)
* The units in Table 3 are% by weight.
85.9% by weight of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
2.0% by weight of a plastic resin;
2.0% by weight of acrylic;
10.0 wt% solvent;
And 0.1% by weight of glass frit having a softening point (Ts) of 800 캜.
85.0 wt% of a conductive filler having a ceramic coating layer coated on the outer surface of the metal powder by a spray pyrolysis process;
2.0% by weight of a plastic resin;
2.0% by weight of acrylic;
10.0 wt% solvent;
And 1.0 wt% of a glass frit having a softening point (Ts) of 800 캜.
81.0 wt% of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
2.0% by weight of a plastic resin;
2.0% by weight of acrylic;
10.0 wt% solvent;
And 5.0 wt% of glass frit having a softening point (Ts) of 800 캜.
[Comparative Example 4]
85.95 wt% of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
2.0% by weight of a plastic resin;
2.0% by weight of acrylic;
10.0 wt% solvent;
And 0.05% by weight of glass frit having a softening point (Ts) of 800 캜.
[Comparative Example 5]
85.99 wt% of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
2.0% by weight of a plastic resin;
2.0% by weight of acrylic;
10.0 wt% solvent;
And 0.01 wt% of glass frit having a softening point (Ts) of 800 캜.
[Comparative Example 6]
79.0 wt% of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
2.0% by weight of a plastic resin;
2.0% by weight of acrylic;
10.0 wt% solvent;
And 7.0% by weight of a glass frit having a softening point (Ts) of 800 캜.
[Comparative Example 7]
86.0 wt% of a conductive filler having a ceramic coating layer coated on the outer surface of the metal powder by a spray pyrolysis process;
2.0% by weight of a plastic resin;
2.0% by weight of acrylic;
And 10.0% by weight of a solvent.
Table 4 shows the measured values of Experimental Example 2 for Examples 4 to 6 and Comparative Examples 4 to 7 in Table 3.
Measures
* Unit in Table 4 is uΩ · cm.
The volume resistance measured values of Examples 4 to 6 and Comparative Examples 4 to 7 will be described with reference to Table 4.
Example 4 is an electrode paste composition containing 0.1% by weight of glass frit and the volume resistivity was measured as 2.12 (u? 占) m). At this time, in Example 4, glass frit promotes sintering of the ceramic as a coating layer of the conductive filler, so that the sintering efficiency of the ceramic coating layer and the core of the metal powder is simultaneously started at the time of sintering to increase the sintering efficiency, have.
Example 5 was an electrode paste composition containing 1.0% by weight of glass frit and the volume resistivity was measured as 2.10 (u? 占) m). At this time, in Example 5, the content of the glass frit was increased as compared with Example 4, so that the glass frit promoted the sintering of the ceramic coating layer and the resistance was measured to be low.
Example 6 is an electrode paste composition containing 5.0 wt% of glass frit, and the volume resistivity value was measured to be 2.28 (u? 占) m). At this time, in Example 6, the content of the glass frit was increased as compared with that in Example 4, but it was found that the volume resistance value was rather increased as the glass having a high floating property floated on the surface of the electrode during firing and covered the surface of the electrode. However, in Example 3, it is understood that the rate of decrease of the resistance value due to acceleration of sintering of the ceramic coating layer due to glass is higher than the rate of increase of the resistance value due to floating of the glass, so that the volume resistance value is measured to be low.
In other words, it can be seen that Examples 4 to 6 have a low volume resistivity value of less than 2.28 (u? 占) m). In other words, the problem that the ceramic is coated on the outer surface of the metal powder leads to a problem of poor conductivity. .
Comparative Example 4 was an electrode paste composition containing 0.05% by weight of glass frit and the volume resistivity was measured as 2.77 (u? 占) m). At this time, in Comparative Example 4, the content of the glass frit was excessively lowered so that the sintering of the ceramic coating layer could not be promoted. As a result, the volume resistivity was significantly increased as compared with Examples 4 to 6.
Comparative Example 5 was an electrode paste composition containing 0.01% by weight of glass frit and a volume resistivity of 2.91 (u? 占) m) was measured. At this time, in Comparative Example 5, the content of the glass frit was lower than that in Comparative Example 4, and thus the volumetric resistance value was greatly increased as the sintering acceleration of the ceramic coating layer was not affected.
Comparative Example 6 was an electrode paste composition containing 7.0% by weight of glass frit and the volume resistivity was measured as 3.12 (u? 占) m). At this time, in Comparative Example 6, since the content of the glass frit is higher than those of Experimental Examples 4 to 6 and Comparative Examples 4 to 5, it is understood that the volume resistance value is measured most because of the floating phenomenon of the glass frit.
Comparative Example 7 was an electrode paste composition containing no glass frit and the volume resistivity value was measured as 4.68 (u? 占) m). That is, when ceramic is coated on the outer surface of the metal powder through the spray pyrolysis process, delamination with the sheet can be suppressed because the shrinkage matching property with the ceramic coating layer and the sheet is excellent, but the coating layer (ceramic) Powder) and the sintering efficiency is lowered, the volume resistance value is increased.
The sintering of the ceramic as the coating layer of the conductive filler is promoted so that the firing time of the ceramic coating layer and the core of the metal powder are simultaneously achieved at the time of firing so that the sintering efficiency is increased and the resistance is measured to be low.
9 (a) is a microscope showing a sintered structure of an electrode paste composition to which no glass frit is added as in Comparative Example 7 after firing at 900 ° C, and FIG. 9 (b) is a microscope showing a sintered structure of Example 5.
In Comparative Example 7, as shown in FIG. 9 (a), since the glass frit is not added, the coating powder forming the coating layer (ceramic) upon firing is sintered later than the metal powder forming the core, It can be seen that the pores 331 are generated on the outer surface of the
As shown in FIG. 9 (b), Example 5 is a method of improving the sintering of a coating powder that forms a coating layer (ceramic) by including a glass frit in an amount of 1.0 wt% It can be seen that the sintered structure is excellent because the viewpoint is made at a similar time.
Table 5 shows the components contained in Examples 7 to 9 and Comparative Examples 8 to 10.
Temperature
pay
The
Composition
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(Sub-resin)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
Frit
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(weight%)
(-100 ° C)
(-120 DEG C)
(-80 ° C)
(-200 ° C)
(-50 ° C)
(-0 DEG C)
83.0 wt% of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
2.0% by weight of a plastic resin;
Acrylic 2.0 wt%
10.0 wt% solvent;
And 3.0 wt% of glass frit having a softening point (Ts) of 800 캜.
83.0 wt% of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
2.0% by weight of a plastic resin;
Acrylic 2.0 wt%
10.0 wt% solvent;
And 3.0 wt% of glass frit having a softening point (Ts) of 780 캜.
83.0 wt% of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
2.0% by weight of a plastic resin;
Acrylic 2.0 wt%
10.0 wt% solvent;
And 3.0 wt% of glass frit having a softening point (Ts) of 820 캜.
[Comparative Example 8]
83.0 wt% of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
2.0% by weight of a plastic resin;
Acrylic 2.0 wt%
10.0 wt% solvent;
And 3.0 wt% of glass frit having a softening point (Ts) of 700 캜.
[Comparative Example 9]
83.0 wt% of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
2.0% by weight of a plastic resin;
Acrylic 2.0 wt%
10.0 wt% solvent;
And 3.0 wt% of glass frit having a softening point (Ts) of 850 캜.
[Comparative Example 10]
83.0 wt% of a conductive filler coated with a ceramic coating layer on the outer surface of the metal powder by a spray pyrolysis process;
2.0% by weight of a plastic resin;
Acrylic 2.0 wt%
10.0 wt% solvent;
And 3.0 wt% of glass frit having a softening point (Ts) of 900 캜.
In the present invention, the oxide powder of glass frit
Example 7 demonstrates that glass frit
Example 8 demonstrates that glass frit
Example 9 demonstrates that glass frit
In Comparative Example 8,
In Comparative Example 9,
In Comparative Example 10,
Table 6 shows the measured values of Experimental Example 2 for Examples 7 to 9 and Comparative Examples 8 to 10 in Table 5.
Measures
* The units in Table 6 are uΩ · cm.
With reference to Table 6, the volume resistance measured values of Examples 7 to 9 and Comparative Examples 8 to 10 will be described.
Example 7 is an electrode paste composition containing 3.0 wt% of glass frit having a softening point Ts of 800 DEG C which is 100 DEG C lower than the firing temperature (900 DEG C), and has a volume resistivity of 2.19 (u? 占) m) . At this time, in Example 4, since the glass frit has a softening point (Ts) lower than the firing temperature by 100 占 폚, it is found that the resistance is lowered by increasing the sintering efficiency.
Examples 8 and 9 are also electrode paste compositions comprising 3.0 wt% of glass frit having a softening point (Ts) of 780 DEG C and 820 DEG C lower than that of firing temperature (900 DEG C) by 120 DEG C and 80 DEG C and having a volume resistance value of 2.23 ',' 2.30 '(uΩ · cm) and the resistance was low due to the high sintering efficiency.
In Comparative Examples 8, 9 and 10, the electrode paste composition comprising 3.0 wt% of glass frit having a softening point (Ts) of 700 DEG C, 850 DEG C, 900 DEG C lower than that of the firing temperature (900 DEG C) And the volumetric resistance value was measured as high as 2.89, 3.15, and 3.77 (u? 占) m).
10 is an experimental photograph showing the fluidity of the glass frit of the present invention according to the softening point at a firing temperature of 900 캜.
As shown in FIG. 10, when the softening point (Ts) of the glass frit is 700 ° C at a firing temperature of 900 ° C, the glass frit is melted at a sintering temperature of 900 ° C, And as the melting of the glass frit is progressed rapidly, the compactness of the sintered structure of the coating powder and the metal powder is lowered, resulting in an increase in resistance.
It can be seen that when the softening point (Ts) of the glass frit is 900 ° C, the melting point is slow, and when the sintering temperature reaches 900 ° C, the glass frit is not yet melted and the fluidity is excessively low. The glass frit does not perform its essential function for promoting the sintering of the coating powder, and the compactness of the sintered structure of the coating powder and the metal powder is lowered.
That is, the electrode paste composition of the present invention can maximize the sintering acceleration of the coating layer (ceramic) by controlling the softening point of a simple glass frit by forming the glass frit to have a softening point lower than the firing temperature by 80 to 120 ° C.
S1: Manufacturing method of pressure-resistant chip component S10: Electrode paste manufacturing step
S11: conductive filler production step S12: glass frit production step
S13: Preparation of plastic resin and sub resin S15: Mixing step
S16: Filtering step S17: Bubble removal step
S20: Ceramic sheet manufacturing step S30: Pattern printing step
S40: drying step S50: sheet lamination step
S60: Pressurization step S70: Slicing step S80: Sintering of the body
S90: external electrode application step
Claims (8)
A sheet manufacturing step of manufacturing a ceramic sheet;
A printing step of printing on the one surface of the ceramic sheet by the sheet manufacturing step the electrode paste produced by the electrode paste manufacturing step according to a predetermined pattern;
A drying step of drying the ceramic sheet on which the pattern is printed by the printing step;
A sheet stacking step of stacking the ceramic sheets having passed through the drying step;
And pressing the ceramic sheet stacked by the sheet stacking step.
Wherein the plastic resin is ethyl cellulose.
The electrode paste is prepared by mixing the conductive filler in an amount of 78.0 to 90.0% by weight, the conductive filler prepared in the conductive filler production step, the glass frit in an amount of 0.1 to 5.0% by weight, Wherein the electrode paste is prepared by mixing and stirring 15.0 wt% of the resin, 1.5 to 4.0 wt% of the sub resin, and 1.5 to 4.0 wt% of the plastic resin.
The conductive filler-
Wherein a coating layer of a ceramic type is coated on the outer surface of the core, which is a metal powder, through a spray pyrolysis process, thereby increasing shrink matching of the coating layer and the ceramic sheet during the sintering step.
The glass frit preparation step
78.0 to 90.0% by weight of a conductive filler composed of a core which is a metal powder and a ceramic-based coating layer which is coated on the outer surface of the core by a pulsed heat process;
1.5 to 4.0% by weight of a plastic resin;
1.5 to 4.0% by weight of a sub resin which is acrylic or polyvinyl butyral (PVB);
0.1 to 5.0% by weight of glass frit;
And 6.9 to 15.0% by weight of a solvent.
The glass frit
Wherein the core is formed with a diameter of less than 30 mu m, and the coating layer is formed with a thickness of 10 to 20 nm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160046839A KR101860745B1 (en) | 2016-04-18 | 2016-04-18 | Pressure-resistant electrode paste for chip component using thermo-plastic resin and manufacturing method therewith |
| PCT/KR2016/004040 WO2017183741A1 (en) | 2016-04-18 | 2016-04-19 | Plastic resin-applied electrode paste composition for internal bonding, and method for producing chip component which has used electrode paste composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160046839A KR101860745B1 (en) | 2016-04-18 | 2016-04-18 | Pressure-resistant electrode paste for chip component using thermo-plastic resin and manufacturing method therewith |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170119105A true KR20170119105A (en) | 2017-10-26 |
| KR101860745B1 KR101860745B1 (en) | 2018-05-24 |
Family
ID=60116106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020160046839A KR101860745B1 (en) | 2016-04-18 | 2016-04-18 | Pressure-resistant electrode paste for chip component using thermo-plastic resin and manufacturing method therewith |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101860745B1 (en) |
| WO (1) | WO2017183741A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246606A (en) * | 2019-06-21 | 2019-09-17 | 广州市儒兴科技开发有限公司 | The electrocondution slurry that a kind of high-performance organic carrier and preparation method thereof is applied with it |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4347440B2 (en) * | 1998-09-01 | 2009-10-21 | 住友ゴム工業株式会社 | Conductive paste for internal electrode of multilayer ceramic capacitor, and method of manufacturing multilayer ceramic capacitor using the same |
| JP4436697B2 (en) * | 2003-10-30 | 2010-03-24 | 京セラ株式会社 | Ceramic green sheet laminate, ceramic multilayer wiring board and manufacturing method thereof |
| KR20060061380A (en) * | 2003-11-14 | 2006-06-07 | 가부시키가이샤 무라타 세이사쿠쇼 | Conductive paste and multilayer ceramic substrate |
| JP5488282B2 (en) * | 2010-07-13 | 2014-05-14 | 昭栄化学工業株式会社 | Conductive paste |
| JP6090101B2 (en) * | 2013-10-11 | 2017-03-08 | 住友金属鉱山株式会社 | Paste composition |
-
2016
- 2016-04-18 KR KR1020160046839A patent/KR101860745B1/en active IP Right Grant
- 2016-04-19 WO PCT/KR2016/004040 patent/WO2017183741A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246606A (en) * | 2019-06-21 | 2019-09-17 | 广州市儒兴科技开发有限公司 | The electrocondution slurry that a kind of high-performance organic carrier and preparation method thereof is applied with it |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101860745B1 (en) | 2018-05-24 |
| WO2017183741A1 (en) | 2017-10-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102365249B (en) | Dielectric ceramic composition, multilayer dielectric substrate, electronic component, and method for producing dielectric ceramic composition | |
| CN103377824B (en) | Laminated ceramic electronic component and its manufacture method | |
| KR101598945B1 (en) | Conductive paste, laminated ceramic electronic component and method for manufacturing laminated ceramic electronic component | |
| JP5299904B2 (en) | Conductive paste for internal electrode of multilayer electronic component and multilayer electronic component using the same | |
| CN112390640B (en) | NTC thermistor and manufacturing method thereof | |
| JP4821197B2 (en) | Release layer paste and method for manufacturing multilayer electronic component | |
| JP5018154B2 (en) | Internal electrode forming paste, multilayer ceramic electronic component, and manufacturing method thereof | |
| JP2004186339A (en) | Conductive paste for internal electrode of multilayer electronic component and multilayer electronic component using the same | |
| JP2011003612A (en) | Electronic component and method of manufacturing the same | |
| KR101860745B1 (en) | Pressure-resistant electrode paste for chip component using thermo-plastic resin and manufacturing method therewith | |
| CN104704932B (en) | Conductive paste and the ceramic substrate using the conductive paste | |
| WO2005062396A1 (en) | Multilayered piezoelectric element | |
| KR101684251B1 (en) | electrode paste for chip component | |
| JP2012004189A (en) | Multilayer ceramic capacitor | |
| KR101742033B1 (en) | Pressure-resistant electrode paste for chip component using UV hardening and manufacturing method therewith | |
| JP7102943B2 (en) | A method for manufacturing an organic vehicle, a method for manufacturing a conductive paste, and a method for manufacturing a multilayer ceramic capacitor. | |
| TW202042252A (en) | Electroconductive paste, electronic component, and laminated ceramic capacitor | |
| JP4373968B2 (en) | CERAMIC GREEN SHEET COATING AND ITS MANUFACTURING METHOD, CERAMIC GREEN SHEET, AND ELECTRONIC COMPONENT EQUIPPED WITH THE SAME | |
| KR102105906B1 (en) | Cu paste for high-temperature sintering and manufacturing method for metal bonded ceramic substrates therewith | |
| JP2002255655A (en) | Ceramic compact and ceramic electronic parts | |
| JP5268847B2 (en) | Wiring board and manufacturing method thereof | |
| WO2006134673A1 (en) | Process for producing ceramic sheet | |
| JP2006089319A (en) | Ferrite and glass-ceramic substrate | |
| JP7494554B2 (en) | Conductive paste, electronic components, and multilayer ceramic capacitors | |
| JP4930817B2 (en) | Ceramic slurry, ceramic green sheet, and multilayer electronic component using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E90F | Notification of reason for final refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |