JP2011003612A - Electronic component and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component having terminal electrodes which have high size precision and shape precision, are fine and free from a void etc., and easy to form, and to provide a method of manufacturing the electronic component.SOLUTION: Element bodies 16 having end surfaces 16a and 16b where terminal electrodes are to be formed are held in a plurality of holding holes 42 of a holding plate 40 provided with the holding holes 42 in which the element bodies 16 are fitted in a direction substantially perpendicular to the end surfaces 16a and 16b so that the end surfaces 16a and 16b of the element bodies 16 are substantially flush with plate surfaces 40a and 40b of the holding plate 40. Conductive adhesive sheets 26 are stacked on the end surfaces 16a and 16b of the element bodies 16 and bonded in one body, and then cut along peripheral edges of the respective holding holes 42 of the holding plate 40, and the terminal electrodes 18 are formed on the end surfaces 16a and 16b.

Description

  The present invention relates to an electronic component provided with a terminal electrode, and a method for manufacturing such an electronic component.

  Electronic parts such as multilayer ceramic capacitors and chip type ceramic thermistors are known as chip type electronic parts having terminal electrodes at both ends of a rectangular parallelepiped element body, and are widely used in various electronic device products.

  To form the terminal electrode of this chip-type electronic component, conventionally, one end of the element body is immersed in a conductive paste (electrode paste) to form a film, and then the other end of the element body is immersed in the conductive paste. Then, a method of drying and baking these coatings (immersion method), or forming a conductive paste layer on a support, and sequentially transferring the conductive paste layer to both ends of the element body Thereafter, a drying and firing method (transfer method) is used. FIG. 7 shows an example of a multilayer ceramic capacitor in which a terminal electrode is formed by such a conventional method. The terminal electrode is covered so as to cover both end faces of the ceramic body 2 on which the internal electrode 1 is formed. (External electrode) 3 is formed.

  However, in such a conventional method, it is difficult to precisely control the size and shape, and the terminal electrode has a drawback that the dimensional accuracy and the shape accuracy are low. For this reason, it was practically impossible to apply to the latest ultra-small chip type electronic components requiring high dimensional accuracy and shape accuracy.

  That is, recently, as electronic devices become lighter, thinner, and smaller, chip-type electronic components have also been miniaturized. For example, in a multilayer ceramic capacitor, conventionally, 1608 type (1.6 mm × 0.8 mm × 0.8 mm), 1005 It was up to the mold (1.0 mm x 0.5 mm x 0.5 mm), but recently, the 0603 type (0.6 mm x 0.3 mm x 0.3 mm), the 0402 type (0.4 mm x 0.2 mm) X 0.2 mm) has appeared. In such an extremely small chip-type electronic component, it is difficult to precisely control the size and shape of the terminal electrode by the conventional dipping method or transfer method.

  Further, in the conventional method, the organic binder contained in the conductive paste is removed by combustion decomposition in the process of drying and baking the coating, but if this so-called “binder removal” is not performed sufficiently, There was also a problem that voids were likely to occur.

  Therefore, as an alternative method to the conventional method, for example, by holding the capacitor element body on a holding jig having a specific structure, a dent portion is formed by one end of the capacitor element body and the holding jig. A method of filling the dent portion with a conductive paste, forming a film on one end of the capacitor element body, and drying and solidifying the film (for example, refer to Patent Document 1), and inserting an electronic component into a holding hole formed in the holding plate Then, a method of exposing an end face of an electronic component and forming a thin-film terminal electrode on the exposed end face by a vapor phase method (for example, see Patent Document 2) has been proposed.

  However, in the former method of filling the hollow portion formed by the capacitor element body and the holding jig with the conductive paste, the structure of the holding jig is complicated, and it takes time to assemble and the like, so the workability is poor. Further, although the dimensional accuracy and the shape accuracy are improved to some extent, they are not always sufficient. Furthermore, the void problem has not been resolved. On the other hand, the latter method of forming a film by the vapor phase method, although the problems of dimensional accuracy, shape accuracy and void are almost solved, the vapor phase method itself is based on batch processing, so that the productivity is poor.

JP 2004-281823 A JP-A-7-263273

  The present invention has been made to solve the above-described problems of the prior art, and provides an electronic component including a terminal electrode that has high dimensional accuracy and shape accuracy, is dense, has no voids, and is easy to form, and a method for manufacturing the electronic component. The purpose is to provide.

  In order to achieve the above object, an electronic component according to an aspect of the present invention is an electronic component having a pair of end faces parallel to each other at both ends of an element body, and terminal electrodes are formed on the respective end faces. The terminal electrode is formed by laminating a conductive adhesive sheet on each end face and bonding them together.

  According to another aspect of the present invention, there is provided a method of manufacturing an electronic component comprising: an element body having end faces on which both end electrodes are to be formed; and a plurality of holding holes into which the element body is fitted in a direction substantially perpendicular to the end face. Each holding hole of the provided holding plate is held so that the end surface on which the terminal electrode of the element body is to be formed and the plate surface of the holding plate are substantially flush with each other, and conductive on the end surface of the element body A step of laminating and bonding the conductive adhesive sheets together, a step of cutting the conductive adhesive sheet along the peripheral edge of each holding hole, and obtaining an element body in which the conductive adhesive sheet is bonded to an end surface; , Including.

  According to the present invention, it is possible to obtain an electronic component including a terminal electrode that has high dimensional accuracy and shape accuracy, is dense, has no voids, and is easy to form.

It is sectional drawing which shows the multilayer ceramic capacitor of one Embodiment of this invention. It is sectional drawing which shows an example of the metal foil with a conductive adhesive layer used for this invention. It is sectional drawing which shows an example of the electroconductive adhesive sheet used for this invention. It is sectional drawing which shows each process of this invention method typically. It is sectional drawing which shows an example of the holding plate used for this invention method. (A) is sectional drawing which shows the state which mounted the multilayer ceramic capacitor of FIG. 1 on the wiring board, (b) It is sectional drawing which shows the state which mounted the conventional multilayer ceramic capacitor on the wiring board. It is sectional drawing which shows an example of the multilayer ceramic capacitor provided with the terminal electrode by the conventional method.

  Hereinafter, modes for carrying out the present invention will be described. Although the description will be made based on the drawings, the drawings are provided for illustration only, and the present invention is not limited to the drawings. In the following description of the drawings, common portions or portions having substantially the same function are denoted by the same reference numerals.

  FIG. 1 is a cross-sectional view showing a multilayer ceramic capacitor according to an embodiment of an electronic component of the present invention.

  As shown in FIG. 1, the multilayer ceramic capacitor 10 of this embodiment includes a capacitor element body 16 composed of a ceramic body 12 and internal electrodes 14, terminal electrodes (external electrodes) 18, 18 formed at both ends thereof, and It has.

The ceramic body 12 is obtained by laminating a plurality of (for example, about 30 to 50) ceramic green sheets mainly composed of a dielectric material, for example, BaTiO ₃ , and firing them at a predetermined temperature. The ceramic body 12 has a substantially rectangular parallelepiped shape.

  The internal electrodes 14 are formed in layers in the ceramic body 12 such that the respective edges are exposed at any end face of the ceramic body 12. These internal electrodes 14 are formed by, for example, applying a conductive paste containing a conductive component such as copper or nickel onto a predetermined ceramic green sheet directly in a desired pattern by screen printing, an ink jet method, or the like, and simultaneously firing it. Is done.

  The terminal electrode 18 is formed by laminating a conductive adhesive sheet on both end surfaces of the ceramic body 12 where the internal electrode 14 is exposed and bonding them together. These terminal electrodes 18 are electrically and mechanically joined to the internal electrode 14.

  As the conductive adhesive sheet, for example, as shown in FIG. 2, a metal foil 26 with a conductive adhesive layer in which a conductive adhesive layer 24 is provided on one side of the metal foil 22, or as shown in FIG. The conductive adhesive sheet 30 etc. which shape | molded the conductive adhesive composition in the sheet form are used.

  Examples of the metal foil 22 of the metal foil 26 with the conductive adhesive layer include a copper foil. The copper foil preferably has a thickness of 5 to 50 μm. The kind of copper foil is not particularly limited, and various commercially available copper foils such as electrolytic copper foil and rolled copper foil can be used. Examples of the conductive adhesive constituting the conductive adhesive layer 24 include an adhesive containing conductive powder and an organic binder. Any adhesive may be used as long as the cured product has conductivity and can adhere the metal foil 22 and the capacitor element body 16. Examples of the conductive powder include a metal simple substance such as copper, gold, silver, nickel, palladium, cobalt, or a metal powder made of an alloy containing at least one selected from the above metal elements. Among these conductive powders, copper powder is preferable from the viewpoint of balance between conductivity and price. In addition, as the organic binder, those having good adhesion to metal are preferable, for example, epoxy resin, acrylic resin, urethane resin, silicone resin, styrene resin, phenol resin, polyamide resin, polyolefin resin, melamine resin, urea resin, etc. Is mentioned. Among these, an epoxy resin is preferable from the viewpoint of connection reliability and the like.

  Moreover, the conductive adhesive composition used for forming the conductive adhesive sheet 30 includes a conductive powder and an organic binder, and preferably further includes a glass powder.

  As the conductive powder, the same conductive powder as exemplified in the description of the conductive adhesive layer 24 of the metal foil 26 with the adhesive layer described above, that is, for example, copper, gold, silver, nickel, palladium, cobalt Examples of such a simple metal, or a metal powder made of an alloy containing at least one selected from the above metal elements, among these conductive powders, from the viewpoint of the balance between conductivity and price, etc. Copper powder is preferred. The conductive powder is preferably contained in the conductive adhesive composition in an amount of 50 to 90% by mass, and more preferably 65 to 85% by mass. When the content of the conductive powder is less than the above range, the conductivity is lowered. Conversely, when the content is more than the above range, it becomes difficult to form a sheet.

  The organic binder is preferably one that thermally decomposes even when the oxygen concentration in the furnace atmosphere is low. For example, a (co) polymer of (meth) acrylic acid ester, (meth) acrylic acid ester and (meth) acrylic acid An acrylic resin such as a copolymer is used. Specific examples of (meth) acrylic acid esters include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, iso-propyl (meth) acrylate, n-butyl (meth) acrylate, iso- Butyl (meth) acrylate, tert-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, glycidyl methacrylate, methyl glycidyl methacrylate, 2-hydroxy (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate , Diethylaminoethyl (meth) acrylate, dimethylamino (meth) acrylate, dimethylaminoethyl (meth) acrylate, benzyl (meth) acrylate, cyclohexyl (meth) acrylate Rate, 1,6-hexanediol (meth) acrylate. These may be used individually by 1 type, and may mix and use 2 or more types.

  This organic binder preferably has a molecular weight (weight average molecular weight measured by gel permeation chromatography) of 50,000 to 300,000. If the molecular weight is less than 50,000, it becomes difficult to form a sheet. If the molecular weight is more than 300,000, the solvent for adjusting the viscosity becomes excessive, and voids are likely to occur after firing.

  Moreover, it is preferable that 3-10 mass% of organic binders are contained in the conductive adhesive composition. When the content of the organic binder is less than 3% by mass, it becomes difficult to form a sheet. Conversely, when the content exceeds 10% by mass, the density after firing decreases.

  The conductive adhesive sheet 30 preferably has an appropriate viscosity. Adjustment of the viscosity of the conductive adhesive sheet 30 can be adjusted by the molecular weight and blending amount of the organic binder and the amount of the solvent.

Glass powder is a component that is basically blended to facilitate sintering of the metal powder. Examples of the glass powder include BaO—B ₂ O ₃ —SiO ₂ glass powder, Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ glass powder, ZnO—B ₂ O ₃ —SiO ₂ glass powder, and the like. A mixture of these is used. These glass powders may contain a small amount of other oxides, for example, oxides of alkali metals, strontium, lead, copper, tin, iron, cobalt, etc., as long as the properties are not affected.

  The glass powder used in the present invention can be produced by a sol-gel method, a spray pyrolysis method, an atomizing method, or the like, in addition to a usual method of mixing raw material compounds of each component, melting, quenching and grinding. Among these methods, the spray pyrolysis method is preferable because a spherical glass powder having a fine and uniform particle size is obtained, and it is not necessary to perform a pulverization treatment when blended into the composition.

  When mix | blending glass powder, it is preferable to set the compounding quantity as 5-12 mass% of the whole conductive adhesive composition, and it is more preferable to set it as 6-10 mass%. When the blending amount of the glass powder is less than 5% by mass, the density after firing cannot be sufficiently obtained. Conversely, when the amount exceeds 12% by mass, sufficient conductivity cannot be obtained.

  Although not shown, a plating film by wet plating such as nickel, tin, or solder may be provided on the surface of the terminal electrode 18. By providing such a plating film, solder wettability and solder heat resistance can be improved.

  Next, a method for manufacturing the multilayer ceramic capacitor 10 will be described with reference to FIG. In this method, a holding plate 40 as shown in FIG. 5 is used. That is, the holding plate 40 holds the capacitor element body 16 on a flat plate 41 having a thickness substantially the same as the length of the capacitor element body 16 (the length in the direction perpendicular to the end face forming the terminal electrode 18). A plurality of rectangular holding holes 42 are provided. In FIG. 5, the 25 holding holes 42 are provided so as to be substantially equally arranged, but the number, the formation positions, and the like of the holding holes 42 are not particularly limited thereto.

  As the flat plate 41, a metal plate made of stainless steel, copper, or the like, or a plate made of various organic materials is used. Among them, an organic material having good workability and less warping and twisting, for example, an epoxy resin It is preferable to use a thermosetting resin such as a phenol resin, a polyimide resin, an unsaturated ester resin, or a melamine resin, or a thermoplastic resin such as a fluorine resin, polyvinyl chloride, a polyester resin, or an acrylic resin. A flat plate made of fiber reinforced plastic (FRP) reinforced with fibers of glass fiber, aramid fiber, cellulose fiber, polyester fiber, and basalt fiber has high strength even if it is thin. It is more preferable because it can be increased. A glass epoxy laminated plate generally used conventionally as a material for the wiring board is suitable as a material for the holding plate 40.

  In addition, as a method of forming the holding hole 42 in the flat plate 41 made of such a glass epoxy laminated plate or the like, various conventionally known drilling methods such as drilling, router processing, die punching, and laser processing are used. Can do.

  It is also possible to use the holding plate 40 that has been molded into a predetermined shape in advance by resin injection molding or the like in addition to the plate 41 that has been perforated.

  In this manufacturing method, first, as shown in FIG. 4 (a), the capacitor element body 16 provided with an internal electrode inside the ceramic body is formed in each holding hole 42 of the holding plate 40, and its terminal electrode is formed. The respective end surfaces (the first end surface 16a and the second end surface 16b) to be performed and the upper and lower plate surfaces (the first plate surface 40a and the second plate surface 40b) of the holding plate 40 are substantially flush with each other. Insert to become.

  Next, as shown in FIG. 4B, a conductive adhesive sheet is laminated on each of the first and second plate surfaces 40a and 40b of the holding plate 40 in which the capacitor element body 16 is inserted, and bonded together.

  The drawing shows an example in which a metal foil 26 with a conductive adhesive layer as shown in FIG. 2 is used as a conductive adhesive sheet. Thus, when using the metal foil 26 with a conductive adhesive layer, after laminating | stacking the conductive adhesive layer 24 side toward the 1st end surface 16a or the 2nd end surface 16b side, a press, a roll, etc. are carried out. For example, it is heated and pressurized at room temperature to 150 ° C. and a pressure of 0 to 0.5 MPa, and bonded together. After the bonding, if necessary, the adhesive is further aged by heating at 150 to 200 ° C. to completely cure the adhesive.

  Thereafter, if necessary, a plating film of nickel, tin, solder, or the like is formed on the terminal electrode 18 by a wet plating method. Then, as shown in FIG. The conductive adhesive sheet (metal foil 26 with a conductive adhesive layer) adhered to the second end faces 16a and 16b is cut along the peripheral edge of each holding hole 42 using a router or the like.

  Thereby, the multilayer ceramic capacitor 10 in which the terminal electrodes 18 are formed at both ends of the capacitor element body 16 as shown in FIG. 1 is obtained.

  Although not described with reference to the drawings, when the conductive adhesive sheet 30 as shown in FIG. 3 is used as the conductive adhesive sheet, the capacitor element body 16 is inserted into each holding hole 42 of the holding plate 40. The conductive adhesive sheet 30 is laminated on the first and second plate surfaces 40a, 40b of the holding plate 40, and the same as in the case of the metal foil 26 with the conductive adhesive layer, for example, room temperature to 150 ° C., pressure 0 to Heat and press at 0.5 MPa to bond them together. Next, the bonded conductive adhesive sheet 30 is cut along the peripheral edge of each of the 42 holding holes by using a router or the like, and the capacitor element body in which the conductive adhesive sheet 30 is bonded to both end faces. Get 16. Next, the capacitor element body 16 in which the conductive adhesive sheet 30 is bonded to both end faces is placed in a heating furnace and heated at, for example, 650 to 850 ° C. for about 0.5 to 2 hours, and the conductive adhesive sheet 30 is fired to form the terminal electrode 18. Thereafter, if necessary, a plating film of nickel, tin, solder or the like is formed on the terminal electrode 18 by wet plating. Thereby, the multilayer ceramic capacitor 10 in which the terminal electrodes 18 are formed at both ends of the capacitor element body 16 as shown in FIG. 1 is obtained.

  In such a manufacturing method, since the terminal electrode is formed using a pre-formed conductive adhesive sheet, it is possible to form a terminal electrode that is excellent in dimensional accuracy and shape accuracy and is dense and has few voids. When a metal foil with a conductive adhesive layer is used as the conductive adhesive sheet, since there is no need for firing, the terminal electrode can be formed with few steps. Moreover, since it is possible to form terminal electrodes on both end faces of a large number of capacitor element bodies using a simple holding jig, the workability and productivity are excellent.

  Furthermore, since the terminal electrode 18 according to the present embodiment is formed only on the end face of the capacitor element body 16, the solder wettability at the time of connecting the conductor on the board surface as compared with the conventional terminal electrode provided continuously from the end face to the side face. It will be excellent. 6A is a cross-sectional view showing a state in which the multilayer ceramic capacitor 10 of the present embodiment shown in FIG. 1 is mounted on the wiring board 70, and FIG. 6B is a cross-sectional view of FIG. 6 is a cross-sectional view showing a state in which the conventional multilayer ceramic capacitor shown is mounted on a wiring board 70. FIG. As shown in these drawings, since the terminal electrode 18 according to the present embodiment has better solder wettability than the conventional terminal electrode 3, the solder layer 72 is more reliable than the conductor layer 71 on the wiring board 70. Connection is possible.

  The present invention can be widely applied not only to the above-described multilayer ceramic capacitor but also to chip-type ceramic thermistors and various chip-type electronic components having terminal electrodes at the ends, and has high dimensional accuracy and shape accuracy. An electronic component having electrodes and excellent workability and productivity can be obtained.

  EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples at all. In the following description, “parts” means “parts by mass” unless otherwise specified.

Example 1
100 parts of bisphenol A liquid epoxy resin (trade name EP4100E manufactured by Asahi Denka Co., Ltd.), 50 parts of novolak type epoxy resin (trade name N-673 manufactured by DIC Corporation), product manufactured by Japan Epoxy Resin Co., Ltd. Name XY8100) 40 parts, curing accelerator (product name C11Z, manufactured by Shikoku Kasei Co., Ltd.) 5 parts, spherical silver powder (number average particle size 1.5 μm) 60 parts, and methyl ethyl ketone / toluene mixture (mass ratio 6 / 4) After stirring and mixing 600 parts, this liquid mixture was applied to one side of a 35 μm thick electrolytic copper foil (Fukuda Metal Foil Powder Co., Ltd.) and dried to form a 10 μm thick conductive adhesive layer. A copper foil with a conductive adhesive layer was formed.

  In addition, using a router on a 300 mm long, 300 mm wide, 4 mm thick glass epoxy laminate (trade name: TLB-551, manufactured by Kyocera Chemical Co., Ltd.), a rectangular through-hole of vertical / horizontal = 2mm / 2mm is drilled. And a holding plate as shown in FIG. 5 was produced.

  After inserting the element body of a 1005 type multilayer ceramic capacitor having an internal electrode formed in each through hole of the holding plate, the copper foil with the conductive adhesive layer is formed on the upper surface and the lower surface of the conductive adhesive layer. Lay the side facing the ceramic body, heat press for 30 minutes at a temperature of 130 ° C and a pressure of 0.5 MPa, and further heat at 170 ° C for 1 hour to integrate the element body and copper foil together Made it.

  Thereafter, the laminated copper foil using a router was cut together with a holding plate to produce a multilayer ceramic capacitor having external electrodes on both end faces.

(Example 2)
10 parts of scaly copper powder (number average particle size 1.5 μm), 65 parts of spherical copper powder (number average particle size 1.3 μm), 8 parts of glass powder (number average particle size 3 μm) and 30% iso-butyl methacrylate resin After mixing 17 parts of a contained terpineol solution (trade name High Pearl M-0603-30c, weight average molecular weight 170,000 manufactured by Negami Kogyo Co., Ltd.), a conductive adhesive sheet having a thickness of 50 μm was prepared with a roll.

  This conductive adhesive sheet was produced in the same manner as in Example 1, and the upper and lower surfaces of the holding plate in which the element body of the 1005 type multilayer ceramic capacitor having the internal electrode formed therein was inserted into the through-hole, In a hot press, it was heated and pressed at a temperature of 100 ° C. and a pressure of 0.2 MPa for 30 minutes for adhesion.

  Thereafter, the conductive adhesive sheet is cut using a router to obtain an element body of a 1005 type multilayer ceramic capacitor having conductive adhesive sheets on both end faces, and then these are placed in a nitrogen atmosphere at a temperature of 700 ° C. By heating for 50 minutes, the conductive adhesive sheet was baked to produce a multilayer ceramic capacitor having external electrodes on both end faces.

(Comparative example)
Prepare 100 element bodies of 1005 type multilayer ceramic capacitor with internal electrodes formed inside, and with one end of each element body fixed to the adhesive tape, the conductive paste contained in the immersion tank A conductive paste was applied to both ends of each element body by a method of immersing the ends, dried at 150 ° C. for 15 minutes, and then baked at 700 ° C. for 50 minutes in a nitrogen atmosphere to form terminal electrodes. . As the conductive paste, a commercially available conductive paste (trade name: CT600 manufactured by Kyocera Corporation) was used.

  The dimensions of the terminal electrodes (distance L between electrodes and electrode side length M shown in FIG. 6) of the multilayer ceramic capacitors obtained in each of the above examples and comparative examples were measured, and the occurrence of voids was observed by observing the cross section. The number of samples was counted. In addition, the solder was mounted on the wiring board, the ratio of the solder wet area to the entire end face was determined, and the solder wettability was evaluated (average value of n = 5). The results are shown in Table 1.

  As is apparent from Table 1, the terminal electrodes formed in the examples are superior in dimensional accuracy compared to the comparative example to which the conventional method is applied, and the occurrence of voids in the terminal electrodes is small, and the solder wettability is also low. It was good.

  DESCRIPTION OF SYMBOLS 10 ... Multilayer ceramic capacitor, 12 ... Ceramic body, 14 ... Internal electrode, 16 ... Capacitor element main body, 16a ... 1st end surface, 16b ... 2nd end surface, 18 ... External electrode, 22 ... Metal foil, 24 ... Conductivity Conductive adhesive layer, 26 ... metal foil with conductive adhesive layer, 30 ... conductive adhesive sheet, 40 ... holding plate, 40a ... first plate surface, 40b ... second plate surface, 42 ... holding hole.

Claims (6)

  An electronic component having a pair of end faces parallel to each other at both ends of the element body, and terminal electrodes are formed on each of these end faces, wherein the terminal electrodes are formed by laminating a conductive adhesive sheet on each end face. Electronic parts characterized by being bonded together.   The electronic component according to claim 1, wherein the conductive adhesive sheet is a metal foil with a conductive adhesive layer in which a conductive adhesive layer is provided on one side of the metal foil.   The electronic component according to claim 1, wherein the conductive adhesive sheet is a conductive adhesive sheet obtained by forming a conductive adhesive composition into a sheet shape.   4. The electronic component according to claim 1, wherein the electronic component is a multilayer ceramic capacitor or a chip-type ceramic thermistor element. The element body having an end surface on which the terminal electrodes are to be formed at both ends, and the element body in each holding hole provided with a plurality of holding holes into which the element body is fitted in a direction substantially perpendicular to the end surface. And a step of laminating a conductive adhesive sheet on the end face of the element body and integrally bonding the end face to be formed so that the end face of the terminal electrode and the holding plate are substantially flush with each other, and
Cutting the conductive adhesive sheet along the peripheral edge of each holding hole to obtain an element body having the conductive adhesive sheet bonded to an end surface;
The manufacturing method of the electronic component characterized by including.   6. The method of manufacturing an electronic component according to claim 5, wherein after the conductive adhesive sheet is cut, a predetermined heat treatment is performed on the conductive adhesive sheet bonded to the end face of the element body.

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