JP2002255655A - Ceramic compact and ceramic electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic compact in which the content of an organic binder is low, and the heating and removal of the organic binder can be performed in a short time, and ceramic electronic parts using the ceramic compact. SOLUTION: The ceramic compact is produced by using ceramic slurry containing ceramic powder and an organic vehicle as an emulsion consisting of an organic binder consisting of a polyurethane resin and a solvent. When the ceramic slurry is produced by using a water-containing solvent, as the organic binder, an anionic polyurethane resin, or a nonionic polyurethane resin, or an anionic/nonionic polyurethane resin is used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic compact formed using a ceramic slurry containing a ceramic powder, an organic vehicle comprising an organic binder and a solvent, and a ceramic electronic device using the same. It concerns parts.

[0002]

2. Description of the Related Art Conventionally, a ceramic molded body, especially a ceramic green sheet, is prepared by, for example, using a ceramic slurry, which is a mixture of a ceramic powder and an organic vehicle comprising an organic binder and a solvent, by a doctor blade method or the like. It was formed by applying a predetermined thickness on a carrier tape and drying it to remove the solvent by volatilization. As an organic binder used for a conventional ceramic molded body, for example, a thermoplastic resin can be cited, and a typical example is an acrylic resin or polyvinyl alcohol (PV).
A). Examples of the method for producing the ceramic molded body include, besides sheet molding, casting, injection molding, extrusion molding, thick film printing molding, and the like.

[0003]

The organic binder in the ceramic slurry is adsorbed on the surface of the ceramic powder and agglomerates at the time of drying after forming the sheet to give shape retention. In order to obtain a ceramic molded body having high elongation or elongation, that is, to cause sufficient adsorption and aggregation, generally, 10 to 15 parts by weight of an organic binder is required for 100 parts by weight of the ceramic powder. For this reason, there is a problem that it takes time to heat and remove the organic binder, and deformation and warping are likely to occur due to a large shrinkage accompanying sintering of the ceramic molded body.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and it is an object of the present invention to provide a ceramic molded body having a low content of an organic binder and requiring only a short time to remove the organic binder by heating, and a ceramic using the same. To provide electronic components.

[0005]

Means for Solving the Problems To achieve the above object, a ceramic compact of the present invention comprises a ceramic powder,
It is characterized by being molded using a ceramic slurry containing an organic vehicle which is an emulsion comprising an organic binder comprising a polyurethane resin and a solvent.

Further, a ceramic molded body of the present invention is the above-mentioned ceramic molded body, wherein the average particle size of the organic binder is 300 nm or less.

The ceramic compact of the present invention is the above-described ceramic compact, wherein the content of the organic binder in the ceramic slurry is 10% or less.
The amount is not more than 8 parts by weight with respect to 0 parts by weight.

[0008] The ceramic molded article of the present invention is the above-mentioned ceramic molded article, wherein the ceramic slurry further contains a crosslinking agent.

Further, a ceramic molded body of the present invention is the above-mentioned ceramic molded body, wherein the solvent in the ceramic slurry contains water.

Further, when a solvent containing water is used,
The organic binder is made of an anionic polyurethane resin, a nonionic polyurethane resin, or an anionic / nonionic polyurethane resin.

Further, the ceramic molded body of the present invention is the above-mentioned ceramic molded body, characterized in that it is a ceramic green sheet formed into a sheet using a ceramic slurry.

A ceramic electronic component according to the present invention includes a ceramic body and external electrodes formed so as to be in contact with the ceramic body. The ceramic body is formed by firing the above-described ceramic molded body of the present invention. It is characterized by becoming.

[0013] Further, a ceramic electronic component according to the present invention includes a ceramic body in which a plurality of ceramic layers are laminated;
An external electrode formed so as to be in contact with the ceramic body, wherein the ceramic layer is formed by firing the above-mentioned ceramic molded body of the present invention.

The ceramic compact of the present invention is formed by using a ceramic slurry containing ceramic powder, an organic vehicle which is an emulsion comprising an organic binder comprising a polyurethane resin and a solvent, and The content of the organic binder in the ceramic slurry can be reduced, the amount of the aggregate of the excess organic binder is small, and the ceramic slurry has excellent tensile strength and elongation. When the ceramic molded body is fired to produce a ceramic electronic component, the organic binder can be removed by heating in a short time. Further, shrinkage due to sintering of the ceramic molded body is reduced, and a ceramic electronic component with less deformation and warpage can be provided.

Further, the ceramic molded body of the present invention has excellent tensile strength and elongation as compared with the conventional one, and the organic binder content, because the average particle size of the organic binder in the above-mentioned ceramic slurry is 300 nm or less. Can be further reduced.

Further, in the ceramic compact of the present invention, the content of the organic binder in the above-mentioned ceramic slurry is 8 parts by weight or less with respect to 100 parts by weight of the ceramic powder, so that the organic binder content is smaller than that of the conventional ceramic slurry. But with excellent tensile strength and elongation.

Further, the ceramic molded article of the present invention has more excellent tensile strength and elongation while having a smaller organic binder content than before, because the ceramic slurry further contains a crosslinking agent.

When a water-containing solvent is used as the solvent in the ceramic slurry, an anionic polyurethane resin, a nonionic polyurethane resin, or an anionic / nonionic polyurethane resin is used as an organic binder. Can be used.

Among these, there are many types of anionic polyurethane resins as compared with nonionic or anionic / nonionic polyurethane resins, so that the degree of freedom in selecting a polyurethane resin to be used as a binder is high. Then, an optimal polyurethane resin can be selected in order to obtain desired properties such as elongation and tensile strength of the ceramic molded body to be produced.

When a nonionic polyurethane resin is used, the metal ions eluted from the ceramic powder in the ceramic slurry do not react with the hydrophilic groups.
When an anionic / nonionic polyurethane resin is used, the degree of reaction between the eluted metal ion and the hydrophilic group is low. Therefore, when a nonionic polyurethane resin or an anionic / nonionic polyurethane resin is used, it is not necessary to add an additive for preventing the reaction between the eluted metal ion and the hydrophilic group. Further, it is not necessary to add an organic binder excessively in order to obtain strength. Thereby, it is possible to prevent a decrease in the density of the ceramic molded body. Further, it is possible to prevent an increase in pores and an increase in pore diameter of the ceramic body obtained by firing the ceramic molded body.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The ceramic molded article of the present invention requires the use of an organic vehicle which is an emulsion composed of an organic binder composed of a polyurethane resin and a solvent. In the present invention, "emulsion"
It is generally defined as "a liquid in which another liquid that does not dissolve in the form of fine droplets is dispersed" and includes so-called colloidal dispersion.

The reasons for selecting the polyurethane resin emulsion as the organic vehicle in the ceramic molded article of the present invention are roughly classified into the following three points. First, the polyurethane resin has a urethane bond, and the urethane bond between N—H and C ＝ O, and the N of the urethane bond
Since hydrogen bonds are formed between -H and O in the polyol portion, the molecular cohesion is excellent.

Second, the polyurethane resin has a segment structure, exhibits strength in the hard segment portion and exhibits flexibility in the soft segment portion, and satisfies the desired strength and elongation by combining these. The resulting ceramic molded body is obtained.

Third, the emulsion has a high molecular weight,
It has better film forming properties, lower viscosity and better dispersibility than the solution type organic binder. Due to the characteristics of such a polyurethane resin emulsion, a ceramic molded body having excellent workability and elongation can be obtained even if the content in the ceramic slurry is small.

As the organic binder, an anionic polyurethane resin, a nonionic polyurethane resin, or an anionic / nonionic polyurethane resin can be used. Here, in the present invention,
The “anionic / nonionic” polyurethane resin is a polyurethane resin to which both an anionic hydrophilic group and a nonionic hydrophilic group are provided.

When an anionic polyurethane resin is used, a polyurethane resin emulsion composed of the resin and a solvent may aggregate to cause gelation or high viscosity of the ceramic slurry. This is presumably because metal ions eluted from the ceramic powder in the ceramic slurry react with anionic groups in the anionic polyurethane resin. In order to prevent such a reaction, an additive such as a tertiary amine, an alkali carbonate or an alkali hydrogen carbonate may be added to the ceramic slurry.

When a nonionic polyurethane resin is used, a nonionic hydrophilic group is provided and does not react with metal ions eluted from the ceramic powder. Furthermore, when an anionic / nonionic polyurethane resin is used, both an anionic hydrophilic group and a nonionic hydrophilic group are provided, and the degree of reaction is lower than that of the anionic polyurethane resin.

The average particle size of the organic binder, that is, the polyurethane resin in the ceramic molded body of the present invention is preferably 300 nm or less. The smaller the average particle size of the organic binder, the higher the relative density, tensile strength, and elongation of the ceramic molded body containing the same weight.
When the average particle size of the organic binder is 300 nm or less,
The effect of improving the tensile strength and elongation for the same content becomes remarkable. The average particle size of the organic binder is more preferably 200 nm or less, and particularly preferably 10 nm.
0 nm or less.

In the case of using a conventional organic binder such as an acrylic resin, 10 to 15 parts by weight is required, whereas in the case of the ceramic molded article of the present invention, the content of the organic binder is reduced. Since the relative density, tensile strength, and elongation of the ceramic molded body of the present invention are equal to or greater than the above, the content of the organic binder in the ceramic slurry of the ceramic molded body of the present invention is 8 parts by weight or less based on 100 parts by weight of the ceramic powder. Preferably, there is. Here, the content of the organic binder and the tensile strength and elongation of the ceramic molded body are in a substantially proportional relationship.

As described above, the smaller the average particle size of the organic binder, the higher the relative density, tensile strength and elongation of the ceramic molded body. For example, in the case of a single-plate type ceramic electronic component in which the thickness of the ceramic molded body is relatively thick, about 0.2 mm, the average particle size of the organic binder is 300 nm.
The content of the organic binder is preferably 5 to 7 parts by weight if it is around, and the content is 4 if the average particle size is around 200 nm.
If the average particle size is around 100 nm, the content is preferably 3 to 5 parts by weight, and the average particle size is 10 to 10 parts by weight.
If it is less than 0 nm, the content is preferably 1 to 3 parts by weight.

In the method for producing a ceramic molded body of the present invention, a crosslinking agent is further contained in the ceramic slurry in order to improve the strength of the ceramic molded body without increasing the content of the organic binder in the ceramic slurry. Is preferred. In the case of the present invention using an organic vehicle which is an emulsion composed of an organic binder composed of a polyurethane resin and a solvent, a crosslinked structure is formed between functional groups in the polyurethane resin emulsion, so that the strength of the ceramic molded body is improved. The crosslinking agent is not particularly limited, but is preferably a polyisocyanate. In particular, when an aqueous solution is used as a solvent, a water-dispersible polyisocyanate is preferred.

Examples of the ceramic molded body of the present invention include ceramic green sheets formed by using a ceramic slurry to form a sheet. However, the present invention is not limited thereto, and includes, for example, casting, injection molding, and extrusion. It may be a ceramic molded body formed by molding, thick film printing molding, or the like.

An embodiment of the ceramic electronic component of the present invention will be described in detail with reference to FIG. That is, the ceramic electronic component 1 includes the ceramic body 2, the electrodes 3,
3, solder 4, 4; lead terminals 5, 5;

The ceramic body 2 is a disc-shaped sintered body obtained by firing a ceramic molded body of the present invention, which is formed by sheet-forming a ceramic slurry. The electrodes 3, 3 are composed of a pair of electrode films formed on both main surfaces of the ceramic body 2. The solders 4, 4 are formed on the electrodes 3, 3 so as to electrically and mechanically join the electrodes 3, 3 and the lead terminals 5, 5, respectively. The exterior resin 6 is formed so as to cover the ceramic body 2, the electrodes 3, 3 and the solders 4, 4.

As the ceramic body 2, for example, a material made of a material functioning as a dielectric, an insulator, a semiconductor, a piezoelectric, or a magnetic material can be appropriately used. Although the shape of the ceramic body 2 shown in FIG. 1 is a disk shape, the shape of the ceramic body 2 is not particularly limited to a disk shape, and is sufficient to form the electrodes 3 and 3. If a surface is provided, for example, a square plate type or the like can be appropriately used.

The electrodes 3 and 3 are electrode films formed on both main surfaces of the ceramic body 2. For example, when formed by electroless Ni plating, Ni / Ni 3 depends on the type of the reducing agent component in the plating bath. The film is formed as a layer of P, Ni / B or Ni / Ag alloy or the like. The shape and size of the external electrode are not limited to the embodiment of the present invention.
Alternatively, it can be formed by taking a gap width of an arbitrary shape, and the effect of the present invention can be obtained in any case. In addition, the number of layers of the external electrode is not limited to the embodiment of the present invention. For example, an external electrode of the second layer may be further formed on the external electrode of the first layer. An electrode may be formed as appropriate.

The material, shape and size of the solders 4 and 4 are not limited to the embodiment of the present invention.
It may be formed on the entirety of the electrodes 3 or 3 or may be an arbitrary part on the electrodes 3 and 3, whichever case.

The material, shape and size of the lead terminals 5 and 5 are not limited to the embodiment of the present invention. For example, a metal wire made of Cu, Fe, Ni, Au or the like may be used as a core material. Accordingly, Sn, Cu, Pd,
Au, Sn-Cu, Sn-Ag, a lead terminal plated with Sn-Ag-Cu, or the like can be used as appropriate.

The exterior resin 6 includes, for example, epoxy resin, silicone resin, etc., but is not particularly limited thereto. Representative resins having excellent insulation properties, moisture resistance, impact resistance, heat resistance, and the like can be used. A suitable resin can be used as appropriate. Note that the exterior resin 6 does not necessarily need to be provided, and any number of layers may be formed.

Another embodiment of the ceramic electronic component of the present invention will be described in detail with reference to FIG. That is, the ceramic electronic component 11 is
, Internal electrodes 13, 13, external electrodes 14, 14, and plating films 15, 15.

The ceramic body 12 is formed by laminating a plurality of green ceramic layers obtained by cutting a ceramic molded body of the present invention, which is formed by sheet-forming a ceramic slurry made of a dielectric material containing BaTiO ₃ as a main component, into a predetermined size. Is fired.

The internal electrodes 13 and 13 are made of ceramic body 1
A conductive paste is printed on a plurality of green ceramic layers between the ceramic layers 12a in the inner layer 2 and is fired simultaneously with a green ceramic body laminated with the green ceramic layers to form the internal electrodes 13 and 13. Are formed so as to be exposed at any end face of the ceramic body 12.

The external electrodes 14 and 14 are
A conductive paste is applied to the end face of the ceramic body 12 and baked so as to be electrically and mechanically joined to one end of each of the internal electrodes 13, 13 exposed on the end face of the ceramic element 12.

The plating films 15 are made of, for example, Sn or N
At least one layer is formed on the external electrodes 14 and 14 by electroless plating such as i or solder plating.

The material of the ceramic body 12 of the ceramic electronic component of the present invention is not limited to the above-described embodiment, but may be any other dielectric material such as CaTiO ₃ and MgTiO ₃ , an insulator, a magnetic material, and the like. A body, a piezoelectric body, or a semiconductor material may be used. Further, the number of stacked ceramic layers in the ceramic body 12 of the present invention is not limited to the above-described embodiment, and any number of stacked layers may be used. Further, the number of internal electrodes 13 of the ceramic electronic component of the present invention is not limited to the above embodiment.

[0046]

[Embodiment] [Example using anionic polyurethane resin] An example in which barium titanate powder is used as a ceramic material and an anionic polyurethane resin is used as an organic binder to form a ceramic molded body will be described.

The reason why the ceramic material made of barium titanate powder is combined with the organic binder made of an anionic polyurethane resin is as follows. That is, generally, relatively small amounts of metal ions elute from a ceramic slurry prepared using barium titanate powder. Therefore, the anionic group in the anionic polyurethane resin reacts with the eluted metal ions, and there is no possibility that the ceramic slurry gels or has a high viscosity. Therefore, when a polyurethane resin is used as an organic binder in the preparation of a ceramic slurry using barium titanate powder, an anionic polyurethane resin is usually employed.

Barium titanate powder as a ceramic material, and an average particle size of 1 as an organic vehicle in Examples 1 to 5
Anionic polyurethane resin emulsion composed of 30% by weight of an anionic polyurethane resin having a thickness of 100 to 500 nm and 70% by weight of an aqueous solvent, and 50% by weight of a vinyl acetate resin having an average particle diameter of 1000 nm as an organic vehicle of Comparative Example 1 And a vinyl acetate resin emulsion comprising 50% by weight of a water solvent, an acrylic resin emulsion comprising 30% by weight of an acrylic resin having an average particle diameter of 100 nm as an organic vehicle of Comparative Example 2 and 70% by weight of an aqueous solvent, A dispersant for uniformly dispersing and an antifoaming agent for improving the defoaming property were prepared.

Next, 100 parts by weight of barium titanate powder, various resin emulsions of Examples 1 to 5 and Comparative Examples 1 and 2 having the contents shown in Table 1, 20 parts by weight of an aqueous solvent, and 1 part by weight of a dispersant And 0.5 parts by weight of an antifoaming agent, and then mixed and crushed for 2 hours using a ball mill to obtain a ceramic slurry, which was then defoamed and then formed into a sheet using a doctor blade. Dry to a thickness of 0.2
Examples 1 to 5 and Comparative Examples 1 and 2 were manufactured.

Therefore, Examples 1 to 5 and Comparative Examples 1 and 2
The relative density (%), tensile strength (MPa) and elongation (%) of the ceramic molded body of No. 2 were measured.
To 3 respectively. In addition, based on Tables 1 to 3, the relationship between the content of the organic binder and the relative density of the ceramic molded body is shown in a graph in FIG. FIG. 4 is a graph showing the relationship between the content of the organic binder and the tensile strength of the ceramic molded body. FIG. 5 is a graph showing the relationship between the content of the organic binder and the elongation of the ceramic molded body.

The relative density was obtained by punching a ceramic molded body into a sheet having a size of 76.0 × 58.4 mm using a sheet punching machine, and calculating the relative density (%) from the dimensions and thickness of the mold and the weight of the degreased body. The theoretical density was 5.83 g / cm ^{3 of the} true density of the powder.

The tensile strength and elongation were measured at 40.0 × 1 using a sheet punching machine.
A 2.0 mm “I” shape (center width 2 mm, recess length 30 mm, recess R5 mm) was punched out, and the test piece was subjected to a tensile strength tester Tensilon UCT manufactured by Orientec.
It measured using -1T. The crosshead speed during the test was 5.0 mm / min, and the measurement temperature was room temperature 25 ° C.

[0053]

[Table 1]

As is clear from Table 1 and FIG. 3, it is understood that the content of the organic binder in the ceramic slurry and the relative density of the ceramic compact are substantially inversely proportional. Further, comparing Examples 1 to 5 in which the average particle size of the organic binder is different, it can be seen that the relative density increases as the ceramic molded body uses the organic binder having the smaller average particle size.

When the content of the organic binder is the same, the relative densities of the ceramic molded bodies of Examples 1 to 5 are as follows:
It can be seen that the density is slightly higher than the relative density of the ceramic molded body of Comparative Example 2 having the same particle size, and about 20% higher than the relative density of the ceramic molded body of Comparative Example 1. Therefore, it can be said that when an anionic polyurethane resin or an acrylic resin is used as the organic binder, a higher-density ceramic molded body can be obtained than when a vinyl acetate resin is used.

[0056]

[Table 2]

As is clear from Table 2 and FIG. 4, it is understood that the content of the organic binder in the ceramic slurry and the tensile strength of the ceramic molded body are substantially proportional. In addition, comparing Examples 1 to 5 in which the average particle diameter of the organic binder is different, it can be seen that the tensile strength becomes higher as the ceramic molded body uses the organic binder having a smaller average particle diameter.

When the content of the organic binder is the same, the tensile strengths of the ceramic molded bodies of Examples 1 to 5 are higher and superior to those of Comparative Examples 1 and 2. . Therefore, in order to obtain the same tensile strength, it can be said that the content is smaller when the anionic polyurethane resin is used as the organic binder than when the vinyl acetate resin or the acrylic resin of the organic binder is used. .

[0059]

[Table 3]

As is clear from Table 3 and FIG. 5, it is understood that the content of the organic binder in the ceramic slurry and the elongation of the ceramic molded body are substantially proportional. Also, comparing Examples 1 to 5 in which the average particle size of the organic binder is different, it can be seen that the elongation increases as the ceramic molded body uses the organic binder having a smaller average particle size.

When the content of the organic binder is the same, it can be seen that the elongation of the ceramic molded bodies of Examples 1 to 5 is higher than the elongation of the ceramic molded bodies of Comparative Examples 1 and 2. Therefore, in order to obtain the same elongation, it can be said that the content is smaller when an anionic polyurethane resin is used as the organic binder than when a vinyl acetate resin or an acrylic resin of the organic binder is used.

FIG. 6 shows a micrograph of a polished ceramic molded body of Example 1 having a tensile strength of 2.30 MPa. Also, the same tensile strength of 2.30M
FIG. 7 shows a microphotograph of a polished ceramic molded body of Comparative Example 1 with Pa. 6 and 7, the portions indicated by arrows are organic binders. Example 1
And in the ceramic molded body of Comparative Example 1, the content of the organic binder was 4 parts by weight and 13 parts by weight, respectively, and the average particle diameter of the organic binder was 100 nm and 1000 parts, respectively.
nm.

When FIG. 6 and FIG. 7 are compared, FIG. 6 (Comparative Example 1) shows that the ceramic material constituting the ceramic molded body is denser in FIG. 6 (Example 1) than in FIG. 7 (Comparative Example 1). This is presumably because the polyurethane resin emulsion having excellent cohesiveness was used as the organic vehicle, and the fine organic binder was used.

Next, the ceramic compact of Example 1 was replaced with 8
The sample cut to 0.0 × 60.0 mm was degreased by raising the temperature to 50 to 600 ° C. at the temperature raising rate shown in Table 4 to obtain a degreased ceramic body. The amount of residual carbon remaining in the ceramic degreased body was measured and is shown in Table 4.

[0065]

[Table 4]

As is clear from Table 4, when the content of the anionic polyurethane resin as the organic binder in the ceramic slurry is 8 parts by weight or less with respect to 100 parts by weight of the ceramic powder, the temperature rising rate is 2 parts. 29 ° C /
Even in the case of min, the residual carbon amount is 0.01% by weight or less, which indicates that the carbon is sufficiently degreased. On the other hand, when the content exceeds 8 parts by weight, the effect of improving the degreasing property is reduced.

Next, a ceramic molded body was produced using a ceramic slurry containing a crosslinking agent. That is, using the ceramic slurries of Examples 1 to 5 described above, water-dispersible polyisocyanate was further prepared as a crosslinking agent, and 10% by weight of this was added to 100% by weight of an anionic polyurethane resin. Prepare ceramic slurries of No. 10 to No. 10, and apply them to Examples 1 to
Sheet molding was performed in the same manner as in No. 5 to produce ceramic molded bodies of Examples 6 to 10.

Therefore, the relative density (%), tensile strength (MPa),
The elongation (%) was measured and shown in Tables 5 to 7, respectively. FIG. 8 shows the relationship between the content of the organic binder and the relative density of the ceramic molded body based on Tables 5 to 7. FIG. 9 shows the relationship between the content of the organic binder and the tensile strength of the ceramic molded body. FIG. 10 shows the relationship between the content of the organic binder and the elongation of the ceramic molded body. The relative density, tensile strength, and elongation were measured in the same manner as in Examples 1 to 5 and Comparative Examples 1 and 2 described above.

Similarly, the relationship between the content of the organic binder and the relative density of the ceramic molded body was also shown in FIG. 8 based on the above measurement results for the ceramic molded bodies of Comparative Examples 1 and 2. . FIG. 9 also shows the relationship between the content of the organic binder and the tensile strength of the ceramic molded body. FIG. 10 also shows the relationship between the content of the organic binder and the elongation of the ceramic molded body.

[0070]

[Table 5]

As is apparent from Table 5 and FIG. 8, even when the crosslinking agent is contained, the content of the organic binder in the ceramic slurry and the relative density of the ceramic molded body are substantially inversely proportional. In addition, comparing Examples 6 to 10 in which the average particle size of the organic binder is different, it can be seen that the relative density increases as the ceramic molded body uses the organic binder having the smaller average particle size.

When the content of the organic binder is the same, the relative densities of the ceramic molded bodies of Examples 6 to 10 are substantially equal to the relative density of the ceramic molded body of Comparative Example 2, and It can be seen that when compared with the relative density of the ceramic molded body, it is about 20% higher. Therefore, it can be said that when an anionic polyurethane resin or an acrylic resin is used as the organic binder, a higher-density ceramic molded body can be obtained than when a vinyl acetate resin is used.

Further, as shown in Table 1 and FIG.
The relative densities of the ceramic moldings containing no crosslinking agent in Examples 1 to 5 are shown in Table 5 and Examples 6 to 10 shown in FIG.
It can be seen that the density is slightly higher than the relative density of the ceramic compact containing the crosslinking agent. This is because when a crosslinking agent is contained, the density is slightly reduced by the amount that drying shrinkage is inhibited by crosslinking.

[0074]

[Table 6]

As is clear from Table 6 and FIG. 9, even when the crosslinking agent is contained, the content of the organic binder in the ceramic slurry and the tensile strength of the ceramic molded body are approximately proportional. In addition, comparing Examples 6 to 10 in which the average particle size of the organic binder is different, it can be seen that the tensile strength becomes higher as the ceramic molded body uses an organic binder having a smaller average particle size.

When the content of the organic binder is the same, the tensile strengths of the ceramic molded bodies of Examples 6 to 10 are higher and superior to those of Comparative Examples 1 and 2. . Therefore, in order to obtain the same tensile strength, it can be said that the content is smaller when the anionic polyurethane resin is used as the organic binder than when the vinyl acetate resin or the acrylic resin of the organic binder is used. .

Further, Example 1 shown in Table 2 and FIG.
When the tensile strengths of the ceramic moldings containing no crosslinking agent of Examples 5 to 10 are compared with the tensile strengths of the ceramic moldings containing the crosslinking agents of Examples 6 to 10 shown in Table 6 and FIG. Is around 5 parts by weight and 20-5
About 0% strength improvement is observed. This is because a crosslinked structure is formed between the functional groups of the anionic polyurethane resin emulsion which is an organic vehicle.

[0078]

[Table 7]

As is clear from Table 7 and FIG.
It can be seen that even when a crosslinking agent is contained, the content of the organic binder in the ceramic slurry and the elongation of the ceramic molded body are substantially proportional. In addition, comparing Examples 6 to 10 in which the average particle size of the organic binder is different, it can be seen that the elongation increases as the ceramic molded body uses the organic binder having a smaller average particle size.

Further, when the content of the organic binder is the same, the elongation of the ceramic molded bodies of Examples 6 to 10 is higher and superior than the elongation of the ceramic molded bodies of Comparative Examples 1 and 2. Therefore, in order to obtain the same elongation, it can be said that the content is smaller when an anionic polyurethane resin is used as the organic binder than when a vinyl acetate resin or an acrylic resin is used as the organic binder.

Further, Example 1 shown in Table 3 and FIG.
Elongation of the ceramic molded body containing no crosslinker of ~ 5;
Comparing the elongation of the ceramic moldings containing the cross-linking agents of Examples 6 to 10 shown in Table 7 and FIG. 10, when the content of the organic binder was about 5 parts by weight, the elongation improvement of about 10 to 25% was found. Can be [Embodiment Using Nonionic Polyurethane Resin] An embodiment in which a ceramic molded body is manufactured by using lead zirconate titanate powder as a ceramic material and using a nonionic polyurethane resin as an organic binder will be described.

Here, the combination of a ceramic material composed of lead zirconate titanate powder and an organic binder composed of nonionic polyurethane resin is based on the following background. That is, generally, a relatively large amount of metal ions are eluted from a ceramic slurry prepared using lead zirconate titanate powder. Therefore, when a polyurethane resin is used as the organic binder, a nonionic polyurethane resin to which a nonionic hydrophilic group which does not react with metal ions eluted from the ceramic slurry is usually employed.

A lead zirconate titanate powder as a ceramic material, various resin emulsions of Examples 11 to 15 and Comparative Example 3, an organic vehicle, a dispersant, and an antifoaming agent were prepared. The above-mentioned various polyurethane resin emulsions are specifically as follows. That is, in Examples 11 to 15, the average particle size was 100 to 500 n.
m is a nonionic polyurethane resin emulsion comprising 30% by weight of a nonionic polyurethane resin and 70% by weight of a water solvent. Comparative Example 3 is an acrylic resin emulsion composed of 30% by weight of an acrylic resin having an average particle diameter of 100 nm and 70% by weight of an aqueous solvent.

Next, lead zirconate titanate powder 100
Parts by weight, the various resin emulsions of Examples 11 to 15 and Comparative Example 3 having the contents shown in Table 8, 20 parts by weight of an aqueous solvent, 1 part by weight of a dispersant, and 0.5 part by weight of an antifoaming agent After blending, the mixture was mixed and crushed for 24 hours using a ball mill to obtain a ceramic slurry. After defoaming these ceramic slurries, sheets were formed using a doctor blade and dried to produce ceramic formed bodies of Examples 11 to 15 and Comparative Example 3 having a thickness of 0.2 mm. Here, the relative density (%), tensile strength (MPa), and elongation (%) of the ceramic molded body were measured and are shown in Tables 8 to 10, respectively. The ceramic body was fired to obtain a ceramic body. The pore area ratio (%) and the maximum pore diameter (μm) of this ceramic body were measured.
1 and 12 respectively.

The relative density, tensile strength and elongation were determined in the same manner as in Examples 1 to 10 and Comparative Examples 1 and 2. The theoretical density used for calculating the relative density was 8.0 g / cm ^{3 of the} true specific gravity of the powder.

The pore area ratio and the maximum pore diameter are as follows:
Using a real-time image analyzer manufactured by NIRECO, in which the surface of the sintered body subjected to mirror finishing using a precision sample polishing apparatus MA-300 manufactured by Musashino Electronics was connected to a measure scope UM-2 manufactured by Nikon, and a magnification of 50 times was used. Was measured. In the present embodiment, the pore area ratio is
The ratio of the pores in the field of view, and the maximum pore diameter is the diameter of the largest pore in the field of view.

[0087]

[Table 8]

Table 8 shows the relative density of the ceramic compact. As is apparent from Table 8, the content of the organic binder in the ceramic slurry and the relative density of the ceramic molded body are substantially inversely proportional. Further, when Examples 11 to 15 having different average particle diameters of the organic binder are compared with each other, it can be seen that the relative density increases as the organic binder having a smaller average particle diameter is used. Further, when the content of the organic binder is the same, the relative density of the ceramic molded body of Example 11 is higher than the relative density of the ceramic molded body of Comparative Example 3 having the same average particle diameter value. I understand. Therefore, it can be said that when a nonionic polyurethane resin emulsion is used as the organic binder, a higher density ceramic molded body can be obtained than when an acrylic resin emulsion is used.

[0089]

[Table 9]

Table 9 shows the tensile strength of the ceramic compact. As is clear from Table 9, the content of the organic binder in the ceramic slurry and the tensile strength of the ceramic molded body are substantially proportional. Further, when Examples 11 to 15 having different average particle diameters of the organic binder are compared with each other, it can be seen that the tensile strength increases as the organic binder having a smaller average particle diameter is used. When the content of the organic binder was the same, the tensile strength of the ceramic molded body of Example 11 was the same as that of Comparative Example 3 in which the average particle size was the same.
It can be seen that the tensile strength becomes higher as compared with the tensile strength of the ceramic molded body. Therefore, in order to obtain the same tensile strength, it can be said that the content of the organic binder is smaller when the nonionic polyurethane resin emulsion is used as the organic binder than when the acrylic resin emulsion is used.

[0091]

[Table 10]

Table 10 shows the elongation of the ceramic molded body. As is apparent from Table 10, the content of the organic binder in the ceramic slurry and the elongation of the ceramic molded body are substantially proportional. Further, when Examples 11 to 15 having different average particle diameters of the organic binder are compared with each other, it is understood that the elongation increases as the organic binder having a smaller average particle diameter is used. In addition, when the content of the organic binder is the same, the elongation of the ceramic molded body of Example 11 is higher than the elongation of the ceramic molded body of Comparative Example 3 having the same average particle diameter value. . Therefore, in order to obtain the same elongation, it is better to use a nonionic polyurethane resin emulsion as the organic binder,
It can be said that the content of the organic binder can be reduced as compared with the case of using the acrylic resin emulsion.

[0093]

[Table 11]

Table 11 shows the pore area ratio of the ceramic body. As is apparent from Table 11, the content of the organic binder in the ceramic slurry and the pore area ratio of the ceramic body are substantially proportional. Further, when Examples 11 to 15 having different average particle diameters of the organic binder are compared with each other, it can be seen that the pore area ratio becomes smaller as the organic binder having a smaller average particle diameter is used. Further, when the content of the organic binder is the same, the pore area ratio of the ceramic body of Example 11 is the same as that of Comparative Example 3 in which the value of the average particle size is the same.
It can be seen that it is smaller than the pore area ratio of the ceramic body. Therefore, it can be said that the pore area ratio is smaller when the nonionic polyurethane resin emulsion is used as the organic binder than when the acrylic resin emulsion is used.

[0095]

[Table 12]

Table 12 shows the maximum pore diameter of the ceramic body. As is clear from Table 12, the content of the organic binder in the ceramic slurry and the maximum pore diameter of the ceramic body are substantially proportional. Further, when Examples 11 to 15 having different average particle diameters of the organic binder are compared with each other, it can be seen that the maximum pore diameter becomes smaller as the organic binder having a smaller average particle diameter is used. When the content of the organic binder is the same, the maximum pore size of the ceramic body of Example 11 is the same as that of Comparative Example 3 in which the average particle size is the same.
It can be seen that the pore size is smaller than the maximum pore diameter of the ceramic body. Therefore, when a nonionic polyurethane resin emulsion is used as the organic binder,
It can be said that the maximum pore diameter is smaller than when an acrylic resin emulsion is used.

Next, a sample obtained by cutting the ceramic molded bodies of Example 11 and Comparative Example 3 to 80.0 × 60.0 mm was degreased by raising the temperature to 50 to 600 ° C. at the heating rate shown in Table 13. Then, a ceramic degreased body was obtained.
The amount of residual carbon remaining in the ceramic degreased body was measured and is shown in Table 13.

[0098]

[Table 13]

As is clear from Table 13, the content of the organic binder in the ceramic slurry was
If it is 8 parts by weight or less with respect to 00 parts by weight, even if the temperature rise rate is relatively low at 2.29 ° C./min, it is sufficiently degreased, and the residual carbon amount of 0.01% by weight or less Become.
On the other hand, when the content of the organic binder exceeds 8 parts by weight with respect to 100 parts by weight of the ceramic powder, the effect of improving the degreasing property is reduced. Note that there is no significant difference in the degreasing property between Example 11 using the nonionic polyurethane resin emulsion as the organic binder and Comparative Example 3 using the acrylic resin emulsion, and the degreasing property is substantially determined by the content of the organic binder. I understand.

Next, a crosslinking agent was further added to the ceramic slurries of Examples 11 to 15 described above.
Twenty ceramic slurries were prepared. A water-dispersible polyisocyanate was used as a crosslinking agent, and 10% by weight was added to 100% by weight of the solid content of the nonionic polyurethane resin emulsion. These ceramic slurries were subjected to sheet molding in the same manner as in Examples 11 to 15 to produce ceramic molded bodies. Here, relative densities (%), tensile strengths (MPa), and elongations (%) of the ceramic molded bodies of Examples 16 to 20 were measured, and are shown in Tables 14 to 16, respectively. Further, the pore area ratio (%) and the maximum pore diameter (μm) of the ceramic body were measured.
8 are shown. The measurement of the relative density, tensile strength, elongation, pore area ratio, and maximum pore diameter of the sintered body was performed in the same manner as in Examples 11 to 15 and Comparative Example 3. Table 8 shows the relative density (%), tensile strength (MPa), elongation (%), pore area ratio (%), and maximum pore diameter (μm) of the ceramic molded body and the sintered body of Comparative Example 3. Table 14
18

[0101]

[Table 14]

As is clear from Table 14, even when the crosslinking agent is contained, the content of the organic binder in the ceramic slurry and the relative density of the ceramic molded body are substantially inversely proportional. Further, as compared with the relative densities of the ceramic molded bodies of Examples 11 to 15 not containing the crosslinking agent shown in Table 8, the relative densities of the ceramic molded bodies of Examples 16 to 20 containing the crosslinking agent shown in Table 14 Is slightly lower. This is because, when a crosslinking agent is contained, the density is reduced by an amount corresponding to inhibition of drying shrinkage by crosslinking.

[0103]

[Table 15]

As is clear from Table 15, even when the crosslinking agent is contained, the content of the organic binder in the ceramic slurry and the tensile strength of the ceramic molded body are substantially proportional. Further, the tensile strengths of the ceramic molded bodies of Examples 11 to 15 containing no crosslinking agent shown in Table 9 and Table 15
Comparing the tensile strengths of the ceramic molded bodies of Examples 16 to 20 containing the cross-linking agent shown in Table 2, it can be seen that the one containing the cross-linking agent is higher. This is because a crosslinked structure is formed between the functional groups of the polyurethane resin emulsion.

[0105]

[Table 16]

As is clear from Table 16, even when the crosslinking agent is contained, the content of the organic binder in the ceramic slurry and the elongation of the ceramic molded body are substantially proportional. Example 1 containing no crosslinking agent shown in Table 10
Comparing the elongation of the ceramic molded bodies of Nos. 1 to 15 with the elongation of the ceramic molded bodies of Examples 16 to 20 containing the cross-linking agent shown in Table 16, it is understood that the one containing the cross-linking agent is larger. This is because a crosslinked structure is formed between the functional groups of the polyurethane resin emulsion as described above.

[0107]

[Table 17]

Table 17 shows the pore area ratio of the ceramic body. As is clear from Table 17, even when the crosslinking agent is contained, the content of the organic binder in the ceramic slurry and the pore area ratio of the ceramic body are substantially proportional. Further, in comparison with the pore area ratios of the ceramic bodies of Examples 11 to 15 which do not contain the crosslinking agent shown in Table 11, Examples 16 to which contain the crosslinking agent shown in Table 17
It can be seen that the pore area ratio of the 20 ceramic bodies was slightly larger. This is because if a crosslinking agent is included, the distance between the ceramic particles increases due to crosslinking.

[0109]

[Table 18]

Table 18 shows the maximum pore diameter of the ceramic body. As is apparent from Table 18, even when the crosslinking agent is contained, the content of the organic binder in the ceramic slurry and the maximum pore diameter of the ceramic body are substantially proportional. Further, as compared with the maximum pore diameters of the ceramic bodies of Examples 11 to 15 which do not contain the crosslinking agent shown in Table 12, Examples 16 to which contain the crosslinking agent shown in Table 18
It can be seen that the maximum pore diameter of the 20 ceramic bodies was slightly larger. This is because if a crosslinking agent is included, the distance between the ceramic particles increases due to crosslinking. [Examples using each of anionic, nonionic and anionic / nonionic polyurethane resins] Lead titanate zirconate powder as a ceramic material, and various polyurethane resin emulsions of Examples 21 to 26 as an organic vehicle, and dispersion. An agent and an antifoaming agent were prepared. The above-mentioned various polyurethane resin emulsions are specifically as follows. That is, in Examples 21 and 22, the nonionic polyurethane resin 3 having an average particle size of 100 nm was used.
A nonionic polyurethane resin emulsion consisting of 0% by weight and 70% by weight of a water solvent was used. Example 2
In Nos. 3 and 24, the anion having an average particle size of 100 nm /
Nonionic polyurethane resin 30% by weight and water solvent 70
% Of an anionic / nonionic polyurethane resin emulsion. In Examples 25 and 26, an anionic polyurethane resin emulsion composed of 30% by weight of an anionic polyurethane resin having an average particle diameter of 100 nm and 70% by weight of an aqueous solvent was used.

Here, in the present embodiment, “anion /
The “nonionic” polyurethane resin emulsion is one in which both anionic carboxyl groups and nonionic ether groups are imparted to the polyurethane resin and self-emulsified. Not only self-emulsifying but also, for example, a polyurethane resin having a carboxyl group,
Further, a surfactant to which a surfactant is applied and emulsified by force may be used.

Next, lead zirconate titanate powder 100
Parts by weight, 5 parts by weight of the polyurethane resin emulsion of Examples 21 to 26, 20 parts by weight of an aqueous solvent, 1 part by weight of a dispersant, and 0.5 part by weight of an antifoaming agent, and then using a ball mill. After mixing and crushing for 2 hours and 24 hours, ceramic slurries were obtained. After defoaming these ceramic slurries, sheets were formed using a doctor blade and dried to obtain a 0.2 mm-thick Example 21-26.
Were formed respectively.

Next, the ceramic molded bodies of Examples 21 to 26 were cut into 80.0 × 60.0 mm to produce a green ceramic body, which was fired, and the ceramic bodies of Examples 21 to 26 were respectively obtained. Obtained.

Then, for each of the ceramic slurries of Examples 21 to 26, the average particle size of the raw materials and the elution amount of metal ions were measured. The relative density, tensile strength, and elongation of each ceramic molded body were measured. Further, the pore area and the maximum pore diameter of each ceramic body were measured, and Table 1 was obtained.
9 respectively.

Here, the average particle size of the raw material was measured using a laser diffraction / scattering type particle size distribution analyzer manufactured by Horiba, Ltd. In the measurement of the metal ion elution amount, the supernatant of the ceramic slurry separated using a centrifugal separator was collected, and the amount of Pb ions considered to be particularly high in the elution amount was measured using an inductively coupled plasma emission spectrometer. It was measured. Also,
The relative density, tensile strength, elongation, pore area, and maximum pore diameter were measured in the same manner as in Examples 11 to 15 described above.

[0116]

[Table 19]

As is clear from Table 19, the ceramic slurries of Examples 21, 23 and 25 having the same raw material average particle diameter of 800 nm have the same metal elution amount of 200 ppm. Further, the ceramic slurries of Examples 22, 24 and 26 having the same raw material average particle diameter of 500 nm are as follows:
All the metal elution amounts are consistent at 1500 ppm. Further, the ceramic molded bodies of Examples 21 and 22 using the nonionic polyurethane resin as the organic binder have relative densities of 64.3% and 64.5%, respectively. Also,
The ceramic molded bodies of Examples 23 and 24 using an anionic / nonionic polyurethane resin have relative densities of 64.2% and 64.0%, respectively. On the other hand, the ceramic molded bodies of Examples 25 and 26 using an anionic polyurethane resin had relative densities of 64.0% and 44.0%, respectively.
61.0%. Therefore, it can be seen that the ceramic molded bodies of Examples 25 and 26 are slightly lower in relative density than the ceramic molded bodies of Examples 21 to 24.

The tensile strength and elongation are as follows:
Each of the ceramic molded bodies of Examples 21 to 24 was 2.6.
Whereas the ceramic molded bodies of Examples 25 and 26 were 2.8 MPa, 1.8 MPa, 20.0%, and 14.0%, respectively.
It is. Therefore, it is understood that the ceramic molded bodies of Examples 25 and 26 have lower tensile strength and elongation than the ceramic molded bodies of Examples 21 to 24.

Regarding the pore area ratio and the maximum pore diameter of the ceramic body, the ceramic bodies of Examples 21 to 24 were 0.23 to 0.30% and 2.4 to 3%, respectively.
In contrast to 3 μm, the ceramic bodies of Examples 25 and 26 were 0.30%, 0.95%, and 3.2 μm, respectively.
m, 4.4 μm. Therefore, Examples 25 and 26
It can be seen that the ceramic body of Example 2 has a larger pore area ratio and a larger maximum pore diameter than the ceramic bodies of Examples 21 to 24.

It should be noted that in Example 22 using a nonionic polyurethane resin as the organic binder (the metal elution amount was 1500 ppm), Example 21 (the metal elution amount was relatively small) using the same organic binder was used. The relative density, tensile strength, elongation, pore area ratio of the ceramic body,
And the maximum pore diameter is improved. That is, in Example 22, the relative density was 0.2 points, the tensile strength was 0.2 points, the elongation was 0.5 points, the pore area ratio was 0.04 points, and the maximum pore diameter was 0, as compared with Example 21. .4 points higher. When these numerical values are converted into the improvement rates of Example 22 with respect to Example 21, they are 0.3%, 6.3%, 2.3%, and 1%, respectively.
This means that they are improved by 4.8% and 14.3%. This is due to the fact that the average particle diameter of the raw material of Example 22 is smaller than that of Example 21. The relative density, tensile strength,
This indicates that no decrease in elongation, no increase in the pores of the ceramic body, and no increase in the pore diameter have occurred.

On the other hand, Example 24 using an anionic / nonionic polyurethane resin as an organic binder was used.
(The metal elution amount is 1500 ppm), the relative density, the tensile strength, the elongation, and the ceramic of the ceramic molded body are lower than those of Example 23 (the metal elution amount is 200 ppm) using the same organic binder and the metal elution amount is relatively small. Both the pore area ratio of the element body and the maximum pore diameter decrease.
That is, Example 24 has a relative density of 0.2 points, a tensile strength of 0.4 points, an elongation of 1.7 points, a pore area ratio of 0.02 points, and a maximum pore diameter of 0 as compared with Example 23. .2 points lower. When these numerical values are converted into reduction rates of Example 24 with respect to Example 23, they are 0.3%, 13.3%, 7.9%, and 7.1, respectively.
%, 6.5%.

In Example 26 using an anionic polyurethane resin as the organic binder (the metal elution amount was 15%).
00 ppm) is the value of Example 25 (metal leaching amount of 200 pp) having a relatively small metal leaching amount using the same organic binder.
In comparison with m), the relative density, tensile strength, elongation, pore area ratio and maximum pore diameter of the ceramic body are all lower. That is, in Example 26, as compared with Example 25, the relative density was 3.0 points, the tensile strength was 1.0 point, the elongation was 6.0 points, the pore area ratio was 0.65 points, and the maximum pore diameter was 1 point. .
Two points down. When these numerical values are converted into the reduction rate of the example 26 with respect to the example 25, respectively,
7%, 35.7%, 30.0%, 216.7%, 37.
This means that it has decreased by 5%.

As described above, the reduction rate of Example 26 with respect to Example 25 is clearly larger than the reduction rate of Example 24 with respect to Example 23. This indicates that the effect of metal elution is greater than the effect of the average material particle diameter of Example 26 being smaller than that of Example 25.

[0124]

As described above, the ceramic molded article of the present invention is formed using a ceramic slurry containing ceramic powder and an organic vehicle which is an emulsion comprising an organic binder composed of a polyurethane resin and a solvent. By being characterized by having been performed, the organic binder content in the ceramic slurry can be reduced, the amount of excess organic binder agglomerated is small, and the material has excellent tensile strength and elongation. When a ceramic electronic component is manufactured by firing, it is possible to provide a ceramic electronic component which requires only a short time to remove the organic binder by heating, has a small shrinkage due to sintering of the ceramic molded body, and has little deformation and warpage.

Further, the ceramic molded body of the present invention has excellent tensile strength and elongation as compared with the conventional one, and the organic binder content, because the average particle size of the organic binder in the above-mentioned ceramic slurry is 300 nm or less. Can be further reduced.

Further, in the ceramic molded body of the present invention, since the content of the organic binder in the above-mentioned ceramic slurry is 8 parts by weight or less based on 100 parts by weight of the ceramic powder, the organic binder content is smaller than that of the conventional ceramic slurry. But with excellent tensile strength and elongation.

Further, the ceramic molded article of the present invention has more excellent tensile strength and elongation while having a smaller organic binder content than before, because the above-mentioned ceramic slurry further contains a crosslinking agent.

Further, in the ceramic molded body of the present invention, an organic binder made of any of an anionic polyurethane resin, a nonionic polyurethane resin, and an anionic / nonionic polyurethane resin can be used.

Among these, there are many types of anionic polyurethane resins as compared with nonionic or anionic / nonionic polyurethane resins, so that the degree of freedom in selecting a polyurethane resin to be used as a binder is high. Then, an optimal polyurethane resin can be selected in order to obtain desired properties such as elongation and tensile strength of the ceramic molded body to be produced.

When a nonionic polyurethane resin is used, the metal ions eluted from the ceramic powder in the ceramic slurry do not react with the hydrophilic groups.
When an anionic / nonionic polyurethane resin is used, the degree of reaction between the eluted metal ion and the hydrophilic group is low. Therefore, nonionic polyurethane resin,
Alternatively, when an anionic / nonionic polyurethane resin is used, it is not necessary to add an additive for preventing the reaction between the eluted metal ion and the hydrophilic group. Further, it is not necessary to add an organic binder excessively in order to obtain strength. Thereby, it is possible to prevent a decrease in the density of the ceramic molded body. Further, it is possible to prevent an increase in pores and an increase in the diameter of the pores of the ceramic body obtained by firing the ceramic molded body.

[Brief description of the drawings]

FIG. 1 is a schematic view of a ceramic electronic component according to one embodiment of the present invention.

FIG. 2 is a sectional view of a ceramic electronic component according to another embodiment of the present invention.

FIG. 3 is a graph showing the relationship between the content of an organic binder and the relative density of a ceramic molded body in Examples 1 to 5 and Comparative Examples 1 and 2 of the present invention.

FIG. 4 is a graph showing the relationship between the content of an organic binder and the tensile strength of a ceramic molded body in Examples 1 to 5 and Comparative Examples 1 and 2 of the present invention.

FIG. 5 is a graph showing the relationship between the content of an organic binder and the elongation of a ceramic molded body in Examples 1 to 5 and Comparative Examples 1 and 2 of the present invention.

FIG. 6 is a photomicrograph showing the presence of an organic binder in a ceramic molded body according to one embodiment of the present invention using a polyurethane resin emulsion as an organic binder.

FIG. 7 shows the use of a vinyl acetate resin as an organic binder.
It is a microscope photograph which showed the existing state of the organic binder in the conventional ceramic molded object.

FIG. 8 shows Examples 6 to 10 and Comparative Examples 1 and 2 of the present invention.
3 is a graph showing the relationship between the content of an organic binder and the relative density of a ceramic molded body.

FIG. 9 shows Examples 6 to 10 of the present invention and Comparative Examples 1 and 2.
4 is a graph showing the relationship between the content of an organic binder and the tensile strength of a ceramic molded body for the present invention.

FIG. 10 shows Examples 6 to 10 of the present invention and Comparative Examples 1 and 2.
2 is a graph showing the relationship between the content of an organic binder and the elongation of a ceramic molded body for No. 2.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ceramic electronic component 2 Ceramic body 3 Electrode 4 Solder 11 Ceramic electronic component 12 Ceramic body 12a Ceramic layer 14 External electrode

Claims (9)

[Claims] 1. A ceramic formed body formed by using a ceramic slurry containing ceramic powder, an organic vehicle which is an emulsion comprising an organic binder made of a polyurethane resin and a solvent, and a ceramic slurry. 2. The organic binder has an average particle size of 300.
The ceramic molded body according to claim 1, wherein the thickness is equal to or less than nm. 3. The ceramic compact according to claim 1, wherein the content of the organic binder in the ceramic slurry is 8 parts by weight or less based on 100 parts by weight of the ceramic powder. 4. The ceramic molded body according to claim 1, wherein the ceramic slurry further contains a crosslinking agent. 5. The ceramic formed body according to claim 1, wherein the solvent in the ceramic slurry contains water. 6. The organic binder according to claim 5, wherein the organic binder is made of an anionic polyurethane resin, a nonionic polyurethane resin, or an anionic / nonionic polyurethane resin. Ceramic molded body. 7. The ceramic formed body according to claim 1, wherein the ceramic formed body is a ceramic green sheet formed by using the ceramic slurry to form a sheet. 8. A ceramic electronic component comprising: a ceramic body; and an external electrode formed so as to be in contact with the ceramic body, wherein the ceramic body is any one of claims 1 to 7. Characterized by being fired ceramic molded body,
Ceramic electronic components. 9. A ceramic electronic component comprising: a ceramic body in which a plurality of ceramic layers are stacked; and an external electrode formed so as to be in contact with the ceramic body. A ceramic electronic component, wherein the ceramic molded body according to any one of 1 to 7 is fired.