KR20170111497A - Handler for testing electronic components - Google Patents

Abstract

The present invention relates to a handler for testing electronic components.
A handler according to the present invention includes: a connecting device that can grip or release an electronic component and electrically connect the gripped electronic component to a test socket of a tester; A supplying device for supplying electronic components to be tested with the connecting device; A recovery device for recovering the tested electronic component after being connected to the test socket by the connection device; A cleaning table on which a cleaning element for cleaning the test socket is mounted; And a control device for controlling the connection device; Wherein the control device controls the connection device to perform cleaning of the test socket using a cleaning element in the cleaning table when the predetermined condition is satisfied.
According to the present invention, in order to prevent the deterioration of the test socket due to continuous operation, the use of the cleaning device for cleaning the test socket in a state in which the operation of the handler is not stopped, and the movement for repositioning are optimized, There is an effect that can be.

Description

[0001] HANDLER FOR TESTING ELECTRONIC COMPONENTS [0002]

The present invention relates to a handler used for testing electrical characteristics of an electronic component produced. In particular, the present invention relates to a technique for cleaning a test socket of a tester.

Electronic components such as semiconductors and modular RAM are manufactured and then shipped through electrical characteristics tests. At this time, a handler is used to electrically connect the electronic components to be tested to the tester.

The handler can be manufactured in various forms depending on the type of electronic component to be tested. These handlers can be classified into a type having a test tray circulating to move the electronic component and a type having a shuttle table which reciprocates only a predetermined section. Among them, the present invention relates to a method for manufacturing a semiconductor device, which comprises the steps of: And a handler having a shuttle table, such as the handler shown in -0007710 (hereinafter referred to as " Prior Art 2 ").

In general, the test socket of a tester is contaminated by foreign matter such as dust, oil, or particles generated by the operation of the machine, and contamination by foreign matter interferes with the electrical connection between the test socket and the electronic component.

Therefore, it is necessary to replace or clean the test socket contaminated by the foreign substance. At this time, when the test socket is exchanged or cleaned, the operation of the handler and the tester is stopped and the operation rate of the handler is lowered.

The present invention provides a technique in which the handler can be normally operated while the test socket is being cleaned.

A handler for testing electronic components according to the present invention is a handler for testing electronic components which can grip or release grips and electrically connect the gripped electronic components to a test socket of a tester; A feeding device provided for feeding an electronic component to be tested with the connecting device; A recovery device provided to recover the tested electronic component after being connected to the test socket by the connection device; A cleaning table on which a cleaning element for cleaning the test socket is mounted; And a control device for controlling the connection device; Wherein the control device controls the connection device to perform cleaning of the test socket using a cleaning element in the cleaning table when the predetermined condition is satisfied.

A delivery device for delivering electronic components to be tested, which are received from the supply device, to the connection device and forwards the tested electronic component received from the connection device to the collection device; Wherein the connecting device comprises: a grip portion capable of gripping or releasing the electronic component received from the delivery device; A vertical mover that electrically connects or disconnects the electronic component held by the gripping portion by lifting the gripping portion to the test socket; And a horizontal moving unit for horizontally moving the gripping part so that the gripping part receives the electronic part to be tested from the delivery device or sends the tested electronic part to the delivery device. .

The connecting device includes: a gripping portion capable of gripping or releasing the electronic component; A vertical mover that electrically connects or disconnects the electronic component held by the gripping portion by lifting the gripping portion to the test socket; And a horizontal shifter for horizontally moving the gripping portion so that the gripping portion grips the electronic component to be tested supplied by the supply device or sends the tested electronic component to the collection device; .

The connecting device includes: a pressing portion that presses the electronic component to be tested against the test socket; And a vertical mover for electrically connecting or disconnecting the electronic component to be tested by the pressing portion by lifting the pressing portion to the test socket; .

The feeding device includes: a movable shuttle table capable of loading electronic components; A first picking machine for moving electronic components to be tested in the supply tray to the shuttle table; A reciprocating unit for reciprocating the shuttle table; And a second picker for providing the test socket with electronic components to be tested in the shuttle table; .

The cleaning table is provided on one side of a loading position where electronic components to be tested are loaded into the shuttle table from a supply tray.

The cleaning table may be provided on one side of a test position where the electronic component is connected to the test socket by the connecting device.

The control device controls at least one of the connection device and the supply device so that the connection device relocates the cleaning device held by the test socket after cleaning the test socket.

The control device controls the supplying device and the collecting device to perform the moving operation of the electronic part even while the cleaning of the test socket is proceeding.

The predetermined requirement includes a socket-off situation for a certain test socket, and if a socket-off situation occurs for the arbitrary test socket, the control device causes the test socket to be cleaned, Sends an electronic component to an arbitrary test socket, and makes a socket-off decision for the arbitrary test socket when the tested electronic component through the arbitrary test socket is again judged to be defective.

According to the present invention, during the cleaning of the test socket, all the operations for testing the electronic component are smoothly performed in the remaining part, and thus the operating rate of the handler and the tester can be increased ultimately.

1 is a conceptual plan view of a handler for testing electronic components according to a first embodiment of the present invention.
2 is a schematic view of a connection device applied to the handler of FIG.
3 is a schematic view of a cleaning element that may be used in the handler of FIG.
4 is a conceptual plan view of a handler for testing electronic components according to a second embodiment of the present invention.
5 is a schematic view of a connection device applied to the handler of FIG.
6 is a conceptual plan view of a handler for testing electronic components according to a third embodiment of the present invention.
7 is a schematic view of a connection device applied to the handler of FIG.
8 is a conceptual plan view of a handler for testing electronic components according to a modification of the handler of FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other aspects of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which: FIG.

≪ Embodiment 1 >

1 is a conceptual plan view of a handler 100 (hereinafter abbreviated as a 'handler') for testing electronic components according to a first embodiment of the present invention, and has a structure similar to the handler according to Prior Art 1.

1, the handler 100 according to the present embodiment includes a connecting device 110, a supplying device 120, a collecting device 130, a transmitting device 140, a cleaning table 150, and a controller 160 ).

The connecting device 110 can grip or release the electronic component and electrically connect the gripped electronic component to the test socket TS of the tester. To this end, the coupling device 110 has a gripping portion 111, a vertical mover 112 and a horizontal mover 113 as in the schematic diagram of Fig.

The gripping part 111 has eight pickers PK in the form of a 2x4 matrix capable of gripping or releasing the grip of the electronic part.

The vertical movement device 112 electrically connects or disconnects the electronic component held by the gripping portion 111 to the test socket TS by lifting the gripping portion 111. That is, when the vertical movement device 112 moves down the gripping part 111, the electronic parts held by the pickers PK in the gripping part 111 are pressed against the test socket TS, And when the vertical moving member 112 raises the holding portion 111, the electrical connection between the electronic component and the test socket TS is released.

The horizontal shifter 113 horizontally moves the grip portion 112 in the forward and backward directions to receive the electronic component to be tested from the delivery device 140 or to transfer the tested electronic component to the delivery device 140 Move to a position where you can send.

A supply device 120 is provided on the left side and is provided for supplying electronic components to be tested with the connection device 110. [ To this end, the feeder 120 includes a first shuttle table 121, a first picker 122, a first reciprocator 123, and a second picker 124.

The first shuttle table 121 is capable of loading electronic components and is movable in the forward and backward directions.

The first picker 122 moves the electronic components to be tested in the supply tray ST to the first shuttle table 121.

The first reciprocating machine 123 reciprocates the first shuttle table 121 in the forward and backward directions.

The second picker 124 sends the electronic components to be tested in the first shuttle table 121 to the delivery device 140. The second picker 124 also sends the cleaning device 151 on the cleaning table 150 to the delivery device 140.

The recovery device 130 is provided on the right side and is provided to recover the tested electronic components by the operation of the connection device 110. To this end, the recovery device 130 includes a second shuttle table 131, a third picker 132, a second shuttle 133, and a fourth picker 134.

The second shuttle table 131 is capable of loading electronic components and is movable in the forward and backward directions.

The third picker 132 moves the tested electronic components in the second shuttle table 131 to the recovery tray DT.

The second reciprocating machine 133 reciprocates the second shuttle table 131 in the forward and backward directions.

The fourth picker 134 moves the tested electronic component in the delivery device 140 to the second shuttle table 131.

The delivery device 140 has a supply table 141, a collection table 142, and left and right mover 143.

The supply table 141 is loaded with eight electronic components to be tested.

Eight electronic components that have been tested are loaded in the collection table 142.

The left-right mover 143 moves the supply table 141 and the collection table 142 in the left-right direction. Therefore, the supply table 141 and the collection table 142 also function as a shuttle table for moving the electronic components.

The cleaning table 150 is provided to load eight cleaning elements 151. This cleaning table 150 is provided on the left side of the test position TP at which the electronic component is tested so as to minimize the moving distance of the cleaning element 151 to be used for cleaning the test socket TS. Of course, it is also conceivable that the cleaning table 150 is provided on the right side of the test position TP depending on the implementation. If the cleaning table is provided on the right side of the test position TP, the fourth picker 134 will be involved in the movement of the cleaning element 151. It is preferable that the cleaning table 150 is detachably installed in accordance with a change in the standard of the electronic component and the cleaning element 151 to be tested.

Fig. 3 is an example of the cleaning element 151. Fig.

The cleaning element 151 is divided into an upper base portion 151a and a lower adhesive portion 151b.

The base portion 151a is a portion gripped by the grip portion 111 and the adhesive portion 151b is a portion that contacts the test socket TS and adsorbs foreign matter by its adhesiveness.

The control device 160 controls the operation of the connecting device 110, the supplying device 120, and the collecting device 130. In particular, when the predetermined requirement is satisfied, the cleaning device 151 is used to control the connecting device 110 and the supplying device 120 to clean the test socket TS.

Subsequently, the operation of the handler 100 according to the first embodiment will be described.

The first picking machine 122 operates to move the electronic components to be tested from the supply tray ST to the forwardly moving first shuttle table 121. When the first shuttle table 121 moves backward, the second picker 124 moves the electronic components to the supply table 141, which is moved to the left from the first shuttle table 121.

When the electronic parts to be tested are loaded on the supply table 141, the supply table 141 is moved to the right by the left and right mobile device 143 and positioned in front of the test socket TS. The horizontal moving machine 113 is operated to place the gripping portion 111 on the upper side of the feeding table 141 and the vertical moving machine 112 is operated to lower the gripping portion 111, Thereby allowing the electronic components in the electronic device 141 to be gripped. When the gripping portion 111 grips the electronic components, the vertical movement device 112 raises the gripping portion 111 and then the horizontal movement device 113 operates to move the gripping portion 111 above the test socket TS . Then, the vertical movement device 112 operates to lower the grip portion 111 to press the electronic component against the test socket TS, thereby electrically connecting the electronic component and the test socket TS.

When the testing of the electronic components is completed, the vertical movement device 112 and the horizontal movement device 113 are operated to move the tested electronic component to the collection table 142 located in front of the test socket TS. Then, when the recovery table 142 moves to the right side, the fourth picker 134 moves the electronic component from the recovery table 142 to the second shuttle table 131. When the second shuttle table 131 is moved forward, the third picker 132 moves the tested electronic component in the second shuttle table 131 to the tray DT. At this time, the controller 160 controls the third picking machine 132 to classify the electronic components according to the test results.

On the other hand, if the predetermined requirement is satisfied, the control device 160 controls to perform a cleaning operation for the test socket TS. Here, the predetermined requirement may be the start of the test for the first time, the failure of the test socket (TS) in any of the eight test sockets (TS) three times in succession, how many electronic components have been tested . Of course, certain requirements may be set by the administrator in an arbitrary condition.

When the predetermined condition is satisfied, the second picker 124 moves the eight cleaning elements 151 in the cleaning table 150 to the supply table 141. When the cleaning element 151 is moved to the supply table 141, the connection device 110 operates to press the cleaning element 151 against the test socket TS to remove the foreign substance in the test socket TS from the cleaning element 151 to clean the test socket TS. At this time, the process of pressing or releasing the pressure of the cleaning element 151 against the test socket TS may be repeated a plurality of times to complete the cleaning of the test socket TS. When the cleaning is completed, the connecting device 110 moves the cleaning device 151 to the supply table 141. When the supply table 141 moves to the left, the second picker 124 relocates the cleaning element 151 in the supply table 141 to the cleaning table 150. The first picking machine 122 to the fourth picking machine 134 and the like continue to perform their roles in the process of performing the cleaning operation for the test socket TS so as to maintain the operation of the handler 100 have. Of course, depending on the execution of the cleaning operation, the operation of the other apparatus may be stopped.

≪ Embodiment 2 >

4 is a conceptual plan view of the handler 400 according to the second embodiment of the present invention and has a structure similar to the handler according to the prior art.

4, the handler 400 according to the present embodiment includes a connecting device 410, a supplying device 420, a collecting device 430, a cleaning table 450, and a control device 460.

The connecting device 410 can grip or release the electronic component and electrically connect the gripped electronic component to the test socket TS of the tester. To this end, the connecting device 410 has a grip portion 411, a vertical mover 412 and a horizontal mover 413 as in the schematic diagram of Fig.

The grip portion 411 has eight pickers (PK) capable of gripping or releasing the grip of the electronic component.

The vertical mover 412 electrically connects or disconnects the electronic component held by the grip portion 411 to the test socket TS by moving the grip portion 411 up and down.

The horizontal shifter 413 horizontally moves the gripping portion 411 in the left and right directions to receive the electronic parts to be tested from the supply device 420 or to send the tested electronic components to the recovery device 430 Move to a position where you can send.

A supply device 420 is provided on the left side and is provided for supplying electronic components to be tested with the connection device 410. To this end, the feeder 420 includes a first shuttle table 421, a first picker 422, and a first reciprocator 423.

The first shuttle table 421 can load electronic components and is movable in the forward and backward directions.

The first picking machine 422 moves the electronic components to be tested in the supply tray ST to the first shuttle table 421.

The first reciprocating machine 423 reciprocates the first shuttle table 421 in the forward and backward directions.

The recovery device 430 is provided on the right side to recover the tested electronic component by the operation of the connection device 410. To this end, the recovery device 430 includes a second shuttle table 431, a second picker 432, and a second shuttle 433.

The second shuttle table 431 is capable of loading electronic components and is movable in the forward and backward directions.

The second picking machine 432 moves the tested electronic components in the second shuttle table 431 to the recovery tray DT.

The second shuttle 433 reciprocates the second shuttle table 431 in the forward and backward directions.

The cleaning table 450 is provided on the left side of the test position TP to load eight cleaning elements 151. [

The control device 460 controls the operation of the connecting device 410, the supplying device 420, and the collecting device 430. Further, when the predetermined requirement is satisfied, the cleaning device 451 is used to control the connecting device 410 and the supplying device 420 to clean the test socket TS.

Next, the operation of the handler 400 according to the second embodiment will be described.

The first picking machine 422 operates to move the electronic components to be tested from the supply tray ST to the forwardly moving first shuttle table 421. When the first shuttle table 421 moves backward, the horizontal moving unit 413 is operated to place the gripping part 411 on the upper side of the first shuttle table 421, and the vertical moving unit 412 is operated, By lowering the portion 411, the gripping portion 411 makes it possible to grasp the electronic components in the first shuttle table 421. When the gripping part 411 grips the electronic parts, the vertical moving device 412 raises the gripping part 411 and then the horizontal moving device 413 is operated to move the gripping part 411 to the upper side of the test socket TS . Then, the vertical movement device 412 is operated to lower the grip portion 411 to press the electronic component against the test socket TS, thereby electrically connecting the electronic component and the test socket TS.

When testing of the electronic components is completed, the vertical mover 412 and the horizontal mover 413 are operated to move the tested electronic component to the second shuttle table 431 located at the rear. Then, when the second shuttle table 431 moves forward, the second picking machine 432 moves the tested electronic component from the second shuttle table 431 to the rotation tray DT. Similarly, the control device 460 controls the second picking machine 432 to perform the operation of classifying the electronic components according to the test results.

The handler 400 according to the second embodiment controls the controller 460 to perform the cleaning operation for the test socket TS as the predetermined requirements are satisfied.

The horizontal moving device 413 and the vertical moving device 412 are operated so that the gripping part 411 grips the eight cleaning devices 451 from the cleaning table 450 and then the test socket TS The test socket TS is cleaned by sucking the foreign substance in the test socket TS to the cleaning element 451 by pressurization. When the cleaning is completed, the connecting device 410 relocates the cleaning element 451 to the cleaning table 450.

≪ Third Embodiment >

FIG. 6 is a conceptual plan view of the handler 600 according to the third embodiment of the present invention, and has a structure similar to the handler according to the prior art 2. FIG.

6, the handler 600 according to the present invention includes two connection devices 610, a supply and recovery device 620, a cleaning table 650, and a control device 660. [

The two connecting devices 610 electrically connect the electronic component and the test socket TS by pressing the electronic component placed on the test socket TS against the test socket TS. To this end, each connecting device 610 includes a pressing portion 611 and a vertical mover 612 as shown in FIG.

The pressing portion 611 has two pressing elements PE that contact the electronic component.

The vertical mover 612 electrically connects or disconnects the electronic component placed on the upper side of the test socket TS to the test socket TS by moving the pressurizing portion 611 up and down.

The supply and recovery device 620 supplies electronic components to the test socket TS or withdraws electronic components from the test socket TS. To this end, the feed and retrieve device 620 includes two shuttle tables 621, two reciprocators 622, a first picker 623, and two second pickers 624.

The shuttle table 621 is provided so as to be movable in the forward and backward directions, and the electronic parts to be tested or the tested electronic parts can be loaded.

The reciprocating unit 622 reciprocates the shuttle table 621 in its longitudinal direction.

The first picking machine 623 moves the electronic components to be tested in the supply tray ST to the shuttle table 621 and transfers the tested electronic components from the shuttle table 621 to the recovery tray DT .

The second picking machine 624 moves the electronic component to be tested from the shuttle table 621 to the test socket TS side and moves the tested electronic component from the test socket TS side to the shuttle table 621 .

That is, the supply and recovery device 620 may be a supply device or a recovery device depending on the operating state of the shuttle table 621, the reciprocator 622, the first picking device 623 and the second picking device 624 .

The cleaning table 650 is provided on one side of the loading position LP where the electronic component to be tested by the first picking machine 623 is loaded from the feeding tray ST to the shuttle table 621. [ That is, in this embodiment, the cleaning table 650 is provided between the two loading positions LP. Of course, cleaning devices 651 are loaded on the cleaning table 650.

The control device 660 controls the operation of the connecting device 610, the feeding and collecting device 620. Further, when the predetermined requirement is satisfied, the cleaning device 651 is used to control the connecting device 610 and the supplying and collecting device 620 to clean the test socket TS.

Hereinafter, the operation of the handler 600 according to the third embodiment will be described.

When the first picking machine 623 moves the electronic components to be tested in the supply tray ST to the shuttle table 621, the shuttle table 621 moves backward and the second picking machine 624 The electronic component in the shuttle table 621 is moved to the upper side of the test socket TS. Thereafter, the connecting device 610 is operated so that the pressing portion 611 presses the electronic component downward, so that the electronic component and the test socket TS are electrically connected. When the test for the electronic component is completed, the connecting device 610 is operated to raise the pressing portion 611, and the second picking machine 624 moves the tested electronic component to the shuttle table 621. When the shuttle table 621 moves forward, the first picker 623 moves the electronic component to the rotation tray DT.

Similarly, when the predetermined requirement is satisfied, the cleaning element 151 moves through the same path as the above-described electronic component moving path, thereby cleaning the test socket TS. Of course, when the cleaning is finished, the cleaning elements 151 are relocated to the cleaning table 650. Even in this embodiment, even if cleaning is performed on either side of the test socket (TS), the test can normally proceed on the side of the other test socket (TS).

<Modifications>

The handler 800 of FIG. 8 is a modification of the handler 100 according to the first embodiment of the present invention.

8, the handler 800 according to the present modification includes a connection device 810, a supply device 820, a collection device 830, a delivery device 840, a cleaning table 850, and a control device 860 ).

The connecting device 810, the transfer device 840, the cleaning table 850, and the control device 860 are the same as those of the handler 100 in the first embodiment, and a description thereof will be omitted.

A supply device 820 is provided on the left-hand side and is provided for supplying electronic components to be tested with the connection device 810. To this end, the feeder 820 includes a first picker 822 and a hot plate 825.

The first picking machine 822 transfers the electronic components to be tested in the feed tray ST to the feed table 841 of the delivery apparatus 840. [ In the HOT test, the first picking machine 822 moves the electronic components in the feed tray ST to the hot plate 825, and then, from the hot plate 825 to the feed table 841 I will move it. The first picking machine 822 transfers the cleaning elements 851 in the cleaning table 850 to the supply table 841 and the cleaning elements 851 in the subsequent supply table 841 (851) to the cleaning table (850).

The hot plate 825 is fixedly provided and is provided to apply thermal stimulation to the electronic component.

The recovery device 830 is provided on the right side and is provided to recover the tested electronic components by the operation of the connection device 810. To this end, the recovery device 130 includes a third picker 832.

The third picking machine 832 moves the tested electronic components in the recovery table 842 of the delivery device 840 to the recovery tray DT.

Next, the operation of the handler 800 according to the present modification will be described.

The first picking machine 822 operates to move the electronic components to be tested from the feeding tray ST to the feeding table 841 which is moved to the left.

When the electronic parts to be tested are loaded in the supply table 841, the supply table 841 moves to the right and is located in front of the test socket TS. Then, the connecting device 810 operates to electrically connect the electronic part and the test socket TS.

When testing of the electronic components is completed in the future, the connecting device 810 moves the tested electronic component to the collection table 842. When the recovery table 842 moves to the right side, the third picking machine 833 moves the tested electronic component from the recovery table 142 to the recovery tray DT.

On the other hand, when the predetermined requirement is satisfied, the first picking machine 822 moves the eight cleaning elements 851 in the cleaning table 850 to the supply table 841. When the cleaning element 851 is moved to the supply table 841, the connecting device 810 is operated to press the cleaning element 851 against the test socket TS to remove the foreign substance in the test socket TS from the cleaning element 851 to clean the test socket TS. When the cleaning is completed, the connecting device 810 moves the cleaning device 851 to the supply table 841. When the supply table 841 moves to the left, the first picker 822 relocates the cleaning element 151 in the supply table 841 to the cleaning table 850.

<Note>

A socket-off situation for any test socket (TS) has been mentioned above as a requirement for carrying out a cleaning operation on the test socket (TS).

Generally, when any test socket (TS) is socket-off, the handler will not supply electronic components to that arbitrary test socket (TS).

However, in the present invention, when a socket-off situation occurs for a certain test socket (TS), the control device causes the test socket (TS) to be cleaned, and then the electronic device And determines the socket-off for the arbitrary test socket (TS) when the tested electronic component through the arbitrary test socket (TS) is judged to be defective again.

Of course, after the cleaning of the test socket (TS) is made, if the tested electronic component is judged as good by the arbitrary test socket (TS), the control device judges that the test socket - Do not make an off decision.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the scope of the present invention is to be construed as being limited only by the following claims and their equivalents.

100: Handler for testing electronic components
110: connecting device
111: grip part 112: vertical mobile unit
113: Horizontal mover
120: Feeder
121: first shuttle table 122: first picking machine
123: first reciprocating machine 124: second picking machine
130: Recovery device
140: Transmission device
150: Cleaning table
160: Control device

Claims (10)

A connecting device capable of holding or releasing the electronic component and electrically connecting the gripped electronic component to the test socket of the tester;
A feeding device provided for feeding an electronic component to be tested with the connecting device;
A recovery device provided to recover the tested electronic component after being connected to the test socket by the connection device;
A cleaning table on which a cleaning element for cleaning the test socket is mounted; And
A control device for controlling the connecting device; Lt; / RTI &gt;
The control device controls the connection device to perform cleaning of the test socket using the cleaning device in the cleaning table when the predetermined condition is satisfied
Handler for testing electronic components. The method according to claim 1,
A delivery device for delivering electronic components to be tested, which are received from the supply device, to the connection device and forwards the tested electronic component received from the connection device to the collection device; Further comprising:
The connecting device comprises:
A grip portion capable of gripping or releasing an electronic component received from the delivery device;
A vertical mover that electrically connects or disconnects the electronic component held by the gripping portion by lifting the gripping portion to the test socket; And
A horizontal moving unit for horizontally moving the gripping part so that the gripping part receives the electronic part to be tested from the delivery device or sends the tested electronic part to the delivery device; Containing
Handler for testing electronic components. The method according to claim 1,
The connecting device comprises:
A grip portion capable of gripping or releasing the electronic component;
A vertical mover that electrically connects or disconnects the electronic component held by the gripping portion by lifting the gripping portion to the test socket; And
A horizontal shifter for horizontally moving the gripping portion so that the gripping portion grasps an electronic component to be tested supplied by the supply device or sends a tested electronic component to the collection device; Containing
Handler for testing electronic components. The method according to claim 1,
The connecting device comprises:
A pressing portion for pressing the electronic component to be tested against the test socket; And
A vertical mover which electrically connects or disconnects the electronic component to be tested by the pressing portion by lifting the pressing portion; Containing
Handler for testing electronic components. 5. The method of claim 4,
The feeding device includes:
A movable shuttle table capable of loading electronic components;
A first picking machine for moving electronic components to be tested in the supply tray to the shuttle table;
A reciprocating unit for reciprocating the shuttle table; And
A second picker for providing an electronic component to be tested to the test socket in the shuttle table; Containing
Handler for testing electronic components. 6. The method of claim 5,
The cleaning table is provided on one side of a loading position where electronic components to be tested are loaded into the shuttle table from a supply tray
Handler for testing electronic components. The method according to claim 1,
The cleaning table is provided on one side of the test position where the electronic component is connected to the test socket by the connecting device
Handler for testing electronic components. The method according to claim 1,
Wherein the controller controls at least one of the connecting device and the supplying device to relocate the cleaning device held by the connecting device after cleaning the test socket to the cleaning table
Handler for testing electronic components. The method according to claim 1,
The control device controls the supplying device and the collecting device to perform the moving operation of the electronic part even while the cleaning of the test socket is proceeding
Handler for testing electronic components. The method according to claim 1,
The predetermined requirement includes a socket-off situation for any test socket,
If a socket-off situation occurs for any of the test sockets, the controller sends an electronic component to the test socket after clearing the test socket, If the electronic component is judged to be defective again, a socket-off determination is made for the arbitrary test socket
Handler for testing electronic components.

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