KR20170054266A - 화학 기계적 연마 방법 - Google Patents

화학 기계적 연마 방법 Download PDF

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Publication number
KR20170054266A
KR20170054266A KR1020160141438A KR20160141438A KR20170054266A KR 20170054266 A KR20170054266 A KR 20170054266A KR 1020160141438 A KR1020160141438 A KR 1020160141438A KR 20160141438 A KR20160141438 A KR 20160141438A KR 20170054266 A KR20170054266 A KR 20170054266A
Authority
KR
South Korea
Prior art keywords
polishing
amine
curing agent
substrate
isocyanate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020160141438A
Other languages
English (en)
Korean (ko)
Inventor
퀴안 바이니안
구오 이
더블유. 데구르트 마티
씨. 야코브 조지
Original Assignee
다우 글로벌 테크놀로지스 엘엘씨
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 글로벌 테크놀로지스 엘엘씨, 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 다우 글로벌 테크놀로지스 엘엘씨
Publication of KR20170054266A publication Critical patent/KR20170054266A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • H01L21/304—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • H01L21/30625—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020160141438A 2015-10-30 2016-10-27 화학 기계적 연마 방법 Withdrawn KR20170054266A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/927,704 US9484212B1 (en) 2015-10-30 2015-10-30 Chemical mechanical polishing method
US14/927,704 2015-10-30

Publications (1)

Publication Number Publication Date
KR20170054266A true KR20170054266A (ko) 2017-05-17

Family

ID=57189269

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160141438A Withdrawn KR20170054266A (ko) 2015-10-30 2016-10-27 화학 기계적 연마 방법

Country Status (7)

Country Link
US (1) US9484212B1 (cg-RX-API-DMAC7.html)
JP (1) JP6849389B2 (cg-RX-API-DMAC7.html)
KR (1) KR20170054266A (cg-RX-API-DMAC7.html)
CN (1) CN106625031A (cg-RX-API-DMAC7.html)
DE (1) DE102016012533A1 (cg-RX-API-DMAC7.html)
FR (1) FR3043001A1 (cg-RX-API-DMAC7.html)
TW (1) TW201715016A (cg-RX-API-DMAC7.html)

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US20180169827A1 (en) * 2016-12-16 2018-06-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Methods for making chemical mechanical planarization (cmp) polishing pads having integral windows
CN106891246B (zh) * 2017-03-30 2019-05-07 湖北鼎龙控股股份有限公司 一种用于半导体、光学材料和磁性材料表面平坦化的化学机械抛光垫
JP2019050307A (ja) 2017-09-11 2019-03-28 株式会社フジミインコーポレーテッド 研磨方法、ならびに研磨用組成物およびその製造方法
US10464187B2 (en) 2017-12-01 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
US10569384B1 (en) 2018-11-06 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and polishing method
US10464188B1 (en) * 2018-11-06 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and polishing method
EP3947580A4 (en) * 2019-03-25 2022-12-14 CMC Materials, Inc. ADDITIVES TO IMPROVE PARTICLE DISPERSION FOR CMP SLURRY
US11772230B2 (en) 2021-01-21 2023-10-03 Rohm And Haas Electronic Materials Cmp Holdings Inc. Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith
KR102561824B1 (ko) 2021-06-02 2023-07-31 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
CN120206314B (zh) * 2025-05-09 2025-09-05 河北同光半导体股份有限公司 一种大尺寸碳化硅衬底的化学机械抛光方法

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Also Published As

Publication number Publication date
JP6849389B2 (ja) 2021-03-24
JP2017139443A (ja) 2017-08-10
FR3043001A1 (fr) 2017-05-05
CN106625031A (zh) 2017-05-10
US9484212B1 (en) 2016-11-01
DE102016012533A1 (de) 2017-05-04
TW201715016A (zh) 2017-05-01

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WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
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