KR20170053314A

KR20170053314A - Method and apparatus for processing laminating guide hole by using laser drill

Info

Publication number: KR20170053314A
Application number: KR1020150155648A
Authority: KR
Inventors: 배종원; 배상구
Original assignee: 배상구
Priority date: 2015-11-06
Filing date: 2015-11-06
Publication date: 2017-05-16

Abstract

A method and an apparatus for processing a lamination guide hole using a laser drill are disclosed. A method of laminating guide holes using a laser drill includes a step of determining a target point of a laminating guide hole based on a light and dark camera and a laminating guide hole processing step of laminating on a target point of a laminating guide hole based on a laser drill And forming a guide hole.

Description

Technical Field [0001] The present invention relates to a method and apparatus for laminating a guide hole using a laser drill,

The present invention relates to a method and an apparatus for processing a laminated guide hole, and more particularly, to a method and an apparatus for processing a laminated guide hole using a laser drill.

2. Description of the Related Art [0002] With progressive advancement in IC (Integrated Circuit) technology and improvement of their operation speed and integration scale, high performance of a microprocessor and large capacity of a memory chip are realizing at a very high speed. Accordingly, in the next generation information communication system composed of a large-capacity parallel computer or an asynchronous transfer-mode (ATM) switching system of terabits (Tb / s) or higher that transfers a large amount of information at a high speed, It is required to increase the speed of signal transmission and the wiring density.

However, since the information transfer between the board and the board or between the chip and the chip is mainly performed by the electrical signal, there is a limitation in speeding up the signal and increasing the densification of the wiring, and the signal delay due to the self- . In addition, high-speed signal transmission and high-density wiring work as a cause of noise due to electromagnetic interference (EMI), and countermeasures are also needed.

KR 10-2000-0050466

One aspect of the present invention provides a method of processing a laminated guide hole using a laser drill.

Another aspect of the present invention provides an apparatus for processing a laminated guide hole using a laser drill.

According to an aspect of the present invention, there is provided a method of processing a laminated guide hole using a laser drill, the method comprising: determining a target point of a laminated guide hole based on a light and dark camera; And forming a lamination guide hole on a target point of the lamination guide hole.

Meanwhile, the laminated guide hole processing method may further include transmitting the drilling offset information for correcting the drilling position with the laser drill, wherein the laser drill is based on the drilling offset information The drilling position can be corrected.

The laser drill receives reference position information for generating a reference guide hole to form a reference lamination guide hole. The laser drill is configured to form a reference lamination guide hole, wherein the position of the reference point information and the position To determine the drilling offset.

The method further includes the step of instructing the laminating guide hole processing apparatus to irradiate a low energy pre-irradiation laser onto the substrate with the laser drill to determine the position of the anticipated lamination guide hole to be drilled, The method may further include comparing the position of the anticipated lamination guide hole with the position of the set lamination guide hole to determine the drilling offset.

Further, in the lamination guide hole processing method, the lamination guide hole processing apparatus includes a step of generating a lamination guide hole pattern reference image including a plurality of ideal reference lamination guide holes, and the lamination guide hole processing apparatus includes a plurality Forming a plurality of stacked guide hole patterns by comparing the stacked guide hole pattern reference images with the stacked guide hole pattern images to form a plurality of stacked guide hole patterns, At least one tolerance generating hole formed and at least one unoriented unoccupied hole in which a tolerance has not occurred, and the lamination guide hole processing apparatus calculating a tolerance for each of the at least one tolerance generating hole, The drill It may comprise the step of determining the offset.

According to another aspect of the present invention, there is provided an apparatus for processing a laminated guide hole using a laser drill, the apparatus comprising: a light and dark camera for determining a target point of a laminated guide hole; a laser drill for forming a laminated guide hole on a target point of the laminated guide hole; And a processor for controlling the drill.

Meanwhile, the processor may be configured to transmit drilling offset information for correcting the drilling position with the laser drill, and the laser drill may correct the drilling position based on the drilling offset information.

In addition, the laser drill may be configured to receive reference position information for generating a reference guide hole to form a reference lamination guide hole, wherein the processor is configured to determine a position indicated by the reference position information and a formation position of the reference lamination guide hole, To determine the drilling offset.

The processor also instructs the laser drill to irradiate a low energy pre-irradiation laser onto the substrate to determine the position of the anticipated stacked guide hole, and the position of the stacked guide hole To determine the drilling offset.

Also, the processor may generate a laminated guide hole pattern reference image including a plurality of ideal reference laminated guide holes, generate a laminated guide hole pattern image including a plurality of laminated guide holes formed by the laser drill, The guide hole pattern reference image is compared with the lamination guide hole pattern image to divide the plurality of lamination guide holes into at least one tolerance generation hole in which the tolerance has occurred and at least one unrecognized-tolerance hole in which no tolerance has occurred, To determine the drilling offset for each of the at least one tolerance generating hole by calculating a tolerance for each of the tolerance generating holes of the at least one tolerance generating hole.

The method and apparatus for laminating guide holes using the laser drill according to the embodiment of the present invention generate lamination guide holes through a laser drill so that vibration is not generated and accordingly the tolerance range of the lamination guide holes can be reduced. In addition, a lamination guide hole can be generated at a high speed in terms of speed. Therefore, when a laminated guide hole process is performed using a laser drill, the pitch, which is the distance between the hole and the hole, is reduced, and the air gap, which is the distance between the circuit and the circuit, is also reduced, and a more direct circuit can be generated.

FIG. 1 is a conceptual view showing a method of processing a laminated guide hole using a laser drill according to an embodiment of the present invention.
2 is an image showing a pitch and an air gap according to an embodiment of the present invention.
FIG. 3 is a conceptual diagram showing a device for processing a laminated guide hole using a laser drill according to an embodiment of the present invention.
4 is a conceptual diagram showing a method of generating a laminated guide hole according to an embodiment of the present invention.
5 is a conceptual diagram showing a method of generating a laminated guide hole according to an embodiment of the present invention.
6 is a conceptual diagram illustrating a method of generating a laminated guide hole according to an embodiment of the present invention.

The following detailed description of the invention refers to the accompanying drawings, which illustrate, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain features, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in connection with an embodiment. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is to be limited only by the appended claims, along with the full scope of equivalents to which such claims are entitled, if properly explained. In the drawings, like reference numerals refer to the same or similar functions throughout the several views.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the drawings.

Conventionally, a method of drilling a laminated guide hole by a computerized numerical control (CNC) machine by reading a target point with an X-ray was used. However, due to the tolerances of the X-ray and the tolerances of the CNC machine, a deviation of up to x um (micro meter) may be generated in the lamination guide hole.

When such a deviation occurs, a phenomenon in which each layer is distorted by an increment of x um may occur during lamination. In addition, when such a deviation occurs, the tolerance between the hole and the hole (pitch) and between the circuit and the circuit (air gap) increases in the PCB (printed circuit board) design. HI Speed B / D, , Etc., are obstacles to highly specialized PCB design. HI Speed B / D is a PCB designed to send and receive signals at a high speed to test very-large-scale integration (VLSI) / D (Automatic Test Equipment) is a PCB in an automated test equipment that evaluates the performance of automated test and test electronics. It can be a 100% clear, high precision PCB for testing other equipment and components.

Hereinafter, a method of drilling a laminated guide hole using a laser drill to solve the problem of the conventional CNC machine drilling method of a laminated guide hole is disclosed.

FIG. 1 is a conceptual view showing a method of processing a laminated guide hole using a laser drill according to an embodiment of the present invention.

In FIG. 1, a method for producing a laminated guide hole using a laser drill with a very small tolerance value than a CNC machine is disclosed.

Laser drills can have a maximum tolerance value less than x um than CNC machines. Therefore, the registration value that is changed for each layer at the time of lamination can be extremely small. Based on this, it is possible to realize an extremely close pitch and air gap on the PCB. In other words, by using the micro-tolerance of the laser drill, it is possible to design a smaller pitch and an air gap since the registration value that is changed for each layer in the lamination is extremely small.

First, the target point of the lamination guide hole is determined based on the contrast camera (step S100).

The laminated guide hole processing apparatus may include a contrast camera and a laser drill. A laminated guide hole to be drilled based on the contrast camera can be determined.

The pins that are fixed through the lamination guide holes on the PCB can be piled up. Therefore, if the spacing between the layered guide holes is not correct, bending is generated for each layer and the matching between the layer and the layer may be distorted.

Each layer may have different expansion and contraction ratios depending on the area of the copper foil distributed per layer area, temperature difference, and thickness. therefore. Since the probability of matching with some layers is high, it is possible to form a laminated guide hole by using a laser drill one by one after positioning by an X-ray.

Based on the laser drill, a target point of the lamination guide hole is drilled to produce a lamination guide hole (step S110).

When a laminated guide hole is created based on a laser drill, a circuit can be formed in a smaller area by reducing the distance (pitch) between holes and holes and further reducing the gap (air gap) between the circuit and the circuit. The flowing electrical signal is advantageous in terms of speed compared to the electric signal flowing in a large space, and a product having a complex function can be created by adding a circuit having a different function to the space.

Because PCB is the basic foundation for assembling electronic components (IC (integrated circuit), CPU (central processing unit), etc.), it is necessary to process more precise laminar guide holes and raise the precision . Therefore, a laser drill having a small tolerance can be used for generation of the lamination guide hole.

Existing machining drills have tolerances due to drill bit condition, drill bit position, thickness difference of each layer, and vibration due to drilling. However, since laser drill is a method of processing with light and heat, there are no machining bits, no vibration, and an extremely small tolerance range. Also, in terms of speed, it is less than half the time to process the laminated guide holes on the PCB based on the laser drill than the time to process the laminated guide holes on the PCB in the CNC machine, so that it can have high working efficiency.

2 is an image showing a pitch and an air gap according to an embodiment of the present invention.

Referring to Fig. 2, when a lamination guide hole process is performed using a laser drill, the pitch that is the distance between the hole and the hole is reduced, and the air gap, which is the distance between the circuit and the circuit, can also be reduced.

As described above, a circuit can be formed in a smaller area by reducing the space (pitch) between the holes and the holes and further reducing the space (air gap) between the circuit and the circuit. It is advantageous in terms of speed, and a product having a complex function can be created by adding a circuit having other functions in the space.

FIG. 3 is a conceptual diagram showing a device for processing a laminated guide hole using a laser drill according to an embodiment of the present invention.

FIG. 3 shows a multilayer guide hole processing apparatus using a laser drill to produce a laminated guide hole by using a laser drill whose tolerance value is extremely smaller than that of a CNC machine.

The laminating guide hole processing apparatus may include a contrast camera 300, a laser drill 320, and a processor 340.

The contrast camera 300 can be implemented to determine the target point of the lamination guide hole to form the red guide hole.

As described above, the laser drill 320 can process the lamination guide holes with light and heat. Therefore, there are no machining bits, no vibration, and a tolerance range is extremely small. Also, in terms of speed, the time required for the laser drill 320 to process the laminating guide hole on the PCB is less than half the time for the CNC machine to process the laminating guide hole on the PCB, thereby achieving high working efficiency.

The processor 340 may be implemented to control the operation of the contrast camera 300 and the laser drill 320.

4 is a conceptual diagram showing a method of generating a laminated guide hole according to an embodiment of the present invention.

4 illustrates a method of confirming whether or not a laminated hole is matched based on a reference laminated guide hole and generating a laminated guide hole on the PCB.

4, in order to calculate the offset between the target point of the layered guide hole targeted based on the contrast camera and the actual position of the laser drill's laminated guide hole before the reference layered guide hole 400 is formed, (400) may be used.

For example, one coordinate on the PCB can be determined as a point of creation of the reference lamination guide hole 400. For example, a point 5 mm to the right and 5 mm to the upper side may be determined as a generation point of the reference lamination guide hole 400 based on the leftmost bottom edge in the PCB base.

It is possible to drill the reference laminated guide hole 400 using a laser drill before the actual laminated guide hole is formed. Information about the position of the reference lamination guide hole 400 is inputted by the laser drill and the laser drill can perform drilling at the position of the input reference lamination guide hole 400. [

The apparatus for producing a laminated guide hole can determine the drilling offset of the actual laser drill by comparing the position of the reference lamination guide hole 400 and the position where the actual laser drill is drilled. The drilling offset can be determined to be (0.03 mm, 0.05 mm) when the position of the reference lamination guide hole 400 is 5 mm and 5 mm, and the position where the laser drill is actually drilled (5.03 mm, 5.05 mm) have. Information on the drilled position of the actual laser drill can be obtained by performing image analysis based on image information on the reference lamination guide hole 400 formed on the PCB.

Thereafter, the laminated guide hole generating apparatus can generate an actual laminated guide hole by considering information on the drilling offset. That is, information on the position of the laminated guide hole input by the laser drill may be information adjusted in consideration of the size of the drilling offset.

The drilling offset adjustment procedure as described above can be performed periodically. For example, depending on the user's setting, the drilling offset can be adjusted each time n stacked guide holes are drilled.

5 is a conceptual diagram showing a method of generating a laminated guide hole according to an embodiment of the present invention.

In Fig. 5, a method of producing a laminated guide hole using a laser drill is disclosed.

Referring to FIG. 5, the laser drill irradiates a laser (hereinafter, referred to as a pre-irradiation laser) having a low energy enough for drilling operation to perform the actual drilling, It can be judged. It is determined whether or not the position 550 of the set guide hole and the position 500 indicated by the pre-irradiation laser are matched. Only when the position of the set guide hole is matched with the position indicated by the pre- As shown in FIG.

Whether the position 550 of the set guide hole is matched with the position 500 indicated by the pre-irradiation laser can be judged in various ways. For example, an image of the position where the laser is irradiated is acquired through the image pickup unit implemented in the apparatus for producing a laminated guide hole, and the position of the lamination guide hole set through the image analysis of the image with respect to the position where the laser is irradiated, It can be determined whether or not the position indicated by the laser is matched.

If the position of the set stacking guide hole is not matched with the position indicated by the preliminary irradiation laser, the drilling offset is determined, the position of the laser part is reflected to reflect the drilling offset, or the position of the adjusted stacking guide hole Can be input to the laser device.

When the position 550 of the set guide hole is matched with the position 500 indicated by the pre-irradiation laser, the lamination guide hole generating device can transmit a lamination guide hole generating command to the laser section and the laser section generates a lamination guide hole It is possible to generate a laminated guide hole.

6 is a conceptual diagram illustrating a method of generating a laminated guide hole according to an embodiment of the present invention.

In Figure 6, a method for determining a drilling offset based on a hole pattern is disclosed.

Referring to FIG. 6, a drilling offset can be determined based on the hole pattern information formed on the PCB.

For example, a plurality of laminated guide holes on a PCB can form one laminated guide hole pattern.

In this case, an ideal laminated guide hole pattern reference image for the laminated guide hole pattern can be generated. The laminated guide hole pattern reference image 600 may include information on the positions of the plurality of laminated guide holes, assuming that no tolerance by drilling has occurred.

According to an embodiment of the present invention, such a laminated guide hole pattern reference image 600 and an image 650 for a laminated guide hole pattern formed on an actual PCB by an actual laser drill can be compared to determine a drilling offset.

Each of the plurality of lamination guide holes included in the lamination guide hole pattern reference image 600 may be expressed by the term reference lamination guide hole. Each of the plurality of lamination guide holes included in the image 600 for the lamination guide hole pattern formed by drilling by the actual laser drill can be expressed by the term drilled lamination guide hole.

The position of each of the plurality of reference laminated guide holes included in the laminated guide hole pattern reference image 600 and the position of each of the plurality of drilled laminated guide holes included in the image 650 for the laminated guide hole pattern formed by actual drilling are compared (The hole 620) in which the tolerance is generated and the hole in which the tolerance does not occur (the hole 620 without the tolerance).

That is, when a plurality of laminated guide holes are formed while the laser is moved, a part of the plurality of laminated guide holes may be the tolerance generation hole 640, and a part of the plurality of the lamination guide holes may be the non-generation hole 620. In this case, the tolerance for the tolerance generating hole 640 can be determined, and the drilling offset can be adjusted for the individual tolerance, with the exception of the non-tolerance hole 620. That is, by eliminating the tolerance that may be caused by the movement of the laser part, the tolerance of each of the plurality of lamination guide holes included in the PCB can be released.

Such drilling offset adjustment can be initially performed on a plurality of PCBs, and tolerance generation holes among a plurality of lamination guide holes can be removed through a plurality of drilling offset adjustments.

The above-mentioned drilling offset adjustment information is databaseed considering the movement pattern of the laser drill, and can be used for generation of the lamination guide hole thereafter. The tolerances generated due to the movement of the laser drill can be different from each other and the size of the tolerance generated due to the movement of the laser drill can be statistically stored in a database to be used for forming a later laminated guide hole in the laminated guide hole processing apparatus.

For example, the size of the tolerance generated when the laser drill moves up and down to form the laminated guide hole, and the size of the tolerance generated when the laser drill moves left and right to form the laminated guide hole may be different from each other. When the laser drill moves to form the stacking guide hole, the drilling position of the laser drill can be corrected in consideration of the expected size of the tolerance. have. By using this method, it is possible to form the lamination guide holes more precisely by setting the individual offsets that each of the machines can have.

In addition, a movement pattern of the laser drill in which the tolerance is minimized may be determined by databaseing the expected occurrence size of the tolerance due to the movement of the laser drill.

The operation of the lamination guide hole processing apparatus described above with reference to Figs. 4 to 6 can be controlled by the processor of the lamination guide hole processing apparatus.

Such a laminated guide hole process using a laser drill can be implemented in an application or implemented in the form of program instructions that can be executed through various computer components and recorded in a computer-readable recording medium. The computer-readable recording medium may include program commands, data files, data structures, and the like, alone or in combination.

The program instructions recorded on the computer-readable recording medium may be ones that are specially designed and configured for the present invention and are known and available to those skilled in the art of computer software.

Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks and magnetic tape, optical recording media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, media, and hardware devices specifically configured to store and execute program instructions such as ROM, RAM, flash memory, and the like.

Examples of program instructions include machine language code such as those generated by a compiler, as well as high-level language code that can be executed by a computer using an interpreter or the like. The hardware device may be configured to operate as one or more software modules for performing the processing according to the present invention, and vice versa.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined in the appended claims. It will be possible.

Claims

In a method of laminating a guide hole using a laser drill,
Determining a target point of the lamination guide hole based on the contrast camera; And
And forming a lamination guide hole on a target point of the lamination guide hole based on a laser drill, wherein the lamination guide hole processing apparatus comprises a laser drill.

The method according to claim 1,
Further comprising the step of transferring drilling offset information for correcting the drilling position by the laser drill,
Wherein the laser drill corrects the drilling position based on the drilling offset information.

3. The method of claim 2,
The laser drill receives reference position information for generating a reference guide hole to form a reference layered guide hole,
Wherein the laminating guide hole processing apparatus determines the drilling offset based on a position indicated by the reference position information and a position at which the reference lamination guide hole is formed.

3. The method of claim 2,
Directing the laser drill to irradiate a low energy pre-irradiation laser onto the substrate to determine the position of the anticipated stacked guide hole where the stacked guide hole processing apparatus is expected to be drilled; And
Further comprising the step of comparing the position of the stacked guide hole with the position of the stacked guide hole to determine the drilling offset.

3. The method of claim 2,
Wherein the lamination guide hole processing apparatus includes: a step of generating a lamination guide hole pattern reference image including an ideal plurality of reference lamination guide holes;
Generating a laminated guide hole pattern image including a plurality of laminated guide holes formed by the laser drill;
Wherein the lamination guide hole processing apparatus compares the lamination guide hole pattern reference image with the lamination guide hole pattern image to form at least one tolerance hole in which the plurality of lamination guide holes are formed and at least one tolerance Dividing into non-generated holes; And
And wherein said step of laminating guide hole processing calculates a tolerance for each of said at least one tolerance generating hole to determine said drilling offset for each of said at least one tolerance generating hole. Guide hole processing method.

In the laminating guide hole processing apparatus using a laser drill, in the laminating guide hole processing apparatus,
A contrast camera for determining a target point of the lamination guide hole;
A laser drill for forming a lamination guide hole on a target point of the lamination guide hole; And
And a processor for controlling the contrast camera and the laser drill.

The method according to claim 6,
Wherein the processor is configured to transmit drilling offset information for correcting the drilling position with the laser drill,
Wherein the laser drill corrects the drilling position based on the drilling offset information.

8. The method of claim 7,
The laser drill is configured to receive reference position information for generating a reference guide hole to form a reference lamination guide hole,
Wherein the processor determines the drilling offset based on the position indicated by the reference position information and the position of the reference lamination guide hole.

8. The method of claim 7,
The processor instructs the laser drill to irradiate a low energy pre-irradiation laser onto the substrate to determine the position of the anticipated stacked guide hole where the processor is expected to drill, comparing the position of the anticipated stacked guide hole with the position of the set stacked guide hole To determine the drilling offset. &Lt; Desc / Clms Page number 19 >

8. The method of claim 7,
The processor generates a laminated guide hole pattern reference image including an ideal plurality of reference lamination guide holes,
Generating a laminated guide hole pattern image including a plurality of laminated guide holes formed by the laser drill,
Comparing the laminated guide hole pattern reference image with the laminated guide hole pattern image to divide the plurality of laminated guide holes into at least one tolerance generation hole in which the tolerance has occurred and at least one unoriented unoccupied hole in which no tolerance has occurred,
And to calculate a tolerance for each of the at least one tolerance generating hole to determine the drilling offset for each of the at least one tolerance generating hole.