CN117047322A - Direct cross-layer laser drilling process utilizing UV laser - Google Patents
Direct cross-layer laser drilling process utilizing UV laser Download PDFInfo
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- CN117047322A CN117047322A CN202311147990.7A CN202311147990A CN117047322A CN 117047322 A CN117047322 A CN 117047322A CN 202311147990 A CN202311147990 A CN 202311147990A CN 117047322 A CN117047322 A CN 117047322A
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- 238000005553 drilling Methods 0.000 title claims abstract description 101
- 238000000034 method Methods 0.000 title claims abstract description 34
- 230000008569 process Effects 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 40
- 238000012544 monitoring process Methods 0.000 claims abstract description 16
- 238000012805 post-processing Methods 0.000 claims abstract description 4
- 238000012806 monitoring device Methods 0.000 claims description 8
- 230000009471 action Effects 0.000 claims description 3
- 230000003044 adaptive effect Effects 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000000399 optical microscopy Methods 0.000 claims description 3
- 238000004626 scanning electron microscopy Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000013528 artificial neural network Methods 0.000 description 1
- 238000011217 control strategy Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002068 genetic effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a direct cross-layer laser drilling process utilizing UV laser, which comprises the following steps: s1, preparing: selecting a material to be drilled and a UV laser; s2, setting parameters: setting power, frequency and pulse width parameters of the UV laser; s3, positioning and calibrating: aligning the drilling position using a microscope; s4, starting drilling: starting a UV laser to drill holes; s5, controlling and monitoring: monitoring parameters such as the depth, diameter, quality and the like of the drilling hole in real time by using a control system and monitoring equipment; s6, post-processing: and (5) carrying out post-treatment on the drilling holes according to the requirement. The invention utilizes the high energy and high focusing property of UV laser, can realize high-precision drilling of various materials, can greatly shorten the processing period, reduce the cost and the alignment deviation, can drill holes efficiently and accurately, and is suitable for drilling various materials.
Description
Technical Field
The invention belongs to the technical field of laser drilling, and particularly relates to a direct cross-layer laser drilling process utilizing UV laser.
Background
The circuit board can be called a printed circuit board or a printed circuit board, the English name is PCB and FPC circuit board, the FPC circuit board is also called a flexible circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility. The wiring density is high, the weight is light, the thickness is thin, the flexibility is good.
The punching of the circuit board is an important item in the circuit board processing, in order to satisfy the characteristics of high density and light weight of electronic products, the integration level of the printed circuit board can be effectively improved by using any layer interconnection technology, but any interconnection technology has the defects of difficult alignment, long flow period, high processing cost and the like in the traditional drilling technology processing, in addition, the traditional drilling technology generally needs to guide a drill bit through preparing a hole bottom guide hole in advance and then drilling, and the method has some problems such as inaccurate position, inconsistent aperture and the like of the guide hole, and the traditional drilling technology often cannot meet the requirements for hard materials and thin film materials due to high hardness or thinness.
Disclosure of Invention
The invention aims to provide a direct cross-layer laser drilling process by utilizing UV laser, which can realize high-precision drilling of various materials by utilizing the high energy and high focusing property of the UV laser, can greatly shorten the processing period, reduce the cost and the alignment deviation, can drill holes efficiently and accurately, is suitable for drilling various materials, and solves the problems in the prior art.
In order to achieve the above purpose, the invention adopts the following technical scheme:
a direct cross-layer laser drilling process using UV laser, comprising the steps of: s1, preparing: selecting a material to be drilled and a UV laser, and carrying out proper pretreatment on the surface to be drilled according to the characteristics of the material;
s2, setting parameters: setting power, frequency and pulse width parameters of the UV laser according to the characteristics of the material and the required drilling size;
s3, positioning and calibrating: placing the material on a drilling platform and aligning the drilling position using a microscope;
s4, starting drilling: starting a UV laser, directly irradiating a laser beam on a target position on the surface of the material, drilling, and rapidly melting and evaporating the material by high-density energy of the laser to form a hole;
s5, controlling and monitoring: in the laser drilling process, a control system and monitoring equipment are used for monitoring the depth, diameter and quality parameters of the drilling in real time so as to ensure the quality and stability of the drilling;
s6, post-processing: and (5) carrying out post-treatment on the drilling holes according to the requirement.
Preferably, in S1 to S5, the UV laser is one of a solid-state laser and a semiconductor laser.
Preferably, in the step S5, the control system controls the operation of the process by controlling the output power, pulse width and frequency of the UV laser and adjusting the focal length and position of the beam delivery system. Preferably, in the step S5, the control system specifically includes a laser power controller, configured to adjust and control the output power of the UV laser, so as to ensure that the energy and intensity of the laser meet the drilling requirements; a laser pulse frequency controller for adjusting and controlling the pulse frequency of the UV laser to control the action time and frequency of the laser beam; and the laser focusing controller is used for adjusting and controlling the focusing degree of the laser beam so as to ensure that the laser beam can be accurately focused on the drilling position and realize high-precision drilling.
Preferably, in the step S5, the monitoring device includes a drilling depth monitoring device, and the drilling depth is monitored in real time by a laser range finder to ensure that the drilling reaches the required depth; the drilling diameter monitoring device monitors the diameter of the drilling in real time through an optical sensor so as to ensure that the drilling achieves the required dimensional accuracy; and optical microscopy and scanning electron microscopy equipment detect the surface quality of the borehole to ensure the smoothness and quality of the borehole.
Preferably, in the step S5, the control system further includes automatic control and real-time monitoring of the laser drilling process through written control software and using a corresponding algorithm, so as to improve stability and consistency of drilling, where the algorithm includes a PID control algorithm, an adaptive control algorithm and a fuzzy control algorithm. The invention has the technical effects and advantages that: compared with the prior art, the direct cross-layer laser drilling process utilizing the UV laser has the following advantages:
the invention utilizes the high energy and high focusing property of UV laser, can realize high-precision drilling of various materials, can greatly shorten the processing period, reduce the cost and the alignment deviation, can drill holes efficiently and accurately, is suitable for drilling various materials, is particularly suitable for drilling hard materials and film materials, and can be widely applied in the fields of manufacturing industry, electronic industry and the like.
Drawings
FIG. 1 is a flow chart of the present invention;
fig. 2 is a graph comparing the effects of the conventional process and the present process.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. The specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. The invention provides a direct cross-layer laser drilling process using UV laser as shown in FIGS. 1-2, comprising the following steps:
s1, preparing: selecting a material to be drilled and a UV laser, and carrying out proper pretreatment, such as cleaning, coating or heating, on the surface to be drilled according to the characteristics of the material;
s2, setting parameters: setting parameters such as power, frequency, pulse width and the like of the UV laser according to the characteristics of the materials and the required drilling size;
s3, positioning and calibrating: placing the material on a drilling platform and aligning the drilling position using a microscope or other auxiliary tool;
s4, starting drilling: starting a UV laser, directly irradiating a laser beam on a target position on the surface of the material, and drilling, wherein the high energy density of the laser can rapidly melt and evaporate the material to form holes;
s5, controlling and monitoring: in the laser drilling process, proper control systems and monitoring equipment are used for monitoring parameters such as the depth, the diameter, the quality and the like of the drilling in real time so as to ensure the quality and the stability of the drilling; s6, post-processing: the borehole is subjected to post-treatment, such as cleaning, coating or machining, as required. In S1-S5, the UV laser is one of a solid-state laser or a semiconductor laser. In S5, the control system controls the operation of the process by controlling the output power, pulse width and frequency of the UV laser, and adjusting the focal length and position of the beam delivery system.
S5, the control system specifically comprises a laser power controller for adjusting and controlling the output power of the UV laser so as to ensure that the energy and the intensity of the laser meet the drilling requirements; a laser pulse frequency controller for adjusting and controlling the pulse frequency of the UV laser to control the action time and frequency of the laser beam; and the laser focusing controller is used for adjusting and controlling the focusing degree of the laser beam so as to ensure that the laser beam can be accurately focused on the drilling position and realize high-precision drilling.
In S5, the monitoring equipment comprises a drilling depth monitoring device, and the drilling depth is monitored in real time through a laser range finder so as to ensure that the drilling reaches the required depth; the drilling diameter monitoring device monitors the diameter of the drilling in real time through an optical sensor so as to ensure that the drilling achieves the required dimensional accuracy; and optical microscopy and scanning electron microscopy equipment detect the surface quality of the borehole to ensure the smoothness and quality of the borehole.
And S5, the control system further comprises automatic control and real-time monitoring of the laser drilling process through written control software and corresponding algorithms, and stability and consistency of drilling are improved, wherein the algorithms comprise a PID control algorithm, an adaptive control algorithm and a fuzzy control algorithm.
The invention utilizes the high energy and high focusing property of UV laser, can realize high-precision drilling of various materials, can greatly shorten the processing period, reduce the cost and the alignment deviation, can drill holes efficiently and accurately, is suitable for drilling various materials, is particularly suitable for drilling hard materials and film materials, and can be widely applied in the fields of manufacturing industry, electronic industry and the like.
Please refer to fig. 2:
the process combines the process capability of electroplating laser holes with the thickness-diameter ratio of 0.75-0.8, performs direct UV laser drilling and electroplating hole filling test on a cross-medium layer, realizes direct cross-layer processing of 4mil and 5mil lasers on a soft and hard combined plate design of a 1-layer ultrathin PP+1-layer PI material design and a pure hard plate design of a 2-layer ultrathin PP design, and passes related reliability test;
the process aims at the paper-based layer with the inner layer designed for 4 pure soft boards, realizes direct cross-layer processing of 4mil and 5mil lasers on the design of 1 layer of PI material and 1 layer of pure glue material, and passes the related reliability test.
Example 1: the hard ceramic material is drilled using a UV laser. A UV laser with the power of 10W, the frequency of 100kHz and the pulse width of 10ns is selected, and a laser beam is directly irradiated on a target position on the surface of the ceramic material to drill holes. By adjusting the parameters of the laser, drilling holes of different sizes and shapes can be realized.
Example 2: the thin film material is drilled using a UV laser. A UV laser with the power of 5W, the frequency of 200kHz and the pulse width of 5ns is selected, and a laser beam is directly irradiated on a target position on the surface of a film material to drill holes. By adjusting the parameters of the laser, drilling holes of different sizes and shapes can be realized.
The PID control algorithm is a common control algorithm, and stable control on the laser drilling process is realized by measuring and adjusting parameters such as laser power, pulse frequency, focusing degree and the like; the self-adaptive control algorithm can automatically adjust the parameters of the laser according to the real-time drilling condition and the material characteristics so as to realize the control of the drilling depth and the diameter; the fuzzy control algorithm can adjust the parameters of the laser according to the relation between the fuzzy rule and the input and output so as to realize the control and optimization of the drilling process;
these control software and algorithms may be selected and developed according to the specific application requirements. In general, it is necessary to determine the optimal control strategy by experimentation and testing, optimize parameter settings and algorithm adjustments to achieve a highly accurate and stable laser drilling process. Meanwhile, other advanced control algorithms and technologies, such as neural network control, genetic algorithm and the like, can be adopted according to actual application conditions so as to further improve the effect and control precision of the drilling process.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present invention, and although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present invention.
Claims (6)
1. A direct cross-layer laser drilling process utilizing UV laser is characterized in that: the method comprises the following steps:
s1, preparing: selecting a material to be drilled and a UV laser, and carrying out proper pretreatment on the surface to be drilled according to the characteristics of the material;
s2, setting parameters: setting power, frequency and pulse width parameters of the UV laser according to the characteristics of the material and the required drilling size;
s3, positioning and calibrating: placing the material on a drilling platform and aligning the drilling position using a microscope;
s4, starting drilling: starting a UV laser, directly irradiating a laser beam on a target position on the surface of the material, drilling, and rapidly melting and evaporating the material by high-density energy of the laser to form a hole;
s5, controlling and monitoring: in the laser drilling process, a control system and monitoring equipment are used for monitoring the depth, diameter and quality parameters of the drilling in real time so as to ensure the quality and stability of the drilling;
s6, post-processing: and (5) carrying out post-treatment on the drilling holes according to the requirement.
2. A direct trans-layer laser drilling process using UV lasers as claimed in claim 1 wherein: in the S1-S5, the UV laser is one of a solid-state laser or a semiconductor laser.
3. A direct trans-layer laser drilling process using UV lasers as claimed in claim 1 wherein: in S5, the control system controls the operation of the process by controlling the output power, pulse width and frequency of the UV laser, and adjusting the focal length and position of the beam delivery system.
4. A direct trans-layer laser drilling process using UV lasers as claimed in claim 1 wherein: in the step S5, the control system specifically includes a laser power controller, which is used for adjusting and controlling the output power of the UV laser, so as to ensure that the energy and the intensity of the laser meet the drilling requirements; a laser pulse frequency controller for adjusting and controlling the pulse frequency of the UV laser to control the action time and frequency of the laser beam; and the laser focusing controller is used for adjusting and controlling the focusing degree of the laser beam so as to ensure that the laser beam can be accurately focused on the drilling position and realize high-precision drilling.
5. A direct trans-layer laser drilling process using UV lasers as claimed in claim 1 wherein: in the step S5, the monitoring device includes a drilling depth monitoring device, and the drilling depth is monitored in real time by a laser range finder to ensure that the drilling reaches the required depth; the drilling diameter monitoring device monitors the diameter of the drilling in real time through an optical sensor so as to ensure that the drilling achieves the required dimensional accuracy; and optical microscopy and scanning electron microscopy equipment detect the surface quality of the borehole to ensure the smoothness and quality of the borehole.
6. A direct trans-layer laser drilling process using UV lasers as claimed in claim 1 wherein: in the step S5, the control system further includes automatic control and real-time monitoring of the laser drilling process through written control software and using corresponding algorithms, so as to improve stability and consistency of drilling, wherein the algorithms include a PID control algorithm, an adaptive control algorithm and a fuzzy control algorithm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311147990.7A CN117047322A (en) | 2023-09-06 | 2023-09-06 | Direct cross-layer laser drilling process utilizing UV laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311147990.7A CN117047322A (en) | 2023-09-06 | 2023-09-06 | Direct cross-layer laser drilling process utilizing UV laser |
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| CN117047322A true CN117047322A (en) | 2023-11-14 |
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| CN202311147990.7A Pending CN117047322A (en) | 2023-09-06 | 2023-09-06 | Direct cross-layer laser drilling process utilizing UV laser |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117832841A (en) * | 2024-01-11 | 2024-04-05 | 东莞市合康电子有限公司 | Small-sized filter antenna and processing technology thereof |
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2023
- 2023-09-06 CN CN202311147990.7A patent/CN117047322A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117832841A (en) * | 2024-01-11 | 2024-04-05 | 东莞市合康电子有限公司 | Small-sized filter antenna and processing technology thereof |
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