KR20170053226A - Fabricaing method of led module - Google Patents

Fabricaing method of led module Download PDF

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Publication number
KR20170053226A
KR20170053226A KR1020150155435A KR20150155435A KR20170053226A KR 20170053226 A KR20170053226 A KR 20170053226A KR 1020150155435 A KR1020150155435 A KR 1020150155435A KR 20150155435 A KR20150155435 A KR 20150155435A KR 20170053226 A KR20170053226 A KR 20170053226A
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South Korea
Prior art keywords
led
color conversion
sheet
conversion sheet
layer
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KR1020150155435A
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Korean (ko)
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KR101778514B1 (en
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김용일
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김용일
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/08—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for producing coloured light, e.g. monochromatic; for reducing intensity of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention provides LED lighting that is easy to manufacture, has thermal durability and excellent color reproducibility.
The LED illumination according to one aspect of the present invention includes the steps of soldering a plurality of LED bear chips on a substrate and attaching a color conversion sheet including a phosphor on the substrate to cover the plurality of LED bear chips ≪ / RTI >

Description

FABRICING METHOD OF LED MODULE [0002]

The present invention relates to LED lighting, and more particularly to LED lighting without a fluorescent molding layer.

A light emitting diode (LED) refers to a device that emits a predetermined light by making a small number of injected carriers (electrons or holes) using a pn junction structure of a semiconductor and recombining them. A green light emitting diode using GaP or the like, and a blue light emitting diode using an InGaN / AlGaN double hetero structure.

The light emitting device can realize white light by combining the light emitting diode chip and the phosphor mold. For example, a phosphor mold emitting yellow-green or yellow light is disposed on the upper part of the light-emitting diode chip which emits blue light to excite a part of the light to obtain a white color by blue light emission of the light emitting diode chip and yellow- have. That is, a white light can be realized by a combination of a blue light emitting diode chip made of a semiconductor component emitting a wavelength of 430 nm to 480 nm and a phosphor capable of generating yellow light using blue light as an excitation source.

That is, in a conventional white light emitting device, light having a sufficiently high energy emitted from a high-brightness blue LED excites a yellow YAG-based phosphor to emit light in a yellow region, thereby inducing a white color by a combination of the blue of the LED and the yellow of the phosphor Method.

In addition, a reflector was provided to form a phosphor mold, and a phosphor resin was injected into the reflector to form an LED package. However, such an LED package is not only complicated in manufacturing process, but also has a problem in that the luminescent brightness is irregular due to the mixing ratio of the epoxy resin or silicone resin used for applying the phosphor, the thermal instability of the resin, and irregular deposition of the phosphor upon curing, The defective rate is high and the color reproducibility is poor.

It is an object of the present invention to provide an LED illumination which is easy to manufacture, has thermal durability and excellent color reproducibility.

However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

The LED illumination according to one aspect of the present invention includes the steps of soldering a plurality of LED bear chips on a substrate and attaching a color conversion sheet including a phosphor on the substrate to cover the plurality of LED bear chips ≪ / RTI >

In addition, the manufacturing method of the LED lighting may further include forming an underfilling layer filling a space between the LED bear chips on the substrate.

The underfilling layer may be formed of a light transmitting material.

In addition, the underfilling layer may include a white or silver color material reflecting light.

Further, in the step of forming the underfilling layer, the underfilling layer may be formed so as to surround the side surface and the bottom surface of the LED bare chip.

In addition, in the step of forming the underfilling layer, the upper surface of the underfilling layer is formed so as to be located on the same plane as the upper surface of the LED bear chip, and in the step of attaching the color conversion sheet, Layer and the upper surface of the LED bare chip.

Further, in the step of forming the underfilling layer, the underfilling layer is formed so as to cover the upper surface of the LED bear chip, and in the step of attaching the color conversion sheet, the color conversion sheet is sandwiched between the underfilling layers And may be attached so as to face the upper surface of the LED bear chip.

In addition, in the step of forming the underfilling layer, the upper surface of the underfilling layer is formed lower than the upper surface of the upper surface of the LED bear chip, and in the step of attaching the color conversion sheet, And a buffer space enclosed by the LED bear chip can be formed.

In addition, the manufacturing method of the LED illumination may further include the step of producing a color conversion sheet for bonding a first sheet having a phosphor and a second sheet having an adhesive force.

In addition, the step of producing the color conversion sheet may include a step of applying a phosphor layer on the first base material to produce a first sheet, and a step of applying a bonding layer on the second base material to produce a second sheet .

Further, in the step of producing the color conversion sheet, the color conversion sheet wound on the roller may be conveyed at a speed of 1 m / min to 15 m / min.

Further, in the step of producing the second sheet, the hardness of the second sheet may be made to have a Shore A hardness of 5 or more and 20 or less.

The thickness of the second sheet 12 may be greater than 15 탆 and less than the thickness of the LED bare chip 25 in the step of producing the second sheet.

Further, the LED lighting manufacturing method may further include the step of forming a plurality of openings in the color conversion sheet, wherein in the step of attaching the color conversion sheet, As shown in FIG.

Further, in the step of attaching the color conversion sheet, the color conversion sheet is attached so as to be in contact with the upper surface of the LED bear chip and the substrate, thereby forming a buffer space between the side surface of the LED bear chip and the color wall- have.

In addition, the buffer space may be formed in a circumferential direction of the LED bare chip so as to surround the side surface of the LED bear chip.

Further, the buffer space may be formed to have a triangular profile.

The LED lighting method may further include forming a plurality of holes in an underfilling layer made of a film and attaching the underfilling layer to the substrate so that the LED bear chip is inserted into the hole have.

In addition, in the step of attaching the color conversion sheet, a protrusion inserted between the underfilling layer and the LED bear chip may be formed in the color conversion sheet.

The protrusion may be formed to have an annular cross-section extending in the circumferential direction of the LED bare chip.

The LED illumination of the present invention includes a color conversion sheet and does not have an LED package manufacturing process, so that it is possible to manufacture the LED illumination more easily.

Further, since the color conversion sheet is provided instead of the phosphor mold, the phosphor mold is prevented from being deteriorated by heat, and white color can be reproduced with excellent performance.

In addition, since the color conversion sheet includes the first sheet and the second sheet, the color conversion sheet having adhesiveness and the phosphor layer can be manufactured more easily, and the color conversion sheet can be more easily installed.

In addition, since a buffer space is formed on the side surface of the LED bare chip, light radiated to the buffer space spreads laterally, thereby effectively reducing the dot-sight effect.

In addition, since the underfilling layer abutting the side surface of the LED bare chip is formed, the heat generated from the LED bare cell can be efficiently emitted to prevent the color conversion sheet from being deteriorated.

1 is a perspective view showing an LED lighting according to a first embodiment of the present invention.
2 is a flowchart illustrating a method of manufacturing an LED illumination according to a first embodiment of the present invention.
3A is a diagram for explaining a process for producing a color conversion sheet.
3B is a view showing a state in which an LED bear chip is mounted on a substrate.
3C is a view showing a state in which an underfilling layer is formed on a substrate.
Fig. 3D is a view showing a state in which a color conversion sheet is attached to an underfilling layer and an LED bare chip.
4 is a flowchart illustrating a method of manufacturing an LED illumination according to a second embodiment of the present invention.
5 is a cross-sectional view illustrating LED lighting according to a second embodiment of the present invention.
6 is a flowchart illustrating a method of manufacturing an LED illumination according to a third embodiment of the present invention.
7 is a cross-sectional view illustrating LED lighting according to a third embodiment of the present invention.
8 is a flowchart illustrating a method of manufacturing an LED illumination according to a fourth embodiment of the present invention.
9 is a cross-sectional view illustrating an LED lighting according to a fourth embodiment of the present invention.
10 is a flowchart illustrating a method of manufacturing an LED illumination according to a fifth embodiment of the present invention.
11 is a plan view showing an LED illumination according to a fifth embodiment of the present invention.
12 is a cross-sectional view illustrating an LED illumination according to a fifth embodiment of the present invention.
13 is a flowchart illustrating a method of manufacturing an LED illumination according to a sixth embodiment of the present invention.
14 is a cross-sectional view illustrating an LED illumination according to a sixth embodiment of the present invention.

The present invention can be variously modified and may have various embodiments, and specific embodiments will be described in detail with reference to the drawings. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Terms including ordinals, such as first, second, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another.

For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, the present invention and its preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing an LED lighting according to a first embodiment of the present invention.

1, the LED lighting 101 according to the first embodiment includes a substrate 21, an LED bare chip 25, and a color conversion sheet 10. The LED illumination 101 according to the first embodiment does not have a package. In the present description, the package is defined as including a LED bearing chip, a reflective barrier, and a fluorescent molding layer covering the LED bear chip inside the reflective barrier. do.

FIG. 3 is a view for explaining a process of manufacturing a color conversion sheet according to a first embodiment of the present invention. FIG. 3B is a cross- FIG. 3C is a view showing a state in which an underfilling layer is formed on a substrate, and FIG. 3D is a view showing a state in which a color conversion sheet is attached to an underfilling layer and an LED bare chip.

2, a manufacturing method of the LED lighting 101 according to the first embodiment includes a step of manufacturing a color conversion sheet 10 (S101), a step of forming an LED bear chip 25 on the substrate 21 A step of soldering (S102), a step of forming an underfilling layer (S103), and a step of attaching the color conversion sheet 10 (S104).

3A, the color conversion sheet 10 is manufactured (S101) by bonding a first sheet 11 having a phosphor and a second sheet 12 having adhesiveness to each other to form a color conversion sheet 10 ). The step S101 of manufacturing the color conversion sheet 10 includes the steps of forming the first sheet 11 by applying the phosphor layer 11b on the first base material 11a and forming the first sheet 11 on the second base material 12a And a step of bonding the first sheet 11 and the second sheet 12 in a roll-to-roll process. The second sheet 12 is formed by applying an adhesive layer 12b to the first sheet 11 and the second sheet 12, respectively.

The first base material 11a may be made of a resin, and the resin may be, for example, a silicone resin, an epoxy resin, a glass, a glass ceramic, a polyester resin, an acrylic resin, a urethane resin , Thermosetting resins having transparency such as nylon resin, polyamide resin, polyimide resin, vinyl chloride resin, polycarbonate resin, polyethylene resin, Teflon resin, polystyrene resin, polypropylene resin and polyolefin resin.

The phosphor layer 11b is manufactured by using as a main component a phosphor whose yellow wavelength is excited by the blue light emitted from the LED bear chip 25. Here, the present embodiment corresponds to the case where the LED bear chip 25 outputs the blue light and constitutes the color conversion sheet 10 for producing the white light, but the LED bear chip 25 outputs the green light or the red light In the case of a phosphor, other phosphors may be used to produce white light.

In the step of manufacturing the first sheet 11, the phosphor layer 11b may be applied on the first base material 11a in a printing manner using a slot die or a doctor blade. At this time, the first sheet 11 is formed in the shape of a ribbon wound on a roller and can be conveyed at a speed of 1 m / min to 15 m / min, and the first sheet 11 is cured through a thermosetting section of 10 m or more .

The second sheet 12 includes a second base material 12a and an adhesive layer 12b formed on the second base material 12a. The second base material 12a may be made of a resin having an adhesive force, and may be made of heat-resistant transparent silicone. The adhesive layer 12b may include a transparent adhesive such as a UV curable resin, a thermosetting resin, and a sealant.

In the step of manufacturing the second sheet 12, the adhesive layer 12b may be applied on the second substrate 12a in a printing manner using a slot die or a doctor blade. The hardness of the second sheet 12 in the step of producing the second sheet 12 is formed to be smaller than the thickness of the first sheet 11 and the hardness of the second sheet 12 is set to the Shore A hardness 5 or more and 20 or less. Further, the thickness of the second sheet 12 may be larger than 15 mu m and smaller than the thickness of the LED bear chip 25. However, the present invention is not limited thereto, and the second sheet 12 may have various structures. On the other hand, the second sheet 12 is formed to have a higher thermal conductivity than the first sheet 11. The second sheet 12 may be made of a polyimide resin, and the second sheet 12 may be made of a thermally conductive And may include a metal oxide such as ITO (indium tin oxide) so as to be improved.

The step of joining the first sheet 11 and the second sheet 12 by a roll to roll process is performed by simultaneously pressing the first sheet 11 and the second sheet 12 using a roller And the first sheet 11 and the second sheet 12 are joined together by heating.

As shown in FIG. 3B, the step of soldering the LED bear chip 25 to the substrate 21 (S102) is to solder the LED bear chip 25 on a substrate by surface mount technology (SMT). Accordingly, a soldering portion 27 is formed between the LED bare chip 25 and the substrate 21. The soldering portion 27 electrically connects the LED bear chip 25 and the substrate 21 and electrically connects the terminal 26 formed on the LED bear chip 25 to the substrate 21.

The substrate 21 can be any substrate that can mount the LED bare chip 25 at a high density. Such as, but not limited to, alumina, quartz, calcium zirconate, forsterite, SiC, graphite, fused silica, Mullite, cordierite, zirconia, beryllia, and aluminum nitride, low temperature co-fired ceramic (LTCC), and the like.

1, the substrate 21 is provided with a first wire 23 and a second wire 23 for supplying power to the LED bear chip 25, 24 may be installed. The LED lighting 101 according to the first embodiment is electrically connected to the LED bear chip 25 and the substrate 21 through the soldering portion 27 and does not have a separate bonding wire.

The LED bear chip 25 is a blue light emitting LED chip, and may be made of a semiconductor component emitting a wavelength of 430 nm to 480 nm. However, the LED bare chip 25 may be an LED bare chip that emits different color light, and the scope of the present invention is not limited to a specific LED bare chip.

3C, in the step of forming the underfilling layer 22 (S103), an underfilling layer 22 filling a space between the LED bearings 25 is formed. Chips 25 to form an underfilling layer 22. The under-

The under filling layer 22 may be made of an epoxy resin or a polyimide resin. In addition, the underfilling layer 22 may be made of a light-transmitting material that transmits light, and may be made of a white or silver material that reflects light. One underfilling layer 22 is in contact with the side surfaces of the plurality of LED bear chips 25 and may be made of a unibody.

The underfilling layer 22 may be formed to surround the side surfaces and the bottom surface of the LED bear chips 25 and the upper surface of the underfilling layer 22 may be formed to be positioned on the same plane as the upper surface of the LED bear chip 25 . The distance between the upper surface of the underfilling layer 22 and the substrate 21 becomes equal to the distance between the upper surface of the LED bear chip 25 and the substrate 21. In addition, the underfilling layer 22 may be formed to expose only the upper surfaces of the LED bear chips 25 and to cover the side surfaces and the bottom surface.

The underfilling layer 22 is formed by flattening the surface to which the color conversion sheet 10 is attached so that the color conversion sheet 10 can be stably installed on the substrate 21, And quickly discharges the heat generated in the heat exchanger 21.

In step S103 of attaching the color conversion sheet 10, the color conversion sheet 10 is attached so as to abut the LED bear chip 25, the underfilling layer 22, and the substrate 21. In step S103 of attaching the color conversion sheet 10, the color conversion sheet 10 is provided to cover the plurality of LED bear chips 25 and includes an LED bear chip 25, an underfilling layer 22, (21).

A color conversion sheet 10 may be provided on the substrate 21 so as to cover all the LED bear chips 25 provided on the substrate 21 in the step S103 of attaching the color conversion sheet 10. [ At this time, the color conversion sheet 10 may be made of a unibody. However, the present invention is not limited thereto, and a plurality of color conversion sheets 10 may be provided on one substrate 21. In this case, the color conversion sheet 10 may be provided so as to cover the plurality of LED bear chips 25.

The LED lighting 101 according to the first embodiment does not have a fluorescent molding layer and is not packaged. Since the LED bear chip 25 is directly mounted on the substrate 21, the LED lighting can significantly reduce the volume And the manufacturing process can be remarkably simplified.

Further, since the color conversion sheet 10 is provided so as to cover the plurality of LED bear chips 25 instead of the fluorescent molding layer, it is possible to prevent the fluorescent molding layer from being deteriorated due to the thermal effect, thereby reducing the color reproducibility.

When the underfilling layer 22 is formed as in the first embodiment, the heat generated from the LED bear chip 25 can be discharged more easily and the color conversion sheet 10 can be stably attached .

Hereinafter, a method of manufacturing the LED illumination according to the second embodiment of the present invention will be described with reference to FIGS. FIG. 4 is a flowchart illustrating a method of manufacturing an LED illumination according to a second embodiment of the present invention, and FIG. 5 is a cross-sectional view illustrating an LED illumination according to a second embodiment of the present invention.

4 and 5, a method of manufacturing the LED illumination 102 according to the second embodiment includes the steps of (S201) manufacturing the color conversion sheet 10, forming the LED bear chip 25 on the substrate 21, (S202), and attaching the color conversion sheet 10 (S203).

Referring to FIG. 6C, step S201 of manufacturing the color conversion sheet 10 includes the steps of producing the first sheet 11, producing the second sheet 12, And joining the sheet (12). The first sheet 11 may be manufactured by preparing a first sheet by press molding a slurry which is a mixture of a resin and a phosphor or by drawing or extruding the first sheet 11 . The phosphors 15 can be distributed over the entire first sheet 11 with a uniform density.

The step of producing the second sheet 12 may be performed by molding a resin having an adhesive force so that the first sheet 11 has an overall adhesive force and the first sheet 11 and the second sheet 12 are joined together The first sheet 11 and the second sheet 12 can be adhered by heating under pressure by a roll-to-roll process.

The step of soldering the LED bare chip 25 (S202) comprises placing the terminals 26 of the plurality of LED bear chips 25 on the substrate 21 via the soldering portion 27, (S102) of soldering the LED bare chip 25 according to the embodiment.

The step of attaching the color conversion sheet 10 (S203) attaches the color conversion sheet 10 so as to abut the LED bear chip 25 and the substrate 21. In step S203 of attaching the color conversion sheet 10, the color conversion sheet 10 is installed to cover the plurality of LED bear chips 25 and is attached to the upper surface of the LED bear chip 25 and the substrate 21 .

A color conversion sheet 10 may be provided on the substrate 21 so as to cover all the LED bear chips 25 provided on the substrate 21 in the step S203 of attaching the color conversion sheet 10. [ At this time, the color conversion sheet 10 may be made of a unibody. However, the present invention is not limited thereto, and a plurality of color conversion sheets 10 may be provided on one substrate 21. In this case, the color conversion sheet 10 may be provided so as to cover the plurality of LED bear chips 25. At this time, the second sheet 12 may be installed to cover the upper surface and the upper surface of the LED bear chips 25.

A buffer space 28 is formed between the side surface of the LED bear chip 25 and the color conversion sheet 10 in the step S203 of attaching the color conversion sheet 10. The color conversion sheet 10 is attached so as to be in contact with the upper surface of the LED bear chip 25 and the substrate 21 to form a buffer space between the side surface of the LED bear chip 25 and the color wall- .

The buffer space 28 is formed in the circumferential direction of the LED bare chip 25 so as to surround the side surface of the LED bear chip 25. In addition, the buffer space 28 may have a triangular channel shape and may have a triangular profile.

The color conversion sheet 10 is formed with a first portion attached to the upper surface of the LED bear chip 25 and a second portion attached to the substrate 21 and a third portion forming the buffer space 28. [

The first part is attached to the upper surface of the LED bare chip 25 and the second part is attached to the substrate 21 and the second part is located between the LED bear chips 25, Lt; / RTI > The third portion forms a buffer space 28 between the side of the LED bare chip 25 and the color conversion sheet 10.

When the buffer space 28 is formed by the color conversion sheet 10 as described above, the light emitted from the LED bear chip 25 is diffused in the buffer space 28 to reduce the dot appearance.

Hereinafter, a method of manufacturing an LED illumination according to a third embodiment of the present invention will be described with reference to FIGS. 6 and 7. FIG. FIG. 6 is a flowchart illustrating a method of manufacturing an LED illumination according to a third embodiment of the present invention, and FIG. 7 is a cross-sectional view illustrating an LED illumination according to a third embodiment of the present invention.

6 and 7, a method of manufacturing the LED illumination 103 according to the third embodiment includes a step S301 of soldering the LED bear chip 25 to the substrate 21, a step S302 of bonding the under- (S302) of forming the color conversion sheet 10, and attaching the color conversion sheet 10 (S303).

In operation S301 of soldering the LED bear chip 25 to the substrate 21, the LED bear chip 25 is soldered on the substrate by surface mount technology (SMT). Accordingly, a soldering portion 27 is formed between the LED bare chip 25 and the substrate 21. The soldering portion 27 electrically connects the LED bear chip 25 and the substrate 21 and electrically connects the terminal 26 formed on the LED bear chip 25 to the substrate 21.

In step S302 of forming the underfilling layer 22, an underfilling layer 22 is formed between the LED bear chips 25. The liquid resin is filled between the LED bear chips 25, (22). The under filling layer 22 may be made of an epoxy resin or a polyimide resin. In addition, the underfilling layer 22 may be made of a light-transmitting material that transmits light, and may be made of a white or silver material that reflects light. One underfilling layer 22 is in contact with the side surfaces of the plurality of LED bear chips 25 and may be made of a unibody.

The underfilling layer 22 may be formed to surround the side surfaces and the bottom surface of the LED bear chips 25 and the upper surface of the underfilling layer 22 may be formed lower than the upper surface of the LED bear chip 25. The distance between the upper surface of the underfilling layer 22 and the substrate 21 becomes smaller than the distance between the upper surface of the LED bear chip 25 and the substrate 21. [ In addition, the underfilling layer 22 may be formed to expose upper and side surfaces of the LED bear chips 25 and to cover a part of the side surface and a lower surface of the side surface.

The underfilling layer 22 is formed by flattening the surface to which the color conversion sheet 10 is attached so that the color conversion sheet 10 can be stably installed on the substrate 21, And quickly discharges the heat generated in the heat exchanger 21.

The color conversion sheet 10 manufactured in the step S303 of attaching the color conversion sheet 10 is attached so as to abut the LED bear chip 25, the underfilling layer 22, and the substrate 21. In step S303 of attaching the color conversion sheet 10, the color conversion sheet 10 is provided to cover the plurality of LED bear chips 25 and includes an LED bear chip 25, an underfilling layer 22, (21).

The color conversion sheet 10 may be installed on the substrate 21 so as to cover all the LED bear chips 25 provided on the substrate 21 in the step S303 of attaching the color conversion sheet 10. [

A buffer space 29 is formed between the side surface of the LED bear chip 25 and the color conversion sheet 10 in the step S303 of attaching the color conversion sheet 10. The color conversion sheet 10 is attached so as to be in contact with the upper surface of the LED bear chip 25 and the underfilling layer 22 so that the side surface of the LED bear chip 25 and the color block sheet 10 and the underfilling layer 22 The buffer space 29 is formed.

The buffer space 29 extends in the circumferential direction of the LED bare chip 25 and is formed so as to surround the side surface of the LED bear chip 25. In addition, the buffer space 29 may have a triangular-shaped longitudinal cross-section.

Since the LED lighting 103 according to the third embodiment is formed with the under filling layer 22, it is possible to more easily discharge the heat generated from the LED bear chip 25, And can be stably attached. In addition, since the buffer space 28 is formed by the color conversion sheet 10, the light emitted from the LED bear chip 25 can be diffused in the buffer space 28 to reduce the dot appearance.

Hereinafter, a method of manufacturing an LED illumination according to a fourth embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a flowchart illustrating a method of manufacturing an LED lighting according to a fourth embodiment of the present invention, and FIG. 9 is a cross-sectional view illustrating an LED lighting according to a fourth embodiment of the present invention.

8 and 9, a method of manufacturing the LED illumination 104 according to the fourth embodiment includes a step S401 of soldering the LED bear chip 25 to the substrate 21, a step of bonding the under- 22), and attaching the color conversion sheet 10 (S403).

In step S401 of soldering the LED bear chip 25 to the substrate 21, the LED bear chip 25 is soldered on the substrate by surface mount technology (SMT). Accordingly, a soldering portion 27 is formed between the LED bare chip 25 and the substrate 21. The soldering portion 27 electrically connects the LED bear chip 25 and the substrate 21 and electrically connects the terminal 26 formed on the LED bear chip 25 to the substrate 21.

In step S402 of forming the underfilling layer 22, an underfilling layer 22 is formed between the LED bear chips 25. The underfilling layer 22 is formed by filling the liquid resin between the LED bear chips 25, (22). The under filling layer 22 may be made of an epoxy resin or a polyimide resin. In addition, the underfilling layer 22 may be made of a light-transmitting material that transmits light, and may be made of a white or silver material that reflects light. One underfilling layer 22 is in contact with the side surfaces of the plurality of LED bear chips 25 and may be made of a unibody.

The underfilling layer 22 may be formed to surround the side surfaces and the upper and lower surfaces of the LED bear chips 25 and the upper surface of the underfilling layer 22 may be formed higher than the upper surface of the LED bear chip 25. The distance between the upper surface of the underfilling layer 22 and the substrate 21 becomes larger than the distance between the upper surface of the LED bear chip 25 and the substrate 21. [

The underfilling layer 22 is formed by flattening the surface to which the color conversion sheet 10 is attached so that the color conversion sheet 10 can be stably installed on the substrate 21, And quickly discharges the heat generated in the heat exchanger 21.

In step S403 of attaching the color conversion sheet 10, the color conversion sheet 10 is attached so as to abut the underfilling layer 22 and the substrate 21. The color conversion sheet 10 is provided so as to cover the plurality of LED bear chips 25 in the step of attaching the color conversion sheet 10 and the LED bear chip 25 with the underfilling layer 22 interposed therebetween. As shown in Fig. A color conversion sheet 10 may be provided on the substrate 21 so as to cover all the LED bear chips 25 provided on the substrate 21 in the step S403 of attaching the color conversion sheet 10. [

Hereinafter, a method of manufacturing an LED illumination according to a fifth embodiment of the present invention will be described with reference to FIGS. 10, 11, and 12. FIG. FIG. 10 is a flowchart illustrating a method of manufacturing an LED lighting according to a fifth embodiment of the present invention. FIG. 11 is a plan view of an LED lighting according to a fifth embodiment of the present invention, 5 is a cross-sectional view illustrating LED lighting according to an embodiment.

10 to 11, a method of manufacturing the LED illumination 105 according to the fifth embodiment includes a step (S501) of soldering an LED bear chip 25 to a substrate 21, a step A step S502 of forming a plurality of holes 31 in the substrate 30, a step S503 of attaching the underfilling layer 30 to the substrate 21, And attaching the color conversion sheet 10 (S504).

In step S501 of soldering the LED bear chip 25 to the substrate 21, the LED bear chip 25 is soldered on the substrate by surface mount technology (SMT). Accordingly, a soldering portion 27 is formed between the LED bare chip 25 and the substrate 21. The soldering portion 27 electrically connects the LED bear chip 25 and the substrate 21 and electrically connects the terminal 26 formed on the LED bear chip 25 to the substrate 21.

The step of forming the hole 31 in the underfilling layer 30 may include forming a plurality of holes 31 in the underfilling layer 30 in the form of a film and the hole 31 may be a square, And the like.

In step S503 of attaching the underfilling layer 30 to the substrate 21, the underfilling layer 30 is attached to the substrate 21 such that the LED bear chip 25 is inserted into the hole 31. The underfilling layer 30 may be made of a film having adhesiveness. At this time, a gap is formed between the underfilling layer 30 and the LED bear chip 25, and the inner surface of the hole 31 and the LED bear chip 25 are spaced apart from each other.

In step S504 of attaching the color conversion sheet 10, the color conversion sheet 10 is attached so as to abut the underfilling layer 22, the LED bear chip 25, and the substrate 21. In the step of attaching the color conversion sheet 10, the color conversion sheet 10 is provided so as to cover the plurality of LED bear chips 25, and one color conversion sheet 10 is provided on the entire surface of the substrate 21 And may be installed to cover the LED bear chip 25.

In step S504 of attaching the color conversion sheet 10, the color conversion sheet 10 is provided with a protrusion 121, which is inserted into the hole 31. [ That is, the protruding portion 121 is inserted between the LED bear chip 25 and the underfilling layer 30, and can abut the inner surface of the hole 31 and the side surface of the LED bear chip 25. Further, the protruding portion 121 may be formed to have an annular cross-section extending in the circumferential direction of the LED bear chip 25.

Hereinafter, a method of manufacturing an LED illumination according to a sixth embodiment of the present invention will be described with reference to FIGS. 13 and 14. FIG. FIG. 13 is a flowchart illustrating a method of manufacturing an LED illumination according to a sixth embodiment of the present invention, and FIG. 14 is a cross-sectional view illustrating an LED illumination according to the sixth embodiment of the present invention.

13 and 14, the manufacturing method of the LED lighting 106 according to the sixth embodiment includes the steps of manufacturing the color conversion sheet 50 (S601), forming the color conversion sheet 50 with the openings 51 and 52 A step S603 of forming an underfilling layer 22 and a step S604 of forming an underfilling layer 22 on the color conversion sheet 50 (Step S605).

The manufacturing method of the LED illumination 103 according to the fifth embodiment is the same as the manufacturing method of the LED illumination 103 according to the first embodiment except for the step S602 of forming the openings 51 and 52 in the silver- And the manufacturing method of the illumination is the same as that of the manufacturing method of the illumination.

In the step S601 of producing the color conversion sheet 50, the color conversion sheet 50 is manufactured by bonding a first sheet having a phosphor and a second sheet having adhesiveness.

A plurality of first openings 51 and a plurality of second openings 52 are formed in the color conversion sheet 50 in the step S602 of forming the openings 51 and 52 in the color conversion sheet 50, 51 may have a circular shape, and the second opening 52 may have a rectangular shape. However, the present invention is not limited thereto, and the first and second openings 51 and 52 may have various shapes such as a circular shape, an elliptical shape, and a polygonal shape.

The first opening 51 and the second opening 52 are spaced apart from each other at predetermined intervals in the step S602 of forming the openings 51 and 52 in the color conversion sheet 50, A plurality of openings may be formed.

In step S603 of soldering the LED bear chip 25 to the substrate 21, the LED bear chip 25 is soldered on the substrate by surface mount technology (SMT). Accordingly, a soldering portion 27 is formed between the LED bare chip 25 and the substrate 21. The soldering portion 27 electrically connects the LED bear chip 25 and the substrate 21 and electrically connects the terminal 26 formed on the LED bear chip 25 to the substrate 21.

In step S604 of forming the underfilling layer 22, an underfilling layer 22 is formed between the LED bear chips 25. The underfilling layer 22 is filled between the LED bear chips 25, (22). The under filling layer 22 may be made of an epoxy resin or a polyimide resin.

In the step of attaching the color conversion sheet 50 (S605), the color conversion sheet 50 is attached so that the first opening 51 and the second opening 52 are positioned between the LED bear chips 25, The openings 51 and 52 are located on the underfilling layer 22 so that the underfilling layer 22 is exposed through the openings 51 and 52. When a plurality of first openings 51 and second openings 52 are formed in the color conversion sheet 50 as in the sixth embodiment, light can be emitted with uniform brightness and uniform color.

As described above, preferred embodiments of the present invention have been disclosed in the present specification and drawings, and although specific terms have been used, they have been used only in a general sense to easily describe the technical contents of the present invention and to facilitate understanding of the invention , And are not intended to limit the scope of the present invention. It is to be understood by those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

101, 102, 103, 104, 105, and 106: LED lighting
10, 50: color conversion sheet
11: first sheet
11a: first substrate
11b: phosphor layer
12: second sheet
12a: second substrate
12b:
15: Phosphor
22, 30: Underfilling layer
23: first wire
24: second wire
25: LED bear chip
26: Terminal
27: soldering portion
28, 29: buffer space
31: Hall
51: first opening
52: second opening
121:

Claims (20)

The method comprising: soldering a plurality of LED bear chips onto a substrate; and attaching a color conversion sheet comprising a phosphor on the substrate to cover the plurality of LED bear chips. LED lighting without molding layer.
The method according to claim 1,
Further comprising forming an underfill layer on the substrate to fill a space between the LED bear chips. ≪ RTI ID = 0.0 > 11. < / RTI >
3. The method of claim 2,
Wherein the underfilling layer is made of a light-transmitting material, and the LED lighting does not have a fluorescent molding layer produced by the method.
3. The method of claim 2,
Wherein the underfilling layer comprises a white or silver material that reflects light. ≪ RTI ID = 0.0 > 11. < / RTI >
3. The method of claim 2,
Wherein the underfilling layer is formed to surround the side surface and the lower surface of the LED bare chip in the step of forming the underfilling layer.
3. The method of claim 2,
In the step of forming the underfilling layer, the upper surface of the underfilling layer is formed to be positioned on the same plane as the upper surface of the LED bear chip, and in the step of attaching the color conversion sheet, And the LED bare chip is attached so as to be in contact with the upper surface of the upper surface of the LED bare chip.
3. The method of claim 2,
Wherein the underfilling layer is formed to cover the upper surface of the LED bear chip in the step of forming the underfilling layer, and in the step of attaching the color conversion sheet, the color conversion sheet is interposed between the LED Wherein the LED chip is attached so as to face the upper surface of the bare chip.
3. The method of claim 2,
The upper surface of the underfilling layer is formed lower than the upper surface of the upper surface of the LED bare chip in the step of forming the underfilling layer,
Characterized in that in the step of attaching the color conversion sheet, the color conversion sheet forms a buffer space surrounded by the underfilling layer and the LED bear chip.
The method according to claim 1,
A method of fabricating a color conversion sheet, the method comprising: fabricating a color conversion sheet that joins a first sheet having a phosphor and a second sheet having an adhesive force to each other, the LED sheet having no fluorescent molding layer produced by the method.
10. The method of claim 9,
The step of producing the color conversion sheet includes a step of applying a phosphor layer on the first base material to produce a first sheet and a step of applying a bonding layer on the second base material to produce a second sheet Gt; LED lighting < / RTI >
10. The method of claim 9,
Wherein the color conversion sheet wound on the rollers in the step of producing the color conversion sheet is conveyed at a speed of 1 m / min to 15 m / min, without the fluorescent molding layer produced by the method.
10. The method of claim 9,
Wherein the hardness of the second sheet in the step of producing the second sheet is made to have a Shore A hardness of 5 or more and 20 or less.
10. The method of claim 9,
Characterized in that the thickness of the second sheet (12) in the step of producing the second sheet is greater than 15 탆 and smaller than the thickness of the LED bare chip (25) light.
6. The method of claim 5,
Further comprising forming a plurality of openings in the color conversion sheet,
Characterized in that in the step of attaching the color conversion sheet, the color conversion sheet is attached such that the opening is positioned between the LED bear chips.
The method according to claim 1,
Wherein the color conversion sheet is attached in contact with the upper surface of the LED bear chip and the substrate in the step of attaching the color conversion sheet to form a buffer space between the side surface of the LED bear chip and the color wall- LED lighting without a fluorescent molding layer produced by the method.
16. The method of claim 15,
Wherein the buffer space is formed to extend in the circumferential direction of the LED bear chip so as to surround a side surface of the LED bear chip, the LED lighting device having no fluorescent molding layer manufactured by the method.
16. The method of claim 15,
Wherein the buffer space has a triangular profile. ≪ RTI ID = 0.0 > 11. < / RTI >
The method according to claim 1,
Forming a plurality of holes in an underfilling layer made of a film and attaching the underfilling layer to the substrate so that the LED bare chip is inserted into the hole; LED lighting without molding layer.
19. The method of claim 18,
Wherein the color conversion sheet is formed with protrusions inserted between the underfilling layer and the LED bear chip in the step of attaching the color conversion sheet, wherein the color conversion sheet does not have a fluorescent molding layer manufactured by the method.
20. The method of claim 19,
Characterized in that the protrusions have an annular cross section extending in the circumferential direction of the LED bare chip, the LED illumination not having a fluorescent molding layer produced by the method.
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