KR20170031040A - Elastic composite filter - Google Patents

Abstract

Disclosed is a technology for removing noise by allowing a complex filter having elasticity to include a capacitor. The complex filter comprises: a functional material layer; an electrode pattern formed on each of the upper and lower surfaces of the material layer; and an electrically conductive elastic member bonded to the electrode pattern on the upper surface. The elastic member is electrically and mechanically coupled to the electrode pattern on the upper surface to be used as an electrode. The elastic member is in direct contact with an electrically conductive object, which face each other, to provide elasticity.

Description

[0001] The present invention relates to a composite filter having elasticity,

[0001] The present invention relates to a composite filter, and more particularly to a technique for elastically contacting one of objects to provide functionality and eliminating noise such as static electricity, .

An electrical connection terminal having elasticity is used for electrically connecting a conductive object such as an antenna or a metal case to a conductive pattern of a circuit board or for electrically connecting to a ground for eliminating static electricity or electromagnetic interference (EMI).

The electrical connection terminal may be soldered to the conductive pattern of the circuit board and fixed or used between the objects.

When these electric connection terminals are used to connect electric power in the vertical direction, the working distance is large in the vertical direction as possible so as to accommodate the dimensional tolerance in the vertical direction of the electrically conductive object to be electrically connected while the electric resistance is small, And structures and materials having good elastic restoring force are required.

Examples of such elastic electrical connection terminals include Korean Patent Registration Nos. 1001354 and 1381127 by the present applicant.

However, these electrical connection terminals have a role of elastically and electrically connecting opposing objects interposed between the electrically conductive objects, but they do not have a function of removing noise from which the electrical connection terminals themselves are introduced.

Generally, noise consists of conduction noise propagated through a signal line or a power line, induction noise propagated through an electromagnetic induction or an electrostatic induction, and radiation noise propagated in the air in the form of an electromagnetic wave.

Conventional capacitors are mounted on a printed circuit board and are not resilient, so that they are difficult to mount between electrically conductive objects and also do not elastically contact with a working distance, There is a great risk of being damaged by impact.

Accordingly, an object of the present invention is to provide a composite filter having elasticity and capable of preventing or attenuating an electric shock or noise caused by an overcurrent through grounding.

Another object of the present invention is to provide a composite filter which is easy to manufacture and install and which is economical.

Another object of the present invention is to provide a composite filter which has a large working distance, good elasticity and elastic restoration ratio, and which does not affect the change in capacitance even when pressed by an object.

Another object of the present invention is to provide a composite filter that is easy to mount and solderable.

Another object of the present invention is to provide a composite filter which is easy to discharge.

The above object is achieved by a semiconductor device comprising: a functional material layer; An electrode pattern formed on the upper surface and the lower surface of the material layer, respectively; And an electrically conductive elastic member adhered on the upper surface electrode pattern, wherein the elastic member is electrically and mechanically coupled to the upper surface electrode pattern to serve as an electrode, and the elastic member is in direct contact with an opposing electrically conductive object Thereby providing an elasticity. The present invention also provides a composite filter having elasticity.

According to the above configuration, the composite filter is provided with a capacitance suitable for elasticity and noise elimination that provide opposed working distances, thereby eliminating noise that flows in and out of contact with the opposing electrically conductive object with elasticity.

Further, it is easy to mount to either the electrically conductive double-sided adhesive tape which is sandwiched between the electrically conductive objects or electrically conductive in the thickness direction, or to the electrically conductive object which is opposed by soldering.

In addition, the working distance can be easily adjusted by adjusting the height of the leaf spring, which is an elastic member, and the elasticity and elastic restoration rate are good due to the metal material.

In addition, even if the composite filter is pressed by the object, there is no change in the distance between the two electrodes, so that the change of the capacitance of the composite filter is not affected.

In addition, the electric shock or noise caused by the overcurrent flowing into the capacitor constituting the functional material layer can be prevented or attenuated through the ground.

In addition, when static electricity flows from the outside through the elastic member, the static electricity is attenuated through the process of converting into the light energy through the discharge path interposed within the functional material layer.

Also, since the external discharge distance is increased by the insulating coating layer, the external discharge resistance is increased or the internal discharge path is shortened by the electrode tip extending into the via hole, so that the internal discharge can be more easily caused.

1 shows a composite filter according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of the composite filter of Fig. 1 cut vertically. Fig.
Figure 3 (a) shows the use of a composite filter, and Figure 3 (b) shows an equivalent circuit.
4 shows a composite filter according to another embodiment of the present invention.
5 is a cross-sectional view illustrating a composite filter according to another embodiment of the present invention.
6 (a) and 6 (b) each show a composite filter according to another embodiment of the present invention.
7 shows a composite filter according to another embodiment of the present invention.
8 shows a composite filter according to another embodiment of the present invention.

It is noted that the technical terms used in the present invention are used only to describe specific embodiments and are not intended to limit the present invention. In addition, the technical terms used in the present invention should be construed in a sense generally understood by a person having ordinary skill in the art to which the present invention belongs, unless otherwise defined in the present invention, Should not be construed as interpreted or interpreted in an excessively reduced sense. In addition, when a technical term used in the present invention is an erroneous technical term that does not accurately express the concept of the present invention, it should be understood that technical terms can be understood by those skilled in the art.

In addition, the general terms used in the present invention should be interpreted according to a predefined or prior context, and should not be construed as being excessively reduced.

Furthermore, the singular expressions used in the present invention include plural expressions unless the context clearly dictates otherwise. In the present invention, the terms such as " comprises " or " comprising " and the like should not be construed as encompassing various elements or various steps of the invention, Or may further include additional components or steps.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 shows a composite filter according to an embodiment of the present invention. Fig. 2 is a vertical cross-sectional view of the composite filter of Fig. 1, ) Represents an equivalent circuit.

The composite filter 100 is composed of a planar element 110 and a plate spring 130 made of an elastic material and adhered to the planar element 110 by an electrically conductive adhesive or solder 120.

The flat plate type device 110 includes a functional material layer 111 and electrode patterns 112 and 113 formed on upper and lower surfaces of the functional material layer 111. The flat plate type device 110 includes a plate spring 130 are mounted.

A dielectric material can be applied to the functional material layer 111 constituting the flat plate-like element 110, and in this embodiment, a capacitor is taken as an example. The dielectric material may be a ceramic material, a composite material of ceramic and polymer, and a polymer material.

The lower surface electrode pattern 112 and the leaf spring 130 are used as electrodes and form a capacitor together with the functional material layer 111 so that the leaf spring 130 can be pressed against the electrically conductive object, .

The edges of the electrode patterns 112 and 113 may be formed inwardly from the edge of the functional material layer 111 to have a pull back margin. The distance of the full back margin is formed to be at least 0.01 mm or more so that electrical shorting between the top surface electrode pattern 113 and the bottom surface electrode pattern 112 can be prevented when surface mounting is required.

When the lower surface electrode pattern 112 is a solderable metal foil, as shown in FIG. 3A, the composite filter 100 is subjected to reel taping and then vacuum-picked up the leaf spring 130, 10 by the reflow soldering with a solder cream and the leaf spring 130 is pressed by the metal case 20 from the upper part so that the compression of the composite filter 100 Provides restoration.

In this embodiment, the plate spring 130 has a Z-shape when viewed from the side, but is not limited thereto. The plate spring 130 may have a Z- C 'shape or the like, and a coil type or pressure contact type spring can be applied.

The leaf spring 130 is made of a single body, and a metal foil having good elasticity such as phosphor bronze or copper alloy having a thickness of 0.05 mm to 0.15 mm, for example, can be continuously produced by press using a press die.

Here, the plate spring 130 may be manufactured by pressing tin, silver or gold to prevent oxidation.

The upper surface of the leaf spring 130 has a relatively large area and is planar and has an advantage of easy electrical contact with an opposing object having various structures and increasing electrical contact with an object to reduce electrical resistance. Particularly, there is an advantage that the electrical contact resistance becomes small when making electrical contact with an antenna or the like, and reliable mechanical contact is made.

The size of the lower surface of the leaf spring 130 is not particularly limited, but may be the same as or similar to the size of the upper surface electrode pattern 113.

3 (b), the leaf spring 130 of the composite filter 100 is electrically and mechanically coupled to the upper surface electrode pattern 113 and used as one of the electrodes of the capacitor, Lt; RTI ID = 0.0 > 100 < / RTI > Since the relative permittivity of the leaf spring 130 is so small that the leaf spring 130 having a relatively large height is electrically conductive, The change of the parasitic capacitance due to the leaf spring 130 is not large even though the height of the leaf spring 130 is changed by being interposed between the objects.

The dimensions of the composite filter 100 are not limited. For example, the composite filter 100 may have a width of 1 mm to 3 mm, a length of 1 mm to 10 mm, a height of 0.5 mm to 2.0 mm, a capacitance, .

The capacitance, which is the capacitance of the capacitor mainly generated by the lower surface electrode pattern 112 and the upper surface electrode pattern 113 and the functional material layer 111 interposed therebetween, is not limited, However, the present invention is not limited thereto. For example, the LTE band may have a capacitance of 2 to 50 pF, but the present invention is not limited thereto. For example, the capacitance may be a value that can attenuate unwanted noise, such as unwanted static electricity or an electrical shock through ground.

The compression ratio of the composite filter 100 by the leaf spring 130 may preferably be 25% or more of the original height, and the elastic restoration ratio after pressing is maintained at 90% or more.

The electrode patterns 112 and 113 may be a metal foil such as a copper foil, a plated electroconductive fiber, a polymer film having a metal layer formed on its outer surface, or an electrically conductive polymer coating layer having a relatively low electrical resistance, And the polymer coating layer may be, for example, a silicone rubber coating layer.

When the electrode patterns 112 and 113 are a metal foil or a polymer film having a metal layer formed thereon, a metal foil or a metal layer is plated with a refractory metal such as tin, silver or nickel and gold, Low electroconductive polymer resin or electrically conductive silicone rubber can be coated to prevent corrosion.

Similar to the case of the functional material layer 111, the electrode patterns 112 and 113 may be formed of a metal foil, a plated electroconductive fiber, or a polymer film having a metal layer formed on the outer surface thereof, A silicone rubber adhesive having elasticity and flexibility can be applied as the adhesive. When the electrode patterns 112 and 113 are electrically conductive polymer coating layers, the electrode patterns 112 and 113 may be integrally bonded to the lower surface or the upper surface of the functional material layer 111, for example, by casting.

The functional material layer 111 is electrically insulated. For example, the polymer resin may have a Y5V (capacitance change rate within a range of -30 ° C to + 85 ° C with a relative dielectric constant of about 18,000, a capacitance change within a range of -82% to + 22% A dielectric ceramic material in which a high dielectric ceramic powder mainly composed of barium titanate (BaTiO3) such as X7R having a dielectric constant of about 3,000 (-55 DEG C to + 125 DEG C and a capacitance change ratio within 15% with respect to a capacitance at 25 DEG C) Or a dielectric ceramic formed by firing a high dielectric ceramic powder such as ZnO 2, such as a varistor.

The dielectric polymer has flexibility and low hardness, which makes it easy to process such as blade cutting. However, it has a disadvantage in that the dielectric constant is lower than that of the fired dielectric ceramic, so that the capacitance value is small.

Since the other constituent parts except for the functional material layer 111 all have a much lower permittivity than the functional material layer 111, the gap between the lower surface electrode pattern 112 and the upper surface electrode pattern 113 The capacitance of the composite filter 100 is determined mainly by the dielectric constant of the functional material layer 111. [

The capacitance of the composite filter 100 is calculated by the following equation (1).

Where S is the spacing between the base and the spring underneath, d is the spacing between the horizontal base and the spring bottom, ε0 is the dielectric constant in vacuum (8.85 × 10-12 F / m) and εr is the dielectric constant of the material Relative dielectric constant.

The capacitance of the composite filter 100 is proportional to the area of the electrode patterns 112 and 113 used as electrodes and is proportional to the relative dielectric constant of the functional material layer 111 and is inversely proportional to the spacing between the electrode patterns 112 and 113 do.

3 (a), when the composite filter 100 is soldered and adhered onto the conductive pattern 12 of the circuit board 10, the metal case 20 is resiliently deformed by the elasticity of the leaf spring 130 The high frequency noise introduced through the metal case 20 is filtered by the capacitance of the composite filter 100 and does not flow into the circuit board 10 and the ESD introduced through the metal case 20 likewise functions as the functional material Since the thickness of the layer 111 is thin, it is directly transferred from the leaf spring 130 or the top surface electrode pattern 113 to the bottom surface electrode pattern 112 through the atmosphere adjacent to the side of the functional material layer 111.

The commercial power source flowing through the conductive pattern 12 of the circuit board 10 is shielded by the capacitance of the composite filter 100 and is not transmitted to the metal case 20,

Meanwhile, when the capacitance of the composite filter 100 is set to correspond to another related frequency, for example, a low frequency, the low frequency noise introduced through the leaf spring 130 is grounded through the lower surface electrode pattern 112, Lt; / RTI >

The meaning of the high frequency and the low frequency used in the present invention is a relative concept that can be determined according to the use of the composite filter 100. For example, in the case of a smart phone, the high frequency means about 30 MHz or more, But it is not limited to this.

Therefore, since the noise removed or suppressed by the capacitance of the composite filter 100 is different, the capacitance can be set in consideration of the frequency and the size of the noise to be removed.

The tolerance of the capacitance of the composite filter 100, that is, the variation of the capacitance of the composite filter 100 when the composite filter 100 is pressed to the maximum and minimum pressures is preferably within ± 10%, but is not limited thereto .

When the composite filter 100 is pressed between the metal case 20 and the circuit board 10, the leaf spring 130 is compressed. However, the gap between the upper surface electrode pattern 113 and the lower surface electrode pattern 112 The capacitance of the composite filter 100 is not changed as shown in Equation (1).

Although the composite filter 100 is preferably fixed to the electrically conductive object by a double-sided electroconductive adhesive tape or soldering, it is not limited thereto and may be used interposed between electrically conductive objects.

Here, for the soldering, the functional material layer 111 needs to have heat resistance enough to satisfy the soldering condition by the solder cream.

4 shows a composite filter according to another embodiment of the present invention.

According to this embodiment, solder resists 115 are formed on both side edges of the upper and lower surface electrode patterns 112 and 113 to have a constant width and to cover the solder resists 115 and the electrode patterns 112 and 113 A plating layer 116 is formed.

The plate spring 132 having a C-shaped cross section is bonded onto the plating layer 116 via the solder 120.

When the pressure is applied to the plate springs 130 and 132, the pressure is not uniformly applied to the plate springs 130 and 132, or the leaf springs 130 and 132 act like levers due to the shape of the leaf springs 130 and 132 In this case, one edge of the top surface electrode pattern 113 may be lifted away from the functional material layer 111. As a result, there arises a problem that the capacitance of the capacitor varies depending on the type of the functional material layer.

A solder resist 115 containing a large amount of a glass component is sandwiched between the plating layer 116 and the upper surface electrode pattern 113 at both edges of the plating layer 116 in direct contact with the leaf spring 132. [ It is possible to protect the upper surface electrode pattern 113 by causing the gap between the solder resist 115 and the upper surface electrode pattern 113 to expand in one direction even when the leaf spring 132 operates like a lever.

In addition, the plating layer 116 is formed to cover both the upper surface electrode pattern 113 and the lower surface electrode pattern 112, so that the fixing strength can be improved.

5 is a cross-sectional view illustrating a composite filter according to another embodiment of the present invention.

Electrode patterns 212 and 213 are formed on the upper surface and the lower surface of the functional material layer 211 and electrically conductive metal leaf springs 230 are formed on the upper surface electrode pattern 213 via the solder 220 or the electrically conductive adhesive, Thereby forming the composite filter 200. [

The functional material layer 211 may be a dielectric polymer or a dielectric ceramic, as described above. In this embodiment, the ceramic chip is applied to the functional material layer 211.

The internal electrodes 216 and 217 are partially formed in the ceramic chip 211 and the internal electrodes 216 and 217 are electrically connected to the electrode patterns 214 and 215 through the via holes 214 and 215, 212, and 213, respectively.

The ceramic chip 211 may be a ceramic varistor or a ceramic capacitor and may have an electric shock prevention function by forming an air gap between the internal electrodes 216 and 217.

According to this structure, the gap between the internal electrodes 216 and 217 can be narrowed to increase the overall capacitance of the composite filter 200, and the thickness of the ceramic chip 211 can be secured to ensure a constant strength.

In other words, as described above, in order to increase the capacitance of the composite filter, it is necessary to reduce the distance between the electrodes. However, when the dielectric layer is a dielectric ceramic, there are many advantages. However, if the thickness is reduced, the dielectric layer is broken due to external impact. However, according to this embodiment, by applying the ceramic chip element as the dielectric layer, it is possible to sufficiently obtain the advantage of the dielectric ceramic as the dielectric layer while solving this problem.

On the other hand, the lower surface electrode pattern 212 of the ceramic chip 211 can be used for soldering to a circuit board or the like. However, the present invention is not limited to this, And can be adhered to the metal case.

6 (a) and 6 (b) each show a composite filter according to another embodiment of the present invention.

6A, the electrically conductive elastic member 330 constituting the composite filter 300 includes an elastic core 331 including rubber, an electrically conductive sheet 332 wrapped around the elastic core 331, ≪ / RTI >

Here, the electrically conductive sheet 332 may be an electrically conductive cloth, or an electrically conductive heat-resistant polymer film in which a metal layer is integrally formed on the back surface or a metal foil is adhered thereto. The polymer film can also be used as a dielectric, but the dielectric constant of the polymer film is smaller than the dielectric constant of the dielectric layer 320, which is not significant.

An electrically conductive or insulating rubber tube may be applied to the elastic core 331 to provide compression and resilient restoration of the composite filter 300 and the electrically conductive sheet 332 wrapping the elastic core 331 may be disposed on the electrode of the capacitor It is used as one.

6B, the elastic member 430 includes a core 431 having at least one through hole formed in the longitudinal direction thereof, and an electrically conductive rubber layer or polymer coating layer (not shown) formed by surrounding the outer surface of the core 431 432).

7 shows a composite filter according to another embodiment of the present invention.

Electrode patterns 512 and 513 are formed on the upper surface and the lower surface of the functional material layer 511 and are directly connected to the electrode patterns 512 and 513 to be electrically connected to each other inside the functional material layer 511, Internal electrodes 516 and 517 extending vertically in the vertical direction, and an electrostatic discharge unit 515 formed between the internal electrodes 516 and 517.

The electrostatic discharge portion 515 may be a layer of semiconductor material that provides an electrostatic discharge path and may be a gap (spaced-apart space) or discharge inducible.

A plurality of the electrostatic discharge units 515 may be formed and internal electrodes 516 and 517 corresponding to the respective electrostatic discharge units 515 may be formed.

The composite filter 500 can be mounted on the printed circuit board by surface mounting by vacuum pick-up and reflow soldering.

Also in this embodiment, as described above, the edges of the electrode patterns 512 and 513 are formed inward from the edge of the functional material layer 511 and have a pull back margin so that, when surface mounting is required, It is possible to prevent an electrical short between the electrode pattern 513 and the lower surface electrode pattern 512. [

The functional material layer 511 may be any one of dielectric materials having a dielectric constant, voltage and current, or semiconductor whose resistance is changed with respect to a temperature change. If the functional material layer 511 has an insulating property with respect to a certain voltage, It is possible to implement an electric shock protection function.

As described above, the blocking function of the functional material layer 511 with respect to the external power source can be managed by evaluating the withstand voltage characteristic per unit thickness of the functional material layer.

Since the internal electrodes 516 and 517 are formed perpendicular to the upper and lower electrode patterns 512 and 513 and the electrostatic discharge portion 515 is formed therebetween, The thickness can be secured.

Since the internal electrodes 516 and 517 are directly electrically connected to the upper and lower electrode patterns 512 and 513, a via hole for the intermediate electrode is formed and the metal paste is not required to be filled, As a result, the manufacturing process is simple and the manufacturing cost is reduced.

8 shows a composite filter according to another embodiment of the present invention.

The composite filter 600 includes electrode patterns 612 and 613 formed on the upper and lower surfaces of the functional material layer 611 and the functional material layer 611 and functional material layers 611 and electrode patterns 612 and 613 And a via hole 614 passing through the through hole 614. The plate spring which is bonded to the upper surface electrode pattern 613 via solder is omitted for convenience.

In this embodiment, the electrode patterns 612 and 613 at the edge of the via hole 614 are bent inward of the via hole 614 to extend the electrode tips tip 612a and 613a.

The via holes 614 can be formed by laser machining or die punching, and the electrode tips 612a and 613a can be formed by printing a liquid metal paste on the electrode patterns 612 and 613.

According to this structure, the electrode tips 612a and 613a extending inward of the via hole 614 formed in the functional material layer 611 have a structure in which the via holes 614 face each other vertically with a spacing space .

The static electricity is transferred from the electrode tip 613a of the upper surface electrode pattern 613 to the electrode tip 612a of the lower surface electrode pattern 612 while the static electricity is transmitted from the plate spring through the upper surface electrode pattern 613 And the via hole 614 provides a sort of discharge path.

It is important that the distance between the electrode tip 613a of the upper surface electrode pattern 613 and the electrode tip 612a of the lower surface electrode pattern 612 is formed to be equal to or smaller than the thickness of the functional material layer 611. [ The distance between the electrode tip 613a on the upper surface and the electrode tip 612a on the lower surface is a design condition for guiding the path of the electrostatic discharge to the via hole 614 on the inner side of the flat plate- It is preferable that the thickness is not more than 95% of the thickness.

8, the discharge path formed in the functional material layer 611 includes an internal discharge path Ain and an external discharge path Aout. In the above embodiment, since the internal discharge resistance is smaller than the external discharge resistance, An internal discharge is generated through the internal discharge path, so that a high electrostatic discharge immunity function can be provided.

Here, in addition to the method of reducing the internal discharge resistance, a method of increasing the external discharge resistance, for example, a pullback margin is secured, but there is a limit to the value of the pullback margin.

However, the external discharge resistance varies depending on the temperature, humidity, and usage environment, and is influenced by the peripheral components.

8, the external discharge resistance can be increased by the coating layer 640 covering the functional material layer 611 and the edges of the upper and lower surface electrode patterns 612 and 613.

That is, the coating layer 640 is formed at all of the exposed portions of the functional material layer 611 and the edges of the upper surface electrode pattern 613 and the lower surface electrode pattern 612 at a constant width, 613 and the lower surface electrode pattern 612 are exposed to the outside.

Here, the coating layer 640 may not be formed on the lower surface electrode pattern 612 in consideration of soldering.

According to this structure, since the external discharge resistance is increased by increasing the external discharge distance by the coating layer 640, the external discharge Aout is hard to occur and the internal discharge Ain can be more easily generated.

The coating layer 640 may be formed by, for example, dipping into an insulating glass paste, followed by heat treatment, but is not limited thereto.

The coating layer 640 is preferably an insulating layer, but is not limited thereto.

In this embodiment, the coating layer 640 is formed on the exposed portion of the functional material layer 611. However, if the efficiency of the manufacturing method can be secured, the coating layer 640 is not limited to the above structure, The same effect can be obtained even if the electrode pattern 613 is formed so as to cover only a certain width portion at the edge thereof.

In the above-described embodiments, the composite filter is used to remove static electricity, surge, or noise, which is interposed between the metal case and the circuit board and one of the objects is used as a ground. However, the present invention is not limited thereto. wearable devices, smart shoes, and the like.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or essential characteristics thereof. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100 to 600: Compound filter
110: Plate type device
112, 113: electrode pattern
120, 220: Solder
130, 230: leaf spring

Claims (18)

A functional material layer;
An electrode pattern formed on the upper surface and the lower surface of the material layer, respectively; And
Wherein the elastic member is electrically and mechanically coupled to the upper surface electrode pattern to serve as an electrode,
Wherein the elastic member is in direct contact with an opposing electrically conductive object to provide elasticity. In claim 1,
Wherein the electrode pattern is a metal foil, a plated electroconductive fiber, a polymer film having a metal layer formed on an outer surface thereof, or an electroconductive polymer coating layer. In claim 1,
Wherein the material layer is a dielectric ceramic formed by curing a dielectric polymer mixed with a high dielectric ceramic powder or a high dielectric ceramic powder. In claim 3,
Wherein the dielectric polymer is one of a silicone rubber, an epoxy resin, and a polyimide resin, and the dielectric ceramic is a ceramic capacitor or a ceramic varistor. In claim 1,
The elastic member
a) an elastic member comprising an elastic core including a foam and a rubber tube, and an electrically conductive cloth wrapped around the elastic core,
b) an elastic member composed of the elastic core and a metal layer or an electroconductive polymer coating layer formed by encapsulating the elastic core,
c) metal plate spring or metal coil spring, or
and d) an electrically conductive elastic rubber. In claim 1,
An inner electrode directly connected to each of the electrode patterns to electrically conduct and extending vertically in a vertical direction within the material layer; And
And an electrostatic discharge unit formed between the internal electrodes. In claim 6,
Wherein the electrostatic discharge portion includes a layer of semiconductor material capable of inducing a gap (space) or discharge. In claim 6,
A plurality of the electrostatic discharge units are formed,
And an internal electrode corresponding to each of the electrostatic discharge units is formed. In claim 1,
The edge of the electrode pattern is formed inwardly from an edge of the material layer and has a pull back margin,
And a via hole penetrating the material layer and the electrode pattern. In claim 9,
Wherein each electrode pattern is bent to the inside of the via hole at an edge of each of the openings of the via hole to extend an electrode tip. In claim 10,
Wherein the distance between the electrode tips is less than or equal to the thickness of the material layer. In claim 1,
Wherein a certain width portion at the edge of the upper surface electrode pattern is covered with an insulating coating layer. In claim 1,
Wherein an exposed portion of the material layer and a constant width portion at an edge of the upper surface electrode pattern are covered with an insulating coating layer. In claim 13,
Wherein the exposed portion includes an upper surface, a side surface and a lower surface of the material layer. In claim 1,
Further comprising an internal electrode electrically connected to each of the electrode patterns through a via hole and horizontally opposed to each other so that a part of the electrode pattern overlaps the inside of the material layer. In claim 15,
And an air gap is formed between the internal electrodes to provide an electric shock protection function. In claim 15,
Wherein the material layer is a ceramic chip comprising a ceramic capacitor and a ceramic varistor. In claim 1,
Wherein a solder resist is formed on both sides of the electrode pattern with a predetermined width and a plating layer is formed to cover the solder resist and the electrode pattern.

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