JP2011096601A - Contact member - Google Patents

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Publication number
JP2011096601A
JP2011096601A JP2009252109A JP2009252109A JP2011096601A JP 2011096601 A JP2011096601 A JP 2011096601A JP 2009252109 A JP2009252109 A JP 2009252109A JP 2009252109 A JP2009252109 A JP 2009252109A JP 2011096601 A JP2011096601 A JP 2011096601A
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JP
Japan
Prior art keywords
contact member
member
contact
base member
insulating layer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009252109A
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Japanese (ja)
Inventor
Tomohisa Kurita
智久 栗田
Original Assignee
Kitagawa Ind Co Ltd
北川工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Kitagawa Ind Co Ltd, 北川工業株式会社 filed Critical Kitagawa Ind Co Ltd
Priority to JP2009252109A priority Critical patent/JP2011096601A/en
Publication of JP2011096601A publication Critical patent/JP2011096601A/en
Application status is Pending legal-status Critical

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Abstract

PROBLEM TO BE SOLVED: To provide a contact member having a function of a capacitor.
A contact member includes a base member, an insulating layer, and a contact member. The base member 2 is formed by bending a copper alloy thin plate by press working or the like. The insulating layer 3 is a thin film formed on the surface of the base member 2 and is made of an epoxy resin, and insulates the base member 2 and the contact member 4. The contact member 4 is a thin film formed on the insulating layer 3 and is made of an Ni-coated ink paste on Ni and has conductivity. The insulating layer 3 and the contact member 4 are formed so as to cover the extending portion 2d and the protruding portion 2e of the base member 2. The contact member 1 configured as described above functions as a capacitor having the base member 2 and the contact member 4 as parallel electrode plates and the insulating layer 3 as a dielectric.
[Selection] Figure 1

Description

  The present invention relates to a contact member that is used by being mounted on a printed wiring board or the like on which a conductor pattern is formed, and that makes contact with two conductive members and electrically connects them.

Conventionally, the present applicant has already proposed a contact member (conductive member) described in Patent Document 1 below as this type of contact member.
The contact member described in Patent Document 1 can be surface-mounted on the mounting target surface of a printed wiring board using an automatic mounting machine. If such a contact member is used, for example, the printed wiring board side By electrically connecting the earth pattern and a part of the housing having the ground potential, noise countermeasures can be taken.

Japanese Patent No. 3425546

Conventionally, when a capacitor is used as a high-frequency filter or the like, it has been necessary to mount terminals at both ends on the same printed wiring board.
Incidentally, electronic devices are required to be miniaturized in order to reduce weight and save space. Therefore, the printed wiring board is also required to be downsized, and the board pattern is complicated. Therefore, there has been a problem that in the contact member, an element mounted on the printed wiring board is desired to be arranged other than the printed wiring board.

  This invention is made | formed in view of the subject mentioned above, The objective is to provide the contact member which has a function of a capacitor | condenser.

  In order to solve the above-mentioned problem, the invention according to claim 1 is a contact member that comes into contact with two conductive members, comprising a conductive thin plate, and a base that comes into contact with one of the conductive members. And a conductive contact member that contacts the other conductive member, and an insulating layer that insulates the base member and the contact member.

  In the contact member configured as described above, when the base member is in contact with one conductive member and the contact member is in contact with the other conductive member, the base member and the contact member are electrode plates, and the insulating layer is a dielectric. It becomes a capacitor. Thus, the contact member can function as a capacitor by conducting the two conductive members.

  By making the contact member function as a capacitor in this way, for example, the contact member can be used as a high-frequency filter, or can be used for suppressing the inflow of direct current.

  By the way, conventionally, a technique of connecting a substrate ground and a frame ground with a low-impedance member is often used in order to suppress EMC radiation. However, the connection may form a power supply loop particularly in a low frequency band in a small device.

  However, if the contact member according to claim 1 described above is used, since it has a function of a capacitor, the power supply loop can be cut in the low frequency band, and the low impedance connection can be made in the high frequency band.

  Conventionally, there is a case where the above-mentioned countermeasure is performed by connecting a contact member and a capacitor in series on the same substrate. However, according to the present invention, the above-mentioned countermeasure can be performed with one component. High density can be realized.

  Incidentally, the capacitance C of the capacitor includes the area S between the electrode plates (area of the region where the base member and the contact member overlap), the distance d between the electrode plates (thickness of the insulating layer), and the dielectric (insulating layer). Is determined as C = ε × (S / d). Therefore, the capacitance can be adjusted by adjusting them. In particular, since the overlapping area of the base member and the contact member can be changed relatively easily, the capacitance can be easily adjusted by adjusting them.

  Further, even if the contact of the base member or the contact member with the conductive member is a point contact or a line contact, the electrostatic capacity is not affected, so that the function of the capacitor can be stably exhibited.

  By the way, the base member described above can have various configurations as long as it is a thin plate having conductivity. For example, like the contact member according to claim 2, in the contact member according to claim 1, the base member may be configured as a bent metal thin plate.

  If it is a contact member comprised in this way, a base member will be able to perform sufficient elastic deformation. Therefore, by arranging the contact member and the two conductive members so that the contact member is sandwiched between the two conductive members, the contact member and the two conductive members can be reliably brought into contact by the elastic force of the contact member. Can do.

Moreover, you may use the thin plate manufactured with carbon or a carbon mixture as composition other than the said Claim 2.
According to a third aspect of the present invention, in the contact member according to the first or second aspect, the base member has a solder joint surface to be soldered to the one conductive member.

If it is a contact member comprised in this way, a base member can be fixed to an electroconductive member by soldering.
According to a fourth aspect of the present invention, in the contact member according to the third aspect, the solder joint surface includes a conductive region having conductivity and an insulating region, and the insulating region is the conductive member. The region is provided so as to be divided into two or more.

  In the case of a contact member configured in this way, when the contact member is soldered to the conductive member by a reflow process, the insulating region of the solder joint surface of the contact member is soldered in the same manner as the resist of the printed wiring board. Since it plays a repelling role, a self-alignment effect can be obtained. Thus, since the self-alignment effect can be obtained by the structure of the contact member, there is no need to change the board pad specification of the printed wiring board according to the contact member, which is convenient.

Side view showing contact member Contact member viewed from below Side view showing a state where printed wiring boards are connected to each other via contact members Side view showing a modified contact member

Embodiments of the present invention will be described below with reference to the drawings.
(1) Overall Configuration FIG. 1A shows a side sectional view of the contact member 1. FIG. 1B shows an enlarged view of a region surrounded by a broken line in the contact member 1 shown in FIG. These cross-sectional views are schematic, and the thickness is different from the actual one.

  The contact member 1 is fixed to a printed wiring board by soldering, and electrically contacts the printed wiring board with another printed wiring board or housing, and is a base member that is a first conductive layer 2, an insulating layer 3, and a contact member 4 that is a second conductive layer.

  The base member 2 is formed by bending a copper alloy thin plate by press working or the like. The base member 2 has a joint portion 2b having a solder joint surface 2a to be soldered to the printed wiring board, and approximately 90 degrees from the joint portion 2b. A bent portion 2c to be bent, an extended portion 2d extending from the bent portion 2c substantially parallel to the joint portion 2b, and a protruding portion 2e protruding from the extended portion 2d toward the opposite side of the joint portion 2b are formed. ing.

  FIG. 2 shows the contact member 1 viewed from the direction of arrow A in FIG. The solder joint surface 2a has a conductive region 2f having conductivity and an insulating region 2g covered with an epoxy resin film. The insulating region 2g is provided so as to divide the conductive region 2f into two regions along the direction in which the base member 2 extends.

  Returning to FIG. The insulating layer 3 is a thin film formed on the surface of the base member 2 and is made of an epoxy resin, and insulates the base member 2 and the contact member 4. This insulating layer 3 is formed on the base member 2 by coating or baking.

The contact member 4 is a thin film formed on the insulating layer 3 and is made of an Ni-coated ink paste on Ni and has conductivity.
The contact member 4 is formed on the insulating layer 3 by coating or the like.

The insulating layer 3 and the contact member 4 are formed so as to cover the extending portion 2d and the protruding portion 2e of the base member 2.
The contact member 1 configured as described above functions as a capacitor having the base member 2 and the contact member 4 as parallel electrode plates and the insulating layer 3 as a dielectric.

  A state in which the printed wiring boards are connected to each other through the contact member 1 is shown in FIG. The contact member 1 contacts the other printed wiring board 11 from the protruding portion 2e side (the upper side in FIG. 3) of the base member 2 in a state where the joint portion 2b is fixed to the printed wiring board 10 by solder. The member 1 is sandwiched between the printed wiring board 10 and another printed wiring board 11.

At this time, the bent portion 2c and the like of the base member 2 are compressed by the printed wiring board 11, and the extended portion 2d and the protruding portion 2e are elastically deformed toward the joint portion 2b. At that time, the contact member 4 covering the protruding portion 2e is surely brought into contact with the printed wiring board 11 by the elastic force of the base member 2. The base member 2 is in contact with the printed wiring board 10 by soldering, and the contact member 4 is in contact with the other printed wiring board 11.
(2) Effects of the Invention The contact member 1 configured as described above is a capacitor having the base member 2 and the contact member 4 as electrode plates and the insulating layer 3 as a dielectric. Therefore, when the printed wiring board 10 and the printed wiring board 11 are made conductive through the contact member 1, the contact member 1 functions as a capacitor, so that it can be used for high-frequency noise filter and suppression of inflow of direct current.

  Further, the capacitance of the capacitor in the contact member 1 is determined by the overlapping area of the base member 2 and the contact member 4, the thickness of the insulating layer 3, and the dielectric constant of the insulating layer 3. The electric capacity can be adjusted. In particular, since the overlapping area of the base member 2 and the contact member 4 can be changed relatively easily, the capacitance can be easily adjusted by adjusting them.

  Further, the capacitance described above is not affected by the contact state between the contact member 4 and the printed wiring board 11. Therefore, even if the contact between the contact member 4 and the printed wiring board 11 is a point contact or a line contact, the capacitance does not change, so that the function of the capacitor can be exhibited stably.

  Further, with the contact member 1 having the above-described configuration, the contact member 1 can be removed by removing the solder only on the printed wiring board 10 side. Therefore, it is not necessary to remove both of the two terminals as in the normal removal of the capacitor.

  Further, with the contact member 1 having the above-described configuration, a good self-alignment effect can be obtained when the contact member 1 is soldered to the printed wiring board 10 by a reflow process.

Conventionally, in order to efficiently achieve the self-alignment effect, it is necessary to change the shape of the substrate pad on the printed wiring board 10 in accordance with the shape of the bottom surface of the contact member 1. Therefore, when the contact member 1 is changed after the substrate pad is created, the substrate pad must be revised each time. However, since the insulating region 2g of the bottom surface of the contact member 1 plays a role of repelling solder in the same manner as the resist of the printed wiring board, a self-alignment effect can be obtained with a common pad shape without changing the substrate pad shape. it can.
(3) Modifications While the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and can take various forms as long as they belong to the technical scope of the present invention. Needless to say.

  For example, in the said Example, although the structure utilized for contact member 1 for the inflow suppression of the high frequency noise filter at the time of electrically connecting printed wiring boards and a direct current, it is other usage methods. Also good. For example, it may be connected so as to be electrically connected to a conductive substance such as a printed wiring board and a housing, or a printed wiring board and a heat sink.

  Moreover, the shape of the contact member 1 is not limited to what was mentioned above. For example, like the contact member 21 shown in FIGS. 4A and 4B, the contact member 4 may be formed so as to be in contact with the printed wiring board 11 by changing the bending method.

  Moreover, in the said contact member 1, although the structure which uses a copper alloy was illustrated as the base member 2, as long as it has electroconductivity, you may use another material. For example, a thin plate formed of a metal other than copper may be used, or the thin plate may be formed of a conductive material such as carbon.

  Moreover, although the structure which uses an epoxy resin as the said insulating layer 3 was illustrated, you may comprise using a material other than that. Specific examples include polyester resins, PES resins, epoxy + fluorine resins, and polyether resins.

  The insulating layer 3 is preferably made of a material having an insulating property and a high dielectric constant. In addition, after the insulating layer 3 is formed on the base member 2, when the base member 2 is bent by pressing, it is preferable to use a material that can follow the pressing.

  Moreover, although the structure which uses the ink paste of Ag coating for Ni was illustrated as the said contact member 4, you may use materials other than that. For example, it is possible to use Sn paste, Au paste, or the like.

DESCRIPTION OF SYMBOLS 1 ... Contact member, 2 ... Base member, 2a ... Solder joint surface, 2b ... Joint part, 2c ... Bending part, 2d ... Extension part, 2e ... Projection part, 2f ... Conductive area, 2g ... Insulation area, 3 ... Insulation Layer, 4 ... contact member, 10, 11 ... printed wiring board, 21 ... contact member

Claims (4)

  1. A contact member that contacts two conductive members,
    A base member made of a conductive thin plate and in contact with one of the conductive members;
    A conductive contact member in contact with the other conductive member;
    An insulating layer that insulates the base member and the contact member.
  2. The contact member according to claim 1, wherein the base member is a bent metal thin plate.
  3. The contact member according to claim 1, wherein the base member has a solder joint surface soldered to the one conductive member.
  4. The solder joint surface includes a conductive region having conductivity and an insulating region, and the insulating region is provided so as to divide the conductive region into two or more. The contact member according to claim 3.
JP2009252109A 2009-11-02 2009-11-02 Contact member Pending JP2011096601A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009252109A JP2011096601A (en) 2009-11-02 2009-11-02 Contact member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009252109A JP2011096601A (en) 2009-11-02 2009-11-02 Contact member

Publications (1)

Publication Number Publication Date
JP2011096601A true JP2011096601A (en) 2011-05-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009252109A Pending JP2011096601A (en) 2009-11-02 2009-11-02 Contact member

Country Status (1)

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JP (1) JP2011096601A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015501524A (en) * 2011-11-02 2015-01-15 タイコ・エレクトロニクス・コーポレイションTyco Electronics Corporation Capacitors
EP3128607A1 (en) * 2015-08-04 2017-02-08 Samsung Electronics Co., Ltd. Antenna for device
KR101743989B1 (en) * 2015-10-23 2017-06-07 조인셋 주식회사 Elastic composite filter

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015501524A (en) * 2011-11-02 2015-01-15 タイコ・エレクトロニクス・コーポレイションTyco Electronics Corporation Capacitors
EP3128607A1 (en) * 2015-08-04 2017-02-08 Samsung Electronics Co., Ltd. Antenna for device
CN106450652A (en) * 2015-08-04 2017-02-22 三星电子株式会社 Antenna for device
US10218054B2 (en) 2015-08-04 2019-02-26 Samsung Electronics Co., Ltd. Antenna for device
KR101743989B1 (en) * 2015-10-23 2017-06-07 조인셋 주식회사 Elastic composite filter

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