WO2019013608A1 - Functional contactor - Google Patents

Abstract

A functional contactor is provided. A functional contactor according to one embodiment of the present invention comprises: a first element having a lower surface formed by a long side and a short side, contacting a conductor of an electronic device, and having elasticity in the vertical direction; a second element having an upper surface larger than the lower surface of the first element, and disposed at a lower portion of the first element so as to include a first area corresponding to the lower surface of the first element and a second area surrounding the first area; and a conductive bonding member interposed between the first element and the second element to electrically connect the first element and the second element, wherein the conductive bonding member is configured to include a first conductive part corresponding to the lower surface of the first element and a second conductive part extending from the first conductive part and surrounding the first element by forming an inclined surface connecting a portion of a side surface of the first element and a portion of an upper portion of the second area so as to improve the lateral strength. According to this, the functional contactor of the present invention comprises the conductive bonding member including a specific polymer compound such that the conductivity is excellent and the bonding strength between elements and the lateral strength may be increased, thereby being capable of improving the reliability of products.

Description

Functional Contactor

The present invention relates to a contactor, and more particularly to a functional contactor.

In recent portable electronic devices, there is an increasing tendency to adopt a metal housing to improve esthetics and robustness. Such a portable electronic device alleviates an external impact and at the same time reduces electromagnetic waves leaking from or leaking into the portable electronic device and is also excellent in electrical conductivity such as a conductive gasket or a conductive contactor for electrical contact between an antenna disposed in an external housing and an internal circuit board The elastic part is used.

However, when static electricity having an instantaneous high voltage flows through a conductor such as an outer metal housing, static electricity flows into the built-in circuit board through the conductive elastic part to break a circuit such as an IC, If the leakage current is transmitted to the external housing along the ground of the circuit to cause discomfort to the user or severe, it may cause an electric shock which may cause injury to the user.

A functional element for protecting the user from such static electricity or leakage current is provided together with a conductive gasket or a conductive contactor for connecting the metal housing and the circuit board, There is a need for a functional contactor having various functions for protecting a circuit in a portable electronic device or for smoothly transmitting a communication signal.

Further, the functional contactor laminated the elastic portion to the electrode of the element by soldering. At this time, since the elastic portion has to be heightened due to the available range, more external impact acts on the longer side, The bonding strength and / or the lateral strength between the elements is reduced, and thus a large amount of product defects occur as the conductive elastic additional functional elements are separated from each other.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a functional contactor which is excellent in conductivity and can increase the bonding strength between devices by including a specific conductive bonding member.

According to an aspect of the present invention, there is provided an electronic device comprising: a first element made of a long side and a short side and contacting with a conductor of an electronic device and having elasticity in a vertical direction; A second element disposed on a lower portion of the first element to include a first region having an upper surface larger than a lower surface of the first element and corresponding to a lower surface of the first element and a second region surrounding the first region; And

And a conductive bonding member interposed between the first element and the second element to electrically connect the first element and the second element, wherein the conductive bonding material has a first conductive portion corresponding to a lower surface of the first element, And a second conductive portion extending from the first conductive portion and forming an inclined surface extending from a portion of the side of the first element to a portion of the upper portion of the second region for improving the lateral strength and surrounding the first element Functional contactor.

According to an embodiment of the present invention, the conductive joint material comprises a first portion formed on an inclined surface of the second conductive portion, a second portion extending to the first portion and covering a side portion of the first element, And a third portion extending to a portion of the first region of the first element and covering a portion of the upper portion of the second region of the second element.

Further, the coating layer may include a polymer compound.

The coating layer may have a thickness of 10 to 100 mu m.

The height of the second conductive portion may be 0.01% or more with respect to the height of the first element.

The height of the second conductive portion and the width of the second conductive portion may be 1: 0.1 to 0.5 in length ratio.

In addition, the conductive bonding material may be formed by curing a composition including an alloy powder, a main resin, a curing agent, a reducing agent, and a curing catalyst.

The main resin may include at least one selected from the group consisting of a bisphenol-based epoxy, a novolac-based epoxy, an aliphatic epoxy, and a glycidylamine-based epoxy.

In addition, the composition may include the alloy powder in an amount of 550 to 800 parts by weight based on 100 parts by weight of the main resin.

The alloy powder may be at least one selected from the group consisting of Pb-Sn, Pb-free Sn-Ag-Cu, Sn-Ag, Sn-Cu, Sn-Bi, Sn-Bi- Based alloy and a Sn-Ag-Cu-Bi based alloy.

The second element may include a first electrode on at least a part of an upper surface and a second electrode at at least a part of a lower surface.

The first element may further include: a clip-shaped contact portion that contacts a conductor of the electronic device; A bending portion having a predetermined curvature to impart an elastic force; And a terminal portion contacting the first electrode of the second element.

The first element may be any one of a conductive gasket, a silicone rubber pad, and a C-clip.

Further, the first element can be plated with metal on the lower surface and a part of the side surface.

According to another aspect of the present invention, there is provided an electronic device comprising: a first element made of a bottom surface having a long side and a short side and contacting with a conductor of an electronic device and having elasticity in a vertical direction; A second element disposed on a lower portion of the first element to include a first region having an upper surface larger than a lower surface of the first element and corresponding to a lower surface of the first element and a second region surrounding the first region; And a first conductive bonding member interposed between the first element and the second element to electrically connect the first element and the second element; A reinforcing member disposed at a lower portion of the second element; And a second conductive bonding member interposed between the second element and the reinforcing member for electrically connecting the second element and the reinforcing member, wherein the first conductive bonding material has a first conductive bonding material And a second conductive layer surrounding the first element to form an inclined surface extending from the first conductive portion and connecting a portion of the side surface of the first element to a portion of the upper portion of the second region for improving the lateral strength, A functional contactor comprising:

The functional contactor of the present invention includes the conductive bonding member including the specific polymer compound, so that the bonding strength and lateral strength between the devices can be increased and the reliability of the product can be improved.

1 is a perspective view of a functional contactor according to an embodiment of the present invention,

Fig. 2 is a side view of Fig. 1,

Fig. 3 is a front view of Fig. 1,

FIG. 4 is a cross-sectional view taken along a line X-X 'in FIG. 1 according to an embodiment of the present invention,

5 is a cross-sectional view taken along a line X-X 'in FIG. 1 according to another embodiment of the present invention;

6 is a perspective view showing another example of the first element in the functional contactor according to the embodiment of the present invention,

7 is a perspective view illustrating a functional contactor according to another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.

The functional contactor 100 according to an embodiment of the present invention includes a first element 110, a second element 120, and a conductive bonding member 130, as shown in FIGS.

Such a functional contactor 100 is for electrically connecting a conductive case such as an external metal case to a circuit board or a conductive bracket electrically coupled to a circuit board on one side in a portable electronic device.

At this time, the functional contactor 100 may be configured such that the first element 110 contacts the circuit board or the conductive bracket and the second element 120 can be coupled to the conductive case, And the second element 120 may be coupled to the circuit board.

For example, if the functional contactor 100 is of the SMT type, i.e., coupled through soldering, the second element 120 is coupled to the circuit board, and if it is an adhesive layer type, The second element 120 may be coupled to the conductive case.

Meanwhile, the portable electronic device may be a portable terminal such as a smart phone, a cellular phone, and the like, and may be a smart watch, a digital camera, a DMB, an electronic book, a netbook, a tablet PC, Such electronic devices may comprise any suitable electronic components including antenna structures for communication with external devices.

Here, the conductive case may be an antenna for communication between the portable electronic device and an external device. Such a conductive case may be provided, for example, to partially surround or partially surround the sides of the portable electronic device.

First, the first element 110 will be described.

The first element 110 is in electrical contact with the conductor of the electronic device and has an elastic force in the vertical direction. In one example, the first element 110 may be in electrical contact with any one of a body-accessible conductor, such as a circuit board of an electronic device, a bracket coupled to a circuit board, and a case.

Here, when the first element 110 contacts the conductor, the first element 110 can be contracted toward the second element 120 by the pressing force, and when the conductor is separated, It can be restored to its original state by the elastic force.

On the other hand, when the first element 110 is pressed, galvanic corrosion occurs due to a potential difference between dissimilar metals. At this time, in order to minimize galvanic corrosion, it is preferable that the contact area of the first element 110 is reduced.

One side of the first element 110 is in contact with the conductor of the electronic device and the other side of the first element 110 is electrically connected to the second element 120. The lower side of the first element 110 is formed of the long side 115a and the short side 115b. That is, the first element 110 may have a rectangular shape whose longer side is longer than the length of the other side.

1, the first element 110 may include a contact portion 111, a bent portion 112, a spacing portion 113, an external portion 114, and a terminal portion 115.

Here, the first element 110 may be any one of a conductive gasket, a silicone rubber pad, and a C-clip, and may preferably be a C-clip having a " C " shape. Since the first element 110 is in line contact or point contact, galvanic corrosion resistance can be excellent.

The contact portion 111 has a clip-like curved shape and can be in electrical contact with the conductor of the electronic device. The contact portion 111 may be disposed in the opening 114b provided on one side of the upper surface 114a of the covering portion 114 so that the curved portion protrudes outside the opening 114b.

The bending portion 112 extends in a round shape from the contact portion 111 and may have an elastic force. That is, the bent portion 112 may have a constant curvature to impart an elastic force. One end of the bent portion 112 may be connected to the contact portion 111 at the inner side of the first element 110 and the other end may be connected to the upper surface 114a between the outer portions 114.

The spacing portion 113 is a space formed between the lower end of the bent portion 112 and the side wall 114c of the covering portion 114. [ The bending portion 112 may be spaced apart from the terminal portion 115 by a predetermined distance. That is, the spacing portion 113 separates the bent portion 112 from the terminal portion 115 so as not to constrain the bent portion 112 that provides the elastic force. As a result, the elastic force of the contact portion 111 and the bent portion 112 may not be affected by the terminal portion 115.

The enclosure 114 includes an upper surface 114a, an opening 114b, and a side wall 114c. The upper surface 114a of the covering part 114 is connected to the bent part 112 and the side wall 114c and the contact part 111 is disposed inwardly from the inside of the opening part 114b. The opening 114b forms a space through which the contact portion 111 flows according to the elastic force of the bent portion 112. [

The side wall 114c extends vertically from the terminal portion 115 at the long side 115a. The side wall 114c may extend to the short side 115b where the bent portion 112 is not formed.

As a result, the external portion 114 can be formed in a case shape that surrounds the end portions of the contact portion 111 and the bent portion 112 from the outside so that the ends of the contact portion 111 and the bent portion 112 are not exposed to the outside .

In this way, the first element 110 can suppress the influence of external elements such as a latch by an operator.

The terminal portion 115 may correspond to a lower surface of the first element 110 and may be formed to be connected to a lower side of the external portion 114. The terminal portion 115 may be a terminal that contacts the first electrode 121 of the second element 120 and is electrically connected to the second element 120.

The contact portion 111, the bent portion 112, the external portion 114, and the terminal portion 115 may be integrally formed of a conductive material having an elastic force.

Meanwhile, as shown in FIG. 6, the functional contactor according to the embodiment of the present invention may include a first element 210 in which the spacing part is omitted. The description of the same parts as those of the first element 110 described with reference to FIG. 1 will be omitted.

6, the first element 210 may include a contact portion 211, a bent portion 212, a side wall 214, and a terminal portion 215.

This first element 210 may be a C-clip of approximately " C " shape.

The contact portion 211 has a clip-like curved shape and can be in electrical contact with the conductor of the electronic device. The contact portion 211 may be arranged to protrude outward between the side walls 214. [

The bent portion 212 extends in a round shape from the contact portion 211 and can have an elastic force. That is, the bent portion 212 may have a predetermined curvature to impart an elastic force. Here, the bent portion 212 may extend from the terminal portion 215. That is, the bent portion 212 may be disposed between the contact portion 211 and the terminal portion 215.

The side wall 214 extends vertically from the terminal portion 215 at the long side 215a. This side wall may extend to a portion 214a of the short side 215b where the bent portion 212 is not formed. That is, in the side wall 214, only a part 214a is formed on both sides of the short side 215b on which the bent part 212 is not formed, and a space is formed therebetween. At this time, in the space between the portions 214a of the side wall 214, the contact portion 211 can flow by the elastic force of the bent portion 212. [

In this way, the first element 210 can suppress the influence of external elements such as a latch by an operator.

The terminal portion 215 may correspond to the lower surface of the first element 210 and may be formed to be connected to the lower side of the side wall 214. The terminal portion 215 may be a terminal that is in contact with the first electrode of the second element and is electrically connected to the second element.

On the other hand, the first element 110 may be plated with metal on the lower surface and a part of the side surface. As a result, since the conductive bonding member 130 described later can be formed to cover a part of the side surface of the first element 110, not only the area of the conductive bonding member 130 can be increased, The bonding strength between the first element 110 and the second element 120 at the long side 115a and the lateral strength at the short side 115a can be further improved because the conductive bonding member 130 is formed with a certain thickness from the bonding portion between the two elements 120. [ Can be improved. Here, the metal plated on the lower surface and the side surface of the first element 110 may be Sn.

Next, the second element 120 will be described.

The second element 120 is disposed under the first element 110 and is electrically connected to the first element 110. The upper surface of the second element 120 is larger than the lower surface of the first element 110, And a second region 121b surrounding the first region 121a. The first region 121a corresponds to the lower surface of the first element 110 and the second region 121b surrounds the first region 121a.

A first region 121a corresponding to a lower surface of the first element 110 and a second region 121b surrounding the first region 121a may be formed on the lower surface of the conductive connecting member 130, 1 element 110 and a part of the upper surface of the second region 121b so as to improve the bonding strength and lateral strength between the first element 110 and the second element 120 The reliability of the product can be further improved.

The first electrode 121 may be provided on at least a part of the upper surface of the second element 120, or the second electrode 122 may be provided on at least a part of the lower surface of the second element 120.

For example, each of the first electrode 121 and the second electrode 122 may be provided on a top surface and a bottom surface of the second element 120, respectively. That is, the body between the first electrode 121 and the second electrode 122 may protrude outward from the first electrode 121 and the second electrode 122 in the second element 120. [

As another example, the first electrode 121 and the second electrode 122 may be formed to have a large area in order to increase the capacity of the capacitance. That is, the first electrode 121 and the second electrode 122 may be formed on the upper surface and the lower surface of the second element 120, respectively.

The first electrode 121 is laminated to the first element 110 through a conductive bonding member 130 to be described later and the second electrode 122 is bonded to the circuit board through soldering or through a conductive bonding member It can be coupled to a conductor such as a conductive case.

Meanwhile, the first device 110 and the second device 120 described above may have a function for protecting a user or an internal circuit, and may be used without limitations in the case of known circuit components included in an electronic device . For example, the first and second devices 110 and 120 may each independently comprise a varistor, a suppressor, a capacitor, a common module filter, an inductor, a PTC, a diode, a Power semiconductor ), A surface acoustic wave filter (SAW filter), and a dielectric filter.

That is, the second device 120 can block the leakage current of the external power source flowing into the conductor from the ground of the circuit board. At this time, the second element 120 may be configured such that its breakdown voltage (Vbr) or breakdown voltage is higher than the rated voltage of the external power supply of the electronic device. Here, the rated voltage may be a standard rated voltage for each country, for example, 240V, 110V, 220V, 120V and 100V.

In addition, when the conductive case has an antenna function, the first electrode 121 and the second electrode 122 provided on the top and bottom surfaces of the second element 120 function as a capacitor, It is possible to pass a communication signal coming from a conductor or a circuit board.

Further, the second element 120 can pass the static electricity (ESD) flowing from the conductive case without being broken. At this time, the breakdown voltage Vbr of the second element 120 may be smaller than the breakdown voltage Vcp of the element disposed between the first electrode 121 and the second electrode 122.

Therefore, the functional contactor 100 electrically connects the conductive case and the circuit board with respect to a communication signal, an electrostatic discharge (ESD), and the like, and passes the leakage current of the external power source from the circuit board to the conductive case .

Next, the conductive bonding member 130 will be described.

The conductive bonding member 130 is interposed between the first element 110 and the second element 120 to electrically connect the first element 110 and the second element 120.

The conductive bonding member 130 is formed by applying the conductive bonding member composition to the first electrode 121 and then placing the first element 110 on the conductive bonding member composition in the process of forming the conductive bonding member 130 The melted conductive bonding member composition is fused to the lower surface and the side surface of the first element 110 and the first electrode 121 of the second element 120 to form the first element 110 and the second element 120, (Not shown).

At this time, the bonding strength and side strength between the first element 110 and the second element 120 are different from each other in the short side 115b having a shorter length and the longer side 115a having a longer length. That is, the first element 110 may have an external impact through a wider area at the long side 115a than the short side 115b.

Therefore, since the first element 110 is vulnerable to an external shock to the long side 115a side compared to the short side 115b, the first element 110 is separated from the second element 120 in a large amount, so that the first element 110 is required to be supplemented .

4, the conductive bonding member 130 includes a first conductive portion 130a corresponding to the lower surface of the first element 110 and a second conductive portion 130b corresponding to the first conductive portion 130a. A second conductive portion 130b that extends from the conductive portion 130a and surrounds the first element 110 by forming an inclined surface connecting a portion of the side surface of the first element 110 and the upper portion of the second region 121b, ).

The conductive bonding member 130 connecting the first element 110 and the second element 120 is formed so as to extend from the first conductive portion 130a and to cover the side surface of the first element 110 And the second conductive portion 130b surrounding the first element 110 forms an inclined surface connecting a portion of the first element 110 and the upper portion of the second region 121b to the long side 115a of the first element 110, The bonding strength and the lateral strength can be increased. Therefore, the first element 110 can be prevented from being separated from the second element 120 due to an external impact to the long side 115a, thereby improving the reliability of the product.

The height of the second conductive portion 130b may be 0.01% or more, preferably 0.02-0.05% of the height of the first element 110. If the height of the second conductive portion 130b is less than 0.01% with respect to the height of the first element 110, a desired level of bonding strength and lateral strength may not be exhibited.

The height ratio of the second conductive portion 130b and the width of the second conductive portion 130b may be 1: 0.1 to 0.5, preferably 1: 0.2 to 0.4. If the length ratio of the height and width of the second conductive part 130b is out of the above range, the bonding strength and the side strength may be lowered. It is obvious that the width of the second conductive portion 130b is smaller than the width of the second region 121b.

Meanwhile, the conductive bonding member 130 may be formed by curing a composition including an alloy powder, a main resin, a curing agent, a reducing agent, and a curing catalyst.

First, the main resin may be any resin that can be used in the art to form a bonding member, and epoxy resin may be preferably used. For example, the epoxy resin may include at least one selected from the group consisting of a bisphenol-based epoxy, a novolak-based epoxy, an aliphatic epoxy, and a glycidylamine-based epoxy, and preferably includes a bisphenol- And more preferably bisphenol-F type epoxy.

The alloy powder may be any alloy powder that can be included in a bonding member capable of electrical connection between elements in the art, and an alloy of two or more elements may be preferably used. For example, the alloy powder may be at least one selected from the group consisting of Pb-Sn, Pb-free Sn-Ag-Cu, Sn-Ag, Sn-Cu, Sn-Bi, Sn- In-based alloy and Sn-Ag-Cu-Bi based alloy.

The alloy powder may be contained in an amount of 550 to 800 parts by weight, preferably 600 to 750 parts by weight, based on 100 parts by weight of the main resin. If the amount of the alloy powder is less than 550 parts by weight with respect to 100 parts by weight of the main resin, the conductivity of the functional contactor may deteriorate. If the amount of the alloy powder exceeds 800 parts by weight, the lateral strength and bonding strength of the functional contactor may be lowered .

The curing agent is not particularly limited as long as it can be used as a curing agent in the art, and preferably an amine curing agent, a phenol curing agent, a thiol curing agent, or the like can be used. The reducing agent is not particularly limited as long as it can be used as a reducing agent in the art, and preferable examples thereof include oxalic acid, malonic acid, glutaric acid, adipic acid, pimelic acid, Sebacic acid, etc. may be used.

The curing catalyst may be any material that can be used as a curing catalyst in the art, and may be a basic nitrogen compound. In one example, the basic nitrogen compound may be an imidazole compound.

5, the conductive bonding member 130 includes a first portion 140a formed on an inclined surface of the second conductive portion 130b, a first portion 140b extending from the first portion 140a, A second portion 140b that covers a portion of a side surface of the device 110 and a third portion 140c that extends to the first portion 140a and covers a portion of the upper portion of the second region 121b of the second device 120. [ (Not shown).

The bonding strength to the long side 115a of the first element 110 and the bonding strength to the side surface 115a of the first element 110 can be further improved by further including the coating layer 140 including the first part 140a, the second part 140b and the third part 140c. It is possible to further increase the strength and thus to prevent the first element 110 from being separated from the second element 120 due to an external impact against the long side 115a, and thus the reliability of the product can be remarkably improved.

The coating layer 140 may include a polymer compound, and preferably a coating layer 140 formed by curing epoxy. As a result, the bonding strength and lateral strength with respect to the long side 115a of the first element 110 can be further increased.

The coating layer 140 may have a thickness of 10 to 100 탆, preferably 20 to 90 탆. If the thickness of the coating layer 140 is less than 10 mu m, the bonding strength and lateral strength can not be improved to a desired level. If the thickness exceeds 100 mu m, Can be degraded.

7, the functional contactor 100 according to another embodiment of the present invention includes a first element 110, a second element 120, and a first conductive bonding member 130 And a second conductive bonding member 131 and a reinforcing member 150 below the second element 120.

The second conductive bonding member 131 may be a conductive bonding material having the same shape and formed of the same composition as the first conductive bonding member 130. Accordingly, the description of the first element 110, the second element 120, the first conductive bonding member 130, and the second conductive bonding member 131 will be omitted in the description of the first element, the second element, And the description thereof will be omitted.

The second element 120 and the reinforcing member 150 may be connected to each other through the second conductive bonding member 131 and electrically connected to each other.

The reinforcing member 150 can be used without limitation as long as it can be used as a reinforcing member in the art. Since the shape of the reinforcing member 150 may vary depending on the application to which the functional contactor 100 is applied, the shape of the reinforcing member 150 is not limited in the present invention. For example, the reinforcing member 150 ) May have a circular, oval, rectangular or square bottom surface.

The present invention will now be described more specifically with reference to the following examples. However, the following examples should not be construed as limiting the scope of the present invention, and should be construed to facilitate understanding of the present invention.

≪ Example 1 >

First, in order to prepare a composition for forming a conductive bonding member, Pb-Pb alloy containing Sn, Ag and Cu in a weight ratio of 1: 0.03: 0.005 as an alloy powder to 100 parts by weight of a bisphenol-F type epoxy resin as a main resin, free Sn-Ag-Cu alloy powder was mixed in 679.2 parts by weight to prepare a composition. At this time, the composition further contains an amine-based curing agent as a curing agent, an imidazole compound as a curing catalyst, and oxalic acid as a reducing agent.

Then, Sn was plated on the lower surface of a first element (CS-077B, cooperative connector) having a long side x short side x height of 2.5 mm x 1.3 mm x 3.2 mm, The composition was interposed between the first element and the second element (electric shock protection element, Amotech), and then electrically bonded using a reflow soldering apparatus (BK-350S, Regenia) to produce a functional contactor. At this time, the height of the second conductive portion of the conductive bonding member provided in the prepared functional contactor was 0.096 mm (96 m), which was 0.03% with respect to the height of the first element, and the width of the second conductive portion was 0.0288 mm ), And a length ratio of height and width was 1: 0.3. On the inclined surface, a coating layer having a thickness of 50 占 퐉 containing an epoxy compound was formed.

≪ Examples 2 to 17 >

The thickness of the second conductive portion, the width of the second conductive portion, the content of the alloy powder, the thickness of the coating layer, and the thickness of the main resin layer were measured in the same manner as in Example 1, Type and the like were changed to produce a functional contactor as shown in Tables 1 to 3.

<Experimental Example>

The following physical properties of each of the functional contactors prepared according to the examples were evaluated and shown in Tables 1 to 3.

1. Evaluation of bonding strength

For each functional contactor manufactured in the example, each functional contactor was fixed on the floor and then the first device was pulled in the vertical direction through a tensile tester (BMSHIGO-V1.3, BMSTech) Was evaluated.

2. Evaluation of side strength

For each functional contactor manufactured in the example, each functional contactor was fixed on the floor and then the lower end of the first element was pushed in the lateral direction through a tensile tester (Series 4000, Dage) The strength was evaluated.

3. Conductivity evaluation

For each of the functional contactors manufactured in the examples, each functional contactor was fixed on the floor, and the lower end of the second element of the conductivity evaluation device (IM3523, Hioki) and the upper end of the first element were connected to the measurement, To evaluate the conductivity.

division			Example 1	Example 2	Example 3	Example 4	Example 5
Composition	Theme balance	Kinds	Bisphenol-F type epoxy	Bisphenol-F type epoxy	Bisphenol-F type epoxy	Bisphenol-F type epoxy	Bisphenol-F type epoxy
	Alloy powder	Content (parts by weight)	679.2	679.2	679.2	679.2	679.2
Conductive bonding member	Coating layer	Thickness (㎛)	50	50	50	50	50
	The second conductive portion	Height ratio (%) for the first element	0.03	0.005	0.02	0.05	0.03
		Height and width Length ratio	1: 0.3	1: 0.3	1: 0.3	1: 0.3	0.05
The first element	Whether bottom plating		○	○	○	○	○
Functional Contactor		Bond strength (kgf)	13.1	8.1	12.7	13.7	11.1
		Side strength (kgf)	11.8	5.9	11.4	12.5	5.6
		Conductive (CP)	58	57	58	58	57

division			Example 6	Example 7	Example 8	Example 9	Example 10	Example 11
Composition	Theme balance	Kinds	Bisphenol-F type epoxy	Bisphenol-F type epoxy	Bisphenol-F type epoxy	Bisphenol-F type epoxy	Bisphenol-F type epoxy	Bisphenol-F type epoxy
	Alloy powder	Content (parts by weight)	679.2	679.2	679.2	679.2	679.2	500
Conductive bonding member	Coating layer	Thickness (㎛)	50	50	50	5	120	50
	The second conductive portion	Height ratio (%) for the first element	0.03	0.03	0.005	0.03	0.03	0.03
		Height and width Length ratio	0.2	0.4	0.7	1: 0.3	1: 0.3	1: 0.3
The first element	Whether bottom plating		○	○	○	○	○	○
Functional Contactor		Bond strength (kgf)	12.8	13.4	8.2	8.2	7.9	13.2
		Side strength (kgf)	11.3	11.4	6.9	7.7	7.8	12.1
		Conductive (CP)	58	59	59	58	57	41

division			Example 12	Example 13	Example 14	Example 15	Example 16	Example 17
Composition	Theme balance	Kinds	Bisphenol-F type epoxy	Bisphenol-F type epoxy	Bisphenol-F type epoxy	Bisphenol-F type epoxy	Bisphenol-A type epoxy	-
	Alloy powder	Content (parts by weight)	600	750	850	679.2	679.2	679.2
Conductive bonding member	Coating layer	Thickness (㎛)	50	50	50	50	50	-
	The second conductive portion	Height ratio (%) for the first element	0.03	0.03	0.03	0.002	0.03	0.03
		Height and width Length ratio	1: 0.3	1: 0.3	1: 0.3	1: 0.4	1: 0.3	1: 0.3
The first element	Whether bottom plating		○	○	○	×	○	○
Functional Contactor		Bond strength (kgf)	13.1	12.7	9.2	6.3	12.9	5.1
		Side strength (kgf)	11.5	11.1	6.5	5.1	11.5	4.0
		Conductive (CP)	57	59	66	58	58	58
1) Example 17 shows that an alloy powder of the same kind and weight as in Example 1 was used without the main resin.

As can be seen from Tables 1 to 3, whether or not a part of the sides extending from the lower surface and the lower surface according to the present invention is plated, the height of the second conductive portion, the width of the second conductive portion, the content of the alloy powder, Examples 1, 3, 4, 6, 7, 12, 13, and 16 satisfying all of the above-mentioned conditions, Side strength and conductivity were both excellent at the same time.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (15)

1. A first element made of a lower surface having a long side and a short side and contacting with a conductor of the electronic device and having elasticity in a vertical direction;

   A second element disposed on a lower portion of the first element to include a first region having an upper surface larger than a lower surface of the first element and corresponding to a lower surface of the first element and a second region surrounding the first region; And

   And a conductive bonding member interposed between the first element and the second element to electrically connect the first element and the second element,

   The conductive joint material includes a first conductive portion corresponding to a lower surface of the first element and a second conductive portion extending from the first conductive portion for improving lateral strength and having a portion of a side surface of the first element and a portion of an upper portion of the second region And a second conductive portion forming a tapered inclined surface to surround the first element.
2. The method according to claim 1,

   The conductive joint material

   A first portion formed on an inclined surface of the second conductive portion,

   A second portion extending from the first portion to cover a portion of a side surface of the first element and

   And a third portion extending from the first portion and covering a portion of the upper portion of the second region of the second element.
3. 3. The method of claim 2,

   Wherein the coating layer comprises a polymer compound.
4. 3. The method of claim 2,

   Wherein the coating layer has a thickness of 10 to 100 占 퐉.
5. The method according to claim 1,

   Wherein the height of the second conductive portion is 0.01% or more with respect to the height of the first element.
6. The method according to claim 1,

   Wherein the height of the second conductive portion and the width of the second conductive portion have a length ratio of 1: 0.1 to 0.5.
7. The method according to claim 1,

   The conductive contact material is formed by curing a composition comprising an alloy powder, a main resin, a curing agent, a reducing agent, and a curing catalyst.
8. 8. The method of claim 7,

   Wherein the main resin comprises at least one member selected from the group consisting of a bisphenol-based epoxy, a novolac-based epoxy, an aliphatic epoxy, and a glycidylamine-based epoxy.
9. 8. The method of claim 7,

   Wherein the composition comprises 550 to 800 parts by weight of the alloy powder relative to 100 parts by weight of the main resin.
10. 8. The method of claim 7,

    The alloy powder may be at least one selected from the group consisting of Pb-Sn, Pb-free Sn-Ag-Cu, Sn-Ag, Sn-Cu, Sn-Bi, Sn- Sn-Ag-Cu-Bi system.
11. 2. The device of claim 1,

    A first electrode is provided on at least a part of the upper surface,

    And a second electrode is provided on at least a part of the lower surface.
12. 12. The method of claim 11,

    Wherein the first element comprises:

    A clip-shaped contact portion in contact with the conductor of the electronic device;

    A bending portion having a predetermined curvature to impart an elastic force; And

    And a terminal portion that contacts the first electrode of the second element.
13. 13. The method of claim 12,

    Wherein the first element is one of a conductive gasket, a silicone rubber pad, and a C-clip.
14. The method according to claim 1,

    Wherein the first element is plated with metal on a lower surface and a portion of a side surface.
15. A first element made of a lower surface having a long side and a short side and contacting with a conductor of the electronic device and having elasticity in a vertical direction;

    A second element disposed on a lower portion of the first element to include a first region having an upper surface larger than a lower surface of the first element and corresponding to a lower surface of the first element and a second region surrounding the first region; And

    A first conductive bonding member interposed between the first element and the second element to electrically connect the first element and the second element;

    A reinforcing member disposed at a lower portion of the second element; And

    And a second conductive bonding member interposed between the second element and the reinforcing member to electrically connect the second element and the reinforcing member,

    The first conductive junction material having a first conductive portion corresponding to a lower surface of the first element and a second conductive portion extending from the first conductive portion for improving lateral strength, And a second conductive portion surrounding the first element by forming an inclined surface connecting the first element and the second conductive portion.

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