WO2019013566A1 - Functional contactor - Google Patents

Functional contactor Download PDF

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Publication number
WO2019013566A1
WO2019013566A1 PCT/KR2018/007905 KR2018007905W WO2019013566A1 WO 2019013566 A1 WO2019013566 A1 WO 2019013566A1 KR 2018007905 W KR2018007905 W KR 2018007905W WO 2019013566 A1 WO2019013566 A1 WO 2019013566A1
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WO
WIPO (PCT)
Prior art keywords
conductor
terminal portion
electrode
elasticity
hole
Prior art date
Application number
PCT/KR2018/007905
Other languages
French (fr)
Korean (ko)
Inventor
임병국
공동훈
문지우
Original Assignee
주식회사 아모텍
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Filing date
Publication date
Application filed by 주식회사 아모텍 filed Critical 주식회사 아모텍
Publication of WO2019013566A1 publication Critical patent/WO2019013566A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2428Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using meander springs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02Soldered or welded connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067Devices for protecting against damage from electrostatic discharge

Definitions

  • the present invention relates to a contactor for an electronic device such as a smart phone, and more particularly to a functional contactor capable of improving the bonding strength of a contactor stacked by soldering on a functional device.
  • Such a portable electronic device reduces the external impact and reduces the electromagnetic waves leaking from or leaking into the portable electronic device, and provides an elasticity such as a conductive gasket or a conductive contactor for electrical contact between the antenna disposed in the external housing and the built- Is used.
  • a functional element for protecting the user from such static electricity or leakage current is provided together with a conductive gasket or a conductive contactor for connecting the metal housing and the circuit board,
  • a functional contactor having various functions for protecting a circuit in a portable electronic device or for smoothly transmitting a communication signal.
  • such a functional contactor laminates a conductor having elasticity to the electrode of the functional device by soldering, wherein the bond strength between the conductor having elasticity by the solder and the functional device does not ensure sufficient reliability, A large amount of product defects occur as they are separated from the functional elements.
  • the present invention provides an electronic device comprising: a conductor having elasticity to be brought into contact with a conductor of an electronic device; A functional element connected to the elastic conductor and having a first electrode and a second electrode on at least a part of an upper surface and a lower surface, respectively; And a solder connecting the lower surface of the conductor having elasticity and the first electrode of the functional device.
  • the elastic conductor includes at least one through hole in a terminal portion opposite to the functional element, and the solder includes a wedge portion inserted and fixed to the elastic conductor through the at least one through hole.
  • a part of the wedge portion may be formed larger than the diameter of the at least one through hole.
  • the elastic conductor may be plated with a metal on one surface of the terminal portion facing the functional element, an inner wall of the at least one through hole, and a portion of the other surface of the terminal portion.
  • a portion of the upper surface of the terminal portion adjacent to the inner wall of the through hole may be plated.
  • the metal may be Sn.
  • the through holes may be formed in a plurality of holes and may be provided symmetrically with respect to the center of the terminal portions.
  • the through holes may be formed in a plurality of points and may be provided in point symmetry with respect to the center of the terminal portions.
  • the through holes may be formed in the center and on both sides of the terminal portion.
  • the first electrode and the second electrode may be provided on the upper surface and the lower surface of the functional device.
  • the elastic conductor includes: a clip-shaped contact portion which contacts the conductor of the electronic device; And a bent portion having a predetermined curvature to impart an elastic force.
  • the elastic conductor may further include a side wall extending vertically from the terminal portion at the long side.
  • the side wall may extend at least a part of the short side where the bending portion is not formed.
  • bent portion may extend from the terminal portion.
  • the bent portion may be spaced apart from the terminal portion by a predetermined distance.
  • the functional device may include an electric shock prevention function for blocking a leakage current of an external power source flowing from the ground of the circuit board of the electronic device, a communication signal transmitting function for passing a communication signal flowing into the conductive case or from the circuit board, And an ESD protection function of passing the static electricity from the conductive case by discharging the static electricity from the conductive case.
  • the solder since at least one through hole is provided in the lower portion of the elastic conductor and the solder is introduced into the through hole to form the wedge portion, an additional coupling structure can be provided by the solder, The bonding strength between the conductors can be increased and the reliability of the product can be improved.
  • FIG. 1 is a perspective view of a functional contactor according to an embodiment of the present invention
  • Fig. 2 is a sectional view of Fig. 1,
  • Fig. 3 is a plan view showing the lower part of the elastic body having the elasticity in Fig. 1,
  • FIG. 4 is a cross-sectional view illustrating a state before coupling of a conductor having elasticity and a functional device in a process of manufacturing a functional contactor according to an embodiment of the present invention
  • FIG. 5 is a cross-sectional view illustrating a state where a conductor having elasticity and a functional device are combined with each other in the course of manufacturing a functional contactor according to an embodiment of the present invention
  • FIG. 6 is an enlarged cross-sectional view of a portion A in Fig. 5
  • FIG. 7 is an enlarged cross-sectional view of a state where a wedge portion is formed by solder at portion A of FIG. 5,
  • FIG. 8 is a plan view showing another example of the through hole in the functional contactor according to the embodiment of the present invention.
  • FIG. 9 is a plan view showing another example of the through hole in the functional contactor according to the embodiment of the present invention.
  • FIG. 10 is a perspective view showing another example of a conductor having elasticity in a functional contactor according to an embodiment of the present invention.
  • FIG. 11 is a cross-sectional view of the functional contactor to which the elastic conductor of Fig. 10 is applied.
  • the functional contactor 100 includes a conductor 110 having an elasticity, a functional device 120, and a solder 130, as shown in FIGS.
  • Such a functional contactor 100 is for electrically connecting a conductive case such as an external metal case to a circuit board or a conductive bracket electrically coupled to a circuit board on one side in a portable electronic device.
  • the functional contactor 100 may be configured such that the elastic conductor 110 contacts the circuit board or the conductive bracket, and the functional element 120 can be coupled to the conductive case, And the functional device 120 may be coupled to the circuit board.
  • the functional contactor 100 is of the SMT type, i.e., coupled through soldering
  • the functional element 120 is coupled to the circuit board, and if it is an adhesive layer type, ,
  • the functional device 120 may be coupled to the conductive case.
  • the portable electronic device may be a portable terminal such as a smart phone, a cellular phone, and the like, and may be a smart watch, a digital camera, a DMB, an electronic book, a netbook, a tablet PC,
  • Such electronic devices may comprise any suitable electronic components including antenna structures for communication with external devices.
  • the conductive case may be an antenna for communication between the portable electronic device and an external device.
  • Such a conductive case may be provided, for example, to partially surround or partially surround the sides of the portable electronic device.
  • the resilient conductor 110 is in electrical contact with the conductor of the electronic device and has an elastic force.
  • the resilient conductor 110 may be in electrical contact with a circuit board of the electronic device, a bracket coupled to the circuit board, and a human contactable conductor, such as a case.
  • the conductor 110 having elasticity when the conductor 110 having elasticity contacts the conductor, the conductor 110 having elasticity can be contracted toward the functional device 120 by the pressing force, and when the conductor is separated, Can be restored to its original state.
  • One side of the conductor 110 having such elasticity is in contact with the conductor of the electronic device and the other side thereof is electrically connected to the functional device 120 and the lower side thereof is formed of the long side 115a and the short side 115b. That is, the conductor 110 having elasticity may be a rectangle whose bottom surface is longer than one side of the length of one side.
  • the functional device 120 is electrically connected in series to the elastic conductor 110, and the first electrode 121 and the second electrode 122 are provided on at least a part of the upper surface and the lower surface, respectively.
  • the first electrode 121 and the second electrode 122 may be provided on a top surface and a bottom surface of the functional device 120, respectively. That is, the body between the first electrode 121 and the second electrode 122 may protrude outwardly from the first electrode 121 and the second electrode 122.
  • the first electrode 121 and the second electrode 122 may be formed to have a large area in order to increase the capacity of the capacitance. That is, the first electrode 121 and the second electrode 122 may be formed over the entire upper surface and the lower surface of the functional device 120.
  • the first electrode 121 may be laminated with a conductor 110 having elasticity, and the second electrode 122 may be coupled to a circuit board through soldering or may be coupled to a conductor such as a conductive case through a conductive adhesive layer .
  • the solder 130 is used to connect the elastic conductive conductor 110 and the functional device 120 to connect the lower surface of the elastic conductive conductor 110 and the first electrode 121 of the functional device 120 do.
  • the solder 130 may be formed by applying a solder paste to the first electrode 121, placing the resilient conductor 110 on the solder paste in the soldering process, and then heating the melted solder paste, The lower electrode 110 and the first electrode 121 of the functional device 120 are bonded to each other so that the functional device 120 and the conductor 110 having elasticity can be coupled to each other.
  • the elastic conductor 110 is provided with at least one through hole 116 in the lower portion thereof.
  • a lower portion of the elastic conductor 110 may be a terminal portion 115 as described later, and the through hole 116 may be provided in the terminal portion 115, as shown in FIGS. 2 and 3.
  • the through holes 116 may be formed as a single unit, it is preferable that a plurality of the through holes 116 are formed to ensure a uniform bonding force to the whole of the elastic conductor 110.
  • the through hole 116 may be provided symmetrically with respect to the center of the terminal portion 115.
  • the two through holes 116 are shown and described as being arranged symmetrically on both sides of the terminal portion 115 in Fig. 3, the number and position of the through holes 116 are not limited thereto.
  • the solder 130 includes a wedge portion 131 which is inserted and fixed to the elastic conductor 110 through at least one through hole 116. That is, the wedge part 131 is formed to be larger than the diameter of the at least one through hole 116, so that the wedge part 131 can be inserted and fixed into the elastic conductor 110.
  • the wedge part 131 protrudes from the through hole 116 to the upper surface of the terminal part 115, that is, the upper surface of the terminal part 115, And is provided in an elongated form.
  • the wedge portion 131 can function as an additional coupling structure between the elastic conductive body 110 and the functional device 120.
  • the bonding strength between the elastic conductive member 110 and the functional device 120 is higher than the bonding strength of the solder 130 by the bonding of the terminal portion 115 of the conductor 110 having elasticity by the wedge portion 131
  • the bonding strength of the solder 130 alone can be compensated for, so that sufficient reliability can be assured for the bonding strength between the elastic conductor 110 and the functional device 120. Therefore, the conductor 110 having elasticity against external impact is prevented from being separated from the functional device 120, so that the reliability of the product can be improved.
  • the wedge portion 131 may be formed during the SMT process in which the conductor 110 having elasticity is mounted on the first electrode 121 on the upper surface of the functional device 120.
  • the solder paste is coated on the first electrode 121 of the functional device 120 and heated in the same manner as in the usual case of soldering the conductor 110 having elasticity onto the functional device 120,
  • the solder 130a of the first electrode 121 is formed on the first electrode 121 (see Fig. 4).
  • the solder 130 is welded to the lower surface of the elastic conductor 110 and the first electrode 121 of the functional device 120, and the through hole 116 and the terminal And is welded to a part of the upper surface of the wedge portion 115 to form the wedge portion 131.
  • the upper end portion 131a of the wedge portion 131 may extend from the upper surface of the terminal portion 115 to the periphery of the through hole 116 to be larger than the diameter of the through hole 116.
  • one surface of the terminal portion 115 opposed to the functional device 120, one surface of the at least one through hole 116, and the other surface of the terminal portion 115 are formed so that the molten solder 130a easily flows to the upper surface of the terminal portion 115 through the through-
  • the inner wall and a portion 115c of the other surface of the terminal portion 115 can be plated with metal (see Figs. 6 and 7).
  • a portion 115c adjacent to the inner wall of the through hole 116 in the upper surface of the terminal portion 115 may be plated with metal.
  • the elasticity of the conductor 110 having elasticity can be improved by the inner wall of the through hole 116 and a part of the upper surface of the terminal portion 115 Can be plated together.
  • the metal plated on the lower surface of the terminal portion 115, the upper surface portion 115c of the terminal portion 115, and the inner wall of the through hole 116 may be Sn.
  • the lower surface of the terminal portion 115 may be plated after the lower surface of the terminal portion 115 is formed so as to form the through hole 116.
  • the melted metal for the plating process flows to the inner wall of the through hole 116 and the upper surface portion 115c of the terminal portion 115 so that the inner wall of the through hole 116 and the terminal portion 115 may be also plated together.
  • the shape of the wedge portion 131 can be easily adjusted according to the length of the upper surface portion 115c of the terminal portion 115.
  • the through holes 116 ' may be provided in point symmetry with respect to the center of the terminal portion 115.
  • the through holes 116 ' may be provided on diagonal lines around the edges facing each other on the lower surface of the terminal portion 115.
  • three through-holes 116 " may be provided at the center and both sides of the terminal portion 115.
  • the three through holes 116 may be formed to be substantially triangular so as to minimize the distance between the wedge portions 131 without increasing the number of the through holes 116 ", for example.
  • the through hole 116 " is disposed at one side of the long side 115a at the center of the terminal portion 115 and one through hole 116" may be disposed at the other side of the long side 115a on both sides of the long side 115a .
  • the distance between the wedge portions 131 is minimized by minimizing the number of the through holes 116 ", thereby providing a uniform bonding force to the entirety of the elastic conductor 110,
  • the coupling strength between the wedge part 131 provided on the flexible board 116 " can be increased, so that the bonding strength between the flexible conductor 110 and the functional device 120 can be further increased.
  • the elastic conductor 110 may include a contact portion 111, a bent portion 112, a spacing portion 113, an external portion 114, and a terminal portion 115 (see FIG. 1).
  • the conductor 110 having elasticity may be a C-clip having a roughly " C-shaped " shape. Since the conductor 110 having such elasticity is in line contact or point contact, galvanic corrosion resistance can be excellent.
  • the contact portion 111 has a clip-like curved shape and can be in electrical contact with the conductor of the electronic device.
  • the contact portion 111 may be disposed in the opening 114b provided on one side of the upper surface 114a of the covering portion 114 so that the curved portion protrudes outside the opening 114b.
  • the bent portion 112 extends from the contact portion 111 in a round shape and can have an elastic force. That is, the bent portion 112 may have a constant curvature to impart an elastic force.
  • the bent portion 112 may be connected to the contact portion 111 at one end inside the elastic conductor 110 and at the other end to the upper surface 114a between the external portions 114.
  • the spacing portion 113 is a space formed between the lower end of the bending portion 112 and the side wall 114c of the covering portion 114.
  • the bending portion 112 may be spaced apart from the terminal portion 115 by a predetermined distance. That is, the spacing portion 113 separates the bent portion 112 from the terminal portion 115 so as not to constrain the bent portion 112 that provides the elastic force. As a result, the elastic force of the contact portion 111 and the bent portion 112 may not be affected by the terminal portion 115.
  • the enclosure 114 may include an upper surface 114a, an opening 114b, and a side wall 114c.
  • the upper surface 114a is connected to the bent portion 112 and the side wall 114c and the contact portion 111 can be arranged from the inside to the outside of the opening 114b.
  • the opening 114b may form a space through which the contact portion 111 flows according to the elastic force of the bent portion 112.
  • the side wall 114c may extend vertically from the terminal portion 115 at the long side 115a.
  • the side wall 114c may extend vertically from the terminal portion 115 to the short side 115b on which the bent portion 112 is not formed.
  • the external portion 114 can be formed in a case shape that surrounds the end portions of the contact portion 111 and the bent portion 112 from the outside so that the ends of the contact portion 111 and the bent portion 112 are not exposed to the outside .
  • the portion of the conductor 110 having elasticity can be minimized to the outside, so that it is possible to suppress the influence of external factors such as a hanging by the operator.
  • the terminal portion 115 corresponds to the lower surface of the elastic conductor 110 and may be formed to be connected to the lower portion of the outer casing 114.
  • the terminal portion 115 may be a terminal that contacts the first electrode 121 of the functional device 120 and is electrically connected to the functional device 120.
  • the contact portion 111, the bent portion 112, the external portion 114, and the terminal portion 115 may be integrally formed of a conductive material having an elastic force.
  • the functional device 120 may have a function for protecting a user or an internal circuit.
  • the functional device 120 may include at least one of an electric shock protection device, a varistor, a suppressor, a diode, and a capacitor.
  • the functional device 120 may block the leakage current of the external power source flowing into the conductor from the ground of the circuit board.
  • the functional device 120 may be configured such that the breakdown voltage Vbr or the breakdown voltage thereof is larger than the rated voltage of the external power supply of the electronic device.
  • the rated voltage may be a standard rated voltage for each country, for example, 240V, 110V, 220V, 120V, and 100V.
  • the first electrode 121 and the second electrode 122 provided on the upper surface and the lower surface of the functional device 120 function as a capacitor to block leakage current of the external power source And a communication signal flowing from the conductor or the circuit board can be passed.
  • the functional device 120 can discharge the electrostatic discharge (ESD) flowing from the conductive case and allow it to pass through without being destroyed by insulation.
  • the functional device 120 may be configured such that the breakdown voltage Vbr thereof is smaller than the dielectric breakdown voltage Vcp of the body provided between the first electrode 121 and the second electrode 122.
  • the functional contactor 100 electrically connects the conductive case and the circuit board with respect to a communication signal, an electrostatic discharge (ESD), etc., and passes the leakage current of the external power from the circuit board to the conductive case .
  • ESD electrostatic discharge
  • the functional contactor 200 may include a conductor having elasticity in which the spacing portion is omitted.
  • the functional contactor 200 will be described with reference to FIG. 10, and the same parts as the functional contactor 100 described with reference to FIGS. 1 to 3 will not be described.
  • the elastic conductor 210 includes a contact portion 211, a bent portion 212, a side wall 214, and a terminal portion 215.
  • the conductor 210 having such elasticity may be a C-clip having a roughly " C " shape. Since the conductor 210 having such elasticity is in line contact or point contact, galvanic corrosion resistance can be excellent.
  • the contact portion 211 has a clip-like curved shape and can be in electrical contact with the conductor of the electronic device.
  • the contact portion 211 may be arranged to protrude outward between the side walls 214.
  • the bent portion 212 extends in a round shape from the contact portion 211 and can have an elastic force. That is, the bent portion 212 may have a predetermined curvature to impart an elastic force.
  • the bent portion 212 may extend from the terminal portion 2115. That is, the bent portion 212 may be disposed between the contact portion 211 and the terminal portion 215.
  • the bent portion 212 may be exposed to the outside of the side wall 214, and the exposed portion may include a first electrode 121 and a solder 130 on a lower side thereof so as to flow without being fixed, (See FIG. 11).
  • the side wall 214 may extend vertically from the terminal portion 215 at the long side 215a. This side wall may extend to a portion 214a of the short side 215b where the bent portion 212 is not formed. That is, in the side wall 214, only a part 214a is formed on both sides of the side wall 214 at the short side 215b where the bent part 212 is not formed, so that a space is formed between the part 214a of the side wall 214 do. At this time, in the space between the portions 214a of the side wall 214, the contact portion 211 can flow by the elastic force of the bent portion 212. [
  • the portion of the conductor 210 having elasticity can be minimized to the outside, so that it is possible to suppress the influence of the external elements such as the latching by the operator.
  • the terminal portion 215 corresponds to the lower surface of the elastic conductive member 210 and may be formed to be connected to the lower side of the side wall 214.
  • the terminal unit 215 may be a terminal that is coupled to the first electrode 221 of the functional device 220 by the solder 130 and is electrically connected to the functional device 220.
  • a through hole 216 may be formed in the terminal portion 215 and a wedge portion 131 may be formed on the upper surface of the through hole 216 and the terminal portion 215 by solder 130.
  • the contact portion 211, the bent portion 212, the side wall 214, and the terminal portion 215 may be integrally formed of a conductive material having an elastic force.
  • the functional contactor 200 may further include a functional device 220.
  • the functional device 220 is electrically connected in series to the elastic conductor 210, and the first electrode 221 and the second electrode 222 are provided on the upper surface and the lower surface, respectively.
  • the bent portion 212 of the elastic conductive member 210 is extended from the terminal portion 215 so that the first electrode 221 of the functional device 220 does not constrain the bent portion 212 that provides the elastic force, Is not formed at a position corresponding to the bent portion 212.
  • the first electrode 221 may be formed only on a part of the upper surface of the functional device 220 (see FIG. 11).
  • the second electrode 222 may be formed only in a part of the lower surface corresponding to the first electrode 221.
  • the body 220 formed between the first electrode 221 and the second electrode 222 may protrude outward from the first electrode 221 and the second electrode 222.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Disclosed is a functional contactor. The functional contactor according to an exemplary embodiment of the present invention comprises: a conductor having elasticity and in contact with a conductor of an electronic device; a functional element which is connected to the conductor having elasticity and has a first electrode and a second electrode on at least a part of an upper surface and a lower surface, respectively; and a solder for bonding a lower surface of the conductor having elasticity to the first electrode of the functional element. Here, the conductor having elasticity has at least one through hole in a terminal portion facing the functional element, and the solder includes a wedge portion which is inserted and fixed into the conductor having elasticity through the at least one through hole.

Description

기능성 컨택터Functional Contactor
본 발명은 스마트 폰 등과 같은 전자장치용 컨택터에 관한 것이며, 보다 구체적으로는 기능소자 상에 솔더링에 의해 적층되는 컨택터의 결합강도를 향상시킬 수 있는 기능성 컨택터에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactor for an electronic device such as a smart phone, and more particularly to a functional contactor capable of improving the bonding strength of a contactor stacked by soldering on a functional device.
최근의 휴대용 전자장치는 심미성과 견고함을 향상시키기 위해 메탈 재질의 하우징의 채택이 증가하고 있는 추세이다. 이러한 휴대용 전자장치는 외부충격을 완화시키는 동시에 휴대용 전자장치 내부로 침투하거나 그로부터 누설되는 전자파를 감소시키고, 외장하우징에 배치되는 안테나와 내장회로기판의 전기적 접촉을 위해 도전성 개스킷 또는 도전성 컨택터 등과 같은 탄성을 갖는 전도체를 사용한다. In recent portable electronic devices, there is an increasing tendency to adopt a metal housing to improve esthetics and robustness. Such a portable electronic device reduces the external impact and reduces the electromagnetic waves leaking from or leaking into the portable electronic device, and provides an elasticity such as a conductive gasket or a conductive contactor for electrical contact between the antenna disposed in the external housing and the built- Is used.
그러나 외부의 메탈 하우징과 같은 전도체를 통하여 순간적으로 높은 전압을 갖는 정전기가 유입되는 경우, 상기 탄성을 갖는 전도체를 통하여 정전기가 내장회로기판에 유입되어 IC 등의 회로를 파손시키며, AC 전원에 의해 발생되는 누설전류가 회로의 접지부를 따라 외장 하우징으로 전파되어 사용자에게 불쾌감을 주거나 심한 경우, 사용자에게 상해를 입힐 수 있는 감전 사고를 초래한다.However, when static electricity having an instantaneous high voltage is input through a conductor such as an outer metal housing, static electricity flows into the built-in circuit board through the elastic conductor to break the circuit of the IC and the like, Leakage current is propagated along the ground of the circuit to the external housing to cause discomfort to the user or severe shock, resulting in an electric shock which may cause injury to the user.
이와 같은 정전기나 누설전류로부터 사용자를 보호하기 위한 기능소자가 메탈 하우징과 회로기판을 연결하는 도전성 개스킷 또는 도전성 컨택터와 함께 구비되며, 메탈 케이스와 같은 전도체의 사용에 따라 단순한 전기적인 접촉뿐만 아니라 사용자 또는 휴대용 전자장치 내의 회로를 보호하거나 통신 신호를 원활하게 전달하기 위한 다양한 기능을 구비한 기능성 컨택터가 요구되고 있다.A functional element for protecting the user from such static electricity or leakage current is provided together with a conductive gasket or a conductive contactor for connecting the metal housing and the circuit board, There is a need for a functional contactor having various functions for protecting a circuit in a portable electronic device or for smoothly transmitting a communication signal.
더욱이, 이러한 기능성 컨택터는 탄성을 갖는 전도체를 솔더링에 의해 기능소자의 전극에 적층하는데, 이때 솔더에 의한 탄성을 갖는 전도체와 기능소자 사이의 결합강도는 충분한 신뢰성을 보장하지 못하므로 탄성을 갖는 전도체가 기능소자로부터 분리됨에 따라 다량의 제품 불량이 발생하는 실정이다. Moreover, such a functional contactor laminates a conductor having elasticity to the electrode of the functional device by soldering, wherein the bond strength between the conductor having elasticity by the solder and the functional device does not ensure sufficient reliability, A large amount of product defects occur as they are separated from the functional elements.
본 발명은 상기와 같은 점을 감안하여 안출한 것으로, 솔더를 이용한 결합부재를 구비하여 기능소자와 탄성을 갖는 전도체 사이의 결합강도를 증대시킬 수 있는 기능성 컨택터를 제공하는데 그 목적이 있다. SUMMARY OF THE INVENTION It is an object of the present invention to provide a functional contactor having a coupling member using solder and capable of increasing a coupling strength between a functional element and a conductor having elasticity.
상술한 과제를 해결하기 위하여 본 발명은 전자장치의 전도체에 접촉되는 탄성을 갖는 전도체; 상기 탄성을 갖는 전도체에 연결되며, 상면 및 하면의 적어도 일부에 각각 제1전극 및 제2전극이 구비되는 기능소자; 및 상기 탄성을 갖는 전도체의 하면과 상기 기능소자의 제1전극을 결합하는 솔더;를 포함하는 기능성 컨택터를 제공한다. 여기서, 상기 탄성을 갖는 전도체는 상기 기능소자에 대향하는 단자부에 적어도 하나의 관통홀이 구비되고, 상기 솔더는 상기 적어도 하나의 관통홀을 통하여 상기 탄성을 갖는 전도체에 삽입고정되는 쐐기부를 포함한다. In order to solve the above-mentioned problems, the present invention provides an electronic device comprising: a conductor having elasticity to be brought into contact with a conductor of an electronic device; A functional element connected to the elastic conductor and having a first electrode and a second electrode on at least a part of an upper surface and a lower surface, respectively; And a solder connecting the lower surface of the conductor having elasticity and the first electrode of the functional device. Here, the elastic conductor includes at least one through hole in a terminal portion opposite to the functional element, and the solder includes a wedge portion inserted and fixed to the elastic conductor through the at least one through hole.
본 발명의 바람직한 실시예에 의하면, 상기 쐐기부의 일부는 상기 적어도 하나의 관통홀의 직경보다 크게 형성될 수 있다.According to a preferred embodiment of the present invention, a part of the wedge portion may be formed larger than the diameter of the at least one through hole.
또한, 상기 탄성을 갖는 전도체는 상기 기능소자에 대향하는 상기 단자부의 일면, 상기 적어도 하나의 관통홀의 내벽, 및 상기 단자부의 타면의 일부가 금속으로 도금처리될 수 있다. The elastic conductor may be plated with a metal on one surface of the terminal portion facing the functional element, an inner wall of the at least one through hole, and a portion of the other surface of the terminal portion.
이때, 상기 단자부의 상면 중에서 상기 관통홀의 내벽과 이웃하는 일부가 도금처리될 수 있다.At this time, a portion of the upper surface of the terminal portion adjacent to the inner wall of the through hole may be plated.
여기서, 상기 금속은 Sn일 수 있다. Here, the metal may be Sn.
또한, 상기 관통홀은 복수개로 이루어지고 상기 단자부의 중앙을 기준으로 좌우 대칭으로 구비될 수 있다.The through holes may be formed in a plurality of holes and may be provided symmetrically with respect to the center of the terminal portions.
다른 예로서, 상기 관통홀은 복수개로 이루어지고 상기 단자부의 중앙을 기준으로 점대칭으로 구비될 수 있다.As another example, the through holes may be formed in a plurality of points and may be provided in point symmetry with respect to the center of the terminal portions.
또 다른 예로서, 상기 관통홀은 복수개로 이루어지고 상기 단자부의 중앙 및 양측에 구비될 수 있다.As another example, the through holes may be formed in the center and on both sides of the terminal portion.
또한, 상기 제1전극 및 상기 제2전극은 상기 기능소자의 상면 및 하면 전체에 구비될 수 있다.The first electrode and the second electrode may be provided on the upper surface and the lower surface of the functional device.
또한, 상기 탄성을 갖는 전도체는, 상기 전자장치의 전도체와 접촉하는 클립 형상의 접촉부; 및 탄성력을 부여하도록 일정 곡률로 이루어진 절곡부;를 더 포함할 수 있다.Further, the elastic conductor includes: a clip-shaped contact portion which contacts the conductor of the electronic device; And a bent portion having a predetermined curvature to impart an elastic force.
또한, 상기 탄성을 갖는 전도체는 상기 장변에서 상기 단자부로부터 수직으로 연장되는 측벽을 더 포함할 수 있다.In addition, the elastic conductor may further include a side wall extending vertically from the terminal portion at the long side.
이때, 상기 측벽은 상기 절곡부가 형성되지 않은 단변의 적어도 일부에 연장될 수 있다.At this time, the side wall may extend at least a part of the short side where the bending portion is not formed.
또한, 상기 절곡부는 상기 단자부로부터 연장될 수 있다.Further, the bent portion may extend from the terminal portion.
다른 예로서, 상기 절곡부는 상기 단자부와 일정거리 이격될 수 있다.As another example, the bent portion may be spaced apart from the terminal portion by a predetermined distance.
또한, 상기 기능소자는 상기 전자장치의 회로기판의 접지로부터 유입되는 외부전원의 누설전류를 차단하는 감전 방지 기능, 상기 도전성 케이스로 또는 상기 회로기판으로부터 유입되는 통신 신호를 통과시키는 통신 신호 전달 기능, 및 상기 도전성 케이스로부터 정전기 유입시 방전에 의해 통과시키는 ESD 방호 기능 중 적어도 하나의 기능을 가질 수 있다. The functional device may include an electric shock prevention function for blocking a leakage current of an external power source flowing from the ground of the circuit board of the electronic device, a communication signal transmitting function for passing a communication signal flowing into the conductive case or from the circuit board, And an ESD protection function of passing the static electricity from the conductive case by discharging the static electricity from the conductive case.
본 발명에 의하면, 탄성을 갖는 전도체의 하부에 적어도 하나의 관통홀을 구비하고, 관통홀 내로 솔더를 유입시켜 쐐기부를 형성함으로써, 솔더에 의해 추가적인 결합구조를 구비할 수 있으므로 기능소자와 탄성을 갖는 전도체 사이의 결합강도를 증대시킬 수 있어 제품의 신뢰성을 향상시킬 수 있다. According to the present invention, since at least one through hole is provided in the lower portion of the elastic conductor and the solder is introduced into the through hole to form the wedge portion, an additional coupling structure can be provided by the solder, The bonding strength between the conductors can be increased and the reliability of the product can be improved.
도 1은 본 발명의 일 실시예에 따른 기능성 컨택터를 나타낸 사시도,1 is a perspective view of a functional contactor according to an embodiment of the present invention,
도 2는 도 1의 단면도,Fig. 2 is a sectional view of Fig. 1,
도 3은 도 1에서 탄성을 갖는 전도체의 하부를 나타낸 평면도,Fig. 3 is a plan view showing the lower part of the elastic body having the elasticity in Fig. 1,
도 4는 본 발명의 일 실시예에 따른 기능성 컨택터를 제조하는 과정에서 탄성을 갖는 전도체와 기능소자의 결합이전 상태를 나타낸 단면도, FIG. 4 is a cross-sectional view illustrating a state before coupling of a conductor having elasticity and a functional device in a process of manufacturing a functional contactor according to an embodiment of the present invention;
도 5는 본 발명의 일 실시예에 따른 기능성 컨택터를 제조하는 과정에서 탄성을 갖는 전도체와 기능소자를 결합할 때의 상태를 나타낸 단면도, FIG. 5 is a cross-sectional view illustrating a state where a conductor having elasticity and a functional device are combined with each other in the course of manufacturing a functional contactor according to an embodiment of the present invention,
도 6은 도 5의 A 부분의 확대단면도 6 is an enlarged cross-sectional view of a portion A in Fig. 5
도 7은 도 5의 A 부분에서 솔더에 의한 쐐기부가 형성된 상태의 확대단면도, 7 is an enlarged cross-sectional view of a state where a wedge portion is formed by solder at portion A of FIG. 5,
도 8은 본 발명의 일 실시예에 따른 기능성 컨택터에서 관통홀의 다른 예를 나타낸 평면도, 8 is a plan view showing another example of the through hole in the functional contactor according to the embodiment of the present invention,
도 9는 본 발명의 일 실시예에 따른 기능성 컨택터에서 관통홀의 또 다른 예를 나타낸 평면도, 9 is a plan view showing another example of the through hole in the functional contactor according to the embodiment of the present invention,
도 10은 본 발명의 일 실시예에 따른 기능성 컨택터에서 탄성을 갖는 전도체의 다른 예를 나타난 사시도, 그리고,10 is a perspective view showing another example of a conductor having elasticity in a functional contactor according to an embodiment of the present invention,
도 11은 도 10의 탄성을 갖는 전도체를 적용한 기능성 컨택터의 단면도이다.11 is a cross-sectional view of the functional contactor to which the elastic conductor of Fig. 10 is applied.
이하, 첨부한 도면을 참고로 하여 본 발명의 실시예에 대하여 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 동일 또는 유사한 구성요소에 대해서는 동일한 참조부호를 부가한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.
본 발명의 일 실시예에 따른 기능성 컨택터(100)는 도 1 내지 도 3에 도시된 바와 같이, 탄성을 갖는 전도체(110), 기능소자(120) 및 솔더(130)를 포함한다. The functional contactor 100 according to an embodiment of the present invention includes a conductor 110 having an elasticity, a functional device 120, and a solder 130, as shown in FIGS.
이러한 기능성 컨택터(100)는 휴대용 전자장치에서, 외장 메탈 케이스와 같은 도전성 케이스와 회로기판 또는 회로기판에 일측에 전기적으로 결합되는 도전성 브래킷을 전기적으로 연결하기 위한 것이다. Such a functional contactor 100 is for electrically connecting a conductive case such as an external metal case to a circuit board or a conductive bracket electrically coupled to a circuit board on one side in a portable electronic device.
이때, 기능성 컨택터(100)는 탄성을 갖는 전도체(110)가 회로기판 또는 도전성 브래킷에 접촉되고, 기능소자(120)가 도전성 케이스에 결합될 수 있지만, 이와 반대로, 탄성을 갖는 전도체(110)가 도전성 케이스에 접촉되고, 기능소자(120)가 회로기판에 결합될 수도 있다. At this time, the functional contactor 100 may be configured such that the elastic conductor 110 contacts the circuit board or the conductive bracket, and the functional element 120 can be coupled to the conductive case, And the functional device 120 may be coupled to the circuit board.
일례로, 기능성 컨택터(100)가 SMT 타입인 경우, 즉, 솔더링을 통하여 결합되는 경우, 기능소자(120)는 회로기판에 결합되며, 접착층 타입인 경우, 즉, 도전성 접착층을 통하여 결합되는 경우, 기능소자(120)는 도전성 케이스에 결합될 수 있다.For example, if the functional contactor 100 is of the SMT type, i.e., coupled through soldering, then the functional element 120 is coupled to the circuit board, and if it is an adhesive layer type, , The functional device 120 may be coupled to the conductive case.
한편, 상기 휴대용 전자장치는 스마트폰, 셀룰러폰 등과 같은 휴대단말기일 수 있으며, 스마트 워치, 디지털 카메라, DMB, 전자책, 넷북, 태블릿 PC, 휴대용 컴퓨터 등일 수 있다. 이러한 전자장치들은 외부기기와의 통신을 위한 안테나 구조들을 포함하는 임의의 적절한 전자 컴포넌트들을 구비할 수 있다. Meanwhile, the portable electronic device may be a portable terminal such as a smart phone, a cellular phone, and the like, and may be a smart watch, a digital camera, a DMB, an electronic book, a netbook, a tablet PC, Such electronic devices may comprise any suitable electronic components including antenna structures for communication with external devices.
여기서, 상기 도전성 케이스는 상기 휴대용 전자장치와 외부기기의 통신을 위한 안테나일 수 있다. 이러한 도전성 케이스는 예를 들면, 휴대용 전자장치의 측부를 부분적으로 둘러싸거나 전체적으로 둘러싸도록 구비될 수 있다. Here, the conductive case may be an antenna for communication between the portable electronic device and an external device. Such a conductive case may be provided, for example, to partially surround or partially surround the sides of the portable electronic device.
탄성을 갖는 전도체(110)는 전자장치의 전도체에 전기적으로 접촉하며 탄성력을 갖는다. 일례로, 탄성을 갖는 전도체(110)는 전자장치의 회로기판, 회로기판에 결합된 브래킷, 및 케이스와 같은 인체 접촉가능한 전도체 중 어느 하나에 전기적으로 접촉될 수 있다.The resilient conductor 110 is in electrical contact with the conductor of the electronic device and has an elastic force. In one example, the resilient conductor 110 may be in electrical contact with a circuit board of the electronic device, a bracket coupled to the circuit board, and a human contactable conductor, such as a case.
여기서, 탄성을 갖는 전도체(110)가 상기 전도체에 접촉되는 경우, 그 가압력에 의해 탄성을 갖는 전도체(110)는 기능소자(120) 측으로 수축될 수 있고, 상기 전도체가 분리되는 경우, 그 탄성력에 의해 원래의 상태로 복원될 수 있다.Here, when the conductor 110 having elasticity contacts the conductor, the conductor 110 having elasticity can be contracted toward the functional device 120 by the pressing force, and when the conductor is separated, Can be restored to its original state.
한편, 탄성을 갖는 전도체(110)가 가압되는 경우, 부식 환경에 노출되면 이종금속 사이의 전위차에 의한 갈바닉 부식(galvanic corrosion)이 발생한다. 이때, 갈바닉 부식을 최소화하기 위해, 탄성을 갖는 전도체(110)는 접촉되는 면적을 작게 하는 것이 바람직하다. On the other hand, when the elastic conductor 110 is pressed, galvanic corrosion occurs due to the potential difference between the dissimilar metals when exposed to the corrosive environment. At this time, in order to minimize galvanic corrosion, it is preferable that the contact area of the conductor 110 having elasticity is made small.
이러한 탄성을 갖는 전도체(110)는 그 일측이 전자장치의 전도체에 접촉하고, 그 타측은 기능소자(120)에 전기적으로 연결되며, 그 하면이 장변(115a) 및 단변(115b)으로 이루어진다. 즉, 탄성을 갖는 전도체(110)는 그 하면이 한 변의 길이가 다른 변의 길이보다 길게 형성되는 직사각형일 수 있다. One side of the conductor 110 having such elasticity is in contact with the conductor of the electronic device and the other side thereof is electrically connected to the functional device 120 and the lower side thereof is formed of the long side 115a and the short side 115b. That is, the conductor 110 having elasticity may be a rectangle whose bottom surface is longer than one side of the length of one side.
기능소자(120)는 탄성을 갖는 전도체(110)에 전기적으로 직렬 연결되며, 상면 및 하면의 적어도 일부에 각각 제1전극(121) 및 제2전극(122)이 구비된다. The functional device 120 is electrically connected in series to the elastic conductor 110, and the first electrode 121 and the second electrode 122 are provided on at least a part of the upper surface and the lower surface, respectively.
일례로, 제1전극(121) 및 제2전극(122)은 기능소자(120)의 상면 및 하면의 일부에 구비될 수 있다. 즉, 기능소자(120)는 제1전극(121)과 제2전극(122) 사이의 몸체가 제1전극(121) 및 제2전극(122) 보다 외부로 돌출 형성될 수 있다.For example, the first electrode 121 and the second electrode 122 may be provided on a top surface and a bottom surface of the functional device 120, respectively. That is, the body between the first electrode 121 and the second electrode 122 may protrude outwardly from the first electrode 121 and the second electrode 122.
다른 예로서, 제1전극(121) 및 제2전극(122)은 커패시턴스의 용량을 증대시키기 위해 대면적으로 이루어질 수 있다. 즉, 제1전극(121) 및 제2전극(122)은 기능소자(120)의 상면 및 하면 전체에 걸쳐 형성될 수 있다.As another example, the first electrode 121 and the second electrode 122 may be formed to have a large area in order to increase the capacity of the capacitance. That is, the first electrode 121 and the second electrode 122 may be formed over the entire upper surface and the lower surface of the functional device 120.
이때, 제1전극(121)은 탄성을 갖는 전도체(110)가 적층 결합되고, 제2전극(122)은 솔더링을 통하여 회로기판에 결합되거나 도전성 접착층을 통하여 도전성 케이스와 같은 전도체에 결합될 수 있다.At this time, the first electrode 121 may be laminated with a conductor 110 having elasticity, and the second electrode 122 may be coupled to a circuit board through soldering or may be coupled to a conductor such as a conductive case through a conductive adhesive layer .
솔더(130)는 탄성을 갖는 전도체(110)와 기능소자(120)를 연결하기 결합하기 위한 것으로, 탄성을 갖는 전도체(110)의 하면과 기능소자(120)의 제1전극(121)을 결합한다. The solder 130 is used to connect the elastic conductive conductor 110 and the functional device 120 to connect the lower surface of the elastic conductive conductor 110 and the first electrode 121 of the functional device 120 do.
이러한 솔더(130)는 제1전극(121)에 솔더 페이스트를 도포한 후 솔더링 공정에서, 탄성을 갖는 전도체(110)를 솔더 페이스트 상에 배치한 후 가열함으로써, 용융된 솔더 페이스트가 탄성을 갖는 전도체(110)의 하면과 기능소자(120)의 제1전극(121)에 용착됨으로써, 탄성을 갖는 전도체(110)와 기능소자(120)를 결합할 수 있다. The solder 130 may be formed by applying a solder paste to the first electrode 121, placing the resilient conductor 110 on the solder paste in the soldering process, and then heating the melted solder paste, The lower electrode 110 and the first electrode 121 of the functional device 120 are bonded to each other so that the functional device 120 and the conductor 110 having elasticity can be coupled to each other.
또한, 탄성을 갖는 전도체(110)는 그 하부에 적어도 하나의 관통홀(116)이 구비된다. 여기서, 탄성을 갖는 전도체(110)의 하부는 후술하는 바와 같은 단자부(115)로서, 관통홀(116)은 도 2 및 도 3에 도시된 바와 같이, 단자부(115)에 구비될 수 있다.In addition, the elastic conductor 110 is provided with at least one through hole 116 in the lower portion thereof. Here, a lower portion of the elastic conductor 110 may be a terminal portion 115 as described later, and the through hole 116 may be provided in the terminal portion 115, as shown in FIGS. 2 and 3.
이러한 관통홀(116)은 하나로 이루어질 수 있지만, 탄성을 갖는 전도체(110)의 전체에 균일한 결합력을 보장하도록 복수개로 이루어지는 것이 바람직하다. Although the through holes 116 may be formed as a single unit, it is preferable that a plurality of the through holes 116 are formed to ensure a uniform bonding force to the whole of the elastic conductor 110.
일례로, 관통홀(116)은 단자부(115)의 중앙을 기준으로 좌우 대칭으로 구비될 수 있다. 도 3에는 2개의 관통홀(116)이 단자부(115)의 양측에 대칭으로 배치되는 것으로 도시되고 설명되었지만 관통홀(116)의 개수 및 위치는 이에 한정되지 않는다. For example, the through hole 116 may be provided symmetrically with respect to the center of the terminal portion 115. Although the two through holes 116 are shown and described as being arranged symmetrically on both sides of the terminal portion 115 in Fig. 3, the number and position of the through holes 116 are not limited thereto.
이때, 솔더(130)는 적어도 하나의 관통홀(116)을 통하여 탄성을 갖는 전도체(110)에 삽입고정되는 쐐기부(131)를 포함한다. 즉, 쐐기부(131)는 그 일부가 적어도 하나의 관통홀(116)의 직경보다 크게 형성됨으로써, 탄성을 갖는 전도체(110)의 내부에 삽입고정될 수 있다.At this time, the solder 130 includes a wedge portion 131 which is inserted and fixed to the elastic conductor 110 through at least one through hole 116. That is, the wedge part 131 is formed to be larger than the diameter of the at least one through hole 116, so that the wedge part 131 can be inserted and fixed into the elastic conductor 110.
보다 상세하게는, 쐐기부(131)는 탄성을 갖는 전도체(110)의 내부, 즉, 단자부(115)의 상면으로 돌출형성되며, 특히, 관통홀(116)로부터 단자부(115)의 상면을 따라 연장된 형태로 구비된다. 여기서, 쐐기부(131)는 탄성을 갖는 전도체(110)와 기능소자(120) 사이의 추가적인 결합구조로서 기능할 수 있다.More specifically, the wedge part 131 protrudes from the through hole 116 to the upper surface of the terminal part 115, that is, the upper surface of the terminal part 115, And is provided in an elongated form. Here, the wedge portion 131 can function as an additional coupling structure between the elastic conductive body 110 and the functional device 120.
이를 통해, 탄성을 갖는 전도체(110)와 기능소자(120) 사이의 결합강도는 솔더(130)의 용착에 의한 결합력에 더하여 쐐기부(131)에 의해 탄성을 갖는 전도체(110)의 단자부(115)를 지지하는 결합력이 부가됨으로써, 솔더(130)만에 의한 결합력을 보완할 수 있으므로 탄성을 갖는 전도체(110)와 기능소자(120) 사이의 결합강도에 대한 충분한 신뢰성을 보장할 수 있다. 따라서 외부의 충격에도 탄성을 갖는 전도체(110)가 기능소자(120)로부터 분리되는 것을 억제하므로 제품의 신뢰성을 향상시킬 수 있다. The bonding strength between the elastic conductive member 110 and the functional device 120 is higher than the bonding strength of the solder 130 by the bonding of the terminal portion 115 of the conductor 110 having elasticity by the wedge portion 131 The bonding strength of the solder 130 alone can be compensated for, so that sufficient reliability can be assured for the bonding strength between the elastic conductor 110 and the functional device 120. Therefore, the conductor 110 having elasticity against external impact is prevented from being separated from the functional device 120, so that the reliability of the product can be improved.
이와 같은 쐐기부(131)는 탄성을 갖는 전도체(110)를 기능소자(120)의 상면의 제1전극(121)에 실장하는 SMT 공정 중에 형성할 수 있다. 먼저, 탄성을 갖는 전도체(110)를 기능소자(120) 상에 솔더링하는 통상적인 경우와 동일하게 기능소자(120)의 제1전극(121) 상에 솔더 페이스트를 도포한 후 가열함으로써, 용융 상태의 솔더(130a)가 제1전극(121) 상에 형성된다(도 4 참조).The wedge portion 131 may be formed during the SMT process in which the conductor 110 having elasticity is mounted on the first electrode 121 on the upper surface of the functional device 120. First, the solder paste is coated on the first electrode 121 of the functional device 120 and heated in the same manner as in the usual case of soldering the conductor 110 having elasticity onto the functional device 120, The solder 130a of the first electrode 121 is formed on the first electrode 121 (see Fig. 4).
이때, 도 5에 도시된 바와 같이, 용융 솔더(130a) 상에 탄성을 갖는 전도체(110)를 가압하면, 용융 솔더(130a)가 관통홀(116)을 통해 단자부(115)의 상면으로, 즉, 탄성을 갖는 전도체(110)의 내부로 유입된다. 여기서, 용융 솔더(130a)는 탄성을 갖는 전도체(110)의 가압력에 의해 관통홀(116)을 통해 단자부(115)의 상면으로 상승하고, 그 상부(130b)는 다시 단자부(115)의 상면을 따라 수평 방향으로 유동한다(도 6 참조). 5, when the conductor 110 having elasticity is pressed on the molten solder 130a, the molten solder 130a passes through the through hole 116 to the upper surface of the terminal portion 115, that is, , And flows into the interior of the elastic conductor (110). The molten solder 130a rises to the upper surface of the terminal portion 115 through the through hole 116 by the urging force of the elastic conductor 110 and the upper portion 130b of the solder 130a again rises to the upper surface of the terminal portion 115 And flows in the horizontal direction (see Fig. 6).
결과적으로, 도 7에 도시된 바와 같이, 솔더(130)는 탄성을 갖는 전도체(110)의 하면과 기능소자(120)의 제1전극(121)에 용착되는 동시에, 관통홀(116) 및 단자부(115)의 상면 일부에 용착됨으로써 쐐기부(131)를 형성한다. 여기서, 쐐기부(131)의 상단부(131a)는 단자부(115)의 상면에서 관통홀(116) 주변으로 연장되어 관통홀(116)의 직경보다 크게 형성될 수 있다.7, the solder 130 is welded to the lower surface of the elastic conductor 110 and the first electrode 121 of the functional device 120, and the through hole 116 and the terminal And is welded to a part of the upper surface of the wedge portion 115 to form the wedge portion 131. The upper end portion 131a of the wedge portion 131 may extend from the upper surface of the terminal portion 115 to the periphery of the through hole 116 to be larger than the diameter of the through hole 116.
이때, 용융 솔더(130a)가 관통홀(116)을 통해 단자부(115)의 상면으로 용이하게 유동하도록 기능소자(120)에 대향하는 단자부(115)의 일면, 적어도 하나의 관통홀(116)의 내벽 및 단자부(115)의 타면의 일부(115c)가 금속으로 도금처리될 수 있다(도 6 및 도 7 참조). 여기서, 단자부(115)의 상면 중에서 관통홀(116)의 내벽과 이웃하는 일부(115c)가 금속으로 도금처리될 수 있다.At this time, one surface of the terminal portion 115 opposed to the functional device 120, one surface of the at least one through hole 116, and the other surface of the terminal portion 115 are formed so that the molten solder 130a easily flows to the upper surface of the terminal portion 115 through the through- The inner wall and a portion 115c of the other surface of the terminal portion 115 can be plated with metal (see Figs. 6 and 7). Here, a portion 115c adjacent to the inner wall of the through hole 116 in the upper surface of the terminal portion 115 may be plated with metal.
즉, 탄성을 갖는 전도체(110)는 기능소자(120)와의 솔더링이 용이하도록 단자부(115)의 하면을 금속으로 도금처리할 때, 관통홀(116)의 내벽 및 단자부(115)의 상면의 일부까지 함께 도금처리할 수 있다. 이와 같이, 단자부(115)의 하면, 단자부(115)의 상면 일부(115c), 및 관통홀(116)의 내벽에 도금되는 금속은 Sn일 수 있다. That is, when the lower surface of the terminal portion 115 is plated with metal so as to facilitate soldering with the functional device 120, the elasticity of the conductor 110 having elasticity can be improved by the inner wall of the through hole 116 and a part of the upper surface of the terminal portion 115 Can be plated together. As described above, the metal plated on the lower surface of the terminal portion 115, the upper surface portion 115c of the terminal portion 115, and the inner wall of the through hole 116 may be Sn.
이를 위해, 관통홀(116)을 형성하도록 단자부(115)의 하면에 타공한 후 단자부(115)의 하면을 도금처리할 수 있다. 이때, 도금처리를 위한 용융된 금속이 관통홀(116)의 내벽 및 단자부(115)의 상면 일부(115c)로 유동함으로써, 단자부(115)의 하면과 함께 관통홀(116)의 내벽 및 단자부(115)의 상면 일부(115c)도 함께 도금처리될 수 있다. For this purpose, the lower surface of the terminal portion 115 may be plated after the lower surface of the terminal portion 115 is formed so as to form the through hole 116. The melted metal for the plating process flows to the inner wall of the through hole 116 and the upper surface portion 115c of the terminal portion 115 so that the inner wall of the through hole 116 and the terminal portion 115 may be also plated together.
이를 통해, 용융 솔더(130a)가 관통홀(116)의 내벽을 따라 단자부(115)의 상면의 일부(115c)로 용이하게 유동함으로써, 쐐기부(131)를 안정적으로 형성할 수 있다. 아울러, 단자부(115)의 상면 일부(115c)의 길이에 따라 쐐기부(131)의 형상을 용이하게 조절할 수 있다.This allows the molten solder 130a to flow easily along the inner wall of the through hole 116 to the upper portion 115c of the terminal portion 115 to stably form the wedge portion 131. [ In addition, the shape of the wedge portion 131 can be easily adjusted according to the length of the upper surface portion 115c of the terminal portion 115.
아울러, 도 8에 도시된 바와 같이, 관통홀(116')은 단자부(115)의 중앙을 기준으로 점대칭으로 구비될 수 있다. 예를 들면, 관통홀(116')은 단자부(115)의 하면에서 서로 대향하는 모서리 주변에서 대각선상에 구비될 수 있다.As shown in FIG. 8, the through holes 116 'may be provided in point symmetry with respect to the center of the terminal portion 115. For example, the through holes 116 'may be provided on diagonal lines around the edges facing each other on the lower surface of the terminal portion 115.
이를 통해, 탄성을 갖는 전도체(110)의 장변(115a) 방향뿐만 아니라 단변방향(115b)으로도 균일한 결합력을 제공할 수 있으므로, 탄성을 갖는 전도체(110)와 기능소자(120) 사이의 결합강도를 더욱 증대시킬 수 있다. As a result, a uniform coupling force can be provided not only in the long side 115a of the elastic conductor 110 but also in the short side direction 115b. Therefore, the coupling between the elastic conductor 110 and the functional element 120 The strength can be further increased.
다른 예로서, 도 9에 도시된 바와 같이, 관통홀(116")은 3개로 이루어지고, 단자부(115)의 중앙 및 양측에 구비될 수 있다. As another example, as shown in Fig. 9, three through-holes 116 " may be provided at the center and both sides of the terminal portion 115. [
이때, 관통홀(116")의 수를 크게 증가하지 않으면서도 쐐기부(131) 사이의 거리를 최소화하도록 3개의 관통홀(116)은 대략 삼각형을 이루도록 구비될 수 있다. 예를 들면, 하나의 관통홀(116")은 단자부(115)의 중앙에서 장변(115a)의 일측에 배치되고, 이를 중심으로 양측에서 장변(115a)의 타측에 각각 하나의 관통홀(116")이 배치될 수 있다.At this time, the three through holes 116 may be formed to be substantially triangular so as to minimize the distance between the wedge portions 131 without increasing the number of the through holes 116 ", for example. The through hole 116 "is disposed at one side of the long side 115a at the center of the terminal portion 115 and one through hole 116" may be disposed at the other side of the long side 115a on both sides of the long side 115a .
이를 통해, 관통홀(116")의 수를 최소화화면서도 쐐기부(131) 사이의 거리를 최대한 짧게 형성함으로써, 탄성을 갖는 전도체(110)의 전체에 대하여 균일한 결합력을 제공하는 동시에 각 관통홀(116")에 구비된 쐐기부(131) 사이의 결합력을 증대시킬 수 있으므로 탄성을 갖는 전도체(110)와 기능소자(120) 사이의 결합강도를 더욱 증대시킬 수 있다. Accordingly, the distance between the wedge portions 131 is minimized by minimizing the number of the through holes 116 ", thereby providing a uniform bonding force to the entirety of the elastic conductor 110, The coupling strength between the wedge part 131 provided on the flexible board 116 " can be increased, so that the bonding strength between the flexible conductor 110 and the functional device 120 can be further increased.
한편, 탄성을 갖는 전도체(110)는 접촉부(111), 절곡부(112), 이격부(113), 외장부(114) 및 단자부(115)를 포함할 수 있다(도 1 참조). On the other hand, the elastic conductor 110 may include a contact portion 111, a bent portion 112, a spacing portion 113, an external portion 114, and a terminal portion 115 (see FIG. 1).
여기서, 탄성을 갖는 전도체(110)는 대략적으로 "C자" 형상으로 이루어지는 C-클립일 수 있다. 이러한 탄성을 갖는 전도체(110)는 선접촉 또는 점접촉되기 때문에, 갈바닉 부식성이 우수할 수 있다. Here, the conductor 110 having elasticity may be a C-clip having a roughly " C-shaped " shape. Since the conductor 110 having such elasticity is in line contact or point contact, galvanic corrosion resistance can be excellent.
접촉부(111)는 클립 형상의 만곡부 형상을 가지며 전자장치의 전도체와 전기적으로 접촉될 수 있다. 이러한 접촉부(111)는 외장부(114)의 상면(114a)의 일측에 구비된 개구(114b)에 배치되어 만곡부가 개구(114b)의 외측으로 돌출되도록 배치될 수 있다.The contact portion 111 has a clip-like curved shape and can be in electrical contact with the conductor of the electronic device. The contact portion 111 may be disposed in the opening 114b provided on one side of the upper surface 114a of the covering portion 114 so that the curved portion protrudes outside the opening 114b.
절곡부(112)는 접촉부(111)로부터 라운드 형상으로 연장형성되며, 탄성력을 가질 수 있다. 즉, 절곡부(112)는 탄성력을 부여하도록 일정 곡률로 이루어질 수 있다. 여기서, 절곡부(112)는 일단이 탄성을 갖는 전도체(110)의 내측에서 접촉부(111)로 연결되고, 타단은 외장부(114) 사이의 상면(114a)에 연결될 수 있다. The bent portion 112 extends from the contact portion 111 in a round shape and can have an elastic force. That is, the bent portion 112 may have a constant curvature to impart an elastic force. The bent portion 112 may be connected to the contact portion 111 at one end inside the elastic conductor 110 and at the other end to the upper surface 114a between the external portions 114.
이격부(113)는 절곡부(112)의 하단에서 외장부(114)의 측벽(114c) 사이에 형성된 공간이다. 이에 의해 절곡부(112)는 단자부(115)와 일정거리 이격될 수 있다. 즉, 이격부(113)는 탄성력을 제공하는 절곡부(112)를 구속하지 않도록 절곡부(112)와 단자부(115)를 이격시킨다. 이를 통해, 접촉부(111) 및 절곡부(112)에 의한 탄성력은 단자부(115)에 의한 영향을 받지 않을 수 있다. The spacing portion 113 is a space formed between the lower end of the bending portion 112 and the side wall 114c of the covering portion 114. [ The bending portion 112 may be spaced apart from the terminal portion 115 by a predetermined distance. That is, the spacing portion 113 separates the bent portion 112 from the terminal portion 115 so as not to constrain the bent portion 112 that provides the elastic force. As a result, the elastic force of the contact portion 111 and the bent portion 112 may not be affected by the terminal portion 115.
외장부(114)는 상면(114a), 개구부(114b) 및 측벽(114c)을 포함할 수 있다.The enclosure 114 may include an upper surface 114a, an opening 114b, and a side wall 114c.
상면(114a)은 절곡부(112) 및 측벽(114c)과 연결되며, 개구부(114b)는 그 내측에서 외측으로 접촉부(111)가 배치될 수 있다. 이러한 개구부(114b)는 절곡부(112)의 탄성력에 따라 접촉부(111)가 유동하는 공간을 형성할 수 있다.The upper surface 114a is connected to the bent portion 112 and the side wall 114c and the contact portion 111 can be arranged from the inside to the outside of the opening 114b. The opening 114b may form a space through which the contact portion 111 flows according to the elastic force of the bent portion 112. [
측벽(114c)은 장변(115a)에서 단자부(115)로부터 수직으로 연장형성될 수 있다. 이러한 측벽(114c)은 절곡부(112)가 형성되지 않은 단변(115b)에 단자부(115)로부터 수직으로 연장형성될 수 있다.The side wall 114c may extend vertically from the terminal portion 115 at the long side 115a. The side wall 114c may extend vertically from the terminal portion 115 to the short side 115b on which the bent portion 112 is not formed.
결과적으로, 외장부(114)는 접촉부(111) 및 절곡부(112)의 단부가 외부로 노출되지 않도록 접촉부(111) 및 절곡부(112)의 단부를 외부에서 둘러싸는 케이스 형태로 이루어질 수 있다. As a result, the external portion 114 can be formed in a case shape that surrounds the end portions of the contact portion 111 and the bent portion 112 from the outside so that the ends of the contact portion 111 and the bent portion 112 are not exposed to the outside .
이를 통해, 탄성을 갖는 전도체(110)는 외부로 노출되는 부분을 최소화할 수 있으므로 작업자에 의한 걸림 등과 같은 외부요소들에 의해 의한 영향을 억제할 수 있다. As a result, the portion of the conductor 110 having elasticity can be minimized to the outside, so that it is possible to suppress the influence of external factors such as a hanging by the operator.
단자부(115)는 탄성을 갖는 전도체(110)의 하면에 대응하며 외장부(114)의 하측에서 연결되도록 형성될 수 있다. 이러한 단자부(115)는 기능소자(120)의 제1전극(121)에 접촉되어 기능소자(120)와 전기적으로 연결되는 단자일 수 있다. The terminal portion 115 corresponds to the lower surface of the elastic conductor 110 and may be formed to be connected to the lower portion of the outer casing 114. The terminal portion 115 may be a terminal that contacts the first electrode 121 of the functional device 120 and is electrically connected to the functional device 120.
이와 같은 접촉부(111), 절곡부(112), 외장부(114) 및 단자부(115)는 탄성력을 갖는 도전성물질로 일체로 형성될 수 있다.The contact portion 111, the bent portion 112, the external portion 114, and the terminal portion 115 may be integrally formed of a conductive material having an elastic force.
한편, 기능소자(120)는 사용자 또는 내부회로를 보호하기 위한 기능을 구비할 수 있다. 일례로, 기능소자(120)는 감전보호소자, 바리스터(varistor), 써프레서(suppressor), 다이오드, 및 커패시터 중 적어도 하나를 포함할 수 있다. Meanwhile, the functional device 120 may have a function for protecting a user or an internal circuit. In one example, the functional device 120 may include at least one of an electric shock protection device, a varistor, a suppressor, a diode, and a capacitor.
이러한 기능소자(120)는 상기 회로기판의 접지로부터 상기 전도체로 유입되는 외부전원의 누설전류를 차단할 수 있다. 이때, 기능소자(120)는 그 항복전압(Vbr) 또는 내압이 상기 전자장치의 외부전원의 정격전압보다 크게 되도록 구성될 수 있다. 여기서, 상기 정격전압은 국가별 표준 정격전압일 수 있으며, 예를 들면, 240V, 110V, 220V, 120V, 및 100V 중 어느 하나일 수 있다.The functional device 120 may block the leakage current of the external power source flowing into the conductor from the ground of the circuit board. At this time, the functional device 120 may be configured such that the breakdown voltage Vbr or the breakdown voltage thereof is larger than the rated voltage of the external power supply of the electronic device. Here, the rated voltage may be a standard rated voltage for each country, for example, 240V, 110V, 220V, 120V, and 100V.
아울러, 도전성 케이스가 안테나 기능을 갖는 경우, 기능소자(120)는 상면 및 하면에 구비된 제1전극(121) 및 제2전극(122)이 커패시터로 기능하여, 외부전원의 누설전류를 차단함과 아울러 전도체 또는 회로기판으로부터 유입되는 통신 신호를 통과시킬 수 있다.When the conductive case has an antenna function, the first electrode 121 and the second electrode 122 provided on the upper surface and the lower surface of the functional device 120 function as a capacitor to block leakage current of the external power source And a communication signal flowing from the conductor or the circuit board can be passed.
나아가, 기능소자(120)는 상기 도전성 케이스로부터 유입되는 정전기(ESD)를 방전하여 절연파괴되지 않고 통과시킬 수 있다. 이때, 기능소자(120)는 그 항복전압(Vbr)이 제1전극(121)과 제2전극(122) 사이에 구비되는 소체의 절연파괴 전압(Vcp)보다 작게 되도록 구성될 수 있다. Furthermore, the functional device 120 can discharge the electrostatic discharge (ESD) flowing from the conductive case and allow it to pass through without being destroyed by insulation. At this time, the functional device 120 may be configured such that the breakdown voltage Vbr thereof is smaller than the dielectric breakdown voltage Vcp of the body provided between the first electrode 121 and the second electrode 122.
따라서 상기 기능성 컨택터(100)는 통신 신호 및 정전기(ESD) 등에 대하여 상기 도전성 케이스와 상기 회로기판을 전기적으로 연결하여 통과시키지만, 상기 회로기판으로부터의 외부전원의 누설전류는 상기 도전성 케이스로 전달되지 않도록 차단할 수 있다. Accordingly, the functional contactor 100 electrically connects the conductive case and the circuit board with respect to a communication signal, an electrostatic discharge (ESD), etc., and passes the leakage current of the external power from the circuit board to the conductive case .
한편, 본 발명의 실시예에 따른 기능성 컨택터(200)는 이격부가 생략된 탄성을 갖는 전도체를 구비할 수 있다. 이하, 도 10을 참조하여 기능성 컨택터(200)를 설명하며, 도 1 내지 도 3을 참조하여 설명한 기능성 컨택터(100)와 동일 부분은 그 설명을 생략한다. Meanwhile, the functional contactor 200 according to the embodiment of the present invention may include a conductor having elasticity in which the spacing portion is omitted. Hereinafter, the functional contactor 200 will be described with reference to FIG. 10, and the same parts as the functional contactor 100 described with reference to FIGS. 1 to 3 will not be described.
도 10에 도시된 바와 같이, 탄성을 갖는 전도체(210)는 접촉부(211), 절곡부(212), 측벽(214) 및 단자부(215)를 포함한다. 10, the elastic conductor 210 includes a contact portion 211, a bent portion 212, a side wall 214, and a terminal portion 215. [
이러한 탄성을 갖는 전도체(210)는 대략적으로 "C자" 형상으로 이루어지는 C-클립일 수 있다. 이러한 탄성을 갖는 전도체(210)는 선접촉 또는 점접촉되기 때문에, 갈바닉 부식성이 우수할 수 있다.The conductor 210 having such elasticity may be a C-clip having a roughly " C " shape. Since the conductor 210 having such elasticity is in line contact or point contact, galvanic corrosion resistance can be excellent.
접촉부(211)는 클립 형상의 만곡부 형상을 가지며 전자장치의 전도체와 전기적으로 접촉될 수 있다. 이러한 접촉부(211)는 측벽(214) 사이에서 외측으로 돌출되도록 배치될 수 있다.The contact portion 211 has a clip-like curved shape and can be in electrical contact with the conductor of the electronic device. The contact portion 211 may be arranged to protrude outward between the side walls 214. [
절곡부(212)는 접촉부(211)로부터 라운드 형상으로 연장형성되며, 탄성력을 가질 수 있다. 즉, 절곡부(212)는 탄성력을 부여하도록 일정 곡률로 이루어질 수 있다. 여기서, 절곡부(212)는 단자부(2115)로부터 연장형성될 수 있다. 즉, 절곡부(212)는 접촉부(211)와 단자부(215) 사이에 배치될 수 있다.The bent portion 212 extends in a round shape from the contact portion 211 and can have an elastic force. That is, the bent portion 212 may have a predetermined curvature to impart an elastic force. Here, the bent portion 212 may extend from the terminal portion 2115. That is, the bent portion 212 may be disposed between the contact portion 211 and the terminal portion 215.
이때, 절곡부(212)는 측벽(214)의 외부로 노출될 수 있으며, 노출된 부분은 탄성력을 부여하기 위해 고정되지 않고 유동할 수 있도록 그 하측에 제1전극(121) 및 솔더(130)가 배치되지 않을 수 있다(도 11 참조). At this time, the bent portion 212 may be exposed to the outside of the side wall 214, and the exposed portion may include a first electrode 121 and a solder 130 on a lower side thereof so as to flow without being fixed, (See FIG. 11).
측벽(214)은 장변(215a)에서 단자부(215)로부터 수직으로 연장형성될 수 있다. 이러한 측벽은 절곡부(212)가 형성되지 않은 단변(215b)의 일부(214a)에 연장될 수 있다. 즉, 측벽(214)은 절곡부(212)가 형성되지 않은 단변(215b)에서, 일부(214a)만이 측벽(214)의 양측에 형성되어 측벽(214)의 일부(214a) 사이에 공간이 형성된다. 이때, 측벽(214)의 일부(214a) 사이의 공간에서, 절곡부(212)의 탄성력에 의해 접촉부(211)가 유동할 수 있다.The side wall 214 may extend vertically from the terminal portion 215 at the long side 215a. This side wall may extend to a portion 214a of the short side 215b where the bent portion 212 is not formed. That is, in the side wall 214, only a part 214a is formed on both sides of the side wall 214 at the short side 215b where the bent part 212 is not formed, so that a space is formed between the part 214a of the side wall 214 do. At this time, in the space between the portions 214a of the side wall 214, the contact portion 211 can flow by the elastic force of the bent portion 212. [
이를 통해, 탄성을 갖는 전도체(210)는 외부로 노출되는 부분을 최소화할 수 있으므로 작업자에 의한 걸림 등과 같은 외부요소들에 의해 의한 영향을 억제할 수 있다. As a result, the portion of the conductor 210 having elasticity can be minimized to the outside, so that it is possible to suppress the influence of the external elements such as the latching by the operator.
단자부(215)는 탄성을 갖는 전도체(210)의 하면에 대응하며 측벽(214)의 하측에서 연결되도록 형성될 수 있다. 여기서, 단자부(215)는 솔더(130)에 의해 기능소자(220)의 제1전극(221)에 결합되어 기능소자(220)와 전기적으로 연결되는 단자일 수 있다. The terminal portion 215 corresponds to the lower surface of the elastic conductive member 210 and may be formed to be connected to the lower side of the side wall 214. The terminal unit 215 may be a terminal that is coupled to the first electrode 221 of the functional device 220 by the solder 130 and is electrically connected to the functional device 220.
이때, 단자부(215)에는 관통홀(216)이 구비되며, 관통홀(216) 및 단자부(215)의 상면 일부에 솔더(130)에 의해 쐐기부(131)가 구비될 수 있다.A through hole 216 may be formed in the terminal portion 215 and a wedge portion 131 may be formed on the upper surface of the through hole 216 and the terminal portion 215 by solder 130.
이와 같은 접촉부(211), 절곡부(212), 측벽(214) 및 단자부(215)는 탄성력을 갖는 도전성물질로 일체로 형성될 수 있다.The contact portion 211, the bent portion 212, the side wall 214, and the terminal portion 215 may be integrally formed of a conductive material having an elastic force.
이러한 기능성 컨택터(200)는 기능소자(220)를 더 포함할 수 있다.The functional contactor 200 may further include a functional device 220.
기능소자(220)는 탄성을 갖는 전도체(210)에 전기적으로 직렬 연결되며, 상면 및 하면의 일부에 각각 제1전극(221) 및 제2전극(222)이 구비된다. The functional device 220 is electrically connected in series to the elastic conductor 210, and the first electrode 221 and the second electrode 222 are provided on the upper surface and the lower surface, respectively.
이때, 탄성을 갖는 전도체(210)의 절곡부(212)가 단자부(215)로부터 연장형성되기 때문에, 탄성력을 제공하는 절곡부(212)를 구속하지 않도록 기능소자(220)의 제1전극(221)은 절곡부(212)에 대응하는 위치에는 형성되지 않는다. The bent portion 212 of the elastic conductive member 210 is extended from the terminal portion 215 so that the first electrode 221 of the functional device 220 does not constrain the bent portion 212 that provides the elastic force, Is not formed at a position corresponding to the bent portion 212. [
즉, 제1전극(221)은 기능소자(220)의 상면에서 일부에만 형성될 수 있다(도 11 참조). 이때, 제2전극(222)도 제1전극(221)에 대응하여 하면에서 일부에만 형성될 수 있다. 따라서 기능소자(220)는 제1전극(221)과 제2전극(222) 사이에 형성된 몸체가 제1전극(221)과 제2전극(222) 외부로 돌출 형성될 수 있다.That is, the first electrode 221 may be formed only on a part of the upper surface of the functional device 220 (see FIG. 11). At this time, the second electrode 222 may be formed only in a part of the lower surface corresponding to the first electrode 221. The body 220 formed between the first electrode 221 and the second electrode 222 may protrude outward from the first electrode 221 and the second electrode 222.
이상에서 본 발명의 일 실시예에 대하여 설명하였으나, 본 발명의 사상은 본 명세서에 제시되는 실시 예에 제한되지 아니하며, 본 발명의 사상을 이해하는 당업자는 동일한 사상의 범위 내에서, 구성요소의 부가, 변경, 삭제, 추가 등에 의해서 다른 실시 예를 용이하게 제안할 수 있을 것이나, 이 또한 본 발명의 사상범위 내에 든다고 할 것이다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (15)

  1. 전자장치의 전도체에 접촉되는 탄성을 갖는 전도체; A conductor having elasticity to contact the conductor of the electronic device;
    상기 탄성을 갖는 전도체에 연결되며, 상면 및 하면의 적어도 일부에 각각 제1전극 및 제2전극이 구비되는 기능소자; 및 A functional element connected to the elastic conductor and having a first electrode and a second electrode on at least a part of an upper surface and a lower surface, respectively; And
    상기 탄성을 갖는 전도체의 하면과 상기 기능소자의 제1전극을 결합하는 솔더;를 포함하고,And a solder coupling the lower surface of the conductor having elasticity and the first electrode of the functional device,
    상기 탄성을 갖는 전도체는 상기 기능소자에 대향하는 단자부에 적어도 하나의 관통홀이 구비되고, Wherein at least one through hole is provided in a terminal portion of the conductor having elasticity opposite to the functional element,
    상기 솔더는 상기 적어도 하나의 관통홀을 통하여 상기 탄성을 갖는 전도체에 삽입고정되는 쐐기부를 포함하는 기능성 컨택터. And the solder includes a wedge portion which is inserted and fixed to the elastic conductor through the at least one through hole.
  2. 제1항에 있어서,The method according to claim 1,
    상기 쐐기부의 일부는 상기 적어도 하나의 관통홀의 직경보다 크게 형성되는 기능성 컨택터.Wherein a portion of the wedge portion is formed to be larger than a diameter of the at least one through hole.
  3. 제1항에 있어서, The method according to claim 1,
    상기 탄성을 갖는 전도체는 상기 기능소자에 대향하는 상기 단자부의 일면, 상기 적어도 하나의 관통홀의 내벽, 및 상기 단자부의 타면의 일부가 금속으로 도금처리되는 기능성 컨택터. Wherein the conductor having elasticity is plated with a metal on one surface of the terminal portion facing the functional element, an inner wall of the at least one through hole, and a portion of the other surface of the terminal portion.
  4. 제3항에 있어서, The method of claim 3,
    상기 단자부의 상면 중에서 상기 관통홀의 내벽과 이웃하는 일부가 도금처리되는 기능성 컨택터.And a portion of the upper surface of the terminal portion adjacent to the inner wall of the through hole is plated.
  5. 제3항에 있어서,The method of claim 3,
    상기 금속은 Sn인 기능성 컨택터. Wherein the metal is Sn.
  6. 제1항에 있어서,The method according to claim 1,
    상기 관통홀은 복수개로 이루어지고 상기 단자부의 중앙을 기준으로 좌우 대칭으로 구비되는 기능성 컨택터.Wherein the plurality of through holes are provided symmetrically with respect to a center of the terminal portion.
  7. 제1항에 있어서,The method according to claim 1,
    상기 관통홀은 복수개로 이루어지고 상기 단자부의 중앙을 기준으로 점대칭으로 구비되는 기능성 컨택터.Wherein the through-holes are formed in a plurality of points and are provided symmetrically with respect to a center of the terminal portion.
  8. 제1항에 있어서,The method according to claim 1,
    상기 관통홀은 복수개로 이루어지고 상기 단자부의 중앙 및 양측에 구비되는 기능성 컨택터.Wherein the plurality of through holes are provided at the center and both sides of the terminal portion.
  9. 제1항에 있어서,The method according to claim 1,
    상기 제1전극 및 상기 제2전극은 상기 기능소자의 상면 및 하면 전체에 구비되는 기능성 컨택터.Wherein the first electrode and the second electrode are provided on the upper surface and the lower surface of the functional device.
  10. 제1항에 있어서,The method according to claim 1,
    상기 탄성을 갖는 전도체는, The conductor having elasticity may be formed,
    상기 전자장치의 전도체와 접촉하는 클립 형상의 접촉부; 및A clip-shaped contact portion in contact with the conductor of the electronic device; And
    탄성력을 부여하도록 일정 곡률로 이루어진 절곡부;를 더 포함하는 기능성 컨택터. And a bending portion having a predetermined curvature to impart an elastic force.
  11. 제10항에 있어서, 11. The method of claim 10,
    상기 탄성을 갖는 전도체는 장변에서 상기 단자부로부터 수직으로 연장되는 측벽을 더 포함하는 기능성 컨택터. Wherein the resilient conductor further comprises a sidewall extending vertically from the terminal portion at a long side.
  12. 제11항에 있어서, 12. The method of claim 11,
    상기 측벽은 상기 절곡부가 형성되지 않은 단변의 적어도 일부에 연장되는 기능성 컨택터. Wherein the sidewall extends at least a portion of the short side where the bend is not formed.
  13. 제10항에 있어서, 11. The method of claim 10,
    상기 절곡부는 상기 단자부로부터 연장되는 기능성 컨택터.And the bent portion extends from the terminal portion.
  14. 제10항에 있어서,11. The method of claim 10,
    상기 절곡부는 상기 단자부와 일정거리 이격되는 기능성 컨택터.Wherein the bent portion is spaced apart from the terminal portion by a predetermined distance.
  15. 제1항에 있어서, The method according to claim 1,
    상기 기능소자는 상기 전자장치의 회로기판의 접지로부터 유입되는 외부전원의 누설전류를 차단하는 감전 방지 기능, 도전성 케이스로 또는 상기 회로기판으로부터 유입되는 통신 신호를 통과시키는 통신 신호 전달 기능, 및 상기 도전성 케이스로부터 정전기 유입시 방전에 의해 통과시키는 ESD 방호 기능 중 적어도 하나의 기능을 갖는 기능성 컨택터.Wherein the functional device has an electric shock prevention function for blocking a leakage current of an external power source flowing from a ground of a circuit board of the electronic device, a communication signal transfer function for passing a communication signal flowing into the conductive case or from the circuit board, And a function of at least one of an ESD protection function which is passed by discharging when an electrostatic charge is inputted from the case.
PCT/KR2018/007905 2017-07-12 2018-07-12 Functional contactor WO2019013566A1 (en)

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KR200424639Y1 (en) * 2006-06-05 2006-08-25 박진우 Antenna contacting element for mobile phone
KR20070052518A (en) * 2005-11-17 2007-05-22 삼성전기주식회사 Flip chip package printed circuit board and method for manufacturing the same
KR101029037B1 (en) * 2001-08-13 2011-04-15 오토스플라이스, 인코퍼레이티드 Discrete solder ball contact and circuit board assembly utilizing same
KR20170004830A (en) * 2015-07-01 2017-01-11 주식회사 아모텍 Functional circuit protection contactor and potable electronic device with the same
KR20170077618A (en) * 2015-12-28 2017-07-06 주식회사 아모텍 Electric shock protection contactor assembly and mobile electronic apparatus with the same

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Publication number Priority date Publication date Assignee Title
KR101364117B1 (en) 2012-05-17 2014-02-19 이중식 Antenna Contactor For Mobile Communication Terminal And Method For Providing The Contactor

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KR101029037B1 (en) * 2001-08-13 2011-04-15 오토스플라이스, 인코퍼레이티드 Discrete solder ball contact and circuit board assembly utilizing same
KR20070052518A (en) * 2005-11-17 2007-05-22 삼성전기주식회사 Flip chip package printed circuit board and method for manufacturing the same
KR200424639Y1 (en) * 2006-06-05 2006-08-25 박진우 Antenna contacting element for mobile phone
KR20170004830A (en) * 2015-07-01 2017-01-11 주식회사 아모텍 Functional circuit protection contactor and potable electronic device with the same
KR20170077618A (en) * 2015-12-28 2017-07-06 주식회사 아모텍 Electric shock protection contactor assembly and mobile electronic apparatus with the same

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