WO2016153268A1 - Battery pack having structure capable of efficiently sensing temperature, and temperature sensor-mounted printed circuit board applied to same - Google Patents

Battery pack having structure capable of efficiently sensing temperature, and temperature sensor-mounted printed circuit board applied to same Download PDF

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Publication number
WO2016153268A1
WO2016153268A1 PCT/KR2016/002921 KR2016002921W WO2016153268A1 WO 2016153268 A1 WO2016153268 A1 WO 2016153268A1 KR 2016002921 W KR2016002921 W KR 2016002921W WO 2016153268 A1 WO2016153268 A1 WO 2016153268A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
heat
temperature element
heat sink
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Application number
PCT/KR2016/002921
Other languages
French (fr)
Korean (ko)
Inventor
홍인관
김광호
김정익
조도휘
Original Assignee
주식회사 코캄
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Publication of WO2016153268A1 publication Critical patent/WO2016153268A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/202—Casings or frames around the primary casing of a single cell or a single battery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/63—Control systems
    • H01M10/637—Control systems characterised by the use of reversible temperature-sensitive devices, e.g. NTC, PTC or bimetal devices; characterised by control of the internal current flowing through the cells, e.g. by switching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/262—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with fastening means, e.g. locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/284—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a battery pack having a structure capable of efficient temperature detection, and a temperature element-mounted printed circuit board applied thereto.
  • the present invention relates to a battery pack having a structure that can be easily delivered, and a temperature element mounted printed circuit board applied thereto.
  • the life of the battery is closely related to the ambient temperature. Therefore, when the ambient temperature is extremely low or high temperature, it is necessary to check this to avoid the operation of the battery (meaning charging / discharging of the secondary battery). It can be a big help.
  • the temperature element used to measure the temperature of the battery may be a negative temperature coefficient device (NTC), a positive temperature coefficient device (PTC), etc., such a temperature element is attached directly to the battery, or absorbs the heat of the battery It was common to attach to a heat sink installed in the battery to release / discharge.
  • NTC negative temperature coefficient device
  • PTC positive temperature coefficient device
  • the present invention has been made in view of the above-described problems, and provides a battery pack structure and a printed circuit board structure applied thereto by improving a connection structure between a temperature element and a PCB, thereby improving processability, quality, and temperature measurement efficiency.
  • the purpose is to improve a connection structure between a temperature element and a PCB, thereby improving processability, quality, and temperature measurement efficiency.
  • Battery pack for solving the above technical problem, at least one battery cell; A heat sink dissipating heat generated from the battery cell; A printed circuit board at least partially in contact with the heat sink; And a temperature element mounted on the printed circuit board to sense heat conducted from the heat sink to the printed circuit board.
  • the printed circuit board includes a substrate main body portion; And a substrate extension part extending from one side of the substrate body part and connected to the heat sink.
  • a heat conductive coating layer may be formed on at least a portion of the first surface of the substrate extension to contact the heat sink.
  • the temperature element may be mounted in a heat conductive region corresponding to a region where the heat conductive coating layer is formed on the second surface of the substrate extension.
  • the substrate extension part may include a heat transfer hole which is formed on at least a portion of the circumference of the temperature element and penetrates the printed circuit board so that heat emitted from the heat sink can be transferred to the temperature element. .
  • a metal layer may be formed on an inner wall surface of the heat transfer hole.
  • the printed circuit board may include a heat transfer slit formed at a boundary area between the substrate main body part and the substrate extension part and penetrating the printed circuit board so that heat emitted from the heat sink may be transferred to the temperature element. It can be provided.
  • the substrate extension part may include a fastening hole for fastening between the printed circuit board and the heat sink.
  • the printed circuit board and the heat sink may be fastened to each other by bolts.
  • the temperature device may be an NTC device.
  • the printed circuit board includes a first terminal for electrically connecting the temperature element and a second terminal electrically connected to the battery cell to function as a terminal of the battery cell, wherein the first terminal and the second terminal are insulated from each other. You can maintain a certain distance to maintain the strength.
  • a printed circuit board for solving the above technical problem, at least a portion of the printed circuit board in contact with the heat sink for dissipating heat generated from the battery cell; And a temperature element mounted on the printed circuit board to sense heat conducted from the heat sink to the printed circuit board.
  • FIG. 1 is a real picture showing a state in which a printed circuit board and a heat sink are combined in a battery pack according to an embodiment of the present invention.
  • FIG. 2 is a real photograph showing a state in which a temperature element is mounted on a printed circuit board according to an exemplary embodiment of the present invention.
  • FIG 3 is a real picture showing a first surface of a printed circuit board according to an embodiment of the present invention.
  • FIG. 4 is a plan view illustrating a printed circuit board, a heat sink, and a temperature element coupled together in a battery pack according to an exemplary embodiment of the present invention.
  • FIG. 5 is a side cross-sectional view illustrating a form cut along the v-v line illustrated in FIG. 4.
  • 6 and 7 are diagrams schematically showing a path through which heat is released in the battery pack according to an embodiment of the present invention.
  • FIG. 8 is a plan view illustrating a distance between a temperature element mounting terminal and a battery power terminal in a battery pack according to an embodiment of the present invention.
  • FIG. 1 is a real picture showing a state in which a printed circuit board and a heat sink are combined in a battery pack according to an embodiment of the present invention
  • Figure 2 is a temperature element on a printed circuit board according to an embodiment of the present invention 3 is a real picture showing a mounted state
  • FIG. 3 is a real picture showing a first surface of a printed circuit board according to an exemplary embodiment of the present invention.
  • FIG. 4 is a plan view illustrating a printed circuit board, a heat sink, and a temperature device coupled to each other in the battery pack according to an exemplary embodiment of the present invention.
  • FIG. 5 is a view along the line vv shown in FIG. 4. It is a side sectional drawing which shows the cut
  • a battery pack according to an embodiment of the present invention includes a battery cell (not shown), a heat sink 10, a printed circuit board (PCB) 20, and a temperature element ( It may be implemented in a form including 30).
  • the battery cell may be applied in various kinds according to the purpose or required capacity of the battery pack. For example, after accommodating the electrode assembly in a pouch case, a pair of electrode leads connected to the electrode assembly may be drawn out. A pouch type cell manufactured by sealing the edge region of the pouch case in a heat-sealed manner may be applied.
  • the heat sink 10 is in direct or indirect contact with the battery cell to perform the function of dissipating heat generated from the battery cell.
  • the heat sink 10 is a lead conductor directly contacting or connected to an electrode lead T (see FIG. 5) having a particularly high heat generation value among the battery cells in order to efficiently transfer heat generated from the battery cell. It may be installed to contact a component such as).
  • the printed circuit board 20 is at least partially installed in contact with the heat sink 10
  • the temperature element 30 is mounted on the printed circuit board 20
  • the battery cell in addition to the temperature element 30
  • Various components such as a logic circuit chip and / or a switching element for controlling the operation of the device may be mounted.
  • the operation control of the battery cell may be made by a separate BMS, in which case the electrical connection between the battery cell and the BMS and / or the electrical connection between the BMS and the temperature element 30 is a printed circuit board 20 It can be made by a conductive circuit pattern formed therein.
  • the printed circuit board 20 includes a substrate main body 20a and a substrate extension 20b extending from one side of the substrate main body 20a and contacting the heat sink 10.
  • a fastening hole 21 for coupling between the printed circuit board 20 and the heat sink 10 is formed in the substrate extension part 20b.
  • various structures are formed in the substrate extension part 20b for efficient heat transfer from the heat sink 10 to the temperature element 30.
  • a heat conductive coating layer 22 is formed on a first surface of the both sides of the substrate extension 20b that faces / contacts the heat sink 10.
  • the heat conductive coating layer 22 performs a function of increasing heat transfer efficiency toward the temperature device 30 mounted on the second surface of the printed circuit board 20 by contacting the heat sink 10.
  • the thermal conductive coating layer 22 is preferably made of a material having high thermal conductivity, and may be made of copper (Cu) in consideration of both productivity and thermal conductivity.
  • the substrate extension part 20b may be easily circulated from the heat sink 10 toward the temperature element 30 so that heat transfer may be efficiently performed.
  • Heat transfer holes 23 may be formed.
  • the heat transfer holes 23 are formed in at least a portion of a circumference of a region where the temperature element 30 is installed in the printed circuit board 20, but are formed through the printed circuit board 20 to be discharged from the heat sink 10. Allow heat to be transferred through the air circulation towards the temperature element 30.
  • a metal layer may be formed on the inner wall surface of the heat transfer hole 23, in which case the efficiency of heat transfer may be further improved due to the excellent thermal conductivity of the metal.
  • the printed circuit board 20 further includes a heat transfer slit 24 in addition to the heat conductive coating layer 22 and / or the heat transfer hole 23 for efficient heat transfer between the heat sink 10 and the temperature element 30. It may be further provided.
  • the heat transfer slit 24 is formed at the boundary area between the substrate main body 20a and the substrate extension 20b but penetrates the printed circuit board 20 so that heat released from the heat sink 10 is heated. It can be delivered more efficiently toward the device.
  • a metal coating layer 25 may be formed on a portion of the printed circuit board 20 in a portion of the printed circuit board 20, and the metal coating layer 25 may include a fastening hole ( Up to the periphery of 21) and the region adjacent thereto.
  • the metal coating layer 25 may be connected to the heat conductive coating layer 22 formed on the first surface of the printed circuit board 20 described above, in which case the heat transfer efficiency by the conduction method may be further improved.
  • the temperature element 30 applied to the battery pack according to an embodiment of the present invention is not particularly limited as long as it can detect a change in temperature due to a change in electrical properties with temperature.
  • the temperature device examples include an NTC device (negative temperature coefficient device) in which the resistance value gradually decreases as the temperature increases, or a PTC device (positive temperature coefficient device) in which the resistance value gradually increases as the temperature increases. Can be used.
  • NTC device negative temperature coefficient device
  • PTC device positive temperature coefficient device
  • 6 and 7 are diagrams schematically showing a path through which heat is released in the battery pack according to an embodiment of the present invention.
  • FIG. 8 shows a distance relationship between the temperature element mounting terminal and the battery power terminal in the battery pack according to the present invention.
  • FIG. 8 is a plan view illustrating a distance between a temperature element mounting terminal and a battery power terminal in a battery pack according to an embodiment of the present invention.
  • the printed circuit board 20 may include a pair of temperature device mounting terminals 26 for installing the temperature device 30, and the second surface of the printed circuit board 20 described above.
  • the metal coating layer 25 formed thereon may correspond to a battery power terminal functioning as a terminal of the battery cell.
  • the battery power terminal 25 and the temperature element mounting terminal 26 can maintain a predetermined distance.
  • the distance between both terminals is preferably maintained at least 1.75mm.
  • the connection between the printed circuit board 20 and the temperature device 30 is poor. There is very little risk of this occurring.
  • the battery pack according to the present invention has a structure in which the temperature element 30 is mounted directly on the printed circuit board 20, which may not only have a process advantage but also a risk of poor contact due to breakage of the connection part. little.
  • the battery pack according to an embodiment of the present invention has a structure in which the heat transfer between the heat sink 10 and the temperature element 30 can be efficiently performed, it is possible to measure the cell temperature quickly and accurately, thereby heat Enables proper battery pack operation according to the occurrence.

Abstract

A battery pack according to an embodiment of the present invention comprises: at least one battery cell; a heat sink for dissipating heat generated by the battery cell; a printed circuit board having at least a portion thereof contacting the heat sink; and a temperature sensor mounted on the printed circuit board to sense heat conducted from the heat sink to the printed circuit board.

Description

효율적인 온도 검출이 가능한 구조를 갖는 배터리 팩 및 이에 적용되는 온도 소자 실장형 인쇄회로기판Battery pack having a structure capable of efficient temperature detection and temperature element mounted printed circuit board applied thereto
본 출원은 2015년 3월 23에 출원된 한국특허출원 제10-2015-0040020호에 기초한 우선권을 주장하며, 해당 출원의 명세서 및 도면에 개시된 모든 내용은 본 출원에 원용된다.This application claims priority based on Korean Patent Application No. 10-2015-0040020 filed on March 23, 2015, and all the contents disclosed in the specification and drawings of the application are incorporated in this application.
본 발명은 효율적인 온도 검출이 가능한 구조를 갖는 배터리 팩 및 이에 적용되는 온도 소자 실장형 인쇄회로기판에 관한 것으로서, 좀 더 구체적으로는 인쇄회로기판 상에 실장되어 있는 온도 소자에 배터리로부터 발생된 열이 잘 전달될 수 있는 구조를 갖는 배터리 팩 및 이에 적용되는 온도 소자 실장형 인쇄회로기판에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a battery pack having a structure capable of efficient temperature detection, and a temperature element-mounted printed circuit board applied thereto. The present invention relates to a battery pack having a structure that can be easily delivered, and a temperature element mounted printed circuit board applied thereto.
배터리를 사용함에 있어서 이차전지의 온도를 확인하는 것은 안전사고 발생의 방지 및 배터리 수명 향상 등의 측면에서 매우 중요하다.In using the battery, it is very important to check the temperature of the secondary battery in terms of preventing a safety accident and improving battery life.
즉, 전자기기의 성능이 날로 향상되어 감에 따라 이에 전력을 공급하는 배터리의 성능 또한 향상되어 가고, 특히 이러한 고성능 전자기기에 사용되는 배터리의 경우 발열량이 매우 커 온도 상승에 적절히 대처하지 못하는 경우 발화/폭발 등의 사고를 유발할 수 있다.In other words, as the performance of electronic devices improves day by day, the performance of the battery that supplies power also increases. Especially, the battery used in such high-performance electronic devices generates a large amount of heat, so that the fire does not respond properly to temperature rise. May cause an accident such as an explosion.
뿐만 아니라, 배터리의 수명은 주변의 온도와 밀접한 관련성이 있어 주변 온도가 극히 저온 또는 고온인 경우에는 이를 확인하여 배터리의 운전(이차전지의 충전/방전을 의미)을 지양하는 것이 배터리 수명의 연장에 큰 도움이 될 수 있다.In addition, the life of the battery is closely related to the ambient temperature. Therefore, when the ambient temperature is extremely low or high temperature, it is necessary to check this to avoid the operation of the battery (meaning charging / discharging of the secondary battery). It can be a big help.
배터리의 온도 측정을 위해 사용되는 온도 소자로는 NTC 소자(negative temperature coefficient device), PTC 소자(positive temperature coefficient device) 등이 사용될 수 있으며, 이러한 온도 소자는 배터리에 직접 부착되거나, 배터리의 열을 흡수/방출하기 위해 배터리에 설치되는 히트싱크(heat sink)에 부착되는 것이 일반적이었다.The temperature element used to measure the temperature of the battery may be a negative temperature coefficient device (NTC), a positive temperature coefficient device (PTC), etc., such a temperature element is attached directly to the battery, or absorbs the heat of the battery It was common to attach to a heat sink installed in the battery to release / discharge.
또한, 이처럼 배터리 또는 히트싱크에 부착된 온도 소자와 PCB(printed circuit board: 인쇄회로기판) 사이를 전기적으로 연결하기 위해 케이블을 이용하는 것이 일반적이었다.In addition, it was common to use a cable to electrically connect a temperature element attached to a battery or heat sink and a printed circuit board (PCB).
그러나, 이처럼 케이블을 이용하여 온도 소자와 PCB를 연결하는 경우 케이블의 외부 접촉 방지를 위해 수지 필름 등으로 절연 처리를 해줘야 하는 공정상의 번거로움이 있고, 케이블을 PCB에 연결하기 위해 납땜 처리한 부분에서 단선이 발생할 수 있는 위험이 크다는 문제점이 있다.However, when connecting the temperature element and the PCB by using a cable as described above, there is a cumbersome process that requires insulation treatment with a resin film to prevent external contact of the cable, and in the soldered part to connect the cable to the PCB. There is a problem that the risk of disconnection is great.
본 발명은 상술한 문제점을 고려하여 창안된 것으로서, 온도 소자와 PCB 사이의 연결 구조를 개선하여 공정성, 품질 및 온도 측정의 효율성이 향상된 배터리 팩 구조 및 이에 적용되는 인쇄회로기판 구조를 제공하는 것을 일 목적으로 한다.SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and provides a battery pack structure and a printed circuit board structure applied thereto by improving a connection structure between a temperature element and a PCB, thereby improving processability, quality, and temperature measurement efficiency. The purpose.
다만, 본 발명이 이루고자 하는 기술적 과제는 상술한 과제에 제한되지 않으며, 위에서 언급되지 않은 또 다른 기술적 과제들은 아래에 기재된 발명의 설명으로부터 당업자에게 명확하게 이해될 수 있을 것이다.However, the technical problem to be achieved by the present invention is not limited to the above-described problem, another technical problem not mentioned above will be clearly understood by those skilled in the art from the description of the invention described below.
상술한 기술적 과제를 해결하기 위한 본 발명의 일 실시예에 따른 배터리 팩은, 적어도 하나의 배터리 셀; 상기 배터리 셀로부터 발생된 열을 방출하는 히트 싱크; 적어도 일부가 상기 히트 싱크와 접하는 인쇄회로기판; 및 상기 인쇄회로기판 상에 실장 되어 상기 히트 싱크로부터 상기 인쇄회로기판으로 전도된 열을 감지하는 온도 소자;를 포함한다.Battery pack according to an embodiment of the present invention for solving the above technical problem, at least one battery cell; A heat sink dissipating heat generated from the battery cell; A printed circuit board at least partially in contact with the heat sink; And a temperature element mounted on the printed circuit board to sense heat conducted from the heat sink to the printed circuit board.
상기 인쇄회로기판은, 기판 본체부; 및 상기 기판 본체부의 일 측으로부터 연장되어 상기 히트 싱크와 연결되는 기판 연장부;를 포함할 수 있다.The printed circuit board includes a substrate main body portion; And a substrate extension part extending from one side of the substrate body part and connected to the heat sink.
상기 기판 연장부의 제1 면의 적어도 일부 영역에는 상기 히트 싱크와 접하는 열전도 코팅층이 형성될 수 있다.A heat conductive coating layer may be formed on at least a portion of the first surface of the substrate extension to contact the heat sink.
상기 온도 소자는, 상기 기판 연장부의 제2 면 중 상기 열전도 코팅층이 형성된 영역과 대응되는 열전도 영역 내에 실장될 수 있다.The temperature element may be mounted in a heat conductive region corresponding to a region where the heat conductive coating layer is formed on the second surface of the substrate extension.
상기 기판 연장부는, 상기 온도 소자의 둘레 중 적어도 일부에 형성되되 상기 인쇄회로기판을 관통하여 형성됨으로써 상기 히트 싱크로부터 방출된 열이 상기 온도 소자 쪽으로 전달될 수 있도록 하는 열 전달 홀을 구비할 수 있다.The substrate extension part may include a heat transfer hole which is formed on at least a portion of the circumference of the temperature element and penetrates the printed circuit board so that heat emitted from the heat sink can be transferred to the temperature element. .
상기 열 전달 홀의 내벽 면 상에는 금속층이 형성될 수 있다.A metal layer may be formed on an inner wall surface of the heat transfer hole.
상기 인쇄회로기판은, 상기 기판 본체부와 상기 기판 연장부의 경계 영역에 형성되되 상기 인쇄회로기판을 관통하여 형성됨으로써 상기 히트 싱크로부터 방출된 열이 상기 온도 소자 쪽으로 전달될 수 있도록 하는 열 전달 슬릿을 구비할 수 있다.The printed circuit board may include a heat transfer slit formed at a boundary area between the substrate main body part and the substrate extension part and penetrating the printed circuit board so that heat emitted from the heat sink may be transferred to the temperature element. It can be provided.
상기 기판 연장부는, 상기 인쇄회로기판과 상기 히트 싱크 사이의 체결을 위한 체결 홀을 구비할 수 있다.The substrate extension part may include a fastening hole for fastening between the printed circuit board and the heat sink.
상기 인쇄회로기판과 상기 히트 싱크는 볼트에 의해 상호 체결될 수 있다.The printed circuit board and the heat sink may be fastened to each other by bolts.
상기 온도 소자는, NTC 소자일 수 있다.The temperature device may be an NTC device.
상기 인쇄회로기판은 상기 온도 소자의 전기적 연결을 위한 제1 단자 및 상기 배터리 셀과 전기적으로 연결되어 상기 배터리 셀의 단자로서 기능하는 제2 단자를 포함하며, 상기 제1 단자와 제2 단자는 절연내력을 유지하기 위해 일정 거리를 유지할 수 있다.The printed circuit board includes a first terminal for electrically connecting the temperature element and a second terminal electrically connected to the battery cell to function as a terminal of the battery cell, wherein the first terminal and the second terminal are insulated from each other. You can maintain a certain distance to maintain the strength.
한편, 상술한 기술적 과제를 해결하기 위한 본 발명의 일실시예에 따른 인쇄회로기판은, 적어도 일부가 배터리 셀로부터 발생된 열을 방출하는 히트 싱크와 접하는 인쇄회로기판; 및 상기 인쇄회로기판 상에 실장되어 상기 히트 싱크로부터 상기 인쇄회로기판으로 전도된 열을 감지하는 온도 소자;를 포함한다.On the other hand, a printed circuit board according to an embodiment of the present invention for solving the above technical problem, at least a portion of the printed circuit board in contact with the heat sink for dissipating heat generated from the battery cell; And a temperature element mounted on the printed circuit board to sense heat conducted from the heat sink to the printed circuit board.
본 발명의 일 측면에 따르면, 온도 소자를 인쇄회로기판에 연결시키기 위한 공정의 간소화 및 원가 절감이 가능하여 생산성을 향상시킬 수 있게 된다.According to one aspect of the invention, it is possible to simplify the process for reducing the temperature element to the printed circuit board and to reduce the cost to improve productivity.
본 발명의 다른 측면에 따르면, 온도 소자와 인쇄회로기판 사이의 단선에 따른 제품 불량 발생을 방지할 수 있게 된다.According to another aspect of the invention, it is possible to prevent the occurrence of product defects due to disconnection between the temperature element and the printed circuit board.
본 발명의 또 다른 측면에 따르면, 배터리에서 발생된 열을 온도 소자에 좀 더 신속하고 정확하게 전달할 수 있어 배터리의 온도 검출 효율성을 높일 수 있게된다.According to another aspect of the present invention, it is possible to transfer heat generated from the battery to the temperature element more quickly and accurately, thereby increasing the temperature detection efficiency of the battery.
본 명세서에 첨부되는 다음의 도면들은 본 발명의 바람직한 실시예를 예시하는 것이며, 후술되는 발명의 상세한 설명과 함께 본 발명의 기술사상을 더욱 이해시키는 역할을 하는 것이므로, 본 발명은 그러한 도면에 기재된 사항에만 한정되어 해석되어서는 아니 된다.The following drawings attached to this specification are illustrative of the preferred embodiments of the present invention, and together with the detailed description of the invention to serve to further understand the technical spirit of the present invention, the present invention is a matter described in such drawings It should not be construed as limited to.
도 1은, 본 발명의 일 실시예에 따른 배터리 팩에 있어서 인쇄회로기판 및 히트 싱크가 결합된 상태를 나타내는 실물 사진이다.1 is a real picture showing a state in which a printed circuit board and a heat sink are combined in a battery pack according to an embodiment of the present invention.
도 2는, 본 발명의 일 실시예에 따른 인쇄회로기판 상에 온도 소자가 실장된 모습을 나타내는 실물 사진이다.2 is a real photograph showing a state in which a temperature element is mounted on a printed circuit board according to an exemplary embodiment of the present invention.
도 3은, 본 발명의 일 실시예에 따른 인쇄회로기판의 제1 면을 나타내는 실물 사진이다.3 is a real picture showing a first surface of a printed circuit board according to an embodiment of the present invention.
도 4는, 본 발명의 일 실시예에 따른 배터리 팩에 있어서 인쇄회로기판, 히트 싱크 및 온도 소자가 상호 결합된 형태를 나타내는 평면도이다.4 is a plan view illustrating a printed circuit board, a heat sink, and a temperature element coupled together in a battery pack according to an exemplary embodiment of the present invention.
도 5는, 도 4에 도시된 v-v 라인을 따라 절단된 형태를 나타내는 측 단면도이다.FIG. 5 is a side cross-sectional view illustrating a form cut along the v-v line illustrated in FIG. 4.
도 6은 및 도 7은, 본 발명의 일 실시예에 따른 배터리 팩에 있어서 열이 방출되는 경로를 모식적으로 나타내는 도면이다.6 and 7 are diagrams schematically showing a path through which heat is released in the battery pack according to an embodiment of the present invention.
도 8은, 본 발명의 일 실시예에 따른 배터리 팩에 있어서, 온도소자 설치 단자와 배터리 파워 단자 사이의 거리를 나타내는 평면도이다.8 is a plan view illustrating a distance between a temperature element mounting terminal and a battery power terminal in a battery pack according to an embodiment of the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명하기로 한다. 이에 앞서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니 되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다. 따라서, 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일부 실시예에 불과할 뿐이고 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형예들이 있을 수 있음을 이해하여야 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only some of the most preferred embodiments of the present invention and do not represent all of the technical spirit of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.
먼저, 도 1 내지 도 5를 참조하여 본 발명의 일 실시예에 따른 배터리 팩 구조를 설명하기로 한다.First, a battery pack structure according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 to 5.
도 1은 본 발명의 일 실시예에 따른 배터리 팩에 있어서 인쇄회로기판 및 히트 싱크가 결합된 상태를 나타내는 실물 사진이고, 도 2는 본 발명의 일 실시예에 따른 인쇄회로기판 상에 온도 소자가 실장된 모습을 나타내는 실물 사진이며, 도 3은 본 발명의 일 실시예에 따른 인쇄회로기판의 제1 면을 나타내는 실물 사진이다. 또한, 도 4는, 본 발명의 일 실시예에 따른 배터리 팩에 있어서 인쇄회로기판, 히트 싱크 및 온도 소자가 상호 결합된 형태를 나타내는 평면도이고, 도 5는, 도 4에 도시된 v-v 라인을 따라 절단된 형태를 나타내는 측 단면도이다.1 is a real picture showing a state in which a printed circuit board and a heat sink are combined in a battery pack according to an embodiment of the present invention, Figure 2 is a temperature element on a printed circuit board according to an embodiment of the present invention 3 is a real picture showing a mounted state, and FIG. 3 is a real picture showing a first surface of a printed circuit board according to an exemplary embodiment of the present invention. FIG. 4 is a plan view illustrating a printed circuit board, a heat sink, and a temperature device coupled to each other in the battery pack according to an exemplary embodiment of the present invention. FIG. 5 is a view along the line vv shown in FIG. 4. It is a side sectional drawing which shows the cut | disconnected form.
도 1 내지 도 5를 참조하면, 본 발명의 일 실시예에 따른 배터리 팩은 배터리 셀(미도시), 히트 싱크(10), 인쇄회로기판(PCB: printed circuit board)(20) 및 온도 소자(30)를 포함하는 형태로 구현될 수 있다.1 to 5, a battery pack according to an embodiment of the present invention includes a battery cell (not shown), a heat sink 10, a printed circuit board (PCB) 20, and a temperature element ( It may be implemented in a form including 30).
상기 배터리 셀은, 배터리 팩의 용도나 요구되는 용량 등에 따라 다양한 종류가 적용 가능하며, 예를 들어 파우치 케이스 내에 전극 조립체를 수용시킨 후 전극 조립체와 연결된 한 쌍의 전극 리드가 외부로 인출된 상태로 파우치 케이스의 테두리 영역을 열 융착 하는 방식으로 실링 함으로써 제조되는 파우치 타입 셀이 적용될 수 있다.The battery cell may be applied in various kinds according to the purpose or required capacity of the battery pack. For example, after accommodating the electrode assembly in a pouch case, a pair of electrode leads connected to the electrode assembly may be drawn out. A pouch type cell manufactured by sealing the edge region of the pouch case in a heat-sealed manner may be applied.
상기 히트 싱크(heat sink)(10)는, 배터리 셀과 직접 또는 간접적으로 접하여 배터리 셀로부터 발생된 열을 방출하는 기능을 수행한다.The heat sink 10 is in direct or indirect contact with the battery cell to perform the function of dissipating heat generated from the battery cell.
상기 히트 싱크(10)는 배터리 셀로부터 발생된 열을 효율적으로 전달 받기 위해 배터리 셀 중 특히 발열량이 큰 전극 리드(T, 도 5 참조)와 직접 접촉하거나 또는 이러한 전극 리드와 연결된 리드 컨덕터(lead conductor)와 같은 부품과 접촉하도록 설치될 수 있다.The heat sink 10 is a lead conductor directly contacting or connected to an electrode lead T (see FIG. 5) having a particularly high heat generation value among the battery cells in order to efficiently transfer heat generated from the battery cell. It may be installed to contact a component such as).
한편, 상기 인쇄회로기판(20)은 적어도 일부가 히트 싱크(10)와 접하도록 설치되는 것으로서, 이러한 인쇄회로기판(20) 상에는 온도 소자(30)가 실장되며, 온도 소자(30) 외에도 배터리 셀의 동작 제어를 위한 논리회로 칩 및/또는 스위칭 소자 등의 다양한 부품들이 실장될 수 있다.On the other hand, the printed circuit board 20 is at least partially installed in contact with the heat sink 10, the temperature element 30 is mounted on the printed circuit board 20, the battery cell in addition to the temperature element 30 Various components such as a logic circuit chip and / or a switching element for controlling the operation of the device may be mounted.
물론, 상기 배터리 셀의 동작 제어는, 별도의 BMS에 의해 이루어질 수도 있으며, 이 경우 배터리 셀과 BMS 사이의 전기적 연결 및/또는 BMS와 온도 소자(30) 사이의 전기적 연결은 인쇄회로기판(20) 내에 형성된 도전성 회로 패턴에 의해 이루어질 수 있다.Of course, the operation control of the battery cell may be made by a separate BMS, in which case the electrical connection between the battery cell and the BMS and / or the electrical connection between the BMS and the temperature element 30 is a printed circuit board 20 It can be made by a conductive circuit pattern formed therein.
즉, 상기 인쇄회로기판(20)의 역할을 매우 다양할 수 있으나, 본 발명에 있어서는 히트 싱크(10)와 온도 소자(30) 사이의 열 매개체로서의 역할에 대해 집중적으로 설명하기로 한다.That is, although the role of the printed circuit board 20 may be very diverse, the role of the heat medium between the heat sink 10 and the temperature element 30 will be intensively described in the present invention.
상기 인쇄회로기판(20)은, 기판 본체부(20a) 및 기판 본체부(20a)의 일 측으로부터 연장되어 히트 싱크(10)와 접촉하는 기판 연장부(20b)를 포함한다.The printed circuit board 20 includes a substrate main body 20a and a substrate extension 20b extending from one side of the substrate main body 20a and contacting the heat sink 10.
상기 기판 연장부(20b)에는 인쇄회로기판(20)과 히트 싱크(10) 간의 결합을 위한 체결 홀(21)이 형성되어 있다.A fastening hole 21 for coupling between the printed circuit board 20 and the heat sink 10 is formed in the substrate extension part 20b.
또한, 상기 기판 연장부(20b)에는 히트 싱크(10)로부터 온도 소자(30)로 열 전달이 효율적으로 이루어지도록 하기 위한 다양한 구조들이 형성되어 있다.In addition, various structures are formed in the substrate extension part 20b for efficient heat transfer from the heat sink 10 to the temperature element 30.
먼저, 도 3 및 도 5를 함께 참조하면, 기판 연장부(20b)의 양 면 중 히트 싱크(10)와 대면/접촉하는 제1 면 상에는 열전도 코팅층(22)이 형성되어 있다.First, referring to FIGS. 3 and 5, a heat conductive coating layer 22 is formed on a first surface of the both sides of the substrate extension 20b that faces / contacts the heat sink 10.
상기 열전도 코팅층(22)은 히트 싱크(10)와 접촉함으로써 인쇄회로기판(20)의 제2 면 상에 실장되어 있는 온도 소자(30)쪽으로의 열 전달 효율을 높여주는 기능을 수행한다.The heat conductive coating layer 22 performs a function of increasing heat transfer efficiency toward the temperature device 30 mounted on the second surface of the printed circuit board 20 by contacting the heat sink 10.
이러한 기능을 고려할 때, 상기 열전도 코팅층(22)은 가능한 열전도도가 높은 물질로 이루어지는 것이 바람직하며, 생산성 및 열전도도를 모두 고려하여 구리(Cu)로 이루어질 수 있다.In consideration of such a function, the thermal conductive coating layer 22 is preferably made of a material having high thermal conductivity, and may be made of copper (Cu) in consideration of both productivity and thermal conductivity.
한편, 다시 도 1 내지 도 5를 함께 참조하면, 상기 기판 연장부(20b)에는 히트 싱크(10)로부터 온도 소자(30) 쪽으로 가열된 공기가 용이하게 순환되도록 함으로써 열 전달이 효율적으로 이루어질 수 있도록 하기 위한 열 전달 홀(23)들이 형성될 수 있다.Meanwhile, referring to FIGS. 1 to 5 again, the substrate extension part 20b may be easily circulated from the heat sink 10 toward the temperature element 30 so that heat transfer may be efficiently performed. Heat transfer holes 23 may be formed.
상기 열 전달 홀(23)들은 인쇄회로기판(20) 중 온도 소자(30)가 설치된 영역의 둘레 중 적어도 일부에 형성되되 인쇄회로기판(20)을 관통하여 형성됨으로써 히트 싱크(10)로부터 방출된 열이 온도 소자(30) 쪽으로 공기 순환을 통해 전달될 수 있도록 한다.The heat transfer holes 23 are formed in at least a portion of a circumference of a region where the temperature element 30 is installed in the printed circuit board 20, but are formed through the printed circuit board 20 to be discharged from the heat sink 10. Allow heat to be transferred through the air circulation towards the temperature element 30.
이러한 열 전달 홀(23)의 내벽면 상에는 금속층이 형성될 수도 있으며, 이 경우 금속의 우수한 열전도도로 인해 열 전달의 효율성이 더욱 향상될 수 있다.A metal layer may be formed on the inner wall surface of the heat transfer hole 23, in which case the efficiency of heat transfer may be further improved due to the excellent thermal conductivity of the metal.
상기 인쇄회로기판(20)은, 히트 싱크(10)와 온도 소자(30) 사이의 효율적인 열 전달을 위해 열전도 코팅층(22) 및/또는 열 전달 홀(23) 이외에도 열 전달 슬릿(24)을 추가적으로 더 구비할 수도 있다.The printed circuit board 20 further includes a heat transfer slit 24 in addition to the heat conductive coating layer 22 and / or the heat transfer hole 23 for efficient heat transfer between the heat sink 10 and the temperature element 30. It may be further provided.
상기 열 전달 슬릿(24)은, 기판 본체부(20a)와 기판 연장부(20b)의 경계 영역에 형성되되 인쇄회로기판(20)을 관통하여 형성됨으로써 히트 싱크(10)로부터 방출된 열이 온도 소자 쪽으로 더욱 효율적으로 전달될 수 있도록 한다.The heat transfer slit 24 is formed at the boundary area between the substrate main body 20a and the substrate extension 20b but penetrates the printed circuit board 20 so that heat released from the heat sink 10 is heated. It can be delivered more efficiently toward the device.
한편, 본 발명의 도 4 및 도 5를 참조하면, 상기 인쇄회로기판(20)의 제2 면 상에는 일부 영역에 금속 코팅층(25)이 형성될 수도 있는데, 이러한 금속 코팅층(25)은 체결 홀(21)의 둘레 영역 및 그에 인접한 영역에까지 형성될 수 있다.Meanwhile, referring to FIGS. 4 and 5 of the present invention, a metal coating layer 25 may be formed on a portion of the printed circuit board 20 in a portion of the printed circuit board 20, and the metal coating layer 25 may include a fastening hole ( Up to the periphery of 21) and the region adjacent thereto.
이러한 금속 코팅층(25)은 앞서 설명한 인쇄회로기판(20)의 제1 면 상에 형성된 열전도 코팅층(22)과 연결될 수도 있으며, 이 경우 전도 방식에 의한 열전달 효율이 더욱 향상될 수 있다.The metal coating layer 25 may be connected to the heat conductive coating layer 22 formed on the first surface of the printed circuit board 20 described above, in which case the heat transfer efficiency by the conduction method may be further improved.
본 발명의 일 실시예에 따른 배터리 팩에 적용되는 온도 소자(30)는, 온도에 따른 전기적 물성 변화로 인해 온도의 변화 수준을 감지할 수 있는 것이라면 특별히 그 종류가 제한되지는 않는다.The temperature element 30 applied to the battery pack according to an embodiment of the present invention is not particularly limited as long as it can detect a change in temperature due to a change in electrical properties with temperature.
상기 온도 소자로는, 예를 들어 온도의 상승에 따라 저항 값이 점점 작아지는 NTC 소자(negative temperature coefficient device) 또는 온도의 상승에 따라 저항의 값이 점점 커지는 PTC 소자(positive temperature coefficient device) 등이 이용될 수 있다.Examples of the temperature device include an NTC device (negative temperature coefficient device) in which the resistance value gradually decreases as the temperature increases, or a PTC device (positive temperature coefficient device) in which the resistance value gradually increases as the temperature increases. Can be used.
도 6 및 도 7을 참조하면, 본 발명의 일 실시예에 따른 인쇄회로기판(20)에 구비된 열전도 코팅층(22), 열 전달 홀(23), 그리고 열 전달 슬릿(24)에 의한 열 전달 경로가 구체적으로 나타나 있다.6 and 7, heat transfer by the heat conductive coating layer 22, the heat transfer hole 23, and the heat transfer slit 24 provided in the printed circuit board 20 according to the exemplary embodiment of the present invention. The route is shown in detail.
도 6은 및 도 7은, 본 발명의 일 실시예에 따른 배터리 팩에 있어서 열이 방출되는 경로를 모식적으로 나타내는 도면이다.6 and 7 are diagrams schematically showing a path through which heat is released in the battery pack according to an embodiment of the present invention.
도 6 및 도 7을 참조하면, 상기 히트 싱크(10)가 배터리 셀(미도시)에 구비된 전극 리드(T)와 접하여 열을 흡수한 후 상방으로 다시 방출하면, 방출된 열은 인쇄회로기판(20)의 제1 면으로부터 열전도 코팅층(22), 열 전달 홀(23) 및 열 전달 슬릿(24)을 통해 온도 소자(30)가 설치된 제2 면 쪽으로 전달됨을 알 수 있다.6 and 7, when the heat sink 10 absorbs heat in contact with the electrode lead T provided in the battery cell (not shown) and releases the heat upward again, the heat is released from the printed circuit board. It can be seen that the heat transfer coating layer 22, the heat transfer hole 23, and the heat transfer slit 24 are transferred from the first side of the 20 side toward the second side where the temperature element 30 is installed.
한편, 도 8에는, 본 발명에 따른 배터리 팩에 있어서 온도 소자 설치 단자와 배터리 파워 단자 사이의 거리 관계가 나타나 있다.8 shows a distance relationship between the temperature element mounting terminal and the battery power terminal in the battery pack according to the present invention.
도 8은, 본 발명의 일 실시예에 따른 배터리 팩에 있어서, 온도소자 설치 단자와 배터리 파워 단자 사이의 거리를 나타내는 평면도이다.8 is a plan view illustrating a distance between a temperature element mounting terminal and a battery power terminal in a battery pack according to an embodiment of the present invention.
도 8을 참조하면, 인쇄회로기판(20)은 온도 소자(30)의 설치를 위한 한 쌍의 온도소자 설치 단자(26)를 구비할 수 있고, 앞서 설명한 인쇄회로기판(20)의 제2 면 상에 형성된 금속 코팅층(25)은 배터리 셀의 단자로서 기능하는 배터리 파워 단자에 해당할 수 있다.Referring to FIG. 8, the printed circuit board 20 may include a pair of temperature device mounting terminals 26 for installing the temperature device 30, and the second surface of the printed circuit board 20 described above. The metal coating layer 25 formed thereon may correspond to a battery power terminal functioning as a terminal of the battery cell.
이 경우, 양 단자 사이에는 절연이 유지되어야 하는데, 이러한 절연 유지를 위해 배터리 파워 단자(25)와 온도소자 설치 단자(26)는 일정 거리를 유지할 수 있다. 일 예로서, 요구되는 절연 내력이 대략 2KV 수준인 경우, 양 단자 사이의 거리는 최소한 1.75mm 이상의 간격을 유지하는 것이 바람직하다.In this case, insulation must be maintained between both terminals. In order to maintain such insulation, the battery power terminal 25 and the temperature element mounting terminal 26 can maintain a predetermined distance. As an example, when the required dielectric strength is approximately 2KV, the distance between both terminals is preferably maintained at least 1.75mm.
상술한 바와 같이, 본 발명의 일 실시예에 따른 배터리 팩은 온도 소자(30)가 인쇄회로기판(20) 상에 직접 실장되어 있으므로 인쇄회로기판(20)과 온도 소자(30) 사이의 연결 불량이 발생될 위험이 매우 적다.As described above, in the battery pack according to the exemplary embodiment of the present invention, since the temperature device 30 is directly mounted on the printed circuit board 20, the connection between the printed circuit board 20 and the temperature device 30 is poor. There is very little risk of this occurring.
즉, 인쇄회로기판(20)과 온도 소자(30) 사이를 별도의 케이블 등을 이용하여 연결하고자 하는 경우 공정이 번거로울 뿐만 아니라, 케이블과 인쇄회로기판(20)의 결합을 위한 납땜 부위가 제품의 사용 과정에서 파손되어 접촉 불량이 발생될 위험 또한 높다. 반면, 본 발명에 따른 배터리 팩의 경우 온도 소자(30)가 인쇄회로기판(20)에 직접 실장되는 구조를 가지므로 공정상의 이점을 가질 수 있을 뿐만 아니라 연결 부위 파손에 따른 접촉 불량의 위험 역시 매우 적다.In other words, if the printed circuit board 20 and the temperature element 30 are to be connected by using a separate cable, the process is cumbersome, and a soldering part for coupling the cable and the printed circuit board 20 may be formed. There is also a high risk of breakage during use and poor contact. On the other hand, the battery pack according to the present invention has a structure in which the temperature element 30 is mounted directly on the printed circuit board 20, which may not only have a process advantage but also a risk of poor contact due to breakage of the connection part. little.
또한, 본 발명의 일 실시예에 따른 배터리 팩은 히트 싱크(10)와 온도 소자(30) 사이의 열 전달이 효율적으로 이루어질 수 있는 구조를 가짐으로써 신속하고 정확한 셀 온도 측정이 가능하며, 이로써 열 발생에 따른 적절한 배터리 팩 운용을 가능하게 한다.In addition, the battery pack according to an embodiment of the present invention has a structure in which the heat transfer between the heat sink 10 and the temperature element 30 can be efficiently performed, it is possible to measure the cell temperature quickly and accurately, thereby heat Enables proper battery pack operation according to the occurrence.
이상에서 본 발명은 비록 한정된 실시예와 도면에 의해 설명되었으나, 본 발명은 이것에 의해 한정되지 않으며 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 본 발명의 기술사상과 아래에 기재될 특허청구범위의 균등범위 내에서 다양한 수정 및 변형이 가능함은 물론이다.Although the present invention has been described above by means of limited embodiments and drawings, the present invention is not limited thereto and will be described below by the person skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of the claims.

Claims (20)

  1. 적어도 하나의 배터리 셀;At least one battery cell;
    상기 배터리 셀로부터 발생된 열을 방출하는 히트 싱크;A heat sink dissipating heat generated from the battery cell;
    적어도 일부가 상기 히트 싱크와 접하는 인쇄회로기판; 및A printed circuit board at least partially in contact with the heat sink; And
    상기 인쇄회로기판 상에 실장되어 상기 히트 싱크로부터 상기 인쇄회로기판으로 전도된 열을 감지하는 온도 소자;A temperature element mounted on the printed circuit board to sense heat conducted from the heat sink to the printed circuit board;
    를 포함하는 배터리 팩.Battery pack comprising a.
  2. 제1항에 있어서,The method of claim 1,
    상기 인쇄회로기판은,The printed circuit board,
    기판 본체부; 및A substrate main body; And
    상기 기판 본체부의 일측으로부터 연장되어 상기 히트 싱크와 연결되는 기판 연장부;A substrate extension part extending from one side of the substrate body part and connected to the heat sink;
    를 포함하는 것을 특징으로 하는 배터리 팩.Battery pack comprising a.
  3. 제2항에 있어서,The method of claim 2,
    상기 기판 연장부의 제1 면의 적어도 일부 영역에는 상기 히트 싱크와 접하는 열전도 코팅층이 형성된 것을 특징으로 하는 배터리 팩.And at least a portion of a first surface of the substrate extension, wherein a heat conductive coating layer is in contact with the heat sink.
  4. 제3항에 있어서,The method of claim 3,
    상기 온도 소자는,The temperature element,
    상기 기판 연장부의 제2 면 중 상기 열전도 코팅층이 형성된 영역과 대응되는 열전도 영역 내에 실장되는 것을 특징으로 하는 배터리 팩.The battery pack of claim 2, wherein the battery pack is mounted in a heat conduction region corresponding to a region where the heat conduction coating layer is formed.
  5. 제2항에 있어서,The method of claim 2,
    상기 기판 연장부는,The substrate extension portion,
    상기 온도 소자의 둘레 중 적어도 일부에 형성되되 상기 인쇄회로기판을 관통하여 형성됨으로써 상기 히트 싱크로부터 방출된 열이 상기 온도 소자 쪽으로 전달될 수 있도록 하는 열 전달 홀을 구비하는 것을 특징으로 하는 배터리 팩.And a heat transfer hole formed in at least a portion of a circumference of the temperature element and penetrating through the printed circuit board so that heat emitted from the heat sink can be transferred to the temperature element.
  6. 제5항에 있어서,The method of claim 5,
    상기 열 전달 홀의 내벽면 상에는 금속층이 형성된 것을 특징으로 하는 배터리 팩.The battery pack, characterized in that the metal layer is formed on the inner wall surface of the heat transfer hole.
  7. 제2항에 있어서,The method of claim 2,
    상기 인쇄회로기판은,The printed circuit board,
    상기 기판 본체부와 상기 기판 연장부의 경계 영역에 형성되되 상기 인쇄회로기판을 관통하여 형성됨으로써 상기 히트 싱크로부터 방출된 열이 상기 온도 소자 쪽으로 전달될 수 있도록 하는 열 전달 슬릿을 구비하는 것을 특징으로 하는 배터리 팩.And a heat transfer slit formed at a boundary area between the substrate body part and the substrate extension part and penetrating the printed circuit board so that heat emitted from the heat sink can be transferred to the temperature element. Battery pack.
  8. 제2항에 있어서,The method of claim 2,
    상기 기판 연장부는,The substrate extension portion,
    상기 인쇄회로기판과 상기 히트 싱크 사이의 체결을 위한 체결 홀을 구비하는 것을 특징으로 하는 배터리 팩.And a fastening hole for fastening between the printed circuit board and the heat sink.
  9. 제8항에 있어서,The method of claim 8,
    상기 인쇄회로기판과 상기 히트 싱크는 볼트에 의해 상호 체결되는 것을 특징으로 하는 배터리 팩.The printed circuit board and the heat sink is a battery pack, characterized in that fastened to each other by a bolt.
  10. 제1항에 있어서,The method of claim 1,
    상기 온도 소자는,The temperature element,
    NTC 소자인 것을 특징으로 하는 배터리 팩.A battery pack, which is an NTC element.
  11. 제1항에 있어서,The method of claim 1,
    상기 인쇄회로기판은 상기 온도 소자의 전기적 연결을 위한 온도소자 설치 단자 및 상기 배터리 셀과 전기적으로 연결되어 상기 배터리 셀의 단자로서 기능하는 배터리 파워 단자를 포함하며,The printed circuit board includes a temperature element mounting terminal for electrical connection of the temperature element, and a battery power terminal electrically connected to the battery cell and functioning as a terminal of the battery cell.
    상기 온도소자 설치 단자와 상기 배터리 파워 단자 사이의 거리는 적어도 1.75mm 이상인 것을 특징으로 하는 배터리 팩.And the distance between the temperature element mounting terminal and the battery power terminal is at least 1.75 mm or more.
  12. 적어도 일부가 배터리 셀로부터 발생된 열을 방출하는 히트 싱크와 접하는 인쇄회로기판; 및A printed circuit board at least partially in contact with a heat sink that emits heat generated from the battery cell; And
    상기 인쇄회로기판 상에 실장되어 상기 히트 싱크로부터 상기 인쇄회로기판으로 전도된 열을 감지하는 온도 소자;A temperature element mounted on the printed circuit board to sense heat conducted from the heat sink to the printed circuit board;
    를 포함하는 인쇄회로기판 조립체.Printed circuit board assembly comprising a.
  13. 제12항에 있어서,The method of claim 12,
    상기 인쇄회로기판은,The printed circuit board,
    기판 본체부; 및A substrate main body; And
    상기 기판 본체의 일측으로부터 연장되어 상기 히트 싱크와 연결되는 기판 연장부;A substrate extension part extending from one side of the substrate body and connected to the heat sink;
    를 포함하는 것을 특징으로 하는 인쇄회로기판 조립체.Printed circuit board assembly comprising a.
  14. 제13항에 있어서,The method of claim 13,
    상기 기판 연장부의 제1 면의 적어도 일부 영역에는 상기 히트 싱크와 접하는 열전도 코팅층이 형성된 것을 특징으로 하는 인쇄회로기판 조립체.Printed circuit board assembly, characterized in that the heat conductive coating layer in contact with the heat sink is formed in at least a portion of the first surface of the substrate extension.
  15. 제14항에 있어서,The method of claim 14,
    상기 온도 소자는,The temperature element,
    상기 기판 연장부의 제2 면 중 상기 열전도 코팅층이 형성된 영역과 대응되는 열전도 영역 내에 실장되는 것을 특징으로 하는 인쇄회로기판 조립체.The printed circuit board assembly of claim 2, wherein the printed circuit board assembly is mounted in a thermally conductive region corresponding to a region where the thermally conductive coating layer is formed on the second surface of the substrate extension.
  16. 제13항에 있어서,The method of claim 13,
    상기 기판 연장부는,The substrate extension portion,
    상기 온도 소자의 둘레 중 적어도 일부에 형성되되 상기 인쇄회로기판을 관통하여 형성됨으로써 상기 히트 싱크로부터 방출된 열이 상기 온도 소자 쪽으로 전달될 수 있도록 하는 열 전달 홀을 구비하는 것을 특징으로 하는 인쇄회로기판 조립체.A printed circuit board formed on at least a portion of a circumference of the temperature element, the heat transfer hole being formed through the printed circuit board to allow heat emitted from the heat sink to be transferred to the temperature element; Assembly.
  17. 제16항에 있어서,The method of claim 16,
    상기 열 전달 홀의 내벽면 상에는 금속층이 형성된 것을 특징으로 하는 인쇄회로기판 조립체.Printed circuit board assembly, characterized in that the metal layer is formed on the inner wall surface of the heat transfer hole.
  18. 제13항에 있어서,The method of claim 13,
    상기 인쇄회로기판은,The printed circuit board,
    상기 기판 본체부와 상기 기판 연장부의 경계 영역에 형성되되 상기 인쇄회로기판을 관통하여 형성됨으로써 상기 히트 싱크로부터 방출된 열이 상기 온도 소자 쪽으로 전달될 수 있도록 하는 열 전달 슬릿을 구비하는 것을 특징으로 하는 인쇄회로기판 조립체.And a heat transfer slit formed at a boundary area between the substrate body part and the substrate extension part and penetrating the printed circuit board so that heat emitted from the heat sink can be transferred to the temperature element. Printed circuit board assembly.
  19. 제13항에 있어서,The method of claim 13,
    상기 기판 연장부는,The substrate extension portion,
    상기 인쇄회로기판과 상기 히트 싱크 사이의 체결을 위한 체결 홀을 구비하는 것을 특징으로 하는 인쇄회로기판 조립체.And a fastening hole for fastening between the printed circuit board and the heat sink.
  20. 제12항에 있어서,The method of claim 12,
    상기 인쇄회로기판은 상기 온도 소자의 전기적 연결을 위한 온도소자 설치 단자 및 상기 배터리 셀과 전기적으로 연결되어 상기 배터리 셀의 단자로서 기능하는 배터리 파워 단자를 포함하며,The printed circuit board includes a temperature element mounting terminal for electrical connection of the temperature element, and a battery power terminal electrically connected to the battery cell and functioning as a terminal of the battery cell.
    상기 온도소자 설치 단자와 상기 배터리 파워 단자 사이의 거리는 적어도 1.75mm 이상인 것을 특징으로 하는 인쇄회로기판 조립체.Printed circuit board assembly, characterized in that the distance between the temperature element mounting terminal and the battery power terminal is at least 1.75mm or more.
PCT/KR2016/002921 2015-03-23 2016-03-23 Battery pack having structure capable of efficiently sensing temperature, and temperature sensor-mounted printed circuit board applied to same WO2016153268A1 (en)

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KR1020150040020A KR101733088B1 (en) 2015-03-23 2015-03-23 Battery pack with structure of enabling effective temperature detection and Temperature device mounting type printed circuit board applied for the same
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108183275A (en) * 2017-02-22 2018-06-19 深圳市格瑞普电池有限公司 Li-ion batteries piles with temperature detecting function
CN110495046A (en) * 2017-11-07 2019-11-22 株式会社Lg化学 Device and method for estimating the temperature of battery
DE102019219602A1 (en) * 2019-12-13 2021-06-17 Viessmann Werke Gmbh & Co Kg Temperature measuring device
WO2021142842A1 (en) * 2020-01-19 2021-07-22 深圳市明唐通信有限公司 Protection circuit apparatus for lithium ion battery
TWI788414B (en) * 2018-01-10 2023-01-01 南韓商三星電機股份有限公司 Printed circuit board and battery module having the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3346524A1 (en) * 2017-01-09 2018-07-11 Samsung SDI Co., Ltd Battery module with thermocouple unit
KR20200124996A (en) 2019-04-25 2020-11-04 주식회사 엘지화학 Bms circuit and battery pack including the bms circuit

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179085A (en) * 2002-11-28 2004-06-24 Sanyo Electric Co Ltd Battery pack
JP2011066002A (en) * 2004-02-20 2011-03-31 Autonetworks Technologies Ltd Battery temperature-detecting device and on-board power supply distribution device
JP4718978B2 (en) * 2005-11-30 2011-07-06 クロイ電機株式会社 Heat sink and circuit board for heat dissipation
KR20150005288A (en) * 2013-07-05 2015-01-14 주식회사 엘지화학 Battery pack and Protective circuit module applied for the same
KR20150006650A (en) * 2013-07-09 2015-01-19 삼성에스디아이 주식회사 Battery Pack

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179085A (en) * 2002-11-28 2004-06-24 Sanyo Electric Co Ltd Battery pack
JP2011066002A (en) * 2004-02-20 2011-03-31 Autonetworks Technologies Ltd Battery temperature-detecting device and on-board power supply distribution device
JP4718978B2 (en) * 2005-11-30 2011-07-06 クロイ電機株式会社 Heat sink and circuit board for heat dissipation
KR20150005288A (en) * 2013-07-05 2015-01-14 주식회사 엘지화학 Battery pack and Protective circuit module applied for the same
KR20150006650A (en) * 2013-07-09 2015-01-19 삼성에스디아이 주식회사 Battery Pack

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108183275A (en) * 2017-02-22 2018-06-19 深圳市格瑞普电池有限公司 Li-ion batteries piles with temperature detecting function
CN110495046A (en) * 2017-11-07 2019-11-22 株式会社Lg化学 Device and method for estimating the temperature of battery
US11552343B2 (en) 2017-11-07 2023-01-10 Lg Energy Solution, Ltd. Apparatus and method for estimating temperature of battery
TWI788414B (en) * 2018-01-10 2023-01-01 南韓商三星電機股份有限公司 Printed circuit board and battery module having the same
DE102019219602A1 (en) * 2019-12-13 2021-06-17 Viessmann Werke Gmbh & Co Kg Temperature measuring device
WO2021142842A1 (en) * 2020-01-19 2021-07-22 深圳市明唐通信有限公司 Protection circuit apparatus for lithium ion battery

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