KR20170026952A - Unit for supplying chemical and Apparatus for treating substrate - Google Patents

Unit for supplying chemical and Apparatus for treating substrate Download PDF

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Publication number
KR20170026952A
KR20170026952A KR1020150123172A KR20150123172A KR20170026952A KR 20170026952 A KR20170026952 A KR 20170026952A KR 1020150123172 A KR1020150123172 A KR 1020150123172A KR 20150123172 A KR20150123172 A KR 20150123172A KR 20170026952 A KR20170026952 A KR 20170026952A
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KR
South Korea
Prior art keywords
plate
supply line
liquid
buffer space
hole
Prior art date
Application number
KR1020150123172A
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Korean (ko)
Inventor
김재열
신철용
정은선
Original Assignee
세메스 주식회사
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Priority to KR1020150123172A priority Critical patent/KR20170026952A/en
Publication of KR20170026952A publication Critical patent/KR20170026952A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention provides an apparatus for supplying a liquid chemical. A chemical supply unit includes: a treatment container having a treatment space therein; a substrate support unit supporting a substrate in the treatment space; and a liquid chemical supply unit supplying a treatment liquid to a substrate supported by the substrate support unit. The liquid chemical supply unit includes: an upstream supply line supplying the treatment liquid; a downstream supply line supplying, to a nozzle, the treatment liquid supplied from the upstream supply line; and a bubble removing member connecting the upstream supply line and the downstream supply line. The bubble removing member includes a buffer tank situated between the upstream supply line and the downstream supply line and having a buffer space therein; a first plate situated in the buffer space and having a plurality of first holes; and a bubble discharge line connected to an area of the buffer space higher than the first plate. Bubbles in the flowing treatment liquid may be removed.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a liquid supply unit,

The present invention relates to an apparatus for supplying a liquid.

In order to manufacture semiconductor devices or liquid crystal displays, various processes such as photolithography, ashing, etching, ion implantation, thin film deposition, and cleaning are performed on the substrate. Among these, the cleaning process is a process of removing particles remaining on the substrate, and proceeds in the stages before and after each process.

In general, a cleaning process is a liquid processing process for removing particles remaining on a substrate by using a process liquid. Depending on the progress of the liquid treatment process, the treatment liquid is stored in the supply tank or is supplied to the nozzle from the supply tank. 1 is a cross-sectional view showing a general liquid supply unit. Referring to Fig. 1, the liquid supply unit includes a supply tank 6, a liquid supply line 2, a bubble removing member 4, a flow meter, and a nozzle 8. The bubble removing member 4 is provided in the primary supply line. The bubble removing member 4 removes the bubble from the processing liquid supplied to the supply tank 4. The bubble removing member 4 removes the bubble by the density difference of the bubble with respect to the process liquid in which the flow is stopped.

However, it is difficult for the bubble removing member 4 in Fig. 2 to expect bubble removal for the flowing process liquid. As a result, bubbles frequently cause measurement errors during flow measurement. Abnormal alarms frequently occur with such measurement errors, which may cause the liquid processing process to stop.

Korean Patent Publication No. 2014-0120232

An object of the present invention is to provide an apparatus capable of improving the efficiency of a liquid processing process of a substrate.

The present invention seeks to provide a device capable of removing bubbles of a flowing process liquid.

An embodiment of the present invention provides an apparatus for supplying a liquid. The liquid supply unit includes a processing vessel having a processing space therein, a substrate supporting unit for supporting the substrate in the processing space, and a liquid supply unit for supplying the processing liquid onto the substrate supported by the substrate supporting unit, The supply unit includes an upstream supply line for supplying the process liquid, a downstream supply line for supplying the process liquid supplied from the upstream supply line to the nozzle, and a bubble removing member for connecting the upstream supply line and the downstream supply line to each other The bubble removing member includes a buffer tank positioned between the upstream supply line and the downstream supply line and having a buffer space therein, a first plate positioned in the buffer space and having a plurality of first holes formed therein, And a bubble exhaust line connected to an area of the buffer space higher than the first plate.

Wherein the bubble removing member includes a second plate positioned below the first plate and facing the first plate in the buffer space and having a plurality of second holes formed therein, And the second holes may be positioned so as not to overlap with each other. Wherein the first plate is located closer to the upstream feed line than the second plate and the second plate is positioned closer to the downstream feed line than the first plate, The holes may have diameters different from each other. The first hole may have a smaller diameter than the second hole.

Alternatively, the second hole may have a smaller diameter than the first hole. The buffer tank further includes a housing having the buffer space therein and an inlet port located above the first plate and fixedly coupled to the housing to allow process liquid to flow into the buffer space at the upstream supply line, The port may be provided in a tubular shape having a smaller opening area as it approaches the first plate. The area of the first plate facing the opening of the inlet port as viewed from above may be provided as a blocking area. The first hole may be arranged to surround the blocking region when viewed from above. The inlet port is located at the center of the upper surface of the housing when viewed from above, and the bubble exhaust line may be connected to an off-center position on the upper surface of the housing. Wherein the housing has a tubular body portion having the buffer space therein and a ring-shaped discharge portion extending downward from a lower end of the body portion, the outlet portion having a smaller cross-sectional surface as it goes downward And the downstream supply line may be connected to the lower end of the discharge unit. Wherein the liquid supply unit includes a supply tank in which the process liquid is accommodated and a supply tank to which the downstream supply line is connected and a liquid supply line for connecting the supply tank and the nozzles to each other, A flow meter for measuring the flow rate of the liquid, and a controller for controlling the valve installed in the downstream supply line based on the information transmitted from the flow meter.

The unit for supplying the treatment liquid includes an upstream supply line for supplying the treatment liquid, a downstream supply line for supplying the treatment liquid supplied from the upstream supply line to the nozzle, and a bubble eliminating unit for connecting the upstream supply line and the downstream supply line, Wherein the bubble removal member comprises a buffer tank positioned between the upstream supply line and the downstream supply line and having a buffer space therein, a first tank located in the buffer space, And a bubble exhaust line connected to the region of the buffer space higher than the first plate.

Wherein the bubble removing member includes a second plate positioned below the first plate and facing the first plate in the buffer space and having a plurality of second holes formed therein, And the second holes may be positioned so as not to overlap with each other. The buffer tank further includes a housing having the buffer space therein, an inlet port located above the first plate and fixedly coupled to the housing to allow the process liquid to flow into the buffer space at the upstream supply line, The port may be provided in a tubular shape having a smaller opening area as it approaches the first plate. The area of the first plate facing the opening of the inlet port as viewed from above may be provided as a blocking area. The inlet port is located at the center of the upper surface of the housing when viewed from above, and the bubble exhaust line may be connected to an off-center position on the upper surface of the housing. Wherein the housing has a tubular body portion having the buffer space therein and a ring-shaped discharge portion extending downward from a lower end of the body portion, the outlet portion having a smaller cross-sectional surface as it goes downward And the downstream supply line may be connected to the lower end of the discharge unit.

According to the embodiment of the present invention, the bubble is removed in the process of passing the processing solution through the hole-formed plate. This makes it possible to remove bubbles of the processing liquid flowing.

According to an embodiment of the present invention, a plurality of plates are provided, and the holes formed in each plate are arranged differently from each other. As a result, the treatment liquid is scattered on each plate in the process of passing through the holes, so that the bubbles can be more easily separated.

Further, according to the embodiment of the present invention, the inflow opening of the housing has a shape gradually becoming narrower toward the inside thereof. As a result, the inflow speed of the process liquid gradually increases toward the inside thereof, and the bubble can be prevented from being re-introduced into the inflow port.

Further, according to the embodiment of the present invention, the cross section of the lower region of the housing is narrowed downward. Accordingly, the bubble can be collected toward the central axis of the housing and can be moved upward during the process liquid is discharged from the housing.

1 is a cross-sectional view showing a general liquid supply unit.
Fig. 2 is a cross-sectional view showing the bubble removing member of Fig. 1;
3 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.
4 is a cross-sectional view showing the substrate processing apparatus of FIG.
Fig. 5 is a sectional view showing the liquid supply unit of Fig. 3; Fig.
Fig. 6 is a cross-sectional view showing the bubble removing member of Fig. 5;
FIG. 7 is a plan view showing the first plate and the second plate of FIG. 6;
Figs. 8 and 9 are cross-sectional views showing a process of separating the bubble from the processing solution using the bubble removing member of Fig. 6;
FIG. 10 is a plan view showing another embodiment of the first plate and the second plate of FIG. 7; FIG.
11 is a plan view showing another embodiment of the first plate and the second plate of Fig. 7;

The embodiments of the present invention can be modified into various forms and the scope of the present invention should not be interpreted as being limited by the embodiments described below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Accordingly, the shapes of the components and the like in the drawings are exaggerated in order to emphasize a clearer description.

In this embodiment, a process of cleaning a hydrophobic film formed on a substrate will be described as an example. Hereinafter, an example of the present invention will be described in detail with reference to FIG. 3 to FIG.

3 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 3, the substrate processing apparatus 1 has an index module 10 and a processing module 20. The index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 20 are sequentially arranged in a line. The direction in which the load port 120, the transfer frame 140 and the processing module 20 are arranged is referred to as a first direction 12 and a direction perpendicular to the first direction 12 Direction is referred to as a second direction 14 and a direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction 16. [

The carrier 130 in which the substrate W is accommodated is mounted on the load port 120. A plurality of load ports 120 are provided, and they are arranged in a line along the second direction 14. The number of load ports 120 may increase or decrease depending on the process efficiency and footprint conditions of the process module 20 and the like. A plurality of slots (not shown) are formed in the carrier 130 for accommodating the substrates W horizontally with respect to the paper surface. As the carrier 130, a front opening unified pod (FOUP) may be used.

The process module 20 has a buffer unit 220, a transfer chamber 240, and a process chamber 260. The transfer chamber 240 is disposed such that its longitudinal direction is parallel to the first direction 12. Process chambers 260 are disposed on both sides of the transfer chamber 240, respectively. At one side and the other side of the transfer chamber 240, the process chambers 260 are provided to be symmetrical with respect to the transfer chamber 240. A plurality of substrate processing units 260 are provided on one side of the transfer chamber 240. Some of the process chambers 260 are disposed along the longitudinal direction of the transfer chamber 240. In addition, some of the process chambers 260 are stacked together. That is, at one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of A X B. Where A is the number of process chambers 260 provided in a row along the first direction 12 and B is the number of process chambers 260 provided in a row along the third direction 16. When four or six process chambers 260 are provided on one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of 2 X 2 or 3 X 2. The number of process chambers 260 may increase or decrease. Unlike the above, the process chamber 260 may be provided only on one side of the transfer chamber 240. In addition, the process chamber 260 may be provided as a single layer on one side and on both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before the transfer of the substrate W between the transfer chamber 240 and the transfer frame 140. [ In the buffer unit 220, a slot (not shown) in which the substrate W is placed is provided. A plurality of slots (not shown) are provided to be spaced along the third direction 16 from each other. The buffer unit 220 is opened on the side facing the transfer frame 140 and on the side facing the transfer chamber 240.

The transfer frame 140 transfers the substrate W between the buffer unit 220 and the carrier 130 that is seated on the load port 120. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and is linearly moved along the index rail 142 in the second direction 14. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. Also, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward relative to the body 144b. A plurality of index arms 144c are provided and each is provided to be individually driven. The index arms 144c are stacked in a state of being spaced from each other along the third direction 16. Some of the index arms 144c are used to transfer the substrate W from the processing module 20 to the carrier 130 and another portion of the index arms 144c from the carrier 130 to the processing module 20, ). ≪ / RTI > This can prevent the particles generated from the substrate W before the process processing from adhering to the substrate W after the process processing in the process of loading and unloading the substrate W by the index robot 144. [

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260 and between the process chambers 260. The transfer chamber 240 is provided with a guide rail 242 and a main robot 244. The guide rails 242 are arranged so that their longitudinal directions are parallel to the first direction 12. The main robot 244 is installed on the guide rails 242 and is linearly moved along the first direction 12 on the guide rails 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed so as to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. Body 244b is also provided to be rotatable on base 244a. The main arm 244c is coupled to the body 244b, which is provided for forward and backward movement relative to the body 244b. A plurality of main arms 244c are provided and each is provided to be individually driven. The main arms 244c are stacked in a state of being spaced from each other along the third direction 16.

The process chamber 260 is provided with a substrate processing apparatus 300 for performing a cleaning process on the substrate W. The substrate processing apparatus 300 may have a different structure depending on the type of the cleaning process to be performed. Alternatively, the substrate processing apparatus 300 in each process chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups such that the substrate processing apparatuses 300 in the process chambers 260 belonging to the same group are identical to one another, The structure of the device 300 may be provided different from each other.

FIG. 4 is a cross-sectional view of the substrate processing apparatus of FIG. 3; FIG. 4, the substrate processing apparatus 300 includes a processing vessel 320, a spin head 340, a lift unit 360, and a liquid supply unit.

The processing vessel 320 has a cylindrical shape with an open top. The processing vessel 320 has an inner recovery cylinder 322 and an outer recovery cylinder 326. [ Each of the recovery cylinders 322 and 326 recovers the different treatment liquids among the treatment liquids used in the process. The inner recovery cylinder 322 is provided in an annular ring shape surrounding the spin head 340 and the outer recovery cylinder 326 is provided in an annular ring shape surrounding the inner recovery cylinder 326. The inner space 322a of the inner recovery cylinder 322 and the inner recovery cylinder 322 function as a first inlet 322a through which the process liquid flows into the inner recovery cylinder 322. [ The space 326a between the inner recovery cylinder 322 and the outer recovery cylinder 326 functions as a second inlet 326a through which the process liquid flows into the outer recovery cylinder 326. [ According to one example, each inlet 322a, 326a may be positioned at a different height from each other. Collection lines 322b and 326b are connected under the bottom of each of the collection bins 322 and 326. The treatment liquids flowing into the respective recovery cylinders 322 and 326 can be supplied to an external treatment liquid regeneration system (not shown) through the recovery lines 322b and 326b and can be reused.

The spin head 340 is provided in a substrate support unit 340 that supports and rotates the substrate W during the process. The spin head 340 has a body 342, a support pin 344, a chuck pin 346, and a support shaft 348. The body 342 has a top surface that is generally circular when viewed from the top. A supporting shaft 348 rotatable by a driving unit 349 is fixedly coupled to the bottom surface of the body 342. [

A plurality of support pins 344 are provided. The support pins 344 are spaced apart from the edge of the upper surface of the body 342 and protrude upward from the body 342. The support pins 344 are arranged so as to have a generally annular ring shape in combination with each other. The support pins 344 support the rear edge of the substrate W such that the substrate W is spaced from the upper surface of the body 342 by a predetermined distance.

A plurality of the chuck pins 346 are provided. The chuck pin 346 is disposed farther away from the center of the body 342 than the support pin 344. The chuck pin 346 is provided to protrude upward from the body 342. The chuck pin 346 supports the side of the substrate W so that the substrate W is not laterally displaced in place when the spin head 340 is rotated. The chuck pin 346 is provided to allow linear movement between the standby position and the support position along the radial direction of the body 342. The standby position is a distance from the center of the body 342 relative to the support position. The chuck pin 346 is positioned in the standby position when the substrate W is loaded or unloaded onto the spin head 340 and the chuck pin 346 is positioned in the supporting position when the substrate W is being processed. At the support position, the chuck pin 346 contacts the side of the substrate W.

The elevating unit 360 moves the processing vessel 320 linearly in the vertical direction. As the processing vessel 320 is moved up and down, the relative height of the processing vessel 320 to the spin head 340 is changed. The lifting unit 360 has a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixed to the outer wall of the processing container 320 and a moving shaft 364 which is moved upward and downward by a driver 366 is fixedly coupled to the bracket 362. The processing vessel 320 is lowered so that the spin head 340 protrudes to the upper portion of the processing vessel 320 when the substrate W is placed on the spin head 340 or lifted from the spin head 340. When the process is performed, the height of the process container 320 is adjusted so that the process liquid may flow into the predetermined collection container 360 according to the type of the process liquid supplied to the substrate W. Alternatively, the lifting unit 360 can move the spin head 340 in the vertical direction.

The liquid supply unit supplies the treatment liquid onto the substrate W. The liquid supply unit includes a liquid discharge portion and a liquid supply portion. The liquid ejecting portion includes a moving member 381 and a nozzle 390. The moving member 381 moves the nozzle 390 to the process position and the standby position. Where the process position is the position where the nozzle 390 is opposite the substrate W supported by the substrate support unit 340 and the standby position is the position where the nozzle 390 is out of the process position. The shifting member 381 includes a support shaft 386, an arm 382, and a driver 388. The support shaft 386 is located on one side of the processing vessel 320. The support shaft 386 has a rod shape whose longitudinal direction faces the third direction. The support shaft 386 is provided to be rotatable by a driver 388. The arm 382 is coupled to the upper end of the support shaft 386. The arm 382 extends vertically from the support shaft 386. A nozzle 390 is fixedly coupled to an end of the arm 382. As the support shaft 386 is rotated, the nozzle 390 is swingable with the arm 382. The nozzle 390 can be swung and moved to the process and standby positions. The nozzle 390 can be positioned to coincide with the central axis of the substrate W at the process position. For example, the treatment liquid may be a chemical. The chemical may be a liquid comprising at least one of ammonia (NH 3 ), phosphoric acid (P 2 O 5 ), and sulfuric acid (H 2 SO 4 ). Alternatively, the support shaft 386 may be provided so as to be movable up and down. Also, the arm 382 can be provided to allow forward and backward movement toward its longitudinal direction.

The liquid supply unit 400 supplies the process liquid to the nozzles 390. The liquid supply unit 400 supplies the process liquid to the nozzles 390 when the liquid processing process of the substrate W proceeds and stops the process liquid supply to the nozzles 390 when the liquid process is stopped. Fig. 5 is a sectional view showing the liquid supply unit of Fig. 3; Fig. 5, the liquid supply unit 400 includes a primary supply line 410, a bubble removal member 500, a supply tank 440, a flow meter 450, a secondary supply line 420, 460). The treatment liquid is a primary supply line 410, a supply tank 440. And then the secondary supply line 420 is sequentially supplied to the nozzle 390. The bubbles are removed by the bubble removing member 500 while the process liquid flows to the primary supply line 410, and the flow rate is measured by the flow meter 450.

The primary supply line 410 provides the treatment liquid stored in the liquid storage unit 430 to the supply tank 440. The primary feed line 410 includes an upstream feed line 412 and a downstream feed line 416. The upstream supply line 412 connects the liquid storage part 430 and the bubble removal member 500 to each other. The treatment liquid is supplied to the bubble removing member 500 from the liquid storage part 430 through the upstream supply line 412. [ The downstream supply line 416 connects the bubble removal member 500 and the supply tank 440 to each other. The treatment liquid is supplied from the bubble removing member 500 to the supply tank 440 through the downstream supply line 416. The treatment liquid is supplied to the supply tank 440 through the upstream supply line 412, the bubble removal member 500, and the downstream supply line 416 in sequence.

The supply tank 440 has a receiving space in which the processing liquid can be received. The accommodating space has a capacity larger than the capacity required for performing one-time liquid processing of the substrate W. Although not shown, a level sensor is installed in the supply tank 440. The level sensor measures the amount of the treatment liquid contained in the accommodation space. A plurality of supply tanks 440 are provided. According to one example, the supply tank 440 may include a first supply tank 440 and a second supply tank 440. The supply tank 440 may be two. Optionally, there may be one or more feed tanks 440. The downstream supply line 416 is connected to the first supply tank 440a and the branch line branching from the downstream supply line 416 is connected to the second supply tank 440b. Valves 416a and 416b are provided on each of its downstream lines with respect to the branch point. Each of the valves 416a and 416b is controlled by a controller 460.

The flow meter 450 measures the flow rate of the process liquid supplied to the supply tank 440. The flow meter 450 is installed in the downstream supply line 416. The flow meter 450 is located upstream of the branch point in the downstream feed line 416.

The controller 460 controls each valve based on the flow rate information measured from the flow rate meter 450 and the accommodation information measured from the level sensor. The controller 460 controls the valve so that a predetermined amount of the processing liquid is received in the receiving space. According to one example, the controller 460 can open the valve when the amount of the processing solution in the accommodation space is less than the preset amount. On the contrary, the controller 460 can close the valve if the amount of the processing liquid in the accommodation space is equal to or larger than the preset amount.

Next, the bubble removing member 500 will be described in more detail. 6 is a cross-sectional view showing the bubble removing member 500 of FIG. Referring to FIG. 6, the bubble removal member 500 includes a buffer tank, a bubble exhaust line 540, a first plate 570, and a second plate 580. The buffer tank includes a housing 510 and an inlet port 530. The housing 510 has a cylindrical shape. The housing 510 includes a buffer space 514 therein. The buffer space 514 is provided as a space capable of removing bubbles included in the processing liquid. The housing 510 has a body portion 512 and a discharge portion 518. The buffer space 514 is formed by the body 512 and the discharge portion 518. The trunk portion 512 is provided in a cylindrical shape with its bottom opened. For example, the body portion 512 may be provided in a cylindrical shape. The trunk portion 512 is provided so that its longitudinal direction is directed up and down. An inlet hole 515 and an exhaust hole 516 are formed on the upper surface of the body 512. The inlet hole 515 is formed in the center of the upper surface of the body 512 and the exhaust hole 516 is formed in a position deviated from the center of the upper surface. The discharge portion 518 is provided to have an annular ring shape. The discharge portion 518 extends downward from the lower end of the body portion 512. The inner diameter of the discharge portion 518 becomes smaller as it goes downward. A downstream supply line 416 is connected to the lower end of the discharge portion 518.

The inlet port 530 is fixed to the inlet hole 515 of the body portion 512. The inlet port 530 guides the process liquid from the upstream feed line 412 into the buffer space 514. The inlet port 530 is provided in a tubular shape having a smaller opening area as it goes downward. The bubble exhaust line 540 is connected to the exhaust hole 516. The bubble separated from the process liquid in the buffer space 514 is exhausted to the outside through the bubble exhaust line 540.

The first plate 570 firstly separates the bubbles from the processing liquid contained in the buffer space 514. FIG. 7 is a plan view showing the first plate and the second plate of FIG. 6; Referring to FIG. 7, the first plate 570 is located in the buffer space 514. The first plate 570 is located at a height corresponding to the body 512 in the buffer space 514. The first plate 570 is fixedly coupled to the inner surface of the body 512. The first plate 570 is provided in a plate shape having a plurality of first holes 572 formed therein. The first plate 570 is provided so as to have the same outer diameter as the inner diameter of the trunk portion 512. An area of the first plate 570 facing the opening of the inlet port 530 as viewed from above is provided in the blocking area. The blocking region is defined as a blocking region in which the first hole 572 is not formed. For example, the first hole 572 may be arranged to enclose the blocking region. Accordingly, the treatment liquid introduced through the inlet hole 515 can be scattered by the first plate 570 more than once.

The second plate 580 secondarily separates the bubbles from the processing liquid contained in the buffer space 514. [ The second plate 580 is positioned to face the first plate 570 below the first plate 570 in the buffer space 514. The second plate 580 is spaced apart from the first plate 570. The second plate 580 is located at a height corresponding to the body 512 in the buffer space 514. The second plate 580 is fixedly coupled to the inner surface of the body 512. The second plate 580 is provided in the form of a plate having a plurality of second holes 582 formed therein. For example, the second plate 580 may be a plate having the same diameter as the first plate 570. The second holes 582 may be arranged differently from the first holes 572. The first hole 572 and the second hole 582 are arranged so as not to overlap with each other when viewed from above. The first hole 572 and the second hole 582 are provided so as to have the same diameter.

Next, a process of separating the bubble from the process liquid using the bubble removal member 500 will be described. Referring to Figs. 8 and 9, the process liquid is supplied to the inlet port 530 through the upstream feed line 412. Because the shape of the inlet port 530, whose inner diameter narrows downward as the process liquid goes downward, the flow rate becomes faster as it gets closer to the buffer space 514. The process liquid is introduced into the buffer space 514, and the bubble is separated by the first plate 570 at least twice. The process liquid is separated from the first plate 570 by one time during the process of scattering, and the bubble is separated twice by the process of passing through the first hole 572. The treatment liquid may be scattered from the first plate 570 more than once. The process liquid is scattered in the center of the first plate 570, which forms a vortex in the upper edge region of the first plate 570 in the buffer space 514. The vortex formed in the buffer space 514 prevents the process liquid from entering the inlet port 530 again. The treatment liquid is dropped through the first holes 572. The dropped process liquid is separated from the bubbles by the second plate 580 at least twice. The process liquid is separated from the second plate 580 by one time while the bubble is separated from the second plate 580, and the bubble is separated twice by the process of passing through the second hole 582. The treatment liquid is dropped to the discharge portion 518 of the housing 510 through the second hole 582. The flow rate of the treatment liquid is increased due to the shape of the discharge portion 518 whose inner diameter becomes narrower toward the bottom. The treatment liquid is discharged to the downstream supply line 416 through the discharge portion 518. The separated bubbles are collected toward the central axis of the housing 510 during the process liquid is discharged to the downstream supply line 416. The bubbles collected at the center are sequentially exhausted to the bubble exhaust line 540 through the second hole 582 and the first hole 572.

In the above-described embodiment, the first hole 572 and the second hole 582 are described as having the same diameter. However, the first hole 572 and the second hole 582 may have different diameters from each other. As shown in FIG. 10, the first hole 572 may have a smaller diameter than the second hole 582. As a result, a large amount of bubbles can be separated from the processing liquid on the first plate 570 as compared with the second plate 580.

Alternatively, referring to FIG. 11, the second hole 582 may have a smaller diameter than the first hole 572. In this case, the treatment liquid can remove the bubbles having different sizes from each other in the first plate 570 and the second plate 580, respectively. The bubbles separated at the second plate 580 may be bubbles of a smaller size than the bubbles separated at the first plate 570.

412: upstream feed line 416: downstream feed line
510: housing 530: inlet port
570: first plate 572: first hole
580: second plate 582: second hole

Claims (17)

A processing vessel having a processing space therein;
A substrate supporting unit for supporting the substrate in the processing space;
And a liquid supply unit for supplying the processing liquid onto the substrate supported by the substrate supporting unit,
The liquid supply unit includes:
An upstream feed line for feeding the treatment liquid;
A downstream supply line for supplying the processing liquid supplied from the upstream supply line to the nozzle;
And a bubble removing member connecting the upstream supply line and the downstream supply line to each other,
The bubble removing member
A buffer tank positioned between the upstream supply line and the downstream supply line and having a buffer space therein;
A first plate positioned in the buffer space and having a plurality of first holes formed therein;
And a bubble exhaust line connected to an area of the buffer space higher than the first plate. The method according to claim 1,
The bubble removing member
And a second plate positioned below the first plate in the buffer space to face the first plate and having a plurality of second holes formed therein,
Wherein the first hole and the second hole are positioned so as not to overlap with each other when viewed from above. 3. The method of claim 2,
Wherein the first plate is located closer to the upstream feed line than the second plate,
Wherein the second plate is located closer to the downstream supply line than the first plate,
Wherein the first hole and the second hole have different diameters from each other. The method of claim 3,
Wherein the first hole has a smaller diameter than the second hole. The method of claim 3,
Wherein the second hole has a smaller diameter than the first hole. 6. The method according to any one of claims 1 to 5,
The buffer tank includes:
A housing having the buffer space therein;
Further comprising an inlet port located above the first plate and fixedly coupled to the housing to allow process liquid to flow into the buffer space at the upstream feed line,
Wherein the inlet port is provided in a tubular shape in which an opening area becomes smaller as the plate approaches the first plate. The method according to claim 6,
Wherein an area of the first plate facing the opening of the inlet port as viewed from the top is provided as a blocking area. 8. The method of claim 7,
Wherein the first hole is arranged to surround the blocking region when viewed from above. The method according to claim 6,
Wherein the inlet port is located at the center of the top surface of the housing and the bubble exhaust line is connected at an off-center location on the top surface of the housing. The method according to claim 6,
The housing includes:
A tubular body coupled to the inlet port and having the buffer space therein;
An annular ring-shaped discharge portion extending downward from a lower end of the body portion,
Wherein the discharge portion has a smaller cross-sectional surface as it goes down, and the downstream supply line is connected to a lower end of the discharge portion. 6. The method according to any one of claims 1 to 5,
The liquid supply unit
A supply tank having an accommodation space for accommodating the treatment liquid therein and connected to the downstream supply line;
A liquid supply line connecting the supply tank and the nozzle to each other;
A flow meter installed in the downstream supply line for measuring a flow rate of the process liquid;
And a controller for controlling a valve installed in the downstream supply line based on the information transmitted from the flow meter. A unit for supplying a treatment liquid,
An upstream feed line for feeding the treatment liquid;
A downstream supply line for supplying the processing liquid supplied from the upstream supply line to the nozzle;
And a bubble removing member connecting the upstream supply line and the downstream supply line to each other,
The bubble removing member
A buffer tank positioned between the upstream supply line and the downstream supply line and having a buffer space therein;
A first plate positioned in the buffer space and having a plurality of first holes formed therein;
And a bubble exhaust line connected to an area of the buffer space higher than the first plate. 13. The method of claim 12,
The bubble removing member
And a second plate positioned below the first plate in the buffer space to face the first plate and having a plurality of second holes formed therein,
The first hole and the second hole are arranged so as not to overlap each other, The method according to claim 12 or 13,
The buffer tank includes:
A housing having the buffer space therein;
Further comprising an inlet port located above the first plate and fixedly coupled to the housing to allow process liquid to flow into the buffer space at the upstream feed line,
And the inflow port is provided in a tubular shape having a smaller opening area as it gets closer to the first plate. 15. The method of claim 14,
Wherein a region of the first plate facing the opening of the inlet port is provided as a blocking region when viewed from the top. 15. The method of claim 14,
Wherein the inlet port is located at the center of the upper surface of the housing and the bubble exhaust line is connected at a position away from the center of the upper surface of the housing. 15. The method of claim 14,
The housing includes:
A tubular body coupled to the inlet port and having the buffer space therein;
An annular ring-shaped discharge portion extending downward from a lower end of the body portion,
Wherein the discharge portion has a smaller cross-sectional surface as it goes down, and the downstream supply line is connected to the lower end of the discharge portion.





KR1020150123172A 2015-08-31 2015-08-31 Unit for supplying chemical and Apparatus for treating substrate KR20170026952A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101942690B1 (en) * 2018-10-22 2019-01-25 양형근 Tank for mixing and preserving a chemical solution
KR20220033917A (en) * 2020-09-10 2022-03-17 세메스 주식회사 Degassing apparatus, equipment for treating substrate and treatment solution degassing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140120232A (en) 2013-03-29 2014-10-13 세메스 주식회사 Chemical supplying unit, substrate treating apparatus and substrate treating method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140120232A (en) 2013-03-29 2014-10-13 세메스 주식회사 Chemical supplying unit, substrate treating apparatus and substrate treating method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101942690B1 (en) * 2018-10-22 2019-01-25 양형근 Tank for mixing and preserving a chemical solution
KR20220033917A (en) * 2020-09-10 2022-03-17 세메스 주식회사 Degassing apparatus, equipment for treating substrate and treatment solution degassing method
US11673075B2 (en) 2020-09-10 2023-06-13 Semes Co., Ltd. Degassing apparatus and substrate treating apparatus

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