KR102409472B1 - Apparatus for treating a substrate - Google Patents

Abstract

The present invention relates to an apparatus for processing a substrate. A substrate processing apparatus according to an embodiment of the present invention includes a process chamber configured to perform a processing process by supplying a processing liquid to a substrate, and a processing liquid supply unit supplying the processing liquid to the process chamber, wherein the process chamber is disposed therein a housing having a space, a support unit positioned in the processing space to support a substrate, and a liquid supply nozzle receiving the processing liquid from the processing liquid supply unit and supplying the processing liquid to the substrate, wherein the processing liquid supply unit includes a plurality of liquids A mixing member receiving a liquid from a supply source and mixing the plurality of liquids is supplied with the processing liquid mixed from the mixing member through a connection pipe, the processing liquid is stored, and the processing liquid is supplied through a supply line to the liquid supply nozzle and a substrate processing apparatus including a buffer tank for supplying to the substrate.

Description

Substrate processing apparatus

The present invention relates to an apparatus for processing a substrate, and more particularly, to an apparatus for processing a substrate by supplying a processing liquid to the substrate.

In general, a process of treating a glass substrate or a wafer in a flat panel display device manufacturing process or a semiconductor manufacturing process includes a photoresist coating process, a developing process, an etching process, an ashing process, etc. Various processes are performed.

In particular, as semiconductor devices become high-density, high-integration, and high-performance, circuit pattern miniaturization is rapidly progressing, and contaminants such as particles, organic contaminants, and metal contaminants remaining on the substrate surface greatly affect device characteristics and production yield. drive crazy For this reason, a cleaning process for removing various contaminants adhering to the surface of the substrate has become very important in the semiconductor manufacturing process, and a process of cleaning the substrate is performed before and after each unit process of manufacturing a semiconductor.

On the other hand, in the process of manufacturing the substrate, a liquid treatment process is performed by supplying various chemical solutions on the substrate. It may be prepared by mixing a plurality of liquids in the liquid supplied on the substrate. The mixed chemical is supplied to a device for supplying the chemical to perform a process of treating the substrate. However, when the mixed chemical is not mixed at a predetermined concentration or is supplied on the substrate in a non-uniformly mixed state, there is a problem in causing a defect in the substrate processing process.

Meanwhile, in the process of treating the substrate, the process may be performed by receiving a chemical solution from a plurality of chambers. The chemical solution is supplied to each chamber by supplying a processing solution mixed with a plurality of liquids to perform a substrate processing process.

An object of the present invention is to provide a substrate processing apparatus for uniformly mixing and providing a chemical solution supplied to a substrate.

Another object of the present invention is to provide a substrate processing apparatus for constantly providing the concentration and temperature of a chemical solution mixed with a plurality of liquids supplied to the substrate.

Another object of the present invention is to provide a substrate processing apparatus for maintaining a constant supply amount of a processing liquid supplied to a plurality of process chambers.

Another object of the present invention is to provide a substrate processing apparatus for monitoring and checking the amount, concentration, and pressure of a processing liquid supplied to a plurality of process chambers in real time.

The problem to be solved by the present invention is not limited to the above-mentioned problems, and the problems not mentioned can be clearly understood by those of ordinary skill in the art to which the present invention belongs from the present specification and the accompanying drawings. will be.

The present invention provides an apparatus for processing a substrate.

According to an embodiment of the present disclosure, the substrate processing apparatus includes a process chamber configured to perform a processing process by supplying a processing liquid to a substrate, and a processing liquid supply unit configured to supply the processing liquid to the process chamber, wherein the process chamber includes an internal a housing having a processing space in the processing space, a support unit positioned in the processing space to support a substrate, and a liquid supply nozzle receiving the processing liquid from the processing liquid supply unit and supplying the processing liquid to the substrate, wherein the processing liquid supply unit includes a plurality of The processing liquid is supplied from the mixing member through a mixing member and a connection pipe for receiving the liquid from the liquid supply source and mixing the plurality of liquids to store the processing liquid, and supplying the processing liquid to the liquid It may include a buffer tank that supplies the supply nozzle.

According to an embodiment, the mixing member includes a container having an inner space, a mixer disposed in the inner space and having a mixing space therein, and a plurality of liquid inlet pipes for respectively supplying a plurality of liquids to be mixed into the mixer. may include

According to an embodiment, the mixing member may include a heater for heating the inside of the mixing space.

According to an embodiment, the heater may be installed on an outer wall of the mixer.

According to an embodiment, the mixing member may have an outlet for discharging the treatment liquid in which the plurality of liquids are mixed into the inner space, and the container may have an outlet for discharging the treatment liquid to the connection pipe.

According to an embodiment, the outlet may be provided at a position lower than the outlet.

According to an embodiment, the outlet may be provided on an upper wall or a side wall of the container.

According to an embodiment, the process chamber may be provided in plurality, and the processing liquid supply unit may be installed in the supply line, and may further include a distributor for distributing the processing liquid to the plurality of process chambers.

According to an embodiment, the supply line is branched from the main line and the main line, and a plurality of branch lines positioned in parallel with each other, and one end connected to the plurality of branch lines and the other end connected to the buffer tank It includes a line, and the distributor may be installed in each of the plurality of branch lines.

According to an embodiment, the same number of the process chambers connected to each of the branch lines may be provided.

According to an embodiment, the treatment liquid supply unit further includes a pump installed in the main line and a pump installed in the recovery line, a pressure meter measuring the pressure of the treatment liquid, and a pump controller controlling the pump, , the pump controller may control the pump to adjust the pressure of the treatment liquid supplied to the process chamber by the pressure value measured by the pressure gauge.

According to an embodiment, the treatment liquid supply unit is installed in a plurality of liquid supply lines and a plurality of liquid supply lines for supplying a plurality of the liquids to the inlet pipe, It may further include a flow regulator for adjusting the flow rate.

According to an embodiment, the treatment liquid supply unit may be installed on the connection pipe and further include a concentration meter for measuring the concentration of the treatment liquid.

According to an embodiment, a water level measuring device for measuring the water level of the treatment liquid may be installed inside the buffer tank.

According to an embodiment, the treatment liquid supply unit further includes an alarm member connected to the flow rate controller, the concentration meter, and the water level meter to sound an alarm when the preset flow rate, concentration, and water level are out of order, and the substrate processing apparatus may further include a controller for controlling the treatment liquid supply unit, wherein the controller controls the liquid supply unit to stop supplying the treatment liquid and mixing the plurality of liquids when an alarm sounds in the alarm member.

According to another embodiment of the present invention, the substrate processing apparatus includes a process chamber for performing a substrate processing process by supplying a processing liquid to a substrate, and a processing liquid supply unit for supplying the processing liquid to the process chamber, wherein the process chamber includes: A housing having a processing space therein, a support unit positioned in the processing space to support a substrate, and a liquid supply nozzle receiving the processing liquid from the processing liquid supply unit and supplying the processing liquid to the substrate, wherein the process chamber is provided in plurality and the processing liquid supply unit is installed in a buffer tank for storing the processing liquid, a supply line for supplying the processing liquid to the buffer tank to the liquid supply nozzle, and the supply line, and performs the processing with a plurality of the process chambers It may further include a distributor for dispensing the liquid.

According to an embodiment, the supply line is branched from the main line and the main line, and a plurality of branch lines positioned in parallel with each other, and one end connected to the plurality of branch lines and the other end connected to the buffer tank It includes a line, and the distributor may be installed in each of the plurality of branch lines.

According to an embodiment, the same number of the process chambers installed in each of the branch lines may be provided.

According to an embodiment, the treatment liquid supply unit further includes a pump installed in the main line and a pump installed in the recovery line, a pressure measuring device measuring the pressure of the treatment liquid, and a pump controller controlling the pump, The pump controller may control the pump to adjust the pressure of the treatment liquid supplied to the process chamber with the pressure value measured by the pressure gauge.

According to an embodiment of the present invention, it is possible to improve the efficiency of the substrate processing process by mixing a plurality of liquids at a constant concentration and supplying the mixture to the substrate.

In addition, according to an embodiment of the present invention, it is possible to uniformly supply the processing liquid supplied to the substrate by checking the concentration of the mixed processing liquid in real time.

In addition, according to an embodiment of the present invention, the efficiency of the substrate processing process may be improved by maintaining a constant supply amount of the processing liquid supplied to the plurality of process chambers.

In addition, according to an embodiment of the present invention, it is possible to improve the efficiency of the substrate processing process by monitoring the amount, concentration, and pressure of the processing liquid supplied to the plurality of process chambers in real time.

The effects of the present invention are not limited to the above-described effects, and the effects not mentioned will be clearly understood by those of ordinary skill in the art to which the present invention belongs from the present specification and accompanying drawings.

1 is a plan view showing a substrate processing facility according to an embodiment of the present invention.
FIG. 2 is a diagram schematically illustrating a processing liquid supply unit for supplying a processing liquid to the process chamber of FIG. 1 .
3 is a cross-sectional view illustrating a substrate processing apparatus provided in the process chamber of FIG. 1 .
4 is a cutaway perspective view showing the mixing member of FIG. 2 ;
FIG. 5 is a cross-sectional view of the mixing member of FIG. 4 ;
FIG. 6 is a perspective view showing the mixer of FIG. 4 .
7 is a view showing another embodiment of the mixing member of FIG.
8 is a liquid flow diagram showing the flow of a treatment liquid inside the container of FIG. 4 .
9 and 10 are views showing another embodiment of the heater installed in FIG. 4 .

Hereinafter, an embodiment of the present invention will be described in more detail with reference to the accompanying drawings. Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more completely explain the present invention to those of ordinary skill in the art. Accordingly, the shapes of elements in the drawings are exaggerated to emphasize a clearer description.

1 is a plan view showing a substrate processing facility according to an embodiment of the present invention. Referring to FIG. 1 , a substrate processing facility 1 includes an index module 10 and a process processing module 20 . The index module 10 has a load port 120 and a transfer frame 140 . The load port 120 , the transfer frame 140 , and the process processing module 20 are sequentially arranged in a line. Hereinafter, the direction in which the load port 120 , the transfer frame 140 , and the process processing module 20 are arranged is referred to as a first direction 12 . And when viewed from the top, a direction perpendicular to the first direction 12 is referred to as a second direction 14 , and a direction perpendicular to a plane including the first direction 12 and the second direction 14 is referred to as a third direction. It is called (16).

The carrier 130 in which the substrate W is accommodated is seated on the load port 120 . A plurality of load ports 120 are provided, and they are arranged in a line along the second direction 14 . In FIG. 1, it is shown that four load ports 120 are provided. However, the number of load ports 120 may increase or decrease according to conditions such as process efficiency and footprint of the process processing module 20 . A slot (not shown) provided to support the edge of the substrate W is formed in the carrier 130 . A plurality of slots are provided in the third direction 16 , and the substrates W are positioned in the carrier to be stacked apart from each other along the third direction 16 . A Front Opening Unified Pod (FOUP) may be used as the carrier 130 .

The process module 20 includes a buffer unit 220 , a transfer chamber 240 , and a process chamber 260 . The transfer chamber 240 is disposed in a longitudinal direction parallel to the first direction (12). Process chambers 260 are respectively disposed on one side and the other side of the transfer chamber 240 along the second direction 14 . The process chambers 260 located on one side of the transfer chamber 240 and the process chambers 260 located on the other side of the transfer chamber 240 are provided to be symmetrical with respect to the transfer chamber 240 . Some of the process chambers 260 are disposed along the longitudinal direction of the transfer chamber 240 . In addition, some of the process chambers 260 are disposed to be stacked on each other. That is, on one side of the transfer chamber 240 , the process chambers 260 may be arranged in an arrangement of A X B (each of A and B being a natural number equal to or greater than 1). Here, A is the number of process chambers 260 provided in a line along the first direction 12 , and B is the number of process chambers 260 provided in a line along the third direction 16 . When four or six process chambers 260 are provided on one side of the transfer chamber 240 , the process chambers 260 may be arranged in an arrangement of 2 X 2 or 3 X 2 . The number of process chambers 260 may increase or decrease. Unlike the above, the process chamber 260 may be provided only on one side of the transfer chamber 240 . Also, unlike the above, the process chamber 260 may be provided as a single layer on one side and both sides of the transfer chamber 240 .

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240 . The buffer unit 220 provides a space in which the substrate W stays before the substrate W is transferred between the transfer chamber 240 and the transfer frame 140 . The buffer unit 220 is provided with a slot (not shown) in which the substrate W is placed therein, and a plurality of slots (not shown) are provided to be spaced apart from each other in the third direction 16 . In the buffer unit 220 , a surface facing the transfer frame 140 and a surface facing the transfer chamber 240 are respectively opened.

The transfer frame 140 transfers the substrate W between the carrier 130 seated on the load port 120 and the buffer unit 220 . The transfer frame 140 is provided with an index rail 142 and an index robot 144 . The index rail 142 is provided in a longitudinal direction parallel to the second direction 14 . The index robot 144 is installed on the index rail 142 and moves linearly in the second direction 14 along the index rail 142 . The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed to be movable along the index rail 142 . The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. In addition, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward with respect to the body 144b. A plurality of index arms 144c are provided to be individually driven. The index arms 144c are arranged to be stacked apart from each other in the third direction 16 . Some of the index arms 144c are used when transferring the substrate W from the process processing module 20 to the carrier 130 , and other parts of the index arms 144c are used for transferring the substrate W from the carrier 130 to the process processing module 20 . It can be used when returning This can prevent particles generated from the substrate W before the process from adhering to the substrate W after the process in the process of the index robot 144 loading and unloading the substrate W.

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260 and between the process chambers 260 . A guide rail 242 and a main robot 244 are provided in the transfer chamber 240 . The guide rail 242 is disposed so that its longitudinal direction is parallel to the first direction 12 . The main robot 244 is installed on the guide rail 242 and linearly moved along the first direction 12 on the guide rail 242 . The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed to be movable along the guide rail 242 . The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. In addition, the body 244b is provided to be rotatable on the base 244a. The main arm 244c is coupled to the body 244b, which is provided to be movable forward and backward with respect to the body 244b. A plurality of main arms 244c are provided to be individually driven. The main arms 244c are arranged to be stacked apart from each other in the third direction 16 . Main arm 244c used when transferring the substrate W from the buffer unit 220 to the process chamber 260 and the substrate W used when transferring the substrate W from the process chamber 260 to the buffer unit 220 The main arms 244c may be different from each other.

A substrate processing apparatus 300 for performing a cleaning process on the substrate W is provided in the process chamber 260 . The substrate processing apparatus 300 provided in each process chamber 260 may have a different structure according to the type of cleaning process performed. Optionally, the substrate processing apparatus 300 in each process chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups, and the substrate processing apparatuses 300 provided in the process chamber 260 belonging to the same group have the same structure and are provided to the process chambers 260 belonging to different groups. The substrate processing apparatuses 300 may have different structures. For example, when the process chamber 260 is divided into two groups, a first group of process chambers 260 are provided on one side of the transfer chamber 240 , and the second group of process chambers 260 on the other side of the transfer chamber 240 . Process chambers 260 may be provided. Optionally, a first group of process chambers 260 may be provided on a lower layer on one side and the other side of the transfer chamber 240 , and a second group of process chambers 260 may be provided on an upper layer. The first group of process chambers 260 and the second group of process chambers 260 may be classified according to the type of chemical used or the type of cleaning method, respectively.

Hereinafter, an example of the substrate processing apparatus 300 for cleaning the substrate W using a processing liquid will be described. FIG. 2 is a diagram schematically illustrating a processing liquid supply unit supplying a processing liquid to the process chamber of FIG. 1 , and FIG. 3 is a cross-sectional view illustrating a substrate processing apparatus provided in the process chamber of FIG. 1 . 2 and 3 , the substrate processing apparatus 300 includes a housing 320 , a support unit 340 , an elevation unit 360 , and a liquid supply nozzle 380 .

The housing 320 provides a processing space in which a substrate processing process is performed. The housing 320 is provided in an open top shape. The housing 320 includes an internal recovery container 322 , an intermediate recovery container 324 , and an external recovery container 326 . Each of the recovery tubes 322 , 324 , and 326 recovers different treatment liquids among the treatment liquids used in the process. The internal recovery container 322 is provided in the shape of an annular ring surrounding the support unit 340 . The intermediate recovery container 324 is provided in the shape of an annular ring surrounding the internal recovery container 322 . The external recovery container 326 is provided in the shape of an annular ring surrounding the intermediate recovery container 324 . The inner space 322a of the internal recovery container 322, the space 324a between the internal recovery container 322 and the intermediate recovery container 324, and the space between the intermediate recovery container 324 and the external recovery container 326 ( 326a) functions as an inlet through which the treatment liquid flows into the internal recovery container 322 , the intermediate recovery container 324 , and the external recovery container 326 , respectively. Recovery lines 322b, 324b, and 326b extending vertically downwards are connected to each of the recovery barrels 322, 324, and 326. Each of the recovery lines 322b, 324b, and 326b discharges the treatment liquid introduced through the respective recovery tanks 322, 324, and 326. The discharged treatment liquid may be reused through an external treatment liquid regeneration system (not shown).

The support unit 340 is disposed within the housing 320 . The support unit 340 supports the substrate W and rotates the substrate W during the substrate processing process. The support unit 340 includes a body 342 , a support pin 344 , a chuck pin 346 , and a support shaft 348 . Body 342 has a top surface that is provided as a generally circular shape when viewed from above. A support shaft 348 rotatable by a motor 349 is fixedly coupled to the bottom surface of the body 342 . A plurality of support pins 344 are provided. The support pins 344 are disposed to be spaced apart from each other at predetermined intervals on the edge of the upper surface of the body 342 and protrude upward from the body 342 . The support pins 344 are arranged to have an annular ring shape as a whole by combination with each other. The support pin 344 supports the rear edge of the substrate W so that the substrate W is spaced apart from the upper surface of the body 342 by a predetermined distance.

A plurality of chuck pins 346 are provided. The chuck pin 346 is disposed farther from the center of the body 342 than the support pin 344 . The chuck pin 346 is provided to protrude upward from the body 342 . The chuck pin 346 supports the side of the substrate W so that the substrate W is not laterally separated from the original position when the support unit 340 is rotated. The chuck pin 346 is provided to be linearly movable between the standby position and the supporting position along the radial direction of the body 342 . The standby position is a position further away from the center of the body 342 compared to the support position. When the substrate W is loaded or unloaded from the support unit 340 , the chuck pin 346 is positioned at the standby position, and when a process is performed on the substrate, the chuck pin 346 is positioned at the support position. In the supported position, the chuck pin 346 is in contact with the side of the substrate.

The lifting unit 360 linearly moves the housing 320 in the vertical direction. As the housing 320 moves up and down, the relative height of the housing 320 with respect to the support unit 340 is changed. The lifting unit 360 includes a bracket 362 , a moving shaft 364 , and a driver 366 .

The bracket 362 is fixedly installed on the outer wall of the housing 320 . A moving shaft 364 that is moved in the vertical direction by the actuator 366 is fixedly coupled to the bracket 362 . When the substrate W is placed on or lifted from the support unit 340 , the housing 320 is lowered so that the support unit 340 protrudes above the housing 320 . In addition, when the process is in progress, the height of the housing 320 is adjusted so that the treatment liquid can be introduced into the predetermined collection container 360 according to the type of the treatment liquid supplied to the substrate W.

For example, while the substrate W is being treated with the first processing liquid, the substrate W is positioned at a height corresponding to the inner space 322a of the internal recovery container 322 . In addition, during the treatment of the substrate W with the second processing liquid and the third processing liquid, the substrate W is disposed in a space 324a between the internal recovery container 322 and the intermediate recovery container 324 , and the intermediate recovery container, respectively. It may be located at a height corresponding to the space 326a between the barrel 324 and the external recovery container 326 . Unlike the above, the lifting unit 360 may move the support unit 340 in the vertical direction instead of the housing 320 .

The liquid supply nozzle 380 supplies the processing liquid to the substrate W during the substrate W processing process. The liquid supply nozzle 380 includes a nozzle support 382 , a nozzle 384 , a support shaft 386 , and a driver 388 . The longitudinal direction of the support shaft 386 is provided along the third direction 16 , and the actuator 388 is coupled to the lower end of the support shaft 386 . The actuator 388 rotates and lifts the support shaft 386 . The nozzle support 382 is vertically coupled to the opposite end of the support shaft 386 coupled to the actuator 388 . The nozzle 384 is installed on the bottom surface of the end of the nozzle support 382 . The nozzle 384 is moved by a driver 388 to a process position and a standby position. The process position is a position where the nozzle 384 is disposed vertically above the housing 320 , and the standby position is a position where the nozzle 384 deviates from the vertical top of the housing 320 . The nozzle 382 receives the processing liquid and supplies the processing liquid onto the substrate W.

One or a plurality of liquid supply nozzles 380 may be provided. When a plurality of liquid supply nozzles 380 are provided, a chemical, a rinse liquid, or an organic solvent may be provided through different liquid supply nozzles 380 . The rinse liquid may be pure water, and the organic solvent may be a mixture of isopropyl alcohol vapor and an inert gas or isopropyl alcohol liquid.

The processing liquid supply unit 400 mixes a plurality of liquids and supplies the processing liquid to the process chamber 260 . The processing liquid supply unit 400 includes a liquid supply source 401 , a liquid supply line 402 , a liquid supply valve 403 , a flow controller 404 , a mixing member 410 , a connector 440 , and a concentration meter 408 . ), a buffer tank 460 , a water level gauge 409 , a supply line 450 , an alarm member 480 and a controller 490 .

The liquid supply 401 supplies a plurality of liquids to the container 430 . A plurality of liquids are respectively stored in the liquid supply source 401 . The plurality of liquids are liquids used in the process of treating the substrate W, and are mixed in the mixing member and then supplied to the process chamber 260 . The liquid supply sources 401 are respectively connected to the liquid supply line 402 .

Each liquid supply line 402 is connected to the inlet pipe (439). One end of the liquid supply line 402 is connected to the liquid supply 401 , and the other end is connected to the mixing member 410 . The liquid supply line 402 supplies a plurality of liquids to the mixing member 410 .

A liquid supply valve 403 is installed in each of the liquid supply lines 402 . The liquid supply valve 403 controls the flow rate of the supplied liquid. Each of the liquid supply lines 402 is provided with a flow controller 404 for controlling the flow rate of the liquid. The flow rate controller 404 adjusts the flow rate of each liquid supplied to the container 430 . For example, the flow controller 404 supplies a predetermined amount of liquid to the container 430 .

The plurality of liquids supplied to the container 430 are controlled through the liquid supply valve 403 and the flow rate controller 404 . For example, the plurality of liquids supplied may be pure water, ammonia, or hydrogen peroxide. Pure water, ammonia, and hydrogen peroxide are supplied to the container 430 by a preset amount and mixed. The plurality of liquids is not limited to the above-described example, and different liquids may be supplied according to the processing process of the substrate W. Further, according to the type of liquid, the liquid supply source 401 , the liquid supply line 402 , the liquid supply valve 403 , and the flow rate controller 404 are provided in corresponding numbers.

4 is a cut-away perspective view showing the mixing member of FIG. 2 , FIG. 5 is a cross-sectional view of the mixing member of FIG. 4 , and FIG. 6 is a perspective view showing the mixer of FIG. 4 . Hereinafter, referring to FIGS. 4 to 6 , the mixing member 410 receives the liquid from the plurality of liquid sources 401 and mixes the plurality of liquids. The mixed treatment liquid is supplied to the substrate W. The mixing member 410 includes a container 430 , a mixer 420 , an inlet pipe 439 , and a heater 435 .

The container 430 has an interior space 406 . The container 430 is provided in a circular shape when viewed from the top. The container 430 may be provided in a cylindrical shape. A plurality of liquids are mixed in the inner space 406 of the container 430 to generate a treatment liquid. The container 430 has an outlet 437 for discharging the processing liquid mixed in the mixer 420 through the connection pipe 440 . For example, the outlet 437 may be provided on the sidewall 433 of the container 430 . Alternatively, as shown in FIG. 7 , the outlet 437 may be provided on the upper wall 431 of the container 430 . The outlet 437 is connected to the connector 440 . The outlet 437 flows the treatment liquid into the inner space 406 through the connection pipe 440 .

The mixer 420 mixes a plurality of liquids. The mixer 420 has a mixing space 405 therein. The mixer 420 has an upper body 421 , an intermediate body 423 , and a lower body 425 . The upper body 421 is provided with a constant cross-sectional area. For example, the upper body 421 may be provided in a cylindrical shape. The upper body 421 is connected to the inlet pipe 439 . The upper body 421 supplies the plurality of liquids supplied from the inlet pipe 439 to the mixing space 405 .

An intermediate body 423 is coupled to the lower portion of the upper body 421 . The intermediate body 423 is provided in a shape in which its cross-sectional area decreases toward the bottom. The cross-sectional area of the intermediate body 423 may be provided in a circular shape. The lower body 425 is coupled to the lower portion of the intermediate body 423 . The lower body 425 is provided with a constant cross-sectional area. The cross-sectional area of the lower body 425 is provided in a circular shape.

The interior of the upper body 421 , the intermediate body 423 , and the lower body 425 forms a mixing space 405 . The plurality of liquids are mixed while sequentially passing through the mixing space 405 inside the upper body 421 , the intermediate body 423 , and the lower body 425 through the inlet pipe 439 .

A lower portion of the mixer 420 has an outlet 427 . The discharge port 427 discharges the processing liquid mixed in the mixing space 405 to the inner space 406 . The outlet 427 is provided at a position lower than the outlet 437 .

In the mixer 420 , a plurality of liquids are introduced through an inlet pipe 439 as shown in FIG. 8 . The plurality of liquids are mixed into the treatment liquid while flowing to the lower part of the mixer 420 . While the plurality of liquids are mixed in the mixer 420 , the mixing space 405 is heated from the heat transferred from the heater 435 . The processing liquid mixed in the mixer 420 is discharged through the outlet 427 and flows through the inner space 406 . The processing liquid in the inner space 406 may be heated through the heater 435 of the mixer 420 . The processing liquid mixed in the mixer 420 moves to the connection pipe 440 through the outlet 437 .

The heater 435 heats the inside or outside of the mixing space 405 . In an embodiment, the heater 435 is installed on the outer wall of the mixer 420 . For example, the heater 435 may be provided as a heating coil on the outer wall of the mixer 420 . With the heating of the heater 435 , the processing liquid located inside the mixing space 405 and the processing liquid mixed in the mixing space 405 and discharged into the internal space 406 may be simultaneously heated. Alternatively, as shown in FIG. 9 , the heater 435a may be provided to be inserted into the sidewall 433 of the container 430 . When the heater 435a is provided as shown in FIG. 9 , the processing liquid may be heated in the internal space 406 . However, when the processing liquid mixed in the mixer 420 is heated, the heat transfer rate supplied from the heater 435a decreases.

Optionally, as shown in FIG. 10 , a heater 435b may be provided in the mixing space 405 of the mixer 420 . In this case, it is effective when heating the treatment liquid in the mixing space 405 of the mixer 420 . However, when the treatment liquid is heated in the inner space 406 of the container 430 , the heat transfer rate supplied from the heater 435b decreases.

That is, when the heater 435 is installed on the sidewall 433 of the mixer 420 , unlike the case where the heater 435 is installed inside the container 430 or the mixer 420 , the processing liquid is applied to the inside and outside of the mixer 420 . Since it can be heated at the same time, the treatment liquid can be effectively heated with one heater 435 .

The inlet pipe 439 supplies a plurality of liquids to the mixing space 405 , respectively. The inlet tube 439 is coupled to the upper wall 431 of the vessel 430 . The inflow pipe 439 includes a first inflow pipe 439a, a second inflow pipe 439b, and a third inflow pipe 439c.

The first inlet pipe (439a), the second inlet pipe (439b), and the third inlet pipe (439c) receive the liquid from the outside, respectively, and supply the liquid to the mixing space (405). The first inlet pipe (439a), the second inlet pipe (439b), and the third inlet pipe (439c) are respectively connected to the upper portion of the container (430). The first inlet pipe 439a, the second inlet pipe 439b, and the third inlet pipe 439c supply the liquid by a predetermined amount. For example, the liquid supplied from the first inlet pipe 439a may be pure water. The liquid supplied from the second inlet pipe 439b may be ammonia. The liquid supplied from the third inlet pipe 439c may be hydrogen peroxide. On the other hand, the first inlet pipe 439a, the second inlet pipe 439b, and the third inlet pipe 439c may provide one type of liquid selected from ammonia, water peroxide, and pure water, respectively. The plurality of liquids is not limited to the above-described example, and different liquids may be supplied according to the processing process of the substrates W and W. In addition, depending on the type of liquid, the number of the inlet pipe 439 may be provided as four or more.

The vessel 430 is provided with an exhaust member 438 . The exhaust member 438 discharges gas generated when a plurality of liquids are mixed to the outside. The exhaust member 438 is provided on the upper wall 431 of the container 430 .

The connection pipe 440 connects the container 430 and the buffer tank 460 . The connection pipe 440 supplies the processing liquid mixed in the container 430 to the buffer tank 460 . One end of the connection pipe 440 is connected to the outlet 437 of the container 430 , and the other end is connected to the buffer tank 460 . The connection pipe 440 is provided by being connected to the upper wall 431 or the side wall 433 of the container 430 . The connector 440 is located at a higher position than the outlet 427 of the mixer 420 .

The concentration meter 408 measures the concentration of the mixed treatment solution. The concentration meter 408 is installed in the connector 440 . The concentration meter 408 measures whether the concentration of the treatment liquid is preset.

The buffer tank 460 stores the mixed solution supplied from the connection pipe 440 . The buffer tank 460 has a buffer space 407 therein. The buffer tank 460 has a circular shape when viewed from the top. The buffer tank 460 may be provided in a cylindrical shape. A water level meter 409 for measuring the level of the treatment liquid is provided inside the buffer tank 460 . The water level meter 409 measures whether the water level of the treatment liquid is within a preset water level range. The water level of the treatment liquid in the buffer tank 460 is maintained at a constant amount through the water level meter 409 .

The supply line 450 supplies the processing liquid to the buffer tank 460 to the process chamber 260 . One end of the supply line 450 is connected to the buffer tank 460 , and the other end is connected to a liquid supply nozzle in the process chamber 260 . The supply line 450 supplies the processing liquid to the process chamber 260 . The supply line 450 includes a main line 451 , a branch line 452 , and a recovery line.

The main line 451 is connected to the buffer tank 460 to supply the processing liquid to the branch line 452 . A pump 454 is provided on the main line 451 . The pump 454 applies a constant pressure to the treatment liquid and supplies the treatment liquid to the process chamber 260 through the branch line 452 .

A heating member 457 is installed on the main line 451 . The heating member 457 heats the processing liquid to a preset temperature value. The heating member 457 heats the processing liquid before supplying the processing liquid to the process chamber 260 . For example, the heating member 457 may be provided as a heater.

The distributor 470 supplies the processing liquid to the plurality of process chambers 260 . The distributor 470 is installed in the supply line 450 . The distributor 470 is installed on the branch line 452 . A plurality of distributors 470 are provided. The distributors 470 are provided in a number corresponding to the branch lines 452 . For example, two distributors 470 may be provided. Alternatively, a different number may be provided according to the number of process chambers 260 .

The distributor 470 supplies the processing liquid to each branch line 452 to supply a predetermined amount of the processing liquid to each process chamber 260 .

One end of the branch line 452 is connected to the process line, and the other end is connected to the recovery line 453 . A plurality of branch lines 452 are provided. A plurality of branch lines 452 are positioned in parallel. A distributor 470 is installed on the branch line 452 . The branch line 452 is respectively connected to the plurality of process chambers 260 . The same number of process chambers 260 connected to each branch line 452 may be provided.

The recovery line 453 has one end connected to the branch line 452 and the other end connected to the buffer tank 460 . The recovery line 453 is supplied from the branch line 452 to the process chamber 260 and the remaining processing liquid is supplied back to the buffer tank 460 . The recovery line 453 is connected to each branch line 452 .

The pressure gauge 456 is installed in the recovery line 453 . The pressure gauge 456 measures the pressure of the treatment liquid in the recovery line 453 . The pressure gauge 456 measures whether the pressure of the treatment liquid in the recovery line 453 is a preset pressure value.

The pressure gauge 456 is connected to the pump controller 490 . The pressure value measured by the pressure gauge 456 is sent to the pump controller 490 . The pump controller 490 controls the pump 454 based on the pressure value measured by the pressure gauge 456 to control the pump 454 to supply the processing liquid to the process chamber 260 at a constant pressure.

The alarm member 480 sounds an alarm when the flow rate, concentration, and water level preset in the treatment liquid supply unit 400 are out of alignment. The alarm member 480 is connected to the flow controller 404 , the concentration meter 408 and the water level meter 409 .

When an alarm sounds from the alarm member 480 , the controller 490 stops mixing the processing liquid or stops supplying the processing liquid to the process chamber 260 . The controller 490 controls the liquid supply unit to stop mixing of the treatment liquid when the concentration value measured by the concentration meter 408 deviates from the preset concentration value. The controller 490 stops the supply of the treatment solution to the supply line 450 when the water level measured by the water level meter 409 in the buffer tank 460 is out of a preset value range. When the flow rate of the supplied processing liquid is abnormal, the controller 490 controls a valve installed in the supply line 450 to stop supplying the processing liquid to the process chamber 260 .

The above-described processing liquid supply unit 400 pre-mixes a plurality of liquids in a separate mixing member. The concentration of the mixed treatment solution may be measured in advance to maintain a constant concentration of the treatment solution supplied to the substrate W, thereby improving the efficiency of the substrate W treatment process. In addition, when storing the treatment liquid in the buffer tank 460, the concentration and amount of the treatment liquid can be constantly maintained by circulating the treatment liquid through the main line 451, the distribution line, and the recovery line 453 in the supply line. have. In addition, it is possible to process a large amount of the substrate W at once by supplying a certain amount of processing liquid to the plurality of process chambers 260 through the plurality of distributors 470 at the same time, increasing the efficiency of the substrate W processing process. can be improved

The above detailed description is illustrative of the present invention. In addition, the above description shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed herein, the scope equivalent to the written disclosure, and/or within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in specific application fields and uses of the present invention are possible. Accordingly, the detailed description of the present invention is not intended to limit the present invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

260: process chamber 300: substrate processing apparatus
400: processing liquid supply unit 401: liquid supply unit
402: liquid supply line 403: liquid supply valve
404: flow regulator 410: mixing element
420: mixer 430: vessel
440: connector 460: buffer tank
450: supply line 480: no alarm
490: controller

Claims (19)

An apparatus for processing a substrate, comprising:
a process chamber for performing a processing process by supplying a processing liquid to the substrate;
a processing liquid supply unit supplying the processing liquid to the process chamber;
The process chamber,
a housing having a processing space therein;
a support unit positioned in the processing space to support a substrate; and
and a liquid supply nozzle receiving the processing liquid from the processing liquid supply unit and supplying the processing liquid to the substrate;
The processing liquid supply unit,
a mixing member receiving a liquid from a plurality of liquid sources and mixing the plurality of liquids;
a buffer tank receiving the mixed treatment liquid from the mixing member through a connection pipe, storing the treatment liquid, and supplying the treatment liquid to the liquid supply nozzle through a supply line;
The mixing member is
a container having an interior space;
a mixer disposed in the inner space and having a mixing space therein; and
and a plurality of liquid inlet pipes for respectively supplying a plurality of liquids to be mixed into the mixer. delete According to claim 1,
The mixing member includes a heater configured to heat the inside of the mixing space. 4. The method of claim 3,
The heater is a substrate processing apparatus installed on an outer wall of the mixer. According to claim 1,
The mixer has an outlet for discharging the processing liquid in which the plurality of liquids are mixed into the inner space, and the container has an outlet for discharging the processing liquid to the connection pipe. 6. The method of claim 5,
The outlet is provided at a position lower than the outlet. 7. The method of claim 6,
The outlet is provided on an upper wall or a side wall of the vessel. An apparatus for processing a substrate, comprising:
a process chamber for performing a processing process by supplying a processing liquid to the substrate;
a processing liquid supply unit supplying the processing liquid to the process chamber;
The process chamber,
a housing having a processing space therein;
a support unit positioned in the processing space to support a substrate; and
and a liquid supply nozzle receiving the processing liquid from the processing liquid supply unit and supplying the processing liquid to the substrate;
The processing liquid supply unit,
a mixing member receiving a liquid from a plurality of liquid sources and mixing the plurality of liquids;
a buffer tank receiving the mixed treatment liquid from the mixing member through a connection pipe, storing the treatment liquid, and supplying the treatment liquid to the liquid supply nozzle through a supply line,
The process chamber is provided in plurality,
The processing liquid supply unit is installed in the supply line, and further includes a distributor for distributing the processing liquid to a plurality of the process chambers,
The supply line is
main line;
a plurality of branch lines branched from the main line and positioned in parallel with each other; and
One end is connected to the plurality of branch lines, the other end includes a recovery line connected to the buffer tank,
The distributor is installed in each of the plurality of branch lines,
The processing liquid supply unit,
a pump installed on the main line;
a pressure measuring device installed in the recovery line and measuring the pressure of the treatment liquid; and
Further comprising a pump controller for controlling the pump,
The pump controller controls the pump to adjust the pressure of the processing liquid supplied to the process chamber with the pressure value measured by the pressure gauge. delete 9. The method of claim 8,
and the number of the process chambers connected to each of the branch lines is the same. delete According to claim 1,
The treatment liquid supply unit may include a plurality of liquid supply lines for supplying the plurality of liquids to the inlet pipe;
a flow rate controller installed in the plurality of liquid supply lines and configured to control the flow rate of each of the liquids supplied to the mixing member; Further comprising a substrate processing apparatus. 13. The method of claim 12,
The processing liquid supply unit is installed on the connection pipe, the substrate processing apparatus further comprising a concentration meter for measuring the concentration of the processing liquid. 14. The method of claim 13,
A substrate processing apparatus in which a water level measuring device for measuring a level of the processing liquid is installed in the buffer tank. 15. The method of claim 14,
The treatment liquid supply unit further includes an alarm member that is connected to the flow controller, the concentration meter, and the water level meter to sound an alarm when a preset flow rate, concentration, and water level are violated,
The substrate processing apparatus further includes a controller for controlling the processing liquid supply unit,
and the controller controls the liquid supply unit to stop supplying the processing liquid and mixing the plurality of liquids when an alarm sounds in the alarm member. An apparatus for processing a substrate, comprising:
a process chamber for performing a substrate processing process by supplying a processing liquid to the substrate;
a processing liquid supply unit supplying the processing liquid to the process chamber;
The process chamber,
a housing having a processing space therein;
a support unit positioned in the processing space to support a substrate; and
and a liquid supply nozzle receiving the processing liquid from the processing liquid supply unit and supplying the processing liquid to the substrate;
The process chamber is provided in plurality,
The processing liquid supply unit,
a buffer tank for storing the treatment liquid;
a supply line for supplying the processing liquid to the buffer tank to the liquid supply nozzle; and
Installed in the supply line, further comprising a distributor for distributing the processing liquid to a plurality of the process chamber,
The supply line is
main line;
a plurality of branch lines branched from the main line and positioned in parallel with each other; and
One end is connected to the plurality of branch lines, the other end includes a recovery line connected to the buffer tank,
The distributor is installed in each of the plurality of branch lines,
The processing liquid supply unit,
a pump installed on the main line; and
a pressure measuring device installed in the recovery line and measuring the pressure of the treatment liquid;
Further comprising a pump controller for controlling the pump,
The pump controller controls the pump to adjust the pressure of the processing liquid supplied to the process chamber with the pressure value measured by the pressure gauge. delete 17. The method of claim 16,
and the number of the process chambers installed in each of the branch lines is the same.


delete

Images