KR20170011297A - Substrate Transferring Apparatus - Google Patents

Substrate Transferring Apparatus Download PDF

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Publication number
KR20170011297A
KR20170011297A KR1020150103695A KR20150103695A KR20170011297A KR 20170011297 A KR20170011297 A KR 20170011297A KR 1020150103695 A KR1020150103695 A KR 1020150103695A KR 20150103695 A KR20150103695 A KR 20150103695A KR 20170011297 A KR20170011297 A KR 20170011297A
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KR
South Korea
Prior art keywords
substrate
support
static electricity
support member
fastening member
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KR1020150103695A
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Korean (ko)
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KR101784380B1 (en
Inventor
김귀상
김병현
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주식회사 레인테크
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Priority to KR1020150103695A priority Critical patent/KR101784380B1/en
Publication of KR20170011297A publication Critical patent/KR20170011297A/en
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Publication of KR101784380B1 publication Critical patent/KR101784380B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67396—Closed carriers characterised by the presence of antistatic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Abstract

The present invention relates to a plasma display panel comprising a body portion, a plurality of support portions spaced apart from each other above the body portion to support the substrate, and a plurality of support portions connected to each of the plurality of support portions for discharging static electricity remaining on the substrate, And includes an electric conductive portion, and it is possible to prevent or prevent contamination and breakage of the substrate by removing static electricity between the substrate and the substrate transfer device.

Description

[0001] Substrate Transferring Apparatus [0002]

The present invention relates to a substrate transfer apparatus, and more particularly, to a substrate transfer apparatus capable of suppressing or preventing contamination and breakage of a substrate by removing static electricity between the substrate and the substrate transfer apparatus.

In general, a semiconductor device has a built-in electrostatic sensitive circuit board or electric parts therein, and static electricity can easily flow into the semiconductor device through the bodies of semiconductor devices made of conductive materials.

Static electricity is electricity that has no temporal change, or an electrical phenomenon that accompanies such a distribution of charge, which means electricity that is stationary on an object, such as a triboelectricity. When the electric load of the two objects is polarity, there is the mechanical action, and when the electric load of the two objects is polarity, suction force acts to cause dust and mist to adhere to the product. In case of the polarity, repulsive force acts to assemble the fiber, paper, And electrostatic induction phenomenon in which an electric load appears on the surface of the conductor such as accuracy may occur.

Since the unit devices constituting the integrated circuit in the semiconductor manufacturing process are repeatedly formed on the substrate by photolithography, diffusion, etching, vapor deposition, and the like, so that they are manufactured using various types of process equipment. Therefore, To the facility.

At this time, since many charges of positive (+) polarity or negative (-) polarity existing between the semiconductor elements are increased in an object of either the substrate transfer device or the substrate due to friction or the like due to contact and separation, And the static electricity may be generated. In other words, there are a large number of charges of positive and negative polarity between the semiconductor devices. As the substrate transfer device approaches, movements of positive (+) polarity and negative (-) polarity are moved Polarity charge may be generated and static electricity may be generated.

Accordingly, there is a problem in that a suction or a repulsive force acts between the substrate and the substrate transfer device by static electricity, thereby causing scratches or cracks on the substrate. In addition, static electricity of tens of thousands of volts may be instantaneously introduced into the facility, causing damage to the circuit board or malfunction of the equipment.

KR 10-0851819 B1

The present invention provides a substrate transfer apparatus capable of removing static electricity between a substrate and a substrate transfer apparatus.

The present invention provides a substrate transfer apparatus capable of suppressing or preventing contamination and breakage of a substrate.

The present invention relates to a body part; A plurality of supporting portions spaced apart from each other on the upper side of the body portion to support the substrate; And a plurality of electric conductive parts connected to each of the plurality of supporting parts to form a discharge path so that static electricity remaining on the substrate is discharged; .

The plurality of supports are arranged so as to be able to contact at least any one of an outer frame portion and a central portion of the substrate.

The support portion includes: a support member on which the substrate is placed; And a fastening member which is fastened through the support member, the electric conductive portion, and the body portion; .

The resistance value of the support member and the electric conductive portion is 1? Or less.

A through hole through which the fastening member can pass is formed in the electric conductive portion and a plurality of protrusions protruding toward the center portion are provided in the through hole so as to be able to contact with the circumference of the fastening member.

A plurality of insertion grooves are formed in the body so as to respectively form the storage lines corresponding to the shapes of the plurality of electrical conductive parts so that the plurality of electrical conductive parts are inserted into the body part.

Concave or convex portions are formed on the upper surface of the support member.

The support portion further includes an auxiliary fastening member spaced apart from the fastening member and fastened through the support member and the body portion.

And a support protrusion protruded upward to prevent the substrate from being detached from the outer periphery of the body portion. The support portion is disposed at a central portion of the body portion.

A groove for inserting the support member is formed at a central portion of the body portion, and the height of the upper surface of the support portion is equal to the height of the upper surface of the central portion of the body portion.

The supporting portion protrudes upward and the height of the upper surface of the supporting portion is lower than the height of the upper surface of the separation preventing jaw.

The driving unit further includes a grounding member connected to the electric conductive unit to discharge the static electricity.

The substrate includes a wafer provided on at least one of a liquid crystal display (LCD), a plasma display panel (PDP), and a light emitting diode (LED).

According to the embodiment of the present invention, a plurality of electroconductive parts for discharging static electricity are connected to each of the plurality of supporting parts for supporting the substrate. Therefore, the static electricity generated between the substrate and the substrate transfer device can be discharged to the ground and removed immediately.

Thus, it is possible to prevent the substrate from sticking to the substrate transfer device due to the action of the electrostatic force due to static electricity, or dust and the like adhering to the substrate to be contaminated. It is possible to prevent the substrate from being detached from the substrate transfer apparatus and being damaged by the repulsive force due to static electricity.

In addition, it is possible to prevent damage to the semiconductor manufacturing facility, such as damage to the circuit board, caused by the generation of static electricity, thereby improving the efficiency of the semiconductor production process.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows a substrate transfer apparatus according to an embodiment of the present invention. Fig.
2 is a perspective view showing a body part, a supporting part, and an electric conductive part assembled according to an embodiment of the present invention.
3 is an exploded perspective view showing a body part, a support part, and an electrically conductive part in a disassembled state according to an embodiment of the present invention;
4 is a perspective view showing a substrate transfer apparatus according to another embodiment of the present invention;
5 is a cross-sectional view illustrating a substrate transfer apparatus according to another embodiment of the present invention;

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. To illustrate the invention in detail, the drawings may be exaggerated and the same reference numbers refer to the same elements in the figures.

2 is a perspective view illustrating a body, a support, and an electro-conductive part assembled according to an embodiment of the present invention. FIG. 3 is a cross- Fig. 4 is an exploded perspective view showing a body part, a supporting part, and an electrically conductive part according to an embodiment of the present invention. Fig.

1 to 3, a substrate transfer apparatus 1000 according to an embodiment of the present invention includes a body 100 and a substrate S, And a plurality of electric conduction parts 300 connected to the plurality of supporting parts 200 to discharge electric charges remaining on the substrate S and form a discharge path. Further, the substrate transfer apparatus 1000 may include a driving unit 500. At this time, the substrate may include a wafer provided on at least one of a liquid crystal display (LCD), a plasma display panel (PDP), and a light emitting diode (LED).

The unit devices constituting the integrated circuit in the semiconductor manufacturing process are manufactured by repeating processes such as photography, diffusion, etching, and deposition on the substrate S. Accordingly, an operation of transferring the substrate S to various types of processing facilities is performed. The substrate S can be temporarily loaded into the storage unit 20 for the next process before and after these processes. The storage unit (20) has a plurality of slots (25) capable of supporting a substrate (S) therein. Thus, the substrate S is supported in the slot 25 and housed in the storage unit 20. [

The substrate transfer apparatus transfers the substrate S loaded on the storage unit 20 to the facility for the next process. When the substrate S and the substrate transfer apparatus are in contact, static electricity is generated between the substrate S and the substrate transfer apparatus Lt; / RTI > Static electricity may cause a suction force or a repulsive force between the substrate S and the substrate transfer device to damage the substrate S and foreign substances such as dust may adhere to the substrate S and the substrate S may be contaminated. In addition, static electricity of tens of thousands of volts may be instantaneously introduced into the facility, causing damage to the circuit board or malfunction of the equipment.

Therefore, the substrate transfer apparatus 1000 according to the embodiment of the present invention can discharge static electricity. However, the present invention is not limited to this, and the substrate S may be directly transferred from the equipment to the equipment or from the chamber to the chamber without the temporary loading of the substrate S into the storage unit 20. [

The body part 100 is formed in the form of a plate having a predetermined area on the upper part. For example, the body part 100 may extend in the front-rear direction, and the front end may be divided into two parts and may be formed in a 'Y' shape. The body 100 may be formed of a ceramic material, which is an insulator, to prevent the generation of static electricity, or may be coated with a ceramic material.

A plurality of insertion grooves 110 are formed on the upper surface or the lower surface of the body part 100 to respectively form storage lines corresponding to the shapes of the plurality of electrical conductive parts 300 so that the plurality of electrical conductive parts 300 are inserted. . The insertion groove 110 is formed to extend along the extending direction of the electric conductive portion 300 corresponding to the shape of the electric conductive portion 300.

The thickness of the insertion groove 110 may be such that the height of the top surface of the conductive portion 300 is less than the height of the top surface of the body 100. That is, the thickness of the insertion groove 110 may be equal to or greater than the thickness of the conductive portion 300. Since the electrical conduction part 300 is housed in the insertion groove 110 of the body part 100, it is possible to prevent the electrical conduction part 300 from contacting the lower surface of the substrate S. Accordingly, it is possible to reduce the contact area between the substrate S and other equipment, thereby preventing the substrate S from being contaminated or damaged.

For example, the insertion grooves 110 may include a plurality of the number of the electric conduction parts 300, and may include a pair of first insertion grooves 111 And a pair of second insertion grooves 112 into which the pair of second electrical conductive parts 320 are inserted, respectively.

A pair of first insertion holes 111 may be formed along the periphery of the body part 100 at the outer periphery of the body part 100. Therefore, a space in which the second support portion 220, the second electrical conductive portion 320, and the like can be disposed may be formed between the pair of first insertion holes 111. [ A pair of second insertion holes 112 may be formed between the pair of first insertion holes 111. [ However, the structure, shape and material of the body part 100 are not limited to these, and may be various.

A plurality of support portions 200 may be disposed on the upper side of the body portion 100 to support the substrate S. The plurality of support members 211 and 221 are arranged so as to be in contact with at least one of the outer frame portion and the central portion of the substrate S. For example, when the plurality of supports 200 can be brought into contact with the outer frame of the substrate S, the plurality of supports 200 may include a pair of first supports (not shown) provided on the two divided portions of the front end of the body 100, And a pair of second supporting portions 220 spaced apart from each other in the left-right direction on the rear end of the body portion 100.

The first support member 210 includes a first support member 211 on which an outer portion of the substrate S is placed and a first support member 211, And a first fastening member (212) fastened by the fastening member (212). In addition, the first support portion 210 may include a first auxiliary fastening member 213.

The first support member 211 may be formed in a plate shape having an area where the substrate S can be seated on the upper surface. The first support member 211 may include a first layer 211a supporting the lower surface of the substrate S and a second layer 211b having a height higher than the upper surface of the first layer 211a . The outer surface of the substrate S is seated on the first layer 211a and the substrate S is formed on the first layer 211a by the jaws formed between the first layer 211a and the second layer 211b Can be prevented from being separated. At this time, the side surface that surrounds the periphery of the substrate S of the jaw may be formed to be slanted or rounded along the peripheral shape of the substrate S so that the substrate S can be placed on the first layer 211a.

The upper surface of the first supporting member 211, particularly, the upper surface of the first layer 211a may be formed with concavities or convexities to prevent the substrate S from slipping. The substrate S is stably supported on the first support member 211 through the step between the first layer 211a and the second layer 211b and the concavity and convexity formed on the first layer 211a, .

In addition, the first supporting member 211 may be formed of a metal or the like, which is electrically conductive, or the surface thereof may be coated with an electrically conductive material. That is, the first support member 211 may be formed of a low-resistance material having a resistance value of 1? Or less. If the resistance value of the first supporting member 211 exceeds 1 ?, the resistance value is too large, so that the static electricity may not be discharged through the first supporting member 211. Therefore, the first support member 211 is formed of a low-resistance material having a small resistance value, so that the static electricity generated in the substrate S can be easily transferred to the first support member 211.

For example, the first support member 211 can be formed using Si or SiC. Thus, it is possible to prevent the first support member 211, which is in contact with the substrate S, from contaminating the substrate S. However, the structure, shape, and material of the first support member 211 are not limited thereto and may be various.

The first fastening member 212 may be formed in a bolt shape extending in the vertical direction. The first fastening member 212 is fastened through the first support member 211, the electric conductive portion 300 and the body portion 100 so that the first support member 211, the electric conductive portion 300, And serves to join the part 100 to the substrate. Particularly, the first fastening member 212 can be fastened to the body part 100 through the upper surface of the second layer 211b of the first supporting member 211, and the first fastening member 212 can be fastened to the body part 100, A groove into which the head portion of the fastening member 212 can be inserted can be formed.

Further, the first fastening member 212 may be formed of silver, which is an electrically conductive material, or the surface thereof may be coated with silver. Thus, the static electricity transferred to the first support member 211 can be easily discharged through the first connection member 212 and the electric conduction unit 300. That is, the first fastening member 212 not only structurally fastens the first supporting member 211 and the body 100, but also functions to electrically connect the first supporting member 211 and the electric conductive portion 300 do. However, the structure, fastening direction and material of the first fastening member 212 are not limited to these, and may be various.

The first auxiliary fastening member 213 may be formed in a bolt shape extending in the vertical direction. The first auxiliary coupling member 213 is spaced apart from the first coupling member 212 and is coupled to the first supporting member 211 through the body 100. The first auxiliary fastening member 213 serves to fix the first support member 211. [

That is, when the first support member 211 is fastened only to the first fastening member 212, the first support member 211 can rotate around the first fastening member 212. The position of the jaw between the first layer 211a and the second layer 211b is changed so that the substrate S can not be seated on the first layer 211a and can be seated on the second layer 211b And the substrate S is out of balance and can fall on the plurality of support members 211, 212. Therefore, when the first supporting member 211 is fastened to the first fastening member 212 and the first auxiliary fastening member 213, it is possible to prevent the first supporting member 211 from being fixed and rotated, S can be stably supported.

The first auxiliary fastening member 213 may be fastened to the body 100 through the upper surface of the second layer 211b of the first support member 211 and may be fastened to the second layer 211b. A groove into which the head portion of the first auxiliary fastening member 213 can be inserted can be formed. However, the structure and the fastening direction of the first auxiliary fastening member 213 are not limited to this and may vary.

The second support member 220 includes a second support member 221 on which an outer portion of the substrate S is seated and a second support member 221 that penetrates the second support member 221, And a second fastening member (222) fastened by the fastening member. Also, the second support portion 220 may include a second auxiliary fastening member 223.

The second support member 221 may be formed in a plate shape having an area where the substrate S can be seated on the upper surface. The second support member 221 may include a first layer supporting the lower surface of the substrate S and a second layer having a higher height than the upper surface of the first layer similarly to the first support member 211 have. The outer surface of the substrate S is seated on the first layer of the second supporting member 221 and the substrate S is held by the jaws formed between the first and second layers of the second supporting member 221 And can be prevented from being separated on the first layer. At this time, the lateral shape of the jaw surrounding the substrate S is formed to be slanted or rounded along the peripheral shape of the substrate S so that the substrate S can be placed on the first layer of the support members 211 and 221 .

Further, the first layer of the second supporting member 221 may be formed to be inclined downward in the direction from the rear to the front. Therefore, even if the substrate S can not be stably stuck to the first layer of the second supporting member 221, the substrate S is moved to the correct position where it can be stably supported by the inclined surface formed by the first layer .

In addition, the second support member 221 may be formed of a metal or the like, which is electrically conductive, or the surface thereof may be coated with an electrically conductive material. That is, the second support member 221 may be formed of a low-resistance material having a resistance value of 1? Or less. If the resistance value of the second supporting member 221 exceeds 1 ?, the resistance value is too large, so that the static electricity may not be discharged through the second supporting member 221. Therefore, the second support member 221 can be formed of a low-resistance material having a small resistance value, so that the static electricity generated in the substrate S can be easily transferred to the second support member 221.

For example, the second support member 221 can be formed using Si or SiC. Thus, it is possible to prevent the second support member 221, which is in contact with the substrate S, from contaminating the substrate S. However, the structure, shape, and material of the second support member 221 are not limited to these, and may vary.

The second fastening member 222 may be formed in a bolt shape extending in the vertical direction. Since the second fastening member 222 is fastened through the second support member 221, the electric conductive portion 300 and the body portion 100, the second support member 221, the electric conductive portion 300, And serves to join the part 100 to the substrate. Particularly, the second fastening member 222 can be fastened to the second support member 221 through the lower surface of the body 100, and the second fastening member 222 Can be formed.

Further, the second fastening member 222 may be formed of silver, which is an electrically conductive material, or the surface thereof may be coated with silver. Thus, the static electricity transmitted to the second support member 221 can be easily discharged through the second connection member 222 and the electric conduction unit 300. That is, the second fastening member 222 not only structurally fastens the second supporting member 221 and the body 100 but also electrically connects the second supporting member 221 to the electric conductive portion 300 do. However, the structure, fastening direction and material of the second fastening member 222 are not limited to these, and may be various.

The second auxiliary fastening member 223 may be formed in a bolt shape extending in the vertical direction. The second auxiliary fastening member 223 is spaced apart from the second fastening member 222 and is coupled to the second support member 221 through the body 100. The second auxiliary fastening member 223 serves to fix the second support member 221.

That is, when the second support member 221 is fastened only to the second fastening member 222, the second support member 221 can rotate about the second fastening member 222. The substrate S can not be stably fixed to the plurality of support portions 200, so that the balance S can be lost and fall. Therefore, when the second supporting member 221 is fastened to the second fastening member 222 and the second auxiliary fastening member 223, the second supporting member 221 can be prevented from being fixed and rotated, S can be stably supported.

The second auxiliary fastening member 223 may be fastened to the second support member 221 through the lower surface of the body 100. However, the structure and the fastening direction of the first auxiliary fastening member 213 are not limited to this and may vary.

As described above, the plurality of support members 211 and 221 do not contact the entire lower surface of the substrate S, but support the substrate S while minimizing the area in contact with the substrate S at a plurality of positions. Therefore, it is possible to prevent dust or the like, which may be present on the support members 211 and 221, from being attached to the lower surface of the substrate S, and when the substrate S is seated on the support members 211 and 221, The area can be reduced. Thus, the quality of the substrate S can be improved.

The electrically conductive portion 300 is formed in the form of a thin conductive film, and can form a static discharge path. That is, one end of the electric conductive part 300 is electrically connected to the first supporting member 211 or the second supporting member 221, and the other end thereof is connected to the driving part 500 to be described later to form a line through which static electricity is discharged . At this time, the driving unit 500 may be grounded to discharge the static electricity transmitted through the electric conduction unit 300. Accordingly, the conductive portion 300 can be formed in a film form, and can be easily brought into close contact with the body portion 100, and space usability can be improved.

Further, the electric conductive portion 300 may have a resistance value of 1? Or less. That is, when the resistance value of the electric conduction part 300 exceeds 1 ?, the resistance value is too large, and the electric conduction part 300 is difficult to conduct electricity, so that the electric conduction part 300 may not function as a room. Therefore, the electric conductive portion 300 can be formed to have a low resistance.

The electrical conductive portion 300 may have a through hole through which the first fastening member 212 or the second fastening member 222 can pass. In addition, a plurality of protrusions may be provided in the through hole so as to protrude toward the center of the through hole so that the first and the second fastening members 212 and 222 may be in contact with the circumference. Therefore, when the first fastening member 212 or the second fastening member 222 passes through the through hole, the plurality of projections can contact the circumference of the first fastening member 212 or the second fastening member 222 have.

For example, two to eight protrusions may be formed, and the protrusion may contact the first fastening member 212 or the second fastening member 222 to form the first fastening member 212 or the second fastening member 222, As shown in FIG. Therefore, after the static electricity generated in the substrate S is transferred to the first support member 211 or the second support member 221, the first fastening member 212 or the second fastening member 222, To the electrically conductive portion 300 electrically connected to the member 212 or the second fastening member 222. However, the shape and structure of the conductive portion 300 and the number of the projections are not limited to these, and may vary.

In addition, a plurality of the conductive portions 300 may be provided as many as the support members 211 and 221 are provided. For example, in an embodiment of the present invention, a pair of first electrically conductive parts 310 and a pair of second support members 221, which are respectively connected to a pair of first support members 211, A pair of second electrically conductive portions 320 may be provided.

The first electrical conductive portion 310 may extend from the front end to the rear end of the body 100 or from the first support member 211 to the rear end of the body 100. One end of the first conductive portion 310 is connected to the grounding member (not shown) of the driving unit 500, which is connected to the rear end of the body 100 by the first fastening member 212, have. Accordingly, the static electricity can be discharged through the ground member after moving from one end of the first electrical conductive portion 310 to the other end.

The first conductive portion 310 may be inserted into the insertion groove 110 formed on the upper surface of the body 100. The insertion groove 110 may extend along the extending direction of the conductive portion 300 in correspondence with the shape of the conductive portion 300 and may be disposed at the outer portion of the body portion 100. Since the electrical conduction part 300 is housed in the insertion groove 110 of the body part 100, it is possible to prevent the electrical conduction part 300 from contacting the lower surface of the substrate S.

The second electrically conductive portion 320 may extend from the second support member 221 to the rear end of the body 100. One end of the second conductive portion 320 may be coupled to the grounding member of the driving unit 500 coupled to the rear end of the body 100 by the second fastening member 222 and the other end thereof may be connected to the rear end of the body 100. Accordingly, the static electricity can be discharged through the ground member after moving from one end of the second electrical conductive portion 320 to the other end.

The second conductive portion 320 may be inserted into the insertion groove 110 formed in the upper surface of the body 100. The insertion groove 110 may extend along the extending direction of the electrical conductive portion 300 corresponding to the shape of the electrical conductive portion 300. The second insertion groove 112 into which the second electrical conductive portion 320 is inserted may be shorter than the first insertion groove 111 into which the first electrical conductive portion 310 is inserted, A pair of second conductive portions 320 may be disposed inside the conductive portion 310. Since the electrical conduction part 300 is housed in the insertion groove 110 of the body part 100, it is possible to prevent the electrical conduction part 300 from contacting the lower surface of the substrate S.

Also, the electrically conductive portion 300 may be made of an electrically conductive material or the surface thereof may be coated with an electrically conductive material. Thus, static electricity can be easily discharged. However, the connection structure and the material of the electric conductive portion 300 are not limited to these, and may be various.

The driving part 500 supports the body part 100 and is capable of vertical and horizontal movement and rotational movement. The driving unit 500 may include a first arm 510 connected to the rear end of the body 100 and a second arm 520 connected to the first arm 510. The first arm 510 and the second arm 520 can move relative to each other, and thus the body 100 can be moved up and down and back and forth, right and left. Therefore, the substrate S on the upper side of the body part 100 can also move in accordance with the movement of the body part 100. However, the method of supporting and moving the body part 100 is not limited to this and may be various.

In addition, the driving unit 500 may include a grounding member connected to the electric conduction unit to discharge static electricity. The grounding member may be accommodated in a space formed inside the first arm 510 and the second arm 520 or attached to the surfaces of the first arm 510 and the second arm 520 .

The grounding member (not shown) may be formed in the form of a wire, one end connected to the electric conductive portion 300, and the other end grounded. For example, the grounding member may be connected to each of the plurality of electric conductive parts 300 by providing a plurality of grounding members as many as the number of the electric conductive parts 300 are provided. Thus, even if any one of the plurality of electric conductive parts 300 and the plurality of grounding members is broken, the static electricity can be discharged through the other electric conductive parts and the grounding member which are not damaged.

Alternatively, the grounding member may be formed such that one end of one electric wire is divided into a plurality of parts and connected to each of the plurality of electric conductive parts 300. Accordingly, the static electricity transmitted through the plurality of electric conduction parts 300 can be discharged from the one line to the grounded part.

A discharging bolt (not shown) extending vertically may be provided, and one end of the grounding member may pass through a lower portion of the body 100 and be coupled to the electric conductive portion 300. Thus, the static electricity transmitted from the electric conduction unit 300 can be transmitted to the ground member through the discharge bolt. However, the connection structure of the grounding member and the electric conductive portion 300 and the installation position of the grounding member are not limited to this, and may vary.

A plurality of conductive portions 300 for discharging static electricity are connected to each of the plurality of supporting portions 200 supporting the substrate S so that the static electricity generated between the substrate S and the substrate transfer device 1000 is grounded And can be removed immediately.

Thus, it is possible to prevent the substrate S from sticking to the substrate transfer apparatus 1000 due to the electrostatic force, or dust and the like adhering to the substrate S to be contaminated. It is possible to prevent the substrate S from being detached from the substrate transfer apparatus 1000 and being damaged due to the repulsive force due to the static electricity. In addition, it is possible to prevent damage to the semiconductor manufacturing facility, such as damage to the circuit board, caused by the generation of static electricity, thereby improving the efficiency of the semiconductor production process.

Hereinafter, a substrate transfer apparatus according to another embodiment of the present invention will be described.

FIG. 4 is a perspective view illustrating a substrate transfer apparatus according to another embodiment of the present invention, and FIG. 5 is a cross-sectional view illustrating a substrate transfer apparatus according to another embodiment of the present invention.

4 and 5, a substrate transfer apparatus 1000 'according to another exemplary embodiment of the present invention includes a body 100', an upper substrate 100 'to support the substrate S, And a plurality of electric conductive parts 300 'connected to each of the plurality of supporting parts 200' so as to discharge the static electricity remaining on the substrate S and forming discharge paths, ').

The body 100 'may be formed as a plate having a predetermined area on the upper surface. The body 100 'may extend in the front-rear direction and the rear end of the body 100' may be connected to a driving unit (not shown) for moving the body 100 '. The body 100 'may be formed of a ceramic material, which is an insulator, to prevent the generation of static electricity, or may be coated with a ceramic material. Further, a separation preventing protrusion 120 'protruding upward may be provided on the outer frame of the body 100' to prevent the substrate S from being separated. That is, the separation preventing tongue 120 'is formed higher than the central portion of the body 100'.

For example, the separation preventing jaw 120 'may be separated from the first separation preventing jaw 121' and the first separation preventing jaw provided at the front end of the body 100 ' And a second release preventing tuck 122 'provided at the end portion. At this time, the separation distance between the first and second separation preventing tucks 121 'and 122' may be equal to or larger than the diameter of the substrate S. Accordingly, the substrate S can be disposed at the center of the body part 100 between the first and second separation preventing tails 121 'and 122', and the first and second separation preventing tails 121 'and 121' Can be prevented from being separated from the center portion of the body portion 100 'by the protrusion 122'.

At this time, the side surface that surrounds the periphery of the substrate S of the jaw may be formed corresponding to the peripheral shape of the substrate S so that the substrate S can be seated at the center portion of the body portion 100 '. Further, the separation preventing jaw 120 'may be formed so as to have a tapered or rounded shape. Therefore, even if the substrate S is mistakenly mounted on the body 100 'of the substrate S, the substrate S can be moved to a position where the substrate S can be stably mounted on the inclined surface formed by the separation preventing jaw 120'. However, the structure, shape, and material of the body portion 100 'are not limited thereto and may vary.

A plurality of support portions 200 'may be provided to support the substrate S and may be disposed on the upper side of the body portion 100'. The plurality of supports 200 'are arranged so as to be able to contact at least any one of the outer frame portion and the central portion of the substrate S. For example, when the plurality of supports 200 'can contact the center of the substrate S, a plurality of supports 200' may be disposed at the center of the body 100 '.

In the embodiment of the present invention, three supporting portions 200 'may be provided and arranged as a vertex of a triangle at the center of the body portion 100'. Thus, the support portion 200 'can stably support the substrate S while minimizing the contact area between the support portion 200' and the substrate S. Further, the plurality of support portions 200 'may not be arranged on the same line in the back-and-forth direction. Accordingly, the electric conduction parts 200 'connected to each of the plurality of supporting parts 200' may not overlap each other. However, the number of the supporting portions 200 'and the shape in which the supporting portions 200' are disposed are not limited to these and may vary.

As shown in FIG. 5A, the upper surface of the body 100 'may have a groove into which the support 200' is inserted, and the support 200 'may be inserted into the groove and fixed. The height of the upper surface of the support portion 200 'may be the same as the height of the upper surface of the central portion of the body portion 100'. At this time, the groove for inserting the supporting part 200 'is connected to a groove or an internal space for inserting the electric conductive part 300' to be described later, and the electric conductive part 300 'is connected to the supporting part 200' do. Therefore, when the substrate S is seated in the central portion of the body 100 ', the static electricity generated in the substrate S while the substrate S is in contact with the support 200' is transmitted to the support 200 ' , And then transferred from the supporting portion 200 'to the electric conductive portion 300' to be discharged.

5 (b), the support portion 200 'may protrude upward and the height of the upper surface of the support portion 200' may be higher than the height of the upper surface of the central portion of the body 100 '. Accordingly, the lower surface of the substrate S can be in contact with the support portion 200 'without contacting the upper surface of the body portion 100'. Therefore, it is possible to minimize the contact area between the substrate S and other equipment, thereby preventing the dust or the like, which may be present on the body 100 'or the support 200', from adhering to the lower surface of the substrate S , The substrate S is seated on the support portion 200 ', and the area where scratches or the like are generated can be reduced. Thus, the quality of the substrate S can be improved.

At this time, the height of the upper surface of the support portion 200 'is formed to be lower than the height of the upper surface of the separation preventing jaw 120'. When the height of the upper surface of the support portion 200 'is higher than the height of the upper surface of the separation preventing jaw 120', the height of the substrate S is higher than the height of the separation preventing jaw 120 ' It may not take. Accordingly, the substrate S may be easily detached from the support portion 200 'and fall down.

If the height of the upper surface of the support portion 200 'is set to be lower than the height of the upper surface of the separation preventing jaw 120', the height at which the substrate S is seated is lower than the height of the separation preventing jaw 120 ' In the case where the slip is generated, the slip may be caught by the slip-off preventing tongue 120 'and not deviate from the correct position. Thus, it is possible to prevent an accident that the substrate S is stably supported and the substrate S falls.

Further, the support portion 200 'may be formed of a metal or the like, which is electrically conductive, or the surface thereof may be coated with an electrically conductive material. Thus, the static electricity generated in the substrate S can be easily transferred to the support portion 200 '. However, the structure, shape, and material of the support portion 200 'are not limited thereto and may vary.

On the other hand, fastening bolts (not shown) extending in the vertical direction may be provided. The fastening bolt can be fastened to the support part 200 'through the lower part of the body part 100' and the electric conductive part 300 '. Thus, the support portion 200 'is fixed in position by the fastening bolt, and the substrate S can be stably supported. Also, the fastening bolt may be formed of silver, which is an electrically conductive material, or the surface may be coated with silver. Thus, the static electricity transmitted to the support portion 200 'can be easily discharged through the fastening bolt through the electric conductive portion 300'. However, the structure, fastening direction, and material of the fastening bolt are not limited to these and may vary.

The electrically conductive portion 300 'is formed in the form of a thin film, and can form a static discharge path. That is, the electrical conducting portion 300 'may form a line through which static electricity is discharged. The plurality of electric conduction parts 300 'may be provided as many as the number of the support parts 200'. The electrically conductive portion 300 'may be disposed in a groove formed in the upper surface of the body portion 100' or an inner space formed in the body portion 100 '. Thus, the electric conductive portion 300 'is housed in the body portion 100', so that the electric conductive portion 300 'can be prevented from coming into contact with the lower surface of the substrate S. Alternatively, the height of the upper surface of the electric conductive portion 300 'may be lower than the height of the upper surface of the supporting portion 200' so that the electric conductive portion 300 'may be exposed to the upper surface of the body portion 100' have.

In addition, the electric conductive portion 300 'is connected to a grounding member (not shown) having one end connected to the supporting portion 200' and the other end connected to a driving portion. Accordingly, the electroconductive part 300 'can transmit static electricity, which is transmitted through the support part 200', to the ground member to discharge the static electricity. At this time, the electric conductive part 300 'may be made of an electrically conductive material or the surface thereof may be coated with an electrically conductive material. Thus, static electricity can be easily discharged. However, the structure, shape, and material of the electrically conductive portion 300 'are not limited thereto and may be various.

As described above, a plurality of electric conduction parts 300 'for discharging static electricity are connected to each of the plurality of supporting parts 200' for supporting the substrate S, and a plurality of conductive parts 300 'are formed between the substrate S and the substrate transfer device 1000' The static electricity can be removed by discharging it to the ground.

Thus, it is possible to prevent the substrate S from sticking to the substrate transfer apparatus 1000 'due to the electrostatic force, or dust and the like attached to the substrate S to be contaminated. Or the substrate S can be prevented from being detached from the substrate transfer apparatus 1000 'and damaged due to the repulsive force due to static electricity. In addition, it is possible to prevent damage to the semiconductor manufacturing facility, such as damage to the circuit board, caused by the generation of static electricity, thereby improving the efficiency of the semiconductor production process.

Hereinafter, the operation of the substrate transfer apparatus according to the embodiment of the present invention will be described.

The substrate transfer apparatus 1000 can perform the operation of transferring the substrate S. The substrate transfer apparatus 1000 moves to the position where the substrate S is loaded and places the body section 100 on the lower side of the substrate S. [ When the body part 100 is lifted, a plurality of support members 211 and 221 provided on the upper part of the body part 100 come into contact with the lower surface of the substrate S. At this time, the static electricity existing in the substrate S is transmitted to the support members 211 and 212, and the static electricity transmitted to the support members 211 and 221 is discharged to the ground through the fastening members 212 and 222 and the electric conductive part 300, . Thus, the substrate transfer apparatus 1000 can stably support the substrate S, thereby safely transferring the substrate S.

Therefore, it is possible to prevent the substrate S from sticking to the substrate transfer apparatus 1000 due to the electrostatic force, or dust and the like attached to the substrate S to be contaminated. It is possible to prevent the substrate S from being detached from the substrate transfer apparatus 1000 and being damaged due to the repulsive force due to the static electricity. In addition, it is possible to prevent damage to the semiconductor manufacturing facility, such as damage to the circuit board, caused by the generation of static electricity, thereby improving the efficiency of the semiconductor production process.

Although the present invention has been described in detail with reference to the specific embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited by the described embodiments, but should be defined by the appended claims, as well as the appended claims.

100: Body part 200: Support part
211, 221: support member 212, 222: fastening member
300: electric conduction part 500: driving part

Claims (13)

Body part;
A plurality of supporting portions spaced apart from each other on the upper side of the body portion to support the substrate; And
A plurality of electric conduction parts connected to each of the plurality of supporting parts to form a discharge path so that static electricity remaining on the substrate is discharged; Wherein the substrate transfer device comprises: The method according to claim 1,
Wherein the plurality of support portions are arranged to be capable of contacting at least any one of an outer frame portion and a central portion of the substrate. The method according to claim 1,
The support portion
A support member on which the substrate is placed; And
A coupling member that is inserted through the support member, the electric conductive portion, and the body portion; Wherein the substrate transfer device comprises: The method of claim 3,
Wherein the support member and the electroconductive portion have a resistance value of 1? Or less. The method of claim 3,
A through hole through which the fastening member can pass is formed in the electrically conductive portion,
And a plurality of protrusions protruding toward the central portion of the through-hole so as to be in contact with the periphery of the fastening member. The method of claim 3,
Wherein a plurality of insertion grooves are formed in the body portion so as to form storage lines corresponding to the shapes of the plurality of electric conductive portions so that each of the plurality of electric conductive portions is inserted into the body portion. The method according to any one of claims 3 to 6,
Wherein a convexity or a curvature is formed on an upper surface of the support member. The method according to any one of claims 3 to 6,
Wherein the support portion further comprises an auxiliary fastening member spaced apart from the fastening member and fastened through the support member and the body portion. The method of claim 2,
And a separation preventing protrusion protruded upward to prevent the substrate from being separated from the outer frame of the body,
Wherein the support portion is disposed at a central portion of the body portion. The method of claim 9,
A groove into which the support member is inserted is formed in a central portion of the body portion,
Wherein the height of the upper surface of the support portion is the same as the height of the upper surface of the central portion of the body portion. The method of claim 9,
Wherein the supporting portion protrudes upward and the height of the upper surface of the supporting portion is lower than the height of the upper surface of the separation preventing jaw. The method according to any one of claims 1 to 6 and claims 9 to 11,
Further comprising a driving unit that supports the body and is capable of vertical and horizontal movement and rotational movement,
Wherein the driving unit includes a grounding member connected to the electric conduction unit to discharge the static electricity. The method according to any one of claims 1 to 6 and claims 9 to 11,
Wherein the substrate comprises a wafer provided on at least one of a liquid crystal display (LCD), a plasma display panel (PDP), and a light emitting diode (LED).
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102024170B1 (en) * 2018-07-16 2019-09-23 김순훈 A method of manufacturing a clamp structure to be applied to a robot for manufacturing a semiconductor wafer and a clamp structure to be applied to a robot for manufacturing a semiconductor wafer fabrication facility manufactured by a clamp structure applied to the robot for the semiconductor wafer fabrication facility

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